Securing device for a lithography system, and lithography system comprising such a securing device

Abstract

The invention relates to a securing device (100) for a lithography system (1), comprising a first and second component (102, 104), at least one vibration damping device (106) having at least one damping element (108), by means of which the second component (104) is secured to the first component (102) such that vibrations are damped, and at least one flexible housing (112), by means of which the at least one damping element (108) is fluid-tightly housed.

Description

[0001] Carl Zeiss SMT GmbH 1 Fastening device for a lithography system and a lithography system with such a fastening device. The content of the priority application DE 10 2024 203526.2 is incorporated by reference in its entirety. Microlithography is used to manufacture microstructured components, such as integrated circuits. The microlithography process is carried out using a lithography system that has an illumination system and a projection system.The image of a mask (reticle) illuminated by the illumination system is projected by the projection system onto a substrate coated with a light-sensitive layer (photoresist) and arranged in the image plane of the projection system, for example, a silicon wafer, in order to transfer the mask structure onto the light-sensitive coating of the substrate. Driven by the pursuit of ever smaller structures in the manufacture of integrated circuits, EUV lithography systems are currently being developed that use light with a wavelength in the range of 0.1 nm to 30 nm, particularly 13.5 nm. Since most materials absorb light at this wavelength, such EUV lithography systems must use reflective optics, i.e., mirrors, instead of the previously used refractive optics, i.e., lenses.The demands on the accuracy and precision of the imaging properties of lithography systems are constantly increasing. This requires, for example, very precise positioning of numerous position-sensitive optical and mechanical components of the lithography system, especially mirrors and sensor frames. However, during operation of a lithography system, it is unavoidable that mechanical vibrations occur in the system. These mechanical vibrations can be caused, for example, by floor vibrations or transmitted by other components, such as a movable wafer holder, a movable reticle holder, or other components of the lithography system. Furthermore, the passage of cooling water through components of the lithography system can also lead to vibration excitation.Therefore, it is necessary to minimize the influence of interference on the position and movement of position-sensitive components of the lithography system. To dampen such mechanical vibrations, it is known to insert damping elements between components of the lithography system and / or to use damping devices, as proposed, for example, in DE 102023201560 A1. Against this background, one object of the present invention is to provide an improved fastening device for a lithography system. Accordingly, a fastening device for a lithography system is proposed. The fastening device comprises: a first and a second component, at least one vibration damper device with at least one damper element, with which the second component is fastened to the first component in a vibration-damping manner, and at least one flexible housing, by means of which the at least one damper element is housed in a fluid-tight manner.Carl Zeiss SMT GmbH 3 The at least one vibration damper device secures the first and second components to one another in a vibration-damping manner. As a result, fewer or no mechanical vibrations are transmitted between the first and second components. Consequently, a transmission path for unwanted mechanical vibrations in the lithography system is interrupted or at least impaired. This makes it possible to avoid or reduce unwanted vibration excitation of one or more position-sensitive components of the lithography system. In addition, the at least one damper element is encased in a fluid-tight manner using the at least one flexible housing. As a result, outgassing from the at least one damper element does not reach a space outside the at least one flexible housing. In particular, it is avoided that outgassing from the at least one damper element comes into contact with surfaces of optical components, e.g.Mirrors of the lithography system. In particular, such outgassing can deposit on the surfaces of optical components and even lead to the blindness of mirrors, e.g., EUV mirrors. This is prevented by the proposed at least one flexible housing. Consequently, the optical functionality of optical components of the lithography system is maintained for longer, and the service life of such optical components is extended. The lithography system (projection exposure system) is, for example, an EUV or DUV lithography system. EUV stands for "extreme ultraviolet" (EUV) and refers to a wavelength of the working light in the range of 0.1 nm to 30 nm, in particular 13.5 nm. Furthermore, DUV stands for "deep ultraviolet" (DUV) and refers to a wavelength of the working light between 30 nm and 250 nm.Carl Zeiss SMT GmbH 4The EUV or DUV lithography system comprises an illumination system and a projection system. In particular, with the EUV or DUV lithography system, the image of a mask (reticle) illuminated by the illumination system is projected by means of the projection system onto a substrate coated with a light-sensitive layer (photoresist) and arranged in the image plane of the projection system, for example, a silicon wafer, in order to transfer the mask structure to the light-sensitive coating of the substrate. The fastening device is, for example, part of the lithography system. In the fastening device, the first and second components are mechanically fastened to one another. The fastening device is preferably part of a projection optics system of the lithography system. However, the fastening device can also be part of an illumination system of the lithography system.The first and second components can each be, for example, any desired components of the lithography system. The first and second components are preferably both mechanical components. However, the first and / or second component can also be an optical component of the lithography system. For example, the first component is a carrier (support element, support frame). Furthermore, the second component is, for example, a mechanical component attached to the carrier, which is mechanically coupled to a position-sensitive component of the lithography system. Alternatively, the second component is itself, for example, a position-sensitive component of the lithography system. The position-sensitive component of the lithography system can be an optical or a mechanical component of the lithography system, e.g., a projection optics of the lithography system.The position-sensitive component is Carl Zeiss SMT GmbH 5 in particular a component that must be held in a precise position with only small tolerances during operation of the lithography system. The position-sensitive component of the lithography system is, for example, a mirror of the lithography system, e.g., a mirror of the projection optics of the lithography system. The mirrors of a projection optics of an EUV lithography system are usually movably attached to a support frame by means of actuators in order to be able to precisely adjust the position of the respective mirror, e.g., in six degrees of freedom. The six degrees of freedom include, in particular, three translational degrees of freedom (e.g., in three mutually perpendicular spatial directions) and three rotational degrees of freedom (e.g., with respect to a rotation around the three mutually perpendicular spatial directions). The position-sensitive component of the lithography system can also be a support structure and / or frame structure, which can be used as (e.g.,optical) reference. The position-sensitive component can, for example, be a sensor frame of the lithography system, e.g., the projection optics of the lithography system. A sensor frame typically has a sensor device for measuring a current position of one or more optical components of the lithography system relative to the sensor frame. The sensor frame is, for example, mounted in a vibration-decoupled manner with respect to a support frame of the optical component(s). The sensor device comprises, for example, one or more sensors, such as interferometers and / or other measuring devices for detecting a position of the optical component(s). The optical component(s) can, for example, have reflector elements for reflecting light emitted by the sensors (e.g., laser light). For example, the one or more sensors serve to detect a position of the optical component(s) in the six degrees of freedom.Carl Zeiss SMT GmbH 6 The at least one vibration damper device is designed in particular to dampen mechanical vibrations. Due to the vibration-damping attachment of the second component to the first component by means of the at least one vibration damper device, a transmission of mechanical vibrations from the first component to the second component (and / or vice versa) is prevented or at least reduced. It can also be said that the first and second components are decoupled from one another with regard to mechanical vibrations by the at least one vibration damper device. The at least one damper element of the at least one vibration damper device is designed in particular to absorb mechanical vibration energy (e.g., convert it into deformation energy). The at least one damper element is in particular indirectly (e.g., via one or more connecting elements) or directly (i.e.in direct physical contact) to the first and second components. The at least one damper element is also arranged in particular between the first and second components. Furthermore, the only mechanical connection between the first and second components is realized by means of the at least one damper element. In other words, the first and second components are not mechanically connected to one another except via the at least one damper element. The at least one damper element can have any suitable geometric shape. For example, the at least one damper element can have a cylindrical shape. The cylindrical shape can have a circular or otherwise shaped base surface. However, the at least one damper element can also have a cuboid shape and / or a cube shape, for example. The at least one damper element can also have a spherical shape, a ring shape, or another shape with a curved surface.Carl Zeiss SMT GmbH 7The at least one flexible housing encloses the at least one damper element in a fluid-tight manner. Fluid-tight encompasses, for example, gas-tight, liquid-tight, and / or watertight. Fluid-tight encompasses, in particular, gas-tight with respect to outgassing from the at least one damper element, i.e., outgassing from a material of the at least one damper element. Outgassing from the at least one damper element can, for example, comprise HC compounds and / or other gases. The at least one flexible housing is, in particular, designed and mounted in such a way that it does not impair the damping properties of the at least one damper element. In particular, the at least one flexible housing is flexible enough to allow (i.e., not impair) the movement and / or deformation of the at least one damper element required for vibration damping.The fastening device can – instead of being used in a lithography system – also be used in a system other than a lithography system. By way of example only, the fastening device can also be used in a system for aerospace technology. According to one embodiment, the at least one flexible housing comprises at least one flexible film, at least one flexible hose, at least one flexible corrugated hose and / or at least one flexible bellows. The at least one flexible film is, for example, at least one flexible metal foil, which comprises, for example, stainless steel and / or another metal. Carl Zeiss SMT GmbH 8 According to a further embodiment, a wall thickness of the at least one flexible housing is 1 mm or less, 100 µm or less, 50 µm or less and / or 30 µm or less. Due to the low wall thickness (ieBy means of the thin-walled construction (i.e., thin-walledness) of the at least one flexible housing, a particularly high degree of flexibility of the corresponding housing is achieved. In particular, the at least one flexible housing has a low component rigidity due to the low wall thickness. For example, a wall thickness of the at least one flexible housing has a respective value at every point of the housing that is equal to or less than 1 mm, equal to or less than 100 µm, equal to or less than 50 µm, and / or equal to or less than 30 µm. This includes a case in which the wall thickness of the at least one flexible housing is not the same at every point. According to a further embodiment, a rigidity of the at least one flexible housing is equal to or less than a rigidity of the at least one damper element.Thus, the at least one flexible housing does not impair the damping properties of the at least one damper element, or only slightly impairs them. In particular, a movement and / or deformation of the at least one damper element required for vibration damping is possible despite the arrangement of the at least one flexible housing. It can also be said that a compliance of the at least one flexible housing is equal to or greater than a compliance of the at least one damper element. Carl Zeiss SMT GmbH 9 According to a further embodiment, the stiffness of the at least one flexible housing and the stiffness of the at least one damper element each comprise a material stiffness and a component stiffness of the corresponding component. The material stiffness is, in particular, a stiffness predetermined by a property of the material of the respective component (e.g.quantified by the modulus of elasticity of the corresponding material). The component stiffness is in particular a component stiffness predetermined by a geometry (e.g. also wall thickness) of the respective component. In particular, an overall stiffness of the at least one flexible housing, which comprises the material stiffness and the geometry-dependent component stiffness of the at least one flexible housing, is equal to or less than an overall stiffness of the at least one damper element, which comprises the material stiffness and the geometry-dependent component stiffness of the at least one damper element. Preferably, a component stiffness of the at least one flexible housing is equal to or less than a component stiffness of the at least one damper element. For example, a wall thickness of the at least one flexible housing is many times smaller (e.g.100 times smaller or 1000 times smaller) than a dimension / wall thickness (e.g. also each dimension) of the at least one damper element. In addition, an elastic modulus of a material of the at least one flexible housing can optionally be the same as or smaller than an elastic modulus of a material of the at least one damper element. Carl Zeiss SMT GmbH 10 The stiffness of the at least one flexible housing and the stiffness of the at least one damper element each comprise, for example, an extensional stiffness in a direction parallel to a direction pointing from the first component to the second component. The stiffness of the at least one flexible housing and the stiffness of the at least one damper element can each also comprise, for example, a shear stiffness, bending stiffness and / or torsional stiffness.According to a further embodiment, the at least one vibration damper device has at least a first and at least one second mechanical connecting element. In addition, the at least one first connecting element mechanically connects the at least one damper element to the first component, and the at least one second connecting element mechanically connects the at least one damper element to the second component. For example, the at least one first and second mechanical connecting elements are arranged and / or attached to opposite sides of the at least one damper element. For example, the at least one damper element is arranged between the at least one first and second mechanical connecting elements (e.g., clamped and / or arranged to form a sandwich structure). By way of example only, the at least one first and second connecting element each has a fastening element (e.g.,a screw, a pin or the like) for mechanical connection with the first or second component. According to a further embodiment, the at least one damper element is connected to the first component or to a / the first connecting element of the at least one vibration damper device in a materially bonded, positively locking and / or non-positively locking manner. In addition, the at least one damper element is connected to the second component or to a / the second connecting element of the at least one vibration damper device in a materially bonded, positively locking and / or non-positively locking manner. An example of a materially bonded connection is vulcanizing and / or gluing the at least one damper element onto / to the first and second connecting element.An example of a positive connection comprises one or more damper elements in the form of balls, rings and / or O-rings, each of which is arranged in one or more recesses jointly formed by the first and second connecting elements. An example of a force-locking connection comprises the at least one damper element being clamped between the first and second components or between the first and second connecting elements. According to a further embodiment, the at least one flexible housing is fastened in a fluid-tight manner to the first component or to a / the first connecting element of the at least one vibration damper device. In addition, the at least one flexible housing is fastened in a fluid-tight manner to the second component or to a / the second connecting element of the at least one vibration damper device.Consequently, the at least one flexible housing, a section of the first component or the first connecting element, and a section of the second component or the second connecting element together house the at least one damper element in a completely fluid-tight manner. In particular, the at least one flexible housing, the section of the first component or the first connecting element, and the section of the second component or the second connecting element together form a boundary of a space in which the at least one damper element is completely accommodated. For example, the at least one flexible housing is fastened to the first component or the first connecting element and to the second component or the second connecting element in a material-to-material manner (e.g., by welding).According to a further embodiment, the at least one flexible housing, the first component or a / the first connecting element and the second component or a / the second connecting element jointly enclose the at least one damper element in a fluid-tight manner. For example, the flexible housing, a section of the first component or the first connecting element and a section of the second component or the second connecting element jointly enclose the at least one damper element in a fluid-tight manner. The first and second connecting elements are, in particular, a first and second connecting element of the at least one vibration damper device. According to a further embodiment, the fastening device has at least two of the vibration damper devices, wherein the damper elements of the at least two vibration damper devices are jointly enclosed in a fluid-tight manner by means of the at least one flexible housing.As a result, two or more damper elements arranged between the first and second components can be housed together in a fluid-tight space by means of the at least one flexible housing (e.g. a single flexible housing). Carl Zeiss SMT GmbH 13 According to a further embodiment, the fastening device has at least one further component, wherein the at least one vibration damper device has at least one first vibration damper device with which the second component is fastened to the first component in a vibration-damping manner, and at least one further vibration damper device with which the at least one further component is fastened to the second component in a vibration-damping manner, and with the aid of the at least one flexible housing, the damper elements of the at least one first and the at least one further vibration damper device are housed together in a fluid-tight manner.As a result, two or more damper elements, which are arranged between different components, can be housed together in a fluid-tight space by means of the at least one flexible housing (e.g., a single flexible housing). The further component is, for example, another component of the lithography system. The further component is, for example, a mechanical component of the lithography system. However, the further component can also be an optical component of the lithography system. According to a further embodiment, the first component has a support element, and the second component has a liquid line for receiving a temperature control liquid. The liquid line is, for example, part of a temperature control device, e.g., a cooling device, of the lithography system. With the aid of the temperature control device, a thermal condition of a position-sensitive component of the lithography system can be influenced.In particular, the position-sensitive component can be temperature-controlled, i.e., cooled or heated, using the Carl Zeiss SMT GmbH 14 temperature control device. Accordingly, the temperature control device is, for example, a cooling device or a heating device. Furthermore, the temperature control fluid is, for example, a cooling fluid or a heating fluid. The fluid line serves, for example, to transport the temperature control fluid (e.g., cooling fluid) from a temperature control unit (e.g., cooling unit) to the position-sensitive component of the lithography system or to transport the temperature control fluid back from the position-sensitive component to the temperature control unit. In the following, the temperature control device is usually described as a cooling device. In other embodiments, however, the temperature control device can also be a heating device.Therefore, wherever reference is made in this application to a cooling device, cooling unit, cooling, coolant, cooling line, etc., it can equally well refer to a heating device, heating unit, heating, heating fluid, heating line, etc. The cooling device, as an example of a temperature control device, serves in particular to prevent high temperatures and temperature fluctuations in the position-sensitive component. In particular, mirrors of an EUV lithography system (as an example of position-sensitive components) heat up as a result of absorbing the high-energy EUV radiation. The resulting high temperatures and temperature fluctuations in the mirror and the associated thermal deformation of the mirror can lead to wavefront aberrations and thus impair the imaging properties of the mirrors.To prevent thermally induced deformations, mirrors of the lithography system can be actively cooled. The cooling device, as an example of a temperature control device, can also be used (in addition to or instead of), for example, to cool a sensor frame (as an example of a position-sensitive component). This can prevent thermal crosstalk (e.g., heating of the sensor frame due to thermal radiation). Thermal radiation is caused in particular by working light absorbed by mirror surfaces or structural elements of the lithography system, e.g., scattered light. Other heat sources can be, for example, actuators and heating heads. With the help of the cooling device, a stable temperature environment can be created for the sensor frame. This allows the position of one or more mirrors to be measured with greater accuracy using the sensor device held by the sensor frame.The cooling device, as an example of a temperature control device, further comprises, for example, a cooling unit for cooling the cooling liquid, one or more pumps for generating a required coolant flow rate of the cooling liquid, and one or more valves for controlling the cooling flow. According to a further embodiment, a silencer device for dampening acoustic vibrations of the temperature control liquid is arranged on the liquid line. Furthermore, the at least one vibration damper device has at least one first and at least one second vibration damper device, wherein the at least one first vibration damper device is arranged upstream of the silencer device with respect to a flow direction of the temperature control liquid in the liquid line, and the at least one second vibration damper device is arranged downstream of the silencer device with respect to the flow direction.The silencer device is, in particular, an acoustic damper device for dampening pressure fluctuations in the tempering fluid. The silencer device can be any known silencer device. The silencer device can, for example, comprise one or more (visco-)elastic elements, one or more (visco-)elastic hoses, one or more so-called silencers, and / or one or more Helmholtz resonators. Local pressure fluctuations in the tempering fluid can be caused, for example, by pumps and valves of the tempering device, as well as cross-sectional changes and deflections of the fluid line of the tempering device. This type of dynamic disturbance is also called flow-induced vibrations (FIV). The pressure fluctuations can be transmitted via fluid sound (longitudinal fluid sound wave) throughout the entire tempering circuit (e.g.,Cooling circuit) and forwarded to the temperature-controlled (e.g., cooled) position-sensitive component. This can cause a change in the position of the position-sensitive component. In particular, a pressure surge of the temperature-controlled position-sensitive component acts on surfaces of the temperature-controlled position-sensitive component. The pressure surge is converted into a force at the surfaces on which it acts. Due to this force, the position of the position-sensitive component deviates from a desired position. Generally speaking, any pressure disturbance, e.g., one or more pressure surges, a harmonic pressure signal, and / or harmonic pressure fluctuations in the temperature-controlled position-sensitive component, can cause disturbances in the temperature-controlled position-sensitive component. Carl Zeiss SMT GmbH 17Pressure fluctuations in the temperature-controlled position-sensitive component can be dampened using the proposed silencer device.However, the problem can arise that a mechanical connection between the support element and the fluid line leads to the introduction of structure-borne sound from the support element into the fluid line and thus to pressure fluctuations in the tempering fluid. To prevent this, the fastening device has the first and second vibration damper devices for damping mechanical vibrations, wherein the first and second vibration damper devices are arranged upstream and downstream of the silencer device with respect to the flow direction, respectively. According to a further embodiment, the at least one damper element comprises an elastic material.The elastic material comprises, for example, polyurethane, silicone, rubber, natural rubber, silicone rubber, fluororubber, perfluororubber, polynorbornene rubber, perfluoroalkyl vinyl ether, perfluoroalkoxy, polyvinyl chloride, one or more thermoplastic elastomers, one or more fluorothermoplastics, tetrafluoroethylene, polytetrafluoroethylene, hexafluoropropylene, and / or vinylidene fluoride. According to a further aspect, a lithography system is proposed. The lithography system has a fastening device as described above. "One" is not necessarily to be understood as being limited to exactly one element. Rather, multiple elements, such as two, three, or more, can also be provided. Any other counting term used here is also not to be understood as implying a limitation to the exact number of elements mentioned.Rather, numerical deviations upwards and downwards are possible unless stated otherwise. Further possible implementations of the invention also include combinations of features or embodiments described above or below with regard to the exemplary embodiments, which are not explicitly mentioned. A person skilled in the art will also add individual aspects as improvements or additions to the respective basic form of the invention. Further advantageous embodiments and aspects of the invention are the subject of the dependent claims and the exemplary embodiments of the invention described below. The invention is explained in more detail below using preferred embodiments with reference to the attached figures. Fig. 1 shows a schematic meridional section of a projection exposure system for EUV projection lithography according to one embodiment; Fig.Fig. 2 shows a fastening device of the projection exposure system from Fig. 1 according to a first embodiment; Fig. 3 shows a cross-section along line III-III in Fig. 2; Fig. 4 shows a fastening device of the projection exposure system from Fig. 1 according to a second embodiment; Fig. 5 shows a fastening device of the projection exposure system from Fig. 1 according to a third embodiment; Carl Zeiss SMT GmbH 19 Fig. 6 shows a fastening device of the projection exposure system from Fig. 1 according to a fourth embodiment; Fig. 7 shows a fastening device of the projection exposure system from Fig. 1 according to a fifth embodiment; and Fig. 8 shows a fastening device of the projection exposure system from Fig. 1 according to a sixth embodiment. In the figures, identical or functionally equivalent elements have been provided with the same reference numerals unless otherwise stated.Furthermore, it should be noted that the representations in the figures are not necessarily to scale. Fig. 1 shows an embodiment of a projection exposure system 1 (lithography system), in particular an EUV lithography system. One embodiment of an illumination system 2 of the projection exposure system 1 has, in addition to a light or radiation source 3, an illumination optics 4 for illuminating an object field 5 in an object plane 6. In an alternative embodiment, the light source 3 can also be provided as a separate module from the rest of the illumination system 2. In this case, the illumination system 2 does not include the light source 3. A reticle 7 arranged in the object field 5 is exposed. The reticle 7 is held by a reticle holder 8. The reticle holder 8 can be displaced, in particular in a scanning direction, via a reticle displacement drive 9. In Fig.For the purpose of explanation, Figure 1 shows a Cartesian coordinate system with an x-direction x, a y-direction y and a z-direction z. The x-direction x runs perpendicular into the drawing plane. The y-direction y runs horizontally and the z-direction z runs vertically. In Figure 1, the scanning direction runs along the y-direction y. The z-direction z runs perpendicular to the object plane 6. The projection exposure system 1 comprises projection optics 10. The projection optics 10 serve to image the object field 5 into an image field 11 in an image plane 12. The image plane 12 runs parallel to the object plane 6. Alternatively, an angle other than 0° between the object plane 6 and the image plane 12 is also possible. A structure on the reticle 7 is imaged onto a light-sensitive layer of a wafer 13 arranged in the region of the image field 11 in the image plane 12. The wafer 13 is held by a wafer holder 14.The wafer holder 14 can be displaced, in particular along the y-direction y, via a wafer displacement drive 15. The displacement of the reticle 7, on the one hand, via the reticle displacement drive 9, and of the wafer 13, on the other hand, via the wafer displacement drive 15, can be synchronized with one another. The light source 3 is an EUV radiation source. The light source 3 emits, in particular, EUV radiation 16, which is also referred to below as useful radiation, illumination radiation, or illumination light. The useful radiation 16 has, in particular, a wavelength in the range between 5 nm and 30 nm. The light source 3 can be a plasma source, for example, an LPP source (Laser Produced Plasma, plasma generated with the aid of a laser) or a DPP source (Gas Discharged Produced Plasma, plasma generated by means of a gas discharge). It can also be a synchrotron-based radiation source.The light source 3 can be a free-electron laser (FEL). Carl Zeiss SMT GmbH 21 The illumination radiation 16 emanating from the light source 3 is bundled by a collector 17. The collector 17 can be a collector with one or more ellipsoidal and / or hyperboloidal reflection surfaces. The at least one reflection surface of the collector 17 can be exposed to the illumination radiation 16 at grazing incidence (GI), i.e., at angles of incidence greater than 45°, or at normal incidence (NI), i.e., at angles of incidence less than 45°. The collector 17 can be structured and / or coated on the one hand to optimize its reflectivity for the useful radiation and on the other hand to suppress stray light.After the collector 17, the illumination radiation 16 propagates through an intermediate focus in an intermediate focal plane 18. The intermediate focal plane 18 can represent a separation between a radiation source module, comprising the light source 3 and the collector 17, and the illumination optics 4. The illumination optics 4 comprise a deflecting mirror 19 and, downstream of this in the beam path, a first facet mirror 20. The deflecting mirror 19 can be a flat deflecting mirror or, alternatively, a mirror with a beam-influencing effect beyond the pure deflection effect. Alternatively or additionally, the deflecting mirror 19 can be designed as a spectral filter that separates a useful light wavelength of the illumination radiation 16 from stray light of a different wavelength.If the first facet mirror 20 is arranged in a plane of the illumination optics 4 that is optically conjugate to the object plane 6 as the field plane, it is also referred to as a field facet mirror. The first facet mirror 20 comprises a plurality of individual first facets 21, which can also be referred to as field facets. Only a few of these first facets 21 are shown in Fig. 1 as examples. Carl Zeiss SMT GmbH 22 The first facets 21 can be designed as macroscopic facets, in particular as rectangular facets or as facets with an arcuate or part-circular edge contour. The first facets 21 can be designed as flat facets or, alternatively, as convex or concave curved facets. As is known, for example, from DE 102008009600 A1, the first facets 21 themselves can each be composed of a plurality of individual mirrors, in particular a plurality of micromirrors.The first facet mirror 20 can be designed, in particular, as a microelectromechanical system (MEMS system). For details, reference is made to DE 102008009600 A1. Between the collector 17 and the deflecting mirror 19, the illumination radiation 16 runs horizontally, i.e., along the y-direction y. In the beam path of the illumination optics 4, a second facet mirror 22 is arranged downstream of the first facet mirror 20. If the second facet mirror 22 is arranged in a pupil plane of the illumination optics 4, it is also referred to as a pupil facet mirror. The second facet mirror 22 can also be arranged at a distance from a pupil plane of the illumination optics 4. In this case, the combination of the first facet mirror 20 and the second facet mirror 22 is also referred to as a specular reflector. Specular reflectors are known from US 2006 / 0132747 A1, EP 1614 008 B1 and US 6,573,978.The second facet mirror 22 comprises a plurality of second facets 23. In the case of a pupil facet mirror, the second facets 23 are also referred to as pupil facets. Carl Zeiss SMT GmbH 23 The second facets 23 can also be macroscopic facets, which can, for example, be round, rectangular, or hexagonal, or alternatively facets composed of micromirrors. In this regard, reference is also made to DE 102008009600 A1. The second facets 23 can have flat or, alternatively, convex or concave curved reflection surfaces. The illumination optics 4 thus forms a double-faceted system. This basic principle is also referred to as a fly's eye integrator. It may be advantageous not to arrange the second facet mirror 22 exactly in a plane which is optically conjugated to a pupil plane of the projection optics 10.In particular, the second facet mirror 22 can be arranged tilted relative to a pupil plane of the projection optics 10, as described, for example, in DE 102017220586 A1. With the help of the second facet mirror 22, the individual first facets 21 are imaged into the object field 5. The second facet mirror 22 is the last bundle-forming or actually the last mirror for the illumination radiation 16 in the beam path in front of the object field 5. In a further embodiment of the illumination optics 4 (not shown), a transmission optics can be arranged in the beam path between the second facet mirror 22 and the object field 5, which transmission optics contributes in particular to the imaging of the first facets 21 in the object field 5. The transmission optics can have exactly one mirror, but alternatively also two or more mirrors, which are arranged one behind the other in the beam path of the illumination optics 4.The transmission optics can in particular comprise one or two mirrors for normal incidence (NI mirrors, Normal Incidence Mirrors) and / or one or two mirrors for grazing incidence (GI mirrors, Grazing Incidence Mirrors). In the embodiment shown in Fig. 1, the illumination optics 4 has exactly three mirrors after the collector 17, namely the deflecting mirror 19, the first facet mirror 20 and the second facet mirror 22. In a further embodiment of the illumination optics 4, the deflecting mirror 19 can also be omitted, so that the illumination optics 4 can then have exactly two mirrors after the collector 17, namely the first facet mirror 20 and the second facet mirror 22. The imaging of the first facets 21 by means of the second facets 23 or with the second facets 23 and a transmission optics into the object plane 6 is generally only an approximate imaging.The projection optics 10 comprises a plurality of mirrors Mi, which are numbered according to their arrangement in the beam path of the projection exposure system 1. In the example shown in Fig. 1, the projection optics 10 comprises six mirrors M1 to M6. Alternatives with four, eight, ten, twelve or a different number of mirrors Mi are also possible. The projection optics 10 is a doubly obscured optic. The penultimate mirror M5 and the last mirror M6 each have a passage opening for the illumination radiation 16. The projection optics 10 has an image-side numerical aperture that is greater than 0.5 and can also be greater than 0.6 and can be, for example, 0.7 or 0.75. Carl Zeiss SMT GmbH 25 Reflecting surfaces of the mirrors Mi can be designed as freeform surfaces without a rotational symmetry axis.Alternatively, the reflection surfaces of the mirrors Mi can be designed as aspherical surfaces with exactly one axis of rotational symmetry of the reflection surface shape. The mirrors Mi, just like the mirrors of the illumination optics 4, can have highly reflective coatings for the illumination radiation 16. These coatings can be designed as multilayer coatings, in particular with alternating layers of molybdenum and silicon. The projection optics 10 has a large object-image offset in the y-direction y between a y-coordinate of a center of the object field 5 and a y-coordinate of the center of the image field 11. This object-image offset in the y-direction y can be approximately as large as a z-distance between the object plane 6 and the image plane 12. The projection optics 10 can, in particular, be anamorphic. In particular, it has different magnifications βx, βy in the x and y directions x, y.The two magnifications βx, βy of the projection optics 10 are preferably (βx, βy) = (+ / - 0.25, + / - 0.125). A positive magnification β means an image without image inversion. A negative sign for the magnification β means an image with image inversion. The projection optics 10 thus results in a reduction in the ratio 4:1 in the x-direction, i.e., in the direction perpendicular to the scanning direction. The projection optics 10 results in a reduction of 8:1 in the y-direction, i.e., in the scanning direction. Carl Zeiss SMT GmbH 26 Other magnifications are also possible. Image scales with the same sign and absolutely equal in the x and y directions x, y, for example with absolute values ​​of 0.125 or 0.25, are also possible. The number of intermediate image planes in the x and y directions x, y in the beam path between the object field 5 and the image field 11 can be the same or can be different, depending on the design of the projection optics 10.Examples of projection optics with different numbers of such intermediate images in the x and y directions x, y are known from US 2018 / 0074303 A1. Each of the second facets 23 is assigned to exactly one of the first facets 21 to form a respective illumination channel for illuminating the object field 5. This can result in particular in illumination according to the Köhler principle. The far field is broken down into a plurality of object fields 5 with the aid of the first facets 21. The first facets 21 generate a plurality of images of the intermediate focus on the second facets 23 respectively assigned to them. The first facets 21 are each imaged onto the reticle 7 by an assigned second facet 23 in a manner superimposed on one another to illuminate the object field 5. The illumination of the object field 5 is in particular as homogeneous as possible. It preferably has a uniformity error of less than 2%.Field uniformity can be achieved by superimposing different illumination channels. The illumination of the entrance pupil of the projection optics 10 can be geometrically defined by arranging the second facets 23. By selecting the illumination channels, in particular the subset of the second facets 23 that guide light, the intensity distribution in the entrance pupil of the Carl Zeiss SMT GmbH 27 projection optics 10 can be adjusted. This intensity distribution is also referred to as illumination setting or illumination pupil filling. A likewise preferred pupil uniformity in the area of ​​defined illuminated sections of an illumination pupil of the illumination optics 4 can be achieved by redistributing the illumination channels. Further aspects and details of the illumination of the object field 5 and, in particular, of the entrance pupil of the projection optics 10 are described below.The projection optics 10 can, in particular, have a homocentric entrance pupil. This can be accessible. It can also be inaccessible. The entrance pupil of the projection optics 10 cannot usually be precisely illuminated with the second facet mirror 22. When the projection optics 10 images the center of the second facet mirror 22 telecentrically onto the wafer 13, the aperture rays often do not intersect at a single point. However, a surface can be found in which the pairwise determined distance of the aperture rays is minimal. This surface represents the entrance pupil or a surface conjugated to it in spatial space. In particular, this surface exhibits a finite curvature. The projection optics 10 can have different positions of the entrance pupil for the tangential and for the sagittal beam path.In this case, an imaging element, in particular an optical component of the transmission optics, should be provided between the second facet mirror 22 and the reticle 7. With the help of this optical element, the different positions of the tangential entrance pupil and the sagittal entrance pupil can be taken into account. Carl Zeiss SMT GmbH 28 In the arrangement of the components of the illumination optics 4 shown in Fig. 1, the second facet mirror 22 is arranged in a surface conjugated to the entrance pupil of the projection optics 10. The first facet mirror 20 is arranged tilted to the object plane 6. The first facet mirror 20 is arranged tilted to an arrangement plane that is defined by the deflection mirror 19. The first facet mirror 20 is arranged tilted to an arrangement plane that is defined by the second facet mirror 22.Fig. 2 shows a fastening device 100 of the lithography system 1 from Fig.1 according to a first embodiment. The fastening device 100 comprises a first and second component 102, 104 of the lithography system 1, which are fastened to one another in the fastening device 100. The fastening device 100 also comprises at least one vibration damper device 106 with at least one damper element 108. In particular, the second component 104 is fastened to the first component 102 in a vibration-damping manner by means of the at least one vibration damper device 106. As a result, fewer or no mechanical vibrations are transmitted between the first and second components 102, 104. The at least one damper element 108 comprises, for example, an elastic material 110. The at least one damper element 108 is designed in particular to absorb mechanical vibration energy (e.g., to convert it into deformation energy). As shown in Fig.As shown in Fig. 2, the fastening device 100 also has at least one flexible housing 112, by means of which the at least one damper element 108 is enclosed in a fluid-tight manner. The at least one flexible housing 112 is used to prevent the escape of outgassing from the at least one Carl Zeiss SMT GmbH 29 damper element 108 of the at least one vibration damper device 106. By way of example, Fig. 2 (and partially in Figs. 4 and 5) shows exactly one vibration damper device 106 with exactly one damper element 108 and exactly one flexible housing 112. However, several vibration damper devices 106, several damper elements 108 and / or several flexible housings 112 may also be provided, even if not explicitly described below. The flexible housing 112 (e.g., together with sections of the first and second components 102, 104) encloses, in particular, a first space 114 (enclosed space) in a fluid-tight manner.The damper element 108 is completely accommodated in this first space 114. The flexible housing 112 now prevents outgassing from the damper element 108 from escaping from the first space 114 and reaching an environment 116 (second space 116) outside the first space 114. The flexible housing 112 can thus prevent outgassing from settling, for example, on mirror surfaces of mirrors (e.g., the mirrors 20, 22, M1-M6 in Fig. 1) arranged in the second space 116. Fig. 3 shows a cross-section along line III-III in Fig. 2. As can be seen in Fig. 3, the flexible housing 112 has a closed circumference U when viewed in cross-section. The flexible housing 112 has, for example, a flexible film, e.g. B. a flexible metal foil made of stainless steel. The flexible housing 112 has, in particular, a very thin wall with a wall thickness D1 (e.g., thickness D1 of the foil), which is, for example, 100 µm or less or even 50 µm or less.The low wall thickness (e.g., film thickness) of the flexible housing 112 achieves a high degree of flexibility of the flexible housing 112. It should be noted that the wall thickness D1 of the housing 112 is exaggerated in Fig. 3 for illustrative purposes. As can be seen in Fig. 2, the flexible film of the flexible housing 112 can be tubular and form a flexible hose, in particular a flexible corrugated hose. The flexible housing 112 can also be designed as a flexible bellows. The flexible housing 112 is, in particular, designed and mounted in such a way that it does not impair the damping properties of the damper element 108.For this purpose, the flexibility of the flexible housing 112 is in particular sufficiently large so that a movement and / or deformation of the damper element 108 required for vibration damping is possible despite the housing 112 and is not impaired by the housing 112. In particular, a stiffness C1 of the flexible housing 112 is equal to or less than a stiffness C2 of the damper element 108. C1 and C2 are each a total stiffness of the corresponding component 112, 108. In other words, the stiffness C1 of the flexible housing 112 includes a material stiffness C1. M and a component stiffness C1 Bof the flexible housing 112. Likewise, the stiffness C2 of the damper element 108 includes a material stiffness C2M and a component stiffness C2B of the damper element 108. Preferably, a low stiffness C1 of the flexible housing 112 is realized predominantly or exclusively via a low component stiffness C1B determined by a geometry of the flexible housing 112. Preferably, the wall thickness D1 of the flexible housing 112 is so thin that sufficient flexibility is provided solely by this - e.g. B. also independent of a material stiffness C1M (e.g., a modulus of elasticity) of the housing 112. The Carl Zeiss SMT GmbH 31 wall thickness D1 of the flexible housing 112 is, in particular, many times smaller than any dimension D2 of the damper element 108. The at least one damper element 108 can have any suitable geometric shape. In the example of Fig.2, 3, the damper element 108 has a cylindrical shape with a circular base surface. However, the damper element 108 can also have a cylindrical shape with a base surface other than circular. Furthermore, the damper element 108 can also have a cuboid shape and / or a cube shape. In the embodiment of Fig. 2, the damper element 108 is directly and immediately attached to the first and second components 102, 104 (i.e., in direct physical contact with both components 102, 104, more precisely with surfaces 118, 120 of the two components 102, 104). For example, the damper element 108 is integrally connected to both the first and second components 102, 104. The damper element 108 can, for example, be vulcanized onto the first and second components 102, 104. However, the damper element 108 can also be glued to the first and second components 102, 104, for example.Instead of being materially connected, the damper element 108 can, for example, also be non-positively connected to the first and second components 102, 104. This is indicated by the dashed arrows F in Fig. 2. In this case, the damper element 108 is clamped between the first and second components 102, 104 by a force F (clamping force). A positive connection is also possible in order to connect the damper element 108 to the first and second components 102, 104, as shown in Fig. 5. Carl Zeiss SMT GmbH 32 In the embodiment of Fig. 2, the flexible housing 112 is fastened in a fluid-tight manner to both the first component 102 and the second component 104. For example, the flexible housing 112 is materially connected to the first and second components 102, 104, e.g. B. by welding.As shown in Fig.As can be seen in Fig. 2, the flexible housing 112, a section 122 of the first component 102 (more precisely, a section 122 of the surface 118 of the first component 102), and a section 124 of the second component (more precisely, a section 124 of the surface 120 of the second component 104) jointly enclose the damper element 108 in a fluid-tight manner. Fig. 4 shows a fastening device 200 according to a second embodiment. The fastening device 200 has—like the fastening device 100 in Fig. 2—a first and second component 202, 204, a vibration damper device 206 with a damper element 208, and a flexible housing 212. In the following, only differences from the first embodiment in Fig. 2 are described. In the fastening device 200 according to the second embodiment (Fig. 4), the vibration damper device 206 has a first and second mechanical connecting element 226, 228.The first connecting element 226 mechanically connects the damper element 208 to the first component 202. Furthermore, the second connecting element 228 mechanically connects the damper element 208 to the second component 204. In particular, the first connecting element 226 and the second connecting element 228 are each fastened to the damper element 208. These fastenings / connections are preferably realized with a material fit, e.g., by vulcanization and / or gluing. However, positive-locking (Fig. 2) and / or non-positive-locking (Fig. 5) connections are also possible. Carl Zeiss SMT GmbH 33 In addition, the first and second connecting elements 226, 228 are fastened to the first and second components 202, 204, respectively. By way of example only, the first and second connecting elements 226, 228 each have a fastening element 230, 232 (e.g. a screw) for mechanical connection to the first and second components 202, 204, respectively. In the example of Fig.In Fig. 4, the flexible housing 212 is attached in a fluid-tight manner to the first and second connecting elements 226, 228—instead of to the first and second components 102, 104 as in Fig. 2. However, in the second embodiment, the flexible housing 212 can also be attached in a fluid-tight manner to the first and second components 202, 204 (and not to the first and second connecting elements 226, 228). In the example of Fig. 4, the flexible housing 212, the first connecting element 226, and the second connecting element 228 jointly enclose the damper element 208 in a fluid-tight manner. Fig. 5 shows a fastening device 300 according to a third embodiment. The fastening device 300 has - like the fastening devices 100, 200 in Fig. 2, 4 - a first and second component 302, 304, a vibration damper device 306 with at least one damper element 308 and a flexible housing 312.The vibration damper device 306 also has—like the vibration damper device 206 in Fig. 4—a first and second connecting element 326, 328. Only differences from the first and second embodiments in Figs. 2, 4 are described below. In the embodiment of Fig. 5, several damper elements 308 are provided, which are positively connected to the first and second connecting elements 326, 328 of the vibration damper device 306. Carl Zeiss SMT GmbH 34 In particular, the first and second connecting elements 326, 328 in Fig. 5 differ from the first and second connecting elements 226, 228 in Fig. 4 in that they each have a different geometric shape. For example, the first and second connecting elements 326, 328 together form a plurality of recesses 334 between them. Furthermore, the vibration damper device 306 comprises a plurality of damper elements 308, e.g. in the form of balls or rings.Each damper element 308 is arranged in a corresponding one of the plurality of recesses 334 such that the first and second connecting elements 326, 328 do not touch. Fig. 6 shows a fastening device 400 according to a fourth embodiment. The fastening device 400 has—like the fastening devices 100 in Fig. 2—a first and second component 402, 404, at least one vibration damper device 406, 406' with at least one damper element 408, 408', and a flexible housing 412. Only differences from the first embodiment in Fig. 2 are described below. As can be seen in Fig. 6, the fastening device 400 has at least two of the vibration damper devices 406, 406'. In Fig. 6, exactly two vibration damper devices 406, 406' are shown, although more than two may be provided. In the embodiment of Fig.6, the damper elements 408, 408' of the at least two vibration damper devices 406, 406' are now jointly enclosed in a fluid-tight manner by the flexible housing 412. In this embodiment, one flexible housing 412 is thus sufficient to jointly enclose several damper elements 408, 408' in a fluid-tight manner. Fig. 7 shows a fastening device 500 according to a fifth embodiment. The fastening device 500 has—like the Carl Zeiss SMT GmbH 35 fastening devices 100 in Fig. 2—a first and second component 502, 504, at least one vibration damper device 506, 506' with at least one damper element 508, 508', and a flexible housing 512. In the following, only differences from the first embodiment in Fig. 2 are described. As can be seen in Fig. 7, the fastening device 500 has at least one further component 534 of the lithography system 1.In addition, the fastening device 500 has at least two of the vibration damper devices 506, 506'. Exactly two vibration damper devices 506, 506' (first and second vibration damper devices 506, 506') are shown in Fig. 7, although more than two vibration damper devices 506, 506' may also be provided. The first vibration damper device 506 secures the second component 504 to the first component 502 in a vibration-damping manner. Furthermore, the second vibration damper device 506' secures the further component 534 to the second component 504 in a vibration-damping manner. In the embodiment of Fig. 7, the damper elements 508, 508' of the at least two vibration damper devices 506, 506' are jointly enclosed in a fluid-tight manner by the flexible housing 512.In this embodiment, a flexible housing 512 is thus sufficient to jointly enclose a plurality of damper elements 508, 508' between more than two components 502, 504, 534 in a fluid-tight manner. Although not shown in Figures 6 and 7, each of the vibration damper devices 406, 406', 506, 506'—similar to the vibration damper device 206 in Figure 4—can have a first and second connecting element 226, 228. Carl Zeiss SMT GmbH 36 Figure 8 shows a fastening device 600 according to a sixth embodiment. The fastening device 600 has—like the fastening devices 100 in Fig. 2—a first and second component 602, 604, at least one vibration damper device 606, 606' with at least one damper element 608, 608', and at least one flexible housing 612, 612'. Only differences from the first embodiment in Fig. 2 are described below. In Fig. 8, the first component 602 is a support element 602a.Furthermore, the second component 604 is a liquid line 604a (or a section of a liquid line) for receiving a temperature control liquid 636. The liquid line 604a is, in particular, part of a temperature control device of the lithography system 1. The temperature control device (not shown) serves, for example, to control the temperature (e.g., cooling) of one or more of the mirrors 20, 22, M1 to M6 of the lithography system 1 (Fig. 1). The fastening device 600 comprises a sound dampening device 638 arranged on the liquid line 604a for dampening acoustic vibrations of the temperature control liquid 636. In addition, the fastening device 600 has a first and a second vibration dampening device 606, 606'. The first vibration damper device 606 is arranged in the liquid line 604a upstream of the silencer device 638 with respect to a flow direction R of the tempering liquid 636.Furthermore, the second vibration damper device 606' is arranged downstream of the silencer device 606 with respect to the flow direction R. In Fig. 8, each vibration damper device 606, 606' has a first and second connecting element (without reference numeral) similar to the vibration damper device 206 in Fig. 4. However, the vibration damper devices 606, 606' in Fig. 8, although not shown, can also be provided without these connecting elements (i.e., as shown in Fig. 2). Pressure fluctuations of the temperature control liquid 636 can be dampened by the silencer device 638. Furthermore, the introduction of mechanical vibrations from the support element 602a into the liquid line 604a, which in turn can lead to further pressure fluctuations of the temperature control liquid 636, is also to be prevented.For this purpose, the fastening device 600 has the first and second vibration damper devices 606, 606' for damping mechanical vibrations. Although not shown in the figures, the fastening devices 100 to 600 described herein can also be used, for example, in a DUV lithography system. Although the present invention has been described using exemplary embodiments, it is capable of numerous modifications.

[0002] Carl Zeiss SMT GmbH 38 LIST OF REFERENCE SYMBOLS1 Projection exposure system2 Illumination system3 Light source4 Illumination optics5 Object field6 Object plane 7 Retikel 8 Reticle holder9 Reticle displacement drive10 Projection optics11 Image field12 Image plane 13 Wafer14 Wafer holder 15 Wafer displacement drive 16 Illumination radiation 17 Collector 18 Intermediate focal plane 19 Deflecting mirror 20 First facet mirror 21 First facet 22 Second facet mirror 23 Second facet 100 Fastening device 102 Component 104 Component 106 Vibration damper device 108 Damper element Carl Zeiss SMT GmbH 39110 Material 112 Enclosure 114 Raum 116 Raum118 Surface 120 Surface 122 Section 124 Section 200 Fastening device 202 Component 204 Component 206 Vibration damper device 208 Damper element 212 Enclosure 226 Connecting element 228 Connecting element 230 Fastening element 232 Fastening element 300 Fastening device 302 Component 304 Component 306 Vibration damper device 308 Damper element 312 Enclosure 326 Connecting element 328 Connecting element 334 Recesses 400 Fastening device 402 Component 404 Component Carl Zeiss SMT GmbH 404 06, 406' Vibration damper device 408, 408' Damper element 412 Enclosure 500 Fastening device 502 Component 504 Component 506, 506' Vibration damper device 508, 508' Damper element 512 Enclosure 534 Component 600 Fastening device 602 Component 602a Supporting element 604 Component 604a Fluid line606, 606' Vibration damper device608, 608' Damper element612, 612' Housing636 Tempering fluid638 Silencer deviceC1 StiffnessC1 BComponent stiffness C1M Material stiffnessC2 StiffnessC2 B Component stiffness C2M Material stiffnessD1 Wall thicknessD2 Dimension F Kraft M1-M6 Mirror Carl Zeiss SMT GmbH 41 Richtung Umfang

Claims

Carl Zeiss SMT GmbH 42 PATENT CLAIMS1. A fastening device (100) for a lithography system (1), comprising a first and a second component (102, 104), at least one vibration damper device (106) with at least one damper element (108), with which the second component (104) is fastened to the first component (102) in a vibration-damping manner, and at least one flexible housing (112) by means of which the at least one damper element (108) is housed in a fluid-tight manner, wherein the first component (602) has a support element (602a), and the second component (604) has a liquid line (604a) for receiving a temperature control liquid (636), a sound damper device (638) for damping acoustic vibrations of the temperature control liquid (636) is arranged on the liquid line (604a), which sound damper device (638) has at least one vibration damper device (606, 606') has at least one first and at least one second vibration damper device (606, 606'),the at least one first vibration damper device (606) is arranged upstream of the silencer device (638) in the liquid line (604a) with respect to a flow direction (R) of the tempering liquid (636), and the at least one second vibration damper device (606') is arranged downstream of the silencer device (638) with respect to the flow direction (R).

2. Fastening device according to claim 1, wherein the at least one flexible housing (112) comprises at least one flexible film, at least one flexible hose, at least one flexible corrugated hose, and / or at least one flexible bellows. Carl Zeiss SMT GmbH 433. Fastening device according to claim 1 or 2, wherein a wall thickness (D1) of the at least one flexible housing (112) is 1 mm or less, 100 µm or less, 50 µm or less and / or 30 µm or less.

4. Fastening device according to one of claims 1 to 3, wherein a stiffness (C1) of the at least one flexible housing (112) is equal to or less than a stiffness (C2) of the at least one damper element (108).

5. Fastening device according to claim 4, wherein the stiffness (C1) of the at least one flexible housing (112) and the stiffness (C2) of the at least one damper element (108) each have a material stiffness (C1 M , C2 M ) and a component stiffness (C1 B , C2 B) of the corresponding component (112, 108).

6. Fastening device according to one of claims 1 to 5, wherein the at least one vibration damper device (206) has at least a first and at least one second mechanical connecting element (226, 228), the at least one first connecting element (226) mechanically connects the at least one damper element (208) to the first component (202), and the at least one second connecting element (228) mechanically connects the at least one damper element (208) to the second component (204).7.Fastening device according to one of claims 1 to 6, wherein the at least one damper element (108, 208) is connected to the first component (102) or to a / the first connecting element (226) of the at least one vibration damper device (206) in a materially bonded, positively bonded and / or non-positively bonded manner, and the at least one damper element (108, 208) is connected to the second component (104) or to a / the second connecting element (228) of the at least one vibration damper device (206) in a materially bonded, positively bonded and / or non-positively bonded manner. Carl Zeiss SMT GmbH 448. Fastening device according to one of claims 1 to 7, wherein the at least one flexible housing (112, 212) is fastened in a fluid-tight manner to the first component (102) or to a / the first connecting element (226) of the at least one vibration damper device (206), and the at least one flexible housing (112) is fastened in a fluid-tight manner to the second component (104) or to a / the second connecting element (228) of the at least one vibration damper device (206).

9. Fastening device according to one of claims 1 to 8, wherein the at least one flexible housing (112, 212), the first component (102) or a / the first connecting element (226) and the second component (104) or a / the second connecting element (228) together enclose the at least one damper element (108, 208) in a fluid-tight manner.10.Fastening device according to one of claims 1 to 9, comprising at least two of the vibration damper devices (406, 406'), wherein the damper elements (408, 408') of the at least two vibration damper devices (406, 406') are jointly housed in a fluid-tight manner by means of the at least one flexible housing (412).

11. Fastening device according to one of claims 1 to 10, comprising at least one further component (534), wherein the at least one vibration damper device (506, 506') has at least one first vibration damper device (506) with which the second component (504) is fastened to the first component (502) in a vibration-damping manner, and at least one further vibration damper device (506') with which the at least one further component (534) is fastened to the second component (504) in a vibration-damping manner, and. Carl Zeiss SMT GmbH 45, the damper elements (508, 508') of the at least one first and the at least one further vibration damper device (506, 506') are jointly housed in a fluid-tight manner using the at least one flexible housing (512).

12. Fastening device according to one of claims 1 to 11, wherein the at least one damper element (108) comprises an elastic material (110).

13. Lithography system (1) with a fastening device (100) according to one of claims 1 to 12.

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