Cooling device for cooling an electronic component of a motor vehicle, electronic assembly and motor vehicle

Abstract

The invention relates to a cooling device (1) for cooling an electronic component (2) of a motor vehicle (3) with improved cooling performance. The cooling device has a housing (4) with an outer side (5) which has an area (6) on which the electronic component (3) can be arranged, wherein the housing (4) forms a flow channel (7) on the inside for guiding cooling fluid, wherein pins (9, 10) are formed in a section (8) of the housing (4) opposite the area (6), which pins extend into the flow channel (7), and turbulators (11) are formed inside the flow channel (7).

Description

[0001] Cooling device for cooling an electronic component of a motor vehicle, electronic assembly and motor vehicle

[0002] The present invention relates to a cooling device for cooling an electronic component of a motor vehicle, comprising a housing with an outer side which has an area on which the electronic component can be arranged, wherein the housing forms a flow channel on the inside for guiding cooling fluid. The invention further relates to a method for manufacturing the cooling device, as well as to an electronic assembly comprising a cooling device and an electronic component which is arranged on the area of the outer side of the housing. The invention further relates to an associated motor vehicle.

[0003] Technological progress in motor vehicles, especially in autonomous vehicles, depends heavily on the development of electronic components, particularly electronic control units (ECU). The exponential increase in the power requirements of electronic components in automotive engineering poses a major challenge for cooling solutions. Passive cooling is a thing of the past as its efficiency is insufficient for newer generation ECUs. Typically, all ECUs that consume more than 40 W of power require active cooling solutions.

[0004] US 2020 / 0132026 A1 shows a device for an air box for cooling an engine control unit. CN 218634611 U and CN 212786395 U show further cooling devices.

[0005] A cooling plate for cooling an electronic control unit of an engine is known from the publication US 6,302,190 B1 . The cooling plate comprises a housing having a flat front surface on which the ECU can be mounted, with a central bag for receiving components protruding from the rear of the ECU. The housing also includes flow channels through which a fluid can flow around at least a portion of the periphery of the central bag to transfer heat to the fluid from areas of the front surface surrounding the bag.

[0006] The publication WO 2023 / 280818 A1 describes an electronic computing device comprising a cooling device with a columnar structure. The publication US 11 ,726,534 B2 discloses a computing unit comprising a liquid cooler. However, the efficiency of these cooling devices could be improved.

[0007] The object of the invention is to provide an improved concept for a cooling device for cooling an electronic component for a motor vehicle, for a method for manufacturing the cooling device, for an electronic assembly and for a motor vehicle, which have a higher efficiency and maximize heat dissipation from the electronic component.

[0008] The object is solved by the subject matters of the independent patent claims. Advantageous further embodiments of the invention are described by the dependent patent claims, the following description and the figures.

[0009] A first aspect of the invention relates to a cooling device for cooling an electronic component of a motor vehicle. In particular, the cooling device has a housing comprising an outer side. The outer side has an area on which the electronic component can be arranged. On the inner side, the housing in particular forms a flow channel for guiding cooling fluid. In a section of the inner side of the housing opposite the area, pins are formed that extend into the flow channel. Furthermore, turbulators or at least one turbulator are formed at least sectionally inside the flow channel.

[0010] Such a cooling device can significantly increase its cooling efficiency compared to known cooling devices in automotive engineering. In particular, heat dissipation can be maximized. The turbulators can be used to induce turbulence in the fluid flowing through the flow channel, so that in particular the heat transfer coefficient (HTC) and a mass flow of the cooling fluid can be increased, and a pressure loss in the flow can be reduced by reducing a boundary layer in the flow. In particular, turbulators can also ensure that a stagnant area of the fluid flow, which can only contribute very little to the cooling effect, is minimized.

[0011] The pins, which extend into the flow channel opposite the area where the electronic component can be arranged, can advantageously guide the heat from the electronic component into the flow channel, in which the heat can be dissipated by the fluid. In particular, the pins significantly increase the surface area of the housing around which the cooling fluid flows, so that more heat can be dissipated and the efficiency can thus be increased.

[0012] The combination of pins and turbulators in the flow channel can be particularly advantageous. The turbulators can increase the turbulence in the fluid flow so that a more turbulent fluid flow flows around the pins. As a result of the increased heat transfer coefficient of the turbulent fluid flow at the pins, more heat can be absorbed and dissipated by the fluid from the pins, improving the overall cooling performance. The described cooling device design can be used for any electronic component of a motor vehicle that requires a lot of energy and thus generates waste heat that needs to be dissipated. The increased computing power of the latest generation of ECUs for motor vehicles may require a cooling solution according to the invention in order to prevent the computer chips and other electronic components and parts on the circuit boards from overheating.

[0013] The electronic component can be any electronic element that generates heat during operation, which must be dissipated by a cooling device so that the electronic component does not overheat. For example, the electronic element can be an ECU, a computer chip, a processor, an integrated circuit or a system-on-chip (SoC), which can be used in particular for control units of the motor vehicle.

[0014] In particular, the housing of the cooling device can be metallic, for example made of aluminum, which promotes heat conduction in the housing. In particular, the housing can have an outer side and an inner side opposite the outer side. The outer side can also be referred to as the bottom side. The opposite side of the bottom side, i.e. the top side of the housing, can at least partially correspond to the inner side of the housing. The inner side is referred to as such because it can be closed by a cover of the cooling device, so that the inner side of the housing is inside the cooling device.

[0015] The area on which the electronic component can be arranged can preferably be recessed or raised on the outer side and form a plane. The area can preferably be formed complementary to the electronic component.

[0016] The electronic component can, for example, be connected to the area comprising a thermal interface material (TIM), in particular a heat-conducting paste or similar, or can also make direct contact. An air gap can also be provided between the electronic component and the outer side of the housing.

[0017] In particular, the inner side of the housing forms the flow channel. In particular, the flow channel can be recessed into the inner side of the housing. For example, the flow channel may have been milled out of a blank of the housing. Alternatively, the housing comprising the flow channel can be produced by mould casting, for example.

[0018] The flow channel can be tubular or hose-shaped, at least sectionally, and can be formed to guide the flowing cooling fluid. A main flow direction of the cooling fluid can be directed essentially parallel to a main extension plane of the housing or the cooling device, wherein the main flow direction in this plane can change depending on the shape of the flow channel. In particular, the cooling fluid can be a cooling liquid, such as cooling water, or cooling air.

[0019] The area where the pins are formed is located in particular on the inner side of the housing. In particular, the housing forms the pins in the said section of the inner side. Preferably, the pins are formed integrally with the housing. In particular, the pins are metallic, preferably made of aluminum.

[0020] The pins can extend mainly perpendicular to the main plane of the housing or perpendicular to the outer side. Inside the flow channel, the pins extend in particular transversely to a main flow of the cooling fluid, so that the cooling fluid can flow around the surfaces of the pins and dissipate heat.

[0021] In particular, the pins are arranged in the section of the inner side opposite the area on the outer side where the electronic component can be arranged. In this way, heat can be guided into the pins via the housing in a focused and short way, which can then be dissipated by the fluid flow.

[0022] The pins can, for example, be formed like columns, in particular each as a round column. In said section, a plurality of pins may be formed, preferably several pins along the flow channel one behind the other and side by side, viewed in the main flow direction of the cooling fluid. In particular, the section may be divided into several subsections of the flow channel.

[0023] Furthermore, turbulators are formed at least sectionally inside the flow channel. A turbulator can be described as an element that transforms a laminar boundary layer into a turbulent boundary layer and / or makes the fluid flow more turbulent overall. In particular, this can increase the HTC and reduce the formation of stagnant flow areas.

[0024] In addition, the turbulators can be used to reduce the boundary layer of the fluid flow. As a result, the friction of the fluid flow with the flow channel walls can be reduced, so that the speed and mass flow of the flow can be increased and a pressure loss in the flow can be reduced. This can increase the overall cooling performance of the cooling device. Turbulators can be incorporated into the flow channel in many ways. For example, the turbulators can be elements or disturbances in a surface of the flow channel, wherein the surface of the flow channel can correspond to a part of the inner side of the housing or a part of the cover. On the other hand, turbulators may be incorporated or inserted as additional elements in the flow channel.

[0025] Preferably, a plurality of turbulators can be formed inside the flow channel. A plurality of turbulators can be formed in different sections of the flow channel.

[0026] In at least one embodiment, it is provided that a flow channel wall of the flow channel forms the turbulators. This has at least the advantage that turbulators do not have to be introduced separately into the flow channel, but are already integrated into the flow channel wall. In particular, the turbulators can thus correspond to intentionally created unevenness in the flow channel wall.

[0027] In particular, the flow channel wall can be divided into four segments in the cross-section of the flow channel. A bottom segment of the flow channel wall can extend essentially parallel to the top side of the housing and be formed by the housing. Two lateral segments of the flow channel wall can extend essentially perpendicular to the bottom segment and be formed by the housing. An upper segment of the flow channel wall can extend essentially parallel to and opposite the bottom segment and be formed in particular by the cover.

[0028] In particular, the turbulators can be formed in the bottom segment and / or in the lateral segments and / or in the upper segment of the flow channel wall.

[0029] In particular, the pins can extend into the flow channel from the bottom segment and / or from the lateral segments and / or from the upper segment of the flow channel wall.

[0030] In at least one embodiment, it is provided that at least dimples and / or at least bulges in the flow channel wall are formed as turbulators. It has proven to be advantageous in this regard that the aforementioned positive effects of the turbulators on the flowing cooling fluid and the cooling performance can be achieved particularly effectively. In particular, the dimples and / or bulges can reduce the boundary layer of the flow and reduce stagnant areas of the flow. The dimples can in particular represent depressions in the flow channel wall, in particular in a roundish shape. In contrast, the bulges can in particular represent elevations in the flow channel wall, in particular in a roundish shape. Depths or heights of the dimples or bulges may be small compared to a diameter of the cooling channel wall, preferably less than 15%, 10%, or 5% of the diameter. Maximum radii of the bulges or dimples can, for example, correspond to approximately 10 %, 20 %, 25 %, 30 %, 40 %, 50 % or more than 50 % of the diameter of the flow channel wall.

[0031] Preferably, several dimples or bulges can be formed one behind the other along the main flow direction and next to each other transverse to the main flow direction. In particular, the dimples or bulges can be formed directly adjacent to each other.

[0032] In particular, the dimples or bulges can be formed in the bottom segment and / or in the lateral segments and / or in the upper segment of the flow channel wall.

[0033] In at least one embodiment example, it is provided that the dimples and bulges are formed alternately in a main flow direction of the cooling fluid. In other words, adjacent dimples and bulges alternate along and / or transverse to the main flow direction, for example comparable to a chessboard pattern. Due to this alternating arrangement of dimples and bulges, it has been found to be advantageous that the aforementioned positive effects of the turbulators on the flowing cooling fluid and the cooling performance can be achieved particularly effectively. In particular, the alternating dimples and bulges can reduce the boundary layer of the flow and reduce stagnant areas of the flow.

[0034] In at least one embodiment, at least one helical groove is provided in the flow channel wall as a turbulator. In particular, this can give the cooling fluid a spin so that the overall cooling effect can be improved. In particular, several helical grooves can be provided.

[0035] In particular, the helical shape of the groove can be formed along the main flow direction. In particular, the groove can be recessed in the flow channel wall. In other words, a recessed helix is formed in the flow channel wall.

[0036] In particular, the helical groove can be formed in the housing as well as in the cover so that it can be completely circumferential. In at least one embodiment, it is provided that at least one coil in the flow channel is formed as a turbulator. In particular, this can give the cooling fluid a spin so that the overall cooling effect can be improved. In particular, several coils can be provided.

[0037] It may be provided that at least one coil of the cooling device separate from the housing is inserted into the flow channel.

[0038] Alternatively, it may be provided that the flow channel wall forms the coil, wherein the spiral shape of the coil protrudes in particular from the flow channel wall. In particular, the coil can be formed in the housing as well as in the cover, so that it can be completely circumferential.

[0039] In at least one embodiment example, it is provided that the turbulators are arranged upstream of the pins. In other words, the flowing cooling fluid first passes the turbulators and then the pins. This results in at least the advantage that the flow hits the pins as a turbulent flow. This allows an increased heat exchange to take place between the pins and the turbulent flow of the cooling fluid, so that the cooling effect can be significantly improved.

[0040] In addition, it may be possible for further turbulators to be arranged downstream of the pins. This can be particularly advantageous in that the formation of a boundary layer and thus the frictional resistance and pressure loss can be minimized, thereby increasing the mass flow of the cooling fluid.

[0041] In at least one embodiment, it is envisaged that the pins have a round cross-section. Such pins have the advantage that they are particularly easy to manufacture.

[0042] In at least one embodiment example, it is provided that the pins each have a biconvex cross-section. Such a shape of the cross-section can be particularly advantageous in that they only have a low resistance to the fluid flow. As a result, the pressure loss in the flow can be reduced and the mass flow of the cooling fluid, and thus the cooling capacity, can be increased. On the other hand, the biconvex cross-section has an increased surface area of the pin compared to a round cross-section, over which the cooling fluid flows. This allows an increased heat exchange to take place and the cooling effect of the cooling device to be further increased. In particular, the biconvex cross-section can have a front and a rear tip and be formed bulbous on both sides in between. The tips can be pointed or rounded.

[0043] In particular, the front tip is directed into the fluid flow. In other words, a virtual connecting line between the front and rear tip can extend parallel to the main flow direction. As a result, the fluid flow striking a biconvex pin is divided almost without loss into two partial flows that flow around the bulbous area of the cross-section.

[0044] In other words, biconvex can be understood to mean that the cross-section is formed at least in a streamlined or fluid-dynamically optimized manner. For example, the crosssection can also have a kind of teardrop shape or similar.

[0045] Both round and biconvex cross-sections for pins can be provided together in one cooling device, as well as pins with a different cross-section.

[0046] In at least one embodiment, it is provided that a cross-section of the pins tapers into the flow channel. This is provided in particular for pins, preferably with a biconvex crosssection, which extend from the bottom segment of the flow channel wall into the flow channel. It has been found that such a shape of the pins improves the heat transfer from the pins to the fluid and thus the cooling performance of the cooling device can be improved.

[0047] In particular, a cross-sectional area of the pins decreases into the flow channel, wherein preferably the front and rear tips of the biconvex pin approach each other.

[0048] In at least one embodiment example, it is provided that the pins in said section are arranged in rows along the main flow direction of the cooling fluid, i.e. are arranged more or less one behind the other and form a straight row. Several rows are arranged next to each other transversely to the main flow direction in such a way that the pins arranged next to each other are offset from each other.

[0049] Such an offset of the pins transverse to the main flow direction can enable a cross- sectional area of the flow channel inside this section, through which the fluid can flow, to remain largely constant. This allows the cooling fluid to flow more evenly, reducing pressure loss and increasing the cooling capacity. In at least one embodiment, it is provided that the flow channel wall of the flow channel is formed undulating or wavy along the main flow direction of the cooling fluid.

[0050] The undulating flow channel wall is preferably designed to break up a stagnant liquid layer that would otherwise form near the flow channel walls. This leads to a turbulent flow and causes the cooling fluid to mix as it flows through the channel, which increases thermal efficiency.

[0051] Preferably, the lateral segments of the flow channel wall are formed in an undulating shape, wherein the upper and / or bottom segment can also be undulating. Preferably, the flow channel walls are undulated at an inlet and / or an outlet of the flow channel.

[0052] The undulation can be described in particular as being long-wave and rather flat. The depth or height of the waves can be small compared to the diameter of the flow channel, preferably less than 15 %, 10 % or 5 % of the diameter. The wavelength can be in the centimeter range, in particular in an area of a few centimeters, for example 1 , 2, 3, 4 or 5 centimeters.

[0053] In at least one embodiment, it is provided that fins are formed at least in sections along a main flow direction of the cooling fluid in the flow channel. In particular, the fins, also known as ribs, can serve as a guide for the flow. Fins can positively influence the flow of the fluid and thus the cooling performance of the cooling device, and also increase the surface area of the housing for fluid flow so that more heat can be dissipated.

[0054] Several fins can be arranged next to each other transverse to the main flow direction. The fins of a cooling device can be formed at different heights in certain sections. In particular, the outer fins of the adjacent fins can be higher in the vicinity of the inlet or outlet than in other sections of the cooling device. Preferably, the fins extend from the bottom segment of the flow channel surface into the flow channel. In particular, they can extend continuously from the bottom segment to the top segment or only partially.

[0055] In at least one embodiment, it is provided that the flow channel wall forms steps that extend along a main flow direction of the cooling fluid. In particular, the steps can be formed in the lateral segments of the flow channel wall. The steps have a beneficial effect on the flow properties of the cooling fluid, particularly comprising the fins, which can be formed on the bottom segment. In particular, the steps can be used to reduce the effect of the cooling fluid flowing over the fins at right angles to the direction of flow. In at least one embodiment example, it is provided that the flow channel has at least one U-shaped passage. In other words, the flow channel forms at least one bend of approximately 180°. This allows the available installation space in the housing to be used effectively.

[0056] In at least one embodiment example, it is provided that the flow channel has at least one M-shaped or W-shaped passage. In other words, the flow channel forms at least three bends of approximately 120° to preferably 180° each. This allows the available installation space in the housing to be used even more effectively. In particular, the flow can be directed through the section opposite the electrical component in a targeted manner, so that the cooling effect of the cooling device can be improved.

[0057] In addition, several U-shaped or M-shaped passages can be realized in one cooling device.

[0058] In at least one embodiment, it is provided that the flow channel has at least one meandering passage. This means that the flow channel can form a large number of bends.

[0059] In at least one embodiment example, it is provided that the section comprising the pins is formed in the at least one U-shaped or M-shaped or meander-shaped passage. This means that the flow channel forms the passage where the heat is primarily to be dissipated from the electronic component. The cooling effect of the fluid can therefore be used specifically in this section.

[0060] In at least one embodiment example, it is provided that the at least one passage has at least one rounding, in particular in the respective bend. This allows the cooling fluid to be guided around the bend of the passage with nearly no pressure loss.

[0061] In at least one embodiment, it is provided that at least one guide vane is formed in the at least one rounding. Preferably, several guide vanes are provided. By means of the guide vanes, the flow in the bend can be separated into several partial flows and guided around the bend in a targeted manner. Their function is to distribute the flow evenly across the width of the flow channel and to direct the flow to the next thermal features. This has at least the advantage that no stagnant area or dead space forms in an inner area of the rounding, which would worsen the cooling performance. In particular, back circulation of the flow in the rounding can be significantly reduced. They also function as typical fins or ribs, which means that they can transfer heat from the housing to the fluid.

[0062] In particular, the guide vanes can be shaped as crescent-shaped fins and thus direct the flow around the rounding with almost no loss.

[0063] In at least one embodiment, it is provided that at least one cant is formed in the at least one rounding. The cant corresponds to a transverse inclination of the flow channel in a bend towards the inside of the bend. The cant can be formed in particular by means of the bottom segment of the flow channel wall.

[0064] By means of such a cant, the cooling fluid, which runs on the outside of the bend and therefore has to cover a longer distance than the cooling fluid on the inside of the bend, can be accelerated by reducing the flow channel cross-section. On the other hand, the cant can be used to counteract the centrifugal forces of the fluid in the bend and thus improve the flow properties.

[0065] In at least one embodiment, it is provided that the inlet and the outlet of the flow channel are formed on a common lateral surface of the housing. Accordingly, the inlet and the outlet are formed next to each other. In particular, the lateral surface can correspond to an outer surface of the housing between the top side and the bottom side of the housing, which is orthogonal to these and connects them to each other. This arrangement makes it particularly easy to connect the cooling device to external cooling fluid hoses.

[0066] In at least one embodiment, it is provided that the cooling device has a cover which is connected to the housing and fluidically closes off the flow channel on a top side of the housing opposite the outer side. Preferably, the cover encloses the inner side of the housing, in which the flow channel is formed, between the cover and the housing. The cover can thus form the upper segment of the cooling channel wall.

[0067] In particular, the cover can be metallic, preferably made of aluminum. The cover can, for example, be screwed to the housing or connected to the housing by friction stir welding.

[0068] In at least one embodiment, the cover is formed as a flat plate. This makes it particularly easy to manufacture and connect to the housing. In at least one embodiment, it is provided that the cover is formed as a plate, wherein a first half-side of the flow channel is formed in the housing and a second half-side of the flow channel, which is complementary to the first half-side, is formed in the plate. According to this embodiment, the housing and the cover together form the flow channel. This makes it possible to achieve complex geometries of the flow channel, in particular of the pins and the turbulators.

[0069] In particular, it may thus be provided that the cover also forms pins that can extend into the flow channel. The cover can also form turbulators or parts of a turbulator.

[0070] In at least one embodiment, it is provided that the pins are divided into a first group and at least one second group, wherein the pins of the first group have a first length and the pins of the second group have a second length that is shorter than the first length. It has been found that this can further improve the cooling performance.

[0071] Preferably, pins of the second group can be formed between the pins of the first group so that they are arranged alternately to one another.

[0072] In at least one embodiment example, it is provided that in an inlet area of the flow channel, the cross-section of the flow channel tapers along a main flow direction of the cooling fluid. When the cooling fluid enters the flow channel through the inlet, the height of the flow channel in particular gradually decreases in order to increase the velocity of the cooling fluid. This allows the flow properties of the cooling fluid and therefore the cooling effect to be further improved.

[0073] The invention also comprises the combinations of the features of the described embodiments.

[0074] A further aspect of the invention relates to a method of manufacturing a cooling device according to the invention with a cover which is connected to the housing and fluidically closes off the flow channel on a top side of the housing opposite the outer side. In particular, the plate is attached to the top side of the housing by means of friction stir welding.

[0075] The flow channel is thus fluidically sealed in a simple manner. As a result of friction stir welding, the cover and the housing are formed in one piece and are not connected to each other in a non-destructive manner. In particular, there is no need for a screw connection and seals between the cover and the housing. This makes the cooling device particularly durable and low-maintenance.

[0076] A further aspect of the invention relates to an electronic assembly for a motor vehicle, with a cooling device according to the invention and an electronic component, wherein the electronic component is arranged on the area of the outer side of the housing. For example, the cooling device and the electronic component are directly connected to one another in a contacting manner or, for example, indirectly connected to one another via a heat-conducting paste.

[0077] According to at least one embodiment example, it is provided that the electronic assembly is a control unit, in particular an electronic control unit (ECU), which can preferably be used for motor vehicles.

[0078] In particular, a vehicle-centric, zone-oriented architecture of the electrical or electronic components of the motor vehicle can be provided for the motor vehicle. In particular, at least one main controller, for example a single main controller, can be provided in such a vehicle architecture, which can also be referred to as the main control unit or vehicle computer, and which can be designed to perform the main computing operations for vehicle-specific applications, for example autonomous driving.

[0079] The main controller can be signally connected to several, preferably four, zonal controllers, which can also be referred to as zone controllers. Zonal controllers can be designed to perform less demanding computing operations compared to the main computing operations of the main controller.

[0080] For example, the electronic vehicle architecture may be divided into zones, preferably four zones, with a zonal controller being provided for each zone. In particular, the main controller can be connected via the zonal controllers to other electrical and electronic components of the motor vehicle, in particular to smaller, distributed control units, as well as to a large number of sensors and actuators of the motor vehicle.

[0081] Such a vehicle-centric, zone-oriented architecture of the electrical or electronic components can be advantageous at least to the extent that they are less complex than domain-oriented architectures. In particular, the computing operations of the complex, vehicle-specific applications of distributed control units can be consolidated on a single or on a few, very powerful main controllers. Preferably, the electronic assembly according to the invention can be a main controller of the motor vehicle. Alternatively, the assembly according to the invention can be a zonal controller of the motor vehicle. Accordingly, the cooling device according to the invention can be provided for cooling the powerful electronic components of a main controller or a zonal controller.

[0082] The electronic component can in particular be a component of the ECU, in particular an SoC, a microchip, a processor, an integrated circuit or the like, whereby the powerful electronic component generates harmful waste heat during operation, which must be dissipated by means of the cooling device.

[0083] A further aspect of the invention relates to a motor vehicle having at least one electronic assembly according to the invention.

[0084] The following describes embodiments of the invention. In the figures:

[0085] Fig. 1a shows an upper view of a first embodiment example of a housing of a cooling device according to the invention;

[0086] Fig. 1b shows a perspective view of the first embodiment example;

[0087] Fig. 1c shows an enlarged view of the first embodiment;

[0088] Fig. 2a shows an upper view of a second embodiment of a housing of a cooling device according to the invention;

[0089] Fig. 2b shows a perspective view of the second embodiment;

[0090] Fig. 2c shows a perspective view of a cover for the second embodiment example;

[0091] Fig. 3a shows an upper view of a third embodiment of a housing of a cooling device according to the invention;

[0092] Fig. 3b shows a perspective view of the third embodiment example;

[0093] Fig. 3c shows a perspective view of a cover for the third embodiment example; Fig. 4a shows an upper view of a fourth embodiment of a housing of a cooling device according to the invention;

[0094] Fig. 4b shows a perspective view of the fourth embodiment;

[0095] Fig. 4c shows a perspective view of a cover for the fourth embodiment example;

[0096] Fig. 5a shows an upper view of a fifth embodiment of a housing of a cooling device according to the invention;

[0097] Fig. 5b shows a perspective view of the fifth embodiment;

[0098] Fig. 5c shows a perspective view of a cover for the fifth embodiment example;

[0099] Fig. 6 shows an upper view of a sixth embodiment of a housing of a cooling device according to the invention;

[0100] Fig. 7a shows an upper view of an embodiment example of a flow channel of a cooling device according to the invention;

[0101] Fig. 7b shows enlarged views of the embodiment example of the flow channel;

[0102] Fig. 8 shows a schematic representation of a motor vehicle according to the invention with an electronic assembly according to the invention;

[0103] Fig. 9 shows a flow chart of a method according to the invention for manufacturing a cooling device according to the invention.

[0104] The embodiment examples explained below are preferred embodiments of the invention. In the embodiment examples, the described components of the embodiments each represent individual features of the invention which are to be considered independently of each other, which also further form the invention independently of each other and are thus also to be regarded as part of the invention individually or in a combination other than that shown. Furthermore, the embodiment described can also be supplemented by other features of the invention already described. In the figures, identical reference signs denote elements with the same function. Fig. 1a shows a top view or a top side 31 of a first embodiment example of a housing 4 of a cooling device 1 according to the invention for cooling an electronic component 2 of a motor vehicle 3. The housing 4 has an outer side 5 (see Fig. 1 b) opposite the top side 31 , which has an area 6 on which the electronic component 3 (not shown) can be arranged. The top side 31 can have an inner side 36, which can be closed by a cover 30 (not shown). A flow channel 7 is formed in the inner side 31 for guiding cooling fluid, which can be fluidically sealed by the cover 30. In a section 8 on the top side 31 of the housing 4, which can be opposite the area 6 on the outer side 5, pins 9, 10 are formed which extend into the flow channel 7. In addition, turbulators 11 may be formed in the flow channel 7.

[0105] In the embodiment shown, the turbulators 11 are formed as dimples 13 and bulges 14 in a flow channel wall 12 of the flow channel 7, in particular in a bottom segment 34 of the flow channel wall 7, which is opposite the outer side 5. The dimples 13 and the bulges 14 are formed alternately in a main flow direction X of the cooling fluid, as well as transversely to the main flow direction X. In particular, these can be formed to break up a laminar boundary layer so that a frictional resistance can be minimized and a mass flow of cooling fluid can be increased, so that the overall cooling effect of the cooling device 1 can be improved.

[0106] Preferably, the turbulators 11 can be positioned upstream of the pins 9, 10 in the main flow direction X. This makes it possible to create a turbulent flow of the fluid that impinges on the pins 9, 10. Based on a higher energy exchange of the turbulent flows, more heat can thus be transferred from the pins 9, 10 and from the flow channel wall 12 to the fluid and dissipated.

[0107] In the embodiment example shown, the pins 9, 10 each have a biconvex cross-section 18. Pins 9, 10 with biconvex cross-sections 18 are designed to maximize a surface area that dissipates heat to the fluid. Their main advantage over pins with a round cross-section 17 is a lower pressure drop and high heat transfer to the fluid. The pins 9, 10 can also be designed to have sharp ends that divide the fluid flow into several smaller streams, causing less turbulence that would result in a pressure drop.

[0108] The pins 9, 10 can in particular be arranged in the section 8 in rows along the main flow direction X, wherein several rows are arranged next to each other in such a way that the pins 9, 10 arranged next to each other are offset to each other transversely to the flow direction X. Further features of the embodiment example are, in particular, that the flow channel wall 12, in particular a lateral segment 35 of the flow channel wall 12, which can be essentially perpendicular to the bottom segment 34, is formed in an undulating manner along the main flow direction X. As a result, stagnant areas of the flow in particular, which can have a negative influence on the cooling capacity, can be reduced.

[0109] The flow channel 7 of the first embodiment example can have at least one M-shaped passage 22 in order to extend a path, in particular in the section 8, and thus improve the cooling performance. Preferably, the section 8 is thus formed with the pins 9, 10 in the passage 22. Furthermore, an inlet 27 and an outlet 28 of the flow channel 7 may thus be formed on a common lateral surface 29 of the housing 4 in order to facilitate coupling to a cooling system.

[0110] The M-shaped passage 22 has three roundings 24 in particular, in order to deflect the flow through approximately 180° with as little pressure loss as possible. At least one crescentshaped guide vane 25 is formed in the respective roundings 24, in particular three or four guide vanes 25. The guide vanes 25 can be contoured in such a way that their ends are sharp. This allows them to cut the fluid flow into a series of smaller flows with minimal pressure drop.

[0111] Further features of the first embodiment example can be seen in Fig. 1b, which shows a perspective view of the first embodiment example of the housing 4 of the cooling device. In particular, it can be seen that in an inlet area 32 of the flow channel 7 near the inlet 27, the cross-section of the flow channel 7 tapers in the direction of the main flow direction X. In particular, the bottom segment 34 in the inlet area 32 is formed like a ramp. As the coolant enters the flow channel, a height of the flow channel 7 gradually decreases to increase the flow velocity. This allows the flow to be accelerated.

[0112] Another advantage is that the inlet can be offset towards the outer side 5. As a result, a wall 33 at the inlet 27 can be formed thicker on the top side 31 . This is particularly advantageous during assembly of the cover 30, when the cover 30 is welded to the top side 31 by means of friction stir welding.

[0113] Furthermore, it can be seen that at least one cant 26 is formed in the roundings 25, which can preferably be caused by thickening the bottom segment 34 of the flow channel wall 12. The cant 26 can minimize a pressure loss of the flow in the rounding 25. Fig. 1c shows an enlarged view of the first embodiment example of the housing 4 of the cooling device 1 , showing in particular the three-dimensional shapes of the dimples 13 and bulges 14, the fins 19 and the pins 9, 10.

[0114] In particular, it can be seen here that the biconvex cross-section 18 of the pins 9, 10 tapers into the flow channel 7. In particular, a length of the cross-section 18 decreases. In particular, a cross-section of the fins 19 can also be tapered into the flow channel 7.

[0115] Fig. 2a shows a top view or top side 31 of a second embodiment example of a housing 4 of a cooling device 1 according to the invention. The essential features of the first embodiment example can be transferred to the second embodiment example.

[0116] Pins 9, 10 with a round cross-section 17 are formed in section 8. Inlet 27 and outlet 28 are located on the same side. The flow channel 7 has an M-shaped passage 22, which again comprises roundings 24.

[0117] Turbulators 11 may be formed in the lateral segment 35 of the flow channel wall 12, for example in the form of elevations.

[0118] In particular, the flow channel 7 can comprise fins 19, which can transfer heat to the fluid over a large surface area. A guide vane 25 can be provided in each of the roundings 25, in particular in the form of a crescent.

[0119] Fig. 2b shows a perspective view of the second embodiment. Here it can be seen that the side wall surface 12 can be stepped, or forms steps 20 which extend along the main flow direction X of the cooling fluid.

[0120] Furthermore, it can be seen that the wall 33 is thicker in the inlet area 32 near the inlet 27, as well as in the outlet area.

[0121] Fig. 2c shows a perspective view of a plate-like cover 30 for the second embodiment example. In particular, this can be welded to the top side 31 of the housing 4 so that the inner side 36 of the housing 4 can be enclosed. Fig. 3a shows an upper view of a third embodiment example of a housing 4 of a cooling device 1 according to the invention. The essential features of the first embodiment example can be transferred to the third embodiment example.

[0122] In this embodiment, the flow channel 7 may have a U-shaped passage 21 with a rounding 24, wherein the section 8 in the passage 21 is provided with pins 9, 10.

[0123] The pins 9, 10 can in particular be divided into a first group and at least one second group, wherein the pins 9 of the first group have a first length and the pins 10 of the second group have a second length which is reduced compared to the first length. This has proven to be advantageous with regard to the cooling effect of the cooling device.

[0124] In this embodiment, dimples 13 and bulges 14 are provided as turbulators 1 1 in the flow channel 7, which can be formed alternately. Turbulators 1 1 may also be formed in the lateral segment 35 in the form of bumps.

[0125] Fig. 3b shows a perspective view of the third embodiment of the housing 4. In particular, the different lengths of the pins 9 of the first group and the pins 10 of the second group can be recognized.

[0126] Furthermore, it can be seen that the wall 33 is thicker in the inlet area 32 near the inlet 27, as well as in the outlet area.

[0127] Fig. 3c shows a perspective view of a cover 30 for the third embodiment example.

[0128] Fig. 4a shows a top view or top side 31 of a fourth embodiment example of a housing 4 of a cooling device 1 according to the invention. The essential features of the first embodiment example can be transferred to the fourth embodiment example.

[0129] In particular, the flow channel can have a meander-shaped passage 23 with a total of five roundings 24, wherein more than five roundings 24 can also be provided. The section 8 with the pins 9, 10 is provided in particular in the passage 23.

[0130] In this embodiment example, turbulators 11 may be provided as helical grooves 15 in the flow channel wall 12. In this and in other embodiments, it may be provided that a first half-side of the flow channel 7 is formed in the housing 4, and the second half-side of the flow channel 7 is formed in the associated cover 30, see Fig. 4c. For example, it may be provided that the cover 30 also forms one half of the turbulators 11 in the form of the helical groove 15, which fits complementarily to the half of the turbulators 11 in the housing 4. Similarly, the pins 8, 9 can each be formed half high in the housing 4 and in the cover 30 and fit on top of each other.

[0131] Fig. 4b shows a perspective view of the fourth embodiment example of the housing 4. It can be seen that the wall 33 is thicker in the inlet area 32 near the inlet 27, as well as in the outlet area.

[0132] Fig. 5a shows a top view or the top side 31 of a fifth embodiment example of a housing 4 of a cooling device 1 according to the invention. The essential features of the first embodiment example can be transferred to the fifth embodiment example. Here, the cooling channel 7 has an M-shaped passage 23, inside which the section 8 is formed.

[0133] Coils 16 can be formed as turbulators 11 in the flow channel 7, which can generate turbulence in the fluid flow.

[0134] Fig. 5b shows a perspective view of the fifth embodiment. The lateral segment 35 of the flow channel wall 12 can be stepped or have steps 20 that extend in the main flow direction X.

[0135] The cover 30 according to Fig. 4c for the housing 4 of the fifth embodiment example can be formed like a plate.

[0136] Fig. 6 shows an upper view of a sixth embodiment example of a housing 4 of a cooling device 1 according to the invention. The essential features of the first embodiment example can be transferred to the sixth embodiment example. Here, the flow channel 7 can have a U-shaped passage 21 with a rounding 24.

[0137] Two areas 6 can be provided at which two electronic components 3 can be arranged. Thus, two sections 8 with pins 9, 10 can also be provided, which can have different heights in this embodiment. Dimples 13 and bulges 14 are provided as turbulators 11 in the bottom segment 34 of the flow channel wall 12, which can be located upstream of the pins 9, 10 in the main flow direction X.

[0138] Fig. 7a shows an upper view of an embodiment example of an insulated flow channel 7 of a cooling device 1 according to the invention. The flow channel 7 has an M-shaped passage 22 with pins 6, 8. The roundings 24 can each have a crescent-shaped guide vane 25. The lateral segments 35 can form turbulators 11 as small elevations.

[0139] In Fig. 7b, enlarged views of the embodiment example of the flow channel 7 are shown in more detail. In particular, the steps 20 of the flow channel wall 20 can be seen here, which extend along the main flow direction X, as well as the guide vane 25, the pins 9, 10 and the turbulators 11.

[0140] Fig. 8 shows a schematic representation of a motor vehicle 3 according to the invention with an electronic assembly 37 according to the invention. In particular, the electronic assembly 37 has a cooling device 1 according to the invention and an electronic component 2, wherein the electronic component 2 is arranged on the area 6 of the outer side 5 of the housing 4.

[0141] Fig. 9 shows a flowchart of a method according to the invention for manufacturing a cooling device according to the invention. In a step S1 , a housing 3 can be provided, which has an outer side 5 with an area 6 on which the electronic component 3 can be arranged, wherein the housing 4 forms a flow channel 7 on the inner side for guiding cooling fluid, as well as pins 9, 10 and turbulators 11 . In particular, the housing 4 is made of aluminum.

[0142] In a second step S2, a suitable cover 30 is provided. In a third step S3, the cover 30 is attached to the top side 31 of the housing 4 by means of friction stir welding, so that the flow channel 7 is closed off.

Claims

Claims1 . Cooling device (1 ) for cooling an electronic component (2) of a motor vehicle (3), comprising- a housing (4) having an outer side (5), the outer side (5) comprising an area (6) on which the electronic component (3) can be arranged, wherein the housing (4) forms a flow channel (7) inside for guiding cooling fluid, characterized in that- pins (9, 10) are formed in a section (8) of the housing (4) opposite the area (6), which pins (9, 10) extend into the flow channel (7), and- turbulators (1 1 ) are formed inside the flow channel (7).

2. Cooling device (1 ) according to claim 1 , characterized in that a flow channel wall (12) of the flow channel (7) forms the turbulators (1 1 ).

3. Cooling device (1 ) according to claim 2, characterized in that at least dimples (13) and / or at least bulges (14) in the flow channel wall (12) are formed as turbulators (11 ).

4. Cooling device (1 ) according to claim 3, characterized in that the dimples (13) and the bulges (14) are formed alternately in a main flow direction (X) of the cooling fluid.

5. Cooling device (1 ) according to one of claims 2 to 4, characterized in that at least one helical groove (15) in the flow channel wall (12) is formed as turbulator (11 ).

6. Cooling device (1 ) according to one of the preceding claims, characterized in that at least one coil (16) in the flow channel (7) is formed as turbulator (1 1 ).

7. Cooling device (1 ) according to one of the preceding claims, characterized in that the turbulators are arranged upstream of the pins (9, 10).

8. Cooling device (1 ) according to one of the preceding claims, characterized in that the pins (9, 10) each have a round cross-section (17).

9. Cooling device (1 ) according to one of claims 1 to 7, characterized in that the pins (9, 10) each have a biconvex cross-section (18).

10. Cooling device (1 ) according to one of the preceding claims, characterized in that a cross-section (17, 18) of the pins (9, 10) tapers into the flow channel (7).11 . Cooling device (1 ) according to one of the preceding claims, characterized in that the pins (9, 10) in the section (8) are arranged in rows along a main flow direction (X) of the cooling fluid, wherein several rows are arranged next to each other in such a way that the pins (9, 10) arranged next to each other are offset with respect to each other.

12. Cooling device (1 ) according to one of the preceding claims, characterized in that a flow channel wall (12) of the flow channel (7) is formed undulating along a main flow direction (X) of the cooling fluid.

13. Cooling device (1 ) according to one of the preceding claims, characterized in that fins (19) are formed in the flow channel (7) at least sectionally along a main flow direction (X) of the cooling fluid.

14. Cooling device (1 ) according to one of the preceding claims, characterized in that the flow channel wall (12) forms steps (20) which extend along a main flow direction (X) of the cooling fluid.

15. Cooling device (1 ) according to one of the preceding claims, characterized in that the flow channel (7) comprises at least one U-shaped passage (21 ).

16. Cooling device (1 ) according to one of the preceding claims, characterized in that the flow channel (7) comprises at least one M-shaped passage (22).

17. Cooling device (1 ) according to one of the preceding claims, characterized in that the flow channel (7) comprises at least one meandering passage (23).

18. Cooling device (1 ) according to at least one of claims 15 to 17, characterized in that the section (8) comprising the pins (9, 10) is formed in the at least one passage (21 , 22, 23).

19. Cooling device (1 ) according to at least one of claims 15 to 18, characterized in that the at least one passage (21 , 22, 23) has at least one rounding (24).

20. Cooling device (1 ) according to claim 19, characterized in that at least one guide vane (25) is formed in the at least one rounding (24).21 . Cooling device (1 ) according to claim 19 or 20, characterized in that at least one cant (26) is formed in the at least one rounding (25).

22. Cooling device (1 ) according to one of the preceding claims, characterized in that an inlet (27) and an outlet (28) of the flow channel (7) are formed on a common lateral surface (29) of the housing (4).

23. Cooling device (1 ) according to one of the preceding claims, characterized bya cover (30), which is connected to the housing (4) and fluidically closes off the flow channel (7) on a top side (31) of the housing (4) opposite the outer side (5).

24. Cooling device (1 ) according to claim 23, characterized in that the cover (30) is formed as a flat plate.

25. Cooling device (1 ) according to claim 23, characterized in that the cover (30) is formed as a plate, a first half-side of the flow channel (7) being formed in the housing (4), and a second half-side of the flow channel (7), which is complementary to the first half-side, being formed in the cover (30).

26. Cooling device (1 ) according to one of the preceding claims, characterized in that the pins (9, 10) are divided into a first group and at least one second group, wherein the pins (9) of the first group have a first length, and the pins (10) of the second group have a second length which is shorter than the first length.

27. Cooling device (1 ) according to one of the preceding claims, characterized in that the cross-section of the flow channel (7) tapers along a main flow direction (X) of the cooling fluid at an inlet area (32) of the flow channel (7).

28. Method for manufacturing a cooling device (1) according to claim 23, wherein the cover (30) is attached to a top side (31 ) of the housing (4) by friction stir welding.

29. Electronic assembly (37) for a motor vehicle (3), comprising a cooling device (1) according to one of claims 1 to 27 and an electronic component (2) which is arranged on the area (6) of the outer side (5) of the housing (4).

30. Electronic assembly (37) according to claim 29, characterized in that the electronic assembly (37) is a control unit.31 . Motor vehicle (3), comprising an electronic assembly (37) according to claim 29 or

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