Conductive inlay grounding and shielding

Abstract

Aspects of conductive inlay grounding for terminations between cables and printed circuit boards (PCBs) are described. An example termination assembly includes a PCB with a shield termination pocket, a cable including a signal conductor, a shield, and a jacket, and a conductive inlay positioned in the shield termination pocket. The jacket of the cable includes an opening or cutout that exposes a surface region of the shield. The conductive inlay is positioned in the shield termination pocket and at least in part between the shield termination pocket and the surface region of the shield. The conductive inlay can be embodied as at least one of a conductive paste, a conductive adhesive, a conductive foam, or a conductive gasket in some examples. A module for the termination assembly can also include upper and lower shields over inner surfaces of upper and lower housings.

Description

CONDUCTIVE INEAY GROUNDING AND SHIEEDINGBACKGROUND

[0001] The amount of data processed by computers, computing systems, and computing environments continues to increase. For example, data centers can include hundreds of computing and networking systems interconnected using optical cables, copper cables, and various connectors, cable assemblies, and terminations between them. The data throughput of these interconnects is high and increasing. As examples, many data centers incorporate a combination of 10 Gigabit Ethernet (lOGbE), 25 GbE, 50 GbE, and 100 GbE network interfaces and interconnects. 200 GbE, 400 GbE, and 800 GbE interconnection technology is also being developed and deployed. Other interconnection solutions rely upon 56 Gigabit per second (Gb / s), 112 Gb / s, and 224 Gb / s interconnection technologies, and interconnection technologies are being developed to support higher data rates. A range of cable assemblies are available for the data interconnects. A variety of designs exist for each cable assembly, depending on the requirements of the data communications environment in which the connectors are used.

[0002] The small form-factor pluggable (SFP) module format is a compact, hot-pluggable network interface module format used for data interconnects. An SFP interface on a computing or networking system is a modular slot for a media-specific transceiver, such as a fiber-optic or a copper cable. Cable assemblies can include SFP pluggable transceiver modules at one or both ends of a copper, fiber-optic, or other type of interconnecting cable. SFP pluggable transceiver modules can be inserted into SFP interfaces for data interconnections.SUMMARYIn the context outlined above, aspects of conductive inlay grounding for terminations between cables and printed circuit boards (PCBs) are described. The conductive inlays and related concepts can be relied upon in a range of different assemblies including PCBs and cables to improve data rates and signal integrity. The conductive inlays and related concepts can mitigate resonances, improve crosstalk, improve insertion loss performance, and improve other signal integrity attributes, particularly by improving shielding and grounding at transitions between the cables and the PCBs and / or other ground structures. An example termination assembly includes a PCB with a shield termination pocket, a cable including a signal conductor, a shield, and a jacket, and a conductive inlay positioned in the shield termination pocket. The shield termination pocket can have an exposed ground or ground plane of the PCB within the pocket. The jacket of the cable includes an opening or cutout that exposes a surface region of the shield. The conductive inlay is positioned in the shield termination pocket and at least in part between the shield termination pocket and the surface region of the shield. The conductive inlay can be embodied as at least one of a conductive paste, a conductive adhesive, a conductive foam, or a conductive gasket in some examples. The conductive inlay improves the electrical coupling between the surface region of the shield of the cable and the exposed ground or ground plane of the PCB within the pocket. In other aspects, a module for a cable assembly can include an upper housing with an upper shield positioned over a first region of an inner surface of the upper housing and a lower housing with a lower shield positioned over a second region of an inner surface of the lower housing.BRIEF DESCRIPTION OF THE DRAWINGS

[0003] Many aspects of the present disclosure can be better understood with reference to the following drawings. The components in the drawings are not necessarily to scale, with emphasis instead being placed upon clearly illustrating the principles of the disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.

[0004] FIG. 1 illustrates a perspective view of one end of a cable assembly according to aspects of the present disclosure.

[0005] FIG. 2A illustrates a perspective view of a printed circuit board (PCB) and termination assembly for a cable bundle of the cable assembly shown in FIG. 1 according to aspects of the present disclosure.

[0006] FIG. 2B illustrates a side view of the PCB and termination assembly shown in FIG. 2A according to aspects of the present disclosure.

[0007] FIG. 2C illustrates a top view of the PCB and termination assembly shown in FIG. 2A according to aspects of the present disclosure.

[0008] FIG. 2D illustrates a bottom view of the PCB and termination assembly shown in FIG. 2A according to aspects of the present disclosure.

[0009] FIG. 3 illustrates a detail view of the PCB and termination assembly shown in FIG. 2A according to aspects of the present disclosure.

[0010] FIG. 4A illustrates a perspective view of the PCB shown in FIG. 2A, with the cables omitted and some of the conductive inlays separated from the PCB, according to aspects of the present disclosure.

[0011] FIG. 4B illustrates another perspective view of the PCB shown in FIG. 2A, with the cables omitted, according to aspects of the present disclosure.

[0012] FIG. 4C illustrates a top view of the PCB shown in FIG. 2A, with the cables omitted, according to aspects of the present disclosure.

[0013] FIG. 4D illustrates a bottom view of the PCB shown in FIG. 2A, with the cables omitted, according to aspects of the present disclosure.

[0014] FIG. 5A illustrates an example cable used in the termination assembly shown in FIG. 2A, according to aspects of the present disclosure.

[0015] FIG. 5B illustrates another example cable that can be used in the termination assembly shown in FIG. 2A, according to aspects of the present disclosure.

[0016] FIG. 6 illustrates different inlay configurations that can be used in the termination assembly shown in FIG. 2A, according to aspects of the present disclosure.

[0017] FIGS. 7A-7D illustrate sectional views of different inlays that can be used in the termination assembly shown in FIG. 2A, according to aspects of the present disclosure.

[0018] FIG. 8A illustrates an exploded side view of the cable assembly shown in FIG. 1 according to aspects of the present disclosure.

[0019] FIG. 8B illustrates another exploded side view of the cable assembly shown in FIG. 1 according to aspects of the present disclosure.

[0020] FIG. 9A illustrates another top view of another example PCB and termination assembly according to aspects of the present disclosure.

[0021] FIG. 9B illustrates a bottom view of the PCB and termination assembly shown in FIG. 9A according to aspects of the present disclosure.

[0022] FIG. 10A illustrates an upper housing of the cable assembly shown in FIG. 1 according to aspects of the present disclosure.

[0023] FIG. 10B illustrates a lower housing of the cable assembly shown in FIG. 1 according to aspects of the present disclosure.DETAILED DESCRIPTION

[0024] The amount of data processed by computers, computing systems, and computing environments continues to increase. For example, data centers can include hundreds of computing and networking systems interconnected using optical cables, copper cables, and various connectors, cable assemblies, and terminations between them. The small form-factor pluggable (SFP) module format is a compact, hot-pluggable network interface module format used for data interconnects. SFP pluggable transceiver modules can be inserted into SFP interfaces for data interconnections. An SFP interface on a computing or networking system is a modular slot for a media-specific transceiver, such as a copper cable or fiber-optic transceiver. Cable assemblies can include SFP pluggable transceiver modules at one or both ends of a copper, fiber-optic, or other type of interconnecting cable or cable bundle.

[0025] A range of SFP pluggable transceiver modules are currently available, including small form-factor pluggable double density (SFP-DD), compact small form-factor pluggable (cSFP), SFP+, quad small form-factor pluggable (QSFP), quad small form-factor pluggable double density(QSFP-DD), octal small form factor pluggable (OSFP), and others. SFP pluggable transceiver modules often include one or more printed circuit boards (PCBs) with one or more semiconductor circuit devices or chips and other circuitry mounted to the PCB or PCB. An active electrical cable (AEC) assembly can include one or more SFP pluggable transceiver modules at the free ends of cables or a cable bundle. An AEC assembly can include a PCB and semiconductor chips for signal re-timing, noise reduction, signal integrity improvement, and other functions.

[0026] In the context outlined above, aspects of conductive inlay grounding for terminations between twinaxial or twinax cables, for example, and PCBs are described. The conductive inlays and related concepts can be relied upon in a range of different assemblies including PCBs and cables to improve data rates and signal integrity, particularly by improving shielding at transitions between the cables and the PCBs. An example termination assembly includes a PCB with a shield termination pocket, a cable including a signal conductor, a shield, and a jacket, and a conductive inlay positioned in the shield termination pocket. The jacket of the cable includes an opening or cutout that exposes a surface region of the shield. The conductive inlay is positioned in the shield termination pocket and at least in part between the shield termination pocket and the surface region of the shield. The conductive inlay can be embodied as at least one of a conductive paste, a conductive adhesive, a conductive foam, or a conductive gasket in some examples.

[0027] Turning to the drawings, FIG. 1 illustrates a perspective view of a cable assembly 100 according to aspects of the present disclosure. The cable assembly 100 is representative, not drawn to any particular scale, and is illustrated to provide context for the concepts of pluggable transceiver modules that incorporate conductive inlays, such as conductive foams, for improved terminations between cables and PCBs. The cable assembly 100 is not intended to be limited to any particular type of cable or cable assembly. The concepts of using conductive inlays between cables and PCBs, as described herein, are also not limited to use with SFP modules. The concepts can be relied upon in a range of different assemblies including PCBs and cables to improve data rates and signal integrity, particularly by improving shielding at transitions between the cables and the PCBs.

[0028] The cable assembly 100 includes a pluggable transceiver module 102 (also “module 102”) at one end of a cable bundle 104. The cable assembly 100 is an example of an AEC or related type of cable assembly. The module 102, which is described in further detail below, is also representative, and the concepts described herein can be applied to a range of pluggable modules,including SFP, OSFP, SFP-DD, cSFP, SFP+, QSFP, QSFP-DD, and other types of pluggable modules.

[0029] The module 102 includes a module shell or housing that encloses a number of components, such as a PCB, one or more semiconductor chips and other circuitry mounted on the PCB, and other components. The module shell includes an upper shell 112, a lower shell 114, and other components. The upper shell 112 and lower shell 114 of the module 102 can be embodied as or formed from a metal or metal alloy. In one example, the upper shell 112 and lower shell 114 can be embodied as a die-cast zinc, zinc alloy, or other metals or metal alloys and can be plated in some cases. The cable bundle 104 can include a number of cables with signal and ground or drain conductors. In one example, the cable bundle 104 includes a number of twinaxial cables, also called twinax cables. Each twinax cable can include a pair of conductors, each surrounded by a dielectric insulator or insulating material, a shield, one or more drain conductors, a jacket, and other features or components. Twinax cables can be particularly suited for use in short-range, high-speed differential data signaling applications. The cable bundle 104 can be embodied by cables other than twinax cables in some cases, including twisted pair cables, shielded twisted pair cables, single-conductor cables, shielded single-conductor cables, single-conductor coaxial cables, and other types of cables. The concepts described herein are not limited to use with any particular type or style of cable.

[0030] FIG. 2A illustrates a perspective view of a PCB 130 and termination assembly for cables 10A-10D, 20A-20D, 30A-30D, and 40A-40D in the cable bundle 104 of the cable assembly 100 shown in FIG. 1. FIG. 2B illustrates a side view of the PCB 130 and termination assembly, FIG. 2C illustrates a top view of the PCB 130 and termination assembly, and FIG. 2D illustrates a bottom view of the PCB 130 and termination assembly. Referring among FIGS. 2A-2D, the PCB 130 includes a top surface 132 and a bottom surface 134. The PCB 130 can be embodied as a printed circuit board including a laminated stack of metal layers and dielectric insulating material. One or more semiconductor chips and other circuit components (not shown) can be electrically coupled to and mounted on the PCB 130 and electrically interconnected among each other by metal traces of the PCB 130. The PCB 130 provides a PCB-style tip at the end of the module 102 (see FIG. 1).

[0031] A number of shielded cables, such as the cables 10A-10D, 20A-20D, 30A-30D, and 40A-40D, have conductors that are electrically coupled and terminated to the PCB 130. Each ofthe cables 10A-10D, 20A-20D, 30A-30D, and 40A-40D is a twinax cable in the example shown. As described in further detail below, signal conductors in the cables 10A-10D, 20A-20D, 30A- 30D, and 40A-40D are electrically coupled and terminated to signal or trace contact pads on the PCB 130. Further, ground or drain conductors in the cables 10A-10D, 20A-20D, 30A-30D, and 40A-40D are electrically coupled and terminated to ground contact pads or surface regions of the PCB 130.

[0032] A subset of the cables 10A-10D, 20A-20D, 30A-30D, and 40A-40D can be relied upon for data reception (e.g., data RX) and another subset of the cables 10A-10D, 20A-20D, 30A-30D, and 40A-40D can be relied upon for data transmission (e.g., data TX). The pitch between the longitudinal axis of adjacent cables in a row can be the same in some cases, regardless of whether the cables are relied upon for RX or TX. In other cases, the pitch between the longitudinal axis of cables can vary in the same row depending on whether or not the cables are relied upon for RX or TX

[0033] FIG. 3 illustrates a detail view of the PCB 130 and termination assembly shown in FIG. 2 A. The cable 10A includes two signal conductors 11A and 11B for data communication. The signal conductors 11A and 11B can be embodied as copper conductors, copper-clad steel conductors, or conductors formed from other metals. The conductors can include an outer-surface plating of silver or other metals in some cases. As examples, the conductors can range in gauge, such as between 22-34 AWG, although conductors of other gauges can be relied upon in twinax cables. Data signals can be differentially coupled to the signal conductors 11 A and 1 IB, and the cable 10A can be used to communicate data using a range of modulation and signaling techniques. The conductors 11 A and 1 IB are electrically coupled to respective signal contact pads on the top surface 132 of the PCB 130. Within the cable 10A, the signal conductors 11A and 11B are surrounded by a core of dielectric insulating material 13, such as a solid or low-density polyolefin, polyethylene (PE), polytetrafluoroethylene (PTFE), fluoropolymer, or other plastic or insulating material.

[0034] The cable 10A also includes a shield 14 around the dielectric insulating material 13, drain conductors 12A and 12B, and an outer jacket 15. The shield 14 can be embodied as a relatively thin layer of conductive material, such as aluminum, copper, or other conductive shield layer, that is wrapped around and covers the outer surface of the dielectric insulating material 13. The drain conductors 12A and 12B can be embodied as aluminum, copper, or other metalconductors. The drain conductors 12A and 12B can range in gauge and can be a larger or smaller gauge than the signal conductors 11A and 11B. The drain conductors 12A and 12B contact and are electrically coupled with the shield 14. The drain conductors 12A and 12B are also electrically coupled to respective ground pads on the top surface 132 of the PCB 130. The jacket 15 can be embodied as any suitable material capable of protecting and permitting sufficient flexibility for the cable 10A, such as polyvinyl chloride (PVC), polyurethane, chlorinated PE, or other thermoplastic, thermoset, or related material. The cables 10B-10D, 20A-20D, 30A-30D, and 40A-40D are similar to the cable 10A.

[0035] Although obscured in FIGS. 2A-2D and 3, the PCB 130 includes rows of shield termination pockets. The shield termination pockets are partial apertures or openings that extend into but not through the PCB 130. The PCB 130 includes shield termination pockets formed in the top surface 132 and shield termination pockets formed in the bottom surface 134. At the locations where the ends of the cables 10A-10D, 20A-20D, 30A-30D, and 40A-40D are electrically coupled and terminated with the PCB 130, the ends of the cables 10A-10D, 20A-20D, 30A-30D, and 40A-40D are seated into the shield termination pockets. Conductive inlays are also positioned between the ends of the cables 10A-10D, 20A-20D, 30A-30D, and 40A-40D and the shield termination pockets, as described in further detail below.

[0036] FIG. 4A illustrates a perspective view of the PCB 130 shown in FIG. 2A. The cables 10A-10D, 20A-20D, 30A-30D, and 40A-40D are omitted from view. Shield termination pockets 60A-60D and 61A-61D (also “pockets”) are visible in FIG. 4 A. The pockets 60A-60D and 61A- 61D are depressions, partial apertures, or partial openings that extend into the PCB 130 from the top surface 132. A surface region of a ground plane of the PCB 130 is exposed within each of the pockets 60A-60D and 61A-61D. For example, the surface region 80A of a ground plane of the PCB 130 is exposed within the pocket 60 A. The sidewalls of each of the shield termination pockets 60A-60D and 61 A-61D can also be plated, conductive, and electrically coupled to the ground plane of the PCB 130. Thus, the sidewalls of the pocket 60A can be plated, conductive, and electrically coupled to the surface region 80A of the ground plane exposed within the pocket 60A. Although not visible in FIG. 4A, the PCB 130 can also include shield termination pockets on the bottom side that extend into the PCB 130 from the bottom surface 134.

[0037] The size and shape of the pockets 60A-60D and 61A-61D is representative in FIG. 4A. The pockets 60A-60D and 61 A-61D can vary in shape, size, and position as compared to thatshown. In one example, each pocket among the back row of pockets 61A-61D is formed to be wider than the front row of pockets 60A-60D. The PCB 130 can also include more pockets or fewer pockets than that shown in FIG. 4A. The row of pockets 60A-60D is offset from (e.g., not aligned with) the row of pockets 61 A-61D, to facilitate routing the cables 10A-10D and the cables 20A-20D, and other arrangements and positions are within the scope of the embodiments.

[0038] Conductive inlays are also visible in FIG. 4A and, for illustrative purposes, some are separated from the pockets 60A-60D and 61 A-61D of the PCB 130. Conductive foam inlays 70A- 70D and 71A-71D are shown in FIG. 4A, and other types of inlays can be relied upon in other examples. When the termination assembly is assembled, each of the conductive foam inlays 70A- 70D and 71A-71D is respectively positioned within one of the pockets 60A-60D and 61A-61D. In other cases, one or more of the inlays 70A-70D and 71 A-71D can be omitted from the assembly, and or more of the pockets 60A-60D and 61 A-61D can be free from any inlay(s).

[0039] The conductive foam inlays 70A-70D and 71A-71D can be embodied as flexible, elastic conductive foam. The conductive foam inlays 70A-70D and 71A-71D can be secured within the pockets 60A-60D and 61A-61D using conductive pastes or adhesives in some cases. The conductive foam inlays 70A-70D and 71A-71D are formed (i.e., by cutting, shaping, manufacturing, etc. in a type of “U” or horseshoe shape, but conductive foam inlays can be formed in other shapes. Examples of other shapes, sizes, and styles of inlays are described below with reference to FIGS. 6 and 7A-7D. Examples of other shapes include strips, rectangles, squares, and inlays with raised and curved sides. Two or more separate inlays can also be used in respective pockets 60A-60D and 61A-61D in some cases. The inlays can also include curved and beveled surfaces or surface regions in some cases. The conductive foam inlays 70A-70D and 71A-71D are also formed (i.e., dimensioned) to fit within the pockets 60A-60D and 61A-61D, possibly with a clearance between the sidewalls of the pockets 60A-60D and 61 A-61D and the conductive foam inlays 70A-70D and 71A-71D. However, when the conductive foam inlays 70A-70D and 71A- 71D are compressed, they can expand laterally and contact the conductive sidewalls of each of the pockets 60A-60D and 61A-61D.

[0040] The material from which the conductive foam inlays 70A-70D and 71A-71D are formed is elastic and compressible to some extent. As an example, the conductive foam inlays described herein can be embodied as a polyurethane foam multi-laminate including conductive materials, such as copper, nickel, or other conductive metals or materials. In a particular example,the conductive foam inlays can be embodied as the P-SHIELD® brand PS- 1323, PS- 1768, or similar conductive foam, foam tape, or foam sheet manufactured by Polymer Science, Inc. of Monticello, Indiana, although other suitable types of conductive elastomeric or foam materials can be relied upon. The conductive foam inlays can range in thickness from between 0.1-1.0 mm, and example thicknesses include 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1.0 mm, and other thicknesses can be relied upon. In another example, the conductive foam inlays can range in thickness from between 0.5 -2.0 mm, and example thicknesses include 0.5 mm, 1.0 mm, 1.5 mm, and 2.0 mm, and other thicknesses can be relied upon.

[0041] Shield walls are also visible in FIG. 4A. The shield walls 50A-50C and 51 A-51C are shown in FIG. 4A. The shield walls 50A-50C and 51 A-51C can be embodied as metal shields and electrically coupled to ground contact pads on the top surface 132 of the PCB 130. Each of the shield walls 50A-50C and 51A-51C is mounted and positioned on the PCB 130 between adjacent pockets 60A-60D and 61A-61D. The shield walls 50A-50C and 51 A-51C can be surface mounted between adjacent pockets 60A-60D and 61A-61D. The overall shape, size, and thickness of the shield walls 50A-50C and 51A-51C can vary as compared to the example depicted in FIG. 4A. Further, in some cases, one or more of the shield walls 50A-50C and 51A-51C can be omitted from the assembly. All the shield walls 50A-50C and 51A-51C can be omitted in some cases. Additionally, although not illustrated in FIG. 4A, the PCB can include additional shield walls mounted and positioned between adjacent pockets on the bottom of the PCB 130.

[0042] FIG. 4B illustrates another perspective view, FIG. 4C illustrates a top view, and FIG. 4D illustrates a bottom view of the PCB 130 with the cables omitted. The shield walls 50A-50C and 51 A-51C and conductive foam inlays 70A-70D and 71 A-71D are visible in FIGS. 4B and 4C. The shield walls 50A-50C and 51 A-51C and conductive foam inlays 70A-70D and 71 A-71D help to improve data rates and signal integrity, particularly by improving shielding at transitions between the cables 10A-10D and 20A-20D and the PCB 130. Further, although not individually referenced, additional shield walls are positioned on the bottom surface 134 of the PCB 130 and additional conductive foam inlays are positioned on additional pockets formed on or in the bottom surface 134 of the PCB 130 for terminating the cables 30A-30D and 40A-40D.

[0043] FIG. 5 A illustrates the cable 10A used in the termination assembly shown in FIG. 2A, according to aspects of the present disclosure. As noted above, the cable 10A includes two signal conductors 11A and 11B, a core of dielectric insulating material 13, a shield 14 around thedielectric insulating material 13, drain conductors 12Aand 12B, and an outer jacket 15. The shield 14 can be embodied as a relatively thin layer of conductive material, such as aluminum, copper, or other conductive shield layer, that is wrapped around and covers the outer surface of the dielectric insulating material 13.

[0044] The jacket 15 of the cable 10A includes an opening 16. The opening 16 exposes a surface region of the shield 14, as shown in FIG. 5 A. The opening 16 is close to the distal end of the cable 10A. The shape, size, and position of the opening 16 is illustrated as an example in FIG. 5 A. In other cases, the opening 16 can be larger, smaller, and located at different positions through the jacket 15. The opening 16 can also be formed as a notch or cutaway from an end edge of the jacket 15 of the cable 10A. The opening 16 can be formed by any suitable process or technique, including ablation using a laser or other heat source, cutting, scoring, or other approaches.

[0045] Each of the other cables 10B-10D, 20A-20D, 30A-30D, and 40A-40D also includes a jacket opening similar to the opening 16 in one example. When the cable 10A is terminated to the PCB 130, the conductive foam inlay 70A is positioned in the pocket 60A, and the cable 10A is positioned over the foam inlay 70A with the opening 16 in the jacket 15 aligned over the foam inlay 70A. Thus, the conductive foam inlay 70A makes contact with the exposed surface region of the shield 14 of the cable 10 A, for improving grounding, interference rejection, and signal integrity. At the same time, the conductive foam inlay 70A can also be compressed and expand laterally to contact the conductive sidewalls of the pocket 60A.

[0046] The conductive foam inlays 70A-70D and 71A-71D improve the electrical coupling between the shields of the cables 10A-10D and 20A-20D and the ground plane or planes of the PCB 130. In other cases, conductive adhesives, conductive gaskets, conductive pastes, or other conductive inlays can be applied in, on, or around the pockets 60A-60D and 61A-61D, among other pockets on either side of the PCB 130. Those inlays can improve the electrical coupling between the shields of the cables 10A-10D and 20A-20D and the ground plane or planes of the PCB 130 in a similar way.

[0047] FIG. 5B illustrates another example cable 140 that can be used in the termination assembly shown in FIG. 2A. The cable 140 includes two signal conductors 141A and 141B, a core of dielectric insulating material 143, a shield 144 around the dielectric insulating material 143, drain conductors 142A and 142B, and an outer jacket 145. The shield 144 can be embodied as a relatively thin layer of conductive material, such as aluminum, copper, or other conductiveshield layer, that is wrapped around and covers the outer surface of the dielectric insulating material 143.

[0048] The jacket 145 of the cable 140 is cut or peeled back over a region 146. The region 146 exposes a surface region of the shield 144, as shown in FIG. 5B. The region 146 is at the distal end of the cable 140. The overall size of the region 146 is illustrated as an example in FIG. 5B. In other cases, the region 146 can be larger or smaller than that depicted. The region 146 can also be formed as a notch or cutaway from an end edge of the jacket 145. The region 146 can be formed by any suitable process or technique, including ablation using a laser or other heat source, cutting, scoring, or other approaches. Any or all of the cables 10A-10D, 20A-20D, 30A-30D, and 40A-40D can include an exposed region similar to that shown in FIG. 5B, as an alternative to the window shown in FIG. 5 A. An inlay can make contact with the region 146 for improving grounding, interference rejection, and signal integrity.

[0049] FIG. 6 illustrates different inlay configurations 200A-200H that can be used in the termination assembly shown in FIG. 2A. The configurations 200A-200H are not exhaustive as to the different types, styles, and sizes of inlays that can be relied upon. The configuration 200A includes pockets 210A and 211 A. The pockets 210A and 211 A are illustrated at an example size, and the pockets 210A and 211 A can vary in size and shape. A surface region 212 of a ground plane is exposed within the pocket 210A. Signal contact pads 220 and 221 are also illustrated in the configuration 200A. The end of a twinax cable, such as the end of the cable 10A shown in FIG. 5A or the cable 140 shown in FIG. 5B, can be positioned within the pocket 210A. Signal conductors of the twinax cable can be electrically coupled (e.g., soldered, welded, sintered, etc. to the signal contact pads 220 and 221. Drain conductors of the twinax cable can also be electrically coupled to drain or ground contact pads (not shown) outside of the pocket 210A, consistent with the examples described herein. Notably, the configuration 200A does not include any inlays. However, even without any inlay within the pocket 210A, the shield 14 of the cable 10A (see also FIG. 5 A) can still contact the surface region 212 of the ground plane exposed within the pocket 210A.

[0050] The configuration 200B also includes the pockets 210A and 211 A. Elongated rectangular cuboid conductive foam inlays 230B and 23 IB are positioned within the pocket 210A in the configuration 200B, and similar foam inlays are also positioned within the pocket 211 A. The inlays 230B and 23 IB are shaped as rectangular cuboids and are respectively positioned alongside edges of the pocket 21 OA. The inlay 230B is a first conductive inlay positioned along one side of the pocket 21 OA, and the inlay 23 IB is a second conductive inlay positioned along another side of the pocket 21 OA. In another example, the configuration 200C depicts curved ramp conductive foam inlays 23 OC and 231C within the pocket 210A. The inlays 23 OC and 231C are shaped as curved ramps and are respectively positioned along side edges of the pocket 21 OA. The inlay 23 OC is a first curved conductive inlay positioned along one side of the pocket 21 OA, and the inlay 231C is a second curved conductive inlay positioned along another side of the pocket 21 OA.

[0051] The configuration 200D depicts a single conductive foam strip inlay 230D within the pocket 21 OA. The inlay 230D is a conductive strip with a smaller height (i.e., in the “z” direction) as compared to the conductive foam inlays 230B and 23 IB in the configuration 200B. Also, the foam strip inlay 230D is positioned at a relative center of the pocket 21 OA rather than along a side edge of the pocket 210A. The configuration 200E depicts a wider (i.e., in the “x” direction) conductive foam strip inlay 230E within the pocket 21 OA. The inlay 230E is a conductive strip with a smaller height as compared to the conductive foam inlays 23 OB and 23 IB in the configuration 200B. Also, the foam strip inlay 230E is wider than the strip inlay 230D and positioned at a relative center of the pocket 21 OA rather than along a side edge of the pocket 21 OA.

[0052] The configuration 200F depicts a single conductive foam ramp inlay 23 OF within the pocket 210A. The inlay 23 OF is a formed wider than the foam strip inlay 230E. The inlay 23 OF also includes a curved shape with increasing foam material in the “z” direction towards the side edges of the inlay 230E. The configuration 200G depicts a single conductive foam ramp inlay 230G within the pocket 210A. The inlay 230G also includes a curved shape with increasing foam material in the “z” direction towards the side edges. The side edges of the inlay 230G curl up more and higher in the “z” direction than the inlay 230F. The configuration 200H depicts a single conductive foam ramp inlay 23 OH. The inlay 23 OH also includes a curved shape with increasing foam material in the “z” direction towards the side edges. The side edges of the inlay 23 OH curl up more and higher in the “z” direction than the inlay 23 OG Examples of some of the inlays shown in FIG. 6 are also described with respect to FIGS. 7A-7D.

[0053] In all the examples shown in FIG. 6, the end of a twinax cable, such as the end of the cable 10A shown in FIG. 5 A or the cable 140 shown in FIG. 5B, can be positioned within the pocket 210A. Signal conductors of the twinax cable can be electrically coupled (e.g., soldered,welded, sintered, etc.) to the signal contact pads 220 and 221. Drain conductors of the twinax cable can also be electrically coupled to drain or ground contact pads (not shown) outside of the pocket 210A, consistent with the examples described herein. The inlays illustrated in FIG. 6 can also be formed using materials other than conductive foam in some cases. For example, the inlays can be embodied as forms or formations of conductive paste, conductive adhesive, or conductive gaskets.

[0054] FIGS. 7A-7D illustrate sectional views of inlays that can be used in the termination assembly shown in FIG. 2A. In FIG. 7A, an inlay 240A is positioned within a shield termination pocket of a PCB, under the cable 10A. The inlay 240A is similar to the conductive foam strip inlay 230D shown in FIG. 6, in that it is centrally positioned within the pocket and under the cable 10A. In FIG. 7B, an inlay 240B is positioned within a shield termination pocket of a PCB, under the cable 10A. The inlay 240B is similar to the conductive foam strip inlay 230E shown in FIG. 6 and is wider than the inlay 240A.

[0055] In FIG. 7C, an inlay 240C is positioned within a shield termination pocket of a PCB, under the cable 10A. The inlay 240C is similar to the conductive foam strip inlay 230G shown in FIG. 6. The inlay 240C is curved with increasing foam material in the “z” direction towards the side edges. In FIG. 7D, an inlay 240D is positioned within a shield termination pocket of a PCB, under the cable 10A. The inlay 240D is similar to the conductive foam strip inlay 230H shown in FIG. 6. The inlay 240D is curved with increasing foam material in the “z” direction towards the side edges. The side edges of the inlay 240D extend up higher than the inlay 240C and even extend behind the drain conductors 12A and 12B.

[0056] Other aspects of the embodiments include the use of additional shields within the module 102. The shields can be positioned on or over inner surfaces of the upper shell 112 and lower shell 114 of the module 102, as described in further detail below with reference to FIGS. 8 A, 8B, 9A, 9B, 10 A, and 10B. The shields can be helpful to reduce or mitigate resonances, improve crosstalk, improve insertion loss performance, and improve other signal integrity attributes. The shields can be particularly helpful to reduce or mitigate any interactions between the circuit components within the module 102 and the upper and lower shells 112 and 114 of the module 102.

[0057] FIG. 8 A illustrates an exploded side view of the cable assembly 100, and FIG. 8B illustrates another exploded side view of the cable assembly 100. The upper shell 112, lower shell114, and PCB 130 of the cable assembly 100 are shown in FIGS. 8A and 8B. Certain circuit components are also shown on the PCB 130. For example, among other components, amplifiers150 and 151 are shown on the PCB 130 in FIGS. 8A and 8B. The amplifier 150 is mounted and electrically coupled to traces on the top surface 132 of the PCB 130. The amplifier 151 is mounted and electrically coupled to traces on the bottom surface 134 of the PCB 130. The amplifiers 150 and 151 can be embodied as re-timer amplifiers, as one example, although the amplifiers 150 and151 are just one example of an integrated circuit chip package that can be mounted to the PCB 130. The shielded cables, such as the cables 10A and 40A, are electrically coupled and terminated to the PCB 130.

[0058] Shields 160 and 161 and insulating films 170 and 171 are also shown in FIGS. 8 A and 8B. The shields 160 and 161 and insulating films 170 and 171 are illustrated as representative examples, are not drawn to any particular scale, and are illustrated to provide context for the use of conductive shields over inner surface regions of module housing shells in cable assemblies. The shields 160 and 161 and insulating films 170 and 171 can vary in materials, size, shape, position, and other characteristics among the embodiments as described below. One or more of the shields 160 and 161 and insulating films 170 and 171 can also be omitted in some cases. The shields 160 and 161 and insulating films 170 and 171 can be relied upon in a range of different cable assemblies to improve data rates and signal integrity. For example, the amplifiers 150 and 151 can have a tendency to amplify or increase the amount of crosstalk experienced among signal channels in the cable assembly 100. The shields 160 and 161 can be helpful to reduce or mitigate signal integrity issues caused by the amplifiers 150 and 151, although the shields 160 and 161 are not limited to that purpose and can provide other benefits in the cable assembly 100.

[0059] The shields 160 and 161 and the insulating films 170 and 171 are separated from the shell or housing of the module 102 in FIGS. 8 A and 8B. However, the shield 160 and the insulating film 170 can be positioned on or over the inner surface(s) of the upper shell 112 as described below with reference to FIG. 10A and, in some cases, adhered to the inner surface(s) of the upper shell 112 using adhesives or other means. Similarly, the shield 161 and the insulating film 171 are positioned on or over the inner surface(s) of the lower shell 114 as described below with reference to FIG. 10B and, in some cases, adhered to the inner surface(s) of the lower shell 114. When the cable assembly 100 is assembled, the shield 160 and the insulating film 170 are positioned between the top surface 132 of the PCB 130 and inner surface(s) of the upper shell 112. The shield 161and the insulating film 171 are positioned between the bottom surface 134 of the PCB 130 and inner surface(s) of the lower shell 114.

[0060] The shields 160 and 161 operate as a type of shield, dampener, or related component, particularly for shielding or dampening electromagnetic energy, and can be conductive or non- conductive depending on the type of materials the shields 160 and 161 are formed from. The shields 160 and 161 can be embodied as flexible, elastic conductive foam in one example. The shields 160 and 161 can be secured to the inner surfaces of the upper shell 112 and the lower shell 114, respectively, using adhesives, conductive pastes, or other means in some cases. The shields 160 and 161 can be formed (i.e., by cutting, shaping, manufacturing, etc.) in square or rectangular shapes, as examples, but the shields 160 and 161 can be formed to any suitable size and shape. The material from which the shields 160 and 161 are formed can be elastic and compressible to some extent. As an example, the shields 160 and 161 can be embodied as a polyurethane foam multi-laminate including conductive materials, such as copper, nickel, or other conductive metals or materials. In a particular example, the shields 160 and 161 can be embodied as the P-SHIELD® brand PS-1323, PS-1768, or similar conductive foam, foam tape, or foam sheet, although other suitable types of conductive elastomeric or foam materials can be relied upon. The shields 160 and 161 can range in thickness from between 0.1-2.0 mm, and example thicknesses include 0.5 mm, 1.0 mm, 1.5 mm, and 2.0 mm, and other thicknesses can be relied upon.

[0061] The shields 160 and 161 can be conductive and can act as a type of electromagnetic shield in the cable assembly 100. If conductive, the shields 160 and 161 can electrically couple (e.g., short) certain electric potentials within the cable assembly 100 (e.g., circuit nodes or traces on the PCB 130) in an unintended way. To avoid unintentional electrical couplings, the insulating films 170 and 171 can be relied upon to electrically isolate the shields 160 and 161 from the PCB 130, the conductors of the cables 10A-10D, 20A-20D, 30A-30D, and 40A-40D, and other electric potentials within the cable assembly 100. The insulating films 170 and 171 may not be needed in every case and can be omitted in some designs.

[0062] In other examples, the shields 160 and 161 can be insulative and operate to dampen resonances within the module 102, which can be particularly helpful to the extent that the upper shell 112 and the lower shell 114 act as a type of waveguide for electromagnetic energy. As examples, the shields 160 and 161 can be embodied as non-conductive, high-loss dielectric material(s), such as silicone rubber sheets. The shields 160 and 161 can be and magneticallyloaded in some cases. As particular examples, the shields 160 and 161 can be embodied as the LAIRD™ ECCOSORB® MMI millimeter wave absorber material(s), the LAIRD™ ECCOSORB® GDS microwave absorber material(s), or related absorber material(s).

[0063] The shields 160 and 161 can also be embodied as materials capable of both shielding and dampening, such as combinations of conductive shielding and non- conductive dampening materials. Each of the shields 160 and 161 can also be embodied as two or more layers of different materials, such as a first layer of conductive foam and a second layer of microwave absorber materials in some cases. The shield 160 can also be embodied as the same materials as the shield 161, or the shield 160 can also be embodied as different materials than the shield 161.

[0064] Each of the insulating films 170 and 171 can be embodied as an insulating film, such as a polyimide film, possibly including an adhesive applied to one side of the film. As a more particular example, the insulating films 170 and 171 can be embodied as a tape, such as KAPTON® or a related tape. In some cases, the insulating films 170 and 171 can cover the shields 160 and 161 (i.e., the insulating films 170 and 171 can be larger than the shields 160 and 161), although it is not necessary in all cases for the insulating films 170 and 171 to cover the shields 160 and 161.

[0065] FIG. 8B identifies certain positions or edges along the lengthwise direction “L,” extending from the front end to the back end of the module 102. The front tip 131 of the PCB 130 is identified in FIG. 8B. Moving from the left to the right of the PCB 130, a position “A” is marked at the right side of the amplifier 151, a position “B” is marked at the right side of the amplifier 150, and positions “C” and “D” are marked at different positions along the cables 10A and 40 A. The positions “A”-“D” are examples of boundaries within which the shields 160 and 161 and the insulating films 170 and 171 can be positioned over regions of inner surfaces of the upper shell 112 and the lower shell 114, as described in further detail below.

[0066] FIG. 8B also illustrates how the shield 160, which is positioned over a first region of an inner surface of the upper housing 112, is different than the shield 161, which is positioned over a second region of an inner surface of the lower housing 114. More particularly, the shield 160 is a different size than the shield 161. Thus, the shield 160 is positioned on a first region of an inner surface of the upper housing 112 (see also FIG. 10 A), the shield 161 is positioned on a second region of an inner surface of the lower housing 114 (see also FIG. 10B), and the first and second regions are different sizes. The shields 160 and 161 also start and end at different positions alongthe lengthwise direction “L” in the example shown. The shield 160 has a different length than the shield 161 in the lengthwise direction “L,” and the shield 160 is shorter than the shield 161 in the example shown. The shields 160 and 161 have substantially the same width, measured perpendicular to the lengthwise direction “L,” in the example shown, but the shields 160 and 161 can have different widths in some cases. Although the shields 160 and 161 are different sizes in the example shown, the shields 160 and 161 can also start and end at the same positions along the lengthwise direction “L” in some embodiments. The shields 160 and 161 can be the same size in some cases.

[0067] Additional shields and insulating films can also be inserted or positioned between or among the cables 10B-10D, 20A-20D, 30A-30D, and 40A-40D in some cases. For example, FIG. 8B illustrates the shields 162 and 163 and the insulating films 172 and 173. The shields 162 and 163 and the insulating films 172 and 173 are not positioned on surfaces of the upper shell 112 and lower shell 114 of the module 102. Instead, the shield 162 and the insulating film 172 are positioned between the cables 10A-10D and the cables 20A-20D, over the top surface 132 of the PCB 130. The shield 163 and the insulating film 173 are positioned between the cables 30A-30D and the cables 40A-40D, over the bottom surface 134 of the PCB 130.

[0068] The shields 162 and 163 and the insulating films 172 and 173 are depicted in a representative fashion in FIG. 8B. In practice, the shields 162 and 163 can be compressed and conforming (e.g., curved, bent, etc. between the cables 10B-10D, 20A-20D, 30A-30D, and 40A- 40D. In the example depicted in the drawings, the shield 162 and the insulating film 172 are sized to cover or substantially cover the exposed signal conductors, drain conductors, and shields of the cables 20A-20D over the top surface 132 of the PCB 130. The shield 163 and the insulating film 173 are sized to cover or substantially cover the exposed signal conductors, drain conductors, and shields of the cables 30A-30D over the bottom surface 134 of the PCB 130. The sizes, shapes, and positions of the shields 162 and 163 and the insulating films 172 and 173 can vary as compared to that shown. The shields 162 and 163 and the insulating films 172 and 173 can also be omitted in some cases.

[0069] The shields 162 and 163 can be embodied as the same materials as the shields 160 and 161 (e.g, conductive foam, PS-1323, PS-1768, silicone rubber sheets, MMI millimeter wave absorber materials, GDS microwave absorber material), although the shields 162 and 163 can vary in materials, size, shape, and other characteristics as compared to the shields 160 and 161. As oneexample, the shields 162 and 163 can be thinner than the shields 160 and 161 to facilitate the placement of the shields 162 and 163 between the between the cables 10B-10D, 20A-20D, 30A- 30D, and 40A-40D. The insulating films 172 and 173 can be embodied as the same materials as the insulating films 170 and 171, although the insulating films 172 and 173 can vary in materials, size, shape, and other characteristics as compared to the insulating films 170 and 171.

[0070] FIG. 9A illustrates another top view of the example PCB 130, and FIG. 9B illustrates a bottom view of the PCB 130. The positions “A”-“D” in FIGS. 9A and 9B correspond to those shown in FIG. 8B and are examples of boundaries within which the shields 160 and 161 and the insulating films 170 and 171 can be positioned along regions of the PCB 130. Overall, the sizes of the shields 160 and 161 can be tailored or selected among the embodiments. The sizes of the shields 160 and 161 can be tailored based on the size of the PCB 130, the positions of components on the PCB 130, the positions of the terminations of the cables 10A-10D, 20A-20D, 30A-30D, and 40A-40D to the PCB 130, the extent to which the outer jackets of the cables are cut back, and other factors.

[0071] Using the positions “A”-“D” as examples, a shield can be sized to extend from the position “A,” at the right side of the amplifier 151, to position “C,” “D,” or another location where the outer jacket of one or more cables is cut back. For example, the shield 160 can be sized to extend from one side of the amplifier 151 to position “C,” “D,” or another location where the outer jackets of cables are cut back. As other examples, a shield can be sized to extend from the position “B,” at the right side of the amplifier 150, to position “C,” “D,” or another location where the outer jackets of cables are cut back. For example, the shield 161 can be sized to extend from one side of the amplifier 150 to position “C,” “D,” or another location where the outer jackets of cables are cut back. In the example depicted in the drawings, the shield 160 is sized to cover or substantially cover the exposed signal conductors, drain conductors, and shields of the cables 10A-10D over the top surface 132 of the PCB 130, as best shown in FIGS. 8A and 8B. The shield 161 is sized to cover or substantially cover the exposed signal conductors, drain conductors, and shields of the cables 40A-40D over the bottom surface 134 of the PCB 130. Thus, one or both of the shields 160 and 161 can be sized to cover exposed conductive surfaces of cable terminations to the PCB 130. The shield 161 is larger than the shield 160 in the examples depicted and extends over a larger region of the bottom surface 134 of the PCB 130, and other example sizes and extensions of the shields 160 and 161 are described below.

[0072] FIG. 10A illustrates the upper housing 112 of the cable assembly 100 shown in FIG. 1, and FIG. 10B illustrates a lower housing 114 of the cable assembly 100. The positions “A”- “D” in FIGS. 10A and 10B correspond to those shown in FIGS. 8B, 9A, and 9B and are examples of boundaries within which the shields 160 and 161 and the insulating films 170 and 171 can be positioned over the upper housing 112 and the lower housing 114. The shields 160 and 161 are also shown in FIGS. 10A and 10B. The shield 160 is positioned over a first region of an inner surface 113 of the upper housing 112. The shield 161 is positioned over a second region of an inner surface 115 of the lower housing 114. The first region is different in size than the second region, because the shield 160 is a different size than the shield 161. The first region extends a different length in the direction “L” than the second region. The first region also starts and ends at different positions along the direction “L” as compared to the second region.

[0073] FIG. 10A also illustrates examples of the insulating films 170 and 171. The sizes, shapes, and positions of the insulating films 170 and 171 are provided as representative examples in FIGS. 10A and 10B. As shown, the insulating films 170 and 171 cover portions or regions of the shields 160 and 161, and the insulating films 170 and 171 can cover different portions or regions of the shields 160 and 161 in other cases. The insulating films 170 and 171 can help to secure the shields 160 and 161 in place, such as when the insulating films 170 and 171 include an adhesive backing. In that case, the insulating films 170 and 171 can be adhered in part to the shields 160 and 161 and in part to the inner surfaces 113 and 115. In other examples, the insulating films 170 and 171 can be larger or smaller than shown. The insulating films 170 and 171 can also be larger than and cover the shields 160 and 161 in some cases. In other cases, one or both of the insulating films 170 and 171 can be omitted.

[0074] Terms such as “top,” “bottom,” “side,” “front,” “back,” “right,” and “left” are not intended to provide an absolute frame of reference. Rather, the terms are relative and are intended to identify certain features in relation to each other, as the orientation of structures described herein can vary. The terms “comprising,” “including,” “having,” and the like are synonymous, are used in an open-ended fashion, and do not exclude additional elements, features, acts, operations, and so forth. Also, the term “or” is used in its inclusive sense, and not in its exclusive sense, so that when used, for example, to connect a list of elements, the term “or” means one, some, or all of the elements in the list.

[0075] Combinatorial language, such as “at least one of X, Y, and Z” or “at least one of X, Y, or Z,” unless indicated otherwise, is used in general to identify one, a combination of any two, or all three (or more if a larger group is identified) thereof, such as X and only X, Y and only Y, and Z and only Z, the combinations of X and Y, X and Z, and Y and Z, and all of X, Y, and Z. Such combinatorial language is not generally intended to, and unless specified does not, identify or require at least one of X, at least one of Y, and at least one of Z to be included.

[0076] The terms “about” and “substantially,” unless otherwise defined herein to be associated with a particular range, percentage, or related metric of deviation, account for at least some manufacturing tolerances between a theoretical design and manufactured product or assembly, such as the geometric dimensioning and tolerancing criteria described in the American Society of Mechanical Engineers (ASME®) Y14.5 and the related International Organization for Standardization (ISO®) standards. Such manufacturing tolerances are still contemplated, as one of ordinary skill in the art would appreciate, although “about,” “substantially,” or related terms are not expressly referenced, even in connection with the use of theoretical terms, such as the geometric “perpendicular,” “orthogonal,” “vertex,” “collinear,” “coplanar,” and other terms.

[0077] The above-described embodiments of the present disclosure are merely examples of implementations to provide a clear understanding of the principles of the present disclosure. Many variations and modifications can be made to the above-described embodiments without departing substantially from the spirit and principles of the disclosure. In addition, components and features described with respect to one embodiment can be included in another embodiment. All such modifications and variations are intended to be included herein within the scope of this disclosure.

Claims

CLAIMSAt least the following is claimed:

1. A termination assembly, comprising: a printed circuit board (PCB) comprising a shield termination pocket; a cable comprising a signal conductor, a shield, and a jacket, the jacket comprising an opening that exposes a surface region of the shield; and a conductive inlay positioned in the shield termination pocket and at least in part between the shield termination pocket and the surface region of the shield of the cable.

2. The termination assembly according to claim 1, wherein the conductive inlay comprises at least one of a conductive paste, a conductive adhesive, a conductive foam, or a conductive gasket.

3. The termination assembly according to claim 1, wherein: a surface region of a ground plane of the PCB is exposed within the shield termination pocket; and the conductive inlay is positioned between the surface region of the ground plane of the PCB exposed within the shield termination pocket and the surface region of the shield of the cable.

4. The termination assembly according to claim 1 , wherein: a surface region of a ground plane of the PCB is exposed within the shield termination pocket; sidewalls of the shield termination pocket are plated and conductive; and the conductive inlay is compressed between the surface region of the ground plane of the PCB exposed within the shield termination pocket and the surface region of the shield of the cable and expands to contact the sidewalls of the shield termination pocket.

5. The termination assembly according to claim 1, wherein the PCB comprises a plurality of shield termination pockets.

6. The termination assembly according to claim 5, further comprising a shield wall mounted on the PCB between adjacent shield termination pockets.

7. The termination assembly according to claim 1 , wherein the PCB comprises a first plurality of shield termination pockets on a top surface and a second plurality of shield termination pockets on a bottom surface.

8. The termination assembly according to claim 7, further comprising a shield wall mounted on the PCB between adjacent shield termination pockets.

9. The termination assembly according to claim 1, wherein the conductive inlay comprises a first conductive inlay positioned along one side of the shield termination pocket and a second first conductive inlay positioned along another side of the shield termination pocket.

10. The termination assembly according to claim 1, wherein the conductive inlay comprises a curved shape with increasing material towards side edges of the conductive inlay.

11. A pluggable transceiver module, comprising: a printed circuit board (PCB) comprising a shield termination pocket; a cable comprising a signal conductor, a shield, and a jacket, the jacket comprising an opening that exposes a surface region of the shield; and a conductive inlay positioned in the shield termination pocket and at least in part between the shield termination pocket and the surface region of the shield of the cable.

12. The pluggable transceiver module according to claim 11, wherein the conductive inlay comprises at least one of a conductive paste, a conductive adhesive, a conductive foam, or a conductive gasket.

13. The pluggable transceiver module according to claim 11, wherein: a surface region of a ground plane of the PCB is exposed within the shield termination pocket; andthe conductive inlay is positioned between the surface region of the ground plane of the PCB exposed within the shield termination pocket and the surface region of the shield of the cable.

14. The pluggable transceiver module according to claim 11, wherein: a surface region of a ground plane of the PCB is exposed within the shield termination pocket; sidewalls of the shield termination pocket are plated and conductive; and the conductive inlay is compressed between the surface region of the ground plane of the PCB exposed within the shield termination pocket and the surface region of the shield of the cable and expands to contact the sidewalls of the shield termination pocket.

15. The pluggable transceiver module according to claim 11, wherein the PCB comprises a plurality of shield termination pockets.

16. The pluggable transceiver module according to claim 15, further comprising a shield wall mounted on the PCB between adjacent shield termination pockets.

17. The pluggable transceiver module according to claim 11, wherein the PCB comprises a first plurality of shield termination pockets on a top surface and a second plurality of shield termination pockets on a bottom surface.

18. The pluggable transceiver module according to claim 17, further comprising a shield wall mounted on the PCB between adjacent shield termination pockets.

19. The pluggable transceiver module according to claim 18, wherein the conductive inlay comprises a first conductive inlay positioned along one side of the shield termination pocket and a second first conductive inlay positioned along another side of the shield termination pocket.

20. The pluggable transceiver module according to claim 18, wherein the conductive inlay comprises a curved shape with increasing material towards side edges of the conductive inlay.

21. The pluggable transceiver module according to claim 11, further comprising: an upper housing comprising an upper shield positioned over a first region of an inner surface of the upper housing; and a lower housing comprising a lower shield positioned over a second region of an inner surface of the lower housing.

22. The pluggable transceiver module according to claim 21, wherein the first region is different in size than the second region.

23. The pluggable transceiver module according to claim 21, wherein, measuring lengthwise from a front end to a back end of the module, the first region extends a different length than the second region.

24. The pluggable transceiver module according to claim 21, wherein, measuring lengthwise from a front end to a back end of the module, the first region starts at a different position than the second region.

25. The pluggable transceiver module according to claim 21, wherein, measuring lengthwise from a front end to a back end of the module, the first region ends at a different position than the second region.

26. The pluggable transceiver module according to claim 21, wherein the upper shield comprises a conductive foam and the lower shield comprises a conductive foam.

27. The pluggable transceiver module according to claim 21, further comprising an upper insulating film over at least part of the upper shield; and a lower insulating film over at least part of the lower shield.

28. A module for a cable assembly, comprising:an upper housing comprising an upper shield positioned over a first region of an inner surface of the upper housing; and a lower housing comprising a lower shield positioned over a second region of an inner surface of the lower housing.

29. The module according to claim 28, wherein the first region is different in size than the second region.

30. The module according to claim 28, wherein, measuring lengthwise from a front end to a back end of the module, the first region extends a different length than the second region.

31. The module according to claim 28, wherein, measuring lengthwise from a front end to a back end of the module, the first region starts at a different position than the second region.

32. The module according to claim 28, wherein, measuring lengthwise from a front end to a back end of the module, the first region ends at a different position than the second region.

33. The module according to claim 28, wherein the upper shield comprises a conductive foam and the lower shield comprises a conductive foam.

34. The module according to claim 28, further comprising an upper insulating film over at least part of the upper shield; and a lower insulating film over at least part of the lower shield.

35. A module for a cable assembly, comprising: an upper housing comprising an upper shield positioned over a first region of an inner surface of the upper housing; a lower housing comprising a lower shield positioned over a second region of an inner surface of the lower housing; an upper insulating film over at least part of the upper shield; and a lower insulating film over at least part of the lower shield.

36. The module according to claim 35, wherein the first region is different in size than the second region.

37. The module according to claim 35, wherein, measuring lengthwise from a front end to a back end of the module, the first region extends a different length than the second region.

38. The module according to claim 35, wherein, measuring lengthwise from a front end to a back end of the module, the first region starts at a different position than the second region.

39. The module according to claim 35, wherein, measuring lengthwise from a front end to a back end of the module, the first region ends at a different position than the second region.

40. The module according to claim 35 , wherein the upper shield comprises a conductive foam and the lower shield comprises a conductive foam.

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