Printed circuit board

Abstract

This printed circuit board comprises: a first glass substrate; a first conductive layer formed on the upper surface of the first glass substrate; a second glass substrate spaced apart from the lower surface of the first glass substrate; a second conductive layer formed on the lower surface of the second glass substrate; a heat conductive layer formed between the lower surface of the first glass substrate and the upper surface of the second glass substrate; and a bridge extending through the first glass substrate and the second glass substrate and connecting the first conductive layer and the second conductive layer.

Description

printed circuit board

[0001] The present invention relates to a printed circuit board.

[0002] In electronics, a printed circuit board is a board that forms an electronic circuit by fixing electronic components such as resistors, capacitors, and integrated circuits to the surface of a printed wiring board and connecting the components with copper wires.

[0003] Printed circuit boards (PCBs) are essential substrates for electronic products. They are designed to connect electronic components by forming a conductive pattern on the surface of an electrical insulating layer to transmit electrical signals.

[0004] A printed circuit board is made by pressing copper foil onto one or both sides of an insulating plate such as phenol resin or epoxy resin, forming a pattern (wiring) according to the circuit, and then corroding unnecessary parts to remove the copper foil to form a circuit.

[0005] These printed circuit boards can be plated by drilling holes (through holes) for component leads or holes (vias) for connecting wires between the top and bottom surfaces. Then, by coating the top and bottom surfaces with ink such as Photo Solder Resist (PSR), the printed circuit board can be completed.

[0006] The core of a printed circuit board is made of plastics such as epoxy. Recently, the size of high-performance packages has been increasing, and package warpage has become a chronic problem.

[0007] Glass materials are harder than plastics such as epoxy, so using them as cores for printed circuit boards can improve warpage.

[0008] An example of a glass substrate to which a glass material is applied may be a graphene-based heating glass disclosed in Korean Patent Publication No. 10-2013-0120627 A (published on November 5, 2013), and the graphene-based heating glass comprises: a pair of transparent glass substrates bonded in a laminated structure; a transparent heating film laminated on a first glass substrate among the glass substrates and generating heat over the entire surface when power is applied; a pair of electrodes for applying external power to the transparent heating film; and a transparent bonding film for bonding the pair of transparent glass substrates; and the transparent heating film is disclosed to be made of graphene.

[0009] The present embodiment provides a printed circuit board that can minimize warpage and has high heat dissipation performance by using multiple glasses.

[0010] A printed circuit board according to the present embodiment may include a first glass substrate; a first conductive layer formed on an upper surface of the first glass substrate; a second glass substrate spaced apart from a lower surface of the first glass substrate; a second conductive layer formed on a lower surface of the second glass substrate; a thermally conductive layer formed between the lower surface of the first glass substrate and the upper surface of the second glass substrate; and a bridge penetrating through each of the first glass substrate and the second glass substrate and connecting the first conductive layer and the second conductive layer.

[0011] The upper end of the bridge can be in contact with the lower surface of the first conductive layer, and the lower end of the bridge can be in contact with the upper surface of the second conductive layer.

[0012] The bridge penetrates the thermally conductive layer.

[0013] `An upper hole may be formed in the first conductive layer, a lower hole may be formed in the second conductive layer, and a bridge hole may be formed in the bridge in which the upper hole and the lower hole are each connected to each other.

[0014] The thermal conductive layer can be graphene.

[0015] The thermal conductive layer can form the border surface of the printed circuit board.

[0016] The printed circuit board may further include an insulating layer formed between the bridge and the thermally conductive layer.

[0017] The insulating layer may include an insulating ring surrounding a portion of the outer perimeter of the bridge. The insulating ring may surround a central portion of the bridge.

[0018] Accommodation holes can be formed in the thermal conductive layer.

[0019] Part of the bridge can be accommodated in the receiving hall.

[0020] The insulating layer can be accommodated in the accommodation hole.

[0021] Multiple bridges may be provided.

[0022] The insulating layers may be provided in multiple numbers and may correspond 1:1 with the bridge.

[0023] A plurality of thermal conductive layers may be provided between the first glass substrate and the second glass substrate. The plurality of thermal conductive layers may be spaced apart from each other in the vertical direction.

[0024] The plurality of thermally conductive layers may include an upper thermally conductive layer in contact with the lower surface of the first glass substrate; and a lower thermally conductive layer in contact with the upper surface of the second glass substrate.

[0025] The upper thermal conductive layer and the lower thermal conductive layer can be spaced apart in the vertical direction.

[0026] The printed circuit board may further include a third glass substrate disposed between the plurality of thermally conductive layers.

[0027] A third glass substrate may be placed between the lower surface of the upper thermal conductive layer and the upper surface of the lower thermal conductive layer.

[0028] The printed circuit board may further include an upper insulating layer formed between the bridge and the upper thermally conductive layer; and a lower insulating layer formed between the bridge and the lower thermally conductive layer.

[0029] The upper insulating layer can be arranged between the first glass substrate and the third glass substrate in the vertical direction.

[0030] The lower insulating layer can be arranged between the third glass substrate and the second glass substrate in the vertical direction.

[0031] According to the present embodiment, the first glass substrate and the second glass substrate are arranged to overlap each other with a thermally conductive layer therebetween, so that warping of the printed circuit board can be minimized, heat from at least one of the first glass substrate and the second glass substrate can be conducted to the thermally conductive layer and spread over a wide area of ​​the thermally conductive layer, and there is an advantage in that the heat dissipation performance of the printed circuit board is high.

[0032] In addition, there is an advantage in that the first conductive layer formed on the upper surface of the first glass substrate and the second conductive layer formed on the lower surface of the second glass substrate are electrically connected by a bridge, so that the printed circuit board can function as a double-sided circuit board with a simple configuration.

[0033] In addition, the thermal conductive layer is made of graphene and is placed between the first glass substrate and the second glass substrate, so that the bending direction according to the thermal expansion of each material of the components constituting the printed circuit board can be applied in a plane direction, and deformation of the printed circuit board due to bending can be minimized.

[0034] In addition, the thermal conductive layer forms the edge surface of the printed circuit board, so there is an advantage in that the heat transferred to the thermal conductive layer can be released in four directions: front, back, left, and right of the printed circuit board.

[0035] Additionally, the insulating layer can insulate the bridge and the thermal conductive layer between the bridge and the thermal conductive layer, and can prevent an accident that may occur when current is applied to the thermal conductive layer.

[0036] In addition, the insulating layer is an insulating ring that surrounds a portion of the outer circumference of the bridge, and a receiving hole is formed in the thermal conductive layer to receive the insulating layer, so that the bridge penetrates the thermal conductive layer and the insulating layer is reliably maintained between the bridge and the thermal conductive layer.

[0037] In addition, a plurality of thermal conductive layers are provided, and the plurality of thermal conductive layers include an upper thermal conductive layer in contact with the lower surface of the first glass substrate; and a lower thermal conductive layer in contact with the upper surface of the second glass substrate, so that heat of the printed circuit board is distributed to the upper thermal conductive layer and the lower thermal conductive layer, thereby having the advantage of maximizing heat dissipation performance.

[0038] In addition, a third glass substrate is disposed between the lower surface of the upper thermal conductive layer and the upper surface of the lower thermal conductive layer, thereby forming a triple core of the first glass substrate, the third glass substrate, and the second glass substrate, and there is an advantage in that warping of the printed circuit board can be minimized by the triple core.

[0039] Figure 1 is an exploded perspective view of an example of a printed circuit board according to the present embodiment.

[0040] Figure 2 is a cross-sectional view of an example of a printed circuit board according to the present embodiment.

[0041] Figure 3 is a partially cut-away perspective view of an example of a printed circuit board according to the present embodiment.

[0042] Figure 4 is a perspective view showing a package to which an example of a printed circuit board according to the present embodiment is applied.

[0043] Figure 5 is a cross-sectional view showing a heat transfer path of an example of a printed circuit board according to the present embodiment;

[0044] Figure 6 is a cross-sectional view of a comparative example compared to the printed circuit board according to the present embodiment;

[0045] Figure 7 is a cross-sectional view of another example of a printed circuit board according to the present embodiment.

[0046] Hereinafter, specific embodiments of the present invention will be described in detail with drawings.

[0047] FIG. 1 is an exploded perspective view of an example of a printed circuit board according to the present embodiment, FIG. 2 is a cross-sectional view of an example of a printed circuit board according to the present embodiment, FIG. 3 is a partially cut-away perspective view of an example of a printed circuit board according to the present embodiment, FIG. 4 is a perspective view illustrating a package to which an example of a printed circuit board according to the present embodiment is applied, and FIG. 5 is a cross-sectional view illustrating a heat transfer path of an example of a printed circuit board according to the present embodiment.

[0048] Electronic components (2), such as resistors, capacitors, and integrated circuits, can be fixed to the printed circuit board (1) according to the present embodiment, and wiring can be formed between the electronic components (2).

[0049] A printed circuit board (1) may include a first glass substrate (3); a first conductive layer (4); a second glass substrate (5); a second conductive layer (6); a thermally conductive layer (7) and a bridge (8).

[0050] The printed circuit board (1) may further include an insulating layer (9).

[0051] The first glass substrate (3) may be a top glass substrate located at the uppermost side.

[0052] The second glass substrate (5) may be a bottom glass substrate located at the lowest side.

[0053] Each of the first glass substrate (3) and the second glass substrate (5) can constitute a core of the printed circuit board (1), and can be harder than a plastic such as epoxy, and the first glass substrate (3) and the second glass substrate (5) can minimize warping of the printed circuit board (1).

[0054] An example of a core of a printed circuit board (1) may be configured such that a first glass substrate (3) and a second glass substrate (5) overlap in the vertical direction (Z), thereby forming a double core.

[0055] Another example of a core of a printed circuit board (1) is that an additional glass substrate may be placed between the first glass substrate (3) and the second glass substrate (5), and a triple core or quadruple core may be configured depending on the number of additional glass substrates.

[0056] When the printed circuit board (1) is configured with multiple cores such as dual cores, triple cores, or quadruple cores, warping of the printed circuit board (1) can be minimized.

[0057] Below, an example in which a printed circuit board (1) includes a double core is described, but the printed circuit board (1) is not limited to a double core, and it is of course possible to include a triple core or a quadruple core.

[0058] The first conductive layer (4) may be formed on the upper surface (31) of the first glass substrate (3). The first conductive layer (4) may include a top pattern layer.

[0059] The first conductive layer (4) can form the upper surface of the printed circuit board (1).

[0060] The first conductive layer (4) can be formed of copper, gold, etc., and can include wiring connecting electronic components (2).

[0061] The second glass substrate (5) can be parallel to the first glass substrate (3).

[0062] The second glass substrate (5) can be placed on the lower side of the first glass substrate (3).

[0063] The second glass substrate (5) can be spaced apart from the bottom surface (32) of the first glass substrate (3). The second glass substrate (5) can be spaced apart from the bottom surface (32) of the first glass substrate (3) by a thermal conductive layer (7).

[0064] The upper surface (51) of the second glass substrate (5) can be spaced apart from the lower surface (32) of the first glass substrate (3) in the vertical direction (Z).

[0065] The second conductive layer (6) may be formed on the bottom surface (52) of the second glass substrate (5). The second conductive layer (6) may include a bottom pattern layer.

[0066] The second conductive layer (6) can form the lower surface of the printed circuit board (1).

[0067] The second conductive layer (6) can be formed of copper, gold, etc., and can include wiring connecting electronic components (2).

[0068] When a first conductive layer (4) is formed on the upper surface (31) of a first glass substrate (3) and a second conductive layer (6) is formed on the lower surface (32) of a second glass substrate (5), electronic components (2) such as resistors, capacitors, and integrated circuits can be installed in a distributed manner on the upper and lower surfaces of a printed circuit board (1), and in this case, the printed circuit board (1) can be a double-sided circuit board or a double-sided glass substrate in which electronic components (1) are arranged on both surfaces.

[0069] When the printed circuit board (1) includes only the first glass substrate (3), the first conductive layer (4), the second glass substrate (5), and the second conductive layer (6), the thermal expansion coefficient may be high, but the thermal conductivity may be very low.

[0070] If the thermal conductivity of the printed circuit board (1) is low, the printed circuit board (1) may not be able to effectively transfer heat to the semiconductor package and may become a factor that reduces the performance of the semiconductor package.

[0071] Meanwhile, it is also possible to attach a cooling fan or heat sink to a printed circuit board (1) or electronic component (2) that includes only a first glass substrate (3), a first conductive layer (4), a second glass substrate (5), and a second conductive layer (6), but the thermal conductivity of the printed circuit board (1) may be low and there is a limit to the heat dissipation performance.

[0072] A thermal conductive layer (7) can be formed between the lower surface (32) of the first glass substrate (3) and the upper surface (51) of the second glass substrate (5).

[0073] The heat of the first glass substrate (3) or the heat of the second glass substrate (5) can be conducted to the heat conducting layer (7), and the heat conducted to the heat conducting layer (7) can be dissipated to the outside of the printed circuit board (1) through the heat conducting layer (7).

[0074] The thermal conductive layer (7) can be in thermal contact with each of the first glass substrate (3) and the second glass substrate (5).

[0075] The thermal conductive layer (7) can be in direct contact with each of the first glass substrate (3) and the second glass substrate (5).

[0076] The upper surface of the thermal conductive layer (7) can be in contact with the lower surface (32) of the first glass substrate (3), and the lower surface of the thermal conductive layer (7) can be in contact with the upper surface (51) of the second glass substrate (5).

[0077] The thermal conductive layer (7) may be a thermal conductive member having a higher thermal conductivity than the first glass substrate (3) or the second glass substrate (5).

[0078] The heat conducting layer (7) can spread the heat transferred from the first glass substrate (3) or the second glass substrate (5) in a horizontal direction (i.e., the front-back direction (X) and the left-right direction (Y)) and can dissipate the heat over a wide area.

[0079] The outer size of the thermal conductive layer (7) may be the same as the outer size of the first glass substrate (3) or the outer size of the second glass substrate (5).

[0080] The edge of the thermal conductive layer (7) can be positioned between the edge of the first glass substrate (3) and the edge of the second glass substrate (5). The edge of the thermal conductive layer (7) can be a heat dissipation surface that dissipates heat from the printed circuit board (1).

[0081] The thermal conductive layer (7) can form part of the border of the printed circuit board (1).

[0082] The upper part of the border of the printed circuit board (1) may be the border of the first glass substrate (3), the central part of the border of the printed circuit board (1) may be the border of the thermal conductive layer (7), and the lower part of the border of the printed circuit board (1) may be the border of the second glass substrate (5).

[0083] The border of the thermal conductive layer (7) may include a front border (72), a rear border (73), a left border (74), and a right border (75).

[0084] Each of the front edge (72), the rear edge (73), the left edge (74) and the right edge (75) can be exposed to the outside of the printed circuit board (1), and the heat conductive layer (7) can distribute and release heat in the front-back direction (X) and the left-right direction (Y) of the printed circuit board (1).

[0085] A heat dissipation pad may be in contact with at least one of the front edge (72), the rear edge (73), the left edge (74), and the right edge (75), or a heat sink having heat dissipation fins may be in contact with the heat dissipation pad, and heat conducted to the heat conductive layer (7) may be conducted to the heat dissipation pad or the heat sink through the edge of the heat conductive layer (7).

[0086] The thermal conductive layer (7) may be made of a material that conducts heat well (e.g., copper, aluminum, graphene, graphite, etc.) and may be a heat transfer member or heat dissipation member that effectively conducts heat between the first glass substrate (3) and the second glass substrate (5).

[0087] It is preferable that the thermal conductive layer (7) be composed of a material with a small thermal expansion coefficient and high thermal conductivity.

[0088] The thermal expansion coefficient of graphene or graphite is smaller than that of silver, copper, iron or glass, and a preferred example of a heat-conducting layer (7) is preferably graphene or graphite.

[0089] Graphene is thin, has a tensile strength of 130 GPa, a thermal conductivity of 5,300 W / mk, an allowable current density of 108 A / cm2, and an electron mobility of 200,000 cm2 / Vs.

[0090] Graphene is typically manufactured at high temperatures above 1000℃ and has the property of expanding when the temperature is lowered.

[0091] When the thermal conductive layer (7) is composed of graphene, the bending direction according to the thermal expansion of each material of the components constituting the printed circuit board (1) can be made to act in the plane direction (front-back direction (X) and left-right direction (Y)), and deformation of the printed circuit board (1) due to bending can be minimized. In other words, graphene can minimize bending of a double-sided glass substrate.

[0092] The most desirable example of a thermal conductive layer (7) may be graphene.

[0093] A receiving hole (76) can be formed in the heat conducting layer (7).

[0094] The diameter of the receiving hole (76) may be larger than the diameter (i.e., outer diameter) of the bridge (8), and the bridge (8) may pass through the receiving hole (76). Some of the bridges (8) may be received in the receiving hole (76). The central portion of the bridge (8) may be received in the receiving hole (76).

[0095] The thermal conductive layer (7) can be spaced apart from the bridge (8) and electrically insulated.

[0096] An insulating layer (9) can be accommodated in the accommodation hole (76). The accommodation hole (76) can be positioned between the bridge (8) and the heat-conducting layer (7), and can electrically insulate the bridge (8) and the heat-conducting layer (7).

[0097] A bridge (8) can connect the first conductive layer (2) and the second conductive layer (6). The bridge (8) can be a conductor that electrically connects the top pattern layer and the bottom pattern layer.

[0098] The bridge (8) may be cylindrical or cylindrical.

[0099] The upper end (81) of the bridge (8) can be in contact with the lower surface of the first conductive layer (4).

[0100] The lower end (82) of the bridge (8) can be in contact with the upper surface of the second conductive layer (6).

[0101] The bridge (8) can penetrate the first glass substrate (3) and the second glass substrate (5), respectively.

[0102] An upper through hole (33) through which the upper part of the bridge (8) passes may be formed in the first glass substrate (3).

[0103] A lower through hole (53) can be formed in the second glass substrate (5) through which the lower part of the bridge (8) passes.

[0104] The bridge (8) can penetrate the lower through hole (53), the receiving hole (76), and the upper through hole (33), and can electrically connect the first conductive layer (2) and the second conductive layer (6).

[0105] Current can flow through the bridge (8), and when the current flowing through the bridge (8) is large, it is preferable that an insulating layer (9) be placed between the bridge (8) and the heat-conducting layer (7).

[0106] An insulating layer (9) is formed between the bridge (8) and the heat-conducting layer (7), so as to electrically insulate the bridge (8) and the heat-conducting layer (7).

[0107] The insulating layer (9) may be an insulating ring surrounding a portion of the outer circumferential surface (84) of the bridge (8).

[0108] The insulating ring may surround the center of the bridge (9). The insulating ring may not surround the upper and lower portions of the bridge (9).

[0109] The insulating layer (9) can be accommodated in the accommodation hole (76) of the thermal conductive layer (7), and can electrically insulate the thermal conductive layer (7) between the bridge (8) and the thermal conductive layer (7).

[0110] The insulating layer (9) can be placed between the lower surface (32) of the first glass substrate (3) and the upper surface (51) of the second glass substrate (5) in the vertical direction (Z).

[0111] The insulating layer (9) can be bound in the vertical direction (Z) to the first glass substrate (3) and the second glass substrate (5).

[0112] Meanwhile, an upper hole (45) can be formed in the first conductive layer (4), and a lower hole (65) can be formed in the second conductive layer (6).

[0113] And, a bridge hole (85) can be formed in the bridge (8). The bridge hole (85) can be connected to the upper hole (45) and the lower hole (65), respectively.

[0114] The upper hole (45), the bridge hole (85), and the lower hole (65) can form a heat dissipation hole.

[0115] A plurality of bridges (8) may be provided as shown in Fig. 1. The plurality of bridges (8) may be spaced apart in a horizontal direction (for example, in at least one of the front-back direction (X) and the left-right direction (Y)).

[0116] A plurality of insulating layers (9) may be provided. The insulating layers (9) may correspond 1:1 to the bridges (8).

[0117] A plurality of receiving holes (76) in which the insulating layer (9) is received may be formed in the heat-conducting layer (7). The receiving holes (76) may correspond 1:1 with the insulating layer (9) or the bridge (8).

[0118] Meanwhile, the insulating layer (9) can also be selectively installed depending on the strength of the current flowing in the bridge (8).

[0119] When the current flowing through the bridge (8) is greater than the reference value, it is preferable that the insulating layer (9) be placed between the bridge (8) and the heat-conducting layer (7) to insulate the heat-conducting layer (7) and the bridge (8).

[0120] If the current flowing in the bridge (8) is smaller and insignificant than the reference value, the insulating layer (9) may not be placed between the bridge (8) and the heat-conducting layer (7), and the heat-conducting layer (7) and the bridge (8) may be spaced apart.

[0121] As shown in FIGS. 4 and 5, an electronic component (2) can be installed on the upper surface of a printed circuit board (1), and as shown in FIG. 4, a heat sink (2') having heat dissipation fins formed thereon can be arranged on the lower surface of the printed circuit board (1), and heat of the electronic component (2) can be transferred through a plurality of heat transfer paths (P1, P2, P3).

[0122] Heat of the electronic component (2) can be transferred through the first conductive layer (4), and as shown in Fig. 5, can be transferred through a heat transfer path (P1) in the vertical direction (Z) and a heat transfer path (P2, P3) in the horizontal direction (X, Y).

[0123] The heat transfer path (P1) in the vertical direction (Z) may include a bridge (8).

[0124] The heat transfer path (P2, P3) in the horizontal direction (X, Y) may include a bridge (8), an insulating layer (9), and a heat-conducting layer (7), or may include a first glass substrate (3) and a heat-conducting layer (7).

[0125] A portion of the heat transferred to the printed circuit board (1) can be conducted to the lower side of the printed circuit board (1) through a heat transfer path (P1) in the vertical direction (Z), and can be conducted to a heat sink (2') and dissipated into the atmosphere.

[0126] The remainder of the heat transferred to the printed circuit board (1) can be conducted to the heat-conducting layer (7) and spread over a wide area of ​​the heat-conducting layer (7), and can be dissipated in four directions: front, back, left, and right through the edges of the heat-conducting layer (7), and can be dissipated into the air.

[0127] If the printed circuit board (1) does not include a thermal conductive layer (7), heat may be concentrated on the lower side of the printed circuit board (1).

[0128] On the other hand, when the printed circuit board (1) includes a thermal conductive layer (7), heat can be distributed to the lower side and the edge of the printed circuit board (1), and the printed circuit board (1) can dissipate heat more efficiently and quickly.

[0129] When the printed circuit board (1) forms part of a high-power heat-generating semiconductor package (CPU, GPU, etc.), a thermally conductive layer (7) with excellent thermal conductivity, such as graphene, can utilize the entire area of ​​the printed circuit board (1) as a heat-radiating area, and improve the heat-radiating performance of the high-power heat-generating semiconductor package.

[0130] Fig. 6 is a cross-sectional view of a comparative example compared to an example of a printed circuit board according to the present embodiment.

[0131] Comparative example (1') illustrated in Fig. 6 may include a first glass substrate (3), a first conductive layer (4), a thermal conductive layer (7), a bridge (8), and an insulating layer (9), and a second conductive layer (6') may be formed on the lower surface of the thermal conductive layer (7).

[0132] The configuration of each of the first glass substrate (3), the first conductive layer (4), the thermal conductive layer (7), the bridge (8), and the insulating layer (9) of the comparative example (1') may be the same as that of the printed circuit board (1) according to the present embodiment.

[0133] Comparative example (1') does not include a second glass substrate (5) of the printed circuit board (1).

[0134] Depending on the thermal expansion characteristics of the materials of each component, bending may occur in Comparative Example (1'). Since Comparative Example (1') does not include the second glass substrate (5) of the printed circuit board (1), it can easily bend in the bending direction (D), and the reliability of Comparative Example (1') may be reduced. Here, the bending direction (D) may be a curved shape centered on the bridge (8).

[0135] Figure 7 is a cross-sectional view of another example of a printed circuit board according to the present embodiment.

[0136] Another example of a printed circuit board (1") may include a first glass substrate (3), a first conductive layer (4), a second glass substrate (5), a second conductive layer (6), a thermally conductive layer (7'), a bridge (8), and an insulating layer (9'). A plurality of thermally conductive layers (7') may be provided between the first glass substrate (3) and the second glass substrate (5), and a plurality of insulating layers (9') may be provided to insulate each of the plurality of thermally conductive layers (7').

[0137] The configuration of the first glass substrate (3), the first conductive layer (4), the second glass substrate (5), the second conductive layer (6), and the bridge (8) of another example (1") of the printed circuit board may be the same as or similar to that of the printed circuit board example, and in the following, the same symbols are used to avoid duplicate descriptions, and detailed descriptions thereof are omitted.

[0138] Multiple heat-conducting layers (7') can be spaced apart from each other in the vertical direction (Z).

[0139] The multiple heat-conducting layers (7') may include an upper heat-conducting layer (7a) and a lower heat-conducting layer (7b).

[0140] The upper thermal conductive layer (7a) can be in contact with the lower surface of the first glass substrate (3).

[0141] An upper receiving hole (76a) in which an upper insulating layer (9a) is received can be formed in the upper heat-conducting layer (7a).

[0142] The lower heat-conducting layer (7b) can be in contact with the upper surface of the second glass substrate (5). The lower heat-conducting layer (7b) can be spaced apart from the upper heat-conducting layer (7a) in the vertical direction (Z).

[0143] A lower receiving hole (76b) in which a lower insulating layer (9b) is received can be formed in the lower heat-conducting layer (7b).

[0144] Another example of a printed circuit board (1") may further include a third glass substrate (10) disposed between a plurality of thermally conductive layers (7').

[0145] The third glass substrate (10) can be placed between the lower surface of the upper thermal conductive layer (7a) and the upper surface of the lower thermal conductive layer (7b).

[0146] The third glass substrate (10) may be an intermediate glass substrate positioned between the first glass substrate (3) and the second glass substrate (5).

[0147] Another example of a printed circuit board (1") may include a triple core in which a first glass substrate (3), a third glass substrate (10), and a second glass substrate (5) are stacked in layers.

[0148] The multiple insulating layers (9') may include an upper insulating layer (9a) and a lower insulating layer (9b).

[0149] The upper insulating layer (9a) can be placed between the bridge (8) and the upper thermally conductive layer (7a). The upper insulating layer (9a) can be accommodated in the upper accommodation hole (76a) of the upper thermally conductive layer (7a) and can insulate the upper thermally conductive layer (7a).

[0150] The lower insulating layer (9b) can be placed between the bridge (8) and the lower thermal conductive layer (7b). The lower insulating layer (9b) can be accommodated in the lower accommodation hole (76b) of the lower thermal conductive layer (7b) and can insulate the lower thermal conductive layer (7b).

[0151] The upper insulation layer (9a) and the lower insulation layer (9b) can be spaced apart in the vertical direction (X).

[0152] The upper insulating layer (9a) can be placed between the first glass substrate (3) and the third glass substrate (10) in the vertical direction (Z).

[0153] The lower insulating layer (9b) can be placed between the third glass substrate (10) and the second glass substrate (6) in the vertical direction (Z).

[0154] The above description is merely an example of the technical idea of ​​the present invention, and those skilled in the art will appreciate that various modifications and variations can be made without departing from the essential characteristics of the present invention.

[0155] Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of ​​the present invention but to explain it, and the scope of the technical idea of ​​the present invention is not limited by these embodiments.

[0156] The scope of protection of the present invention should be interpreted by the claims below, and all technical ideas within the scope equivalent thereto should be interpreted as being included in the scope of the rights of the present invention.

Claims

1. First glass substrate; A first conductive layer formed on the upper surface of the first glass substrate; A second glass substrate spaced apart from the lower surface of the first glass substrate; A second conductive layer formed on the lower surface of the second glass substrate; A thermal conductive layer formed between the lower surface of the first glass substrate and the upper surface of the second glass substrate; and A bridge is included that penetrates the first glass substrate and the second glass substrate and connects the first conductive layer and the second conductive layer. Printed circuit board.

2. In paragraph 1, The upper end of the above bridge is in contact with the lower surface of the first conductive layer, The lower end of the above bridge is in contact with the upper surface of the second conductive layer. Printed circuit board.

3. In paragraph 1, An upper hole is formed in the first challenge layer, A lower hole is formed in the second challenge layer above, A printed circuit board having a bridge hole formed in the bridge to communicate with each of the upper hole and the lower hole.

4. In paragraph 1, A printed circuit board in which the above thermally conductive layer is graphene.

5. In paragraph 1, A printed circuit board in which the above thermal conductive layer forms the edge surface of the printed circuit board.

6. In paragraph 1, A printed circuit board further comprising an insulating layer formed between the bridge and the thermal conductive layer.

7. In paragraph 6, A printed circuit board in which the above insulating layer is an insulating ring that surrounds a portion of the outer circumference of the above bridge.

8. In paragraph 6, A printed circuit board having a receiving hole formed in the above heat-conducting layer to receive the above insulating layer.

9. In paragraph 6, The above bridges are provided in multiples, A printed circuit board in which the above insulating layers are provided in multiple numbers and correspond 1:1 to the above bridge.

10. In paragraph 1, A printed circuit board in which a plurality of the above thermal conductive layers are provided between the first glass substrate and the second glass substrate, and the plurality of thermal conductive layers are spaced apart from each other in the vertical direction.

11. In paragraph 10, A printed circuit board further comprising a third glass substrate disposed between the plurality of thermally conductive layers.

12. In paragraph 10, The above multiple heat-conducting layers An upper thermally conductive layer in contact with the lower surface of the first glass substrate; and Including a lower thermal conductive layer in contact with the upper surface of the second glass substrate, A printed circuit board in which the upper thermal conductive layer and the lower thermal conductive layer are spaced apart in the vertical direction.

13. In paragraph 12, A printed circuit board further comprising a third glass substrate disposed between the lower surface of the upper thermal conductive layer and the upper surface of the lower thermal conductive layer.

14. In paragraph 12, An upper insulating layer formed between the above bridge and the upper heat-conducting layer; and A printed circuit board further comprising a lower insulating layer formed between the above bridge and the lower thermal conductive layer.

15. In paragraph 14, The upper insulating layer is arranged between the first glass substrate and the third glass substrate in the vertical direction, The above lower insulating layer is a printed circuit board arranged between the third glass substrate and the second glass substrate in the vertical direction.

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