Modular heat rejection system for cooling data center

Abstract

A modular heat transfer system is disclosed. The system includes a first number of heat rejection units arranged adjacent to each other defining an internal space at the center. Heated air from the heat source flows upward through the internal space. Each of the first heat rejection units includes a housing, coils through which the heat is flowing, and a fan arranged away from the internal space and configured to drag ambient air from outside to inside the housing.

Description

Docket No. LIE-THM-24-100.US.WO MODULAR HEAT REJECTION SYSTEM FOR COOLING DATA CENTER CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of priority to U.S. Provisional Application Ser. No. 63 / 635,019, entitled “MODULAR HEAT REJECTION SYSTEM FOR COOLING DATA CENTER,” filed April 17, 2024, and which is herein incorporated by reference in its entirety. TECHNICAL FIELD

[0002] The present disclosure relates to heat rejection systems, and more specifically, to high- density heat rejection systems for use with data centers. BACKGROUND

[0003] Data centers are experiencing increasing heat density, which demands thermal systems that can provide higher cooling density. Moreover, the trend toward higher-density data centers, driven by artificial intelligence, requires greater heat rejection per unit of footprint. Emerging edge applications, such as containerized systems, also require more compact and efficient cooling solutions. Both outdoor and indoor heat exchanger coils can benefit from improvements in density and footprint.

[0004] However, the increasing heat generation in data centers has created a bottleneck in efficiently rejecting that heat. Rooftops are generally constrained by the size of the overall building, and current solutions have primarily focused on two-dimensional approaches to address this limitation. For example, as shown in FIG. 1, a condenser system 100 for data centers is typically installed on the rooftop. FIG. 11 illustrates multiple condenser systems mounted on a data center rooftop. Due to the limited surface area or footprint of the rooftop, the number of heat rejection systems (e.g., heat exchangers) is similarly constrained. As a result, even if heat generation in data centers increases, the current systems and structures limitDocket No. LIE-THM-24-100.US.WO the capacity for effective heat removal or rejection. Therefore, there is a need for improvements that increase heat rejection density in confined spaces without expanding the footprint, or even with the potential to reduce it. SUMMARY

[0005] Embodiments described herein relate to techniques for cooling data centers. Specifically, the systems and methods of the present disclosure introduce innovative heat rejection systems that reduce footprint while increasing heat rejection density in confined spaces, such as multi-floor environments. These embodiments enable the practical use of three- dimensional layouts for heat rejection systems, allowing for the integration of heat rejection modules in both vertical and horizontal spaces. Additionally, a cooling system for data centers is provided that promotes the efficient use of footprint, benefiting both existing and new data center designs.

[0006] Various embodiments described herein enable air to rise through an internal space of heat rejection units, while colder air can be dragged into the internal space cooling the heat rejection units.

[0007] In accordance with an embodiment of the present disclosure, a modular heat rejection system for transferring heat from a heat source may include a first plurality of heat rejection units arranged adjacent to each other defining an internal space at the center, wherein heated air from the heat source flows upward through the internal space. Each of the first plurality of heat rejection units may include a housing, coils through which the heat is flowing, and a fan arranged away from the internal space and configured to drag ambient air from outside to inside the housing.

[0008] In some embodiments, the first number of heat rejection units may be circumferentially arranged. The system may further include dividers respectively connecting the first number of heat rejection units side by side. In some embodiments, the system may further include a connector configured to connect a heat rejection unit to a divider, and each heat rejection unit may be spaced apart from each other, defining a gap toward the center, away from the fan. Each fan may be arranged to face outward and configured to drag the ambient air while directing the heated air laterally from the internal space to the outside.

[0009] In some embodiments, the system may further include a second number of heat rejection units arranged adjacent to each other, and the second number of heat rejection unitsDocket No. LIE-THM-24-100.US.WO may be vertically stacked on the first number of heat rejection units. The system may further include a third number of heat rejection units circumferentially arranged and vertically stacked on the second number of heat rejection units. Internal spaces of the first, second, and third heat rejection units may correspond to each other.

[0010] In some embodiments, the system may further include a stand configured to support the first to third heat rejection units. The stand may define an interior opening that communicates with internal spaces of the first to third heat rejection units. The heated air rises and flows out gradually from the first, second, and third pluralities of heat rejection units to the outside upwardly and laterally. In some embodiments, the housing may include a plurality of panels forming a prism shape, and the first plurality of heat rejection units may be arranged adjacent to each other in a tubular shape.

[0011] In accordance with another embodiment of the present disclosure, a modular heat rejection system for transferring heat from a heat source may include: a first plurality of heat rejection units arranged adjacent to each other defining an internal space at the center, wherein heated air from the heat source flows upward through the internal space. Each of the first plurality of heat rejection units may include a housing, coils through which the heat is flowing, and a fan arranged away from the internal space and configured to drag ambient air from outside to inside the housing. The system may further include a stand configured to support the first plurality of heat rejection units.

[0012] In some embodiments, the first number of heat rejection units may be arranged in a dome shape. The system may further include dividers respectively connecting the first number of heat rejection units side by side. The system may further include a connector configured to connect a heat rejection unit to a divider, and each heat rejection unit may be spaced apart from each other, defining a gap toward the center, away from the fan. In some embodiments, each fan may be arranged to face outward and configured to drag ambient air to the internal space. In some embodiments, the system may further include a second number of heat rejection units arranged adjacent to each other. The second heat rejection units may be configured to be horizontally stacked to the first number of heat rejection units.

[0013] In some embodiments, the system may further include third heat rejection units adjacent to each other and configured to be horizontally stacked to the second number of heat rejection units. Internal spaces of the first, second, and third pluralities of heat rejection units may be configured to direct the heated air outside through the first, second, and third pluralities of heat rejection units. In some embodiments, the ambient air enters the stand cooling the first, second, and third pluralities of heat rejection units while the heated air flows outside through the first,Docket No. LIE-THM-24-100.US.WO second, and third pluralities of heat rejection units. In some embodiments, the housing may include a plurality of panels forming a prism shape, and the first plurality of heat rejection units may be arranged adjacent to each other in a tubular shape.

[0014] Other aspects and advantages of the invention will become apparent from the following detailed description, taken in conjunction with the accompanying drawings, illustrating by way of example the principles of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The disclosure will be readily understood by the following detailed description in conjunction with the accompanying drawings, wherein like reference numerals designate like elements:

[0016] FIG. 1 shows a heat exchanger system according to the related art;

[0017] FIGS.2A and 2B show perspective view and front view, respectively, of a heat rejection unit according to an embodiment of the present disclosure;

[0018] FIGS. 3A and 3B show heat rejection unit arrangements according to an embodiment of the present disclosure;

[0019] FIG. 4 shows a top view of a system for transferring heat from a heat source according to an embodiment of the present disclosure;

[0020] FIG.5 shows a perspective view of the system for transferring heat from a heat source;

[0021] FIGS. 6A and 6B show top views of systems for transferring heat from a heat source according to various embodiments of the present disclosure.

[0022] FIG. 7 shows a front view of a set of systems for transferring heat stacked on a data center;

[0023] FIGS. 8A and 8B show front views of sets of systems stacked on a data center;

[0024] FIG.9 shows a front view of a system for transferring heat from a heat source according to another embodiment of the present disclosure;

[0025] FIG.10 shows the system for transferring heat from a heat source according to another embodiment arranged on a data center;

[0026] FIG.11 shows a plane view of arrangement of heat exchanger systems according to the related art disposed on a rooftop of a data center; andDocket No. LIE-THM-24-100.US.WO

[0027] FIGS. 12A and 12B show plane views of arrangements of heat rejection systems for transferring heat from a heat source according to various embodiments disposed on a rooftop of a data center. DETAILED DESCRIPTION

[0028] The figures described above and the written description of specific structures and functions below are not presented to limit the scope of what Applicants have invented or the scope of the appended claims. Rather, the Figures and written description are provided to teach any person skilled in the art to make and use the inventions for which patent protection is sought. Those skilled in the art will appreciate that not all features of a commercial embodiment of the inventions are described or shown for the sake of clarity and understanding. Persons of skill in this art will also appreciate that the development of an actual commercial embodiment incorporating aspects of the present inventions will require numerous implementation-specific decisions to achieve the developer’s goal for the commercial embodiment. Such implementation-specific decisions may include and likely are not limited to, compliance with system-related, business-related, government-related, and other constraints, which may vary by specific implementation, location, and from time to time. While a developer’s efforts might be complex and time-consuming in an absolute sense, such efforts would be, nevertheless, a routine undertaking for those of skill in this art having the benefit of this disclosure. It must be understood that the inventions disclosed and taught herein are susceptible to numerous and various modifications and alternative forms.

[0029] The use of a singular term, such as, but not limited to, “a,” is not intended as limiting of the number of items. The use of relational terms, such as, but not limited to, “top,” “bottom,” “left,” “right,” “upper,” “lower,” “down,” “up,” “side,” and the like are used in the written description for clarity in specific reference to the Figures and are not intended to limit the scope of the inventions or the appended claims. The terms “including” and “such as” are for illustrative purposes but not limited thereto. The terms “couple,” “coupled,” “coupling,” “coupler,” and like terms are used broadly herein and can include any method or device for securing, binding, bonding, fastening, attaching, joining, inserting therein, forming thereon or therein, communicating, or otherwise associating, for example, mechanically, magnetically, electrically, chemically, operably, directly or indirectly with intermediate elements, one or more pieces of members together and can further include without limitation integrally formingDocket No. LIE-THM-24-100.US.WO one functional member with another in a unity fashion. The coupling can occur in any direction, including rotationally. Further, all parts and components of the disclosure that are capable of being physically embodied inherently include imaginary and real characteristics regardless of whether such characteristics are expressly described herein, including but not limited to characteristics such as axes, ends, inner and outer surfaces, interior spaces, tops, bottoms, sides, boundaries, dimensions (e.g., height, length, width, thickness), mass, weight, volume, and density, among others.

[0030] The present disclosure pertains to modular or stackable systems designed to provide energy-efficient, space-saving, and high-density cooling configurations. This modular approach optimizes the use of various geometric shapes to create air passages through which heated or hot air is expelled, thereby cooling heat sources such as data centers. These systems, which can be configured as closed-loop, semi-closed, or open systems, enhance both energy efficiency and space utilization, making them ideal for applications like rooftop cooling units (RTUs). Furthermore, the disclosure enables the use of external walls or surfaces of data center buildings, allowing modular or stackable systems to be arranged beyond just the rooftop.

[0031] High power consumption by servers generates significant heat within the associated building, and the hot air from the data center space can be cooled using a refrigerant-based system. In this process, the hot air from the data center transfers heat to a cold refrigerant. The now-heated refrigerant is then transported to the heat rejection units. Compressor fans pull ambient air, which is cooler than the hot refrigerant, across heat exchangers or coils, transferring heat from the refrigerant to the ambient air or another external air stream, unrelated to the data center space. While natural convection may assist in heat transfer, mechanical cooling systems such as fans are often used to improve efficiency. The modular cooling system of the present disclosure is structured to maximize the space-saving advantages of multi-sided and geometric shapes, which can be incorporated into the system design. This arrangement enhances the cooling effect by enabling vertical stacking of systems without requiring additional installation area or increasing the footprint on the data center building rooftop. For example, the modular or stackable systems of the present disclosure can achieve up to a 40% reduction in footprint without compromising cooling performance.

[0032] The modular systems according to various embodiments of the present disclosure may incorporate one or more heat rejection units. These units may vary in shape, size, and configuration, allowing for flexibility in defining the overall dimensions of the system and its installation footprint. Depending on the cooling requirements, the number, size, andDocket No. LIE-THM-24-100.US.WO arrangement of the heat rejection units can be adjusted. This provides a cost-effective, customizable solution for data center cooling systems, tailored to meet specific customer needs.

[0033] FIGS.2A and 2B show a heat rejection unit according to an embodiment of the present disclosure, and FIGS. 3A and 3B show heat rejection unit arrangements according to an embodiment of the present disclosure. The term “heat rejection unit” may be understood as “condenser,” “chiller,” “heat exchanger,” “condenser coils,” or any other terms known in the AC / HVAC systems.

[0034] In some embodiments, a heat rejection unit 200 consists of a housing 201 with a first panel 210 and a second panel 220. While these panels are illustrated as having a rectangular shape, the shape is not limited to rectangles; they may alternatively be triangular, circular, pentagonal, hexagonal, parallelogram, or other shapes. The housing 201 may also include third and fourth panels 230, 240, which are shown as triangular. However, the triangular shape is not restrictive and could include various forms such as isosceles, equilateral, scalene, obtuse, acute, or right triangles, or even non-triangular shapes like pentagons, hexagons, and others. In some embodiments, the third and fourth panels 230, 240 may have the same or similar shapes, facing each other in parallel. Additionally, the number of panels forming the housing 201 is not limited to the five panels shown in the drawings; the housing may include one, two, three, four, five, six, or more panels. The five-panel configuration illustrated is provided merely as an example to convey the inventive concept.

[0035] In various embodiments, the triangular-shaped third panel 230 may have three angles 232, 234, and 236. For example, angle 232 may range between 25° and 40°. These values are provided as examples, and the angles of the third panel 230 may vary depending on factors such as the size and shape of the panel. For instance, the third panel 230 may alternatively have a rectangular or pentagonal shape.

[0036] In some embodiments, the housing 201 may also include a fifth panel 250, on which a fan 260 is positioned. As shown in FIG.2A, the fifth panel 250 is located on the top portion of the heat rejection unit 200, similar to the heat rejection system in FIG.1. Referring to FIG.2A, the edges of the first through fifth panels 210, 220, 230, 240, 250 may be connected to form a prism shape. However, the housing 201 is not limited to this prism shape, and other three- dimensional shapes can be adapted for the housing 201 as needed. In various embodiments, lengths of each panel may be based on the cooling capacity requirement, size of heat source building, size of the fan 260, etc.

[0037] In some embodiments, the heat rejection unit 200 may include a pair of coils 212, 222, which are disposed on the first and second panels 210, 220, respectively. These coils may serveDocket No. LIE-THM-24-100.US.WO as condenser coils, through which a fluid flows during the heat exchange cycle. The coils 212, 222 may be arranged to face each other in a V-shape, though this is not a limitation, as the coils may also be arranged parallel to each other or in other configurations. Additionally, the heat rejection unit 200 may include removable coil guards 270, 290 on the first and second panels 210, 220, respectively, to protect the coils 212, 222.

[0038] FIG. 2B illustrates the airflow path through the heat rejection unit 200. Heated or hot air 280, transferred from the pair of coils 212, 222, rises due to buoyancy, while ambient air 281, which is cooler than the heated air, is drawn into the housing 201 by the fan 260, thereby cooling the coils 212, 222.

[0039] In various embodiments, the fluid passing through the coils 212, 222 may be a refrigerant used in an air conditioning system. While various types of refrigerants can be employed, examples include, but are not limited to, R22, R410A, R407C, R744, R134a, R1234yf, R290, and R600a. Alternatively, the refrigerant may include water, glycol, or other fluids. The coils 212, 222 may be in fluid communication with a compressor located inside the data center building. The compressor pressurizes and sends the refrigerant as a heated vapor, which is then cooled by the coils 212, 222, assisted by the fans 260, converting the vapor into a liquid. The cooled refrigerant is then sent back to the data center building.

[0040] FIG. 3A shows a system 300A having two heat rejection units 200 as a set arranged adjacent to each other and connected via a divider 310. For instance, the system 200 may be installed in a structure having a connector 320 connecting the heat rejection unit 200 to the divider 310. The structure having the connector 320 can robustly hold the set of heat rejection units 200 as one unit. In addition, at the opposite end of the connector 320, the set of heat rejection units 200 (e.g., system 300A) are spaced apart from each other with a gap 330 at a tip portion away from the fan 260, allowing air or fluid to flow therethrough.

[0041] FIG. 3B shows a system 300A having three heat rejection units 200 arranged adjacent to each other and connected via a divider 310, similar to the system 300A of FIG. 3A. The number of heat rejection units 200 is not limited to two or three but can be four, five, etc., based on variables, such as but not limited to, the dimension of the overall structure, data center building, cooling need, etc.

[0042] FIG. 4 shows a top view of a system for transferring heat from a heat source according to an embodiment of the present disclosure, and FIG.5 shows a perspective view of the system for transferring heat from a heat source.

[0043] In some embodiments, a system 400 may comprise multiple heat rejection units 200 arranged in a closed-loop, circular configuration. As shown in FIG. 5, a system 500,Docket No. LIE-THM-24-100.US.WO corresponding to system 400, may have a ring-shaped arrangement where the first or outermost diameter 640 is defined by the virtual connection of the ends of the dividers 310, and the second or innermost diameter 620 is defined by the internal space 410 at a center 420 of the system 400. While the figures depict a circumferential arrangement, other configurations are possible. The heat rejection units 200 may be arranged in elliptical, rectangular, irregular, or other shapes. Furthermore, the outermost diameter 640 and innermost diameter 620 can vary based on the size and number of heat rejection units 200. For example, both the innermost diameter 620 and outermost diameter 640 may exceed 2 meters. The height 560 may be determined by factors such as the minimum spacing between each heat rejection unit 200 and the total number of units in the system. The overall diameters are not limited to the values described and may vary depending on factors such as the number of heat rejection units 200 and other design considerations.

[0044] FIGS. 6A and 6B show top views of systems for transferring heat from a heat source according to various embodiments of the present disclosure. Referring to FIG. 6A, as an example, inner diameter D1 may be about 2 m while outer diameter D2 may be about 3.5 m when the current standard spacing for the coil inlet air opening (e.g., spacing between the pair of coils) is used. Here, the heat rejection units are arranged creating spacings (A) and (B) at the inner and outer diameters, respectively. Here, the spacing (B) may correspond to the gap 330 shown in FIG. 4. However, it is not limited to what is shown in FIG. 6A. For instance, the number of the heat rejection units or the inner diameter can be varied so that the spacing (B) may be 0 (zero) and the spacing (A) may be decreased accordingly. The decreasing space creates an uneven flow distribution effect. The configuration of FIG. 6A has a single layer of heat rejection units which would take a space (or circular area) of about 144 ft2on the rooftop or floor. A typical rectangular unit with the same number of fans has a footprint area of about 95 ft2or about 50% less than one layer of the round unit's area (e.g., 95 ft2 / unit = 1 standard condenser). The two layouts would have 2.1 kW / ft2for a single round and 3.16 kW / ft2for the standard. When the round design is stacked at multiple layers arrangement, as will be described below, for example, when, e.g., two systems 400 are stacked, the kW per footprint becomes 4.17 kW / ft2(more efficient). Similarly, when, e.g., three systems 400 are stacked, the kW per footprint becomes 6.25 kW / ft2.

[0045] FIG.6B shows another example of the system 400 having an elliptical shape rather than a circular shape (e.g., D1’ and D2’ are greater than D1’’ and D2’’, respectively), a single layer or stack can use the same space as about four typical systems or 200% more space. When stacked to two structures, the ft2 / unit can be at the typical spacing, i.e., when conventional heatDocket No. LIE-THM-24-100.US.WO rejection systems are installed. When increased to a 3-stacked structure, the ft2 / unit is between 60 or 63%. Like the circular-shaped structures, at 4 layers (8 units) the ft2 / unit drops to about 45% of the of the typical unit ft2usage. The footage reduction will be further described later with reference to FIGS. 11, 12A, and 12B.

[0046] In various embodiments, the units or systems 200 through 500 can be stacked on top of each other, as will be described hereinafter. FIG. 7 illustrates a front view of a set of systems for transferring heat from a heat source, stacked on a data center structure. Specifically, structure 700 in FIG.7 may include system 500 and systems 710 to 730, stacked vertically with their internal spaces aligned.

[0047] Additionally, or optionally, structure 700 may further include a stand 720 with a hollow design forming an air passage or interior opening 740. This passage allows heated air picked up from the coils 212, 222 to flow through, as indicated by the arrow in FIG. 7. The heated air then follows the air passage and rises upward by buoyancy through the internal space 410 of system 400. The heated air continues upward through the internal space of system 710 and is forced out horizontally. Any remaining heated air rises upward and flows outward in a similar manner. In this way, the heated air gradually exits from the stacked systems of the heat rejection units to the outside. The term “heat source” may be broadly interpreted as the origin of the heat. For example, in various embodiments, the heat may be generated by the refrigerant, which is pressurized and transferred from a compressor to the heat rejection units or systems 200 through 400. The ambient air absorbs the heat generated by the pressurized and heated refrigerant, and the heat is then rejected in the form of heated air by the fans 260.

[0048] In various embodiments, structure 700 may further include a lid 750 that covers the top opening of the structure. The lid 750 may be configured to open and close, preventing heated air, which is drawn outside by buoyancy or fans, from re-entering the internal space of the structure.

[0049] FIGS.8A and 8B show front views of sets of systems stacked on a data center. FIG.8A illustrates structure 800A, which includes more than four systems for heat transfer. In this embodiment, the stand 720 and / or lid 750 may be omitted, or alternatively, the stand 720 and / or lid 750 may be included. Additionally, lid 750 can be placed on each stacked structure 700 as shown in FIG. 8, helping to separate airflow between each structure and preventing recirculation.

[0050] Stacking the systems for heat transfer from a heat source offers several benefits, as described throughout the specification. For example, structure 800B in FIG. 8B features four systems stacked to a height of approximately 3.5 meters. This stacked arrangement allows forDocket No. LIE-THM-24-100.US.WO a 50% reduction in rooftop space compared to conventional rooftop cooling systems. The number of stacked systems is not limited to those shown in the figures (one, four, or twelve) but can be adjusted based on various factors, such as the dimensions of the data center building, required cooling capacity, available power, and cost considerations.

[0051] FIGS. 9 and 10 illustrate a system for transferring heat from a heat source according to another embodiment of the present disclosure. In some embodiments, system 900 may include one or more heat rejection units 200 arranged as a set in a half-closed loop with an internal space 910, as opposed to the closed-loop configuration of system 400. Additionally, unlike system 400, which is arranged cylindrically with fans 260 facing outward in a lateral direction, system 900 is arranged in a dome shape. This configuration allows the air to be drawn out both upwardly and laterally.

[0052] In some embodiments, system 900 further includes a hollow-structured stand 920 with an air passage or interior opening 940 through which ambient air is drawn into internal space 910. The cooler ambient air absorbs heat from the coils of the heat rejection units 200 and is expelled from system 900 through fans 260, as shown by the arrows. FIG.9 illustrates the flow path of heated air as it exits the heat rejection units 200 while fans 260 draw in ambient air. In some embodiments, the dome-shaped set of heat rejection units 200 may be secured to stand 920 by a pair of holding units 960, which may be coupling devices, attachments, or other securing means.

[0053] In some embodiments, system 900 can be stacked laterally, for example, placed side- by-side, rather than stacked vertically. As shown in FIG. 10, one or more systems 900 can be installed on the top and side walls of a data center building, forming structure 1000. This arrangement allows for increased cooling capacity by adding more condenser coils and fans, without increasing the footprint (e.g., the installation surface area) on the rooftop or side of the building. When installed on the side walls, as shown in system 1020 in FIG. 10, the heated air flows horizontally and is discharged vertically.

[0054] In various embodiments, systems 400 and 900 may each be fixed within a rack frame that secures each heat rejection unit 200 in position. In some embodiments, the ends of dividers 310 may be secured to the rack frame, while one or more heat rejection units 200 are secured to dividers 310 using connectors 320. The structure, arrangement, and dimensions of the rack frame can be designed and fabricated as needed.

[0055] FIG. 11 shows a plan view of a conventional arrangement of heat transfer systems disposed on the rooftop of a data center. In contrast, FIGS. 12A and 12B show plan views of arrangements of systems for transferring heat from a heat source according to variousDocket No. LIE-THM-24-100.US.WO embodiments, also installed on the rooftop of a data center. In the arrangement shown in FIG. 11, only one heat rejection unit can be positioned within the same surface area, typically forming a two-dimensional array of heat transfer systems. Specifically, one heat rejection unit can be installed in area 1101, while one or more heat rejection units can be installed in area 1201, as seen in the arrangements 1200A and 1200B.

[0056] Furthermore, conventional heat rejection units typically use a single fan, requiring a larger fan to achieve the desired cooling capacity. In contrast, the heat rejection units of the present disclosure may include multiple fans, as illustrated in FIGS. 5 and 9, enabling more efficient cooling. This configuration allows for a reduction in the installation area or footprint. Additionally, it permits the installation of a larger number of heat rejection units, which can significantly increase the overall cooling capacity of the system.

[0057] Process flowcharts discussed herein illustrate the operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present invention. In this regard, each block in the flowchart may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the blocks might occur out of the order depicted in the figures. For example, blocks shown in succession may be executed substantially concurrently. It will also be noted that each block of flowchart illustration can be implemented by special-purpose hardware-based systems that perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.

[0058] The foregoing description, for purposes of explanation, used specific nomenclature to provide a thorough understanding of the described embodiments. However, it will be apparent to one skilled in the art that the specific details are not required in order to practice the described embodiments. Thus, the foregoing descriptions of the specific embodiments described herein are presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the embodiments to the precise forms disclosed. It will be apparent to one of ordinary skill in the art that many modifications and variations are possible in view of the above teachings.

Claims

Docket No. LIE-THM-24-100.US.WO What is claimed is:

1. A modular heat rejection system for transferring heat from a heat source, the system comprising: a first plurality of heat rejection units arranged adjacent to each other defining an internal space at the center, wherein heated air from the heat source flows upward through the internal space, and wherein each of the first plurality of heat rejection units comprises: a housing; coils through which the heat is flowing; and a fan arranged away from the internal space and configured to drag ambient air from outside to inside the housing.

2. The system of claim 1, wherein the first plurality of heat rejection units is circumferentially arranged.

3. The system of claim 2, further comprising connectors configured to connect the first plurality of heat rejection units to the plurality of dividers, respectively, and wherein each heat rejection unit is spaced apart from each other, defining a gap toward the center, away from the fan.

4. The system of claim 1, wherein the fan is configured to drag the ambient air while directing heated air outside.

5. The system of claim 1, further comprising a second plurality of heat rejection units arranged adjacent to each other, wherein the second plurality of heat rejection units is configured to be vertically stacked on the first plurality of heat rejection units.

6. The system of claim 5, further comprising a third plurality of heat rejection units circumferentially arranged and configured to be vertically stacked on the second plurality of heat rejection units, andDocket No. LIE-THM-24-100.US.WO wherein internal spaces of the first, second, and third pluralities of heat rejection units are configured to guide the heated air rise therethrough.

7. The system of claim 6, further comprising a stand configured to support the first to third pluralities of heat rejection units, wherein the stand defines an interior opening that communicates with internal spaces of the first to third pluralities of heat rejection units, wherein the heated air rises and flows out gradually from the first, second, and third pluralities of heat rejection units to the outside upwardly and laterally.

8. The system of claim 7, further comprising a lid configured to open and close the top of the system blocking recirculation of the heated air between the first, second, and third pluralities of heat rejection units.

9. The system of claim 1, wherein the housing comprises a plurality of panels forming a prism shape.

10. The system of claim 1, wherein the first plurality of heat rejection units is arranged adjacent to each other in a tubular shape.

11. A modular heat rejection system for transferring heat from a heat source comprising: a first plurality of heat rejection units arranged adjacent to each other defining an internal space at the center, wherein heated air from the heat source flows upward through the internal space, and wherein each of the first plurality of heat rejection units comprises: a housing; coils through which the heat is flowing; and a fan arranged away from the internal space and configured to drag ambient air from outside to inside the housing; and a stand configured to support the first plurality of heat rejection units.

12. The system of claim 11, wherein the first plurality of heat rejection units is arranged in a dome shape.Docket No. LIE-THM-24-100.US.WO 13. The system of claim 12, further comprising a plurality of dividers respectively connecting the first plurality of heat rejection units side by side.

14. The system of claim 13, wherein the fan is configured to drag the ambient air while directing the heated air outside.

15. The system of claim 14, further comprising a connector configured to connect a heat rejection unit to a divider, and wherein each heat rejection unit is spaced apart from each other, defining a gap toward the center, away from the fan.

16. The system of claim 11, further comprising a second plurality of heat rejection units arranged adjacent to each other, wherein the second plurality of heat rejection units is configured to be horizontally stacked adjacent to the first plurality of heat rejection units.

17. The system of claim 16, further comprising a third plurality of heat rejection units adjacent to each other and configured to be horizontally stacked adjacent to the second plurality of heat rejection units, wherein internal spaces of the first, second, and third pluralities of heat rejection units are configured to direct the heated air outside through the first, second, and third pluralities of heat rejection units.

18. The system of claim 17, wherein the ambient air enters the stand cooling the first, second, and third pluralities of heat rejection units while the heated air flows outside through the first, second, and third pluralities of heat rejection units.

19. The system of claim 11, wherein the housing comprises a plurality of panels forming a prism shape.

20. The system of claim 11, wherein the first plurality of heat rejection units is arranged adjacent to each other in a tubular shape.

Images