Display panel, manufacturing method for display panel, and display apparatus

Abstract

A display panel, a manufacturing method for the display panel, and a display apparatus. The display panel comprises a substrate, an isolation structure, a plurality of light-emitting devices, a packaging structure, and an optical structure. The isolation structure is located on one side of the substrate; and the isolation structure defines a plurality of pixel openings. The light-emitting devices are arranged in the pixel openings. The packaging structure comprises a first inorganic packaging layer, an organic packaging layer, and a second inorganic packaging layer which are sequentially stacked in the direction moving away from the substrate. The optical structure is located between the first inorganic packaging layer and the organic packaging layer. The optical structure comprises a plurality of light-transmitting optical portions; and one optical portion is located in one corresponding pixel opening. The display panel is used for displaying an image.

Description

Display panel, method for manufacturing display panel, and display device Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display panel, a method for manufacturing the display panel, and a display device. Background Technology

[0002] With the continuous development of display technology, display devices have gradually become ubiquitous in people's lives. Among them, organic light-emitting diode (OLED) display panels are widely used in display devices such as mobile phones, televisions, and laptops due to their advantages such as self-illumination, low power consumption, wide viewing angle, fast response speed, and high contrast.

[0003] Summary of the Invention

[0004] On one hand, a display panel is provided. The display panel includes a substrate, an isolation structure, a light-emitting device, a packaging structure, and an optical structure.

[0005] An isolation structure is located on one side of the substrate, defining a plurality of pixel openings. Light-emitting devices are disposed within each pixel opening. An encapsulation structure is located on the side of the light-emitting devices away from the substrate. The encapsulation structure includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer sequentially stacked along a direction away from the substrate.

[0006] An optical structure is located between the first inorganic encapsulation layer and the organic encapsulation layer. The optical structure includes a plurality of light-transmitting optical elements, one of which is located within one of the pixel openings.

[0007] In some embodiments, the surface of the optical element away from the substrate is closer to the substrate than the surface of the isolation structure away from the substrate; or, the surface of the optical element away from the substrate and the surface of the isolation structure away from the substrate are flush.

[0008] In some embodiments, the isolation structure includes a first sublayer, a second sublayer, and a third sublayer sequentially stacked in a direction away from the substrate. The surface of the optical portion away from the substrate is farther from the substrate than the surface of the second sublayer.

[0009] In some embodiments, the refractive index of the material of the optical part is different from that of the material of the third sublayer.

[0010] In some embodiments, the refractive index of the optical element is greater than or equal to 1.65, and the refractive index of the third sublayer is less than or equal to 1.4; or, the refractive index of the optical element is less than or equal to 1.4, and the refractive index of the third sublayer is greater than or equal to 1.65.

[0011] In some embodiments, the material of the optical part includes photoresist.

[0012] In some embodiments, the optical element includes a first particle having a refractive index of 1 to 2.

[0013] In some embodiments, the optical element is a color filter, and in the light-emitting device and the color filter located in the same pixel opening, the color filter allows the color of the light transmitted to be the same as the color of the light emitted by the light-emitting device.

[0014] In some embodiments, the isolation structure includes a first sublayer, a second sublayer, and a third sublayer sequentially stacked along a direction away from the substrate. At least the third sublayer in the isolation structure includes a light-shielding material.

[0015] In some embodiments, both the second sublayer and the third sublayer include a light-shielding material.

[0016] In some embodiments, the first sublayer and the third sublayer of the isolation structure comprise insulating materials, and the second sublayer of the isolation structure comprises conductive materials.

[0017] The light-emitting device includes a first electrode, a light-emitting part, and a second electrode stacked sequentially in a direction away from the substrate. The second electrodes of two adjacent light-emitting devices are connected by a second sub-layer in an isolation structure located between the two adjacent light-emitting devices.

[0018] In some embodiments, the isolation structure has a plurality of grooves on the surface away from the substrate, and the grooves are in communication with at least one of the pixel openings.

[0019] In some embodiments, at least one groove is provided between two adjacent pixel openings, and the groove and the two adjacent pixel openings are connected.

[0020] In some embodiments, one pixel opening communicates with a plurality of grooves, the plurality of grooves extend in a direction away from the pixel opening, and the plurality of grooves are spaced apart around the pixel opening.

[0021] In some embodiments, the spacing between two adjacent grooves is equal along the circumferential direction of the plurality of grooves.

[0022] In some embodiments, the depth of the groove is less than or equal to the thickness of the third sublayer of the isolation structure.

[0023] In some embodiments, the material of the third sublayer of the isolation structure and the material of the optical structure both include hydrophobic or oleophobic materials.

[0024] In some embodiments, the isolation structure includes a first sublayer, a second sublayer, and a third sublayer stacked sequentially in a direction away from the substrate.

[0025] The light-emitting device includes a first electrode, a light-emitting part, and a second electrode, which are sequentially stacked in a direction away from the substrate.

[0026] The first sublayer covers a portion of the area of ​​the first electrode.

[0027] On the other hand, a method for manufacturing a display panel is provided, comprising the following steps:

[0028] An isolation structure is formed on one side of the substrate; the isolation structure defines a plurality of pixel openings.

[0029] A light-emitting device film layer of the target color and a first inorganic thin film are sequentially formed on a substrate having the plurality of pixel openings.

[0030] A photoresist layer is formed on the side of the first inorganic thin film away from the substrate, the photoresist layer covering the light-emitting device region of the target color.

[0031] Based on the photoresist layer, the portion of the target color light-emitting device film layer and the portion of the first inorganic thin film covering the area other than the target color light-emitting device area is removed. The target color light-emitting device film layer and the first inorganic thin film retained in the target color light-emitting device area respectively form the target color light-emitting device and its corresponding first inorganic encapsulation layer. The retained photoresist layer forms an optical structure.

[0032] In another aspect, a display device is provided, comprising a display panel and a cover plate as described in any of the above embodiments.

[0033] The cover plate is located on the light-emitting side of the display panel. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0035] Figure 1 is a structural diagram of a display device according to some embodiments;

[0036] Figure 2 is a first cross-sectional view of the display device in Figure 1 along section line BB;

[0037] Figure 3 is a structural diagram of a display panel according to some embodiments;

[0038] Figure 4A is a film structure diagram of a light-emitting device according to some embodiments;

[0039] Figure 4B is a diagram of another film structure of a light-emitting device according to some embodiments;

[0040] Figure 4C is another film structure diagram of a light-emitting device according to some embodiments;

[0041] Figure 4D is a diagram of another film structure of a light-emitting device according to some embodiments;

[0042] Figure 5 is a second cross-sectional view of the display device in Figure 1 along section line BB;

[0043] Figure 6 is a partial plan view of a display panel according to some embodiments;

[0044] Figure 7 is a cross-sectional view of an isolation structure according to some embodiments;

[0045] Figure 8A is another structural diagram of a display device according to some embodiments;

[0046] Figure 8B is another structural diagram of a display device according to some embodiments;

[0047] Figure 8C is another structural diagram of a display device according to some embodiments;

[0048] Figure 9 is another structural diagram of a display panel according to some embodiments;

[0049] Figure 10 is a schematic diagram of the transmittance curves of different wavelengths of light by the optical element in the optical structure of the display panel according to some embodiments.

[0050] Figure 11 is another structural diagram of a display panel according to some embodiments;

[0051] Figure 12 is a schematic diagram showing the thickness variation trend of the organic encapsulation layer in the encapsulation structure along the direction from the edge of the display panel to the center of the display panel;

[0052] Figure 13 is a partial planar structural diagram of an isolation structure according to some embodiments;

[0053] Figure 14 is another partial planar structural diagram of the isolation structure according to some embodiments;

[0054] Figure 15A is the first cross-sectional view of the isolation structure in Figure 13 along section line CC;

[0055] Figure 15B is a second cross-sectional view of the isolation structure in Figure 13 along section line CC;

[0056] Figure 16 is a flowchart of a method for manufacturing a display panel according to some embodiments;

[0057] Figure 17 is a structural diagram corresponding to step S1 in the method for preparing the display panel according to the embodiment shown in Figure 16;

[0058] Figure 18 is a structural diagram corresponding to step S2 in the manufacturing method of the display panel according to the embodiment shown in Figure 16;

[0059] Figure 19 is a structural diagram corresponding to step S3 in the manufacturing method of the display panel according to the embodiment shown in Figure 16;

[0060] Figure 20 is a structural diagram corresponding to step S4 in the manufacturing method of the display panel according to the embodiment shown in Figure 16;

[0061] Figure 21 is another structural diagram corresponding to step S2 in the manufacturing method of the display panel according to the embodiment shown in Figure 16;

[0062] Figure 22 is another structural diagram corresponding to step S3 in the manufacturing method of the display panel according to the embodiment shown in Figure 16;

[0063] Figure 23 is another structural diagram corresponding to step S4 in the manufacturing method of the display panel according to the embodiment shown in Figure 16;

[0064] Figure 24 is another structural diagram corresponding to step S2 in the manufacturing method of the display panel according to the embodiment shown in Figure 16;

[0065] Figure 25 is another structural diagram corresponding to step S3 in the manufacturing method of the display panel according to the embodiment shown in Figure 16;

[0066] Figure 26 is another structural diagram corresponding to step S4 in the manufacturing method of the display panel according to the embodiment shown in Figure 16;

[0067] Figure 27 is another structural diagram corresponding to step S2 in the manufacturing method of the display panel according to the embodiment shown in Figure 16;

[0068] Figure 28 is another structural diagram corresponding to step S3 in the manufacturing method of the display panel according to the embodiment shown in Figure 16;

[0069] Figure 29 is another structural diagram corresponding to step S4 in the manufacturing method of the display panel according to the embodiment shown in Figure 16. Detailed Implementation

[0070] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0071] Unless the context otherwise requires, throughout the specification and claims, the term "comprise" and its other forms, such as the third-person singular "comprises" and the present participle "comprising," are interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," or "some examples," etc., are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0072] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0073] In describing some embodiments, the terms "coupled" and "connected," and their derivative expressions, may be used. The term "connected" should be interpreted broadly; for example, a "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection via an intermediate medium. The term "coupled," for example, indicates that two or more components have direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that do not have direct contact with each other but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the content of this document.

[0074] "At least one of A, B and C" has the same meaning as "at least one of A, B or C", both including the following combinations of A, B and C: only A, only B, only C, combinations of A and B, combinations of A and C, combinations of B and C, and combinations of A, B and C.

[0075] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0076] As used herein, depending on the context, the term “if” may optionally be interpreted as meaning “when”, “in the event of”, “in response to determination”, or “in response to detection”. Similarly, depending on the context, the phrase “if it is determined that…” or “if [the stated condition or event] is detected” may optionally be interpreted as meaning “in the event of determination that…”, “in response to determination that…”, “when [the stated condition or event] is detected”, or “in response to the detection of [the stated condition or event]”.

[0077] The use of “applies to” or “configured to” in this article implies an open and inclusive language that does not preclude applicability to or configuration to devices that perform additional tasks or steps.

[0078] In addition, the use of “based on” implies openness and inclusivity, because processes, steps, calculations or other actions “based on” one or more of the stated conditions or values ​​may in practice be based on additional conditions or values ​​beyond those stated.

[0079] As used herein, “about,” “approximately,” or “approximately” includes the stated value and the average value within an acceptable range of deviation from the given value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the given quantity (i.e., the limitations of the measurement system).

[0080] As used herein, “parallel,” “perpendicular,” and “equal” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°; “equal” includes absolute equality and approximate equality, where an acceptable range of deviation for approximate equality may be, for example, a difference between the two equals being less than or equal to 5% of either one.

[0081] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0082] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as being limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched areas shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the areas of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0083] For ease of description below, an XYZ coordinate system is established. The third direction Z represents the thickness direction of the display device, the XY plane is perpendicular to the Z direction, and the first direction X intersects the second direction Y. For example, the first direction X and the second direction Y are perpendicular to each other.

[0084] It should be noted that, for example, F1 / F in the accompanying drawings of this disclosure indicates that the component is both F1 and F, and other similar reference numerals in the drawings also follow the above description.

[0085] As shown in FIG1, some embodiments of the present disclosure provide a display device 100.

[0086] Exemplarily, display device 100 can be any device that displays images, whether moving (e.g., video) or stationary (e.g., still images), and whether text or images. More specifically, the embodiments described are contemplated to be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, camcorders, game consoles, watches, clocks, calculators, television monitors, flat panel displays, computer monitors, automotive displays (e.g., odometer displays, etc.), navigators, cockpit controllers and / or displays, displays of camera views (e.g., displays of rearview cameras in vehicles), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging and aesthetic structures (e.g., displays of images of a piece of jewelry), etc. Figure 1 illustrates display device 100 as an example of a mobile phone.

[0087] For example, the display device 100 may be an electroluminescent display device or a photoluminescent display device. When the display device 100 is an electroluminescent display device, it may be an organic light-emitting diode (OLED) or a quantum dot light-emitting diode (QLED). When the display device 100 is a photoluminescent display device, it may be a quantum dot photoluminescent display device.

[0088] The following uses an organic light-emitting diode (OLED) display device 100 as an example to illustrate some embodiments of the present disclosure. However, the implementation of the present disclosure includes, but is not limited to, these embodiments. Any other display device can also be considered as long as the same technical concept is applied.

[0089] In some embodiments, as shown in FIG2, FIG2 is a first cross-sectional view of the display device 100 in FIG1 along section line BB. The display device 100 includes a display panel 10 and a cover plate 20. The cover plate 20 is disposed on the light-emitting side of the display panel 10.

[0090] The cover plate 20 can isolate the display panel 10 from the external environment and provide protection for the display panel 10.

[0091] For example, the cover plate 20 can be a single-layer cover plate or multiple cover plates 20 bonded together by adhesive.

[0092] For example, the cover plate 20 can be a silicate glass cover plate, such as curved glass or ultra-thin glass.

[0093] The cover plate 20 can also be a flexible polymer film cover plate, such as transparent polyimide, PET or polyurethane.

[0094] The cover plate 20 can also be a combination of the above-mentioned flexible polymer films, or a combination of flexible polymer film and silicate glass.

[0095] In some embodiments, the display device 100 may further include a circuit board (not shown). The circuit board is electrically connected to the display panel 10 and is configured to drive the display panel 10 to display an image.

[0096] For example, circuit boards include, but are not limited to, PCBs (Printed Circuit Boards) and FPCs (Flexible Printed Circuit Boards).

[0097] In some embodiments, the display device 100 may further include an under-display camera and an under-display fingerprint sensor, enabling the display device 100 to perform various functions such as taking photos, recording videos, fingerprint recognition, or facial recognition. This disclosure does not impose any limitations on this, and adaptive designs can be made according to actual needs.

[0098] The display panel 10 described above will be described in detail below.

[0099] In some embodiments, referring to FIG2, the display panel 10 includes a substrate 1.

[0100] For example, the material used to form substrate 1 may include inorganic materials, such as glass materials such as soda-lime glass, quartz glass, and sapphire glass.

[0101] The material used to form substrate 1 may also include organic materials, such as one or more of polymethyl methacrylate, polyvinyl alcohol, polyvinylphenol, polyethersulfone, polyimide, polyamide, polyacetal, polycarbonate, polyethylene terephthalate, and polyethylene naphthalate.

[0102] The materials used to form substrate 1 may include both organic and inorganic materials.

[0103] In some embodiments, as shown in FIG3, FIG3 is a structural diagram of a display panel 10 according to some embodiments. The display panel 10 can be a rectangular structure.

[0104] It should be noted that the aforementioned "rectangular structure" refers to the fact that the overall shape of the boundary of the display panel 10 is rectangular, but it is not limited to a standard rectangle. That is, the "rectangle" here includes not only the shape of a standard rectangle, but also shapes similar to rectangles, taking into account manufacturing conditions. For example, as shown in Figure 3, the long and short sides of the rectangle are curved at each intersection point (i.e., at the corner G), meaning that the corner G is smooth, making the boundary of the display panel 10 a rounded rectangle in the plan view.

[0105] In other embodiments, the display panel 10 may be a circular structure or other shapes with corners.

[0106] The following uses a rectangular structure for the display panel 10 as an example to illustrate some embodiments of the present disclosure. However, the implementation of the present disclosure includes, but is not limited to, this, and the shape of the display panel 10 can also be any other shape.

[0107] In some embodiments, please continue to refer to FIG3, the display panel 10 has a display area AA for displaying images and a peripheral area AN located on at least one side of the display area AA.

[0108] For example, the peripheral area AN is located on one side of the display area AA.

[0109] For example, the peripheral area AN is located on opposite sides of the display area AA.

[0110] For example, as shown in Figure 3, the peripheral area AN surrounds the display area AA.

[0111] It should be noted that the specific setting of the peripheral area AN is related to the specific design of the display panel 10, and can be designed according to actual needs. This is only an example and is not intended to limit this disclosure.

[0112] In some embodiments, referring to Figures 2 and 3, a plurality of light-emitting devices F are disposed within the display area AA of the display panel 10, and each light-emitting device F is the smallest light-emitting unit within the display area AA. The plurality of light-emitting devices F within the display area AA of the display panel 10 are located on one side of the substrate 1.

[0113] For example, other film structures may be provided between the substrate 1 and the light-emitting device F.

[0114] For example, a driving layer (not shown in the figure) for driving the light-emitting device F to emit light can be disposed between the substrate 1 and the light-emitting device F. The driving layer may include an active layer formed on the substrate 1 by a patterning process, a gate insulating layer (GI) formed on the active layer by deposition or the like, a gate of a thin film transistor (TFT) formed on the gate insulating layer (GI) by a patterning process, a dielectric layer (ILD) formed on the gate by deposition or the like, a source and drain metal layer formed on the dielectric layer (ILD), and a planarization layer (PLN) covering the source and drain metal layer and the exposed dielectric layer (ILD). The source and drain metal layer forms the source and drain of the thin film transistor (TFT).

[0115] The active layer can be made of materials such as polysilicon and metal oxides. The gate insulating layer (GI) can be made of inorganic insulating materials such as silicon oxide, silicon nitride, or silicon oxynitride. The dielectric layer (ILD) can also be made of inorganic insulating materials such as silicon oxide, silicon nitride, or silicon oxynitride. The gate material can be made of metals or alloys such as aluminum, titanium, or cobalt. The planarization layer (PLN) can be made of organic materials or inorganic insulating materials such as silicon oxide, silicon nitride, or silicon oxynitride. The planarization layer (PLN) has a planarization function, which is beneficial to improving the quality of subsequent material deposition, reducing surface differences of other films formed later, and preventing water and oxygen from entering the light-emitting device (F).

[0116] For example, multiple light-emitting devices F within the display area AA of the display panel 10 can emit light of the same color. The display panel 10 may also include a color filter layer disposed on the light-emitting side of the multiple light-emitting devices F. For instance, the multiple light-emitting devices F may emit light of colors such as white, red, green, or blue. In this case, the colored light emitted by the light-emitting devices F is emitted as the same color after passing through the color filter layer, or it is converted into other colors and emitted. Thus, when the multiple light-emitting devices F emit light of the same color, the display panel 10 can achieve multi-color light emission.

[0117] Alternatively, as shown in Figure 2, multiple light-emitting devices F in the display area AA of the display panel 10 emit light of different colors. For example, the multiple light-emitting devices F include a first-color light-emitting device F1 that emits a first-color light, a second-color light-emitting device F2 that emits a second-color light, and a third-color light-emitting device F3 that emits a third-color light, thereby realizing multi-color light emission of the display panel 10.

[0118] Among them, the first color light-emitting device F1 can be a red light-emitting device, emitting red light. The second color light-emitting device F2 can be a green light-emitting device, emitting green light. The third color light-emitting device F3 can be a blue light-emitting device, emitting blue light.

[0119] Alternatively, the first color light-emitting device F1 can also be a green light-emitting device or a blue light-emitting device. The second color light-emitting device F2 can also be a red light-emitting device or a blue light-emitting device. The third color light-emitting device F3 can also be a red light-emitting device or a green light-emitting device.

[0120] The following describes some embodiments of this disclosure by taking the example of multiple light-emitting devices F emitting different colors of light in the display area AA of the display panel 10.

[0121] In some embodiments, referring to FIG2, the light-emitting device F includes a first electrode 41, a light-emitting portion 43, and a second electrode 42 sequentially stacked along a direction away from the substrate 1. That is, the first electrode 41 is closer to the substrate 1 than the second electrode 42.

[0122] The first electrode 41 and the second electrode 42 can provide charge carriers such as electrons and holes to the light-emitting part 43 so that the light-emitting part 43 emits light.

[0123] For example, one of the first electrode 41 and the second electrode 42 can serve as the anode of the light-emitting device F (e.g., the first color light-emitting device F1, the second color light-emitting device F2 and the third color light-emitting device F3), and the other can serve as the cathode of the light-emitting device F (e.g., the first color light-emitting device F1, the second color light-emitting device F2 and the third color light-emitting device F3).

[0124] For example, the first electrode 41 can be used as the anode of the light-emitting device F (e.g., the first color light-emitting device F1, the second color light-emitting device F2, and the third color light-emitting device F3), and the second electrode 42 can be used as the cathode of the light-emitting device F (e.g., the first color light-emitting device F1, the second color light-emitting device F2, and the third color light-emitting device F3).

[0125] For example, the material used to form the first electrode 41 may include metallic materials, such as any one or more of magnesium (Mg), silver (Ag), copper (Cu), aluminum (Al), titanium (Ti) and molybdenum (Mo).

[0126] The material used to form the first electrode 41 may also include alloys of the aforementioned metallic materials, such as aluminum-neodymium alloy (AlNd) or molybdenum-niobium alloy (MoNb).

[0127] For example, the first electrode 41 may be a single-layer structure.

[0128] Alternatively, the first electrode 41 can also be a multilayer composite structure. For example, the first electrode 41 can be a Ti / Al / Ti structure, etc. Another example is that the first electrode 41 can be a stacked structure formed of metallic materials and transparent conductive materials, such as ITO / Ag / ITO, Mo / AlNd / ITO, etc.

[0129] For example, the material used to form the second electrode 42 may include any one or more of magnesium (Mg), silver (Ag), aluminum (Al), etc.

[0130] The material used to form the second electrode 42 may also include any one or more alloys made of magnesium (Mg), silver (Ag), aluminum (Al), etc.

[0131] The material used to form the second electrode 42 may also include a transparent conductive material, such as indium tin oxide (ITO).

[0132] In some embodiments, as shown in Figures 4A, 4B, 4C, and 4D, which are film structure diagrams of a light-emitting device F according to some embodiments, the light-emitting portion 43 within the light-emitting device F includes a light-emitting layer 43a.

[0133] For example, referring to Figures 4A and 4C, the display panel 10 can be an OLED display panel. Since the display panel 10 is an OLED display panel, the light-emitting layer 43a can include an organic light-emitting layer (EML). For example, the organic light-emitting layer EML can include a host material and a guest material, and the guest material can be a fluorescent dopant or a phosphorescent dopant.

[0134] Alternatively, referring to Figures 4B and 4D, the display panel 10 can also be a QLED display panel. Based on the fact that the display panel 10 is a QLED display panel, the light-emitting layer 43a may include a quantum dot layer (QDL). For example, the quantum dot layer (QDL) may have quantum dot particles, which can be interconnected by surface-modified groups. Exemplarily, referring to Figures 4A, 4B, 4C, and 4D, the light-emitting part 43 may also include one or more of the following: a hole injection layer (HIL), a hole transport layer (HTL), an electron block layer (EBL), a hole block layer (HBL), an electron transport layer (ETL), and an electron injection layer (EIL).

[0135] In some embodiments, please continue to refer to Figures 4A and 4B, the light-emitting portion 43 in the light-emitting device F may include a single-layer light-emitting layer 43a.

[0136] In some other embodiments, please continue to refer to Figures 4C and 4D, the light-emitting portion 43 in the light-emitting device F may include multiple light-emitting layers 43a.

[0137] For example, please continue to refer to Figures 4C and 4D. The light-emitting part 43 in the light-emitting device F may include two light-emitting layers 43a.

[0138] Please refer to Figures 4C and 4D. The light-emitting part 43 in the light-emitting device F also includes a charge generation layer (CGL) located between two adjacent light-emitting layers 43a. The charge generation layer (CGL) can connect two adjacent light-emitting layers 43a in series to achieve a tandem EL design.

[0139] On the one hand, due to the increased number of light-emitting layers 43a, and the fact that the charge generation layer (CGL) can reduce the driving voltage and generate new charge carriers, the luminous efficiency of the light-emitting part 43 can be increased several times. On the other hand, at the same brightness, the current density of the display panel 10 with a tandem EL design is reduced compared to the display panel 10 with a single-layer light-emitting design, which is beneficial to extending the lifespan of the display panel 10.

[0140] For example, the charge generation layer (CGL) can be configured to generate, transport, and inject charge carriers.

[0141] For example, the charge generation layer (CGL) may include an N-type charge generation layer (n-CGL) and a P-type charge generation layer (p-CGL).

[0142] N-type charge generation layers (n-CGLs) may include, for example, organic electron transport layer (ETL) materials doped with metal materials.

[0143] P-type charge generation layer (p-CGL) can include, for example, organic hole transport layer (HTL) materials doped with p-type light-emitting dopants (p-dopant, PD).

[0144] In some embodiments, as shown in Figures 5 and 6, Figure 5 is a second cross-sectional view of the display device 100 in Figure 1 along section line BB, and Figure 6 is a partial planar structural view of the display panel 10 according to some embodiments. The display panel 10 also includes an isolation structure 5. The isolation structure 5 is located on one side of the substrate 1 and defines a plurality of pixel openings K. A light-emitting device F (e.g., a first-color light-emitting device F1, a second-color light-emitting device F2, or a third-color light-emitting device F3) is disposed in the pixel opening K, and the pixel opening K and the light-emitting device F (e.g., the first-color light-emitting device F1, the second-color light-emitting device F2, or the third-color light-emitting device F3) correspond one-to-one.

[0145] By setting an isolation structure 5 and placing a light-emitting device F (e.g., a first-color light-emitting device F1, a second-color light-emitting device F2, or a third-color light-emitting device F3) within a pixel opening K in the isolation structure 5, the light-emitting parts 43 in two adjacent light-emitting devices F can be disconnected at the isolation structure 5.

[0146] For example, the pixel opening K can be a rectangular structure, a circular structure, or other shapes with corners.

[0147] In some embodiments, referring to FIG5, the isolation structure 5 includes a first sublayer 51, a second sublayer 52, and a third sublayer 53 sequentially stacked along a direction away from the substrate 1. That is, the first sublayer 51 is closer to the substrate 1 than the third sublayer 53.

[0148] The first sublayer 51 and the third sublayer 53 may include insulating materials, and the second sublayer 52 may include conductive materials.

[0149] For example, the first sublayer 51 may include an organic insulating material, such as polyimide, acrylic, or polyethylene terephthalate.

[0150] The third sublayer 53 may include an inorganic insulating material, such as silicon oxide, silicon dioxide, silicon nitride, or carbon black. The material of the second sublayer 52 may include a metal, such as titanium nitride. In some embodiments, referring to FIG5, since the second sublayer 52 includes a conductive material, the second electrodes 42 in two adjacent light-emitting devices F can be connected through the second sublayer 52 in the isolation structure 5 located between the two adjacent light-emitting devices F, which facilitates the transmission of second electrode (e.g., cathode) signals between the two adjacent light-emitting devices F.

[0151] In some embodiments, please continue to refer to FIG5, the first sublayer 51 of the isolation structure 5 covers a portion of the first electrode 41 of the light-emitting device F.

[0152] By covering a portion of the first electrode 41 of the light-emitting device F with the first sub-layer 51 of the isolation structure 5, that is, exposing a portion of the first electrode 41 through the pixel opening K defined by the isolation structure 5, the first sub-layer 51 of the isolation structure 5 can effectively define the actual effective area of ​​the first electrode 41 (i.e., the area where the first electrode 41 is directly electrically connected to the light-emitting part 43), thereby defining the light-emitting area and light-emitting area of ​​the sub-pixel F.

[0153] For example, the first sublayer 51 of the isolation structure 5 may cover the edge region of the first electrode 41 of the light-emitting device F.

[0154] For example, as shown in FIG7, FIG7 is a cross-sectional view of the isolation structure 5 according to some embodiments. The third sub-layer 53 has a first included angle R1 between its surface 53a near the second sub-layer 52 and its side surface 53b, the first included angle R1 facing inward of the third sub-layer 53. The first included angle R1 is greater than 45° and less than 90°.

[0155] For example, the first included angle R1 can be 46°, 50°, 55°, 60°, 66°, 70°, 75°, 80°, 85°, 86°, 88°, or 89°, etc.

[0156] By setting the first included angle R1 to be greater than 45° and less than 90°, the cross-section of the third sub-layer 53 is arranged in a trapezoidal shape, which facilitates the deposition of the material used to form the second electrode 42 on the sidewall of the second sub-layer 52, thereby improving the bonding yield of the second electrode 42 and the second sub-layer 52.

[0157] For example, referring to Figure 7, the surface 51a of the first sublayer 51 near the second sublayer 52 has a second included angle R2 with the side surface 51b of the first sublayer 51, and the second included angle R2 faces inward of the first sublayer 51. The second included angle R2 is greater than 90° and less than 180°.

[0158] For example, the second included angle R2 can be 93°, 100°, 105°, 110°, 115°, 120°, 126°, 130°, 135°, 140°, 145°, 150°, 155°, 160°, 165°, 170°, 175°, or 178°, etc. In some embodiments, referring to FIG5, the display panel 10 further includes an encapsulation structure 8. The encapsulation structure 8 is located on the side of the plurality of light-emitting devices F away from the substrate 1. That is, the encapsulation structure 8 is farther from the substrate 1 than the light-emitting devices F.

[0159] The encapsulation structure 8 includes a first inorganic encapsulation layer 81, an organic encapsulation layer 83, and a second inorganic encapsulation layer 82, which are sequentially stacked along a direction away from the substrate 1. That is, the first inorganic encapsulation layer 81 is closer to the light-emitting device F than the second inorganic encapsulation layer 82.

[0160] The encapsulation structure 8 is used to encapsulate the light-emitting device F (e.g., the first color light-emitting device F1, the second color light-emitting device F2, and the third color light-emitting device F3), thereby protecting the light-emitting device F from corrosion caused by external water and oxygen.

[0161] The first inorganic encapsulation layer 81 and the second inorganic encapsulation layer 82 are made of inorganic materials, which can be used to block water and oxygen. The organic encapsulation layer 83 is made of organic materials, which can flatten the interface, cover defects, and relieve stress.

[0162] For example, the materials of the first inorganic encapsulation layer 81 and the second inorganic encapsulation layer 82 may include alkali metal compounds (e.g., LiF), alkaline earth metal compounds (e.g., MgF2), SiON, SiNx, or SiOy, etc.

[0163] The organic encapsulation layer 83 may include organic inks, etc.

[0164] For example, the formation of the first inorganic encapsulation layer 81 and the second inorganic encapsulation layer 82 can be achieved using processes such as plasma enhanced chemical vapor deposition (PECVD), magnetron sputtering (SUPTTER), or atomic layer deposition (ALD).

[0165] When forming the organic encapsulation layer 83, processes such as inkjet printing (IJP), plasma-enhanced chemical vapor deposition (PECVD), screen printing, or flash evaporation can be used.

[0166] In some embodiments, as shown in Figures 8A, 8B, and 8C, which are structural diagrams of a display device 100 according to some embodiments, the display panel 10 also includes an optical structure 6. The optical structure 6 includes a plurality of light-transmitting optical elements 61, one of which is located on the light-emitting side of a light-emitting device F.

[0167] For example, the optical structure 6 can be used to form an enhanced efficiency structure (EES), which is beneficial to improving the light emission efficiency of the display panel 10. The implementation of the optical structure 6 in forming the enhanced efficiency structure (EES) and the principle of improving the light emission efficiency of the display panel 10 will be explained in detail later.

[0168] Optical structure 6 can also be used to form a color filter on encapsulation (COE), which is beneficial for improving light transmittance. The implementation method of using optical structure 6 to form a color filter on encapsulation (COE) and the principle of improving light transmittance will be explained in detail later.

[0169] In some embodiments, referring to Figures 8A, 8B, and 8C, an optical element 61 is located within a pixel opening K, and the optical element 61 is closer to the substrate 1 than the surface 61a of the isolation structure 5 that is farther from the substrate 1. That is, the distance d1 between the surface 61a of the optical element 61 and the substrate 1 is less than the distance d2 between the surface 5a of the isolation structure 5 and the substrate 1.

[0170] In other words, at least a portion of an optical element 61 is located within a pixel opening K. By placing at least a portion of an optical element 61 of the optical structure 6 within a pixel opening K defined by the isolation structure 5, compared to having the optical structure 6 separately disposed on the side of the isolation structure 5 away from the substrate 1, the increase in thickness of the display panel 10 due to the addition of the optical structure 6 can be reduced, which is beneficial for reducing the thickness h1 of the display panel 10 and achieving a thinner and lighter display panel 10.

[0171] It should be noted that the "thickness h1 of display panel 10" mentioned above refers to the dimension h1 of display panel 10 along the third direction Z. The following description of "thickness h1 of display panel 10" will also follow this explanation and will not be repeated.

[0172] For example, referring to FIG8C, the surface 61b of the optical part 61 away from the substrate 1 is farther from the substrate 1 than the surface 5a of the isolation structure 5 away from the substrate 1. That is, the distance d5 between the surface 61b of the optical part 61 away from the substrate 1 and the substrate 1 is greater than the distance d2 between the surface 5a of the isolation structure 5 away from the substrate 1 and the substrate 1.

[0173] In other words, a portion of the optical section 61 is located within a pixel opening K. Compared to the optical structure 6 being separately disposed on the side of the isolation structure 5 away from the substrate 1, the increase in the thickness of the display panel 10 due to the addition of the optical structure 6 can be reduced, which is beneficial to reducing the thickness h1 of the display panel 10 and achieving a thinner and lighter display panel 10.

[0174] Alternatively, referring to Figure 8B, the surface 61b of the optical part 61 away from the substrate 1 is flush with the surface 5a of the isolation structure 5 away from the substrate 1. That is, the distance d4 between the surface 61b of the optical part 61 away from the substrate 1 and the substrate 1 is equal to the distance d2 between the surface 5a of the isolation structure 5 away from the substrate 1 and the substrate 1.

[0175] In other words, an entire optical element 61 is located within a single pixel opening K. Compared to the optical structure 6 being separately positioned on the side of the isolation structure 5 away from the substrate 1, the increase in thickness of the display panel 10 due to the addition of the optical structure 6 can be reduced to 0 or close to 0, which is beneficial for further reducing the thickness h1 of the display panel 10 and further achieving a thinner and lighter display panel 10.

[0176] Alternatively, referring to Figure 8A, the surface 61b of the optical section 61 that is away from the substrate 1 is closer to the substrate 1 than the surface 5a of the isolation structure 5 that is away from the substrate 1. That is, the distance d3 between the surface 61b of the optical section 61 that is away from the substrate 1 and the substrate 1 is less than the distance d2 between the surface 5a of the isolation structure 5 that is away from the substrate 1 and the substrate 1.

[0177] In other words, an entire optical element 61 is located within a single pixel opening K. Compared to the optical structure 6 being separately positioned on the side of the isolation structure 5 away from the substrate 1, the increase in thickness of the display panel 10 due to the addition of the optical structure 6 can be reduced to 0, which is beneficial for further reducing the thickness h1 of the display panel 10 and further achieving a thinner and lighter display panel 10.

[0178] For example, referring to Figures 8A, 8B, and 8C, the surface 61b of the optical section 61 away from the substrate 1 is farther from the substrate 1 than the surface 52a of the second sublayer 52 of the isolation structure 5. That is, the distance d3 between the surface 61b of the optical section 61 away from the substrate 1 and the substrate 1 in the embodiment shown in Figure 8A, the distance d4 between the surface 61b of the optical section 61 away from the substrate 1 and the substrate 1 in the embodiment shown in Figure 8B, and the distance d5 between the surface 61b of the optical section 61 away from the substrate 1 and the substrate 1 in the embodiment shown in Figure 8C are all greater than the distance d6 between the surface 52a of the second sublayer 52 of the isolation structure 5 and the substrate 1.

[0179] In other words, the optical part 61 of the optical structure 6 is located relatively far from the substrate 1 within the pixel opening K defined by the isolation structure 5, which allows for sufficient space between the optical part 61 and the substrate 1 for setting the light-emitting device F. This ensures the thickness of each film layer structure (e.g., the first electrode 41, the light-emitting part 43, and the second electrode 42) within the light-emitting device F, thereby improving the optical performance of the light-emitting device F.

[0180] For example, the material of the optical part 61 of the optical structure 6 may include photoresist.

[0181] For example, please continue to refer to Figures 8A, 8B and 8C, where the thickness h2 of the optical part 61 is greater than or equal to 1.5 μm.

[0182] For example, the thickness h2 of the optical part 61 can be 1.5μm, 1.8μm, 2.1μm, 2.3μm, 2.5μm, 2.6μm, 2.8μm, 3μm, 3.3μm or 3.6μm, etc.

[0183] In some embodiments, referring to Figures 8A, 8B, and 8C, the optical structure 6 may be located between the first inorganic encapsulation layer 81 and the organic encapsulation layer 83. Specifically, the plurality of optical elements 61 in the optical structure 6 may be located between the first inorganic encapsulation layer 81 and the organic encapsulation layer 83. That is, the first inorganic encapsulation layer 81 in the encapsulation structure 8 is located between the plurality of optical elements 61 in the optical structure 6 and the light-emitting device F, and the organic encapsulation layer 83 and the second inorganic encapsulation layer 82 in the encapsulation structure 8 are located on the side of the plurality of optical elements 61 in the optical structure 6 away from the substrate.

[0184] By positioning the first inorganic encapsulation layer 81 in the encapsulation structure 8 between the plurality of optical parts 61 and the light-emitting device F in the optical structure 6, and the organic encapsulation layer 83 and the second inorganic encapsulation layer 82 in the encapsulation structure 8 on the side of the plurality of optical parts 61 in the optical structure 6 away from the substrate, compared to the organic encapsulation layer 83 and the second inorganic encapsulation layer 82 in the encapsulation structure 8 also being located between the plurality of optical parts 61 and the light-emitting device F in the optical structure 6, the distance between the optical parts 61 and the light-emitting device F can be reduced. This is beneficial for the plurality of optical parts 61 in the optical structure 6 to function better and improves the optical performance of the display panel 10.

[0185] The following details the implementation of the optical structure 6 in forming the Enhanced Efficiency Structure (EES) and the principle of improving the light emission efficiency of the display panel 10.

[0186] In some embodiments, referring to Figure 5, the light emitted by the light-emitting device F is ultimately emitted into the air from the cover plate 20. The refractive index n1 of the cover plate 20 is greater than the refractive index n0 of the air, meaning the refractive index of the cover plate 20 is higher and the refractive index of the air is lower. Since the display panel 10 does not have an optical structure 6 for forming an enhanced efficiency structure (EES), when the light emitted by the light-emitting device F enters the low-refractive-index air from the high-refractive-index cover plate 20, if the incident angle of the light at the interface between the cover plate 20 and the air reaches or exceeds the critical angle of total internal reflection arcsin(n0 / n1), total internal reflection will occur (e.g., the light path L1 in Figure 5), resulting in a lower overall light extraction efficiency of the display panel 10.

[0187] It should be noted that the aforementioned "total internal reflection" is an optical phenomenon, which refers to the phenomenon that when light enters a medium with a lower refractive index from a medium with a higher refractive index (for example, light enters air with a lower refractive index from a cover plate 20 with a higher refractive index), if the angle of incidence reaches or exceeds the critical angle of total internal reflection, the refracted light will disappear, and the incident light will be reflected and will not enter the medium with a lower refractive index (such as air).

[0188] Based on this, in some embodiments, please continue to refer to Figures 8A, 8B, and 8C, when the display panel 10 includes an optical structure 6, and the optical structure 6 is used to form an enhanced efficiency structure (EES), the refractive index n2 of the optical portion 61 of the optical structure 6 and the refractive index n3 of the third sublayer 53 of the isolation structure 5 are different. That is, one of the optical portion 61 of the optical structure 6 and the third sublayer 53 of the isolation structure 5 has a relatively high refractive index, and the other has a relatively low refractive index.

[0189] By making one of the optical part 61 of the optical structure 6 and the third sub-layer 53 of the isolation structure 5 have a relatively high refractive index and the other has a relatively low refractive index, the optical part 61 of the optical structure 6 and the third sub-layer 53 of the isolation structure 5 can form an alternating structure of high and low refractive indices. This can refract or scatter the light emitted by the light-emitting device F, change the direction of light propagation, reduce the light that is totally internally reflected at the interface between the cover plate 20 and the air, that is, extract the light that was originally totally internally reflected in the display panel 10, so that more light can be emitted into the air through the cover plate 20, increase the light transmittance of the display panel 10, and thus effectively improve the light emission efficiency of the display panel 10.

[0190] For example, the refractive index n2 of the optical part 61 of the optical structure 6 can be greater than the refractive index n3 of the third sublayer 53 of the isolation structure 5. For instance, the refractive index of the optical part 61 of the optical structure 6 can be greater than 1.65, and the refractive index of the third sublayer 53 of the isolation structure 5 can be less than 1.4.

[0191] Alternatively, the refractive index n3 of the third sublayer 53 of the isolation structure 5 can be greater than the refractive index n2 of the optical part 61 of the optical structure 6. For example, the refractive index of the third sublayer 53 of the isolation structure 5 can be greater than 1.65, and the refractive index of the optical part 61 of the optical structure 6 can be less than 1.4.

[0192] In some embodiments, the material of the optical portion 61 of the optical structure 6 may include first particles. The refractive index of the first particles is 1 to 2. The overall refractive index of the optical portion 61 of the optical structure 6 can be adjusted by providing first particles with different refractive indices in the optical portion 61 of the optical structure 6, so that the refractive index n2 of the optical portion 61 of the optical structure 6 is greater than or less than the refractive index n3 of the third sub-layer 53 of the isolation structure 5, and the difference between the refractive index n2 of the optical portion 61 of the optical structure 6 and the refractive index n3 of the third sub-layer 53 of the isolation structure 5 can be adjusted according to actual needs, which is beneficial to improving the optical performance of the display panel 10.

[0193] For example, the first particle may include a hollow particle, such as a zirconium oxide hollow particle or a silicon oxide hollow particle.

[0194] For example, the refractive index of the first particle can be 1, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9 or 2, etc.

[0195] In some embodiments, please continue to refer to Figures 8A, 8B and 8C, a first inorganic encapsulation layer 81 in the encapsulation structure 8 is disposed between the optical part 61 of the optical structure 6 and the third sub-layer 53 of the isolation structure 5. The refractive index n2 of the optical part 61 of the optical structure 6, the refractive index n3 of the third sub-layer 53 of the isolation structure 5, and the refractive index n4 of the first inorganic encapsulation layer 81 in the encapsulation structure 8 are all different.

[0196] In this structure, the refractive index n2 of the optical part 61 of the optical structure 6 and the refractive index n3 of the third sub-layer 53 of the isolation structure 5 can both be greater than the refractive index n4 of the first inorganic encapsulation layer 81 in the encapsulation structure 8. That is, the refractive indices of the optical part 61 of the optical structure 6 and the third sub-layer 53 of the isolation structure 5 are relatively high, while the refractive index of the first inorganic encapsulation layer 81 in the encapsulation structure 8 is relatively low. The optical part 61 of the optical structure 6, the first inorganic encapsulation layer 81 of the encapsulation structure 8, and the third sub-layer 53 of the isolation structure 5 can form a high-low high refractive index structure, which can further refract or scatter the light emitted by the light-emitting device F, change the direction of light propagation, further reduce the light that undergoes total internal reflection at the interface between the cover plate 20 and the air, that is, extract the light that was originally totally reflected in the display panel 10, so that more light can be emitted into the air through the cover plate 20, further increasing the light transmittance of the display panel 10, thereby effectively improving the light emission efficiency of the display panel 10.

[0197] Alternatively, the refractive index n2 of the optical part 61 of the optical structure 6 and the refractive index n3 of the third sub-layer 53 of the isolation structure 5 can both be less than the refractive index n4 of the first inorganic encapsulation layer 81 in the encapsulation structure 8. That is, the refractive indices of the optical part 61 of the optical structure 6 and the third sub-layer 53 of the isolation structure 5 are relatively low, while the refractive index of the first inorganic encapsulation layer 81 in the encapsulation structure 8 is relatively high. The optical part 61 of the optical structure 6, the first inorganic encapsulation layer 81 in the encapsulation structure 8, and the third sub-layer 53 of the isolation structure 5 can form a low-high-low refractive index structure, which can further refract or scatter the light emitted by the light-emitting device F, change the direction of light propagation, further reduce the light that undergoes total internal reflection at the interface between the cover plate 20 and the air, that is, extract the light that was originally totally reflected in the display panel 10, so that more light can be emitted into the air through the cover plate 20, further increasing the light transmittance of the display panel 10, thereby effectively improving the light emission efficiency of the display panel 10.

[0198] The following section provides a detailed explanation of how optical structure 6 is used to form the color filter on encapsulation (COE) structure and the principle behind improving light transmittance.

[0199] The color filter on encapsulation (COE) structure, also known as the polarizer-less (POL-Less) structure, refers to a structure in which a color filter (CF) replaces the polarizer in the display panel 10. It has advantages such as improving the light transmittance of the display panel 10, reducing the power consumption of the display panel 10, and achieving a thinner and lighter display panel 10.

[0200] In some embodiments, as shown in FIG9, FIG9 is a structural diagram of a display panel 10 according to some embodiments. When the optical structure 6 is used to form a color filter on encapsulation (COE) structure, the optical part 61 in the optical structure 6 is a color filter 611. In the light-emitting device F and the color filter 611 located in the same pixel opening K, the color of the light allowed to pass through the color filter 611 is the same as the color of the light emitted by the light-emitting device F. That is, the color of the light allowed to pass through the color filter 611 located in the same pixel opening K as the first color light-emitting device F1 is a first color (e.g., red), the color of the light allowed to pass through the color filter 611 located in the same pixel opening K as the second color light-emitting device F2 is a second color (e.g., green), and the color filter 611 located in the same pixel opening K as the third color light-emitting device F3 is a third color (e.g., blue).

[0201] The color filter 611 is set to correspond with the light-emitting device F and is located on the light-emitting side of the light-emitting device F, which can reduce the reflectivity of ambient light in the area where the light-emitting device F is located (i.e., the light-emitting area).

[0202] Please refer to Figure 9. Based on the fact that the optical part 61 in the optical structure 6 is a color filter 611, at least the third sublayer 53 in the isolation structure 5 includes a light-shielding material. When ambient light shines on the third sublayer 53, the third sublayer 53 can absorb the ambient light, thereby preventing ambient light reflection and reducing the reflectivity of ambient light in the area where the isolation structure 5 is located (i.e., the non-light-emitting area).

[0203] In summary, by setting a color filter 611 on the light-emitting side of the light-emitting device F, and by including at least a third sub-layer 53 of the isolation structure 5 as a light-shielding material, the overall reflectivity of ambient light can be reduced, thereby improving the contrast of the display panel 10.

[0204] In this way, even without the polarizer, the display panel 10 can still achieve a good anti-reflective effect. At the same time, by removing the polarizer, the light transmittance of the display panel 10 can be increased, thereby effectively reducing the power consumption of the display panel 10 and making the display panel 10 thinner and lighter.

[0205] For example, the third sub-layer 53 in the isolation structure 5 may include a light-shielding material; or, both the second sub-layer 52 and the third sub-layer 53 in the isolation structure 5 may include a light-shielding material.

[0206] It should be noted that in the embodiment shown in FIG9 where the optical structure 6 is used to form a color filter on encapsulation (COE), the example shown is that the surface 61b of the optical part 61 (i.e., the color filter 611) away from the substrate 1 is closer to the substrate 1 than the surface 5a of the isolation structure 5. However, in the embodiment shown in FIG9 where the optical structure 6 is used to form a color filter on encapsulation (COE), the arrangement of the optical part 61 (i.e., the color filter 611) and the isolation structure 5 is not limited to this. For example, the surface 61b of the optical part 61 (i.e., the color filter 611) away from the substrate 1 may be farther from the substrate 1 than the surface 5a of the isolation structure 5; or, for example, the surface 61b of the optical part 61 (i.e., the color filter 611) away from the substrate 1 and the surface 5a of the isolation structure 5 away from the substrate 1 may be flush. Further details will not be provided here.

[0207] For example, the material of the color filter 611 may include one or more of the following: oxazine compounds, anthocyanin compounds, and tetrazole squaric acid compounds.

[0208] In some embodiments, as shown in FIG10, FIG10 is a schematic diagram of the transmittance curves of the optical part 61 (i.e., the color filter 611) in the optical structure 6 of the display panel 10 according to some embodiments for light of different wavelengths. The transmittance of the red light band (R), green light band (G) and blue light band (B) is higher than 70%, but the transmittance of the first transition band N between the red light band (R) and the green light band (G) and the second transition band M between the green light band (G) and the blue light band (B) is not 0, which can easily lead to a decrease in the color purity of the display screen 10.

[0209] Based on this, in some embodiments, as shown in FIG11, FIG11 is a structural diagram of a display panel 10 according to some embodiments. The display panel 10 further includes an anti-reflection layer 3. The anti-reflection layer 3 is located between the first inorganic encapsulation layer 81 of the encapsulation structure 8 and the second electrode 42 of the light-emitting device F.

[0210] An antireflection layer 3 is provided between the first inorganic encapsulation layer 81 of the encapsulation structure 8 and the second electrode 42 of the light-emitting device F. The antireflection layer 3 and its adjacent film layers (e.g., the first inorganic encapsulation layer 81 in the encapsulation structure 8) form a stacked structure, and the refractive indices of the reflective layer 3 and the adjacent film layers (e.g., the first inorganic encapsulation layer 81 in the encapsulation structure 8) are different. A microcavity structure is formed between the first electrode 41 (i.e. the reflective electrode) and the stacked structure. The light emitted by the light-emitting part 43 of the light-emitting device F passes sequentially through the second electrode 42 and the stacked structure before exiting the display panel 10. The microcavity structure can enhance the light of specific wavelengths (e.g., red light band (R), green light band (G), and blue light band (B)), thereby increasing the light extraction amount of specific wavelengths (e.g., red light band (R), green light band (G), and blue light band (B)) and weaken the light of other wavelengths (e.g., the first transition band N between red light band (R) and green light band (G), and the second transition band M between green light band (G) and blue light band (B)), thereby reducing the light extraction amount of other wavelengths (e.g., the first transition band N between red light band (R) and green light band (G), and the second transition band M between green light band (G) and blue light band (B)), thereby improving the display effect of the display panel 10.

[0211] For example, the material of the antireflective layer 3 may include a metal or a metal composite. For instance, Thick reflective metal (MOM) or Thick reflective metal (MIM). Here, "M" can be Sm / Alq3 / Al, Sm / Alq3 / Sm / Alq3 / Al, or Al / CuPc / Al / CuPc / Al, etc. "O" can be iF / Cr / LiF / Cr / LiF / Ag, ZnO, Alq3+C60, Alq3, CuPc, or LiF, etc. "I" can be iF / Cr / LiF / Cr / LiF / Ag, ZnO, Alq3+C60, Alq3, CuPc, or LiF, etc.

[0212] For example, please continue to refer to Figure 11, the thickness h7 of the antireflection layer 3 can be 1nm to 50nm.

[0213] For example, the thickness h7 of the antireflection layer 3 can be 1nm, 5nm, 8nm, 10nm, 12nm, 15nm, 18nm, 20nm, 23nm, 25nm, 28nm, 30nm, 33nm, 35nm, 38nm, 40nm, 43nm, 45nm, 48nm or 50nm, etc.

[0214] It should be noted that the "thickness h7 of the antireflection layer 3" mentioned above refers to the dimension h7 of the antireflection layer 3 along the third direction Z.

[0215] The organic encapsulation layer 83 in the above-mentioned encapsulation structure 8 will be described in detail below.

[0216] In some embodiments, the organic encapsulation layer 83 in the encapsulation structure 8 can be formed by an inkjet-printed (IJP) process.

[0217] The specific steps can be as follows: dissolve the material used to form the organic encapsulation layer 83 in the encapsulation structure 8 in a solvent to form printing ink; use an inkjet printer to drop the printing ink onto the side of the first inorganic encapsulation layer 81 in the encapsulation structure 8 away from the substrate 1; the liquid printing ink flows freely and levels on the side of the first inorganic encapsulation layer 81 away from the substrate 1; and then use ultraviolet light to excite and cure to form a uniform film layer (i.e., the organic encapsulation layer 83 in the encapsulation structure 8). However, when the printing ink is dropped onto the side of the first inorganic encapsulation layer 81 in the encapsulation structure 8 away from the substrate 1, the flow speed of the droplet at the edge of the display panel 10 is inconsistent with the flow speed of the droplet in the central region of the display panel 10. At the same time, due to the surface tension of the droplet, the surface of the formed organic encapsulation layer 83 away from the substrate 1 is uneven. For example, the edge of the surface of the organic encapsulation layer 83 away from the substrate 1 is prone to protrusion (i.e., edge-top defects).

[0218] Specifically, as shown in Figure 12, Figure 12 is a schematic diagram of the thickness variation trend of the organic encapsulation layer 83 in the encapsulation structure 8 along the direction from the edge of the display panel 10 to the center of the display panel 10. In Figure 12, the horizontal axis d7 represents the distance between the organic encapsulation layer 83 and the edge of the display panel 10, and the vertical axis d8 represents the distance between the surface of the organic encapsulation layer 83 away from the substrate 1 and the substrate 1. There is a protrusion (i.e., Edge Top) at the edge of the organic encapsulation layer 83 away from the substrate 1, which is higher than other areas. The aforementioned Edge Top defect makes the surface of the organic encapsulation layer 83 away from the substrate 1 uneven, which can easily lead to differences in light extraction efficiency at different positions of the display panel 10, affecting the optical uniformity of the display panel 10.

[0219] Based on this, in some embodiments, as shown in FIG13, and in conjunction with FIG8A, FIG8B, FIG8C and FIG9, FIG13 is a partial planar structural diagram of the isolation structure 5 according to some embodiments. The isolation structure 5 has a plurality of grooves 5aa formed on the surface 5a away from the substrate 1.

[0220] It is understandable that the surface 5a of the isolation structure 5 away from the substrate 1 and the surface of the third sublayer 53 of the isolation structure 5 away from the substrate 1 are coplanar.

[0221] By creating multiple grooves 5aa on the surface 5a of the isolation structure 5 away from the substrate 1, the printing ink used to form the organic encapsulation layer 83 in the encapsulation structure 8 can be guided, which helps to promote the leveling of the printing ink, improve the flatness of the surface 83a of the organic encapsulation layer 83 away from the substrate 1, reduce the difference in light emission efficiency at different positions of the display panel 10, and improve the optical uniformity of the display panel 10.

[0222] It should be noted that the embodiment shown in Figure 13, and the embodiments below, are only illustrated with the example of a rectangular structure for the pixel opening K. However, the implementation of this disclosure includes, but is not limited to, this, and the shape of the pixel opening K can also be any other shape.

[0223] In some embodiments, please continue to refer to Figure 5, based on a light-emitting device F located within a pixel opening K.

[0224] Alternatively, referring to Figure 8A, the display panel 10 includes an optical structure 6. One of the plurality of optical elements 61 within the optical structure 6 is located within a pixel opening K, and the optical element 61 is located away from the surface 61b of the substrate 1, while being closer to the substrate 1 than the surface 5a of the isolation structure 5, which is also away from the substrate 1. That is, the distance d3 between the surface 61b of the optical element 61 and the substrate 1 is less than the distance d2 between the surface 5a of the isolation structure 5 and the substrate 1.

[0225] In the encapsulation structure 8, the thickness h3 of the organic encapsulation layer 83 corresponding to the pixel opening K is greater than the thickness h4 of the corresponding isolation structure 5. That is, there is a difference between the thickness h3 of the organic encapsulation layer 83 corresponding to the pixel opening K and the thickness h4 of the corresponding isolation structure 5. This difference can easily lead to a difference between the light extraction efficiency of the area corresponding to the pixel opening K of the display panel 10 and the light extraction efficiency of the area corresponding to the isolation structure 5, thus affecting the optical uniformity of the display panel 10.

[0226] It should be noted that the "thickness h3 of the region corresponding to the pixel opening K of the organic encapsulation layer 83 in the encapsulation structure 8" refers to the straight-line distance between the region corresponding to the pixel opening K of the surface 83a of the organic encapsulation layer 83 away from the substrate 1 and the surface 83b of the organic encapsulation layer 83 close to the substrate 1 in the encapsulation structure 8.

[0227] The aforementioned "thickness h4 of the region of the organic encapsulation layer 83 in the encapsulation structure 8 corresponding to the isolation structure 5" refers to the straight-line distance between the region of the organic encapsulation layer 83 in the encapsulation structure 8 away from the substrate 1 and the region of the organic encapsulation layer 83 in the encapsulation structure 8 corresponding to the isolation structure 5, and the region of the organic encapsulation layer 83 in the encapsulation structure 8 close to the substrate 1.

[0228] The following descriptions of "the thickness h3 of the region corresponding to the pixel opening K in the organic encapsulation layer 83 in the encapsulation structure 8" and "the thickness h4 of the region corresponding to the isolation structure 5 in the organic encapsulation layer 83 in the encapsulation structure 8" will also follow this explanation and will not be repeated.

[0229] Based on this, in some embodiments, please continue to refer to FIG13 and in conjunction with FIG14, FIG14 being a partial planar structural diagram of the isolation structure 5 according to some embodiments. The groove 5aa is connected to at least one pixel opening K.

[0230] By creating multiple grooves 5aa on the surface 5a of the isolation structure 5 away from the substrate 1, and having the grooves 5aa connected to at least one pixel opening K, the thickness h4 of the region of the organic encapsulation layer 83 in the encapsulation structure 8 corresponding to the isolation structure 5 can be increased, thereby reducing the difference between the thickness h3 of the region of the organic encapsulation layer 83 in the encapsulation structure 8 corresponding to the pixel opening K and the thickness h4 of the region corresponding to the isolation structure 5. This balances the light emission efficiency of the region corresponding to the pixel opening K of the display panel 10 and the light emission efficiency of the region corresponding to the isolation structure 5, further improving the optical uniformity of the display panel 10.

[0231] On the other hand, the groove 5aa is connected to at least one pixel opening K, which allows the printing ink used to form the organic encapsulation layer 83 in the encapsulation structure 8 to flow to other areas through the groove 5aa. This prevents the printing ink used to form the organic encapsulation layer 83 in the encapsulation structure 8 from accumulating in the pixel opening K, which helps to promote the leveling of the printing ink used to form the organic encapsulation layer 83 in the encapsulation structure 8, further improves the flatness of the surface 83a of the organic encapsulation layer 83 in the encapsulation structure 8 away from the substrate 1, and further enhances the optical uniformity of the display panel 10.

[0232] For example, please continue to refer to Figure 13, the groove 5aa can be connected to a pixel opening K.

[0233] Alternatively, please refer to Figure 14. At least one groove 5aa is provided between two adjacent pixel openings K in the plurality of pixel openings K defined by the isolation structure 5, and the groove 5aa is connected to both adjacent pixel openings K.

[0234] It should be noted that in the embodiment shown in Figure 14, the light-emitting part 43 in the light-emitting device F located in the two adjacent pixel openings K connected by the groove 5aa is not connected.

[0235] In some embodiments, please continue to refer to FIG13, a pixel opening K is connected to a plurality of grooves 5aa, the plurality of grooves 5aa extend in a direction away from the pixel opening K, and the plurality of grooves 5aa are arranged at intervals around the pixel opening K.

[0236] By connecting a pixel opening K to multiple grooves 5aa, and having each groove 5aa extend in a direction away from the pixel opening K, the printing ink used to form the organic encapsulation layer 83 in the encapsulation structure 8 can be further allowed to flow to other areas through the grooves 5aa. This further prevents the printing ink used to form the organic encapsulation layer 83 in the encapsulation structure 8 from accumulating in the pixel opening K, which helps to promote the leveling of the printing ink used to form the organic encapsulation layer 83 in the encapsulation structure 8, and further improves the flatness of the surface 83a of the organic encapsulation layer 83 away from the substrate 1, thereby improving the optical uniformity of the display panel 10.

[0237] For example, please continue to refer to Figure 13. Along the circumferential direction of the plurality of grooves 5aa, the spacing d9 between two adjacent grooves 5aa is equal.

[0238] In some embodiments, as shown in Figures 15A and 15B, Figure 15A is a first cross-sectional view of the isolation structure 5 in Figure 13 along section line CC, and Figure 15B is a second cross-sectional view of the isolation structure 5 in Figure 13 along section line CC. The depth h5 of the groove 5aa is less than or equal to the thickness h6 of the third sub-layer 53 of the isolation structure 5.

[0239] It should be noted that the "depth h5 of the groove 5aa" mentioned above refers to the dimension h5 of the groove 5aa along the third direction Z. Similarly, the "thickness h6 of the third sub-layer 53 of the isolation structure 5" refers to the dimension h6 of the third sub-layer 53 of the isolation structure 5 along the third direction Z. The following descriptions of the "depth h5 of the groove 5aa" and the "thickness h6 of the third sub-layer 53 of the isolation structure 5" will follow this explanation and will not be repeated.

[0240] For example, referring to Figure 15A, the depth h5 of the groove 5aa can be less than the thickness h6 of the third sub-layer 53 of the isolation structure 5. That is, the groove 5aa does not penetrate the third sub-layer 53 of the isolation structure 5.

[0241] Alternatively, referring to Figure 15B, the depth h5 of the groove 5aa can be equal to the thickness h6 of the third sub-layer 53 of the isolation structure 5. That is, the groove 5aa penetrates the third sub-layer 53 of the isolation structure 5 and contacts the second sub-layer 52 of the isolation structure 5.

[0242] In some embodiments, the materials of the third sublayer 53 of the isolation structure 5 and the optical structure 6 both include hydrophobic or oleophobic materials. Specifically, the materials of the third sublayer 53 of the isolation structure 5 and the optical part 61 of the optical structure 6 both include hydrophobic or oleophobic materials.

[0243] For example, the materials of the third sublayer 53 of the isolation structure 5 and the optical part 61 of the optical structure 6 may both include hydrophobic materials. Alternatively, the materials of the third sublayer 53 of the isolation structure 5 and the optical part 61 of the optical structure 6 may both include oleophobic materials.

[0244] Inkjet printing (IJP) processes typically use inks formed by dissolving organic materials in ester or alcohol solvents, resulting in both water-based and oil-based inks. Since the ink is water-based, when both the material of the third sublayer 53 of the isolation structure 5 and the material of the optical part 61 of the optical structure 6 include oleophobic materials, the ink can have a smaller contact angle on the side of the third sublayer 53 of the isolation structure 5 and the optical part 61 of the optical structure 6 away from the substrate 1. This facilitates leveling and improves the flatness and thickness uniformity of the formed organic encapsulation layer 83.

[0245] Since the printing ink is oil-based, when both the material of the third sublayer 53 of the isolation structure 5 and the material of the optical part 61 of the optical structure 6 include hydrophobic materials, the printing ink can have a smaller contact angle on the side of the material of the third sublayer 53 of the isolation structure 5 and the optical part 61 of the optical structure 6 away from the substrate 1, making it easy to level out. This is beneficial to improving the flatness of the formed organic encapsulation layer 83 and the uniformity of the film thickness.

[0246] The following provides a detailed description of the manufacturing method of the above-mentioned display panel 10.

[0247] In some embodiments, as shown in FIG16, FIG16 is a flowchart of a method for manufacturing a display panel 10 according to some embodiments. The method for manufacturing the display panel 10 includes steps S1 to S4.

[0248] S1: As shown in Figure 17, which is a structural diagram corresponding to step S1 in the fabrication method of the display panel 10 according to the embodiment shown in Figure 16, an isolation structure 5 is formed on one side of the substrate 1. The isolation structure 5 defines a plurality of pixel openings K.

[0249] S2: As shown in Figure 18, which is a structural diagram corresponding to step S2 in the fabrication method of the display panel 10 according to the embodiment shown in Figure 16, a light-emitting device film Fa of the target color and a first inorganic thin film 811 are sequentially formed on a substrate 1 having a plurality of pixel openings K.

[0250] S3: As shown in Figure 19, which is a structural diagram corresponding to step S3 in the fabrication method of the display panel 10 according to the embodiment shown in Figure 16, a photoresist layer PR is formed on the side of the first inorganic thin film 811 away from the substrate 1, and the photoresist layer PR covers the light-emitting device Faa region of the target color.

[0251] S4: As shown in Figure 20, which is a structural diagram corresponding to step S4 in the fabrication method of the display panel 10 according to the embodiment shown in Figure 16. Based on the photoresist layer PR, the portions of the target color light-emitting device film layer Fa and the first inorganic thin film 811 covering areas other than the target color light-emitting device Faa region are removed. The target color light-emitting device film layer Fa and the first inorganic thin film 811 remaining in the target color light-emitting device Faa region respectively form the target color light-emitting device Faa and its corresponding first inorganic encapsulation layer 81. The retained photoresist layer PR forms the optical structure 6. Specifically, the retained photoresist layer PR forms the optical part 61 of the optical structure 6.

[0252] For example, the photoresist layer PR may include positive photoresist or negative photoresist.

[0253] It should be noted that the part of the positive photoresist that is exposed to light (i.e., the exposed part) will dissolve in the photoresist developer, while the part that is not exposed to light (i.e., the part other than the exposed part) will not dissolve in the photoresist developer or will dissolve very slowly.

[0254] In negative photoresist, the parts exposed to light (i.e., the exposed parts) do not dissolve in the photoresist developer or dissolve very slowly, while the parts not exposed to light (i.e., the parts other than the exposed parts) dissolve in the photoresist developer.

[0255] Please refer to Figure 20. A photoresist layer PR can be exposed using a mask, followed by a development reaction to remove the portion of the target color light-emitting device film Fa and the first inorganic thin film 811 that covers areas other than the target color light-emitting device Faa region. The target color light-emitting device film Fa and the first inorganic thin film 811 retained in the target color light-emitting device Faa region respectively form the target color light-emitting device Faa and its corresponding first inorganic encapsulation layer 81. The retained photoresist layer PR forms the optical structure 6.

[0256] It is understandable that the photoresist layer PR includes positive photoresist, and the part of the photoresist layer PR other than the Faa region of the target color light-emitting device is the exposed part, and the Faa region of the target color light-emitting device is the part other than the exposed part.

[0257] The photoresist layer PR includes negative photoresist. The Faa region of the target color light-emitting device is the exposed part, and the part of the photoresist layer PR other than the Faa region of the target color light-emitting device is the part outside the exposed part.

[0258] The optical part 61 based on the optical structure 6 includes photoresist. Through the above steps, the optical structure 6 (i.e., the optical part 61 in the optical structure 6) can be formed at the same time as the light-emitting device Faa of the target color and its corresponding first inorganic encapsulation layer 81 are formed. This eliminates the need for additional masks or additional operation steps, which helps to reduce the manufacturing cost of the display panel 10 and simplify the manufacturing steps of the display panel 10.

[0259] For example, the aforementioned "target color light-emitting device Faa" can be a first color light-emitting device F1, a second color light-emitting device F2, or a third color light-emitting device F3.

[0260] For example, a first color light-emitting device F1, a first inorganic encapsulation layer 81 and an optical part 61 corresponding to the first color light-emitting device F1 can be formed first, then a second color light-emitting device F2, a first inorganic encapsulation layer 81 and an optical part 61 corresponding to the second color light-emitting device F2 can be formed, and finally a third color light-emitting device F3, a first inorganic encapsulation layer 81 and an optical part 61 corresponding to the third color light-emitting device F3 can be formed.

[0261] Alternatively, a second color light-emitting device F2, a first inorganic encapsulation layer 81 and an optical part 61 corresponding to the second color light-emitting device F2 can be formed first, then a first color light-emitting device F1, a first inorganic encapsulation layer 81 and an optical part 61 corresponding to the first color light-emitting device F1 can be formed, and finally a third color light-emitting device F3, a first inorganic encapsulation layer 81 and an optical part 61 corresponding to the third color light-emitting device F3 can be formed.

[0262] Alternatively, a third color light-emitting device F3, a first inorganic encapsulation layer 81 and an optical part 61 corresponding to the third color light-emitting device F3 can be formed first, then a first color light-emitting device F1, a first inorganic encapsulation layer 81 and an optical part 61 corresponding to the first color light-emitting device F1 can be formed, and finally a second color light-emitting device F2, a first inorganic encapsulation layer 81 and an optical part 61 corresponding to the second color light-emitting device F2 can be formed.

[0263] The following describes some embodiments of this disclosure in an illustrative manner, first forming a first color light-emitting device F1, and a first inorganic encapsulation layer 81 and an optical part 61 corresponding to the first color light-emitting device F1; then forming a second color light-emitting device F2, and a first inorganic encapsulation layer 81 and an optical part 61 corresponding to the second color light-emitting device F2; and finally forming a third color light-emitting device F3, and a first inorganic encapsulation layer 81 and an optical part 61 corresponding to the third color light-emitting device F3.

[0264] Please continue referring to Figure 16. The light-emitting device Faa based on the target color is the first color light-emitting device F1. The steps of forming the first color light-emitting device F1, the first inorganic encapsulation layer 81 corresponding to the first color light-emitting device F1, and the optical part 61 include:

[0265] S2: As shown in Figure 21, which is a structural diagram corresponding to step S2 in the fabrication method of the display panel 10 according to the embodiment shown in Figure 16, a first color light-emitting device film layer F11 and a first inorganic thin film 811 are sequentially formed on a substrate 1 having a plurality of pixel openings K.

[0266] S3: As shown in Figure 22, which is a structural diagram corresponding to step S3 in the fabrication method of the display panel 10 according to the embodiment shown in Figure 16, a photoresist layer PR is formed on the side of the first inorganic thin film 811 away from the substrate 1, and the photoresist layer PR covers the region of the first color light-emitting device F1.

[0267] S4: As shown in Figure 23, which is a structural diagram corresponding to step S4 in the fabrication method of the display panel 10 according to the embodiment shown in Figure 16. Based on the photoresist layer PR, the portions of the first color light-emitting device film F11 and the first inorganic thin film 811 covering areas other than the first color light-emitting device F1 region are removed. The first color light-emitting device film F11 and the first inorganic thin film 811 remaining in the first color light-emitting device F1 region respectively form the first color light-emitting device F1 and its corresponding first inorganic encapsulation layer 81. The remaining photoresist layer PR forms the optical structure 6. Specifically, the remaining photoresist layer PR forms the optical part 61 corresponding to the first color light-emitting device F1.

[0268] After forming the first color light-emitting device F1, and the first inorganic encapsulation layer 81 and optical part 61 corresponding to the first color light-emitting device F1, steps S2 to S4 in the method for manufacturing the display panel 10 shown in FIG16 are repeated. The light-emitting device Faa based on the target color is the second color light-emitting device F2. The steps for forming the second color light-emitting device F2, and the first inorganic encapsulation layer 81 and optical part 61 corresponding to the second color light-emitting device F2 include:

[0269] S2: As shown in Figure 24, which is a structural diagram corresponding to step S2 in the fabrication method of the display panel 10 according to the embodiment shown in Figure 16, a second color light-emitting device film layer F12 and a first inorganic thin film 811 are sequentially formed on a substrate 1 having a plurality of pixel openings K.

[0270] S3: As shown in Figure 25, which is a structural diagram corresponding to step S3 in the fabrication method of the display panel 10 according to the embodiment shown in Figure 16, a photoresist layer PR is formed on the side of the first inorganic thin film 811 away from the substrate 1, and the photoresist layer PR covers the region of the second color light-emitting device F2.

[0271] S4: As shown in Figure 26, which is a structural diagram corresponding to step S4 in the fabrication method of the display panel 10 according to the embodiment shown in Figure 16. Based on the photoresist layer PR, the portions of the second color light-emitting device film F12 and the first inorganic thin film 811 covering areas other than the second color light-emitting device F2 region are removed. The second color light-emitting device film F12 and the first inorganic thin film 811 remaining in the second color light-emitting device F2 region respectively form the second color light-emitting device F2 and its corresponding first inorganic encapsulation layer 81. The remaining photoresist layer PR forms the optical structure 6. Specifically, the remaining photoresist layer PR forms the optical part 61 corresponding to the second color light-emitting device F2.

[0272] After forming the second color light-emitting device F2, and the first inorganic encapsulation layer 81 and optical part 61 corresponding to the second color light-emitting device F2, steps S2 to S4 in the method for manufacturing the display panel 10 shown in FIG16 are repeated. The light-emitting device Faa based on the target color is the third color light-emitting device F3. The steps for forming the third color light-emitting device F3, and the first inorganic encapsulation layer 81 and optical part 61 corresponding to the third color light-emitting device F3 include:

[0273] S2: As shown in Figure 27, which is a structural diagram corresponding to step S2 in the fabrication method of the display panel 10 according to the embodiment shown in Figure 16, a third color light-emitting device film layer F13 and a first inorganic thin film 811 are sequentially formed on a substrate 1 having multiple pixel openings K.

[0274] S3: As shown in Figure 28, which is a structural diagram corresponding to step S3 in the fabrication method of the display panel 10 according to the embodiment shown in Figure 16, a photoresist layer PR is formed on the side of the first inorganic thin film 811 away from the substrate 1, and the photoresist layer PR covers the region of the third color light-emitting device F3.

[0275] S4: As shown in Figure 29, which is a structural diagram corresponding to step S4 in the fabrication method of the display panel 10 according to the embodiment shown in Figure 16. Based on the photoresist layer PR, the portions of the third color light-emitting device film F13 and the first inorganic thin film 811 covering areas other than the third color light-emitting device F3 region are removed. The third color light-emitting device film F13 and the first inorganic thin film 811 remaining in the third color light-emitting device F3 region respectively form the third color light-emitting device F3 and its corresponding first inorganic encapsulation layer 81. The remaining photoresist layer PR forms the optical structure 6. Specifically, the remaining photoresist layer PR forms the optical part 61 corresponding to the third color light-emitting device F3.

[0276] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A display panel, comprising: Substrate; An isolation structure is located on one side of the substrate; The isolation structure defines multiple pixel openings; A light-emitting device is disposed within the pixel opening; The encapsulation structure is located on the side of the light-emitting device away from the substrate; the encapsulation structure includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer sequentially stacked along a direction away from the substrate; An optical structure is located between the first inorganic encapsulation layer and the organic encapsulation layer; the optical structure includes a plurality of light-transmitting optical parts, one of which is located within one of the pixel openings.

2. The display panel according to claim 1, wherein, The surface of the optical element that is away from the substrate is closer to the substrate than the surface of the isolation structure that is away from the substrate; or... The surface of the optical element away from the substrate and the surface of the isolation structure away from the substrate are flush.

3. The display panel according to claim 1 or 2, wherein, The isolation structure includes a first sublayer, a second sublayer, and a third sublayer that are sequentially stacked along a direction away from the substrate; The surface of the optical section that is farther from the substrate is farther from the substrate than the surface of the second sublayer that is farther from the substrate.

4. The display panel according to claim 3, wherein, The refractive index of the material in the optical section is different from that of the material in the third sublayer.

5. The display panel according to claim 4, wherein, The refractive index of the optical component is greater than or equal to 1.65, and the refractive index of the third sublayer is less than or equal to 1.4; or, The refractive index of the optical part is less than or equal to 1.4, and the refractive index of the third sublayer is greater than or equal to 1.

65.

6. The display panel according to any one of claims 1 to 5, wherein, The material of the optical component includes photoresist.

7. The display panel according to any one of claims 1 to 6, wherein, The optical component includes a first particle with a refractive index of 1 to 2.

8. The display panel according to claim 1 or 2, wherein, The optical component is a color filter; In the light-emitting device and the color filter located in the same pixel opening, the color filter allows the color of the light transmitted to be the same as the color of the light emitted by the light-emitting device.

9. The display panel according to claim 8, wherein, The isolation structure includes a first sublayer, a second sublayer, and a third sublayer that are sequentially stacked along a direction away from the substrate; At least the third sublayer in the isolation structure includes a light-shielding material.

10. The display panel according to claim 9, wherein, Both the second sublayer and the third sublayer include light-shielding material.

11. The display panel according to any one of claims 1 to 10, wherein, The first and third sub-layers of the isolation structure comprise insulating materials, and the second sub-layer of the isolation structure comprises conductive materials. The light-emitting device includes a first electrode, a light-emitting part, and a second electrode stacked sequentially in a direction away from the substrate. The second electrodes of two adjacent light-emitting devices are connected by a second sub-layer in an isolation structure located between the two adjacent light-emitting devices.

12. The display panel according to any one of claims 1 to 11, wherein, The isolation structure has multiple grooves on its surface away from the substrate, and the grooves are connected to at least one of the pixel openings.

13. The display panel according to claim 12, wherein, At least one groove is provided between two adjacent pixel openings, and the groove is connected to both adjacent pixel openings.

14. The display panel according to claim 12 or 13, wherein, One of the pixel openings communicates with a plurality of the grooves, the plurality of grooves extend in a direction away from the pixel opening, and the plurality of grooves are spaced apart around the pixel opening.

15. The display panel according to claim 14, wherein, Along the circumferential direction of the plurality of grooves, the spacing between two adjacent grooves is equal.

16. The display panel according to any one of claims 12 to 15, wherein, The depth of the groove is less than or equal to the thickness of the third sub-layer of the isolation structure.

17. The display panel according to any one of claims 1 to 16, wherein, The materials of the third sublayer of the isolation structure and the optical structure both include hydrophobic or oleophobic materials.

18. The display panel according to any one of claims 1 to 17, wherein, The isolation structure includes a first sublayer, a second sublayer, and a third sublayer that are sequentially stacked along a direction away from the substrate; The light-emitting device includes a first electrode, a light-emitting part, and a second electrode, which are sequentially stacked along a direction away from the substrate; The first sublayer covers a portion of the area of ​​the first electrode.

19. A method for manufacturing a display panel, comprising: An isolation structure is formed on one side of the substrate; The isolation structure defines multiple pixel openings; A light-emitting device film layer of the target color and a first inorganic thin film are sequentially formed on a substrate having the plurality of pixel openings; A photoresist layer is formed on the side of the first inorganic thin film away from the substrate, and the photoresist layer covers the light-emitting device area of ​​the target color; Based on the photoresist layer, the portion of the target color light-emitting device film layer and the portion of the first inorganic thin film covering the area other than the target color light-emitting device area is removed. The target color light-emitting device film layer and the first inorganic thin film retained in the target color light-emitting device area respectively form the target color light-emitting device and its corresponding first inorganic encapsulation layer. The retained photoresist layer forms an optical structure.

20. A display device, comprising: The display panel as described in any one of claims 1 to 18; A cover plate is disposed on the light-emitting side of the display panel.

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