Display panel, manufacturing method for display panel, and display apparatus

Abstract

A display panel, a manufacturing method for the display panel, and a display apparatus. The display panel comprises a substrate, an isolation structure, a plurality of light-emitting devices, a packaging structure, and an optical structure. The isolation structure is located on one side of the substrate; and the isolation structure defines a plurality of pixel openings. The light-emitting devices are arranged in the pixel openings. The packaging structure comprises a first inorganic packaging layer, an organic packaging layer, and a second inorganic packaging layer which are sequentially stacked in the direction moving away from the substrate. The optical structure is located between the first inorganic packaging layer and the organic packaging layer. The optical structure comprises a plurality of light-transmitting optical portions; and one optical portion is located in one corresponding pixel opening. The display panel is used for displaying an image.

Description

Display panel, display panel manufacturing method and display device TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, and in particular, to a display panel, a display panel manufacturing method and a display device. BACKGROUND

[0002] With the continuous development of display technology, display devices have gradually spread in people's lives. Among them, the organic light-emitting diode (OLED) display panel has the advantages of self-luminous, low power consumption, wide viewing angle, fast response speed, high contrast ratio, etc., and is widely used in display devices such as mobile phones, televisions, notebook computers, etc.

[0003] SUMMARY

[0004] In one aspect, a display panel is provided. The display panel includes a substrate, an isolation structure, a light-emitting device, an encapsulation structure, and an optical structure.

[0005] The isolation structure is located on one side of the substrate, and the isolation structure defines a plurality of pixel openings. The light-emitting device is disposed in the pixel opening. The encapsulation structure is located on a side of the light-emitting device away from the substrate. The encapsulation structure includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer, which are sequentially stacked in a direction away from the substrate.

[0006] The optical structure is located between the first inorganic encapsulation layer and the organic encapsulation layer. The optical structure includes a plurality of light-transmissive optical portions, and one optical portion is located in one pixel opening.

[0007] In some embodiments, a surface of the optical portion away from the substrate is closer to the substrate than a surface of the isolation structure away from the substrate; or, the surface of the optical portion away from the substrate and the surface of the isolation structure away from the substrate are flush.

[0008] In some embodiments, the isolation structure includes a first sub-layer, a second sub-layer, and a third sub-layer, which are sequentially stacked in a direction away from the substrate. A surface of the optical portion away from the substrate is farther away from the substrate than a surface of the second sub-layer away from the substrate.

[0009] In some embodiments, the refractive index of the material of the optical portion is different from the refractive index of the material of the third sub-layer.

[0010] In some embodiments, the optical portion has a refractive index greater than or equal to 1.65, and the third sub-layer has a refractive index less than or equal to 1.4; or the optical portion has a refractive index less than or equal to 1.4, and the third sub-layer has a refractive index greater than or equal to 1.65.

[0011] In some embodiments, the material of the optical portion comprises a photoresist.

[0012] In some embodiments, the optical portion comprises first particles having a refractive index of 1-2.

[0013] In some embodiments, the optical portion is a color filter, and the color of light allowed to pass through the color filter is the same as the color of light emitted by the light emitting device located in the same pixel opening.

[0014] In some embodiments, the isolation structure comprises a first sub-layer, a second sub-layer, and a third sub-layer stacked in sequence in a direction away from the substrate. At least the third sub-layer of the isolation structure comprises a light-blocking material.

[0015] In some embodiments, the second sub-layer and the third sub-layer of the isolation structure each comprise a light-blocking material.

[0016] In some embodiments, the first sub-layer of the isolation structure and the third sub-layer of the isolation structure comprise an insulating material, and the second sub-layer of the isolation structure comprises a conductive material.

[0017] The light emitting device comprises a first electrode, a light emitting portion, and a second electrode stacked in sequence in a direction away from the substrate. The second electrodes of two adjacent light emitting devices are connected through the second sub-layer of the isolation structure located between the two adjacent light emitting devices.

[0018] In some embodiments, the isolation structure is provided with a plurality of recesses on a surface thereof away from the substrate, and the recesses are in communication with at least one pixel opening.

[0019] In some embodiments, at least one recess is provided between two adjacent pixel openings, and the recess is in communication with both of the two adjacent pixel openings.

[0020] In some embodiments, one pixel opening is in communication with a plurality of recesses, the plurality of recesses extend in a direction away from the pixel opening, and the plurality of recesses are arranged at intervals around the pixel opening.

[0021] In some embodiments, the distance between two adjacent recesses in a direction of surrounding the plurality of recesses is equal.

[0022] In some embodiments, the depth of the groove is less than or equal to the thickness of the third sub-layer of the isolation structure.

[0023] In some embodiments, the material of the third sub-layer of the isolation structure and the material of the optical structure both comprise a hydrophobic material or an oleophobic material.

[0024] In some embodiments, the isolation structure comprises a first sub-layer, a second sub-layer and a third sub-layer which are sequentially stacked in a direction away from the substrate.

[0025] The light-emitting device comprises a first electrode, a light-emitting part and a second electrode which are sequentially stacked in a direction away from the substrate.

[0026] The first sub-layer covers a part of the area of the first electrode.

[0027] In another aspect, a method for manufacturing a display panel is provided, comprising the following steps:

[0028] An isolation structure is formed on one side of a substrate; the isolation structure defines a plurality of pixel openings.

[0029] A light-emitting device film layer of a target color and a first inorganic thin film are sequentially formed on the substrate with the plurality of pixel openings.

[0030] A photoresist layer is formed on the side of the first inorganic thin film away from the substrate, covering the light-emitting device region of the target color.

[0031] Based on the photoresist layer, the light-emitting device film layer of the target color and the first inorganic thin film covering the part other than the light-emitting device region of the target color are removed, and the light-emitting device film layer of the target color and the first inorganic thin film in the light-emitting device region of the target color are reserved to form the light-emitting device of the target color and the corresponding first inorganic encapsulation layer respectively, and the reserved photoresist layer forms an optical structure.

[0032] In yet another aspect, a display device is provided, comprising a display panel as described in any of the above embodiments and a cover plate.

[0033] The cover plate is arranged on the light-emitting side of the display panel. BRIEF DESCRIPTION OF DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the present disclosure, the following will briefly introduce the drawings needed to be used in some embodiments of the present disclosure. Obviously, the drawings in the following description only represent some embodiments of the present disclosure, and other drawings can also be obtained by those skilled in the art according to these drawings. In addition, the drawings in the following description can be regarded as schematic diagrams, and are not limited to the actual size, actual process, actual time sequence, etc. of the product involved in the embodiments of the present disclosure.

[0035] FIG. 1 is a structural diagram of a display device according to some embodiments;

[0036] FIG. 2 is a first cross-sectional view of the display device in FIG. 1 along the cross-sectional line B-B;

[0037] FIG. 3 is a structural diagram of a display panel according to some embodiments;

[0038] FIG. 4A is a film layer structure diagram of a light emitting device according to some embodiments;

[0039] FIG. 4B is another film layer structure diagram of a light emitting device according to some embodiments;

[0040] FIG. 4C is yet another film layer structure diagram of a light emitting device according to some embodiments;

[0041] FIG. 4D is still another film layer structure diagram of a light emitting device according to some embodiments;

[0042] FIG. 5 is a second cross-sectional view of the display device in FIG. 1 along the cross-sectional line B-B;

[0043] FIG. 6 is a partial plan view of a display panel according to some embodiments;

[0044] FIG. 7 is a cross-sectional view of an isolation structure according to some embodiments;

[0045] FIG. 8A is another structural diagram of a display device according to some embodiments;

[0046] FIG. 8B is yet another structural diagram of a display device according to some embodiments;

[0047] FIG. 8C is still another structural diagram of a display device according to some embodiments;

[0048] FIG. 9 is another structural diagram of a display panel according to some embodiments;

[0049] FIG. 10 is a schematic diagram of the transmittance curve of an optical part in an optical structure in a display panel according to some embodiments;

[0050] FIG. 11 is yet another structural diagram of a display panel according to some embodiments;

[0051] FIG. 12 is a schematic diagram of thickness variation trend of the organic encapsulation layer in the encapsulation structure along a direction from the edge of the display panel to the center of the display panel;

[0052] FIG. 13 is a partial plan view of an isolation structure according to some embodiments;

[0053] FIG. 14 is another partial plan view of an isolation structure according to some embodiments;

[0054] FIG. 15A is a first cross-sectional view of the isolation structure in FIG. 13 along section line C-C;

[0055] FIG. 15B is a second cross-sectional view of the isolation structure in FIG. 13 along section line C-C;

[0056] FIG. 16 is a flowchart of a method of manufacturing a display panel according to some embodiments;

[0057] FIG. 17 is a structure corresponding to step S1 in the method of manufacturing a display panel according to the embodiment shown in FIG. 16;

[0058] FIG. 18 is a structure corresponding to step S2 in the method of manufacturing a display panel according to the embodiment shown in FIG. 16;

[0059] FIG. 19 is a structure corresponding to step S3 in the method of manufacturing a display panel according to the embodiment shown in FIG. 16;

[0060] FIG. 20 is a structure corresponding to step S4 in the method of manufacturing a display panel according to the embodiment shown in FIG. 16;

[0061] FIG. 21 is another structure corresponding to step S2 in the method of manufacturing a display panel according to the embodiment shown in FIG. 16;

[0062] FIG. 22 is another structure corresponding to step S3 in the method of manufacturing a display panel according to the embodiment shown in FIG. 16;

[0063] FIG. 23 is another structure corresponding to step S4 in the method of manufacturing a display panel according to the embodiment shown in FIG. 16;

[0064] FIG. 24 is yet another structure corresponding to step S2 in the method of manufacturing a display panel according to the embodiment shown in FIG. 16;

[0065] FIG. 25 is yet another structure corresponding to step S3 in the method of manufacturing a display panel according to the embodiment shown in FIG. 16;

[0066] FIG. 26 is another structural view corresponding to step S4 in the preparation method of the display panel in the embodiment shown in FIG. 16;

[0067] FIG. 27 is still another structural view corresponding to step S2 in the preparation method of the display panel in the embodiment shown in FIG. 16;

[0068] FIG. 28 is still another structural view corresponding to step S3 in the preparation method of the display panel in the embodiment shown in FIG. 16;

[0069] FIG. 29 is still another structural view corresponding to step S4 in the preparation method of the display panel in the embodiment shown in FIG. 16. DETAILED DESCRIPTION

[0070] The technical solutions in some embodiments of the present disclosure will be clearly and completely described below with reference to the drawings. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided in the present disclosure, all other embodiments obtained by a person of ordinary skill in the art belong to the scope of protection of the present disclosure.

[0071] Unless otherwise required by context, the term “comprise” and other forms thereof such as “comprises” and “comprising” are to be construed as open, inclusive, meaning that “comprising” means “including, but not limited to.” In the description of the specification, the terms “one embodiment”, “some embodiments”, “exemplary embodiments”, “example”, “specific example” or “some examples” and the like are intended to mean that a particular feature, structure, material or characteristic included in at least one embodiment or example of the present disclosure. The illustrative representation of the above terms does not necessarily mean the same embodiment or example. In addition, the specific features, structures, materials or characteristics described can be included in any one or more embodiments or examples in any appropriate manner.

[0072] Hereinafter, the terms “first” and “second” are used only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with “first” and “second” can explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise stated, the meaning of “a plurality of” is two or more.

[0073] In describing some embodiments, "coupled" and "connected," along with their derivatives, can be used. It should be understood that these terms are not intended as synonyms for each other. Rather, "connected" can be used to indicate that two or more elements are in direct physical or electrical contact with each other. "Coupled" can be used to indicate that two or more elements are in either physical or electrical contact with each other, even at a remote location from each other. The term "coupled" as used herein encompasses the case where one or more intervening elements can exist. The embodiments disclosed herein are not necessarily limited to the details of the embodiments described.

[0074] "A, B, and C at least one of" has the same meaning as "at least one of A, B, or C," and includes the following combinations: only A, only B, only C, a combination of A and B, a combination of A and C, a combination of B and C, and a combination of A, B, and C.

[0075] "A and / or B" includes the following combinations: A alone, B alone, and a combination of A and B.

[0076] As used herein, the term "if' is, optionally, interpreted as meaning "when" or "while" or "in response to a determination" or "in response to a detection of," depending on the context. Similarly, the phrase "if it is determined" or "if [a stated condition or event] is detected" is, optionally, interpreted as meaning "upon a determination of" or "in response to a determination of" or "upon detecting [a stated condition or event]" or "in response to detecting [a stated condition or event]," depending on the context.

[0077] Use of "adapted to" or "configured to," as used herein, means open and inclusive language that does not exclude additional devices or steps that are adapted to or configured to perform the recited tasks or steps.

[0078] Additionally, use of "based on" means open and inclusive, as the process, step, calculation, or other action that is based on one or more stated conditions or values can in fact be based on additional conditions or values beyond those stated.

[0079] As used herein, "about," "approximately," or "around" includes the recited value and the average value within an acceptable range of deviation from the stated value, as determined by one of ordinary skill in the art considering the measurement in question and the error in measuring the particular quantity (i.e., the limitations of the measurement system).

[0080] As used herein, "parallel," "perpendicular," "equal" include the recited condition and conditions that are approximately the recited condition, the range of approximation being within an acceptable deviation range as determined by one of ordinary skill in the art taking into account the measurement being discussed and the error associated with the measurement of the particular quantity (i.e., limitations of the measurement system). For example, "parallel" includes absolute parallel and near parallel, where the acceptable deviation range for near parallel can be, for example, within 5°; "perpendicular" includes absolute perpendicular and near perpendicular, where the acceptable deviation range for near perpendicular can also be, for example, within 5°. "Equal" includes absolute equality and near equality, where the acceptable deviation range for near equality can be, for example, a difference between the two that is less than or equal to 5% of either.

[0081] It should be understood that when a layer or element is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate, or intervening layers can also be present.

[0082] Exemplary embodiments are described herein with reference to cross-sectional and / or plan view illustrations that are idealized examples. In the interest of clarity, not all of the circular features can be shown in the drawings. It will be appreciated that in the development of any such actual implementation, numerous implementation-specific decisions can be made. These implementation-specific decisions can include, for example, manufacturing or processing tolerances, variations from the teaching, and / or the skill(s) of artisans within the relevant trade. As such, some aspects of the exemplary embodiments can be practiced without the these specific details. In other instances, well-known methods, procedures and components have not been described in detail so as not to unnecessarily obscure aspects of the exemplary embodiments. Further, it should be understood that the drawings are not necessarily drawn to scale. The exemplary embodiments should not be construed as limited to the regions shown in the drawings, but rather are to be construed in accordance with the language of the specification. For example, etched regions shown as rectangular will typically have curved features. Accordingly, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of the exemplary embodiments.

[0083] For the convenience of the following description, an XYZ coordinate system is established. A third direction Z is a thickness direction of the display device, an XY plane is perpendicular to the Z direction, a first direction X and a second direction Y intersect each other. For example, the first direction X and the second direction Y are perpendicular to each other.

[0084] It should be noted that, for example, F1 / F appearing in the drawings of the present disclosure indicates that the component is both F1 and F, and other similar designations appearing in the drawings also follow the above description.

[0085] As shown in FIG. 1, some embodiments of the present disclosure provide a display device 100.

[0086] Exemplarily, the display device 100 can be any device that displays images whether in motion (e.g., video) or stationary (e.g., a still image), whether textual or pictorial. More particularly, it is contemplated that the embodiments can be implemented in or in association with a variety of electronic devices such as, but not limited to, mobile telephones, wireless devices, personal data assistants (PDAs), hand-held or portable computers, GPS receivers / navigators, cameras, MP4 players, camcorders, game consoles, wrist watches, clocks, calculators, television monitors, flat panel displays, computer monitors, auto displays (e.g., odometer display, etc.), cockpit controls and / or displays, camera view displays (e.g., display of a rear view camera in a vehicle), electronic photographs, electronic billboards or signs, projections, architectural structures, packaging, and aesthetic structures (e.g., display of images on a piece of jewelry), and the like. By way of further example, the display device 100 is schematically depicted in FIG. 1 as a mobile phone.

[0087] Exemplarily, the display device 100 can be an electroluminescent display device or a photoluminescent display device. In the case that the display device 100 is an electroluminescent display device, the electroluminescent display device can be an organic electroluminescent display device (OLED) or a quantum dot electroluminescent display device (QLED). In the case that the display device 100 is a photoluminescent display device, the photoluminescent display device can be a quantum dot photoluminescent display device.

[0088] Hereinafter, some embodiments of the present disclosure are exemplarily described by taking the display device 100 as an organic electroluminescent display device (OLED), but the embodiments of the present disclosure include but are not limited to this, and any other display device can also be considered as long as the same technical idea is applied.

[0089] In some embodiments, as shown in FIG. 2, which is a first cross-sectional view of the display device 100 along the cross-sectional line B-B in FIG. 1, the display device 100 includes a display panel 10 and a cover plate 20. The cover plate 20 is disposed at the light-out side of the display panel 10.

[0090] The cover plate 20 can separate the display panel 10 from the external environment and provide protection for the display panel 10.

[0091] Exemplarily, the cover plate 20 can be a single-layer cover plate or a multi-layer cover plate 20 that are bonded together by adhesive material.

[0092] Exemplarily, the cover plate 20 can be a silicate glass cover plate, which can be a curved glass or an ultra-thin glass, for example.

[0093] The cover plate 20 can also be a flexible polymer film cover plate, which can be a transparent polyimide, PET, polyurethane, or the like.

[0094] The cover plate 20 can also be a combination of the above flexible polymer films, or a combination of the flexible polymer film and the silicate glass.

[0095] In some embodiments, the display device 100 can further include a circuit board (not shown in the figure). The circuit board is electrically connected to the display panel 10 and is configured to drive the display panel 10 to display images.

[0096] Exemplarily, the circuit board includes but is not limited to a PCB (Printed Circuit Board) and an FPC (Flexible Printed Circuit Board).

[0097] In some embodiments, the display device 100 can further include an under-screen camera, an under-screen fingerprint identification sensor, or the like, so that the display device 100 can implement multiple different functions such as photographing, video recording, fingerprint identification, and face recognition. The present disclosure does not make any limitation in this regard, and adaptive design can be made according to actual needs.

[0098] The display panel 10 is described in detail below.

[0099] In some embodiments, referring to FIG. 2, the display panel 10 includes a substrate 1.

[0100] Exemplarily, the material used to form the substrate 1 can include an inorganic material, such as a glass material, e.g., soda lime glass, quartz glass, sapphire glass, or the like.

[0101] The material used to form the substrate 1 can also include an organic material, such as one or more of polymethyl methacrylate, polyvinyl alcohol, polyvinyl phenol, polyether sulfone, polyimide, polyamide, polyacetal, polycarbonate, polyethylene terephthalate, and polyethylene naphthalate.

[0102] The material used to form the substrate 1 can also include both an organic material and an inorganic material.

[0103] In some embodiments, as shown in FIG. 3, which is a structural diagram of the display panel 10 according to some embodiments, the display panel 10 can have a rectangular structure.

[0104] It should be noted that the "rectangular structure" refers to the shape of the boundary of the display panel 10 as a whole, but is not limited to a standard rectangle. That is, the "rectangle" herein not only includes the shape of a standard rectangle, but also includes shapes similar to a rectangle in consideration of process conditions. For example, as shown in FIG. 3, the long side and the short side of the rectangle are curved at each intersection (i.e., the corner G), that is, the corner G is smooth, so that the shape of the boundary of the display panel 10 in the plan view is a rounded rectangle.

[0105] In other embodiments, the display panel 10 can be a circular structure, or other shapes with corners.

[0106] Hereinafter, some embodiments of the present disclosure will be illustratively described with the display panel 10 as a rectangular structure, but the embodiments of the present disclosure include but are not limited to this, and the shape of the display panel 10 can also consider any other shape.

[0107] In some embodiments, please continue to refer to FIG. 3, the display panel 10 has a display area AA for displaying an image, and a peripheral area AN located at least one side of the display area AA.

[0108] For example, the peripheral area AN is located at one side of the display area AA.

[0109] For another example, the peripheral area AN is located at opposite sides of the display area AA.

[0110] For another example, as shown in FIG. 3, the peripheral area AN surrounds the display area AA.

[0111] It should be noted that the specific arrangement of the peripheral area AN is related to the specific design of the display panel 10, and can be designed according to actual needs, which is only illustratively described herein and does not limit the present disclosure.

[0112] In some embodiments, please continue to refer to FIG. 2 and FIG. 3, the display panel 10 is provided with a plurality of light emitting devices F in the display area AA, and the light emitting device F is the smallest light emitting unit in the display area AA. The plurality of light emitting devices F in the display area AA of the display panel 10 are located at one side of the substrate 1.

[0113] Illustratively, other film layer structures can be provided between the substrate 1 and the light emitting device F.

[0114] For example, a driving layer (not shown in the figure) for driving the light emitting device F to emit light can be arranged between the substrate 1 and the light emitting device F. The driving layer can include an active layer (Active) formed on the substrate 1 by a patterning process, a gate insulating layer (GI) formed on the active layer (Active) by deposition or the like, a gate (Gate) of a thin film transistor (TFT) formed on the gate insulating layer (GI) by a patterning process, an insulating layer (ILD) formed on the gate (Gate) by deposition or the like, a source-drain metal layer forming a source (Source) and a drain (Drain) of the thin film transistor (TFT), and a planar layer (PLN) covering the source-drain metal layer and the exposed insulating layer (ILD).

[0115] The material of the active layer (Active) can include polysilicon and metal oxide, etc., the material of the gate insulating layer (GI) can include inorganic insulating material such as silicon oxide, silicon nitride or silicon oxynitride, and the material of the insulating layer (ILD) can include inorganic insulating material such as silicon oxide, silicon nitride or silicon oxynitride. The material of the gate (Gate) can include metal or alloy material such as aluminum, titanium or cobalt. The material of the planar layer (PLN) can include organic material, or inorganic insulating material such as silicon oxide, silicon nitride or silicon oxynitride. The planar layer (PLN) has a planarization effect, which is conducive to improving the quality of subsequent material deposition, reducing the surface difference of other film layers formed subsequently, and the planar layer (PLN) can block water and oxygen from entering the light emitting device F.

[0116] For example, the plurality of light emitting devices F in the display area AA of the display panel 10 can emit light of the same color, and the display panel 10 can further include a color film layer arranged on the light emitting side of the plurality of light emitting devices F. For example, the plurality of light emitting devices F all emit white light, red light, green light or blue light, etc., in which case the color light emitted by the light emitting device F remains the same color after passing through the color film layer, or is converted into other color light, so that the display panel 10 can realize multi-color light emission when the plurality of light emitting devices F emit light of the same color.

[0117] Alternatively, as shown in FIG. 2, the plurality of light emitting devices F in the display area AA of the display panel 10 emit light of different colors, for example, the plurality of light emitting devices F include first color light emitting devices F1 emitting first color light, second color light emitting devices F2 emitting second color light, and third color light emitting devices F3 emitting third color light, so as to realize multi-color light emission of the display panel 10.

[0118] The first color light emitting device F1 can be a red light emitting device, emitting red light. The second color light emitting device F2 can be a green light emitting device, emitting green light. The third color light emitting device F3 can be a blue light emitting device, emitting blue light.

[0119] Alternatively, the first color light emitting device F1 can also be a green light emitting device or a blue light emitting device. The second color light emitting device F2 can also be a red light emitting device or a blue light emitting device. The third color light emitting device F3 can also be a red light emitting device or a green light emitting device.

[0120] The following will be described with an example that the plurality of light emitting devices F in the display area AA of the display panel 10 emit light of different colors.

[0121] In some embodiments, referring to FIG. 2, the light emitting device F includes a first electrode 41, a light emitting part 43, and a second electrode 42, which are sequentially stacked in a direction away from the substrate 1. That is, the first electrode 41 is closer to the substrate 1 than the second electrode 42.

[0122] The first electrode 41 and the second electrode 42 can provide carriers such as electrons and holes to the light emitting part 43, so that the light emitting part 43 emits light.

[0123] For example, one of the first electrode 41 and the second electrode 42 can serve as an anode of the light emitting device F (e.g., the first color light emitting device F1, the second color light emitting device F2, and the third color light emitting device F3), and the other can serve as a cathode of the light emitting device F (e.g., the first color light emitting device F1, the second color light emitting device F2, and the third color light emitting device F3).

[0124] For example, the first electrode 41 can serve as an anode of the light emitting device F (e.g., the first color light emitting device F1, the second color light emitting device F2, and the third color light emitting device F3), and the second electrode 42 can serve as a cathode of the light emitting device F (e.g., the first color light emitting device F1, the second color light emitting device F2, and the third color light emitting device F3).

[0125] For example, the material for forming the first electrode 41 can include a metal material, such as any one or more of magnesium (Mg), silver (Ag), copper (Cu), aluminum (Al), titanium (Ti), and molybdenum (Mo).

[0126] The material for forming the first electrode 41 can also include an alloy material of the above-mentioned metal material, such as aluminum-neodymium alloy (AlNd) or molybdenum-niobium alloy (MoNb).

[0127] For example, the first electrode 41 can be a single-layer structure.

[0128] Alternatively, the first electrode 41 can also be a multi-layer composite structure. For example, the first electrode 41 can be a Ti / Al / Ti structure or the like. For another example, the first electrode 41 can be a stack structure formed by a metal material and a transparent conductive material, such as ITO / Ag / ITO, Mo / AlNd / ITO, or the like.

[0129] Exemplarily, the material for forming the second electrode 42 can include any one or several of magnesium (Mg), silver (Ag), aluminum (Al), or the like.

[0130] The material for forming the second electrode 42 can also include an alloy made of any one or several of magnesium (Mg), silver (Ag), aluminum (Al), or the like.

[0131] The material for forming the second electrode 42 can further include a transparent conductive material, for example, indium tin oxide (ITO).

[0132] In some embodiments, as shown in FIGS. 4A, 4B, 4C, and 4D, each of FIGS. 4A, 4B, 4C, and 4D is a film layer structure diagram of a light emitting device F according to some embodiments. The light emitting part 43 in the light emitting device F includes a light emitting layer 43a.

[0133] Exemplarily, please continue to refer to FIGS. 4A and 4C, the display panel 10 can be an OLED display panel. Based on that the display panel 10 is an OLED display panel, the light emitting layer 43a can include an organic light emitting layer (EML). For example, the organic light emitting layer EML can include a light emitting layer host material and a light emitting layer guest material, which can be a fluorescent dopant or a phosphorescent dopant.

[0134] Alternatively, please continue to refer to FIGS. 4B and 4D, the display panel 10 can also be a QLED display panel. Based on that the display panel 10 is a QLED display panel, the light emitting layer 43a can include a quantum dot layer (QDL). For example, the quantum dot layer (QDL) can have quantum dot particles, which can be connected to each other through surface modification groups. Exemplarily, please continue to refer to FIGS. 4A, 4B, 4C, and 4D, the light emitting part 43 can further include one or several of a hole injection layer (HIL), a hole transport layer (HTL), an electron block layer (EBL), a hole block layer (HBL), an electron transport layer (ETL), and an electron injection layer (EIL).

[0135] In some embodiments, referring to FIGS. 4A and 4B, the light emitting part 43 in the light emitting device F can include a single light emitting layer 43a.

[0136] In other embodiments, referring to FIGS. 4C and 4D, the light emitting part 43 in the light emitting device F can include a multi-layer light emitting layer 43a.

[0137] Exemplarily, referring to FIGS. 4C and 4D, the light emitting part 43 in the light emitting device F can include a two-layer light emitting layer 43a.

[0138] Referring to FIGS. 4C and 4D, the light emitting part 43 in the light emitting device F further includes a charge generation layer (CGL) between the two adjacent light emitting layers 43a. The charge generation layer (CGL) can connect the two adjacent light emitting layers 43a in series to realize a tandem EL design.

[0139] On the one hand, due to the increase in the number of light emitting layers 43a and the charge generation layer (CGL) can reduce the driving voltage and generate new carriers, the light emitting efficiency of the light emitting part 43 can be doubled. On the other hand, at the same brightness, the current density of the display panel 10 with the tandem EL design is reduced compared to the display panel 10 with the single-layer light emitting design, which is beneficial to prolong the service life of the display panel 10.

[0140] Exemplarily, the charge generation layer (CGL) can be configured to generate, transport and inject carriers.

[0141] Exemplarily, the charge generation layer (CGL) can include an n-type charge generation layer (n-CGL) and a p-type charge generation layer (p-CGL).

[0142] The n-type charge generation layer (n-CGL) can include, for example, an organic electron transport layer (ETL) material doped with a metal material.

[0143] The p-type charge generation layer (p-CGL) can include, for example, an organic hole transport layer (HTL) material doped with a p-dopant (PD).

[0144] In some embodiments, as shown in FIG. 5 and FIG. 6, FIG. 5 is a second cross-sectional view of the display device 100 in FIG. 1 along the cross-sectional line B-B, and FIG. 6 is a partial plan view of the display panel 10 according to some embodiments. The display panel 10 further comprises an isolation structure 5. The isolation structure 5 is located on one side of the substrate 1 and defines a plurality of pixel openings K. A light emitting device F (e.g., a first color light emitting device F1, a second color light emitting device F2, or a third color light emitting device F3) is disposed in each pixel opening K, and each pixel opening K and light emitting device F (e.g., a first color light emitting device F1, a second color light emitting device F2, or a third color light emitting device F3) correspond one-to-one.

[0145] By providing the isolation structure 5 and disposing one light emitting device F (e.g., a first color light emitting device F1, a second color light emitting device F2, or a third color light emitting device F3) in one pixel opening K in the isolation structure 5, the light emitting portion 43 in the two adjacent light emitting devices F can be disconnected at the isolation structure 5.

[0146] Exemplarily, the pixel opening K can have a rectangular structure, a circular structure, or other shapes with corners.

[0147] In some embodiments, referring to FIG. 5, the isolation structure 5 comprises a first sub-layer 51, a second sub-layer 52, and a third sub-layer 53 which are sequentially stacked in a direction away from the substrate 1. That is, the first sub-layer 51 is closer to the substrate 1 than the third sub-layer 53.

[0148] The first sub-layer 51 and the third sub-layer 53 can comprise insulating materials, and the second sub-layer 52 can comprise conductive materials.

[0149] Exemplarily, the first sub-layer 51 can comprise an organic insulating material. For example, polyimide, acrylic, polyethylene terephthalate, etc.

[0150] The third sub-layer 53 can comprise an inorganic insulating material. For example, silicon oxide, silicon dioxide, silicon nitride, or carbon black, etc. The material of the second sub-layer 52 can comprise a metal. For example, titanium nitride, etc. In some embodiments, referring to FIG. 5, based on the second sub-layer 52 comprising conductive materials, the second electrode 42 in the two adjacent light emitting devices F can be connected through the second sub-layer 52 in the isolation structure 5 between the two adjacent light emitting devices F, facilitating the transmission of the second electrode (e.g., cathode) signal between the two adjacent light emitting devices F.

[0151] In some embodiments, referring to FIG. 5, the first sub-layer 51 of the isolation structure 5 covers part of the area of the first electrode 41 of the light emitting device F.

[0152] By covering part of the first electrode 41 of the light emitting device F with the first sub-layer 51 of the isolation structure 5, i.e. exposing part of the first electrode 41 by the pixel opening K defined by the isolation structure 5, the first sub-layer 51 of the isolation structure 5 can effectively define the actual effective area of the first electrode 41 (i.e. the area where the first electrode 41 is directly electrically connected to the light emitting part 43), and further define the light emitting area and light emitting area of the sub-pixel F.

[0153] Exemplarily, the first sub-layer 51 of the isolation structure 5 can cover the edge area of the first electrode 41 of the light emitting device F.

[0154] Exemplarily, as shown in FIG. 7, which is a cross-sectional view of the isolation structure 5 according to some embodiments. The third sub-layer 53 has a first included angle R1 between the surface 53a of the second sub-layer 52 and the side surface 53b of the third sub-layer 53, the first included angle R1 is towards the inside of the third sub-layer 53. The first included angle R1 is greater than 45° and less than 90°.

[0155] For example, the first included angle R1 can be 46°, 50°, 55°, 60°, 66°, 70°, 75°, 80°, 85°, 86°, 88° or 89°, etc.

[0156] By setting the first included angle R1 to be greater than 45° and less than 90°, the cross section of the third sub-layer 53 is set as a right trapezoid, which facilitates the deposition of the material used to form the second electrode 42 on the side wall of the second sub-layer 52, so as to improve the bonding yield of the second electrode 42 and the second sub-layer 52.

[0157] Exemplarily, as shown in FIG. 7, the first sub-layer 51 has a second included angle R2 between the surface 51a of the second sub-layer 52 and the side surface 51b of the first sub-layer 51, the second included angle R2 is towards the inside of the first sub-layer 51. The second included angle R2 is greater than 90° and less than 180°.

[0158] For example, the second included angle R2 can be 93°, 100°, 105°, 110°, 115°, 120°, 126°, 130°, 135°, 140°, 145°, 150°, 155°, 160°, 165°, 170°, 175° or 178°, etc. In some embodiments, as shown in FIG. 5, the display panel 10 further comprises an encapsulation structure 8. The encapsulation structure 8 is located on the side of the plurality of light emitting devices F away from the substrate 1. That is, the encapsulation structure 8 is farther away from the substrate 1 than the light emitting device F.

[0159] The encapsulation structure 8 comprises a first inorganic encapsulation layer 81, an organic encapsulation layer 83 and a second inorganic encapsulation layer 82 which are sequentially stacked in the direction away from the substrate 1. That is, the first inorganic encapsulation layer 81 is closer to the light emitting device F than the second inorganic encapsulation layer 82.

[0160] The encapsulation structure 8 is used for encapsulating the light emitting device F (e.g., the first color light emitting device F1, the second color light emitting device F2, and the third color light emitting device F3), and plays a role of protecting the light emitting device F from corrosion caused by external water and oxygen.

[0161] The materials of the first inorganic encapsulation layer 81 and the second inorganic encapsulation layer 82 are inorganic materials, which can be used for blocking water and oxygen. The material of the organic encapsulation layer 83 is an organic material, which can play a role of flat interface, defect covering, and stress release.

[0162] Exemplarily, the materials of the first inorganic encapsulation layer 81 and the second inorganic encapsulation layer 82 can include alkali metal compounds (e.g., LiF), alkaline earth metal compounds (e.g., MgF2), SiON, SiNx, or SiOy, etc.

[0163] The organic encapsulation layer 83 can include organic ink, etc.

[0164] Exemplarily, the first inorganic encapsulation layer 81 and the second inorganic encapsulation layer 82 can be formed by using a process such as Plasma Enhanced Chemical Vapor Deposition (PECVD), magnetron sputtering (SUPTTER), or atomic layer deposition (ALD), etc.

[0165] The organic encapsulation layer 83 can be formed by using a process such as inkjet printing (IJP), Plasma Enhanced Chemical Vapor Deposition (PECVD), screen printing, or flash evaporation, etc.

[0166] In some embodiments, as shown in FIGS. 8A, 8B, and 8C, each of FIGS. 8A, 8B, and 8C is a structural diagram of the display device 100 according to some embodiments. The display panel 10 further includes an optical structure 6. The optical structure 6 includes a plurality of light-transmissive optical units 61, and one optical unit 61 is located at the light emitting side of one light emitting device F.

[0167] Exemplarily, the optical structure 6 can be used for forming an Enhanced Efficiency Structure (EES), which is beneficial to improve the light emitting efficiency of the display panel 10. The implementation of the optical structure 6 for forming the Enhanced Efficiency Structure (EES), and the principle of improving the light emitting efficiency of the display panel 10 will be described in detail later.

[0168] The optical structure 6 can also be used to form a color filter on encapsulation (COE) structure, which is beneficial to improve light transmittance. The implementation of the optical structure 6 in forming the color filter on encapsulation (COE) structure and the principle of improving light transmittance will be described in detail later.

[0169] In some embodiments, referring to FIGS. 8A, 8B and 8C, an optical portion 61 is located in a pixel opening K, and the optical portion 61 is closer to a surface 61a of the substrate 1 than the isolation structure 5 is to a surface 5a of the substrate 1. That is, a distance d1 between the optical portion 61 and the surface 61a of the substrate 1 is less than a distance d2 between the isolation structure 5 and the surface 5a of the substrate 1.

[0170] That is, at least part of an optical portion 61 is located in a pixel opening K. By locating at least part of an optical portion 61 of the optical structure 6 in a pixel opening K defined by the isolation structure 5, compared with separately arranging the optical structure 6 on the side of the isolation structure 5 away from the substrate 1, the increase in the thickness of the display panel 10 due to the addition of the optical structure 6 can be reduced, which is beneficial to reduce the thickness h1 of the display panel 10 and achieve thinning of the display panel 10.

[0171] It should be noted that the "thickness h1 of the display panel 10" refers to the size h1 of the display panel 10 along the third direction Z. The following description of the "thickness h1 of the display panel 10" also follows this description and will not be repeated.

[0172] Exemplarily, referring to FIG. 8C, a surface 61b of the optical portion 61 away from the substrate 1 is farther away from the substrate 1 than the surface 5a of the isolation structure 5 away from the substrate 1. That is, a distance d5 between the surface 61b of the optical portion 61 and the substrate 1 is greater than the distance d2 between the surface 5a of the isolation structure 5 and the substrate 1.

[0173] That is, part of an optical portion 61 is located in a pixel opening K. Compared with separately arranging the optical structure 6 on the side of the isolation structure 5 away from the substrate 1, the increase in the thickness of the display panel 10 due to the addition of the optical structure 6 can be reduced, which is beneficial to reduce the thickness h1 of the display panel 10 and achieve thinning of the display panel 10.

[0174] Alternatively, please continue to refer to FIG. 8B, the optical portion 61 is away from the surface 61b of the substrate 1, and the isolation structure 5 is away from the surface 5a of the substrate 1. That is, the distance d4 between the optical portion 61 and the substrate 1 is equal to the distance d2 between the surface 52a of the second sub-layer 52 of the isolation structure 5 and the substrate 1.

[0175] That is, one optical portion 61 is located in one pixel opening K. Compared with the optical structure 6 being arranged separately on the side of the isolation structure 5 away from the substrate 1, the thickness of the display panel 10 caused by the increase of the optical structure 6 can be 0 or close to 0, which is conducive to further reducing the thickness h1 of the display panel 10 and further achieving the lightness and thinness of the display panel 10.

[0176] Alternatively, please continue to refer to FIG. 8A, the optical portion 61 is away from the surface 61b of the substrate 1, and the isolation structure 5 is closer to the substrate 1 than the surface 5a of the substrate 1. That is, the distance d3 between the optical portion 61 and the substrate 1 is less than the distance d2 between the surface 52a of the second sub-layer 52 of the isolation structure 5 and the substrate 1.

[0177] That is, one optical portion 61 is located in one pixel opening K. Compared with the optical structure 6 being arranged separately on the side of the isolation structure 5 away from the substrate 1, the thickness of the display panel 10 caused by the increase of the optical structure 6 can be 0 or close to 0, which is conducive to further reducing the thickness h1 of the display panel 10 and further achieving the lightness and thinness of the display panel 10.

[0178] Exemplarily, please continue to refer to FIG. 8A, FIG. 8B and FIG. 8C, the optical portion 61 is away from the substrate 1 than the surface 52a of the second sub-layer 52 of the isolation structure 5. That is, the distance d3 between the optical portion 61 and the substrate 1 in the embodiment shown in FIG. 8A, the distance d4 between the optical portion 61 and the substrate 1 in the embodiment shown in FIG. 8B, and the distance d5 between the optical portion 61 and the substrate 1 in the embodiment shown in FIG. 8C are all greater than the distance d6 between the surface 52a of the second sub-layer 52 of the isolation structure 5 and the substrate 1.

[0179] That is, the optical portion 61 of the optical structure 6 is located in the pixel opening K defined by the isolation structure 5 and is relatively far away from the substrate 1, which can provide sufficient space between the optical portion 61 and the substrate 1 for arranging the light emitting device F, and can ensure the thickness of each film layer structure (such as the first electrode 41, the light emitting portion 43 and the second electrode 42) in the light emitting device F, which is conducive to improving the optical performance of the light emitting device F.

[0180] Exemplarily, the material of the optical part 61 of the optical structure 6 can include photoresist.

[0181] Exemplarily, please refer to FIGS. 8A, 8B and 8C, the thickness h2 of the optical part 61 is greater than or equal to 1.5 μm.

[0182] For example, the thickness h2 of the optical part 61 can be 1.5 μm, 1.8 μm, 2.1 μm, 2.3 μm, 2.5 μm, 2.6 μm, 2.8 μm, 3 μm, 3.3 μm or 3.6 μm, etc.

[0183] In some embodiments, please refer to FIGS. 8A, 8B and 8C, the optical structure 6 can be located between the first inorganic encapsulation layer 81 and the organic encapsulation layer 83. Specifically, the plurality of optical parts 61 in the optical structure 6 can be located between the first inorganic encapsulation layer 81 and the organic encapsulation layer 83. That is, the first inorganic encapsulation layer 81 in the encapsulation structure 8 is located between the plurality of optical parts 61 in the optical structure 6 and the light emitting device F, and the organic encapsulation layer 83 and the second inorganic encapsulation layer 82 in the encapsulation structure 8 are located on the side of the plurality of optical parts 61 in the optical structure 6 away from the substrate.

[0184] By locating the first inorganic encapsulation layer 81 in the encapsulation structure 8 between the plurality of optical parts 61 in the optical structure 6 and the light emitting device F, and locating the organic encapsulation layer 83 and the second inorganic encapsulation layer 82 in the encapsulation structure 8 on the side of the plurality of optical parts 61 in the optical structure 6 away from the substrate, compared with locating the organic encapsulation layer 83 and the second inorganic encapsulation layer 82 in the encapsulation structure 8 between the plurality of optical parts 61 in the optical structure 6 and the light emitting device F, the distance between the optical part 61 and the light emitting device F can be reduced, which is conducive to the better play of the plurality of optical parts 61 in the optical structure 6, and improves the optical performance of the display panel 10.

[0185] The following describes the implementation mode of the optical structure 6 for forming an Enhanced Efficiency Structure (EES), and the principle of improving the light extraction efficiency of the display panel 10.

[0186] In some embodiments, referring to FIG. 5, the light emitted by the light emitting device F is finally emitted from the cover plate 20 into the air, and the refractive index n1 of the cover plate 20 is greater than the refractive index n0 of the air, that is, the refractive index of the cover plate 20 is relatively high, and the refractive index of the air is relatively low. Based on the display panel 10 not being provided with the optical structure 6 for forming the Enhanced Efficiency Structure (EES), when the light emitted by the light emitting device F is emitted from the cover plate 20 with a high refractive index into the air with a low refractive index, total reflection occurs (for example, the light path L1 in FIG. 5) if the incident angle of the light between the interface between the cover plate 20 and the air reaches or is greater than the total reflection critical angle arcsin(n0 / n1), resulting in low light extraction efficiency of the display panel 10 as a whole.

[0187] It should be noted that the above-mentioned "total reflection" is an optical phenomenon, which refers to the fact that when light is emitted from a medium with a relatively high refractive index into a medium with a relatively low refractive index (for example, light is emitted from the cover plate 20 with a high refractive index into the air with a low refractive index), if the incident angle reaches or is greater than the total reflection critical angle, the refracted light will disappear, and the incident light will be reflected without entering the medium with a low refractive index (for example, the air).

[0188] Based on this, in some embodiments, referring to FIGS. 8A, 8B and 8C, when the display panel 10 includes the optical structure 6, and the optical structure 6 is used to form the Enhanced Efficiency Structure (EES), the refractive index n2 of the optical part 61 of the optical structure 6 and the refractive index n3 of the third sub-layer 53 of the isolation structure 5 are different. That is, the refractive index of one of the optical part 61 of the optical structure 6 and the third sub-layer 53 of the isolation structure 5 is relatively high, and the refractive index of the other is relatively low.

[0189] By making the refractive index of one of the optical part 61 of the optical structure 6 and the third sub-layer 53 of the isolation structure 5 relatively high and the refractive index of the other relatively low, the optical part 61 of the optical structure 6 and the third sub-layer 53 of the isolation structure 5 form a high-low refractive index alternating structure, which can refract or scatter the light emitted by the light emitting device F, change the propagation direction of the light, reduce the light that is totally reflected at the interface between the cover plate 20 and the air, that is, extract the light that is originally totally reflected in the display panel 10, so that more light can be emitted from the cover plate 20 into the air, increase the light transmittance of the display panel 10, and thus effectively improve the light extraction efficiency of the display panel 10.

[0190] For example, the refractive index n2 of the optical part 61 of the optical structure 6 can be greater than the refractive index n3 of the third sub-layer 53 of the isolation structure 5. For example, the refractive index of the optical part 61 of the optical structure 6 can be greater than 1.65, and the refractive index of the third sub-layer 53 of the isolation structure 5 can be less than 1.4.

[0191] Alternatively, the refractive index n3 of the third sub-layer 53 of the isolation structure 5 can be greater than the refractive index n2 of the optical portion 61 of the optical structure 6. For example, the refractive index of the third sub-layer 53 of the isolation structure 5 can be greater than 1.65, and the refractive index of the optical portion 61 of the optical structure 6 can be less than 1.4.

[0192] In some embodiments, the material of the optical portion 61 of the optical structure 6 can include first particles. The refractive index of the first particles is 1-2. The refractive index of the optical portion 61 of the optical structure 6 as a whole can be adjusted by arranging the first particles with different refractive indices in the optical portion 61 of the optical structure 6, so that the refractive index n2 of the optical portion 61 of the optical structure 6 is greater than or less than the refractive index n3 of the third sub-layer 53 of the isolation structure 5, and the difference between the refractive index n2 of the optical portion 61 of the optical structure 6 and the refractive index n3 of the third sub-layer 53 of the isolation structure 5 can be adjusted according to actual needs, which is beneficial to improve the optical performance of the display panel 10.

[0193] Exemplarily, the first particles can include hollow particles. For example, zirconium oxide hollow particles or silicon oxide hollow particles, etc.

[0194] Exemplarily, the refractive index of the first particles can be 1, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9 or 2, etc.

[0195] In some embodiments, please continue to refer to FIGS. 8A, 8B and 8C, the optical portion 61 of the optical structure 6 and the third sub-layer 53 of the isolation structure 5 are provided with the first inorganic encapsulation layer 81 in the encapsulation structure 8, and the refractive index n2 of the optical portion 61 of the optical structure 6 and the refractive index n3 of the third sub-layer 53 of the isolation structure 5, and the refractive index n4 of the first inorganic encapsulation layer 81 in the encapsulation structure 8 are all different.

[0196] The refractive index n2 of the optical part 61 of the optical structure 6 and the refractive index n3 of the third sub-layer 53 of the isolation structure 5 can be greater than the refractive index n4 of the first inorganic encapsulation layer 81 in the encapsulation structure 8. That is, the refractive index of the optical part 61 of the optical structure 6 and the third sub-layer 53 of the isolation structure 5 is relatively high, and the refractive index of the first inorganic encapsulation layer 81 in the encapsulation structure 8 is relatively low. The optical part 61 of the optical structure 6, the first inorganic encapsulation layer 81 in the encapsulation structure 8, and the third sub-layer 53 of the isolation structure 5 can form a high-low-high refractive index structure, which can further refract or scatter the light emitted by the light-emitting device F, change the propagation direction of the light, further reduce the light that is totally reflected at the interface between the cover plate 20 and the air, that is, extract the light that is totally reflected in the display panel 10, so that more light can be emitted through the cover plate 20 to the air, further increase the light transmittance of the display panel 10, and effectively improve the light extraction efficiency of the display panel 10.

[0197] Alternatively, the refractive index n2 of the optical part 61 of the optical structure 6 and the refractive index n3 of the third sub-layer 53 of the isolation structure 5 can be less than the refractive index n4 of the first inorganic encapsulation layer 81 in the encapsulation structure 8. That is, the refractive index of the optical part 61 of the optical structure 6 and the third sub-layer 53 of the isolation structure 5 is relatively low, and the refractive index of the first inorganic encapsulation layer 81 in the encapsulation structure 8 is relatively high. The optical part 61 of the optical structure 6, the first inorganic encapsulation layer 81 in the encapsulation structure 8, and the third sub-layer 53 of the isolation structure 5 can form a low-high-low refractive index structure, which can further refract or scatter the light emitted by the light-emitting device F, change the propagation direction of the light, further reduce the light that is totally reflected at the interface between the cover plate 20 and the air, that is, extract the light that is totally reflected in the display panel 10, so that more light can be emitted through the cover plate 20 to the air, further increase the light transmittance of the display panel 10, and effectively improve the light extraction efficiency of the display panel 10.

[0198] The implementation of the optical structure 6 for forming a color filter structure (Color filter On Encapsulation, COE) and the principle of improving light transmittance are described below.

[0199] The color filter structure (Color filter On Encapsulation, COE), which can also be referred to as a polarizer-Less (POL-Less) structure, refers to a structure in which a color film or a color filter (CF) is used to replace a polarizer in the display panel 10, which has the advantages of improving the light transmittance of the display panel 10, reducing the working power consumption of the display panel 10, and realizing the thinning of the display panel 10.

[0200] In some embodiments, as shown in FIG. 9, which is a structural diagram of the display panel 10 according to some embodiments. When the optical structure 6 is used to form a color filter on encapsulation (COE) structure, the optical part 61 in the optical structure 6 is a color filter 611. In the light emitting device F and the color filter 611 located in the same pixel opening K, the color of the light allowed to pass through the color filter 611 is the same as the color of the light emitted by the light emitting device F. That is, the color of the light allowed to pass through the color filter 611 located in the same pixel opening K as the first color light emitting device F1 is the first color (for example, red), the color of the light allowed to pass through the color filter 611 located in the same pixel opening K as the second color light emitting device F2 is the second color (for example, green), and the color of the light allowed to pass through the color filter 611 located in the same pixel opening K as the third color light emitting device F3 is the third color (for example, blue).

[0201] The color filter 611 and the light emitting device F are correspondingly arranged and located on the light emitting side of the light emitting device F, which can reduce the reflectivity of ambient light in the area where the light emitting device F is located (i.e., the light emitting area).

[0202] Please continue to refer to FIG. 9. Based on the fact that the optical part 61 in the optical structure 6 is the color filter 611, at least the third sub-layer 53 in the isolation structure 5 includes a light shielding material. When ambient light irradiates on the third sub-layer 53, the third sub-layer 53 can absorb the ambient light, thereby preventing the reflection of the ambient light and reducing the reflectivity of the ambient light in the area where the isolation structure 5 is located (i.e., the non-light emitting area).

[0203] In summary, by arranging the color filter 611 on the light emitting side of the light emitting device F and arranging at least the third sub-layer 53 in the isolation structure 5 to include a light shielding material, the reflectivity of the ambient light can be reduced as a whole, thereby achieving the effect of improving the contrast ratio of the display panel 10.

[0204] In this way, under the premise of removing the polarizer, the display panel 10 can still achieve the effect of anti-reflection, and at the same time, since the polarizer is removed, the light transmittance of the display panel 10 can be improved, thereby effectively reducing the power consumption of the display panel 10 and achieving the lightness and thinness of the display panel 10.

[0205] For example, the third sub-layer 53 in the isolation structure 5 can include a light shielding material; or, both the second sub-layer 52 and the third sub-layer 53 in the isolation structure 5 can include a light shielding material.

[0206] It should be noted that in the embodiment shown in FIG. 9 in which the optical structure 6 is used to form a color filter on encapsulation (COE) structure, the optical part 61 (i.e., the light filtering color resist 611) is shown as being farther away from the surface 61b of the substrate 1 than the isolation structure 5 is from the surface 5a of the substrate 1. However, in the embodiment shown in FIG. 9 in which the optical structure 6 is used to form a color filter on encapsulation (COE) structure, the optical part 61 (i.e., the light filtering color resist 611) and the isolation structure 5 can be arranged in other manners, for example, the optical part 61 (i.e., the light filtering color resist 611) can be farther away from the surface 61b of the substrate 1 than the isolation structure 5 is from the surface 5a of the substrate 1; or for example, the optical part 61 (i.e., the light filtering color resist 611) and the isolation structure 5 can be flush with the surface 61b of the substrate 1, and the details are not described herein.

[0207] Exemplarily, the material of the light filtering color resist 611 can include one or more of an oxazine compound, a cyanine compound, and a tetrazine compound.

[0208] In some embodiments, as shown in FIG. 10, FIG. 10 is a schematic diagram of the transmittance curves of the optical part 61 (i.e., the light filtering color resist 611) in the optical structure 6 in the display panel 10 for different wavebands of light, according to some embodiments. The light transmittance of the red light waveband (R), the green light waveband (G), and the blue light waveband (B) is all higher than 70%, but the light transmittance of the first transition waveband N between the red light waveband (R) and the green light waveband (G), and the second transition waveband M between the green light waveband (G) and the blue light waveband (B) is not 0, which can easily cause the color purity of the display panel 10 to decrease.

[0209] Based on this, in some embodiments, as shown in FIG. 11, FIG. 11 is a structural diagram of the display panel 10, according to some embodiments. The display panel 10 further includes an anti-reflection layer 3. The anti-reflection layer 3 is located between the first inorganic encapsulation layer 81 of the encapsulation structure 8 and the second electrode 42 of the light emitting device F.

[0210] By arranging the anti-reflection layer 3 between the first inorganic encapsulation layer 81 of the encapsulation structure 8 and the second electrode 42 of the light-emitting device F, the anti-reflection layer 3 and the adjacent film layer of the anti-reflection layer 3 (for example, the first inorganic encapsulation layer 81 within the encapsulation structure 8) form a stack structure, and the refractive index of the anti-reflection layer 3 and the adjacent film layer of the anti-reflection layer 3 (for example, the first inorganic encapsulation layer 81 within the encapsulation structure 8) is different, forming a microcavity structure between the first electrode 41 (i.e., the reflective electrode) and the stack structure. The light emitted by the light-emitting part 43 of the light-emitting device F passes through the second electrode 42 and the stack structure in turn and exits the display panel 10. The microcavity structure can enhance the light of a specific waveband (for example, the red waveband (R), the green waveband (G), and the blue waveband (B)), increase the light extraction amount of the light of the specific waveband (for example, the red waveband (R), the green waveband (G), and the blue waveband (B)), and weaken the light of other wavebands (for example, the first transition waveband N between the red waveband (R) and the green waveband (G), and the second transition waveband M between the green waveband (G) and the blue waveband (B)), and reduce the light extraction amount of the light of the other wavebands (for example, the first transition waveband N between the red waveband (R) and the green waveband (G), and the second transition waveband M between the green waveband (G) and the blue waveband (B)), thereby improving the display effect of the display panel 10.

[0211] Exemplarily, the material of the anti-reflection layer 3 can include a metal or a metal compound. For example, Thick reflective metal (M-O-M) or Thick reflective metal (M-I-M). Wherein, the above-mentioned “M” can be Sm / Alq3 / Al, Sm / Alq3 / Sm / Alq3 / Al, or Al / CuPc / Al / CuPc / Al, etc. The above-mentioned “O” can be iF / Cr / LiF / Cr / LiF / Ag, ZnO, Alq3+C60, Alq3, CuPc, or LiF, etc. The above-mentioned “I” can be iF / Cr / LiF / Cr / LiF / Ag, ZnO, Alq3+C60, Alq3, CuPc, or LiF, etc.

[0212] Exemplarily, please continue to refer to FIG. 11, the thickness h7 of the anti-reflection layer 3 can be 1 nm to 50 nm.

[0213] For example, the thickness h7 of the anti-reflection layer 3 can be 1 nm, 5 nm, 8 nm, 10 nm, 12 nm, 15 nm, 18 nm, 20 nm, 23 nm, 25 nm, 28 nm, 30 nm, 33 nm, 35 nm, 38 nm, 40 nm, 43 nm, 45 nm, 48 nm, or 50 nm, etc.

[0214] It should be noted that the above-mentioned “thickness h7 of the anti-reflection layer 3” refers to the size h7 of the anti-reflection layer 3 along the third direction Z.

[0215] The organic encapsulation layer 83 in the encapsulation structure 8 is described in detail as follows.

[0216] In some embodiments, the organic encapsulation layer 83 in the encapsulation structure 8 can be formed by an Inkjet-printed (IJP) process.

[0217] Specifically, the material used to form the organic encapsulation layer 83 in the encapsulation structure 8 is dissolved in a solvent to form a printing ink, the printing ink is dropped on the side of the first inorganic encapsulation layer 81 in the encapsulation structure 8 away from the substrate 1 by an inkjet printer, the liquid printing ink is free to flow on the side of the first inorganic encapsulation layer 81 away from the substrate 1, and then a uniform film layer (i.e., the organic encapsulation layer 83 in the encapsulation structure 8) is formed by using ultraviolet light excitation curing. However, when the printing ink is dropped on the side of the first inorganic encapsulation layer 81 in the encapsulation structure 8 away from the substrate 1, the flow speed of the liquid drops at the edge of the display panel 10 is inconsistent with the flow speed of the liquid drops at the central area of the display panel 10, and at the same time, the surface of the organic encapsulation layer 83 away from the substrate 1 is uneven due to the surface tension of the liquid drops, for example, the edge of the surface of the organic encapsulation layer 83 away from the substrate 1 is prone to protrusion (i.e., Edge Top defect).

[0218] Specifically, as shown in FIG. 12, FIG. 12 is a schematic diagram of the thickness variation trend of the organic encapsulation layer 83 in the encapsulation structure 8 along the direction from the edge of the display panel 10 to the center of the display panel 10. The horizontal coordinate d7 in FIG. 12 represents the distance from the edge of the display panel 10, and the vertical coordinate d8 represents the distance between the surface of the organic encapsulation layer 83 in the encapsulation structure 8 away from the substrate 1 and the substrate 1. There is a protrusion (i.e., Edge Top) at the edge of the surface of the organic encapsulation layer 83 in the encapsulation structure 8 away from the substrate 1, which is higher than other areas. The above-mentioned Edge Top defect makes the surface of the organic encapsulation layer 83 away from the substrate 1 uneven, which is prone to cause the difference in light extraction efficiency at different positions of the display panel 10, and affects the optical uniformity of the display panel 10.

[0219] Based on this, in some embodiments, as shown in FIG. 13, and in combination with FIGS. 8A, 8B, 8C and 9, FIG. 13 is a partial planar structure diagram of the isolation structure 5 according to some embodiments. The surface 5a of the isolation structure 5 away from the substrate 1 is provided with a plurality of grooves 5aa.

[0220] It can be understood that the surface 5a of the isolation structure 5 away from the substrate 1 and the surface of the third sub-layer 53 of the isolation structure 5 away from the substrate 1 are coplanar.

[0221] By opening a plurality of grooves 5aa away from the surface 5a of the substrate 1 in the isolation structure 5, the printing ink used to form the organic encapsulation layer 83 in the encapsulation structure 8 can be guided, which is conducive to promoting the flow of the printing ink, improving the flatness of the organic encapsulation layer 83 away from the surface 83a of the substrate 1, reducing the difference in light extraction efficiency at different positions of the display panel 10, and improving the optical uniformity of the display panel 10.

[0222] It should be noted that the embodiment shown in FIG. 13, and the pixel opening K is only taken as a rectangular structure for illustrative purposes in the following embodiments, but the embodiments of the present disclosure include but are not limited to this, and the shape of the pixel opening K can also consider any other shape.

[0223] In some embodiments, please continue to refer to FIG. 5, based on one light emitting device F located in one pixel opening K.

[0224] Alternatively, please continue to refer to FIG. 8A, based on the display panel 10 including the optical structure 6, one of the plurality of optical parts 61 in the optical structure 6 is located in one pixel opening K, and the optical part 61 is away from the surface 61b of the substrate 1, which is closer to the substrate 1 than the surface 5a of the isolation structure 5 away from the substrate 1. That is, the distance d3 between the surface 61b of the optical part 61 away from the substrate 1 and the substrate 1 is less than the distance d2 between the surface 5a of the isolation structure 5 away from the substrate 1 and the substrate 1.

[0225] The thickness h3 of the organic encapsulation layer 83 in the encapsulation structure 8 corresponding to the area of the pixel opening K is greater than the thickness h4 corresponding to the area of the isolation structure 5. That is, there is a difference between the thickness h3 of the organic encapsulation layer 83 in the encapsulation structure 8 corresponding to the area of the pixel opening K and the thickness h4 corresponding to the area of the isolation structure 5, which easily causes the difference between the light extraction efficiency of the pixel opening K corresponding area of the display panel 10 and the light extraction efficiency of the isolation structure 5 corresponding area, and affects the optical uniformity of the display panel 10.

[0226] It should be noted that the "thickness h3 of the organic encapsulation layer 83 in the encapsulation structure 8 corresponding to the area of the pixel opening K" refers to the straight line distance between the surface 83a of the organic encapsulation layer 83 in the encapsulation structure 8 away from the substrate 1 corresponding to the area of the pixel opening K and the surface 83b of the organic encapsulation layer 83 in the encapsulation structure 8 close to the substrate 1.

[0227] The "thickness h4 of the organic encapsulation layer 83 in the encapsulation structure 8 corresponding to the area of the isolation structure 5" refers to the straight line distance between the surface 83a of the organic encapsulation layer 83 in the encapsulation structure 8 away from the substrate 1 corresponding to the area of the isolation structure 5 and the surface 83b of the organic encapsulation layer 83 in the encapsulation structure 8 close to the substrate 1.

[0228] The following description of the thickness h3 of the organic encapsulation layer 83 in the encapsulation structure 8 corresponding to the region of the pixel opening K and the thickness h4 of the organic encapsulation layer 83 in the encapsulation structure 8 corresponding to the region of the isolation structure 5 also applies to this description and will not be repeated.

[0229] Based on this, in some embodiments, please continue to refer to FIG. 13, and in combination with FIG. 14, which is a partial planar structural diagram of the isolation structure 5 according to some embodiments. The groove 5aa and the at least one pixel opening K are in communication.

[0230] By opening the plurality of grooves 5aa away from the surface 5a of the substrate 1 of the isolation structure 5, and the groove 5aa and the at least one pixel opening K are in communication, on the one hand, the thickness h4 of the organic encapsulation layer 83 in the encapsulation structure 8 corresponding to the region of the isolation structure 5 can be increased, the difference between the thickness h3 of the organic encapsulation layer 83 in the encapsulation structure 8 corresponding to the region of the pixel opening K and the thickness h4 of the organic encapsulation layer 83 in the encapsulation structure 8 corresponding to the region of the isolation structure 5 can be reduced, the light extraction efficiency of the region corresponding to the pixel opening K of the display panel 10 and the light extraction efficiency of the region corresponding to the isolation structure 5 can be balanced, and the optical uniformity of the display panel 10 can be further improved.

[0231] On the other hand, the groove 5aa and the at least one pixel opening K are in communication, which can make the printing ink used to form the organic encapsulation layer 83 in the encapsulation structure 8 located in the pixel opening K flow to other regions through the groove 5aa, avoid the printing ink used to form the organic encapsulation layer 83 in the encapsulation structure 8 from accumulating in the pixel opening K, facilitate the flow of the printing ink used to form the organic encapsulation layer 83 in the encapsulation structure 8, further improve the flatness of the surface 83a of the organic encapsulation layer 83 in the encapsulation structure 8 away from the substrate 1, and further improve the optical uniformity of the display panel 10.

[0232] Exemplarily, please continue to refer to FIG. 13, the groove 5aa can be in communication with one pixel opening K.

[0233] Alternatively, please continue to refer to FIG. 14, at least one groove 5aa is arranged between adjacent two pixel openings K in the plurality of pixel openings K defined by the isolation structure 5, and the groove 5aa and the adjacent two pixel openings K are in communication.

[0234] It should be noted that in the embodiment shown in FIG. 14, the light emitting part 43 in the light emitting device F located in the adjacent two pixel openings K in communication through the groove 5aa has no connection.

[0235] In some embodiments, please continue to refer to FIG. 13, one pixel opening K is in communication with a plurality of grooves 5aa, the plurality of grooves 5aa extend in a direction away from the pixel opening K, and the plurality of grooves 5aa are arranged at intervals around the pixel opening K.

[0236] By making one pixel opening K communicate with a plurality of grooves 5aa, and the plurality of grooves 5aa extend in a direction away from the pixel opening K, the printing ink used to form the organic encapsulation layer 83 in the encapsulation structure 8 located in the pixel opening K can further flow to other areas through the grooves 5aa, further avoiding the printing ink used to form the organic encapsulation layer 83 in the encapsulation structure 8 from accumulating in the pixel opening K, facilitating the flow of the printing ink used to form the organic encapsulation layer 83 in the encapsulation structure 8 to be flat, and further improving the flatness of the organic encapsulation layer 83 in the encapsulation structure 8 away from the surface 83a of the substrate 1, and improving the optical uniformity of the display panel 10.

[0237] For example, please continue to refer to FIG. 13, along the surrounding direction of the plurality of grooves 5aa, the spacing d9 between adjacent two grooves 5aa is equal.

[0238] In some embodiments, as shown in FIGS. 15A and 15B, FIG. 15A is a first cross-sectional view of the isolation structure 5 in FIG. 13 along the cross-sectional line C-C, and FIG. 15B is a second cross-sectional view of the isolation structure 5 in FIG. 13 along the cross-sectional line C-C. The depth h5 of the groove 5aa is less than or equal to the thickness h6 of the third sub-layer 53 of the isolation structure 5.

[0239] It should be noted that the "depth h5 of the groove 5aa" refers to the dimension h5 of the groove 5aa along the third direction Z. The "thickness h6 of the third sub-layer 53 of the isolation structure 5" refers to the dimension h6 of the third sub-layer 53 of the isolation structure 5 along the third direction Z. The following related descriptions of "depth h5 of the groove 5aa" and "thickness h6 of the third sub-layer 53 of the isolation structure 5" also follow this description and will not be repeated.

[0240] For example, please continue to refer to FIG. 15A, the depth h5 of the groove 5aa can be less than the thickness h6 of the third sub-layer 53 of the isolation structure 5. That is, the groove 5aa does not penetrate the third sub-layer 53 of the isolation structure 5.

[0241] Alternatively, please continue to refer to FIG. 15B, the depth h5 of the groove 5aa can be equal to the thickness h6 of the third sub-layer 53 of the isolation structure 5. That is, the groove 5aa penetrates the third sub-layer 53 of the isolation structure 5 and contacts the second sub-layer 52 of the isolation structure 5.

[0242] In some embodiments, the material of the third sub-layer 53 of the isolation structure 5 and the material of the optical structure 6 both include a hydrophobic material or an oleophobic material. Specifically, the material of the third sub-layer 53 of the isolation structure 5 and the material of the optical part 61 of the optical structure 6 both include a hydrophobic material or an oleophobic material.

[0243] Exemplarily, the material of the third sub-layer 53 of the isolation structure 5 and the material of the optical part 61 of the optical structure 6 can both comprise a hydrophobic material. Alternatively, the material of the third sub-layer 53 of the isolation structure 5 and the material of the optical part 61 of the optical structure 6 can both comprise an oleophobic material.

[0244] The printing ink used in the inkjet-printed (IJP) process is usually formed by dissolving organic materials in lipophilic or alcoholic solvents, and has both aqueous and oily properties. When the printing ink is aqueous, if the material of the third sub-layer 53 of the isolation structure 5 and the material of the optical part 61 of the optical structure 6 both comprise an oleophobic material, the printing ink can have a small contact angle on the side of the material of the third sub-layer 53 of the isolation structure 5 and the material of the optical part 61 of the optical structure 6 away from the substrate 1, easily flow flat, and be conducive to improving the flatness and film thickness uniformity of the formed organic encapsulation layer 83.

[0245] When the printing ink is oily, if the material of the third sub-layer 53 of the isolation structure 5 and the material of the optical part 61 of the optical structure 6 both comprise a hydrophobic material, the printing ink can have a small contact angle on the side of the material of the third sub-layer 53 of the isolation structure 5 and the material of the optical part 61 of the optical structure 6 away from the substrate 1, easily flow flat, and be conducive to improving the flatness and film thickness uniformity of the formed organic encapsulation layer 83.

[0246] The preparation method of the display panel 10 is described in detail below.

[0247] In some embodiments, as shown in FIG. 16, which is a flowchart of a preparation method of a display panel 10 according to some embodiments, the preparation method of the display panel 10 includes steps S1-S4.

[0248] S1: As shown in FIG. 17, which is a structure diagram corresponding to step S1 in the preparation method of the display panel 10 according to the embodiment shown in FIG. 16, the isolation structure 5 is formed on one side of the substrate 1. The isolation structure 5 defines a plurality of pixel openings K.

[0249] S2: As shown in FIG. 18, which is a structure diagram corresponding to step S2 in the preparation method of the display panel 10 according to the embodiment shown in FIG. 16, the target color light emitting device film layer Fa and the first inorganic thin film 811 are sequentially formed on the substrate 1 having the plurality of pixel openings K.

[0250] S3: As shown in FIG. 19, which is a structure diagram corresponding to step S3 in the preparation method of the display panel 10 according to the embodiment shown in FIG. 16, the photoresist layer PR is formed on the side of the first inorganic thin film 811 away from the substrate 1, and the photoresist layer PR covers the target color light emitting device Faa region.

[0251] S4: As shown in FIG. 20, FIG. 20 is a structural diagram corresponding to step S4 in the preparation method of the display panel 10 in the embodiment shown in FIG. 16. Based on the photoresist layer PR, the part of the light-emitting device film layer Fa and the first inorganic film 811 covering the area other than the area of the light-emitting device of the target color Faa is removed, and the light-emitting device film layer Fa of the target color and the first inorganic film 811 in the area of the light-emitting device of the target color Faa respectively form the light-emitting device of the target color Faa and the corresponding first inorganic encapsulation layer 81, and the remaining photoresist layer PR forms the optical structure 6. Specifically, the remaining photoresist layer PR forms the optical part 61 of the optical structure 6.

[0252] Exemplarily, the photoresist layer PR can include a positive photoresist or a negative photoresist.

[0253] It should be noted that the part (i.e. the exposed part) of the positive photoresist exposed to light will dissolve in the photoresist developer, and the part (i.e. the part other than the exposed part) not exposed to light will not dissolve in the photoresist developer or dissolve very slowly.

[0254] The part (i.e. the exposed part) of the negative photoresist exposed to light will not dissolve in the photoresist developer or dissolve very slowly, and the part (i.e. the part other than the exposed part) not exposed to light will dissolve in the photoresist developer.

[0255] Please continue to refer to FIG. 20. The photoresist layer PR can be exposed using a mask, and then subjected to a developing reaction to remove the part of the light-emitting device film layer Fa and the first inorganic film 811 covering the area other than the area of the light-emitting device of the target color Faa, and the light-emitting device film layer Fa of the target color and the first inorganic film 811 in the area of the light-emitting device of the target color Faa respectively form the light-emitting device of the target color Faa and the corresponding first inorganic encapsulation layer 81, and the remaining photoresist layer PR forms the optical structure 6.

[0256] It can be understood that, based on the photoresist layer PR including a positive photoresist, the part of the photoresist layer PR other than the area of the light-emitting device of the target color Faa is the exposed part, and the area of the light-emitting device of the target color Faa is the part other than the exposed part.

[0257] Based on the photoresist layer PR including a negative photoresist, the area of the light-emitting device of the target color Faa is the exposed part, and the part of the photoresist layer PR other than the area of the light-emitting device of the target color Faa is the part other than the exposed part.

[0258] The optical part 61 of the optical structure 6 comprises photoresist. Through the above steps, the optical structure 6 (i.e., the optical part 61 in the optical structure 6) can be formed at the same time as the light emitting device Faa of the target color and the corresponding first inorganic encapsulation layer 81, without the need to additionally increase a mask (Mask) or to increase an additional operation step, thereby facilitating the reduction of the preparation cost of the display panel 10 and the simplification of the preparation steps of the display panel 10.

[0259] Exemplarily, the "light emitting device Faa of the target color" can be a first color light emitting device F1, a second color light emitting device F2, or a third color light emitting device F3.

[0260] For example, the first color light emitting device F1, and the first inorganic encapsulation layer 81 and the optical part 61 corresponding to the first color light emitting device F1 can be formed first, then the second color light emitting device F2, and the first inorganic encapsulation layer 81 and the optical part 61 corresponding to the second color light emitting device F2 are formed, and finally the third color light emitting device F3, and the first inorganic encapsulation layer 81 and the optical part 61 corresponding to the third color light emitting device F3 are formed.

[0261] The second color light emitting device F2, and the first inorganic encapsulation layer 81 and the optical part 61 corresponding to the second color light emitting device F2 can be formed first, then the first color light emitting device F1, and the first inorganic encapsulation layer 81 and the optical part 61 corresponding to the first color light emitting device F1 are formed, and finally the third color light emitting device F3, and the first inorganic encapsulation layer 81 and the optical part 61 corresponding to the third color light emitting device F3 are formed.

[0262] The third color light emitting device F3, and the first inorganic encapsulation layer 81 and the optical part 61 corresponding to the third color light emitting device F3 can be formed first, then the first color light emitting device F1, and the first inorganic encapsulation layer 81 and the optical part 61 corresponding to the first color light emitting device F1 are formed, and finally the second color light emitting device F2, and the first inorganic encapsulation layer 81 and the optical part 61 corresponding to the second color light emitting device F2 are formed.

[0263] Hereinafter, some embodiments of the present disclosure are illustratively described with the first color light emitting device F1, and the first inorganic encapsulation layer 81 and the optical part 61 corresponding to the first color light emitting device F1 being formed first, then the second color light emitting device F2, and the first inorganic encapsulation layer 81 and the optical part 61 corresponding to the second color light emitting device F2 are formed, and finally the third color light emitting device F3, and the first inorganic encapsulation layer 81 and the optical part 61 corresponding to the third color light emitting device F3 are formed.

[0264] Please continue to refer to FIG. 16, the step of forming the first color light emitting device F1 and the first inorganic encapsulation layer 81 and the optical part 61 corresponding to the first color light emitting device F1 based on the target color light emitting device Faa is the first color light emitting device F1, and the step includes:

[0265] S2: As shown in FIG. 21, FIG. 21 is a structure diagram corresponding to step S2 in the preparation method of the display panel 10 in the embodiment shown in FIG. 16. The first color light emitting device film layer F11 and the first inorganic film 811 are sequentially formed on the substrate 1 formed with the plurality of pixel openings K.

[0266] S3: As shown in FIG. 22, FIG. 22 is a structure diagram corresponding to step S3 in the preparation method of the display panel 10 in the embodiment shown in FIG. 16. The photoresist layer PR is formed on the side of the first inorganic film 811 away from the substrate 1, and the photoresist layer PR covers the region of the first color light emitting device F1.

[0267] S4: As shown in FIG. 23, FIG. 23 is a structure diagram corresponding to step S4 in the preparation method of the display panel 10 in the embodiment shown in FIG. 16. Based on the photoresist layer PR, the part of the first color light emitting device film layer F11 and the first inorganic film 811 covering the region other than the region of the first color light emitting device F1 is removed, and the first color light emitting device film layer F11 and the first inorganic film 811 remaining in the region of the first color light emitting device F1 form the first color light emitting device F1 and the first inorganic encapsulation layer 81 corresponding to the first color light emitting device F1 respectively, and the remaining photoresist layer PR forms the optical structure 6. Specifically, the remaining photoresist layer PR forms the optical part 61 corresponding to the first color light emitting device F1.

[0268] After the first color light emitting device F1 and the first inorganic encapsulation layer 81 and the optical part 61 corresponding to the first color light emitting device F1 are formed, steps S2-S4 in the preparation method of the display panel 10 shown in FIG. 16 are repeated, the target color light emitting device Faa is the second color light emitting device F2, and the step of forming the second color light emitting device F2 and the first inorganic encapsulation layer 81 and the optical part 61 corresponding to the second color light emitting device F2 includes:

[0269] S2: As shown in FIG. 24, FIG. 24 is a structure diagram corresponding to step S2 in the preparation method of the display panel 10 in the embodiment shown in FIG. 16. The second color light emitting device film layer F12 and the first inorganic film 811 are sequentially formed on the substrate 1 formed with the plurality of pixel openings K.

[0270] S3: As shown in FIG. 25, FIG. 25 is a structure diagram corresponding to step S3 in the preparation method of the display panel 10 in the embodiment shown in FIG. 16. A photoresist layer PR is formed on the side of the first inorganic thin film 811 away from the substrate 1, and the photoresist layer PR covers the region of the second color light emitting device F2.

[0271] S4: As shown in FIG. 26, FIG. 26 is a structure diagram corresponding to step S4 in the preparation method of the display panel 10 in the embodiment shown in FIG. 16. Based on the photoresist layer PR, the second color light emitting device film layer F12 and the part of the first inorganic thin film 811 covering the region other than the region of the second color light emitting device F2 are removed, and the second color light emitting device film layer F12 and the first inorganic thin film 811 in the region of the second color light emitting device F2 are retained to form the second color light emitting device F2 and the corresponding first inorganic encapsulation layer 81, respectively, and the retained photoresist layer PR forms the optical structure 6. Specifically, the retained photoresist layer PR forms the optical part 61 corresponding to the second color light emitting device F2.

[0272] After the second color light emitting device F2, and the first inorganic encapsulation layer 81 and the optical part 61 corresponding to the second color light emitting device F2 are formed, steps S2-S4 in the preparation method of the display panel 10 shown in FIG. 16 are repeated, and based on the target color light emitting device Faa being the third color light emitting device F3, steps of forming the third color light emitting device F3, and the first inorganic encapsulation layer 81 and the optical part 61 corresponding to the third color light emitting device F3 include:

[0273] S2: As shown in FIG. 27, FIG. 27 is a structure diagram corresponding to step S2 in the preparation method of the display panel 10 in the embodiment shown in FIG. 16. The third color light emitting device film layer F13 and the first inorganic thin film 811 are sequentially formed on the substrate 1 formed with a plurality of pixel openings K.

[0274] S3: As shown in FIG. 28, FIG. 28 is a structure diagram corresponding to step S3 in the preparation method of the display panel 10 in the embodiment shown in FIG. 16. A photoresist layer PR is formed on the side of the first inorganic thin film 811 away from the substrate 1, and the photoresist layer PR covers the region of the third color light emitting device F3.

[0275] S4: As shown in FIG. 29, FIG. 29 is a structural diagram corresponding to step S4 in the preparation method of the display panel 10 in the embodiment shown in FIG. 16. Based on the photoresist layer PR, the third color light emitting device film layer F13 and the part of the first inorganic thin film 811 covering the area other than the area of the third color light emitting device F3 are removed, the third color light emitting device film layer F13 and the first inorganic thin film 811 in the area of the third color light emitting device F3 are reserved to form the third color light emitting device F3 and its corresponding first inorganic encapsulation layer 81 respectively, and the reserved photoresist layer PR forms the optical structure 6. Specifically, the reserved photoresist layer PR forms the optical part 61 corresponding to the third color light emitting device F3.

[0276] The above merely provides a specific implementation of the present disclosure, but the protection scope of the present disclosure is not limited thereto, any person skilled in the art who thinks of changes or replacements within the technical range disclosed by the present disclosure should be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims

1. A display panel, comprising: a substrate; an isolation structure on one side of the substrate; the isolation structure defines a plurality of pixel openings; a light emitting device is disposed in each of the pixel openings; an encapsulation structure on a side of the light emitting device away from the substrate; the encapsulation structure comprises a first inorganic encapsulation layer, an organic encapsulation layer and a second inorganic encapsulation layer which are sequentially stacked in a direction away from the substrate; an optical structure between the first inorganic encapsulation layer and the organic encapsulation layer; the optical structure comprises a plurality of light-transmissive optical portions, one optical portion is located in one of the pixel openings. a surface of the optical portion away from the substrate is closer to the substrate than a surface of the isolation structure away from the substrate; or, the surface of the optical portion away from the substrate is flush with the surface of the isolation structure away from the substrate. the isolation structure comprises a first sub-layer, a second sub-layer and a third sub-layer which are sequentially stacked in a direction away from the substrate; a surface of the optical portion away from the substrate is farther away from the substrate than a surface of the second sub-layer away from the substrate. a refractive index of a material of the optical portion is different from a refractive index of a material of the third sub-layer. the refractive index of the optical portion is greater than or equal to 1.65, and the refractive index of the third sub-layer is less than or equal to 1.4; or, the refractive index of the optical portion is less than or equal to 1.4, and the refractive index of the third sub-layer is greater than or equal to 1.

65. the material of the optical portion comprises a photoresist. the optical portion comprises first particles, and a refractive index of the first particles is 1-2. the optical portion is a color filter; in the light emitting device and the color filter located in the same pixel opening, the color of light allowed to pass through the color filter is the same as the color of light emitted by the light emitting device. the isolation structure comprises a first sub-layer, a second sub-layer and a third sub-layer which are sequentially stacked in a direction away from the substrate; at least the third sub-layer of the isolation structure comprises a light-blocking material. the second sub-layer and the third sub-layer of the isolation structure both comprise a light-blocking material. the first sub-layer of the isolation structure and the third sub-layer of the isolation structure comprise an insulating material, and the second sub-layer of the isolation structure comprises a conductive material; the light emitting device comprises a first electrode, a light emitting portion and a second electrode which are sequentially stacked in a direction away from the substrate, and the second electrodes of two adjacent light emitting devices are connected through the second sub-layer in the isolation structure between the two adjacent light emitting devices. a surface of the isolation structure away from the substrate is provided with a plurality of grooves, and the grooves are in communication with at least one of the pixel openings. at least one groove is provided between two adjacent pixel openings, and the groove is in communication with the two adjacent pixel openings. one pixel opening is in communication with a plurality of grooves, the grooves extend in a direction away from the pixel opening, and the grooves are arranged at intervals around the pixel opening. the distance between two adjacent grooves in a surrounding direction of the grooves is equal. the depth of the groove is less than or equal to the thickness of the third sub-layer of the isolation structure. ​ ​ ​ ​ ​ ​ 2. The display panel of claim 1, wherein, ​ ​ 3. The display panel of claim 1 or 2, wherein, ​ ​ 4. The display panel of claim 3, wherein, ​ 5. The display panel of claim 4, wherein, ​ ​ 6. The display panel according to any one of claims 1 to 5, wherein ​ 7. The display panel according to any one of claims 1 to 6, wherein ​ 8. The display panel of claim 1 or 2, wherein, ​ ​ 9. The display panel of claim 8, wherein, ​ ​ 10. The display panel of claim 9, wherein, ​ 11. The display panel according to any one of claims 1 to 10, wherein ​ ​ 12. The display panel according to any one of claims 1 to 11, wherein, ​ 13. The display panel of claim 12, wherein, ​ 14. The display panel of claim 12 or 13, wherein, ​ 15. The display panel of claim 14, wherein, ​ 16. The display panel according to any one of claims 12 to 15, wherein, ​ 17. The display panel according to any one of claims 1 to 16, wherein, The material of the third sub-layer of the isolation structure and the material of the optical structure both comprise a hydrophobic material or an oleophobic material.

18. The display panel according to any one of claims 1 to 17, wherein, The isolation structure comprises a first sub-layer, a second sub-layer and a third sub-layer which are sequentially stacked in a direction away from the substrate. The light-emitting device comprises a first electrode, a light-emitting part and a second electrode which are sequentially stacked in a direction away from the substrate. The first sub-layer covers a partial area of the first electrode.

19. A manufacturing method of a display panel, comprising: forming an isolation structure on one side of a substrate; the isolation structure defines a plurality of pixel openings; forming a light-emitting device film layer of a target color and a first inorganic thin film on the substrate with the plurality of pixel openings sequentially; forming a photoresist layer on a side of the first inorganic thin film away from the substrate, the photoresist layer covering a light-emitting device region of the target color; based on the photoresist layer, removing a part of the light-emitting device film layer of the target color and the first inorganic thin film which covers an area other than the light-emitting device region of the target color, and retaining the light-emitting device film layer of the target color and the first inorganic thin film in the light-emitting device region of the target color to form a light-emitting device of the target color and a corresponding first inorganic encapsulation layer respectively, and the retained photoresist layer forms an optical structure.

20. A display device, comprising: the display panel according to any one of claims 1-18; a cover plate arranged on a light-emitting side of the display panel.

Images