Multi-station chip test device, chip test system, chip test method, and control method

Abstract

A multi-station chip test device, a chip test system, a chip test method, and a control method, relating to the technical field of semiconductor testing. A first test assembly comprises a testing machine and a plurality of probe bases distributed on the testing machine, and each probe base is provided with a test probe. A second test assembly is arranged at the top of the first test assembly; the second test assembly comprises a rotating disc and a plurality of test fixtures distributed in the circumferential direction of the rotating disc; and the plurality of test fixtures are each configured to suction a chip under test to the bottom of the corresponding test fixture and to rotate on the basis of the rotating disc. Any test fixture is configured to enable the corresponding test probe to contact the suctioned chip under test when rotating to be matched with any probe base, so as to carry out performance testing on said chip. A linear test device is replaced with a rotating disc test device, a plurality of test fixtures can match the corresponding probe bases, and performance testing is carried out on a plurality of chips under test at the same time.

Description

A multi-station chip testing device, testing system, and testing and control method Technical Field

[0001] This invention relates to the field of semiconductor testing technology, and in particular to a multi-station chip testing device, testing system, and testing and control method. Background Technology

[0002] As electronic products require electronic components to have good performance and reliability, various performance tests are needed to screen out qualified chips, thereby ensuring the performance and reliability of electronic components.

[0003] Existing testing equipment mainly uses a linear method. This method involves placing the die to be tested onto the test fixture, removing the tested die after the test is completed, and then placing the next die to be tested. Because placing the die to be tested, performing electrical performance testing, and removing the tested die are all done on the same test fixture, the required testing time is long, resulting in low equipment productivity.

[0004] Furthermore, when performing electrical performance testing on silicon carbide (SiC) chips, a testing device needs to be designed to perform the performance tests. Specifically, the testing device includes test probes that contact the SiC chips to perform performance testing. Over time, the test probes may become contaminated, leading to increased contact resistance and even probe failure. Therefore, cleaning the test probes is necessary.

[0005] In existing technologies, a separate cleaning device is typically used to clean the test probes. This requires controlling the cleaning device to move to the test probe and clean it. Since the cleaning device and the testing device are arranged independently, and each requires its own drive mechanism, they occupy a relatively large amount of space.

[0006] Summary of the Invention

[0007] One objective of this invention is to provide a multi-station chip testing device that solves the technical problem of low chip testing efficiency in the prior art.

[0008] A further objective of this invention is to simplify the structure of the test fixture and reduce its development cost.

[0009] Another object of the present invention is to provide a chip testing system having the above-mentioned multi-station chip testing equipment.

[0010] Another object of the present invention is to provide a chip testing method applicable to the above-mentioned multi-station chip testing equipment.

[0011] Another objective of this invention is to provide a multi-station chip testing device (also known as a chip testing and cleaning device) that combines cleaning functions, thereby solving the technical problem that chip testing devices and cleaning devices occupy a large space in the prior art.

[0012] Another object of the present invention is to provide a control method applicable to the above-mentioned chip testing and cleaning apparatus.

[0013] Specifically, the present invention provides a multi-station chip testing device, comprising:

[0014] The first test component includes a test machine and a plurality of probe holders distributed on the test machine, each of the probe holders being provided with a test probe;

[0015] The second test component is disposed on top of the first test component. The second test component includes a turntable and a plurality of test fixtures distributed circumferentially along the turntable. The plurality of test fixtures are configured to be able to adsorb the chip under test on their bottom and rotate according to the turntable. Each probe holder corresponds to one test fixture.

[0016] Each of the test fixtures is configured such that when rotated to engage with any of the probe holders, the corresponding test probe contacts the adsorbed chip under test to perform performance testing on the chip under test.

[0017] Optionally, the multi-station chip testing equipment also includes:

[0018] Multiple driving mechanisms are provided, each driving mechanism being connected to a test fixture. The driving mechanism is configured to drive the corresponding test fixture to descend when the corresponding test fixture rotates with the turntable to the top of any of the probe holders, so that the test probe on the corresponding probe holder contacts the adsorbed chip under test.

[0019] Optionally, the multi-station chip testing equipment also includes:

[0020] A feeding assembly is positioned near the turntable. The feeding assembly is configured to move in a controlled manner below the test fixture when the test fixture rotates to the first target position, so that the corresponding test fixture adsorbs the chip under test on the feeding assembly.

[0021] The unloading component is located near the turntable. The unloading component is configured to move in a controlled manner below the test fixture when the test fixture rotates to the second target position, so as to receive the chip under test on the corresponding test fixture.

[0022] Optionally, a plurality of the probe holders are arranged in a circular pattern on the top of the testing machine, and the included angle between two adjacent probe holders is the same as the included angle between two adjacent test fixtures.

[0023] Optionally, the multi-station chip testing equipment also includes:

[0024] Multiple temperature control components are provided, each of which is connected to a corresponding test fixture for heating or cooling the corresponding test fixture, thereby performing high-temperature testing, low-temperature testing, or room-temperature testing on the chip under test.

[0025] Optionally, the first test component further includes:

[0026] A first PCB board is mounted on top of the testing machine. The first PCB board has at least one first positioning hole. The probe holder is mounted on the first PCB board by bolts. The probe holder has a mounting position for mounting the chip under test and at least one second positioning hole located near the mounting position, so that the pin passes through the second positioning hole and the first positioning hole, thereby making the bottom of the test probe on the probe holder fully contact the first PCB board.

[0027] Optionally, the test fixture includes:

[0028] The first adsorption component is located at the bottom of the test fixture, and the interior of the first adsorption component is provided with an air channel for adsorbing the chip under test.

[0029] Optionally, the multi-station chip testing equipment also includes:

[0030] At least one first cleaning component is mounted on the turntable, the first cleaning component being configured to rotate with the turntable to the corresponding probe holder to clean the test probe on the probe holder.

[0031] Optionally, any of the first cleaning components includes at least one brush head;

[0032] The turntable is configured to controllably rotate any of the first cleaning components to the corresponding probe holder, and then controllably rotate back and forth to move the brush head back and forth, thereby cleaning the test probe on the probe holder.

[0033] Optionally, the multi-station chip testing equipment also includes:

[0034] At least one second cleaning component is mounted on the turntable, each of the second cleaning components having at least one suction cup configured to suck or blow air onto the test probe as it rotates with the turntable above the corresponding probe holder.

[0035] Optionally, the multi-station chip testing equipment also includes:

[0036] At least one visual inspection component is mounted on the turntable, and the visual inspection component is configured to rotate with the turntable to perform visual inspection on the corresponding test probe.

[0037] Optionally, the first cleaning component, the second cleaning component, or the visual inspection component is provided between two adjacent test fixtures.

[0038] In particular, the present invention also provides a multi-station chip testing system, comprising:

[0039] Feeding equipment is used to provide chips to be tested;

[0040] At least one of the above-mentioned multi-station chip testing devices is located near the loading device and is used to receive the chip under test from the loading device and perform performance testing on the chip under test.

[0041] The unloading device is located on the side of the multi-station chip testing equipment away from the loading device, and is used to remove the chip under test after performance testing has been completed on the multi-station chip testing equipment.

[0042] In particular, the present invention also provides a chip testing method applied to the above-mentioned multi-station chip testing equipment, comprising the following steps:

[0043] Control the turntable to rotate, so as to rotate any test fixture to the first target position;

[0044] The corresponding test fixture is controlled to adsorb the chip to be tested at the first target position;

[0045] The turntable is controlled to rotate at a preset angle along a first direction, and the test fixture is controlled to cooperate with the corresponding probe holder so that the corresponding test probe contacts the adsorbed chip under test, thereby performing performance testing on the chip under test. The first direction is either clockwise or counterclockwise.

[0046] Optionally, during the process of controlling the turntable to rotate along the first direction by a preset angle and controlling the test fixture to cooperate with the corresponding probe holder, the next test fixture rotates to the first target position and adsorbs the next chip to be tested;

[0047] Optionally, the step of controlling the turntable to rotate a preset angle along a first direction and controlling the test fixture to engage with the corresponding probe holder specifically includes the following steps:

[0048] The turntable is controlled to rotate by the preset angle along the first direction so that the test fixture is positioned above the corresponding probe holder;

[0049] The control drive mechanism drives the corresponding test fixture to descend, so that the test probe on the corresponding probe holder comes into contact with the adsorbed chip under test.

[0050] In particular, the present invention also provides a control method for the above-mentioned multi-station chip testing equipment with cleaning function, comprising the following steps:

[0051] When a control command is received to test the chip under test, the turntable is controlled to rotate so that any test fixture can be rotated to the first target position.

[0052] The corresponding test fixture is controlled to adsorb the chip under test at the first target position;

[0053] The turntable is controlled to rotate at a preset angle along a first direction, and the test fixture is controlled to cooperate with the corresponding probe holder so that the corresponding test probe contacts the adsorbed chip under test, thereby performing performance testing on the chip under test. The first direction is either clockwise or counterclockwise.

[0054] Optionally, the control method further includes the following steps:

[0055] When a control command is received to clean the test probes of the probe holder, the turntable is controlled to rotate, thereby driving the first cleaning component to rotate to the corresponding probe holder, and thus cleaning the test probes on the probe holder.

[0056] Optionally, upon receiving a control command to clean the test probes on the probe holder, the turntable is controlled to rotate, thereby rotating the first cleaning component to the corresponding probe holder to clean the test probes on the probe holder. This step specifically includes the following steps:

[0057] When a control command is received to clean the test probes of the probe holder, the turntable is controlled to rotate so as to drive the first cleaning component to rotate to the corresponding probe holder.

[0058] The first brush head of the first cleaning component is controlled to move downward so that the first brush head contacts the test probe on the probe holder;

[0059] The turntable is controlled to rotate back and forth, thereby driving the first brush head to move back and forth, thus performing forward cleaning of the test probe on the probe holder;

[0060] Control the first brush head to reset, and control the second brush head of the first cleaning component to move downward so that the second brush head contacts the test probe on the probe holder;

[0061] The turntable is controlled to rotate back and forth, thereby driving the second brush head to move back and forth, thus performing reverse cleaning on the test probe on the probe holder;

[0062] Control the second brush head to reset.

[0063] Optionally, after receiving a control command to clean the test probes on the probe holder, controlling the turntable to rotate so as to rotate the first cleaning component to the corresponding probe holder to clean the test probes on the probe holder, the control method further includes the following steps:

[0064] Control the turntable to rotate, so as to drive the second cleaning component to rotate above the corresponding probe holder;

[0065] After controlling the suction cup of the second cleaning component to move downward, control the suction cup to suck or blow air to clean the test probe on the probe holder;

[0066] Control the suction cup to reset.

[0067] According to some embodiments of the present invention, a first testing component includes a testing machine and a plurality of probe holders distributed on the testing machine, each probe holder having a test probe. A second testing component is disposed on top of the first testing component, and the second testing component includes a turntable and a plurality of test fixtures distributed circumferentially along the turntable. The plurality of test fixtures are configured to adsorb the chip under test onto their bottoms, and each probe holder corresponds to one test fixture as the turntable rotates. Any test fixture is configured such that when it rotates to engage with any probe holder, the corresponding test probe contacts the adsorbed chip under test for performance testing. The above technical solution uses a turntable-type testing device instead of a linear testing device, and multiple test fixtures can engage with corresponding probe holders to simultaneously perform performance testing on multiple chips under test, thereby reducing testing time and improving the testing efficiency of the chips under test.

[0068] Furthermore, since the test fixture can hold the chip under test (DUT) at its bottom, the test probes on the probe holder can directly contact the DUT. There is no need to set up adapter probes and adapter boards inside the test fixture to connect the DUT and the test probes, which simplifies the structure of the test fixture and reduces the development cost of the test fixture.

[0069] According to other embodiments of the present invention, a second testing component is located below the turntable and has at least one probe holder with test probes. A testing fixture is mounted on the turntable and is used to attract the chip under test (DUT). The testing fixture rotates with the turntable to move the DUT to the corresponding probe holder, so that the DUT contacts the corresponding test probe, thereby testing the DUT. A first cleaning component is mounted on the turntable and is configured to rotate with the turntable to the corresponding probe holder to clean the test probes on the probe holder. It can be understood that the testing fixture and the first cleaning component are integrated on the same turntable. A single turntable can drive the testing fixture and the first cleaning component to complete the chip performance testing and test probe cleaning respectively, saving layout space and eliminating the need for a separate drive mechanism for the first cleaning component, thus reducing development costs.

[0070] The above and other objects, advantages and features of the present invention will become more apparent to those skilled in the art from the following detailed description of specific embodiments of the invention in conjunction with the accompanying drawings. Attached Figure Description

[0071] The following sections will describe some specific embodiments of the invention in a detailed manner by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar parts or portions. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:

[0072] Figure 1 is a schematic structural diagram of a multi-station chip testing device according to an embodiment of the present invention;

[0073] Figure 2 is a schematic structural diagram of the second test component, probe holder, loading component, and unloading component in the multi-station chip testing equipment shown in Figure 1.

[0074] Figure 3 is a schematic structural diagram of the first test component in the multi-station chip testing equipment shown in Figure 1;

[0075] Figure 4 is a schematic structural diagram of a test fixture and probe holder according to an embodiment of the present invention;

[0076] Figure 5 is a schematic structural diagram of a probe holder according to an embodiment of the present invention;

[0077] Figure 6 is a schematic structural diagram of the first adsorption component of a test fixture according to an embodiment of the present invention;

[0078] Figure 7 is a schematic cross-sectional view of a first adsorption component according to an embodiment of the present invention;

[0079] Figure 8 is a schematic structural diagram of the driving mechanism of a multi-station chip testing device according to an embodiment of the present invention;

[0080] Figure 9 is a schematic structural diagram of a multi-station chip testing device according to another embodiment of the present invention;

[0081] Figure 10 is a schematic structural diagram of a feeding assembly according to an embodiment of the present invention;

[0082] Figure 11 is a schematic enlarged view of the suction nozzle of a feeding assembly according to an embodiment of the present invention;

[0083] Figure 12 is a schematic cross-sectional view of a first test component according to an embodiment of the present invention;

[0084] Figure 13 is a schematic structural diagram of a chip testing and cleaning apparatus according to an embodiment of the present invention;

[0085] Figure 14 is a schematic structural diagram of a test component according to an embodiment of the present invention;

[0086] Figure 15 is a schematic structural diagram of the probe holder in the test assembly shown in Figure 13;

[0087] Figure 16 is a schematic structural diagram of a test fixture and probe holder according to an embodiment of the present invention;

[0088] Figure 17 is a schematic structural diagram of the adsorption assembly of a test fixture according to an embodiment of the present invention;

[0089] Figure 18 is a schematic structural diagram of a first cleaning component according to an embodiment of the present invention;

[0090] Figure 19 is a schematic front view of a second cleaning component according to an embodiment of the present invention;

[0091] Figure 20 is a schematic side view of a second cleaning component according to an embodiment of the present invention;

[0092] Figure 21 is a schematic structural diagram of a vision detection component according to an embodiment of the present invention;

[0093] Figure 22 is a schematic connection block diagram of a multi-station chip testing system according to an embodiment of the present invention;

[0094] Figure 23 is a schematic flowchart of a chip testing method using a multi-station chip testing device according to an embodiment of the present invention;

[0095] Figure 24 is a schematic flowchart of a chip testing method for a multi-station chip testing device according to another embodiment of the present invention;

[0096] Figure 25 is a schematic flowchart of a control method for a chip testing and cleaning apparatus according to an embodiment of the present invention;

[0097] Figure 26 is a schematic flowchart of a control method for a chip testing and cleaning apparatus according to another embodiment of the present invention;

[0098] Figure 27 is a schematic flowchart of a control method for a chip testing and cleaning apparatus according to yet another embodiment of the present invention.

[0099] Figure label:

[0100] 1000 - Chip testing system; 300 - Loading equipment; 400 - Unloading equipment; 100 - Multi-station chip testing equipment / chip testing and cleaning device; 200 - Chip under test; 10 - Second testing component; 20 - First testing component; 30 - Unloading component; 40 - Loading component; 11 - Turntable; 12 - Test fixture; 13 - Drive mechanism; 21 - Testing machine; 22 - Probe holder; 121 - First adsorption component; 221 - Test probe; 31 - First slide rail; 32 - Second slide rail; 33 - Second adsorption component; 331 - Nozzle; 332 - Vacuum adsorption airway; 122 - Air nozzle; 123 - First airway; 124 - Second airway; 23 - First PCB board; 24 - Support component. 241-First insulating board, 242-Metal plate, 243-Second insulating board, 25-Second PCB board, 70-Motor, 80-First cleaning component, 50-Second cleaning component, 60-Vision inspection component, 81-Brush head, 82-First driving component, 83-Angle adjustment component, 831-First adjusting component, 832-Second adjusting component, 833-Mounting hole, 834-Mounting slot, 51-Suction cup, 52-Second driving component, 53-Air tube, 61-Light source, 62-Lens, 63-Camera. Detailed Implementation

[0101] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0102] In the description of this invention, it should be understood that the terms "upper", "lower", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0103] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature, that is, include one or more of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. When a feature "includes or contains" one or more of the features it encompasses, unless otherwise specifically stated, this indicates that other features are not excluded and may be further included.

[0104] Unless otherwise expressly specified and limited, the terms "connection," "installation," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art should be able to understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0105] Unless otherwise specified, all terms (including technical and scientific terms) used in the description of this embodiment have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0106] Figure 1 is a schematic structural diagram of a multi-station chip testing device 100 according to an embodiment of the present invention. Figure 2 is a schematic structural diagram of the second testing component 10, probe holder 22, loading component 40, and unloading component 30 in the multi-station chip testing device 100 shown in Figure 1. Figure 3 is a schematic structural diagram of the first testing component 20 in the multi-station chip testing device 100 shown in Figure 1. Figure 4 is a schematic structural diagram of the testing fixture 12 and probe holder 22 according to an embodiment of the present invention. Figure 5 is a schematic structural diagram of the probe holder 22 according to an embodiment of the present invention. As shown in Figures 1 to 5, in one embodiment, the multi-station chip testing device 100 includes a first testing component 20 and a second testing component 10. The first testing component 20 includes a testing machine 21 and a plurality of probe holders 22 distributed on the testing machine 21, each probe holder 22 being provided with a test probe 221. The second test assembly 10 is disposed on top of the first test assembly 20. The second test assembly 10 includes a turntable 11 and a plurality of test fixtures 12 distributed circumferentially along the turntable 11. The plurality of test fixtures 12 are configured to adsorb the chip under test 200 onto their bottoms, and each probe holder 22 corresponds to one test fixture 12 as the turntable 11 rotates. Any test fixture 12 is configured such that when it rotates to engage with any probe holder 22, the corresponding test probe 221 contacts the adsorbed chip under test 200 to perform performance testing on the chip under test 200.

[0107] This embodiment uses a rotary testing device instead of a linear testing device. Multiple test fixtures 12 can cooperate with corresponding probe holders 22 to perform performance tests on multiple chips under test 200 at the same time, thereby reducing testing time and improving the testing efficiency of the chips under test 200.

[0108] Furthermore, in this embodiment, since the test fixture 12 can adsorb the chip under test 200 on its bottom, the test probe 221 on the probe holder 22 can directly contact the chip under test 200. There is no need to set up an adapter probe and an adapter board in the test fixture 12 to connect the chip under test 200 and the test probe 221, which simplifies the structure of the test fixture 12 and reduces the development cost of the test fixture 12.

[0109] Figure 6 is a schematic structural diagram of the first adsorption component 121 of the test fixture 12 according to an embodiment of the present invention, and Figure 7 is a schematic cross-sectional view of the first adsorption component 121 according to an embodiment of the present invention. As shown in Figures 6 and 7, in this embodiment, the test fixture 12 includes a first adsorption component 121, which is located at the bottom of the test fixture 12. The first adsorption component 121 has an air channel for adsorbing the chip 200 to be tested inside. The first adsorption component 121 has a first air channel 123 arranged horizontally and a second air channel 124 arranged vertically inside, and the first air channel 123 communicates with the second air channel 124. An air nozzle 122 is provided at one end of the first air channel 123, and the air nozzle 122 is connected to a vacuum pumping device. The chip 200 to be tested is located below the second air channel 124. The vacuum pumping device adsorbs the chip 200 to be tested sequentially through the air nozzle 122, the first air channel 123, and the second air channel 124. Here, the functional surface of the chip under test 200 faces downward, and the probe holder 22 has a test probe 221. The test probe 221 contacts the functional surface of the chip under test 200 to perform performance testing on the chip under test 200.

[0110] Figure 8 is a schematic structural diagram of the drive mechanism 13 of a multi-station chip testing device 100 according to an embodiment of the present invention. As shown in Figure 8, the multi-station chip testing device 100 further includes multiple drive mechanisms 13, each drive mechanism 13 being connected to a test fixture 12. The drive mechanism 13 is configured to drive the corresponding test fixture 12 to descend when it rotates with the turntable 11 to the top of any probe holder 22, so that the test probe 221 on the corresponding probe holder 22 contacts the adsorbed chip under test 200, thereby enabling the testing machine 21 to perform performance testing on the chip under test 200. Here, the drive mechanism 13 is a motor, and the drive mechanism 13 is mounted on the top of the corresponding test fixture 12.

[0111] Figure 9 is a schematic structural diagram of a multi-station chip testing device 100 according to another embodiment of the present invention, and Figure 10 is a schematic structural diagram of a feeding assembly 30 according to another embodiment of the present invention. As shown in Figures 9 and 10, in this embodiment, the multi-station chip testing device 100 further includes a loading assembly 40 and a feeding assembly 30. The loading assembly 40 is disposed near the turntable 11 and is configured to move under the test fixture 12 in a controlled manner when the test fixture 12 rotates to a first target position, so that the corresponding test fixture 12 adsorbs the chip under test 200 on the loading assembly 40. The feeding assembly 30 is disposed near the turntable 11 and is configured to move under the test fixture 12 in a controlled manner when the test fixture 12 rotates to a second target position, so as to receive the chip under test 200 on the corresponding test fixture 12. Here, the loading assembly 40 and the feeding assembly 30 have the same structure. In other embodiments, the structures of the loading assembly 40 and the feeding assembly 30 may also be different. The feeding assembly 40 and the unloading assembly 30 are located on the left and right sides of the turntable 11, respectively.

[0112] In another embodiment, if there are multiple multi-station chip testing devices 100, then the unloading component 30 of the previous multi-station chip testing device 100 becomes the loading component 40 of the next multi-station chip testing device 100. This can be understood as the unloading component 30 of the previous multi-station chip testing device 100 receiving the chip under test 200 from the test fixture 12 of the previous multi-station chip testing device 100 and moving the chip under test 200 to the loading position of the next multi-station chip testing device 100, so that the test fixture 12 of the next multi-station chip testing device 100 can absorb the chip under test 200 from the unloading component 30, as shown in Figure 9.

[0113] In some embodiments, the number of multi-station chip testing devices 100 is two. The test fixture 12 of one of the two multi-station chip testing devices 100 is used for high-temperature testing of the chip under test 200, and the test fixture 12 of the other multi-station chip testing device 100 is used for low-temperature testing of the chip under test 200. This embodiment uses two multi-station chip testing devices 100 to perform high-temperature and low-temperature testing on the chip under test 200 respectively, eliminating the need to heat the chip under test 200 from low temperature to high temperature and then cool it from high temperature to low temperature on the same turntable 11, saving testing time and increasing equipment productivity.

[0114] As shown in Figure 10, the unloading assembly 30 includes a first slide rail 31, a second slide rail 32, and a second adsorption assembly 33. The first slide rail 31 extends along a first direction. The second slide rail 32 extends along a second direction perpendicular to the first direction and is connected to the first slide rail 31. The second adsorption assembly 33 is mounted on the second slide rail 32 and is used to adsorb the chip under test 200. The second adsorption assembly 33 can move with the first slide rail 31 and the second slide rail 32 to move to the second target position of the corresponding multi-station chip testing equipment 100 and receive the chip under test 200. If the chip under test 200 needs to be tested on another multi-station chip testing equipment 100, the second adsorption assembly 33 will continue to move, transferring the chip under test 200 to the other multi-station chip testing equipment 100, so that the test fixture 12 on the other multi-station chip testing equipment 100 adsorbs the chip under test 200. If the chip under test 200 does not need to be tested on another multi-station chip testing device 100, the second adsorption component 33 moves to the second target position and accepts the chip under test 200 before directly unloading it, that is, moving to the unloading device 400. This can be understood as follows: if the unloading component 30 is located between the two multi-station chip testing devices 100, the unloading component 30 needs to both unload and load the chip. If the unloading component 30 is located between the multi-station chip testing device 100 and the unloading device 400, then the unloading component 30 only needs to unload the chip.

[0115] Figure 11 is a schematic enlarged view of the suction nozzle 331 of the feeding assembly 30 according to an embodiment of the present invention. As shown in Figure 11, in this embodiment, the second adsorption assembly 33 has a suction nozzle 331 on its top. The top of the suction nozzle 331 has a mounting position for placing the chip under test 200. The suction nozzle 331 has a vacuum adsorption channel 332 inside, which communicates with the mounting position to adsorb the chip under test 200 on the mounting position when a vacuum is drawn, thus preventing the chip under test 200 from slipping during the transfer process. Here, the second adsorption assembly 33 adopts a linear rotary actuator, i.e., a ZR actuator, which can rotate to align with the chip under test 200, thereby better supporting the chip under test 200.

[0116] In this embodiment, multiple probe holders 22 are arranged in a circle on the top of the test machine 21. The included angle between two adjacent probe holders 22 is the same as the included angle between two adjacent test fixtures 12, so that the test fixture 12 can be aligned with the next probe holder 22 after rotating a certain angle, and multiple chips under test 200 can be tested simultaneously.

[0117] In this embodiment, the multi-station chip testing equipment 100 further includes multiple temperature control components, each connected to a corresponding test fixture 12, for heating or cooling the corresponding test fixture 12, thereby performing high-temperature testing, low-temperature testing, or room-temperature testing on the chip 200 under test. Here, the temperature control components include a heating element and a vortex tube. The heating element is disposed on top of the first adsorption component 121 for heating the first adsorption component 121, thereby heating the adsorbed chip 200 under test. The first adsorption component 121 has a third air channel connected to the vortex tube, which generates cold air to enter the third air channel, thereby cooling the first adsorption component 121 and the adsorbed chip 200 under test.

[0118] Figure 12 is a schematic cross-sectional view of a first test assembly 20 according to an embodiment of the present invention. As shown in Figure 12, in this embodiment, the first test assembly 20 further includes a first PCB board 23, which is mounted on top of the test machine 21. The first PCB board 23 has at least one first positioning hole. A probe holder 22 is mounted on the first PCB board 23 by bolts. The probe holder 22 has a mounting position for mounting a chip under test 200 and at least one second positioning hole located near the mounting position, such that a pin passes through the second positioning hole and the first positioning hole, thereby ensuring that the bottom of the test probe 221 on the probe holder 22 is in full contact with the first PCB board 23.

[0119] This embodiment is equivalent to using a pivot pin to reduce the gap between the probe holder 22 and the first PCB board 23, thereby enabling the test probe 221 to press against the first PCB board 23, ensuring normal circuit conduction, and ensuring the stability of the test of the chip 200 under test.

[0120] In this embodiment, the first test component 20 further includes a second PCB board 25, which is mounted on the test machine 21 and located between the first PCB board 23 and the test machine 21. The second PCB board 25 is connected to the first PCB board 23. This is equivalent to the second PCB board 25 being located above the test machine 21, and the first PCB board 23 being located above the second PCB board 25. The circuit passes through the metal contacts of the chip under test 200, sequentially through the test probe 221, the first PCB board 23, and the second PCB board 25 to the test machine 21.

[0121] In this embodiment, the first test component 20 further includes a support component 24, which is disposed between the first PCB board 23 and the second PCB board 25, and is used to support the first PCB board 23 when the chip under test 200 is tested. Since the probe holder 22 of the chip under test 200 is subjected to a pressure of about 300N when it is tested, and the first PCB board 23 is made of glass fiber, it will deform significantly under pressure. In order to reduce the amount of deformation, this embodiment adds a support component 24 under the first PCB board 23, thereby reducing the amount of deformation of the first PCB board 23.

[0122] In this embodiment, the support assembly 24 further includes a metal plate 242, a first insulating plate 241, and a second insulating plate 243. The first insulating plate 241 is disposed between the metal plate 242 and the first PCB board 23 for electrical isolation between the metal plate 242 and the first PCB board 23. The second insulating plate 243 is disposed between the metal plate 242 and the second PCB board 25 for electrical isolation between the metal plate 242 and the second PCB board 25. Here, the metal plate 242 is made of 45# steel, used to provide stress support for the first PCB board 23 during the testing of the chip under test 200, ensuring that the deformation of the first PCB board 23 is less than 50 micrometers. In other embodiments, the material of the metal plate 242 can be selected according to specific design requirements.

[0123] It can be understood that the first test component 20 is arranged from top to bottom as follows: probe holder 22, first PCB board 23, first insulating board 241, metal plate 242, second insulating board 243, second PCB board 25 and test machine 21, as shown in Figure 12.

[0124] Figure 13 is a schematic structural diagram of a chip testing and cleaning apparatus 100 according to an embodiment of the present invention; Figure 14 is a schematic structural diagram of a test assembly 20 according to an embodiment of the present invention; Figure 15 is a schematic structural diagram of the probe holder 22 in the test assembly 20 shown in Figure 13; Figure 16 is a schematic structural diagram of a test fixture 12 and probe holder 22 according to an embodiment of the present invention; and Figure 17 is a schematic structural diagram of the adsorption component (also referred to as the first adsorption component) 121 of the test fixture 12 according to an embodiment of the present invention. As shown in Figures 13 to 17, in a specific embodiment, the chip testing and cleaning apparatus 100 includes a turntable 11, a test assembly (also referred to as the first test assembly) 20, at least one test fixture 12, and at least one first cleaning component 80. The turntable 11 is configured to rotate in a controlled manner. The turntable 11 and the test fixture 12 may constitute a second test assembly 10. The test assembly 20 is located below the turntable 11 and has at least one probe holder 22 with test probes 221 on it. A test fixture 12 is mounted on a turntable 11. The test fixture 12 is used to adsorb the chip under test 200 and rotates with the turntable 11 to move the chip under test 200 to the corresponding probe holder 22, so that the chip under test 200 contacts the corresponding test probe 221, thereby testing the chip under test 200. A first cleaning component 80 is mounted on the turntable 11 and is configured to rotate with the turntable 11 to the corresponding probe holder 22 to clean the test probe 221 on the probe holder 22. Here, the test assembly 20 includes a test machine 21 located below the turntable 11, and the probe holder 22 is mounted on the top of the test machine 21 (see Figure 14). A motor 70 is mounted on the top of the turntable 11, and the motor 70 drives the turntable 11 to rotate.

[0125] This embodiment integrates the test fixture 12 and the first cleaning component 80 on the same turntable 11. The test fixture 12 and the first cleaning component 80 can be driven by a single turntable 11 to complete the performance testing of the chip and the cleaning of the test probe 221, respectively, saving layout space and eliminating the drive mechanism 13 of the first cleaning component 80, thus saving development costs.

[0126] In some embodiments, as shown in FIG13, there are multiple test fixtures 12 and multiple probe holders 22. Multiple test fixtures 12 can cooperate with corresponding probe holders 22 to perform performance tests on multiple chips under test at the same time. In this case, the chip testing and cleaning device 100 can be considered as a multi-station chip testing device 100 with cleaning function.

[0127] In this embodiment, the bottom of the test fixture 12 has an adsorption component 121 for adsorbing the chip 200 under test. The adsorption component 121 has an air channel inside, which is connected to a vacuum pumping device to evacuate the air channel, thereby adsorbing the chip 200 under test onto the bottom of the test fixture 12.

[0128] In some specific embodiments, any first cleaning component 80 includes at least one brush head 81. The turntable 11 is configured to controllably rotate any first cleaning component 80 to the corresponding probe holder 22, and then controllably rotate back and forth to move the brush head 81 back and forth, thereby cleaning the test probe 221 on the probe holder 22. In this embodiment, the cleaning speed of the brush head 81 can be controlled by controlling the rotation speed of the turntable 11.

[0129] This embodiment automates the cleaning of the test probe 221, saving labor costs and avoiding situations where manual cleaning is inadequate or the test probe 221 is damaged. It also uses a brush head 81 instead of a cleaning pad, which can effectively clean the test probe 221.

[0130] Figure 18 is a schematic structural diagram of a first cleaning component 80 according to an embodiment of the present invention. As shown in Figure 18, in a preferred embodiment, the first cleaning component 80 includes a plurality of brush heads 81 arranged side by side. The plurality of brush heads 81 are configured to rotate with the turntable 11 and sequentially clean the test probe 221 on the probe holder 22. That is, each first cleaning component 80 has a plurality of brush heads 81, which can be set to two. The turntable 11 first moves one of the brush heads 81 of the first cleaning component 80 to the probe holder 22, and then rotates back and forth to move the brush head 81 back and forth, thereby cleaning the test probe 221. Then, it moves the other brush head 81 of the first cleaning component 80 to a position opposite to the probe holder 22, and then rotates back and forth to move the brush head 81 to clean the test probe 221. Here, one brush head 81 performs forward cleaning and the other brush head 81 performs reverse cleaning, which can improve the cleaning effect of the test probe 221. In other embodiments, the number of brush heads 81 can also be set according to specific design requirements.

[0131] Referring to Figure 13, the chip testing and cleaning apparatus 100 further includes at least one drive mechanism 13, each drive mechanism 13 being mounted on a test fixture 12. The drive mechanism 13 is configured to controllably drive the test fixture 12 downwards as it rotates with the turntable 11 above the corresponding probe holder, so that the chip 200 adsorbed at its bottom contacts the corresponding test probe 221. Here, the drive mechanism 13 is mounted on top of the test fixture 12.

[0132] In some alternative embodiments, as shown in FIG13, if there are multiple test fixtures 12, then there are also multiple drive mechanisms 13.

[0133] Figure 19 is a schematic front view of a second cleaning component 50 according to an embodiment of the present invention, and Figure 20 is a schematic side view of a second cleaning component 50 according to an embodiment of the present invention. As shown in Figures 19 and 20, and referring to Figure 13, in some specific embodiments, the chip testing and cleaning apparatus 100 further includes at least one second cleaning component 50, which is mounted on a turntable 11. Each second cleaning component 50 has at least one suction cup 51, which is configured to suction or blow air onto the test probe 221 when it rotates with the turntable 11 above the corresponding probe holder. Here, the suction cup 51 has an air tube 53 inside, which is connected to an external air supply device. The cleaning force can be controlled by controlling the pressure of the air tube 53. The second cleaning component 50 cleans the test probe 221 after the brush head 81 has finished cleaning it. After the brush head 81 of the first cleaning component 80 has finished cleaning, the turntable 11 rotates and drives the second cleaning component 50 to move to the probe seat 22. The air supply device blows air with positive pressure and sucks up foreign objects after cleaning through the air pipe 53, thereby preventing foreign objects after cleaning by the brush head 81 from remaining at the test probe 221, which can further improve the cleaning effect.

[0134] Figure 21 is a schematic structural diagram of a visual inspection component 60 according to an embodiment of the present invention. As shown in Figure 21 and referring to Figure 13, in some specific embodiments, the chip testing and cleaning apparatus 100 further includes at least one visual inspection component 60. The visual inspection component 60 is mounted on a turntable 11 and is configured to rotate with the turntable 11 to perform visual inspection on the corresponding test probe 221. The visual inspection component 60 can observe the dirt condition of the test probe 221 before cleaning it, and observe the test probe 221 again after cleaning by the first cleaning component 80 and the second cleaning component 50 to observe the cleaning effect. Here, the visual inspection component 60 includes a light source 61, a lens 62, and a camera 63.

[0135] In some specific embodiments, the first cleaning component 80 includes at least one first driving member 82, each first driving member 82 being connected to a brush head 81. The first driving member 82 is configured to controllably drive the brush head 81 to move vertically, thereby adjusting the height of the brush head 81. Specifically, when the brush head 81 moves with the turntable 11 to the probe holder 22, the brush head 81 is positioned above the probe holder 22. The first driving member 82 needs to drive the brush head 81 downwards to a position where it contacts the test probe 221. Then, the turntable 11 rotates back and forth, thereby driving the brush head 81 to move back and forth. This embodiment, by setting the first driving member 82, can adjust the height of the brush head 81 according to the height of different probe holders 22, thus meeting the cleaning needs of probe holders 22 at different heights. Here, if the first driving member 82 is not set, the brush head 81 directly contacts the test probe 221 on the probe holder 22 after rotating with the turntable 11, without needing to adjust the position of the brush head 81 vertically. The first driving member 82 is a cylinder.

[0136] In a preferred embodiment, the first cleaning component 80 further includes at least one angle adjustment component 83, each angle adjustment component 83 being connected to a first drive component 82 and a brush head 81 for adjusting the angle of the brush head 81. This embodiment allows the angle of the brush head 81 to be adjusted according to cleaning needs, making the cleaning of the test probe 221 more convenient.

[0137] In some specific embodiments, the angle adjustment assembly 83 includes a first adjustment member 831 and a second adjustment member 832. The first adjustment member 831 is mounted on the first drive member 82 and has at least one set of mounting holes 833, each set of mounting holes 833 including a plurality of mounting holes 833 arranged in an arc shape at intervals. The second adjustment member 832 has at least one arc-shaped mounting groove 834 and is connected to the brush head 81. Each mounting groove 834 corresponds to a set of mounting holes 833. The second adjustment member 832 is configured to rotate relative to the first adjustment member 831 and is connected to the first adjustment member 831 by bolts passing through the mounting groove 834 and the mounting holes 833. Referring to Figure 18, the first adjustment member 831 has two sets of mounting holes 833 arranged opposite to each other on the left and right sides of the brush head 81, each set of mounting holes 833 having three mounting holes 833. All mounting holes 833 on each first adjustment member 831 are located on the same circle. The second adjusting member 832 has two mounting slots 834 arranged opposite each other on the left and right sides of the brush head 81, and the two mounting slots 834 are located on the same circle. In other embodiments, the number of mounting holes 833 can also be set according to specific design requirements. In this embodiment, the second adjusting member 832 can be manually adjusted so that the second adjusting member 832 rotates relative to the first adjusting member 831. After rotating to the target angle, the second adjusting member 832 and the first adjusting member 831 can be connected by bolts. Since the brush head 81 is connected to the second adjusting member 832, the angle of the brush head 81 can be adjusted while the second adjusting member 832 rotates.

[0138] In some specific embodiments, there are multiple test fixtures 12, and a first cleaning component 80, a second cleaning component 50, or a visual inspection component 60 are provided between two adjacent test fixtures 12, as shown in Figure 13. There are also multiple probe holders 22. When the turntable 11 rotates to a position where each probe holder 22 corresponds to one test fixture 12, performance testing can be performed on the chips 200 adsorbed on multiple test fixtures 12 simultaneously, improving chip testing efficiency.

[0139] In some specific embodiments, there are multiple first cleaning components 80. When the turntable 11 rotates to a position where multiple first cleaning components 80 correspond one-to-one with multiple probe holders 22, the requirement to clean the test probes 221 on multiple probe holders 22 at the same time can be met, thus improving the cleaning efficiency.

[0140] In some specific embodiments, the second cleaning component 50 includes at least one second driving member 52, each second driving member 52 being connected to a suction cup 51. The second driving member 52 is configured to controllably drive the suction cup 5131 to move vertically, thereby adjusting the height of the suction cup 51. Here, when the turntable 11 drives the second cleaning component 50 to rotate to the probe holder 22, the second driving member 52 drives the suction cup 51 to move downwards, and then blows or sucks air. On the one hand, the second driving member 52 can drive the suction cup 51 downwards to a position closer to the probe holder 22, which can effectively blow away or suck up foreign objects, thereby improving the cleaning effect. On the other hand, the second driving member 52 can adjust the height of the suction cup 51 according to the height of different probe holders 22, which can meet the cleaning needs of probe holders 22 of different heights and realize the universality of the chip testing and cleaning device 100. The second driving member 52 is a cylinder.

[0141] Figure 22 is a schematic connection block diagram of a multi-station chip testing system 1000 according to an embodiment of the present invention. As shown in Figure 22, in this embodiment, the multi-station chip testing system 1000 includes a loading device 300, at least one multi-station chip testing device 100 from any of the above embodiments, and a unloading device 400. The multi-station chip testing device 100 is located near the loading device 300 and is used to receive the chip under test 200 from the loading device 300 and perform performance testing on the chip under test 200. The unloading device 400 is located on the side of the multi-station chip testing device 100 away from the loading device 300 and is used to remove the chip under test 200 from the multi-station chip testing device 100 after performance testing has been completed. Here, the loading device 300 is connected to the nearest loading component 40, and the unloading device 400 is connected to the nearest unloading component 30. This can be understood as follows: the loading device 300 places the chip to be tested 200 on the loading component 40, and the unloading component 30 places the chip after testing on the unloading device 400.

[0142] Figure 23 is a schematic flowchart of a chip testing method using a multi-station chip testing apparatus 100 according to an embodiment of the present invention. As shown in Figure 23, in this embodiment, the chip testing method applied to the multi-station chip testing apparatus 100 of any of the above embodiments includes the following steps:

[0143] Step S100: Control the turntable 11 to rotate, so as to drive any test fixture 12 to rotate to the first target position;

[0144] Step S200: Control the corresponding test fixture 12 to adsorb the chip to be tested 200 at the first target position;

[0145] In step S300, the turntable 11 is controlled to rotate at a preset angle along the first direction, and the test fixture 12 is controlled to cooperate with the corresponding probe holder 22 so that the corresponding test probe 221 contacts the adsorbed chip under test 200, thereby performing performance testing on the chip under test 200. The first direction is either clockwise or counterclockwise.

[0146] Figure 24 is a schematic flowchart of a chip testing method of a multi-station chip testing apparatus 100 according to another embodiment of the present invention. As shown in Figure 24, in this embodiment, step S300 includes the following steps:

[0147] Step S310: Control the turntable 11 to rotate along the first direction by a preset angle so that the test fixture 12 is positioned above the corresponding probe holder 22;

[0148] In step S320, the control drive mechanism 13 drives the corresponding test fixture 12 to descend so that the test probe 221 on the corresponding probe holder 22 comes into contact with the adsorbed chip 200.

[0149] In this embodiment, while controlling the turntable 11 to rotate a preset angle along a first direction and controlling the test fixture 12 to engage with the corresponding probe holder 22, the next test fixture 12 rotates to the first target position and picks up the next chip under test 200. Here, the preset angle is set according to specific design requirements, and the preset angle is the same as the angle between two adjacent test fixtures 12. The first direction is either counterclockwise or clockwise.

[0150] In this embodiment, there are six test fixtures 12 and three probe holders 22. The angle between any two adjacent test fixtures 12 is 60°, and the angle between any two adjacent probe holders 22 is also 60°. Each probe holder 22 corresponds to one test fixture 12. The three probe holders 22 perform different performance tests on the chip under test 200, such as AC, DC, and avalanche tests, as shown in Figure 2. In Figure 2, the leftmost test fixture 12 is named Test Fixture 1, and the others are named Test Fixture 2, Test Fixture 3, Test Fixture 4, Test Fixture 5, and Test Fixture 6 in a counter-clockwise direction. The leftmost probe holder 22 is named Probe Holder 1, and the others are named Probe Holder 2 and Probe Holder 3 in a counter-clockwise direction. The loading assembly 40 is located below the test fixture 1. When testing the chip under test 200, test fixture 1 picks up the chip under test 200 from the loading assembly 40. Then, turntable 11 rotates counterclockwise by 60°. At this time, test fixture 1 is above probe holder 1, and test fixture 6 is above the loading assembly 40. Driven by drive mechanism 13, test fixture 1 moves downward to engage with probe holder 1 to perform performance testing on the chip under test 200. Simultaneously, test fixture 6 picks up the chip under test 200 from the loading assembly 40. Then, turntable 11 continues to rotate counterclockwise by 60°. At this time, test fixture 1 is above probe holder 2, and test fixture 6 is above probe holder 1. Driven by drive mechanism 13, test fixture 1 moves downward to engage with probe holder 2 to perform performance testing on the corresponding chip under test 200. Test fixture 6 moves downward to engage with probe holder 1 under drive mechanism 13 to perform performance testing on the corresponding chip under test 200. Simultaneously, test fixture 5 picks up the chip under test 200 from the loading assembly 40. Then, turntable 11 continues to rotate 60° counterclockwise. At this point, test fixture 1 is positioned above probe holder 3, test fixture 6 is positioned above probe holder 2, and test fixture 5 is positioned above probe holder 1. Test fixture 3, driven by drive mechanism 13, moves downward to engage with probe holder 3 to perform performance testing on the corresponding chip under test 200. Test fixture 6, driven by drive mechanism 13, moves downward to engage with probe holder 2 to perform performance testing on the corresponding chip under test 200. Test fixture 5, driven by drive mechanism 13, moves downward to engage with probe holder 1 to perform performance testing on the chip under test 200. In other words, this embodiment can simultaneously perform performance testing on three chips under test 200. Then, turntable 11 continues to rotate 60°, test fixture 1 rotates to the second target position, test fixture 6 is positioned above probe holder 3, test fixture 5 is positioned above probe holder 2, and test fixture 4 is positioned above test fixture 1, continuing performance testing.The unloading component 30 moves to the bottom of the test fixture 1 to receive the chip under test 200 at the test fixture 1, and moves the chip under test 200 to the first target position of the next multi-station chip testing equipment 100, so that the test fixture 12 on another turntable 11 can continue to perform performance testing on the chip under test 200.

[0151] Figure 25 is a schematic flowchart of a control method for a chip testing and cleaning apparatus 100 according to an embodiment of the present invention. As shown in Figure 25, in this embodiment, the control method includes the following steps:

[0152] Step S101: When a control command to test the chip 200 is received, the turntable 11 is controlled to rotate so as to drive any test fixture 12 to rotate to the first target position.

[0153] Step S201: Control the corresponding test fixture 12 to adsorb the chip 200 under test at the first target position;

[0154] In step S301, the turntable 11 is controlled to rotate by a preset angle along the first direction, and the test fixture 12 is controlled to cooperate with the corresponding probe holder 22 so that the corresponding test probe 221 contacts the adsorbed chip under test 200, thereby performing performance testing on the chip under test 200. The first direction is either clockwise or counterclockwise. Here, the preset angle can be set according to specific design requirements.

[0155] In step S101, a feeding component is provided below the first target position. The feeding component has a chip under test 200. When the corresponding test fixture 12 rotates to the first target position, the chip under test 200 on the feeding component can be directly adsorbed by the adsorption component 121.

[0156] In some specific embodiments, step S301 specifically includes the following steps:

[0157] Step 1: Control the turntable 11 to rotate by a preset angle along the first direction so that the test fixture 12 is positioned above the corresponding probe holder 22;

[0158] Step two: Control the corresponding drive mechanism 13 to drive the test fixture 12 downward so that the corresponding test probe 221 contacts the adsorbed chip 200 under test. Here, the drive mechanism 13 is installed on the top of the test fixture 12.

[0159] In this embodiment, the control method further includes the following steps:

[0160] In step S401, upon receiving a control command to clean the test probe 221 of the probe holder 22, the turntable 11 is controlled to rotate, thereby driving the first cleaning component 80 to rotate to the corresponding probe holder 22, thus cleaning the test probe 221 on the probe holder 22. It should be noted that there is no sequential relationship between steps S401 and S101.

[0161] In this embodiment, the turntable 11 can be controlled to rotate according to control commands, so that the test fixture 12 rotates to the probe holder 22 to perform performance testing on the chip under test 200; or the first cleaning component 80 rotates to the probe holder 22 to clean the test probes 221 on the probe holder. Through the turntable 11 combined with the control program, the chip testing and cleaning device 100 can realize the functions of performing performance testing on the chip under test 200 and cleaning the test probes 221.

[0162] Figure 26 is a schematic flowchart of a control method for a chip testing and cleaning apparatus 100 according to another embodiment of the present invention. As shown in Figure 26, in some specific embodiments, step S401 specifically includes the following steps:

[0163] In step S410, when a control command is received to clean the test probe 221 of the probe holder 22, the turntable 11 is controlled to rotate so as to drive the first cleaning component 80 to rotate to the corresponding probe holder 22.

[0164] Step S420: Control the first brush head of the first cleaning component 80 to move downward so that the first brush head contacts the test probe 221 on the probe holder 22;

[0165] Step S430: Control the turntable 11 to rotate back and forth to drive the first brush head to move back and forth, thereby cleaning the test probe 221 on the probe holder 22 in the forward direction;

[0166] Step S440: Control the first brush head to reset and control the second brush head of the first cleaning component 80 to move downward so that the second brush head contacts the test probe 221 on the probe holder 22.

[0167] Step S450: Control the turntable 11 to rotate back and forth to drive the second brush head to move back and forth, thereby performing reverse cleaning on the test probe 221 on the probe holder 22.

[0168] Step S460: Control the second brush head to reset.

[0169] Here, "first brush head" and "second brush head" refer to the first cleaning component 80 having two brush heads 81. One brush head 81 performs forward cleaning, and the other brush head 81 performs reverse cleaning, which can improve the cleaning effect of the test probe 221.

[0170] Figure 27 is a schematic flowchart of a control method for a chip testing and cleaning apparatus 100 according to another embodiment of the present invention. As shown in Figure 27, in this embodiment, the following step is included after step S401:

[0171] Step S501: Control the turntable 11 to rotate, so as to drive the second cleaning component 50 to rotate above the corresponding probe seat;

[0172] Step S601: After controlling the suction cup 51 of the second cleaning component 50 to move downward, control the suction cup 51 to suck or blow air to clean the test probe 221 on the probe holder.

[0173] Step S701: Control the suction cup 51 to reset.

[0174] Therefore, those skilled in the art should recognize that although numerous exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications conforming to the principles of the present invention can be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the invention. Thus, the scope of the present invention should be understood and construed as covering all such other variations or modifications.

Claims

1. A multi-station chip testing device, comprising: The first test component includes a test machine and a plurality of probe holders distributed on the test machine, each of the probe holders being provided with a test probe; The second test component is disposed on top of the first test component. The second test component includes a turntable and a plurality of test fixtures distributed circumferentially along the turntable. The plurality of test fixtures are configured to be able to adsorb the chip under test on their bottom and rotate according to the turntable. Each probe holder corresponds to one test fixture. Each of the test fixtures is configured such that when rotated to engage with any of the probe holders, the corresponding test probe contacts the adsorbed chip under test to perform performance testing on the chip under test.

2. The multi-station chip testing equipment according to claim 1 further includes: Multiple driving mechanisms are provided, each driving mechanism being connected to a test fixture. The driving mechanism is configured to drive the corresponding test fixture to descend when the corresponding test fixture rotates with the turntable to the top of any of the probe holders, so that the test probe on the corresponding probe holder contacts the adsorbed chip under test.

3. The multi-station chip testing equipment according to claim 1 further includes: A feeding assembly is positioned near the turntable. The feeding assembly is configured to move in a controlled manner below the test fixture when the test fixture rotates to the first target position, so that the corresponding test fixture adsorbs the chip under test on the feeding assembly. The unloading component is located near the turntable. The unloading component is configured to move in a controlled manner below the test fixture when the test fixture rotates to the second target position, so as to receive the chip under test on the corresponding test fixture.

4. The multi-station chip testing equipment according to claim 1, wherein, Multiple probe holders are arranged in a circular pattern on the top of the testing machine, and the included angle between two adjacent probe holders is the same as the included angle between two adjacent test fixtures.

5. The multi-station chip testing equipment according to claim 1 further includes: Multiple temperature control components are provided, each of which is connected to a corresponding test fixture for heating or cooling the corresponding test fixture, thereby performing high-temperature testing, low-temperature testing, or room-temperature testing on the chip under test.

6. The multi-station chip testing equipment according to claim 1, wherein, The first test component also includes: A first PCB board is mounted on top of the testing machine. The first PCB board has at least one first positioning hole. The probe holder is mounted on the first PCB board by bolts. The probe holder has a mounting position for mounting the chip under test and at least one second positioning hole located near the mounting position, so that the pin passes through the second positioning hole and the first positioning hole, thereby making the bottom of the test probe on the probe holder fully contact the first PCB board.

7. The multi-station chip testing equipment according to claim 1, wherein, The test fixture includes: The first adsorption component is located at the bottom of the test fixture, and the interior of the first adsorption component is provided with an air channel for adsorbing the chip under test.

8. The multi-station chip testing equipment according to claim 1 or 2, further comprising: At least one first cleaning component is mounted on the turntable, the first cleaning component being configured to rotate with the turntable to the corresponding probe holder to clean the test probe on the probe holder.

9. The multi-station chip testing equipment according to claim 8, wherein, Each of the first cleaning components includes at least one brush head; The turntable is configured to controllably rotate any of the first cleaning components to the corresponding probe holder, and then controllably rotate back and forth to move the brush head back and forth, thereby cleaning the test probe on the probe holder.

10. The multi-station chip testing equipment according to claim 8, further comprising: At least one second cleaning component is mounted on the turntable, each of the second cleaning components having at least one suction cup configured to suck or blow air onto the test probe as it rotates with the turntable above the corresponding probe holder.

11. The multi-station chip testing equipment according to claim 10, further comprising: At least one visual inspection component is mounted on the turntable, and the visual inspection component is configured to rotate with the turntable to perform visual inspection on the corresponding test probe.

12. The multi-station chip testing equipment according to claim 11, wherein, The first cleaning component, the second cleaning component, or the visual inspection component are provided between two adjacent test fixtures.

13. A multi-station chip testing system, comprising: Feeding equipment is used to provide chips to be tested; At least one multi-station chip testing device as described in any one of claims 1-7, located near the loading device, is used to receive the chip under test from the loading device and perform performance testing on the chip under test; The unloading device is located on the side of the multi-station chip testing equipment away from the loading device, and is used to remove the chip under test after performance testing has been completed on the multi-station chip testing equipment.

14. A chip testing method applied to the multi-station chip testing equipment according to any one of claims 1-7, comprising the following steps: Control the turntable to rotate, so as to drive any test fixture to the first target position; The corresponding test fixture is controlled to adsorb the chip to be tested at the first target position; The turntable is controlled to rotate at a preset angle along a first direction, and the test fixture is controlled to cooperate with the corresponding probe holder so that the corresponding test probe contacts the adsorbed chip under test, thereby performing performance testing on the chip under test. The first direction is either clockwise or counterclockwise.

15. The chip testing method according to claim 14, wherein, During the process of controlling the turntable to rotate along the first direction by a preset angle and controlling the test fixture to cooperate with the corresponding probe holder, the next test fixture rotates to the first target position and picks up the next chip to be tested; Optionally, the step of controlling the turntable to rotate a preset angle along a first direction and controlling the test fixture to engage with the corresponding probe holder specifically includes the following steps: The turntable is controlled to rotate by the preset angle along the first direction so that the test fixture is positioned above the corresponding probe holder; The control drive mechanism drives the corresponding test fixture to descend, so that the test probe on the corresponding probe holder comes into contact with the adsorbed chip under test.

16. A control method for a multi-station chip testing equipment according to any one of claims 8-12, comprising the following steps: Upon receiving a control command to test the chip under test, the turntable is controlled to rotate, thereby driving any test fixture to rotate. Move to the first target location; The corresponding test fixture is controlled to adsorb the chip under test at the first target position; The turntable is controlled to rotate at a preset angle along a first direction, and the test fixture is controlled to cooperate with the corresponding probe holder so that the corresponding test probe contacts the adsorbed chip under test, thereby performing performance testing on the chip under test. The first direction is either clockwise or counterclockwise.

17. The control method according to claim 16 further comprises the following steps: When a control command is received to clean the test probes of the probe holder, the turntable is controlled to rotate, thereby driving the first cleaning component to rotate to the corresponding probe holder, and thus cleaning the test probes on the probe holder.

18. The control method according to claim 17, characterized in that, Upon receiving a control command to clean the test probes on the probe holder, the turntable is controlled to rotate, thereby rotating the first cleaning component to the corresponding probe holder to clean the test probes on the probe holder. This process specifically includes the following steps: When a control command is received to clean the test probes of the probe holder, the turntable is controlled to rotate so as to drive the first cleaning component to rotate to the corresponding probe holder. The first brush head of the first cleaning component is controlled to move downward so that the first brush head contacts the test probe on the probe holder; The turntable is controlled to rotate back and forth, thereby driving the first brush head to move back and forth, thus performing forward cleaning of the test probe on the probe holder; Control the first brush head to reset, and control the second brush head of the first cleaning component to move downward so that the second brush head contacts the test probe on the probe holder; The turntable is controlled to rotate back and forth, thereby driving the second brush head to move back and forth, thus performing reverse cleaning on the test probe on the probe holder; Control the second brush head to reset.

19. The control method according to claim 17, after receiving a control command to clean the test probes on the probe holder, controlling the turntable to rotate so as to drive the first cleaning component to rotate to the corresponding probe holder, thereby cleaning the test probes on the probe holder, further includes the following step: Control the turntable to rotate, so as to drive the second cleaning component to rotate above the corresponding probe holder; After controlling the suction cup of the second cleaning component to move downward, control the suction cup to suck or blow air to clean the test probe on the probe holder; Control the suction cup to reset.

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