Substrate, light-emitting device, and light-emitting module

Abstract

Provided is a substrate capable of achieving both flexibility and convenience of wiring connection. This substrate comprises a plurality of upper wiring parts and a plurality of lower wiring parts. The plurality of upper wiring parts include on the upper surface side: a first upper wiring part and a second upper wiring part which are provided on a first outer surface side; and a third upper wiring part and a fourth upper wiring part which are provided on a second outer surface side. The plurality of lower wiring parts are each provided on one outer surface side of a plurality of outer surfaces on the lower surface side and include: a first lower wiring part electrically connected to the first upper wiring part; a second lower wiring part electrically connected to the second upper wiring part; a third lower wiring part electrically connected to the third upper wiring part; and a fourth lower wiring part electrically connected to the fourth upper wiring part. In the plurality of upper wiring parts, the respective upper wiring parts are not electrically connected to the other upper wiring parts, and in the plurality of lower wiring parts, the respective lower wiring parts are not electrically connected to the other lower wiring parts.

Description

Base, light-emitting device, and light-emitting module

[0001] The present invention relates to a base, a light-emitting device, and a light-emitting module.

[0002] Japanese Patent Application Laid-Open No. 2019-212752 discloses a light-emitting device in which multiple semiconductor laser elements are arranged in a closed space of a package, and a package having a first electrode layer and a second electrode layer and electrically connected to the semiconductor laser elements.

[0003] Japanese Patent Application Laid-Open No. 2019-212752

[0004] An invention is disclosed that solves the problem of achieving both flexibility and convenience in wiring connections.

[0005] Alternatively, instead of the above-mentioned problem, an invention is disclosed that solves the problem of realizing miniaturization of a wiring board or a light-emitting module.

[0006] Alternatively, instead of the above-mentioned problems, an invention is disclosed that solves the problem of realizing a small wiring board with good heat dissipation performance.

[0007] Alternatively, instead of the above-mentioned problems, an invention is disclosed that solves the problem of achieving both convenience in wiring connection and bonding stability.

[0008] This specification also discloses inventions that solve multiple of the above-mentioned problems in a composite manner.

[0009] The base disclosed in the embodiment comprises an upper surface, a lower surface, and a plurality of outer surfaces including a first outer surface and a second outer surface; a plurality of upper wiring portions including, on the upper surface side, a first upper wiring portion and a second upper wiring portion provided on the first outer surface side, and a third upper wiring portion and a fourth upper wiring portion provided on the second outer surface side; and a plurality of lower wiring portions on the lower surface side, each of which is provided on one of the plurality of outer surfaces, and including a first lower wiring portion electrically connected to the first upper wiring portion, a second lower wiring portion electrically connected to the second upper wiring portion, a third lower wiring portion electrically connected to the third upper wiring portion, and a fourth lower wiring portion electrically connected to the fourth upper wiring portion, wherein, among the plurality of upper wiring portions, each upper wiring portion is not electrically connected to the other upper wiring portions, and among the plurality of lower wiring portions, each lower wiring portion is not electrically connected to the other lower wiring portions.

[0010] The light-emitting device disclosed in the embodiment comprises the above-mentioned base having a first upper surface, a plurality of light-emitting elements including a first light-emitting element and a second light-emitting element and arranged on the first upper surface, and a plurality of wirings including a first wiring and a second wiring, wherein the first wiring is provided on one of two electrodes of the first light-emitting element and is joined to either the first upper wiring portion or the second upper wiring portion, and the second wiring is provided on one of two electrodes of the second light-emitting element and is joined to either the third upper wiring portion or the fourth upper wiring portion.

[0011] A light-emitting module disclosed in an embodiment is the light-emitting device described above, wherein the plurality of light-emitting elements further includes a third light-emitting element, the plurality of wirings further includes a third wiring and a fourth wiring, the third wiring is provided on one electrode side of two electrodes of the third light-emitting element, and is joined to the upper wiring portion of the first upper wiring portion and the second upper wiring portion to which the first wiring is not joined, and the fourth wiring is provided on the other electrode side of each of the first light-emitting element, the second light-emitting element, and the third light-emitting element, and is joined to the upper wiring portion of the third upper wiring portion and the fourth upper wiring portion to which the second wiring is not joined; a first electrode member, the first electrode member has a first region that joins with the first lower wiring portion, the second electrode member has a second region that joins with the second lower wiring portion, the third electrode member has a third region that joins with the third lower wiring portion, and the fourth electrode member has a fourth region that joins with the fourth lower wiring portion, and the first electrode member, the second electrode member, the third electrode member, and the fourth electrode member are arranged such that, in a top view, a single imaginary straight line passes through the first electrode member, the second electrode member, the third electrode member, and the fourth electrode member.

[0012] The light emitting module disclosed in the embodiment includes a first light emitting device including the above-mentioned base having a first upper surface, a plurality of light emitting elements arranged on the first upper surface, and a plurality of wirings including a first wiring and a second wiring; a second light emitting device which is the above-mentioned light emitting device, wherein the plurality of wirings further include a third wiring and a fourth wiring, the third wiring is provided on the other electrode side of two electrodes of the first light emitting element, and is joined to the upper wiring portion of the first upper wiring portion and the second upper wiring portion to which the first wiring is not joined, and the fourth wiring is provided on the other electrode side of two electrodes of the second light emitting element, and is joined to the upper wiring portion of the third upper wiring portion and the fourth upper wiring portion to which the second wiring is not joined; and a plurality of electrode members including a first electrode member, a second electrode member, a third electrode member, a fourth electrode member, a fifth electrode member, and a sixth electrode member. and a wiring board having a mounting surface on which the light-emitting element is mounted, wherein in the first light-emitting device, the first wiring is provided on one of two electrodes of the plurality of light-emitting elements and is joined to the first upper wiring portion, the second wiring is provided on the other of two electrodes of the plurality of light-emitting elements and is joined to the third upper wiring portion, the first electrode member has a first region joined to the first lower wiring portion of the first light-emitting device, the second electrode member has a second region joined to the third lower wiring portion of the first light-emitting device, the third electrode member has a third region joined to the first lower wiring portion of the second light-emitting device, the fourth electrode member has a fourth region joined to the second lower wiring portion of the second light-emitting device, the fifth electrode member has a fifth region joined to the third lower wiring portion of the second light-emitting device, and the sixth electrode member has a sixth region joined to the fourth lower wiring portion of the second light-emitting device.

[0013] In at least one of one or more inventions disclosed in the embodiments, it is possible to achieve both flexibility and convenience in wiring connections.

[0014] 10 ; a perspective view of a light-emitting module according to a first embodiment; a top view of a wiring board according to a first embodiment; a schematic cross-sectional view of a wiring board taken along the III-III cross-sectional line of FIG. 2; a perspective view of a light-emitting device according to each embodiment; a side view of a light-emitting device according to each embodiment; a cross-sectional view of a light-emitting device taken along the VI-VI cross-sectional line of FIG. 4; a diagram illustrating an example of components arranged in the internal space of a light-emitting device according to each embodiment; a diagram illustrating another example of components arranged in the internal space of a light-emitting device according to each embodiment; a perspective view of a package according to each embodiment; a cross-sectional view of a package taken along the IXA-IXA cross-sectional line of FIG. 8; a cross-sectional view showing another example of a package according to each embodiment; a top view of a base according to each embodiment; a top view of the base according to the first embodiment seen transparently from the upper surface side; a bottom view of the base according to the first embodiment; a cross-sectional view of the base according to each embodiment taken along the XIIA-XIIA cross-sectional line of FIG. 10; a cross-sectional view showing an example of a plurality of insulating layers of a base; a top view of an example of an upper wiring portion provided in a first layer of an insulating layer of a base according to a first embodiment; a top view of an example of an intermediate wiring portion provided in an upper third layer of an insulating layer; a top view of an example of an intermediate wiring portion provided in a lower third layer of an insulating layer. 1 is a top view showing the appearance of a light-emitting element and the like arranged on a submount according to each embodiment. FIG. 2 is a side view showing the appearance of a light-emitting element and the like arranged on a submount according to each embodiment. FIG. 3 is a top view of a light-emitting module according to a first embodiment. FIG. 4 is a top view of a wiring board according to the first embodiment. FIG. 5 is a top view of a wiring board according to the first embodiment. FIG. 6 is a top view of a light-emitting module according to a second embodiment. FIG. 7 is a top view of a wiring board according to the second embodiment. FIG. 8 is a top view of a wiring board according to the second embodiment. FIG. 9 is a top view of a first light-emitting device and a second light-emitting device arranged on a submount according to each embodiment. FIG. 10 is a six-sided view and a perspective view showing a first example of a light-emitting module according to another embodiment. FIG. 11 is a six-sided view and a perspective view showing a second example of a light-emitting module according to another embodiment. FIG. 12 is a six-sided view and a perspective view showing a third example of a light-emitting module according to another embodiment.

[0015] In this specification and claims, polygons such as triangles and quadrilaterals are referred to as polygons, including shapes in which the corners of the polygons have been rounded, chamfered, corner-cut, rounded, etc. Furthermore, shapes in which processing has been applied not only to the corners (edges of the sides) but also to the middle portions of the sides are also referred to as polygons. In other words, shapes in which partial processing has been applied while retaining the polygonal base are included in the interpretation of "polygon" described in this specification and claims.

[0016] The same applies to words that describe specific shapes, such as trapezoids, circles, and irregularities, not just polygons. The same also applies when dealing with the sides that form the shape. In other words, even if the corners or middle part of a side are processed, the interpretation of "side" includes the processed part. Note that when distinguishing a "polygon" or "side" that has no processing from a processed shape, the word "strict" is added, for example, "strict quadrangle."

[0017] Furthermore, in this specification or the claims, descriptions such as up and down (upper / lower), left and right, front and back, front and back (front / rear), front and back, etc. merely describe relationships such as relative positions, orientations, directions, etc., and do not necessarily correspond to the relationships during use.

[0018] In the drawings, directions such as the X direction, Y direction, and Z direction may be indicated using arrows. The directions of these arrows are consistent among multiple drawings relating to the same embodiment. In the drawings, the direction of an arrow marked with X, Y, and Z is the positive direction, and the opposite direction is the negative direction. For example, a direction marked with X at the end of an arrow is the X direction and the positive direction. In this specification, a direction that is the X direction and the positive direction is referred to as the "positive X direction," and the opposite direction is referred to as the "negative X direction." When referring to the "X direction," it is intended to include both the positive and negative directions. The same applies to the Y direction and the Z direction.

[0019] Furthermore, in this specification, when a certain object is described by specifying "one or more," both the form in which there is one object and the form in which there is more than one object are described together. Therefore, the description specifying "one or more" supports any of the following embodiments: an embodiment including one or more objects, an embodiment including at least one object, and an embodiment including more than one object.

[0020] Furthermore, in this specification, a description of "one or each" object is a description that compiles a description of one object in an embodiment that includes one object, a description of one object in an embodiment that includes multiple objects, and a description of each of the multiple objects in an embodiment that includes multiple objects. Therefore, a description of "one or each" object supports all of the following: in an embodiment that includes one object, this one object has the explanatory content; in an embodiment that includes multiple objects, at least one of these objects has the explanatory content; in an embodiment that includes multiple objects, each of these multiple objects has the explanatory content; and in an embodiment that includes one or multiple objects, all of the objects have the explanatory content.

[0021] Furthermore, in this specification, the terms "component" and "part" may be used when describing components, for example. A "component" refers to an object that is handled physically as a single unit. An object that is handled physically as a single unit can also be said to be an object that is handled as a single component in the manufacturing process. On the other hand, a "part" refers to an object that does not need to be handled physically as a single unit. For example, the term "part" is used when referring to a portion of a single component, or when referring to multiple components collectively as a single object.

[0022] The distinction between "component" and "part" above does not indicate a conscious intention to limit the scope of rights in the interpretation of the doctrine of equivalents. In other words, even if a component is described as a "component" in the claims, this does not mean that the applicant recognizes that treating this component as a single physical unit is essential for the application of the present invention.

[0023] Furthermore, in this specification or claims, when there are multiple elements of a certain type and they need to be distinguished from one another, the elements may be prefixed with "first" or "second." Furthermore, the objects distinguished between the specification and the claims may differ. Therefore, even if the claims describe elements with the same prefixes as the specification, the objects identified by these elements may not be the same between the specification and the claims.

[0024] For example, if there are elements in this specification that are distinguished by the notation "first," "second," and "third," and the elements marked with "first" and "third" in this specification are described in the claims, the elements may be distinguished by the notation "first" and "second" in the claims for ease of reading. In this case, the elements marked with "first" and "second" in the claims refer to the elements marked with "first" and "third" in this specification, respectively. Note that this rule is not limited to elements, and can be applied rationally and flexibly to other objects as well.

[0025] Hereinafter, embodiments for carrying out the present invention will be described. Furthermore, specific embodiments for carrying out the present invention will be described with reference to the drawings. Note that the embodiments for carrying out the present invention are not limited to these specific embodiments. In other words, the illustrated embodiments are not the only embodiments in which the present invention can be realized. Note that the sizes and positional relationships of components shown in each drawing may be exaggerated for ease of understanding.

[0026] First Embodiment A light-emitting module 901 according to a first embodiment will be described. FIGS. 1 to 17D are drawings for explaining an exemplary embodiment of the light-emitting module 901. FIG. 1 is a perspective view of the light-emitting module 901 according to the first embodiment. FIG. 2 is a top view of a wiring substrate 101 according to the first embodiment. FIG. 3 is a schematic cross-sectional view of the wiring substrate taken along the III-III cross-sectional line in FIG. 2. FIG. 4 is a perspective view of a light-emitting device 1 according to each embodiment. FIG. 5 is a side view of the light-emitting device 1 according to each embodiment. FIG. 6 is a cross-sectional view of the light-emitting device 1 taken along the VI-VI cross-sectional line in FIG. 4. FIG. 7A is a diagram illustrating an example of components arranged in the internal space of the light-emitting device 1 according to each embodiment. FIG. 7B is a diagram illustrating another example of components arranged in the internal space of the light-emitting device 1 according to each embodiment. FIG. 8 is a perspective view of a package 10 according to each embodiment. FIG. 9A is a cross-sectional view of the package 10 taken along the IXA-IXA cross-sectional line in FIG. 8. FIG. 9B is a cross-sectional view illustrating another example of the package 10 according to each embodiment.

[0027] FIG. 10 is a top view of the base 11 according to each embodiment. FIG. 11A is a top view of the base 11 according to the first embodiment, viewed transparently from the top surface. Note that the dotted line in FIG. 11A indicates the lower wiring portion 12B when viewed from the top surface. FIG. 11B is a bottom view of the base 11 according to the first embodiment. FIG. 12A is a cross-sectional view of the base 11 according to each embodiment, taken along the XIIA-XIIA cross-sectional line in FIG. 10. FIG. 12B is a cross-sectional view showing an example of multiple insulating layers 11S included in the base 11. FIG. 13 is a top view showing an example of an upper wiring portion 12A provided on the first layer 11S1 of the insulating layer 11S of the base 11 according to the first embodiment. Note that the hatching in FIG. 13 indicates a portion that does not overlap with the fourth layer 11S4 in a top view. FIG. 14A is a top view showing an example of an intermediate wiring portion 12D provided on the upper third layer 11S31 of the insulating layer 11S. Fig. 14B is a top view showing an example of an intermediate wiring portion 12D provided in a lower third layer 11S32 of the insulating layer 11S. Fig. 15 is a top view showing a state of a light emitting element and the like arranged on a submount according to each embodiment. Fig. 16 is a side view showing a state of a light emitting element 20 and the like arranged on a submount 30 according to each embodiment.

[0028] Fig. 17A is a top view of the light-emitting module 901 according to the first embodiment. Fig. 17B is a top view of the wiring board 101 according to the first embodiment. Fig. 17C is a top view of the wiring board 101 according to the first embodiment. Fig. 17D is a top view showing the state of the internal space of the light-emitting device 1 provided in the light-emitting module 901 according to the first embodiment. Fig. 17B excludes the bonding member 141. Fig. 17C excludes the portion of the insulating member 131 that is provided on the electrode member 121. The dotted line in Fig. 17D transparently indicates the lower wiring portion 12B.

[0029] The light-emitting module 901 includes a plurality of components, including one or more light-emitting devices 1 and a wiring substrate 101.

[0030] The light-emitting module 901 may include other components. For example, the light-emitting module 901 may include a light-emitting device different from the light-emitting device 1. The light-emitting module 901 may not include some of the components listed here.

[0031] The light emitting device 1 includes a plurality of components, including a package 10, one or more light emitting elements 20, one or more submounts 30, one or more reflecting members 40, one or more protective elements 50, a plurality of wirings 60, and an optical member 70.

[0032] The light emitting device 1 may include other components. For example, the light emitting device 1 may include a light emitting element in addition to the one or more light emitting elements 20. Furthermore, the light emitting device 1 may not include some of the components listed here.

[0033] First, each component will be described.

[0034] (Package 10) The package 10 includes a base 11 and a lid 14. The lid 14 is joined to the base 11 to form the package 10. An internal space is defined in the package 10 in which other components are placed. This internal space is a closed space surrounded by the base 11 and the lid 14. This internal space can also be a space sealed in a vacuum or airtight state.

[0035] When viewed from above, the outer edge of the package 10 has a rectangular shape. This rectangle can have long and short sides. In the illustrated package 10, the long side of the rectangle is oriented in the X direction, and the short side is oriented in the Y direction. However, when viewed from above, the outer edge of the package 10 does not have to have a rectangular shape.

[0036] The package 10 defines an internal space in which other components are placed. The first upper surface 11A of the package 10 is part of the area that defines the internal space. In addition, each of the inner side surfaces 11E and the lower surface 14B of the package 10 is also part of the area that defines the internal space.

[0037] The base 11 has a first upper surface 11A and a lower surface 11B. The base 11 has a second upper surface 11C. The base 11 has one or more outer surfaces 11D. The base 11 has one or more inner surfaces 11E. The one or more outer surfaces 11D intersect with the second upper surface 11C. The one or more outer surfaces 11D intersect with the lower surface 11B. The one or more inner surfaces 11E intersect with the second upper surface 11C.

[0038] The one or more outer surfaces 11D may include a first outer surface 11D1 and a second outer surface 11D2. The second outer surface 11D2 is the outer surface 11D opposite the first outer surface 11D1. The one or more inner surfaces 11E may include a first inner surface 11E1 and a second inner surface 11E2. The second inner surface 11E2 is the inner surface 11E facing the first inner surface 11E1. The first inner surface 11E1 is provided on the first outer surface 11D1 side, and the second inner surface 11E2 is provided on the second outer surface 11D2 side. Note that the second outer surface 11D2 does not have to be the outer surface 11D opposite the first outer surface 11D1, and the second inner surface 11E2 does not have to be the inner surface 11E facing the first inner surface 11E1. The one or more outer surfaces 11D may include a third outer surface 11D3 and a fourth outer surface 11D4. The fourth outer surface 11D4 is the outer surface 11D opposite the third outer surface 11D3. The one or more inner surfaces 11E may include a third inner surface 11E3 and a fourth inner surface 11E4. The fourth inner surface 11E4 is the inner surface 11E opposite the third inner surface 11E3.

[0039] When viewed from above, the outer edge shape of the base 11 is rectangular. When viewed from above, the outer edge shape of the base 11 is the outer edge shape of the package 10. When viewed from above, the outer edge shape of the first top surface 11A is rectangular. This rectangle can be a rectangle having long sides and short sides. The long side direction of the first top surface 11A and the long side direction of the outer edge shape of the base 11 are parallel. Note that when viewed from above, the outer edge shape of the first top surface 11A does not have to be rectangular.

[0040] In a top view, the first top surface 11A is surrounded by the second top surface 11C. The second top surface 11C is an annular surface that surrounds the first top surface 11A in a top view. The second top surface 11C is a rectangular annular surface. Here, the frame defined by the inner edge of the second top surface 11C is referred to as the inner frame of the second top surface 11C, and the frame defined by the outer edge of the second top surface 11C is referred to as the outer frame of the second top surface 11C.

[0041] The one or more outer surfaces 11D form an outer frame in top view. The one or more inner surfaces 11E form an inner frame in top view. In top view, the outer frame of the second top surface 11C is also an outer frame formed by the one or more outer surfaces 11D. In top view, the inner frame of the second top surface 11C is also an inner frame formed by the one or more inner surfaces 11E.

[0042] The base 11 has a recess surrounded by a frame by the second top surface 11C. The recess defines a portion of the base 11 that is recessed below the second top surface 11C. The first top surface 11A is a part of the recess. One or more inner surfaces 11E are also a part of the recess. The second top surface 11C is located above the first top surface 11A.

[0043] The base 11 has one or more step portions 11F. The step portion 11F has an upper surface 11G and a side surface 11H that intersects with the upper surface 11G and extends downward from the upper surface 11G. Here, one step portion 11F has only one upper surface 11G and one side surface 11H. The upper surface 11G intersects with the inner surface 11E. The side surface 11H intersects with the first upper surface 11A.

[0044] One or each step portion 11F is provided inside the inner frame of the second upper surface 11C in top view. One or each step portion 11F is formed along part or all of the inner surface 11E in top view. In the base 11, the side surface 11H is an inner surface, but the side surface 11H and the inner surface 11E are different surfaces. One or each inner surface 11E and one or each side surface 11H are perpendicular to the first upper surface 11A. Here, the perpendicular allows for a difference of ±3 degrees.

[0045] The one or more step portions 11F may include a first step portion 11F1 and a second step portion 11F2. The first step portion 11F1 and the second step portion 11F2 are provided at positions where their respective side surfaces 11H face each other. The first step portion 11F1 and the second step portion 11F2 are provided on the short side of the inner frame of the second upper surface 11C.

[0046] The first step portion 11F1 is provided on the first outer surface 11D1 side of the base 11. The second step portion 11F2 is provided on the second outer surface 11D2 side of the base 11. The first step portion 11F1 is formed along the first inner surface 11E1. The second step portion 11F2 is formed along the second inner surface 11E2.

[0047] 9B, the base 11 can have a base portion 11M and a frame portion 11N. The base portion 11M and the frame portion 11N can be made of different materials. The base 11 can be configured to include a base member corresponding to the base portion 11M and a frame member corresponding to the frame portion 11N.

[0048] The base portion 11M includes a first upper surface 11A. The frame portion 11N includes a second upper surface 11C. The frame portion 11N includes one or more outer surfaces 11D and one or more inner surfaces 11E. The frame portion 11N includes one or more step portions 11F.

[0049] The lower surface of the base 11M constitutes a part or all of the area of ​​the lower surface 11B of the base 11. When the lower surface of the base 11M constitutes a part of the area of ​​the lower surface 11B of the base 11, the lower surface of the frame 11N constitutes the remaining area of ​​the lower surface 11B of the base.

[0050] The base 11 has a plurality of wiring portions 12. The plurality of wiring portions 12 includes one or more wiring portions 12 arranged in the internal space of the package 10 and one or more wiring portions 12 provided on the outer surface of the package 10.

[0051] The plurality of wiring portions 12 include a plurality of upper wiring portions 12A provided on the upper surface side of the base 11. The plurality of wiring portions 12 include a plurality of lower wiring portions 12B provided on the lower surface side of the base 11. The plurality of wiring portions 12 are provided spaced apart from each other.

[0052] In the base 11, the upper wiring portion 12A is electrically connected to the lower wiring portion 12B. Each of the plurality of upper wiring portions 12A is electrically connected to one or more lower wiring portions 12B. For example, the upper wiring portion 12A and the lower wiring portion 12B are electrically connected to each other through via wiring inside the base 11.

[0053] The plurality of upper wiring portions 12A includes a first upper wiring portion 12A1 provided on the first outer surface 11D1 side of the base 11 in a top view. The plurality of upper wiring portions 12A includes a second upper wiring portion 12A2 provided on the first outer surface 11D1 side of the base 11 in a top view. The plurality of upper wiring portions 12A includes a third upper wiring portion 12A3 provided on the second outer surface 11D2 side of the base 11 in a top view. The plurality of upper wiring portions 12A includes a fourth upper wiring portion 12A4 provided on the second outer surface 11D2 side of the base 11 in a top view. One or each upper wiring portion 12A is provided inside the inner frame of the second upper surface 11C in a top view. Providing the upper wiring portions 12A on each of the plurality of outer surface 11D sides increases the options for wiring connection and ensures flexibility in wiring connection.

[0054] In the base 11, the first upper wiring portion 12A1 and the second upper wiring portion 12A2 are not electrically connected. In the base 11, the third upper wiring portion 12A3 and the fourth upper wiring portion 12A4 are not electrically connected. In the base 11, the first upper wiring portion 12A1 and the third upper wiring portion 12A3 are not electrically connected. In the multiple upper wiring portions 12A, each upper wiring portion 12A is not electrically connected to the other upper wiring portions 12A.

[0055] The first upper wiring portion 12A1 and the second upper wiring portion 12A2 are arranged side by side in one direction. Hereinafter, this direction will be referred to as the first direction. The third upper wiring portion 12A3 and the fourth upper wiring portion 12A4 are arranged side by side in one direction. Hereinafter, this direction will be referred to as the second direction. The second direction is the opposite direction to the first direction. Note that the first direction and the second direction may be the same direction. Also, the first direction and the second direction do not have to be the same direction.

[0056] The first direction is a direction perpendicular to the direction from the first outer surface 11D1 to the second outer surface 11D2. The first direction is a direction along the first outer surface 11D1 in a top view. The first direction is a direction parallel to the short side direction of the first upper surface 11A. The first direction is a direction parallel to the short side direction of the outer edge shape of the base 11.

[0057] One or each upper wiring portion 12A is provided on the upper surface 11G of the step portion 11F. The base 11 has one or more upper wiring portions 12A provided on the upper surface 11G of the first step portion 11F1. The base 11 has one or more upper wiring portions 12A provided on the upper surface 11G of the second step portion 11F2. Note that the upper wiring portion 12A may be provided on an upper surface other than the upper surface 11G of the base 11.

[0058] One or each of the lower wiring portions 12B is provided on the lower surface 11B of the package 10. One or each of the lower wiring portions 12B is provided on the lower surface of the frame portion 11N. The lower wiring portions 12B may be provided on an outer surface different from the lower surface 11B of the package 10. In this case, rather than calling them "upper wiring portion 12A" and "lower wiring portion 12B," it would be more appropriate to call them "inner wiring portion 12A" and "outer wiring portion 12B," in consideration of the relationship between the surfaces that define the internal space of the package 10 and the outer surfaces of the package 10.

[0059] The plurality of lower wiring portions 12B includes a first lower wiring portion 12B1 provided on one outer surface 11D side. The plurality of lower wiring portions 12B includes a second lower wiring portion 12B2 provided on this outer surface 11D side. The plurality of lower wiring portions 12B includes a third lower wiring portion 12B3 provided on this outer surface 11D side. The plurality of lower wiring portions 12B includes a fourth lower wiring portion 12B4 provided on this outer surface 11D side. This outer surface 11D is, for example, the first outer surface 11D1. By consolidating the plurality of lower wiring portions 12B electrically connected to the plurality of upper wiring portions 12A provided on the two outer surfaces 11D sides on one outer surface 11D side, wiring connection can be realized within the consolidated region, thereby improving the convenience of wiring connection.

[0060] In the base 11, the first lower wiring portion 12B1 and the second lower wiring portion 12B2 are not electrically connected. In the base 11, the third lower wiring portion 12B3 and the fourth lower wiring portion 12B4 are not electrically connected. In the base 11, the first lower wiring portion 12B1 and the third lower wiring portion 12B3 are not electrically connected. In the multiple lower wiring portions 12B, each lower wiring portion 12B is not electrically connected to the other lower wiring portions 12B.

[0061] The first lower wiring portion 12B1, the second lower wiring portion 12B2, the third lower wiring portion 12B3, and the fourth lower wiring portion 12B4 are arranged side by side in one direction. Hereinafter, this direction will be referred to as the third direction. The third direction and the first direction are the same direction. Note that the third direction and the first direction do not have to be the same direction.

[0062] In the base 11, the first lower wiring portion 12B1 is electrically connected to the first upper wiring portion 12A1. In the base 11, the second lower wiring portion 12B2 is electrically connected to the second upper wiring portion 12A2. In the base 11, the third lower wiring portion 12B3 is electrically connected to the third upper wiring portion 12A3. In the base 11, the fourth lower wiring portion 12B4 is electrically connected to the fourth upper wiring portion 12A4.

[0063] The base 11 has a plurality of insulating layers 11S. The base 11 is provided with a plurality of insulating layers 11S in the vertical direction. The plurality of insulating layers 11S includes a first layer 11S1 on which the upper wiring portion 12A is provided. The plurality of insulating layers 11S includes a second layer 11S2 on which the lower wiring portion 12B is provided. The plurality of insulating layers 11S includes one or more third layers 11S3 provided between the first layer 11S1 and the second layer 11S2. The plurality of insulating layers 11S includes one or more fourth layers 11S4 provided on the first layer 11S1.

[0064] The multiple wiring portions 12 include multiple intermediate wiring portions 12D provided between the first layer 11S1 and the second layer 11S2. The intermediate wiring portion 12D may be provided between the first layer 11S1 and the third layer 11S3. The intermediate wiring portion 12D may be provided between two consecutive third layers 11S3. The intermediate wiring portion 12D may be provided between the third layer 11S3 and the second layer 11S2.

[0065] The or each intermediate wiring portion 12D is not arranged in the internal space of the package 10. The or each intermediate wiring portion 12D is not arranged on the outer surface of the package 10. The or each intermediate wiring portion 12D is arranged inside the package 10, and is not arranged on the surface of the base 11.

[0066] The plurality of insulating layers 11S includes one or more insulating layers 11S provided with via wirings that connect to wiring portions 12 provided above and below the insulating layer 11S. The via wirings are arranged in through holes provided in the insulating layer 11S. The portions of the insulating layer 11S where the via wirings are provided are conductive.

[0067] A plurality of via wirings are provided in the first layer 11S1. A plurality of via wirings are provided in the second layer 11S2. A plurality of via wirings are provided in one or each of the third layers 11S3. A plurality of via wirings are provided in all of the insulating layers 11S arranged in the base 11 between the surface on which the plurality of upper wiring portions 12A are provided and the surface on which the plurality of lower wiring portions 12B are provided.

[0068] The multiple wiring portions 12 include wiring portions 12 having a region extending from the first outer surface 11D1 side to the second outer surface 11D2 side. This wiring portion 12 is an upper wiring portion 12A. This allows the upper wiring portion 12A to be provided so as to be electrically connected to both the lower wiring portion 12B provided on the first outer surface 11D1 side and the lower joint portion 12C provided on the second outer surface 11D2 side. This makes it possible to reverse the arrangement of the lower wiring portion 12B and the lower joint portion 12C. That is, the wiring portion 12 provided on the first outer surface 11D1 side can be used as the lower joint portion, and the wiring portion 12 provided on the second outer surface 11D2 side can be used as the lower wiring portion. Instead of providing the upper wiring portion 12A with such a shape, the upper wiring portion 12A may be electrically connected to both the lower wiring portion 12B and the lower joint portion 12C by the intermediate wiring portion 12D.

[0069] 13 , the second upper wiring portion 12A2 has a region extending from the first outer surface 11D1 to the second outer surface 11D2. The first upper wiring portion 12A1, the second upper wiring portion 12A2, the third upper wiring portion 12A3, and the fourth upper wiring portion 12A4 each have a region overlapping with the fourth layer 11S4 and a region not overlapping with the fourth layer 11S4 in a top view. Only one upper wiring portion 12A may have a region extending from the first outer surface 11D1 to the second outer surface 11D2. This makes it easier to increase the width of the upper wiring portion 12A in the first direction.

[0070] 14A and 14B , the plurality of intermediate wiring portions 12D includes an intermediate wiring portion 12D having a region extending from the first outer surface 11D1 side to the second outer surface 11D2 side. The plurality of intermediate wiring portions 12D includes a first intermediate wiring portion 12D1 electrically connected to the first upper wiring portion 12A1. The plurality of intermediate wiring portions 12D includes a second intermediate wiring portion 12D2 electrically connected to the second upper wiring portion 12A2. The plurality of intermediate wiring portions 12D includes a third intermediate wiring portion 12D3 electrically connected to the third upper wiring portion 12A3. The plurality of intermediate wiring portions 12D includes a fourth intermediate wiring portion 12D4 electrically connected to the fourth upper wiring portion 12A4.

[0071] The base 11 may have a wiring portion 12E provided at the same height as the upper wiring portion 12A. The wiring portion 12E is provided on the upper surface 11G of the step portion 11F. In a top view, the wiring portion 12E has a region overlapping with the fourth layer 11S4 and a region not overlapping with the fourth layer 11S4. The wiring portion 12E is electrically connected to one of the upper wiring portions 12A. In the base 11, the wiring portion 12E is electrically connected to the first upper wiring portion 12A1. The wiring portion 12E and one of the upper wiring portions 12A are electrically connected via an intermediate wiring portion 12D. The wiring portion 12E is arranged on a side of the outer surface different from the side on which one of the upper wiring portions 12A electrically connected to it is provided. The wiring portion 12E can be used, for example, to connect a protection element 50 and a light-emitting element 20 in parallel. In the illustrated base 11, the first upper wiring portion 12A1 is arranged on the first outer surface 11D1 side, and the wiring portion 12E is arranged on the second outer surface 11D2 side.

[0072] The lower wiring portions 12B are arranged in the third direction in the order of the first lower wiring portion 12B1, the second lower wiring portion 12B2, the third lower wiring portion 12B3, and the fourth lower wiring portion 12B4. The distance in the third direction from the first lower wiring portion 12B1 to the second lower wiring portion 12B2 is smaller than the width in the third direction of the first lower wiring portion 12B1. This distance is also smaller than the width in the third direction of the second lower wiring portion 12B2. By reducing the distance between adjacent lower wiring portions 12B, more lower wiring portions 12B can be arranged. The arrangement order of the lower wiring portions 12B may be different from this.

[0073] The distance in the third direction from the second lower wiring portion 12B2 to the third lower wiring portion 12B3 is smaller than the width in the third direction of the second lower wiring portion 12B2. This distance is also smaller than the width in the third direction of the third lower wiring portion 12B3.

[0074] The distance in the third direction from the third lower wiring portion 12B3 to the fourth lower wiring portion 12B4 is smaller than the width in the third direction of the third lower wiring portion 12B3. This distance is also smaller than the width in the third direction of the fourth lower wiring portion 12B4.

[0075] The sum of the distance in the third direction from the first lower wiring portion 12B1 to the second lower wiring portion 12B2, the distance in the third direction from the second lower wiring portion 12B2 to the third lower wiring portion 12B3, and the distance in the third direction from the third lower wiring portion 12B3 to the fourth lower wiring portion 12B4 is smaller than the width in the third direction of at least any of the lower wiring portions 12B. One or each lower wiring portion 12B has a width in the third direction greater than this sum.

[0076] The one or more upper wiring portions 12A may include upper wiring portions 12A whose width in the first direction is larger than the width in the third direction of any of the first lower wiring portion 12B1, the second lower wiring portion 12B2, the third lower wiring portion 12B3, and the fourth lower wiring portion 12B4. As shown in FIG. 13 , the shape of the upper wiring portion 12A is not limited to a rectangle. The width in the first direction of the upper wiring portion 12A refers to the length from one end to the other end in the first direction. The width in the first direction of the upper wiring portion 12A exposed from the insulating layer 11S may also be compared. That is, the one or more upper wiring portions 12A may include upper wiring portions 12A whose width in the first direction of the region exposed from the insulating layer 11S is larger than the width in the third direction of any of the first lower wiring portion 12B1, the second lower wiring portion 12B2, the third lower wiring portion 12B3, and the fourth lower wiring portion 12B4.

[0077] The width in the third direction of the first lower wiring portion 12B1, the second lower wiring portion 12B2, the third lower wiring portion 12B3, and the fourth lower wiring portion 12B4 is all smaller than the width in the first direction of the first upper wiring portion 12A1. For the same width, the lower wiring portion 12B may be provided in greater numbers than the upper wiring portion 12A. The width in the third direction of the upper wiring portion 12A refers to the length from one end to the other end in the third direction. In the figure, the wiring portion in the lower right of the figure is the first upper wiring portion 12A1, and the wiring portion in the upper right of the figure is the second upper wiring portion 12A2, but the first and second wiring portions may be reversed.

[0078] The number of lower wiring portions 12B arranged in the third direction on the lower surface 11B is greater than the number of upper wiring portions 12A arranged in the first direction on the first outer surface 11D1 side. The number of lower wiring portions 12B arranged in the third direction on the lower surface 11B is greater than the number of upper wiring portions 12A arranged in the second direction on the second outer surface 11D2 side. These relationships are also satisfied for the number of regions of the upper wiring portions 12A exposed from the insulating layer 11S.

[0079] When viewed from above, the base 11 has one or more lower wiring portions 12B provided on the lower surface 11B of the base 11 in the region that includes the upper surface 11G of the first step portion 11F1 when the base 11 is divided into two regions by a virtual line that passes through the side surface 11H of the first step portion 11F1 and is parallel to this side surface 11H.

[0080] When the base 11 is divided into two regions by a virtual line that passes through the side surface 11H of the second step portion 11F2 and is parallel to this side surface 11H in a top view, the region that includes the upper surface 11G of the second step portion 11F2 does not have one or more lower wiring portions 12B provided on the lower surface 11B of the base 11. Note that this region may have one or more lower wiring portions 12B provided on the lower surface 11B of the base 11.

[0081] The base 11 has one or more lower bonding portions 12C on the outer surface 11D side different from the outer surface 11D on which the one or more lower wiring portions 12B are provided. The one or more lower bonding portions 12C are provided, for example, on the second outer surface 11D2 side. This improves bonding stability when bonding the base 11 to another component.

[0082] The plurality of lower joints 12C include a first lower joint 12C1 and a second lower joint 12C2. The plurality of lower joints 12C further include a third lower joint 12C3. The plurality of lower joints 12C further include a fourth lower joint 12C4.

[0083] The first lower joint portion 12C1, the second lower joint portion 12C2, the third lower joint portion 12C3, and the fourth lower joint portion 12C4 are arranged in one direction. Hereinafter, this direction will be referred to as the fourth direction. The fourth direction and the third direction are the same direction. Note that the fourth direction and the third direction do not have to be the same direction. These lower joint portions 12C are arranged in the fourth direction in the order of the third lower joint portion 12C3, the first lower joint portion 12C1, the fourth lower joint portion 12C4, and the second lower joint portion 12C2. The arrangement order of the lower joint portions 12C may be different from this.

[0084] When viewed from below, the shapes of the third lower joint 12C3, the first lower joint 12C1, the fourth lower joint 12C4, and the second lower joint 12C2 are the same as the shapes of the first lower wiring portion 12B1, the second lower wiring portion 12B2, the third lower wiring portion 12B3, and the fourth lower wiring portion 12B4, respectively.

[0085] The one or more lower joints 12C may include at least one lower joint 12C electrically connected to the upper wiring portion 12A. One or each lower joint 12C may be electrically connected to the upper wiring portion 12A. None of the one or more lower joints 12C may be electrically connected to the upper wiring portion 12A. In the base 11, the first lower joint 12C1 is electrically connected to the first upper wiring portion 12A1. In the base 11, the second lower joint 12C2 is electrically connected to the second upper wiring portion 12A2. In the base 11, the third lower joint 12C3 is electrically connected to the third upper wiring portion 12A3. In the base 11, the fourth lower joint 12C4 is electrically connected to the fourth upper wiring portion 12A4. This improves the flexibility of the arrangement of the light emitting device 1.

[0086] The base 11 may have a bonding pattern. The bonding pattern is provided on the second upper surface 11C. The bonding pattern is provided in a ring shape. The bonding pattern is provided in a rectangular ring shape. In top view, the first upper surface 11A is surrounded by the bonding pattern.

[0087] The base 11 can be formed, for example, using ceramic as the main material. Examples of the ceramic that can be the main material of the base 11 include aluminum nitride, silicon nitride, aluminum oxide, and silicon carbide.

[0088] Here, the term "main material" refers to the material that accounts for the largest proportion of the mass or volume of the target structure. Note that when the target structure is formed from a single material, that material is the main material. In other words, when a material is the main material, it includes the possibility that the proportion of that material can be 100%.

[0089] The base 11 may be formed using a base member and a frame member formed using different main materials. The base member may be formed using, for example, a material with excellent heat dissipation properties, such as a metal or a metal-containing composite, graphite, or diamond, as its main material. Examples of metals that serve as the main material of the base member include copper, aluminum, or iron. Examples of metal-containing composites that serve as the main material of the base member include copper-molybdenum and copper-tungsten. The frame member may be formed using, for example, the ceramics listed above as the main material of the base 11 as its main material.

[0090] The wiring portion 12 can be formed, for example, using a metal material as the main material. Examples of the metal material that can be the main material of the wiring portion 12 include elemental metals such as Cu, Ag, Ni, Au, Ti, Pt, Pd, Cr, and W, or alloys containing these metals. The wiring portion 12 can be formed, for example, by one or more metal layers.

[0091] The bonding pattern provided on the second upper surface 11C can be formed, for example, using a metal material as the main material. Examples of the metal material that can be the main material of the bonding pattern include elemental metals such as Cu, Ag, Ni, Au, Sn, Ti, and Pd, or alloys containing these metals. The bonding pattern can be composed of, for example, one or more metal layers.

[0092] The lid 14 has an upper surface 14A and a lower surface 14B. The lid 14 also has one or more side surfaces 14C. The lid 14 is configured in the shape of a rectangular parallelepiped flat plate. However, the shape of the lid 14 does not have to be rectangular.

[0093] The lid 14 is bonded to the base 11. The lower surface 14B of the lid 14 is bonded to the second upper surface 11C of the base 11. The lid 14 is bonded to the bonding pattern of the base 11. The lid 14 is bonded to the base 11 via an adhesive.

[0094] The lid 14 has a translucent property that allows light to pass through. Here, translucency means that the transmittance of light incident on the lid 14 is 80% or more. Note that the lid 14 may have a non-translucent region (a region that does not have translucency) in part.

[0095] The lid 14 can be formed, for example, using glass as the main material, or can be formed, for example, using sapphire as the main material.

[0096] (Light-emitting element 20) The light-emitting element 20 has an upper surface 21A, a lower surface 21B, and multiple side surfaces 21C. The shape of the upper surface 21A is rectangular. This rectangle has long sides and short sides. The outer shape of the light-emitting element 20 when viewed from above is rectangular. This rectangle has long sides and short sides. Note that the shape of the upper surface 21A and the outer shape of the light-emitting element 20 when viewed from above are not limited to this.

[0097] The light-emitting element 20 has a light-emitting surface 22 that emits light. For example, the side surface 21C can be the light-emitting surface 22. The side surface 21C that serves as the light-emitting surface 22 intersects with a short side of the top surface 21A. Alternatively, for example, the top surface 21A can be the light-emitting surface 22. The light-emitting element 20 has one or more light-emitting surfaces 22.

[0098] For example, a light-emitting element that emits blue light can be used as the light-emitting element 20. Alternatively, for example, a light-emitting element that emits green light can be used as the light-emitting element 20. Alternatively, for example, a light-emitting element that emits red light can be used as the light-emitting element 20. Note that a light-emitting element that emits light of another color or wavelength may also be used as the light-emitting element 20.

[0099] Here, blue light refers to light whose peak emission wavelength is in the range of 420 nm to 494 nm, green light refers to light whose peak emission wavelength is in the range of 495 nm to 570 nm, and red light refers to light whose peak emission wavelength is in the range of 605 nm to 750 nm.

[0100] The light-emitting element 20 that emits blue light or the light-emitting element 20 that emits green light may include a light-emitting element containing a nitride semiconductor. Examples of nitride semiconductors that can be used include GaN-based semiconductors such as GaN, InGaN, and AlGaN. The light-emitting element 20 that emits red light may include a light-emitting element that contains InAlGaP-based, GaInP-based, and GaAs-based semiconductors such as GaAs and AlGaAs.

[0101] For example, a semiconductor laser element can be used as the light-emitting element 20. Also, a single-emitter semiconductor laser element having one emitter can be used as the light-emitting element 20. Also, a multi-emitter semiconductor laser element having multiple emitters can be used as the light-emitting element 20. Note that the light-emitting element 20 is not limited to a semiconductor laser element, and a light-emitting diode or the like may also be used.

[0102] Here, a semiconductor laser element, which is an example of the light emitting element 20, will be described.

[0103] The semiconductor laser element emits directional laser light. Diverging light with a spreading area is emitted from the light-emitting surface 22 of the semiconductor laser element. The light emitted from the semiconductor laser element forms an elliptical far-field pattern (hereinafter referred to as "FFP") in a plane parallel to the light-emitting surface 22. The FFP refers to the shape and light intensity distribution of the emitted light at a position away from the light-emitting surface of the semiconductor laser element.

[0104] Here, the light passing through the center of the elliptical shape of the FFP, in other words, the light with the peak intensity in the light intensity distribution of the FFP, is referred to as the light traveling along the optical axis or the light passing through the optical axis. ２ The light having the above intensity is called the main part of the light.

[0105] The FFP of light emitted from the semiconductor laser element has an elliptical shape in a plane parallel to the light emitting surface 22, with the stacking direction being longer than the direction perpendicular to the stacking direction. The stacking direction is the direction in which multiple semiconductor layers including the active layer are stacked in the semiconductor laser element. The direction perpendicular to the stacking direction can also be referred to as the in-plane direction of the semiconductor layers. The long axis direction of the elliptical shape of the FFP can also be referred to as the fast axis direction of the semiconductor laser element, and the short axis direction can also be referred to as the slow axis direction of the semiconductor laser element.

[0106] Based on the light intensity distribution of the FFP, 1 / e of the peak light intensity ２The angle at which light of this intensity spreads is defined as the light spread angle of the semiconductor laser element. Here, the light spread angle is the angle at which light of the peak intensity (light passing through the optical axis) spreads, and the angle at which light of the peak intensity spreads is defined as the angle at which light of the peak intensity spreads, which is the angle at which light of the peak intensity spreads. ２ The spread angle of light is expressed as the angle formed by the light having a light intensity of 1 / e of the peak light intensity. ２ In the description of this specification, when simply referring to the "angle of light", it is meant to be 1 / e of the peak light intensity. ２ This refers to the angle of spread of light at a light intensity of 1000 nm.

[0107] The divergence angle of the light emitted from the semiconductor laser element in the fast axis direction can be equal to or greater than 20 degrees and less than 65 degrees. The divergence angle of the light in the slow axis direction can be greater than 0 degrees and less than 15 degrees. The divergence angle of the light in the fast axis direction is greater than the divergence angle of the light in the slow axis direction.

[0108] For example, the divergence angle in the fast axis direction of blue light emitted from the semiconductor laser element can be 15 degrees or more and less than 50 degrees, and the divergence angle in the slow axis direction can be more than 0 degrees and less than 10 degrees. Also, for example, the divergence angle in the fast axis direction of green light emitted from the semiconductor laser element can be 15 degrees or more and less than 50 degrees, and the divergence angle in the slow axis direction can be more than 0 degrees and less than 10 degrees. Also, for example, the divergence angle in the fast axis direction of red light emitted from the semiconductor laser element can be 20 degrees or more and less than 65 degrees, and the divergence angle in the slow axis direction can be more than 0 degrees and less than 10 degrees.

[0109] (Submount 30) The submount 30 has an upper surface 31A, a lower surface 31B, and one or more side surfaces 31C. The upper surface 31A can be considered a mounting surface on which other components are mounted. The shape of the upper surface 31A is rectangular. This rectangle of the upper surface 31A can have short sides and long sides. Note that the shape of the upper surface 31A does not have to be rectangular.

[0110] The outer shape of the submount 30 when viewed from above is rectangular. This rectangle of the submount 30 may have short sides and long sides. However, the outer shape of the submount 30 when viewed from above does not have to be rectangular. When viewed from above, the submount 30 may have an outer shape in which the length in one direction (hereinafter, this direction will be referred to as the short side direction of the submount 30) is shorter than the length in the direction perpendicular to this (hereinafter, this direction will be referred to as the long side direction of the submount 30). In the illustrated submount 30, the short side direction is the same as the X direction, and the long side direction is the same as the Y direction.

[0111] The submount 30 may be configured to include a substrate 32A and an upper metal member 32B. The submount 30 may also be configured to include a lower metal member 32C. The upper metal member 32B is provided on the upper surface of the substrate 32A. The lower metal member 32C is provided on the lower surface of the substrate 32A. The submount 30 further includes a wiring layer 33. The wiring layer 33 is provided on the upper metal member 32B.

[0112] The substrate 32A has insulating properties and is made of, for example, silicon nitride, aluminum nitride, or silicon carbide. It is preferable to select ceramic, which has relatively good heat dissipation properties (high thermal conductivity), as the main material of the substrate 32A.

[0113] The upper metal member 32B is primarily made of a metal such as copper or aluminum. The upper metal member 32B has one or more metal layers. The upper metal member 32B may have multiple metal layers made primarily of different metals.

[0114] The lower metal member 32C is primarily made of a metal such as copper or aluminum. The lower metal member 32C has one or more metal layers. The lower metal member 32C may have multiple metal layers made primarily of different metals.

[0115] The wiring layer 33 can be formed using a metal. For example, the wiring layer 33 can be formed using AuSn solder (a metal layer of AuSn).

[0116] For example, the length of the submount 30 in the short side or lateral direction is 700 μm or more and 1200 μm or less. The length of the submount 30 in the long side or longitudinal direction is 1000 μm or more and 2500 μm or less. The difference between the length of the submount 30 in the longitudinal direction and the length of the submount 30 in the lateral direction is 200 μm or more and 1800 μm or less.

[0117] For example, the thickness of the submount 30 (width in the direction perpendicular to the upper surface 31A) is 200 μm or more and 400 μm or less. Also, for example, the thickness of the substrate 32A is 100 μm or more and 300 μm or less. Also, for example, the thickness of the upper metal member 32B is 30 μm or more and 100 μm or less. Also, for example, the thickness of the lower metal member 32C is 30 μm or more and 100 μm or less. Also, for example, the thickness of the wiring layer 33 is 1 μm or more and 10 μm or less.

[0118] (Reflecting member 40) The reflecting member 40 has a lower surface and a light-reflecting surface that reflects light. The light-reflecting surface is inclined with respect to the lower surface. A line connecting the lower end and upper end of the light-reflecting surface is inclined with respect to the lower surface. The angle at which the light-reflecting surface is inclined with respect to the lower surface is called the inclination angle of the light-reflecting surface.

[0119] The light reflecting surface is a flat surface. However, the light reflecting surface may be a curved surface. The inclination angle of the light reflecting surface is 45 degrees. However, the inclination angle of the light reflecting surface does not have to be 45 degrees.

[0120] The reflecting member 40 can be primarily made of glass, metal, or the like. It is preferable to use a heat-resistant material as the primary material of the reflecting member 40. The primary material can be, for example, glass such as quartz or BK7 (borosilicate glass), or metal such as Al. The reflecting member 40 can also be formed using Si as the primary material.

[0121] If the main material is a reflective material such as Al, the light reflecting surface can be formed from the main material. Instead of forming the light reflecting surface from the main material, the main material may be used to form the outline of the reflecting member 40, and the light reflecting surface may be formed on the surface of the outline. In this case, the light reflecting surface may be formed from a metal layer such as Ag or Al, or a Ta layer. ２ O ５ / SiO ２ , TiO ２ / SiO２ , Nb ２ O ５ / SiO ２ The dielectric multilayer film can be formed using the above.

[0122] The light reflecting surface has a reflectance of 90% or more for the peak wavelength of light irradiated onto the light reflecting surface. This reflectance may be 95% or more. This reflectance may also be 99% or more. The light reflectance is 100% or less, or less than 100%.

[0123] (Protection Element 50) The protection element 50 has an upper surface 51A, a lower surface 51B, and one or more side surfaces 51C. The shape of the protection element 50 is a rectangular parallelepiped. However, the shape of the protection element 50 does not have to be a rectangular parallelepiped.

[0124] The protective element 50 is intended to prevent a specific element (e.g., a semiconductor laser element) from being destroyed by excessive current flowing through it. An example of the protective element 50 is a Zener diode. The Zener diode may be made of Si.

[0125] (Wiring 60) The wiring 60 is a linear conductive material with joints at both ends. The joints at both ends become joints with other components. The wiring 60 is used for electrical connection between two components. The wiring 60 is, for example, a metal wire. Examples of metals that can be used include gold, aluminum, silver, and copper.

[0126] (Optical member 70) The optical member 70 has an upper surface 71A, a lower surface 71B, and one or more side surfaces 71C. The optical member 70 imparts an optical effect to light incident on the optical member 70. Examples of optical effects imparted to light by the optical member 70 include light collection, collimation, diffusion, polarization, diffraction, wave combination, light guidance, reflection, and wavelength conversion.

[0127] The optical member 70 has an optically active surface that provides an optical effect. The upper surface 71A, the lower surface 71B, or the side surface 71C can be the optically active surface. Alternatively, the optically active surface may be located at a position different from the upper surface 71A, the lower surface 71B, or the side surface 71C. For example, the optically active surface may be formed inside the optical member 70 rather than on the surface thereof.

[0128] The optical element 70 may have one or more lens surfaces 71D. The lens surfaces 71D are optically active surfaces of the optical element 70. Note that the optical element 70 having the lens surfaces 71D may also be called a lens element. The optical element 70 applies an optical effect of focusing, diffusing, or collimating to light that passes through the lens surfaces 71D and is emitted from the optical element 70. For example, the optical element 70 is a collimating lens that converts light that enters the optical element 70 into collimated light and emits it.

[0129] One or each lens surface 71D is provided on the upper surface 71A side. Alternatively, lens surface 71D may be provided on the lower surface 71B side. Upper surface 71A and lower surface 71B are flat surfaces. One or each lens surface 71D intersects with upper surface 71A. In a top view, one or each lens surface 71D is surrounded by upper surface 71A.

[0130] When viewed from above, the outer shape of the optical member 70 is rectangular. However, the outer shape of the optical member 70 when viewed from above does not have to be rectangular. The lower surface 71B is flat. No lens surface 71D is formed on the lower surface 71B side of the optical member 70. The shape of the lower surface 71B is rectangular. However, the shape of the lower surface 71B does not have to be rectangular.

[0131] In optical member 70, the portion overlapping with lens surface 71D in top view is referred to as lens portion 72A. In optical member 70, the portion overlapping with top surface 71A in top view is referred to as non-lens portion 72B. Bottom surface 71B has a region that forms the bottom surface of one or each lens portion 72A and a region that forms the bottom surface of non-lens portion 72B.

[0132] The optical member 70 may have a plurality of lens surfaces 71D formed in a line. The direction in which the plurality of lens surfaces 71D are arranged in a top view is referred to as the lens connection direction. In the illustrated optical member 70, the connection direction is the same as the X direction.

[0133] The plurality of lens surfaces 71D are formed so that the vertices of the lens surfaces 71D are aligned on a straight line. This imaginary line connecting the vertices is parallel to the lower surface 71B of the optical member 70. Note that "parallel" here includes a difference of ±5 degrees or less.

[0134] The curvature of two or more of the lens surfaces 71D may be the same for some or all of the lens surfaces 71D. All of the lens surfaces 71D may have the same curvature.

[0135] The optical member 70 is translucent. The optical member 70 has a transmittance of 80% or more for the peak wavelength of light incident on the optical member 70. The optical member 70 may have a translucent region and a non-translucent region (hereinafter referred to as a non-translucent region). In the non-translucent region, the transmittance for the peak wavelength of light incident on the optical member 70 is 50% or less. The optical member 70 can be formed using glass such as BK7, for example.

[0136] (Light emitting device 1) In the light emitting device 1, one or more light emitting elements 20 are arranged in the internal space of the package 10. The one or more light emitting elements 20 are arranged on the first upper surface 11A. The one or more light emitting elements 20 are surrounded by the second upper surface 11C in top view. The one or more light emitting elements 20 may be configured with a plurality of light emitting elements 20 arranged side by side in one direction.

[0137] One or each light-emitting element 20 emits light in a predetermined direction from light exit surface 22. One or each light-emitting element 20 emits light toward inner surface 11E of base 11. One or each light-emitting element 20 emits light in a first direction. Alternatively, one or each light-emitting element 20 emits light in a second direction.

[0138] The one or more light-emitting elements 20 include a first light-emitting element 20A and a second light-emitting element 20B. The first light-emitting element 20A and the second light-emitting element 20B emit light in the same direction. The one or more light-emitting elements 20 further include a third light-emitting element 20C. The first light-emitting element 20A and the third light-emitting element 20C emit light in the same direction.

[0139] The one or more light-emitting elements 20 may include one or more first light-emitting elements 20A. The one or more light-emitting elements 20 may include one or more second light-emitting elements 20B. The one or more light-emitting elements 20 may include one or more third light-emitting elements 20C.

[0140] The one or more light-emitting elements 20 are disposed between the first step portion 11F1 and the second step portion 11F2 in a top view. The one or more light-emitting elements 20 are disposed so that a straight line connecting the first step portion 11F1 and the second step portion 11F2 passes through the one or more light-emitting elements 20 in a top view.

[0141] In a top view, the distance from one or more first light-emitting elements 20A to first step portion 11F1 is shorter than the distance from one or more second light-emitting elements 20B to first step portion 11F1. In a top view, the distance from one or more second light-emitting elements 20B to second step portion 11F2 is shorter than the distance from one or more first light-emitting elements 20A to second step portion 11F2.

[0142] In a top view, the distance from one or more first light-emitting elements 20A to the first step portion 11F1 is shorter than the distance from one or more third light-emitting elements 20C to the first step portion 11F1. In a top view, the distance from one or more third light-emitting elements 20C to the second step portion 11F2 is shorter than the distance from one or more first light-emitting elements 20A to the second step portion 11F2. In a top view, the distance from one or more second light-emitting elements 20B to the second step portion 11F2 is shorter than the distance from one or more third light-emitting elements 20C to the second step portion 11F2. In a top view, the one or more third light-emitting elements 20C are arranged between the one or more first light-emitting elements 20A and the one or more second light-emitting elements 20B.

[0143] The one or more first light-emitting elements 20A emit light having a peak emission wavelength in the range of a first wavelength ±10 nm. The one or more second light-emitting elements 20B emit light having a peak emission wavelength in the range of a second wavelength ±10 nm. The difference between the first wavelength and the second wavelength is 30 nm or more.

[0144] The one or more third light-emitting elements 20C emit light whose emission peak wavelength is in the range of the third wavelength ±10 nm. The difference between the third wavelength and the first wavelength and the difference between the third wavelength and the second wavelength are both 30 nm or more.

[0145] In the light emitting device 1, one or each of the light emitting elements 20 is disposed on a submount 30. The number of light emitting elements 20 disposed on one submount 30 is one. The light emitting element 20 is disposed on the wiring layer 33 of one or each of the submounts 30.

[0146] One or more submounts 30 are disposed on the first upper surface 11A. The one or more submounts 30 may be configured by a plurality of submounts 30 arranged side by side in a direction perpendicular to the first direction in a top view. The submount 30 on which the first light-emitting element 20A is disposed and the submount 30 on which the second light-emitting element 20B is disposed have different sizes of upper surfaces 31A. The width of each submount 30 in the first direction is greater than the width in the direction perpendicular to the first direction.

[0147] In the light emitting device 1, one or more reflective members 40 are disposed in the internal space of the package 10. The one or more reflective members 40 are disposed on the first upper surface 11A. The one or more reflective members 40 are surrounded by the second upper surface 11C in top view. The one or more reflective members 40 may be composed of multiple reflective members 40 arranged in one direction.

[0148] One or each of the reflecting members 40 reflects light emitted from the light-emitting elements 20. One or each of the reflecting members 40 is arranged so that the light-reflecting surface faces the light-emitting surface 22 of the light-emitting element 20. The light emitted from one or more light-emitting elements 20 is reflected by one or more of the reflecting members 40 and travels upward from the light-reflecting surface.

[0149] The one or more reflective members 40 are disposed between the one or more light-emitting elements 20 and the inner surface 11E in a top view. The distance from the one or more reflective members 40 to the inner surface 11E is shorter than the distance from the one or more light-emitting elements 20 to the inner surface 11E opposite the one or more light-emitting elements 20. By disposing the one or more reflective members 40 close to the inner surface 11E, the light emitted from the light-emitting device 1 can also be brought closer to the inner surface 11E.

[0150] In the light emitting device 1, one or more protective elements 50 are disposed in the internal space of the package 10. The one or more protective elements 50 are disposed on the upper surface 31A of the submount 30 or the upper surface 11G of the stepped portion 11F. The one or more protective elements 50 protect the one or more light emitting elements 20.

[0151] In the light emitting device 1, a plurality of wirings 60 are used to electrically connect one or more light emitting elements 20 to the package 10. The plurality of wirings 60 are arranged in the internal space of the package 10. The plurality of wirings 60 include one or more first wirings 60A and one or more second wirings 60B. The plurality of wirings 60 may also include one or more third wirings 60C. The plurality of wirings 60 may also include one or more fourth wirings 60D.

[0152] One or more first wirings 60A are provided on one of the two electrodes of the first light-emitting element 20A, and are joined to either the first upper wiring portion 12A1 or the second upper wiring portion 12A2. Note that "the wiring is provided on one of the two electrodes" means that the electrode closer to the wiring on the current path is the one electrode, and the electrode farther away is the other electrode. In the light-emitting device 1 illustrated in FIGS. 7A and 10, the first wiring 60A is joined to the second upper wiring portion 12A2.

[0153] One or more second wirings 60B are provided on one of the two electrodes of the second light-emitting element 20B and are joined to either the third upper wiring portion 12A3 or the fourth upper wiring portion 12A4. This ensures flexibility by allowing the upper wiring portions 12A provided on the two outer surfaces 11D to be used to connect the wirings 60 for the first light-emitting element 20A and the second light-emitting element 20B, while also providing convenience by allowing the two lower wiring portions 12B provided on one outer surface to be consolidated into wiring portions 12 for electrical connection to an external power source. In other words, by distributing multiple wiring portions 12 on one side and integrating multiple wiring portions 12 on the other side, it is possible to provide both flexibility and convenience in wiring connections depending on the application. In the light-emitting device 1 illustrated in FIGS. 7A and 10, the second wirings 60B are joined to the third upper wiring portion 12A3.

[0154] One or more third wirings 60C are provided on the side of one of the two electrodes of the third light-emitting element 20C, and are joined to upper wiring portions 12A among the first upper wiring portion 12A1, the second upper wiring portion 12A2, the third upper wiring portion 12A3, and the fourth upper wiring portion 12A4, other than the upper wiring portion 12A to which the first wiring 60A is joined and the upper wiring portion 12A to which the second wiring 60B is joined. In the light-emitting device 1 illustrated in FIGS. 7A and 10, the third wiring 60C is joined to the fourth upper wiring portion 12A4.

[0155] The one or more fourth wirings 60D are provided on the other electrode side of each of the one or more first light-emitting elements 20A, the one or more second light-emitting elements 20B, and the one or more third light-emitting elements 20C, and are joined to upper wiring portions 12A among the first upper wiring portion 12A1, the second upper wiring portion 12A2, the third upper wiring portion 12A3, and the fourth upper wiring portion 12A4, other than the upper wiring portion 12A to which the first wiring 60A is joined, the upper wiring portion 12A to which the second wiring 60B is joined, and the upper wiring portion 12A to which the third wiring 60C is joined. In the light-emitting device 1 illustrated in FIGS. 7A and 10, the fourth wiring 60D is joined to the first upper wiring portion 12A1.

[0156] One or each of the third wirings 60C is longer than the fourth wirings 60D. The one or more third wirings 60C include third wirings 60C that partially overlap the third light-emitting element 20C or the submount 30 on which the third light-emitting element 20C is disposed in a top view. When it is desired to reduce the length of the third wirings 60C, it is preferable that, in the light-emitting device 1, one or more first light-emitting elements 20A and one or more second light-emitting elements 20B, which are arranged on the side in which the third wirings C extend from the third light-emitting element 20C, are configured as a single light-emitting element 20. Considering the wiring resistance, a shorter length of the wiring 60 allows a larger current to flow.

[0157] Of the one or more light-emitting elements 20, the number of light-emitting elements 20 arranged on the side in which the third wiring 60C extends from the third light-emitting element 20C is smaller than the number of light-emitting elements 20 arranged on the opposite side. The distance from the inner surface 11E located on the side in which the third wiring 60C extends from the third light-emitting element 20C, among the first inner surface 11E1 and the second inner surface 11E2, to the third light-emitting element 20C is shorter than the distance from the inner surface 11E located on the opposite side to the third light-emitting element 20C. In this way, a wiring layout can be achieved that takes wiring resistance into consideration.

[0158] The one or more first wirings 60A may be composed of a plurality of first wirings 60A, each of which is bonded to the first light-emitting element 20A or the submount 30 on which the first light-emitting element 20A is disposed. When the light-emitting device 1 is composed of such a plurality of first wirings 60A, a larger current can be passed through the first light-emitting element 20A.

[0159] One or each of the third wirings 60C is longer than the first wirings 60A. One or more first wirings 60A may be composed of a plurality of first wirings 60A, the number of which is greater than the one or more third wirings 60C. By making the number of third wirings 60C, which are longer than the first wirings 60A, smaller than the number of first wirings 60A, wiring implementation becomes easier.

[0160] The plurality of wirings 60 includes wirings 60 bonded to the submount 30 on which the second light-emitting element 20B is arranged and the submount 30 on which the third light-emitting element 20C is arranged. The plurality of wirings 60 includes wirings 60 bonded to the submount 30 on which the third light-emitting element 20C is arranged and the submount 30 on which the first light-emitting element 20A is arranged. The plurality of wirings 60 includes wirings 60 bonded to the first light-emitting element 20A and the submount 30 on which a first light-emitting element 20A different from the first light-emitting element 20A is arranged. The plurality of wirings 60 includes wirings 60 bonded to the protection element 50.

[0161] In the light emitting device 1, an optical member 70 is fixed to the package 10. The optical member 70 is bonded to the top surface 14A. Light emitted from one or more light emitting elements 20 is incident on the optically active surface of the optical member 70. The light emitted from one or more light emitting elements 20 passes through one or more lens surfaces 71D. As a result, for example, the light emitted from one or more light emitting elements 20 is collimated and emitted from the light emitting device 1.

[0162] (Wiring Board 101) The wiring board 101 has an upper surface 101A, a lower surface 101B, and one or more side surfaces 101C. The wiring board 101 has a plate-like shape. When viewed from above, the outer edge of the wiring board 101 has a rectangular shape. This rectangle can have long and short sides. In the illustrated wiring board 101, the long side of the rectangle is in the same direction as the X direction, and the short side is in the same direction as the Y direction.

[0163] The wiring substrate 101 has a heat dissipation portion 101D, an electrode portion 101E, and an insulating portion 101F. The heat dissipation portion 101D functions as a heat dissipation path for heat generated from other components mounted on the wiring substrate 101. The electrode portion 101E is electrically connected to the other components mounted on the wiring substrate 101.

[0164] The insulating portion 101F insulates the heat dissipation portion 101D from the electrode portion 101E. The insulating portion 101F is provided on the wiring substrate 101 to insulate the heat dissipation portion 101D from the electrode portion 101E from each other electrically.

[0165] The wiring substrate 101 includes a heat dissipation member 111, a plurality of electrode members 121, and one or more insulating members 131. The heat dissipation section 101D includes the heat dissipation member 111, the electrode section 101E includes the plurality of electrode members 121, and the insulating section 101F includes one or more insulating members 131.

[0166] The wiring substrate 101 further has a dummy electrode portion 101G. On the upper surface 101A, the dummy electrode portion 101G is formed of the same material as the electrode portion 101E. The wiring substrate 101 includes a bonding member 141, and the dummy electrode portion 101G includes the bonding member 141.

[0167] The plurality of electrode members 121 include a first electrode member 121A and a second electrode member 121B. The plurality of electrode members 121 also include a third electrode member 121C and a fourth electrode member 121D.

[0168] The first electrode member 121A, the second electrode member 121B, the third electrode member 121C, and the fourth electrode member 121D are arranged such that, in a top view, a single imaginary straight line L1 passes through the first electrode member 121A, the second electrode member 121B, the third electrode member 121C, and the fourth electrode member 121D. Having an area where these electrode members 121 are arranged in a straight line enables these electrode members 121 to be arranged together in this area. The first electrode member 121A, the second electrode member 121B, the third electrode member 121C, and the fourth electrode member 121D are arranged such that, in a top view, a virtual line perpendicular to the virtual line L1 does not pass through all of the first electrode member 121A, the second electrode member 121B, the third electrode member 121C, and the fourth electrode member 121D. The first electrode member 121A, the second electrode member 121B, the third electrode member 121C, and the fourth electrode member 121D are arranged such that, when viewed from above, a virtual line perpendicular to the virtual line L1 passes through one or two of the first electrode member 121A, the second electrode member 121B, the third electrode member 121C, and the fourth electrode member 121D.

[0169] The first electrode member 121A has, on the upper surface 101A, a first region 121A1 and a second region 121A2 that are not covered by one or more insulating members 131 and are exposed from the one or more insulating members 131. The first region 121A1 and the second region 121A2 are spaced apart from each other in a top view. By using the first region 121A1 and the second region 121A2, a component connected to the first region 121A1 can be electrically connected to another component connected to the second region 121A2.

[0170] The second electrode member 121B has, on the upper surface 101A, a first region 121B1 and a second region 121B2 that are not covered by one or more insulating members 131 and are exposed from the one or more insulating members 131. The first region 121B1 and the second region 121B2 are spaced apart from each other in a top view.

[0171] The third electrode member 121C has, on the upper surface 101A, a first region 121C1 and a second region 121C2 that are not covered by one or more insulating members 131 and are exposed from the one or more insulating members 131. The first region 121C1 and the second region 121C2 are spaced apart from each other in a top view.

[0172] The fourth electrode member 121D has, on the upper surface 101A, a first region 121D1 and a second region 121D2 that are not covered by one or more insulating members 131 and are exposed from the one or more insulating members 131. The first region 121D1 and the second region 121D2 are spaced apart from each other in a top view.

[0173] In a top view, the first region 121A1 of the first electrode member 121A, the first region 121B1 of the second electrode member 121B, the first region 121C1 of the third electrode member 121C, and the first region 121D1 of the fourth electrode member 121D are arranged side by side in one direction. Hereinafter, this direction will be referred to as the fifth direction. The fifth direction is the same direction as the short side direction of the wiring substrate 101.

[0174] When viewed from above, when the upper surface 101A is divided into four regions by three imaginary straight lines parallel to the short side direction that pass through each point that divides the long side of the wiring board 101 into four equal parts, the second region 121A2 of the first electrode member 121A, the second region 121B2 of the second electrode member 121B, the second region 121C2 of the third electrode member 121C, and the second region 121D2 of the fourth electrode member 121D are arranged in one of the end regions.

[0175] In addition, the first region 121A1 of the first electrode member 121A, the first region 121B1 of the second electrode member 121B, the first region 121C1 of the third electrode member 121C, and the first region 121D1 of the fourth electrode member 121D are arranged in this one end region or in a region adjacent to this one end region.

[0176] The first electrode member 121A, the second electrode member 121B, the third electrode member 121C, and the fourth electrode member 121D are not provided in the other end region of these end regions or in the region adjacent to this other end region. In other words, these electrode members 121 are provided on one half of the wiring substrate 101.

[0177] Assume that the top surface 101A is divided into two regions by a virtual straight line L2 that passes only through the outer edge of the heat dissipation section 101D and is parallel to the fifth direction. In this case, the first electrode member 121A, the second electrode member 121B, the third electrode member 121C, and the fourth electrode member 121D are not provided in the region of the two regions that includes the outer edge and the inside of the outer edge of the heat dissipation section 101D, including the region that overlaps with the insulating section 101F. In other words, even when the wiring board 101 is viewed three-dimensionally from above, including the portions that overlap with the region, the first electrode member 121A, the second electrode member 121B, the third electrode member 121C, and the fourth electrode member 121D are provided so as to fit within the other region.

[0178] It is desirable that the electrode member 121 be provided without contacting the heat dissipation portion 101D. Therefore, by not providing the electrode member 121 on the heat dissipation portion 101D side of the virtual line L2, the design of the heat dissipation portion 101D side can be considered without including the electrode member 121, which can contribute to reducing the width of the wiring board 101 in the fifth direction.

[0179] In a top view, the heat dissipation portion 101D is disposed between the electrode portion 101E and the dummy electrode portion 101G. In a top view, the electrode portion 101E, the heat dissipation portion 101D, and the dummy electrode portion 101G are disposed side by side in a direction perpendicular to the fifth direction.

[0180] The bonding member 141 has a first region 141A, a second region 141B, a third region 141C, and a fourth region 141D that are not covered by one or more insulating members 131 and are exposed from the one or more insulating members 131. In a top view, the first region 141A, the second region 141B, the third region 141C, and the fourth region 141D are spaced apart from one another.

[0181] The first region 141A, the second region 141B, the third region 141C, and the fourth region 141D are arranged side by side in the fifth direction. The first region 141A of the bonding member 141 and the first region 121A1 of the first electrode member 121A have the same shape. The second region 141B of the bonding member 141 and the first region 121B1 of the second electrode member 121B have the same shape. The third region 141C of the bonding member 141 and the first region 121C1 of the third electrode member 121C have the same shape. The fourth region 141D of the bonding member 141 and the first region 121D1 of the fourth electrode member 121D have the same shape.

[0182] The wiring substrate 101 may have a dummy electrode portion 101G. The dummy electrode portion 101G may be formed in the same manner as the electrode portion 101E. The dummy electrode portion 101G does not necessarily require the other components to be electrically connected to the dummy electrode portion 101G in order to supply power to the other components. In other words, the dummy electrode portion 101G may be electrically connected to the light-emitting element 20, but the light-emitting element 20 can receive power even if it is not electrically connected to the dummy electrode portion 101G.

[0183] One or more insulating members 131 are provided on the heat dissipation member 111. The one or more insulating members 131 include a first insulating member 131A provided on one or more second upper surfaces 111B.

[0184] The plurality of electrode members 121 are provided on the first insulating member 131A. The plurality of electrode members 121 are provided in a plurality of regions that are spaced apart from one another. The heat dissipation member 111 and each of the electrode members 121 are spaced apart from one another. Each of the electrode members 121 is insulated from the heat dissipation member 111 via the first insulating member 131A.

[0185] The wiring substrate 101 may have one or more dummy electrode members 151. The dummy electrode portion 101G includes one or more dummy electrode members 151. Note that a part or all of the dummy electrode portion 101G may be formed by an electrode member 121. The one or more dummy electrode members 151 are provided on a first insulating member 131A. In a top view, a first upper surface 111A may be disposed between the electrode member 121 and the dummy electrode member 151.

[0186] Each electrode member 121 has an upper surface 122A and one or more side surfaces 122B. In a top view, the first upper surface 111A of the heat dissipation member 111 and the upper surface 122A of each electrode member 121 are spaced apart from each other. One or each electrode member 121 has a side surface 122B that faces the first side surface 111C of the heat dissipation member 111.

[0187] The one or more insulating members 131 include a second insulating member 131B provided between the heat dissipation member 111 and each electrode member 121. One or each first side surface 111C of the heat dissipation member 111 is covered by the second insulating member 131B. One or each side surface 122B of the electrode member 121, which faces the first side surface 111C, is covered by the second insulating member 131B. The second insulating member 131B fills the gap between the first side surface 111C and the side surface 122B.

[0188] The second insulating member 131B covers a part of the first upper surface 111A continuing from the first side surface 111C of the heat dissipation member 111. The second insulating member 131B covers a part of the upper surface 122A continuing from the side surface 122B of the electrode member 121.

[0189] The second insulating member 131B is partially provided on the electrode member 121 in a top view. The second insulating member 131B makes the single connected electrode member 121 appear to be divided into multiple regions. In this way, a wiring pattern is formed on the upper surface 101A of the wiring substrate 101.

[0190] One or more bonding members 141 are provided on the heat dissipation member 111 or the electrode member 121. The upper surfaces of the one or more bonding members 141 form a partial area of ​​the upper surface 101A of the wiring substrate 101. The upper surface of the insulating member 131 forms another partial area of ​​the upper surface 101A of the wiring substrate 101.

[0191] The heat dissipation member 111 may be primarily made of a metal material. For example, an elemental metal such as Cu, Ag, Al, Ni, Rh, Au, Ti, Pt, Pd, Mo, Cr, or W, or an alloy containing these metals, may be used as the primary material of the heat dissipation member 111. The heat dissipation member 111 is preferably made of a material with excellent heat dissipation properties. The heat dissipation member 111 may be made to contain 95% by mass or more of copper.

[0192] A metal material can be used as the main material of the electrode member 121. For example, the electrode member 121 can be made of a single metal such as Cu, Ag, Al, Ni, Rh, Au, Ti, Pt, Pd, Mo, Cr, or W, or an alloy containing any of these metals.

[0193] The insulating member 131 is formed of an insulating material. For example, the insulating member 131 can be primarily made of polyimide. Alternatively, the insulating member 131 can be primarily made of glass epoxy, which is made by impregnating one or more sheets of glass cloth with a thermosetting insulating resin such as epoxy resin and then curing the thermosetting insulating resin, or liquid crystal polymer. For example, the first insulating member 131A can be made of a film-like polyimide, and the second insulating member 131B can be made of a resist such as solder resist.

[0194] The bonding members 141 may be mainly made of a metal material such as Au, Ag, Cu, Pt, Ni, Pd, or an alloy containing one of these metals. The bonding members 141 may be formed by plating.

[0195] Next, the light emitting module 901 will be described.

[0196] (Light-emitting module 901) In the light-emitting module 901, the light-emitting device 1 is mounted on a wiring substrate 101. The light-emitting device 1 is disposed on an upper surface 101A of the wiring substrate 101. The upper surface 101A can also be referred to as a mounting surface on which the light-emitting device 1 is mounted. A lower surface 11B of the light-emitting device 1 serves as a bonding surface that bonds to the wiring substrate 101.

[0197] The light emitting device 1 is electrically connected to the electrode portion 101E of the wiring substrate 101. This allows power to be supplied from the outside to the light emitting device 1 through the wiring substrate 101. The frame portion 11N of the light emitting device 1 is joined to the electrode portion 101E.

[0198] The light emitting device 1 is connected to the heat dissipation portion 101D of the wiring substrate 101. The bottom surface 11B of the light emitting device 1 is joined to the heat dissipation portion 101D. This allows heat generated from the light emitting device 1 to be efficiently dissipated to the outside of the light emitting device 1 through the wiring substrate 101. The base 11M of the light emitting device 1 is joined to the heat dissipation portion 101D.

[0199] The first region 121A1 of the first electrode member 121A is bonded to the first lower wiring portion 12B1. The first region 121B1 of the second electrode member 121B is bonded to the second lower wiring portion 12B2. The first region 121C1 of the third electrode member 121C is bonded to the third lower wiring portion 12B3. The first region 121D1 of the fourth electrode member 121D is bonded to the fourth lower wiring portion 12B4. By consolidating multiple lower wiring portions 12B on one outer surface in this manner, multiple electrode members 121 can also be consolidated on the wiring substrate 101, improving the convenience of wiring connection to the wiring substrate 101. In the light-emitting module 901, the third direction and the fifth direction are the same.

[0200] Alternatively, the ability to aggregate the plurality of electrode members 121 allows the wiring board 101 to be made smaller, thereby enabling the light-emitting module 901 to be made smaller. Alternatively, the plurality of electrode members 121 are aggregated and provided on one half of the side, thereby ensuring a large area of ​​the heat dissipation portion 101D on the upper surface 101A, thereby realizing the wiring board 101 with good heat dissipation performance.

[0201] When viewed from below, the ratio of the width of the base material constituting the base portion 11M to the width of the package 10 in the short side direction of the package 10 is 70% or more and 90% or less. When viewed from below, the ratio of the width of the base material constituting the base portion 11M to the width of the package 10 in the second direction is 70% or more and 90% or less. When viewed from below, the ratio of the width of the base material constituting the base portion 11M to the width of the package 10 in the third direction is 70% or more and 90% or less. In this way, by providing a large ratio of the base material to the package 10, the heat dissipation performance of the light-emitting module 901 is improved.

[0202] The electrode member 121 is not formed in a position away in the fifth direction from the region where the light emitting device 1 and the heat dissipation portion 101D are joined. By not providing the electrode member 121 in this position, the width of the wiring substrate 101 in the fifth direction can be reduced, which contributes to the miniaturization of the light emitting module 901.

[0203] Second Embodiment A light-emitting module 902 according to a second embodiment will now be described. FIGS. 18A to 18D are diagrams illustrating an exemplary embodiment of the light-emitting module 902. FIG. 18A is a top view of the light-emitting module 902 according to the second embodiment. FIG. 18B is a top view of the wiring substrate 102 according to the second embodiment. FIG. 18C is a top view of the wiring substrate 102 according to the second embodiment. FIG. 18D is a top view showing the internal spaces of the first light-emitting device 1A and the second light-emitting device 1B included in the light-emitting module 902 according to the second embodiment. FIG. 18B does not include the bonding member 141. FIG. 18C does not include the portion of the insulating member 131 that is provided on the electrode member 121. The dotted line in FIG. 18D transparently indicates the lower wiring portion 12B.

[0204] Of the above-described descriptions of the light-emitting module 901 and each component of the first embodiment, all of the descriptions except for those that may be considered inconsistent with the drawings of Figures 18A to 18D relating to the light-emitting module 902 also apply to the light-emitting module 902. To avoid redundancy, all of the descriptions that do not contradict each other will not be repeated here.

[0205] The light emitting module 902 includes a plurality of components, including a first light emitting device 1A, a second light emitting device 1B, and a wiring substrate 102.

[0206] Of the above-mentioned descriptions of the light emitting device 1 and each component of the first embodiment, all of the contents except for those that may be considered to be inconsistent with the drawings of Figures 18A to 18D relating to the light emitting module 902 also apply to the first light emitting device 1A and the second light emitting device 1B. To avoid redundancy, all of the non-inconsistent contents will not be repeated here.

[0207] Of the above-described descriptions of the wiring board 101 and each component of the first embodiment, all of the descriptions except for those that may be considered inconsistent with the drawings of Figures 18A to 18D related to the light-emitting module 902 also apply to the description of the wiring board 102. To avoid redundancy, all of the descriptions that are not inconsistent will not be repeated here.

[0208] (First Light-Emitting Device 1A and Second Light-Emitting Device 1B) The first light-emitting device 1A has a base 11 having a first upper surface 11A, a plurality of light-emitting elements 20 arranged on the first upper surface 11A, and a plurality of wirings 60 including first wirings 60A and second wirings 60B. The plurality of light-emitting elements 20 include one or more first light-emitting elements and one or more second light-emitting elements.

[0209] In the first light-emitting device 1A, the first wiring 60A is provided on one of the two electrodes of one of the plurality of light-emitting elements 20 and is joined to the first upper wiring portion 12A1. The second wiring 60B is provided on the other of the two electrodes of one of the plurality of light-emitting elements 20 and is joined to the third upper wiring portion 12A3.

[0210] The second light-emitting device 1B includes a base 11, a plurality of light-emitting elements 20, and a plurality of wirings 60. The plurality of light-emitting elements 20 include one or more first light-emitting elements and one or more second light-emitting elements. The plurality of wirings 60 include a first wiring 60A, a second wiring 60B, a third wiring 60C, and a fourth wiring 60D. The third wiring 60C is provided on the other electrode side of the two electrodes of the first light-emitting element. The third wiring 60C is bonded to the upper wiring portion 12A of the first upper wiring portion 12A1 and the second upper wiring portion 12A2 to which the first wiring 60A is not bonded. The fourth wiring 60D is provided on the other electrode side of the two electrodes of the second light-emitting element. The fourth wiring 60D is bonded to the upper wiring portion 12A of the third upper wiring portion 12A3 and the fourth upper wiring portion 12A4 to which the second wiring 60B is not bonded.

[0211] (Wiring Board 102) The wiring board 102 has a plurality of electrode members 121 and a mounting surface on which the first light-emitting device 1A and the second light-emitting device 1B are mounted. The plurality of electrode members 121 include a first electrode member 121A, a second electrode member 121B, a third electrode member 121C, a fourth electrode member 121D, a fifth electrode member 121E, and a sixth electrode member 121F. The first electrode member 121A has a region bonded to the first lower wiring portion 12B1 of the first light-emitting device 1A. The second electrode member 121B has a region bonded to the third lower wiring portion 12B3 of the first light-emitting device 1A. The third electrode member 121C has a region bonded to the first lower wiring portion 12B1 of the second light-emitting device 1B. The fourth electrode member 121D has a region bonded to the second lower wiring portion 12B2 of the second light-emitting device 1B. The fifth electrode member 121E has a region that is joined to the third lower wiring portion 12B3 of the second light emitting device 1B. The sixth electrode member 121F has a region that is joined to the fourth lower wiring portion 12B4 of the second light emitting device 1B.

[0212] The fifth electrode member 121E has, on the upper surface 101A, a first region 121E1 and a second region 121E2 that are not covered by one or more insulating members 131 and are exposed from the one or more insulating members 131. The first region 121E1 and the second region 121E2 are spaced apart from each other in a top view.

[0213] The sixth electrode member 121F has, on the upper surface 101A, a first region 121F1 and a second region 121F2 that are not covered by one or more insulating members 131 and are exposed from the one or more insulating members 131. The first region 121F1 and the second region 121F2 are spaced apart from each other in a top view.

[0214] The wiring board 102 is provided with one or more through holes 101H. The one or more through holes 101H include a through hole 101H for fixing the wiring board 101 to another member (component). For example, a screw is fitted into the through hole 101H to fix the wiring board 101 to the other member. The one or more through holes 101H include a through hole 101H used to determine the position when fixing the wiring board 101 to the other member.

[0215] In the first light-emitting device 1A, the lower wiring portion 12B provided on the first outer surface 11E1 side is joined to the electrode member 121 of the wiring substrate 102. In the first light-emitting device 1A, the lower wiring portion 12B provided on the second outer surface 11E2 side is joined to the dummy electrode portion 101G of the wiring substrate 102. Therefore, the lower wiring portion 12B on the first outer surface 11E1 side is used to form a current path, and the lower joint portion 12C on the second outer surface 11E2 side is not used to form a current path.

[0216] In the second light-emitting device 1B, the lower joint portion 12C provided on the second outer surface 11E2 side is joined to the electrode member 121 of the wiring substrate 102. In the second light-emitting device 1B, the lower wiring portion 12B provided on the first outer surface 11E1 side is joined to the dummy electrode portion 101G of the wiring substrate 102. Therefore, the lower joint portion 12C on the second outer surface 11E2 side is used to form a current path, and the lower wiring portion 12B on the first outer surface 11E1 side is not used to form a current path.

[0217] In this way, in the light-emitting module 902, the arrangement of the first lower wiring portion 12B and the lower joint portion 12C can be reversed between the first light-emitting device 1A and the second light-emitting device 1B, allowing them to be used for wiring connections. While the first light-emitting device 1A and the second light-emitting device 1B have the same base 11, the portion of the base 11 of the first light-emitting device 1A that is used as the lower joint portion 12C is used as the lower wiring portion 12B in the second light-emitting device 1B. This allows for flexible wiring connections, improving convenience.

[0218] 19 to 21 are six-sided views and a perspective view, respectively, illustrating other forms of light-emitting modules. The contents described above for the light-emitting module 901 and the light-emitting module 902 are applicable to any of the light-emitting modules, except for matters that are clearly inconsistent with the drawings.

[0219] Although the above describes various embodiments of the present invention, the light-emitting module, light-emitting device, or substrate according to the present invention is not strictly limited to the light-emitting module, light-emitting device, or substrate of each embodiment. In other words, the present invention can be realized without being limited to the external shape and structure of the light-emitting module, light-emitting device, or substrate disclosed in each embodiment. The present invention may be applied without necessarily including all components. For example, if the claims do not recite some of the components of a light-emitting module, light-emitting device, or substrate disclosed in an embodiment, the claims allow for the design freedom of those components by those skilled in the art, such as substitution, omission, modification of shape, or change of material, and specify that the invention described in the claims applies.

[0220] Through the contents described so far in this specification, the following technical matters are disclosed. (Item 1) A base comprising: an upper surface; a lower surface; a plurality of outer surfaces including a first outer surface and a second outer surface; a plurality of upper wiring portions including, on the upper surface side, a first upper wiring portion and a second upper wiring portion provided on the first outer surface side, and a third upper wiring portion and a fourth upper wiring portion provided on the second outer surface side; and a plurality of lower wiring portions on the lower surface side, each provided on one outer surface side of the plurality of outer surfaces, the plurality of lower wiring portions including a first lower wiring portion electrically connected to the first upper wiring portion, a second lower wiring portion electrically connected to the second upper wiring portion, a third lower wiring portion electrically connected to the third upper wiring portion, and a fourth lower wiring portion electrically connected to the fourth upper wiring portion, wherein, in the plurality of upper wiring portions, each upper wiring portion is not electrically connected to the other upper wiring portions; and in the plurality of lower wiring portions, each lower wiring portion is not electrically connected to the other lower wiring portions. (Item 2) The base according to Item 1, wherein the second outer surface is an outer surface opposite to the first outer surface. (Item 3) The base according to Item 1 or 2, wherein the first lower wiring portion, the second lower wiring portion, the third lower wiring portion, and the fourth lower wiring portion are provided on the first outer surface side. (Item 4) The base according to any one of Items 1 to 3, comprising a plurality of inner surfaces that form an inner frame in a top view, including a first inner surface that is provided on the first outer surface side and a second inner surface that is provided on the second outer surface side, and wherein the first upper wiring portion, the second upper wiring portion, the third upper wiring portion, and the fourth upper wiring portion are provided inside the inner frame in a top view. (Item 5) The base according to any one of Items 1 to 4, wherein the first upper wiring portion and the second upper wiring portion are arranged side by side in a first direction, the third upper wiring portion and the fourth upper wiring portion are arranged side by side in a second direction, and the first lower wiring portion, the second lower wiring portion, the third lower wiring portion, and the fourth lower wiring portion are arranged side by side in a third direction. (Item 6) The base according to Item 5, wherein the first direction and the third direction are the same. (Item 7) The base according to Item 5 or 6, wherein the first direction, the second direction, and the third direction are the same.(Item 8) The base according to any one of Items 5 to 7, wherein the width in the third direction of the first lower wiring portion, the second lower wiring portion, the third lower wiring portion, and the fourth lower wiring portion is all smaller than the width in the first direction of the first upper wiring portion. (Item 9) The base according to any one of Items 1 to 8, comprising a first upper surface on which a plurality of light-emitting elements are arranged. (Item 10) The base according to any one of Items 1 to 9, comprising: a base having a first upper surface; a plurality of light-emitting elements including a first light-emitting element and a second light-emitting element, the light-emitting elements being arranged on the first upper surface; and a plurality of wirings including a first wiring and a second wiring, wherein the first wiring is provided on one of two electrodes of the first light-emitting element and is joined to either the first upper wiring portion or the second upper wiring portion, and the second wiring is provided on one of two electrodes of the second light-emitting element and is joined to either the third upper wiring portion or the fourth upper wiring portion. (Item 11) The light emitting device according to item 10, wherein the plurality of light emitting elements further include a third light emitting element, the plurality of wirings further include a third wiring and a fourth wiring, the third wiring is provided on one electrode side of two electrodes of the third light emitting element, and is joined to an upper wiring portion among the first upper wiring portion, the second upper wiring portion, the third upper wiring portion, and the fourth upper wiring portion other than the upper wiring portion to which the first wiring is joined and the upper wiring portion to which the second wiring is joined, and the fourth wiring is provided on the other electrode side of each of the first light emitting element, the second light emitting element, and the third light emitting element, and is joined to an upper wiring portion among the first upper wiring portion, the second upper wiring portion, the third upper wiring portion, and the fourth upper wiring portion other than the upper wiring portion to which the first wiring is joined, the upper wiring portion to which the second wiring is joined, and the upper wiring portion to which the third wiring is joined.(Item 12) A light emitting module comprising: the light emitting device according to item 11; and a wiring board having a plurality of electrode members including a first electrode member, a second electrode member, a third electrode member, and a fourth electrode member, and a mounting surface on which the light emitting device is mounted, wherein the first electrode member has a first region that joins with the first lower wiring portion, the second electrode member has a second region that joins with the second lower wiring portion, the third electrode member has a third region that joins with the third lower wiring portion, and the fourth electrode member has a fourth region that joins with the fourth lower wiring portion, and the first electrode member, the second electrode member, the third electrode member, and the fourth electrode member are arranged so that, in a top view, a single imaginary straight line passes through the first electrode member, the second electrode member, the third electrode member, and the fourth electrode member. (Item 13) The light-emitting device described in item 10, wherein the plurality of wirings further include a third wiring and a fourth wiring, the third wiring being provided on the other electrode side of the two electrodes of the first light-emitting element and being joined to the upper wiring portion of the first upper wiring portion and the second upper wiring portion to which the first wiring is not joined, and the fourth wiring being provided on the other electrode side of the two electrodes of the second light-emitting element and being joined to the upper wiring portion of the third upper wiring portion and the fourth upper wiring portion to which the second wiring is not joined.(Item 14) A first light emitting device comprising: the base according to any one of items 1 to 9, the base having a first upper surface; a plurality of light emitting elements arranged on the first upper surface; and a plurality of wirings including a first wiring and a second wiring; a second light emitting device which is the light emitting device according to item 13; and a wiring substrate having a plurality of electrode members including a first electrode member, a second electrode member, a third electrode member, a fourth electrode member, a fifth electrode member, and a sixth electrode member, and a mounting surface on which the light emitting device is mounted, wherein in the first light emitting device, the first wiring is provided on one of two electrodes of one of the plurality of light emitting elements and is joined to the first upper wiring portion; the second wiring is provided on the other of two electrodes of one of the plurality of light emitting elements and is joined to the third upper wiring portion; and the first electrode member has a first region joined to the first lower wiring portion of the first light emitting device, a light-emitting module, wherein the second electrode member has a second region that is joined to the third lower wiring portion of the first light-emitting device, the third electrode member has a third region that is joined to the first lower wiring portion of the second light-emitting device, the fourth electrode member has a fourth region that is joined to the second lower wiring portion of the second light-emitting device, the fifth electrode member has a fifth region that is joined to the third lower wiring portion of the second light-emitting device, and the sixth electrode member has a sixth region that is joined to the fourth lower wiring portion of the second light-emitting device.

[0221] The light-emitting module, light-emitting device, or substrate described in the embodiments can be used in a projector. In other words, a projector can be considered one application form to which the present invention can be applied. However, the present invention is not limited to this and can be used in various applications such as illumination, exposure, vehicle headlights, head-mounted displays, and backlights for other displays.

[0222] 1 Light emitting device 1A First light emitting device 1B Second light emitting device 10 Package 11 Base 11A First upper surface 11B Lower surface 11C Second upper surface 11D Outer surface 11D1 First outer surface 11D2 Second outer surface 11D3 Third outer surface 11D4 Fourth outer surface 11E Inner surface 11E1 First inner surface 11E2 Second inner surface 11E3 Third inner surface 11E4 Fourth inner surface 11F Step portion 11F1 First step portion 11F2 Second step portion 11G Top surface 11H Side surface 11M Base 11N Frame portion 11S Insulating layer 11S1 First layer 11S2 Second layer 11S3 Third layer 11S31 Upper third layer 11S32 Lower third layer 11S4 Fourth layer 12 Wiring part 12A Upper wiring part 12A1 First upper wiring part 12A2 Second upper wiring part 12A3 Third upper wiring part 12A4 Fourth upper wiring part 12B Lower wiring part 12B1 First lower wiring part 12B2 Second lower wiring part 12B3 Third lower wiring part 12B4 Fourth lower wiring part 12C Lower joint part 12C1 First lower joint part 12C2 Second lower joint part 12C3 Third lower joint part 12C4 Fourth lower joint part 12D Intermediate wiring part 12D1 First intermediate wiring part 12D2 Second intermediate wiring part 12D3 Third intermediate wiring part 12D4 Fourth intermediate wiring part 12E Wiring part 14 Lid body 14A Upper surface 14B Lower surface 14C Side surface 20 Light-emitting element 20A First light-emitting element 20B Second light-emitting element 20C Third light-emitting element 21A Upper surface 21B Lower surface21C Side surface 22 Light emitting surface 30 Submount 31A Top surface 31B Bottom surface 31C Side surface 32A Substrate 32B Upper metal member 32C Lower metal member 33 Wiring layer 40 Reflecting member 50 Protective element 51A Top surface 51B Bottom surface 51C Side surface 60 Wiring 60A First wiring 60B Second wiring 60C Third wiring 60D Fourth wiring 70 Optical member (lens member) 71A Top surface 71B Bottom surface 71C Side surface 71D Lens surface (optically acting surface) 72A Lens portion 72B Non-lens portion 101, 102 Wiring substrate 101A Top surface 101B Bottom surface 101C Side surface 101D Heat dissipation portion 101E Electrode portion 101F Insulating portion 101G Dummy electrode portion 101H Through hole 111 Heat dissipation member 111A First upper surface 111B Second upper surface 111C First side surface 111D Second side surface 111E Lower surface 121 Electrode member 121A First electrode member 121B Second electrode member 121C Third electrode member 121D Fourth electrode member 121E Fifth electrode member 121F Sixth electrode member 121A1 First region 121A2 Second region 121B1 First region 121B2 Second region 121C1 First region 121C2 Second region 121D1 First region 121D2 Second region 121E1 First region 121E2 Second region 121F1 First region 121F2 Second region 122A Upper surface 122B Side surface 131 Insulating member 131A First insulating member 131B Second insulating member 141 Joining member 141A First region 141B Second region 141C Third region 141D Fourth region 151 Dummy electrode member 901, 902 Light-emitting module

Claims

1. A base comprising: an upper surface; a lower surface; a plurality of outer surfaces including a first outer surface and a second outer surface; a plurality of upper wiring portions on the upper surface side, including a first upper wiring portion and a second upper wiring portion provided on the first outer surface side, and a third upper wiring portion and a fourth upper wiring portion provided on the second outer surface side; and a plurality of lower wiring portions on the lower surface side, each provided on one of the plurality of outer surfaces, including a first lower wiring portion electrically connected to the first upper wiring portion, a second lower wiring portion electrically connected to the second upper wiring portion, a third lower wiring portion electrically connected to the third upper wiring portion, and a fourth lower wiring portion electrically connected to the fourth upper wiring portion, wherein among the plurality of upper wiring portions, each upper wiring portion is not electrically connected to the other upper wiring portions, and among the plurality of lower wiring portions, each lower wiring portion is not electrically connected to the other lower wiring portions.

2. The substrate of claim 1, wherein said second outer surface is an outer surface opposite said first outer surface.

3. A base as described in claim 1 or 2, wherein the first lower wiring portion, the second lower wiring portion, the third lower wiring portion, and the fourth lower wiring portion are provided on the first outer surface side.

4. A base described in any one of claims 1 to 3, comprising a plurality of inner surfaces that form an inner frame in a top view, including a first inner surface provided on the side of the first outer surface and a second inner surface provided on the side of the second outer surface, and wherein the first upper wiring portion, the second upper wiring portion, the third upper wiring portion, and the fourth upper wiring portion are provided inside the inner frame in a top view.

5. A base as described in any one of claims 1 to 4, wherein the first upper wiring portion and the second upper wiring portion are arranged side by side in a first direction, the third upper wiring portion and the fourth upper wiring portion are arranged side by side in a second direction, and the first lower wiring portion, the second lower wiring portion, the third lower wiring portion, and the fourth lower wiring portion are arranged side by side in a third direction.

6. The substrate according to claim 5, wherein the first direction and the third direction are the same direction.

7. The substrate according to claim 5 or 6, wherein the first direction, the second direction, and the third direction are the same direction.

8. A substrate described in any one of claims 5 to 7, wherein the width in the third direction of each of the first lower wiring portion, the second lower wiring portion, the third lower wiring portion, and the fourth lower wiring portion is smaller than the width in the first direction of the first upper wiring portion.

9. The substrate of any one of claims 1 to 8, comprising a first upper surface on which a plurality of light emitting elements are disposed.

10. A light-emitting device comprising: a base as defined in any one of claims 1 to 9, the base having a first upper surface; a plurality of light-emitting elements including a first light-emitting element and a second light-emitting element and arranged on the first upper surface; and a plurality of wirings including a first wiring and a second wiring, wherein the first wiring is provided on one of two electrodes of the first light-emitting element and is joined to either the first upper wiring portion or the second upper wiring portion; and the second wiring is provided on one of two electrodes of the second light-emitting element and is joined to either the third upper wiring portion or the fourth upper wiring portion.

11. The light-emitting device according to claim 10, wherein the plurality of light-emitting elements further include a third light-emitting element, the plurality of wirings further include a third wiring and a fourth wiring, the third wiring is provided on one electrode side of two electrodes of the third light-emitting element, and is joined to an upper wiring portion among the first upper wiring portion, the second upper wiring portion, the third upper wiring portion, and the fourth upper wiring portion other than the upper wiring portion to which the first wiring is joined and the upper wiring portion to which the second wiring is joined, and the fourth wiring is provided on the other electrode side of each of the first light-emitting element, the second light-emitting element, and the third light-emitting element, and is joined to an upper wiring portion among the first upper wiring portion, the second upper wiring portion, the third upper wiring portion, and the fourth upper wiring portion other than the upper wiring portion to which the first wiring is joined, the upper wiring portion to which the second wiring is joined, and the upper wiring portion to which the third wiring is joined.

12. A light-emitting module comprising: the light-emitting device according to claim 11; and a wiring board having a plurality of electrode members including a first electrode member, a second electrode member, a third electrode member, and a fourth electrode member, and a mounting surface on which the light-emitting device is mounted, wherein the first electrode member has a first region that joins with the first lower wiring portion, the second electrode member has a second region that joins with the second lower wiring portion, the third electrode member has a third region that joins with the third lower wiring portion, and the fourth electrode member has a fourth region that joins with the fourth lower wiring portion, and the first electrode member, the second electrode member, the third electrode member, and the fourth electrode member are arranged so that, in a top view, a single imaginary straight line passes through the first electrode member, the second electrode member, the third electrode member, and the fourth electrode member.

13. The light-emitting device described in claim 10, wherein the plurality of wirings further include a third wiring and a fourth wiring, the third wiring being provided on the other of the two electrodes of the first light-emitting element and joined to the upper wiring portion of the first upper wiring portion and the second upper wiring portion to which the first wiring is not joined, and the fourth wiring being provided on the other of the two electrodes of the second light-emitting element and joined to the upper wiring portion of the third upper wiring portion and the fourth upper wiring portion to which the second wiring is not joined.

14. A first light-emitting device comprising: a base as defined in any one of claims 1 to 9, the base having a first upper surface; a plurality of light-emitting elements arranged on the first upper surface; and a plurality of wirings including a first wiring and a second wiring; and a second light-emitting device which is the light-emitting device defined in claim 13; and a wiring board having a plurality of electrode members including a first electrode member, a second electrode member, a third electrode member, a fourth electrode member, a fifth electrode member, and a sixth electrode member, and a mounting surface on which the light-emitting device is mounted, wherein in the first light-emitting device, the first wiring is provided on one of two electrodes of one of the plurality of light-emitting elements and is joined to the first upper wiring portion; the second wiring is provided on the other of two electrodes of one of the plurality of light-emitting elements and is joined to the third upper wiring portion; and the first electrode member has a first region joined to the first lower wiring portion of the first light-emitting device, a light-emitting module, wherein the second electrode member has a second region that is joined to the third lower wiring portion of the first light-emitting device, the third electrode member has a third region that is joined to the first lower wiring portion of the second light-emitting device, the fourth electrode member has a fourth region that is joined to the second lower wiring portion of the second light-emitting device, the fifth electrode member has a fifth region that is joined to the third lower wiring portion of the second light-emitting device, and the sixth electrode member has a sixth region that is joined to the fourth lower wiring portion of the second light-emitting device.

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