Vapor chamber, radiator, and electronic device

Abstract

The present application discloses a vapor chamber, a radiator, and an electronic device. The vapor chamber comprises a first substrate, a second substrate, and a capillary layer. The second substrate and the first substrate are stacked and define a cavity, and a cooling medium is arranged in the cavity. The capillary layer is arranged in the cavity and used for providing capillary force for the cooling medium during return. The first substrate is provided with a recessed part recessed towards the second substrate. The capillary layer is provided with a first area corresponding to the recessed part, and a clearance groove is formed in the first area. According to the vapor chamber in the present application, a clearance groove is formed in the position of a capillary layer corresponding to a recessed part, so that the size of a base material of the capillary layer in the area is reduced, thereby reducing the liquid storage amount of the capillary layer in the area. When the environment temperature is decreased below the freezing point of a cooling medium, the vapor chamber has larger space to accommodate the change of the volume increase caused by freezing of the cooling medium.

Description

Heat spreader, heat sink and electronic device TECHNICAL FIELD

[0001] The present application relates to the technical field of heat spreaders, and more particularly, to a heat spreader, a heat sink and an electronic device. BACKGROUND

[0002] At present, ultra-thin heat spreaders are usually used in electronic devices with small volume or fast heat dissipation, such as mobile phones. The shape and thickness of the heat spreader of the mobile phone are limited by the shape of the middle frame and the thickness of the mobile phone. If there is a protrusion on the surface of the middle frame, the local part of the heat spreader needs to be cut or designed to be thinner, for example, a concave pit is designed in the local part of the heat spreader to avoid the protrusion, so that the entire inside of the mobile phone is covered with the heat spreader, thereby meeting the requirements of heat dissipation capacity and light and thin of the mobile phone.

[0003] However, the local thinning design of the heat spreader increases the risk of reliability, because the concave pit will cause the space volume of the area of the heat spreader to become smaller, and the volume of the cooling medium will expand after solidification, which may cause the heat spreader to bulge at the concave pit, and in severe cases, the heat spreader may squeeze the internal components of the mobile phone, causing damage to the components.

[0004] SUMMARY

[0005] The purpose of the present application is to provide a heat spreader, a heat sink and an electronic device, which opens an avoidance slot on the capillary layer corresponding to the area of the concave part, thereby reducing the substrate volume of the capillary layer in this area, and further reducing the liquid storage capacity of the capillary layer in this area. When the heat spreader encounters a decrease in ambient temperature below the freezing point of the cooling medium, there is more space in the cavity to accommodate the volume increase caused by the solidification of the cooling medium, which can prevent the heat spreader from bulging at the concave part.

[0006] In a first aspect, the present application provides a heat spreader, comprising a first substrate, a second substrate and a capillary layer.

[0007] The second substrate is stacked with the first substrate and encloses a cavity. The capillary layer is arranged in the cavity. The first substrate is provided with a concave part recessed towards the second substrate, and the capillary layer has a first area corresponding to the concave part, and the first area is provided with an avoidance slot.

[0008] The uniform temperature plate provided in the application designs a recess on the first substrate, the recess can be used to avoid the protrusion on the middle frame, so that the uniform temperature plate is laid in the mobile phone in a full coverage manner, and the heat dissipation capacity and the light and thin requirement of the mobile phone can be considered; the avoidance groove is arranged on the capillary layer at the position corresponding to the recess, that is, on the first area, the avoidance groove can reduce the volume of the base material of the capillary layer in the first area, and then reduce the liquid storage amount of the capillary layer in the area, and at the same time, the volume of the space in the cavity at the recess is increased, when the uniform temperature plate encounters the case that the ambient temperature drops below the freezing point of the cooling medium, there is more space in the cavity for bearing the volume increase change caused by the freezing of the cooling medium, and the bulging of the uniform temperature plate at the recess can be prevented. When the uniform temperature plate encounters a use environment with a sudden temperature drop, the thickness of the uniform temperature plate can be stably unchanged, and the internal elements of the electronic device such as the display screen can be prevented from being extruded and damaged.

[0009] In a possible design, the avoidance groove penetrates the capillary layer in the thickness direction of the capillary layer.

[0010] The avoidance groove penetrates the capillary layer, so that the base material in the avoidance groove is completely free of the capillary layer, the volume of the avoidance groove is increased, and more space in the cavity is used to bear the volume increase change caused by the freezing of the cooling medium.

[0011] In a possible design, the uniform temperature plate further includes a support column, the support column is arranged in the cavity and supported between the first substrate and the second substrate, the support column includes a first column body with a water drop-shaped structure in cross section and a second column body with a circular or elliptical shape in cross section, and the second substrate has a second area between the evaporation end and the condensation end of the uniform temperature plate, the first column body is arranged in the second area, and the second column body is arranged at the outer periphery of the second area.

[0012] Compared with the case that all the first column bodies with the water drop-shaped structure in cross section are arranged on the second substrate, only the first column bodies are arranged in the second area, and the second column bodies with the circular or elliptical shape in cross section are arranged outside the second area, the flow efficiency of the gas-phase cooling medium can be higher, and the uniform temperature plate has higher heat dissipation efficiency.

[0013] In a possible design, the water drop-shaped structure includes oppositely arranged first and second circular arcs, the first and second circular arcs are respectively directed to the evaporation end and the condensation end of the uniform temperature plate, and the curvature radius of the first circular arc is greater than that of the second circular arc.

[0014] The cross section of the first column body has a water drop-shaped structure, the water drop-shaped structure includes first and second circular arcs with different curvature radii, and the first column body designed in this way can have the advantages of easy forming and low aerodynamic resistance.

[0015] In a possible design, the first column body is stamping formed on the second substrate.

[0016] The first column is formed by stamping, which is advantageous in reducing the difficulty of processing and assembly, greatly improving the forming efficiency of the first column, and has the advantages of simple process, fewer processing steps and no chemical pollution compared with etching process. The cross section of the first column is in the shape of a water droplet, which includes a first arc and a second arc. In this way, the stamping die can avoid piercing the substrate when stamping the first column, thereby ensuring the yield of the substrate and reducing the material loss in the processing process.

[0017] In one possible design, the capillary layer is laid on the surface of the first substrate facing the second substrate, and the first column and the second column are supported by the capillary layer.

[0018] On the premise of ensuring that the cavity has sufficient space, only the capillary layer is provided on the first substrate, which can reduce the overall thickness of the vapor chamber as much as possible. The first column and the second column are supported by the capillary layer, which indirectly supports the first substrate. In this way, the capillary layer does not need to be provided with a relief hole, thereby reducing the processing difficulty of the capillary layer. In addition, the support column is supported on the capillary layer, which can further enhance the connection strength between the capillary layer and the first substrate, prevent the capillary layer from falling off the first substrate, and improve the drop reliability of the vapor chamber.

[0019] In one possible design, the support column further includes a third column, the third column is arranged in the area corresponding to the recess, and the third column is supported on the first substrate through the relief groove.

[0020] The third column has two functions, one is that the third column can support the first substrate, and the other is that the third column can cooperate with the relief groove to position the installation position of the capillary layer in the cavity.

[0021] In one possible design, the number of second regions is a plurality, and each second region is provided with the first column. Along the direction perpendicular to the evaporation end to the condensation end, the plurality of second regions are arranged at intervals.

[0022] The vapor chamber can dissipate heat for multiple heat sources.

[0023] In one possible design, the opening area of the relief groove is smaller than the area of the first region.

[0024] If the relief groove is one, the opening area of the relief groove is smaller than the first region, which avoids the situation that the relief groove completely occupies the first region, so that the first region retains part of the capillary layer substrate. The retained capillary layer substrate can ensure the backflow efficiency of the liquid-phase cooling medium in the vapor chamber, thereby ensuring the heat dissipation performance of the vapor chamber.

[0025] In a possible design, the avoiding groove includes a plurality of strip-shaped grooves arranged at intervals, and a length direction of the strip-shaped grooves is parallel to or oblique to a direction from the condensation end to the evaporation end of the vapor chamber.

[0026] When the liquid-phase cooling medium at the condensation end flows back to the evaporation end through the capillary layer, in the first region, the liquid-phase cooling medium can flow through the base material between the strip-shaped grooves as a flow channel, the flow path is short, and the heat dissipation efficiency is high. In addition, compared with opening a large avoiding groove on the first region, the base material reserved by the plurality of strip-shaped grooves can uniformly cover the base plate. If the first region is located at or close to the heat source, the evaporation cooling medium is heated and evaporated more uniformly, thereby reducing the risk of dry burning of the vapor chamber in the recess.

[0027] In a possible design, the avoiding groove includes a plurality of first grooves arranged at intervals in the first region, and the first grooves have first groove segments and second groove segments connected in communication, a length direction of the first groove segments is parallel to the first direction, and a length direction of the second groove segments is perpendicular to the first direction. The first direction is a direction from the condensation end to the evaporation end of the vapor chamber.

[0028] The plurality of first grooves arranged at intervals are not connected in communication with each other, so that the base material of the capillary layer between the grooves is reserved as a flow channel. The flow process of the liquid-phase cooling medium in the first region is continuous, and the liquid-phase cooling medium does not bypass the first region, thereby ensuring the flow efficiency of the liquid-phase cooling medium and the heat dissipation efficiency of the vapor chamber.

[0029] In a possible design, the number of recesses is a plurality, and the plurality of recesses are arranged at intervals.

[0030] The avoiding can be performed for the case that there are a plurality of protrusions on the middle frame, so that the entire inside of the electronic device is covered with the vapor chamber, thereby being capable of giving consideration to the heat dissipation capability and the thin and light requirement of the electronic device. For example, when there are two functional elements with large thicknesses, such as a camera module and a speaker module, there are two recesses on the middle frame for accommodating the camera module and the speaker module, and correspondingly, the vapor chamber needs to have two recesses for avoiding the protrusions.

[0031] In a possible design, the recess further has a sub-recess recessed toward the second base plate.

[0032] The vapor chamber has a stepped recess, thereby being capable of being applied to a more complex use scenario and being capable of avoiding the case that there are stepped protrusions on the middle frame. For example, when the functional element is a circuit board, the circuit board has a shielding cover, the recess on the middle frame is shaped according to the outer contour of the circuit board and the shielding cover, and the middle frame has stepped protrusions. Correspondingly, the vapor chamber needs to have a recess with a stepped structure to avoid the protrusions.

[0033] In a possible design, the second substrate is provided with a protruding portion protruding away from the first substrate, and the protruding portion is opposite to the position of the recessed portion.

[0034] In the case that there is a gap between the display screen and the vapor chamber, a protruding portion is arranged on the vapor chamber at a side facing the display screen, and the protruding portion can expand the space volume at the position of the recessed portion in the cavity, so that the change in volume caused by freezing of the cooling medium can be easily borne, to ensure that the thickness of the vapor chamber is stable and unchanged, and to avoid extrusion on the internal components of the electronic device.

[0035] In a second aspect, the present application also provides an electronic device including the vapor chamber.

[0036] In a possible design, the electronic device further includes a middle frame and a functional element, and the vapor chamber, the middle frame and the functional element are sequentially stacked, the middle frame has a groove at a side facing the functional element, at least part of the functional element is located in the groove, and the middle frame has a protrusion corresponding to the groove at a side facing the vapor chamber, and the protrusion is located in the recessed portion.

[0037] Since the electronic device includes the vapor chamber, the electronic device has the same technical effects as the vapor chamber, which will not be repeated here. BRIEF DESCRIPTION OF DRAWINGS

[0038] FIG. 1 is a schematic diagram of a middle frame and a vapor chamber in the related art;

[0039] FIG. 2 is a schematic diagram of a mobile phone according to an embodiment of the present application;

[0040] FIG. 3 is a sectional view of E-E in FIG. 2;

[0041] FIG. 4 is an exploded view of the mobile phone in FIG. 3;

[0042] FIG. 5 is a schematic diagram of a vapor chamber according to an embodiment of the present application;

[0043] FIG. 6 is an exploded view of the vapor chamber in FIG. 5;

[0044] FIG. 7 is a schematic diagram of the vapor chamber in FIG. 5 from another perspective;

[0045] FIG. 8 is an exploded view of the vapor chamber in FIG. 7;

[0046] FIG. 9 is a partial enlarged view of the first substrate in FIG. 8;

[0047] FIG. 10 is a partial enlarged view of the capillary layer in FIG. 8;

[0048] FIG. 11 is a sectional view of an example in FIG. 7;

[0049] FIG. 12 is an exploded view of the vapor chamber in FIG. 11;

[0050] FIG. 13 is a sectional view of another example of FIG. 7;

[0051] FIG. 14 is a schematic view of an example of the capillary layer provided by embodiments of the present application;

[0052] FIG. 15 is a schematic view of another example of the capillary layer provided by embodiments of the present application;

[0053] FIG. 16 is a schematic view of another example of the capillary layer provided by embodiments of the present application;

[0054] FIG. 17 is a schematic view of another example of the capillary layer provided by embodiments of the present application;

[0055] FIG. 18 is a schematic view of another example of the capillary layer provided by embodiments of the present application;

[0056] FIG. 19 is a sectional view of an example of B-B in FIG. 7;

[0057] FIG. 20 is a sectional view of another example of B-B in FIG. 7;

[0058] FIG. 21 is a sectional view of another example of B-B in FIG. 7;

[0059] FIG. 22 is a schematic view of a cross section of the first column provided by embodiments of the present application;

[0060] FIG. 23 is a schematic view of the second substrate provided by embodiments of the present application;

[0061] FIG. 24 is a schematic view of the first column all of which are in a cross section of a water drop shape structure on the second substrate;

[0062] FIG. 25 is a partial schematic view of an example of the second substrate in FIG. 23;

[0063] FIG. 26 is a partial schematic view of another example of the second substrate in FIG. 23;

[0064] FIG. 27 is a sectional view of another example of A-A in FIG. 7;

[0065] FIG. 28 is a partial enlarged view of the second substrate provided by embodiments of the present application;

[0066] FIG. 29 is a schematic view of another example of the vapor chamber provided by embodiments of the present application;

[0067] FIG. 30 is a sectional view of C-C in FIG. 29;

[0068] FIG. 31 is a schematic view of another example of the vapor chamber provided by embodiments of the present application;

[0069] FIG. 32 is a sectional view of another example of E-E in FIG. 2;

[0070] Figure 33 is a schematic diagram of another example of the heat spreader provided in the embodiments of this application;

[0071] Figure 34 is a cross-sectional view of DD in Figure 33;

[0072] Figure 35 is a cross-sectional view of another example of EE in Figure 2;

[0073] Figure 36 is a cross-sectional view of another example of AA in Figure 7;

[0074] Figure 37 is a cross-sectional view of another example of EE in Figure 2;

[0075] Figure 38 is a cross-sectional view of another example of AA in Figure 7.

[0076] Reference numerals: 01, middle frame; 02, protrusion; 03, heat spreader; 04, recess; 10, first substrate; 11, recessed portion; 111, sub-recessed portion; 20, second substrate; 21, protrusion; 22, second region; 30, capillary layer; 31, first region; 32, clearance groove; 321, strip groove; 322, first groove; 322a, first groove segment; 322b, second groove segment; 323, second groove; 323a, third groove segment; 323b, fourth groove segment; 324, third groove; 40, support column; 41, first column; 411, first arc; 412, second arc; 413, side surface; 42, second column; 43, third column; 50, graphite layer; 60, cavity; 100. Heat spreader; 101. Evaporator end; 102. Condenser end; 200. Display screen; 300. Housing; 301. Middle frame; 301a. Protrusion; 301b. Groove; 302. Battery cover; 400. Functional components; 401. Shielding cover. Detailed Implementation

[0077] The following are exemplary descriptions of relevant content that may be involved in the embodiments of this application. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0078] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0079] In the description of the present application, it needs to be understood that the terms "upper", "lower", "side", "inner", "outer", "top", "bottom" and the like indicate the orientation or positional relationship based on the installed orientation or positional relationship, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0080] It should also be noted that the same reference signs in the embodiments of the present application represent the same component or the same part, and for the same parts in the embodiments of the present application, only one of the parts or components may be labeled with a reference sign in the drawings, and it should be understood that the reference signs are also applicable to other identical parts or components.

[0081] In the description of the present application, it needs to be explained that the term "and / or" is only a description of the association relationship of the associated objects, which means that there can be three kinds of relationships, for example, A and / or B, which can represent the three cases of A alone, A and B together, and B alone.

[0082] Electronic components are the basic elements in electronic circuits, with two or more leads or metal contacts. Electronic components can be connected to form an electronic circuit with specific functions, and the common way to connect electronic components is to solder them to the substrate. Electronic components can be individual packages, such as resistors, capacitors, inductors, transistors, diodes, etc., or groups of various complexities, such as integrated circuits (IC).

[0083] Electronic devices are composed of integrated circuits, transistors, electronic tubes and other electronic components, and are devices that use electronic technology software to function, such as desktop computers, notebook computers, tablet computers, game consoles, mobile phones, electronic watches, routers, set-top boxes, televisions, modems, etc.

[0084] Electronic devices generate heat when working, causing the internal temperature of the device to rise rapidly, and the direct cause is due to the power consumption of electronic components. Any electronic component has different degrees of power consumption, and the intensity of heat generation changes with the size of power consumption. If the heat is not dissipated in time, the electronic component will continue to heat up, eventually fail due to overheating, and thus the functional stability of the electronic device will decrease, and even the function will completely fail. Moreover, as electronic devices are increasingly developing towards miniaturization, thinness and high performance, the integration of electronic components in electronic devices is also increasing, and the power consumption is also increasing. How to quickly and effectively dissipate the heat generated by electronic components is a key problem to be solved for electronic devices to develop towards miniaturization, thinness and high performance.

[0085] The vapor chamber is a sealed cavity with a capillary layer on the inner wall and filled with a cooling medium. The working principle of the vapor chamber includes four main steps of conduction, evaporation, convection and condensation. Specifically, heat enters the plate from the outside high temperature area through heat conduction, and the water near the heat source absorbs heat and vaporizes rapidly, taking away a large amount of heat; when the steam in the plate diffuses from the high pressure area to the low pressure area (i.e. the condensing end), the water vapor contacts the inner wall with lower temperature and condenses into liquid and releases heat energy; the condensed water returns to the heat source through the capillary force of the capillary layer, thus completing a heat conduction cycle and forming a two-way circulation system of water and water vapor.

[0086] FIG. 1 is a schematic diagram of a middle frame and a vapor chamber in the related art. In FIG. 1, (a) is a middle frame; and (b) is a vapor chamber.

[0087] At present, the vapor chamber is usually used in electronic devices with small volume or fast heat dissipation requirements, such as mobile phones. As shown in FIG. 1, the shape and thickness of the mobile phone vapor chamber 01 are limited by the shape of the middle frame 01 and the thickness of the mobile phone. If there is a protrusion 02 on the surface of the middle frame 01, the local part of the vapor chamber 03 needs to be designed to be reduced in thickness, for example, a recess 04 is designed in the local part of the vapor chamber 03 to avoid the protrusion 03, so that the entire inside of the mobile phone is covered with the vapor chamber 03, thereby meeting the requirements of heat dissipation and light and thin of the mobile phone.

[0088] However, the local thickness reduction design of the vapor chamber 03 will cause reliability risks, because the recess 04 will cause the accommodation space of the vapor chamber 03 in this area to become smaller. If a mobile phone with such a vapor chamber 03 is used in winter in the north, the user may experience a temperature drop from 20℃ to -20℃ when going out of the room. The liquid cooling medium in the vapor chamber 03 will quickly solidify into a solid state. Compared with the same weight of liquid cooling medium, the volume of solid cooling medium will increase (for example, under the condition of the same weight, the volume of ice is 1.1 times the volume of water), which may cause the vapor chamber 03 to bulge at the recess 04, and in severe cases, the screen of the vapor chamber 03 may be damaged.

[0089] Therefore, in order to solve the above technical problems, the present application provides a vapor chamber, a heat sink and an electronic device. An avoidance groove is formed on the capillary layer corresponding to the area of the recess, thereby reducing the volume of the base material of the capillary layer in this area, and further reducing the liquid storage capacity of the capillary layer in this area. When the vapor chamber encounters a situation where the ambient temperature drops below the freezing point of the cooling medium, there is more space in the cavity to accommodate the volume increase caused by the solidification of the cooling medium, which can prevent the vapor chamber from bulging at the recess.

[0090] The electronic device can be a mobile phone, a tablet computer, a notebook computer, a game console, an e-book reader, a wearable device, and the like, and can also be other electronic devices having a vapor chamber and requiring improved heat dissipation effect.

[0091] To more conveniently describe the electronic device provided by the embodiments of the present application, by way of example but not limitation, the technical solutions of the present application will be described in detail below with the electronic device being a mobile phone as an example.

[0092] The mobile phone provided by the embodiments of the present application will be described in detail below with reference to the accompanying drawings. FIG. 2 is a schematic diagram of the mobile phone provided by the embodiments of the present application. To facilitate the description of the embodiments below, an XYZ coordinate system is established for the mobile phone. Specifically, the thickness direction of the mobile phone is defined as the Z direction, the length direction of the mobile phone is defined as the Y direction, and the width direction of the mobile phone is defined as the X direction.

[0093] As shown in FIG. 2, the mobile phone provided by the embodiments of the present application includes a display screen 200 and a housing 300. The housing 300 further includes a middle frame 301 and a battery cover 302. The display screen 200 is fixedly arranged at the front end surface of the middle frame 301, and the battery cover 302 is fixedly arranged at the rear end surface of the middle frame 301. The display screen 200, the middle frame 301, and the battery cover 302 jointly define a receiving space of the mobile phone, which is used to install various functional elements of the mobile phone, such as the vapor chamber 100 and other functional elements such as a battery, a microphone, a processor, and the like in the embodiments described below.

[0094] The battery cover 302 can be coupled to the middle frame 301 by screwing, clamping, or the like. A sealing ring can be arranged between the battery cover 302 and the middle frame 301 to improve the sealing and waterproof effect of the joint between the battery cover 302 and the middle frame 301. The sealing ring can be made of a high-elasticity material such as silicone or rubber.

[0095] In addition, the mobile phone can further include functional elements such as a system on chip (SoC), a universal serial bus (USB) interface, a charging management module, a power management module, a battery, a microphone, a mobile communication module, an antenna, a wireless communication module, an earphone interface, a sensor module, a key, a subscriber identification module (SIM) card interface, a loudspeaker module, a vibration motor, and the like. These functional elements can be changed according to user needs. It can be understood that the specific embodiments introduced above are only one specific implementation manner of the present application, and other manners that can implement the solutions of the present application are also within the scope of protection of the present application, which will not be described here.

[0096] FIG. 3 is a sectional view of E-E in FIG. 2. FIG. 4 is an exploded view of the mobile phone in FIG. 3.

[0097] As shown in FIGS. 3-4, in an embodiment provided by the present application, the mobile phone comprises a vapor chamber 100, a middle frame 301, and functional elements 400, which are sequentially stacked.

[0098] The side of the middle frame 301 facing the functional elements 400 has a groove 301b, which is used to accommodate some functional elements 400 with large thickness, i.e., functional elements 400 with large Z-direction size. For example, a speaker module usually has a rear cavity, and a larger rear cavity volume can improve the low-frequency characteristics of sound, thereby improving the user's sound quality experience. Therefore, the current speaker module is designed with a larger rear cavity. However, an excessively large rear cavity can cause the overall thickness of the speaker module to be too large, and it is difficult to install the speaker module inside the mobile phone using a conventional middle frame 301. Therefore, the groove 301b can be provided on the middle frame 301 to avoid this, so that the speaker module can be arranged between the middle frame 301 and the battery cover 302. For another example, users currently have high requirements for camera functions, and the number of cameras on the mobile phone and the number of lenses of a single camera are increasing, which makes the size of the entire camera module, especially the thickness direction, larger. However, an excessively large camera module also has a problem of being difficult to install inside the mobile phone. Therefore, the groove 301b provided on the middle frame 301 can be used to avoid this, so that the camera module can be arranged between the middle frame 301 and the battery cover 302. Such functional elements 400 with large thickness located in the groove 301b on the middle frame 301 can be fully supported and protected by the base material of the middle frame 301.

[0099] In the embodiment of the present application, the number and type of functional elements 400 located in the groove 301b are not limited. The functional elements 400 can be installed in the groove 301b of the middle frame 301 by means of adhesive, screws, clamping structures, etc. The functional elements 400 can be partially located in the groove 301b, or entirely located in the groove 301b.

[0100] The side of the middle frame 301 facing the vapor chamber 100 has a protrusion 301a, which corresponds in position to the groove 301b and is located in the recess 11 of the vapor chamber 100. It can be understood that the groove 301b corresponds in position to the protrusion 301a, which means that the projection of the groove 301b on the middle frame 301 coincides with the projection of the protrusion 301a on the middle frame 301.

[0101] The uniform temperature plate 100 can be mounted on the middle frame 301 by means of bonding. The adhesive can be a heat-conducting adhesive. In this way, when the heat generated by the functional element 400 is transmitted to the uniform temperature plate 100 through the middle frame 301, the heat-conducting adhesive can improve the heat transfer efficiency between the middle frame 301 and the uniform temperature plate 100. The gap between the uniform temperature plate 100 and the functional element 400 can also be filled with a heat-conducting adhesive, which can improve the heat transfer efficiency between the functional element 400 and the middle frame 301.

[0102] It should be noted that the functional element 400 located in the groove 301b can be a component with a small amount of heat, such as an audio module, a loudspeaker module, a vibration motor, etc. The functional element 400 with a large amount of heat, such as a radio frequency front-end module, a system-on-chip, a battery, etc., can be arranged outside the groove 301b and as close as possible to the evaporation end 101 of the uniform temperature plate 100. The radio frequency front-end module is an important component of the wireless communication module of a mobile phone, which is a series of components between the radio frequency transceiver and the antenna. The radio frequency front-end module mainly includes a power amplifier, an antenna switch, a filter, a duplexer, and a low-noise amplifier, etc. The radio frequency front-end module generates a large amount of heat when performing power amplification. The system-on-chip has a large power consumption and generates a large amount of heat when processing multiple tasks. The battery generates a large amount of heat when charging, especially when fast charging. Of course, in addition to the radio frequency front-end module, the system-on-chip, the battery, etc., the audio module, the loudspeaker module, the vibration motor, the camera module, etc. can also be close to the evaporation end 101 of the uniform temperature plate 100 and be cooled by the uniform temperature plate 100. The type of the functional element 400 located in the groove 301b and the type of the functional element 400 located at the evaporation end 101 are not limited in the present application.

[0103] The uniform temperature plate 100 provided by the present application will be described in detail in combination with the accompanying drawings. FIG. 5 is a schematic diagram of the uniform temperature plate 100 provided by the present application. FIG. 6 is an exploded view of the uniform temperature plate 100 in FIG. 5. FIG. 7 is a schematic diagram of another perspective view of the uniform temperature plate 100 in FIG. 5. FIG. 8 is an exploded view of the uniform temperature plate 100 in FIG. 7. FIG. 9 is a partial enlarged view of the first substrate 10 in FIG. 8. FIG. 10 is a partial enlarged view of the capillary layer 30 in FIG. 8. FIG. 11 is a cross-sectional view of an example of A-A in FIG. 7. FIG. 12 is an exploded view of the uniform temperature plate 100 in FIG. 11.

[0104] As shown in FIGS. 5-12, the uniform temperature plate 100 provided by the present application includes a first substrate 10, a second substrate 20, and a capillary layer 30. The second substrate 20 is arranged in layers with the first substrate 10 and encloses a cavity 60, and the cavity 60 is provided with a cooling medium (not shown in the figure). The capillary layer 30 is arranged in the cavity 60 and is used to provide a capillary force for the backflow of the cooling medium.

[0105] The working principle of the vapor chamber 100 is as follows: as shown in FIG. 5, the vapor chamber 100 is provided with an evaporation end 101 and a condensation end 102 at opposite ends, the evaporation end 101 is closer to a functional element 400 with a large amount of heat, such as a radio frequency front-end module, a system on chip, a battery, etc., and the evaporation end 101 is used to absorb the heat emitted by the functional element 400. When the functional element 400 works and generates heat, the heat of the functional element 400 is conducted to the evaporation end 101 of the vapor chamber 100 through the middle frame 301, the liquid cooling medium in the evaporation end 101 vaporizes, the gaseous cooling medium flows to the condensation end 102 with lower temperature through the cavity 60, the gaseous cooling medium condenses at the condensation end 102, and returns to the liquid phase, the liquid cooling medium returns to the evaporation end 101 through the capillary force generated by the capillary layer 30, and the heat transfer action can be repeated in this way.

[0106] The first substrate 10 is provided with a recessed portion 11 recessed toward the second substrate 20, and the capillary layer 30 has a first area 31 corresponding to the recessed portion 11, and the first area 31 is provided with an avoiding groove 32. The first area 31 corresponding to the recessed portion 11 can be understood as the projection of the recessed portion 11 on the capillary layer 30, and the projection area of the recessed portion 11 on the capillary layer 30 is the first area 31.

[0107] The vapor chamber 100 provided by the embodiment of the present application is designed with the recessed portion 11 on the first substrate 10, the recessed portion 11 can be used to avoid the protrusion 301a on the middle frame 301, so that the vapor chamber 100 is laid in the mobile phone in a full coverage manner, and the heat dissipation capacity and the thin and light requirement of the mobile phone can be considered; the avoiding groove 32 is arranged on the first area 31 corresponding to the recessed portion 11 on the capillary layer 30, the avoiding groove 32 can reduce the volume of the base material of the capillary layer 30 in the first area 31, thereby reducing the liquid storage amount of the capillary layer 30 in the area, and increasing the space volume of the cavity 60 located in the recessed portion 11 at the same time, when the vapor chamber 100 encounters a temperature drop to below the freezing point of the cooling medium, there is a larger space in the cavity for bearing the volume increase caused by the freezing of the cooling medium, so as to prevent the vapor chamber 100 from bulging at the recessed portion 11. The vapor chamber 100 provided by the embodiment of the present application can ensure that the thickness of the vapor chamber 100 is stable when encountering a temperature drop, and can avoid the vapor chamber 100 from pressing and damaging the internal elements of the mobile phone such as the display screen 200.

[0108] As shown in FIG. 11, in an embodiment provided by the present application, the avoiding groove 32 penetrates the capillary layer 30 in the thickness direction of the capillary layer 30. In this embodiment, the avoiding groove 32 penetrates the capillary layer 30, so that the avoiding groove 32 is completely free of the base material of the capillary layer 30, the volume of the avoiding groove 32 is increased, and there is a larger space in the cavity 60 for bearing the volume increase caused by the freezing of the cooling medium.

[0109] Fig. 13 is a sectional view of another example of A-A in Fig. 7.

[0110] As shown in Fig. 13, in another embodiment provided by the present application, the depth of the avoiding groove 32 is less than the thickness of the capillary layer 30, that is, the avoiding groove 32 is opened on the surface of the capillary layer 30, and the avoiding groove 32 does not penetrate the capillary layer 30 in the thickness direction of the capillary layer 30.

[0111] As shown in Fig. 10, in an embodiment provided by the present application, the opening area of the avoiding groove 32 is less than the area of the first region 31.

[0112] The opening area can be understood as the cross-sectional area of the avoiding groove 32 or the projection profile area of the avoiding groove 32; the avoiding groove 32 can be one or more, and when the avoiding groove 32 is more than one, the sum of the opening areas of the multiple avoiding grooves 32 is less than the area of the first region 31. Assuming that the avoiding groove 32 is one, the opening area of the avoiding groove 32 is less than the first region 31, avoiding the avoiding groove 32 completely occupying the first region 31, so that the first region 31 retains part of the base material of the capillary layer 30, and the retained base material of the capillary layer 30 can ensure the backflow efficiency of the liquid cooling medium in the vapor chamber 100, thereby ensuring the heat dissipation performance of the vapor chamber 100.

[0113] Optionally, the capillary layer 30 can be connected to the first substrate 10 or the second substrate 20 by welding, bonding, molecular force adsorption or the like. For example, the capillary layer 30 is connected to the first substrate 10 or the second substrate 20 by local spot welding or local spot gluing; the capillary layer 30 is fixed on the first substrate 10 or the second substrate 20 by sintering, and the connection is realized by mutual attraction between the base material molecules of the capillary layer 30 and the base material molecules of the substrate.

[0114] Optionally, the capillary layer 30 can be composed of a metal powder sintered body or a non-metal powder sintered body. Sintering refers to the mutual bonding of raw material green body solid particles at high temperature (not higher than the melting point), grain growth, gradual reduction of pores and grain boundaries, volume shrinkage and density increase through mass transfer, and finally becoming a dense polycrystalline sintered body with certain microstructure. This phenomenon is called sintering process. The metal powder sintered body can include but is not limited to being formed by copper powder sintering, and the non-metal powder sintered body can include but is not limited to being formed by ceramic powder sintering. Most of the metal powder sintered body and the non-metal powder sintered body have very small pore size and high capillary force as a whole, which can provide greater driving force for the gas-liquid circulation in the vapor chamber 100.

[0115] Optionally, the capillary layer 30 can also be composed of at least one of a foamed metal, a non-metallic fiber body, a metal woven mesh, and a metal woven braid.

[0116] Foamed metal refers to a special metal material containing foamed pores. The pores inside the foamed metal constitute the high-speed return channels of the liquid-phase cooling medium. The foamed metal that can be used in the embodiments of the present application to constitute the capillary layer 30 includes foamed aluminum, foamed nickel, foamed copper, etc. There are many methods for preparing foamed metal. According to the physical state of the metal or alloy being processed, the methods for obtaining the foamed metal material can be divided into liquid-phase method, powder solid-phase method, ion method (metal ion solution), and getter phase method (metal vapor or gaseous intermetallic compound). Among them, the gas blowing method, melt foaming method, powder metallurgy method, and infiltration casting method are the most commonly used preparation methods.

[0117] The non-metallic fiber body includes but is not limited to glass fiber body or carbon fiber body. Glass fiber is an inorganic non-metallic material with excellent performance, which is made of six kinds of ores, namely, lepidolite, quartz sand, limestone, dolomite, boric calcium stone, and boric magnesium stone, through high-temperature melting, wire drawing, winding, weaving, and other processes, and is commonly used as a reinforcing material in composite materials, an electrical insulating material, and a thermal insulation material. The glass fiber body that can be used in the embodiments of the present application to constitute the capillary layer 30 is also called glass wool, which is a fixed-length glass fiber with a short fiber, generally below 150 mm or shorter, and has a loose organization similar to cotton in shape, and has a large number of pores inside, which are the return channels of the liquid-phase cooling medium. The carbon fiber body refers to a high-strength and high-modulus fiber with a carbon content of more than 90%, and in the embodiments of the present application, the carbon fiber body that can be used to constitute the capillary layer 30 is a porous material woven by carbon fibers, and the internal pores are the return channels of the liquid-phase cooling medium.

[0118] The metal woven mesh is a mesh structure woven by a plurality of metal wires. When the metal woven mesh is used as the capillary layer 30, the gaps between the metal wires can be used as the evaporation channels when the liquid-phase cooling medium evaporates into the gas phase at the evaporation end 101, and can also be used as the return channels of the liquid-phase cooling medium at other positions except the evaporation end 101. When the metal woven mesh is used as the capillary layer 30, the gaps between the metal wires are the return channels of the liquid-phase cooling medium. The metal wires used in the metal woven mesh include copper or aluminum. Compared with the metal woven braid, the metal woven mesh has most of the gaps with small sizes, has a large capillary force as a whole, and can provide a larger driving force for the gas-liquid circulation in the vapor chamber 100.

[0119] The metal woven braid is a bundle of a plurality of metal wires twisted and gathered in a spiral shape, similar to the spiral braid hairstyle of a lady in life. Similar to the metal woven mesh, the gaps between the metal wires in the metal woven braid are the return channels of the liquid-phase cooling medium. The metal wires used in the metal woven braid include copper or aluminum.

[0120] Optionally, the cooling medium can be any liquid that is beneficial to heat dissipation by evaporation, which can be water, inorganic compounds, organic compounds, liquid metals, refrigerants, or mixtures of two or more of the foregoing, and can be used in the embodiments of the present application. When the cooling medium is water, distilled water or deionized water can be used. When the cooling medium is an organic compound, at least one of ethanol, methanol, and acetone can be used.

[0121] Optionally, the size of the cavity 60 can be determined according to the power consumption of the electronic component. When the power consumption of the electronic component is high, more heat will be generated, and the cavity 60 can be larger to accommodate more cooling medium and improve the heat dissipation efficiency of the vapor chamber 100. When the power consumption of the electronic component is low, less heat will be generated, and a smaller cavity 60 can also achieve the purpose of heat conduction. In this way, the filling amount of the cooling medium can also be reduced, thereby reducing the manufacturing cost of the vapor chamber 100.

[0122] Optionally, the number of the avoidance groove 32 can be one or more, and the shape can be circular, square, strip, spiral, L-shaped, S-shaped, etc. It should be noted that regardless of the shape of the avoidance groove 32, the base material structure of the capillary layer 30 in the first area 31 needs to be continuous to ensure that the capillary layer 30 can provide continuous capillary force for the cooling medium and avoid the situation that the capillary force is blocked due to the disconnection of the base material structure of the capillary layer 30.

[0123] FIG. 14 is a schematic view of an example of the capillary layer 30 provided in the embodiments of the present application.

[0124] As shown in FIG. 14, in an embodiment provided in the present application, the avoidance groove 32 includes a plurality of strip-shaped grooves 321 arranged at intervals, and the plurality of strip-shaped grooves 321 are arranged in a row, and the length direction of the strip-shaped groove 321 is parallel to the direction from the condensation end 102 to the evaporation end 101 of the vapor chamber 100.

[0125] Among them, the length direction of the strip-shaped groove 321 can be understood as the b direction in FIG. 14, and the direction from the condensation end 102 to the evaporation end 101 of the vapor chamber 100 is the a direction in FIG. 14.

[0126] In the embodiment, the length direction of the strip-shaped grooves 321 is parallel to the direction from the condensation end 102 to the evaporation end 101 of the vapor chamber 100, or can also be said to be consistent. When the liquid-phase cooling medium at the condensation end 102 flows back to the evaporation end 101 through the capillary layer 30, the liquid-phase cooling medium can pass through the base material between the strip-shaped grooves 321 as a flow passage when passing through the first area 31, the flow path is short, and the heat dissipation efficiency is high. If a large-volume avoidance groove 32 is arranged in the first area 31, when the liquid-phase cooling medium flows through the avoidance groove 32, the liquid-phase cooling medium needs to bypass the large-volume avoidance groove 32 to flow to the evaporation end 101, which causes the flow path of the liquid-phase cooling medium to be too long, the backflow efficiency of the liquid-phase cooling medium is low, and the heat dissipation efficiency of the vapor chamber 100 is low.

[0127] FIG. 15 is a schematic view of another example of the capillary layer 30 provided in the embodiments of the present application.

[0128] As shown in FIG. 15, in an embodiment provided in the present application, the avoidance groove 32 includes a plurality of strip-shaped grooves 321 arranged at intervals, and the plurality of strip-shaped grooves 321 are arranged in two rows, and the length direction of the strip-shaped grooves 321 is parallel to the direction from the condensation end 102 to the evaporation end 101 of the vapor chamber 100.

[0129] Optionally, in other embodiments provided in the present application, the plurality of strip-shaped grooves 321 can also be arranged in three rows or four rows, which is not limited in the present application.

[0130] FIG. 16 is a schematic view of another example of the capillary layer 30 provided in the embodiments of the present application. FIG. 17 is a schematic view of another example of the capillary layer 30 provided in the embodiments of the present application.

[0131] As shown in FIGS. 16-17, in an embodiment provided in the present application, the avoidance groove 32 includes a plurality of strip-shaped grooves 321 arranged at intervals, and the length direction of the strip-shaped grooves 321 is oblique to the direction from the condensation end 102 to the evaporation end 101 of the vapor chamber 100. The oblique direction refers to the direction other than the parallel direction and the vertical direction.

[0132] In the embodiment, the length direction of the strip-shaped grooves 321 is oblique to the direction from the condensation end 102 to the evaporation end 101 of the vapor chamber 100, when the liquid-phase cooling medium at the condensation end 102 flows back to the evaporation end 101 through the capillary layer 30, the liquid-phase cooling medium can pass through the base material arranged at an inclination between the strip-shaped grooves 321 as a flow passage when passing through the first area 31, the flow process of the liquid-phase cooling medium in the first area 31 is continuous, and the liquid-phase cooling medium does not bypass the first area 31, thereby ensuring the backflow efficiency of the liquid-phase cooling medium and ensuring the heat dissipation efficiency of the vapor chamber 100.

[0133] Optionally, the length direction of the strip-shaped groove 321 can be -85°-0° or 0°-85° with respect to the direction from the condensation end 102 to the evaporation end 101 of the vapor chamber 100, which is not limited in the present application.

[0134] FIG. 18 is a schematic view of another example of the capillary layer 30 provided in an embodiment of the present application.

[0135] As shown in FIG. 18, in an embodiment provided in the present application, the avoiding groove 32 includes a plurality of first grooves 322, which are arranged at intervals in the first region 31. The first grooves 322 have first groove segments 322a and second groove segments 322b connected in communication. The length direction of the first groove segments 322a is parallel to the first direction, and the length direction of the second groove segments 322b is perpendicular to the first direction. The first direction is the direction from the condensation end 102 to the evaporation end 101 of the vapor chamber 100, i.e., the a direction in FIG. 18.

[0136] In an embodiment provided in the present application, the avoiding groove 32 can also include a plurality of second grooves 323, which are arranged at intervals on the inner side of the first grooves 322. The second grooves 323 have third groove segments 323a and fourth groove segments 323b connected in communication. The length direction of the third groove segments 323a is parallel to the first direction, and the length direction of the fourth groove segments 323b is perpendicular to the first direction. The inner side of the first grooves 322 can be understood as the side close to the center of the ring formed by the first grooves 322.

[0137] In an embodiment provided in the present application, the avoiding groove 32 can also include a plurality of third grooves 324, which are arranged at intervals on the inner side of the second grooves 323. The inner side of the second grooves 323 can be understood as the side close to the center of the ring formed by the second grooves 323.

[0138] The plurality of first grooves 322 arranged at intervals, the plurality of second grooves 323 arranged at intervals, and the plurality of third grooves 324 arranged at intervals are not connected in communication with each other, so that the substrate of the capillary layer 30 between the grooves is reserved to serve as a flow channel. The flow process of the liquid-phase cooling medium in the first region 31 is continuous, and the liquid-phase cooling medium will not bypass the first region 31, thereby ensuring the backflow efficiency of the liquid-phase cooling medium and the heat dissipation efficiency of the vapor chamber 100.

[0139] The thickness of the uniform temperature plate 100 is limited by the thickness of the mobile phone. In the current development trend of light and thin mobile phones, the uniform temperature plate 100 cannot be too thick. Under the premise of the requirement of the cavity 60 space, the thickness of the first substrate 10 and the second substrate 20 can only be reduced. However, this will affect the impact resistance of the uniform temperature plate 100. Therefore, in order to improve the impact resistance of the uniform temperature plate 100 and ensure the structural stability of the cavity 60, a support column 40 that supports is arranged between the first substrate 10 and the second substrate 20.

[0140] Optionally, the cross-sectional shape of the support column 40 can be circular or elliptical. Alternatively, the cross-sectional shape of the support column 40 can also be some special low-drag shape, such as a water droplet shape, and more specific descriptions can be found in the embodiments described later.

[0141] Optionally, the support column 40 can be separately processed and directly fixed and installed between the first substrate 10 and the second substrate 20 by welding, bonding, clamping or the like. Alternatively, the support column 40 can be integrally formed with the first substrate 10 when the first substrate 10 is processed, and the end of the support column 40 abuts against the second substrate 20. Alternatively, the support column 40 can be integrally formed with the second substrate 20 when the second substrate 20 is processed, and the end of the support column 40 abuts against the first substrate 10.

[0142] When the support column 40 is formed on the first substrate 10 or the second substrate 20, it can be achieved by stamping forming or etching process. Stamping forming refers to a processing and forming method of applying external force to plate, strip, pipe and profiled material by a stamping machine and a die, so as to produce plastic deformation or separation, thereby obtaining a workpiece with a required shape and size. In the embodiments of the present application, the first substrate 10 and the second substrate 20 can use metal plate materials such as copper alloy, stainless steel and titanium alloy, and the support column 40 can be processed by stamping forming. The etching process can use a wet etching process, which is to immerse the substrate blank in a certain chemical reagent solution, so that the part of the blank not masked by the resist reacts with the reagent and is removed, and then the resist is removed. The part exposed by the resist mask forms the support column 40.

[0143] A plurality of support columns 40 can be formed on the substrate by one action of the stamping machine and the die. Compared with the separate processing and fixed installation of the support column 40, the stamping formed support column 40 is beneficial to reduce the processing and assembly difficulty, and greatly improves the forming efficiency of the support column 40. Compared with the etching process, it has the advantages of simple process, fewer processing steps and no chemical pollution. Therefore, in the embodiments of the present application, the stamping forming method is preferably used to process the support column 40.

[0144] Optionally, the recess 11 on the first substrate 10 can also be processed by way of punch forming.

[0145] FIG. 19 is a sectional view of an example of B-B in FIG. 7. FIG. 20 is another sectional view of B-B in FIG. 7. FIG. 21 is another sectional view of B-B in FIG. 7.

[0146] As shown in FIG. 19, the capillary layer 30 can be laid on the inner surface of the first substrate 10, and the support column 40 is provided on the second substrate 20 by way of punch forming, and the end of the support column 40 can abut against the capillary layer 30, and the support column 40 supports the first substrate 10 indirectly. As shown in FIG. 20, the capillary layer 30 can also be laid on the inner surface of the second substrate 20, and the support column 40 is provided on the second substrate 20 by way of punch forming, and in this case, the capillary layer 30 needs to be provided with a relief hole for avoiding the support column 40. As shown in FIG. 21, the capillary layer 30 is a double-layer structure, and the capillary layer 30 is laid on the inner surface of the first substrate 10 and the second substrate 20.

[0147] As shown in FIG. 19, in an embodiment provided by the present application, the capillary layer 30 is laid on the inner surface of the first substrate 10, and the support column 40 is integrally provided on the second substrate 20 by way of punch forming, and the support column 40 is supported between the capillary layer 30 and the second substrate 20.

[0148] In the embodiment, on the premise that the cavity 60 has sufficient space, only one layer of capillary layer 30 is laid on the inner surface of the first substrate 10, which can reduce the overall thickness of the vapor chamber 100; the support column 40 supports the first substrate 10 indirectly, i.e., the support column 40 supports the capillary layer 30, so that the capillary layer 30 does not need to be provided with a relief hole, thereby reducing the processing difficulty of the capillary layer 30; in addition, the support column 40 supports the capillary layer 30, which can further enhance the connection strength between the capillary layer 30 and the first substrate 10, and can avoid the capillary layer 30 from falling off the first substrate 10, so as to improve the drop reliability of the vapor chamber 100.

[0149] Optionally, the thickness of the capillary layer 30 can be 0.05mm-0.06mm, which is not limited in the present application.

[0150] In the following embodiments, the support column 40 is provided on the second substrate 20, and the support column 40 is supported between the capillary layer 30 and the second substrate 20, and the specific structure of the support column 40 will be introduced. It can be understood that the structure of the support column 40 mentioned in the following can also be applied to the separately processed support column 40.

[0151] Fig. 22 is a cross-sectional view of the first column 41 according to an embodiment of the present application. In Fig. 22, (a) is a cross-sectional view of a first example of the first column 41; (b) is a cross-sectional view of a second example of the first column 41; and (c) is a cross-sectional view of a third example of the first column 41.

[0152] As shown in Fig. 22, in one embodiment of the present application, the support column 40 includes a plurality of first columns 41, and the cross section of each first column 41 is in a water-drop shape. The first arc 411 of the water-drop shape is directed to the evaporation end 101 of the vapor chamber 100, and the end of the water-drop shape opposite to the first arc 411 is directed to the condensation end 102 of the vapor chamber 100.

[0153] Compared with the conventional support column with a circular or elliptical cross section, the first column 41 with a water-drop shaped cross section in the present embodiment can improve the flow efficiency of the gas-phase cooling medium in the vapor chamber 100. The specific reasons are as follows. After the cooling medium at the evaporation end 101 of the vapor chamber 100 evaporates and flows toward the condensation end 102, the gas-phase cooling medium first passes through the first arc 411 and then smoothly flows from both sides of the first arc 411. When the gas-phase cooling medium flows to the end of the first column 41 away from the first arc 411, the gas-phase cooling medium in flow and the gas-phase cooling medium in static state are not prone to be stratified due to the converging and converging shape of the end, and thus vortex is not prone to be formed at the end. As a result, the energy loss of the gas-phase cooling medium in the flow process is reduced, the flow efficiency of the gas-phase cooling medium is improved, and the heat dissipation efficiency of the vapor chamber 100 is improved.

[0154] As shown in Fig. 22(a), in one embodiment of the present application, the cross section of the first column 41 is in a water-drop shape, and the end of the water-drop shape opposite to the first arc 411 can be in a pointed shape.

[0155] As shown in Figs. 22(b) and (c), in one embodiment of the present application, the cross section of the first column 41 is in a water-drop shape, and the water-drop shape includes the first arc 411 and the second arc 412 arranged oppositely. The first arc 411 is directed to the evaporation end 101 of the vapor chamber 100, and the second arc 412 is directed to the condensation end 102 of the vapor chamber 100. The curvature radius of the first arc 411 is greater than that of the second arc 412, and the first column 41 is processed by a stamping forming process.

[0156] The curvature radius of the first circular arc 411 is greater than 0.8 mm, for example, can be 0.85 mm, 0.9 mm, 0.95 mm, 1 mm, etc., so that the first column 41 can have sufficient support strength for the first substrate 10 and the second substrate 20. The curvature radius of the second circular arc 412 is greater than 0.25 mm, for example, can be 0.26 mm, 0.3 mm, 0.35 mm, etc. The second circular arc 412 with the curvature radius in this range is easier to be formed for the first column 41 and is not pierced by the stamping die, which can ensure the yield of the substrate. Figures 22(b) and (c) show the second circular arc 412 with different curvature radii in the case of the same first circular arc 411.

[0157] In the embodiment, the design of the second circular arc 412 can improve the yield of the substrate. The specific reason is that the stamping forming method can greatly improve the forming efficiency of the support column 40, so the stamping forming method is used to form the first column 41. If the cross section of the first column 41 is a water drop structure, and the water drop structure includes the first circular arc 411 and the sharp end opposite to the first circular arc 411, that is, the case shown in Figure 22(a), the second substrate 20 is easily pierced by the stamping die with a sharp end, resulting in the entire second substrate 20 being scrapped, which is too high in material loss during processing and has a low yield. If the cross section of the first column 41 is a water drop structure, and the water drop structure includes the first circular arc 411 and the second circular arc 412, that is, the case shown in Figures 22(b) and (c), the corresponding stamping die does not have a sharp end, thereby avoiding the second substrate 20 being pierced by the stamping die, improving the yield of the second substrate 20, and reducing the material loss during processing.

[0158] Alternatively, all the first columns 41 on the second substrate 20 can have a cross section in the shape of a water drop; or, part of the first columns 41 on the second substrate 20 have a cross section in the shape of a water drop, and part of the support columns 40 have a circular cross section. Details can be seen in the following embodiments.

[0159] Figure 23 is a schematic view of the second substrate 20 provided in an embodiment of the present application.

[0160] As shown in Figure 23, in an embodiment provided in the present application, the support column 40 includes the first column 41 with a cross section in the shape of a water drop and the second column 42 with a circular or elliptical cross section. The second substrate 20 has a second region 22 between the evaporation end 101 and the condensation end 102 of the uniform plate 100. The first column 41 is arranged in the second region 22, and the second column 42 is arranged at the outer periphery of the second region 22.

[0161] In order to improve the heat dissipation effect of the heat spreader 100 on the mobile phone, the heat spreader 100 is usually as large as possible to cover the inside of the mobile phone, and does not completely match the heat source inside the mobile phone, that is, the size of the evaporation end 101 of the heat spreader 100 is usually larger than the size of the heat source. When the heat source heats and vaporizes the cooling medium in the cavity 60, the gas-phase cooling medium will flow to the condensation end 102 in a fan-shaped diffusion manner, but most of the flow path of the gas-phase cooling medium is still a straight line from the heat source to the condensation end 102. Based on this, the main flow path of the gas-phase cooling medium can be roughly set on the second substrate 20, that is, the second area 22 in the embodiment. Optionally, the shape of the second area 22 can be rectangular, strip-shaped, etc.

[0162] There are four cases where the second column 42 is arranged on the outer periphery of the second area 22: first, along the direction perpendicular to the evaporation end 101 to the condensation end 102, the second column 42 is arranged on both sides of the second area 22. In this way, the main flow path of the gas-phase cooling medium is the second area 22 where the first column 41 is arranged, which can reduce the flow resistance of the gas-phase cooling medium; the second case is based on the first case, and there is a large gap between the upper edge of the second area 22 and the upper edge of the second substrate 20, which can be used to arrange the second column 42, for example, as shown in Figure 23; the third case is based on the first case, and there is a large gap between the lower edge of the second area 22 and the lower edge of the second substrate 20, which can be used to arrange the second column 42; the fourth case is based on the first case, and there is a large gap between the upper edge of the second area 22 and the upper edge of the second substrate 20, and there is a large gap between the lower edge of the second area 22 and the lower edge of the second substrate 20, which can be used to arrange the second column 42. The last three embodiments can reduce the area of the second area 22, reduce the number of first columns 41 arranged, and increase the number of second columns 42 arranged, which is beneficial to improve the yield of the second substrate 20.

[0163] Compared with the second substrate 20 where all the first columns 41 have a cross-sectional water droplet shape structure, the heat spreader 100 of the embodiment has a higher heat dissipation efficiency, and the specific reasons are as follows.

[0164] Figure 24 is a schematic view of the second substrate 20 where all the first columns 41 have a cross-sectional water droplet shape structure. Figure 25 is a partial schematic view of an example of the second substrate 20 in Figure 23.

[0165] As shown in FIG. 24, assuming that all the first pillars 41 on the second substrate 20 are in the cross-sectionally drop-shaped structure, and as mentioned above, when the heat source is smaller than the size of the evaporation end 101, after the heat source heats and vaporizes the cooling medium in the cavity 60, the gaseous cooling medium will flow to the condensation end 102 in the fan-shaped diffusion manner. The dotted lines in FIG. 24 represent the flow path of the gaseous cooling medium. As can be seen from FIG. 24, in the second area 22, the gaseous cooling medium flows directly against the first pillar 41, so that the first pillar 41 can fully play the effect of low aerodynamic resistance. In contrast, the gaseous cooling medium outside the second area 22 will have a high probability of flowing towards the side surface 413 of the first pillar 41, and the side surface 413 of the first pillar 41 will obviously have a wind-blocking effect due to its large area and no arc-shaped flow guide design, so that the flow resistance of the gaseous cooling medium will be increased. As shown in FIG. 25, the area outside the second area 22 is provided with the second pillar 42 in the cross-sectionally circular or elliptical shape. Since the outer side of the second pillar 42 is arc-shaped, it will not form the wind-blocking effect of the side surface 413 of the first pillar 41 in FIG. 24, and in comparison, the flow resistance of the gaseous cooling medium flowing through the second pillar 42 is smaller.

[0166] Therefore, compared with the case that all the first pillars 41 on the second substrate 20 are in the cross-sectionally drop-shaped structure, i.e. compared with the case shown in FIG. 24, the present embodiment can make the flow efficiency of the gaseous cooling medium higher, and thus make the vapor chamber 100 have higher heat dissipation efficiency.

[0167] Further, in an embodiment provided in the present application, the first pillar 41 is arranged in the second area 22, and the cross-section of the first pillar 41 is in the drop-shaped structure, which includes the first arc 411 and the second arc 412, and the curvature radius of the first arc 411 is greater than that of the second arc 412; the second pillar 42 is arranged at the outer periphery of the second area 22, and the cross-section of the second pillar 42 is in the circular or elliptical shape; and the first pillar 41 and the second pillar 42 are both processed by the stamping forming process.

[0168] The above design can further improve the processing yield of the second substrate 20. The reason is as follows: the first column 41 with the water-drop-shaped cross section is prone to be pierced by the stamping die during the stamping forming, thereby reducing the yield of the second substrate 20. If the first column 41 is only stamped on the second area 22, and the second column 42 with the circular or elliptical cross section is arranged on the outer periphery of the second area 22, compared with the first column 41 with the water-drop-shaped cross section, the die is less likely to pierce the second substrate 20 during the stamping of the second column 42. Therefore, by reducing the number of the first column 41 which is difficult to process and increasing the number of the second column 42 which is easy to process, the probability of the second substrate 20 being pierced by the stamping die can be reduced, and the yield of the second substrate 20 can be improved.

[0169] Of course, the first column 41 with the water-drop-shaped cross section in the second area 22 can also have other forms. For example, FIG. 26 is a partial schematic view of another example of the second substrate 20 in FIG. 23. As shown in FIG. 26, the first column 41 is arranged on the second area 22, and the cross section of the first column 41 has a water-drop-shaped structure including a first circular arc 411 and a sharp end opposite to the first circular arc 411; the second column 42 is arranged on the outer periphery of the second area 22, and the cross section of the second column 42 has a circular or elliptical shape.

[0170] As shown in FIG. 23, in an embodiment provided by the present application, the number of the second areas 22 is multiple, and each second area 22 is provided with the first column 41. In the direction perpendicular to the evaporation end 101 to the condensation end 102, the multiple second areas 22 are arranged at intervals.

[0171] In the embodiment, the number of the second areas 22 is multiple, so that the vapor chamber 100 can dissipate heat for multiple heat sources.

[0172] FIG. 27 is another example of a cross-sectional view of A-A in FIG. 7. FIG. 28 is a partial enlarged view of the second substrate 20 provided in an embodiment of the present application.

[0173] As shown in FIGS. 27-28, in an embodiment provided by the present application, the support column 40 further includes multiple third columns 43, and the multiple third columns 43 are arranged in the areas corresponding to the recesses 11, and the third columns 43 are supported on the first substrate 10 through the avoiding grooves 32.

[0174] In the embodiment, the third column 43 has two functions: one is that the third column 43 can support the first substrate 10, and the other is that the third column 43 can cooperate with the avoiding groove 32 to position the installation position of the capillary layer 30.

[0175] FIG. 29 is a schematic view of another example of the vapor chamber 100 according to an embodiment of the present application. FIG. 30 is a cross-sectional view of C-C in FIG. 29. FIG. 31 is a schematic view of another example of the vapor chamber 100 according to an embodiment of the present application. FIG. 32 is a cross-sectional view of another example of E-E in FIG. 2.

[0176] As shown in FIGS. 29-30, in one embodiment provided by the present application, the number of recesses 11 is multiple, and the multiple recesses 11 are arranged at intervals along a direction perpendicular to the condensation end 102 to the evaporation end 101. As shown in FIG. 31, in another embodiment provided by the present application, the multiple recesses 11 can be arranged at intervals along the direction from the condensation end 102 to the evaporation end 101. The direction from the condensation end 102 to the evaporation end 101 is the a direction in the figure.

[0177] In the present embodiment, the case that there are multiple protrusions 301b on the middle frame 301 can be avoided, so that the entire inside of the mobile phone is covered by the vapor chamber 100, thereby being able to balance the heat dissipation capability and the light and thin requirements of the mobile phone. For example, as shown in FIG. 32, when there are two functional elements 400 with large thicknesses, such as a camera module and a speaker module, there are two grooves 301b on the middle frame 301 to accommodate the camera module and the speaker module, and correspondingly, the vapor chamber 100 needs to have two recesses 11 to avoid the protrusions 301b.

[0178] FIG. 33 is a schematic view of another example of the vapor chamber 100 according to an embodiment of the present application. FIG. 34 is a cross-sectional view of D-D in FIG. 33. FIG. 35 is a cross-sectional view of another example of E-E in FIG. 2.

[0179] As shown in FIGS. 33-34, in one embodiment provided by the present application, the recess 11 is further provided with a sub-recess 111 recessed toward the second substrate 20, so that the recess 11 presents a stepped structure.

[0180] In the present embodiment, the vapor chamber 100 has a stepped recess 11, thereby being able to be applied to more complex use scenarios and being able to avoid the case that there are stepped protrusions 301b on the middle frame 301. For example, as shown in FIG. 35, when the functional element 400 is a circuit board, the circuit board has a shielding cover 401, the groove 301b on the middle frame 301 is shaped according to the outer contour of the circuit board and the shielding cover 401, and the middle frame 301 has stepped protrusions 301b, and correspondingly, the vapor chamber 100 needs to have a stepped recess 11 to avoid the protrusions 301b.

[0181] FIG. 36 is a cross-sectional view of another example of A-A in FIG. 7. FIG. 37 is a cross-sectional view of another example of E-E in FIG. 2.

[0182] As shown in FIG. 36, in an embodiment provided by the present application, the second substrate 20 is provided with a protruding portion 21 protruding away from the first substrate 10, and the protruding portion 21 is opposite to the position of the recessed portion 11.

[0183] As shown in FIG. 37, in the case that there is a gap between the display screen 200 and the vapor chamber 100, a protruding portion 21 is arranged on the side of the vapor chamber 100 facing the display screen 200, and the protruding portion 21 can expand the space volume in the cavity 60 at the position of the recessed portion 11, so that the cavity 60 can more easily bear the volume increase caused by the solidification of the cooling medium, so as to ensure that the thickness of the vapor chamber 100 is stable and unchanged, and avoid extrusion on the internal components of the mobile phone.

[0184] FIG. 38 is another example of a cross-sectional view of A-A in FIG. 7.

[0185] As shown in FIG. 38, in an embodiment provided by the present application, the vapor chamber 100 further comprises a graphite layer 50, and the graphite layer 50 is arranged on the outer side of the second substrate 20.

[0186] In the embodiment, the added graphite layer 50 can improve the heat transfer capacity of the vapor chamber 100 to the outside, and further improve the heat dissipation performance of the vapor chamber 100; in addition, the graphite layer 50 contains an insulating material, such as polyethylene terephthalate (PET), which can make the vapor chamber 100 achieve electrical insulation, and avoid circuit failure caused by incorrect connection of the vapor chamber 100.

[0187] The embodiment of the present application further provides a heat sink, which comprises a heat dissipation component and a vapor chamber 100, and the heat dissipation component is arranged on the evaporation end 101 of the vapor chamber 100.

[0188] Optionally, the heat dissipation component can be a fin or other component with a large heat exchange area.

[0189] Since the presence of the heat dissipation component will increase the thickness of the vapor chamber 100, the heat sink is usually applied in a scene where the thickness space is not particularly limited, for example, a heat dissipation scene applied in a computer host case.

[0190] The working principle of the heat sink is as follows: when the electronic components in the computer host case work and heat, the heat is conducted to the evaporation end 101 of the vapor chamber 100, the cooling medium inside is vaporized, and then flows to the condensation end 102 with lower temperature through the cavity 60 of the vapor chamber 100, at this time, the condensation end 102 releases heat through the external heat dissipation component, so that the vaporized cooling medium restores to liquid phase, and then returns to the evaporation end 101 through the capillary force generated by the capillary layer 30 on the inner wall of the vapor chamber 100, so that the heat transfer effect can be repeated.

[0191] Finally, it should be noted that the above only describes specific embodiments of the present application, but the protection scope of the present application is not limited thereto, and any changes or replacements within the technical scope disclosed by the present application should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A vapor chamber, characterized by, The utility model relates to a uniform temperature plate (100) and a manufacturing method thereof, and the uniform temperature plate (100) comprises: a first substrate (10); a second substrate (20) which is stacked with the first substrate (10) and encloses a cavity (60); a capillary layer (30) which is arranged in the cavity (60); wherein the first substrate (10) is provided with a recessed part (11) which is recessed towards the second substrate (20), and the capillary layer (30) has a first area (31) corresponding to the recessed part (11), and the first area (31) is provided with a relief groove (32).

2. The vapor chamber of claim 1, wherein, The relief groove (32) penetrates the capillary layer (30) in the thickness direction of the capillary layer (30).

3. The uniform heat spreader of claim 1 or 2, wherein, Further comprising: a support column (40) which is arranged in the cavity (60) and supported between the first substrate (10) and the second substrate (20), and the support column (40) comprises a first column body (41) with a water droplet-shaped structure in cross section and a second column body (42) with a circular or elliptical shape in cross section, the second substrate (20) has a second area (22) between the evaporation end (101) and the condensation end (102) of the uniform temperature plate (100), the first column body (41) is arranged in the second area (22), and the second column body (42) is arranged at the outer periphery of the second area (22).

4. The vapor chamber of claim 3, wherein, The water droplet-shaped structure comprises oppositely arranged first and second circular arcs (411) and (412), the first and second circular arcs (411) and (412) are respectively directed towards the evaporation end (101) and the condensation end (102) of the uniform temperature plate (100), and the curvature radius of the first circular arc (411) is greater than that of the second circular arc (412).

5. The vapor chamber of claim 4, wherein, The first column body (41) is stamping formed on the second substrate (20).

6. The vapor chamber of any one of claims 3-5, wherein, The capillary layer (30) is arranged on the surface of the first substrate (10) towards the second substrate (20), and the first and second column bodies (41) and (42) are supported on the capillary layer (30).

7. The vapor chamber of any one of claims 3-6, wherein, The support column (40) further comprises a third column body (43) which is arranged in the area corresponding to the recessed part (11) and supported on the first substrate (10) through the relief groove (32).

8. The vapor chamber of claim 3, wherein, The number of the second areas (22) is plural, and each of the second areas (22) is provided with the first column body (41). Along the direction perpendicular to the evaporation end (101) to the condensation end (102), the plural second areas (22) are arranged at intervals.

9. The vapor chamber of any one of claims 1-8, wherein, The opening area of the relief groove (32) is smaller than the area of the first area (31).

10. The vapor chamber of any one of claims 1-9, wherein, The relief groove (32) comprises plural strip-shaped grooves (321) arranged at intervals, and the length direction of the strip-shaped grooves (321) is parallel or oblique to the direction from the condensation end (102) to the evaporation end (101) of the uniform temperature plate (100).

11. The vapor chamber of any one of claims 1-10, wherein, The avoiding groove (32) comprises a plurality of first grooves (322) which are arranged at intervals in the first area (31), the first grooves (322) have a first groove section (322a) and a second groove section (322b) which are connected in communication, the length direction of the first groove section (322a) is parallel to the first direction, and the length direction of the second groove section (322b) is perpendicular to the first direction. The first direction is from the condensation end (102) to the evaporation end (101) of the vapor chamber (100).

12. The vapor chamber of any one of claims 1-11, wherein, The number of the recessed portions (11) is a plurality, and the plurality of recessed portions (11) are arranged at intervals.

13. The vapor chamber of any one of claims 1-11, wherein, The recessed portion (11) is further provided with a sub-recessed portion (111) which is recessed towards the second substrate (20).

14. The vapor chamber of any one of claims 1-11, wherein, The second substrate (20) is provided with a protruding portion (21) which is protruded away from the first substrate (10), and the position of the protruding portion (21) is opposite to that of the recessed portion (11).

15. An electronic device, comprising: The vapor chamber (100) comprises the vapor chamber (100) according to any one of claims 1-14.

16. The electronic device of claim 15, wherein, Further comprising a middle frame (301) and a functional element (400), the vapor chamber (100), the middle frame (301) and the functional element (400) are sequentially laminated, one side of the middle frame (301) facing the functional element (400) has a recess (301b), at least part of the functional element (400) is located in the recess (301b), one side of the middle frame (301) facing the vapor chamber (100) has a protrusion (301a) corresponding to the recess (301b), and the protrusion (301a) is located in the recessed portion (11).

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