Conductive fabric, conductive foam and electronic device

Abstract

Disclosed in the present application are a conductive fabric, a conductive foam and an electronic device. The conductive fabric is formed by mutually crossing-weaving a plurality of first wire harnesses and a plurality of second wire harnesses. Each first wire harness is a layer of first wire material, the first wire material comprising a plurality of first fiber wires, and each second wire harness is a layer of second wire material, the second wire material comprising a plurality of second fiber wires; or each first wire harness is two layers of first wire material, each layer of first wire material comprising a plurality of first fiber wires, and each second wire harness is two layers of second wire material, each layer of second wire material comprising a plurality of second fiber wires. The conductive fabric is configured in such a way that: when a squeezing force of 0.2N-0.4N is applied to the conductive fabric, the effective contact area fraction of the conductive fabric and a component to be connected is greater than or equal to 50%. Reducing the number of layers of the fiber wires forming the conductive fabric in the present application can reduce the size and the weight of the conductive foam, and allow the surface of the conductive fabric to tend to be a flat surface, such that under the condition of a weak squeezing force, the conductive fabric can still be in full contact with the component to be connected.

Description

Conductive cloth, conductive foam and electronic equipment Technical Field

[0001] This application relates to the technical field of electrical connectors, and more specifically, to a conductive cloth, conductive foam, and electronic equipment. Background Technology

[0002] Conductive foam is commonly used in electronic devices such as mobile phones, televisions, monitors, laptops, tablets, and car navigation systems to fill gaps and connect to a reference ground, or to provide electrical connections between the shielding of electronic components inside electronic devices and the reference ground, or to provide electrical connections between functional devices such as screens, camera modules, and system-on-chips (SOCs) and the reference ground.

[0003] As electronic devices become increasingly miniaturized and thinner, the gaps available for installing conductive foam within these devices are shrinking, making it difficult to install existing conductive foam structures within these narrow gaps. Furthermore, when conductive foam is used in grounding solutions for functional devices such as screens, applying significant pressure to the foam can cause film marks on the screen, affecting its texture. To avoid these film marks, the pressure on the conductive foam needs to be reduced. However, reducing the pressure can prevent sufficient contact between the conductive fabric and the screen, leading to the generation of third harmonics at the contact interface. This can result in the risk of failing radiated spurious emission (RSE) regulatory tests.

[0004] Therefore, it is evident that achieving thinner and lighter conductive foam while ensuring sufficient contact with the device to be connected under low compressive pressure is a problem that urgently needs to be solved in the industry.

[0005] Summary of the Invention

[0006] The purpose of this application is to provide a conductive cloth, conductive foam, and electronic device. By reducing the number of fiber layers constituting the conductive cloth, the thickness of the conductive cloth can be reduced, and the amount of adhesive used for bonding can be reduced, thereby reducing the volume and weight of the conductive foam, so as to achieve the lightweight and miniaturization of the conductive foam. After reducing the number of fiber layers, the surface of the conductive cloth becomes closer to a plane, so that the conductive cloth can achieve sufficient contact with the device to be connected even under weak compressive pressure.

[0007] In a first aspect, this application provides a conductive fabric, which is formed by interlacing multiple first wire bundles and multiple second wire bundles. Each first wire bundle is a layer of first wire, and the first wire includes multiple first fiber filaments; each second wire bundle is a layer of second wire, and the second wire includes multiple second fiber filaments. Alternatively, each first wire bundle is two layers of first wire, each layer of first wire including multiple first fiber filaments; each second wire bundle is two layers of second wire, each layer of second wire including multiple second fiber filaments.

[0008] The conductive cloth is configured such that, under a compressive force of 0.2N to 0.4N, the effective contact area fraction between the conductive cloth and the device to be connected is greater than or equal to 50%.

[0009] The conductive fabric provided in this application reduces its thickness by thinning the first fiber filament constituting the first bundle to one or two layers, and the second fiber filament constituting the second bundle to one or two layers. This thinning also reduces the weight of the conductive fabric, thereby reducing the amount of adhesive used to bond it. When applied to conductive foam, this reduces the volume and weight of the conductive foam, achieving a lighter and smaller design. Furthermore, the reduced number of layers of the first and second fiber filaments makes the overall surface of the conductive fabric nearly planar. From a microscopic perspective, even under weak compressive stress... Under these conditions, more first and second fibers also move closer to the device to be connected, allowing more first and second fibers to be compressed and deformed by the device. This increases the contact area between the conductive cloth and the device, meaning that the conductive cloth can achieve sufficient contact with the device even under weak compressive pressure. This increases the conductive path between the conductive cloth and the device, enhancing the conductivity of the conductive cloth. When this conductive cloth is used in a screen grounding scheme, it can prevent screen imprinting and also reduce or even avoid the generation of third harmonics, thus ensuring that the radiated stray emissions test of electronic equipment passes smoothly.

[0010] In one possible design, multiple first fibers are not twisted together; multiple second fibers are not twisted together.

[0011] This arrangement allows multiple first fiber filaments to be arranged in a roughly parallel manner, and multiple second fiber filaments to also be arranged in a roughly parallel manner. This makes the portions of the first and second wire bundles, excluding the braided nodes, tend to be planar, thereby improving the flatness of the conductive cloth. Consequently, the conductive cloth can achieve sufficient contact with the device to be connected even under weak compressive pressure.

[0012] In one possible design, when each first wire harness includes a layer of first wire and each second wire harness includes a layer of second wire, the conductive fabric satisfies the following relationships: 0.5R≤a1≤1.5R; 0.5R≤a2≤1.5R;

[0013] Where a1 is the minimum distance from the center of the cross section of the first fiber to the surface of the second fiber, a2 is the minimum distance from the center of the cross section of the second fiber to the surface of the first fiber, and R is the cross-sectional radius of the first and second fibers.

[0014] In one possible design, when each first wire harness includes two layers of first wire and each second wire harness includes two layers of second wire, the conductive fabric satisfies the following relationships: 0.5R≤a1≤1.5R; 1.5R<b1≤3.5R; 0.5R≤a2≤1.5R; 1.5R<b2≤3.5R;

[0015] Where a1 is the minimum distance from the center of the cross section of the first fiber filament in the inner layer to the surface of the second fiber filament, b1 is the minimum distance from the center of the cross section of the first fiber filament in the outer layer to the surface of the second fiber filament, a2 is the minimum distance from the center of the cross section of the second fiber filament in the inner layer to the surface of the first fiber filament, b2 is the minimum distance from the center of the cross section of the second fiber filament in the outer layer to the surface of the first fiber filament, and R is the cross-sectional radius of the first and second fibers filaments.

[0016] In one possible design, the conductive fabric satisfies the following relationship:

[0017] n > m. Where n is the number of first fibers in each layer of the first wire, and m is the number of second fibers in each layer of the second wire.

[0018] Under the condition that the conductive cloth has the same area, this embodiment reduces the number of braiding nodes in the second wire harness direction, thereby reducing the flatness problem of the conductive cloth caused by the depression at the braiding nodes, making the surface of the conductive cloth closer to a plane, making the conductive cloth fit better with the device to be connected, and further making the conductive cloth and the device to be connected in full contact, so as to meet the usage requirements of conductive foam under weak extrusion pressure.

[0019] In one possible design, the conductive cloth also satisfies the following relationship: (nm) / n≥50%.

[0020] The relationship between the number of first fibers in the first wire and the number of second fibers in the second wire is further defined. Compared with related technologies, under the condition that the conductive cloth has the same area, the number of braiding nodes can be reduced by 40%. This makes the surface of the conductive cloth approximately a plane, and the effective contact area fraction can reach more than 65% when in contact with the device to be connected.

[0021] In one possible design, the conductive fabric satisfies the following relationship:

[0022] m > n. Where n is the number of first fibers in each layer of the first wire, and m is the number of second fibers in each layer of the second wire.

[0023] Under the condition that the conductive cloth has the same area, this embodiment reduces the number of braiding nodes in the first wire harness direction, thereby reducing the flatness problem of the conductive cloth caused by the depression at the braiding nodes, making the surface of the conductive cloth closer to a plane, making the conductive cloth fit better with the device to be connected, and further making the conductive cloth and the device to be connected in full contact, so as to meet the usage requirements of conductive foam under weak extrusion pressure.

[0024] In one possible design, the conductive cloth also satisfies the following relationship: (mn) / m≥50%.

[0025] The relationship between the number of first fibers in the first wire and the number of second fibers in the second wire is further defined. Compared with related technologies, under the condition that the conductive cloth has the same area, the number of braiding nodes can be reduced by 40%. This makes the surface of the conductive cloth approximately a plane, and the effective contact area fraction can reach more than 65% when in contact with the device to be connected.

[0026] In one possible design, certain areas of the conductive fabric do not have the first wire harness.

[0027] This area of ​​the conductive fabric does not have weaving nodes, making the surface of this area closer to a plane. This allows for better adhesion between the conductive fabric and the device to be connected, and further ensures that the conductive fabric and the device to be connected maintain full contact, thus meeting the requirements for use of conductive foam under low compressive pressure.

[0028] In one possible design, certain areas of the conductive fabric do not have a second wire harness.

[0029] This area of ​​the conductive fabric does not have weaving nodes, making the surface of this area closer to a plane. This allows for better adhesion between the conductive fabric and the device to be connected, and further ensures that the conductive fabric and the device to be connected maintain full contact, thus meeting the requirements for use of conductive foam under low compressive pressure.

[0030] In one possible design, the surface of the conductive cloth is coated with a conductive paste.

[0031] By filling the gaps between the fibers with conductive paste, and also filling the pits at the braiding nodes of the first and second wire bundles, the surface of the conductive cloth becomes more planar, which improves the fit between the conductive cloth and the device to be connected, and further ensures that the conductive cloth and the device to be connected are in full contact, so as to meet the requirements of conductive foam under weak extrusion pressure.

[0032] In one possible design, the conductive cloth satisfies the following relationships: d1 > h1; d2 > h2.

[0033] Wherein, d1 is the cross-sectional width of the first fiber, h1 is the cross-sectional height of the first fiber, d2 is the cross-sectional width of the second fiber, and h2 is the cross-sectional height of the second fiber.

[0034] Pre-processing the fiber filaments to have a cross-sectional width greater than the cross-sectional height, i.e., the fiber filaments are flat and the cross-section is roughly elliptical, has two effects when woven into conductive cloth: first, it is possible to weave a conductive cloth of a larger size with fewer fiber filaments; second, the wider cross-sectional width of the fiber filaments allows the fiber filaments to fill the pores formed by the reduction in the number of fiber filament layers, thus making the surface of the conductive cloth more approximately planar.

[0035] In one possible design, the conductive cloth also satisfies the following relationships: d1 / h1≥130%; d2 / h2≥130%.

[0036] This further defines the relationship between the cross-sectional width and cross-sectional height of the fiber filaments, enabling the fiber filaments to be woven into a conductive fabric with a larger area and smaller pores using fewer filaments.

[0037] In one possible design, the thickness of the conductive cloth is ≤20μm.

[0038] In one possible design, the first filament is a metal fiber; or, the first filament is formed by coating a non-metallic fiber with a metal coating.

[0039] The second fiber is a metal fiber; or, the second fiber is formed by coating a non-metallic fiber with a metal coating.

[0040] In one possible design, the metal fiber material includes at least one of copper, aluminum, silver, gold, magnesium, zinc, iron, lead, nickel, cobalt, tin, bismuth, palladium, platinum, ruthenium, and rhodium.

[0041] In one possible design, the non-metallic fiber material includes at least one of natural fibers, carbon fibers, ceramic fibers, silicon carbide fibers, glass fibers, polyamide fibers, polyester fibers, polyphenylene sulfone terephthalamide fibers, aromatic polyamide fibers, and poly(p-phenylene benzodioxazole) fibers.

[0042] In one possible design, the first and second fibers may be made of the same or different materials.

[0043] In one possible design, the conductive paste material includes at least one of conductive silver paste, conductive copper paste, conductive nickel paste, and conductive graphene paste.

[0044] Secondly, this application also provides a conductive foam, including the conductive cloth of any of the above.

[0045] The conductive foam in this application includes a conductive cloth. This conductive cloth is made by thinning the first fiber filament constituting the first wire bundle to one or two layers, and the second fiber filament constituting the second wire bundle to one or two layers. This reduces the thickness of the conductive cloth, and consequently reduces its mass, allowing for a reduction in the amount of adhesive used to bond the conductive cloth. This reduces the volume and weight of the conductive foam, achieving a lighter and smaller design. Furthermore, the reduced number of layers of the first and second fiber filaments makes the overall surface of the conductive cloth nearly planar, enabling it to make sufficient contact with the device to be connected even under weak compressive pressure. This increases the conductive path between the conductive cloth and the device, enhancing the conductivity of the conductive cloth. When applied to screen grounding solutions, this conductive cloth can prevent screen imprinting and also reduces or even eliminates the generation of third harmonics, ensuring successful passing of radiated stray radiation tests for electronic devices.

[0046] In one possible design, the conductive foam also includes a foam core and an adhesive, with the conductive fabric bonded to the surface of the foam core by the adhesive.

[0047] In one possible design, an insulating adhesive is also included, which is applied to the surface of the foam core to bond the foam core to the components to be connected.

[0048] Insulating adhesive serves to bond and fix the conductive foam to the components to be connected. Furthermore, insulating adhesive is chosen primarily to improve bond strength. In related technologies, conductive adhesive is typically used to bond and fix the conductive foam as a whole. However, since conductive adhesive mainly consists of two parts—conductive particles (which conduct electricity) and adhesive (which provides the bond), while insulating adhesive only contains the adhesive, the insulating adhesive contains more adhesive of the same weight, thus exhibiting greater bond strength.

[0049] In one possible design, the insulating adhesive is located in the center or near the edge of the surface of the foam core.

[0050] When the insulating adhesive is located in the middle of one side of the foam core, the conductive foam is bonded to the components in the middle, so that the fixing point of the conductive foam is located in the middle and can remain stable, thereby improving the shock resistance of the conductive foam.

[0051] The insulating adhesive is placed near the edge of the foam core, so that the fixing point of the conductive foam is located at the edge. This design can be used in some narrow and special installation scenarios.

[0052] In one possible design, the surface of the foam core has a clearance area, and the clearance area is not covered with conductive cloth.

[0053] The surface of the foam has a clearance area where no conductive cloth is installed. This is to avoid accidental connection to non-grounded components, thus facilitating the installation of conductive foam.

[0054] In one possible design, there are two conductive cloths, which are placed opposite each other on the surface of the foam core, and the pores of the foam core are filled with conductive paste.

[0055] Because the foam core only has conductive fabric on two opposing surfaces, and none on its peripheral walls, the volume of the conductive foam can be further reduced. Furthermore, the pores of the foam core are filled with conductive paste, which, when the conductive foam is compressed, electrically connects the upper and lower conductive fabrics, thus ensuring the conductive foam can conduct electricity.

[0056] Thirdly, this application also provides an electronic device including the conductive foam of any of the above.

[0057] In this embodiment, the conductive foam is miniaturized and made thinner, making it easier to install inside the electronic device and reducing the manufacturing difficulty. At the same time, the conductive foam occupies less internal space, which is beneficial for optimizing the layout of other functional components, thereby further reducing the manufacturing difficulty of the electronic device. In addition, when the conductive foam is used in the screen grounding scheme, it can avoid screen imprinting and reduce or even avoid the generation of third harmonics, thereby ensuring that the radiated stray emissions test of the electronic device passes smoothly. Attached Figure Description

[0058] Figure 1 is a schematic diagram of conductive foam in related technologies;

[0059] Figure 2 is a cross-sectional view of the conductive cloth in the related technology;

[0060] Figure 3 is a schematic diagram of a smartphone provided in an embodiment of this application;

[0061] Figure 4 is a cross-sectional view of TT in Figure 3;

[0062] Figure 5 is a cross-sectional view of an example of a camera module for a smartphone provided in an embodiment of this application;

[0063] Figure 6 is a cross-sectional view of another example of a smartphone camera module provided in an embodiment of this application;

[0064] Figure 7 is a cross-sectional view of four embodiments of the conductive foam provided in this application;

[0065] Figure 8 is a cross-sectional view of another example of the conductive foam provided in the embodiments of this application;

[0066] Figure 9 is a cross-sectional view of another example of the conductive foam provided in the embodiments of this application;

[0067] Figure 10 is a schematic diagram of the working principle of the conductive foam in Figure 9;

[0068] Figure 11 is a cross-sectional view of another example of conductive foam provided in the embodiments of this application;

[0069] Figure 12 is a schematic diagram of an example of the conductive cloth provided in an embodiment of this application;

[0070] Figure 13 is a cross-sectional view of an example of EE in Figure 12;

[0071] Figure 14 is a cross-sectional view of an example of MM in Figure 12;

[0072] Figure 15 is a schematic diagram of the conductive cloth and the screen being attached in Figure 13;

[0073] Figure 16 is a top view of the screen provided in the embodiment of this application when it is grounded through conductive foam;

[0074] Figure 17 is a cross-sectional view of an example of UU in Figure 16;

[0075] Figure 18 is a top view of the circuit board provided in the embodiment of this application when it is grounded through conductive foam;

[0076] Figure 19 is a cross-sectional view of VV in Figure 18;

[0077] Figure 20 is a cross-sectional view of another example of EE in Figure 12;

[0078] Figure 21 is a cross-sectional view of another example of MM in Figure 12;

[0079] Figure 22 is a schematic diagram of the first and second fiber filaments provided in this application;

[0080] Figure 23 is a schematic diagram of the conductive cloth and the screen being attached in Figure 20;

[0081] Figure 24 is a schematic diagram of another example of UU in Figure 16;

[0082] Figure 25 is a schematic diagram of another example of the conductive cloth provided in the embodiments of this application;

[0083] Figure 26 is a cross-sectional view of an example of FF in Figure 25;

[0084] Figure 27 is a cross-sectional view of an example of GG in Figure 25;

[0085] Figure 28 is a schematic diagram of another example of the conductive cloth provided in the embodiments of this application;

[0086] Figure 29 is a cross-sectional view of an example of HH in Figure 28;

[0087] Figure 30 is a cross-sectional view of an example of JJ in Figure 28;

[0088] Figure 31 is a schematic diagram of another example of the conductive cloth provided in the embodiments of this application;

[0089] Figure 32 is a cross-sectional view of an example of LL in Figure 31;

[0090] Figure 33 is a schematic diagram of another example of the conductive cloth provided in the embodiments of this application;

[0091] Figure 34 is a cross-sectional view of an example of KK in Figure 33;

[0092] Figure 35 is a cross-sectional view of another example of EE in Figure 12;

[0093] Figure 36 is a cross-sectional view of another example of EE in Figure 12;

[0094] Figure 37 is a cross-sectional view of another example of FF in Figure 25;

[0095] Figure 38 is a cross-sectional view of another example of KK in Figure 33;

[0096] Figure 39 is a cross-sectional view of another example of EE in Figure 12;

[0097] Figure 40 is a cross-sectional view of another example of MM in Figure 12;

[0098] Figure 41 is a cross-sectional view of another example of EE in Figure 12;

[0099] Figure 42 is a cross-sectional view of another example of EE in Figure 12.

[0100] Figure label:

[0101] 10', meridian; 20', parallel;

[0102] 10. First wire harness; 11. First wire; 111. First fiber filament;

[0103] 20. Second wire harness; 21. Second wire; 211. Second fiber filament;

[0104] 30. Conductive paste;

[0105] 100. Conductive foam; 101. Conductive cloth; 102. Adhesive; 103. Foam core; 103a. Clearance area; 104. Insulating adhesive;

[0106] 200. Screen;

[0107] 300. Housing; 301. Mid-frame; 302. Battery cover;

[0108] 400. Circuit board; 401. Electronic components; 402. Solder pads;

[0109] 500, shielding cover;

[0110] 600. Camera module; 601. Steel bracket; 602. Copper foil;

[0111] 700, Antenna. Detailed Implementation

[0112] The following are exemplary descriptions of relevant content that may be involved in the embodiments of this application. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0113] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0114] In the description of this application, it should be understood that the terms "upper", "lower", "side", "inner", "outer", "top", "bottom", etc., indicate the orientation or positional relationship based on the installation orientation or positional relationship, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0115] It should also be noted that in the embodiments of this application, the same reference numerals are used to represent the same component or part. For the same part in the embodiments of this application, the reference numerals may only be used to mark one part or part as an example in the figure. It should be understood that the reference numerals are also applicable to other identical parts or parts.

[0116] In the description of this application, it should be noted that the term "and / or" is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone.

[0117] Conductive foam is commonly used in electronic devices such as mobile phones, televisions, monitors, laptops, tablets, and car navigation systems to fill gaps and connect to a reference ground, or to provide electrical connections between the shielding covers of electronic components inside electronic devices and the reference ground, or to provide electrical connections between functional devices such as screens, camera modules, and system-on-a-chip and the reference ground.

[0118] Figure 1 is a schematic diagram of conductive foam 100 in the related technology.

[0119] As shown in Figure 1, the current conductive foam 100 is typically composed of a foam core 103, an adhesive 102, and a conductive cloth 101. The conductive cloth 101 is bonded and fixed to the outside of the foam core 103 by the adhesive 102. When the conductive foam 100 makes contact with the device to be connected and achieves electrical connection, the current is mainly conducted through the conductive cloth 101.

[0120] When the conductive foam 100 is compressed, the deformation of the conductive foam 100 as a whole is mainly caused by the shrinkage of the pores in the foam core 103. The conductive cloth 101 is woven from warp and weft threads. At the microscopic level, the warp and weft threads can be slightly compressed, but the amount of compression is relatively small.

[0121] Industry-wide improvements to the thinner and lighter design of conductive foam 100 primarily focus on altering the material properties of the foam core 103, adjusting the use of adhesive 102, and improving the structure of conductive cloth 101. This application will focus on proposing new improvements to conductive cloth 101.

[0122] Currently available conductive fabrics 101 are mostly plain-weave conductive fabrics, woven from multiple warp and weft threads. Each warp or weft thread typically consists of three or more layers of fiber filaments, and the overall thickness of the conductive fabric 101 is 30μm to 100μm. Using three or more layers of fiber filaments to form the warp or weft threads increases the weaving density and reduces porosity. However, this type of conductive fabric 101 has a relatively large overall thickness, making it difficult to install in narrow gaps. Furthermore, the surface of the conductive fabric 101 formed by three or more layers of fiber filaments is uneven, preventing the conductive foam 100 from achieving sufficient contact between the conductive fabric 101 and the device to be connected under weak compressive pressure, thus significantly limiting its application scenarios. The following will describe this in detail with reference to the accompanying drawings.

[0123] Figure 2 is a cross-sectional view of the conductive cloth 101 in the related art. The conductive cloth 101 in Figure 2 is a 500x magnified image taken with an electron microscope, and is in a natural, unloaded state. As shown in Figure 2, the cross-section of the conductive cloth 101 shows that the warp 10' and weft 20' are composed of three layers of fibers: A, B, and C. Layer A fibers are defined as the outermost fibers, layer C fibers are defined as the fibers in contact with the weft 20', and layer B fibers are defined as the fibers between layers A and C. Figure 3 is a schematic diagram of a smartphone provided in an embodiment of this application. Figure 3(a) is a front view of the smartphone; Figure 3(b) is a back view of the smartphone.

[0124] As shown in Figures 2 and 3, Figure 2 shows that the conductive cloth 101, woven from three layers of fiber filaments consisting of warp 10' and weft 20', has a relatively large overall thickness. Applying it to conductive foam 100 hinders the achievement of a thinner and lighter design. Furthermore, when conductive foam 100 is used in a scenario where screen 200 is grounded, the surface of the conductive cloth 101 facing screen 200 exhibits an uneven texture. In particular, the weaving nodes between warp 10' and weft 20' (i.e., the location indicated by D1 in the figure) are deeply recessed, while the parts of warp 10' and weft 20' closest to screen 200 (i.e., the locations indicated by D2 and D3 in the figure) are noticeably protruding. It can also be seen that warp 10' is significantly higher than weft 20'. In this situation, to ensure sufficient contact between the conductive cloth 101 and the screen 200, the compressive force on the conductive foam 100 must be increased. This would compress the surface of the conductive cloth 101 to a near-planar shape, thereby increasing the effective contact area between the conductive cloth 101 and the screen 200. However, excessive compressive force can lead to mold marks on the screen 200. To avoid mold marks on the screen 200, the compressive force on the conductive foam 100 needs to be reduced. However, reducing the compressive force would prevent sufficient contact between the conductive cloth 101 and the screen 200. Analysis shows that under weak compressive force, only the warp thread 10' at D2 is the main contact point for the conductive cloth 101, while the weft thread 20' at D3 and the weaving node at D1 have difficulty contacting the screen 200. When the conductive cloth 101 cannot fully contact the screen 200, third harmonics are easily generated at the contact interface, potentially leading to failure of the radiated stray emissions test. The following section will describe this in detail with theoretical justification.

[0125] According to research theory, the key parameters affecting the third harmonic current value I of conductive foam 100 are:

[0126] Where k is the effective contact area fraction of the interface, F is the contact pressure, S is the size of the conductive foam, ρ is the resistivity, and the third harmonic current value I is directly proportional to the above parameters.

[0127] As mentioned above, the main factors affecting the third harmonic current I include contact pressure F and effective contact area fraction k. Contact pressure F is the squeezing force of the screen 200 on the conductive cloth 101 mentioned above, and it is negatively correlated with the third harmonic current I; that is, the greater the contact pressure F, the smaller the third harmonic current I. However, due to the molding limitations of the screen 200, the squeezing force of the screen 200 on the conductive cloth 101 cannot be too large, meaning the value of contact pressure F is limited. Effective contact area fraction k is the degree of contact between the screen 200 and the conductive cloth 101 mentioned above. A larger effective contact area fraction k indicates more sufficient contact between the screen 200 and the conductive cloth 101, and it is also negatively correlated with the third harmonic current I; that is, the larger the effective contact area fraction k, the smaller the third harmonic current I. Therefore, to reduce the third harmonic at the contact interface between the conductive foam 100 and the screen 200, it is necessary to ensure that the screen 200 and the conductive cloth 101 have sufficient contact.

[0128] In summary, the conductive cloth 101 in the related technology has two problems: first, it cannot meet the requirements for thinness and lightness of the conductive foam 100; second, it cannot make sufficient contact with the device to be connected under weak extrusion pressure.

[0129] In view of this, in order to solve the above-mentioned technical problems, this application provides a conductive cloth, a conductive foam, and an electronic device. By reducing the number of fiber filament layers constituting the conductive cloth, the thickness of the conductive cloth can be reduced, and the amount of adhesive used for bonding can be reduced, thereby reducing the volume and weight of the conductive foam, so as to achieve the lightweight and miniaturization of the conductive foam. After reducing the number of fiber filament layers, the surface of the conductive cloth becomes closer to a plane, so that the conductive cloth can achieve full contact with the device to be connected even under weak extrusion pressure.

[0130] This application first provides an electronic device, which may also be referred to as a mobile device, terminal device, mobile terminal, or terminal. This electronic device includes, but is not limited to, handheld devices, in-vehicle devices, wearable devices, computing devices, or other processing devices connected to a wireless modem. For example, the electronic device may include a smartwatch, smart wristband, smartphone, personal digital assistant (PDA) computer, tablet computer, laptop computer, in-vehicle computer, smart glasses, handheld game console, and other electronic devices with conductive foam 100 that require a thin and lightweight design.

[0131] To more conveniently illustrate the electronic device provided in the embodiments of this application, and as an example rather than a limitation, the technical solution of this application will be described in detail below using a smartphone as an example. Meanwhile, for the convenience of the description of the embodiments below, an XYZ coordinate system is established for the smartphone. Specifically, the extension direction of the short side of the smartphone is defined as the X direction, the extension direction of the long side of the smartphone is defined as the Y direction, and the thickness direction of the smartphone is defined as the Z direction, and the X, Y, and Z directions are mutually perpendicular.

[0132] Referring again to Figure 3, the smartphone provided in this embodiment includes a screen 200, a housing 300, and conductive foam 100 (not shown in Figure 3). The housing 300 further includes a mid-frame 301 and a battery cover 302. The screen 200 is fixedly mounted on the front end of the mid-frame 301, and the battery cover 302 is fixedly mounted on the rear end of the mid-frame 301. The screen 200, mid-frame 301, and battery cover 302 together define the accommodating space of the smartphone, which is used to install various functional components of the smartphone, such as the conductive foam 100, camera module 600, circuit board 400, and other functional components mentioned later.

[0133] Optionally, the battery cover 302 can be screwed or snapped onto the middle frame 301. A sealing ring can be provided between the battery cover 302 and the middle frame 301 to improve the sealing and waterproofing effect at the joint between the battery cover 302 and the middle frame 301. The sealing ring can be made of highly elastic materials such as silicone or rubber.

[0134] In addition, smartphones may also include functional components such as: processor, universal serial bus (USB) interface, charging management module, power management module, battery, microphone, mobile communication module, antenna, wireless communication module, audio module, headphone jack, sensor module, buttons, and subscriber identification module (SIM) card interface.

[0135] These functional components can be modified according to user needs. It is understood that the specific embodiments described above are only one specific implementation of this application. Other ways to implement the solution of this application are also within the scope of protection of this application, and will not be elaborated here.

[0136] Figure 4 is a cross-sectional view of TT in Figure 3.

[0137] As shown in Figure 4, in the scenario of grounding the screen 200 of a smartphone, a conductive foam 100 is connected to the inner side of the screen 200, that is, the side of the screen 200 facing the inside of the phone, and a metal frame 301 is also provided at intervals on the side of the screen 200 facing the inside of the phone, so that the conductive foam 100 is pressed between the screen 200 and the metal frame 301, thereby achieving grounding of the screen 200.

[0138] Referring to Figure 4, the circuit board 400 of a smartphone has various electronic components 401 such as resistors, capacitors, and chips. In order to shield the internal circuit from the influence of external electromagnetic waves and the outward radiation of internally generated electromagnetic waves, some electronic components 401 need to be covered with a shield 500. In the scenario where the shield 500 is grounded, the metal frame 301, the conductive foam 100, and the shield 500 are stacked in sequence. The conductive foam 100 is pressed between the shield 500 and the metal frame 301, thereby achieving the grounding of the shield 500.

[0139] In this embodiment, the conductive foam 100, besides being used for grounding the screen 200 and the shielding cover 500, can also be used for electrical connections between other functional components. For example, continuing to refer to Figure 4, an antenna 700 is fabricated on the battery cover 302 of a smartphone using laser-direct-structuring (LDS) technology, or an antenna 700 is fabricated using a flexible circuit board. The conductive foam 100 is disposed between the circuit board 400 and the battery cover 302, so that the antenna 700 on the circuit board 400 and the battery cover 302 are electrically connected through the conductive foam 100. Typically, two to four antennas 700 are required for each signal frequency band, and each antenna 700 has two connection points forming a feed point. Therefore, each antenna 700 requires two conductive foams 100.

[0140] Figure 5 is a cross-sectional view of an example of a smartphone camera module 600 provided in an embodiment of this application.

[0141] As shown in Figure 5, in the grounding scenario of the camera module 600 of a smartphone, a copper foil 602 is provided on the side of the camera module 600 away from the lens, and a steel plate bracket 601 is provided on the copper foil 602 at intervals. A compressed and deformed conductive foam 100 is provided in the gap between the copper foil 602 and the steel plate bracket 601. The end of the steel plate bracket 601 is fixed to the power terminal of the circuit board 400 by screws, thereby realizing the grounding of the camera module 600.

[0142] Figure 6 is a cross-sectional view of another example of a smartphone camera module 600 provided in an embodiment of this application.

[0143] As shown in Figure 6, in another scenario, due to the limited internal space of the smartphone, the gap between the camera module 600 and the steel bracket 601 may not be wide enough, which will not provide enough space for the conductive foam 100. In this case, only the conductive cloth 101 can be laid between the copper foil 602 and the steel bracket 601 to establish an electrical connection between the copper foil 602 and the steel bracket 601, thereby achieving the grounding of the camera module 600.

[0144] Similar to the above scenarios, in other scenarios, for example, in the grounding scenario of screen 200, the electrical connection between screen 200 and metal frame 301 can be achieved solely through conductive cloth 101, thereby grounding screen 200; as another example, in the grounding scenario of shield 500, the electrical connection between shield 500 and metal frame 301 can be achieved solely through conductive cloth 101, thereby grounding shield 500; as yet another example, the electrical connection between circuit board 400 and antenna 700, as well as the electrical connection between other functional components, can all be achieved solely through conductive cloth 101.

[0145] Figure 7 is a cross-sectional view of four embodiments of the conductive foam 100 provided in this application. In Figure 7(a), it is a D-shaped conductive foam; in Figure 7(b), it is an L-shaped conductive foam; in Figure 7(c), it is a T-shaped conductive foam; and in Figure 7(d), it is a P-shaped conductive foam.

[0146] As shown in Figure 7, this application embodiment further provides a conductive foam 100, the cross-section of which includes, but is not limited to, D-shaped, L-shaped, T-shaped, P-shaped, etc. The conductive foam 100 includes a conductive cloth 101, a foam core 103, and an adhesive 102, the conductive cloth 101 being bonded to the outside of the foam core 103 by the adhesive 102.

[0147] Optionally, the material of the foam core 103 includes, but is not limited to, foamed polyurethane, foamed polypropylene, foamed polyethylene, special rubber, ethylene-vinyl acetate copolymer (EVA), ethylene propylene diene monomer (EPDM) rubber, etc.

[0148] Optionally, the adhesive 102 may include, but is not limited to, thermosetting adhesives, pressure-sensitive adhesives, photosensitive adhesives, etc.

[0149] Optionally, in addition to the D-shaped, L-shaped, T-shaped, and P-shaped structures mentioned above, the cross-sectional shape of the conductive foam 100 in this application can also be triangular, circular, elliptical, polygonal, or other irregular shapes.

[0150] Figure 8 is a cross-sectional view of another example of the conductive foam 100 provided in the embodiments of this application.

[0151] As shown in Figure 8, in one embodiment provided in this application, the conductive foam 100 further includes an insulating adhesive 104, which is disposed on the surface of the foam core 103 for bonding the foam core 103 to the component to be connected.

[0152] In this embodiment, the insulating adhesive 104 serves to bond and fix the conductive foam 100 to the components to be connected. Furthermore, the insulating adhesive 104 is chosen primarily to improve the bonding strength. In related technologies, conductive adhesive is typically used to bond and fix the conductive foam 100 as a whole. However, since conductive adhesive mainly consists of conductive particles (which conduct electricity) and adhesive (which provides bonding), while insulating adhesive 104 only contains adhesive, the insulating adhesive 104 contains more adhesive of the same weight, thus exhibiting greater bonding strength.

[0153] Optionally, the insulating adhesive 104 can be disposed on the top of the foam core 103; or, the insulating adhesive 104 can be disposed on the bottom of the foam core 103, as shown in Figure 8; or, the insulating adhesive 104 can also be disposed on the side of the foam core 103.

[0154] As shown in Figure 8, in one embodiment provided in this application, the insulating adhesive 104 is located in the middle on the surface of the foam core 103 with the insulating adhesive 104.

[0155] In this embodiment, the insulating adhesive 104 is located in the middle of one side surface of the foam core 103, so that the conductive foam 100 is bonded to the component at the middle part, and the fixing constraint point of the conductive foam 100 is located in the middle and can remain stable, thereby improving the shock resistance of the conductive foam 100.

[0156] Of course, in other embodiments, the insulating adhesive 104 may also be disposed at the edge of the foam core 103. For example, FIG9 is a cross-sectional view of another example of the conductive foam 100 provided in the embodiments of this application. As shown in FIG9, in one embodiment provided in this application, the insulating adhesive 104 is located adjacent to the edge on the surface of the foam core 103 having the insulating adhesive 104.

[0157] In this embodiment, the insulating adhesive 104 is adjacent to the edge of the foam core 103, so that the fixing constraint point of the conductive foam 100 is located at the edge. This design can be used in some narrow and special installation scenarios.

[0158] As shown in Figure 9, in one embodiment provided in this application, the surface of the foam core 103 has an avoidance area 103a, and the avoidance area 103a is not provided with conductive cloth 101.

[0159] In this embodiment, the surface of the foam has a clearance area 103a where the conductive cloth 101 is not provided. This is to avoid misconnection to non-grounded components, thereby facilitating the installation of the conductive foam 100. For example, if the installation space is narrow and there is a component that does not need to be grounded on the side of the installation position, the clearance area 103a can be used to adhere to the component if the conductive foam 100 cannot be completely cleared, thereby avoiding misconnection to the component.

[0160] Figure 10 is a schematic diagram of the working principle of the conductive foam 100 in Figure 9.

[0161] Taking a smartphone screen 200 grounding scenario as an example, as shown in Figure 10, the top and bottom components of the conductive foam 100 are the screen 200 and the metal frame 301, respectively. After the screen 200 and the metal frame 301 compress and deform the conductive foam 100, the conductive foam 100 adheres tightly to the opposite sides of the screen 200 and the metal frame 301. Under the skin effect, the static electricity and interference current accumulated on the screen 200 flow through the conductive cloth 101 to the metal frame 301, and then the metal frame 301 conducts the current to the user's hand or the external environment, thereby reducing the impact of static electricity and interference current on the screen 200 and ensuring the normal operation of the screen 200.

[0162] Figure 11 is a cross-sectional view of another example of the conductive foam 100 provided in the embodiments of this application.

[0163] As shown in Figure 11, in one embodiment provided in this application, there are two conductive cloths 101. The two conductive cloths 101 are disposed opposite to each other on the surface of the foam core 103, and the pores of the foam core 103 are filled with conductive paste 30.

[0164] In this embodiment, since there is no conductive cloth 101 on the peripheral wall of the foam core 103, the volume of the conductive foam 100 can be further reduced. Furthermore, the pores of the foam core 103 are filled with conductive paste 30, allowing the conductive foam 100 to electrically connect the upper and lower conductive cloths 101 when compressed, thereby ensuring that the conductive foam 100 can conduct electricity.

[0165] As mentioned above, this application will focus on proposing new improvements to the conductive cloth 101. The conductive cloth 101 provided in the embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0166] Figure 12 is a schematic diagram of an example of the conductive cloth 101 provided in an embodiment of this application. Figure 13 is a cross-sectional view of an example of EE in Figure 12. Figure 14 is a cross-sectional view of an example of MM in Figure 12.

[0167] As shown in Figures 12-14, in one embodiment provided in this application, the conductive cloth 101 is formed by interlacing multiple first wire bundles 10 and multiple second wire bundles 20. Each first wire bundle 10 is a layer of first wire 11, and the first wire 11 includes multiple first fiber filaments 111. Each second wire bundle 20 is a layer of second wire 21, and the second wire 21 includes multiple second fiber filaments 211. Furthermore, the conductive cloth 101 is configured such that, under a compressive force of 0.2N to 0.4N, the effective contact area fraction between the conductive cloth 101 and the device to be connected is greater than or equal to 50%.

[0168] It should be noted that in the embodiments of this application, the first wire bundle 10 can be a meridian, and the second wire bundle 20 corresponds to a parallel; if the first wire bundle 10 can be a parallel, then the second wire bundle 20 corresponds to a meridian.

[0169] As shown in Figures 13 and 14, in one embodiment provided in this application, the conductive cloth 101 satisfies the following relationships: 0.5R≤a1≤1.5R; 0.5R≤a2≤1.5R;

[0170] Where a1 is the minimum distance from the center of the cross section of the first fiber filament 111 to the surface of the second fiber filament 211, a2 is the minimum distance from the center of the cross section of the second fiber filament 211 to the surface of the first fiber filament 111, and R is the cross-sectional radius of the first fiber filament 111 and the second fiber filament 211.

[0171] In this embodiment, the cross-sectional shape of the first fiber filament 111 and the second fiber filament 211 is circular, and the value of R is within the range of, but is not limited to, 5 to 10 μm. It should be noted that the limitation on the number of layers of conductive cloth 101 in this application refers to the number of layers of conductive cloth 101 in its natural state when it is not compressed by the device to be connected; the value of R is the cross-sectional radius of the first fiber filament 111 and the second fiber filament 211 in their natural state when they are not compressed by the device to be connected.

[0172] To prevent entanglement between the multiple first fiber filaments 111 and the multiple second fiber filaments 211, and to ensure the surface of the conductive cloth 101 is flat, as shown in Figures 13 and 14, in one embodiment provided in this application, the multiple first fiber filaments 111 are not twisted together; the multiple second fiber filaments 211 are not twisted together.

[0173] Among them, twisting and untwisting refer to the twisting treatment of fiber filaments in the textile process. Twisting is to rotate the fiber filaments so that the filaments are wrapped together to form a certain twist, while untwisting refers to fiber filaments that have not undergone twisting treatment and are not wrapped together.

[0174] In this embodiment, the multiple first fiber filaments 111 are not twisted together, so that the multiple first fiber filaments 111 are arranged in a roughly parallel manner. The multiple second fiber filaments 211 are also not twisted together, so that the multiple second fiber filaments 211 are also arranged in a roughly parallel manner. This makes the portions of the first wire bundle 10 and the second wire bundle 20, except for the braided nodes, tend to be flat, thereby improving the flatness of the conductive cloth 101. As a result, the conductive cloth 101 can achieve sufficient contact with the device to be connected even under weak compressive pressure.

[0175] Figure 15 is a schematic diagram of the conductive cloth 101 and the screen 200 in Figure 13 being attached together.

[0176] Taking the grounding scenario of a smartphone screen 200 as an example, Figure 15 shows the scenario where the conductive cloth 101 and the screen 200 are in contact when the conductive foam 100 is not compressed. As shown in Figure 15, in this embodiment, the conductive cloth 101, the first wire bundle 10 and the second wire bundle 20 are both composed of a layer of fiber filaments. Compared with the conductive cloth 101 of the related technology in Figure 2, it can be seen that the surface of the conductive cloth 101 facing the screen 200 in this embodiment is closer to a plane, which allows the conductive cloth 101 to achieve full contact with the screen 200 even under weak compressive pressure.

[0177] Figure 16 is a top view of the screen 200 provided in this embodiment of the application when it is grounded through the conductive foam 100. Figure 16 is a top view taken from the inside of the screen 200. Figure 17 is a cross-sectional view of an example of UU in Figure 16. The foam core 103 is omitted in Figure 17.

[0178] As shown in Figures 16 and 17, after the screen 200 applies pressure to the conductive foam 100, the screen 200 compresses the surface of the conductive cloth 101 into a roughly planar shape. Since the surface of the conductive cloth 101 is closer to a planar shape in the initial stage, the screen 200 does not need to apply a large pressure. Applying a very weak pressure is enough to make the surface of the conductive cloth 101 present a planar shape. From a microscopic perspective, more first fiber filaments 111 and second fiber filaments 211 move closer to the screen 200, and more first fiber filaments 111 and second fiber filaments 211 can be compressed and deformed by the screen 200, thus having a larger contact area with the screen 200. That is, the conductive cloth 101 and the screen 200 achieve sufficient contact.

[0179] The following section will take the conductive cloth 101 shown in Figure 17 as an example to conduct a detailed calculation and analysis of the contact area between the conductive cloth 101 and the screen 200. First, the following terms will be explained: Nominal contact area, also known as surface contact area or geometric contact area, is the area determined by the boundary of the macroscopic interface between the two contacting objects; Real contact area, also known as effective contact area or actual contact area, is the sum of the areas of the micro-contact surfaces generated by the deformation of the two contacting objects through the direct transmission of interfacial interaction forces by each micro-protrusion.

[0180] Referring again to Figure 17, the nominal contact area between the conductive cloth 101 and the screen 200 is S. The effective contact area between the conductive cloth 101 and the screen 200 is the sum of the contact areas between each first fiber filament 111 and the screen 200, plus the sum of the contact areas between each second fiber filament 211 and the screen 200, i.e., s1+s2+s3+s4+s5+s6+s7.

[0181] After the conductive cloth 101 and the screen 200 come into contact, the ratio of the effective contact area to the nominal contact area, or the effective contact area fraction, is: (s1+s2+s3+s4+s5+s6+s7) / S. The effective contact area fraction is an important indicator of whether the conductive cloth 101 and the screen 200 achieve sufficient contact. When the effective contact area fraction is greater than or equal to 50%, sufficient contact is achieved, meeting grounding requirements and avoiding RSE testing risks. In related technologies, when the screen 200 applies a compressive force of 0.5N to the conductive cloth 101, the effective contact area fraction between the conductive cloth 101 and the screen 200 is 40% to 50%. However, using the conductive cloth 101 in this embodiment, when the screen 200 applies a compressive force of approximately 0.3N to the conductive cloth 101, the effective contact area fraction between the conductive cloth 101 and the screen 200 reaches 65%.

[0182] Furthermore, the nominal contact area is explained further. Referring again to Figures 16-17, taking the screen 200 as an example, when the area of ​​the screen 200 is greater than or equal to the conductive cloth 101, the area of ​​the conductive cloth 101 is used as the nominal contact area, i.e., area S in Figure 17. Figure 18 is a top view of the circuit board 400 provided in this embodiment of the application when grounded through the conductive foam 100. The conductive foam 100 in Figure 18 appears slightly transparent to contrast the area difference between the grounding pad 402 and the conductive foam 100; in reality, the conductive foam 100 is not transparent. Figure 19 is a cross-sectional view of VV in Figure 18, where the foam core 103 is omitted. As shown in Figures 18-19, taking the grounding pad 402 as an example, when the area of ​​the grounding pad 402 is smaller than the conductive cloth 101, the area of ​​the grounding pad 402 is used as the nominal contact area, i.e., the area S in Figure 19. The effective contact area is the sum of the contact areas of each first fiber filament 111 and the grounding pad 402, plus the sum of the contact areas of each second fiber filament 211 and the grounding pad 402, i.e., the area s1+s2+s3+s4+s5 in Figure 19.

[0183] Figure 20 is a cross-sectional view of another example of EE in Figure 12. Figure 21 is a cross-sectional view of another example of MM in Figure 12.

[0184] As shown in Figures 20 and 21, in one embodiment provided in this application, the conductive cloth 101 is formed by interlacing multiple first wire bundles 10 and multiple second wire bundles 20. Each first wire bundle 10 consists of two layers of first wire 11, and each layer of first wire 11 includes multiple first fiber filaments 111. Each second wire bundle 20 consists of two layers of second wire 21, and each layer of second wire 21 includes multiple second fiber filaments 211. Furthermore, the conductive cloth 101 is configured such that, under a compressive force of 0.2N to 0.4N, the effective contact area fraction between the conductive cloth 101 and the device to be connected is greater than or equal to 50%.

[0185] As shown in Figures 20 and 21, in one embodiment provided in this application, the conductive cloth 101 satisfies the following relationships: 0.5R≤a1≤1.5R; 1.5R<b1≤3.5R; 0.5R≤a2≤1.5R; 1.5R<b2≤3.5R;

[0186] Where a1 is the minimum distance from the center of the cross section of the first fiber filament 111 in the inner layer to the surface of the second fiber filament 211, b1 is the minimum distance from the center of the cross section of the first fiber filament 111 in the outer layer to the surface of the second fiber filament 211, a2 is the minimum distance from the center of the cross section of the second fiber filament 211 in the inner layer to the surface of the first fiber filament 111, b2 is the minimum distance from the center of the cross section of the second fiber filament 211 in the outer layer to the surface of the first fiber filament 111, and R is the cross-sectional radius of the first fiber filament 111 and the second fiber filament 211.

[0187] In this embodiment, the cross-sectional shape of the first fiber filament 111 and the second fiber filament 211 is circular, and the value of R is within the range of, but is not limited to, 5 to 10 μm. It should be noted that the limitation on the number of layers of conductive cloth 101 in this application refers to the number of layers of conductive cloth 101 in its natural state when it is not compressed by the device to be connected; the value of R is the cross-sectional radius of the first fiber filament 111 and the second fiber filament 211 in their natural state when they are not compressed by the device to be connected.

[0188] Taking the cross-sectional radius R of the first fiber filament 111 and the second fiber filament 211 as an example of 5 μm, and as shown in Figure 20, when the minimum distance from the center of the cross-section of the first fiber filament 111 to the surface of the second fiber filament 211 is in the range of 2.5 to 7.5 μm (including the endpoint values ​​of 2.5 and 7.5 μm), this part of the first fiber filament 111 is the inner layer of the first wire 11, or the first layer of the first wire 11; when the minimum distance from the center of the cross-section of the first fiber filament 111 to the surface of the second fiber filament 211 is in the range of 7.5 to 17.5 μm (excluding the endpoint value of 7.5 μm, including the endpoint value of 17.5 μm), this part of the first fiber filament 111 is the outer layer of the first wire 11. Or, as shown in Figure 21, when the minimum distance from the center of the cross-section of the second fiber filament 211 to the surface of the first fiber filament 111 is in the range of 2.5 to 7.5 μm (including the endpoint values ​​of 2.5 and 7.5 μm), this part of the second fiber filament 211 is the second wire 21 of the inner layer, or the second wire 21 of the first layer; when the minimum distance from the center of the cross-section of the second fiber filament 211 to the surface of the first fiber filament 111 is in the range of 7.5 to 17.5 μm (excluding the endpoint value of 7.5 μm, including the endpoint value of 17.5 μm), this part of the second fiber filament 211 is the second wire 21 of the outer layer, or the second wire 21 of the second layer.

[0189] Regarding the definition of the number of fiber layers mentioned above, the numerical ranges of a1, b1, a2, and b2 are explained as follows: Figure 22 is a schematic diagram of the first fiber 111 and the second fiber 211 provided in this application. Taking the second fiber 211 in Figure 22 as an example, if the weaving tension is too high when weaving the conductive cloth 101, the first fiber 111 may compress the inner second fiber 211 into a flat shape, resulting in the cross-section of the inner second fiber 211 not being a complete circle. Therefore, the minimum value of a2 is set to 0.5R. The inner second fiber 211 may also be supported by adjacent fiber filaments, so the maximum value of a2 is set to 1.5R. The outermost second fiber 211 may be supported by adjacent fiber filaments and is also opposite to the center of the cross-section of the second fiber 211 directly below it, so the maximum value of b2 is set to 3.5R.

[0190] Figure 23 is a schematic diagram of the conductive cloth 101 and the screen 200 in Figure 20 being attached together.

[0191] Taking the grounding scenario of the smartphone screen 200 as an example, Figure 23 shows the scenario where the conductive cloth 101 and the screen 200 are in contact when the conductive foam 100 is not compressed. As shown in Figure 23, in this embodiment, the first wire bundle 10 and the second wire bundle 20 of the conductive cloth 101 are both two layers of fiber filaments. Compared with the conductive cloth 101 of the related technology in Figure 2, it can be seen that the surface of the conductive cloth 101 facing the screen 200 in this embodiment is closer to a plane, which allows the conductive cloth 101 to achieve full contact with the screen 200 even under weak compressive pressure.

[0192] Figure 24 is a schematic diagram of another example of UU in Figure 16, and also a schematic diagram of screen 200 in Figure 23 when it is pressing conductive cloth 101.

[0193] As shown in Figure 24, after the screen 200 applies pressure to the conductive foam 100, the screen 200 compresses the surface of the conductive cloth 101 into a roughly planar shape. Since the surface of the conductive cloth 101 is closer to a planar shape in the initial stage, the screen 200 does not need to apply a large pressure. Applying a very weak pressure is enough to make the surface of the conductive cloth 101 present a planar shape.

[0194] Referring again to Figure 24, in this embodiment, the nominal contact area between the conductive cloth 101 and the screen 200 is S. The effective contact area between the conductive cloth 101 and the screen 200 is the sum of the contact areas between each first fiber filament 111 and the screen 200, plus the sum of the contact areas between each second fiber filament 211 and the screen 200, i.e., s1+s2+s3+s4+s5+s6+s7+s8+s9. After the conductive cloth 101 and the screen 200 come into contact, the effective contact area fraction is: (s1+s2+s3+s4+s5+s6+s7+s8+s9) / S. Simulation tests show that when the screen 200 applies a compressive force of approximately 0.4N to the conductive cloth 101, the effective contact area fraction between the conductive cloth 101 and the screen 200 reaches 73%.

[0195] In summary, the conductive cloth 101 provided in this application embodiment can reduce its thickness by thinning the first fiber filament 111 constituting the first wire bundle 10 to one or two layers, and the second fiber filament 211 constituting the second wire bundle 20 to one or two layers. This thinning also reduces the mass of the conductive cloth 101, thereby reducing the amount of adhesive 102 used to bond the conductive cloth 101. When the conductive cloth 101 is applied to the conductive foam 100, the volume and weight of the conductive foam 100 can be reduced, achieving a lighter and smaller conductive foam 100. Furthermore, due to the reduction in the number of layers of the first fiber filament 111 and the second fiber filament 211, the overall surface of the conductive cloth 101 approaches a planar shape. From a microscopic perspective... Even under weak compressive pressure, more of the first fiber 111 and the second fiber 211 move closer to the device to be connected, allowing more of the first fiber 111 and the second fiber 211 to be deformed by the device to be connected. This results in a larger contact area between the conductive cloth 101 and the device to be connected. In other words, the conductive cloth 101 can achieve sufficient contact with the device to be connected even under weak compressive pressure. This increases the conductive path between the conductive cloth 101 and the device to be connected, enhances the conductivity of the conductive cloth 101, and avoids screen 200 imprinting when the conductive cloth 101 is used in the grounding scheme of the screen 200. In addition, it reduces or even avoids the generation of third harmonics, thereby ensuring that the radiated stray emissions test of the electronic equipment passes smoothly.

[0196] Simulation tests show that, under the same weak compressive force conditions, such as applying a compressive force of 0.5N to the conductive cloth 101, the effective contact area fraction between the conductive cloth 101 and the device to be connected in this embodiment can reach over 70%, while the effective contact area fraction between the conductive cloth 101 and the device to be connected in related technologies is only 40% to 50%. Compared to related technologies, the conductive cloth 101 in this embodiment can reduce the third harmonic current by 20% to 30%. If the same effective contact area fraction is achieved, the conductive cloth 101 in this embodiment can reduce the compressive force by 40% to 50%, effectively avoiding screen 200 printing problems in grounded scenarios. If the same extrusion pressure and the same third harmonic current are achieved, the nominal contact area of ​​the conductive cloth 101 in the embodiments of this application can be reduced by 40% to 50%, that is, the size of the required conductive cloth 101 is reduced. In addition, the amount of adhesive 102 required for the small-sized conductive cloth 101 is also reduced, so that the volume and weight of the final conductive foam 100 are reduced.

[0197] In one embodiment provided in this application, the thickness of the conductive cloth 101 is ≤20μm, for example, it can be 20μm, 19μm, 18μm, 17μm, etc. The thickness of the conductive cloth 101 can be understood as the Z-direction length in Figure 13.

[0198] In this embodiment, the thickness range of the conductive cloth 101 is further defined so that the conductive cloth 101 can meet the miniaturization design requirements of the conductive foam 100.

[0199] As mentioned earlier, the conductive cloth 101 in the related technology has deep indentations at the weaving nodes (i.e., at D1 in Figure 2), which makes the conductive cloth 101 have an uneven shape, thus affecting the flatness of the conductive cloth 101. Therefore, it is possible to improve the flatness of the conductive cloth 101 by reducing the number of weaving nodes, which is the improvement made in the following embodiment.

[0200] In the conductive cloth 101 provided in this application embodiment, the first wire harness 10 and the second wire harness 20 satisfy the following relationship:

[0201] n≠m.

[0202] Where n is the number of first fiber filaments 111 in each layer of first wire 11, and m is the number of second fiber filaments 211 in each layer of second wire 21.

[0203] When n ≠ m, there are two cases: one is n > m, and the other is m > n. These two implementations will be described in detail below.

[0204] Figure 25 is a schematic diagram of another example of the conductive cloth 101 provided in the embodiments of this application. Figure 26 is a cross-sectional view of an example of FF in Figure 25. Figure 27 is a cross-sectional view of an example of GG in Figure 25.

[0205] As shown in Figures 25-27, in one embodiment provided in this application, n > m, that is, the number of first fiber filaments 111 in the first wire 11 is greater than the number of second fiber filaments 211 in the second wire 21.

[0206] In this embodiment, the relationship between the number of first fiber filaments 111 in the first wire 11 and the number of second fiber filaments 211 in the second wire 21 is defined. Comparing Figures 12 and 25, it can be seen that, under the condition that the conductive cloth 101 has the same area, in the extension direction of the second wire bundle 20, this embodiment reduces the number of braiding nodes, that is, reduces the number of braiding nodes in the X direction in Figure 25, thereby reducing the flatness problem of the conductive cloth 101 caused by the depression at the braiding nodes, making the surface of the conductive cloth 101 closer to a plane, making the conductive cloth 101 fit better with the device to be connected, and further making the conductive cloth 101 maintain sufficient contact with the device to be connected, so as to meet the usage requirements of the conductive foam 100 under weak extrusion pressure.

[0207] Furthermore, in one embodiment provided in this application, (nm) / n≥50%.

[0208] Optionally, the values ​​of n and m can range from 2 to 50.

[0209] Specifically, m can be 3, then n can be 6, 7, 8, 9...; or m can be 5, then n can be 10, 11, 12, 13...; or m can be 7, then n can be 14, 15, 16, 17...

[0210] In this embodiment, the relationship between the number of first fiber filaments 111 in the first wire 11 and the number of second fiber filaments 211 in the second wire 21 is further defined. Compared with related technologies, under the condition that the conductive cloth 101 has the same area, the number of braiding nodes can be reduced by 40%, so that the surface of the conductive cloth 101 can be approximately a plane, and the effective contact area can reach 100% when in contact with the device to be connected.

[0211] Figure 28 is a schematic diagram of another example of the conductive cloth 101 provided in the embodiments of this application. Figure 29 is a cross-sectional view of an example of HH in Figure 28. Figure 30 is a cross-sectional view of an example of JJ in Figure 28.

[0212] As shown in Figures 28-30, in one embodiment provided in this application, m > n, that is, the number of second fiber filaments 211 in the second wire 21 is greater than the number of first fiber filaments 111 in the first wire 11.

[0213] In this embodiment, the relationship between the number of first fiber filaments 111 in the first wire 11 and the number of second fiber filaments 211 in the second wire 21 is defined. Comparing Figures 12 and 28, it can be seen that, under the condition that the conductive cloth 101 has the same area, in the extension direction of the first wire bundle 10, this embodiment reduces the number of braiding nodes, that is, reduces the number of braiding nodes in the Y direction in Figure 28, thereby reducing the flatness problem of the conductive cloth 101 caused by the depression at the braiding nodes, making the surface of the conductive cloth 101 closer to a plane, making the conductive cloth 101 fit better with the device to be connected, and further making the conductive cloth 101 maintain sufficient contact with the device to be connected, so as to meet the usage requirements of the conductive foam 100 under weak extrusion pressure.

[0214] Furthermore, in one embodiment provided in this application, (mn) / m≥50%.

[0215] Optionally, the values ​​of n and m can range from 2 to 50.

[0216] Specifically, n can be 3, then m can be 6, 7, 8, 9...; or n can be 6, then n can be 12, 13, 14, 15...; or n can be 8, then m can be 16, 17, 18, 19...

[0217] In this embodiment, the relationship between the number of first fiber filaments 111 in the first wire 11 and the number of second fiber filaments 211 in the second wire 21 is further defined. Compared with related technologies, under the condition that the conductive cloth 101 has the same area, the number of braiding nodes can be reduced by 40%, so that the surface of the conductive cloth 101 can be approximately a plane, and the effective contact area can reach 100% when in contact with the device to be connected.

[0218] Figure 31 is a schematic diagram of another example of the conductive cloth 101 provided in the embodiments of this application. Figure 32 is a cross-sectional view of an example of LL in Figure 31.

[0219] As shown in Figures 31-32, in one embodiment provided in this application, a portion of the conductive cloth 101 does not have the first wire bundle 10.

[0220] A portion of the second wire bundle 20 on the woven conductive cloth 101 can be removed, or the first wire bundle 10 can be left unwoven in a certain area during the weaving stage of the conductive cloth 101. This results in a portion of the conductive cloth 101 in this embodiment having only the second wire bundle 20 and not the first wire bundle 10. Consequently, this portion of the conductive cloth 101 does not have weaving nodes, making the surface of this portion more planar. This allows for better adhesion between the conductive cloth 101 and the device to be connected, further ensuring sufficient contact between the conductive cloth 101 and the device to be connected, thus meeting the usage requirements of the conductive foam 100 under weak compressive pressure.

[0221] Figure 33 is a schematic diagram of another example of the conductive cloth 101 provided in the embodiments of this application. Figure 34 is a cross-sectional view of an example of KK in Figure 33.

[0222] As shown in Figures 33-34, in one embodiment provided in this application, a portion of the conductive cloth 101 does not have the second wire bundle 20.

[0223] A portion of the second wire bundle 20 on the woven conductive cloth 101 can be removed, or the second wire bundle 20 can be left unwoven in a certain area during the weaving stage of the conductive cloth 101. This results in a portion of the conductive cloth 101 in this embodiment having only the first wire bundle 10 and no second wire bundle 20. Consequently, this portion of the conductive cloth 101 does not have weaving nodes, making the surface of this portion more planar. This allows for better adhesion between the conductive cloth 101 and the device to be connected, further ensuring sufficient contact between the conductive cloth 101 and the device to be connected, thus meeting the usage requirements of the conductive foam 100 under weak compressive pressure.

[0224] Figure 35 is a cross-sectional view of another example of EE in Figure 12.

[0225] As shown in Figure 35, in one embodiment provided in this application, each first wire bundle 10 is a layer of first wire 11, which includes multiple untwisted first fiber filaments 111. Each second wire bundle 20 is a layer of second wire 21, which includes multiple untwisted second fiber filaments 211. After the first wire bundles 10 and the second wire bundles 20 are woven into a conductive cloth 101, a conductive paste 30 is coated on the surface of the conductive cloth 101.

[0226] In this embodiment, a conductive paste 30 is coated on the surface of the conductive cloth 101. The conductive paste 30 can fill the gaps between the fibers and also fill the pits at the braiding nodes of the first wire bundle 10 and the second wire bundle 20. This makes the surface of the conductive cloth 101 closer to a plane, which can improve the fit between the conductive cloth 101 and the device to be connected. Furthermore, it can ensure that the conductive cloth 101 and the device to be connected are in full contact, so as to meet the usage requirements of the conductive foam 100 under weak extrusion pressure. In addition, the first wire bundle 10 and the second wire bundle 20 formed by a single layer of fiber fibers reduce the thickness of the conductive cloth 101 to the minimum. On this basis, the coating of conductive paste 30 increases the conductive path and enhances the conductivity of the conductive cloth 101.

[0227] Figure 36 is a cross-sectional view of another example of EE in Figure 12.

[0228] As shown in Figure 36, in one embodiment provided in this application, each first wire bundle 10 consists of two layers of first wire 11, each layer of first wire 11 including multiple untwisted first fiber filaments 111. Each second wire bundle 20 consists of two layers of second wire 21, each layer of second wire 21 including multiple untwisted second fiber filaments 211. After the first wire bundles 10 and the second wire bundles 20 are woven into a conductive cloth 101, a conductive paste 30 is coated on the surface of the conductive cloth 101.

[0229] Figure 37 is a cross-sectional view of another example of FF in Figure 25.

[0230] As shown in Figure 37, in one embodiment provided in this application, each first wire bundle 10 is a layer of first wire 11, and the first wire 11 includes multiple untwisted first fiber filaments 111. Each second wire bundle 20 is a layer of second wire 21, and the second wire 21 includes multiple untwisted second fiber filaments 211. The number of first fiber filaments 111 in the first wire 11 is greater than the number of second fiber filaments 211 in the second wire 21. After the first wire bundle 10 and the second wire bundle 20 are woven into a conductive cloth 101, a conductive paste 30 is coated on the surface of the conductive cloth 101.

[0231] Figure 38 is a cross-sectional view of another example of KK in Figure 33.

[0232] As shown in Figure 38, in one embodiment provided in this application, each first wire bundle 10 is a layer of first wire 11, which includes multiple untwisted first fiber filaments 111. Each second wire bundle 20 is a layer of second wire 21, which includes multiple untwisted second fiber filaments 211. After the first wire bundles 10 and the second wire bundles 20 are woven into a conductive cloth 101, a portion of the multiple strands of the second wire bundles 20 is removed so that a portion of the conductive cloth 101 does not have the second wire bundles 20. A conductive paste 30 is coated on the surface of the conductive cloth 101.

[0233] In this embodiment, the conductive paste 30 not only fills the gaps between the fiber filaments to enhance the conductivity of the conductive cloth 101, but also bonds adjacent fiber filaments to improve the connection reliability of the fiber filaments and prevent the fiber filaments from breaking apart, thereby avoiding current interruption.

[0234] Figure 39 is a cross-sectional view of another example of EE in Figure 12. Figure 40 is a cross-sectional view of another example of MM in Figure 12.

[0235] As shown in Figures 39-40, in one embodiment provided in this application, the conductive cloth 101 satisfies the following relationships: d1 > h1; d2 > h2.

[0236] Wherein, d1 is the cross-sectional width of the first fiber filament 111, h1 is the cross-sectional height of the first fiber filament 111, d2 is the cross-sectional width of the second fiber filament 211, and h2 is the cross-sectional height of the second fiber filament 211.

[0237] In this embodiment, the fiber filaments are pre-processed so that the cross-sectional width is greater than the cross-sectional height, that is, the fiber filaments are flat and the cross-section is approximately elliptical. Weaving such fiber filaments into conductive cloth 101 has two effects: first, it is possible to weave a conductive cloth 101 of a larger size with fewer fiber filaments; second, the wider cross-sectional width of the fiber filaments allows the fiber filaments to fill the pores formed by the reduction in the number of fiber filament layers, thereby making the surface of the conductive cloth 101 more approximately planar.

[0238] In this embodiment, the cross-sectional shape of the first fiber filament 111 and the second fiber filament 211 is elliptical. For the definition of the number of layers of the conductive cloth 101, you can refer to the case in the previous embodiment where the cross-sectional shape of the first fiber filament 111 and the second fiber filament 211 is circular, as follows.

[0239] When each first wire harness 10 is a layer of first wire 11 and each second wire harness 20 is a layer of second wire 21, the conductive cloth 101 satisfies the following relationship: 0.5R'≤a1≤1.5R'; 0.5R'≤a2≤1.5R'.

[0240] Where a1 is the minimum distance from the center of the cross section of the first fiber filament 111 to the surface of the second fiber filament 211, a2 is the minimum distance from the center of the cross section of the second fiber filament 211 to the surface of the first fiber filament 111, and R' is half of the minor axis of the cross-sectional ellipse of the first fiber filament 111 and the second fiber filament 211. Numerically, R' = 1 / 2 × h1 = 1 / 2 × h2.

[0241] When each first wire harness 10 consists of two layers of first wire 11 and each second wire harness 20 consists of two layers of second wire 21, the conductive cloth 101 satisfies the following relationships: 0.5R'≤a1≤1.5R'; 1.5R'<b1≤3.5R'; 0.5R'≤a2≤1.5R'; 1.5R'<b2≤3.5R'.

[0242] Where a1 is the minimum distance from the center of the cross section of the first fiber filament 111 to the surface of the second fiber filament 211, a2 is the minimum distance from the center of the cross section of the second fiber filament 211 to the surface of the first fiber filament 111, and R' is half of the minor axis of the cross-sectional ellipse of the first fiber filament 111 and the second fiber filament 211. Numerically, R' = 1 / 2 × h1 = 1 / 2 × h2.

[0243] Optionally, in this embodiment, the fiber filaments are processed into a flat shape in two ways: one is to directly form flat fiber filaments during the spinning stage, and the other is to perform secondary processing on the fiber filaments with circular cross-sections, extruding the circular cross-section fiber filaments into flat fiber filaments.

[0244] Alternatively, in order to ensure that the flat fibers can be arranged horizontally in a regular manner, the fibers can be gently pressed by a pressure plate during the weaving stage, or a height limiting plate can be installed on the weaving machine to limit the position of the fibers.

[0245] The cross-sectional shape of the first fiber filament 111 and the second fiber filament 211 is elliptical, which can be used on a conductive cloth 101 woven from a single layer of fiber filaments, for example, as shown in Figures 39-40, where the first wire bundle 10 is composed of a single layer of flat first fiber filament 111 and the second wire bundle 20 is composed of a single layer of flat second fiber filament 211.

[0246] The cross-sectional shape of the first fiber filament 111 and the second fiber filament 211 is elliptical. They can also be used on the conductive cloth 101 woven from two layers of fiber filaments. Figure 41 is a cross-sectional view of another example of EE in Figure 12. For example, as shown in Figure 41, the first wire bundle 10 is composed of two layers of flat first fiber filaments 111, and the second wire bundle 20 is composed of two layers of flat second fiber filaments 211.

[0247] Furthermore, in one embodiment provided in this application, the first wire harness 10 and the second wire harness 20 also satisfy the following relationships: d1 / h1≥130%; d2 / h2≥130%.

[0248] In this embodiment, the relationship between the cross-sectional width and cross-sectional height of the fiber filaments is further defined, so that the fiber filaments can be woven into a conductive cloth 101 with a larger area and smaller pores with fewer fibers.

[0249] Figure 42 is a cross-sectional view of another example of EE in Figure 12.

[0250] As shown in Figure 42, in one embodiment provided in this application, a conductive cloth 101 woven from flat fiber filaments is coated with a conductive paste 30 on its surface.

[0251] In one embodiment provided in this application, the first fiber filament 111 is a metal fiber, and the second fiber filament 211 is a metal fiber.

[0252] In one embodiment provided in this application, the first fiber 111 is formed by coating a non-metallic fiber with a metal coating, and the second fiber 211 is formed by coating a non-metallic fiber with a metal coating.

[0253] In one embodiment provided in this application, the first fiber 111 is formed by coating a non-metallic fiber with a metal coating, and the second fiber 211 is a metallic fiber.

[0254] In one embodiment provided in this application, the first fiber 111 is a metal fiber, and the second fiber 211 is formed by coating a non-metallic fiber with a metal coating.

[0255] Optionally, in the above embodiments, the material of the metal fiber includes at least one of copper, aluminum, silver, gold, magnesium, zinc, iron, lead, nickel, cobalt, tin, bismuth, palladium, platinum, ruthenium, and rhodium.

[0256] Optionally, in the above embodiments, the non-metallic fiber material includes at least one of natural fibers, carbon fibers, ceramic fibers, silicon carbide fibers, glass fibers, polyamide fibers (nylon), polyester fibers (polyester), polyphenylene sulfone terephthalamide fibers (PSA), aromatic polyamide fibers, and poly(p-phenylene benzodioxazole) fibers (PBO).

[0257] Specifically, natural fibers can be at least one of cotton, linen, wool, and silk.

[0258] Alternatively, a metallic coating can be deposited on the aforementioned non-metallic fibers using either physical vapor deposition (PVD) or chemical vapor deposition (CVD).

[0259] In one embodiment provided in this application, the first fiber filament 111 and the second fiber filament 211 can be made of the same material, for example: they can both be copper metal fiber filaments; they can both be silver metal fiber filaments; they can both be copper-plated glass fibers; they can both be copper-plated aromatic polyamide fibers.

[0260] In one embodiment provided in this application, the materials of the first fiber filament 111 and the second fiber filament 211 may be different. For example, the first fiber filament 111 may be a copper metal fiber filament and the second fiber filament 211 may be a silver metal fiber filament; the first fiber filament 111 may be a silver metal fiber filament and the second fiber filament 211 may be a copper-plated glass fiber; the first fiber filament 111 may be a copper-plated aromatic polyamide fiber and the second fiber filament 211 may be a copper-plated glass fiber.

[0261] In one embodiment provided in this application, the conductive paste 30 is made of at least one of conductive silver paste, conductive copper paste, conductive nickel paste, and conductive graphene paste.

[0262] Conductive paste 30 is a mixture of conductive materials suspended or dispersed in a liquid medium, commonly used in the manufacture of electronic components 401 and circuit boards 400. It mainly consists of two components: conductive particles and a dielectric. The conductive particles are typically metallic materials such as silver, copper, and aluminum, possessing high conductivity and mechanical strength. The dielectric serves to stabilize the conductive particles and enhance their conductivity. The differences between conductive silver paste, conductive copper paste, conductive nickel paste, and conductive graphene paste lie in the type of conductive particles; the dielectric can always be an organic material.

[0263] Furthermore, a dispersant can be added to the conductive paste 30. A dispersant is a substance added to a medium that can improve the affinity between the particle surface and the medium, allowing the particles to be easily wetted while maintaining a dispersed state; or a substance that can generate steric hindrance to form a complete coating layer on the particle surface, thereby preventing particle agglomeration. In this application, the dispersant effectively improves the wettability, suspension stability, and rheological properties of the conductive particles, preventing agglomeration and sedimentation, ensuring uniform dispersion of the conductive particles, and giving the conductive paste 30 a suitable viscosity.

[0264] Optionally, the dispersant includes, but is not limited to, aqueous borate, sodium polyacrylate, glycerol, polyethylene glycol, triethanolamine, sodium hexametaphosphate, etc.

[0265] Finally, it should be noted that the above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A conductive cloth, characterized in that, It is made of multiple strands of first wire bundle (10) and multiple strands of second wire bundle (20) interwoven together; Each of the first wire bundles (10) is a layer of first wire (11), the first wire (11) includes multiple first fiber filaments (111), and each of the second wire bundles (20) is a layer of second wire (21), the second wire (21) includes multiple second fiber filaments (211). Alternatively, each of the first wire bundles (10) consists of two layers of first wire (11), each layer of first wire (11) including multiple first fiber filaments (111), and each of the second wire bundles (20) consists of two layers of second wire (21), each layer of second wire (21) including multiple second fiber filaments (211). The conductive cloth (101) is configured such that, under a compressive force of 0.2N to 0.4N, the effective contact area fraction between the conductive cloth (101) and the device to be connected is greater than or equal to 50%.

2. The conductive cloth according to claim 1, characterized in that, The multiple first fiber filaments (111) are not twisted together; the multiple second fiber filaments (211) are not twisted together.

3. The conductive cloth according to claim 1, characterized in that, When each of the first wire bundles (10) is a layer of the first wire (11) and each of the second wire bundles (20) is a layer of the second wire (21), the conductive cloth (101) satisfies the following relationship: 0.5R≤a1≤1.5R; 0.5R≤a2≤1.5R; Where a1 is the minimum distance from the center of the cross section of the first fiber filament (111) to the surface of the second fiber filament (211), a2 is the minimum distance from the center of the cross section of the second fiber filament (211) to the surface of the first fiber filament (111), and R is the cross-sectional radius of the first fiber filament (111) and the second fiber filament (211).

4. The conductive cloth according to claim 1, characterized in that, When each of the first wire bundles (10) consists of two layers of the first wire (11) and each of the second wire bundles (20) consists of two layers of the second wire (21), the conductive cloth (101) satisfies the following relationships: 0.5R≤a1≤1.5R; 1.5R<b1≤3.5R; 0.5R≤a2≤1.5R; 1.5R<b2≤3.5R; Wherein, a1 is the minimum distance from the center of the cross section of the first fiber filament (111) in the inner layer to the surface of the second fiber filament (211), b1 is the minimum distance from the center of the cross section of the first fiber filament (111) in the outer layer to the surface of the second fiber filament (211), a2 is the minimum distance from the center of the cross section of the second fiber filament (211) in the inner layer to the surface of the first fiber filament (111), b2 is the minimum distance from the center of the cross section of the second fiber filament (211) in the outer layer to the surface of the first fiber filament (111), and R is the cross-sectional radius of the first fiber filament (111) and the second fiber filament (211).

5. The conductive cloth according to claim 1, characterized in that, The conductive cloth (101) satisfies the following relationship: n > m; Wherein, n is the number of the first fiber filaments (111) in each layer of the first wire (11), and m is the number of the second fiber filaments (211) in each layer of the second wire (21).

6. The conductive cloth according to claim 5, characterized in that, The conductive cloth (101) also satisfies the following relationship: (nm) / n≥50%.

7. The conductive cloth according to claim 1, characterized in that, The conductive cloth (101) satisfies the following relationship: m > n; Wherein, n is the number of the first fiber filaments (111) in each layer of the first wire (11), and m is the number of the second fiber filaments (211) in each layer of the second wire (21).

8. The conductive cloth according to claim 7, characterized in that, The conductive cloth (101) also satisfies the following relationship: (mn) / m≥50%.

9. The conductive cloth according to any one of claims 1-8, characterized in that, A portion of the conductive cloth (101) does not have the first wire bundle (10).

10. The conductive cloth according to any one of claims 1-8, characterized in that, A portion of the conductive cloth (101) does not have the second wire bundle (20).

11. The conductive cloth according to any one of claims 1-10, characterized in that, The surface of the conductive cloth (101) is coated with a conductive paste (30).

12. The conductive cloth according to any one of claims 1-2 and 5-11, characterized in that, The conductive cloth (101) satisfies the following relationships: d1 > h1; d2 > h2; Wherein, d1 is the cross-sectional width of the first fiber filament (111), h1 is the cross-sectional height of the first fiber filament (111), d2 is the cross-sectional width of the second fiber filament (211), and h2 is the cross-sectional height of the second fiber filament (211).

13. The conductive cloth according to claim 12, characterized in that, The conductive cloth (101) also satisfies the following relationships: d1 / h1≥130%; d2 / h2≥130%.

14. The conductive cloth according to any one of claims 1-13, characterized in that, The thickness of the conductive cloth (101) is ≤20μm.

15. The conductive cloth according to any one of claims 1-14, characterized in that, The first fiber filament (111) is a metal fiber; or, the first fiber filament (111) is formed by coating a non-metallic fiber with a metal coating. The second fiber filament (211) is a metal fiber; or, the second fiber filament (211) is formed by coating a non-metallic fiber with a metal coating.

16. The conductive cloth according to claim 15, characterized in that, The metal fiber material includes at least one of copper, aluminum, silver, gold, magnesium, zinc, iron, lead, nickel, cobalt, tin, bismuth, palladium, platinum, ruthenium, and rhodium.

17. The conductive cloth according to claim 15, characterized in that, The non-metallic fiber material includes at least one of the following: natural fiber, carbon fiber, ceramic fiber, silicon carbide fiber, glass fiber, polyamide fiber, polyester fiber, polyphenylene sulfone terephthalamide fiber, aromatic polyamide fiber, and poly(p-phenylene benzodioxazole) fiber.

18. The conductive cloth according to claim 11, characterized in that, The conductive paste (30) is made of at least one of conductive silver paste, conductive copper paste, conductive nickel paste, and conductive graphene paste.

19. A conductive foam, characterized in that, Includes the conductive cloth (101) as described in any one of claims 1-18.

20. The conductive foam according to claim 19, characterized in that, It also includes a foam core (103) and an adhesive (102), wherein the conductive cloth (101) is bonded to the surface of the foam core (103) by the adhesive (102).

21. The conductive foam according to claim 20, characterized in that, It also includes an insulating adhesive (104) disposed on the surface of the foam core (103) for bonding the foam core (103) to the component to be connected.

22. The conductive foam according to claim 21, characterized in that, On the surface of the foam core (103) having the insulating adhesive (104), the insulating adhesive (104) is located in the middle or near the edge.

23. The conductive foam according to claim 20, characterized in that, The surface of the foam core (103) has a clearance area (103a), and the conductive cloth (101) is not disposed in the clearance area (103a).

24. The conductive foam according to claim 20, characterized in that, The conductive cloth (101) consists of two pieces, which are disposed opposite to each other on the surface of the foam core (103). The pores of the foam core (103) are filled with conductive paste (30).

25. An electronic device, characterized in that, Includes the conductive foam (100) as described in any one of claims 19-24.

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