Printed circuit board system

Abstract

The present invention relates to a printed circuit board system (10), comprising: a first printed circuit board unit (12) and a second printed circuit board unit (14), wherein the first printed circuit board unit (12) has at least one recess (16), wherein at least one part of the second printed circuit board unit (14) is designed to form a press connection to the first printed circuit board unit (12) and is configured to form a signal-conducting or energy-conducting connection to the first printed circuit board unit (12).

Description

[0001] Description

[0002] title

[0003] Printed circuit board system

[0004] State of the art

[0005] The present invention relates to a printed circuit board system, a method for manufacturing a printed circuit board system and a vehicle.

[0006] Currently, a wide variety of solutions exist for contacting printed circuit board (PCB) units in the automotive sector. Due to the increasing number of PCBs and the rising demands for quality and performance, the need for innovative and robust PCB systems is constantly growing.

[0007] The continuous reduction of weight in the vehicle sector to reduce fuel consumption, as well as increasing competition, is creating cost pressure, resulting in a greater demand for cheaper and more efficient vehicle components.

[0008] Disclosure of the invention

[0009] The printed circuit board system according to the invention, with the features of claim 1, has the advantage that the first printed circuit board unit can be directly contacted with the second printed circuit board unit by means of a press fit. This enables direct contacting of the printed circuit boards and allows for the fixing of the printed circuit boards without additional connecting elements. In particular, this offers the advantage of reducing both component and assembly costs, especially since no additional connecting element is required, and also increases the surface area on the printed circuit board units, as the printed circuit board to be contacted does not require a footprint or contact surface. Thus, the installation space requirement of the printed circuit board system can be optimized, as more surface area is available on the respective printed circuit boards. Furthermore, various process steps can preferably be eliminated, such as...The selective soldering process is used to connect two printed circuit boards, as these are directly connected via the press fit. Furthermore, it is particularly advantageous that pre-fixing or similar processes can be omitted, thus simplifying the assembly of a printed circuit board system and allowing the contacting and fixing steps of the printed circuit boards to occur essentially simultaneously.

[0010] This is achieved according to the invention by the printed circuit board system comprising a first printed circuit board unit and a second printed circuit board unit, wherein the first printed circuit board unit has at least one recess, wherein at least a part of the second printed circuit board unit is configured to form a press connection with the first printed circuit board unit and is configured to form a signal and / or energy-transmitting connection with the first printed circuit board unit.

[0011] In other words, an interference fit between the first and second printed circuit board (PCB) units can serve both to fix the PCB units to each other and to establish contact between the two PCBs. For this purpose, the second PCB unit can, in particular, have a larger cross-sectional area than the recess in the first PCB unit, so that when the second PCB unit is inserted into the first PCB unit or its recess, an interference fit is created.

[0012] The dependent claims describe preferred embodiments of the invention.

[0013] Furthermore, the press connection is preferably designed to arrange the first printed circuit board unit essentially orthogonally to the second printed circuit board unit.

[0014] One advantage of this embodiment is that the force distribution of the press fit can be designed to be essentially uniform across the respective contact surfaces, thus increasing the service life of the printed circuit board system. "Essentially orthogonal" in this context means, in particular, a deviation of 10°±, especially manufacturing-related tolerances.

[0015] Preferably, the second printed circuit board unit has at least one pin element, wherein the pin element is configured to engage in the recess of the first printed circuit board unit to form the press connection.

[0016] An advantage of this embodiment is that the respective pin element can be adapted to the specific requirements of a press fit and / or the signal and / or energy-conducting connection, for example, by the diameter and length of the pin as well as the transmission capabilities of the pin element. Preferably, the second printed circuit board unit has a plurality of pins.

[0017] Preferably, the pin element has a circumferential surface, wherein a guide element is arranged at least partially on the circumferential surface.

[0018] One advantage of this embodiment is that, depending on the signal and / or energy-transmitting connection, the conductive element can be selected to transmit both signals and energy between the first printed circuit board unit and the second printed circuit board unit.

[0019] Preferably, the guiding element covers the circumferential surface essentially completely.

[0020] One advantage of this embodiment is that the load on the guide element can be reduced by increasing its area of ​​application.

[0021] Preferably, the conductive element can be a copper element or similar, such as a copper coating on the second printed circuit board unit. "Substantially complete" means, in particular, greater than 90%, especially considering manufacturing tolerances.

[0022] Preferably, the recess has a plug-in surface, wherein the plug-in surface at least partially comprises a contact element. An advantage of this embodiment is that the contact element can be adapted depending on the energy to be transmitted as well as signals.

[0023] Preferably, the contact element covers essentially the entire plugging surface.

[0024] One advantage of this embodiment is that the stress on the contact element can be reduced, or the manufacturing process at the mating surface can be improved. In this context, "essentially" refers to at least 90% of the mating surface, particularly manufacturing-related tolerances.

[0025] Preferably, the guide element and the contact element are configured to form the signal and / or energy-conducting connection when the press connection is present.

[0026] An advantage of this embodiment is that the materials of the contact element as well as the guide element can be selected in such a way that they can be used for a press connection and also have the required signal and energy conducting properties.

[0027] Another aspect of the invention relates to a method for manufacturing a printed circuit board system, as described above and below, wherein the method comprises the steps:

[0028] Providing a first printed circuit board unit and a second printed circuit board unit,

[0029] Aligning the second printed circuit board unit with a recess in the first printed circuit board unit,

[0030] Inserting the second printed circuit board unit into the recess with a predetermined force to form a press fit between the first printed circuit board unit and the second printed circuit board unit.

[0031] Preferably, the predetermined force can be selected such that any excess material of the second printed circuit board unit is at least partially compressed when the second printed circuit board unit is inserted into the recess, thus enabling the press fit or press connection to be formed. A further aspect of the invention relates to a vehicle which has a printed circuit board system as described above and below, and / or has a component which was manufactured using the method as described above and below.

[0032] Brief description of the drawings

[0033] Exemplary embodiments of the invention are described in detail below with reference to the accompanying drawings. The drawing shows:

[0034] Figures 1 to 3 show a printed circuit board system according to one embodiment.

[0035] Figure 4 is a flowchart illustrating steps of the procedure according to one embodiment.

[0036] Figure 5 shows a vehicle according to one embodiment.

[0037] Embodiments of the invention

[0038] Preferably, all identical elements, units and / or steps in all figures are labelled with the same reference symbols.

[0039] Figure 1 shows a printed circuit board system 10 according to one embodiment. The printed circuit board system 10 has a first printed circuit board unit 12 and a second printed circuit board unit 14, wherein the first printed circuit board unit 12 has at least one recess 16, and wherein at least a part of the second

[0040] The printed circuit board unit 14 is configured to form a press connection with the first printed circuit board unit 12 and is configured to form a signal and / or energy-conducting connection with the first printed circuit board unit 12.

[0041] As shown in Figure 1, the first printed circuit board unit 12 is oriented essentially orthogonally to the second printed circuit board unit 14. Preferably, the second printed circuit board unit 14 has a pin element 18.

[0042] Preferably, the second printed circuit board unit 14 can have a plurality of pin elements 18 which can engage in a plurality of recesses of the first printed circuit board unit 12. More preferably, the pin element 18 has a circumferential surface 20 on which a conductive element 22 is at least partially attached. More preferably, the recess 16 can have a plug-in surface 24 which has at least a partial contact element 26. Thus, in particular, the energy- and / or signal-conducting connection between the first printed circuit board unit 12 and the second printed circuit board unit 14 can be formed by means of the conductive element 22 and the contact element 26. More preferably, the contact element 26 can substantially completely cover the plug-in surface 24. In addition, the contact element 26 can be arranged on both sides as shown in Figure 1.The conductive element 22 can extend over the entire surface of the pin element 18, so that both contact elements 26 are contacted. More preferably, a recess 16 can have a contact surface 26 against which the pin element 18 or the conductive element 22 rests on one side. More preferably, the recess 16 can have a cross-sectional area 30 which is substantially smaller than a cross-sectional area 32 in the second printed circuit board unit 14 or of the pin element 18.

[0043] Figure 2 shows a printed circuit board system 10 according to one embodiment. The printed circuit board system 10 has a first printed circuit board unit with a plurality of recesses 14. In the recess 14, a plug-in surface 24 can be formed in particular, on which a contact element 26 can be arranged.

[0044] Figure 3 shows a printed circuit board system 10 according to one embodiment. The printed circuit board system 10 has a first printed circuit board unit 12 with at least one recess 16. Preferably, the first printed circuit board unit 12 can have a recess 16 with a length 34 and a cross-sectional area 30. More preferably, the cross-sectional area 30 can be variably adapted over a total area 36, ​​particularly depending on a pin element 18.

[0045] Figure 4 shows a flowchart illustrating the steps of the method 100 according to one embodiment. The method 100 for manufacturing a printed circuit board system 10 as described above and below preferably comprises the following steps:

[0046] - Provide S1 of a first printed circuit board unit 12 and a second printed circuit board unit 14, - Align S2 of the second printed circuit board unit 14 with a recess 16 in the first printed circuit board unit 12,

[0047] - Inserting S3 of the second printed circuit board unit 14 into the recess 16 with a predetermined force to form a press fit between the first printed circuit board unit 12 and the second printed circuit board unit 14.

[0048] Figure 5 shows a vehicle 200 which has a printed circuit board system 10 as described above and below and / or a component 202 which was manufactured using the method 100 as described above and below.

Claims

Claims 1. Printed circuit board system (10) comprising: a first printed circuit board unit (12), a second printed circuit board unit (14), wherein the first printed circuit board unit (12) has at least one recess (16), wherein at least a part of the second printed circuit board unit (14) is configured to form a press fit with the first printed circuit board unit (12) and is configured to form a signal or energy-conducting connection with the first printed circuit board unit (12).

2. Printed circuit board system (10) according to claim 1, wherein the press connection is configured to arrange the first printed circuit board unit (12) substantially orthogonally to the second printed circuit board unit (14).

3. Printed circuit board system (10) according to one of the preceding claims, wherein the second printed circuit board unit (14) has at least one pin element (18), wherein the pin element (18) is configured to engage in the recess (16) of the first printed circuit board unit (12) to form the press connection.

4. Printed circuit board system (10) according to claim 3, wherein the pin element (18) has a circumferential surface (20), wherein a guide element (22) is arranged at least partially on the circumferential surface (20).

5. Printed circuit board system (10) according to claim 4, wherein the conductive element (22) substantially covers the circumferential surface (20).

6. Printed circuit board system (10) according to one of the preceding claims, wherein the recess (16) has a plug-in surface (24), wherein the plug-in surface (24) has at least a partial contact element (26).

7. Printed circuit board system (10) according to claim 6, wherein the contact element (26) substantially completely covers the plug-in surface (24).

8. Printed circuit board system (10) according to one of claims 4 to 7, wherein the conductive element (22) and contact element (26) are configured to form the signal and / or energy-conducting connection when the press connection is present.

9. Method (100) for manufacturing a printed circuit board system (10) according to any one of the preceding claims, comprising the steps: Providing (S1) a first printed circuit board unit (12) and a second printed circuit board unit (14), Aligning (S2) the second printed circuit board unit (14) to a recess (16) in the first printed circuit board unit (12), inserting (S3) the second printed circuit board unit (14) into the recess (16) with a predetermined force to form a press fit between the first printed circuit board unit (12) and the second printed circuit board unit (14).

10. Vehicle (200) comprising a printed circuit board system (10) and / or a component (202) which was manufactured using the method (100) according to claim 9.

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