Multilayered printed circuit board assembly and electronic device comprising same

Abstract

A multilayered printed circuit board assembly according to one embodiment of the present disclosure may comprise: a first substrate; a second substrate arranged on the first substrate; a plurality of connection structures arranged between the first substrate and the second substrate so as to connect the first substrate and the second substrate; and a shielding structure which is connected to a ground part of the first substrate and a ground part of the second substrate, and which is arranged to form a closed area so as to block electromagnetic interference of an electronic element arranged in the closed area.

Description

Multilayer printed circuit board assembly and electronic device including the same

[0001] Various embodiments of the present disclosure relate to multilayer printed circuit board assemblies and electronic devices including the same.

[0002] Electronic devices such as smartphones and tablet computers are becoming essential means of rapidly changing information transmission. These devices facilitate user interaction through touchscreen-based graphical user interfaces (GUIs) and provide a variety of web-based multimedia.

[0003] Electronic devices incorporate various communication and electronic components to provide diverse functions. For example, a stereo speaker module is embedded in an electronic device, allowing users to enjoy music using stereo sound. A camera module is also embedded in an electronic device, providing a photo-taking function. Furthermore, a communication module is embedded in an electronic device, enabling communication with other electronic devices via a network.

[0004] Additionally, for higher performance electronic devices, more and more electronic components are mounted on a limited printed circuit board space.

[0005] The above information may be provided as background information to aid in understanding this document. None of the above is claimed to be prior art related to this document or can be used to determine prior art.

[0006] A multilayer printed circuit board assembly according to one embodiment of the present disclosure may include a first substrate, a second substrate disposed on the first substrate, a plurality of connecting structures disposed between the first substrate and the second substrate and configured to connect the first substrate and the second substrate, and a shielding structure connected to a ground portion of the first substrate and a ground portion of the second substrate and disposed to form a closed area to shield electromagnetic interference of electronic components disposed within the closed area.

[0007] An electronic device according to one embodiment may include a housing, a first substrate disposed within the housing, a second substrate disposed within the housing and on an upper side of the first substrate, a plurality of connecting structures disposed between the first substrate and the second substrate and configured to connect the first substrate and the second substrate, and a shielding structure connected to a ground portion of the first substrate and a ground portion of the second substrate and arranged to form a closed area to shield electromagnetic interference of an electronic element disposed within the closed area.

[0008] The effects that can be obtained from the exemplary embodiments of the present disclosure are not limited to the effects mentioned above, and other effects not mentioned can be clearly derived and understood by those skilled in the art to which the exemplary embodiments of the present disclosure pertain from the following description. In other words, unintended effects resulting from implementing the exemplary embodiments of the present disclosure can also be derived by those skilled in the art from the exemplary embodiments of the present disclosure.

[0009] FIG. 1 illustrates an electronic device within a network environment according to various embodiments.

[0010] FIG. 2A illustrates a front perspective view of an electronic device according to one embodiment.

[0011] Figure 2b illustrates a rear perspective view of the electronic device of Figure 2a.

[0012] FIG. 3 illustrates an exploded perspective view of an electronic device according to one embodiment.

[0013] FIG. 4 illustrates an exploded perspective view of a multilayer printed circuit board according to one embodiment.

[0014] FIG. 5 illustrates a cross-sectional view of a multilayer printed circuit board according to one embodiment.

[0015] FIG. 6 illustrates an exemplary drawing for illustrating an additional mounting area of ​​a multilayer printed circuit board according to one embodiment.

[0016] FIGS. 7A and 7B illustrate exemplary drawings for explaining a method of printing a shielding structure of a multilayer printed circuit board according to one embodiment.

[0017] FIGS. 8A and 8B illustrate drawings for explaining a portion of a manufacturing process of a multilayer printed circuit board according to one embodiment.

[0018] FIGS. 9A and 9B illustrate drawings for explaining a portion of a manufacturing process of a multilayer printed circuit board according to one embodiment.

[0019] FIGS. 10A and 10B illustrate drawings for explaining a portion of a manufacturing process of a multilayer printed circuit board according to one embodiment.

[0020] FIGS. 11A and 11B illustrate drawings for explaining a portion of a manufacturing process of a multilayer printed circuit board according to one embodiment.

[0021] FIG. 12 illustrates an exploded perspective view of a multilayer printed circuit board assembly according to one embodiment.

[0022] FIGS. 13 to 15 illustrate exemplary cross-sectional views of multilayer printed circuit board assemblies according to various embodiments.

[0023] FIG. 16 illustrates an exemplary nozzle used to form the shielding structure illustrated in FIGS. 13 to 15.

[0024] FIGS. 17A and 17B illustrate exemplary cross-sectional views of a printed circuit board according to one embodiment.

[0025] FIG. 18 is an exemplary drawing showing a state in which a filling material is filled inside a printed circuit board assembly according to one embodiment.

[0026] FIGS. 19A to 19D illustrate exemplary drawings for explaining a shielding structure applied to a multilayer printed circuit board assembly having three or more multilayer structures according to various embodiments.

[0027] The accompanying drawings are referenced in the following description, and specific examples of implementations are illustrated within the drawings. Furthermore, other examples may be utilized and structural changes may be made without departing from the scope of the various examples.

[0028] The various embodiments used to illustrate the principles of the present disclosure, as illustrated in FIGS. 1 through 19d below and in this patent document, are for illustrative purposes only and should not be construed as limiting the scope of the present disclosure in any way. Those skilled in the art will appreciate that the principles of the present disclosure can be implemented in any appropriately arranged system or device.

[0029] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0030] FIG. 1 illustrates an electronic device within a network environment according to various embodiments.

[0031] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0032] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0033] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0034] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0035] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0036] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0037] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0038] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0039] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0040] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0041] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0042] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0043] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0044] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0045] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0046] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0047] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0048] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0049] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0050] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0051] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0052] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0053] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0054] FIG. 2A illustrates a front perspective view of an electronic device according to one embodiment. FIG. 2B illustrates a rear perspective view of the electronic device of FIG. 2A.

[0055] Referring to FIGS. 2A and 2B, an electronic device (200) according to one embodiment may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In another embodiment (not shown), the housing may refer to a structure that forms a portion of the first side (210A), the second side (210B), and the side surface (210C) of FIG. 1. According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The rear plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side bezel structure (or “side member”) (218) that is coupled to the front plate (202) and the rear plate (211) and comprises a metal and / or polymer. In some embodiments, the rear plate (211) and the side bezel structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0056] In the illustrated embodiment, the front plate (202) may include two first regions (210D) extending seamlessly from the first surface (210A) toward the rear plate (211) at both ends of a long edge of the front plate (202). In the illustrated embodiment (see FIG. 2), the rear plate (211) may include two second regions (210E) extending seamlessly from the second surface (210B) toward the front plate (202) at both ends of a long edge. In some embodiments, the front plate (202) (or the rear plate (211)) may include only one of the first regions (210D) (or the second regions (210E)). In another embodiment, some of the first areas (210D) or the second areas (210E) may not be included. In the above embodiments, when viewed from the side of the electronic device (200), the side bezel structure (218) may have a first thickness (or width) on the side that does not include the first areas (210D) or the second areas (210E), and may have a second thickness that is thinner than the first thickness on the side that includes the first areas (210D) or the second areas (210E). In one embodiment, the first areas (210D) or the second areas (210E) may be formed as a plane so as not to be bent and to form substantially one plane with the first surface (210A) or the second surface (210B).

[0057] According to one embodiment, the electronic device (200) may include at least one of a display (201), an audio module (203, 207, 214), a sensor module (204, 216, 219), a camera module (205, 212, 213), a key input device (217), a light emitting element (206), and a connector hole (208, 209). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the key input device (217) or the light emitting element (206)) or may additionally include other components.

[0058] The display (201) may be exposed, for example, through a significant portion of the front plate (202). In some embodiments, at least a portion of the display (201) may be exposed through the front plate (202) forming the first surface (210A) and the first areas (210D) of the side surfaces (210C). In some embodiments, the edges of the display (201) may be formed to be substantially identical to the adjacent outer shape of the front plate (202). In other embodiments (not shown), the gap between the outer edge of the display (201) and the outer edge of the front plate (202) may be formed to be substantially identical to expand the area over which the display (201) is exposed.

[0059] In another embodiment (not shown), a recess or opening may be formed in a portion of the screen display area of ​​the display (201), and at least one of an audio module (214), a sensor module (204), a camera module (205), and a light-emitting element (206) may be included aligned with the recess or opening. In another embodiment (not shown), at least one of an audio module (214), a sensor module (204), a camera module (205), a fingerprint sensor (216), and a light-emitting element (206) may be included on the back surface of the screen display area of ​​the display (201). In another embodiment (not shown), the display (201) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor modules (204, 219) and / or at least a portion of the key input device (217) may be disposed in the first areas (210D) and / or the second areas (210E).

[0060] The audio module (203, 207, 214) may include a microphone hole (203) and a speaker hole (207, 214). The microphone hole (203) may have a microphone disposed inside to acquire external sounds, and in some embodiments, multiple microphones may be disposed to detect the direction of sounds. The speaker hole (207, 214) may include an external speaker hole (207) and a receiver hole (214) for calls. In some embodiments, the speaker hole (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (207, 214) (e.g., a piezo speaker).

[0061] The sensor modules (204, 216, 219) can generate electrical signals or data values ​​corresponding to the internal operating state of the electronic device (200) or the external environmental state. The sensor modules (204, 216, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., an HRM sensor) and / or a fourth sensor module (216) (e.g., a fingerprint sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) (e.g., the display (201)) of the housing (210) as well as the second surface (210B). The electronic device (200) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (204).

[0062] The camera modules (205, 212, 213) may include a first camera device (205) disposed on a first side (210A) of the electronic device (200), a second camera device (212) disposed on a second side (210B), and / or a flash (213). The camera devices (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (200).

[0063] The key input device (217) may be disposed on a side surface (210C) of the housing (210). In other embodiments, the electronic device (200) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201). In some embodiments, the key input device may include a sensor module (216) disposed on a second surface (210B) of the housing (210).

[0064] The light-emitting element (206) may be disposed, for example, on the first surface (210A) of the housing (210). The light-emitting element (206) may provide, for example, status information of the electronic device (200) in the form of light. In another embodiment, the light-emitting element (206) may provide a light source that is linked to the operation of, for example, the camera module (205). The light-emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0065] The connector holes (208, 209) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (209) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0066] FIG. 3 illustrates an exploded perspective view of an electronic device according to one embodiment.

[0067] Referring to FIG. 3, the electronic device (300) may include a side bezel structure (310), a first support member (311) (e.g., a bracket), a front plate (320), a display (330), a printed circuit board (340), a battery (350), a second support member (360) (e.g., a rear case), an antenna (370), and a rear plate (380). In some embodiments, the electronic device (300) may omit at least one of the components (e.g., the first support member (311) or the second support member (360)) or may additionally include other components. At least one of the components of the electronic device (300) may be the same as or similar to at least one of the components of the electronic device (100) of FIG. 1 or FIG. 2, and any redundant description thereof will be omitted below.

[0068] The first support member (311) may be disposed inside the electronic device (300) and connected to the side bezel structure (310), or may be formed integrally with the side bezel structure (310). The first support member (311) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. The first support member (311) may have a display (330) coupled to one surface and a printed circuit board (340) coupled to the other surface. A processor, a memory, and / or an interface may be mounted on the printed circuit board (340). The processor may include, for example, one or more of a central processing unit, an application processor, a graphic processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0069] The memory may include, for example, volatile memory or non-volatile memory.

[0070] The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (300) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0071] The battery (350) is a device for supplying power to at least one component of the electronic device (300), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially on the same plane as, for example, the printed circuit board (340). The battery (350) may be disposed integrally within the electronic device (300), or may be disposed detachably from the electronic device (300).

[0072] The antenna (370) may be positioned between the rear plate (380) and the battery (350). The antenna (370) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (370) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In another embodiment, the antenna structure may be formed by a portion or a combination of the side bezel structure (310) and / or the first support member (311).

[0073] FIG. 4 illustrates an exploded perspective view of a multilayer printed circuit board according to one embodiment. FIG. 5 illustrates a cross-sectional view of a multilayer printed circuit board according to one embodiment. FIG. 6 illustrates an exemplary drawing for explaining an additional mounting area of ​​a multilayer printed circuit board according to one embodiment.

[0074] Electronic components may be mounted on the substrates illustrated in FIGS. 4 to 6, but are omitted for convenience of explanation. The multilayer printed circuit board assembly (400) illustrated in FIGS. 4 to 6 may be included in various types of electronic devices. For example, the multilayer printed circuit board assembly (400) may be included in the electronic device (200) illustrated in FIGS. 2A to 3, but is not limited thereto.

[0075] The multilayer printed circuit board assembly (400) illustrated in FIGS. 4 to 6 may be substantially identical to the printed circuit board of FIG. 3 (e.g., the printed circuit board (340) of FIG. 3).

[0076] The shape of the multilayer printed circuit board assembly (400) illustrated in FIGS. 4 to 6 is an exemplary structure, and the scope of the present disclosure is not limited by the illustrated structure.

[0077] Referring to FIGS. 4 to 6, a multilayer printed circuit board assembly (400) may include a first substrate (410), a second substrate (420), a connection structure (430), a shielding structure (440), and electronic components (not shown). The first substrate (410) and the second substrate (420) may be arranged to overlap each other vertically. The first substrate (410) and the second substrate (420) may be arranged to be spaced apart from each other vertically. The multilayer printed circuit board assembly (400) may be arranged in a housing (e.g., the housing (210) of FIG. 2A) of an electronic device (e.g., the electronic device (200) of FIG. 2A). For convenience of explanation, a structure in which two substrates are stacked is described below as an example, but the scope of the present disclosure may also be applied to a structure in which three or more substrates are stacked.

[0078] According to one embodiment, a processor, memory, and / or interface may be mounted on the first substrate (410) and the second substrate (420). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication unit.

[0079] The memory may include, for example, volatile memory or non-volatile memory.

[0080] The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (300) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0081] According to one embodiment, the first substrate (410) and the second substrate (420) may be various types of substrates well known in the art (e.g., ceramic substrates, printed circuit boards, flexible substrates). Although not shown, electrically connected wiring patterns may be formed on the surfaces of the first substrate (410) and the second substrate (420).

[0082] According to one embodiment, each of the first substrate (410) and the second substrate (420) may be classified into a single-layer PCB having wiring formed on only one side and a double-layer PCB having circuit wiring formed on both sides. In the case of the double-layer PCB substrate, the circuit wiring on the upper and lower sides may be electrically connected through a conductive current-carrying structure penetrating the body.

[0083] In one embodiment, the first substrate (410) may include an upper surface (410a) and a lower surface (410b). In one embodiment, the second substrate (420) may include an upper surface (420a) and a lower surface (420b). The upper surface (410a) of the first substrate (410) and the lower surface (420b) of the second substrate (420) may be arranged to face each other. For example, an electronic component may be mounted on the upper surface (410a) or the lower surface (410b) of the first substrate (410). For example, an electronic component may be mounted on the upper surface (420a) or the lower surface (420b) of the second substrate (420).

[0084] In one embodiment, some of the plurality of electronic components may be positioned within a closed region formed by the shielding structure (440).

[0085] According to one embodiment, the connecting structure (430) may include any structure capable of being assembled and separated. For example, the connecting structure (430) may include a connector. For example, the connecting structure (430) may include various types of connectors, such as a header and socket connector, a board-to-board connector, a mezzanine connector, or a flexible connector. Multiple connecting structures (430) may be arranged.

[0086] According to one embodiment, the connecting structure (430) may include a first connecting portion (431) and a second connecting portion (432). The first connecting portion (431) may be disposed or mounted on a first substrate (410). For example, the first connecting portion (431) may be disposed or mounted on an upper surface (410a) of the first substrate (410). The second connecting portion (432) may be disposed or mounted on a second substrate (420). For example, the second connecting portion (432) may be disposed or mounted on a lower surface (420b) of the second substrate (420). The first connecting portion (431) and the second connecting portion (432) may be coupled so as to be detachably coupled to each other. The first connecting portion (431) and the second connecting portion (432) may be disposed in positions where they overlap each other vertically.

[0087] In one embodiment, the shielding structure (440) may include a conductive material (or electrically conductive filler). For example, the shielding structure (440) may include a metal such as Ag, Cu, Ag coated Cu, Ni, Al, or Sn. For example, the shielding structure (440) may include conductive carbon such as carbon black, carbon nanotubes (CNTs), or graphite. For example, the shielding structure (440) may include at least one conductive polymer material selected from the group consisting of polypyrrole and polyaniline.

[0088] According to one embodiment, the shielding structure (440) may include a binder resin. For example, the shielding structure (440) may include a silicone resin, an epoxy resin, a urethane resin, or an alkyd resin.

[0089] In one embodiment, the shielding structure (440) may further include additives and solvents for other performance enhancements. For example, the shielding structure (440) may include at least one of a thickener, an antioxidant, or a polymeric surfactant as an additive. For example, the shielding structure (440) may include at least one of water or alcohol as an additive.

[0090] According to one embodiment, the shielding structure (440) may have thixotropy, which is a property in which fluidity increases when subjected to a shear force and the shape is maintained when the shear force is removed.

[0091] For example, the width of the shielding structure (440) may be 200 to 700 micrometers. For example, the height of the shielding structure (440) may be 100 to 1300 micrometers. However, this is not limited thereto, and the shielding structure (440) may be applied in various widths and heights depending on the area and mounting integration of the substrate.

[0092] In one embodiment, the shielding structure (440) may be positioned to contact the ground portion of the first substrate (410) and the ground portion of the second substrate (420). The shielding structure (440) may be electrically conductively coupled to the ground portion by contacting the ground portion. In one embodiment, a closed area (441) may be defined by the shielding structure (440). For example, the closed area (441) may be defined by the ground portion of the first substrate (410) or the ground portion of the second substrate (420). For example, the shielding structure (440) may be printed or applied along the ground portion of the first substrate (410) or the ground portion of the second substrate (420) defining the closed area. Here, the closed area (441) may be referred to as a shielding area. Here, the ground portion may be referred to as a ground pad.

[0093] According to one embodiment, the shielding structure (440) can shield electromagnetic interference (unwanted waves or noise) generated from electronic components mounted within the closed area (441).

[0094] In one embodiment, the shielding structure (440) may be referred to as a shielding wall or shielding dam forming a closed area (441).

[0095] According to one embodiment, if a shielding structure (440) such as the present disclosure is used, it can be flexibly applied to a modified closed area (441) even when the closed area (441) (or shielding area) is redesignated due to a change in the design of the product.

[0096] According to one embodiment, if a shielding structure (440) such as the present disclosure is used, a product repair process such as debugging can be performed more easily. If some defects occur during the manufacturing process, a process of separating the first substrate (410) and the second substrate (420) and then reassembling them may be necessary. The multilayer printed circuit board assembly (400) of the present disclosure can be easily separated because the first substrate (410) and the second substrate (420) are connected by a connecting structure (430), and after separation, the shielding structure (440) can be printed again and then connected, thereby making debugging easier. In the case of a multilayer printed circuit board assembly using a conventional interposer, heat must be applied to melt the solder balls in order to separate them, and in the process, there was a problem that the solder balls connected to the surrounding electronic components also melted. In the case of the present disclosure, the first substrate (410) and the second substrate (420) can be easily separated and repaired without such a problem.

[0097] According to one embodiment, the shielding structure (440) of the present disclosure can reduce the defect rate during the manufacturing process because it does not require soldering. When a shield can or an interposer is placed to form a shielding structure, an additional soldering process is required to bond the shield can or interposer to the substrate. The addition of the soldering process can cause manufacturing defects due to soldering defects. The shielding structure (440) of the present disclosure can reduce the defect rate during the manufacturing process because it does not require a separate soldering process.

[0098] Referring to FIG. 6, when using a connecting structure (430) compared to using an interposer that forms a closed area, an additional mounting area (A) can be secured as illustrated. As electronic devices become smaller and the mounting density of electronic components mounted on a board increases, securing an additional mounting area (A) in a limited space is becoming more important. The additional mounting area (A) may be the area that the interposer would occupy if it were used instead of the connecting structure (430). The multilayer printed circuit board assembly (400) of the present disclosure can secure an additional mounting area by shielding electromagnetic interference of electronic components in a small area through the shielding structure (440) and using a connecting structure instead of an interposer.

[0099] FIGS. 7A and 7B are exemplary drawings illustrating a method of printing a shielding structure of a multilayer printed circuit board according to one embodiment.

[0100] According to one embodiment, the shielding structure illustrated in FIGS. 4 and 5 (e.g., the shielding structure (440) of FIG. 4) may be printed by the first nozzle (700) illustrated in FIGS. 7A and 7B. The first nozzle (700) may be referred to as a side slot nozzle.

[0101] According to one embodiment, the first nozzle (700) may include a side slot (710) formed to discharge the shielding structure (440). The shielding structure (440) may be discharged through the side slot (710) of the first nozzle (700).

[0102] In one embodiment, the shielding structure (440) may have thixotropic properties. By applying a shear force to the first nozzle (700), the fluidity of the shielding structure (440) increases, allowing it to be discharged through the side slot (710). After the shielding structure (440) is discharged, the shear force is removed, allowing it to maintain its discharged shape.

[0103] According to one embodiment, the first nozzle (700) may be configured to rotate while moving horizontally. When printing a shielding structure (440) using the first nozzle (700), the shielding structure (440) can be printed in a single printing step without multiple laminations, thereby reducing the manufacturing time. However, this is not limited thereto, and the shielding structure (440) may also be processed by multiple laminations.

[0104] When a shielding structure (440) is printed on a substrate using a first nozzle (700), a narrow shielding structure (440) can form a closed area. In addition, since the shielding structure (440) occupies a small area on the substrate, it can be advantageous for increasing the mounting density of electronic components.

[0105] FIGS. 8A and 8B illustrate drawings for explaining a portion of a manufacturing process of a multilayer printed circuit board according to one embodiment. FIGS. 9A and 9B illustrate drawings for explaining a portion of a manufacturing process of a multilayer printed circuit board according to one embodiment. FIGS. 10A and 10B illustrate drawings for explaining a portion of a manufacturing process of a multilayer printed circuit board according to one embodiment. FIGS. 11A and 11B illustrate drawings for explaining a portion of a manufacturing process of a multilayer printed circuit board according to one embodiment.

[0106] The structure of the multilayer printed circuit board assembly (400) illustrated in FIGS. 8A to 11B may be incorporated into the electronic devices of FIGS. 2A to 3 (e.g., the electronic device (200) of FIG. 2A). The embodiments illustrated in FIGS. 8A to 11B may be optionally combined with the embodiments of FIGS. 4 to 7, respectively. The embodiments illustrated in FIGS. 8A to 11B may be optionally combined with the embodiments of FIGS. 12 to 19D.

[0107] The embodiments of FIGS. 8a and 8b can optionally be combined with at least one of the embodiments of FIGS. 4 and 5 or the embodiments of FIGS. 9a to 11b.

[0108] The embodiments of FIGS. 9a and 9b can optionally be combined with at least one of the embodiments of FIGS. 4 and 5, the embodiments of FIGS. 8a and 8b, or the embodiments of FIGS. 10a to 11b.

[0109] The embodiments of FIGS. 10a and 10b can optionally be combined with at least one of the embodiments of FIGS. 4 and 5, the embodiments of FIGS. 8a to 9b, or the embodiments of FIGS. 11a and 11b.

[0110] The embodiments of FIGS. 11a and 11b can optionally be combined with at least one of the embodiments of FIGS. 4 and 5 or the embodiments of FIGS. 8a to 10b.

[0111] Referring to FIGS. 8A to 11B , the arrangement location or coupling method of the shielding structure (440) included in the multilayer printed circuit board assembly (400) may vary according to various embodiments. The shapes illustrated in FIGS. 8A to 11B are exemplary, and the illustrated shapes do not limit the scope of the present disclosure.

[0112] Figures 8a, 9a, 10a, and 11a illustrate a state before the first substrate (410) and the second substrate (420) are assembled. Figures 8b, 9b, 10b, and 11b illustrate a state after the first substrate (410) and the second substrate (420) are assembled.

[0113] Referring to the embodiments of FIGS. 8A and 8B and 9A and 9B, the shielding structure (440) can be positioned or mounted on the inside of the connecting structure (430). The connecting structure (430) can be positioned on the outside of the shielding structure (440). The connecting structure (430) can be positioned on the outside of the shielding area (441) to be formed by the shielding structure (440). The shielding structure (440) can be positioned further from the side surface (410c) of the first substrate (410) or the side surface (420c) of the second substrate (420) than the connecting structure (430).

[0114] The shielding structure (440) can be printed on the second substrate (420) and then bonded to the first substrate (410), as shown in FIGS. 8a and 8b.

[0115] The shielding structure (440) can be printed on the first substrate (410) and then bonded to the second substrate (420), as shown in FIGS. 9a and 9b.

[0116] Referring to the embodiments of FIGS. 10A and 10B and 11A and 11B, the shielding structure (440) can be positioned or mounted on the outside of the connecting structure (430). The connecting structure (430) can be positioned on the inside of the shielding structure (440). The connecting structure (430) can be positioned on the inside of the shielding area (441) to be formed by the shielding structure (440). The shielding structure (440) can be positioned closer to the side surface (410c) of the first substrate (410) or the side surface (420c) of the second substrate (420) than the connecting structure (430).

[0117] The shielding structure (440) can be printed on a second substrate (420) and then bonded to the first substrate (410), as shown in FIGS. 10a and 10b.

[0118] The shielding structure (440) can be printed on the first substrate (410) and then bonded to the second substrate (420), as shown in FIGS. 11a and 11b.

[0119] The shielding structure (440) may be printed separately, as shown, and then combined with the first substrate (410) and the second substrate (420) during the assembly process.

[0120] FIG. 12 illustrates an exploded perspective view of a multilayer printed circuit board assembly according to one embodiment.

[0121] The multilayer printed circuit board assembly (1200) of FIG. 12 may be included in the electronic device of FIGS. 2A to 3 (e.g., the electronic device (200) of FIG. 2A). The multilayer printed circuit board assembly (1200) of FIG. 12 may be substantially identical to the printed circuit board of FIG. 3 (e.g., the printed circuit board (340) of FIG. 3).

[0122] The embodiment of FIG. 12 can be optionally combined with the embodiments of FIGS. 4 to 11b. The embodiment of FIG. 12 can be optionally combined with the embodiments of FIGS. 13 to 19d.

[0123] The same reference numbers are used for configurations that are substantially identical or similar to the configuration described above.

[0124] Referring to FIG. 12, a multilayer printed circuit board assembly (1200) may include a first substrate (410), a second substrate (420), a plurality of connecting structures (430), and a shielding structure (1240).

[0125] In one embodiment, a shielding structure (1240) may be positioned between a plurality of connecting structures (430). The shielding structure (1240) may be positioned or printed to connect two adjacent connecting structures (430) among the plurality of connecting structures (430). The shielding structure (1240) may be positioned between each of the plurality of connecting structures (430), and multiple shielding structures (1240) may be provided.

[0126] According to one embodiment, the shielding structure (1240) may be placed in contact with the connecting structure (430) or spaced apart from the connecting structure (430) by a predetermined distance, depending on the type of the connecting structure (430). Here, the predetermined distance may be a distance small enough that electromagnetic interference generated by electronic components mounted in the shielding area (1241) is not emitted to the outside.

[0127] According to one embodiment, the shielding area (1241) may refer to a space partitioned by the connecting structure (430) and the shielding structure (1240).

[0128] As illustrated in Fig. 12, by placing a shielding structure (1240) in the space between the connecting structures (430), the mounting efficiency of the electronic device can be increased.

[0129] FIGS. 13 to 15 illustrate exemplary cross-sectional views of multilayer printed circuit board assemblies according to various embodiments.

[0130] The embodiments of FIGS. 13 to 15 can be optionally combined with the embodiments of FIGS. 4 to 12. The embodiments of FIGS. 13 to 15 can be optionally combined with the embodiments of FIGS. 17a to 19d.

[0131] The embodiments illustrated in FIGS. 13 to 15 are exemplary drawings to explain that shielding structures can be configured in various structures.

[0132] Referring to FIGS. 13 to 15, the shielding structure (1300, 1400, or 1500) may be positioned to contact at least one of the side surface (410c) of the first substrate (410) or the side surface (420c) of the second substrate (420). A grounding portion (or grounding pad) may be formed or correspond to the portion where the shielding structure (1300, 1400, or 1500) contacts (or the grounding portion may contact the first substrate (410) and / or the second substrate (420). When the shielding structure is formed as illustrated in FIGS. 13 to 15, it may be more advantageous in securing a mounting area of ​​an electronic device.

[0133] As illustrated in FIG. 13, when the sizes of the first substrate (410) and the second substrate (420) are different, the shielding structure (1300) may be positioned or printed so as to be in contact with at least one of the side surface (410c) of the first substrate (410) or the side surface (420c) of the second substrate (420), as illustrated. The shielding structure (1300) of FIG. 13 may be positioned so as to be in contact with the upper surface (410a) of the first substrate (410) and the side surface (420c) of the second substrate (420). The shielding structure (1300) of FIG. 13 may be positioned so as to surround the edge portion of the second substrate (420).

[0134] Referring to FIG. 14, the shielding structure (1400) may be positioned to surround the edge portions of the first substrate (410) and the second substrate (420). The shielding structure (1400) of FIG. 14 may be positioned to contact a portion of the side surface (410c) and the lower surface (410b) of the first substrate (410). The shielding structure (1400) of FIG. 14 may be positioned to contact a portion of the side surface (420c) and the upper surface (420a) of the second substrate (420).

[0135] Referring to FIG. 15, the shielding structure (1500) can be positioned to contact the side surface (410c) of the first substrate (410) and the side surface (420c) of the second substrate (420).

[0136] The shapes illustrated in FIGS. 13 to 15 are exemplary, and the present disclosure is not limited to the shapes illustrated.

[0137] FIG. 16 illustrates an exemplary nozzle used to form the shielding structure illustrated in FIGS. 13 to 15.

[0138] According to one embodiment, the shielding structure (1300, 1400, or 1500) illustrated in FIGS. 13 to 15 may be printed by a second nozzle (1600) illustrated in FIG. 16. The second nozzle (1600) may be referred to as a half-slot nozzle.

[0139] In one embodiment, the second nozzle (1600) may include a half slot (1610) formed to discharge the shielding structure (1300, 1400, or 1500). The shielding structure (1300, 1400, or 1500) may be discharged through the half slot (1610) of the second nozzle (1600).

[0140] In one embodiment, the shielding structure (1300, 1400, or 1500) may have thixotropic properties. By applying a shear force to the second nozzle (1600), the fluidity of the shielding structure (1300, 1400, or 1500) increases, allowing it to be discharged through the half slot (1610). After the shielding structure (1300, 1400, or 1500) is discharged, the shear force is removed, allowing it to maintain its discharged shape.

[0141] FIGS. 17A and 17B illustrate exemplary cross-sectional views of a printed circuit board according to one embodiment.

[0142] The embodiments of FIGS. 17a and 17b can be optionally combined with the embodiments of FIGS. 4 to 16. The embodiments of FIGS. 17a and 17b can be optionally combined with the embodiments of FIGS. 18 to 19d.

[0143] The multilayer printed circuit board assembly (1700) of FIGS. 17A and 17B may be included in the electronic device of FIGS. 2A to 3 (e.g., the electronic device (200) of FIG. 2A). The multilayer printed circuit board assembly (1700) of FIGS. 17A and 17B may be substantially identical to the printed circuit board of FIG. 3 (e.g., the printed circuit board (340) of FIG. 3).

[0144] The same reference numbers are used for configurations that are substantially identical or similar to the configuration described above.

[0145] Referring to FIGS. 17A and 17B, a multilayer printed circuit board assembly (1700) may include a first substrate (410), a second substrate (420), a connection structure (430), a first shielding structure (1710), and a second shielding structure (1720). FIG. 17A illustrates a state before the first substrate (410) and the second substrate (420) are assembled. FIG. 17B illustrates a state after the first substrate (410) and the second substrate (420) are assembled.

[0146] The first shielding structure (1710) may be a shield can. The first shielding structure (1710) may be composed of, for example, a metal or an alloy. The first shielding structure (1710) may be positioned to be in contact with a grounding portion (or grounding pad) of the first substrate (410).

[0147] The second shielding structure (1720) may be composed of substantially the same material as the shielding structure (440) of FIG. 4. The second shielding structure (1720) may be positioned to be in contact with the grounding portion (or grounding pad) of the second substrate (420).

[0148] In one embodiment, the first shielding structure (1710) and the second shielding structure (1720) may be arranged to overlap each other. For example, the first shielding structure (1710) may be arranged to contact the first substrate (410), and the second shielding structure (1720) may be arranged to contact the second substrate (420).

[0149] As illustrated in FIG. 17b, when the first substrate (410) and the second substrate (420) are assembled, the first shielding structure (1710) and the second shielding structure (1720) are combined to form a shielding area (1721). The shielding area (1721) can be filled with a filling material (e.g., the filling material (1850) of FIG. 18) to be described later.

[0150] Even when a shield can is used in a multilayer printed circuit board assembly (1700), a second shielding structure (1720) may be used to fill the space between the shield can and the board.

[0151] Fig. 18 is an exemplary drawing showing a state in which a filling material is filled inside a printed circuit board assembly according to one embodiment.

[0152] The embodiment of Fig. 18 can be optionally combined with the embodiments of Figs. 4 to 17b. The embodiment of Fig. 18 can be optionally combined with the embodiments of Figs. 19a to 19d.

[0153] The multilayer printed circuit board assembly (1800) of FIG. 18 may be included in the electronic device of FIGS. 2A to 3 (e.g., the electronic device (200) of FIG. 2A). The multilayer printed circuit board assembly (1800) of FIG. 18 may be substantially identical to the printed circuit board of FIG. 3 (e.g., the printed circuit board (340) of FIG. 3).

[0154] For convenience of explanation, various types of electronic components (1860) are illustrated as examples in Fig. 18.

[0155] Referring to FIG. 18, a multilayer printed circuit board assembly (1800) may include a first substrate (1810), a second substrate (1820), a connecting structure (1830), a shielding structure (1840), a filler material (1850), and a plurality of electronic components (1860). The connecting structure (1830) may include a first bonding portion (1831) and a second bonding portion (1832).

[0156] The first substrate (1810) may correspond to the first substrate of FIG. 4 (e.g., the first substrate (410) of FIG. 4). The second substrate (1820) may correspond to the second substrate of FIG. 4 (e.g., the second substrate (420) of FIG. 4). The connection structure (1830) may correspond to the connection structure of FIG. 4 (e.g., the connection structure (430) of FIG. 4). The shielding structure (1840) may correspond to the shielding structure of FIG. 4 (e.g., the shielding structure (1840) of FIG. 4).

[0157] According to one embodiment, a filling material (1850) may be filled in a shielding area (1841) formed by a shielding structure (1840). The filling material (1850) may be, for example, an insulating material or a heat-dissipating material. For example, a filling material (1850) made of a TIM (Thermal Interface Material) may be filled in the shielding area (1841) to easily dissipate heat emitted from a plurality of electronic components (1860) to the outside.

[0158] A multilayer printed circuit board assembly (1800) according to one embodiment can fill a space between stacked substrates with a filler material (1850) by forming a shielding area (1841) of a separate shielding structure (1840), even when using a connecting structure (1830) such as a connector that does not form a closed curve.

[0159] FIGS. 19A to 19D illustrate exemplary drawings for explaining a shielding structure applied to a multilayer printed circuit board assembly having three or more multilayer structures according to various embodiments.

[0160] The multilayer printed circuit board assembly (1910, 1920, 1930, or 1940) illustrated in FIGS. 19A through 19D may be incorporated into the electronic device of FIGS. 2A through 3 (e.g., the electronic device (200) of FIG. 2A). The embodiments of FIGS. 19A through 19D may optionally be combined with the embodiments of FIGS. 4 through 18.

[0161] FIGS. 19A to 19D are exemplary embodiments for explaining various structures of shielding structures arranged in a multilayer printed circuit board assembly (1910, 1920, 1930, or 1940), and for convenience of explanation, other components than the substrates and shielding structures are omitted.

[0162] The shielding structures (1914, 1924, 1934, 1945) illustrated in FIGS. 19a to 19d may be composed of substantially the same material as the shielding structure (440) of FIG. 4.

[0163] Referring to FIG. 19A, a multilayer printed circuit board assembly (1910) may include a first substrate (1911), a second substrate (1912), a third substrate (1913), and a shielding structure (1914). The shielding structure (1914) may include a first shielding member (1914a) and a second shielding member (1914b). The first shielding member (1914a) may connect the first substrate (1911) and the second substrate (1912). The first shielding member (1914a) may be positioned to shield unwanted waves generated from electronic components positioned between the first substrate (1911) and the second substrate (1912). The second shielding member (1914b) may connect the second substrate (1912) and the third substrate (1913). The second shielding member (1914b) can be arranged to shield unwanted waves generated from electronic components arranged between the second substrate (1912) and the third substrate (1913).

[0164] Referring to FIG. 19B, a multilayer printed circuit board assembly (1920) may include a first substrate (1921), a second substrate (1922), a third substrate (1923), and a shielding structure (1924). The second substrate (1922) may be smaller than the first substrate (1921) and the third substrate (1923). The shielding structure (1924) may include a first shielding member (1924a) and a second shielding member (1924b). The first shielding member (1924a) may connect the first substrate (1921) and the second substrate (1922). The second shielding member (1924b) may connect the first substrate (1921) and the third substrate (1923).

[0165] Referring to FIG. 19c, a multilayer printed circuit board assembly (1930) may include a first substrate (1931), a second substrate (1932), a third substrate (1933), and a shielding structure (1934). The shielding structure (1934) may include a first shielding member (1934a), a second shielding member (1934b), and a third shielding member (1934c). The first shielding member (1934a) may connect the first substrate (1931) and the second substrate (1932). The second shielding member (1934b) may connect the second substrate (1932) and the third substrate (1933). The third shielding member (1934c) may be positioned to connect the first substrate (1931) and the third substrate (1933).

[0166] Referring to FIG. 19D, a multilayer printed circuit board assembly (1940) may include a first substrate (1941), a second substrate (1942), a third substrate (1943), a fourth substrate (1944), and a shielding structure (1945). The shielding structure (1945) may include a first shielding member (1945a), a second shielding member (1945b), and a third shielding member (1945c). The first shielding member (1945a) may connect between the first substrate (1941) and the second substrate (1942). The second shielding member (1945b) may connect between the first substrate (1941) and the third substrate (1943). The third shielding member (1945c) may connect between the third substrate (1943) and the fourth substrate (1944).

[0167] Even when a multilayer printed circuit board assembly (1910, 1920, 1930, 1940) having a relatively complex structure as shown in FIGS. 19a to 19d is formed, a shielding area can be formed more easily compared to a shield can or interposer.

[0168] A multilayer printed circuit board assembly according to one embodiment of the present disclosure may include a first substrate (410, 1810), a second substrate (420, 1820) disposed on the first substrate (410, 1810), a plurality of connecting structures (430, 1830) disposed between the first substrate (410, 1810) and the second substrate (420, 1820) and configured to connect the first substrate (410, 1810) and the second substrate (420, 1820), and a shielding structure (440, 1300, 1400, 1500, 1840) disposed to form a closed area and shield electromagnetic interference of electronic components disposed within the closed area. there is.

[0169] According to one embodiment, the plurality of connecting structures (430, 1830) may be positioned outside of a closed area formed by the shielding structure (440, 1300, 1400, 1500, 1840).

[0170] According to one embodiment, the plurality of connecting structures (430, 1830) may be positioned inside a closed area formed by the shielding structure (440, 1300, 1400, 1500, 1840).

[0171] According to one embodiment, the shielding structure (440, 1300, 1400, 1500, 1840) may be configured to connect a first connection structure of the plurality of connection structures (430, 1830) and a second connection structure of the plurality of connection structures (430, 1830). The plurality of connection structures (430, 1830) may be configured to form the closed area.

[0172] According to one embodiment, the shielding structure (440, 1300, 1400, 1500, 1840) and the plurality of connecting structures (430, 1830) may be spaced apart from each other by a predetermined interval.

[0173] According to one embodiment, the shielding structure (440, 1300, 1400, 1500, 1840) may be configured to be in contact with the upper surface of the first substrate (410, 1810) and the lower surface of the second substrate (420, 1820).

[0174] According to one embodiment, the shielding structure (440, 1300, 1400, 1500, 1840) may be configured to be in contact with the upper surface of the first substrate (410, 1810) and the side surface of the second substrate (420, 1820).

[0175] According to one embodiment, the shielding structure (440, 1300, 1400, 1500, 1840) may be configured to be in contact with a side surface of the first substrate (410, 1810) and a side surface of the second substrate (420, 1820).

[0176] According to one embodiment, the multilayer printed circuit board assembly may further include a filler material (1850) filled within an area formed by the shielding structure (440, 1300, 1400, 1500, 1840), the first substrate (410, 1810), and the second substrate (420, 1820).

[0177] According to one embodiment, the filling material (1850) may include an insulating material or a heat dissipating material.

[0178] According to one embodiment, the shielding structure (440, 1300, 1400, 1500, 1840) may include an electrically conductive filler and a binder resin.

[0179] According to one embodiment, the shielding structure (440, 1300, 1400, 1500, 1840) may be formed by printing on one of the first substrate (410, 1810) or the second substrate (420, 1820) and then thermally curing to contact the other of the first substrate (410, 1810) or the second substrate (420, 1820).

[0180] An electronic device according to one embodiment comprises: a housing, a first substrate (410, 1810) disposed within the housing, a second substrate (420, 1820) disposed within the housing and on an upper side of the first substrate (410, 1810), a plurality of connecting structures (430, 1830) disposed between the first substrate (410, 1810) and the second substrate (420, 1820) and configured to connect the first substrate (410, 1810) and the second substrate (420, 1820), and a shielding structure (440, 1300, 1400, 1500) disposed to form a closed area and shield electromagnetic interference of electronic elements disposed within the closed area. 1840) may be included.

[0181] According to one embodiment, the plurality of connecting structures (430, 1830) may be positioned outside the closed area formed by the shielding structure (440, 1300, 1400, 1500, 1840).

[0182] According to one embodiment, the plurality of connecting structures (430, 1830) may be positioned inside the closed area formed by the shielding structure (440, 1300, 1400, 1500, 1840).

[0183] According to one embodiment, the shielding structure (440, 1300, 1400, 1500, 1840) may be configured to connect a first connection structure of the plurality of connection structures (430, 1830) and a second connection structure of the plurality of connection structures (430, 1830). The plurality of connection structures (430, 1830) may be configured to form the closed area.

[0184] According to one embodiment, the shielding structure (440, 1300, 1400, 1500, 1840) and the plurality of connecting structures (430, 1830) may be spaced apart from each other by a predetermined interval.

[0185] According to one embodiment, the shielding structure (440, 1300, 1400, 1500, 1840) may include an electrically conductive filler and a binder resin.

[0186] According to one embodiment, the electronic device may further include a filling material (1850) filled within an area formed by the shielding structure (440, 1300, 1400, 1500, 1840), the first substrate (410, 1810), and the second substrate (420, 1820).

[0187] According to one embodiment, the filling material (1850) may include an insulating material or a heat dissipating material.

[0188] The terminology used herein is merely used to describe specific embodiments and is not intended to limit the present disclosure. For example, a singular element should be understood to include plural elements unless the context clearly indicates only a singular element. As used herein, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can each include any one of the items listed together in that phrase, or all possible combinations thereof. It should be understood that the term "and / or" as used herein encompasses any and all possible combinations of one or more of the listed items. The terms "include," "have," "comprise," and the like used in this disclosure are intended to specify only the presence of a feature, component, part, or combination thereof described in this disclosure, and the use of these terms does not exclude the possibility of the presence or addition of one or more other features, components, parts, or combinations thereof. The expressions "first," "second," and the like used in this disclosure can modify various components regardless of order and / or importance, and are only used to distinguish one component from another, without limiting the components.

[0189] The expression "configured to" used in the present disclosure can be appropriately used interchangeably with, for example, "suitable for," "capable of," "designed to," "modified to," "made to," or "capable of." The term "configured to" may not necessarily mean only something "specially designed" in terms of hardware. Instead, in some situations, the expression "a device configured to" may mean that the device is "capable of" doing something together with other devices or components. For example, the phrase "a device configured (or set) to perform A, B, and C" may mean a dedicated device for performing the corresponding operations, or a general-purpose device that can perform various operations including the corresponding operations.

[0190] Meanwhile, the terms “upper side,” “lower side,” and “front-rear direction” used in the present disclosure are defined based on the drawings, and the shape and position of each component are not limited by these terms.

[0191] Although the foregoing description in this disclosure has focused on specific embodiments, it should be understood that this disclosure is not limited to such specific embodiments, but rather encompasses various modifications, equivalents, and / or alternatives of the various embodiments.

Claims

First substrate (410, 1810); A second substrate (420, 1820) placed on the first substrate (410, 1810); A plurality of connecting structures (430, 1830) arranged between the first substrate (410, 1810) and the second substrate (420, 1820) and configured to connect the first substrate (410, 1810) and the second substrate (420, 1820); and It includes a shielding structure (440, 1300, 1400, 1500, 1840) connected to the grounding portion of the first substrate (410, 1810) and the grounding portion of the second substrate (420, 1820), A multilayer printed circuit board assembly in which the above shielding structure (440, 1300, 1400, 1500, 1840) is arranged to form a closed area and shield electromagnetic interference of electronic components arranged within the closed area. In the first paragraph, A multilayer printed circuit board assembly, wherein the plurality of connecting structures (430, 1830) are positioned outside the closed area formed by the shielding structure (440, 1300, 1400, 1500, 1840). In the first paragraph, A multilayer printed circuit board assembly, wherein the plurality of connecting structures (430, 1830) are positioned inside a closed area formed by the shielding structure (440, 1300, 1400, 1500, 1840). In the first paragraph, The above shielding structure (440, 1300, 1400, 1500, 1840) is It is configured to connect the first connecting structure of the plurality of connecting structures (430, 1830) and the second connecting structure of the plurality of connecting structures (430, 1830), A multilayer printed circuit board assembly, wherein the plurality of connecting structures (430, 1830) are configured to form the closed area. In paragraph 4, A multilayer printed circuit board assembly, wherein the above shielding structure (440, 1300, 1400, 1500, 1840) and the plurality of connecting structures (430, 1830) are spaced apart from each other by a predetermined interval. In one of the first to fifth clauses, The above shielding structure (440, 1300, 1400, 1500, 1840) is A multilayer printed circuit board assembly configured to be in contact with the upper surface of the first substrate (410, 1810) and the lower surface of the second substrate (420, 1820). In one of the first to fifth clauses, The above shielding structure (440, 1300, 1400, 1500, 1840) is A multilayer printed circuit board assembly configured to be in contact with the upper surface of the first substrate (410, 1810) and the side surface of the second substrate (420, 1820). In one of the first to fifth clauses, The above shielding structure (440, 1300, 1400, 1500, 1840) is A multilayer printed circuit board assembly configured to be in contact with the side surface of the first substrate (410, 1810) and the side surface of the second substrate (420, 1820). In one of the first to eighth clauses, Further comprising a filling material (1850) filled within the area formed by the shielding structure (440, 1300, 1400, 1500, 1840), the first substrate (410, 1810) and the second substrate (420, 1820), The above filling material (1850) is A multilayer printed circuit board assembly comprising an insulating material or a heat dissipating material. In electronic devices, housing; A first substrate (410, 1810) placed within the housing; A second substrate (420, 1820) disposed on the upper side of the first substrate (410, 1810) while being disposed within the housing; A plurality of connecting structures (430, 1830) arranged between the first substrate (410, 1810) and the second substrate (420, 1820) and configured to connect the first substrate (410, 1810) and the second substrate (420, 1820); and It includes a shielding structure (440, 1300, 1400, 1500, 1840) connected to the first ground portion of the first substrate (410, 1810) and the second ground portion of the second substrate (420, 1820), An electronic device in which the above shielding structure (440, 1300, 1400, 1500, 1840) is arranged to form a closed area and shield electromagnetic interference of electronic components arranged within the closed area. In Article 10, An electronic device in which the plurality of connecting structures (430, 1830) are positioned outside a closed area formed by the shielding structure (440, 1300, 1400, 1500, 1840). In Article 10, An electronic device in which the plurality of connecting structures (430, 1830) are positioned inside a closed area formed by the shielding structure (440, 1300, 1400, 1500, 1840). In Article 10, The above shielding structure (440, 1300, 1400, 1500, 1840) is It is configured to connect the first connecting structure of the plurality of connecting structures (430, 1830) and the second connecting structure of the plurality of connecting structures (430, 1830), An electronic device wherein the plurality of connecting structures (430, 1830) are configured to form the closed area. In Article 13, An electronic device wherein the above shielding structure (440, 1300, 1400, 1500, 1840) and the plurality of connecting structures (430, 1830) are spaced apart from each other by a predetermined interval. In one of the 10th to 14th clauses, Further comprising a filling material (1850) filled within the area formed by the shielding structure (440, 1300, 1400, 1500, 1840), the first substrate (410, 1810) and the second substrate (420, 1820), The above filling material (1850) is An electronic device comprising an insulating material or a heat-dissipating material.

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