Electronic device comprising printed circuit board

Abstract

An electronic device according to one embodiment is disclosed. The electronic device, according to one embodiment, may comprise: a housing comprising a front frame having a sound hole formed in the outer surface of the electronic device, and a sound channel communicating with the sound hole; a printed circuit board disposed inside the housing, comprising a first substrate surface facing the front frame and a second substrate surface which is opposite to the first substrate surface, and comprising an opening formed in a position overlapping the sound channel; a microphone disposed on the second substrate surface so as to overlap the opening; and a sealing member disposed between the front frame and the printed circuit board, and comprising a hollow penetratingly formed so as to connect the opening and the sound channel.

Description

Electronic devices including printed circuit boards

[0001] The disclosure below relates to an electronic device including a printed circuit board.

[0002] Electronic devices have been miniaturized and lightweight to enhance portability. Electronic devices are equipped with various components to implement various functions, and a printed circuit board (PCB) may be placed to electrically connect the installed components. The aforementioned background technology was acquired or acquired during the process of developing the present disclosure and cannot necessarily be considered publicly available technology prior to the filing of the present disclosure.

[0003] According to one embodiment, an electronic device may include a housing including a front frame in which an acoustic hole is formed on an outer surface of the electronic device and an acoustic conduit communicating with the acoustic hole is formed, a printed circuit board disposed inside the housing and including a first substrate surface facing the front frame and a second substrate surface opposite the first substrate surface, the printed circuit board including an opening formed at a position overlapping the acoustic conduit, a microphone disposed on the second substrate surface to overlap the opening, and a sealing member disposed between the front frame and the printed circuit board and including a hollow formed through the opening to connect the acoustic conduit and the opening. The printed circuit board may include a base member and a plating layer laminated on a surface of the base member. One or more first cutting areas, in which the plating layer is omitted and positioned to overlap with the hollow, and a non-cutting area, in which the plating layer is not omitted, may be formed on a first substrate surface of the printed circuit board, respectively.

[0004] According to one embodiment, a printed circuit board may include a base member and a plating layer laminated on at least a portion of a surface of the base member. An opening may be formed in the printed circuit board, the opening penetrating along a thickness direction of the printed circuit board, the opening including a first substrate surface and a second substrate surface opposite to the first substrate surface. A sealing member may be disposed on the first substrate surface of the printed circuit board, the sealing member surrounding the opening and having a hollow formed therein that communicates with the opening along the thickness direction. The printed circuit board may include at least one first cutting region formed on the first substrate surface, the plating layer being omitted in an overlapping portion within the hollow, and a non-cutting region formed on the first substrate surface, the plating layer not being omitted. An electronic component may be disposed on the second substrate surface of the printed circuit board so as to overlap with the opening.

[0005] An electronic device according to one embodiment may include a housing including a front frame in which an acoustic hole formed on an outer surface of the electronic device and an acoustic conduit communicating with the acoustic hole are formed, a printed circuit board disposed inside the housing and including a first substrate surface facing the front frame and a second substrate surface opposite the first substrate surface, the printed circuit board including an opening formed at a position overlapping the acoustic conduit, a microphone disposed on the second substrate surface so as to overlap the opening, and a sealing member disposed between the front frame and the printed circuit board and including a hollow formed through which the opening and the acoustic conduit are connected. The printed circuit board may include a base member, and a plating layer laminated on a surface of the base member. The printed circuit board may include, when facing the first substrate surface, a first non-cutting region located inside the hollow and surrounding the opening, a second non-cutting region located outside the hollow and surrounding the first non-cutting region, and a first cutting region located inside the hollow and formed between the first non-cutting region and the second non-cutting region, and the plating layer may be omitted in the first cutting region.

[0006] The effects of the electronic device according to the disclosure are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description below.

[0007] The above and other aspects, features and advantages according to specific embodiments of the present disclosure will become more apparent from the detailed description below with reference to the accompanying drawings.

[0008] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0009] FIG. 2A is a front perspective view of an electronic device according to one embodiment.

[0010] FIG. 2b is a rear perspective view of an electronic device according to one embodiment.

[0011] FIG. 2c is an exploded perspective view of an electronic device according to one embodiment.

[0012] FIG. 3A is a partially exploded perspective view of an electronic device for illustrating a printed circuit board according to one embodiment.

[0013] FIG. 3b is a partial cross-sectional view taken along line Ib-Ib of FIG. 3a to illustrate a front frame, a sealing member, a printed circuit board, and a microphone in an assembled state of an electronic device according to one embodiment.

[0014] FIG. 4a is an enlarged view of area A of FIG. 3b for illustrating a printed circuit board having a first cutting area formed thereon according to one embodiment.

[0015] FIG. 4b is a plan view of area B1 of FIG. 4a for illustrating a printed circuit board having a first cutting area formed thereon according to one embodiment.

[0016] FIG. 5A is a cross-sectional view illustrating a printed circuit board having a first cutting area and a second cutting area formed according to one embodiment.

[0017] FIG. 5b is a plan view of area B2 of FIG. 5a for illustrating a printed circuit board in which a first cutting area and a second cutting area are formed according to one embodiment.

[0018] FIG. 5c is a plan view illustrating a printed circuit board having a second cutting area having a rectangular shape according to one embodiment.

[0019] FIG. 6A is a cross-sectional view illustrating a printed circuit board having a first cutting area formed according to one embodiment.

[0020] FIG. 6b is a plan view of area B3 of FIG. 6a for illustrating a printed circuit board having a circular shape in a first cutting area according to one embodiment.

[0021] FIG. 7A is a cross-sectional view of a printed circuit board showing a first cutting area with only the second layer portion omitted according to one embodiment.

[0022] FIG. 7b is a cross-sectional view of a printed circuit board showing a second cutting area with only the second layer portion omitted according to one embodiment.

[0023] Hereinafter, embodiments will be described in detail with reference to the attached drawings. In the description with reference to the attached drawings, identical components are assigned the same reference numerals regardless of the drawing numbers, and redundant descriptions thereof will be omitted.

[0024] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0025] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0026] The processor (120) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0027] The auxiliary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0028] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0029] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0030] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0031] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0032] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0033] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0034] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0035] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0036] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0037] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0038] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0039] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0040] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0041] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0042] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 eB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0043] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0044] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0045] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0046] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service by itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0047] The embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0048] The term "module" used in the embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0049] Embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0050] According to one embodiment, the method according to the embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0051] According to embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0052]

[0053] FIG. 2a is a front perspective view of an electronic device according to one embodiment. FIG. 2b is a rear perspective view of an electronic device according to one embodiment. FIG. 2c is an exploded perspective view of an electronic device according to one embodiment.

[0054] Referring to FIGS. 2A, 2B, and 2C, an electronic device (201) (e.g., the electronic device (101) of FIG. 1) may include a housing (210) that forms an exterior and accommodates components therein. The housing (210) may form a front surface (210a) (e.g., a surface facing the +Z direction), a back surface (210c) (e.g., a surface facing the -Z direction), and a side surface (211c) that surrounds an interior space between the front surface (210a) and the back surface (210b). In one embodiment, the housing (210) may form a side surface (211c) through a first side surface (211c-1) (e.g., a side facing the - Y direction), a second side surface (211c-2) (e.g., a side facing the + Y direction), a third side surface (211c-3) (e.g., a side facing the + X direction), and a fourth side surface (211c-4) (e.g., a side facing the - X direction) connecting the front surface (210a) and the back surface (210b). It should be noted that the shape of the housing illustrated in the drawings is exemplary.

[0055] In one embodiment, the front side (210a) may be formed by a front plate (211a) that is at least partially substantially transparent. For example, the front plate (211a) may comprise a glass plate or a polymer plate including at least one coating layer. In one embodiment, the back side (210b) may be formed by a substantially opaque back plate (211b). For example, the back plate (211b) may be formed by a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel, magnesium, etc.), or a combination thereof. In one embodiment, the side side (211c) may be formed by a front frame (220) that is joined to the front plate (211a) and the back plate (211b) and includes a metal and / or a polymer. In one embodiment, the back plate (211b) and the front frame (220) may be formed seamlessly as one piece. In one embodiment, the rear plate (211b) and the front frame (220) may be formed of substantially the same material (e.g., aluminum).

[0056] In one embodiment, the front plate (211a) may include a plurality of first edge regions (212a-1) facing one direction (e.g., + / - X direction) and extending from at least a portion of the front surface (210a) to the back plate (211b) and having a rounded surface, a plurality of second edge regions (212a-2) facing another direction (e.g., + / - Y direction) and extending from at least a portion of the front surface (210a) to the back plate (211b) and having a rounded surface, and a plurality of third edge regions (212a-3) extending from at least a portion of the front surface (210a) to the back plate (211b) and having a rounded surface and positioned between the plurality of first edge regions (212a-1) and the plurality of second edge regions (212a-2).

[0057] In one embodiment, the back plate (211b) may include a plurality of fourth edge regions (212b-1) facing one direction (e.g., + / - X direction) and extending from at least a portion of the back plate (210b) to the front plate (211a) and having a rounded surface, a plurality of fifth edge regions (212b-2) facing another direction (e.g., + / - Y direction) and extending from at least a portion of the back plate (210b) to the front plate (211a) and having a rounded surface, and a plurality of sixth edge regions (212b-3) extending from at least a portion of the back plate (210b) to the front plate (211a) and having a rounded surface and positioned between the plurality of fourth edge regions (212b-1) and the plurality of fifth edge regions (212b-2).

[0058] In one embodiment, the front frame (220) may surround at least a portion of the internal space between the front (210a) and the rear (210b). In one embodiment, a display (261) may be positioned on one side (e.g., in the +Z direction) of the front frame (220), and a rear plate (211b) may be positioned on the other side (e.g., in the -Z direction) of the front frame (220). In one embodiment, the front frame (220) may include a conductive portion. For example, at least a portion of the front frame (220) may be formed of a conductive material. In one embodiment, the front frame (220) may include a side portion (221) positioned on at least a portion of the side portion (211c), and a support portion (222) connected to the side portion (221) and positioned inside the electronic device (201).

[0059] In one embodiment, the side portion (221) may connect the edges of the front plate (211a) and the rear plate (211b) and may form a side portion (211c) of the housing (210) by surrounding the front plate (211a) and the rear plate (211b). In one embodiment, the support portion (222) may be disposed inside the electronic device (201). In one embodiment, the side portion (221) and the support portion (222) may be formed integrally or may be formed separately and coupled to each other. When the side portion (221) and the support portion (222) are formed separately, the front frame (220) may be formed to include only the side portion (221). In one embodiment, the side portion (221) (e.g., the front frame (220)) may include a plurality of conductive portions disposed along the side portion (211c) of the electronic device (201). For example, the conductive portion may be formed of a metal and / or a conductive polymer material. In one embodiment, the support portion (222) may be formed of a metal and / or a conductive polymer material with the side portion (221). In one embodiment, when the support portion (222) is directly connected to the conductive portion of the side portion (221), the support portion (222) may form an electrical path from the conductive portion of the side portion (221) to ground.

[0060] In one embodiment, the electronic device (201) may include a display (261) (e.g., the display module (160) of FIG. 1). In one embodiment, the display (261) may be located on the front surface (210a) of the electronic device (201). In one embodiment, the display (261) may be exposed through at least a portion of the front plate (211a) (e.g., the first edge regions (212a-1), the second edge regions (212a-2), and the third edge regions (212a-3). In one embodiment, the display (261) may have a shape substantially the same as the outer contour shape of the front plate (211a). Although not shown in the drawing, the display (261) according to one embodiment may include a touch screen panel (TSP), a pressure sensor, and / or a digitizer (not shown) for detecting a stylus pen.

[0061] In one embodiment, the display (261) may include a screen display area (261a) that is visually exposed to the outside of the electronic device (201) and displays content through pixels or a plurality of cells. In one embodiment, the screen display area (261a) may include a sensing area (261a-1) and a camera area (261a-2). The sensing area (261a-1) may overlap at least a portion of the screen display area (261a). The sensing area (261a-1) may allow transmission of an input signal related to a sensor module (e.g., the sensor module (176) of FIG. 1). The sensing area (261a-1) may display content together with a screen display area (261a) that does not overlap with the sensing area (261a-1).

[0062] In one embodiment, the camera area (261a-2) may overlap at least a portion of the screen display area (261a). The camera area (261a-2) may expose a lens of a first camera module (280a) (e.g., the camera module (180) of FIG. 1) positioned to face the front of the electronic device (201). For example, the camera area (261a-2) may allow transmission of an optical signal (e.g., light) associated with the camera module (280a). In one embodiment, the camera area (261a-2) may display content similarly to the screen display area (261a) that does not overlap the camera area (261a-2). For example, the camera area (261a-2) may display content while the first camera module (280a) is not operating.

[0063] In one embodiment, the electronic device (201) may include a sensor module (276). The sensor module (276) may sense a signal applied to the electronic device (201). The sensor module (276) may be located, for example, on the front surface (210a) of the electronic device (201). The sensor module (276) may be arranged in the electronic device (201) to correspond to a sensing area (261a-1) of a screen display area (261a). For example, the sensor module (276) may be arranged to perform its function without being visually exposed through the display (261) in an internal space of the electronic device (201). The sensor module (276) may receive an input signal penetrating the sensing area (261a-1) and generate an electrical signal based on the received input signal. For example, the input signal may have a specified physical quantity (e.g., heat, light, temperature, sound, pressure, ultrasound). As another example, the input signal may include signals relating to the user's biometric information (e.g., the user's fingerprint, voice, etc.).

[0064] In one embodiment, the electronic device (201) may include a camera module (280a, 380b) (e.g., the camera module (180) of FIG. 1). In one embodiment, the camera module (280a, 380b) may include a first camera module (280a) and a second camera module (280b). In one embodiment, the electronic device (201) may include a flash (280c) disposed near the first camera module (280a) and the second camera module (280b).

[0065] In one embodiment, the first camera module (280a) is disposed on the front side (210a) of the housing (210) such that its lens is exposed, and can receive an optical signal from the front side (e.g., +Z direction) of the electronic device (201). The second camera module (280b) is disposed on the rear side (210b) of the housing (210) such that its lens is exposed, and can receive an optical signal from the rear side (e.g., -Z direction) of the electronic device (201). In one embodiment, at least a portion of the first camera module (280a) may be disposed on the housing (210) such that it is covered by the display (261). For example, the first camera module (280a) may include an under-display camera (UDC). In one embodiment, the first camera module (280a) may receive an optical signal that passes through the camera area (261a-2). In one embodiment, the second camera module (280b) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). In one embodiment, the flash (280c) may include a light-emitting diode or a xenon lamp.

[0066] In one embodiment, the electronic device (201) may include an external sound hole (215, 255) formed in the housing (210). The external sound hole (215, 225) may output sound from the inside of the electronic device (201) to the outside. The electronic device (201) may include an sound hole (213) for transmitting sound from the outside of the electronic device (201) to the inside of the electronic device (201).

[0067] In one embodiment, the electronic device (201) may include a microphone (240) (e.g., the audio module (170) of FIG. 1). The microphone (240) may obtain sound from the outside of the electronic device (201). For example, the microphone (240) may be located in the internal space of the housing (210). In one embodiment, the microphone (240) may obtain sound from the outside of the electronic device (201) through at least one sound hole (213) formed in the housing (210) and an sound conduit (220a) communicating with the sound hole (213). The sound hole (213) and the sound conduit (220a) may be formed in the front frame (220).

[0068] In one embodiment, the microphone (240) can generate an electrical signal according to sound transmitted from the outside. In one embodiment, the microphone (240) is directly or indirectly electrically connected to the printed circuit board (232) and can generate an electrical signal according to sound received through the microphone (240). The printed circuit board (232) may be formed with an opening (233) that is open to penetrate at least a portion of the surface to move sound between the microphone (240) and the sound conduit (220a). In one embodiment, the microphone (240) may be placed on the printed circuit board (232) such that the microphone (240) is positioned in the opening (233) of the printed circuit board (232). In one embodiment, sound waves entering the sound conduit (220a) from outside the electronic device (201) through the sound hole (213) can pass through the opening (233) of the printed circuit board (232) and be input to the microphone (240).

[0069] In one embodiment, the electronic device (201) may include an input module (250) (e.g., the input module (150) of FIG. 1). The input module (250) may receive an operation signal from a user. For example, the input module (250) may include at least one key input device that is positioned so as to be exposed on a side surface (211c) of the housing (210).

[0070] In one embodiment, the electronic device (201) may include a connection terminal (278) (e.g., connection terminal (178) of FIG. 1). In one embodiment, the connection terminal (278) may be disposed on an outer surface of the housing (210). The electronic device (201) may be wired to an external device (e.g., another electronic device or an external power source) through the connection terminal (278).

[0071] In one embodiment, the electronic device (201) may include one or more printed circuit boards. For example, the electronic device (201) may include a first circuit board (231) (or a main circuit board) and a second circuit board (232) (or a sub-circuit board). The first circuit board (231) and the second circuit board (232) may be disposed inside the electronic device (201), for example, in a support portion (222). At least one circuit board (231, 232) may be connected to the support portion (222) via a ground. In one embodiment, the first circuit board (231) may be accommodated in a first substrate slot (222a) formed by the support portion (222). In one embodiment, the second circuit board (232) may be accommodated in the second board slot (222b) formed by the support portion (222). In one embodiment, the circuit boards (231, 232) may be a rigid printed circuit board (PCB) or a flexible printed circuit board (FPCB) that is at least partially bendable. In one embodiment, the circuit board may be formed in a multi-layer structure. Hereinafter, for convenience of explanation, the direction in which each layer of the circuit board is stacked is referred to as the first direction.

[0072] In one embodiment, an electrical circuit for transmitting an electrical signal may be formed on the printed circuit board (231, 232). In one embodiment, one or more electrical components for achieving a function of the electronic device (201) may be arranged (e.g., mounted) on the surface of the printed circuit board (231, 232). For example, the electrical components may be components for performing a function within the electronic device (201), such as an application processor (AP), a graphics processing unit (GPU), or a power management IC (PMIC). In one embodiment, an opening (233) that is partially open to penetrate the surface may be formed on the second printed circuit board (232). In one embodiment, a microphone (240) for performing an acoustic function may be arranged on the printed circuit board (231, 232).

[0073] In one embodiment, a processor (e.g., a processor (120) of FIG. 1) may be disposed on the printed circuit board (231, 232). The processor may include, for example, one or more of a central processing unit (CPU), an application processor (AP), an image signal processor, a sensor hub processor, or a communication processor. In one embodiment, a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) may be disposed on the printed circuit board (231, 232). The wireless communication circuit may communicate with, for example, an external device (e.g., an electronic device (104) of FIG. 1). The electronic device (201) may include an antenna structure (e.g., an antenna module (197) of FIG. 1), and the wireless communication circuit may be electrically connected to the antenna structure. In one embodiment, the wireless communication circuit may generate a signal to be transmitted through the antenna structure or detect a signal received through the antenna structure. In one embodiment, the printed circuit board (231, 232) includes a ground, and the ground of the printed circuit board (231, 232) can function as a ground of an antenna structure implemented using a wireless communication circuit.

[0074] In one embodiment, the electronic device (201) may include a battery (289) disposed internally. The battery may be disposed in a battery slot (225) formed in the support portion (222).

[0075] Electronic devices according to embodiments disclosed herein may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments disclosed herein are not limited to the aforementioned devices.

[0076]

[0077] FIG. 3a is a partially exploded perspective view of an electronic device for illustrating a printed circuit board according to one embodiment. FIG. 3b is a partial cross-sectional view taken along line Ib-Ib of FIG. 3a for illustrating a front frame, a sealing member, a printed circuit board, and a microphone in an assembled state of the electronic device according to one embodiment.

[0078] Referring to FIGS. 3A and 3B, an electronic device (301) according to one embodiment (e.g., electronic device (201) of FIG. 2A) may include a housing (310) (e.g., housing (210) of FIG. 2A), a printed circuit board (330) (e.g., printed circuit board (232) of FIG. 2C), a microphone (340) (e.g., microphone (240) of FIG. 2C), and a sealing member (350).

[0079] In one embodiment, the housing (310) forms the exterior of the electronic device (301) and can accommodate components in the interior space (311). The housing (310) can include a front frame (320) (e.g., front frame (220) of FIG. 2c) that forms at least a portion of a side surface (310c) (e.g., side surface (211c) of FIG. 2b).

[0080] In one embodiment, the front frame (320) may include an acoustic hole (313) exposed on the outer surface of the housing (310) (e.g., an acoustic hole (213) of FIG. 2a), and an acoustic conduit (321) formed penetrating from the acoustic hole (313) to the inner space (311) of the housing (310) (e.g., an acoustic conduit (220a) of FIG. 2c). The acoustic hole (313) may be formed on the outer surface of the front frame (320) exposed on the side surface (310c). The acoustic conduit (321) may penetrate the interior of the front frame (320) and function as a path through which sound may travel from the acoustic hole (313) to the inner space (311) of the housing (310). In one embodiment, the acoustic conduit (321) may include an open portion (321a) formed at an end so as to be open in the inner space (311) of the housing (310). The open portion (321a) can be opened in a direction (e.g., -Z direction) toward the microphone (340) described later.

[0081] In one embodiment, a printed circuit board (330) may be disposed in an interior space (311) of a housing (310). The printed circuit board (330) may include a first substrate surface (331) facing the front frame (320) and a second substrate surface (332) opposite to the first substrate surface (331). In one embodiment, the printed circuit board (330) may be fixed to the front frame (320). For example, at least a portion of the first substrate surface (331) of the printed circuit board (330) may be directly or indirectly connected to a surface (e.g., a surface facing the -Z direction) of the front frame (320).

[0082] In one embodiment, the printed circuit board (330) may include an opening (330a) formed to penetrate the surface (e.g., opening (233) of FIG. 2C). The printed circuit board (330) may be connected to the front frame (320) such that, when facing the surface (e.g., first substrate surface (331)), the opening (330a) overlaps the open portion (321a) of the acoustic conduit (321).

[0083] In one embodiment, the microphone (340) may be disposed on the second substrate surface (332) of the printed circuit board (330). For example, the microphone (340) may be mounted on the surface of the printed circuit board (330) and electrically connected to a wiring line formed on the printed circuit board (330). In one embodiment, the microphone (340) may be disposed on the second substrate surface (332) so as to cover the opening (330a). For example, when looking at the first substrate surface (331), the entire opening (330a) may overlap the microphone (340). Meanwhile, although the drawing illustrates an example in which the microphone (340) is disposed on the second substrate surface (332) of the printed circuit board (330), it should be noted that other electronic components may be disposed on the second substrate surface (332) of the printed circuit board (330).

[0084] In one embodiment, the sealing member (350) may be disposed between the printed circuit board (330) and the front frame (320). In one embodiment, the sealing member (350) may include a hollow (350a) formed to penetrate and connect the sound pipe (321) formed in the front frame (320) and the opening (330a) formed in the printed circuit board (330). For example, when looking at the first substrate surface (331), the hollow (350a) formed in the sealing member (350) may overlap the open portion (321a) and the opening (330a). In one embodiment, the hollow (350a) of the sealing member (350) may be formed to have a size that overlaps the entire area of ​​the opening (330a) formed in the printed circuit board (330). For example, the hollow portion (350a) of the sealing member (350) may have a larger cross-sectional area compared to the opening portion (330a) of the printed circuit board (330). The hollow portion (350a) of the sealing member (350) may be formed to have a size that overlaps the entire area of ​​the open portion (321a) facing the thickness direction (e.g., -Z direction) of the sealing member (350). The sealing member (350) surrounds the periphery of the open portion (321a) of the acoustic pipe (321) and the opening portion (330a) of the printed circuit board (330), and may seal the space between the front frame (320) and the printed circuit board (330).

[0085] In one embodiment, the sealing member (350) may include a compressible material. For example, the sealing member (350) may include a rubber material. In one embodiment, the sealing member (350) may seal a gap between the front frame (320) and the printed circuit board (330) by being compressed in the thickness direction (e.g., Z-axis direction) of the sealing member (350) during the process of fixing the printed circuit board (330) to the front frame (320). In one embodiment, the sealing member (350) is formed to have a compression thickness that substantially corresponds to the gap between the printed circuit board (330) and the front frame (320) close to the opening (330a) based on the state in which the printed circuit board (330) is fixed to the front frame (320), thereby ensuring ease of assembly of the front frame (320) and the printed circuit board (330).

[0086] The sealing member (350) can seal between the printed circuit board (330) and the front frame (320), and at the same time, form a sound transmission path from the sound conduit (321) to the opening (330a) through the hollow portion (350a). For example, a sound transmission path can be formed through which sound can be transmitted from the outside of the electronic device (301) to the microphone (340) through the sound hole (313), the sound conduit (321), the hollow portion (350a) of the sealing member (350), and the opening portion (330a) of the printed circuit board (330). Through the sealing function of the sealing member (350), the occurrence of sound leak can be reduced or prevented during the process of transmitting sound from the sound conduit (321) to the opening portion (330a).

[0087] In one embodiment, the printed circuit board (330) may be formed so that the first substrate surface (331) has different surface steps at a portion overlapping the hollow portion (350a) of the sealing member (350), as illustrated in FIG. 3B. For example, the printed circuit board (330) may include a first portion (3311) surrounding the periphery of the opening (330a), and a second portion (3312) surrounding the periphery of the first portion (3311). The first portion (3311) may be formed so as to have a relatively higher surface step than the second portion (3312) in the direction of the first substrate surface (331) (e.g., +Z direction). For example, as described below, the second portion (3312) may be formed as a first cutting area in which the plating layer is omitted from at least a portion of the surface of the printed circuit board (330), thereby having a lower surface step than the first portion (3311) formed as a non-cutting area in which the plating layer is maintained.

[0088]

[0089] FIG. 4A is an enlarged view of area A of FIG. 3B for illustrating a printed circuit board having a first cutting area formed according to one embodiment. FIG. 4B is a plan view of area B1 of FIG. 4A for illustrating a printed circuit board having a first cutting area formed according to one embodiment.

[0090] Referring to FIGS. 4A and 4B, a printed circuit board (430) according to one embodiment (e.g., printed circuit board (330) of FIG. 3A) may include a base member (431) and a plating layer (432) laminated on a surface of the base member (431). The plating layer (432) may form at least a portion of a wiring line on the surface of the base member (431).

[0091] In one embodiment, the plating layer (432) may include a first layer portion (4321) laminated on the surface of the base member (431), and a second layer portion (4322) laminated on the surface of the first layer portion (4321). The first layer portion (4321) and the second layer portion (4322) may be formed of different materials. For example, the first layer portion (4321) may include a copper material. The second layer portion (4322) may include a solder resist (SR) material.

[0092] In one embodiment, on the first substrate surface (430-1) of the printed circuit board (430), one or more first cutting areas (432a) positioned to overlap within a hollow (450a) (e.g., hollow (350a) of FIG. 3b) of a sealing member (450) (e.g., sealing member (350) of FIG. 3a) and in which the plating layer (432) is omitted, and non-cutting areas (432-1, 432-2) in which the plating layer (432) is not omitted, may be formed, respectively.

[0093] In one embodiment, when looking at the first substrate surface (430-1), the non-cutting regions (432-1, 432-2) may include a first non-cutting region (432-1) positioned overlappingly inside the hollow (450a) and surrounding the outer perimeter of the opening (430a) (e.g., the opening (330a) of FIG. 3A), and a second non-cutting region (432-2) positioned overlappingly outside the hollow (450a). In one embodiment, the first non-cutting region (432-1) and the second non-cutting region (432-2) may be spaced apart from each other.

[0094] In one embodiment, the first cutting area (432a) may be formed in a closed loop shape surrounding the outer perimeter of the first non-cutting area (432-1) when looking at the first substrate surface (430-1), as illustrated in FIG. 4B. In one embodiment, the first cutting area (432a) may be formed by cutting at least a portion of the plating layer (432) on the surface of the printed circuit board (430) overlapping within the hollow (450a) when looking at the first substrate surface (430-1).

[0095] In one embodiment, a bonding member (451) and an adhesive member (452) may be disposed between the sealing member (450) and the printed circuit board (430). The bonding member (451) may include a metal material and may be bonded to the surface of the plating layer (432). For example, the bonding member (451) may include a copper material. The adhesive member (452) is disposed between the sealing member (450) and the bonding member (451) and may connect the sealing member (450) and the bonding member (451). In one embodiment, the adhesive member (452) is disposed between the sealing member (450) and the bonding member (451), thereby easily connecting the bonding member (451) made of a metal material and the sealing member (450) made of a rubber material. Through the bonding member (451) and the adhesive member (452), the sealing member (450) can seal the space between the acoustic conduit (421) (e.g., the acoustic conduit (321) of FIG. 3a) and the opening (430a), and connect the printed circuit board (430) and the front frame (420) (e.g., the front frame (320) of FIG. 3a). In one embodiment, the plating layer (432) may omit the second layer portion (4322) at the portion where the sealing member (450) is disposed. In one embodiment, the first layer portion (4321) and the bonding member (451) may be soldered. For example, a bonding layer (453) formed of solder may be formed between the plating layer (432) and the bonding member (451).

[0096] In one embodiment, a liquid chemical flux (F) may be added during a process in which the first layer portion and the bonding member (451) are soldered to form a bonding layer (453) (i.e., a soldering process for mounting the sealing member (450) on the printed circuit board (430). In one embodiment, the flux (F) may be emitted to the plating layer (432) by the soldering process, and the emitted and flowing flux (F) may be induced to flow to the first cutting area (432a). Since the first cutting area (432a) has a lower surface step than the first non-cutting area (432-1) area, the phenomenon in which the flux (F) flowing into the first cutting area (432a) is blocked by the first non-cutting area (432-1) and flows into the opening (430a) may be reduced or prevented. For example, when the first cutting area (432a) of the printed circuit board (430) is arranged to overlap within the hollow portion (450a), the phenomenon of flux (F) flowing into the opening portion (430a) is reduced during the process of soldering the first layer portion (4321) and the bonding member (451), and thus the phenomenon of defects occurring in the microphone (440) (e.g., the microphone (340) of FIG. 3a) arranged on the second substrate surface (430-2) of the printed circuit board (430) can be reduced or prevented.

[0097]

[0098] FIG. 5A is a cross-sectional view illustrating a printed circuit board having a first cutting area and a second cutting area formed according to an embodiment. FIG. 5B is a plan view of area B2 of FIG. 5A illustrating a printed circuit board having a first cutting area and a second cutting area formed according to an embodiment. FIG. 5C is a plan view illustrating a printed circuit board having a second cutting area having a rectangular shape according to an embodiment.

[0099] Referring to FIGS. 5A, 5B, and 5C, a printed circuit board (530) according to one embodiment (e.g., printed circuit board (430) of FIG. 4A) may include a base member (531) (e.g., base member (431) of FIG. 4A) and a plating layer (532) (e.g., plating layer (432) of FIG. 4A) laminated on a surface of the base member (531). The plating layer (532) may form at least a portion of a wiring line on the surface of the base member (531).

[0100] In one embodiment, the plating layer (532) may include a first layer portion (5321) laminated on a surface of the base member (531) (e.g., the first layer portion (4321) of FIG. 4A), and a second layer portion (5322) laminated on the surface of the first layer portion (5321) (e.g., the second layer portion (4322) of FIG. 4A). The first layer portion (5321) and the second layer portion (5322) may be formed of different materials.

[0101] In one embodiment, on the first substrate surface (530-1) of the printed circuit board (530), one or more first cutting areas (532a) (e.g., the first cutting area (432a) of FIG. 4a) positioned to overlap within a hollow (550a) (e.g., the hollow (450a) of FIG. 4a) of a sealing member (550) (e.g., the sealing member (450) of FIG. 4a) and in which the plating layer (532) is omitted, one or more second cutting areas (532b) positioned to overlap on the outer side in the circumferential direction of the sealing member (550) and in which the plating layer (532) is omitted, and non-cutting areas (532-1, 532-2) in which the plating layer (532) is not omitted (e.g., non-cutting areas (432-1, 432-2) of FIG. 4a) may be formed, respectively.

[0102] In one embodiment, when looking at the first substrate surface (530-1), the non-cutting regions (532-1, 532-2) may include a first non-cutting region (532-1) (e.g., the first non-cutting region (432-1) of FIG. 4a) that is positioned to overlap inside the hollow (550a) and surrounds the outer perimeter of the opening (530a) (e.g., the opening (430a) of FIG. 4a), and a second non-cutting region (532-2) (e.g., the second non-cutting region (432-2) of FIG. 4a) that is positioned to overlap outside the hollow (550a). In one embodiment, the first non-cutting region (532-1) and the second non-cutting region (532-2) may be spaced apart from each other.

[0103] In one embodiment, the second cutting area (532b) may be formed in a closed loop shape, wrapping around the outer perimeter of the sealing member (550), when looking at the first substrate surface (532-1), as illustrated in FIG. 5b. In one embodiment, the second cutting area (532b) may be formed by cutting at least a portion of the plating layer (532) on the surface of the printed circuit board (530) that overlaps the outer surface of the sealing member (550) when looking at the first substrate surface (530-1).

[0104] In one embodiment, the second cutting areas (532b') may be formed in multiple numbers, as illustrated in FIG. 5C, and may be spaced apart from each other on the first substrate surface (530-1). In one embodiment, the multiple second cutting areas (532b') may be formed to have a rectangular shape when viewed from the first substrate surface (530-1). Although the multiple second cutting areas (532b') are illustrated as having a rectangular shape in the drawing, it should be noted that the multiple second cutting areas (532b') may have various shapes, such as a circular shape, when viewed from the first substrate surface (530-1).

[0105] In one embodiment, a metal bonding member (551) (e.g., bonding member (451) of FIG. 4a) that can be bonded to the surface of the plating layer (532) between the sealing member (550) and the printed circuit board (530) and an adhesive member (552) (e.g., adhesive member (452) of FIG. 4a) that is disposed between the sealing member (550) and the bonding member (551) and connects the sealing member (550) and the bonding member (551) may be disposed. Through the bonding member (551) and the adhesive member (552), the sealing member (550) seals the space between the acoustic pipe (521) (e.g., the acoustic pipe (421) of FIG. 4a) and the opening (530a), and can connect the printed circuit board (530) and the front frame (520) (e.g., the front frame (420) of FIG. 4a). In one embodiment, the plating layer (532) may be omitted at the second layer portion (5322) at the portion where the sealing member (550) is disposed. In one embodiment, the first layer portion (5321) and the bonding member (551) may be soldered. For example, a bonding layer (553) formed with solder (e.g., the bonding layer (453) of FIG. 4a) may be formed between the plating layer (532) and the bonding member (551).

[0106] In one embodiment, the flux (F) may be emitted to the plating layer (532) by the soldering process, and the emitted flux (F) may be induced to flow to the first cutting area (532a) and the second cutting area (532b). Since the first cutting area (532a) and the second cutting area (532b) have a lower surface step than the non-cutting area (532-1, 532-2) areas, the phenomenon of the flux (F) flowing into the first cutting area (532a) being blocked by the non-cutting area (532-1, 532-2) and flowing into the opening (530a) or other electronic components close to the printed circuit board (530) may be reduced or prevented. For example, it is possible to prevent the flux (F) from flowing to a microphone (540) (e.g., microphone (440) of FIG. 4a) or a battery module (e.g., battery module (289) of FIG. 2c) placed on the second substrate surface (530-2) of the printed circuit board (530).

[0107]

[0108] FIG. 6A is a cross-sectional view illustrating a printed circuit board having a first cutting area formed therein according to one embodiment. FIG. 6B is a plan view of area B3 of FIG. 6A illustrating a printed circuit board having a first cutting area having a circular shape according to one embodiment.

[0109] Referring to FIGS. 6A and 6B, a printed circuit board (630) according to one embodiment (e.g., printed circuit board (530) of FIG. 5A) may include a base member (631) (e.g., base member (531) of FIG. 5A) and a plating layer (632) (e.g., plating layer (532) of FIG. 5A) laminated on a surface of the base member (631). The plating layer (632) may form at least a portion of a wiring line on the surface of the base member (631).

[0110] In one embodiment, the plating layer (632) may include a first layer portion (6321) laminated on a surface of the base member (631) (e.g., the first layer portion (5321) of FIG. 5A), and a second layer portion (6322) laminated on the surface of the first layer portion (6321) (e.g., the second layer portion (5322) of FIG. 5A). The first layer portion (6321) and the second layer portion (6322) may be formed of different materials.

[0111] In one embodiment, on the first substrate surface (630-1) of the printed circuit board (630), one or more first cutting areas (632a) (e.g., the first cutting area (532a) of FIG. 5a) overlappingly positioned within a hollow (650a) (e.g., the hollow (550a) of FIG. 5a) of a sealing member (650) (e.g., the sealing member (550) of FIG. 5a) and in which the plating layer (632) is omitted, and non-cutting areas (632-1, 632-2) (e.g., non-cutting areas (532-1, 532-2) of FIG. 5a) in which the plating layer (632) is not omitted may be formed, respectively.

[0112] In one embodiment, when looking at the first substrate surface (630-1), the non-cutting regions (632-1, 632-2) may include a first non-cutting region (632-1) (e.g., the first non-cutting region (532-1) of FIG. 5a) that is positioned to overlap inside the hollow (650a) and surrounds the outer perimeter of the opening (630a) (e.g., the opening (530a) of FIG. 5a), and a second non-cutting region (632-2) (e.g., the second non-cutting region (532-2) of FIG. 5a) that is positioned to overlap outside the hollow (650a).

[0113] In one embodiment, the first cutting areas (632a) may be formed in plurality, as illustrated in FIG. 6B, and may be spaced apart from each other on the first substrate surface (630-1). In one embodiment, the plurality of first cutting areas (632a) may be formed to have a circular shape when viewed from the first substrate surface (630-1). Although the plurality of first cutting areas (632a) are illustrated as having a circular shape in the drawing, it should be noted that the plurality of first cutting areas (632a) may have various shapes, such as a square shape, when viewed from the first substrate surface (630-1).

[0114] In one embodiment, a metal bonding member (651) (e.g., bonding member (551) of FIG. 5a) that can be bonded to the surface of the plating layer (632) between the sealing member (650) and the printed circuit board (630), and an adhesive member (652) (e.g., adhesive member (552) of FIG. 5a) that is disposed between the sealing member (650) and the bonding member (651) and connects the sealing member (650) and the bonding member (651) may be disposed. Through the bonding member (651) and the adhesive member (652), the sealing member (650) seals the space between the acoustic conduit (621) (e.g., the acoustic conduit (621) of FIG. 5a) and the opening (630a), and can connect the printed circuit board (630) and the front frame (620) (e.g., the front frame (520) of FIG. 5a). In one embodiment, the plating layer (632) may be omitted at the second layer portion (6322) at the portion where the sealing member (650) is disposed. In one embodiment, the first layer portion (6321) and the bonding member (651) may be soldered. For example, a bonding layer (653) formed with solder (e.g., the bonding layer (553) of FIG. 5a) may be formed between the plating layer (632) and the bonding member (651).

[0115] In one embodiment, flux (F) may be emitted to the plating layer (632) by the soldering process, and the emitted flux (F) may be induced to flow to the first cutting area (632a). Since the first cutting area (632a) has a lower surface step than the first non-cutting area (632-1) area, the phenomenon of flux (F) flowing into the first cutting area (632a) being blocked by the first non-cutting area (632-1) and flowing into the opening (630a) may be reduced or prevented. For example, when the first cutting area (632a) of the printed circuit board (630) is formed in multiple pieces and is arranged to overlap within the hollow portion (650a), the phenomenon of flux (F) flowing into the opening (630a) is reduced during the process of soldering the first layer portion (6321) and the bonding member (651), and thus the phenomenon of defects occurring in the microphone (640) (e.g., the microphone (540) of FIG. 5a) arranged on the second substrate surface (630-2) of the printed circuit board (630) can be reduced or prevented.

[0116] In the drawing, only the first cutting area (632a) is shown as being formed on the first substrate surface (630-1) of the printed circuit board (630). However, it should be noted that a second cutting area (e.g., the second cutting area (532b) of FIG. 5a) that is positioned to overlap on the outer side in the circumferential direction of the sealing member (650) and has the plating layer (632) omitted may be formed integrally or in multiple shapes such as circles or squares.

[0117]

[0118] FIG. 7A is a cross-sectional view of a printed circuit board showing a first cutting area with only a second layer portion omitted according to one embodiment. FIG. 7B is a cross-sectional view of a printed circuit board showing a second cutting area with only a second layer portion omitted according to one embodiment.

[0119] Referring to FIGS. 7A and 7B, a printed circuit board (730) according to one embodiment (e.g., printed circuit board (630) of FIG. 6A) may include a base member (731) (e.g., base member (631) of FIG. 6A) and a plating layer (732) (e.g., plating layer (632) of FIG. 6A) laminated on a surface of the base member (631). The plating layer (732) may form at least a portion of a wiring line on the surface of the base member (731).

[0120] In one embodiment, the plating layer (732) may include a first layer portion (7321) laminated on a surface of the base member (731) (e.g., the first layer portion (6321) of FIG. 6A), and a second layer portion (7322) laminated on the surface of the first layer portion (7321) (e.g., the second layer portion (6322) of FIG. 6A). The first layer portion (7321) and the second layer portion (7322) may be formed of different materials.

[0121] In one embodiment, the first substrate surface (730-1) of the printed circuit board (730) includes, as shown in FIG. 7A, one or more first cutting areas (732a) positioned to overlap within a hollow (750a) (e.g., the hollow (650a) of FIG. 6A) of a sealing member (750) (e.g., the sealing member (650) of FIG. 6A) and in which only the second layer portion (7322) of the plating layer (732) is omitted, one or more second cutting areas (732b) positioned to overlap on the outer side in the circumferential direction of the sealing member (750) and in which the plating layer (732) is omitted (e.g., the second cutting area (532b) of FIG. 5A), and non-cutting areas (732-1, 732-2) in which the plating layer (732) is not omitted (e.g., the non-cutting area (632-1, 732-2) of FIG. 6A). 632-2)) can be formed respectively. Even if only the second layer portion (7322) of the plating layer (732) is omitted in the first cutting area (732a), the first cutting area (732a) can have a lower surface step compared to the non-cutting areas (732-1, 732-2).

[0122] In one embodiment, on the first substrate surface (730-1) of the printed circuit board (730), as illustrated in FIG. 7b, one or more first cutting areas (732a) (e.g., the first cutting area (432a) of FIG. 4a) positioned to overlap within the hollow portion (750a) of the sealing member (750) and in which the plating layer (732) is omitted, one or more second cutting areas (732b) positioned to overlap on the outer circumferential side of the sealing member (750) and in which only the second layer portion (7322) of the plating layer (732) is omitted, and non-cutting areas (732-1, 732-2) in which the plating layer (732) is not omitted may be formed, respectively. Even if only the second layer portion (7322) of the plating layer (732) is omitted in the second cutting area (732b), the second cutting area (732b) can have a lower surface step compared to the non-cutting areas (732-1, 732-2).

[0123] In one embodiment, when looking at the first substrate surface (730-1), the non-cutting regions (732-1, 732-2) may include a first non-cutting region (732-1) (e.g., the first non-cutting region (532-1) of FIG. 5a) that is positioned to overlap inside the hollow (750a) and surrounds the outer perimeter of the opening (730a) (e.g., the opening (630a) of FIG. 6a), and a second non-cutting region (732-2) (e.g., the second non-cutting region (532-1) of FIG. 5a) that is positioned to overlap outside the hollow (750a).

[0124] When applying the second layer portion (7322) to the first layer portion (7321) of the plating layer (732), when looking at the first substrate surface (730-1), by not applying the second layer portion (732-2) to the first layer portion (7321) positioned to overlap the first cutting area (732a) or the second cutting area (732b), a first cutting area (732a) or a second cutting area (732b) in which only the second layer portion (7322) is omitted can be formed. In the drawing, the first cutting area (732a) or the second cutting area (732b) is shown with the second layer portion (7322) of the plating layer (732) omitted. However, it should be noted that in both the first cutting area (732a) and the second cutting area (732b), the plating layer (732) may be omitted only in the second layer portion (7322).

[0125] In the drawing, the thickness of the first layer portion (7321) is depicted as being constant in the direction of the first substrate surface (730-1) (e.g., +Z direction in FIG. 7a) on the surface of the base member (731). However, for example, when looking at the first substrate surface (730-1) of the printed circuit board (730), it should be noted that the thickness of the first layer portion (7321) positioned to overlap the first cutting area (732a) or the second cutting area (732b) may be smaller than the thickness of the first layer portion (7321) positioned to overlap the non-cutting area (732-1, 732-2). By forming the thickness of the first layer portion (7321) positioned to overlap the first cutting area (732a) or the second cutting area (732b) to be smaller than the thickness of the first layer portion (7321) positioned to overlap the non-cutting area (732-1, 732-2), the flux (e.g., the flux (F) of FIG. 6b) can be effectively induced to flow into the first cutting area (732a) or the second cutting area (732b).

[0126] In one embodiment, a metal bonding member (751) (e.g., bonding member (651) of FIG. 6A) that can be bonded to the surface of the plating layer (732) between the sealing member (750) and the printed circuit board (730), and an adhesive member (752) (e.g., adhesive member (652) of FIG. 6A) that is disposed between the sealing member (750) and the bonding member (751) and connects the sealing member (750) and the bonding member (751) may be disposed. Through the bonding member (751) and the adhesive member (752), the sealing member (750) can seal the space between the acoustic conduit (721) (e.g., the acoustic conduit (621) of FIG. 6a) and the opening (730a), and connect the printed circuit board (730) and the front frame (720) (e.g., the front frame (620) of FIG. 6a). In one embodiment, the plating layer (732) may be omitted at the second layer portion (7322) at the portion where the sealing member (750) is disposed. In one embodiment, the first layer portion (7321) and the bonding member (751) may be soldered. For example, a bonding layer (753) formed of solder (e.g., the bonding layer (653) of FIG. 6a) may be formed between the plating layer (732) and the bonding member (751).

[0127] In one embodiment, flux may be emitted to the plating layer (732) by the soldering process, and the emitted flux may be induced to flow to the first cutting region (732a) and the second cutting region (732b). Since the first cutting region (732a) and the second cutting region (732b) have lower surface steps than the non-cutting regions (732-1, 732-2), the phenomenon in which the flux flowing into the first cutting region (732a) is blocked by the non-cutting regions (732-1, 732-2) and flows into the opening (730a) or other electronic components close to the printed circuit board (730) may be reduced or prevented. For example, it is possible to prevent the flux from flowing to a microphone (740) (e.g., microphone (640) of FIG. 6a) or a battery module (e.g., battery module (289) of FIG. 2c) disposed on the second substrate surface (730-2).

[0128]

[0129] An electronic device (101; 201; 301) according to one embodiment comprises a housing (210; 310) including a front frame (220; 320; 420; 520; 620; 720) in which an acoustic hole (213; 313) is formed on an outer surface of the electronic device (101; 201; 301) and an acoustic conduit (321; 421; 521; 621; 721) communicating with the acoustic hole (213; 313) is formed, a first substrate surface (331; 430-1; 530-1; 630-1; 730-1) disposed inside the housing (210; 310) and facing the front frame (220; 320; 420; 520; 620; 720), and A printed circuit board (232;330;430;530;630;730) including a second substrate surface (332;430-2;530-2;630-2;730-2) opposite to a first substrate surface (331;430-1;530-1;630-1;730-1), and including an opening (233;330a;430a;530a;630a;730a) formed at a position overlapping the sound pipe (321;421;521;621;721), and arranged on the second substrate surface (332;430-2;530-2;630-2;730-2) to overlap the opening (233;330a;430a;530a;630a;730a) It may include a sealing member (350;450;550;650;750) including a hollow (350a;450a;550a;650a;750a) formed through the opening (233;330a;430a;530a;630a;730a) and the acoustic pipe (321;421;521;621;721) and disposed between the microphone (240;340;440;540;640;740) and the front frame (220;320;420;520;620;720) and the printed circuit board (232;330;430;530;630;730). In one embodiment, the printed circuit board (232; 330; 430; 530; 630; 730) may include a base member (431; 531; 631; 731), and a plating layer (432; 532; 632; 732) laminated on the surface of the base member (431; 531; 631; 731).In one embodiment, on the first substrate surface (331; 430-1; 530-1; 630-1; 730-1) of the printed circuit board (232; 330; 430; 530; 630; 730), one or more first cutting areas (432a; 532a; 632a; 732a) positioned to overlap within the hollow (350a; 450a; 550a; 650a; 750a) and in which the plating layer (432; 532; 632; 732) is omitted, and a non-cutting area (432-1; 432-2; 532-1; 532-2; 632-1; 632-2; 732-1; 732-2) in which the plating layer (432; 532; 632; 732) is not omitted may be formed, respectively.

[0130] In one embodiment, when looking at the first substrate surface (331; 430-1; 530-1; 630-1), the non-cutting area (432-1; 432-2; 532-1; 532-2; 632-1; 632-2; 732-1; 732-2) is positioned to overlap inside the hollow (350a; 450a; 550a; 650a; 750a), and surrounds the outer perimeter of the opening (233; 330a; 430a; 530a; 630a; 730a), and the second non-cutting area (432-1; 532-1; 632-1; 732-1) is positioned to overlap outside the hollow (350a; 450a; 550a; 650a; 750a). It may include areas (432-2; 532-2; 632-2; 732-2).

[0131] In one embodiment, the first cutting area (432a; 532a; 632a; 732a) may be formed in a closed loop shape, surrounding the outer perimeter of the first non-cutting area (432-1; 532-1; 632-1; 732-1) when looking at the first substrate surface (331; 430-1; 530-1; 630-1; 730-1).

[0132] In one embodiment, the first cutting areas (432a; 532a; 632a; 732a) may be formed in plurality and spaced apart from each other on the first substrate surface (331; 430-1; 530-1; 630-1; 730-1). In one embodiment, the plurality of first cutting areas (432a; 532a; 632a; 732a) may be formed to have a circular or rectangular shape when viewed from the first substrate surface (331; 430-1; 530-1; 630-1; 730-1).

[0133] In one embodiment, on the first substrate surface (331;430-1;530-1;630-1;730-1) of the printed circuit board (232;330;430;530;630;730), when looking at the first substrate surface (331;430-1;530-1;630-1;730-1), one or more second cutting areas (532b;532b';732b) may be further formed, which are positioned to overlap on the outer side in the circumferential direction of the sealing member (350;450;550;650;750), and in which the plating layer (432;532;632;732) is omitted.

[0134] In one embodiment, the second cutting area (532b; 732b) may be formed in a closed loop shape by wrapping around the outer perimeter of the sealing member (350; 450; 550; 650; 750) when facing the first substrate surface (331; 430-1; 530-1; 630-1; 730-1).

[0135] In one embodiment, the second cutting areas (532b'; 732b) may be formed in plurality and spaced apart from each other on the first substrate surface (331; 430-1; 530-1; 630-1; 730-1). In one embodiment, the plurality of second cutting areas (532b'; 732b) may be formed to have a circular or rectangular shape when viewed from the first substrate surface (331; 430-1; 530-1; 630-1; 730-1).

[0136] In one embodiment, the plating layer (432; 532; 632; 732) may include a first layer portion (4321; 5321; 6321; 7321) laminated on the surface of the base member (431; 531; 631; 731), and a second layer portion (4322; 5322; 6322; 7322) laminated on the first layer portion (4321; 5321; 6321; 7321). In one embodiment, in the first cutting area (432a; 532a; 632a; 732a) or the second cutting area (532b; 532b'; 732b), the plating layer (432; 532; 632; 732) may be omitted only in the second layer portion (4322; 5322; 6322; 7322).

[0137] In one embodiment, when looking at the first substrate surface (331;430-1;530-1;630-1;730-1) of the printed circuit board (232;330;430;530;630;730), the thickness of the first layer portion (4321;5321;6321;7321) positioned to overlap the first cutting area (432a;532a;632a;732a) or the second cutting area (532b;532b';732b) is greater than the thickness of the first layer portion (4321;5321;6321;7321) positioned to overlap the non-cutting area (432-1;432-2;532-1;532-2;632-1;632-2;732-1;732-2) It may be smaller compared to the thickness of the parts (4321; 5321; 6321; 7321).

[0138] In one embodiment, the first layer portion (4321; 5321; 6321; 7321) may be formed of a copper material, and the second layer portion (4322; 5322; 6322; 7322) may be formed of a solder resist (SR) material.

[0139] In one embodiment, the sealing member (350; 450; 550; 650; 750) and the printed circuit board (232; 330; 430; 530; 630; 730) may be arranged between the sealing member (451; 551; 651; 751) and the printed circuit board (232; 330; 430; 530; 630; 730), and may further include a metal bonding member (451; 551; 651; 751) that is bonded to the plating layer (432; 532; 632; 732), and an adhesive member (452; 552; 652; 752) that is arranged between the sealing member (350; 450; 550; 650; 750) and the bonding member (451; 551; 651; 751) and connects the sealing member (350; 450; 550; 650; 750) and the bonding member (451; 551; 651; 751). In one embodiment, the plating layer (432; 532; 632; 732) may omit the second layer portion (4322; 5322; 6322; 7322) at the location where the sealing member (350; 450; 550; 650; 750) is disposed. In one embodiment, the first layer portion (4321; 5321; 6321; 7321) and the bonding member (451; 551; 651; 751) may be soldered to form a bonding layer (453; 553; 653; 753).

[0140] In one embodiment, the printed circuit board (232; 330; 430; 530; 630; 730) may include a first portion (3311) that overlaps within the hollow portion (350a; 450a; 550a; 650a; 750a) and surrounds the perimeter of the opening (233; 330a; 430a; 530a; 630a; 730a), and a second portion (3312) that overlaps within the hollow portion (350a; 450a; 550a; 650a; 750a) and surrounds the perimeter of the first portion (3311). In one embodiment, at least a portion of the first portion (3311) may be formed to have a higher step in the direction of the first substrate surface (331; 430-1; 530-1; 630-1; 730-1) than at least a portion of the second portion (3312). In one embodiment, the non-cutting region (432-1; 432-2; 532-1; 532-2; 632-1; 632-2; 732-1; 732-2) may be formed in the first portion (3311), and the first cutting region (432a; 532a; 632a; 732a) may be formed in the second portion (3312).

[0141] In one embodiment, the bonding layer (453; 553; 653; 753) may be formed of solder. In one embodiment, the bonding member (451; 551; 651; 751) may be formed of a copper material.

[0142] In one embodiment, the sealing member (350; 450; 550; 650; 750) may be formed of a rubber material.

[0143] In one embodiment, the hollow portion (350a; 450a; 550a; 650a; 750a) of the sealing member (350; 450; 550; 650; 750) may have a larger cross-sectional area compared to the opening portion (233; 330a; 430a; 530a; 630a; 730a) of the printed circuit board (232; 330; 430; 530; 630; 730).

[0144] A printed circuit board (232; 330; 430; 530; 630; 730) according to one embodiment may include a base member (431; 531; 631; 731), and a plating layer (432; 532; 632; 732) laminated on at least a portion of a surface of the base member (431; 531; 631; 731). In the printed circuit board (232;330;430;530;630;730), an opening (233;330a;430a;530a;630a;730a) penetrating along the thickness direction of the printed circuit board (232;330;430;530;630;730) may be formed, which includes a first substrate surface (331;430-1;530-1;630-1;730-1) and a second substrate surface (332;430-2;530-2;630-2;730-2) opposite to the first substrate surface (331;430-1;530-1;630-1;730-1). A sealing member (350;450;550;650;750) having a hollow (350a;450a;550a;650a;750a) formed to surround the opening (233;330a;430a;530a;630a;730a) and communicate with the opening (233;330a;430a;530a;630a;730a) along the thickness direction may be arranged on the first substrate surface (331;430-1;530-1;630-1;730-1) of the printed circuit board (232;330;430;530;630;730). The printed circuit board (232; 330; 430; 530; 630; 730) is formed on the first substrate surface (331; 430-1; 530-1; 630-1; 730-1), and at least one first cutting area (432a; 532a; 632a; 732a) in which the plating layer (432; 532; 632; 732) is omitted in an overlapping portion within the hollow (350a; 450a; 550a; 650a; 750a), and a non-cutting area (432a; 532a; 632a; 732a) in which the plating layer (432; 532; 632; 732) is not omitted, and is formed on the first substrate surface (331; 430-1; 530-1; 630-1; 730-1) It may include areas (432-1;432-2;532-1;532-2;632-1;632-2;732-1;732-2).Electronic components can be placed on the second substrate surface (332;430-1;530-2;630-2;730-2) of the above printed circuit board (232;330;430;530;630;730) to overlap with the opening (233;330a;430a;530a;630a;730a).

[0145] In one embodiment, the electronic component may be a microphone (240; 340; 440; 540; 640; 740).

[0146] In one embodiment, when looking at the first substrate surface (331; 430-1; 530-1; 630-1; 730-1), the non-cutting area (432-1; 432-2; 532-1; 532-2; 632-1; 632-2; 732-1; 732-2) is positioned to overlap within the hollow (350a; 450a; 550a; 650a; 750a), and the first non-cutting area (432-1; 532-1; 632-1; 732-1) surrounding the outer periphery of the opening (233; 330a; 430a; 530a; 630a; 730a), and is positioned to overlap outside the hollow (350a; 450a; 550a; 650a; 750a). It may include a second non-cutting area (432-2; 532-2; 632-2; 732-2).

[0147] In one embodiment, on the first substrate surface (331;430-1;530-1;630-1;730-1) of the printed circuit board (232;330;430;530;630;730), when looking at the first substrate surface (331;430-1;530-1;630-1;730-1), one or more second cutting areas (532b;532b';732b) may be further formed, which are positioned to overlap on the outer side in the circumferential direction of the sealing member (350;450;550;650;750), and in which the plating layer (432;532;632;732) is omitted.

[0148] An electronic device (101; 201; 301) according to one embodiment comprises a housing (210; 310) including a front frame (220; 320; 420; 520; 620; 720) in which an acoustic hole (213; 313) is formed on an outer surface of the electronic device (101; 201; 301) and an acoustic conduit (321; 421; 521; 621; 721) communicating with the acoustic hole (213; 313) is formed, a first substrate surface (331; 430-1; 530-1; 630-1; 730-1) disposed inside the housing (210; 310) and facing the front frame (220; 320; 420; 520; 620; 720), and A printed circuit board (232;330;430;530;630;730) including a second substrate surface (332;430-2;530-2;630-2;730-2) opposite to a first substrate surface (331;430-1;530-1;630-1;730-1), and including an opening (233;330a;430a;530a;630a;730a) formed at a position overlapping the sound pipe (321;421;521;621;721), and arranged on the second substrate surface (332;430-2;530-2;630-2;730-2) to overlap the opening (233;330a;430a;530a;630a;730a) It may include a sealing member (350;450;550;650;750) including a hollow (350a;450a;550a;650a;750a) formed through the opening (233;330a;430a;530a;630a;730a) and the acoustic pipe (321;421;521;621;721) and disposed between the microphone (240;340;440;540;640;740) and the front frame (220;320;420;520;620;720) and the printed circuit board (232;330;430;530;630;730). In one embodiment, the printed circuit board (232; 330; 430; 530; 630; 730) may include a base member (431; 531; 631; 731), and a plating layer (432; 532; 632; 732) laminated on the surface of the base member (431; 531; 631; 731).In one embodiment, the printed circuit board (232; 330; 430; 530; 630; 730) is positioned inside the hollow (350a; 450a; 550a; 650a; 750a) and surrounds the opening (233; 330a; 430a; 530a; 630a; 730a), when facing the first substrate surface (331; 430-1; 530-1; 630-1; 730-1), and has a first non-cutting area (432-1; 532-1; 632-1; 732-1) located outside the hollow (350a; 450a; 550a; 650a; 750a) and surrounds the first non-cutting area (432-1; 532-1; 632-1; 732-1). A surrounding second non-cutting region (432-2; 532-2; 632-2; 732-2), and a first cutting region (432a; 532a; 632a; 732a) located inside the hollow (350a; 450a; 550a; 650a; 750a) and formed between the first non-cutting region (432-1; 532-1; 632-1; 732-1) and the second non-cutting region (432-2; 532-2; 632-2; 732-2), wherein the plating layer (432; 532; 632; 732) may be omitted in the first cutting region (432a; 532a; 632a; 732a).

Claims

1. In electronic devices (101; 201; 301), A housing (210; 310) including a front frame (220; 320; 420; 520; 620; 720) in which an acoustic hole (213; 313) formed on the outer surface of the electronic device (101; 201; 301) and an acoustic conduit (321; 421; 521; 621; 721) communicating with the acoustic hole (213; 313) are formed; A first substrate surface (331;430-1;530-1;630-1;730-1) disposed inside the housing (210;310) and facing the front frame (220;320;420;520;620;720), and a second substrate surface (332;430-2;530-2;630-2;730-2) opposite to the first substrate surface (331;430-1;530-1;630-1;730-1), and including an opening (233;330a;430a;530a;630a;730a) formed at a position overlapping the sound pipe (321;421;521;621;721) Printed circuit board (232;330;430;530;630;730); A microphone (240; 340; 440; 540; 640; 740) placed on the second substrate surface (332; 430-2; 530-2; 630-2; 730-2) so as to overlap with the opening (233; 330a; 430a; 530a; 630a; 730a); and A sealing member (350;450;550;650;750) disposed between the front frame (220;320;420;520;620;720) and the printed circuit board (232;330;430;530;630;730), and including a hollow (350a;450a;550a;650a;750a) formed through the opening (233;330a;430a;530a;630a;730a) and the sound pipe (321;421;521;621;721); Including, The above printed circuit board (232;330;430;530;630;730) is Base member (431; 531; 631; 731); and A plating layer (432; 532; 632; 732) laminated on the surface of the above base member (431; 531; 631; 731); Including, On the first substrate surface (331; 430-1; 530-1; 630-1; 730-1) of the above printed circuit board (232; 330; 430; 530; 630; 730), One or more first cutting areas (432a; 532a; 632a; 732a) positioned overlappingly within the above hollow (350a; 450a; 550a; 650a; 750a) and from which the plating layer (432; 532; 632; 732) is omitted; and The non-cutting areas (432-1; 432-2; 532-1; 532-2; 632-1; 632-2; 732-1; 732-2) in which the above plating layers (432; 532; 632; 732) are not omitted are formed, respectively. Electronic devices (101;201;301).

2. In paragraph 1, Looking at the first substrate surface (331; 430-1; 530-1; 630-1; 730-1), The above non-cutting areas (432-1;432-2;532-1;532-2;632-1;632-2;732-1;732-2) are A first non-cutting area (432-1; 532-1; 632-1; 732-1) positioned so as to overlap within the above hollow portion (350a; 450a; 550a; 650a; 750a) and surrounding the outer perimeter of the opening (233; 330a; 430a; 530a; 630a; 730a); and Second non-cutting area (432-2; 532-2; 632-2; 732-2) positioned to overlap outside the above hollow (350a; 450a; 550a; 650a; 750a); An electronic device (101;201;301) comprising:

3. In paragraph 1 or 2, The above first cutting area (432a; 532a; 632a; 732a) is formed in a closed loop shape by surrounding the outer perimeter of the first non-cutting area (432-1; 532-1; 632-1; 732-1) when looking at the first substrate surface (331; 430-1; 530-1; 630-1; 730-1).

4. In any one of paragraphs 1 to 3, The first cutting areas (432a; 532a; 632a; 732a) are formed in plurality and spaced apart from each other on the first substrate surface (331; 430-1; 530-1; 630-1; 730-1). The above plurality of first cutting areas (432a; 532a; 632a; 732a) are formed to have a circular or rectangular shape when looking at the first substrate surface (331; 430-1; 530-1; 630-1; 730-1). Electronic devices (101;201;301).

5. In any one of paragraphs 1 to 4, On the first substrate surface (331; 430-1; 530-1; 630-1; 730-1) of the above printed circuit board (232; 330; 430; 530; 630; 730), When looking at the first substrate surface (331; 430-1; 530-1; 630-1; 730-1), one or more second cutting areas (532b; 532b'; 732b) are further formed, which are positioned to overlap on the outer side in the circumferential direction of the sealing member (350; 450; 550; 650; 750) and in which the plating layer (432; 532; 632; 732) is omitted. Electronic devices (101;201;301).

6. In any one of paragraphs 1 to 5, The second cutting area (532b; 732b) is formed in a closed loop shape by wrapping around the outer perimeter of the sealing member (350; 450; 550; 650; 750) when looking at the first substrate surface (331; 430-1; 530-1; 630-1; 730-1), in an electronic device (101; 201; 301).

7. In any one of paragraphs 1 to 6, The second cutting area (532b'; 732b) is formed in multiples and spaced apart from each other on the first substrate surface (331; 430-1; 530-1; 630-1; 730-1). An electronic device (101; 201; 301) in which a plurality of the second cutting areas (532b'; 732b) are formed to have a circular or rectangular shape when viewed from the first substrate surface (331; 430-1; 530-1; 630-1; 730-1).

8. In any one of paragraphs 1 to 7, The above plating layer (432; 532; 632; 732) is A first layer portion (4321; 5321; 6321; 7321) laminated on the surface of the above base member (431; 531; 631; 731); and A second layer portion (4322; 5322; 6322; 7322) laminated on the first layer portion (4321; 5321; 6321; 7321); Including, In the first cutting area (432a; 532a; 632a; 732a) or the second cutting area (532b; 532b'; 732b), the plating layer (432; 532; 632; 732) is omitted only in the second layer portion (4322; 5322; 6322; 7322). Electronic devices (101;201;301).

9. In any one of paragraphs 1 to 8, When looking at the first substrate surface (331;430-1;530-1;630-1;730-1) of the printed circuit board (232;330;430;530;630;730), the thickness of the first layer portion (4321;5321;6321;7321) positioned to overlap the first cutting area (432a;532a;632a;732a) or the second cutting area (532b;532b';732b) is Electronic devices (101;201;301) smaller in size compared to the thickness.

10. In any one of paragraphs 1 to 9, The above first layer portion (4321; 5321; 6321; 7321) is formed of copper material, The above second layer portion (4322; 5322; 6322; 7322) is formed of solder resist (SR) material. Electronic devices (101;201;301).

11. In any one of paragraphs 1 to 10, A metal bonding member (451; 551; 651; 751) disposed between the sealing member (350; 450; 550; 650; 750) and the printed circuit board (232; 330; 430; 530; 630; 730) and bonded to the plating layer (432; 532; 632; 732); and An adhesive member (452; 552; 652; 752) disposed between the sealing member (350; 450; 550; 650; 750) and the joining member (451; 551; 651; 751), connecting the sealing member (350; 450; 550; 650; 750) and the joining member (451; 551; 651; 751); Including more, The above plating layer (432; 532; 632; 732) is omitted from the second layer portion (4322; 5322; 6322; 7322) at the location where the sealing member (350; 450; 550; 650; 750) is placed, The first layer portion (4321; 5321; 6321; 7321) and the bonding member (451; 551; 651; 751) are soldered to form a bonding layer (453; 553; 653; 753). Electronic devices (101;201;301).

12. In any one of paragraphs 1 to 11, The above printed circuit board (232;330;430;530;630;730) is A first part (3311) that overlaps within the above hollow (350a; 450a; 550a; 650a; 750a) and surrounds the perimeter of the opening (233; 330a; 430a; 530a; 630a; 730a); and A second part (3312) that overlaps within the above hollow (350a; 450a; 550a; 650a; 750a) and surrounds the perimeter of the first part (3311); Including, At least a part of the first part (3311) is formed to have a higher step in the direction of the first substrate surface (331; 430-1; 530-1; 630-1; 730-1) than at least a part of the second part (3312), In the first part (3311), the non-cutting area (432-1; 432-2; 532-1; 532-2; 632-1; 632-2; 732-1; 732-2) is formed, and in the second part (3312), the first cutting area (432a; 532a; 632a; 732a) is formed. Electronic devices (101;201;301).

13. In any one of paragraphs 1 to 12, The above bonding layer (453; 553; 653; 753) is formed of solder, The above-mentioned joint member (451; 551; 651; 751) is formed of copper material. Electronic devices (101;201;301).

14. In any one of paragraphs 1 to 13, The above sealing member (350; 450; 550; 650; 750) is formed of a rubber material, and is an electronic device (101; 201; 301).

15. In any one of paragraphs 1 to 14, The hollow portion (350a;450a;550a;650a;750a) of the sealing member (350;450;550;650;750) has a larger cross-sectional area compared to the opening portion (233;330a;430a;530a;630a;730a) of the printed circuit board (232;330;430;530;630;730), the electronic device (101;201;301).

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