Display substrate having light-emitting bottom

Abstract

A display substrate having a light-emitting bottom, comprising a first transparent base layer (401), a driving circuit layer (402), a light-emitting structure layer (403), a packaging layer (404), and a light-shielding layer (405); the driving circuit layer (402) is provided on one side of the first transparent base layer (401); the light-emitting structure layer (403) is provided on the side of the driving circuit layer (402) away from the first transparent base layer (401); the packaging layer (404) is provided on the side of the light-emitting structure layer (403) away from the first transparent base layer (401); the light-shielding layer (405) is provided between the first transparent base layer (401) and the light-emitting structure layer (403); the light-emitting structure layer (403) comprises a plurality of pixel structures; the light-shielding layer (405) comprises a light-shielding structure; at least part of the light-shielding structure extends in a row direction, and the projection of the light-shielding structure on the first transparent base layer (401) is located between the projections of two pixel rows; and / or at least part of the light-shielding structure extends in a column direction, and the projection of the light-shielding structure on the first transparent base layer (401) is located between the projections of two pixel columns.

Description

A bottom-emitting display substrate

[0001] This application claims priority to Chinese Patent Application No. 202410683152.X, filed on May 29, 2024, entitled "A Bottom-Light Emitting Display Substrate", the contents of which are to be understood as incorporated herein by reference. Technical Field

[0002] This disclosure relates to, but is not limited to, the field of display technology, and in particular to a bottom-emitting display substrate. Background Technology

[0003] In recent years, OLED (Organic Light-Emitting Diode) display devices have developed rapidly. Flagship phones from major mobile phone brands have adopted OLED displays, and the technology is beginning to penetrate automotive display applications. Compared to traditional LCD (Liquid Crystal Display) displays, OLED displays offer numerous advantages, including a wider color gamut, more vibrant colors, and the ability to be curved or full-screen, thus gaining widespread consumer acceptance.

[0004] In some situations, display devices are required to have narrow viewing angles. Taking an in-vehicle display as an example, as shown in Figure 1(a), a display is installed on the vehicle's console. When driving at night, the display will cast a reflection on the windshield, posing a safety hazard. Therefore, the display needs to have a narrow vertical viewing angle to achieve the reflection-free effect shown in Figure 1(b).

[0005] As shown in Figure 2, for a display that provides entertainment functions in the passenger seat, it is desirable that the display will not interfere with the driver's driving during use. Therefore, a narrow viewing angle is also required for the display.

[0006] Summary of the Invention

[0007] The following is an overview of the subject matter described in detail in this disclosure. This overview is not intended to limit the scope of the claims.

[0008] This disclosure provides a bottom-emitting display substrate, comprising: a first transparent substrate layer, a driving circuit layer, a light-emitting structure layer, an encapsulation layer, and a light-shielding layer;

[0009] The driving circuit layer is disposed on one side of the first transparent substrate layer; the light-emitting structure layer is disposed on the side of the driving circuit layer away from the first transparent substrate layer; the encapsulation layer is disposed on the side of the light-emitting structure layer away from the first transparent substrate layer; and the light-shielding layer is disposed between the first transparent substrate layer and the light-emitting structure layer.

[0010] The light-emitting structure layer includes multiple pixel structures, which are arranged along the row and column directions to form multiple pixel rows and multiple pixel columns.

[0011] The light-shielding layer includes a plurality of light-shielding structures, at least a portion of which extend along the row direction and the projection of the light-shielding structure onto the first transparent substrate is located between the projections of two pixel rows; and / or, at least a portion of the light-shielding layer includes a plurality of light-shielding structures, which extend along the column direction and the projection of the light-shielding structure onto the first transparent substrate is located between the projections of two pixel columns.

[0012] In one exemplary embodiment, the light-emitting structure layer includes: a transparent electrode layer, an electroluminescent layer, a reflective electrode layer, and a pixel defining layer;

[0013] The transparent electrode layer is disposed on the side of the driving circuit layer away from the first transparent substrate layer, the electroluminescent layer is disposed on the side of the transparent electrode layer away from the first transparent substrate layer, and the reflective electrode layer is disposed on the side of the electroluminescent layer away from the first transparent substrate layer; the pixel defining layer is disposed between the transparent electrode layer and the electroluminescent layer, and the pixel defining layer defines the transparent electrode layer, the electroluminescent layer and the reflective electrode layer as the plurality of pixel structures.

[0014] In one exemplary embodiment, a planarization layer is further disposed between the driving circuit layer and the light-emitting structure layer, and the light-shielding structure is disposed between the driving circuit layer and the planarization layer.

[0015] In one exemplary embodiment, a second transparent substrate layer is further provided between the driving circuit layer and the first transparent substrate layer, and the light-shielding structure is disposed between the first transparent substrate layer and the second transparent substrate layer.

[0016] In one exemplary embodiment, the light-shielding layer includes a first light-shielding layer and a second light-shielding layer;

[0017] A planarization layer is further disposed between the driving circuit layer and the light-emitting structure layer, and the light-shielding structure of the first light-shielding layer is disposed between the driving circuit layer and the planarization layer; a second transparent substrate layer is further disposed between the driving circuit layer and the first transparent substrate layer, and the light-shielding structure of the second light-shielding layer is disposed between the first transparent substrate layer and the second transparent substrate layer.

[0018] In one exemplary embodiment, a second transparent substrate layer is further provided between the driving circuit layer and the first transparent substrate layer. The second transparent substrate layer has a through hole that penetrates the second transparent substrate layer in terms of thickness, and the light-shielding structure is located in the through hole.

[0019] In one exemplary embodiment, a first transparent isolation layer is further disposed between the first transparent substrate layer and the second transparent substrate layer.

[0020] In one exemplary embodiment, a second transparent isolation layer is further disposed between the second transparent substrate layer and the driving circuit layer, and the via also penetrates the second transparent isolation layer.

[0021] In one exemplary embodiment, the projection of the light-shielding structure onto the first transparent substrate layer is located within the projection range of the pixel defining layer onto the first transparent substrate layer.

[0022] In one exemplary embodiment, the pixel delimiting layer is a black pixel delimiting layer.

[0023] In one exemplary embodiment, the light-shielding structure is made by exposing and developing a black photosensitive material.

[0024] In one exemplary embodiment, the second transparent isolation layer is formed by exposure and development, and the second transparent substrate layer is formed by etching the second transparent isolation layer as a hard mask.

[0025] In one exemplary embodiment, the thickness of the light-shielding layer is between 1.5 μm and 2.5 μm.

[0026] In one exemplary embodiment, the thickness of the second transparent substrate layer is between 3 μm and 20 μm.

[0027] This disclosure also provides a method for manufacturing a bottom-emitting display substrate, including:

[0028] Forming the first transparent substrate layer;

[0029] A driving circuit layer is formed, wherein the driving circuit layer is disposed on one side of the first transparent substrate layer;

[0030] A light-emitting structure layer is formed, the light-emitting structure layer is disposed on the side of the driving circuit layer away from the first transparent substrate layer, the light-emitting structure layer includes a plurality of pixel structures, the plurality of pixel structures are arranged along the row direction and the column direction to form a plurality of pixel rows and a plurality of pixel columns;

[0031] An encapsulation layer is formed, wherein the encapsulation layer is disposed on the side of the light-emitting structure layer away from the first transparent substrate layer;

[0032] A light-shielding layer is formed, the light-shielding layer being disposed between the first transparent substrate layer and the light-emitting structure layer, the light-shielding layer comprising a plurality of light-shielding structures, at least a portion of the light-shielding structures extending along the row direction, and the projection of the light-shielding structure on the first transparent substrate layer being located between the projections of two pixel rows; and / or, at least a portion of the light-shielding layer comprising a plurality of light-shielding structures, the light-shielding structures extending along the column direction, and the projection of the light-shielding structure on the first transparent substrate layer being located between the projections of two pixel columns.

[0033] In one exemplary embodiment, forming the light-emitting structure layer includes: a transparent electrode layer, an electroluminescent layer, a reflective electrode layer, and a pixel delimiting layer.

[0034] The transparent electrode layer is disposed on the side of the driving circuit layer away from the first transparent substrate layer, the electroluminescent layer is disposed on the side of the transparent electrode layer away from the first transparent substrate layer, and the reflective electrode layer is disposed on the side of the electroluminescent layer away from the first transparent substrate layer; the pixel defining layer is disposed between the transparent electrode layer and the electroluminescent layer, and the pixel defining layer defines the transparent electrode layer, the electroluminescent layer and the reflective electrode layer as the plurality of pixel structures.

[0035] In one exemplary embodiment, the method further includes:

[0036] A planarization layer is formed between the driving circuit layer and the light-emitting structure layer, and the light-shielding structure is disposed between the driving circuit layer and the planarization layer.

[0037] In one exemplary embodiment, the method further includes:

[0038] A second transparent substrate layer is formed between the driving circuit layer and the first transparent substrate layer, and the light-shielding structure is disposed between the first transparent substrate layer and the second transparent substrate layer.

[0039] In one exemplary implementation,

[0040] The light-shielding layer includes: a first light-shielding layer and a second light-shielding layer.

[0041] The manufacturing method further includes: forming a planarization layer between the driving circuit layer and the light-emitting structure layer, wherein the light-shielding structure of the first light-shielding layer is disposed between the driving circuit layer and the planarization layer;

[0042] The manufacturing method further includes: forming a second transparent substrate layer between the driving circuit layer and the first transparent substrate layer, wherein the light-shielding structure of the second light-shielding layer is disposed between the first transparent substrate layer and the second transparent substrate layer.

[0043] This disclosure also provides a display device, including any of the bottom-emitting display substrates described above or below.

[0044] After reading and understanding the accompanying diagrams and detailed descriptions, the other aspects can be understood.

[0045] Overview of the attached figures

[0046] Figure 1 is a schematic diagram of the scene where the in-vehicle display forms a reflection on the windshield;

[0047] Figure 2 is a schematic diagram of the viewing angle of the in-vehicle display;

[0048] Figure 3(a) is a cross-sectional view of a narrow-viewing-angle display substrate in the related art;

[0049] Figure 3(b) is a cross-sectional view of another narrow-viewing-angle display substrate in the related technology;

[0050] Figure 4 is one of the cross-sectional views of the bottom light-emitting display substrate provided in the embodiments of this disclosure;

[0051] Figure 5 is a schematic diagram of the bottom light-emitting display substrate in Figure 4 provided in an embodiment of this disclosure;

[0052] Figure 6(a) is one of the top views of the bottom light-emitting display substrate provided in the embodiment of this disclosure;

[0053] Figure 6(b) is a second top view of the bottom light-emitting display substrate provided in the embodiment of this disclosure;

[0054] Figure 6(c) is a third top view of the bottom light-emitting display substrate provided in the embodiment of this disclosure;

[0055] Figure 7 is a second cross-sectional view of the bottom light-emitting display substrate provided in the embodiment of this disclosure;

[0056] Figure 8 is a third cross-sectional view of the bottom light-emitting display substrate provided in the embodiments of this disclosure;

[0057] Figure 9 is a fourth cross-sectional view of the bottom light-emitting display substrate provided in the embodiments of this disclosure;

[0058] Figure 10 is a fifth cross-sectional view of the bottom light-emitting display substrate provided in the embodiments of this disclosure;

[0059] Figure 11 is a sixth cross-sectional view of the bottom light-emitting display substrate provided in the embodiments of this disclosure;

[0060] Figure 12 is a seventh cross-sectional view of the bottom light-emitting display substrate provided in the embodiment of this disclosure;

[0061] Figure 13 is the eighth cross-sectional view of the bottom light-emitting display substrate provided in the embodiment of this disclosure;

[0062] Figure 14 is a ninth cross-sectional view of the bottom-emitting display substrate provided in an embodiment of this disclosure.

[0063] Detailed Explanation

[0064] The technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art based on this disclosure are within the scope of protection of this disclosure.

[0065] Unless otherwise specified, the embodiments and features described in this disclosure can be combined arbitrarily with each other.

[0066] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this invention pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as “connected” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as “upper,” “lower,” “left,” and “right” are used only to indicate relative positional relationships, which may change accordingly when the absolute position of the described object changes.

[0067] To achieve narrow viewing angles in display devices, it is usually necessary to purchase expensive LCF (Light Control Film).

[0068] In addition, some display panel manufacturers have developed a technical solution in which 4 to 6 masks are added to the OLED display to create 4 to 6 layers of organic film to replace the purchased LCF film. The technical solution of this related technology will be illustrated below with reference to Figures 3(a) and 3(b).

[0069] Figures 3(a) and 3(b) show two different structures of OLED displays implemented using related technologies. These OLED displays are generally fabricated using the following process:

[0070] A1: A conventional TFT (Thin Film Transistor) layer 302 is prepared on the substrate layer 301, then a planarization layer 303 is prepared on the TFT layer 302, an electrode layer 304 and a pixel defining layer 305 are prepared on the planarization layer 303, and then an electroluminescent layer 306 is deposited and an encapsulation layer 307 is encapsulated.

[0071] Among them, the electrode layer 304 is usually an ITO / Ag / ITO (indium tin oxide / silver / indium tin oxide) layer.

[0072] A2: A black light-shielding layer 308 is prepared on the encapsulation layer 307, and then an organic planarization layer 309 with the thickest possible thickness is prepared. The thickness of the organic planarization layer 309 is preferably 3 μm to 10 μm.

[0073] The thickness of the organic planarization layer 309 directly determines the distance between the black light-shielding layer 310 and the black light-shielding layer 308, which has a direct impact on the viewing angle of the display. Currently, the maximum thickness of a single layer in mass-produced materials can reach 4µm.

[0074] A3: A black light-shielding layer 310 is prepared on the organic planarization layer 309, and an organic planarization layer 311 is prepared on the black light-shielding layer 310.

[0075] For the structure shown in Figure 3(a), the purpose of the organic planarization layer 311 is to planarize the black light-shielding layer 310 so that there is a complete surface during the module bonding process, and the thickness is only 2µm.

[0076] Depending on the different requirements for viewing angle, a black light-blocking layer 312 and a corresponding organic planarization layer 313 can be further added to the structure shown in Figure 3(a) to obtain the structure shown in Figure 3(b).

[0077] It can be seen that this technical solution is only applicable to top-emitting display devices. The structure shown in Figure 3(a) adds 4 masks to the conventional product, and the structure shown in Figure 3(b) adds 6 masks to the conventional product. The number of masks required is too large, the structure is complex, and the manufacturing cost is relatively high.

[0078] This illustrative embodiment provides a bottom-emitting display substrate that enables narrow viewing angle display and has advantages such as simple structure and low manufacturing cost.

[0079] Figure 4 is a cross-sectional view of a bottom-emitting display substrate provided in an embodiment of the present disclosure. Referring to Figure 4, the bottom-emitting display substrate includes: a first transparent substrate layer 401, a driving circuit layer 402, a light-emitting structure layer 403, an encapsulation layer 404, and a light-shielding layer 405.

[0080] The driving circuit layer 402 is disposed on one side of the first transparent substrate layer 401; the light-emitting structure layer 403 is disposed on the side of the driving circuit layer 402 away from the first transparent substrate layer 401; the encapsulation layer 404 is disposed on the side of the light-emitting structure layer away from the first transparent substrate layer 401; and the light-shielding layer 405 is disposed between the first transparent substrate layer 401 and the light-emitting structure layer 403.

[0081] The aforementioned driving circuit layer 402 can be understood as a TFT layer.

[0082] Furthermore, in this embodiment of the disclosure, "a film layer is transparent" can mean that the light transmittance of the film layer exceeds a preset value. This preset value can be determined according to actual needs, for example, it can be set to 80%, 85%, or 90%, etc.

[0083] In an exemplary embodiment, the bottom-emitting display substrate provided in the illustrative embodiment of this disclosure adopts a bottom-emitting design, that is, the light emitted by the light-emitting structure layer 403 will pass through the driving circuit layer 402 and the first transparent substrate layer 401 in sequence, and finally be emitted from the bottom of the first transparent substrate layer 401.

[0084] In order to realize the bottom light emission function of the display substrate, in one possible implementation, the light emission structure layer 403 may include: a transparent electrode layer 4031, an electroluminescent layer 4032, a reflective electrode layer 4033, and a pixel defining layer 4034.

[0085] The transparent electrode layer 4031 is disposed on the side of the driving circuit layer 402 away from the first transparent substrate layer 401, the electroluminescent layer 4032 is disposed on the side of the transparent electrode layer 4031 away from the first transparent substrate layer 401, the reflective electrode layer 4033 is disposed on the side of the electroluminescent layer 4032 away from the first transparent substrate layer 401, and the pixel defining layer 4034 is disposed between the transparent electrode layer 4031 and the electroluminescent layer 4032.

[0086] In one exemplary embodiment, the pixel defining layer 4034 has multiple pixel openings, and the transparent electrode layer 4031 and the electroluminescent layer 4032 are correspondingly disposed within the pixel openings. Based on this, the pixel defining layer 4034 defines the transparent electrode layer 4031, the electroluminescent layer 4032, and the reflective electrode layer 4033 into multiple pixel structures. Depending on the color of the electroluminescent layer 4032, these pixel structures can be pixel structures of different colors, as shown in Figure 4, which illustrates a red pixel structure R, a green pixel structure G, and a blue pixel structure B.

[0087] In one exemplary embodiment, the light emitted by the electroluminescent layer 4032 is reflected by the reflective electrode layer 4033, and then emitted from the transparent electrode layer 4031 side to the light-emitting structure layer 403, and finally emitted from the first transparent substrate layer 401, thereby realizing the bottom light-emitting function.

[0088] In one exemplary implementation, a planarization layer 406 is typically provided between the driving circuit layer 402 and the light-emitting structure layer 403.

[0089] In order to control the viewing angle of the bottom light-emitting display substrate, this embodiment of the present disclosure also provides a light-shielding layer 405 between the first transparent substrate layer 401 and the light-emitting structure layer 403. The multiple light-shielding structures included in the light-shielding layer 405 block part of the light emitted from the light-emitting structure layer 403, thereby limiting the angle of the light emitted from the first transparent substrate layer 401, thereby realizing a narrow viewing angle display of the display substrate.

[0090] Referring to Figure 4, taking pixel structure R as an example, some of the light emitted by this pixel structure is blocked by the light-shielding structure and cannot escape to the outside of the display substrate. The same applies to the light emitted by pixel structures G and B. Combined with Figure 5, it can be seen that the human eye can receive the light emitted by the display substrate at a small viewing angle a, but cannot receive the light at a large viewing angle b. Therefore, the viewing angle of this display substrate is limited, achieving a narrow viewing angle display.

[0091] The following provides a detailed explanation of the setting of the light-shielding structure with reference to exemplary examples:

[0092] In one exemplary embodiment, the pixel structures within the light-emitting structure layer 403 are arranged along the row and column directions to form multiple pixel rows and multiple pixel columns. Referring to Figures 6(a), 6(b), and 6(c), several different top views of the display substrate provided in this embodiment are illustrated, showing the distribution of the light-shielding structure (the black area in the figures) and the pixel structures R, G, and B. It can be seen that the pixel structures form three pixel rows and three pixel columns. In practical applications, the light-shielding structure can be designed according to the arrangement shown in Figures 6(a), 6(b), or 6(c) to achieve directional control of the viewing angle.

[0093] Referring to Figure 6(a), the light-shielding structure extends along the row direction, and the projection of the light-shielding structure on the first transparent substrate 401 is located between the projections of two pixel rows. Combining the illustrations in Figures 4 and 5, it can be understood that when the light-shielding structure is arranged as shown in Figure 6(a), compared to a display substrate without a light-shielding structure, the viewing angle in the row direction remains unchanged, while the viewing angle in the column direction is restricted. This is suitable for applications requiring control of the vertical viewing angle of the display. For example, the display substrate provided in Figure 4 can be applied to the display illustrated in Figure 1(a), and the light-shielding structure can be designed to be arranged as shown in Figure 6(a). In this way, the vertical viewing angle of the display is restricted, preventing reflections on the windshield during nighttime driving, achieving the effect shown in Figure 1(b).

[0094] Referring to Figure 6(b), the light-shielding structure extends along the column direction, and its projection onto the first transparent substrate 401 lies between the projections of two pixel rows. Combining this with the illustrations in Figures 4 and 5, it can be understood that when the light-shielding structure is arranged as shown in Figure 6(b), compared to a display substrate without a light-shielding structure, the viewing angle in the column direction remains unchanged, while the viewing angle in the row direction is limited. This is suitable for applications requiring control of the horizontal viewing angle of the display. For example, the display substrate provided in Figure 4 can be applied to the display illustrated in Figure 2, and the light-shielding structure can be arranged as shown in Figure 6(b). In this way, the horizontal viewing angle of the display is limited, and the content displayed on the display will not interfere with the driver's view.

[0095] Referring to Figure 6(c), the light-shielding structure extends along both the row and column directions. The projection of the light-shielding structure onto the first transparent substrate 401 lies between the projections of two pixel rows in the row direction and between the projections of two pixel columns in the column direction. Combining the illustrations in Figures 4 and 5, it can be understood that when the light-shielding structure is arranged as shown in Figure 6(c), compared to a display substrate without a light-shielding structure, the viewing angle in both the row and column directions is limited. This is suitable for applications requiring control over the horizontal and vertical viewing angles of the display. For example, when it is undesirable for a display used for passenger entertainment functions to interfere with the driver's driving, or for the display to cast a reflection on the windshield during nighttime driving, the display substrate provided in Figure 4 can be used on the display, and the light-shielding structure can be arranged as shown in Figure 6(c).

[0096] The above describes how to orient the viewing angle of the display substrate. The size of the viewing angle can be controlled by adjusting the distance between the light-shielding layer 405 and the electroluminescent layer 4032, and the relative positional relationship between the light-shielding structure in the light-shielding layer 405 and the boundary of the pixel opening region in the pixel defining layer 4034. In one possible implementation, when multiple light-shielding layers are further disposed between the first transparent substrate 401 and the driving circuit layer 402, the distance between each light-shielding layer and the electroluminescent layer 4032 will affect the size of the viewing angle.

[0097] In one possible implementation, the projection of the light-shielding structure onto the first transparent substrate 401 is located within the projection range of the pixel defining layer 4034 onto the first transparent substrate 401. In an exemplary embodiment, the projection of the pixel defining layer 4034 onto the first transparent substrate 401 can be the projection of a non-pixel opening area within the pixel defining layer 4034. Therefore, by setting the projection of the light-shielding structure onto the first transparent substrate 401 to be within the projection range of the pixel defining layer 4034 onto the first transparent substrate 401, it can be ensured that the light-shielding structure does not block the light emitted from the pixel structure in a direction perpendicular to the surface of the first transparent substrate 401, and the light-shielding structure can be prevented from affecting the normal display of the display substrate.

[0098] Depending on the required viewing angle, a light-shielding layer can be set on the side of the driving circuit layer 402 away from the first transparent substrate layer 401, or a light-shielding layer can be set between the driving circuit layer 402 and the first transparent substrate layer 401, or a corresponding light-shielding layer can be set at both locations. These situations will be described in conjunction with exemplary embodiments below.

[0099] In one exemplary embodiment, a certain distance needs to be separated between the light-shielding layer 405 and the light-emitting structure layer 403 to ensure that the light-shielding layer 405 can achieve a better effect of limiting the viewing angle and facilitate the control of the viewing angle size. This is the purpose of setting the organic planarization layer 309 in the structure shown in FIG3(a). Furthermore, since the structure shown in FIG3(a) is a top-emitting device, after setting the black light-shielding layer 310 on the light-emitting side of the device, it is necessary to further prepare an organic planarization layer 311 on the black light-shielding layer 310 as the outermost layer of the display substrate, resulting in too many additional film layers in the conventional display substrate structure.

[0100] The bottom-emitting display substrate provided in this embodiment adopts a bottom-emitting design. The light emitted from the light-emitting structure layer 403 passes sequentially through the driving circuit layer 402 and the first transparent substrate layer 401, and finally exits from the first transparent substrate layer 401. By providing a light-shielding layer 405 between the light-emitting structure layer 403 and the first transparent substrate layer 401, the viewing angle of the bottom-emitting display substrate can be limited. Furthermore, by controlling the distance between the light-shielding layer 405 and the light-emitting structure layer 403, or by planarizing the light-shielding layer 405, the film layer structures that would normally be provided on the three light-emitting sides of the light-emitting structure layer 40 can be reused. Compared to conventional display substrate structures, fewer additional film layers are required, resulting in a simpler structure and lower manufacturing costs.

[0101] The film structure of the bottom-emitting display substrate provided in this disclosure will be described below with reference to exemplary embodiments:

[0102] As shown in Figure 4, the light-shielding structure of the light-shielding layer 405 is disposed between the driving circuit layer 402 and the planarization layer 406 in the display substrate.

[0103] As can be seen, for the display substrate shown in Figure 4, the light emitted by the electroluminescent layer 4032 will be transmitted through the transparent electrode layer 4031 to the planarization layer 406. The light shielding layer 405 blocks part of the light entering the planarization layer 406, and the remaining light will further enter the driving circuit layer 402 and finally exit from the first transparent substrate layer 401, realizing a narrow viewing angle display with bottom light emission.

[0104] The fabrication process of the display substrate shown in Figure 4 is described below, including the following steps:

[0105] B1: A driving circuit layer 402 is prepared on the first transparent substrate layer 401, and a light-shielding layer 405 is prepared above the driving circuit layer 402.

[0106] The first transparent substrate 401 can be a conventional glass substrate or a transparent flexible substrate, depending on the actual needs.

[0107] For example, the light-shielding layer 405 can be prepared by coating a black photosensitive material with photoresist and then performing an exposure and development process. For instance, the black photosensitive material can be PSPI (Photosensitive Polyimide). Alternatively, the light-shielding layer 405 can be patterned using a black metal.

[0108] In one exemplary embodiment, the driving circuit layer 402 may include various structures constituting a TFT (Thin Film Transistor), such as a gate, source / drain 4021 (shown in FIG. 7), and active region. In one example, the traces associated with the TFT may be arranged in the driving circuit layer 402, and their arrangement can be found in related technologies, which are not specifically limited in this disclosure. Generally, the source / drain 4021 is an opaque metal structure. Therefore, in the display substrate shown in FIG. 7, in order to prevent the source / drain 4021 from blocking light emission, the position of the source / drain 4021 in the direction perpendicular to the display substrate may coincide with the position of the light-shielding structure, that is, the first projection (the projection of the source / drain 4021 on the first transparent substrate 401) is inside the second projection (the projection of the light-shielding structure on the first transparent substrate 401).

[0109] In one possible implementation, the thickness of the light-shielding layer 405 is between 1.5 μm and 2.5 μm.

[0110] B2: Prepare planarization layer 406.

[0111] In one exemplary embodiment, the fabrication of the planarization layer 406 is related to the arrangement of the source / drain electrodes 4021 in the driver circuit layer 402. The example in Figure 4 shows a single SD (source / drain) 4021 structure, therefore only one planarization layer is provided. Exemplarily, the thickness of the planarization layer 406 can be between 1.5 μm and 3 μm. Depending on the product thickness, the thickness of the planarization layer to be fabricated varies. For example, for 3SD devices, three planarization layers need to be stacked in this step, each with a thickness between 1.5 μm and 3 μm, resulting in a total thickness of 4.5 μm to 9 μm.

[0112] As can be seen, in this embodiment of the present disclosure, the planarization layer 406 plays the basic role of planarizing the SD, and also has the additional effect of planarizing the light-shielding layer 405.

[0113] B3: A pixel defining layer 4034 and a transparent electrode layer 4031 are fabricated on the planarization layer 406.

[0114] For example, the transparent electrode layer can be made of ITO (indium tin oxide) material.

[0115] B4: Evaporate the electroluminescent layer 4032 and the reflective electrode layer 4033, and encapsulate them with the encapsulation layer 404. The display substrate fabrication is now complete.

[0116] For example, the reflective electrode layer 4033 can be made of Ag (silver) material.

[0117] As can be seen from the descriptions in B1 to B4, the solution provided in Figure 4 only requires adding one mask to the traditional product structure, and can achieve two different application scenarios, flexible and rigid, depending on the selected substrate material.

[0118] In one possible implementation, to further ensure the limiting effect on the viewing angle of the display substrate, a black material can be used to fabricate the pixel defining layer 4034 on the bottom-emitting display substrate shown in Figure 4, making the pixel defining layer 4034 specifically a black pixel defining layer. The specific structure of the resulting bottom-emitting display substrate is shown in Figure 8. The only difference between the display substrate shown in Figure 8 and the display substrate shown in Figure 4 is the color of the pixel defining layer 4034; therefore, please refer to the previous explanation of Figure 4 for details.

[0119] Figure 9 is a cross-sectional view of another bottom-emitting display substrate provided in an embodiment of this disclosure. Referring to Figure 9, the bottom-emitting display substrate includes: a first transparent substrate layer 901, a driving circuit layer 902, a light-emitting structure layer 903, an encapsulation layer 904, and a planarization layer 906. The light-emitting structure layer 903 includes a transparent electrode layer 9031, an electroluminescent layer 9032, a reflective electrode layer 9033, and a pixel defining layer 9034. The above-described film structure corresponds to the film structure shown in Figure 4, and can be referred to the preceding description for details.

[0120] Furthermore, the bottom light-emitting display substrate also includes a light-shielding layer 905 disposed between the driving circuit layer 902 and the first transparent substrate layer 901. In an exemplary embodiment, in the bottom light-emitting display substrate shown in FIG9, a second transparent substrate layer 907 is also disposed between the first transparent substrate layer 901 and the driving circuit layer 902, and the light-shielding structure of the light-shielding layer 905 is specifically disposed between the first transparent substrate layer 901 and the second transparent substrate layer 907.

[0121] In one possible implementation, a first transparent isolation layer 908 may be provided between the first transparent substrate layer 901 and the second transparent substrate layer 907.

[0122] For the display substrate shown in Figure 9, the light emitted by the electroluminescent layer 9032 will pass through the transparent electrode layer 9031, the planarization layer 906, and the driving circuit layer 902 in sequence before reaching the second transparent substrate layer 907. The light-shielding layer 905 blocks part of the light entering the second transparent substrate layer 907, and the remaining light further enters the first transparent substrate layer 901 and finally exits from the bottom of the first transparent substrate layer 901, realizing a narrow viewing angle display with bottom light emission.

[0123] The fabrication process of the display substrate shown in Figure 9 is described below, including the following steps:

[0124] C1: Prepare a first transparent substrate layer 901, and prepare an inorganic first transparent isolation layer 908 on the first transparent substrate layer 901.

[0125] In this step, it can be selected whether to prepare the first transparent isolation layer 908 according to actual needs.

[0126] The first transparent substrate 901 can be a conventional glass substrate or a flexible substrate, depending on the actual needs. For example, the first transparent substrate 901 can be made of CPI (Polyimide) material.

[0127] C2: Prepare a light-shielding layer 905 on the first transparent isolation layer 908, and then prepare a second transparent base layer 907 on it for planarization.

[0128] The preparation of the light-shielding layer 905 is similar to that of the light-shielding layer 405. It can be directly patterned by exposure and development of black photosensitive material, or it can be patterned using materials such as black metal.

[0129] For example, since the light-shielding layer 905 needs to be planarized by the second transparent substrate layer 907, the second transparent substrate layer 907 can be made of CPI material in order to facilitate the preparation of the second transparent substrate layer 907. In this step, the preparation of the second transparent substrate layer 907 can be achieved by coating the light-shielding layer 905 with CPI material and performing curing treatment.

[0130] The thickness of the second transparent substrate 907 can be adjusted according to the required optical viewing angle. For example, the thickness of the second transparent substrate 907 can be between 3µm and 20µm.

[0131] C3: Fabricate driving circuit layer 902 and planarization layer 906, and fabricate pixel defining layer 9034 and transparent electrode layer 9031 on planarization layer 906.

[0132] For step C3, please refer to the previous explanations for B2 and B3.

[0133] C4: Evaporate the electroluminescent layer 9032 and the reflective electrode layer 9033, and encapsulate them with the encapsulation layer 904. The display substrate fabrication is now complete.

[0134] As can be seen from C1 to C4, the solution provided in Figure 9 only requires adding one mask to the traditional product structure, and can achieve two different application scenarios, flexible and rigid, depending on the selected substrate material.

[0135] In one possible implementation, to further ensure the limiting effect on the viewing angle of the display substrate, a pixel defining layer 9034 can be fabricated using a black material, based on the bottom-emitting display substrate shown in Figure 8, making the pixel defining layer 9034 specifically a black pixel defining layer. The specific structure of the resulting bottom-emitting display substrate is shown in Figure 10. The only difference between the display substrate shown in Figure 10 and the display substrate shown in Figure 9 is the color of the pixel defining layer 9034; therefore, please refer to the previous explanation of Figure 9 for details.

[0136] Figure 11 is another cross-sectional view of the bottom-emitting display substrate provided in an embodiment of this disclosure. Referring to Figure 10, the display substrate includes: a first transparent substrate layer 1101, a driving circuit layer 1102, a light-emitting structure layer 1103, an encapsulation layer 1104, a planarization layer 1106, a second transparent substrate layer 1107, and a first transparent isolation layer 1108. The light-emitting structure layer 1103 includes a transparent electrode layer 11031, an electroluminescent layer 11032, a reflective electrode layer 11033, and a pixel defining layer 11034. The above-described film structure corresponds to the film structure shown in Figure 9, and can be referred to the preceding description for details.

[0137] Furthermore, in the display substrate shown in FIG11, light-shielding layers are provided on the side of the driving circuit layer 1102 away from the first transparent substrate layer 1101, and between the first transparent substrate layer 1101 and the driving circuit layer 1102. For easy distinction, these two light-shielding layers are referred to as light-shielding layer 11051 and light-shielding layer 11052, respectively.

[0138] Based on this, the light-shielding structure of the light-shielding layer 11051 is disposed between the driving circuit layer 1102 and the planarization layer 1106, while the light-shielding structure of the light-shielding layer 11052 is disposed between the first transparent substrate layer 1101 and the second transparent substrate layer 1107.

[0139] For the display substrate shown in Figure 11, the light emitted by the electroluminescent layer 11032 will pass through the transparent electrode layer 11031 and enter the planarization layer 1106. The light-shielding layer 11051 blocks part of the light entering the planarization layer 1106, and the remaining light further passes through the driving circuit layer 1102 and enters the second transparent substrate layer 1107. The light-shielding layer 11052 blocks part of the light entering the second transparent substrate layer 1107 a second time, and the remaining light further enters the first transparent substrate layer 1101 and exits from the bottom of the first transparent substrate layer 1101, realizing a narrow viewing angle display with bottom light emission.

[0140] The fabrication process of the display substrate shown in Figure 11 is described below, including the following steps:

[0141] D1: Prepare a first transparent substrate layer 1101, and prepare an inorganic first transparent isolation layer 1108 on the first transparent substrate layer 1101.

[0142] This step can be referred to in the previous explanation for C1.

[0143] D2: A light-shielding layer 11052 is prepared on the first transparent isolation layer 1108, and a second transparent base layer 1107 is prepared on it for planarization.

[0144] This step can be referred to in the previous explanation for C2.

[0145] D3: Prepare the driving circuit layer 1102, and prepare the light-shielding layer 11051 on the driving circuit layer 1102.

[0146] The preparation of the light-shielding layer 11051 can be referred to the previous explanation for B1.

[0147] D4: Prepare a planarization layer 1106, and prepare a pixel defining layer 11034 and a transparent electrode layer 11031 on the planarization layer 1106.

[0148] For step C3, please refer to the previous explanations for B2 and B3.

[0149] D5: Evaporate the electroluminescent layer 11032 and the reflective electrode layer 11033, and encapsulate them with the encapsulation layer 1104. The fabrication of the display substrate is now complete.

[0150] As can be seen from the descriptions of D1 to D5, the solution provided in Figure 11 only requires adding two masks to the traditional product structure, and can achieve two different application scenarios, flexible and rigid, depending on the selected substrate material.

[0151] In one possible implementation, to further ensure the limiting effect on the viewing angle of the display substrate, a pixel defining layer 11034 can be fabricated using a black material, based on the bottom-emitting display substrate shown in Figure 11, making the pixel defining layer 11034 specifically a black pixel defining layer. The specific structure of the resulting bottom-emitting display substrate is shown in Figure 12. The only difference between the display substrate shown in Figure 12 and the display substrate shown in Figure 11 is the color of the pixel defining layer 11034; therefore, please refer to the previous description of Figure 11 for details.

[0152] Figure 13 is another cross-sectional view of the bottom-emitting display substrate provided in an embodiment of this disclosure. Referring to Figure 13, the display substrate includes: a first transparent substrate layer 1301, a driving circuit layer 1302, a light-emitting structure layer 1303, an encapsulation layer 1304, a planarization layer 1306, a second transparent substrate layer 1307, and a first transparent isolation layer 1308. The light-emitting structure layer 1303 includes a transparent electrode layer 13031, an electroluminescent layer 13032, a reflective electrode layer 13033, and a pixel defining layer 13034. The above-described film structure corresponds to the film structure shown in Figure 8, and can be referred to the preceding description.

[0153] Furthermore, in the bottom-emitting display substrate shown in Figure 13, a through-hole penetrating the second transparent substrate 1307 is provided on the second transparent substrate 1307. The light-shielding layer 1305 is disposed in the same layer as the second transparent substrate 1307, and the light-shielding structure of the light-shielding layer 1305 is located within the through-hole. In an exemplary embodiment, depending on the desired optical viewing angle, the thickness of the second transparent substrate 1307 can be between 3 μm and 20 μm. Therefore, it can be seen that a relatively deep black light-shielding layer sidewall exists in the display substrate shown in Figure 13.

[0154] Furthermore, a second transparent insulating layer 1309 is provided between the second transparent substrate layer 1307 and the driving circuit layer 1302. This second transparent insulating layer 1309 can be used to assist in the fabrication of the light-shielding layer 1305, and its purpose will be explained later. In this case, the through-hole mentioned above that penetrates the second transparent substrate layer 1307 penetrates the second transparent insulating layer 1309, and the light-shielding structure of the light-shielding layer 1305 fills the through-hole.

[0155] For the display substrate shown in Figure 13, the light emitted by the electroluminescent layer 13032 will pass through the transparent electrode layer 13031, the planarization layer 1306, and the driving circuit layer 1302 in sequence to reach the second transparent substrate layer 1307. The light-shielding layer 1305 blocks part of the light that shines on the second transparent substrate layer 1307, and the remaining light further enters the first transparent substrate layer 1301 and finally exits from the bottom of the first transparent substrate layer 1301, realizing a narrow viewing angle display with bottom light emission.

[0156] The fabrication process of the display substrate shown in Figure 13 is described below, including the following steps:

[0157] E1: An inorganic first transparent isolation layer 1308 is prepared on the first transparent substrate layer 1301.

[0158] In this step, it can be selected whether to prepare the first transparent isolation layer 1308 according to actual needs.

[0159] The first transparent substrate 1301 can be a conventional glass substrate or a flexible substrate, for example, it can be made of CPI material.

[0160] E2: A second transparent substrate layer 1307 is prepared on the first transparent isolation layer 1308, and a second transparent isolation layer 1309 is prepared on the second transparent substrate layer 1307.

[0161] For example, the second transparent substrate 1307 may be made of CPI material, and as mentioned above, the thickness of the second transparent substrate 1307 may be between 3 μm and 20 μm, depending on the desired optical viewing angle.

[0162] For example, the second transparent isolation layer 1309 can be made of transparent inorganic materials such as SiO (silicon monoxide) and SiNx (silicon nitride).

[0163] E3: The second transparent isolation layer 1309 is patterned by exposure and development, and the second transparent isolation layer 1309 is used as a hard mask to etch the second transparent substrate layer 1307 to form a deep hole (i.e., the aforementioned through hole) that cannot be achieved by conventional processes. The deep hole is filled with black light-blocking material to form the light-blocking structure contained in the light-blocking layer 1305.

[0164] In one exemplary embodiment, the deep hole depth that the above process can achieve is above 3 μm, and can reach a maximum of 20 μm.

[0165] Furthermore, the above process does not require the black opaque material to be photosensitive, so many conventional black organic materials can be used for filling deep holes.

[0166] In one exemplary embodiment, after filling the deep holes in the second transparent substrate layer 1307 and the second transparent isolation layer 1309 with black light-shielding material, the surfaces of the light-shielding layer 1305 and the second transparent isolation layer 1309 on the light-facing side may have microscopic morphological irregularities. Therefore, in one possible implementation, as shown in FIG14, after completing the filling with black light-shielding material, an organic layer 1310 can be further prepared to achieve planarization of the light-shielding layer 1305 and the second transparent isolation layer 1309.

[0167] For example, CPI material can be used to prepare the organic layer 1310. That is, after the black light-blocking material is filled, CPI material is coated on the light-blocking layer 1305 and the second transparent isolation layer 1309 to completely flatten the uneven microstructure.

[0168] E4: Fabricate driving circuit layer 1302 and planarization layer 1306, and fabricate pixel defining layer 13034 and transparent electrode layer 13031 on planarization layer 1306.

[0169] E5: Evaporate the electroluminescent layer 13032 and the reflective electrode layer 13033, and encapsulate them with the encapsulation layer 1304. The display substrate fabrication is now complete.

[0170] As can be seen from the descriptions of E1 to E5, the solution provided in Figure 13 only requires one mask, one exposure and one etching on the traditional product structure to achieve a relatively deep black light-shielding layer sidewall in the bottom light-emitting display substrate.

[0171] Based on the above description of Figure 4 and Figures 8 to 14, it can be seen that the bottom-emitting display substrate provided in this disclosure, when a light-shielding layer for limiting the viewing angle of the display substrate is provided between the light-emitting structure layer and the first transparent substrate layer, only requires the addition of a few film layers to the conventional product structure, and all have the advantages of simple structure and low manufacturing cost.

[0172] In summary:

[0173] The bottom-emitting display substrate provided in this embodiment includes a first transparent substrate layer, a driving circuit layer, a light-emitting structure layer, an encapsulation layer, and a light-shielding layer. The driving circuit layer is disposed on one side of the first transparent substrate layer. The light-emitting structure layer is disposed on the side of the driving circuit layer away from the first transparent substrate layer, and the encapsulation layer is disposed on the side of the light-emitting structure layer away from the first transparent substrate layer. Thus, the light emitted by the light-emitting structure layer will sequentially penetrate the driving circuit layer and the first transparent substrate layer, and finally be emitted from the first transparent substrate layer, thereby achieving bottom light emission.

[0174] The bottom-emitting display substrate provided in this embodiment adopts a bottom-emitting design. By setting a light-shielding layer between the first transparent substrate layer and the light-emitting structure layer, and the light-shielding layer includes light-shielding structures extending along the row direction and / or column direction, these light-shielding structures can block part of the light emitted from the light-emitting structure layer, thereby limiting the angle of the light emitted from the first transparent substrate layer, thereby achieving a narrow viewing angle display in the row direction and / or column direction.

[0175] In this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, without necessarily requiring or implying any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0176] The various embodiments in this specification are described in a related manner. For the same or similar parts among the various embodiments, please refer to each other. Each embodiment focuses on describing the differences from other embodiments.

[0177] The above description is merely a preferred embodiment of this disclosure and is not intended to limit the scope of protection of this disclosure. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure are included within the scope of protection of this disclosure.

Claims

1. A bottom emission display substrate, comprising: The first transparent substrate layer, the driving circuit layer, the light-emitting structure layer, the encapsulation layer and the light-blocking layer; The driving circuit layer is arranged on one side of the first transparent substrate layer; The light-emitting structure layer is arranged on the side of the driving circuit layer away from the first transparent substrate layer, the encapsulation layer is arranged on the side of the light-emitting structure layer away from the first transparent substrate layer, and the light-blocking layer is arranged between the first transparent substrate layer and the light-emitting structure layer; The light-emitting structure layer comprises a plurality of pixel structures arranged along the row direction and the column direction to form a plurality of pixel rows and a plurality of pixel columns; The light-blocking layer comprises a plurality of light-blocking structures, at least part of the light-blocking structures extend along the row direction, and the projection of the light-blocking structure on the first transparent substrate layer is located between the projections of two pixel rows; and / or, at least part of the light-blocking layer comprises a plurality of light-blocking structures, the light-blocking structures extend along the column direction, and the projection of the light-blocking structure on the first transparent substrate layer is located between the projections of two pixel columns. 2.The bottom emission display substrate of claim 1, wherein, The light-emitting structure layer comprises a transparent electrode layer, an electroluminescent layer, a reflective electrode layer and a pixel definition layer; The transparent electrode layer is arranged on the side of the driving circuit layer away from the first transparent substrate layer, the electroluminescent layer is arranged on the side of the transparent electrode layer away from the first transparent substrate layer, the reflective electrode layer is arranged on the side of the electroluminescent layer away from the first transparent substrate layer, and the pixel definition layer is arranged between the transparent electrode layer and the electroluminescent layer, and the pixel definition layer defines the transparent electrode layer, the electroluminescent layer and the reflective electrode layer as the plurality of pixel structures.

3. The bottom emission display substrate of claim 2, wherein, A planarization layer is further arranged between the driving circuit layer and the light-emitting structure layer, and the light-blocking structure is arranged between the driving circuit layer and the planarization layer.

4. The bottom emission display substrate of claim 2, wherein, A second transparent substrate layer is further arranged between the driving circuit layer and the first transparent substrate layer, and the light-blocking structure is arranged between the first transparent substrate layer and the second transparent substrate layer.

5. The bottom emission display substrate of claim 2, wherein, The light-blocking layer comprises a first light-blocking layer and a second light-blocking layer; A planarization layer is further arranged between the driving circuit layer and the light-emitting structure layer, and the light-blocking structure of the first light-blocking layer is arranged between the driving circuit layer and the planarization layer; a second transparent substrate layer is further arranged between the driving circuit layer and the first transparent substrate layer, and the light-blocking structure of the second light-blocking layer is arranged between the first transparent substrate layer and the second transparent substrate layer.

6. The bottom emission display substrate of claim 2, wherein, A second transparent substrate layer is further arranged between the driving circuit layer and the first transparent substrate layer, and a through hole penetrating through the second transparent substrate layer in thickness is arranged on the second transparent substrate layer, and the light-blocking structure is located in the through hole.

7. The bottom emission display substrate according to any one of claims 4 to 6, wherein, A first transparent isolation layer is further arranged between the first transparent substrate layer and the second transparent substrate layer.

8. The bottom emission display substrate of claim 6, wherein, A second transparent isolation layer is further arranged between the second transparent substrate layer and the driving circuit layer, and the through hole further penetrates through the second transparent isolation layer. 9.The bottom emission display substrate of any one of claims 2 to 6, wherein, The projection of the light-blocking structure on the first transparent substrate layer is located within the projection range of the pixel definition layer on the first transparent substrate layer. 10.The bottom emission display substrate of any one of claims 2 to 6, wherein, The pixel defining layer is a black pixel defining layer. 11.The bottom emission display substrate of any one of claims 2 to 6, wherein, The light shielding structure is made by exposing and developing a black photosensitive material. 12.The bottom emission display substrate of claim 8, wherein, The second transparent isolation layer is made by exposure and development, and the second transparent substrate layer is made by etching the second transparent isolation layer as a hard mask.

13. The bottom emission display substrate according to any one of claims 1 to 5, wherein, The thickness of the light shielding layer is between 1.5um and 2.5um.

14. The bottom emission display substrate according to claim 5 or 6, wherein, The thickness of the second transparent substrate layer is between 3um and 20um.

15. A manufacturing method of a bottom emission display substrate, comprising: forming a first transparent substrate layer; forming a driving circuit layer, the driving circuit layer being disposed on one side of the first transparent substrate layer; forming a light emitting structure layer, the light emitting structure layer being disposed on a side of the driving circuit layer away from the first transparent substrate layer, the light emitting structure layer comprising a plurality of pixel structures arranged along a row direction and a column direction, forming a plurality of pixel rows and a plurality of pixel columns; forming an encapsulation layer, the encapsulation layer being disposed on a side of the light emitting structure layer away from the first transparent substrate layer; forming a light shielding layer, the light shielding layer being disposed between the first transparent substrate layer and the light emitting structure layer, the light shielding layer comprising a plurality of light shielding structures, at least part of the light shielding structures extending along the row direction, and a projection of the light shielding structures on the first transparent substrate layer being located between projections of two pixel rows; and / or, at least part of the light shielding layer comprising a plurality of light shielding structures, the light shielding structures extending along the column direction, and a projection of the light shielding structures on the first transparent substrate layer being located between projections of two pixel columns.

16. The manufacturing method according to claim 15, wherein forming the light emitting structure layer comprises forming a transparent electrode layer, an electroluminescent layer, a reflective electrode layer and a pixel defining layer of the light emitting structure layer; the transparent electrode layer is disposed on a side of the driving circuit layer away from the first transparent substrate layer, the electroluminescent layer is disposed on a side of the transparent electrode layer away from the first transparent substrate layer, the reflective electrode layer is disposed on a side of the electroluminescent layer away from the first transparent substrate layer; the pixel defining layer is disposed between the transparent electrode layer and the electroluminescent layer, and the pixel defining layer defines the transparent electrode layer, the electroluminescent layer and the reflective electrode layer as the plurality of pixel structures.

17. The manufacturing method of claim 15, further comprising: forming a planarization layer between the driving circuit layer and the light emitting structure layer, the light shielding structure being disposed between the driving circuit layer and the planarization layer.

18. The manufacturing method of claim 15, further comprising: forming a second transparent substrate layer between the driving circuit layer and the first transparent substrate layer, the light shielding structure being disposed between the first transparent substrate layer and the second transparent substrate layer.

19. The manufacturing method of claim 15, wherein: forming the light shielding layer comprises forming a first light shielding layer and a second light shielding layer of the light shielding layer; the manufacturing method further comprises forming a planarization layer between the driving circuit layer and the light emitting structure layer, wherein the light shielding structures of the first light shielding layer are disposed between the driving circuit layer and the planarization layer. The manufacturing method further includes: forming a second transparent substrate layer between the driving circuit layer and the first transparent substrate layer, wherein the light-shielding structure of the second light-shielding layer is arranged between the first transparent substrate layer and the second transparent substrate layer.

20. A display device comprising the bottom-emission display substrate according to any one of claims 1 to 14. ​

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