High-precision conditioning tool and manufacturing method therefor

Abstract

The present application relates to the technical field of CMP (chemical-mechanical polishing) and relates in particular to a high-precision conditioning tool and a manufacturing method therefor. The high-precision conditioning tool comprises a disk and diamond pieces; a plurality of diamond pieces are provided, and all the diamond pieces are provided on the disk and are distributed at intervals along the axis of the disk; a protrusion is formed on each diamond piece, the protrusion is tower-shaped, the protrusion has a multi-layer structure, and each layer structure of the protrusion is formed with horizontal edges and inclined sides edges. The present application has the effect of improving the conditioning capability of the conditioning tool so as to improve the conditioning precision of the conditioning tool.

Description

A high-precision dressing tool and its manufacturing method Technical Field

[0001] This application relates to the field of CMP (chemical mechanical polishing) technology, and in particular to a high-precision dressing tool and its manufacturing method. Background Technology

[0002] Chemical mechanical polishing (CMP) is an advanced microelectronics process widely used in semiconductor manufacturing and other microelectronics fields. This technology combines chemical reactions and mechanical friction to etch or smooth high points on a surface, resulting in a smoother surface and improved device performance and reliability. This polishing process typically requires the wafer to be pressed against a rotating pad made of a durable organic material (such as polyurethane). A chemical polishing slurry containing materials that can damage the wafer, as well as abrasive particles (for physically polishing the wafer surface), is continuously applied to the rotating CMP polishing pad. The combined chemical and mechanical forces apply to the wafer to polish it in the desired manner.

[0003] With the widespread application of semiconductor CMP technology, the market has placed higher demands on the dressing accuracy, service life, and reliability of polishing pad dressing tools. Existing technologies are mainly divided into two categories: one is electroplated or brazed diamond polishing pad dressers, where diamond particles are electroplated or brazed onto the polishing pad dresser substrate, and the exposed diamond crystal portion is used for dressing the polishing pad. The disadvantage is that the exposed diamond height is uncontrollable, and the dressing accuracy is greatly affected by the difference in diamond exposed height. Electroplated or brazed diamond polishing pad dressers are subjected to lateral forces during operation, which may pose a risk of small diamond particles falling off. If these small diamond particles fall into the wafer polishing area, it will cause the wafer to be scrapped. Furthermore, the service life of this type of product is also affected by the sharpness of the exposed diamond particles.

[0004] The second type is the CVD diamond polishing dresser. Uniform protrusions are engraved on the surface of CVD single-crystal diamond, and the single-crystal CVD sheet is then adhered to the polishing pad dresser substrate. Typically, 6-8 CVD single-crystal diamonds are arranged in a ring. The advantages are controllable diamond protrusion height, high dressing precision, and a longer service life than electroplated or brazed polishing pad dressers. The disadvantages are higher cost, and if the diamond spacing is too large, working gaps may occur during the alternating dressing of the CVD single-crystal diamonds, affecting the dressing effect. Currently, common protrusions on the surface of CVD single-crystal diamonds include hexagonal protrusions, pyramidal protrusions, or frustum protrusions. During processing, sharp corners are prone to breakage, and the dressing precision of the polishing dresser is affected by the flatness of the diamond sheet and the protrusions.

[0005] Therefore, designing a dresser with stronger dressing capabilities and higher dressing precision is an urgent problem to be solved. Summary of the Invention

[0006] In order to improve the dressing capability of the dresser and thus improve its dressing accuracy, this application provides a high-precision dressing tool and its manufacturing method.

[0007] The high-precision dressing tool and its manufacturing method provided in this application adopt the following technical solution.

[0008] A high-precision dressing tool includes a disc and a plurality of diamond blades, all of which are disposed on the disc and spaced apart along the axis of the disc. The diamond blades are formed with protrusions, which are tower-shaped and have a multi-layered structure. Each layer of the protrusion is formed with horizontal ridges and inclined side ridges.

[0009] By adopting the above technical solution, each diamond sheet is sequentially installed on the disc during installation. At the same height, the multi-layered tower structure increases the number of raised horizontal and side ridges, and the side ridges are distributed in multiple directions, thereby improving scraping ability and making it easier to scrape cleanly. From a microscopic perspective, the raised side ridges penetrate and scratch the polishing pad, forming certain grooves, allowing the polishing fluid to enter the grooves and simultaneously roughening the surface of the polishing pad, thus adjusting the surface roughness of the polishing pad to the preset requirements. In this way, the improvement of the raised structure enhances the dressing ability of the dresser, thereby improving the dressing accuracy of the dresser.

[0010] Optionally, the protrusion includes multiple scraped layer structures, the cross-sectional area of ​​which gradually decreases away from the diamond sheet along the direction in which the protrusion contacts the diamond sheet. The bottom surface of the upper scraped layer structure is in contact with the top surface of the lower scraped layer structure between two adjacent scraped layer structures, and a connecting surface is formed between the edge of the top surface of the lower scraped layer structure and the edge of the bottom surface of the upper scraped layer structure.

[0011] By adopting the above technical solution, a horizontal transition surface is formed between each scraping layer structure, and no groove is formed between two adjacent scraping layer structures, thus reducing damage to the surface of the polishing pad.

[0012] Optionally, the protrusion includes large towers and small towers. The cross-section of the large tower located in the same scraping layer structure is larger than the cross-section of the small tower located in the same scraping layer structure. Multiple large towers and small towers are provided, and the large towers and small towers are distributed alternately. The distance between the top of the large tower and the surface of the diamond slice is greater than or equal to the distance between the top of the small tower and the surface of the diamond slice. The height of the large tower is 0.04-2mm, the height of the small tower is 0.03-2mm, and the distance between the center point of the large tower and the center point of the small tower is 0.1-4mm.

[0013] By adopting the above technical solution, the protrusions are arranged in a combination of large and small ones. When the large and small towers are set at the same height, because the grooves in the polishing pad vary in size, when the small tower enters the large groove, its small cross-section cannot completely scrape away the debris. The large tower can solve this problem, but if all the large towers are set on the same diamond slice, the wear on the polishing pad surface during the movement of the large towers will be significant, easily leading to a large change in the surface roughness of the polishing pad during scraping (increased roughness). On the other hand, the small towers of the same height, due to their small cross-sectional area, cause less wear on the polishing pad surface and have less impact on the surface roughness of the polishing pad, resulting in a smaller change in roughness relative to the initial roughness. Therefore, the combination of large and small towers of the same height can effectively scrape away the residue in both the large and small grooves while minimizing the change in the roughness of the polishing pad.

[0014] Optionally, the shape of the large tower is the same as the shape of the small tower.

[0015] By adopting the above technical solution, the shape of the large tower and the small tower are the same, which can ensure that the scratches on the polishing pad are similar, thereby improving the finishing effect.

[0016] Optionally, the number of the scraping layer structure is 2-1000 layers.

[0017] The number of layers in the scraping layer structure determines the dressing accuracy of the dresser; the greater the number, the higher the dressing accuracy. The dresser in this application has a wide range of applications.

[0018] Optionally, the diamond sheet has a chip-receiving groove, which is a blind hole.

[0019] By adopting the above technical solution, the chips generated during the scraping process can enter the chip groove, avoiding the chips from affecting the subsequent scraping process and improving the finishing accuracy.

[0020] Optionally, the chip groove is formed on the upper surface of the diamond sheet and at the bottom of the protrusion.

[0021] By adopting the above technical solution, the chip groove is opened between each protrusion, so that the protruding ridges on the protrusions are aligned with the chip groove, which is conducive to the falling of debris.

[0022] Optionally, the diamond sheet may be circular, rectangular, or square.

[0023] By adopting the above technical solutions, the types of diamond sheets can be diversified, thereby making diamond sheets into corresponding shapes according to needs, so that diamond sheets are no longer limited to a single shape and improving their practicality.

[0024] Optionally, it also includes a diamond setting mounted on the disk, with the diamond slices on the setting.

[0025] By adopting the above technical solution, the use of diamonds can be saved and costs reduced while ensuring the effect of the finishing and polishing pad.

[0026] This invention also relates to a method for manufacturing a high-precision dressing tool, comprising the following steps:

[0027] S1, diamond rough growth;

[0028] S2, laser-scanned slicing;

[0029] S3, thinning of diamond rough;

[0030] S4. Laser processing of diamond blanks to the required dimensions;

[0031] S5, laser chamfering;

[0032] S6. Bonding the semi-finished diamond sheet to the diamond setting;

[0033] S7, Diamond setting bonded to disc;

[0034] S8, diamond slices, and discs are polished as a whole;

[0035] S9, laser-engraved raised features;

[0036] S10, sealing adhesive;

[0037] S11. Cleaning and packaging.

[0038] By adopting the above technical solution, the process involves: first, cultivating and growing the diamond rough to meet the required conditions; second, cutting the edges of the diamond rough to the required dimensions; third, cutting the diamond rough in terms of thickness; fourth, processing the diamond rough to the required dimensions using a laser; fifth, using a laser to chamfer the edges; sixth, bonding the semi-finished diamond sheet to the diamond setting; seventh, bonding the diamond setting to the disc; eighth, polishing the diamond sheet and disc as a whole; ninth, using a laser to engrave the required protrusions; tenth, sealing the diamond sheet with adhesive; and finally, cleaning and packaging the entire assembly. This allows for the production of suitable discs, diamond settings, and diamond sheets according to specific needs, making the process convenient and efficient.

[0039] In summary, this application includes at least one of the following beneficial technical effects:

[0040] 1. This application provides a high-precision dressing tool, comprising a disc, a diamond holder, and a diamond sheet. The diamond holder is mounted on the disc, and the diamond sheet is mounted on the diamond holder. The surface of the diamond sheet is formed with protrusions, which have a multi-layered structure. The ridges on the multi-layered protrusions include horizontal ridges and inclined side ridges. At the same height, the number of horizontal ridges is greater than that of existing pyramid-shaped protrusions. The greater number of ridges and their multi-directional arrangement result in stronger chip scraping ability and easier cleaning. From a microscopic perspective, the side ridges of the protrusions penetrate and scratch the polishing pad, forming grooves that allow polishing fluid to enter. Simultaneously, the surface of the polishing pad is roughened. The small platforms of the multi-layered protrusions smooth the grooves and cover the holes, thus achieving the desired surface roughness of the polishing pad. In this way, the improvement of the protrusion structure enhances the dressing ability of the dressing tool, thereby improving its dressing accuracy.

[0041] 2. In this application, the protrusions are arranged in a combination of large and small sizes. The grooves in the polishing pad vary in size. When a small tower enters a large groove, its small cross-section cannot completely remove debris. The large tower solves this problem. However, using only large towers causes significant wear on the polishing pad surface during movement, easily leading to a large change in surface roughness (increased roughness) during scraping. Conversely, small towers of the same height, with their smaller cross-sectional area, cause less wear on the polishing pad surface and have a smaller impact on surface roughness, resulting in less change in roughness. Therefore, the combination of large and small towers of the same height can effectively remove debris from both large and small grooves while minimizing changes in the roughness of the polishing pad.

[0042] 3. In this application, the protrusion is a multi-layer structure. The insertion depth can be adjusted by adjusting parameters such as the number of multi-layers, the width of the staggered layer, and the height of the staggered layer. The larger the value of the above parameters, the shallower the insertion depth, thus achieving the purpose of customization as needed. Attached Figure Description

[0043] Figure 1 is a top view of the high-precision dressing tool of this application;

[0044] Figure 2 is an enlarged view of point A in Figure 1;

[0045] Figure 3 is a schematic diagram of the structure of the diamond sheet of this application;

[0046] Figure 4 is an enlarged view of point B in Figure 3;

[0047] Figure 5 is a front view of the diamond sheet of this application;

[0048] Figure 6 is a schematic diagram of various shapes of protrusions in this application.

[0049] Explanation of reference numerals in the attached diagram: 1. Disk; 2. Chip groove; 3. Diamond sheet; 31. Protrusion; 311. Scraping layer structure; 312. Connecting surface; 313. Large tower; 314. Small tower; 4. Horizontal rib; 5. Side rib. Detailed Implementation

[0050] The present application will be further described in detail below with reference to Figures 1-6.

[0051] This application discloses a high-precision trimming tool. Referring to Figures 1 and 2, the high-precision trimming tool includes a disk 1 and a diamond sheet 3 disposed on the disk 1. The diamond sheet 3 has multiple protrusions 31 formed on it, and each protrusion 31 has a multi-layer structure and is tower-shaped.

[0052] The multi-layered tower structure design improves the groove contact effect between the protrusion 31 and the polishing pad, thereby enhancing scraping ability and making it easier to clean the surface. Simultaneously, the side ridges 5 of the protrusion 31 penetrate and scratch the polishing pad, forming grooves that allow polishing fluid to enter and roughen the surface of the polishing pad, achieving the desired surface roughness. Adjusting the structure of the protrusion 31 improves the dressing ability of the dresser, thus enhancing its dressing accuracy.

[0053] Specifically, referring to Figures 3 and 4, the protrusion 31 includes multiple scraped layer structures 311. The cross-sectional area of ​​the scraped layer structure 311 gradually decreases in the direction away from the diamond sheet 1 along the direction where the protrusion 31 contacts the diamond sheet 3. The bottom surface of the upper scraped layer structure 311 is in contact with the top surface of the lower scraped layer structure 311 between two adjacent scraped layer structures 311. A connecting surface 312 is formed between the edge of the top surface of the lower scraped layer structure 311 and the edge of the bottom surface of the upper scraped layer structure 311. Each scraped layer structure 311 is formed with a horizontal ridge 4 and an inclined side ridge 5. A horizontal transition surface is formed between each scraped layer structure 311, so that grooves are not formed between two adjacent scraped layer structures 311, reducing damage to the surface of the polishing pad.

[0054] Of course, the form of the scraped layer structure 311 is not unique; by adjusting the processing angle, different multi-layered tower structures can be processed. In this embodiment, no specific description will be given, but only a preferred example will be described. It should be noted that during processing, grooves should be avoided between each scraped layer structure 311, as the formation of grooves will increase the destructive force on the polishing pad.

[0055] The top of the protrusion 31 is preferably designed to be flat (not pointed) because pointed parts have low strength and are prone to breakage when interacting with the polishing pad. In addition, the size of the top area of ​​the protrusion 31 is related to the shape of the groove that is drawn on the surface of the polishing pad during operation.

[0056] It should be noted that the multi-layered tower-type bump 31 can be used in conjunction with the conventional bump 31 structure (pyramid type). The multi-layered tower-type bump 31 is inserted into the polishing pad to process the surface of the polishing pad, adjusting the roughness of the polishing pad to meet the requirements. The conventional bump 31 structure is mainly used to scrape and remove particles from the polishing pad to prevent particles from damaging the wafer. To achieve the above effects, the size of the multi-layered tower-type bump 31 should be larger than the size of the conventional bump 31 structure.

[0057] Of course, there are multiple diamond slices 3, and each diamond slice 3 is evenly spaced along the axis of the disk 1 (in this embodiment, six are used as an example for explanation).

[0058] In this embodiment, referring to Figures 4 and 5, the protrusion 31 includes a large tower 313 and a small tower 314. The cross-section of the large tower 313 located in the same scraping layer structure 311 is larger than the cross-section of the small tower 314 located in the same scraping layer structure 311. Multiple large towers 313 and small towers 314 are provided, and they are distributed alternately. The distance between the top of the large tower 313 and the surface of the diamond sheet 3 is greater than the distance between the top of the small tower 314 and the surface of the diamond sheet 3. The protrusion 31 uses a layout of large and small protrusions. The grooves in the polishing pad vary in size. When the small tower 314 enters a large groove, its small cross-section cannot completely scrape away the debris in the large groove. The large tower 313 solves this problem. The small tower 314, due to its small cross-sectional area, causes less wear on the polishing pad surface and has less impact on the surface roughness, resulting in minimal roughness variation. Therefore, the combination of the large tower 313 and the small tower 314 can effectively scrape away debris from both the large and small grooves while minimizing the impact on the roughness of the polishing pad. In other embodiments, the height of the large tower can be greater than that of the small tower. In this case, the small tower only scrapes away debris from the surface of the polishing pad, and its scraping effect on the surface roughness of the polishing pad is smaller compared to the large tower that is deeply inserted into the groove.

[0059] Preferably, the shape of the large tower 313 and the small tower 314 are the same, which can ensure that the scratches on the polishing pad are similar and can improve the finishing effect.

[0060] In this embodiment, the number of scraping layer structures 311 (large tower 313 and small tower 314) is 2-1000 layers. The number of scraping layer structures 311 determines the trimming accuracy of the trimmer. The larger the number, the higher the trimming accuracy. The trimmer in this application has a wide range of applications.

[0061] Taking the square protrusion 31 as an example, the bottom length of the large tower 313 is 0.1-2mm, the top length is 0.005-1mm, and the height is 0.04-2mm. The distance between each scraping layer structure 311 of the large tower 313 is 0.001-1mm, the height of the top scraping layer structure 311 of the large tower 313 is 0.001-1mm, and the width of each connecting surface 312 of the large tower 313 is 0.001-1mm. The bottom length of the small tower 314 is 0.08-2mm, the top length is 0.005-1mm, and the height is 0.03-2mm. The distance between each scraping layer structure 311 of the small tower 314 is 0.001-1mm, and the distance between the center point of the large tower 313 and the center point of the small tower 314 ranges from 0.1-4mm. Of course, the finishing effect will vary with the change of each parameter. In actual use, it is necessary to select appropriate parameters according to the actual situation to ensure that the finishing effect is optimal.

[0062] Specifically, referring to Figure 6, the diamond sheet 3 has a chip groove 2, which allows the chips generated during the scraping process to enter the chip groove 2, thus preventing the chips from affecting the subsequent scraping process and further improving the finishing accuracy.

[0063] Referring to Figures 5 and 6, the shape of the chip-receiving groove 2 can be arbitrarily set, as long as it is ensured that the chip-receiving groove 2 is a blind hole (through holes would disrupt the connection between the diamond sheet 3 and the diamond holder). Preferably, the chip-receiving groove 2 is formed on the upper surface of the diamond sheet 3 and the bottom of the protrusion 31, that is, the chip-receiving groove 2 is preferably set between each protrusion 31, so that the protruding ridges on the protrusion 31 are aligned with the chip-receiving groove 2, which is conducive to the falling of debris. Of course, it can also be set in other positions. Due to the large wear, the diamond sheet 3 is generally scrapped after 50 hours of use. Therefore, the deflecting particles in the chip-receiving groove 2 do not need to be cleaned.

[0064] In this embodiment, the shape of the diamond sheet 3 is illustrated by taking a square shape as an example. Of course, a circle or any other shape can also be used to diversify the types of diamond sheets 3. The diamond sheets 3 can be made into corresponding shapes according to needs, no longer being singular, thus improving practicality.

[0065] This embodiment also includes a diamond holder (not shown in the figure), which is mounted on the disc 1, and the diamond sheet 3 is mounted on the diamond holder. Both the diamond holder and the diamond sheet 3 can be connected by adhesive bonding (using a highly corrosion-resistant epoxy resin adhesive). Using a diamond holder design can significantly reduce the amount of diamond used.

[0066] Specific explanation: If the diamond sheet 3 is directly bonded to the disk 1, a relatively thicker diamond sheet 3 is used to ensure that it protrudes from the surface of the disk 1 and to prevent stress fracture. However, if the diamond holder is designed as a circular shallow groove structure, a thinner diamond sheet 3 can be used. Since the bottom of the diamond sheet 3 is protected by the diamond holder, it is more stable than a direct bonding structure. Therefore, while ensuring the effect of the finishing and polishing pad, the use of CVD diamonds can also be saved.

[0067] The materials for both the disc 1 and the diamond holder are preferably stainless steel. Of course, other materials that meet the requirements can also be selected according to the actual situation. In this embodiment, no specific examples will be given.

[0068] The implementation principle of the high-precision dressing tool in this application embodiment is as follows: First, the protrusions 31 on the diamond sheet 3 adopt a multi-layered tower structure, which increases the number of horizontal ridges 4 and side ridges 5 of the protrusions 31, and the side ridges 5 are distributed in multiple directions, thereby improving the scraping ability and making it easier to scrape clean. Second, the protrusions 31 adopt a layout of large towers 313 and small towers 314. The combination of large towers 313 and small towers 314 can effectively scrape away the residue in both large and small grooves, while minimizing the change in the roughness of the polishing pad. This improves the dressing ability of the dresser, thereby improving the dressing accuracy of the dresser. Finally, a chip groove 2 is also provided, which allows the chips generated during the scraping process to enter the chip groove 2, preventing the chips from affecting the subsequent scraping process and improving the dressing accuracy.

[0069] This application also discloses a method for manufacturing a high-precision dressing tool, which includes the following steps:

[0070] S1, diamond rough growth;

[0071] S1 pertains to diamond culture technology, which involves growing diamond rough under specific temperature and pressure conditions. Diamond rough growth is a well-known process technology in the art, and will not be described in detail in this embodiment.

[0072] S2, laser-scanned slicing;

[0073] S3, thinning of diamond rough;

[0074] S4. Laser processing of diamond blanks to the required dimensions;

[0075] S5, laser chamfering;

[0076] S2-S4 pertain to laser processing technology, which is well-known to those skilled in the art and will not be described in detail in this embodiment.

[0077] S6, diamond sheet 3 semi-finished product is bonded to diamond setting;

[0078] The diamond plate 3 can be joined by using a highly corrosion-resistant epoxy resin adhesive to bond the diamond plate 3 to the diamond holder, or by welding.

[0079] S7, the diamond setting is bonded to the disc 1;

[0080] Similarly, the diamond setting can be connected by using a highly corrosion-resistant epoxy resin adhesive to combine the diamond setting with the disc 1, or by welding.

[0081] S8, diamond sheet 3, and disc 1 are polished as a whole;

[0082] Polishing is a surface finishing technique, which is well known to those skilled in the art, and will not be described in detail in this embodiment.

[0083] S9, laser-engraved protrusion 31;

[0084] Based on actual needs, carve the required protrusion shape 31 according to the predetermined number of layers, staggered width, and staggered height.

[0085] S10, sealing adhesive;

[0086] S11. Cleaning and packaging.

[0087] The process involves several steps: 1. Growing the rough diamond to the required size; 2. Cutting the edges of the rough diamond to the specified dimensions; 3. Cutting the rough diamond to the required thickness; 4. Laser processing the rough diamond to the required size; 5. Laser chamfering; 6. Attaching the semi-finished diamond sheet (3) to the diamond setting; 7. Attaching the diamond setting to the disc (1); 8. Polishing the diamond sheet (3) and disc (1); 9. Laser engraving the required protrusions (31); 10. Sealing the diamond sheet (3); and finally, cleaning and packaging the entire assembly. This method allows for the production of suitable discs (1), diamond settings, and diamond sheets (3) based on specific needs, making the process convenient and efficient.

[0088] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A dressing tool characterized by: The application relates to a diamond disc, which comprises a disc (1) and a plurality of diamond pieces (3), the plurality of diamond pieces (3) are arranged on the disc (1) and are spaced along the axis of the disc (1), the diamond piece (3) is formed with a protrusion (31), the protrusion (31) is tower-shaped and has a multi-layer structure, each layer structure of the protrusion (31) is formed with horizontal ridges (4) and inclined side ridges (5). The protrusion (31) comprises a plurality of scraping layer structures (311), the cross-sectional area of the scraping layer structure (311) gradually decreases in the direction away from the diamond piece (3) along the direction where the protrusion (31) is connected with the diamond piece (3), the bottom surface of the scraping layer structure (311) located above is connected with the top surface of the scraping layer structure (311) located below between two adjacent scraping layer structures (311), and a connecting surface (312) is formed between the edge of the top surface of the scraping layer structure (311) located below and the edge of the bottom surface of the scraping layer structure (311) located above. The protrusion (31) comprises large towers (313) and small towers (314), the cross section of the large tower (313) located in the same scraping layer structure (311) is larger than the cross section of the small tower (314) located in the same scraping layer structure (311), the large tower (313) and the small tower (314) are arranged in a plurality of forms, the large tower (313) and the small tower (314) are alternately distributed, the distance between the top of the large tower (313) and the surface of the diamond piece (3) is greater than or equal to the distance between the top of the small tower (314) and the surface of the diamond piece (3), the height of the large tower (313) is 0.04-2 mm, the height of the small tower (314) is 0.03-2 mm, and the distance between the center point of the large tower (313) and the center point of the small tower (314) ranges from 0.1 mm to 4 mm.

2. The dressing tool of claim 1, wherein: The shape of the large tower (313) is the same as the shape of the small tower (314).

3. The dressing tool of claim 1, wherein: The number of the scraping layer structures (311) ranges from 2 to 1000.

4. The dressing tool of claim 1, wherein: The diamond piece (3) is provided with a chip groove (2), and the chip groove (2) is a blind hole.

5. The dressing tool of claim 4, wherein: The chip groove (2) is arranged on the upper surface of the diamond piece (3) and the bottom of the protrusion (31).

6. The dressing tool of claim 1, wherein: The diamond piece (3) is circular, rectangular or square.

7. The dressing tool of claim 1, wherein: The application further discloses a diamond holder, which is arranged on the disc (1) and is used for mounting the diamond piece (3).

8. A method of manufacturing the dressing tool according to any one of claims 1 to 7, characterized by: The application further discloses a diamond disc manufacturing method, which comprises the following steps: S1, growing a diamond blank; S2, laser edge scanning and slicing; S3, thinning the diamond blank; S4, laser processing the diamond blank to a required size; S5, laser chamfering; S6, bonding the diamond piece (3) semi-finished product with the diamond holder; S7, bonding the diamond holder with the disc (1); S8, polishing the diamond piece (3) and the disc (1) as a whole; S9, laser engraving the protrusion (31); S10, sealing glue; S11, cleaning and packaging.

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