Display panel, display module and manufacturing method therefor, and panel circuit board

Abstract

The present disclosure provides a display panel, a display module and a manufacturing method therefor, and a panel circuit board. The display panel comprises: a display substrate comprising a display area and a peripheral area, wherein the peripheral area comprises a bending area connected to the display area and a binding area connected to the bending area; a driving chip arranged in the binding area; and a panel circuit board electrically connected to the driving chip, wherein the binding area is bent in the direction away from a light emitting side of the display panel by means of the bending area, so that the panel circuit board is located on the side of the display panel facing away from the light emitting side. The driving chip is bound and connected to a first surface of the peripheral area, an area of the first surface surrounding the periphery of the driving chip is a first area, and a chip protection component is provided at least in the first area.

Description

Display panel, display module and its manufacturing method, panel circuit board

[0001] Cross-reference to related applications

[0002] This application claims priority to Chinese Patent Application No. 202410705245.8, filed in China on May 31, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure relates to the field of display technology, and in particular to a display panel, a display module, a method for manufacturing the same, and a panel circuit board. Background Technology

[0004] LCD (Liquid Crystal Display) and OLED (Organic Light-Emitting Diode) display products employ side-bonding technology, where the driver chip (Integrated Circuit, IC) is bonded to the FPC (Flexible Printed Circuit) or PCB (Printed Circuit Board) in the bonding area of ​​the display panel. However, during the assembly of the display module, issues such as interference or impacts between the driver chip and other components can arise, leading to module reliability problems. Summary of the Invention

[0005] The technical solutions provided in this disclosure are as follows:

[0006] In a first aspect, embodiments of this disclosure provide a display panel, including:

[0007] The display substrate includes a display area and a peripheral area, wherein the peripheral area includes a bending area connected to the display area and a bonding area connected to the bending area;

[0008] The driver chip is located in the bonding area; and

[0009] The panel circuit board is electrically connected to the driving chip. The bonding area is bent in a direction away from the light-emitting side of the display panel through the bending area, so that the panel circuit board is located on the side of the display panel away from the light-emitting side; wherein,

[0010] The driver chip is bonded to the first surface of the peripheral area, and the area surrounding the driver chip on the first surface is the first region, and a chip protection element is provided in at least the first region.

[0011] For example, the chip protection component includes:

[0012] A first chip protective adhesive, wherein the first chip protective adhesive at least covers the side of the driver chip facing away from the first surface and the first region; and / or,

[0013] The second chip protective adhesive has a grooved area, and the driver chip is housed in the grooved area so that the second chip protective adhesive surrounds the driver chip, and the second chip protective adhesive only covers the first area.

[0014] For example, at least one of the first chip protective adhesive and the second chip protective adhesive has an adhesive surface for bonding to the first surface, which includes a first adhesive area and a second adhesive area. The first adhesive area is bonded to the panel circuit board, and the second adhesive area is bonded to the side surface of the driver chip opposite to the first surface and to the first area.

[0015] For example, the peel force between the first adhesive area and the panel circuit board is greater than or equal to the peel force between the second adhesive area and the driver chip.

[0016] For example, the peel force between the first adhesive area and the panel circuit board is greater than or equal to 1000 gf / inch; the peel force between the second adhesive area and the driver chip is greater than or equal to 600 gf / inch.

[0017] For example, the main material of at least one of the first chip protective adhesive and the second chip protective adhesive includes a heat dissipation material.

[0018] For example, at least one of the first chip protective adhesive and the second chip protective adhesive includes a first film layer and at least one second film layer, wherein the first film layer is an insulating tape, and the second film layer is stacked on the side of the insulating tape away from the first surface.

[0019] For example, the at least one second film layer includes a conductive film layer, and the conductive film layer is configured as a ground layer or a heat dissipation film to resist signal interference; or,

[0020] The at least one second film layer includes a heat dissipation layer and a conductive film layer stacked on the side of the heat dissipation layer away from the first film layer, wherein the conductive film layer is configured as a ground layer or an anti-signal interference layer.

[0021] For example, in a direction perpendicular to the first surface, the second chip protective adhesive has a first height, the driver chip has a second height, and the first height is greater than or equal to the second height.

[0022] For example, the height difference between the first height and the second height is greater than or equal to 0.3 mm.

[0023] For example, the driver chip includes a first side and a second side opposite to each other in the direction from the display area to the bonding area, and a third side and a fourth side located between the first side and the second side, wherein the first side is closer to the display area than the second side; wherein the second chip protective adhesive is at least disposed on the first side.

[0024] For example, the second chip protective adhesive is distributed around the driver chip to completely surround the driver chip; or, the second chip protective adhesive is distributed on at least one of the third and fourth sides, and the first side, to partially surround the driver chip.

[0025] For example, there is a gap between the groove sidewall of the grooved area and the driving chip.

[0026] For example, the gap is greater than or equal to 0.5 mm.

[0027] For example, the panel circuit board includes a circuit board body; the chip protection component further includes a release film, which is used to adhere to the circuit board body and can be peeled off from the circuit board body. The release film includes a first film area corresponding to the circuit board body and a second film area corresponding to the first area, wherein the second chip protective adhesive is attached to the second film area, and the second film area and the orthographic projection pattern of the second chip protective adhesive on the first surface at least partially overlap and match in shape.

[0028] For example, the peel force between the first film area and the circuit board body is less than or equal to the peel force between the second film area and the second chip protective adhesive.

[0029] For example, in the second chip protective adhesive, the dimensions of the grooved area in the first direction and the second direction are greater than a threshold; wherein, the first direction is the direction from the bonding area to the display area, the second direction is parallel to the first surface and perpendicular to the first direction, and the threshold is the corresponding dimensions of the bonding pressure head in the first direction and the second direction during the bonding process between the driver chip and the panel circuit board.

[0030] For example, the panel circuit board may include a circuit board body with exposed conductive points on it; the chip protection component may also include a circuit board cover layer covering the circuit board body, and the circuit board cover layer is configured as a conductive layer. Specifically, the circuit board cover layer may serve as a grounding film layer or an anti-signal interference film layer; the circuit board cover layer is connected to at least one of the first chip protective adhesive and the second chip protective adhesive and forms an integral component.

[0031] Secondly, this disclosure also provides a panel circuit board, the panel circuit board including a circuit board body and a chip protection component disposed on the circuit board body, wherein the chip protection component is configured for attaching to a first area of ​​the display panel.

[0032] Thirdly, embodiments of this disclosure also provide a display module, including:

[0033] The display panel as described above;

[0034] A protective cover is provided on the light-emitting side of the display panel.

[0035] Fourthly, this disclosure also provides a method for manufacturing a display module, the method comprising the following steps:

[0036] A protective cover is attached to the light-emitting side of the display panel to obtain the display module, wherein before the protective cover is attached to the display panel, the display panel has a chip protection element in at least the first region.

[0037] For example, the method specifically includes:

[0038] A display substrate and a panel circuit board are provided. The bending area of ​​the display substrate is in an unbent state. The release film is attached to the main body of the panel circuit board. The second film area of ​​the release film is attached to the first area so that the second chip protective adhesive surrounds the periphery of the driver chip.

[0039] The driver chip is bonded and connected to the panel circuit board;

[0040] The bending area is bent toward the light-emitting side away from the display panel, so that the panel circuit board is located on the side of the display panel away from the light-emitting side;

[0041] The protective cover is attached to the light-emitting side of the display panel;

[0042] Remove the release film to peel the release film and the second chip protective adhesive from the display panel simultaneously. Attached Figure Description

[0043] Figure 1 shows a front view of the display module provided in some embodiments of this disclosure when no chip protection is provided and the bending area is not bent.

[0044] Figure 2 shows a schematic diagram of the structure of a display module provided in some embodiments of this disclosure when no chip protection is provided and the bending area is not bent.

[0045] Figure 3 shows a schematic diagram of the structure of a display module provided in some embodiments of the present disclosure when a chip protection component is provided and the module is not bent in the bending area.

[0046] Figure 4 shows one of the partial structural diagrams of the binding area in Figure 3;

[0047] Figure 5 shows a second partial structural diagram of the binding area in Figure 3;

[0048] Figure 6 shows one of the schematic diagrams of the connection structure between the first chip protective adhesive and the panel circuit board;

[0049] Figure 7 shows the second schematic diagram of the connection structure between the first chip protective adhesive and the panel circuit board;

[0050] Figure 8 shows one of the schematic diagrams of the film layer stacking structure of the first chip protective adhesive in some embodiments of this disclosure;

[0051] Figure 9 shows a second schematic diagram of the film layer stacking structure of the first chip protective adhesive in some embodiments of this disclosure;

[0052] Figure 10 shows a front view of the display module provided in some embodiments of this disclosure when the chip protection component is provided and the bending area is not bent.

[0053] Figure 11 shows a side view of Figure 10;

[0054] Figure 12 shows an enlarged view of the partial structure E in Figure 11;

[0055] Figure 13 shows a schematic diagram of the structure of the panel circuit board without the first chip protective adhesive in some embodiments of this disclosure;

[0056] Figure 14 shows a schematic diagram of the structure when the panel circuit board is connected to the first chip protective adhesive in some embodiments of this disclosure;

[0057] Figure 15 shows one of the structural schematic diagrams of the first chip protective adhesive;

[0058] Figure 16 shows the second schematic diagram of the structure of the first chip protective adhesive;

[0059] Figure 17 shows the third schematic diagram of the structure of the first chip protective adhesive;

[0060] Figure 18 shows the fourth schematic diagram of the structure of the first chip protective adhesive;

[0061] Figure 19 shows the fifth schematic diagram of the structure of the first chip protective adhesive;

[0062] Figure 20 shows a rear view of a display module provided in some embodiments of this disclosure;

[0063] Figure 21 shows a side view of Figure 20;

[0064] Figure 22 shows an enlarged view of the local structure F in Figure 21;

[0065] Figure 23 shows a front view of a display module provided in some other embodiments of this disclosure when the chip protection element is provided and the bending area is not bent.

[0066] Figure 24 shows one of the structural schematic diagrams of the second chip protective adhesive in some embodiments of this disclosure;

[0067] Figure 25 shows a second schematic diagram of the structure of the second chip protective adhesive in some embodiments of this disclosure;

[0068] Figure 26 shows a third schematic diagram of the structure of the second chip protective adhesive in some embodiments of this disclosure;

[0069] Figure 27 shows a fourth schematic diagram of the structure of the second chip protective adhesive in some embodiments of this disclosure;

[0070] Figure 28 shows a fifth schematic diagram of the structure of the second chip protective adhesive in some embodiments of this disclosure;

[0071] Figure 29 shows a sixth schematic diagram of the structure of the second chip protective adhesive in some embodiments of this disclosure;

[0072] Figure 30 shows a seventh schematic diagram of the structure of the second chip protective adhesive in some embodiments of this disclosure;

[0073] Figure 31 shows an eighth schematic diagram of the structure of the second chip protective adhesive in some embodiments of this disclosure;

[0074] Figure 32 shows a ninth schematic diagram of the structure of the second chip protective adhesive in some embodiments of this disclosure;

[0075] Figure 33 shows a schematic diagram of the structure of the second chip protective adhesive in some embodiments of this disclosure;

[0076] Figure 34 shows a schematic diagram of the connection structure between the chip protection device and the panel circuit board in some embodiments of this disclosure;

[0077] Figure 35 shows a schematic diagram of the structure of the display module in some other embodiments of this disclosure;

[0078] Figure 36 shows a schematic diagram of the connection structure between the release film and the second chip protective adhesive in some embodiments of this disclosure. Detailed Implementation

[0079] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0080] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0081] Before providing a detailed description of the display panel, display module, manufacturing method thereof, and panel circuit board provided in the embodiments of this disclosure, the following description of the related technologies is provided:

[0082] In related technologies, LCD (Liquid Crystal Display) and OLED (Organic Light-Emitting Diode) display products employ side-bonding technology. Specifically, in the bonding area of ​​the display panel, the driver chip (Integrated Circuit, IC) is bonded to the FPC (Flexible Printed Circuit) or PCB (Printed Circuit Board). However, during the assembly of the display module, problems such as interference and collisions between the driver chip and other components can occur, leading to reliability issues.

[0083] The applicant has discovered through research that in some display products, such as foldable displays, especially small-sized foldable displays, more space is needed for the battery compartment in order to increase battery capacity and improve standby time. The panel circuit boards in the display panel are stacked on the back of the display panel. To increase the space for the battery compartment, the driver chip needs to be as close as possible to the edge of the protective cover. This results in the driver chip being too close to the protective cover, which can easily lead to reliability issues such as interference or collisions between the protective cover and the driver chip during the assembly of the display module.

[0084] To avoid interference or collision between the protective cover and the driver chip, increasing the distance between the driver chip and the display area would not meet the space design requirements of the battery compartment.

[0085] Based on this, the present disclosure provides a display panel, a display module, a method for manufacturing the same, and a panel circuit board, which can improve the above-mentioned problems and enhance the reliability of the module.

[0086] As shown in Figures 1 to 7, the display panel 10 provided in this embodiment includes a display substrate 100, a driver chip 200, and a panel circuit board 300. The display substrate 100 includes a display area AA and a peripheral area D. The peripheral area D includes a bending area D1 connected to the display area AA and a bonding area D2 connected to the bending area D1. The driver chip 200 is disposed in the bonding area D2. The panel circuit board 300 is electrically connected to the driver chip 200. The bonding area D2 is bent through the bending area D1 in a direction away from the light-emitting side of the display panel 10, so that the panel circuit board 300 is located on the side of the display panel 10 away from the light-emitting side. The driver chip 200 is bonded to a first surface DA of the peripheral area D. The area surrounding the driver chip 200 on the first surface DA is a first area DA1, and a chip protection member 400 is provided in at least the first area DA1.

[0087] In the above solution, by setting the chip protection component 400 at least in the first region DA1, the chip protection component 400 can surround the driver chip 200 to protect the driver chip 200. This can protect the driver chip 200 when interference or collision occurs between the driver chip 200 and other components during assembly, thereby improving the reliability of the module.

[0088] In some exemplary embodiments of this disclosure, as shown in Figures 1 to 7 and Figures 10 to 22, the chip protection component 400 may include a first chip protective adhesive 410, which at least covers the side of the driver chip 200 facing away from the first surface DA and the first region DA1. Thus, during the assembly of the display module, if the driver chip 200 interferes with or collides with the protective cover plate, the first chip protective adhesive 410 completely encapsulates the driver chip 200, providing a buffering effect to protect the driver chip 200 and prevent reliability issues.

[0089] Since the driver chip 200 protrudes from the first surface DA, the first chip protective adhesive 410 may not adhere evenly or may wrinkle. To improve this problem, as shown in Figures 15 to 19, in some embodiments, the first chip protective adhesive 410 may have an anti-wrinkle structure 413 at a predetermined area P.

[0090] In some exemplary embodiments, the anti-wrinkle structure 413 may include a break 413A or a slot 413B. The break 413A may include a continuous break and / or a discontinuous break. The slot 413B may be a single, integral break 413A, or the slot 413B may include multiple adjacently arranged breaks 413A.

[0091] In some exemplary embodiments, the predetermined region P can be a location corresponding to the corner of the driver chip 200 where unevenness or wrinkles are likely to occur. For example, the predetermined region P may include: a first region P1 located at the edge of the first chip protective adhesive 410 and corresponding to the corner of the driver chip 200; and / or a second region P2 located in the middle of the first chip protective adhesive 410 and adjacent to the corner of the driver chip 200.

[0092] In the above solution, the locations where unevenness or wrinkles are easily generated when the first chip protective adhesive 410 is applied are mainly concentrated at the corners of the corresponding driver chip 200. Therefore, at least at the corners of the corresponding driver chip 200 where unevenness or wrinkles are easily generated, a break 413A or a groove 413B can be provided to reduce the occurrence of unevenness or wrinkles when the first chip protective adhesive 410 is applied.

[0093] In some embodiments, as shown in FIG15, the first region P1 includes at least one corner of the first chip protective adhesive 410, and the first region P1 is provided with the groove 413B, and the groove 413B can be an integral break.

[0094] For example, as shown in FIG15, the shape of the slot 413B can be configured such that the opening size of the slot 413B gradually increases along the direction from the center of the first chip protective adhesive 410 to the corner corresponding to the slot 413B. This configuration reserves the slot 413B at the corner position of the first chip protective adhesive 410, making it easier to attach and flatten the first chip protective adhesive 410.

[0095] It should be noted that the shape of the slot 413B is not limited to this.

[0096] It should also be noted that the groove 413B can be set at one or more corners of the first chip protective adhesive 410. For example, Figure 15 shows that the groove 413B is provided at all four corners of the first chip protective adhesive 410, but it is not limited thereto.

[0097] Furthermore, in some other embodiments, as shown in FIG16, the first region P1 includes at least one corner of the first chip protective adhesive 410, and the first region P1 is provided with the groove 413B, and the groove 413B includes a plurality of adjacent breaks 413A. Exemplarily, the plurality of breaks 413A in each groove 413B are arranged sequentially at intervals along the turning direction of the corresponding corner of the driving chip 200. This arrangement reserves the groove 413B at the corner position of the first chip protective adhesive 410, making it easier to attach and flatten the first chip protective adhesive 410.

[0098] It should be noted that the arrangement and shape of the multiple breaks 413A in the slot 413B are not limited to this.

[0099] It should also be noted that the groove 413B can be set at one or more corners of the first chip protective adhesive 410. For example, Figure 16 shows that the groove 413B is provided at all four corners of the first chip protective adhesive 410, but it is not limited thereto.

[0100] Furthermore, in some embodiments, as shown in FIG17, a break 413A is provided in the second region P2 of the first chip protective adhesive 410 in the middle and adjacent to the corner of the driver chip 200, and at least one break 413A is provided for each corner of the driver chip 200. Since one of the locations where wrinkles and unevenness occur when the first chip protective adhesive 410 is attached is at the corner of the first chip protective adhesive 410, providing a break 413A in the second region P2 of the first chip protective adhesive 410 adjacent to the corner of the driver chip 200 can effectively improve the problem of wrinkles during the attachment of the first chip protective adhesive 410.

[0101] For example, as shown in Figure 17, each of the breaks 413A extends along the bending direction of the corresponding corner of the driving chip 200. For example, the breaks 413A are arc-shaped. This arrangement makes it easier to attach and flatten the first chip protective adhesive 410. It is understood that in practical applications, the shape of the breaks 413A is not limited to this.

[0102] It should also be noted that the break 413A can be set at one or more corners of the driver chip 200. For example, Figure 17 shows that the break 413A is provided at all four corners of the driver chip 200, but this is not a limitation.

[0103] Furthermore, in other embodiments, as shown in FIG18, a break 413A is provided in the second region P2 in the middle of the first chip protective adhesive 410 and adjacent to the corner of the driving chip 200. At least one break 413A is provided for each corner of the driving chip 200. The break 413A can be a continuous break or a discontinuous break. The first region P1 includes at least one corner of the first chip protective adhesive 410. The first region P1 is provided with a groove 413B, and the groove 413B includes a plurality of adjacent breaks 413A.

[0104] In some other embodiments, as shown in FIG19, a break 413A is provided in the middle of the first chip protective adhesive 410 and at a position adjacent to the corner of the driver chip 200. At least one break 413A is provided for each corner of the driver chip 200. The break 413A can be a continuous break or a discontinuous break. The first region P1 includes at least one corner of the first chip protective adhesive 410. The first region P1 is provided with a groove 413B, and the groove 413B is an integral break 413A.

[0105] It should be understood that the above is only an exemplary description of the structure and position of the anti-wrinkle structure 413. However, in other embodiments not shown, the structure and position of the anti-wrinkle structure 413 are not limited thereto.

[0106] The first chip protective adhesive 410 can be any suitable structure, such as single-sided tape or a coated adhesive layer. For example, the first chip protective adhesive 410 is a single-sided tape, with its adhesive side attached to the first surface DA and the surface of the driver chip 200 facing away from the first surface DA. However, it is not limited to this.

[0107] In some other exemplary embodiments of this disclosure, as shown in FIG23, the chip protector 400 may include: a second chip protectant 420, the second chip protectant 420 having a groove area 421, the driver chip 200 being accommodated in the groove area 421, such that the second chip protectant 420 surrounds the driver chip 200, and the second chip protectant 420 only covers the first region DA1.

[0108] In some embodiments, as shown in FIG26, at least one edge of the notch area 421 contacts or abuts against the driver chip 200. This reduces the distance between at least one edge of the notch area 421 and the driver chip 200, providing better protection for the driver chip 200. Simultaneously, when applying the second chip protective adhesive 420, the edge of the notch area 421 that contacts or abuts against the driver chip 200 can be used as a positioning reference, facilitating application. Furthermore, it prevents the second chip protective adhesive 420 from shifting position during assembly or use.

[0109] In some embodiments, as shown in FIG27, the four edges of the cutout area 421 contact or abut against the driver chip 200 to completely surround the driver chip 200. This provides better protection for the four sides of the driver chip 200.

[0110] In some embodiments, as shown in FIG28, at least one corner of the cutout area 421 can be recessed or rounded. This recessed or rounded corner, compared to a right angle, avoids breakage or warping at the corners of the cutout area 421. In some embodiments, as shown in FIG29, the driver chip 200 overlaps with the cutout area 421 in multiple parts. This exposes at least part of the driver chip 200 within the cutout area 421, which is beneficial for heat dissipation and other requirements of the driver chip 200.

[0111] In some embodiments, as shown in FIG30, the second chip protective adhesive 420 covers only a portion of the first region DA1 and the driver chip 200. In other words, the second chip protective adhesive 420 can partially cover the driver chip 200, and the notch area 421 partially exposes the driver chip 200. Thus, the second chip protective adhesive 420 can further protect a portion of the surface area of ​​the driver chip 200.

[0112] In some embodiments, as shown in FIG31, the second chip protective adhesive 420 covers the four edges of the driver chip 200. This provides better protection for the four edges of the driver chip 200.

[0113] In some embodiments, as shown in FIG32, at least one of the four edge portions of the driver chip 200 is provided with an uneven structure 210. The uneven structure 210 may be continuously raised and recessed, and may be wavy. The second chip protective adhesive 420 at least covers the uneven structure 210. In this way, the second chip protective adhesive 420 at least covers the uneven structure 210 on the driver chip 200 to prevent the uneven structure 210 from contacting or bumping with other components. For example, the uneven structure 210 may include pins or wiring on the driver chip 200.

[0114] In some embodiments, as shown in FIG33, the chip protector 400 may further include a third chip protective adhesive 440, which covers at least one edge of the driver chip 200 and extends in the direction of at least one edge adjacent to this edge, covering a portion of the original second chip protective adhesive 420. Thus, the third chip protective adhesive 440 can be used to cover at least one edge of the driver chip 200 to further protect the driver chip 200.

[0115] The above solution utilizes the second chip protective adhesive 420 to surround the driver chip 200, thereby protecting the driver chip 200. During the assembly of the display module, if the driver chip 200 interferes or collides with the protective cover plate, the second chip protective adhesive 420 surrounding the driver chip 200 can reduce the impact of the protective cover plate on the driver chip 200 and avoid reliability issues.

[0116] In some exemplary embodiments, the second chip protective adhesive 420 has a first height in a direction perpendicular to the first surface DA, and the driver chip 200 has a second height, wherein the first height is greater than or equal to the second height. Thus, the second chip protective adhesive 420 is higher than the driver chip 200, which can prevent the protective cover from contacting the driver chip 200 during the display module assembly process, thereby further protecting the driver chip 200.

[0117] In some exemplary embodiments, the height difference between the first height and the second height is greater than or equal to 0.3 mm, which effectively prevents the protective cover from bumping into the driver chip 200. It should be noted that, unless otherwise stated, the values ​​in this application are not absolute definitions, but rather represent a range of variation within a certain range of a reference value. For example, each value may include a variation range of less than or equal to 10%, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to 3%, less than or equal to 2%, less than or equal to 1%, less than or equal to 0.5%, less than or equal to 0.1%, less than or equal to 0.05%, etc.

[0118] It should be noted that the chip protector 400 may use only the first chip protectant 410; the chip protector 400 may also use only the second chip protectant 420; in other embodiments, the chip protector 400 may include both the first chip protectant 410 and the second chip protectant 420. The chip protector 400 is not limited to the first chip protectant 410 and the second chip protectant 420, and may be implemented using other suitable structures.

[0119] In some embodiments of this disclosure, as shown in FIG6, at least one of the first chip protective adhesive 410 and the second chip protective adhesive 420 includes a first adhesive area S1 and a second adhesive area S2 for bonding the first surface DA. The first adhesive area S1 is bonded to the panel circuit board 300, and the second adhesive area S2 is bonded to the side surface of the driver chip 200 opposite to the first surface DA and the first region DA1.

[0120] Using the above solution, at least one of the first chip protective adhesive 410 and the second chip protective adhesive 420 can also be connected to the panel circuit board 300. In other words, at least one of the first chip protective adhesive 410 and the second chip protective adhesive 420 can be integrated with the panel circuit board 300 as a single component. Figures 6 and 14 show schematic diagrams of the structure when the first chip protective adhesive 410 is integrated with the panel circuit board 300.

[0121] Specifically, taking the first chip protective adhesive 410 as an example, after the bonding process between the panel circuit board 300 and the driver chip 200 is completed, the first chip protective adhesive 410 can be used to cover the driver chip 200 and the first area DA1, and then the protective cover can be attached to the display panel 10. During the attachment process of the protective cover, the first chip protective adhesive 410 covers and wraps the driver chip 200, thereby avoiding direct contact and collision between the protective cover and the driver chip 200.

[0122] Figure 13 shows a schematic diagram of one structure of the panel circuit board 300, and Figure 14 shows a schematic diagram of the structure of the panel circuit board 300 with the first chip protective adhesive 410 integrated thereon. Referring to Figures 13 and 14, by attaching the first chip protective adhesive 410 to the panel circuit board 300, an integrated design is achieved, eliminating the need for additional structural elements in the panel circuit board 300. Furthermore, by integrating the first chip protective adhesive 410 onto the panel circuit board 300, it is unnecessary to separately apply a chip protective film, simplifying the process, improving product yield, and reducing costs.

[0123] It is understood that in other embodiments, at least one of the first chip protective adhesive 410 and the second chip protective adhesive 420 may also be disposed independently of the panel circuit board 300.

[0124] In some exemplary embodiments, the peel force between the first adhesive area S1 and the panel circuit board 300 is greater than or equal to the peel force between the second adhesive area S2 and the driver chip 200. In other words, the peel force between the first chip protective adhesive 410 and the panel circuit board 300 is greater.

[0125] Using the above solution, when the bonding area D2 is bent through the bending area D1, if the first chip protective adhesive 410 pulls on the driver chip 200, the first chip protective adhesive 410 is more likely to peel off from the driver chip 200, so as to avoid excessive pulling force on the driver chip 200 and damage to the driver chip 200.

[0126] Furthermore, if the peel force between the first chip protective adhesive 410 and the driver chip 200 is too small, there is a risk that the first chip protective adhesive 410 may accidentally fall off. Therefore, the peel force between the first chip protective adhesive 410 and the driver chip 200 cannot be too small.

[0127] For example, the peel force between the second adhesive area S2 and the driving chip 200 is greater than or equal to 600 gf / inch; the peel force between the first adhesive area S1 and the panel circuit board 300 is greater than or equal to 1000 gf / inch. Unless otherwise stated, the numerical values ​​in this application are not absolute definitions, but rather represent a range of variation within a certain range of a reference value. For example, a numerical value may include a range of variation less than or equal to 10%, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to 3%, less than or equal to 2%, less than or equal to 1%, less than or equal to 0.5%, less than or equal to 0.1%, or less than or equal to 0.05%.

[0128] This configuration satisfies the requirement that the peel force between the first chip protective adhesive 410 and the driver chip 200 cannot be too small, while also preventing excessive pulling force on the driver chip 200 and thus avoiding damage to it. However, it is not limited to this.

[0129] Furthermore, since the first chip protective adhesive 410 covers and encapsulates the driver chip 200, and the second chip protective adhesive 420 surrounds the driver chip 200, and the driver chip 200 generates heat during operation, in order to avoid affecting the heat dissipation of the driver chip 200, in some exemplary embodiments, the main material of at least one of the first chip protective adhesive 410 and the second chip protective adhesive 420 may include a heat dissipation material. For example, the heat dissipation material may be made of any suitable material such as graphite, metal, carbon fiber, or heat dissipation resin.

[0130] In some embodiments, as shown in Figures 8 and 9, the first chip protective adhesive 410 may include a first film layer 411 and at least one second film layer 412. The first film layer 411 is an insulating tape, which can ensure insulation between the driver chip 200 and the first chip protective adhesive 410. The second film layer 412 is stacked on the side of the insulating tape away from the first surface DA. The second film layer 412 can serve as a heat dissipation layer, a grounding layer, or an anti-signal interference layer, etc.

[0131] For example, as shown in FIG8, the at least one second film layer 412 includes a conductive film layer 4121, and the conductive film layer 4121 is configured as a ground layer or an anti-signal interference layer heat dissipation film; or, as shown in FIG9, the at least one second film layer 412 includes a heat dissipation layer 4122 and a conductive film layer 4121 stacked on the side of the heat dissipation layer 4122 away from the first film layer 411, and the conductive film layer 4121 is configured as a ground layer or an anti-signal interference layer. For example, the conductive film layer 4121 can be any suitable film layer such as a metal foil layer and a conductive cloth. In practical applications, the stacked film layer structure of the first chip protective adhesive 410 can be reasonably selected according to product requirements, and is not limited thereto.

[0132] Please refer to Figures 6, 13, and 14. A second region 300A is provided on the panel circuit board 300 adjacent to the bonding area D2. The first chip protective adhesive 410 can be adhered to the second region 300A. The thickness of the second region 300A can be less than the thickness of other regions. After the first chip protective adhesive 410 is adhered to the second region 300A, the surface of the first chip protective adhesive 410 can be approximately flush with the surfaces of other regions on the panel circuit board 300 adjacent to the second region 300A, to ensure the surface flatness of the connection between the panel circuit board 300 and the first chip protective adhesive 410. It should be noted that the term "approximately flush" can mean that the two surfaces are arranged along the same plane within a micrometer range, for example, within 40μm, 30μm, 20μm, 10μm, or 1μm.

[0133] It should also be noted that the first chip protective adhesive 410 adopts a multi-layer stacked structure, which can meet the heat dissipation and other performance requirements of the first chip protective adhesive 410 on the one hand, and also help to meet the surface flatness requirements at the connection between the panel circuit board 300 and the first chip protective adhesive 410 on the other hand.

[0134] In some exemplary embodiments, as shown in FIG4, a alignment mark MA is provided in the bonding area D2, and either the first chip protective adhesive 410 or the second chip protective adhesive 420 has an avoidance cutout area MB at the position corresponding to the alignment mark MA. The avoidance cutout area MB is used to avoid the alignment mark MA. For example, as shown in FIG4, the alignment mark MA may include a first alignment mark MA1 applied to the bending process of the bending area D1, and a second alignment mark MA2 applied to the bending process of the bending area D1, etc.

[0135] Please refer to Figure 4. When the chip protective component 400 includes the first chip protective adhesive 410, the first chip protective adhesive 410 has a first clearance cutout area MB1 at the position corresponding to the first alignment mark MA1, and a second clearance cutout area MB2 at the position corresponding to the second alignment mark MA2. It should be noted that the clearance cutout area MB can be a hollowed-out groove or an opening design. The shape of the clearance cutout area MB can be, but is not limited to, any suitable regular or irregular shape such as an arc, circle, rectangle, or triangle.

[0136] In some embodiments, as shown in Figures 4 and 6, at least a portion of the alignment mark MA is located near at least one edge of the bonding area D2 extending along the first direction X, where the first direction X is the direction from the bonding area D2 to the display area AA; and at least a portion of the clearance cutout area MB is configured as a notch structure on at least one edge of the first chip protective adhesive 410 extending along the first direction X. For example, as shown in Figures 4 and 6, the first clearance cutout area MB1 is an arc-shaped notch structure. It is understood that the shape of the clearance cutout area MB is not limited to an arc shape, but can be any other suitable shape.

[0137] Furthermore, in some embodiments, as shown in Figures 5 and 7, at least a portion of the alignment mark MA is located near at least one edge of the bonding area D2 extending along the first direction X, where the first direction X is the direction from the bonding area D2 to the display area AA; and at least a portion of the clearance cutout area MB is configured as an opening structure on at least one edge of the first chip protective adhesive 410 extending along the first direction X. In other words, there is a certain distance between the clearance cutout area MB and the edge of the first chip protective adhesive 410 extending along the first direction X. This configuration can protect the location of the clearance cutout area MB when the bending area is bent, reducing problems such as warping at the boundary of the clearance cutout area MB. For example, as shown in Figure 5, the first clearance cutout area MB1 is a circular opening structure. It is understood that the shape of the clearance cutout area MB is not limited to a circle, but can be any other suitable shape. To ensure the avoidance effect of the clearance area MB on the alignment mark MA, the clearance area MB is designed to be extended outward relative to the corresponding alignment mark MA, and the extension dimension is greater than or equal to 2mm. In other words, a gap of more than 1mm is reserved between the sidewall of the clearance area MB and the alignment mark MA.

[0138] In some exemplary embodiments, as shown in Figures 24 and 25, the driver chip 200 includes a first side a and a second side b opposite to each other in a direction from the bonding area D2 display area AA to the display area AA (i.e., the first direction X in the figure), and a third side c and a fourth side d located between the first side a and the second side b, wherein the first side a is closer to the display area AA than the second side b; wherein the second chip protective adhesive 420 is at least disposed on the first side a.

[0139] Using the above solution, a protective cover is attached to the light-emitting side of the display panel 10. In order to avoid interference or collision when the protective cover is attached to the driving chip 200, the second chip protective adhesive 420 is at least provided on the side of the driving chip 200 near the display area AA (i.e., the first side a), which can protect the driving chip 200.

[0140] In some embodiments, as shown in FIG24, the second chip protective adhesive 420 is distributed around the driver chip 200 to completely surround the driver chip 200; in other embodiments, as shown in FIG18, the second chip protective adhesive 420 is distributed on at least one of the third side c and the fourth side d, and the first side a, to partially surround the driver chip 200. It should be understood that in practical applications, the structure and size of the second chip protective adhesive 420 can be designed according to the actual product structure, and are not limited thereto.

[0141] Furthermore, in some embodiments, a gap exists between the groove sidewall of the notch area 421 and the driver chip 200. In other words, the notch area 421 is designed to extend outward relative to the driver chip 200 to prevent the second chip protective adhesive 420 from pressing against the driver chip 200 during the attachment of the second chip protective adhesive 420 to the first surface DA or the bonding of the protective cover plate. For example, the gap is greater than or equal to 0.5 mm. The shape of the notch area 421 may be adapted to the shape of the driver chip 200. However, it is not limited to this.

[0142] Furthermore, the attachment process of the second chip protective adhesive 420 to the first surface DA is performed before or after the bonding process of the panel circuit board and before the protective cover bonding process. If the attachment process of the second chip protective adhesive 420 is completed before the bonding process, in some exemplary embodiments, the dimensions of the grooved area 421 in the second chip protective adhesive 420 in the first direction X and the second direction Y are greater than a threshold value; the first direction X is the direction from the bonding area D2 to the display area AA, the second direction Y is parallel to the first surface DA and perpendicular to the first direction X, and the threshold value is the corresponding dimension of the bonding pressure head in the first direction X and the second direction during the bonding process of the driver chip 200 and the panel circuit board 300. In this way, the second chip protective adhesive 420 can be prevented from being burned during the bonding process.

[0143] Furthermore, in some embodiments, the second chip protective adhesive 420 may be an adhesive layer of a certain thickness made of materials such as resin. However, it is not limited to this; for example, the second chip protective adhesive 420 may also be a multi-layer stacked structure similar to the first chip protective adhesive 410.

[0144] Furthermore, in some embodiments, the second chip protective adhesive 420 can be a separate component. Referring to Figure 23, in some embodiments, the second chip protective adhesive 420 is independent of the panel circuit board 300. In other embodiments, the second chip protective adhesive 420 can also be integrated with the panel circuit board 300 as a single integral component.

[0145] In some embodiments, as shown in Figures 35 and 36, the panel circuit board 300 includes a circuit board body 310; the chip protector 400 further includes a release film 430, which is used to adhere to the circuit board body 310 and can be peeled off from the circuit board body 310. The release film 430 includes a first film area 431 corresponding to the circuit board body 310 and a second film area 432 corresponding to the first area DA1, wherein the second chip protective adhesive 420 is attached to the second film area 432, and the second film area 432 and the orthographic projection pattern of the second chip protective adhesive 420 on the first surface DA at least partially overlap and match in shape.

[0146] In the above scheme, the second chip protective adhesive 420 is directly attached to the release film 430, which covers the circuit board body 310 to protect the panel circuit board 300 during the process. After the bonding process of the protective cover 20 is completed, the release film 430 can be removed, and the second chip protective adhesive 420 can be peeled off from the first surface DA along with the release film 430. In this way, the release film 430 of the panel circuit board 300 can be directly used as a carrier to support the second chip protective adhesive 420. In other words, the second chip protective adhesive 420 is integrated onto the release film 430 of the panel circuit board 300, and the bonding operation of the release film 430 and the second chip protective adhesive 420 can be completed in one step, simplifying the process.

[0147] Since the release film 430 needs to be peeled off from the panel circuit board 300 in subsequent processes, the peel force between the release film 430 and the circuit board body 310 cannot be too large to facilitate subsequent peeling. During the bonding process of the protective cover 20, the second chip protective adhesive 420 needs to be firmly attached to the release film 430 to ensure reliability; therefore, the peel force between the second chip protective adhesive 420 and the release film 430 cannot be too small. Thus, in some embodiments, the peel force between the first film area 431 and the circuit board body 310 is less than or equal to the peel force between the second film area 432 and the second chip protective adhesive 420.

[0148] In some embodiments, as shown in FIG36, the release film 430 may include a first surface 430A and a second surface 430B facing away from each other. The release film 430 may be configured as a double-sided adhesive, with the adhesive surface of the first film area 431 located on the first surface 430A, and the adhesive surface of the second film area 432 located on the second surface 430B. The area on the second surface 430B, except for the second film area 432, is an adhesive-free area. The first surface 430A is attached to the circuit board body 310. In this case, the second chip protective adhesive 420 may be located on the side of the release film 430 away from the first surface DA. However, this is not a limitation.

[0149] In other embodiments, the release film 430 may be configured as a single-sided adhesive, with the adhesive surfaces of the first film region 431 and the second film region 432 both located on the first surface 430A, and the second surface 430B being an adhesive-free surface. The first surface 430A is attached to the circuit board body 310, and in this case, the second chip protective adhesive 420 may be located on the side of the release film 430 closer to the first surface DA.

[0150] It should be noted that the release film 430 can be attached to the circuit board body 310 before the bonding process of the panel circuit board 300. Therefore, the release film 430 and the second chip protective adhesive 420 need to avoid the bonding pressure head to prevent being burned by the bonding pressure head.

[0151] Specifically, in some embodiments, in the second chip protective adhesive 420, the dimensions of the grooved area 421 in the first direction X and the second direction Y are greater than a threshold; the first direction X is the direction from the bonding area D2 to the display area AA, the second direction Y is parallel to the first surface DA and perpendicular to the first direction X, and the threshold is the corresponding dimension of the bonding pressure head in the first direction X and the second direction Y during the bonding process between the driver chip 200 and the panel circuit board 300. This prevents the second chip protective adhesive 420 from being burned during the bonding process.

[0152] It should also be noted that, since the second chip protective adhesive 420 is higher than the driver chip 200 to provide better protection for the driver chip 200, the sum of the thicknesses of the second film area 432 and the second chip protective adhesive 420 in the direction perpendicular to the first surface DA can be greater than or equal to the height of the driver chip 200.

[0153] For example, the sum of the thicknesses of the second film region 432 and the second chip protective adhesive 420 can be greater than or equal to 0.3 mm. Furthermore, the thickness of the release film 430 cannot be too thick to ensure smooth subsequent peeling. For example, the thickness of the release film 430 is 0.15 mm, and the thickness of the second chip protective adhesive 420 can also be 0.15 mm. It should be understood that the above are merely examples, and the thicknesses of the release film 430 and the second chip protective adhesive 420 are not limited to these values. Moreover, unless otherwise stated, the numerical values ​​in this application are not absolute definitions, but rather represent a range of variation within a certain range of a reference value. For example, a numerical value can include a range of variation less than or equal to 10%, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to 3%, less than or equal to 2%, less than or equal to 1%, less than or equal to 0.5%, less than or equal to 0.1%, or less than or equal to 0.05%.

[0154] Furthermore, in some embodiments, the panel circuit board 300 may be a flexible printed circuit board (FPC) or a printed circuit board (PCB). For example, as shown in FIG34, the panel circuit board 300 may include a circuit board body 310, on which a plurality of exposed conductive points 311 are provided; the chip protection component 400 further includes a circuit board cover layer 312 covering the circuit board body 310, and the circuit board cover layer 312 is configured as a conductive layer and is conductive to some of the exposed conductive points 311, and the circuit board cover layer 312 may serve as a grounding film layer or an anti-signal interference film layer.

[0155] For example, the circuit board cover layer 312 can be connected to at least one of the first chip protective adhesive 410 and the second chip protective adhesive 420 and form an integral component. In some embodiments, the circuit board cover layer 312 and the heat dissipation layer 4122 are integrated into a single structure. For example, FIG34 illustrates a schematic diagram of the structure in which the circuit board cover layer 312 and the second chip protective adhesive 420 are connected as an integral component.

[0156] The display panel provided in this embodiment can be applied to a foldable display device, but is not limited thereto. For example, in the display panel provided in this embodiment, to increase the arrangement space of the battery compartment 500 in the display device, the driving chip 200 is disposed close to the edge of the protective cover 20. For instance, in the unbent state of the bending area D1, along the first direction X from the bonding area D2 to the display area AA, the distance between the driving chip 200 and the protective cover 20 can be 0.1 to 1 mm. That is, with the edge of the protective cover 20 on the bonding side D1 as a reference, the driving chip 200 is offset from the protective cover 20 in a direction away from the display area AA by 0.1 to 1 mm.

[0157] For example, when the display panel is applied in a display device, with the edge of the protective cover 20 on the bonding side D1 as a reference, the distance between the battery compartment 500 and the edge of the protective cover 20 is greater than or equal to 2 mm. The ratio of the projected area of ​​the battery compartment on the protective cover 20 to the area of ​​the protective cover 20 is 60% to 90%. For example, the ratio of the projected area of ​​the battery compartment 500 on the protective cover 20 to the area of ​​the protective cover 20 is greater than or equal to 80%.

[0158] It should be noted that, unless otherwise stated, the above values ​​are not absolute definitions, but rather represent the range of variation of the benchmark value within a certain range. For example, the value may include a range of variation less than or equal to 10%, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to 3%, less than or equal to 2%, less than or equal to 1%, less than or equal to 0.5%, less than or equal to 0.1%, or less than or equal to 0.05%.

[0159] Furthermore, this disclosure also provides a panel circuit board 300, which includes a circuit board body 310 and a chip protector 400 disposed on the circuit board body 310. The chip protector 400 is configured to be attached to a first region DA1 of the display panel 10. The specific structure of the chip protector 400 has been described in detail in the description of the structure of the chip protector 400 in the display panel 10, and will not be repeated here.

[0160] Furthermore, this disclosure also provides a display module, including a display panel 10 and a protective cover plate 20, wherein the protective cover plate 20 is disposed on the light-emitting side of the display panel 10. Obviously, the display module provided in this disclosure also has the beneficial effects of the display panel provided in this disclosure, which will not be elaborated further here.

[0161] Furthermore, this disclosure also provides a method for manufacturing a display module, the method comprising the following steps: attaching a protective cover plate 20 to the light-emitting side of a display panel to obtain the display module, wherein before attaching the protective cover plate 20 to the display panel, the display panel is provided with a chip protection member 400 at least in the first region DA1.

[0162] In some exemplary embodiments, the method specifically includes the following steps:

[0163] Step S01: Provide a display substrate 100 and a panel circuit board 300. The bending area D1 of the display substrate 100 is in an unbent state. The release film 430 is attached to the circuit board body 310 of the panel circuit board 300. The second film area 432 of the release film 430 is attached to the first area DA1 so that the second chip protective adhesive 420 surrounds the periphery of the driver chip 200.

[0164] Step S02: Bind and connect the driver chip 200 to the panel circuit board 300;

[0165] Step S03: Bend the bending area D1 in a direction away from the light-emitting side of the display panel so that the panel circuit board 300 is located on the side of the display panel away from the light-emitting side.

[0166] Step S04: Attach the protective cover plate 20 to the light-emitting side of the display panel;

[0167] Step S05: Remove the release film 430 to simultaneously peel the release film 430 and the second chip protective adhesive 420 from the display panel.

[0168] The following points need to be explained:

[0169] (1) The accompanying drawings of the embodiments of this disclosure only involve the structures involved in the embodiments of this disclosure. Other structures can be referred to the general design.

[0170] (2) For clarity, the thickness of layers or regions is enlarged or reduced in the drawings used to describe embodiments of the present disclosure, i.e., these drawings are not drawn to actual scale. It will be understood that when an element such as a layer, film, region or substrate is referred to as being “above” or “below” another element, the element may be “directly” located “above” or “below” the other element or there may be intermediate elements.

[0171] (3) Where there is no conflict, the embodiments of this disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0172] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. The scope of protection of this disclosure shall be determined by the scope of the claims.

Claims

1. A display panel, wherein, The display substrate comprises a display area and a peripheral area, the peripheral area comprises a bending area connected to the display area and a binding area connected to the bending area; a driving chip is arranged in the binding area; and a panel circuit board is electrically connected to the driving chip, the binding area is bent towards the direction away from the light-out side of the display panel through the bending area, so that the panel circuit board is located on the side of the display panel away from the light-out side; wherein the driving chip is bound on a first surface of the peripheral area, a region surrounding the periphery of the driving chip on the first surface is a first region, and a chip protection member is arranged at least in the first region. The chip protection member comprises:

2. The display panel according to claim 1, wherein, a first chip protection adhesive, which covers at least the side surface of the driving chip away from the first surface and the first region; and / or a second chip protection adhesive, which is provided with a groove area, the driving chip is accommodated in the groove area, so that the second chip protection adhesive surrounds the driving chip, and the second chip protection adhesive only covers the first region. The adhesive surface of at least one of the first chip protection adhesive and the second chip protection adhesive for adhering to the first surface comprises a first adhesive area and a second adhesive area, the first adhesive area is adhered to the panel circuit board, and the second adhesive area is adhered to the side surface of the driving chip away from the first surface and the first region.

3. The display panel of claim 2, wherein, The peeling force between the first adhesive area and the panel circuit board is greater than or equal to the peeling force between the second adhesive area and the driving chip.

4. The display panel of claim 3, wherein, The peeling force between the first adhesive area and the panel circuit board is greater than or equal to 1000 gf / inch; the peeling force between the second adhesive area and the driving chip is greater than or equal to 600 gf / inch.

5. The display panel according to claim 4, wherein, The main material of at least one of the first chip protection adhesive and the second chip protection adhesive comprises a heat dissipation material.

6. The display panel of claim 2, wherein, At least one of the first chip protection adhesive and the second chip protection adhesive comprises a first film layer and at least one second film layer, the first film layer is an insulating adhesive tape, and the second film layer is stacked on the side of the insulating adhesive tape away from the first surface.

7. The display panel of claim 2, wherein, The at least one second film layer comprises a conductive film layer, and the conductive film layer is configured as a ground layer or an anti-signal interference layer heat dissipation film; 8. The display panel of claim 7, wherein, or The at least one second film layer comprises a heat dissipation layer and a conductive film layer stacked on the side of the heat dissipation layer away from the first film layer, and the conductive film layer is configured as a ground layer or an anti-signal interference layer. In the direction perpendicular to the first surface, the second chip protection adhesive has a first height, the driving chip has a second height, and the first height is greater than or equal to the second height.

9. The display panel of claim 2, wherein, The height difference between the first height and the second height is greater than or equal to 0.3 mm.

10. The display panel of claim 9, wherein, ​ 11. The display panel of claim 2, wherein, The driving chip includes a first side and a second side opposite in a direction from the display area to the binding area, and a third side and a fourth side between the first side and the second side, wherein the first side is closer to the display area relative to the second side; wherein the second chip protection glue is arranged at least on the first side.

12. The display panel of claim 11, wherein, The second chip protection glue is distributed on the four sides of the driving chip to fully surround the driving chip; or the second chip protection glue is distributed on at least one of the third side and the fourth side and the first side to semi-enclose the driving chip.

13. The display panel of claim 11, wherein, The gap is greater than or equal to 0.5 mm.

14. The display panel of claim 13, wherein, The panel circuit board includes a circuit board body; the chip protection member further includes a release film, which is used to be attached to the circuit board body and can be peeled off from the circuit board body, and the release film includes a first film area corresponding to the circuit board body and a second film area corresponding to the first area, wherein the second chip protection glue is attached to the second film area, and the second film area and the second chip protection glue are at least partially coincident and shape-matched in a projection pattern on the first surface.

15. The display panel of claim 2, wherein, The peeling force between the first film area and the circuit board body is less than or equal to the peeling force between the second film area and the second chip protection glue.

16. The display panel of claim 15, wherein, In the second chip protection glue, the size of the groove area in the first direction and the second direction is greater than a threshold value; wherein the first direction is from the binding area to the display area, the second direction is parallel to the first surface and perpendicular to the first direction, and the threshold value is the corresponding size of the binding pressure head in the binding process of the driving chip and the panel circuit board in the first direction and the second direction.

17. The display panel of claim 15, wherein, The binding area is provided with an alignment mark, and either of the first chip protection glue and the second chip protection glue is provided with a avoiding hollow area at a position corresponding to the alignment mark, and the avoiding hollow area is used to avoid the alignment mark.

18. The display panel of claim 2, wherein, The panel circuit board can include a circuit board body, and the circuit board body is provided with exposed conductive points; the chip protection member further includes a circuit board covering layer covering the circuit board body, and the circuit board covering layer is configured as a conductive layer, specifically, the circuit board covering layer can be used as a ground film layer or an anti-signal interference film layer; the circuit board covering layer is connected with at least one of the first chip protection glue and the second chip protection glue and serves as an integral component.

19. The display panel of claim 2, wherein, The panel circuit board includes a circuit board body and a chip protection member arranged on the circuit board body, wherein the chip protection member is configured to be attached to a first area of the display panel.

20. A panel circuit board, wherein, The display panel includes:

21. A display module, wherein, The display panel includes: A protective cover plate is arranged on the light-emitting side of the display panel. The method is applied to the display module of claim 21, and the method includes the following steps:

22. A method for manufacturing a display module, wherein, The display panel includes: The display module is obtained by adhering the protective cover plate to the light-emitting side of the display panel, wherein the display panel is provided with the chip protection piece at least in the first area before the display panel is adhered to the protective cover plate.

23. The method of claim 22, wherein, When applied to the display panel of claim 15, the method specifically comprises: providing a display substrate and a panel circuit board, the bending area of the display substrate being in an unbent state, the circuit board main body of the panel circuit board being attached with the release film, the second film area of the release film being attached on the first area so that the second chip protection glue surrounds the periphery of the driving chip; binding and connecting the driving chip and the panel circuit board; bending the bending area towards the direction away from the light-emitting side of the display panel, so that the panel circuit board is located on the side of the display panel away from the light-emitting side; adhering the protective cover plate to the light-emitting side of the display panel; tearing off the release film to simultaneously peel off the release film and the second chip protection glue from the display panel.

Images