Electronic component transfer device

Abstract

The present application relates to the technical field of automation, and discloses an electronic component transfer device. The electronic component transfer device comprises a base platform, a first stage, a second stage, a camera, and a transfer head. The first stage is used for bearing a first substrate, the second stage is used for bearing a second substrate, and the second substrate is provided with a plurality of first positioning portions. The electronic component transfer device can acquire the first position information of at least some of the first positioning portions relative to the base platform by means of the camera, and then corrects the position information of each connecting portion in the second substrate theoretically relative to the base platform on the basis of the first position information of these first positioning portions, thereby obtaining the second position information of each connecting portion actually relative to the base platform. In this way, the electronic component transfer device can accurately align the connecting portions with corresponding electronic components, so as to ensure that each electronic component can be precisely transferred to the corresponding connecting portion, thereby improving the transfer precision of the electronic component transfer device for electronic components.

Description

Electronic component transfer equipment

[0001] This application claims priority to Chinese Patent Application No. 202410692241.0, filed on May 30, 2024, entitled "Transfer Device for Electronic Components", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of automation technology, and in particular to a device for transferring electronic components. Background Technology

[0003] With the development of display technology, LED (Light-Emitting Diode) light-emitting elements have advantages such as pure color, wide dynamic range, high brightness, high definition, low operating voltage, low power consumption, long life, impact resistance, wide viewing angle, and stable and reliable operation. Therefore, display substrates integrating LED light-emitting elements have become the most advantageous new generation of display media and have been widely used.

[0004] LED light-emitting elements are typically mounted on a driver backplane, and these elements emit light under the drive of the backplane. Usually, a transfer device is needed to mount the LED light-emitting elements onto the driver backplane.

[0005] However, currently, during the process of fixing LED light-emitting elements onto the driver backplane, both the light-emitting element transfer device and the driver backplane are prone to deviation, resulting in low accuracy of the light-emitting element transfer device in fixing the LED light-emitting elements. Summary of the Invention

[0006] This application provides a transfer device for electronic components. It solves the problem of low precision in fixing LED light-emitting elements in existing transfer devices. The technical solution is as follows:

[0007] On the one hand, an electronic component transfer device is provided, comprising:

[0008] abutment;

[0009] A first platform movably connected to the base, the first platform being used to support a first substrate, the first substrate being a flexible substrate, and the first substrate including multiple electronic components;

[0010] A second platform located on the base, the second platform being used to support a second substrate, and the second substrate including: a plurality of connecting portions and at least one first positioning portion;

[0011] A camera, and a transfer head movably connected to the base, the transfer head including a pin;

[0012] The transfer device is configured to: acquire first position information of the first positioning part through the camera, and acquire second position information of each of the connecting parts according to the first position information; control the first stage and the transfer head to move according to the second position information of the target connecting part, so that the target electronic component is aligned with the target connecting part, and after the ejector pin is located on the side of the target electronic component away from the target connecting part, control the ejector pin to apply a force to the side of the first substrate away from the second substrate, so as to transfer the target electronic component onto the target connecting part;

[0013] The target connection part is any one of the plurality of connection parts, and the target electronic component is the electronic component that corresponds to the target connection part among the plurality of electronic components.

[0014] Optionally, there are multiple first positioning parts, which are arranged in an array on the second substrate. At least some of the first positioning parts constitute a first positioning part group, and the first positioning parts constituting a first positioning part group are not completely located in the same row or column.

[0015] At least a portion of the plurality of connecting portions are located within the area enclosed by the first positioning portion group.

[0016] Optionally, the transfer device is configured to: acquire first position information of each first positioning part in the first positioning part group through the camera, and acquire second position information of each connecting part in the area enclosed by the first positioning part group based on the first position information of each first positioning part in the first positioning part group and the first relative position information of the connecting part.

[0017] The first relative position information includes the relative position information between the connecting part and the second substrate.

[0018] Optionally, the plurality of first positioning parts in the first positioning part group include: a first reference positioning part and at least one second reference positioning part;

[0019] The transfer device is configured to: acquire first position information of the first reference positioning unit via the camera, and use the first position information of the first reference positioning unit as the theoretical position information of the first reference positioning unit; determine the theoretical position information of each second reference positioning unit based on the theoretical position information of the first reference positioning unit and the positional relationship between the first reference positioning unit and each second reference positioning unit; acquire first position information of each second reference positioning unit via the camera; determine deformation compensation parameters corresponding to each connecting part within the area enclosed by the first positioning units based on the deviation between the first position information and the theoretical position information of each second reference positioning unit; and determine second position information of each connecting part based on the deformation compensation parameters of each connecting part and the corresponding first relative position information of the connecting part.

[0020] The first relative position information includes the relative position information between the connecting portion and the first reference positioning portion in the second substrate.

[0021] Optionally, there may be multiple first positioning part groups, and the first positioning parts constituting each first positioning part group are not necessarily located in the same row or column.

[0022] At least some of the plurality of connecting portions are located within the regions enclosed by different first positioning portion groups, and the regions enclosed by the plurality of first positioning portion groups are arranged in an array.

[0023] Optionally, the first platform includes a second positioning unit;

[0024] The transfer device is configured to: after the first substrate is supported on the first stage, acquire third position information of the second positioning part through the camera, and acquire fourth position information of each of the electronic components based on the third position information;

[0025] Based on the second position information of the target connector and the fourth position information of the target electronic component, the first stage is controlled to move so that the target electronic component is aligned with the target connector.

[0026] Optionally, the transfer device is configured to:

[0027] The camera acquires the third position information of the second positioning unit, and based on the third position information and the second relative position information of the electronic component, acquires the fourth position information of the electronic component.

[0028] The second relative position information includes the relative position information between the electronic component and the first substrate.

[0029] Optionally, the camera is movably connected to the base, and the camera and the transfer head can move synchronously relative to the base; the second platform includes a third positioning unit; the transfer device is further configured to perform at least one device calibration process until the movement of the camera and the first platform meets preset conditions;

[0030] One of the device calibration processes includes: after controlling the first platform to move relative to the base to a position where the center point of the second positioning part and the center point of the third positioning part coincide in the third direction, and controlling the camera to move relative to the base to a position where the shooting center of the camera coincides with the center point of the third positioning part, receiving a movement command for controlling the camera or the first platform to move; controlling the camera and the first platform to move according to the movement command, and generating corresponding calibration parameters based on the deviation between the shooting center of the camera after the movement and the center point of the second positioning part after the movement of the first platform, so that the transfer device can adjust the process of controlling the movement of the camera and / or the first platform according to the calibration parameters;

[0031] The preset conditions include: after the camera and the first platform are moved according to the movement command, the deviation between the shooting center of the camera and the center point of the second positioning part is less than a preset deviation threshold.

[0032] Optionally, the transfer device further includes: a first support frame, and a first temperature sensor fixed on the first support frame;

[0033] The first support frame is movably connected to the base and to the first platform; the first support frame can drive the first platform to move together along a first direction, and the first platform can move relative to the first support frame along a second direction, the first direction and the second direction intersecting.

[0034] The transfer device is further configured to: acquire a first temperature of the first support frame detected by the first temperature sensor, and acquire a first deformation of the first support frame based on the first temperature; based on the first deformation, as well as the second position information of the target connection and the fourth position information of the target electronic component, control the first stage to move so that the target electronic component is aligned with the target connection.

[0035] Optionally, the first support frame includes: a first crossbeam structure extending along the second direction; the base includes: a first track and a second track disposed opposite to each other in the second direction, both the first track and the second track extending along the first direction;

[0036] Wherein, the first end of the first crossbeam structure is slidably connected to the first track and is in contact with the first guide rail; the second end of the first crossbeam structure is slidably connected to the second track and has a first clearance space between it and the second guide rail for allowing the first crossbeam structure to deform.

[0037] Optionally, the first support frame further includes: a first scale fixed on the first crossbeam structure, and the transfer device is used to: control the stroke of the first platform moving along the second direction on the first crossbeam structure according to the scale of the first scale;

[0038] The first scale can deform along with the first crossbeam structure.

[0039] Optionally, the transfer device further includes: a first position sensor capable of moving synchronously with the first platform, the first position sensor being used in conjunction with the first scale to determine the travel distance of the first platform relative to the first beam structure.

[0040] Optionally, the number of the first temperature sensors is N, and the N first temperature sensors are arranged sequentially along the second direction; where N is an integer greater than or equal to 2.

[0041] Optionally, the first beam structure has N first segmented intervals arranged sequentially along the second direction, and the N first temperature sensors correspond one-to-one with the N first segmented intervals, with one first temperature sensor located in the corresponding first segmented interval;

[0042] The transfer device is configured to: determine the theoretical endpoint position of the first stage after movement based on the second position information of the target connection and the fourth position information of the target electronic component; determine a first target segment interval among the N first segment intervals, wherein the theoretical endpoint position of the first stage after movement is located within the first target segment interval; designate the first target segment interval, and each first segment interval located near the first end of the first target segment interval close to the first beam structure, as at least one first designated segment interval; and determine the actual endpoint position of the first stage after movement based on the temperature detected by the first temperature sensor corresponding to each first designated segment interval, the length of each first designated segment interval in the second direction, and the expansion coefficient of the first beam structure.

[0043] Optionally, the endpoint position of the first platform after movement can be characterized by coordinates distributed in the second direction; each of the first segment intervals has a first coordinate and a second coordinate distributed in the second direction, the first coordinate being closer to the first end of the first beam structure than the second coordinate; the first coordinate of the first segment interval closest to the first end of the first beam structure among the N first segment intervals is a fixed coordinate Y1.

[0044] The first and second coordinates of the first target segment interval are respectively: Y i and Y i+1 ; i is an integer less than or equal to N;

[0045] The difference between the theoretical endpoint coordinates of the first platform after its movement and the fixed coordinate Y1 is: △Ya;

[0046] When i=1, the first target segment interval is the first segment interval closest to the first end of the first beam structure among the N first segment intervals, and the actual endpoint coordinate Ya after the first platform moves is: Ya=Y1+(T1-T0)×α×L1×△Ya;

[0047] When i > 1, the actual endpoint coordinates of the first platform after its movement are: Ya = Y1 + (T1 - T0) × α × L1 + ... + (T i -T0)×α×L i ×(△Ya-L1-…… -L i-1 );

[0048] Wherein, T1 represents the temperature detected by the first temperature sensor corresponding to the first segment closest to the first end of the first beam structure among the N first segment intervals; T i T0 represents the temperature detected by the first temperature sensor corresponding to the first target segment interval; α represents the expansion coefficient of the first beam structure; L1 represents the length of the first segment interval closest to the first end of the first beam structure among the N first segment intervals; L i This represents the length of the first target segment interval.

[0049] Optionally, the number of the first temperature sensors is one;

[0050] The endpoint position of the first platform after its movement can be represented by coordinates distributed in the second direction;

[0051] The coordinates of the first end of the first beam structure distributed in the second direction are fixed coordinates Y1;

[0052] The difference between the theoretical endpoint coordinates of the first platform after its movement and the fixed coordinate Y1 is: △Ya;

[0053] The actual endpoint coordinates Ya of the first platform after its movement are: Ya = Y1 + (T1 - T0) × α × L × △Ya;

[0054] Where T1 represents the temperature detected by the first temperature sensor; T0 represents the initial temperature; α represents the coefficient of thermal expansion of the first beam structure; and L represents the length of the first beam structure.

[0055] Optionally, the transfer device further includes: a second support frame, and a second degree sensor fixed on the second support frame;

[0056] The second support frame is movably connected to the base and to the transfer head; the second support frame can drive the transfer head to move together along the first direction, and the transfer head can move relative to the second support frame along the second direction, the first direction and the second direction intersect;

[0057] The transfer device is further configured to: acquire a second temperature of the second carrier detected by the second temperature sensor, and acquire a second deformation of the second carrier based on the second temperature; control the transfer head to move based on the second deformation and the second position information of the target connection portion, so that the pin is located on the side of the target electronic component away from the target connection portion.

[0058] Optionally, the second support frame includes: a second crossbeam structure extending along the second direction; the base includes: a first track and a second track disposed opposite to each other in the second direction, both the first track and the second track extending along the second direction;

[0059] Wherein, the first end of the second crossbeam structure is slidably connected to the first track and is in contact with the first slide rail; the second end of the second crossbeam structure is slidably connected to the second track and has a second clearance space between it and the second guide rail for allowing the second crossbeam structure to deform.

[0060] Optionally, the second support frame further includes: a second scale fixed on the second crossbeam structure, and the transfer device is used to: control the stroke of the transfer head moving along the second direction on the second crossbeam structure according to the scale of the second scale;

[0061] The second scale can deform along with the second crossbeam structure.

[0062] Optionally, the transfer device further includes a second position sensor capable of moving synchronously with the transfer head, the second position sensor being used in conjunction with the second scale to determine the stroke of the transfer head relative to the second beam structure.

[0063] Optionally, the number of the second temperature sensors is M, and the M second temperature sensors are arranged sequentially along the second direction; M is an integer greater than or equal to 2.

[0064] Optionally, the second beam structure has M second segment intervals arranged sequentially along the second direction, and the M second temperature sensors correspond one-to-one with the M second segment intervals, with one second temperature sensor located in the corresponding second segment interval;

[0065] The transfer device is configured to: determine the theoretical endpoint position of the transfer head after movement based on the second position information of the target connection; determine a second target segment interval among the M second segment intervals, wherein the theoretical endpoint position of the transfer head after movement is located within the second target segment interval; designate the second target segment interval, and each second segment interval located near the first end of the second target segment interval close to the second crossbeam structure, as: at least one second designated segment interval; and determine the actual endpoint position of the transfer head after movement based on the temperature detected by the second temperature sensor corresponding to each second designated segment interval, the length of each second designated segment interval in the second direction, and the expansion coefficient of the second crossbeam structure.

[0066] Optionally, the endpoint position of the transfer head after movement can be characterized by coordinates distributed in the second direction; each of the second segment intervals has a first coordinate and a second coordinate distributed in the second direction, the first coordinate being closer to the first end of the second beam structure relative to the second coordinate; the first coordinate of the second segment interval closest to the first end of the second beam structure among the M second segment intervals is a fixed coordinate Y1;

[0067] The first and second coordinates of the second target segment interval are: Y j and Y j+1 j is an integer less than or equal to M;

[0068] The difference between the theoretical endpoint coordinates of the transfer head after its movement and the fixed coordinate Y1 is: △Yb;

[0069] When j=1, the second target segment interval is the second segment interval closest to the first end of the second crossbeam structure among the M second segment intervals, and the actual endpoint coordinate Yb after the transfer head moves is: Yb=Y1+(T1'-T0)×β×L1'×△Yb;

[0070] When j > 1, the actual endpoint coordinates of the transfer head after movement are: Yb = Y1 + (T1' - T0) × β × L1' + ... + (T j '-T0)×β×L j '×(△Yb -L1'-……-L j-1 ');

[0071] Wherein, T1' represents the temperature detected by the second temperature sensor corresponding to the second segment closest to the first end of the second beam structure among the M second segment intervals; T j ' represents the temperature detected by the second temperature sensor corresponding to the second target segment interval; T0 represents the initial temperature; β represents the expansion coefficient of the second beam structure; L1' represents the length of the second segment interval closest to the first end of the second beam structure among the M second segment intervals; L i ' represents the length of the second target segment interval.

[0072] Optionally, the number of the second temperature sensors is one;

[0073] The endpoint position of the transfer head after its movement can be characterized by coordinates distributed in the second direction;

[0074] The first end of the second beam structure has a fixed coordinate Y1 in the second direction.

[0075] The difference between the theoretical endpoint coordinates of the transfer head after its movement and the fixed coordinate Y1 is: △Yb;

[0076] The actual endpoint coordinates Yb after the transfer head has moved are: Yb=Y1+(T1'-T0)×β×L'×△Yb;

[0077] Where T1' represents the temperature detected by the second temperature sensor; T0 represents the initial temperature; β represents the expansion coefficient of the second beam structure; and L' represents the length of the second beam structure.

[0078] Optionally, the transfer device further includes: an adapter frame and a second support frame;

[0079] The second support frame is movably connected to the base and also movably connected to the adapter frame; the second support frame can drive the adapter frame to move together along a first direction, and the adapter frame can move relative to the second support frame along a second direction, wherein the first direction and the second direction intersect.

[0080] The transfer head further includes a transfer head body movably connected to the ejector pin, and the transfer head body is fixedly connected to the adapter frame.

[0081] Optionally, the plurality of connecting portions are arranged in multiple rows along the first direction and in multiple columns along the second direction;

[0082] The transfer device is configured to: control the adapter to move at a constant speed along a first moving direction on a row of connecting portions where the target connecting portion is located; and control the ejector pin to move along a second moving direction during the process of the ejector pin applying a force to the side of the first substrate away from the second substrate.

[0083] The first moving direction is opposite to the second moving direction, and both are parallel to the second direction.

[0084] Optionally, the transfer device is further configured to: after the target electronic component is transferred to the target connection portion, control the ejector pin to move along the first moving direction, and the moving speed of the ejector pin is greater than the moving speed of the adapter frame, so as to reset the ejector pin.

[0085] Optionally, the adapter is fixedly connected to the camera.

[0086] Optionally, the second position information of the connecting part includes: the planar coordinates of the first feature point of the connecting part in the coordinate system of the transfer device;

[0087] The fourth position information of the electronic component includes: the planar coordinates of the second feature point of the electronic component in the coordinate system of the transfer device;

[0088] The planar coordinates in the coordinate system of the transfer device include coordinate information in a first direction and coordinate information in a second direction.

[0089] Optionally, the transfer device further includes a ranging sensor movably connected to the base;

[0090] The transfer device is further configured to: determine a target distance in a third direction between the target connection portion and the ejector pin via the ranging sensor, and control the ejector pin to move toward the side of the first substrate away from the second substrate according to the target distance, so as to apply a force to the side of the first substrate away from the second substrate.

[0091] Optionally, the second substrate has a plurality of preset points; the transfer device is configured to: acquire position information of each of the preset points in a third direction through the ranging sensor, and determine position information of each of the connecting parts in a third direction based on the position information of each of the preset points in a third direction; and determine the target distance between the target connecting part and the ejector pin based on the position information of the target connecting part in a third direction.

[0092] Optionally, the region formed by a portion of the preset points at least partially overlaps with the central region of the second substrate, and the region formed by a portion of the preset points is located within the region formed by another portion of the preset points.

[0093] Optionally, the transfer device is configured to: after acquiring the position information of each of the preset points in the third direction, identify the preset point that is farthest or closest to the ranging sensor among the multiple preset points as the target preset point; determine multiple contour curves in the second substrate based on the position information of the target preset point and other preset points in the third direction; and determine the position information of each of the connecting parts in the third direction based on the multiple contour curves.

[0094] Optionally, the position information of the preset point in the third direction includes: the height of the preset point; the transfer device is configured as follows:

[0095] If the height difference between at least two of the other preset points is less than a preset height difference threshold, a first contour curve is generated based on the position information of the target preset point and the at least two first other preset points on the second substrate. The first contour curve bends around the target preset point, and the distance between the at least two first other preset points and the first contour curve is less than the preset height difference threshold.

[0096] If at least one second other preset point exists among the other preset points, at least one second contour curve is generated based on the position information of the target preset point and each of the second other preset points on the second substrate. The second contour curve bends around the target preset point, and the second other preset point coincides with a corresponding second contour curve. The height difference between the second other preset point and any other preset point is greater than the preset height difference threshold.

[0097] Optionally, the positions of each of the preset points on the second substrate do not coincide with the positions of the plurality of connecting portions on the second substrate.

[0098] Optionally, the preset point coincides with the position of the first positioning part.

[0099] Optionally, the transfer device further includes: a first hopper and a second hopper, a feeding mechanism cooperating with the first hopper, and a discharging mechanism cooperating with the second hopper;

[0100] The first hopper is used to hold a first substrate that has not undergone electronic component transfer, and the loading mechanism is used to grab a first substrate and transfer the first substrate to the first carrier.

[0101] The second hopper is used to hold the first substrate that has undergone electronic component transfer, and the unloading structure is used to grab the first substrate that has undergone electronic component transfer on the first platform and transfer the first substrate into the second hopper.

[0102] Optionally, the transfer device further includes: a lifting mechanism connected to the second platform, and a transmission mechanism passing through the base;

[0103] The transmission mechanism is used to transmit the second substrate;

[0104] The lifting mechanism is used to: after the transmission mechanism transfers the second substrate, which has not yet been distributed with electronic components, to the second platform, drive the second platform to rise so that the second substrate is separated from the transmission mechanism; after the transferred electronic components are distributed on the second substrate, drive the second platform to fall so that the second substrate contacts the transmission mechanism, so that the transmission mechanism transfers the second substrate with distributed electronic components to the outside of the platform.

[0105] The beneficial effects of the technical solutions provided in this application include at least the following:

[0106] An electronic component transfer device includes: a base, a first stage, a second stage, a camera, and a transfer head. The first stage carries a first substrate, and the second stage carries a second substrate. The second substrate may have multiple first positioning portions. The electronic component transfer device can acquire first position information of at least some of the first positioning portions relative to the base using the camera. Then, based on this first position information, the device can correct the theoretical position information of each connecting portion in the second substrate relative to the base, thereby obtaining second position information of each connecting portion relative to the base. In this way, the electronic component transfer device can accurately align the connecting portions in the second substrate with the corresponding electronic components on the first substrate based on the second position information of each connecting portion, ensuring that each electronic component in the first substrate can be accurately transferred to the corresponding connecting portion in the second substrate, thus improving the transfer accuracy of the electronic components. Attached Figure Description

[0107] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0108] Figure 1 is a schematic diagram of the structure of an electronic component transfer device provided in an embodiment of this application;

[0109] Figure 2 is a schematic diagram of the structure of a first substrate provided in an embodiment of this application;

[0110] Figure 3 is a cross-sectional view of the electronic component transfer device shown in Figure 1;

[0111] Figure 4 is a top view of a first substrate and a second substrate provided in an embodiment of this application;

[0112] Figure 5 is a schematic diagram of the structure of another electronic component transfer device provided in an embodiment of this application;

[0113] Figure 6 is a top view of an electronic component transfer device provided in an embodiment of this application;

[0114] Figure 7 is a top view of a first substrate and a second substrate after alignment according to an embodiment of this application;

[0115] Figure 8 is a schematic diagram of the structure of another electronic component transfer device provided in an embodiment of this application;

[0116] Figure 9 is a partial enlarged view of an electronic component transfer device provided in an embodiment of this application;

[0117] Figure 10 is a top view of another electronic component transfer device provided in an embodiment of this application;

[0118] Figure 11 is a schematic diagram of the structure of another electronic component transfer device provided in an embodiment of this application;

[0119] Figure 12 is a top view of another first substrate and second substrate provided in an embodiment of this application;

[0120] Figure 13 is a schematic diagram of a transfer head movement provided in an embodiment of this application;

[0121] Figure 14 is a schematic diagram of another transfer head movement provided in an embodiment of this application;

[0122] Figure 15 is a schematic diagram of another type of transfer head movement provided in an embodiment of this application;

[0123] Figure 16 is a top view of another first substrate and second substrate provided in an embodiment of this application;

[0124] Figure 17 is a top view of another first substrate and second substrate provided in the embodiments of this application;

[0125] Figure 18 is a top view of a second substrate provided in an embodiment of this application;

[0126] Figure 19 is a schematic diagram of the height of each preset point in Figure 18;

[0127] Figure 20 is a schematic diagram of the structure of an electronic component transfer device according to another embodiment of this application;

[0128] Figure 21 is a cross-sectional view of an electronic component transfer device provided in an embodiment of this application. Detailed Implementation

[0129] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0130] This application provides an electronic component transfer device. Please refer to Figure 1. Figure 1 is a structural schematic diagram of an electronic component transfer device provided in this application. The electronic component transfer device 000 may include: a base 100, a first stage 200, a second stage 300, a camera 400, and a transfer head 500.

[0131] The first stage 200 in the electronic component transfer device 000 can be movably connected to the base 100. The first stage 200 in the transfer device 000 can be used to carry a first substrate 010, which can be a flexible substrate and can include a plurality of electronic components 011.

[0132] It should be noted that, referring to Figure 2, which is a schematic diagram of the structure of a first substrate provided in an embodiment of this application, the first substrate 010 may include: a carrier film 012, and a mother-daughter ring 013 connected to the edge of the carrier film 012. A placement area Q may be provided in the central portion of the carrier film 012 in the first substrate 010, and multiple electronic components 021 in the first substrate 010 may be distributed within the placement area Q. Furthermore, the carrier film 012 in the first substrate 010 may be a flexible carrier film, thus the first substrate 010 may be a flexible substrate. Each position of the edge of the flexible carrier film 012 may be connected to the mother-daughter ring 013, so that the mother-daughter ring 013 can tension the flexible carrier film 012 as a whole, facilitating subsequent die bonding of the electronic components 011 carried by the carrier film 012.

[0133] The second stage 300 in the electronic component transfer device 000 can be located on the base 100, and the second stage 300 can be used to support the second substrate 020. The second substrate 020 can include a plurality of connecting portions 021 and at least one first positioning portion 022. Here, the electronic component transfer device 000 can be used to fix each electronic component 011 in the first substrate 010 to the corresponding connecting portion 021 in the second substrate 020, so that the electronic component 011 transferred to the second substrate 020 can be electrically connected to the corresponding connecting portion 021. That is, the electronic component transfer device 300 can complete the die bonding of each electronic component 011 in the first substrate 010. It should be noted that the electronic components 011 and connecting portions 021 are not marked in FIG. 1, but will be marked in subsequent embodiments.

[0134] It should be noted that the electronic component 011 in this embodiment can be an LED light-emitting element, and the second substrate 020 can be a driving backplate for driving the LED light-emitting element to emit light. In this way, after the transferred LED light-emitting elements are connected to each of the connecting portions 021 in the second substrate 020, a display panel capable of displaying images can be obtained, or a light-emitting substrate capable of providing a light source for a liquid crystal display panel can be obtained.

[0135] The camera 400 in the electronic component transfer device 000 can capture images.

[0136] For example, camera 400 can be movably connected to base 100. This movable connection means that when the transfer device 000 is in operation, the relative position of camera 400 and base 100 is variable, so that camera 400 can freely move to each positioning part to acquire position information of the first substrate and the second substrate.

[0137] For example, the camera 400 can also be fixedly connected to the base 100. That is, when the transfer device 000 is in operation, the relative position of the camera 400 and the base 100 is fixed. The camera 400 can collect the position of each positioning part to obtain the position information of the first substrate and the second substrate.

[0138] For example, there can be multiple cameras 400. The position information of different positioning units can be obtained through different cameras 400, thus achieving high positioning efficiency.

[0139] The transfer head 500 in the electronic component transfer device 000 can be movably connected to the base 100. Please refer to Figure 3, which is a cross-sectional view of the electronic component transfer device shown in Figure 1. The transfer head 500 in the electronic component transfer device 000 may include a pin 501.

[0140] In this application, the electronic component transfer device 000 can acquire the first position information of the first positioning part 022 in the second substrate 020 through the camera 400, and acquire the second position information of each connecting part 021 in the second substrate 020 based on the first position information. After the electronic component transfer device 000 acquires the second position information of each connecting part 021 in the second substrate 020, it can control the first stage 200 and the transfer head 500 to move according to the second position information of the target connecting part in the second substrate 020, so that the target electronic component is aligned with the target connecting part, and the ejector pin 501 is positioned on the side of the target electronic component away from the target connecting part. Then, the ejector pin 501 is controlled to apply force to the side of the first substrate 010 away from the second substrate 020 to transfer the target electronic component onto the target connecting part, thereby achieving die bonding of the target electronic component. Here, the target connecting part can be any one of the multiple connecting parts 021 in the second substrate 020, and the target electronic component can be the electronic component 011 corresponding to the target connecting part among the multiple electronic components 011 in the first substrate 010.

[0141] It should be noted that after the second stage 300 in the electronic component transfer device 000 carries the second substrate 020, the electronic component transfer device 000 can control the camera 400 to capture an image of at least one of the first positioning parts 022 on the second substrate 020 to obtain an image containing the first positioning part 022. In one possible implementation, the electronic component transfer device 000 can obtain the position information of the first positioning part 022 relative to the base 100 based on the image and use it as the first position information. That is, the first position information of the first positioning part 022 refers to the actual position information of the first positioning part 022 relative to the base 100.

[0142] Then, the electronic component transfer device 000 can obtain the second position information of each connecting part 021 based on the first position information of the first positioning part 022 and the theoretical relative positional relationship between the first positioning part 022 and each connecting part 021. Here, the theoretical relative positional relationship between the first positioning part 022 and each connecting part 021 can be obtained after the second substrate 020 is designed and fabricated. The second position information of each connecting part 021 can be considered as the actual position information of the connecting part 021 relative to the base 100.

[0143] However, after the second substrate 020 is fabricated, before it is transferred to the second stage 300 in the electronic component transfer device 000, the second substrate 020 may undergo local deformation, which may cause a change in the relative positional relationship between each connecting part 021 and the first positioning part 022. If the electronic component transfer device 000 continues to obtain the actual positional information of each connecting part 021 relative to the base 100 according to the theoretical relative positional relationship between each connecting part 021 and the first positioning part 022, then during the subsequent transfer of each electronic component 011 in the first substrate 010, each electronic component 011 cannot be accurately aligned with the connecting part 021, resulting in a significant reduction in the transfer accuracy of the electronic component transfer device 000 for the electronic component 011, and consequently, a lower reliability of the resulting display panel.

[0144] Therefore, in another possible implementation, the second substrate 020 may include multiple first positioning portions 022. The electronic component transfer device 000 can acquire first position information of at least some of the first positioning portions 022 through the camera 200, and then, based on the first position information of these first positioning portions 022, correct the theoretical position information of each connecting portion 021 relative to the base 100, thereby obtaining the second position information of each connecting portion 021 actually relative to the base 100, and the second position information of these connecting portions 021 can truly reflect their actual position information relative to the base 100.

[0145] In this way, the subsequent electronic component transfer device 000 accurately aligns the connecting parts 021 in the second substrate 020 with the corresponding electronic components 011 in the first substrate 010 according to the second position information of each connecting part 021 in the second substrate 020, so as to ensure that the electronic components 011 in the first substrate 010 can be accurately transferred to the corresponding connecting parts 021 in the second substrate 020, thereby improving the transfer accuracy of the electronic components transfer device 000 for the electronic components 011.

[0146] In summary, this application provides an electronic component transfer device, including: a base, a first stage, a second stage, a camera, and a transfer head. The first stage carries a first substrate, and the second stage carries a second substrate. The second substrate may have multiple first positioning portions. The electronic component transfer device can acquire first position information of at least some of the first positioning portions relative to the base using the camera. Then, based on the first position information of these first positioning portions, the theoretical position information of each connecting portion in the second substrate relative to the base can be corrected, thereby obtaining second position information of each connecting portion relative to the base. In this way, the electronic component transfer device can accurately align the connecting portions in the second substrate with the corresponding electronic components on the first substrate based on the second position information of each connecting portion, ensuring that each electronic component in the first substrate can be accurately transferred to the corresponding connecting portion in the second substrate, thereby improving the transfer accuracy of the electronic component transfer device.

[0147] In this application, the second position information of the connecting portion 021 in the second substrate 020 may include: the planar coordinates of the first feature point of the connecting portion 021 in the coordinate system of the electronic component transfer device 000. The fourth position information of the electronic component 011 in the first substrate 010 may include: the planar coordinates of the second feature point of the electronic component 011 in the coordinate system of the electronic component transfer device 000. Here, the X-axis of the coordinate system of the electronic component transfer device 000 may be parallel to the first direction X in a subsequent embodiment, and the Y-axis of the coordinate system of the electronic component transfer device 000 may be parallel to the second direction Y in a subsequent embodiment; the origin of the coordinate system of the electronic component may coincide with the third positioning portion in a subsequent embodiment.

[0148] For example, the first feature point of the connection portion 021 in the second substrate 020 can be the center point of the connection portion 021. For example, the connection portion 021 includes a first conductive pad, a second conductive pad, and a second substrate region between the two conductive pads, and the center point of the connection portion 021 can be the center point of the entire corresponding region of the connection portion.

[0149] For example, the connecting portion 021 includes a first conductive pad, a second conductive pad, and a second substrate region between the two conductive pads. The first feature point of the connecting portion 021 in the second substrate 020 can be a specific position (e.g., the midpoint or end point of the outline edge) on one of the first conductive pad or the second conductive pad.

[0150] For example, the second feature point of the electronic component 011 in the first substrate 010 can be the center point of the electronic component 011, or other specific locations on the electronic component 011 (e.g., the midpoint or endpoint of the outline edge).

[0151] Optionally, please refer to Figure 4, which is a top view of a first substrate and a second substrate provided in an embodiment of this application. The second substrate 020 may have multiple first positioning portions 022, which may be arranged in an array on the second substrate 020. At least a portion of the first positioning portions 022 in the second substrate 020 may constitute a first positioning portion group, and the first positioning portions 022 constituting a first positioning portion group may not be entirely located in the same row or column. At least a portion of the multiple connecting portions 021 of the second substrate 020 may be located within the area enclosed by the first positioning portion group.

[0152] In this configuration, the electronic component transfer device 000 can be configured to: acquire first position information of each first positioning part 022 in the first positioning part group of the second substrate 020 via camera 400, and acquire second position information of each connecting part 021 within the area enclosed by the first positioning part group based on the first position information of each first positioning part 022 in the first positioning part group and the first relative position information of the connecting part 021 in the second substrate 020. The first relative position information can be the relative position information between the connecting part 022 in the second substrate 020 and the second substrate 020.

[0153] In this way, the electronic component transfer device 000 can obtain the second position information of multiple connecting parts 021 located in the area enclosed by each of the first positioning part groups relative to the base 100 by using the first position information of each of the first positioning part groups 022 actually relative to the base 100. That is, the electronic component transfer device 000 can modify the theoretical position information of the connecting parts 021 in the second substrate 020 relative to the base 100 in sections to obtain the second position information of the connecting parts 021 actually relative to the base 100 in each region. Thus, for the large second substrate 020, it can be divided into multiple regions by multiple first positioning parts, so that the relative deformation generated in each region of the second substrate 020 is small. When obtaining the second position information of the connecting parts 021 in each region by using the first positioning parts in each region, the accuracy of the obtained second position information of the connecting parts 021 can be guaranteed to be high.

[0154] It should be noted that, based on the first position information of each first positioning part 022 in the first positioning part group, the electronic component transfer device 000 can obtain not only the second position information of the connecting parts 021 located within the area enclosed by the first positioning part group, but also the second position information of at least some connecting parts 021 outside the area enclosed by the first positioning part group (e.g., at least some connecting parts 021 distributed around the periphery of the first positioning part group). In this case, there are no specific limitations on the number and distribution area of ​​the at least some connecting parts 021 outside the area enclosed by the first positioning part group, as long as the first position information of each first positioning part 022 in the first positioning part group can be used to accurately obtain the second position information of these connecting parts 021.

[0155] For example, as shown in FIG3, the two first positioning portions 022 in the second substrate 020 can constitute a first positioning portion group. For example, the first positioning portions 022a and 022b can constitute a first positioning portion group 022A1, and the first positioning portions 022a and 022b can be arranged diagonally.

[0156] For example, the three first positioning portions 022 in the second substrate 020 can constitute a first positioning portion group. For instance, first positioning portions 022a, 022b, and 022c can constitute a first positioning portion group 022A1. Alternatively, first positioning portions 022a, 022b, and 022d can constitute a first positioning portion group 022A1. Here, first positioning portion 022c can be located in the same row as first positioning portion 022a and in the same column as first positioning portion 022b. First positioning portion 022d can be in the same column as first positioning portion 022a and in the same row as first positioning portion 022b.

[0157] For example, the four first positioning portions 022 in the second substrate 020 can constitute a first positioning portion group. For example, the first positioning portions 022a, 022b, 022c and 022d can constitute a first positioning portion group 022A1.

[0158] For example, the area enclosed by the first positioning part group can be a rectangular area, and a first positioning part group can include four first positioning parts 022, and these four first positioning parts 022 can be distributed at the four vertices of the rectangular area respectively.

[0159] It should be noted that one first positioning part 022 can simultaneously form at least one first positioning part group. For example, two adjacent first positioning part groups can simultaneously include at least one identical first positioning part 022. For example, first positioning parts 022c can simultaneously form first positioning part group 022A1 and first positioning part group 022A3. First positioning parts 022d can simultaneously form first positioning part group 022A1 and first positioning part group 022A2. First positioning parts 022b can simultaneously form first positioning part group 022A1, first positioning part group 022A2, first positioning part group 022A3 and first positioning part group 022A4.

[0160] In this application, the plurality of first positioning parts 022 in the first positioning part group may include: a first reference positioning part and at least one second reference positioning part. Here, the first reference positioning part in the first positioning part group can be any one of the plurality of first positioning parts 022 in the first positioning part group; the second reference positioning part in the first positioning part group can be any other first positioning part 022 in the plurality of first positioning parts 022 in the first positioning part group besides being a first positioning part 022.

[0161] For example, the first positioning part 022a in the first positioning part group 022A1 can serve as a first reference positioning part. When the first positioning part group includes two first positioning parts 022, the first positioning part 022b in the first positioning part group 022A1 can serve as a second reference positioning part. When the first positioning part group includes three first positioning parts 022, the first positioning parts 022b and 022c, or the first positioning parts 022b and 022d in the first positioning part group 022A1 can serve as second reference positioning parts. When the first positioning part group includes four first positioning parts 022, the first positioning parts 022b, 022c, and 022d in the first positioning part group 022A1 can serve as second reference positioning parts.

[0162] In this application, the electronic component transfer device 000 can acquire the first position information of the first reference positioning part through the camera 400, and use the first position information of the first reference positioning part as the theoretical position information of the first reference positioning part. That is, the camera 400 is first controlled to take a picture of a first positioning part 022 in the second substrate 020, and this first positioning part 022 can be the first reference positioning part. Then, the theoretical position information of the first reference positioning part can be obtained from the image containing the first reference positioning part captured by the camera.

[0163] Then, the electronic component transfer device 000 can determine the theoretical position information of each second reference positioning part based on the theoretical position information of the first reference positioning part and the positional relationship between the first reference positioning part and each second reference positioning part. Here, after the second substrate 020 is designed and fabricated, the positional relationship between the first reference positioning part and each other second reference positioning part in the first positioning part group can be obtained.

[0164] Next, the electronic component transfer device 000 can acquire the first position information of each of the second reference positioning units through the camera. Here, based on the positional relationship between the first reference positioning unit and each of the second reference positioning units, the camera 400 can be controlled to move sequentially to each of the second reference positioning units, and the camera 400 can be controlled to take pictures of each of the second reference positioning units to obtain images containing the second reference positioning units. Then, based on each image, the first position information of each of the second reference positioning units can be acquired.

[0165] Next, the electronic component transfer device 000 can determine the deformation compensation parameters corresponding to each connecting part 021 within the area enclosed by the first positioning part group based on the deviation between the first position information and the theoretical position information of the second reference positioning part. For example, assuming the graphic of the area formed by the theoretical position information of the first reference positioning part and each second reference positioning part in the first positioning part group is a first graphic; and the graphic of the area formed by the actual position information of the first reference positioning part and each second reference positioning part in the first positioning part group is a second graphic; then the electronic component transfer device 000 can obtain the deformation compensation parameters corresponding to each connecting part 021 within the area enclosed by the first positioning part group based on the difference between the first graphic and the second graphic.

[0166] Finally, the electronic component transfer device 000 can determine the second position information of each connecting part 021 based on the deformation compensation parameters corresponding to each connecting part 021 within the area enclosed by the first positioning part group, and the first relative position information of the corresponding connecting parts 021. The first relative position information of the connecting parts 021 may include the relative position information between the corresponding connecting part 021 and the first reference positioning part in the second substrate 020. For example, the electronic component transfer device 000 can correct the relative position between each connecting part 021 and the first reference positioning part based on the deformation compensation parameters corresponding to each connecting part 021, and then obtain the second position information of each connecting part based on the first position information of the first reference positioning part and the corrected relative position between each connecting part 021 and the first reference positioning part.

[0167] In this application, as shown in FIG4, there can be multiple first positioning part groups, and the first positioning parts 022 constituting each first positioning part group may not be completely located in the same row or column. At least a portion of the connecting part 021 of the second substrate 020 may be located in the area enclosed by different first positioning parts 022, and the area enclosed by multiple first positioning parts 022A may be arranged in an array.

[0168] For example, as shown in FIG4, when the second substrate 020 includes four first positioning part groups, for example, the second substrate 020 may include first positioning part group 022A1, first positioning part group 022A2, first positioning part group 022A3 and first positioning part group 022A4, and the first positioning part group 022A1, first positioning part group 022A2, first positioning part group 022A3 and first positioning part group 022A4 may be arranged in an array.

[0169] It should be noted that the above array arrangement includes the case of being arranged in a single row or a single column. For example, as shown in FIG4, the second substrate 020 includes two first positioning part groups. The second substrate 020 may include first positioning part groups 022A1 and 022A2, and the first positioning part groups 022A1 and 022A2 may be arranged in an array in the row direction. Or, for example, the second substrate 020 may include first positioning part groups 022A1 and 022A3, and the first positioning part groups 022A1 and 022A3 may be arranged in an array in the column direction.

[0170] Optionally, please refer to Figure 5, which is a schematic diagram of another electronic component transfer device provided in an embodiment of this application. The first stage 200 in the electronic component transfer device 000 may include a second positioning part 201. The electronic component transfer device 000 may be configured to: after the first stage 200 carries the first substrate 010, acquire the third position information of the second positioning part 201 through the camera 400; acquire the fourth position information of each electronic component 011 in the first substrate 010 based on the third position information of the second positioning part 201; and control the first stage 200 to move based on the second position information of the target connection part in the second substrate 020 and the fourth position information of the target electronic component in the first substrate 010, so that the target electronic component can be aligned with the target connection part. In this way, the ejector pin 501 can be controlled to transfer the target electronic component onto the target connection part.

[0171] In this application, the electronic component transfer device 000 can acquire the third position information of the second positioning unit 201 through the camera 400. That is, the camera 400 can be controlled to take a picture of the second positioning unit 201 to obtain an image containing the second positioning unit 201, and then the third position information of the second positioning unit 201 can be acquired based on the image. Then, the electronic component transfer device 000 can acquire the fourth position information of the electronic component 011 based on the third position information of the second positioning unit 201 and the second relative position information of the electronic component 011. The second relative position information of the electronic component 011 can include the relative position information of the electronic component 011 and the first substrate 010. Specifically, the second relative position information of the electronic component 011 can include the relative position information of the electronic component 011 and the second positioning unit 201.

[0172] It should be noted that after the first stage 200 carries the first substrate 010, when the electronic component transfer device 000 controls the camera 400 to take a picture of the second positioning unit 201, the electronic component transfer device 000 also takes a picture of the first stage 200. Therefore, the image containing the second positioning unit 201 also includes each electronic component 011 in the first substrate 010. Thus, the electronic component transfer device 000 can obtain not only the third position information of the second positioning unit 201 through this image, but also the second relative position information of each electronic component 011 in the first substrate 010 relative to the second positioning unit 201. Therefore, the electronic component transfer device 000 can obtain the fourth position information of the electronic component 011 based on the third position information of the second positioning unit 201 and the second relative position information of the electronic component 011.

[0173] It should also be noted that the camera 400 used to photograph the second positioning part 201 of the first stage 200 and the camera 400 used to photograph the first positioning part 022 of the second substrate 020 located on the second stage 300 in this application can be the same camera or two different cameras. This application does not limit this.

[0174] In this application, since the first stage 200 is movably connected to the base 100, during the process of the electronic component transfer device 000 transferring the electronic component 011 in the first substrate 010 located on the first stage 200, the first stage 200 needs to move relative to the base 100 while carrying the first substrate 010.

[0175] Therefore, with the camera 400 fixedly connected to the base 100, the camera 400 can be a wide-angle camera. In this way, when the first platform 100 moves with the first substrate 010 to any position, the wide-angle camera 400 can take pictures of the first platform 100.

[0176] Furthermore, when the camera 400 is fixedly connected to the base 100, and the camera 400 used to photograph the first stage 200 and the camera 400 used to photograph the second substrate 020 located on the second stage 300 are the same camera, the camera 400 can simultaneously photograph the first stage 200 and the second stage 300. Thus, the image captured by this camera 400 can simultaneously include the first substrate 010 located on the first stage 200 and the second substrate 020 located on the second stage 300. When the camera used to photograph the first stage 200 and the camera used to photograph the second substrate 020 located on the second stage 300 are different cameras, the image acquired by the camera 400 used to photograph the first stage 200 can only include the second positioning part 201 and the first substrate 010, and the image acquired by the camera 400 used to photograph the second substrate 020 located on the second stage 300 can only include the second substrate 020.

[0177] With the camera 400 movably connected to the base 100, the camera 400 can move relative to the base 100. During the transfer of electronic component 011 by the electronic component transfer device 000, the camera 400 can move relative to the base 100. In this way, the electronic component transfer device 000 can capture images of the first substrate 010 located on the first stage 200 in real time. The following embodiment is described using the example of the camera 400 being movably connected to the base 100.

[0178] Optionally, please refer to Figures 5 and 6. Figure 6 is a top view of an electronic component transfer device provided in an embodiment of this application. The camera 400 can be movably connected to the base 100, and the camera 400 and the transfer head 500 can move synchronously relative to the base 100; that is, the camera 400 can move together with the transfer head 500. The second stage 300 may include a third positioning part 301. The electronic component transfer device 000 can also be configured to perform at least one device calibration process until the camera 400 and the first stage 200 meet preset conditions.

[0179] The device calibration process of the electronic component transfer device 000 may include: after controlling the first stage 200 to move relative to the base 100 to a position where the center point of the second positioning part 201 of the first stage 200 coincides with the center point of the third positioning part 301 of the second stage 300 in the third direction Z, and controlling the camera 400 to move relative to the base 100 to a position where the shooting center of the camera 400 coincides with the center point of the third positioning part 301 of the second stage 300, a movement command for controlling the camera 400 or the first stage 200 to move is received; then, the camera 400 and the first stage 200 are controlled to move according to the movement command, and corresponding calibration parameters are generated according to the deviation between the shooting center of the camera 400 after the movement and the center point of the second positioning part 201 of the first stage 200 after the movement, so that the electronic component transfer device 000 can adjust the process of controlling the camera 400 and / or the first stage 200 to move according to the calibration parameters. The preset conditions may include: after the camera 400 and the first platform 200 are moved according to the movement command, the deviation between the shooting center of the camera 400 and the center point of the second positioning part 201 of the first platform 200 may be less than a preset deviation threshold.

[0180] Specifically, in the working state of the transfer device 000 (including the calibration process), the camera 400 and the transfer head 500 move together while remaining relatively stationary. This allows for precise alignment of the transfer head 500's pin 501, the target electronic components, and the target connecting parts during the transfer process, resulting in high transfer accuracy.

[0181] Specifically, in the working state of the transfer device 000 (including the calibration process), the camera 400 and the transfer head 500 move together, and the camera 400 and the transfer head 500 remain relatively stationary, including: when there are multiple cameras 400, at least one camera 400 and the transfer head 500 move together, and the at least one camera 400 and the transfer head 500 remain relatively stationary.

[0182] It should be noted that the electronic component transfer device 000 can perform device calibration before transfer. For example, device calibration can be performed during the device debugging stage until the camera 400 and the first stage 200 meet the preset conditions. After the debugging is completed, the electronic component transfer device 000 can transfer the electronic component 011.

[0183] It should also be noted that the movement command for controlling the movement of the camera 400 and the first stage 200 may include moving the camera 400 and the first stage 200 by the same distance in at least one direction. For example, the electronic component transfer device 000 can simultaneously control the movement of the camera 400 and the first stage 200 according to the movement command. Before the camera 400 and the first stage 200 move, the shooting center of the camera 400 and the center point of the second positioning part 201 of the first stage 200 coincide. After the electronic component transfer device 000 controls the camera 400 and the first stage 200 to move simultaneously by the distance specified in the movement command, the shooting center of the camera 400 and the center point of the second positioning part 201 of the first stage 200 may not coincide, that is, a deviation will occur. The electronic component transfer device 000 can perform device correction based on this deviation until the movement of the camera 400 and the first stage 200 meets the preset conditions. Here, after the movement of the camera 400 and the first stage 200 meets the preset conditions, the electronic component transfer device 000 can precisely control the movement of the camera 400 and the first stage 200. In this way, during the subsequent transfer process, the electronic component transfer device 000 can control the target electronic component located on the first substrate 010 on the first stage 200 to move precisely above the target connection part, so as to transfer the target electronic component to the target connection part by means of a pin.

[0184] For example, moving the camera 400 and the first stage 200 by the same distance in at least one direction includes moving both the camera 400 and the first stage 200 by the same distance in a first direction X in a later embodiment and / or moving both the camera 400 and the first stage 200 by the same distance in a second direction Y in a later embodiment to achieve a plane, wherein the distance moved in the X direction and the distance moved in the Y direction may be different. This achieves the purpose of precise calibration by moving in a plane.

[0185] It should also be noted that the shooting center of camera 400 is a marker point on camera 400 that indicates the position of camera 400. For example, the shooting center of camera 400 may be located on the optical axis of camera 400.

[0186] Optionally, as shown in Figures 5 and 6, the electronic component transfer device 000 may further include: a first support frame 600, and a first temperature sensor 601 fixed on the first support frame 600. The first temperature sensor 601 located on the first support frame 600 can detect the temperature of the first support frame 600. The first support frame 600 in the electronic component transfer device 000 can be movably connected to the base 100 and can be movably connected to the first stage 200. The first support frame 600 can drive the first stage 200 to move along a first direction X, and the first stage 200 can move relative to the first support frame 600 along a second direction Y. The first direction X can intersect the second direction Y; for example, the first direction X can intersect the second direction Y perpendicularly.

[0187] It should be noted that, as shown in Figure 7, which is a top view of the first substrate and the second substrate after alignment according to an embodiment of this application, during the transfer of electronic component 011 by the electronic component transfer device 000, the electronic component transfer device 000 can control the movement of the first support frame 600 relative to the base 100 along the first direction X, and / or control the movement of the first stage 200 relative to the first support frame 600 along the second direction Y, so that the first substrate 010 located on the first stage 200 can be aligned with the second substrate 020. After the first substrate 010 and the second substrate 020 are aligned, the plurality of electronic components in the first substrate 010 may include a plurality of target electronic components, which may include first electronic component 0111 and second electronic component 0112. The second substrate 020 may include a plurality of target connection portions, which may include first connection portion 0211 and second connection portion 0212.

[0188] For example, camera 400 can move together with transfer head 500, that is, camera 400 and transfer head 500 remain relatively stationary.

[0189] The electronic component transfer device 000 can also be configured such that, in a first transfer mode, after the first electronic component 0111 in the first substrate 010 is transferred to the first connecting portion 0211 in the second substrate 020, while controlling the ejector pin 501 to move towards the second electronic component 0112, the first stage 200 is controlled to perform a regional displacement, so that after the ejector pin 501 reaches the side of the second electronic component 0112 away from the first substrate 010, the second electronic component 0112 can be positioned opposite to the second connecting portion 0212. Here, the regional displacement can be: controlling the first stage 200 to remain stationary relative to the base 100 or the first stage 200 to move the first substrate 010 within a first preset region F1. The first preset region F1 can be a region surrounding the second connecting portion 0212.

[0190] Specifically, the regional displacement can be understood as a slight adjustment to the position of the first stage 100 during the movement of the ejector pin 501 toward the second electronic component 0112, so that after the ejector pin 501 reaches the side of the second electronic component 0112 away from the first substrate 010, the second electronic component 0112 can be positioned opposite to the second connecting portion 0212. In some embodiments, the first electronic component 0111 and the second electronic component 0112 can be designed to be located in the same row, and the distance between the first electronic component 0111 and the second electronic component 0112 is the same as the distance between the first connecting portion 0211 and the second connecting portion 0212. Ideally, after the first electronic component 0111 is aligned with the first connecting part 0211, the second electronic component 0112 should be aligned with the second connecting part 0212. However, due to limitations such as manufacturing precision, there may be alignment deviations between the second connecting part 0212 and the second electronic component 0112. Therefore, it is necessary to perform the aforementioned regional displacement on the position of the first stage 302 to ensure accurate alignment between the second connecting part 0212 and the second electronic component 0112, thus achieving a successful connection.

[0191] Specifically, the first preset region F1 is the region formed around the second connecting portion 0212. For example, the first preset region F1 surrounds the entire second connecting portion 0212 and covers the second connecting portion 0212. For example, the first preset region F1 surrounds a portion of the second connecting portion 0212 and covers that portion. For example, the first preset region F1 surrounds the center of the second connecting portion 0212 and covers the center. For example, the second connecting portion 0212 includes a first conductive pad, a second conductive pad, and a second substrate region between the two conductive pads. The first preset region F1 surrounds the center of the entire second connecting portion 0212 and covers the center. Alternatively, the first preset region F1 surrounds a designated feature point on the second connecting portion 0212 and covers the feature point. The designated feature point is, for example, the center or corner position of one of the conductive pads.

[0192] Furthermore, when the electronic component transfer device 000 controls the first platform 200 to perform regional displacement, it can control the movement of the first support frame 600 relative to the base 100 along the first direction X, and / or control the movement of the first platform 200 relative to the first support frame 600 along the second direction Y, so that the second electronic component 0112 and the second connecting part 0212 are accurately aligned.

[0193] It should also be noted that since the multiple electronic components 011 in the first substrate 010 are arranged in an array, the electronic component transfer device 000 needs to continuously control the first stage 200 to move so that the first stage 200 can continuously align the first substrate 010 with the second substrate 020. Furthermore, after the first substrate 010 and the second substrate 020 are aligned once, the first substrate 010 can include multiple target electronic components. Therefore, the electronic component transfer device also needs to continuously control the first stage 200 to perform regional displacement so that each target electronic component can be aligned with its corresponding target connection part. Thus, during the transfer of electronic components 011 by the electronic component transfer device 000, the first support frame 600 needs to move relative to the base 100 along the first direction X, and the first stage 200 needs to continuously move relative to the first support frame 600 along the second direction Y. Therefore, during the continuous transfer of electronic component 011 by the electronic component transfer device 000, the temperature of the first support frame 600 will change, causing the first support frame 600 to deform. This reduces the movement accuracy of the electronic component transfer device 000 in controlling the first platform 200, and consequently reduces the transfer accuracy of the electronic component transfer device 000.

[0194] It should be noted that, in some embodiments, the distance between the center points of two adjacent connecting portions 021 in a row of connecting portions of the second substrate 020 can be an integer multiple of the distance between two adjacent electronic components 011 in a corresponding row of electronic components of the first substrate 010. Thus, after the first substrate 010 and the second substrate 020 are aligned once, each connecting portion 021 in a row of connecting portions will have corresponding electronic components that are well aligned, or good alignment can be achieved by only making minor adjustments to the position of the first stage 200. This results in higher transfer efficiency, less vibration, and improved transfer accuracy.

[0195] In this application, the electronic component transfer device 000 can also be configured to: acquire a first temperature of the first carrier 600 detected by the first temperature sensor 601, and acquire a first deformation amount of the first carrier 600 based on the first temperature. Then, based on the first deformation amount of the first carrier 600, the second position information of the target connection portion in the second substrate 020, and the fourth position information of the target electronic component in the first substrate 010, the first stage 200 is controlled to move so that the target electronic component can be aligned with the target connection portion.

[0196] Optionally, please refer to Figures 8 and 9. Figure 8 is a structural schematic diagram of another electronic component transfer device provided in an embodiment of this application, and Figure 9 is a partially enlarged view of an electronic component transfer device provided in an embodiment of this application. The first support frame 600 in the electronic component transfer device 000 may include a first crossbeam structure 602 extending along a second direction Y. The base 100 may include a first track 101 and a second track 102 disposed opposite to each other in the second direction Y, both of which may extend along a first direction X. One end of the first crossbeam structure 602 may be slidably connected to and in contact with the first track 101. The second end of the first crossbeam structure 602 may be slidably connected to the second track 102, and a first clearance space may be provided between the first crossbeam structure 602 and the second track 102 for deformation of the first crossbeam structure 602. In this way, the first crossbeam structure 602 can move relative to the base 100 along the first direction X through the sliding connection between the first end of the first crossbeam structure 602 and the first track 101, and the sliding connection between the second end of the first crossbeam structure 602 and the second track 102.

[0197] It should be noted that when the temperature of the first support frame 600 changes, it is the temperature change of the first crossbeam structure 602 within the first support frame 600 that causes the first crossbeam structure 602 to deform, and the first crossbeam structure 602 can deform along the second direction Y. When the temperature of the first crossbeam structure 602 increases, the first crossbeam structure 602 expands, increasing its length along the second direction Y, and the second end of the first crossbeam structure 602 can move within the first clearance space in the direction toward the second track 102. When the temperature of the first crossbeam structure 602 decreases, the first crossbeam structure 602 contracts, decreasing its length along the second direction Y, and the second end of the first crossbeam structure 602 can move within the first clearance space in the direction away from the second track 102.

[0198] In this application, as shown in FIG8, the first crossbeam structure 602 may include: a fixing plate 6021 located on the side of the first crossbeam structure 602 facing the first track 101 and fixedly connected to the first crossbeam structure 602, the fixing plate 6021 being disposed in contact with the first track 101. The first crossbeam structure 602 may further include: a floating plate 6021 located on the side of the second crossbeam structure 602 facing the second track 102 and fixedly connected to the first crossbeam structure 602, the floating plate 6021 being having a first clearance space.

[0199] Optionally, as shown in Figure 8, the first end of the first beam structure 602 facing the first track 101 may have a first drive motor 6031 fixedly connected to the fixed plate 6021, and the first beam structure 602 facing the second track 102 may have a second drive motor 6032 fixedly connected to the floating plate 6022. Under the driving action of the first drive motor 6031 and the second drive motor 6032, the first beam structure 602 can move relative to the base 100 along the first direction X.

[0200] In this application, the first support frame 600 may further include a first scale fixed to the first crossbeam structure 602. The electronic component transfer device 000 can be used to control the stroke of the first platform 200 moving along the second direction Y on the first crossbeam structure 602 according to the scale of the first scale. The first scale can deform along with the first crossbeam structure 602. Thus, when the first crossbeam structure 602 deforms along the second direction Y, that is, during the expansion or contraction of the first crossbeam structure 602 along the second direction Y, the first scale will also expand or contract. Therefore, after the first scale deforms, if the electronic component transfer device 000 still controls the first platform 200 to move along the second direction Y on the first crossbeam structure 602 according to the scale of the first scale, the first platform 200 cannot move to the accurate position, causing the target electronic component in the first substrate 010 on the first platform 200 to not be accurately aligned with the target connection portion.

[0201] Optionally, the electronic component transfer device 000 may further include a first position sensor capable of moving synchronously with the first stage 200. For example, the first position sensor may be fixed to the first stage 200. The first position sensor is used in conjunction with a first scale to determine the travel distance of the first stage 200 relative to the first beam structure 602.

[0202] For example, the first scale fixed to the first beam structure 602 can be a first grating scale, and the first position sensor capable of moving synchronously with the first stage 200 can be a first reading head. The first reading head, which cooperates with the first grating scale, can sense the scale markings on the first grating scale. Therefore, the electronic component transfer device 000 can determine the travel distance of the first stage 200 relative to the first beam structure 602 based on the changes in the scale markings on the first grating scale sensed by the first reading head.

[0203] Optionally, as shown in Figure 8, the number of first temperature sensors 601 located on the first support frame 600 can be N, and the N first temperature sensors 601 can be arranged sequentially along the second direction Y. N can be an integer greater than or equal to 2. Here, since the first crossbeam structure 602 in the first support frame 600 has a certain length in the second direction Y, the temperature at different positions in the first crossbeam structure 602 is not consistent during the operation of the electronic component transfer device 000. Therefore, N first temperature sensors 601 are set on the first crossbeam structure 602 so that the electronic component transfer device 000 can simultaneously detect the temperature at N positions of the first crossbeam structure 602, thereby improving the correction accuracy of the deformation of the first crossbeam structure 602 by the electronic component transfer device 000.

[0204] In this application, the first crossbeam structure 602 in the first support frame 600 may have N first segmented intervals arranged sequentially along the second direction Y. N first temperature sensors 601 may correspond one-to-one with the N first segmented intervals, and each first temperature sensor 601 may be located within its corresponding first segmented interval. Here, a temperature sensor 201 may be located at the middle position within its corresponding first segmented interval. It should be noted that the N first segmented intervals of the first crossbeam structure 602 are obtained by dividing the space at each position of the first crossbeam structure 602 at an initial temperature. For example, the initial temperature refers to the ambient temperature of the environment where the transfer equipment 000 is located. For example, the initial temperature refers to the room temperature of the workshop where the transfer equipment 000 is located.

[0205] The electronic component transfer device 000 can be configured to: determine the theoretical endpoint position of the first stage 200 after movement based on the second position information of the target connection portion in the second substrate 020 and the fourth position information of the target electronic component in the first substrate 010; determine a first target segment interval among N first segment intervals, wherein the theoretical endpoint position of the first stage 200 after movement may be located within the first target segment interval; designate the first target segment interval, and each first segment interval located near the first end of the first beam structure 602 of the first target segment interval, as at least one first designated segment interval; and determine the actual endpoint position of the first stage 201 after movement based on the temperature detected by the first temperature sensor 601 corresponding to each first designated segment interval, the length of each first designated segment interval in the second direction Y, and the expansion coefficient of the first beam structure 602. Here, the actual endpoint position of the first stage 201 after movement is the position where the target electronic component in the first substrate 010 of the first stage 201 can be accurately aligned with the target connection portion.

[0206] It should be noted that the theoretical endpoint position of the first platform 200 after movement can be determined using the midpoint of the connection between the first platform 200 and the first crossbeam structure 602. It is understood that the theoretical endpoint position of the first platform 200 after movement can also be determined using other suitable feature points on the first platform 200, such as the center of gravity of the first platform 200, the center of the first substrate, or the position of the second positioning part. This application does not impose specific limitations, as long as it can effectively compensate for the effects of temperature. Optionally, the endpoint position of the first platform 201 after movement can be characterized using coordinates distributed in the second direction Y. Here, since the first crossbeam mechanism 602 deforms along the second direction Y, the endpoint position of the first platform 201 after movement can be determined by characterizing it using coordinates in the second direction Y. It should be noted that the theoretical endpoint position of the first platform 201 after movement can be characterized using coordinates distributed in the second direction Y of the midpoint of the connection between the first platform 201 and the first crossbeam structure 602.

[0207] Each first segment of the first beam structure 602 can have a first coordinate and a second coordinate distributed in the second direction Y. The first coordinate of a first segment in the second direction Y can be closer to the first end of the first beam structure 602 relative to its second coordinate. The first coordinate of the first segment closest to the first end of the first beam structure 602 among the N first segment segments can be a fixed coordinate Y1. That is, no matter how the first beam structure 602 deforms, the fixed coordinate Y1 in the second direction Y remains unchanged. It should be noted that since the N first segment segments of the first beam structure 602 are divided at the initial temperature at each position of the first beam structure 602, the first coordinate and the second coordinate of each first segment segment in the first beam structure 602 are also the coordinates corresponding to the initial temperature at each position of the first beam structure 602.

[0208] The first and second coordinates of the first target segment interval in the N first segment intervals can be respectively: Y i and Y i+1 Here, i is an integer less than or equal to N. The difference between the theoretical endpoint coordinates of the first platform 200 after its movement and the fixed coordinate Y1 can be: △Ya.

[0209] Thus, when i=1, the first target segment interval is the first segment interval closest to the first end of the first crossbeam structure 602 among the N first segment intervals. The first coordinate Y1 of this first target segment interval is the fixed coordinate Y1, and the second coordinate of this first target segment interval is Y2. The actual endpoint coordinate Ya of the first platform 201 after movement can be: Ya = Y1 + (T1 - T0) × α × L1 × △Ya.

[0210] When i > 1, the actual endpoint coordinates Ya of the first platform after its movement can be: Ya = Y1 + (T1 - T0) × α × L1 + ... + (T i -T0)×α×L i ×(△Ya-L1-……-L i-1 ).

[0211] Where T1 represents the temperature detected by the first temperature sensor in the first segment closest to the first end of the first beam structure 602 among the N first segment intervals; T i T0 represents the temperature detected by the first temperature sensor corresponding to the first target segment interval; α represents the coefficient of thermal expansion of the first beam; L1 represents the length of the first segment interval closest to the first end of the first beam structure among the N first segment intervals; L i This represents the length of the first target segment interval. Here, T0 represents the initial temperature of the first beam structure 602 when the electronic component transfer device 000 is not yet operational, which is also the ambient temperature of the environment where the transfer device 000 is located. L1 represents the length of the first segment interval closest to the first end of the first beam structure among the N first segment intervals at the initial temperature T0. i This represents the length of the first target segment interval at the initial temperature T0.

[0212] For example, please refer to Figure 10, which is a top view of another electronic component transfer device provided in an embodiment of this application. The electronic component transfer device 000 may include three first temperature sensors: first temperature sensor 601a, first temperature sensor 601b, and first temperature sensor 601c. The first beam structure 02 may have three first segmented intervals arranged sequentially along the second direction Y: first segmented interval 602a, first segmented interval 602b, and first segmented interval 602c. The first temperature sensors 601a, 601b, and 601c may be located within their respective first segmented intervals 602a, 602b, and 602c. The lengths of these three first segmented intervals may be L1, L2, and L3, respectively.

[0213] When i=1, the first target segment interval is also the first segment interval 602a, meaning the theoretical endpoint of the first platform 200 after movement can be located within the first segment interval 602a. In this case, the first designated segment interval is also the first segment interval 602a. The first coordinate of the first segment interval 602a can be a fixed coordinate Y1, and the second coordinate can be Y2. The temperature detected by the first temperature sensor 601a located within the first segment interval 602a can be T1. Thus, the actual endpoint coordinate Ya of the first platform 201 after movement can be: Ya = Y1 + (T1 - T0) × α × L1 × ΔYa.

[0214] When i=2, the first target interval is also the first segmented interval 602b, meaning the theoretical endpoint of the first platform 200 after movement can be located within the first segmented interval 602b. In this case, there can be two first designated segmented intervals: the first segmented interval 602a and the second segmented interval 602b. The first coordinate of the first segmented interval 602b can be Y2, and the second coordinate can be Y3. The temperature detected by the first temperature sensor 601a located within the first segmented interval 602a can be T1, and the temperature detected by the first temperature sensor 601b located within the first segmented interval 602b can be T2. Thus, the actual endpoint coordinate Ya of the first platform 201 after movement can be: Ya = Y1 + (T1 - T0) × α × L1 + (T2 - T0) × α × L2 × (△Ya - L1).

[0215] When i=3, the first target interval is also the first segmented interval 602c, meaning the theoretical endpoint of the first platform 200 after movement can be located within the first segmented interval 602c. In this case, there can be three first designated segmented intervals: the first segmented interval 602a, the second segmented interval 602b, and the first segmented interval 602c. The first coordinate of the first segmented interval 602c can be Y3, and the second coordinate can be Y4. The temperature detected by the first temperature sensor 601a located in the first segmented interval 602a can be T1, the temperature detected by the first temperature sensor 601b located in the first segmented interval 602b can be T2, and the temperature detected by the first temperature sensor 601c located in the first segmented interval 602c can be T3. Thus, the actual endpoint coordinates Ya of the first platform 201 after its movement can be: Ya = Y1 + (T1 - T0) × α × L1 + (T2 - T0) × α × L1 + (T3 - T0) × α × L2 × (△Ya - L2 - L1).

[0216] It should be noted that the above embodiments are all illustrated with the case where there are multiple first temperature sensors 601 located on the first crossbeam structure 602. In other possible implementations, the number of first temperature sensors 601 located on the first crossbeam structure 602 can also be one.

[0217] Here, a first temperature sensor 601 can be located at the middle position of the first crossbeam structure 602 in the second direction Y, or it can be located at one of the two ends of the first crossbeam structure 602 in the second direction Y. This application does not make specific limitations, as long as it can be used to effectively compensate for the effects of temperature.

[0218] The final position of the first platform 200 after movement can be represented by coordinates distributed in the second direction Y. The coordinates of the first end of the first beam structure 602 distributed in the second direction Y can be fixed coordinates Y1. The difference between the theoretical final position coordinates of the first platform 200 after movement and the fixed coordinates Y1 can be ΔYa. The actual final position coordinates Ya of the first platform 200 after movement can be: Ya = Y1 + (T1 - T0) × α × L × ΔYa. Where T1 represents the temperature detected by the first temperature sensor 601, T0 represents the initial temperature, α represents the coefficient of thermal expansion of the first beam structure 602, and L represents the length of the first beam structure 602.

[0219] Specifically, the initial temperature T0 can be the sensor temperature during the equipment calibration process or the ambient temperature of the environment in which the equipment is located (e.g., the room temperature in the workshop where the equipment is located), or it can be a specific preset temperature, such as 20°C, 23°C or 25°C. This application does not make any specific limitation, as long as it can be used to effectively determine the impact of the compensation temperature.

[0220] Specifically, L represents the length of the first crossbeam structure 602 at the initial temperature T0.

[0221] Optionally, as shown in Figure 8, the electronic component transfer device 000 may further include: a second support frame 700, and a second temperature sensor 701 fixed on the second support frame 700. The second support frame 700 may be movably connected to the base 100 and to the transfer head 500. The second support frame 700 can drive the transfer head 500 to move together along a first direction X, and the transfer head 500 can move relative to the second support frame 700 along a second direction Y. The first direction X may intersect with the second direction Y; for example, the first direction X may intersect the second direction Y perpendicularly.

[0222] It should be noted that during the transfer of electronic components 011 by the electronic component transfer device 000, after the target electronic component in the first substrate 010 and the target connection portion in the second substrate 020 are aligned, the transfer head 500 needs to drive the ejector pin 501 to move to the side of the target electronic component away from the first substrate 010. This allows the ejector pin 501 to apply force to the side of the first substrate 010 away from the second substrate 020, thereby transferring the target electronic component to the target connection portion. Therefore, during the transfer of each electronic component 011 in the first substrate 010 by the electronic component transfer device 000, the second support frame 700 needs to continuously move relative to the base 100 along the first direction X, and the transfer head 500 needs to continuously move relative to the second support frame 700 along the second direction Y. Therefore, during the continuous transfer of electronic component 011 by the electronic component transfer device 000, the temperature of the second support frame 700 will change, causing the second support frame 700 to deform. This reduces the movement accuracy of the transfer head 500 controlled by the electronic component transfer device 000, and consequently reduces the transfer accuracy of the electronic component transfer device 000.

[0223] In this application, the electronic component transfer device 000 can also be configured to: acquire a second temperature of the second support frame 700 detected by the second temperature sensor 701, and acquire a second deformation amount of the second support frame 700 based on the second temperature. Then, based on the second deformation amount of the second support frame 700 and the second position information of the target connection portion, control the transfer head 500 to perform a certain movement, so that the ejector pin 501 in the transfer head 500 can be located on the side of the target electronic component away from the target connection portion.

[0224] Optionally, as shown in Figure 8, the second support frame 700 in the electronic component transfer device 000 may include a second crossbeam structure 702 extending along the second direction Y. The base 100 may include a first track and a second track disposed opposite to each other in the second direction Y, both of which may extend along the first direction X. Here, the first track cooperating with the second crossbeam structure 702 may be the first track 101 cooperating with the first crossbeam structure 602 as described above, and the second track cooperating with the second crossbeam structure 702 may be the second track 102 cooperating with the first crossbeam structure 602 as described above. The first end of the second crossbeam structure 702 may be slidably connected to the first track 101 and may be in contact with the first track 101. The second end of the second crossbeam structure 702 may be slidably connected to the second track 102, and there may be a second clearance space between the second crossbeam structure 702 and the second track 102 for deformation of the second crossbeam structure 702.

[0225] It should be noted that when the temperature of the second support frame 700 changes, the temperature change of the second crossbeam structure 702 within the second support frame 700 causes the second crossbeam structure 702 to deform, and the second crossbeam structure 702 can deform along the second direction Y. When the temperature of the second crossbeam structure 702 increases, the second crossbeam structure 702 expands, increasing its length along the second direction Y, and the second end of the second crossbeam structure 702 can move within the second clearance space in the direction toward the second track 102. When the temperature of the second crossbeam structure 702 decreases, the second crossbeam structure 702 contracts, decreasing its length along the second direction Y, and the second end of the second crossbeam structure 702 can move within the second clearance space in the direction away from the second track 102.

[0226] It should be noted that the second crossbeam structure 702 may also include a fixed plate located on the side of the first end of the second crossbeam structure 702 facing the first track 101 and fixedly connected to the second crossbeam structure 702, the fixed plate being in contact with the first track 101. The second crossbeam structure 702 may also include a floating plate located on the side of the second end of the second crossbeam structure 702 facing the second track 102 and fixedly connected to the second crossbeam structure 702, the floating plate having a first clearance space. Furthermore, the side of the first end of the second crossbeam structure 702 facing the first track 101 may have a third drive motor fixedly connected to the fixed plate, and the side of the second crossbeam structure 702 facing the second track 102 may have a fourth drive motor fixedly connected to the floating plate. Under the driving action of the third drive motor and the fourth drive motor, the second crossbeam structure 702 can move relative to the base 100 along the first direction X.

[0227] In this application, the second support frame 700 may further include a second scale fixed to the second crossbeam structure 702. The electronic component transfer device 000 can be used to control the stroke of the transfer head 500 along the second direction Y on the second crossbeam structure 702 according to the scale of the second scale. The second scale can deform along with the second crossbeam structure 702. Thus, when the second crossbeam structure 702 deforms along the second direction Y, that is, during the expansion or contraction of the second crossbeam structure 702 along the second direction Y, the second scale will also expand or contract. Therefore, after the second scale deforms, if the electronic component transfer device 000 still controls the transfer head 500 to move along the second direction Y on the second crossbeam structure 702 according to the scale of the second scale, the transfer head 500 cannot accurately move to the side of the target electronic component away from the target connection part, resulting in the transfer head 500 failing to accurately fix the target electronic component to the target connection part.

[0228] Optionally, the electronic component transfer device 000 may further include a second position sensor capable of moving synchronously with the transfer head 500. For example, the second position sensor may be fixed to an adapter frame in a later embodiment. The second position sensor is used in conjunction with a second scale to determine the travel distance of the transfer head 500 relative to the second beam structure 702.

[0229] For example, the second scale fixed to the second beam structure 702 can be a second grating scale, and the second position sensor capable of moving synchronously with the transfer head 500 can be a second reading head. The second reading head, which cooperates with the second grating scale, can sense the scale markings on the second grating scale. Therefore, the electronic component transfer device 000 can determine the travel distance of the transfer head 500 relative to the second beam structure 702 based on the changes in the scale markings on the second grating scale sensed by the second reading head.

[0230] Optionally, as shown in Figures 8 and 10, the number of second temperature sensors 701 located on the second support frame 700 can be M, and the M second temperature sensors 701 can be arranged sequentially along the second direction Y. M can be an integer greater than or equal to 2. Here, since the second crossbeam structure 702 in the second support frame 700 has a certain length in the second direction Y, the temperature at different positions in the second crossbeam structure 702 is not consistent during the operation of the electronic component transfer device 000. Therefore, M second temperature sensors 701 are set on the second crossbeam structure 702 so that the electronic component transfer device 000 can simultaneously detect the temperature at M positions of the second crossbeam structure 702, thereby improving the correction accuracy of the deformation of the second crossbeam structure 702 by the electronic component transfer device 000.

[0231] Optionally, the second crossbeam structure 702 in the second support frame 700 may have M second segmented intervals arranged sequentially along the second direction Y. The M second temperature sensors 701 may correspond one-to-one with the M second segmented intervals, and each second temperature sensor 701 may be located within its corresponding second segmented interval. Here, two temperature sensors 201 may be located at the middle position within their respective second segmented intervals. It should be noted that the M second segmented intervals of the second crossbeam structure 702 are obtained by dividing the space at each location of the second crossbeam structure 702 under the initial temperature. For example, the initial temperature refers to the ambient temperature of the environment where the transfer equipment 000 is located. For example, the initial temperature refers to the room temperature of the workshop where the transfer equipment 000 is located.

[0232] The electronic component transfer device 000 can be configured to: determine the theoretical endpoint position of the transfer head 500 after movement based on the second position information of the target connection portion in the second substrate 020. A second target segment interval is determined among M second segment intervals, and the theoretical endpoint position of the transfer head after movement can be located within the second target segment interval. Then, the second target segment interval, and each second segment interval located near the first end of the second beam structure 702 within the second target segment interval, can be designated as at least one second specified segment interval. Based on the temperature detected by the second temperature sensor 701 corresponding to each second specified segment interval, the length of each second specified segment interval in the second direction Y, and the expansion coefficient of the second beam structure 702, the actual position of the transfer head 500 after movement is determined.

[0233] It should be noted that, since the transfer head 500 is fixedly connected to the adapter frame 800 mentioned in subsequent embodiments, and the adapter frame 800 can move relative to the second support frame 700 along the second direction Y, the transfer head 500 moves relative to the second support frame 700 along the second direction Y via the adapter frame 800. Therefore, the theoretical endpoint position of the transfer head 500 after its movement can be determined using the midpoint of the connection between the adapter frame 800 and the second crossbeam structure 702. It is understood that the theoretical endpoint position of the transfer head 500 after its movement can also be determined using other suitable feature points on the adapter frame 800, such as the center of gravity of the adapter frame 800 or the center of gravity of the transfer head 500. This application does not impose specific limitations, as long as it can effectively compensate for the effects of temperature.

[0234] Optionally, the endpoint position of the transfer head 500 after its movement can be characterized using coordinates distributed in the second direction Y. Here, since the second crossbeam mechanism 702 deforms along the second direction Y, the endpoint position of the first platform 201 after its movement can be determined by characterizing it using coordinates of the first platform 201 in the second direction Y. It should be noted that the theoretical endpoint position of the transfer head 500 after its movement can be characterized using coordinates of the midpoint of the connection between the adapter frame 800 and the second crossbeam structure 702 distributed in the second direction Y.

[0235] Each second segment interval in the second beam structure 702 can have a first coordinate and a second coordinate distributed in the second direction Y. The first coordinate of a second segment interval distributed in the second direction Y can be closer to the first end of the second beam structure 702 relative to the second coordinate. The first coordinate of the second segment interval closest to the first end of the second beam structure 702 among the M second segment intervals can be a fixed coordinate Y1. That is, no matter how the second beam structure 702 deforms, the fixed coordinate Y1 in the second direction Y remains unchanged. It should be noted that since the M second segment intervals of the second beam structure 702 are obtained by dividing the second beam structure 702 at all positions with the initial temperature, the first coordinate and the second coordinate of each second segment interval in the second beam structure 702 are also the coordinates corresponding to the initial temperature at all positions of the second beam structure 702.

[0236] The first and second coordinates of the second target segment interval in the M second segment intervals can be respectively: Y j and Y j+1 Here, j is an integer less than or equal to M. The difference between the theoretical endpoint coordinates of the transfer head 500 after its movement and the fixed coordinate Y1 can be: △Yb.

[0237] Thus, when j=1, the second target segment interval is the second segment interval closest to the first end of the second crossbeam structure 702 among the M second segment intervals. The first coordinate Y1 of this second target segment interval is the fixed coordinate Y1, and the second coordinate of this second target segment interval is Y2. The actual endpoint coordinate Yb after the transfer head 500 moves can be: Yb=Y1+(T1'-T0)×β×L1'×△Yb.

[0238] When j > 1, the actual endpoint coordinate Yb after the transfer head 500 has moved can be: Yb = Y1 + (T1' - T0) × β × L1' + ... + (T j '-T0)×β×L j '(△Yb-L1'-……-L j-1 ').

[0239] Wherein, T1' represents the temperature detected by the second temperature sensor 701 corresponding to the second segment closest to the first end of the second beam structure 702 among the M second segment intervals; T j ' represents the temperature detected by the second temperature sensor 701 corresponding to the second target segment interval; T0 represents the initial temperature; β represents the expansion coefficient of the second beam structure 702; L1' represents the length of the second segment interval closest to the first end of the second beam structure 702 among the M second segment intervals; L j' represents the length of the second target segment interval. Here, T0 represents the initial temperature of the second beam structure 702 when the electronic component transfer device 000 is not in operation, which is also the ambient temperature of the environment where the transfer device 000 is located. L1' represents the length of the second segment interval closest to the first end of the second beam structure 702 among the M second segment intervals at the initial temperature T0. j ' represents the length of the second target segment interval at the initial temperature T0.

[0240] For example, as shown in Figure 10, the electronic component transfer device 000 may include three second temperature sensors: second temperature sensor 701a, second temperature sensor 701b, and second temperature sensor 701c. The second beam structure 702 may have three second segmented intervals arranged sequentially along the second direction Y: second segmented interval 702a, second segmented interval 702b, and second segmented interval 702c. The second temperature sensors 701a, 701b, and 701c may be located within their respective second segmented intervals 702a, 702b, and 702c. The lengths of these three second segmented intervals may be L1', L2', and L3', respectively.

[0241] When j=1, the second target segment interval is also the second segment interval 702a, meaning the theoretical endpoint of the transfer head 500 after movement can be located within the second segment interval 702a. In this case, the second designated segment interval is also the second segment interval 702a. The first coordinate of the second segment interval 702a can be a fixed coordinate Y1, and the second coordinate can be Y2. The temperature detected by the second temperature sensor 701a located within the second segment interval 702a can be T1'. Thus, the actual endpoint coordinate Yb of the second stage 201 after movement can be: Yb=Y1+(T1'-T0)×β×L1'×△Yb.

[0242] When j=2, the second target interval is also the second segmented interval 702b, meaning the theoretical endpoint of the second platform 200 after movement can be located within the second segmented interval 702b. In this case, there can be two second designated segmented intervals: the second segmented interval 702a and the second segmented interval 702b. The first coordinate of the second segmented interval 702b can be Y2, and the second coordinate can be Y3. The temperature detected by the second temperature sensor 701a located in the second segmented interval 702a can be T1', and the temperature detected by the second temperature sensor 701b located in the second segmented interval 702b can be T2'. Thus, the actual endpoint coordinate Yb of the second platform 201 after movement can be: Yb=Y1+(T1'-T0)×β×L1'+(T2'-T0)×α×L2'×(△Yb-L1').

[0243] When j=3, the second target interval is also the second segmented interval 702c, meaning the theoretical endpoint of the second platform 200 after movement can be located within the second segmented interval 702c. In this case, there can be three second designated segmented intervals: the second segmented interval 702a, the second segmented interval 702b, and the second segmented interval 702c. The first coordinate of the second segmented interval 702c can be Y3, and the second coordinate can be Y4. The temperature detected by the second temperature sensor 701a located in the second segmented interval 702a can be T1', the temperature detected by the second temperature sensor 701b located in the second segmented interval 702b can be T2', and the temperature detected by the second temperature sensor 701c located in the second segmented interval 702c can be T3'. Thus, the actual endpoint coordinate Yb of the first platform 201 after its movement can be: Yb=Y1+(T1'-T0)×β×L1'+(T2'-T0)×β×L2'+(T3'-T0)×β×L3'×(△Yb-L2'-L2').

[0244] It should be noted that the above embodiments are all illustrated with the case where there are multiple second temperature sensors 701 located on the second crossbeam structure 702. In other possible implementations, the number of second temperature sensors 701 located on the second crossbeam structure 702 can be one.

[0245] Here, a second temperature sensor 701 can be located at the middle position of the second crossbeam structure 702 in the second direction Y, or it can be located at one of the two ends of the second crossbeam structure 702 in the second direction Y. This application does not make specific limitations, as long as it can be used to effectively compensate for the effects of temperature.

[0246] The endpoint position of the transfer head 500 after movement can be represented by coordinates distributed in the second direction Y. The coordinates of the first end of the second beam structure 702 distributed in the second direction Y can be fixed coordinates Y1. The difference between the theoretical endpoint coordinates of the transfer head 500 after movement and the fixed coordinates Y1 can be ΔYb. The actual endpoint coordinates Yb of the first platform 200 after movement can be: Yb=Y1+(T1'-T0)×β×L'×ΔYb. Where, T1' represents the temperature detected by the second temperature sensor 701, T0 represents the initial temperature, β represents the coefficient of thermal expansion of the second beam structure 702, and L' represents the length of the second beam structure 702.

[0247] Specifically, the initial temperature T0 can be the sensor temperature during the equipment calibration process or the ambient temperature of the environment in which the equipment is located (e.g., the room temperature in the workshop where the equipment is located), or it can be a specific preset temperature, such as 20°C, 23°C or 25°C. This application does not make any specific limitation, as long as it can be used to effectively determine the impact of the compensation temperature.

[0248] Specifically, L' represents the length of the second crossbeam structure 702 at the initial temperature T0.

[0249] Therefore, in this application, the electronic component transfer device 000 can obtain the first deformation amount of the first support frame 600 based on the first temperature sensor 601 located on the first support frame 600, and can correct the first deformation amount by controlling the movement stroke of the first stage 200, so that the target electronic component can be accurately aligned with the target connection part. At the same time, the electronic component transfer device 000 can obtain the second deformation amount of the second support frame 700 based on the second temperature sensor 701 located on the second support frame 700, and can correct the second deformation amount by controlling the movement stroke of the transfer head 500, so that the ejector pin 501 can accurately move to the side of the target electronic component away from the target connection part, and thus the ejector pin 501 can accurately transfer the target electronic component to the target connection part. Thus, during the operation of the electronic component transfer device 000, the electronic component transfer device 000 can continuously correct the deformation of the first support frame 600 and the second support frame 700 based on the first temperature sensor 601 located on the first support frame 600 and the second temperature sensor 701 located on the second support frame 700, so as to improve the transfer accuracy of the electronic component transfer device 000 in transferring the electronic component 011.

[0250] Optionally, the coordinate system of the electronic component transfer device 000 can be established before equipment calibration during the equipment debugging phase. In the above embodiments, the coordinate system of the electronic component transfer device 000 can be a planar coordinate system. The planar coordinate system of the electronic component transfer device 000 is a coordinate system established in the plane containing the first direction X and the second direction Y. The origin of the planar coordinate system of the electronic component transfer device 000 can coincide with the third positioning part 301 of the second stage 300, and the X-axis of the planar coordinate system of the electronic component transfer device 000 can be parallel to the first direction X, and the Y-axis can be parallel to the second direction Y. The planar coordinates in the coordinate system of the electronic component transfer device 000 can include coordinate information in the first direction X and coordinate information in the second direction Y.

[0251] It should be noted that the movement of the first stage 200 in the electronic component transfer device 000 along the second moving direction Y on the first crossbeam structure 602 can be driven by the fifth drive motor.

[0252] Optionally, please refer to Figure 11, which is a schematic diagram of another electronic component transfer device provided in an embodiment of this application. The electronic component transfer device 000 may further include an adapter frame 800. The second carrier frame 700 in the electronic component transfer device 000 may be movably connected to the adapter frame 800. The second carrier frame 700 can drive the adapter frame 800 to move together along the first direction X, that is, the second carrier frame 700 can drive the adapter frame 800 to move together along the first direction X through a sliding connection with the first track 101 and the second track 102. The adapter frame 800 can move relative to the second carrier frame 700 along the second direction Y. The first direction X may intersect with the second direction Y, for example, the first direction X may intersect the second direction Y perpendicularly.

[0253] Optionally, the transfer head 500 in the electronic component transfer device 000 may further include a transfer head body 502 movably connected to the ejector pin 501, and the transfer head body 502 may be fixedly connected to the adapter frame 800. In this way, the adapter frame 800 can drive the transfer head body 502, thereby driving the ejector pin 501 to move in the first direction X or the second direction Y, so that the ejector pin 501 can move to the side of the target electronic component away from the target connection portion. That is, the adapter frame 800 can drive the entire transfer head 500 to move in the first direction X or the second direction Y.

[0254] It should be noted that the movement of the adapter 800 relative to the second support frame 700 along the second direction Y can be driven by the sixth drive motor. The electronic component transfer device 000 can control the movement speed of the adapter 800 relative to the second support frame 700 along the second direction Y by controlling the sixth drive motor.

[0255] In this application, as shown in Figures 12, 13, and 14, Figure 12 is a top view of another first substrate and second substrate provided in an embodiment of this application, Figure 13 is a schematic diagram of a transfer head movement provided in an embodiment of this application, and Figure 14 is a schematic diagram of another transfer head movement provided in an embodiment of this application. The plurality of connecting portions 021 in the second substrate 020 can be arranged in multiple rows along the first direction X and in multiple columns along the second direction Y. Similarly, the plurality of electronic components 011 in the first substrate 010 can be arranged in multiple rows along the first direction X and in multiple columns along the second direction Y. The electronic component transfer device 000 can control the adapter 800 to move uniformly along the first moving direction Y1 on a row of connecting portions where the target connecting portion is located in the second substrate 020, and control the ejector pin 501 to move along the second moving direction Y2 while applying force to the side of the first substrate 010 away from the second substrate 020. The first moving direction Y1 can be opposite to the second moving direction Y2, and both can be parallel to the second direction Y.

[0256] Thus, during the process of transferring electronic component 011 from the electronic component transfer device 000 to the row of connecting portions 021 containing the target connecting portion in the second substrate 020, under the combined action of the adapter 800 moving at a constant speed along the first moving direction Y1 and the ejector pin 501 moving along the second moving direction Y2, the ejector pin 501 in the transfer head 500 can remain relatively stationary relative to the second substrate 020 while applying force to the side of the first substrate 010 away from the second substrate 020, or only move at a very small speed relative to the second substrate 020 along the second direction Y, so that the ejector pin 501 can still complete the transfer action normally. Therefore, even if the adapter 800 moves at a constant speed along the first moving direction Y1, under the action of the ejector pin 501 moving along the second moving direction Y2, the ejector pin 501 can still accurately transfer the target electronic component to the target connecting portion. Thus, the electronic component transfer device 000 only needs to control the adapter 800 to move at a constant speed along the second direction Y through the sixth drive motor, without directly realizing the movement and stopping of the ejector pin 501 relative to the second substrate 020 through the sixth drive motor, thus reducing the requirements for the sixth drive motor.

[0257] Optionally, please refer to Figure 15, which is a schematic diagram of another type of transfer head movement provided in an embodiment of this application. The electronic component transfer device 000 can also be configured such that, after the target point electronic component in the first substrate 010 is transferred to the target connection portion in the second substrate 020, the ejector pin 501 is controlled to move along the first moving direction Y1, and the moving speed of the ejector pin 501 relative to the base 100 can be greater than the moving speed of the adapter relative to the base 100, so as to reset the ejector pin 501.

[0258] Thus, as shown in Figure 13, after the transfer head body 502 moves at a constant speed along the first moving direction Y1 to move the reset pin 501 to the side of the next target electronic component away from the target connection part, the pin 501 can move along the second moving direction Y2. This allows the pin 501 to remain stationary relative to the second substrate 020 or move at a very small speed along the second direction Y while the transfer head body 502 continues to move at a constant speed along the first moving direction Y1. This enables the pin 501 to accurately transfer the target electronic component to the target connection part.

[0259] It should be noted that, as shown in Figures 12 and 16, Figure 16 is a top view of another first substrate and second substrate provided in an embodiment of this application. Before the electronic component transfer device 000 needs to start transferring the electronic component 011 to the row of connecting portions 021 where the target connecting portion is located in the second substrate 020, the electronic component transfer device 000 first needs to control the ejector pin 501 to move to the same position as the target connecting portion in the first direction X. For example, the first connecting portion can be used as the target connecting portion, and the first electronic component can be used as the target electronic component. Then, as shown in Figure 16, the electronic component transfer device 000 can control the adapter frame 800 through the fifth drive motor to drive the ejector pin 501 to start accelerating along the first moving direction Y1 until the ejector pin 501 reaches the side of the first electronic component away from the first connecting portion. Then, the adapter frame 800 can accelerate to the speed for subsequent uniform movement. At the same time, the ejector pin 501 can move along the second moving direction Y2 so that the ejector pin 501 can be stationary relative to the No. 1 connecting part. In this way, the ejector pin 501 can accurately transfer the No. 1 electronic component to the No. 1 connecting part.

[0260] After the ejector pin 501 transfers electronic component number 1 to the connector number 1, the ejector pin 501 can move along the first moving direction Y1 to reset. At the same time, the adapter frame 800, which moves at a constant speed along the first moving direction Y1, can drive the ejector pin 501 to move towards the next target electronic component.

[0261] It should also be noted that after the ejector pin 501 transfers electronic component No. 1 to connection part No. 1, the electronic component transfer device 000 can locate the target electronic component corresponding to the next target connection part. Here, the electronic component transfer device 000 can select the target electronic component corresponding to the next target connection part according to the principle of proximity. For example, as shown in Figures 16 and 17, Figure 17 is a top view of another first substrate and second substrate provided in the embodiment of this application. After the ejector pin 501 transfers electronic component No. 1 to connection part No. 1, the next target connection part is connection part No. 2. Around connection part No. 2, the distance between electronic component No. 8 and connection part No. 2 is the smallest, which means that the distance between the center point of electronic component No. 8 and the center point of connection part No. 2 can be minimized. Therefore, electronic component No. 8 is the electronic component corresponding to connection part No. 2. Then, after determining the next target connection part and the target electronic component, the electronic component transfer device 000 can control the first stage 200 to perform regional displacement so that electronic component No. 8 is aligned with connection part No. 2. Thus, after the adapter 800 moves the ejector pin 501 to the side of the electronic component 8 away from the connection part 2, the ejector pin 501 can repeat the above action to accurately transfer the electronic component 8 to the connection part 2.

[0262] Therefore, the electronic component transfer device 000 can repeat the above transfer process until each row of connecting portions 021 in the second substrate 020 is fixed with a corresponding electronic component 011. The electronic component transfer device 000 can control the second carrier 700 to drive the adapter 800 to move along the first direction X, so that the adapter 800 can drive the ejector pin 501 to the same position as the next target connecting portion in the second substrate 020 in the first direction X, so as to transfer the electronic component 011 to the row of connecting portions 021 where this target connecting portion is located. The electronic component transfer device 000 can continuously repeat the above process until each connecting portion 021 in the second substrate 020 is connected with a corresponding electronic component 011.

[0263] In this application, as shown in FIG11, the adapter 800 in the electronic component transfer device 000 can be fixedly connected to the camera 400. Here, since the transfer head body 502 is also fixedly connected to the adapter 800, the camera 400 and the transfer head 502 can be moved relative to the second support frame 700 along the second direction Y by moving the adapter 800 relative to the second support frame 700. In this case, the transfer head 500 can move synchronously with the camera 400 relative to the base 100.

[0264] It should be noted that, as shown in Figures 13 and 14, after the ejector pin 501 moves to the side of the target electronic component away from the target connection portion, the ejector pin 501 moves toward the side of the first substrate 010 away from the second substrate 020, and moves toward the second substrate 020 against the side of the first substrate 010 away from the second substrate 020, so as to transfer the target electronic component onto the target connection portion, the distance that the ejector pin 501 moves along the third direction Z can be the transfer distance of the ejector pin 501.

[0265] Currently, after the second substrate 020 is supported on the second stage 300, the coordinates of the second substrate 020 in the third direction Z can be fixed. Therefore, the coordinates of each connecting part 021 in the second substrate 020 in the third direction Z are also fixed. Since the coordinates of the first substrate 010 in the third direction Z are also fixed, the electronic component transfer device 000 can set the transfer distance of the ejector pin 501 according to the distance between the first substrate 010 and the second substrate 020 in the third direction Z.

[0266] However, after the second substrate 020 is fabricated, before it is transferred to the second stage 300 in the electronic component transfer device 000, the second substrate 020 may undergo local deformation (e.g., warping), causing at least a portion of the second substrate 020 to change its coordinates in the third direction Z, which in turn causes a change in the distance between this portion of the second substrate 020 and the first substrate 010. Thus, if the electronic component transfer device 000 still controls the ejector pin 501 to move towards the second substrate 020 according to a pre-set moving distance, if the distance between the second substrate 020 and the first substrate 010 decreases, the ejector pin 501 will over-press the target electronic component, causing damage; if the distance between the second substrate 020 and the first substrate 010 increases, the ejector pin 501 cannot transfer the target electronic component to the target connection portion. Therefore, when the electronic component transfer device 000 transfers the electronic component 011 from the deformed second substrate 020, the transfer accuracy of the electronic component transfer device 000 is greatly reduced.

[0267] In this application, as shown in FIG11, the electronic component transfer device 000 may further include a ranging sensor 900 movably connected to the base 100. The electronic component transfer device 000 may also determine the target distance in the third direction Z between the target connection portion in the first substrate 010 and the ejector pin 501, and control the ejector pin 501 to move towards the side of the first substrate 010 away from the second substrate 020 based on the target distance, so as to apply a force to the side of the first substrate 010 away from the second substrate 020, thereby transferring the target electronic component in the first substrate 010 to the target connection portion in the second substrate 020. It should be noted that the target distance in the third direction Z between the target connection portion and the ejector pin 501 may refer to the vertical distance between the initial position of the tip of the ejector pin 501 before it moves along the first substrate 010 in the third direction and the surface of the target connection portion away from the second substrate 020. Here, the vertical distance is the distance in the third direction. Thus, during the process of transferring electronic component 011 from the connecting portion 021 in the deformed second substrate 020 by the electronic component transfer device 000, the electronic component transfer device 000 can control the transfer distance of the ejector pin 501 according to the distance between the different connecting portions 021 in the second substrate 020 and the ejector pin 501 in the third direction Z, so that the ejector pin 501 can accurately transfer the target electronic component to the target connecting portion, thereby avoiding the phenomenon that the ejector pin 501 excessively presses the target electronic component, causing damage, or is unable to transfer the target electronic component.

[0268] It is understood that the movement distance of the ejector pin 501 in the third direction Z can be fixed. Therefore, in some embodiments, the target distance between the target connection portion and the ejector pin 501 in the third direction Z can also refer to the vertical distance between the tip of the ejector pin 501 moving to its farthest position along the first substrate 010 in the third direction and the target connection portion facing away from the surface of the second substrate 020. Here, the vertical distance is the distance in the third direction.

[0269] The following explanation will take the target distance between the target connection portion and the ejector pin 501 in the third direction Z as an example, which refers to the vertical distance between the initial position of the tip of the ejector pin 501 before it moves along the first substrate 010 in the third direction and the target connection portion away from the surface of the second substrate 020:

[0270] It should be noted that when establishing the coordinate system of the electronic component transfer device 000, the overall coordinate system of the electronic component transfer device 000 can be a combination of a planar coordinate system and a Z-axis. Since the first stage 200 does not move in the third Z-direction, the side of the first stage 200 facing the second stage 300 can be used as the origin of the Z-axis. Since the origin of the planar coordinate system of the electronic component transfer device 000 coincides with the third positioning part 301 of the second stage 300, the origin of the overall coordinate system of the electronic component transfer device 000 can coincide with the projection point of the third positioning part 301 on the surface of the first stage 200 facing the second stage 300. After the overall coordinate system of the electronic component transfer device 000 is established, the electronic component transfer device 000 can control the movement stroke of the moving structure in the electronic component transfer device 000 according to the overall coordinate system.

[0271] In some embodiments, the relative position of the ranging sensor 900 and the transfer head 500 is fixed. Specifically, referring to FIG11, the ranging sensor 900 can be fixedly connected to the adapter frame 800, and thus can move with the adapter frame 800 on the second support frame 700.

[0272] In some embodiments, the ranging sensor 900 does not move in the third direction Z, and the position information of the ranging sensor 900 in the third direction Z is known. The electronic component transfer device 000 can obtain the distance between the ranging sensor 900 and various positions of the second substrate 020, and thus obtain the position information of each position of the second substrate 020 in the third direction Z. In this way, the target distance between the target connection portion in the second substrate 020 and the ejector pin 501 in the third direction Z can be obtained.

[0273] In one possible implementation of obtaining the target distance, the second substrate 020 may have multiple preset points. The electronic component transfer device 000 can acquire the position information of each preset point in the second substrate 020 in the third direction Z using the ranging sensor 900, and determine the position information of each connecting part 021 in the second substrate 020 in the third direction Z based on the position information of each preset point in the second substrate 020 in the third direction Z. Then, the electronic component transfer device 000 can determine the target distance between the target connecting part and the ejector pin 501 based on the position information of the target connecting part in the second substrate 020 in the third direction Z. For example, the height of the target connecting part can be obtained by adding or subtracting a fixed height value from the height of the preset points, or the height of the target connecting part can be equal to the height of the preset points.

[0274] Optionally, at least a portion of the preset point is at least a portion of the first positioning part 022. Of course, the preset point 022 can also be a second substrate surface at a specific location, a connecting part 021 at a specific location, or other feature structures.

[0275] Optionally, the region formed by a portion of the preset points in the second substrate 020 may at least partially overlap with the central region of the second substrate 020, and the region formed by a portion of the preset points in the second substrate 020 may be located within the region formed by another portion of the preset points.

[0276] For example, the width of the region formed by a portion of the preset points in the first direction may be half the width of the second substrate 020 in the first direction; the length of the region formed by a portion of the preset points in the second direction may be half the length of the second substrate 020 in the second direction.

[0277] For example, the width of the region formed by a portion of the preset points in the first direction may be one-third of the width of the second substrate 020 in the first direction; the length of the region formed by a portion of the preset points in the second direction may be one-third of the length of the second substrate 020 in the second direction.

[0278] For example, another portion of the multiple preset points can be set around the edge of the second substrate. For example, another portion of the multiple preset points can be set near the four apex corners of the second substrate.

[0279] For example, as shown in Figure 18, which is a top view of another second substrate provided in an embodiment of this application, the second substrate 020 may have eight preset points. The area formed by four preset points in the second substrate 020—preset point S3, preset point S4, preset point S5, and preset point S6—may at least partially overlap with the central area of ​​the second substrate 020. Furthermore, the area formed by preset points S3, S4, S5, and S6 may be located within the area formed by another four preset points in the second substrate 020—preset point S1, preset point S2, preset point S7, and preset point S8.

[0280] Optionally, after acquiring the position information of each preset point in the second substrate 020 in the third direction Z, the electronic component transfer device 000 can select the preset point that is farthest or closest to the ranging sensor 900 among the multiple preset points in the second substrate 020 as the target preset point. Then, based on the position information of the target preset point and other preset points in the third direction Z, the electronic component transfer device 000 can determine multiple contour curves in the second substrate 020. Then, based on the multiple contour curves, the electronic component transfer device 000 can determine the position information of each connecting portion 021 in the second substrate 020 in the third direction Z.

[0281] Optionally, the position information of the preset points in the second substrate 020 in the third direction Z may include the height of the preset points. It should be noted that after the second stage 300 supports the second substrate 020, the position information of the second stage 300 in the third direction Z remains unchanged. However, due to the deformation of the second substrate 020, the distance between different positions on the side of the second substrate 020 away from the second stage 300 and the surface of the second stage 300 facing the second substrate 020 (i.e., the upper surface of the second stage 300) is different. Therefore, the deformation of the second substrate 020 can be characterized by the distance between each preset point of the second substrate 020 and the upper surface of the second stage 300, i.e., the height of the preset point.

[0282] For example, as shown in Figure 19, Figure 19 is a schematic diagram of the heights of the preset points in Figure 18. The horizontal coordinate axis can be the Y-axis of the electronic component transfer device 000, and the vertical coordinate axis can be the X-axis of the electronic component transfer device 000. The values ​​in the coordinate system represent the heights of each preset point. The coordinates of preset point S1 are (27.9755, 6.7428), and its height is 4.2206; the coordinates of preset point S2 are (27.9755, 297.559), and its height is 4.1953; the coordinates of preset point S3 are (89.2295, 103.6815), and its height is 4.2132; the coordinates of preset point S4 are (89.2295, 200.6203), and its height is 4.2012. The coordinates of preset point S5 are (150.4853, 103.6815), and the height of preset point S5 is 4.2103; the coordinates of preset point S6 are (150.4853, 200.6203), and the height of preset point S6 is 4.2032; the coordinates of preset point S7 are (211.774, 4.05), and the height of preset point S7 is 4.2166; the coordinates of preset point S8 are (211.774, 294.863), and the height of preset point S8 is 4.199.

[0283] In this application, when the height difference between at least two first other preset points in the second substrate 020 is less than a preset height threshold, the electronic component transfer device 000 can generate a first contour curve based on the position information of the target preset point and the at least two first other preset points in the third direction Z, i.e., the height of the target preset point and the height of the at least two first other preset points. The first contour curve can bend around the target preset point. The distance between the at least two first other preset points and the first contour curve can be less than the preset height threshold.

[0284] In other words, since the first contour curve is generated based on the height of the target preset point and the heights of at least two other preset points, and since the height difference between the at least two other preset points is less than a preset threshold (meaning the heights of the at least two other preset points are not identical), after the first contour curve and at least one of the at least two other preset points completely overlap, the other other preset points will not completely overlap with the first contour curve; the height difference between the other other preset points and the first contour curve will simply be less than a preset height threshold.

[0285] For example, as shown in Figure 19, the height of preset point S1 is the maximum height among the eight preset points, meaning that preset point S1 is closest to the ranging sensor 900. Therefore, preset point S1 can be a target preset point.

[0286] For example, among the eight preset points of the second substrate 020, there may be three first other preset points: preset point S3, preset point S5, and preset point S7. The height difference between preset points S3, S5, and S7 may be less than a preset height threshold. Therefore, the electronic component transfer device 000 can generate a first contour curve (No. 1) based on the height of the target preset point S1, as well as the heights of preset points S3, S5, and S7. This first contour curve (No. 1) can bend around the target preset point S1.

[0287] Here, if contour line 1 completely coincides with preset point S3, then preset points S5 and S7 do not completely coincide with contour line 1. If contour line 1 completely coincides with preset point S5, then preset points S3 and S7 do not completely coincide with contour line 1. If contour line 1 completely coincides with preset point S7, then preset points S3 and S5 do not completely coincide with contour line 1.

[0288] For example, among the eight preset points of the second substrate 020, there may be two first other preset points: preset point S4 and preset point S6, and the height difference between preset point S4 and preset point S6 may be less than a preset height threshold. Therefore, the electronic component transfer device 000 can generate a second first contour curve based on the height of the target preset point S1, the height of the pre-preset point S4, and the height of the preset point S6, and the second first contour curve can bend around the target preset point S1.

[0289] Here, if contour line 2 completely coincides with preset point S4, preset point S6 does not coincide with contour line 2. If contour line 2 completely coincides with preset point S6, preset point S4 does not completely coincide with contour line 2.

[0290] For example, among the eight preset points of the second substrate 020, there may be two first other preset points: preset point S2 and preset point S8, and the height difference between preset point S2 and preset point S8 may be less than a preset height threshold. Therefore, the electronic component transfer device 000 can generate a third first contour curve based on the height of the target preset point S1, the height of the pre-preset point S2, and the height of the preset point S8, and the third first contour curve can bend around the target preset point S1.

[0291] Here, if contour line 3 completely coincides with preset point S2, preset point S8 does not coincide with contour line 3. If contour line 3 completely coincides with preset point S8, preset point S2 does not completely coincide with contour line 3.

[0292] Optionally, if at least one second other preset point exists among the other preset points in the second substrate 020, the electronic component transfer device 000 can generate at least one second contour curve based on the position information of the target preset point and each of the second other preset points in the third direction Z, and the second contour curve can be curved around the target preset point. The second other preset point coincides with a corresponding second contour curve. The height difference between the second other preset point and any other preset point is greater than a preset height threshold.

[0293] Here, if there exists a preset point in the second substrate 020 whose height difference with any other preset point is greater than a preset height threshold, this preset point is designated as a second other preset point. The electronic component transfer device 000 can generate a second contour curve based on the height of the target preset point and the height of the second other preset point, and the second contour curve can bend around the target preset point. Since the second contour curve is generated based on the height of the target preset point and the height of the second other preset point, this second preset point can bend and coincide with the corresponding second contour line.

[0294] Thus, after the electronic component transfer device 000 obtains multiple contour lines based on the position information of multiple preset points in the second substrate 020 in the third direction Z, the electronic component transfer device 000 can establish a mathematical model based on the multiple contour lines. The electronic component transfer device 000 can then calculate the position information of any point on the second substrate 020 in the third direction Z based on this mathematical model. Therefore, the electronic component transfer device 000 can obtain the position information of each connecting part 021 in the second substrate 020 in the third direction Z, and further obtain the target distance between each connecting part 021 in the second substrate 020 and the ejector pin 501 in the third direction Z.

[0295] Optionally, the positions of each preset point on the second substrate 020 do not coincide with the positions of the multiple connecting parts 021 on the second substrate 020.

[0296] In some embodiments, since the connecting portion 021 in the second substrate 020 has a certain thickness and can be disposed on the surface of the second substrate 020, in order to more accurately obtain the overall undulation of the surface of the second substrate 020, that is, in order to more accurately obtain the position information of each position on the surface of the second substrate 020 in the third direction, it is necessary to ensure that the position of each preset point on the second substrate 020 does not coincide with the position of the multiple connecting portions 021 on the second substrate 020. In this way, the overall undulation of the surface of the second substrate 020 can be obtained based on multiple preset points.

[0297] It should be noted that after the transfer device 000 acquires the overall undulation of the second substrate 020, that is, after acquiring the position information of each position on the surface of the second substrate 020 in the third direction, the transfer device 000 also needs to acquire the position information of the corresponding connection positions on the surface of the second substrate in the third direction based on the planar coordinates of each connection in the first and second directions. Then, the transfer device can determine the position information of the connection facing away from the surface of the second substrate in the third direction based on the position information of the corresponding connection positions on the surface of the second substrate in the third direction and the thickness of the connection protruding relative to the surface of the second substrate. This allows the transfer device to acquire the distance between the connection and the ejector pin in the third direction.

[0298] Optionally, the position of the preset point in the second substrate 020 on the second substrate 020 may coincide with the position of the first positioning part 022 in the second substrate 020 on the second substrate 020. That is, the preset point in the second substrate 020 may be selected from a plurality of first positioning parts 022 in the second substrate 020.

[0299] It should be noted that the multiple preset points in the second substrate 020 can be arranged on the second substrate 020 according to the above-described arrangement of the eight preset points in the second substrate 020. In other possible implementations, the multiple preset points can also be distributed in an array along the first and second directions on the second substrate 020. This application embodiment does not limit this. It should also be noted that the more preset points in the second substrate 020, the more accurate the target distance between the target connection portion and the ejector pin 501 in the second substrate 020 determined by the electronic component transfer device 000 based on the position information of the multiple preset points in the third direction Z, and the better the transfer effect of the electronic component transfer device 000 on the electronic component.

[0300] In this application, please refer to FIG20, which is a schematic diagram of the structure of an electronic component transfer device according to another embodiment of this application. The electronic component transfer device 000 may further include: a first hopper 1100 and a second hopper 1200, a feeding mechanism 1300 cooperating with the first hopper 1100, and a discharging mechanism 1400 cooperating with the second hopper 1200.

[0301] The first hopper 1100 in the electronic component transfer device 000 can be used to hold the first substrate 010 that has not undergone electronic component transfer. The loading mechanism 1300 is used to pick up a first substrate 010 and transfer it onto the first stage 200. The second hopper 1200 in the electronic component transfer device 000 can be used to hold the first substrate 010 that has undergone electronic component transfer. The unloading mechanism 1400 can pick up the first substrate 010 that has undergone electronic component transfer from the first stage 200 and transfer it into the second hopper 1200.

[0302] It should be noted that the first hopper 1100 in the electronic component transfer device 000 can hold multiple first substrates 010 that have not yet undergone electronic component transfer. When the first stage 200 is not holding a first substrate 010, the electronic component transfer device 000 can control the first stage 200 to move to a first designated position. Here, the first designated position refers to the position where the loading mechanism 1300 can transfer the first substrate 010 onto the first carrier 200. For example, the first carrier 200 can be located on the side of the loading mechanism 1300 away from the base stage 100 in the third direction Z. Next, the electronic component transfer device 000 can control the loading mechanism 1300 to grab a first substrate 010 that has not undergone electronic component transfer, and control the loading mechanism 1300 to move along the direction of the third direction Z toward the first stage 200 located at the first designated position, so as to send the first substrate 010 that has not undergone electronic component transfer onto the first stage 200, so that the first substrate 010 can transfer each electronic component 011 in the first substrate 020 to the corresponding connecting part 021 under the drive of the first stage 200.

[0303] After all or part of the electronic components 011 in the first substrate 010 located on the first stage 200 have been transferred, the electronic component transfer device 000 can control the first stage 200 to move to a second designated position. Here, the second designated position refers to the position where the unloading mechanism 1400 can grasp the first substrate 010 located on the first stage 200. For example, the first stage 200 can be located on the side of the unloading mechanism 1400 away from the stage 100 in the third direction Z. Then, the electronic component transfer device 000 controls the unloading mechanism 1400 to move in the third direction Z toward the first stage 200 located at the second designated position to grasp the first substrate 010 on the first stage 200 that has undergone electronic transfer. Then, the electronic component transfer device 000 can control the unloading structure 1400 to feed the first substrate 010 that has undergone electronic component transfer into the second hopper 1200. Meanwhile, the electronic component transfer device 000 can control the first carrier 200 to move to the first designated position to receive the first substrate 010 that has not undergone electronic component transfer, which is picked up by the feeding mechanism 1300.

[0304] In this way, after all the electronic components 011 in a first substrate 010 have been transferred, the electronic component transfer device 000 can control the feeding mechanism 1200 to continuously feed the first substrate 010 that has not yet undergone electronic component transfer onto the first carrier 200, so as to transfer the electronic components 011 in the next first substrate 010, thereby improving the transfer efficiency of the electronic component transfer device 000.

[0305] For example, as shown in Figures 20 and 21, the first hopper 1100 and the second hopper 1200 are closer to the second support frame 700 than the first support frame 600. For example, as shown in Figures 20 and 21, both the loading mechanism 1300 and the unloading mechanism 1400 are closer to the second support frame 700 than the first support frame 600.

[0306] It should be noted that if the first hopper 1100 and the second hopper 1200 are closer to the first support frame 600 than the second support frame 700, and the loading mechanism 1300 and the unloading mechanism 1400 are also closer to the first support frame 600 than the second support frame 700, then in order to ensure that the loading and unloading mechanisms can work normally, clearance space needs to be provided around the first support frame 600, resulting in an increase in the overall size of the electronic component transfer device 000. Therefore, by having the first hopper 1100 and the second hopper 1200 closer to the second support frame 700 than the first support frame 600, and both the loading mechanism 1300 and the unloading mechanism 1400 closer to the second support frame 700 than the first support frame 600, the overall size of the transfer device 000 can be effectively reduced.

[0307] It should also be noted that when the loading mechanism 1300 picks up the first substrate located in the first hopper 1100, the loading mechanism 1300 can move towards the first hopper 1100 in the first direction X to pick up the first substrate located in the first hopper 1100. After the loading mechanism 1300 has picked up the first substrate, the loading mechanism 1300 can move away from the first hopper 1100 in the first direction X until it moves to the same position as the first platform 200 in the third direction Z. After that, the loading mechanism 1300 can move towards the first platform 200 in the third direction Z to feed the first substrate into the first platform 200.

[0308] Similarly, after the electronic components in the first substrate located on the first stage 200 are transferred, the unloading mechanism 1400 can move toward the first stage 200 in the third direction Z to pick up the first substrate located on the first stage 200, and move away from the first stage 200 in the third direction Z. Then the unloading mechanism 1400 can move toward the second hopper 1200 in the first direction X to feed the first substrate into the second hopper 1200.

[0309] In this application, as shown in Figures 20 and 21, Figure 21 is a cross-sectional view of another electronic component transfer device provided in an embodiment of this application. The electronic component transfer device 000 may further include: a lifting mechanism 1500 connected to a second carrier 300, and a transmission mechanism 1600 penetrating the base 100.

[0310] The transfer mechanism 100 in the electronic component transfer device 000 can be used to transfer the second substrate 020. The lifting mechanism 1500 can be used to: after the transfer mechanism 1600 transfers the second substrate 020 without distributed electronic components 011 onto the second stage 300, lift the second stage 300 to separate the second substrate 020 from the transfer mechanism 100. In this way, the electronic component transfer device 000 can control the ejector pin 501 to transfer the target electronic component onto the corresponding connecting portion 021 on the second substrate 020. After the transferred electronic components 011 are distributed on the second substrate 021, the second stage 020 is lowered so that the second substrate 020 can contact the transfer mechanism 1600, thereby allowing the transfer mechanism 1600 to transfer the second substrate 020 with distributed electronic components 011 to the outside of the stage 100. By repeating this cycle, the electronic component transfer device 000 can transfer electronic components 011 onto multiple second substrates 020. For example, the transmission mechanism 100 in the electronic component transfer device 000 can be a belt transmission mechanism.

[0311] For example, referring to Figures 20 and 21, the extension direction of the transmission mechanism 1600 is parallel to the extension direction of the first support frame 600 and the second support frame 700. Thus, the direction in which the second substrate 020 is transferred to the base 100 and leaves the base 100 is parallel to the extension direction of the first support frame 600 and the second support frame 700, which is beneficial for the compact layout of the transfer 000.

[0312] In summary, this application provides an electronic component transfer device, including: a base, a first stage, a second stage, a camera, and a transfer head. The first stage carries a first substrate, and the second stage carries a second substrate. The second substrate may have multiple first positioning portions. The electronic component transfer device can acquire first position information of at least some of the first positioning portions relative to the base using the camera. Then, based on the first position information of these first positioning portions, the theoretical position information of each connecting portion in the second substrate relative to the base can be corrected, thereby obtaining second position information of each connecting portion relative to the base. In this way, the electronic component transfer device can accurately align the connecting portions in the second substrate with the corresponding electronic components on the first substrate based on the second position information of each connecting portion, ensuring that each electronic component in the first substrate can be accurately transferred to the corresponding connecting portion in the second substrate, thereby improving the transfer accuracy of the electronic component transfer device.

[0313] It should be noted that the dimensions of layers and regions may be exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be intermediate layers. Additionally, it is understood that when an element or layer is referred to as being "below" another element or layer, it can be directly below the other element, or there may be more than one intermediate layer or element. Furthermore, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout indicate similar elements.

[0314] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0315] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An apparatus for transferring electronic components, characterized by comprising: include: abutment; A first platform movably connected to the base, the first platform being used to support a first substrate, the first substrate being a flexible substrate, and the first substrate including multiple electronic components; A second platform located on the base, the second platform being used to support a second substrate, and the second substrate including: a plurality of connecting portions and at least one first positioning portion; A camera, and a transfer head movably connected to the base, the transfer head including a pin; The transfer device is configured to: acquire first position information of the first positioning part through the camera, and acquire second position information of each of the connecting parts according to the first position information; control the first stage and the transfer head to move according to the second position information of the target connecting part, so that the target electronic component is aligned with the target connecting part, and after the ejector pin is located on the side of the target electronic component away from the target connecting part, control the ejector pin to apply a force to the side of the first substrate away from the second substrate, so as to transfer the target electronic component onto the target connecting part; The target connection part is any one of the plurality of connection parts, and the target electronic component is the electronic component that corresponds to the target connection part among the plurality of electronic components.

2. The transfer apparatus of claim 1, wherein, The number of the first positioning parts is multiple, and the multiple first positioning parts are arranged in an array on the second substrate. At least some of the first positioning parts constitute a first positioning part group, and the first positioning parts constituting a first positioning part group are not completely located in the same row or the same column. At least a portion of the plurality of connecting portions are located within the area enclosed by the first positioning portion group.

3. The transfer apparatus of claim 2, wherein, The transfer device is configured to: acquire first position information of each first positioning part in the first positioning part group through the camera, and acquire second position information of each connecting part in the area enclosed by the first positioning part group based on the first position information of each first positioning part in the first positioning part group and the first relative position information of the connecting part. The first relative position information includes the relative position information between the connecting part and the second substrate.

4. The transfer apparatus of claim 3, wherein, The plurality of first positioning parts in the first positioning part group include: a first reference positioning part and at least one second reference positioning part; The transfer device is configured to: acquire first position information of the first reference positioning unit via the camera, and use the first position information of the first reference positioning unit as the theoretical position information of the first reference positioning unit; determine the theoretical position information of each second reference positioning unit based on the theoretical position information of the first reference positioning unit and the positional relationship between the first reference positioning unit and each second reference positioning unit; acquire first position information of each second reference positioning unit via the camera; determine deformation compensation parameters corresponding to each connecting part within the area enclosed by the first positioning units based on the deviation between the first position information and the theoretical position information of each second reference positioning unit; and determine second position information of each connecting part based on the deformation compensation parameters of each connecting part and the corresponding first relative position information of the connecting part. The first relative position information includes the relative position information between the connecting portion and the first reference positioning portion in the second substrate.

5. The transfer apparatus of claim 2, wherein, There are multiple first positioning part groups, and the first positioning parts constituting each first positioning part group are not all located in the same row or the same column. At least some of the plurality of connecting portions are located within the regions enclosed by different first positioning portion groups, and the regions enclosed by the plurality of first positioning portion groups are arranged in an array.

6. The transfer apparatus of claim 1, wherein, The first platform includes a second positioning unit; The transfer device is configured to: after the first substrate is supported on the first stage, acquire third position information of the second positioning part through the camera, and acquire fourth position information of each of the electronic components based on the third position information; Based on the second position information of the target connector and the fourth position information of the target electronic component, the first stage is controlled to move so that the target electronic component is aligned with the target connector.

7. The transfer apparatus of claim 6, wherein, The transfer device is configured to: The camera acquires the third position information of the second positioning unit, and based on the third position information and the second relative position information of the electronic component, acquires the fourth position information of the electronic component. The second relative position information includes the relative position information between the electronic component and the first substrate.

8. The transfer apparatus of claim 6, wherein, The camera is movably connected to the base, and the camera and the transfer head can move synchronously relative to the base; the second platform includes a third positioning part; the transfer device is further configured to perform at least one device calibration process until the movement of the camera and the first platform meets preset conditions; One of the device calibration processes includes: after controlling the first platform to move relative to the base to a position where the center point of the second positioning part and the center point of the third positioning part coincide in the third direction, and controlling the camera to move relative to the base to a position where the shooting center of the camera coincides with the center point of the third positioning part, receiving a movement command for controlling the camera or the first platform to move; controlling the camera and the first platform to move according to the movement command, and generating corresponding calibration parameters based on the deviation between the shooting center of the camera after the movement and the center point of the second positioning part after the movement of the first platform, so that the transfer device can adjust the process of controlling the movement of the camera and / or the first platform according to the calibration parameters; The preset conditions include: after the camera and the first platform are moved according to the movement command, the deviation between the shooting center of the camera and the center point of the second positioning part is less than a preset deviation threshold.

9. The transfer apparatus according to any one of claims 1 to 8, characterized in that, The transfer device further includes: a first support frame, and a first temperature sensor fixed on the first support frame; The first support frame is movably connected to the base and to the first platform; the first support frame can drive the first platform to move together along a first direction, and the first platform can move relative to the first support frame along a second direction, the first direction and the second direction intersecting. The transfer device is further configured to: acquire a first temperature of the first support frame detected by the first temperature sensor, and acquire a first deformation of the first support frame based on the first temperature; based on the first deformation, as well as the second position information of the target connection and the fourth position information of the target electronic component, control the first stage to move so that the target electronic component is aligned with the target connection.

10. The transfer apparatus of claim 9, wherein, The first support frame includes: a first crossbeam structure extending along the second direction; the base includes: a first track and a second track disposed opposite to each other in the second direction, both the first track and the second track extending along the first direction; Wherein, the first end of the first crossbeam structure is slidably connected to the first track and is in contact with the first guide rail; the second end of the first crossbeam structure is slidably connected to the second track and has a first clearance space between it and the second guide rail for allowing the first crossbeam structure to deform.

11. The transfer apparatus of claim 10, wherein, The first support frame further includes: a first scale fixed on the first crossbeam structure, and the transfer device is used to: control the stroke of the first platform moving along the second direction on the first crossbeam structure according to the scale of the first scale; The first scale can deform along with the first crossbeam structure.

12. The transfer apparatus of claim 11, wherein, The transfer device further includes a first position sensor capable of moving synchronously with the first platform, the first position sensor being used in conjunction with the first scale to determine the travel distance of the first platform relative to the first beam structure.

13. The transfer apparatus of claim 10, wherein, The number of the first temperature sensors is N, and the N first temperature sensors are arranged sequentially along the second direction; N is an integer greater than or equal to 2.

14. The transfer apparatus of claim 13, wherein, The first beam structure has N first segmented intervals arranged sequentially along the second direction, and the N first temperature sensors correspond one-to-one with the N first segmented intervals, with one first temperature sensor located in the corresponding first segmented interval; The transfer device is configured to: determine the theoretical endpoint position of the first stage after movement based on the second position information of the target connection and the fourth position information of the target electronic component; determine a first target segment interval among the N first segment intervals, wherein the theoretical endpoint position of the first stage after movement is located within the first target segment interval; designate the first target segment interval, and each first segment interval located near the first end of the first target segment interval close to the first beam structure, as at least one first designated segment interval; and determine the actual endpoint position of the first stage after movement based on the temperature detected by the first temperature sensor corresponding to each first designated segment interval, the length of each first designated segment interval in the second direction, and the expansion coefficient of the first beam structure.

15. The transfer apparatus of claim 14, wherein, The endpoint position of the first platform after movement can be characterized by coordinates distributed in the second direction; each of the first segment intervals has a first coordinate and a second coordinate distributed in the second direction, and the first coordinate is closer to the first end of the first beam structure than the second coordinate; the first coordinate of the first segment interval closest to the first end of the first beam structure among the N first segment intervals is a fixed coordinate Y1. The first and second coordinates of the first target segment interval are Yi and Yi+1, respectively; i is an integer less than or equal to N; The difference between the theoretical endpoint coordinates of the first platform after its movement and the fixed coordinate Y1 is: △Ya; When i=1, the first target segment interval is the first segment interval closest to the first end of the first beam structure among the N first segment intervals, and the actual endpoint coordinates Ya of the first platform after movement are: Ya=Y1+(T1-T0)×α×L1×ΔYa; When i > 1, the actual endpoint coordinates of the first platform after its movement are: Ya=Y1+(T1-T0)×α×L1+……+(Ti-T0)×α×Li×(△Ya-L1-…… -Li-1); Wherein, T1 represents the temperature detected by the first temperature sensor corresponding to the first segment closest to the first end of the first beam structure among the N first segment intervals; Ti represents the temperature detected by the first temperature sensor corresponding to the first target segment interval; T0 represents the initial temperature; α represents the expansion coefficient of the first beam structure; L1 represents the length of the first segment interval closest to the first end of the first beam structure among the N first segment intervals; and Li represents the length of the first target segment interval.

16. The transfer apparatus of claim 10, wherein, The number of the first temperature sensors is one; The endpoint position of the first platform after its movement can be represented by coordinates distributed in the second direction; The coordinates of the first end of the first beam structure distributed in the second direction are fixed coordinates Y1; The difference between the theoretical endpoint coordinates of the first platform after its movement and the fixed coordinate Y1 is: △Ya; The actual endpoint coordinates Ya of the first platform after its movement are: Ya=Y1+(T1-T0)×α×L×△Ya; Where T1 represents the temperature detected by the first temperature sensor; T0 represents the initial temperature; α represents the coefficient of thermal expansion of the first beam structure; and L represents the length of the first beam structure.

17. The transfer apparatus of any of claims 1-8, 10-14, wherein, The transfer device further includes: a second support frame, and a second degree sensor fixed on the second support frame; The second support frame is movably connected to the base and to the transfer head; the second support frame can drive the transfer head to move together along the first direction, and the transfer head can move relative to the second support frame along the second direction, the first direction and the second direction intersect. The transfer device is further configured to: acquire a second temperature of the second carrier detected by the second temperature sensor, and acquire a second deformation of the second carrier based on the second temperature; control the transfer head to move based on the second deformation and the second position information of the target connection portion, so that the pin is located on the side of the target electronic component away from the target connection portion.

18. The transfer apparatus of claim 17, wherein, The second support frame includes: a second crossbeam structure extending along the second direction; the base includes: a first track and a second track disposed opposite to each other in the second direction, both the first track and the second track extending along the second direction; The first end of the second crossbeam structure is slidably connected to the first track and is in contact with the first slide rail; the second end of the second crossbeam structure is slidably connected to the second track and has a second clearance space between it and the second guide rail for allowing the second crossbeam structure to deform.

19. The transfer apparatus of claim 17, wherein, The second support frame further includes: a second scale fixed on the second crossbeam structure, and the transfer device is used to: control the stroke of the transfer head moving along the second direction on the second crossbeam structure according to the scale of the second scale; The second scale can deform along with the second crossbeam structure.

20. The transfer apparatus of claim 19, wherein, The transfer device further includes a second position sensor capable of moving synchronously with the transfer head, the second position sensor being used in conjunction with the second scale to determine the stroke of the transfer head relative to the second beam structure.

21. The transfer apparatus of claim 18, wherein, The number of the second temperature sensors is M, and the M second temperature sensors are arranged sequentially along the second direction; M is an integer greater than or equal to 2.

22. The transfer apparatus of claim 21, wherein, The second beam structure has M second segment intervals arranged sequentially along the second direction, and the M second temperature sensors correspond one-to-one with the M second segment intervals, with one second temperature sensor located in the corresponding second segment interval; The transfer device is configured to: determine the theoretical endpoint position of the transfer head after movement based on the second position information of the target connection; determine a second target segment interval among the M second segment intervals, wherein the theoretical endpoint position of the transfer head after movement is located within the second target segment interval; designate the second target segment interval, and each second segment interval located near the first end of the second target segment interval close to the second crossbeam structure, as: at least one second designated segment interval; and determine the actual endpoint position of the transfer head after movement based on the temperature detected by the second temperature sensor corresponding to each second designated segment interval, the length of each second designated segment interval in the second direction, and the expansion coefficient of the second crossbeam structure.

23. The transfer apparatus of claim 22, wherein, The endpoint position of the transfer head after movement can be characterized by coordinates distributed in the second direction; each of the second segment intervals has a first coordinate and a second coordinate distributed in the second direction, the first coordinate being closer to the first end of the second beam structure than the second coordinate; the first coordinate of the second segment interval closest to the first end of the second beam structure among the M second segment intervals is a fixed coordinate Y1; The first and second coordinates of the second target segment interval are Yj and Yj+1, respectively; j is an integer less than or equal to M; The difference between the theoretical endpoint coordinates of the transfer head after its movement and the fixed coordinate Y1 is: △Yb; When j=1, the second target segment interval is the second segment interval closest to the first end of the second crossbeam structure among the M second segment intervals, and the actual endpoint coordinate Yb of the transfer head after movement is: Yb=Y1+(T1'-T0)×β×L1'×△Yb; When j > 1, the actual endpoint coordinates of the transfer head after its movement are: Yb=Y1+(T1'-T0)×β×L1'+……+(Tj'-T0)×β×Lj’×(△ Yb-L1'-……-Lj-1'); Wherein, T1' represents the temperature detected by the second temperature sensor corresponding to the second segment closest to the first end of the second beam structure among the M second segment intervals; Tj' represents the temperature detected by the second temperature sensor corresponding to the second target segment interval; T0 represents the initial temperature; β represents the expansion coefficient of the second beam structure; L1' represents the length of the second segment interval closest to the first end of the second beam structure among the M second segment intervals; and Li' represents the length of the second target segment interval.

24. The transfer apparatus of claim 18, wherein, The number of the second temperature sensors is one; The endpoint position of the transfer head after its movement can be characterized by coordinates distributed in the second direction; The first end of the second beam structure has a fixed coordinate Y1 in the second direction. The difference between the theoretical endpoint coordinates of the transfer head after its movement and the fixed coordinate Y1 is: △Yb; The actual endpoint coordinates Yb after the transfer head has moved are: Yb=Y1+(T1'-T0)×β×L'×△Yb; Where T1' represents the temperature detected by the second temperature sensor; T0 represents the initial temperature; β represents the expansion coefficient of the second beam structure; and L' represents the length of the second beam structure.

25. The transfer apparatus according to any one of claims 1-8, 10-16, 18-24, wherein, The transfer device further includes: a transfer frame and a second support frame; The second support frame is movably connected to the base and also movably connected to the adapter frame; the second support frame can drive the adapter frame to move together along a first direction, and the adapter frame can move relative to the second support frame along a second direction, wherein the first direction and the second direction intersect. The transfer head further includes a transfer head body movably connected to the ejector pin, and the transfer head body is fixedly connected to the adapter frame.

26. The transfer apparatus of claim 25, wherein, The plurality of connecting portions are arranged in multiple rows along the first direction and in multiple columns along the second direction; The transfer device is configured to: control the adapter to move at a constant speed along a first moving direction on a row of connecting portions where the target connecting portion is located; and control the ejector pin to move along a second moving direction during the process of the ejector pin applying a force to the side of the first substrate away from the second substrate. The first moving direction is opposite to the second moving direction, and both are parallel to the second direction.

27. The transfer apparatus of claim 26, wherein, The transfer device is further configured to: after the target electronic component is transferred to the target connection portion, control the ejector pin to move along the first moving direction, and the moving speed of the ejector pin is greater than the moving speed of the adapter frame, so as to reset the ejector pin.

28. The transfer apparatus of claim 25, wherein, The adapter is fixedly connected to the camera.

29. The transfer apparatus of claim 6, wherein, The second position information of the connecting part includes: the planar coordinates of the first feature point of the connecting part in the coordinate system of the transfer device; The fourth position information of the electronic component includes: the planar coordinates of the second feature point of the electronic component in the coordinate system of the transfer device; The planar coordinates in the coordinate system of the transfer device include coordinate information in a first direction and coordinate information in a second direction.

30. The transfer device according to any one of claims 1-8, 10-16, 18-24, and 26-29, characterized in that, The transfer device further includes: a ranging sensor movably connected to the base; The transfer device is further configured to: determine a target distance in a third direction between the target connection portion and the ejector pin via the ranging sensor, and control the ejector pin to move toward the side of the first substrate away from the second substrate according to the target distance, so as to apply a force to the side of the first substrate away from the second substrate.

31. The transfer device according to claim 30, characterized in that, The second substrate has multiple preset points; the transfer device is configured to: acquire position information of each preset point in a third direction through the ranging sensor, and determine the position information of each connecting part in a third direction based on the position information of each preset point in a third direction; and determine the target distance between the target connecting part and the ejector pin based on the position information of the target connecting part in a third direction.

32. The transfer device according to claim 31, characterized in that, The region formed by a portion of the preset points at least partially overlaps with the central region of the second substrate, and the region formed by a portion of the preset points is located within the region formed by another portion of the preset points.

33. The transfer device according to claim 31, characterized in that, The transfer device is configured to: after acquiring the position information of each of the preset points in the third direction, determine the target preset point as the preset point that is farthest or closest to the ranging sensor among the multiple preset points; determine multiple contour curves in the second substrate based on the position information of the target preset point and other preset points in the third direction; and determine the position information of each of the connecting parts in the third direction based on the multiple contour curves.

34. The transfer device according to claim 33, characterized in that, The position information of the preset point in the third direction includes: the height of the preset point; the transfer device is configured as follows: If the height difference between at least two of the other preset points is less than a preset height difference threshold, a first contour curve is generated based on the position information of the target preset point and the at least two first other preset points on the second substrate. The first contour curve bends around the target preset point, and the distance between the at least two first other preset points and the first contour curve is less than the preset height difference threshold. If at least one second other preset point exists among the other preset points, at least one second contour curve is generated based on the position information of the target preset point and each of the second other preset points on the second substrate. The second contour curve bends around the target preset point, and the second other preset point coincides with a corresponding second contour curve. The height difference between the second other preset point and any other preset point is greater than the preset height difference threshold.

35. The transfer device according to claim 31, characterized in that, The positions of each of the preset points on the second substrate do not coincide with the positions of the plurality of connecting portions on the second substrate.

36. The transfer device according to claim 35, characterized in that, The preset point coincides with the position of the first positioning part.

37. The transfer device according to any one of claims 1-8, 10-16, 18-24, 26-29, and 31-36, characterized in that, The transfer device further includes: a first hopper and a second hopper, a feeding mechanism that cooperates with the first hopper, and a discharging mechanism that cooperates with the second hopper; The first hopper is used to hold a first substrate that has not undergone electronic component transfer, and the loading mechanism is used to grab a first substrate and transfer the first substrate to the first carrier. The second hopper is used to hold the first substrate that has undergone electronic component transfer, and the unloading structure is used to grab the first substrate that has undergone electronic component transfer on the first platform and transfer the first substrate into the second hopper.

38. The transfer device according to any one of claims 1-8, 10-16, 18-24, 26-29, and 31-36, characterized in that, The transfer device further includes: a lifting mechanism connected to the second platform, and a transmission mechanism penetrating the base; The transmission mechanism is used to transmit the second substrate; The lifting mechanism is used to: after the transmission mechanism has transferred the second substrate, which has not yet been distributed with electronic components, to the second platform, drive the second platform to rise so that the second substrate is separated from the transmission mechanism; after the transferred electronic components are distributed on the second substrate, drive the second platform to fall so that the second substrate contacts the transmission mechanism, so that the transmission mechanism can transfer the second substrate with distributed electronic components to the outside of the platform.

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