Packaging structure cleaning method and apparatus

Abstract

The present application provides a packaging structure cleaning method and apparatus. The method comprises: a batch cleaning procedure: placing at least two packaging structures into a cleaning tank of a first cleaning module to perform batch cleaning on the at least two packaging structures, and placing the packaging structures that have undergone the batch cleaning procedure into cleaning cavities of second cleaning modules to execute an individual cleaning procedure, wherein one packaging structure is cleaned in the cleaning cavity of each second cleaning module at one time; and the individual cleaning procedure, comprising: spraying a cleaning solution to the packaging structure; extracting air from the cleaning cavity where the packaging structure is located, so that the pressure in the cleaning cavity reaches a second predetermined pressure, the second predetermined pressure being a negative pressure; and keeping the packaging structure stationary for a predetermined duration, so that the cleaning solution enters a gap of the packaging structure to clean the packaging structure. In the present application, batch pre-cleaning is first performed on a plurality of packaging structures, and then refined cleaning is performed on individual packaging structures; and by means of the multi-cleaning process, contaminants are ensured to be removed, thereby improving the cleaning efficiency.

Description

Cleaning method and cleaning device for packaging structure TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor manufacturing, in particular to a cleaning method and a cleaning device for packaging structure. BACKGROUND

[0002] A system-on-chip (SoC) is a complex large system integrated in a large chip. Unlike the concept of a system-on-chip, chip heterogeneity proposes to split a large system into several small systems, manufacture each small system into a small chip, or even into a standard small chip, and then re-integrate these small chips on the same carrier through a soldering process in the packaging technology. Each small chip is stably connected to the carrier through a plurality of bumps to achieve better performance than a single large chip with a large system. In the process of packaging the chip, flux is used to improve the reliability of soldering between the small chip and the carrier. After soldering is completed, the packaging structure after soldering needs to be cleaned to remove the residual flux, so as to avoid the adverse effects of residual flux on subsequent packaging processes, thereby affecting product yield.

[0003] With the further improvement of packaging density and integration, the size of the packaging structure is continuously reduced, and the gap between the chip and the carrier and the gap between the bumps also become smaller. It is more difficult for the cleaning liquid to enter the small gap between the chip and the carrier. Therefore, the traditional high-water-pressure flushing under atmospheric pressure is no longer applicable, and if the cleaning is to be thorough, a longer cleaning time is required. Therefore, there is an urgent need for a way to allow the liquid to flow in the extremely narrow space of the packaging structure, so as to completely remove the residual flux in the packaging structure within a reasonable time. SUMMARY

[0004] In order to enable the cleaning liquid to flow quickly in the extremely narrow space of the packaging structure, thereby completely removing the residual flux in the packaging structure within a reasonable time, the present application proposes a cleaning device and method for packaging structure.

[0005] In a first aspect, the present application proposes a cleaning method for packaging structure, comprising:

[0006] Batch cleaning process: placing at least two packaging structures in the cleaning tank of the first cleaning module to perform batch cleaning on the at least two packaging structures;

[0007] Placing the packaging structure cleaned by the batch cleaning process in the cleaning cavity of the second cleaning module to perform single-chip cleaning process; wherein each cleaning cavity of the second cleaning module cleans one packaging structure at a time; the single-chip cleaning process comprises:

[0008] Spray cleaning solution onto the packaging structure;

[0009] Air is evacuated from the cleaning chamber containing the packaging structure to bring the pressure inside the cleaning chamber to a second predetermined pressure, which is a negative pressure.

[0010] The packaged structure is kept still for a predetermined time to allow the cleaning fluid to enter the gaps in the packaged structure and clean it.

[0011] Secondly, this application proposes a cleaning device for an encapsulation structure, comprising:

[0012] The first cleaning module is configured to perform a batch cleaning process on at least two packaging structures.

[0013] The second cleaning module is configured to perform a single-wafer cleaning process on the packaged structures after the batch cleaning process, with each second cleaning module cleaning one packaged structure at a time; wherein the single-wafer cleaning process includes:

[0014] Spray cleaning solution onto the packaging structure;

[0015] Air is evacuated from the cleaning chamber containing the packaging structure so that the pressure inside the cleaning chamber reaches the second predetermined pressure, which is a negative pressure.

[0016] The packaged structure is kept still for a predetermined time to allow the cleaning fluid to enter the gaps in the packaged structure and clean it.

[0017] The control device is configured to control the encapsulated structure to perform cleaning in the first cleaning module and the second cleaning module in sequence.

[0018] The cleaning method and apparatus for the packaging structure disclosed in this application pre-clean multiple packaging structures by first performing a batch cleaning process on at least two packaging structures; then, a single-structure cleaning process is performed on each individual packaging structure. This secondary cleaning of individual packaging structures achieves a fine cleaning effect. Batch cleaning of the packaging structures allows for the initial removal of residual flux and softening of stubborn contaminants. During the individual packaging structure cleaning process, residual contaminants are quickly removed, significantly reducing cleaning time while maintaining cleanliness and thus improving overall cleaning efficiency.

[0019] Other features and advantages of this application will be set forth in the following description and will be apparent in part from the description or may be learned by practicing the application. The objectives and other advantages of this application may be realized and obtained by means of the structures pointed out in the description and the accompanying drawings.

[0020] Overview of the attached figures

[0021] The features and performance of this application are further described by the following embodiments and accompanying drawings.

[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 shows a schematic diagram of an exemplary packaging structure;

[0024] Figure 2 shows a flowchart of the cleaning method for the encapsulation structure in Embodiment 1 of this application;

[0025] Figure 3 shows a layout diagram of the cleaning device for the encapsulation structure in an embodiment of this application;

[0026] Figure 4 shows a schematic diagram of the structure of the first cleaning module in an embodiment of this application;

[0027] Figure 5 shows a schematic diagram of the structure of the second cleaning module in an embodiment of this application; and

[0028] Figure 6 shows a flowchart of the cleaning method for the encapsulation structure in Embodiment 2 of this application.

[0029] Preferred embodiments of this application

[0030] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0031] Flux is used during the packaging process to improve the reliability of the soldering between the chip and the carrier. Taking a flip chip as an example, please refer to Figure 1, which shows an exemplary packaging structure 10. The packaging structure 10 includes a carrier 11 and at least one chiplet 12, which is flip-chip bonded to the carrier 11 via bumps 13. As described in the background art, when the chiplet 12 is flip-chip bonded to the carrier 11, some flux and other contaminants may remain in the gaps between the chiplet 12 and the carrier 11, as well as in the gaps between the bumps 13. To avoid the contaminants in the gaps affecting subsequent packaging processes, the residual contaminants need to be cleaned.

[0032] This application aims to provide a cleaning method and apparatus for packaging structures to efficiently remove residual flux from the gaps in the packaging structure. Specifically, it includes:

[0033] Batch cleaning process: Place at least two packaging structures in the cleaning tank of the first cleaning module and perform batch cleaning on at least two packaging structures;

[0034] The packaged structures, after being cleaned in the batch cleaning process, are placed in the cleaning chamber of the second cleaning module to perform a single-wafer cleaning process; wherein, each cleaning chamber of the second cleaning module cleans one packaged structure at a time; the single-wafer cleaning process includes:

[0035] Spray cleaning solution onto the packaging structure;

[0036] Air is evacuated from the cleaning chamber containing the packaging structure so that the pressure inside the cleaning chamber reaches a second predetermined pressure, which is a negative pressure.

[0037] The packaged structure is kept still for a predetermined time to allow the cleaning fluid to enter the gaps in the packaged structure and clean it.

[0038] Example 1

[0039] Please refer to Figure 2, which shows a flowchart of the cleaning method for the packaging structure in Embodiment 1 of this application.

[0040] As shown in Figure 2, the cleaning method for the packaging structure includes:

[0041] Step S100: Place at least two packaging structures to be cleaned into the cleaning tank of the first cleaning module.

[0042] Step S200: Set the pressure inside the cleaning tank to the first predetermined pressure.

[0043] During the process, the first predetermined pressure can be either negative or atmospheric pressure. In this embodiment, the first predetermined pressure is selected as negative, meaning the pressure is lower than atmospheric pressure. For example, the range of the first predetermined pressure is 0 torr to 730 torr. Preferably, the range of the first predetermined pressure is 5 torr to 400 torr. Specifically, this application achieves negative pressure control within the cleaning tank by evacuating the tank. The main purpose of evacuating the cleaning tank to control the pressure within it is to remove air from the packaging structure while maintaining a negative pressure within the cleaning tank. This prevents air bubbles from forming inside the packaging structure during the cleaning process, which would leave residual air bubbles in certain parts of the packaging structure, especially in the gaps. The cleaning fluid would then be unable to reach the locations occupied by these air bubbles, resulting in incomplete cleaning of the packaging structure. To ensure cleaning effectiveness, at least two encapsulated structures to be cleaned are held within the cleaning tank of the first cleaning module by a first encapsulated structure holding device. Then, a first pressure regulating device adjusts the pressure within the cleaning tank to a first predetermined pressure, placing the encapsulated structures to be cleaned under this predetermined pressure environment. In this embodiment, the first predetermined pressure is 5 torr to 400 torr. For example, the first pressure regulating device in this embodiment may be, but is not limited to, a vacuum pump or other device capable of removing gas from the encapsulated structures and the cleaning tank.

[0044] Step S300: Under a first predetermined pressure condition, cleaning fluid is injected into the cleaning tank to perform batch cleaning on at least two packaging structures.

[0045] Under a first predetermined pressure condition, cleaning fluid is injected into a cleaning tank to submerge the packaging structure. Then, the cleaning fluid within the tank is circulated internally to perform batch cleaning of at least two packaging structures. Specifically, this includes: injecting cleaning fluid into the cleaning tank using a first fluid supply device until the packaging structure is submerged; then activating the internal circulation device to allow the cleaning fluid to flow, ensuring that at least two packaging structures to be cleaned are uniformly cleaned. It should be understood that in this embodiment, the cleaning method for at least two packaging structures can be either the immersion cleaning method described above or the rinsing cleaning method. Any method that can uniformly clean the packaging structure can be used in this application. This document does not limit the cleaning method for multiple packaging structures.

[0046] After batch cleaning at least two package structures to be cleaned, to further ensure the cleaning quality of the package structures, a single package structure cleaning process is implemented on the package structures that have completed batch cleaning. The single package structure cleaning process includes steps S400, S500, S600, and S700. Details are as follows:

[0047] Step S400: Place the batch-cleaned packaged structures into the cleaning chamber of the second cleaning module to perform a single-wafer cleaning process. One packaged structure is placed in the cleaning chamber of each second cleaning module at a time.

[0048] Step S500: Spray cleaning fluid onto the packaging structure.

[0049] During the spraying of cleaning fluid onto the encapsulation structure, the encapsulation structure can be kept stationary or rotated at a predetermined speed. It should be understood that the predetermined speed in this document can be a low speed, for example, less than or equal to 600 rpm. Choosing to keep the encapsulation structure stationary or rotating at a low speed effectively prevents the cleaning fluid from being directly thrown out of the encapsulation structure due to the greater centrifugal force at high speeds, effectively avoiding the situation where the cleaning fluid is thrown out of the encapsulation structure before effectively entering the gaps to be cleaned. It is worth noting that when the encapsulation structure remains stationary, the outlet of the fluid supply device can move relative to the encapsulation structure, or the outlet can be large enough to cover the encapsulation structure.

[0050] Step S600: Evacuate the cleaning chamber containing the packaging structure to make the pressure inside the cleaning chamber reach the second predetermined pressure, which is a negative pressure.

[0051] Step S700: Keep the package structure still for a predetermined time to allow the cleaning fluid to enter the gaps in the package structure and clean it.

[0052] Specifically, after the cleaning fluid is sprayed onto the packaging structure, the cleaning chamber of the second cleaning module is evacuated using the second pressure regulating device to bring the pressure inside the cleaning chamber to a second predetermined pressure. The second predetermined pressure is a negative pressure. For example, in this embodiment, the second predetermined pressure is 5 torr to 400 torr. After the pressure inside the cleaning chamber is evacuated to the second predetermined pressure, the second packaging structure holding device keeps the packaging structure in a static state for a predetermined time. In this embodiment, the predetermined time is less than or equal to 600 seconds.

[0053] This application involves first spraying cleaning fluid onto the package structure during the cleaning process of a single package structure, followed by evacuation. This process removes residual gas from the package structure, ensuring that every crevice is filled with cleaning fluid and thus guaranteeing effective cleaning. Simultaneously, after spraying the cleaning fluid, the cleaning environment is set to negative pressure. This reduces the surface tension of the cleaning fluid, improves its diffusion capacity, and allows it to penetrate more easily into the crevice of the package structure, spreading evenly between bumps and between the chip and the carrier. This further prevents residual gas in the crevice of the package structure from affecting the cleaning effect. Furthermore, after evacuation, the pressure inside the cleaning chamber reaches a second predetermined pressure. Maintaining the package structure in a negative pressure environment for a predetermined time allows sufficient time for air bubbles to escape from the crevice and for the cleaning fluid to penetrate, resulting in a better cleaning effect.

[0054] It should be understood that in this embodiment, the cleaning method for a single package structure can be either immersion cleaning or rinsing cleaning. Any method that can uniformly clean the package structure can be used in this application. This document does not limit the cleaning method for a single package structure.

[0055] Furthermore, after the second cleaning module finishes cleaning the packaging structure, step S900 is included: atmospheric pressure cleaning process.

[0056] The atmospheric pressure cleaning process includes:

[0057] The pressure in the chamber containing the packaging structure is adjusted to atmospheric pressure; the packaging structure is rotated; deionized water is sprayed onto the rotating packaging structure to perform atmospheric pressure cleaning. It should be understood that the atmospheric pressure cleaning process can be performed in the cleaning chamber of the second cleaning module, or a separate atmospheric pressure cleaning chamber can be set up. When performing the atmospheric pressure cleaning process, the packaging structure is moved from the cleaning chamber of the second cleaning module to the cleaning chamber of the atmospheric pressure cleaning chamber for cleaning.

[0058] Furthermore, after the second cleaning module finishes cleaning the packaged structure, the packaged structure needs to enter the next process flow. In order to prevent excessive cleaning liquid remaining on the surface of the packaged structure from splashing into the interior of the cleaning device and contaminating the internal environment of the cleaning device, a drying process is also included between steps S700 and S900.

[0059] In one embodiment, the drying process includes: introducing gas into the cleaning chamber of the second cleaning module to break the vacuum environment within the cleaning chamber, bringing the gas pressure inside the cleaning chamber to atmospheric pressure; rotating the packaging structure under atmospheric pressure; and controlling the rotation speed of the packaging structure to utilize the centrifugal force generated by the rotation to eject the cleaning liquid from the packaging structure, thereby achieving the drying purpose. In this embodiment, the rotation speed of the packaging structure is generally selected to be relatively high. For example, the rotation speed range of the packaging structure in the drying process is 600-1000 rpm, and preferably, for example, 800-1000 rpm.

[0060] In another embodiment, the drying process includes: introducing gas into the cleaning chamber of the second cleaning module to break the vacuum environment within the cleaning chamber, bringing the gas pressure inside the cleaning chamber to atmospheric pressure; under atmospheric pressure, blowing the drying gas onto the packaging structure to blow the cleaning liquid on the surface of the packaging structure outside the packaging structure, and then collecting and discharging it. In this embodiment, the drying gas is nitrogen or an inert gas. It should be understood that in this embodiment, the packaging structure can remain stationary or rotate.

[0061] In another embodiment, the drying process includes: introducing gas into the cleaning chamber of the second cleaning module to break the vacuum environment within the cleaning chamber and bring the gas pressure inside the cleaning chamber to atmospheric pressure; rotating the packaging structure under atmospheric pressure; controlling the rotation speed of the packaging structure to use the centrifugal force generated by the rotation to fling the cleaning liquid off the packaging structure; and simultaneously blowing drying gas onto the packaging structure to blow the cleaning liquid on the surface of the packaging structure to the outside of the packaging structure, thereby achieving rapid drying. The drying process removes the cleaning liquid from the surface of the packaging structure, facilitating its entry into the next process while preventing the cleaning liquid from contaminating the process environment of the next process, thus improving process safety and stability.

[0062] It should be understood that, in order to further ensure the cleaning effect, steps S500 to S800 can be repeated during the actual cleaning process to achieve the purpose of cleaning the packaged structure multiple times and ensure the cleaning effect. The number of repetitions can be selected according to the process requirements.

[0063] It is worth noting that this application does not specifically limit the order of steps S500 and S600. In actual process, after completing step S400, step S500 can be performed first, followed by step S600; alternatively, step S600 can be performed first, followed by step S500. During the cleaning of the package structure, at least two package structures are first batch-cleaned to achieve pre-cleaning, and then a single package structure is cleaned a second time to achieve fine cleaning. Batch cleaning of multiple package structures allows for the initial removal of residual flux inside the package structure and softening of stubborn contaminants. During the cleaning process of a single package structure, residual contaminants can be quickly removed, significantly reducing cleaning time while ensuring cleanliness and thus improving overall cleaning efficiency.

[0064] This application also proposes a cleaning apparatus for a packaged structure, which can perform the cleaning method described above. Please refer to Figure 3, which shows a schematic diagram of the cleaning apparatus for the packaged structure in an embodiment of this application. As shown in Figure 3, the cleaning apparatus 100 includes a front-end module 110, a transmission module 120, a first cleaning module 130, at least one second cleaning module 140, and a control device 150.

[0065] The first cleaning module 130 and the second cleaning module 140 are disposed on the rear side of the front-end module 110 and on both sides of the transmission module 120, wherein the first cleaning module 130 is disposed closer to the front-end module 110. The front-end module 110 is configured with a loading port 111 for loading the packaged structure 10 to be cleaned and unloading the packaged structure 10 after cleaning. The transmission module 120 is configured with a robotic arm 121 for conveying the packaged structure 10. The first cleaning module 130 is configured to perform batch cleaning of at least two packaged structures 10 under a first predetermined pressure condition. Each second cleaning module 140 is configured to clean a single packaged structure under a second predetermined pressure condition. It should be understood that the first predetermined pressure in this application can be atmospheric pressure or negative pressure; in this embodiment, the first predetermined pressure is negative pressure; the second predetermined pressure in this application is negative pressure. The control device 150 may be a computer, a processor with execution instructions, or a memory that stores instructions. The control device 150 is configured to control the transmission module 120 to transmit the package structure 10 and to make the package structure 10 be cleaned in the first cleaning module 130 and the second cleaning module 140 in sequence.

[0066] Specifically, as shown in Figure 4, the first cleaning module 130 includes: a cleaning tank 131, a sealing device 132, a first encapsulation structure holding device 133, a first fluid supply device 134, and a first pressure regulating device 135.

[0067] The cleaning tank 131 has an inlet 1311 and a drain 1312. The inlet 1311 is used to introduce cleaning fluid into the cleaning tank 131, and the drain 1312 is used to discharge waste fluid after the cleaning process is completed. A sealing device 132 is provided at the opening of the cleaning tank 131. The sealing device 132 is matched with the cleaning tank 131. When the sealing device 132 and the cleaning tank 131 are assembled, a sealed space 1310 is formed inside the cleaning tank 131. For example, in this embodiment, the sealing device 132 is a sealing cover provided on the top of the cleaning tank 131. The sealing cover matches the opening of the cleaning tank 131. When the sealing cover is closed on the opening of the cleaning tank 131, the cleaning tank 131 and the sealing cover form a sealed space 1310. As shown in Figure 4, one side of the sealing cover is hinged to the top of the cleaning tank 131, and the side away from the hinge can be fixed to the opening of the cleaning tank 131 by bolts or clamps. The specific fixing method is not limited here. Once the sealing cap is assembled with the cleaning tank 131, it ensures that there will be no air or liquid leakage under negative pressure conditions.

[0068] The first fluid supply device 134 is configured to supply cleaning fluid to the cleaning tank 131. Specifically, as shown in Figure 4, the first fluid supply device 134 includes a cleaning fluid supply source 1341 (such as a cleaning fluid storage tank) and a supply pipeline 1342. The cleaning fluid supply source 1341 is located near the cleaning tank 131 and is connected to the sealed space 1310 inside the cleaning tank 131 via the supply pipeline 1342 to supply cleaning fluid to the sealed space 1310 of the cleaning tank 131. The supply pipeline 1342 is also equipped with a flow meter 1343 and a pressure gauge 1344 for monitoring and regulating the supply of cleaning fluid.

[0069] A first package structure holding device 133 is disposed within the cleaning tank 131 and configured to hold the package structure 10 to be cleaned. The first package structure holding device 133 typically consists of a bracket and a clamp for stably fixing the package structure 10 to be cleaned.

[0070] The first pressure regulating device 135 is configured to regulate the pressure within the sealed space 1310 formed after the cleaning tank 131 and the sealing device 132 are assembled to a first predetermined pressure. Exemplarily, the first pressure regulating device 135 includes a vacuum pump 1351. The vacuum pump 1351 is connected to the sealed space 1310 via a pipeline. A pressure gauge 1352 and a regulating valve 1353 are installed on the pipeline. The control device 150 precisely controls the pressure within the sealed space 1310 to reach the first predetermined pressure by controlling the opening degree of the regulating valve 1353 and the operating state of the vacuum pump 1351 based on feedback from the pressure gauge 1352. In this embodiment, the first predetermined pressure is 5 torr to 400 torr.

[0071] Furthermore, the first cleaning module 130 also includes a circulation device 136. The circulation device 136 is configured to circulate the cleaning fluid inside the cleaning tank 131. The circulation device 136 includes a circulation pump 1361, which is installed on the circulation pipeline 1362. To save costs while ensuring the cleaning effect of the cleaning fluid on the packaging structure 10, the cleaning fluid in the cleaning tank 131 needs to flow to flush the packaging structure 10, so that the cleaning fluid can carry away contaminants in the gaps of the packaging structure 10, thereby achieving the purpose of cleaning the packaging structure 10. Specifically, when the first fluid supply device 134 supplies cleaning fluid to the cleaning tank 131, causing the cleaning fluid to submerge the packaging structure 10, the first fluid supply device 134 stops supplying cleaning fluid, and then the circulation pump 1361 of the circulation device 136 starts working, causing the cleaning fluid in the cleaning tank 131 to be drawn out of the cleaning tank 131 and flow back into the cleaning tank 131 through the circulation pipeline 1362 to achieve internal circulation. The cleaning fluid can be reused multiple times through the circulation device 136, saving process costs.

[0072] As shown in Figure 5, the second cleaning module 140 includes components such as a cleaning chamber 141, a second packaging structure holding device 142, a second fluid supply device 143, and a second pressure regulating device 144.

[0073] The cleaning chamber 141 can provide a sealed space 1410 to accommodate the packaging structure 10.

[0074] The second encapsulation structure holding device 142 is placed in the cleaning chamber 141 to hold the encapsulation structure 10.

[0075] The second fluid supply device 143 is used to spray cleaning fluid onto the surface of the packaging structure 10. In one example, the second fluid supply device 143 includes a second supply source 1431, a second supply line 1432, and a nozzle 1433. The second supply source 1431 is used to store the cleaning fluid. The nozzle 1433 is disposed in the sealed space 1410 of the cleaning chamber 141 and is connected to the second supply source 1431 via the second supply line 1432 for spraying cleaning fluid onto the packaging structure 10.

[0076] The second pressure regulating device 144 is used to regulate the pressure of the cleaning chamber 141. In one example, the second pressure regulating device 144 includes a vacuum pump 1441 and a vacuum breaking valve 1442. The vacuum pump 1441 is installed on a pressure reducing line L1 connected to the cleaning chamber 141. The vacuum pump 1441 is configured to evacuate the cleaning chamber 141, causing the pressure inside the cleaning chamber 141 to reach a second predetermined pressure. During the cleaning process, the second predetermined pressure is set between 5 torr and 400 torr. The vacuum breaking valve 1442 is installed on a vacuum breaking line L2 connected to the cleaning chamber 141. The vacuum breaking valve 1442 is configured to open or close the gas flowing through the vacuum breaking line L2. After the cleaning process in the cleaning chamber 141 is completed, the control device can open the vacuum breaking valve 1442 to allow air to enter the cleaning chamber 141, breaking the vacuum in the cleaning chamber 141 and restoring the cleaning chamber 141 to normal pressure, facilitating operations such as removing the packaged structure from the cleaning chamber 141.

[0077] In this example, the control device 150 controls the second pressure regulating device 144 to regulate and maintain the pressure of the cleaning chamber 141 at a second predetermined pressure.

[0078] During the cleaning process of the encapsulation structure, one or more cleaning solutions can be selected. When there are more than one type of target object requiring different cleaning solutions, to avoid cross-contamination between different cleaning solutions, one cleaning unit is set up for each cleaning solution. The number of cleaning units is determined according to the type of cleaning solution in the actual process, and this application does not specifically limit the number of cleaning units. It should be understood that a cleaning unit in this application includes a first cleaning module 130 and at least one second cleaning module 140. The cleaning process performed by each cleaning unit is the same, and the specific cleaning process is as described in the cleaning method above, which will not be repeated here. For example, when two cleaning solutions are selected, namely a liquid containing a saponifying agent and a volatile organic solvent, the cleaning device for the encapsulation structure can be set up with two cleaning units, a first cleaning unit and a second cleaning unit. The first cleaning unit includes a first cleaning module 130 and at least one second cleaning module 140; the second cleaning unit includes a first cleaning module 130 and at least one second cleaning module 140. The first cleaning unit selects a liquid containing a saponifying agent as the cleaning solution. After the first cleaning unit completes steps S100 to S800 of the cleaning method, the second cleaning unit selects a volatile organic solvent as the cleaning solution and performs steps S100 to S900 of the cleaning method to clean the packaging structure. The second cleaning unit, while cleaning contaminants, can completely remove the cleaning solution from the first cleaning unit, preventing the introduction of new contaminants into the packaging structure. It is worth noting that when multiple cleaning solutions are selected, it is preferable to use a cleaning solution containing a volatile organic solvent as the cleaning solution for the last cleaning unit, so that the cleaning solution can automatically evaporate after the packaging structure is cleaned, thereby ensuring the dryness of the packaging structure.

[0079] The cleaning method and apparatus for the packaging structure disclosed in this application pre-clean by first performing batch cleaning on multiple packaging structures; then, individual packaging structures are cleaned one by one, achieving a fine cleaning effect through secondary cleaning of each individual packaging structure. After batch cleaning of multiple packaging structures, residual flux inside the packaging structures can be initially removed, and stubborn contaminants can be softened. During the cleaning process of individual packaging structures, residual contaminants can be quickly removed. This application can significantly reduce cleaning time while ensuring the cleanliness of the cleaning process, thereby improving overall cleaning efficiency.

[0080] Example 2

[0081] This embodiment provides a cleaning device for a packaging structure that is the same as in Embodiment 1, and the cleaning method for the packaging structure in this embodiment is basically the same as in Embodiment 1. The difference is that, please refer to Figure 6, which shows a flowchart of the cleaning method for the packaging structure in Embodiment 2 of this application. The cleaning method in this embodiment further includes step S2000. Step S2000 is set before step S2800 (drying process). Steps S2100, S2200, S2300, S2400, S2500, S2600, S2700, S2800, and S2900 in this embodiment correspond to steps S100, S200, S300, S400, S500, S600, S700, S800, and S900 in Embodiment 1, respectively, and will not be described in detail here.

[0082] Step S2000 in this embodiment includes:

[0083] Spray the cleaning fluid onto the packaging structure again, and during the spraying process, change the pressure inside the cleaning chamber at least once.

[0084] After the pressure stops changing, keep the packaged structure still for a predetermined time.

[0085] Specifically, after steps S2100, S2200, S2300, S2400, S2500, and S2600 are completed, i.e., after the control device controls the second pressure regulating device 144 to adjust the environment inside the cleaning chamber 141 to the second predetermined pressure and keeps the packaging structure 10 in a static state for a predetermined time, the control device 150 controls the second fluid supply device 143 to spray cleaning fluid onto the packaging structure 10 again. During the spraying of cleaning fluid, the control device 150 controls the vacuum pump 1441 or the vacuum breaking valve 1442 of the second pressure regulating device 144 to change the pressure inside the cleaning chamber 141 by reducing or increasing the pressure, so as to create a pressure difference between the pressure inside the cleaning chamber 141 after the change and before the change. The pressure inside the cleaning chamber 141 is in a negative pressure state both after and before the change. During the formation of a pressure difference, a pulling or pushing force is generated, changing the force on the cleaning fluid and thus its position. This allows the cleaning fluid to more easily enter the gaps in the packaging structure, dissolving contaminants and facilitating complete cleaning, thereby improving the cleaning effect. It is worth noting that the pressure within the cleaning chamber 141 is changed at least once. The specific number of changes can be selected based on actual process requirements, and this application does not impose a specific limitation. It should be understood that to improve cleaning efficiency, the number of pressure changes can be as many as possible. This allows the constantly changing environmental pressure within the cleaning chamber 141 to accelerate the rate at which the cleaning fluid enters the gaps in the packaging structure 10. After the cleaning fluid has completely dissolved the contaminants, it is then rapidly discharged from the packaging structure 10.

[0086] Each time the pressure inside the cleaning chamber 141 is changed and a pressure difference is formed, the encapsulation structure 10 is kept still for a predetermined time, so that the cleaning fluid has enough time to enter the gaps of the encapsulation structure 10 and clean the contaminants remaining in the gaps of the encapsulation structure 10, thereby further improving the cleaning quality.

[0087] To further ensure the cleaning effect, in the actual cleaning process, steps S2500 to S2800 can be repeated to achieve the purpose of cleaning the package structure multiple times and ensure the cleaning effect.

[0088] Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A cleaning method of a package structure, characterized by, The method comprises: a batch cleaning process, in which at least two packaging structures are placed in a cleaning tank of a first cleaning module to perform batch cleaning on the at least two packaging structures; a single-piece cleaning process, in which the packaging structures cleaned in the batch cleaning process are placed in a cleaning cavity of a second cleaning module to perform the single-piece cleaning process, and each of the cleaning cavities of the second cleaning module cleans one of the packaging structures at a time; the single-piece cleaning process comprises: spraying cleaning liquid on the packaging structures; evacuating the cleaning cavities in which the packaging structures are located to make the pressure in the cleaning cavities reach a second predetermined pressure, which is negative pressure; keeping the packaging structures still for a predetermined time to make the cleaning liquid enter the gaps of the packaging structures to clean the packaging structures.

2. The cleaning method of a package structure according to claim 1, wherein, Further comprising: making the pressure in the cleaning tank reach a first predetermined pressure, which is negative pressure.

3. The method according to claim 2, wherein the first predetermined pressure is 0 torr to 730 torr.

4. The method according to claim 2, wherein the first predetermined pressure is 5 torr to 400 torr.

5. The method according to claim 1, wherein the second predetermined pressure is 5 torr to 400 torr.

6. The cleaning method of a package structure according to claim 1, wherein The single-piece cleaning process further comprises: spraying cleaning liquid on the packaging structures again, and the pressure in the cleaning cavities changes at least once during the spraying of the cleaning liquid; keeping the packaging structures still for a predetermined time after the pressure stops changing.

7. The cleaning method for the packaging structure according to claim 1, characterized in that, Further comprising a drying process; the drying process comprises: inputting gas into the cleaning cavities of the second cleaning module to make the pressure in the cleaning cavities reach normal pressure, and in the state of normal pressure, rotating the packaging structures; and / or blowing dry gas on the packaging structures.

8. The method according to claim 7, wherein the method further comprises a normal-pressure cleaning process after the drying process; the normal-pressure cleaning process comprises: adjusting the pressure in the cavities in which the packaging structures are located to reach normal pressure; rotating the packaging structures; spraying deionized water on the rotating packaging structures to clean the packaging structures under normal pressure.

9. A cleaning apparatus for a package structure, characterized by The apparatus comprises: a first cleaning module configured to perform a batch cleaning process on at least two packaging structures; a second cleaning module configured to perform a single-piece cleaning process on the packaging structures cleaned in the batch cleaning process, and each of the second cleaning modules cleans one of the packaging structures at a time; the single-piece cleaning process comprises: spraying cleaning liquid on the packaging structures; evacuating the cleaning cavities in which the packaging structures are located to make the pressure in the cleaning cavities reach a second predetermined pressure, which is negative pressure; keeping the packaging structures still for a predetermined time to make the cleaning liquid enter the gaps of the packaging structures to clean the packaging structures; a control device configured to control the packaging structures to be cleaned in the first cleaning module and the second cleaning module in turn.

10. The apparatus according to claim 9, wherein the first cleaning module comprises: a cleaning tank with a liquid inlet and a liquid outlet, A sealing device is arranged at a slot of the cleaning tank and matches the cleaning tank to form a closed space in the cleaning tank; A first package structure holding device is arranged in the cleaning tank and is configured to hold the package structure to be cleaned; A first fluid supply device is configured to supply cleaning liquid to the cleaning tank.

11. The package structure cleaning device according to claim 10, wherein The first cleaning module further comprises: A circulating device configured to circulate the cleaning liquid in the cleaning tank.

12. The package structure cleaning device according to claim 11, wherein The first cleaning module further comprises: A first pressure adjusting device configured to adjust the pressure in the cleaning tank to a first predetermined pressure, and the first predetermined pressure is negative pressure.

13. The package structure cleaning device according to claim 12, wherein The first predetermined pressure is 0 torr to 730 torr.

14. The package structure cleaning device according to claim 12, wherein The first predetermined pressure is 5 torr to 400 torr.

15. The package structure cleaning device according to claim 12, wherein The control device is further configured to: Control the sealing device to assemble with the cleaning tank loaded with at least two package structures to form a closed space in the cleaning tank, Control the first pressure adjusting device to adjust the pressure in the cleaning tank to a first predetermined pressure, Control the first fluid control device to supply cleaning liquid to the cleaning tank to clean the package structure under the first predetermined pressure.

16. The package structure cleaning device according to claim 10, wherein The second cleaning module comprises: A cleaning cavity; A second package structure holding device configured to hold the package structure to be cleaned; A second fluid supply device configured to spray cleaning liquid to the package structure; A second pressure adjusting device configured to adjust the pressure in the cleaning cavity where the package structure is located to a second predetermined pressure.

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