Electronic device

Abstract

Provided in an exemplary embodiment of the present application is an electronic device. The electronic device comprises: a first circuit board; a first electronic component fixedly arranged on the first circuit board, the orthogonal projection of the first electronic component on an extension plane of the first circuit board partially overlapping the first circuit board; and a reinforcing member connected to the first circuit board and the first electronic component.

Description

electronic devices

[0001] Cross-references to related applications

[0002] This application claims priority to Chinese Patent Application No. 202410695792.2, filed on May 30, 2024, entitled "An Electronic Device", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of communication technology, and in particular to an electronic device. Background Technology

[0004] Circuit boards have two main functions: supporting and interconnecting electronic components. Signal transmission between chips and connectors in communication equipment requires circuit boards. Interconnection is achieved through internal wiring on the circuit board, which also secures chips, connectors, and other electronic components. With the development of the optical communication industry, the requirements for equipment transmission speeds are increasing. Some high-speed optical communication equipment typically uses high-speed substrates to fabricate circuit boards. Summary of the Invention

[0005] An exemplary embodiment of this application provides an electronic device, comprising: a first circuit board; a first electronic device fixedly disposed on the first circuit board, wherein the orthogonal projection of the first electronic device on an extension plane of the first circuit board partially overlaps with the first circuit board; and a reinforcing member connected to the first circuit board and the first electronic device.

[0006] In the above embodiments, the electronic device can be an optical cage. The electronic device partially overlaps with the first circuit board, resulting in a smaller area occupied by the electronic device on the first circuit board. This allows the same area of ​​the first circuit board to accommodate more components during the fabrication of the electronic device, increasing the utilization rate of the first circuit board area. Furthermore, because the electronic device partially overlaps with the first circuit board, in addition to the overlapping area, another portion of the electronic device extends beyond the exterior of the first circuit board. To reduce the risk of the electronic device detaching, reinforcing components are also provided to strengthen the connection between the electronic device and the first circuit board, improving the reliability of the electronic device.

[0007] In one embodiment, the reinforcing member includes a fixing plate connected to the first circuit board along a first direction.

[0008] In one embodiment, the reinforcing member further includes a first connector, the two ends of which are respectively connected to the first circuit board and the fixing plate.

[0009] In one embodiment, the reinforcing member further includes a second connector, the two ends of which are respectively connected to the first circuit board and the fixing plate, and the second connector and the first connector are arranged at intervals along a second direction, wherein the second direction is perpendicular to the first direction.

[0010] In one embodiment, the fixing plate and the first circuit board have a gap in the first direction.

[0011] In one embodiment, the first electronic device further includes a plurality of fasteners located on the side of the first electronic device facing the first circuit board, in the overlapping area of ​​the orthogonal projection of the first electronic device on the extended plane of the first circuit board and the fastener plate, and the plurality of fasteners are connected to the fastener plate.

[0012] In one embodiment, the first electronic device includes: a body; and a plurality of first pins located on the side of the body facing the first circuit board and in the overlapping area of ​​the orthogonal projection of the first electronic device on the extended plane of the first circuit board and the first circuit board, wherein the plurality of first pins are connected to the first circuit board.

[0013] In one embodiment, each of the plurality of first pins includes a first base and a first insertion portion disposed on the first base, the first base being connected to the body, and the first insertion portion being inserted into a first mounting hole disposed on the circuit board; and each of the fixing members includes a second base and a second insertion portion disposed on the second base, the second base being connected to the body, and the second insertion portion being inserted into a second mounting hole disposed on the fixing plate.

[0014] In one embodiment, the first base has a first surface facing the first circuit board, and the shortest distance between the first surface and the first circuit board is less than 0.1 mm.

[0015] In one embodiment, the fixing plate is located at the center of the first circuit board along the thickness direction of the first circuit board, and the second base has a second surface facing the fixing plate, the shortest distance between the second surface and the fixing plate being less than 0.8 mm.

[0016] In one embodiment, the fastener includes at least one of a pin, a guide pin, or a mounting post.

[0017] In one embodiment, the fixing plate is made of glass fiber reinforced epoxy resin sheet.

[0018] In one embodiment, the thickness of the fixing plate is less than the thickness of the first circuit board.

[0019] In one embodiment, the thickness of the fixing plate ranges from 5.3 mm to 5.9 mm, and / or the thickness of the first circuit board ranges from 5.7 mm to 6.7 mm.

[0020] In one embodiment, the fixing plate includes a first copper foil layer, a first core board layer, a second copper foil layer, a first dielectric layer, a third copper foil layer, a second core board layer, and a fourth copper foil layer stacked sequentially.

[0021] In one embodiment, the first dielectric layer comprises a prepreg.

[0022] In one embodiment, the fixing plate includes a plurality of mounting strips, which are spaced apart in a second direction and connected to the edge of the first circuit board.

[0023] In one embodiment, the plurality of mounting strips are integrally formed with the first circuit board.

[0024] In one embodiment, the reinforcing member includes a reinforcing frame, with both ends of the reinforcing frame connected to the first circuit board, and the reinforcing frame surrounding the outer periphery of the first electronic device.

[0025] In one embodiment, the electronic device further includes a second electronic device, wherein the first electronic device is disposed on one side of the first circuit board, and the second electronic device is disposed on the opposite side of the first circuit board. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 is a schematic diagram of the structure of an electronic device in one embodiment of this application;

[0028] Figure 2 is an assembly diagram of the electronic device and the first circuit board in one embodiment of this application;

[0029] Figure 3 is a side sectional view of an electronic device in one embodiment of this application;

[0030] Figure 4 is a structural diagram of the light cage in one embodiment of this application;

[0031] Figure 5 is a schematic diagram of the structural stacking of the fixing plate in one embodiment of this application;

[0032] Figure 6 is a structural diagram of the circuit board of the related technology;

[0033] Figure 7 is a side view of an electronic device in one embodiment of this application;

[0034] Figure 8 is a schematic diagram of the structure of the first circuit board and the mounting strip in one embodiment of this application;

[0035] Figure 9 is a structural diagram of the first sub-circuit board and the second sub-circuit board in one embodiment of this application;

[0036] Figure 10 is a schematic diagram of the structure of an electronic device in another embodiment of this application;

[0037] Figure 11 is a schematic diagram of the structure of an electronic device in another embodiment of this application.

[0038] Reference numerals: 1-First circuit board; 111-First edge; 112-First mounting hole; 113-Second mounting hole; 100-Electronic component; 30-Reinforcing member; 10-Body; 101-First pin; 102-Fixing member; 2-Fixing plate; 3-Connector; 11-First copper foil layer; 12-First core board layer; 13-Second copper foil layer; 14-Dielectric layer; 15-Third copper foil layer; 16-Second core board layer; 17-Fourth copper foil layer; 18-First dielectric Layer; 19-Core board layer; 20-Second dielectric layer; 1011-First base; 1012-First insertion part; 1021-Second base; 1022-Second insertion part; 5-Mounting strip; 01-First sub-circuit board; 011-First mounting strip; 02-Second sub-circuit board; 021-Second mounting strip; 4-Reinforcing frame; 1001-First device; 1002-Second device; M-First direction; N-Second direction; O-Third direction. Detailed Implementation

[0039] To address the issue of high manufacturing costs for electronic devices, embodiments of this application provide an electronic device. To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description, in conjunction with the accompanying drawings, provides specific examples.

[0040] In the description of the embodiments of this application, unless otherwise stated, " / " means "or". For example, A / B can mean A or B. The "and / or" in the text is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist simultaneously, and B exists alone. In addition, in the description of the embodiments of this application, "multiple" means two or more.

[0041] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of indicated technical features. Thus, a feature defined with "first" and "second" may explicitly or implicitly include one or more of that feature, and in the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more.

[0042] When using the terms "comprising," "having," and "including" as described in this application, another component may be added unless explicitly qualifying terms such as "only," "consisting of," etc. are used. Unless otherwise stated, singular terms may include plural forms and should not be construed as having only one quantity.

[0043] In this application, directional terms such as "upper," "lower," "left," and "right" are used to describe the relative positional relationships of components, typically based on the normal operating orientation of the equipment or an installation reference frame. For example, "upper" indicates the top or higher part of the equipment, "lower" indicates the bottom or lower part of the equipment, "left" indicates the part of the equipment to the left of the centerline, and "right" indicates the part of the equipment to the right of the centerline. However, during use, the equipment may undergo positional changes such as flipping or rotating. In such cases, the directional terms should be understood as direct spatial positional relationships relative to other components rather than fixed orientations. Those skilled in the art can appropriately interpret these terms according to the usage environment.

[0044] "Connection" usually refers to a physical or functional relationship between two components. It can be a direct contact or an indirect connection achieved through one or more intermediate elements.

[0045] As mentioned earlier, some high-speed optical communication devices typically use high-speed substrates to fabricate circuit boards. The higher cost of high-speed substrates leads to higher production costs for electronic devices.

[0046] Therefore, how to reduce the manufacturing cost of electronic devices while effectively achieving signal connectivity and fixing electronic components has become a problem that needs to be solved.

[0047] Optical communication equipment consists of circuit boards and optical cages. The optical cage is used to connect optical modules. The optical cage is mounted on the circuit board. The circuit board achieves signal communication with the optical communication equipment through its internal wiring, and also serves to support and secure the optical cage. The communications industry demands increasingly faster processing speeds from equipment, such as 112G and 224G network transmission. Circuit boards for such high-end optical communication equipment are typically manufactured using high-cost, high-speed substrates. Mainstream high-speed substrate models include M7GN, M8N, EM892K, TU-943SR, and S9N.

[0048] The cost of a circuit board is directly proportional to its area; therefore, the size of the circuit board significantly impacts the manufacturing cost of optical communication equipment. The optical cage is larger than other components mounted on the circuit board. For example, a 2×4 OSFP optical cage occupies approximately 9.4 × 12.7 cm² ≈ 119 cm² of circuit board area. 2 Nearly 50% of the circuit board area is dedicated to fixing the optical cage, and this area accounts for approximately 10% to 20% of the total circuit board cost. The area on the circuit board where the optical cage is fixed does not require wiring for electrical signal connection with the optical cage, thus resulting in a waste of resources.

[0049] The electronic devices provided in the exemplary embodiments of this application solve the problem of how to reduce the area of ​​the circuit board occupied by the optical cage without affecting the use of the optical cage, thereby improving the utilization rate of the circuit board area and reducing costs.

[0050] This application provides an electronic device that reduces manufacturing costs and improves economic efficiency.

[0051] Figure 1 is a structural schematic diagram of an electronic device in one embodiment of this application, and Figure 2 is an assembly diagram of the electronic device and the first circuit board in another embodiment of this application. As shown in Figures 1 and 2, an electronic device provided by this application includes: a first circuit board 1, electronic components 100, and reinforcing components 30.

[0052] The electronic device 100 is mounted on the first edge 111 of the first circuit board 1, and the electronic device 100 partially overlaps with the first circuit board 1. That is, a portion of the electronic device 100 is located outside the first edge 111 of the first circuit board 1, as shown in Figure 2. The electronic device 100 includes a body 10 and a plurality of first pins 101. The plurality of first pins 101 are mounted on the body 10 and located in the overlapping area between the body 10 and the first circuit board 1. The first pins 101 are connected to the first circuit board 1.

[0053] The reinforcing member 30 is connected to the first circuit board 1 and the electronic device 100. As shown in FIG1, the reinforcing member 30 can be used to securely connect the electronic device 100 to the first circuit board 1.

[0054] In the above embodiments, the electronic device 100 can specifically be an optical cage. The orthogonal projection of the electronic device 100 on the extended plane of the first circuit board 1 (the plane formed by the first direction M and the second direction N) partially overlaps with the first circuit board 1, so that the electronic device 100 occupies a smaller area of ​​the first circuit board 1. In this way, when manufacturing electronic devices, the first circuit board 1 of the same area can accommodate more components, increasing the utilization rate of the area of ​​the first circuit board 1.

[0055] Furthermore, since the orthogonal projection of the electronic device 100 on the extended plane of the first circuit board 1 partially overlaps with the first circuit board 1, that is, in addition to the area overlapping with the first circuit board 1, another part of the orthogonal projection of the electronic device 100 on the extended plane of the first circuit board 1 extends out of the first circuit board 1.

[0056] To reduce the risk of electronic components 100 falling off, the electronic device is also equipped with a reinforcing component 30, which strengthens the connection between the electronic components 100 and the first circuit board 1, thereby improving the reliability of the electronic device.

[0057] Figure 3 is a side sectional view of an electronic device in one embodiment of this application. Referring to Figure 3 in conjunction with Figures 1 and 2, the reinforcing member 30 includes a fixing plate 2 and a connector 3.

[0058] In this embodiment, the first electronic device 100, the connector 3, and the fixing plate 2 are arranged sequentially along the first direction M.

[0059] In this embodiment, a plurality of connectors 3 may be provided, which are arranged at intervals along a second direction N. The second direction N is perpendicular to the first direction M.

[0060] Specifically, along the first direction M, the fixing plate 2 is arranged adjacent to the first circuit board 1. This first direction M is perpendicular to the extension direction of the first edge 111 of the first circuit board 1 (i.e., the second direction N). The two ends of the connector 3 can be connected to the first circuit board 1 and the fixing plate 2 respectively by screws, for example, to fix the first circuit board 1 and the fixing plate 2 together.

[0061] In one embodiment, the fixing plate 2 can also be a PCB circuit board, i.e., a second circuit board.

[0062] Referring again to Figure 3, the electronic device 100 includes a first device 1001 and a second device 1002. The first device 1001 may be disposed on one side of the first circuit board 1, and the second device 1002 may be disposed on the opposite side of the first circuit board 1. That is, the first device 1001 and the second device 1002 are respectively disposed on both sides of the first circuit board 1 along a third direction O, wherein the third direction O is perpendicular to the first direction M and the second direction N, respectively.

[0063] In one embodiment, the electronic device 100 may further include a plurality of fasteners 102 connected to the fixing plate 2 for fixing the electronic device 100 to the fixing plate 2.

[0064] The first circuit board 1 can be made of high-speed board material, and the fixing plate 2 can be made of glass fiber reinforced epoxy resin board material. Compared with the high-speed board material of the first circuit board 1, the cost of glass fiber reinforced epoxy resin board material is lower. Furthermore, using this board material allows for higher precision drilling (mounting hole) during processing, reducing assembly errors of electronic components 100.

[0065] Figure 4 is a structural diagram of the optical cage in one embodiment of this application. As shown in Figure 4, the aforementioned fixing member 102 can specifically be a pin, but this pin only serves a fixing function and does not serve an electrical connection function. Specifically, the bottom of the optical cage shown in Figure 4 has multiple pins, among which the pin connected to the first circuit board 1 is called the first pin 101, and the pin connected to the fixing plate 2 is called the second pin 102, which is the aforementioned fixing member 102. It is worth noting that the first pin 101 and the second pin 102 can be the same or different. The first pin 101 is connected to the first circuit board 1 to realize signal communication between the optical cage and the first circuit board 1, and can also be used to fix the optical cage to the first circuit board 1. The fixing member 102 is connected to the fixing plate 2 to fix the optical cage to the fixing plate 2.

[0066] The aforementioned fastener 102 can also be in other forms, such as a pin, a mounting post, etc.

[0067] In the above embodiments, the combined area of ​​the first circuit board 1 and the fixing plate 2 can be the same as the area of ​​the circuit board used to support the optical cage in related technologies. Compared with the circuit board in related technologies, replacing the circuit board which is only suitable for high-speed transmission with the first circuit board 1 for high-speed transmission and the fixing plate 2 for fixing the electronic device 100 achieves the reduction of the area of ​​the first circuit board 1 and the replacement with the lower-cost fixing plate 2 without reducing the high-speed transmission performance, thereby reducing the manufacturing cost of the electronic device.

[0068] In other embodiments, the fixing plate 2 may also be made of other low-cost materials, and this application does not impose specific limitations.

[0069] Figure 5 is a layered structure diagram of the fixing plate 2 in one embodiment of this application, and Figure 6 is a layered structure diagram of a circuit board in the related art. As shown in Figure 5, the fixing plate 2 is a circuit board, which may include a first copper foil layer 11, a first core board layer 12, a second copper foil layer 13, a dielectric layer 14 (Prepreg, PP), a third copper foil layer 15, a second core board layer 16, and a fourth copper foil layer 17 stacked sequentially. Since the fixing plate 2 does not need to be connected to the electronic device 100 to transmit electrical signals but is only used to achieve the function of support and fixation, the copper foil layer of the fixing plate 2 does not need to be processed and wired. Wiring refers to etching the copper foil layer to obtain the required lines.

[0070] The aforementioned dielectric layer 14 can specifically be a prepreg, which serves as a filler in the circuit board and also as a bonding agent for the core board layers. The laminated structure of this application includes two core board layers and one dielectric layer.

[0071] In contrast, Figure 6 shows a conventional circuit board stack-up structure, comprising a first copper foil layer 11, a first dielectric layer 18, a second copper foil layer 13, a core board layer 19, a third copper foil layer 15, a second dielectric layer 20, and a fourth copper foil layer 17 stacked sequentially. The first dielectric layer 18 and the second dielectric layer 20 are both prepregs. This conventional stack-up structure includes two dielectric layers and one core board layer.

[0072] Because the processing precision of the prepreg thickness is difficult to control, the laminated structure provided in the embodiment of this application shown in Figure 5, compared to the related conclusion in Figure 6, reduces the use of prepreg. This allows for higher processing precision of the fixing plate 2, making it easier to keep its thickness within the tolerance range, for example, 5.6mm ± 0.3mm. When electronic devices 100 need to be installed on both sides of the circuit board, since the first circuit board 1 is thicker than the fixing plate 2, if the tolerance of the fixing plate 2 is large, the fixing member 102 may not be able to contact the fixing plate 2. The laminated structure of this embodiment can reduce the excessively large processing thickness tolerance of the fixing plate 2, avoiding the situation where the fixing member 102 cannot be fixed to the fixing plate 2.

[0073] In one embodiment, the thickness of the first circuit board 1 is greater than the thickness of the fixing plate 2. The thickness of the first circuit board 1 can range from 5.7 mm to 6.7 mm, and the thickness of the fixing plate 2 can range from 5.3 mm to 5.9 mm.

[0074] Figure 7 is a side view of an electronic device according to one embodiment of this application. As shown in Figure 7, certain tolerances exist during the processing of the first circuit board 1 and the fixing plate 2. In one embodiment, the fixing plate 2 and the first circuit board 1 have a gap between them in a first direction M. This gap is used to reduce interference between the first circuit board 1 and the fixing plate 2 during assembly. The size of this gap is c, for example, c can be 0.25 mm.

[0075] In one embodiment, the first pin 101 includes a first insertion portion 1012 and a first base 1011, the first base 1011 being connected to the body 10. The first circuit board 1 has a first mounting hole 112, into which the first insertion portion 1012 is inserted. The fixing member 102 includes a second insertion portion 1022 and a second base 1021, the second base 1021 being connected to the body 10. The fixing plate 2 has a second mounting hole, into which the second insertion portion 1022 is inserted.

[0076] In one embodiment, the first insertion portion 1012 can be interference-fitted with the first mounting hole, and the second insertion portion 1022 can be interference-fitted with the second mounting hole. In this embodiment, the optical cage can be securely connected to the first circuit board 1 and the fixing plate 2 respectively without the need for other fasteners.

[0077] In one embodiment, when assembling the electronic device 100, the first circuit board 1, and the fixing plate 2, the lower surface of the electronic device 100 remains parallel to the extending planes of the first circuit board 1 and the fixing plate 2. The lower surface refers to the surface of the electronic device 100 facing the first circuit board 1 and the fixing plate 2. The first base 1011 has a first surface 1013 on the side facing the first circuit board 1. After the electronic device 100 is mounted on the first circuit board 1, the distance 'a' between the first surface 1013 and the first circuit board 1 is, for example, less than 0.1 mm. Along the thickness direction of the first circuit board 1, the fixing plate 2 is located in the center of the first circuit board 1, and the second base 1021 has a second surface 1023 on the side facing the fixing plate 2. After the electronic device 100 is mounted on the fixing plate 2, the distance 'b' between the second surface 1023 and the fixing plate 2 is, for example, less than 0.8 mm. Using these dimensions, the connection between the electronic device 100 and the first circuit board 1 and the fixing plate 2 can be reliable.

[0078] Figure 8 is a structural schematic diagram of the first circuit board 1 and the mounting strip 5 in one embodiment of this application. As shown in Figure 8, the reinforcing member 30 may further include multiple mounting strips 5. The multiple mounting strips 5 are spaced apart at the edge 111 of the first circuit board 1. The mounting strips 5 are used to connect with the fixing member 102 and provide a certain support for the electronic device 100.

[0079] Figure 9 is a structural diagram of the first sub-circuit board 01 and the second sub-circuit board 02 in one embodiment of this application. As shown in Figure 9, the mounting strip 5 can be integrally formed with the first circuit board 1. In the specific fabrication of the first circuit board 1, the entire circuit board can be cut and divided into two opposing and interlaced sub-circuit boards, which are the first circuit board 1. The two sub-circuit boards are staggered, and the mounting strips 5 intersect each other. For example, the first sub-circuit board 01 includes a first mounting strip 011. The second sub-circuit board 02 includes a second mounting strip 021. When cutting the entire circuit board, the shape of the mounting strip 5 is processed so that the second mounting strip 021 is located between two adjacent first mounting strips 011. Similarly, the first mounting strip 011 is located between two adjacent second mounting strips 021. This allows for the division of the entire circuit board into more sub-circuit boards during circuit board segmentation, reducing waste.

[0080] In one embodiment, a plurality of fasteners 102 are arranged at intervals along a first direction to form a fastener column (or array). Each electronic device 100 includes a plurality of fastener columns, and the mounting strips 5 correspond to the position and number of fastener columns. For example, an optical cage includes five fastener columns, and the number of mounting strips 5 can also be five. Each fastener column is mounted on a mounting strip 5 corresponding to its position.

[0081] In one embodiment, the plurality of first pins 101 may also be arranged at intervals along a first direction, and the first pins 101 and the fixing member 102 may be arranged in a row to form a pin column. Each electronic device 100 includes a plurality of pin columns.

[0082] Figure 10 is a schematic diagram of the structure of an electronic device in another embodiment of this application. As shown in Figure 10, since a portion of the electronic device 100 extends beyond the edge of the first circuit board 1, the fixing member 102 is suspended in the air, and the electronic device 100 is fixed to the first circuit board 1 only through the first pin 101. To ensure reliable connection of the electronic device 100, additionally or alternatively, the reinforcing member 30 may include a reinforcing frame 4. The two ends of the reinforcing frame 4 may be fixed to the first circuit board 1, for example, by screws, and the reinforcing frame 4 is wrapped around the outer periphery of the electronic device 100. This reinforcing frame 4 is equivalent to a clamp, which can strengthen the connection between the electronic device 100 and the first circuit board 1, thereby improving the reliability of the electronic device.

[0083] The aforementioned reinforcing frame 4 can be made of metal and formed by sheet metal processing to fit the outer contour of the electronic device 100.

[0084] Figure 11 is a schematic diagram of the structure of an electronic device in another embodiment of this application. As shown in Figure 11, the electronic device 100 includes a first device 1001 and a second device 1002, which are symmetrically mounted on both sides of the first circuit board 1.

[0085] In other embodiments, the electronic device 100 may also be mounted only on the same side of the circuit board. The layout can be tailored to the internal space of the electronic device.

[0086] The electronic device of this application increases the utilization rate of circuit board material by 10% to 20%, reduces production costs, and improves economic efficiency.

[0087] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. An electronic device, comprising: First circuit board; A first electronic device is fixedly disposed on the first circuit board, and the orthogonal projection of the first electronic device on the extended plane of the first circuit board partially overlaps with the first circuit board. as well as A reinforcing component is connected to the first circuit board and the first electronic device. 2.The electronic device of claim 1, wherein, The reinforcing component includes a fixing plate, which is connected to the first circuit board along a first direction.

3. The electronic device of claim 2, wherein, The reinforcing component further includes a first connector, the two ends of which are respectively connected to the first circuit board and the fixing plate.

4. The electronic device of claim 3, wherein, The reinforcing member further includes a second connector, the two ends of which are respectively connected to the first circuit board and the fixing plate, and the second connector and the first connector are arranged at intervals along a second direction, wherein the second direction is perpendicular to the first direction.

5. The electronic device according to any one of claims 1 to 4, wherein The fixing plate and the first circuit board have a gap in the first direction.

6. The electronic device of any one of claims 2 to 5, wherein, The first electronic device further includes a plurality of fasteners located on the side of the first electronic device facing the first circuit board, in the overlapping area of ​​the orthogonal projection of the first electronic device on the extended plane of the first circuit board and the fastener plate, and the plurality of fasteners are connected to the fastener plate.

7. The electronic device of claim 6, wherein, The first electronic device includes: The subject; and A plurality of first pins are located on the side of the body facing the first circuit board and in the overlapping area of ​​the orthogonal projection of the first electronic device on the extended plane of the first circuit board and the first circuit board, wherein the plurality of first pins are connected to the first circuit board.

8. The electronic device according to claim 7, wherein, Each of the plurality of first pins includes a first base and a first insertion portion disposed on the first base, the first base being connected to the body, and the first insertion portion being inserted into a first mounting hole disposed on the circuit board; and Each of the fasteners includes a second base and a second insertion portion disposed on the second base, the second base being connected to the body, and the second insertion portion being inserted into a second mounting hole disposed on the fastener plate.

9. The electronic device according to claim 8, wherein, The first base has a first surface facing the first circuit board, and the shortest distance between the first surface and the first circuit board is less than 0.1 mm.

10. The electronic device according to claim 8 or 9, wherein, Along the thickness direction of the first circuit board, the fixing plate is located in the center of the first circuit board, and the second base has a second surface facing the fixing plate, the shortest distance between the second surface and the fixing plate being less than 0.8 mm.

11. The electronic device according to any one of claims 6 to 10, wherein, The fastener includes at least one of a pin, a socket, or a mounting post.

12. The electronic device according to any one of claims 2 to 11, wherein, The fixing plate is made of glass fiber reinforced epoxy resin sheet.

13. The electronic device according to any one of claims 2 to 12, wherein, The thickness of the fixing plate is less than the thickness of the first circuit board.

14. The electronic device according to claim 13, wherein, The thickness of the fixing plate ranges from 5.3 mm to 5.9 mm, and / or the thickness of the first circuit board ranges from 5.7 mm to 6.7 mm.

15. The electronic device according to any one of claims 2 to 14, wherein, The fixing plate includes a first copper foil layer, a first core board layer, a second copper foil layer, a first dielectric layer, a third copper foil layer, a second core board layer, and a fourth copper foil layer stacked in sequence.

16. The electronic device according to claim 15, wherein, The first dielectric layer includes a prepreg.

17. The electronic device according to any one of claims 2 to 16, wherein, The fixing plate includes a plurality of mounting strips, which are spaced apart in a second direction and connected to the edge of the first circuit board.

18. The electronic device according to claim 17, wherein, The plurality of mounting strips are integrally formed with the first circuit board.

19. The electronic device according to any one of claims 1 to 18, wherein, The reinforcing component includes a reinforcing frame, with both ends of the reinforcing frame connected to the first circuit board, and the reinforcing frame surrounding the outer periphery of the first electronic device.

20. The electronic device according to any one of claims 1 to 19, wherein, The electronic device further includes a second electronic device, wherein the first electronic device is disposed on one side of the first circuit board, and the second electronic device is disposed on the opposite side of the first circuit board.

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