Method for dividing glass substrate using laser

Abstract

According to the present invention, a glass substrate dividing method divides a glass substrate including a glass core, an upper laminate, and a lower laminate into a plurality of units. The glass substrate dividing method comprises: a laminate removing step of removing each of the upper laminate and the lower laminate of an area to be divided along a predetermined line using a laser; a laser drilling step of drilling the glass core along the predetermined line using the laser; and a physical or laser braking step of physically dividing the glass substrate on which the drilling step has been performed into a plurality of units.

Description

Laser-based glass substrate dividing method

[0001] The present invention relates to a method for dividing a glass substrate into a plurality of units, wherein the organic substrate may include an interposer substrate and a core substrate.

[0002] In particular, the present invention relates to a method for dividing a glass substrate into a plurality of units using a laser.

[0003] Glass substrates, such as core substrates and interposer substrates, are substrates with multiple layers laminated on both sides. Glass substrates are used in high-performance semiconductor packaging processes. Their superior data transmission speed and power efficiency can significantly contribute to improving the performance of AI (Artificial Intelligence) semiconductors.

[0004] Traditional methods for dividing glass substrates include mechanical processing steps and breaking steps.

[0005] In the mechanical processing step, grooves are formed on the upper and lower surfaces of the glass substrate by removing multiple layers formed on both sides of the glass substrate using a wheel or blade. In the breaking processing step, the glass substrate is mechanically or laser-cut from the grooves formed by laser processing. This divides the glass substrate into multiple units.

[0006] However, conventional glass substrate splitting methods, such as mechanical wheels or blades, mechanically process the glass substrate, resulting in cracks on the surface or interior of the glass core. These cracks are highly likely to result in horizontal splitting of the glass substrate, also known as SeWaRe defects.

[0007] The problem to be solved by the present invention is to provide a method for dividing a glass substrate capable of suppressing Seware defects.

[0008] In particular, the problem to be solved by the present invention is to provide a glass substrate splitting method capable of suppressing Seware defects by including at least two laser processes prior to the breaking process, efficiently performing the breaking process, and minimizing the impact on the device during the breaking step.

[0009] The problems to be solved by the present invention are not limited to those mentioned above. Other problems and advantages of the present invention not mentioned above can be understood through the following description and will be more clearly understood through the embodiments of the present invention. Furthermore, it will be readily apparent that the problems and advantages of the present invention can be realized by the means and combinations thereof set forth in the claims.

[0010] A method for dividing a glass substrate according to an embodiment of the present invention for solving the above problem is a method for dividing a glass substrate including a glass substrate, an upper laminate laminated on an upper surface of the glass substrate, and a lower laminate laminated on a lower surface of the glass substrate into a plurality of units, the method comprising: a laminate removing step of removing the upper laminate and the lower laminate in a dividing target area along a predetermined line using a laser; a laser perforating step of perforating the glass substrate along a predetermined line using a laser; and a physical or laser breaking step of physically or laser-breaking the glass substrate on which the perforation step has been performed into a plurality of units.

[0011] The above laminate removal step may be performed without laser etching the glass substrate or by a thickness of the laminate from the upper surface and / or lower surface of the glass substrate.

[0012] The above-mentioned layer removal step can be performed using a laser having a wavelength in the range of 1064 nm or less, for example, 257 to 1064 nm, and a pulse width of 100 ns or less, for example, between 100 fs and 100 ns.

[0013] In the above laminate removal step, the laser is emitted from an optical system capable of operating in two axes with one or more mirrors, and the stage on which the glass substrate is placed can operate in the X / Y / T / Z axes.

[0014] The above laser perforation step can be performed using a laser having a wavelength of 515 to 1064 nm and a pulse width of 100 ps to 100 fs.

[0015] In the above laser perforation step, the laser may be emitted from a filamentation or Bessel beam optical system.

[0016] The above physical or laser breaking step can be performed by a physical method of tilting and breaking the glass substrate that has undergone the laser perforation step.

[0017] The above physical or laser breaking step can be performed by a laser method in which a glass substrate that has undergone a laser perforation step is heated by a laser to the surface of the glass core, and the glass core is cooled by a cooling fluid while being broken. The above laser breaking step can be performed using a CW (continuous wave) laser with a wavelength of 200 to 10,900 nm and a pulse width of 100 ns to 100 fs.

[0018] The thickness of the above glass core may be 0.03 mm to 3 mm.

[0019] According to another embodiment of the present invention for solving the above problem, a method for dividing a glass substrate, which comprises a glass substrate, an upper laminate laminated on an upper surface of the glass substrate, and a lower laminate laminated on a lower surface of the glass substrate, is provided, the method comprising: a laminate removing step of removing the upper laminate and the lower laminate in a dividing target area along a predetermined line using a laser; a laser perforating step of perforating the glass substrate along a predetermined line using a laser; a physical or laser breaking step of physically or laser-wise dividing the glass substrate on which the perforation step has been performed into a plurality of units; and a chamfering step of processing edges of the glass substrate of the divided units after the physical or laser breaking step.

[0020] The above laminate removal step may be performed without laser etching the glass substrate or by a thickness of the laminate from the upper surface and / or lower surface of the glass core.

[0021] The above-mentioned layer removal step can be performed using a laser having a wavelength in the range of 257 to 1064 nm and a pulse width of 100 fs to 100 ns.

[0022] In the above laminate removal step, the laser is emitted from an optical system capable of operating in two axes with one or more mirrors, and the stage on which the glass substrate is placed can operate in the X / Y / T / Z axes.

[0023] The above laser perforation step can be performed using a laser having a wavelength of 515 to 1064 nm and a pulse width of 100 ps to 100 fs.

[0024] In the above laser perforation step, the laser may be emitted from a filamentation or Bessel beam optical system.

[0025] The above physical or laser breaking step can be performed by a physical method of tilting and breaking the glass substrate that has undergone the laser perforation step.

[0026] The above physical or laser breaking step can be performed by a laser method in which a glass substrate that has undergone a laser perforation step is heated by a laser to the surface of the glass core, and the glass core is cooled by a cooling fluid while being broken. The above laser breaking step can be performed using a CW (continuous wave) laser with a wavelength of 200 to 10,900 nm and a pulse width of 100 ns to 100 fs.

[0027] The above chamfering can be performed by grinding.

[0028] The above chamfering can be performed using a laser method. In this case, the chamfering step can be performed using a laser having a wavelength of 265 to 10,900 nm and a pulse width of 100 ns to 100 fs.

[0029] The thickness of the above glass core may be 0.03 mm to 3 mm.

[0030] According to another embodiment of the present invention for solving the above problem, a method for dividing a glass substrate, which comprises a glass substrate, an upper laminate laminated on an upper surface of the glass substrate, and a lower laminate laminated on a lower surface of the glass substrate, is provided, the method comprising: a laminate removing step of removing the upper laminate and the lower laminate in a dividing target area along a predetermined line using a laser; a laser perforating step of perforating a glass core along a predetermined line using a laser; a chamfering step of processing an edge of a glass core of a unit to be divided using a laser; and a physical or laser breaking step of physically or laser-breaking the glass substrate on which the perforating step and the chamfering step have been performed into a plurality of units.

[0031] The above laminate removal step may be performed as long as the glass core is not laser etched or as long as the laminate is removed from the upper surface and / or lower surface of the glass core.

[0032] The above-mentioned layer removal step can be performed using a laser having a wavelength in the range of 257 to 1064 nm and a pulse width of 100 fs to 100 ns.

[0033] In the above laminate removal step, the laser is emitted from an optical system capable of operating in two axes with one or more mirrors, and the stage on which the glass substrate is placed can operate in the X / Y / T / Z axes.

[0034] The above laser perforation step can be performed using a laser having a wavelength of 515 to 1064 nm and a pulse width of 100 ps to 100 fs.

[0035] In the above laser perforation step, the laser may be emitted from a filamentation or Bessel beam optical system.

[0036] The above chamfering can be performed using a laser method. In this case, the chamfering step can be performed using a laser having a wavelength of 265 to 355 nm and a pulse width of 100 ps to 100 fs.

[0037] The above physical or laser breaking step can be performed by a physical method of tilting and breaking the glass substrate that has undergone the laser perforation step and the chamfering step.

[0038] The above physical or laser breaking step can be performed by a laser method in which a glass substrate that has undergone a laser perforation step and a chamfering step is heated by a laser to the surface of the glass substrate and the glass core is cooled by a cooling fluid while breaking the glass substrate.

[0039] The thickness of the above glass core may be 0.03 mm to 3 mm.

[0040] The glass substrate splitting method according to the present invention can suppress Seware defects by performing laminate removal and laser perforation using a laser prior to the breaking process, and can also efficiently perform the breaking process by forming a series of perforation lines.

[0041] Furthermore, the glass substrate splitting method according to the present invention can minimize the impact on the device during the breaking process by performing the breaking step using a physical or laser method. While chemical breaking may offer better strength, the liquid used in chemical breaking can contaminate the substrate surface, and a process of attaching a protective or masking film is required. Furthermore, in the case of an interposer substrate, the glass thickness may be too thin, causing breakage during movement. Physical or laser breaking is applicable regardless of substrate thickness.

[0042] Furthermore, the glass substrate dividing method according to the present invention can further enhance the effectiveness of suppressing SeWaRe defects by removing microcracks in individual units by performing a chamfering step on the edges of the glass core. The chamfering process can also provide the effect of enabling tilting with lower force than, for example, a physical breaking method.

[0043] In addition, the glass substrate dividing method according to the present invention can be applied to glass cores having various thicknesses ranging from 0.03 mm to 3 mm.

[0044] In addition to the effects described above, specific effects of the present invention are described below while explaining specific details for carrying out the invention.

[0045] Figure 1 schematically illustrates a glass substrate with laminates laminated on the upper and lower portions of a glass core.

[0046] Figure 2 schematically illustrates a method for dividing a glass substrate according to a conventional technique.

[0047] Figure 3 schematically illustrates an example of SeWaRe defects occurring after division.

[0048] Figure 4a is a flowchart schematically showing a glass substrate dividing method according to an embodiment of the present invention.

[0049] Figure 4b schematically illustrates each step of Figure 4a.

[0050] Figure 5 schematically illustrates an example of a laminate removal step.

[0051] Figure 6 schematically illustrates an example of a laser optical system and stage used in the laminate removal step.

[0052] Figure 7 schematically illustrates the laser perforation steps.

[0053] Figure 8 schematically illustrates an example in which a laser perforation step is performed along a division line.

[0054] Figure 9 schematically illustrates (a) physical method braking and (b) laser method braking.

[0055] Figure 10a is a flowchart schematically showing a glass substrate dividing method according to another embodiment of the present invention.

[0056] Figure 10b schematically illustrates each step of Figure 10a.

[0057] Figure 11 schematically illustrates (a) grinding method chamfering and (b) laser method chamfering.

[0058] FIG. 12a is a flowchart schematically illustrating a glass substrate dividing method according to another embodiment of the present invention.

[0059] Figure 12b schematically illustrates each step of Figure 12a.

[0060] <Explanation of symbols>

[0061] 100: Glass substrate

[0062] 110: Glass core

[0063] 120a: Upper layer

[0064] 120b: Lower layer

[0065] 410, 710, 1010, 1210: Perforation

[0066] 610: Laser optics

[0067] 620: Stage

[0068] 910: Grinder

[0069] 1020, 1220: Chamfered surface

[0070] The advantages and features of the present invention, and the methods for achieving them, will become clearer with reference to the embodiments described in detail below together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms. These embodiments are provided only to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims. Like reference numerals designate like elements throughout the specification.

[0071] To clearly illustrate the present invention in the drawings, parts irrelevant to the description have been omitted, and the same reference numerals have been used throughout the specification to designate identical or similar components. Furthermore, the size and thickness of each component shown in the drawings have been arbitrarily indicated for convenience of explanation, and therefore the present invention is not necessarily limited to what is shown.

[0072] Throughout the specification, when a part is said to be "connected" to another part, this includes not only "directly connected" but also "indirectly connected" with other elements intervening. Furthermore, when a part is said to "include" a component, this does not exclude other components, but rather includes other components, unless otherwise specifically stated.

[0073] In this specification, “front” and “rear” are named based on the direction of travel of the beam, and the direction approaching the workpiece is defined as “rear.”

[0074] Hereinafter, a method for dividing a glass substrate using a laser according to a preferred embodiment of the present invention will be described in detail with reference to the attached drawings.

[0075] Figure 1 schematically illustrates a glass substrate with laminates laminated on the upper and lower portions of a glass core.

[0076] The organic substrate (100) may include an interposer substrate and a core substrate.

[0077] The glass substrate (100) includes a glass core (110), an upper laminate (120a) laminated on the upper surface of the glass core (110), and a lower laminate (120b) laminated on the lower surface of the glass core (110).

[0078] The upper laminate (120a) and / or the lower laminate (120b) arranged on both sides of the glass core (110) of the glass substrate (100) are divided into a plurality of element portions and an outer portion outside each element portion, and a specific position of the outer portion between the element portions becomes a dividing target. The glass core (110) may include one or more via holes that allow the upper laminate (120a) and the lower laminate (120b) to be electrically connected.

[0079] The thickness of the glass core (110) that can be used in the glass substrate dividing method using a laser according to the present invention can vary in the range of 0.03 mm to 3 mm.

[0080] The upper laminate (120a) and / or the lower laminate (120b) include at least one layer. The layers included in the upper laminate (120a) and the lower laminate (120b) can generally be polymer, ABF (Ajinomoto Build-up Film), silicon nitride, SR (Solder Resist), etc.

[0081] Figure 2 schematically illustrates a method for dividing a glass substrate according to a conventional technique.

[0082] Referring to FIG. 2, a glass substrate splitting method according to the prior art includes a mechanical processing step and a breaking step.

[0083] Referring to (a) and (b) of FIG. 2, in the mechanical processing step, a groove (220) is formed on the upper surface of the glass core (110) while removing the upper laminate (120a) formed on the upper surface of the glass core (110) using a wheel or blade (210). In the breaking processing step, the glass substrate is cut mechanically, chemically, or using a laser from the groove formed by the mechanical processing (220). As a result, the glass substrate is divided into a plurality of units.

[0084] However, in the conventional glass substrate splitting method, cracks occur on the surface or inside of the glass core (110) when the glass substrate is mechanically processed using a mechanical wheel or blade (210).

[0085] Due to this crack, there is a high possibility of a defect in which the glass core is split horizontally after splitting, also known as SeWaRe defect.

[0086] Figure 3 schematically illustrates an example of SeWaRe defects occurring after division.

[0087] Referring to (a) of Fig. 3, a crack (310) is formed along the horizontal direction of the glass core (110). This crack (310) mainly occurs when mechanically processing a glass substrate using a mechanical wheel or blade, as mentioned above. Due to this crack (310), a phenomenon in which a divided glass substrate is split in the horizontal direction may occur, as shown in the example illustrated in (b) of Fig. 3. Such a defect, i.e., a Seire defect, has a negative impact on the device manufacturing yield, device operation reliability, etc., and therefore, it is necessary to suppress it as much as possible.

[0088] Fig. 4a is a flowchart schematically illustrating a glass substrate dividing method according to an embodiment of the present invention. Fig. 4b schematically illustrates each step of Fig. 4a.

[0089] Referring to FIGS. 4a and 4b, the illustrated glass substrate splitting method includes an upper and lower laminate removal step (S410), a laser perforation step (S420), and a physical or laser breaking step (S430).

[0090] The present invention provides a method for dividing a glass substrate including a glass core (110), an upper laminate (120a) laminated on the upper surface of the glass core, and a lower laminate (120b) laminated on the lower surface of the glass core into a plurality of units.

[0091] First, in the laminate removal step (S410), a laser is used to remove the upper and lower laminates of the division target area along a predetermined line when viewed from above. For example, as shown in the example illustrated in Fig. 4b, the upper laminate (120a) may be removed first (S410a) and then the lower laminate (120b) may be removed (S410b), or vice versa.

[0092] FIG. 5 schematically illustrates an example of a laminate removal step. As in the example illustrated in FIG. 5, an upper glass core exposure portion (510a) can be formed by removing the upper laminate (120a) along a predetermined line with a laser. Similarly, a lower glass core exposure portion (510b) can be formed by removing the lower laminate (120b) along a predetermined line with a laser. It may be considered that the laminate removal and laser perforation are performed as a single process, but in this case, problems such as contamination with impurities may occur during the laser perforation process. However, as in the present invention, by removing the upper and lower laminates using a laser to first expose the upper and lower surfaces of the glass core (110), problems such as residual impurities can be suppressed in the subsequent laser perforation step (S420).

[0093] The laminate removal step (S410) is preferably performed so that the glass core is hardly affected by the laser, i.e., so that the glass core is not damaged. This provides a protective effect against microcracks, i.e., suppresses the occurrence or expansion of microcracks. For example, the laminate removal step (S410) may be performed so that the glass core (110) is not laser-etched or the etching depth is 1 μm or less from the upper surface and / or lower surface of the glass core (110).

[0094] To this end, the laminate removal step (S410) can be performed using a laser having a wavelength in the range of 1064 nm or less, specifically 257 to 1064 nm, and a pulse width of 100 ns or less, specifically 100 fs to 100 ns. If the laser wavelength used in the laminate removal step exceeds 1064 nm, the absorption on the glass surface may increase, causing damage to the surface and generating cracks. In addition, if the laser pulse width used in the laminate removal step exceeds 100 ns, the HAZ of the polymer to be removed may be significantly generated, which may result in unit failure.

[0095] Figure 6 schematically illustrates an example of a laser optical system and stage used in the laminate removal step.

[0096] In the laminate removal step (S410), a laser may be emitted from an optical system (610) that has one or more mirrors and can operate in two axes, as in the example illustrated in FIG. 6. A stage (620) on which a glass substrate is placed may operate in the X / Y / T / Z axes. That is, the stage may move along the X-axis, Y-axis, and Z-axis, and may turn, for example, along the T-axis, which is a horizontal axis. By the configuration of the laser optical system (610) and the stage (620), even when the thicknesses of the upper and lower laminates are different, the upper and lower laminates can be stably removed at a predetermined width along a predetermined dividing line (L).

[0097] Meanwhile, FIG. 6 shows an example in which a laminate of a glass substrate (100) is removed along a predetermined dividing line (L) corresponding to the Y-axis.

[0098] Next, in the laser perforation step (S420), a laser is used to form a perforation (410) in the glass core along a predetermined line.

[0099] Fig. 7 schematically illustrates a laser perforation step. Fig. 8 schematically illustrates an example in which the laser perforation step is performed along a dividing line. As shown in the example in Fig. 7, the upper and lower laminates (120a, 120b) are removed, exposing the glass core (110), and a laser is irradiated to form perforations (710) in the thickness direction of the glass core. A plurality of perforations (710) are formed along the dividing line (L).

[0100] The laser perforation step can be performed using a laser having a wavelength of 515 to 1064 nm and a pulse width of 100 ps to 100 fs. If the wavelength of the laser used in the laser perforation step is less than 515 nm, problems may arise during processing due to increased glass absorption. In addition, if the laser pulse width used in the laminate perforation step exceeds 100 ps, ​​problems may arise in which many cracks occur inside and outside the glass. To this end, in the laser perforation step, the laser may be emitted from a filamentation or Bessel beam optical system.

[0101] Next, in the physical or laser breaking step (S430), the glass substrate on which the perforation step has been performed is physically or laser-divided into multiple units.

[0102] Typically, breaking is performed using chemical etching. However, chemical etching can introduce problems, such as device operation or stability, due to the penetration of the etchant. Furthermore, applying chemical etching requires additional steps, such as attaching a masking film or a protective film. Therefore, the present invention addresses these issues by performing breaking using physical or laser methods.

[0103] The strength along the break line is weakened by the laser perforation step, so that subsequent physical or laser breaking steps can be easily performed.

[0104] Figure 9 schematically illustrates (a) physical (tilting) method braking and (b) laser method braking.

[0105] The physical or laser breaking step (S430) can be performed using a physical method, such as the tilting method illustrated in (a) of FIG. 9. By performing tilting while holding the units to be broken, the glass substrate can be broken into units along the pre-formed perforations.

[0106] Additionally, the physical or laser breaking step (S430) may be performed using a laser, as illustrated in the example in (b) of FIG. 9. For example, physical or laser breaking may be performed by applying heat to the glass core surface of a glass substrate that has undergone a laser perforation step using a laser that can be well absorbed by the glass surface, and then dividing the glass core while cooling it using a cooling fluid such as air, gas, or water. The laser used for laser breaking is preferably a laser that can be absorbed by the glass surface, and for example, a CO2 laser may be used.

[0107] Fig. 10a is a flowchart schematically illustrating a glass substrate dividing method according to another embodiment of the present invention. Fig. 10b schematically illustrates each step of Fig. 10a.

[0108] The glass substrate splitting method illustrated in FIG. 10a includes an upper and lower laminate removal step (S1010), a laser perforation step (S1020), a physical or laser breaking step (S1030), and a chamfering step (S1040).

[0109] In the upper and lower laminate removal step (S1010), the upper laminate (120a) laminated on the upper side of the glass core (110) in the dividing target area and the lower laminate (120b) laminated on the lower side of the glass core are removed along a predetermined line using a laser, respectively. FIG. 10b illustrates a process of removing the upper laminate (120a) using a laser (S1010a) and then removing the lower laminate (120b) using a laser (S1010b), and vice versa.

[0110] The laminate removal step may be performed so that the glass core (110) is not laser etched or the etching depth is 1 μm or less from the upper surface and / or lower surface of the glass core (110). The laminate removal step may be performed using a laser having a wavelength of 1064 nm or less and a pulse width of 100 ns or less. In the laminate removal step, the laser is emitted from an optical system having one or more mirrors and capable of operating in two axes, and a stage on which the glass substrate is placed may be capable of operating in the X / Y / T / Z axes.

[0111] Next, in the laser perforation step (S1020), a perforation (1010) is formed in the glass core (110) along a predetermined line using a laser. The laser perforation step may be performed using a laser having a wavelength of 515 to 1064 nm and a pulse width of 100 ps to 100 fs. In the laser perforation step, the laser may be emitted from a filamentation or Bessel beam optical system.

[0112] Next, in the physical or laser breaking step (S1030), the glass substrate on which the perforation step has been performed is physically or laser broken into a plurality of units.

[0113] The above physical or laser breaking step can be performed by a physical method of tilting and dividing the glass substrate that has undergone the laser perforation step. As another example, the physical or laser breaking step can be performed by a laser method of applying heat to the surface of the glass core of the glass substrate that has undergone the laser perforation step with a laser that has good glass surface absorption, and then cooling the glass core with a cooling fluid while dividing the glass substrate.

[0114] The upper and lower laminate removal step (S1010), the laser perforation step (S1020), and the physical or laser breaking step (S1030) illustrated in FIGS. 10a and 10b can be performed in substantially the same manner as the upper and lower laminate removal step (S410), the laser perforation step (S420), and the physical or laser breaking step (S430) illustrated in FIGS. 4a and 4b described above.

[0115] Next, in the chamfering (S1040) step, the edges of the glass core of the split unit are processed after the physical or laser breaking step.

[0116] The chamfering step (S1040) is performed to remove chips and chamfer sharp edges generated after physical or laser breaking. The shape of the chamfered surface (1020) can be angular or C-shaped.

[0117] In the present invention, the chamfering process can be performed only on the edges of the glass core in the chamfering step (S1040) by the upper and lower laser removal steps (S1010), so that micro-cracks are removed at the edges of the glass core, thereby enhancing the effect of suppressing seare defects.

[0118] Figure 11 schematically illustrates (a) grinding method chamfering and (b) laser method chamfering.

[0119] Chamfering can be performed by grinding using a grinder (910) as shown in the example in (a) of Fig. 11.

[0120] As another example, chamfering can be performed using a laser, as illustrated in the example of Fig. 11(b). In this case, the chamfering step can be performed using a laser having a wavelength of 265 to 355 nm and a pulse width of 100 ps to 100 fs to minimize heat generation in the glass core. If the laser wavelength used in the chamfering step exceeds 355 nm, the glass absorption may decrease, which may cause problems in the chamfering process. In addition, if the pulse width of the laser used in the chamfering step exceeds 100 ps, ​​a large amount of heat may be generated during processing, which may increase the number of microcracks.

[0121] Fig. 12a is a flowchart schematically illustrating a glass substrate dividing method according to another embodiment of the present invention. Fig. 12b schematically illustrates each step of Fig. 12a.

[0122] The glass substrate splitting method illustrated in FIGS. 12a and 12b includes an upper and lower laminate removal step (S1210), a laser perforation step (S1220), a chamfering step (S1230), and a physical or laser breaking step (S1240).

[0123] In the upper and lower laminate removal step (S1210), the upper laminate (120a) laminated on the upper side of the glass core (110) in the dividing target area and the lower laminate (120b) laminated on the lower side of the glass core are removed along a predetermined line using a laser, respectively. FIG. 12b illustrates a process of removing the upper laminate (120a) using a laser (S1210a) and then removing the lower laminate (120b) using a laser (S1210b), and vice versa.

[0124] The laminate removal step (S1210) may be performed so that the glass core (110) is not laser etched or the etching depth is 1 μm or less from the upper surface and / or lower surface of the glass core (110). The laminate removal step (S1210) may be performed using a laser having a wavelength range of 1064 nm or less and a pulse width of 100 ns or less. In the laminate removal step, the laser is emitted from an optical system having one or more mirrors and capable of operating in two axes, and a stage on which the glass substrate is placed may operate in the X / Y / T / Z axes.

[0125] Next, in the laser perforation step (S1220), a perforation (1210) is formed in the glass core (110) along a predetermined line using a laser. The laser perforation step may be performed using a laser having a wavelength of 515 to 1064 nm and a pulse width of 100 ps to 100 fs. In the laser perforation step, the laser may be emitted from a filamentation or Bessel beam optical system.

[0126] Next, in the physical or laser breaking step (S1240), the glass substrate on which the perforation step and the chamfering step (S1230) were performed is physically or laser broken into a plurality of units.

[0127] The physical or laser breaking step (S1240) may be performed by a physical method that tilts the glass substrate to split it. Alternatively, the physical or laser breaking step may be performed by a laser method that heats the surface of the glass core with a laser and splits the glass core while cooling it with a cooling fluid.

[0128] The upper and lower laminate removal step (S1210), the laser perforation step (S1220), and the physical or laser breaking step (S1230) illustrated in FIGS. 12a and 12b can be performed in substantially the same manner as the upper and lower laminate removal step (S410), the laser perforation step (S420), and the physical or laser breaking step (S430) illustrated in FIGS. 4a and 4b described above, or the upper and lower laminate removal step (S1010), the laser perforation step (S1020), and the physical or laser breaking step (S1030) illustrated in FIGS. 10a and 10b described above.

[0129] Meanwhile, in the case of the glass substrate splitting method illustrated in FIGS. 12a and 12b, unlike the method illustrated in FIGS. 10a and 10b, the chamfering step (S1230) is performed first, and then the physical or laser breaking step (S1240) is performed.

[0130] In the glass substrate splitting method illustrated in FIGS. 12a and 12b, in the chamfering step (S1230), the edge of the glass core of the unit to be split is processed using a laser.

[0131] The chamfering step (S1230) is performed to chamfer sharp edges. The shape of the chamfered surface (1220) can be angled or C-shaped.

[0132] The chamfering step can be performed using a laser having a wavelength of 265 to 355 nm and a pulse width of 100 ps to 100 fs.

[0133] Meanwhile, in the glass substrate splitting method illustrated in FIGS. 12a and 12b, the chamfering step is performed before the physical or laser breaking step, so chamfering using a grinder is not applied.

[0134] As described above, by performing laminate removal and laser perforation using a laser prior to the breaking process according to the present invention, not only can sewer defects be suppressed, but also the breaking process can be performed efficiently by forming a series of perforation lines, and by performing physical or laser breaking, the impact on the element during breaking can be minimized.

[0135] While the above description focuses on specific embodiments of the present invention, those skilled in the art will appreciate that various modifications and variations can be made. Such modifications and variations, as long as they do not depart from the scope of the technical concept provided by the present invention, are considered to be within the scope of the present invention. Therefore, the scope of the present invention should be determined by the claims set forth below.

Claims

1. A method for dividing a glass substrate including a glass core, an upper laminate laminated on the upper surface of the glass core, and a lower laminate laminated on the lower surface of the glass core into a plurality of units, A laminate removal step of removing the upper and lower laminates of the division target area along a predetermined line using a laser; A laser perforation step for perforating a glass core along a predetermined line using a laser; and A method comprising a physical or laser breaking step of physically or laser breaking a glass substrate on which a perforation step has been performed into a plurality of units.

2. A method for dividing a glass substrate including a glass core, an upper laminate laminated on the upper surface of the glass core, and a lower laminate laminated on the lower surface of the glass core into a plurality of units, A laminate removal step of removing the upper and lower laminates of the division target area along a predetermined line using a laser; A laser perforation step for perforating a glass core along a predetermined line using a laser; A physical or laser breaking step for physically or laser-wise dividing the glass substrate on which the perforation step has been performed into a plurality of units; and A method comprising a chamfering step for processing the edges of the glass core of the divided unit after the physical or laser breaking step.

3. In paragraph 2, A method in which the above chamfering is performed by grinding.

4. In paragraph 2, A method in which the above chamfering is performed using a laser method.

5. In paragraph 4, A method in which the above chamfering step is performed using a laser having a wavelength of 265 to 355 nm and a pulse width of 100 ps to 100 fs.

6. A method for dividing a glass substrate including a glass core, an upper laminate laminated on the upper surface of the glass core, and a lower laminate laminated on the lower surface of the glass core into a plurality of units, A laminate removal step of removing the upper and lower laminates of the division target area along a predetermined line using a laser; A laser perforation step for perforating a glass core along a predetermined line using a laser; A chamfering step for processing the edges of the glass core of the unit to be divided using a laser; and A method comprising a physical or laser breaking step for physically or laser-wise dividing a glass substrate on which a perforation step and a chamfering step have been performed into a plurality of units.

7. In paragraph 6, A method in which the above chamfering step is performed using a laser having a wavelength of 265 to 355 nm and a pulse width of 100 ps to 100 fs.

8. In any one of paragraphs 1 to 7, A method wherein the above laminate removal step is performed such that the glass core is not laser etched or is etched to a depth of 1 μm or less from the upper surface and / or lower surface of the glass core.

9. In any one of paragraphs 1 to 7, A method in which the above-mentioned layer removal step is performed using a laser having a wavelength in the range of 257 to 1064 nm and a pulse width in the range of 100 fs to 100 ns.

10. In any one of paragraphs 1 to 7, A method in which, in the above-mentioned laminate removal step, the laser is emitted from an optical system capable of operating in two axes with one or more mirrors, and the stage on which the glass substrate is placed operates in the X / Y / T / Z axes.

11. In any one of paragraphs 1 to 7, A method in which the above laser perforation step is performed using a laser having a wavelength of 515 to 1064 nm and a pulse width of 100 ps to 100 fs.

12. In any one of paragraphs 1 to 7, A method wherein, in the above laser perforation step, the laser is emitted from a filamentation or Bessel beam optical system.

13. In any one of paragraphs 1 to 7, A method wherein the above physical or laser breaking step is performed by a physical method of tilting and breaking the glass substrate.

14. In any one of paragraphs 1 to 7, A method wherein the above physical or laser breaking step is performed by laser-assistedly applying heat to the glass core surface of the glass substrate with a laser absorbable on the glass surface, and breaking the glass core while cooling it with a cooling fluid.

15. In any one of paragraphs 1 to 7, A method wherein the thickness of the glass core is 0.03 mm to 3 mm.

Images