Heat dissipation assembly and computing device

Abstract

Provided in the embodiments of the present application are a heat dissipation assembly and a computing device, wherein the heat dissipation assembly comprises: a circuit board, a plurality of heating components being provided on the circuit board; a heat sink arranged on the side of the heating components facing away from the circuit board; and an anti-scouring sheet, which comprises a plurality of first portions arranged between the heating components and the heat sink, the plurality of first portions being arranged in a manner of corresponding to the plurality of heating components on a one-to-one basis, the first portions defining heat dissipation holes, and heat dissipation media being provided in the heat dissipation holes. The anti-scouring sheet further comprises a second portion arranged on the periphery of the first portions, the second portion being used for connecting adjacent first portions to each other. By means of the technical solutions of the embodiments of the present application, the heat dissipation media can be isolated from coolant fluid, thereby sealing and protecting the heat dissipation media, and preventing the heat dissipation media from being scoured and consumed during long-term immersion, such that the operating reliability of a computing device can be improved while ensuring a heat dissipation effect.

Description

Heat dissipation assembly and computing device

[0001] This application claims priority from the Chinese patent application No. 2024212659790 entitled "Heat dissipation assembly and computing device" and filed with the China Patent Office on June 4, 2024, the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the field of heat dissipation technology, in particular to a heat dissipation assembly and a computing device. BACKGROUND

[0003] With the rise of huge models such as Chat Generative Pre-trained Transformer (Chat GPT), the demand for large-scale operation is increasing, and the development of supercomputing devices is also in full swing. In the related art, a computing board is usually designed by using general-purpose chips or multiple special-purpose chips in a series or parallel structure to provide super large computing power. However, as the power consumption of the chips is increasing, the surface heat flux density of the chips is also increasing, and the heat dissipation demand of the chips is also increasing, and the heat dissipation performance of the chips directly affects the working performance and service life of the chips. SUMMARY

[0004] Embodiments of the present application provide a heat dissipation assembly and a computing device to solve or alleviate one or more technical problems in the prior art.

[0005] As an aspect of the embodiments of the present application, a heat dissipation assembly is provided, comprising: a circuit board, a plurality of heat generating components are disposed on the circuit board; a heat sink, disposed on a side of the heat generating component away from the circuit board; a splash-proof sheet, comprising a plurality of first parts disposed between the heat generating component and the heat sink, the plurality of first parts correspond one-to-one to the plurality of heat generating components, the first part defines a heat dissipation hole, and a heat dissipation medium is disposed in the heat dissipation hole; further comprising a second part disposed on the outer periphery of the first part, the second part is used to connect adjacent first parts to each other.

[0006] In an embodiment, the inner edge of the first part is spaced apart from the edge of the heat generating component.

[0007] In an embodiment, the maximum size of the heat dissipation hole in the first direction is smaller than the size of the heat generating component in the first direction, and the maximum size of the heat dissipation hole in the second direction is smaller than the size of the heat generating component in the second direction; wherein the first direction is perpendicular to the second direction, and the first direction and the second direction are both parallel to the surface of the circuit board.

[0008] In an embodiment, the thickness of the first part is smaller than the thickness of the heat generating component, and the thickness direction is perpendicular to the surface of the circuit board.

[0009] In one embodiment, the first portion is made of an elastic material.

[0010] In one embodiment, the side surface of the anti-washing sheet facing the heat generating component is provided with a first adhesive, and the anti-washing sheet is bonded to the heat generating component by the first adhesive.

[0011] In one embodiment, the side surface of the anti-washing sheet facing the heat generating component is provided with a first adhesive, and the anti-washing sheet is bonded to the heat generating component by the first adhesive.

[0012] In one embodiment, the side surface of the anti-washing sheet facing the heat generating component is provided with a first adhesive, and the anti-washing sheet is bonded to the heat generating component by the first adhesive.

[0013] In one embodiment, the side surface of the anti-washing sheet facing the heat generating component is provided with a first adhesive, and the anti-washing sheet is bonded to the heat generating component by the first adhesive.

[0014] In one embodiment, the anti-washing sheet is connected to the heat generating component, the heat dissipation medium is directly filled in the heat dissipation hole, and the heat sink is connected to the circuit board by the first fastener.

[0015] In one embodiment, the anti-washing sheet is connected to the heat generating component, the heat dissipation medium is directly filled in the heat dissipation hole, and the heat sink is connected to the circuit board by the first fastener.

[0016] In one embodiment, the anti-washing sheet is connected to the heat generating component, the heat dissipation medium is directly filled in the heat dissipation hole, and the heat sink is connected to the circuit board by the first fastener.

[0017] In one embodiment, the anti-washing sheet is connected to the heat generating component, the heat dissipation medium is directly filled in the heat dissipation hole, and the heat sink is connected to the circuit board by the first fastener.

[0018] In one embodiment, the anti-washing sheet is connected to the heat generating component, the heat dissipation medium is directly filled in the heat dissipation hole, and the heat sink is connected to the circuit board by the first fastener.

[0019] In one embodiment, the anti-washing sheet is connected to the heat generating component, the heat dissipation medium is directly filled in the heat dissipation hole, and the heat sink is connected to the circuit board by the first fastener.

[0020] In one embodiment, the anti-washing sheet is connected to the heat generating component, the heat dissipation medium is directly filled in the heat dissipation hole, and the heat sink is connected to the circuit board by the first fastener.

[0021] In an embodiment, the heat-dissipating medium is directly coated on the heat-generating component; or the heat-dissipating medium is coated on the heat-generating component through the fourth mesh structure.

[0022] In an embodiment, the plurality of heat-generating components are connected in parallel to form a parallel component group, and the plurality of first parts are connected through the second parts to form a parallel anti-washing sheet group, and the parallel anti-washing sheet group is arranged corresponding to the parallel component group.

[0023] In an embodiment, the plurality of heat-generating components are connected in series to form a series component group, and the plurality of first parts are connected through the second parts to form a series anti-washing sheet group, and the series anti-washing sheet group is arranged corresponding to the series component group.

[0024] In an embodiment, the second part is an integral structure with the first part.

[0025] In an embodiment, the thickness of the second part is equal to the thickness of the first part.

[0026] In an embodiment, the second part is provided with a positioning structure corresponding to the heat sink and / or the circuit board.

[0027] In an embodiment, the second part is formed with a fastener avoiding hole and / or a component avoiding hole.

[0028] In an embodiment, the anti-washing sheet is made of an oil-resistant material.

[0029] In an embodiment, the heat sink comprises a heat-dissipating substrate and a plurality of heat-dissipating fins arranged at intervals, the anti-washing sheet is located between the heat-generating component and the heat-dissipating substrate, and the plurality of heat-dissipating fins are arranged on the side of the heat-dissipating substrate away from the anti-washing sheet.

[0030] As another aspect of the embodiments of the present application, the embodiments of the present application provide a computing device comprising the heat-dissipating assembly of any of the above embodiments.

[0031] The technical solutions of the embodiments of the present application can avoid the heat-dissipating medium from being washed and dissipated under long-term immersion conditions, improve the operation reliability of the computing device while ensuring the heat-dissipating effect.

[0032] The above summary is only for the purpose of the description and is not intended to limit in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features will become apparent to those skilled in the art upon consideration of the drawings and the following detailed description. BRIEF DESCRIPTION OF DRAWINGS

[0033] In the drawings, like reference numerals refer to like elements throughout the various figures. The drawings are not necessarily to scale, the emphasis instead being placed upon illustrating the principles of the application. It should be understood that the drawings are merely

[0034] Fig. 1 shows a structural schematic diagram of a heat dissipation assembly according to an embodiment of the present application;

[0035] Fig. 2 shows a sectional schematic diagram of a heat dissipation assembly according to an embodiment of the present application;

[0036] Fig. 3 shows a schematic diagram of a first part of a splash guard according to an embodiment of the present application;

[0037] Fig. 4 shows a structural schematic diagram of a heat dissipation assembly according to another embodiment of the present application;

[0038] Fig. 5 shows a schematic diagram of a splash guard according to an embodiment of the present application;

[0039] Fig. 6 shows a schematic diagram of a circuit board according to an embodiment of the present application;

[0040] Fig. 7 shows a schematic diagram of a splash guard according to another embodiment of the present application;

[0041] Fig. 8 shows a schematic diagram of a splash guard and a heat sink cooperating according to an embodiment of the present application.

[0042] Legend of reference numerals: 10: heat dissipation assembly; 100: circuit board; 110: heat generating component; 120: parallel component group; 130: series component group; 200: heat sink; 210: heat dissipation substrate; 220: heat dissipation fin; 300: splash guard; 310: first part; 311: heat dissipation hole; 312: heat dissipation medium; 320: second part; 321: fastener avoiding hole; 322: component avoiding hole; 330: parallel splash guard group; 340: series splash guard group. DETAILED DESCRIPTION

[0043] In the following, only certain example embodiments are simply described. As those skilled in the art can recognize, the described embodiments can be modified in various different ways without departing from the spirit or scope of the present application. Therefore, the drawings and the description are to be considered exemplary in nature but not limiting.

[0044] At present, the common chip cooling methods are air cooling and immersion liquid cooling. For the air cooling method, the chip surface is usually coated with a thermal grease or gel, and the chip is in contact with the heat sink through the thermal grease or gel to reduce the contact thermal resistance. However, due to the low convective heat transfer coefficient of air, the air cooling has limited cooling capacity, which limits the improvement of the overall performance of the computing device. For the immersion liquid cooling method, the circuit board is usually immersed in a cooling liquid, and the cooling liquid is in direct contact with the chip and other devices on the circuit board for heat dissipation, which can improve the cooling capacity compared with the air cooling method. However, due to the high surface heat flux of some chips, a heat sink or other heat-conducting structure needs to be installed on the chip surface. Since the thermal grease or gel is usually used as the heat dissipation medium between the chip and the heat sink or other heat-conducting structure, the thermal grease or gel is prone to be washed away and dissipated under long-term immersion, which is not conducive to the long-term operation of the computing device.

[0045] The heat dissipation assembly according to the first aspect of the present application is described below in combination with FIGS. 1-5.

[0046] FIG. 1 shows a structural schematic diagram of a heat dissipation assembly according to an embodiment of the present application; and FIG. 2 shows a cross-sectional schematic diagram of the heat dissipation assembly according to an embodiment of the present application.

[0047] As shown in FIGS. 1 and 2, the heat dissipation assembly 10 includes a circuit board 100, a heat sink 200, and a wash-preventing sheet.

[0048] FIG. 3 shows a schematic diagram of a first part of the wash-preventing sheet according to an embodiment of the present application. Referring to FIGS. 1-3, the circuit board 100 is provided with a plurality of heat-generating components 110. The heat sink 200 is arranged on the side of the heat-generating components 110 away from the circuit board 100. The wash-preventing sheet includes a first part 310 arranged between the heat-generating components 110 and the heat sink 200, a plurality of first parts 310 correspond to a plurality of heat-generating components 110, the first part 310 defines a heat dissipation hole 311, and a heat dissipation medium 312 is arranged in the heat dissipation hole 311. FIG. 4 shows a structural schematic diagram of a heat dissipation assembly 10 according to another embodiment of the present application; and FIG. 5 shows a schematic diagram of a wash-preventing sheet 300 according to an embodiment of the present application. In an implementation, in combination with FIGS. 4 and 5, the wash-preventing sheet 300 further includes a second part 320 arranged between the circuit board 100 and the heat sink 200, the second part 320 is connected to the first part 310, the second part 320 is arranged on the outer periphery of the first part 310, and the second part 320 is used to connect adjacent first parts 310 to each other. The wash-preventing sheet is one or more. In the description of the present application, “a plurality of” means two or more.

[0049] In this embodiment, by setting the second part 320, the connection between the first part 310 and the heat-generating component 110 and / or the heat sink 200 can be improved by the connection between the second part 320 and the circuit board 100 and / or the heat sink 200. In addition, in the case of multiple heat-generating components 110 and first parts 310, the second part 320 can be used to connect multiple first parts 310, so that multiple first parts 310 can be connected to the corresponding heat-generating components 110 and / or heat sinks 200 at the same time, effectively improving the processing efficiency of the heat dissipation assembly 10.

[0050] The heat-generating component 110 can include a chip, which can be located on one side surface of the circuit board 100 in the thickness direction. The chip can include a core area and a packaging area. The core area is an area where micro circuits and transistors are integrated from a silicon wafer. The core area is the most important part of the chip, including processors, memories, etc.

[0051] The packaging area is the external area of the chip, mainly used to protect the core area. The packaging area is usually made of plastic or ceramic materials, etc., with good insulation and heat resistance. The packaging area also includes circuit connection parts such as pins and pads, which are used to connect the chip with external circuits to realize data transmission and control.

[0052] For example, the outer contour shape of the first part 310 of the anti-washing sheet can be adapted to the outer contour shape of the heat-generating component such as the chip.

[0053] For example, in the case where the outer contour shape of the heat-generating component is rectangular, the outer contour shape of the first part 310 of the anti-washing sheet is also rectangular. The first part 310 of the anti-washing sheet can be formed as a ring structure, thereby defining a heat dissipation hole 311. The heat dissipation hole 311 can correspond to the core area of the chip. The shape of the heat dissipation hole 311 can be circular, rectangular, polygonal, and other irregular shapes, etc. The heat dissipation medium 312 can be silicone grease or gel, etc.

[0054] For example, the anti-washing sheet can be made of oil-resistant materials.

[0055] For example, the anti-washing sheet can be a polyethylene terephthalate (PET) sheet, a polycarbonate (PC) sheet, a polypropylene (PP) sheet, an acrylonitrile butadiene styrene (ABS) sheet, or a metal sheet such as a copper sheet or a steel sheet. The specific material of the anti-washing sheet is not limited in the present application, as long as it is an oil-resistant material. The oil-resistant material refers to a material that has good corrosion resistance, immersion resistance, and washing resistance in a liquid environment such as cooling oil.

[0056] According to the heat dissipation assembly 10 of the embodiment of the present application, the first part 310 of the anti-washing sheet is arranged between the heat-generating component 110 and the heat sink 200, and the first part 310 defines a heat dissipation hole 311 in which a heat dissipation medium 312 is arranged. The first part 310 of the anti-washing sheet can effectively protect the heat dissipation medium 312. In the case that the heat dissipation assembly 10 is immersed in a cooling liquid, the first part 310 can isolate the heat dissipation medium 312 from the cooling liquid to a certain extent, thereby sealing the heat dissipation medium 312, avoiding the heat dissipation medium 312 from being washed and dissipated under long-term immersion conditions, and improving the operation reliability of the computing device while ensuring the heat dissipation effect.

[0057] In an embodiment, the inner edge of the first part 310 is arranged in a spaced manner with respect to the edge of the heat-generating component 110.

[0058] For example, the first part 310 can be formed in a ring structure, the outer edge of the first part 310 can correspond to the edge of the heat-generating component 110, and the inner edge of the first part 310 is arranged in a spaced manner with respect to the edge of the heat-generating component 110.

[0059] The inner edge of the first part 310 is the edge of the heat dissipation hole 311. In this way, by arranging the inner edge of the first part 310 in a spaced manner with respect to the edge of the heat-generating component 110, the heat dissipation hole 311 can be arranged in a spaced manner with respect to the edge of the heat-generating component 110, thereby ensuring that the heat dissipation medium 312 in the heat dissipation hole 311 can be sealed in the first part 310 in the case that the heat dissipation assembly 10 is immersed in a cooling liquid, and further improving the operation reliability of the computing device.

[0060] In an embodiment, the maximum size of the heat dissipation hole 311 in the first direction is smaller than the size of the heat-generating component 110 in the first direction, and the maximum size of the heat dissipation hole 311 in the second direction is smaller than the size of the heat-generating component 110 in the second direction. The first direction is perpendicular to the second direction, and both the first direction and the second direction are parallel to the surface of the circuit board 100.

[0061] Exemplarily, the circuit board 100 can be formed in a rectangular shape. The heat-generating components 110 can be multiple, and the multiple heat-generating components 110 can be arranged in an X-row and Y-column array, where X and Y are both greater than 1. The row direction of the array of heat-generating components 110 can be the width direction of the circuit board 100, and the column direction of the array of heat-generating components 110 can be the length direction of the circuit board 100. The first direction can be the width direction of the circuit board 100, and the second direction can be the length direction of the circuit board 100. Each heat-generating component 110 can be rectangular. Two edges of the heat-generating component 110 can be parallel to the first direction, and the other two edges of the heat-generating component 110 can be parallel to the second direction.

[0062] In the embodiment, by making the maximum size of the heat dissipation hole 311 in the first direction smaller than the size of the heat-generating component 110 in the first direction, and the maximum size of the heat dissipation hole 311 in the second direction smaller than the size of the heat-generating component 110 in the second direction, the area of the heat dissipation hole 311 can be smaller than the area of the heat-generating component 110, so that the first part 310 of the anti-washing sheet can better close the heat dissipation medium 312 in the heat dissipation hole 311, and ensure better heat dissipation effect on the heat-generating component 110.

[0063] In an embodiment, the thickness of the first part 310 can be smaller than the thickness of the heat-generating component 110, and the thickness direction is perpendicular to the surface of the circuit board.

[0064] Therefore, since the thickness of the first part 310 determines the thickness of the heat dissipation medium 312, the thickness of the first part 310 thus arranged can meet the actual demand, so that one side surface of the first part 310 can be closely attached to the heat sink 200, and the other side surface of the first part 310 can be closely attached to the heat-generating component 110, while ensuring that the heat dissipation hole 311 defined by the first part 310 can effectively accommodate the heat dissipation medium 312, thereby avoiding the cooling liquid from contacting the heat dissipation medium 312 through the gap between the heat sink 200 and the first part 310 or the gap between the heat-generating component 110 and the first part 310, and further avoiding the heat dissipation medium 312 from being washed away or dissipated under the condition of long-term immersion.

[0065] In an embodiment, the first part 310 can be made of an elastic material.

[0066] The elastic material is relative to the rigid material, and the rigid material refers to a material that does not deform under the action of an external force. The elastic material refers to a material that deforms under the action of an external force and can restore to the original state when the external force disappears. The deformation of the elastic material is reversible, that is, the material can restore to the original state when the external force disappears. In this way, the first part 310 can have a certain elasticity, so that the first part 310 can be tightly pressed between the heat dissipation device 200 and the heat generating component 110, ensuring that the first part 310 can be tightly attached to the heat dissipation device 200 and the heat generating component 110, thereby further ensuring the sealing of the heat dissipation medium 312 and effectively improving the long-term reliability of the computing device.

[0067] In an embodiment, the side surface of the anti-washing sheet 300 facing the heat generating component 110 is provided with a first adhesive, and the anti-washing sheet 300 is bonded to the heat generating component 110 through the first adhesive.

[0068] In one example, the side surface of the anti-washing sheet 300 facing the heat generating component 110 is provided with a first adhesive, and the side surface of the anti-washing sheet 300 facing the heat dissipation device 200 is not provided with an adhesive, at this time the anti-washing sheet 300 is single-sided adhesive. When processing, the first part 310 can be connected to the heat generating component 110 first, and then the heat dissipation medium 312 is directly filled in the heat dissipation hole 311. Finally, the heat dissipation device 200 is installed on the circuit board 100, for example, the heat dissipation device 200 can be connected to the circuit board 100 through the first fastener.

[0069] In this example, the anti-washing sheet 300 is connected to the heat generating component 110, the heat dissipation medium 312 is directly filled in the heat dissipation hole 311, and the heat dissipation device 200 is connected to the circuit board 100 through the first fastener. The processing method of this example is simple, the first part 310 of the anti-washing sheet does not need to be connected to the heat dissipation device 200, and the heat dissipation medium 312 does not need to be coated on the heat dissipation device 200, which can reduce the installation precision requirement of the heat dissipation device 200 and improve the installation efficiency of the heat dissipation assembly 10.

[0070] In another example, the side surface of the anti-washing sheet 300 facing the heat generating component 110 is provided with a first adhesive, and the side surface of the anti-washing sheet 300 facing the heat dissipation device 200 is not provided with an adhesive, at this time the anti-washing sheet 300 is still single-sided adhesive. When processing, the first part 310 can be connected to the heat generating component 110 first, and then the heat dissipation medium 312 is filled in the heat dissipation hole 311 through a first mesh structure such as a steel mesh. Finally, the heat dissipation device 200 is installed on the circuit board 100, for example, the heat dissipation device 200 can be connected to the circuit board 100 through the second fastener.

[0071] In the present example, the anti-washing sheet 300 is connected to the heat-generating component 110, the heat dissipation medium 312 is filled in the heat dissipation hole 311 through the first mesh structure, and the heat sink 200 is connected to the circuit board 100 through the second fastener. The difference from the above example is that the present example fills the heat dissipation medium 312 in the heat dissipation hole 311 through the first mesh structure. In the case where the heat-generating component 110 and the first part 310 are both multiple, the heat dissipation medium 312 can be quickly filled in multiple heat dissipation holes 311 through the first mesh structure, thereby improving the filling speed of the heat dissipation medium 312 and further improving the processing efficiency of the heat dissipation assembly 10. The above-mentioned first mesh structure can be a silk screen printing process for filling the heat dissipation medium 312 in the position corresponding to the heat dissipation hole 311.

[0072] In another example, the side surface of the anti-washing sheet 300 facing the heat-generating component 110 is provided with a first adhesive, and the side surface of the anti-washing sheet 300 facing the heat sink 200 is not provided with an adhesive, at this time the anti-washing sheet 300 is still single-sided adhesive. During processing, the first part 310 can be connected to the heat-generating component 110, and the heat dissipation medium 312 is coated on the side of the heat sink 200 facing the circuit board 100. Finally, the heat sink 200 coated with the heat dissipation medium 312 is installed on the circuit board 100, for example: the heat sink 200 coated with the heat dissipation medium 312 can be connected to the circuit board 100 through the third fastener, so that the heat dissipation medium 312 is filled in the heat dissipation hole 311.

[0073] In the present example, the anti-washing sheet 300 is connected to the heat-generating component 110, the heat dissipation medium 312 is coated on the side of the heat sink 200 facing the circuit board 100, and the heat sink 200 coated with the heat dissipation medium 312 is connected to the circuit board 100 through the third fastener, so that the heat dissipation medium 312 is filled in the heat dissipation hole 311. Among them, the heat dissipation medium 312 can be directly coated on the heat sink 200; or the heat dissipation medium 312 can be coated on the heat sink 200 through the second mesh structure. The above-mentioned second mesh structure can be a silk screen printing process for coating the heat dissipation medium 312 on the heat sink 200 corresponding to the position of the heat dissipation hole 311.

[0074] In one embodiment, the side surface of the anti-washing sheet 300 facing the heat sink 200 is provided with a second adhesive, and the anti-washing sheet 300 is adhered to the heat sink 200 through the second adhesive.

[0075] In one example, the anti-washing sheet 300 is provided with the second adhesive on the side surface facing the heat sink 200, and the side surface of the anti-washing sheet 300 facing the heat-generating component 110 is not provided with the adhesive, that is, the anti-washing sheet 300 is single-sided adhesive. During processing, the anti-washing sheet 300 can be first connected to the heat sink 200, and then the heat dissipation medium 312 is directly filled in the heat dissipation hole 311. Finally, the heat sink 200 connected to the anti-washing sheet 300 is connected to the circuit board 100, for example, the heat sink 200 can be connected to the circuit board 100 by the fourth fastener.

[0076] In this example, the anti-washing sheet 300 is connected to the heat sink 200, the heat dissipation medium 312 is directly filled in the heat dissipation hole 311, and the heat sink 200 connected to the anti-washing sheet 300 is connected to the circuit board 100 by the fourth fastener. Thus, the adhesion of the anti-washing sheet 300 and the coating of the heat dissipation medium 312 can be completed at the end of the heat sink 200, ensuring that the heat dissipation medium 312 can be filled in the heat dissipation hole 311, thereby improving the processing efficiency of the heat dissipation assembly 10.

[0077] In another example, the anti-washing sheet 300 is provided with the second adhesive on the side surface facing the heat sink 200, and the side surface of the anti-washing sheet 300 facing the heat-generating component 110 is not provided with the adhesive, that is, the anti-washing sheet 300 is still single-sided adhesive. During processing, the anti-washing sheet 300 can be first connected to the heat sink 200, and then the heat dissipation medium 312 is filled in the heat dissipation hole 311 by the third mesh structure. Finally, the heat sink 200 connected to the anti-washing sheet 300 is connected to the circuit board 100, for example, the heat sink 200 can be connected to the circuit board 100 by the fifth fastener.

[0078] In this example, the anti-washing sheet 300 is connected to the heat sink 200, the heat dissipation medium 312 is filled in the heat dissipation hole 311 by the third mesh structure, and the heat sink 200 connected to the anti-washing sheet 300 is connected to the circuit board 100 by the fifth fastener. Thus, in the case where the heat-generating component 110 and the first part 310 are both multiple, the heat dissipation medium 312 can be quickly filled in multiple heat dissipation holes 311 by the third mesh structure, thereby improving the filling speed of the heat dissipation medium 312, and further improving the processing efficiency of the heat dissipation assembly 10. The third mesh structure mentioned above can be a silk screen printing process for coating the heat dissipation medium 312 on the heat sink 200 corresponding to the position of the heat dissipation hole 311.

[0079] In another example, the side of the anti-washout sheet 300 facing the heat sink 200 is provided with a second adhesive, and the side of the anti-washout sheet 300 facing the heat-generating component 110 is not provided with an adhesive, so that the anti-washout sheet 300 is still single-sidedly adhesive. During processing, the anti-washout sheet 300 can be connected to the heat sink 200, and the heat-dissipating medium 312 is coated on the side of the heat-generating component 110 facing the heat sink 200. Finally, the heat sink 200 connected with the anti-washout sheet 300 is mounted on the circuit board 100, for example, the heat sink 200 can be connected to the circuit board 100 by the sixth fastener.

[0080] In this example, the anti-washout sheet 300 is connected to the heat sink 200, the heat-dissipating medium 312 is coated on the side of the heat-generating component 110 facing the heat sink 200, and the heat sink 200 connected with the anti-washout sheet 300 is connected to the circuit board 100 by the sixth fastener, so that the heat-dissipating medium 312 fills the heat-dissipating hole 311. Among them, the heat-dissipating medium 312 is directly coated on the heat-generating component 110; or the heat-dissipating medium 312 is coated on the heat-generating component 110 through a fourth mesh structure. The fourth mesh structure mentioned above can be a silk screen printing process, which coats the heat-dissipating medium 312 on the heat-generating component 110 corresponding to the position of the heat-dissipating hole 311. Alternatively, the first fastener, the second fastener, the third fastener, the fourth fastener, the fifth fastener, and the sixth fastener can be screws, but are not limited thereto.

[0081] In one embodiment, the side of the anti-washout sheet 300 facing the heat-generating component 110 is provided with a first adhesive, and the side of the anti-washout sheet 300 facing the heat sink 200 is provided with a second adhesive. The side of the anti-washout sheet 300 facing the heat-generating component 110 is adhered to the heat-generating component 110 by the first adhesive, and the side of the anti-washout sheet 300 facing the heat sink 200 is adhered to the heat sink 200 by the second adhesive.

[0082] For example, the side of the anti-washout sheet 300 facing the heat-generating component 110 can be provided with a first film, and the first adhesive is located between the anti-washout sheet 300 and the first film. The side of the anti-washout sheet 300 facing the heat sink 200 can be provided with a second film, and the second adhesive is located between the anti-washout sheet 300 and the second film. During processing, the second film can be peeled off first, and the anti-washout sheet 300 is adhered to the heat sink 200 by the second adhesive, and then the heat-dissipating medium 312 is filled in the heat-dissipating hole 311. Finally, the first film is peeled off, and the anti-washout sheet 300 is adhered to the heat-generating component 110 by the first adhesive.

[0083] In the embodiment, the anti-washing sheet 300 is double-sided adhesive, so that the connection between the anti-washing sheet 300 and the heat-generating component 110 and between the anti-washing sheet 300 and the heat sink 200 is more reliable, further ensuring the sealing performance of the heat dissipation medium 312, so that the heat dissipation medium 312 can be enclosed between the anti-washing sheet 300, the heat sink 200 and the heat-generating component 110, avoiding the erosion and dissipation of the heat dissipation medium 312 under the condition of long-term immersion.

[0084] In an embodiment, FIG. 6 shows a schematic diagram of a circuit board according to an embodiment of the present application, a plurality of heat-generating components 110 are connected in parallel to form a parallel component group 120, a plurality of first parts 310 are connected through a second part 320 to form a parallel anti-washing sheet group 330, as shown in FIG. 7, and the parallel anti-washing sheet group 330 is arranged corresponding to the parallel component group 120.

[0085] In the embodiment, the heat-generating components 110 on the circuit board 100 can be multiple, and the multiple heat-generating components 110 can be arranged in an array on the circuit board 100, wherein multiple heat-generating components 110 in the same row or column and adjacent to each other can be connected in parallel to form a parallel component group 120, and then multiple parallel component groups 120 are connected in series or in parallel to complete the electrical connection of all heat-generating components 110 for work. The parallel anti-washing sheet group 330 can be arranged for the parallel component group 120, and multiple first parts 310 are connected through a second part 320, so that multiple parallel heat-generating components 110 can be directly covered as a whole, and the sealing of the heat dissipation medium 312 can be achieved. By arranging the second part 320, the multiple first parts 310 are connected together, avoiding the time-consuming installation of a single first part 310 corresponding to a single heat-generating component 110, and increasing the structural stability of the entire anti-washing sheet 300.

[0086] Multiple parallel component groups 120 can be connected in series or in parallel, and a single parallel anti-washing sheet group 330 can be arranged corresponding to multiple parallel component groups 120.

[0087] In an embodiment, FIG. 6 shows a schematic diagram of a circuit board according to an embodiment of the present application, a plurality of heat-generating components 110 are connected in series to form a series component group 130, a plurality of first parts 310 are connected through a second part 320 to form a series anti-washing sheet group 340, as shown in FIG. 7, and the series anti-washing sheet group 340 is arranged corresponding to the series component group 130.

[0088] In this embodiment, the heat generating components 110 on the circuit board 100 can be multiple, multiple heat generating components 110 can be arranged in an array on the circuit board 100, wherein multiple heat generating components 110 in the same row or column and adjacent can be connected in series to form a series device group 130, and then multiple series device groups 130 are connected in series or parallel to complete the electrical connection of all heat generating components 110 to work. The series device group 130 can be provided with a series of anti-washing piece groups 340, and the multiple first parts 310 are connected by the second part 320, so that the multiple series of heat generating components 110 can be directly covered as a whole, and the sealing of the heat dissipation medium 312 is realized. By providing the second part 320, the multiple first parts 310 are connected together, avoiding the time-consuming installation of a single first part 310 corresponding to a single heat generating component 110, while increasing the structural stability of the entire anti-washing piece 300.

[0089] Multiple series device groups 130 can be connected in series or parallel, and a single series anti-washing piece group 340 can be provided for multiple series device groups 130.

[0090] Of course, in another embodiment, the heat generating components 110 on the circuit board 100 can be multiple, in order to maintain overall consistency, the corresponding multiple first parts 310 connected by the second part 320 can form a whole, and the anti-washing piece 300 formed in this way can cover all the heat generating components 110. After positioning the anti-washing piece 300 relative to the circuit board 100 or the heat sink 200, all the first parts 310 are provided corresponding to the heat generating components 110, reducing the installation time.

[0091] Exemplarily, the second part 320 and the first part 310 can be an integral structure. The integral structure facilitates the processing of the anti-washing piece 300, and the integral anti-washing piece 300 can be directly produced corresponding to the parallel anti-washing piece group 330 or the series anti-washing piece group 330 or all the heat generating components 110.

[0092] Exemplarily, as shown in FIG. 8, the second part 320 is connected with the heat sink 200. The second part 320 is integrated with the first part 310, the first part 310 is connected between the heat-generating component 110 and the heat sink 200, and the heat sink 200 has a spacing from the circuit board 100. The second part 320 can be connected with the heat sink 200. The side of the first part 310 and the second part 320 facing the heat sink 200 can be provided with a second film. The second adhesive is located between the first part 310 and the second film. During processing, the second film is peeled off. The connection position relationship between the anti-washing sheet 300 and the heat sink 200 is quickly located through the positioning structure. The purpose is to align the heat dissipation hole 311 with the heat-generating component 110 after final installation. Then the first part 310 and the second part 320 are bonded to the heat sink 200 through the second adhesive. Then the heat dissipation medium 312 is filled in the heat dissipation hole 311. Finally, the heat sink 200 is connected with the circuit board 100 by using the fastener.

[0093] Exemplarily, the thickness of the second part 320 is equal to the thickness of the first part 310. The second part 320 is integrated with the first part 310. In order to facilitate processing, the second part 320 is equal in thickness to the first part 310. Of course, the thickness of the second part 320 can be greater than the thickness of the first part 310. In this way, the structural strength of the second part 320 can be enhanced. However, the thickness of the second part 320 extends to the surface of the circuit board 100. Of course, the thickness of the second part 320 can be less than the thickness of the first part 310. At this time, the second part 320 only needs to ensure that the adjacent first part 310 can be connected together.

[0094] Exemplarily, as shown in FIG. 5, the second part 320 can be formed with a fastener avoiding hole 321 and / or a device avoiding hole 322 for avoiding the fastener and / or other devices on the circuit board 100.

[0095] Exemplarily, the two side surfaces of the anti-washing sheet 300 can be not provided with adhesive. At this time, the first part 310 of the anti-washing sheet 300 can be pressed between the heat sink 200 and the heat-generating component 110 through the connection of the heat sink 200 and the circuit board 100.

[0096] In an embodiment, the second part 320 can be provided with a positioning structure.

[0097] Exemplarily, the first portion 310 and the second portion 320 of the anti-washing sheet 300 can be processed by sheet metal die machining, and have high machining precision. The positioning structure on the second portion 320 can be a positioning hole, and the number of the positioning holes is multiple. In the case of connecting the anti-washing sheet 300 and the heat sink 200, a jig can be used to position the heat sink 200 / circuit board 100 and the anti-washing sheet 300. The jig can be provided with multiple positioning pins corresponding to the multiple positioning holes one by one, and the precise positioning of the heat sink 200 / circuit board 100 and the anti-washing sheet 300 can be realized through the cooperation of the positioning pins and the corresponding positioning holes, so that the first portion 310 and the second portion 320 of the anti-washing sheet 300 can be quickly bonded to the heat-generating component 110 on the circuit board 100 or the heat sink 200.

[0098] In the embodiment, by providing the positioning structure on the second portion 320, the rapid installation of the anti-washing sheet 300 can be realized, so that the installation efficiency of the entire installation assembly can be further improved.

[0099] In an implementation, the heat sink 200 includes a heat dissipation substrate 210 and multiple heat dissipation fins 220 arranged at intervals, the first portion 310 is located between the heat-generating component 110 and the heat dissipation substrate 210, and the multiple heat dissipation fins 220 are arranged on a side of the heat dissipation substrate 210 away from the first portion 310.

[0100] Exemplarily, a liquid flow channel is formed between two adjacent heat dissipation fins 220. In the case that the heat dissipation assembly 10 is applied to a computing device, the heat dissipation assembly 10 is located in a housing of the computing device. The top wall and the bottom wall of the housing can be provided with liquid flow ports. The arrangement direction of the top wall of the housing and the bottom wall of the housing can be consistent with the extension direction of the heat dissipation fins 220, so that the liquid flow ports on the top wall of the housing, the liquid flow channel, and the liquid flow ports on the bottom wall of the housing together define a cooling liquid flow channel. The cooling liquid can flow upward along the cooling liquid flow channel and take away the heat generated by the heat-generating component 110 during operation. After the cooling liquid flows out of the liquid flow ports on the top wall of the housing, it can flow to both sides and fall back. The side surface of the heat dissipation substrate 210 facing the circuit board 100 can be provided with a boss. The first portion 310 of the anti-washing sheet 300 can be pressed between the boss and the heat-generating component 110.

[0101] According to the computing device of the second aspect of the embodiment of the present application, the heat dissipation assembly 10 according to any of the above-mentioned embodiments of the present application is included.

[0102] Exemplarily, the computing device can further include a housing and a power module. The housing can be provided with a power module accommodating region and a heat dissipation component accommodating region. The power module is arranged in the power module accommodating region. The heat dissipation component 10 is arranged in the heat dissipation component accommodating region. The number of heat dissipation components 10 can be multiple. The multiple heat dissipation components 10 can be arranged on one side of the power module, or can be distributed on both sides of the power module. In the case where the multiple heat dissipation components 10 are distributed on both sides of the power module, the number of heat dissipation components 10 on both sides of the power module can be equal or not equal. The multiple heat dissipation components 10 can also be symmetrically arranged about the power module.

[0103] According to the computing device of the embodiment of the present application, by adopting the heat dissipation component 10 described above, the first part 310 of the anti-washing piece 300 can effectively protect the heat dissipation medium 312. In the case where the heat dissipation component 10 is immersed in the cooling liquid, the first part 310 can isolate the heat dissipation medium 312 from the cooling liquid to a certain extent, so as to seal the heat dissipation medium 312, thereby avoiding the heat dissipation medium 312 from being washed and dissipated under the condition of long-term immersion, ensuring the heat dissipation effect, and improving the operation reliability of the computing device.

[0104] The heat dissipation component 10 and other configurations of the computing device of the above embodiment can adopt various technical solutions known to those skilled in the art at present and in the future, which will not be described in detail here.

[0105] In the description of the present specification, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0106] In addition, the terms "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first" and "second" can explicitly or implicitly include one or more of the features.

[0107] In the present application, unless specifically defined otherwise, the terms "mounting", "connection", "connecting", "fixed", and the like should be construed broadly and do not necessarily mean fixedly connected, but can also mean detachably connected, or integrated; can be mechanical connection, or electrical connection, or communication; can be direct connection, or indirect connection through an intermediate medium; can be the internal communication of two elements, or the interaction relationship between two elements. For those skilled in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0108] In the present application, unless specifically defined otherwise, the first feature "on" or "under" the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "on", "above" and "over" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "under", "below" and "under" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0109] The above disclosure provides many different implementations or examples for implementing the different structures of the present application. In order to simplify the disclosure of the present application, the components and arrangements of the specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeatedly refer to numbers and / or letters in different examples, and such repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or arrangements discussed.

[0110] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto, and any skilled person in the art can easily think of various changes or replacements within the technical scope disclosed by the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A heat dissipating assembly, characterized by, The application relates to a heat-dissipating device for a circuit board. The heat-dissipating device comprises: a circuit board, on which a plurality of heat-generating components are arranged; a heat sink arranged on the side of the heat-generating components away from the circuit board; 2. The heat dissipation assembly of claim 1, wherein, a flushing-preventing sheet comprising a plurality of first parts arranged between the heat-generating components and the heat sink, each of the first parts corresponding to one of the heat-generating components, the first part defining a heat-dissipating hole in which a heat-dissipating medium is arranged, and a second part arranged on the outer periphery of the first part, the second part being used to connect adjacent first parts to each other.

3. The heat dissipation assembly of claim 1, wherein, The inner edge of the first part is arranged at a distance from the edge of the heat-generating component.

4. The heat dissipation assembly of claim 1, wherein, The maximum size of the heat-dissipating hole in a first direction is smaller than the size of the heat-generating component in the first direction, and the maximum size of the heat-dissipating hole in a second direction is smaller than the size of the heat-generating component in the second direction; wherein the first direction is perpendicular to the second direction, and both the first direction and the second direction are parallel to the surface of the circuit board.

5. The heat dissipation assembly of claim 1, wherein, The thickness of the first part is smaller than the thickness of the heat-generating component, and the thickness direction is perpendicular to the surface of the circuit board.

6. The heat dissipation assembly of claim 1, wherein, The first part is made of an elastic material.

7. The heat dissipating assembly of claim 6, wherein, The side surface of the flushing-preventing sheet facing the heat-generating component is provided with a first adhesive, and the flushing-preventing sheet is adhered to the heat-generating component through the first adhesive.

8. The heat dissipating assembly of claim 1, wherein, The side surface of the flushing-preventing sheet facing the heat-generating component is provided with a first film, and the first adhesive is arranged between the flushing-preventing sheet and the first film.

9. The heat dissipating assembly of claim 8, wherein, The side surface of the flushing-preventing sheet facing the heat sink is provided with a second adhesive, and the flushing-preventing sheet is adhered to the heat sink through the second adhesive.

10. The heat dissipating assembly of claim 1, wherein, The side surface of the flushing-preventing sheet facing the heat sink is provided with a second film, and the second adhesive is arranged between the flushing-preventing sheet and the second film.

11. The heat dissipating assembly of claim 1, wherein, The flushing-preventing sheet is connected to the heat-generating component, the heat-dissipating medium is directly filled in the heat-dissipating hole, and the heat sink is connected to the circuit board through a first fastener.

12. The heat dissipating assembly of claim 1, wherein, The flushing-preventing sheet is connected to the heat-generating component, the heat-dissipating medium is filled in the heat-dissipating hole through a first mesh structure, and the heat sink is connected to the circuit board through a second fastener.

13. The heat dissipating assembly of claim 12, wherein, The flushing-preventing sheet is connected to the heat-generating component, the heat-dissipating medium is coated on the side of the heat sink facing the circuit board, the heat sink coated with the heat-dissipating medium is connected to the circuit board through a third fastener, so that the heat-dissipating medium is filled in the heat-dissipating hole.

14. The heat dissipating assembly of claim 1, wherein, The heat-dissipating medium is directly coated on the heat sink, or the heat-dissipating medium is coated on the heat sink through a second mesh structure.

15. The heat dissipating assembly of claim 1, wherein, The flushing-preventing sheet is connected to the heat sink, the heat-dissipating medium is directly filled in the heat-dissipating hole, and the heat sink connected to the flushing-preventing sheet is connected to the circuit board through a fourth fastener. The flushing-preventing sheet is connected to the heat sink, the heat-dissipating medium is filled in the heat-dissipating hole through a third mesh structure, and the heat sink connected to the flushing-preventing sheet is connected to the circuit board through a fifth fastener.

16. The heat dissipating assembly of claim 1, wherein, The anti-washing piece is connected to the heat sink, the heat dissipation medium is coated on the side of the heat-generating component facing the heat sink, and the heat sink connected to the anti-washing piece is connected to the circuit board through the sixth fastener, so that the heat dissipation medium is filled in the heat dissipation hole.

17. The heat dissipating assembly of claim 16, wherein, The heat dissipation medium is directly coated on the heat-generating component; or the heat dissipation medium is coated on the heat-generating component through the fourth mesh structure.

18. The heat dissipating assembly of claim 1, wherein, A plurality of the heat-generating components are connected in parallel to form a parallel component group, a plurality of the first parts are connected through the second parts to form a parallel anti-washing piece group, and the parallel anti-washing piece group is arranged corresponding to the parallel component group.

19. The heat dissipating assembly of claim 1, wherein, A plurality of the heat-generating components are connected in series to form a series component group, a plurality of the first parts are connected through the second parts to form a series anti-washing piece group, and the series anti-washing piece group is arranged corresponding to the series component group.

20. The heat dissipating assembly of claim 1, wherein, The second part is an integral structure with the first part, and / or the thickness of the second part is equal to the thickness of the first part.

21. The heat dissipating assembly of claim 1, wherein, The second part is provided with a positioning structure corresponding to the heat sink and / or the circuit board, and / or the second part is formed with a fastener avoiding hole and / or a component avoiding hole.

22. The heat dissipating assembly of claim 1, wherein, The anti-washing piece is made of oil-resistant material.

23. The heat dissipating assembly of any one of claims 1-22, wherein, The heat sink comprises a heat dissipation base plate and a plurality of heat dissipation fins arranged at intervals, the anti-washing piece is located between the heat-generating component and the heat dissipation base plate, and the plurality of heat dissipation fins are arranged on the side of the heat dissipation base plate away from the anti-washing piece.

24. A computing device, comprising: The heat dissipation assembly comprises the heat dissipation assembly according to any one of claims 1-23.

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