Package and method for manufacturing package

Abstract

The present invention improves bonding strength between a sealing material and a rib for supporting a transparent member on a chip.　The package comprises: a chip; a transparent member positioned over the chip so as to be separated from the chip; and a rib positioned from a lower end to a side surface of the transparent member and supporting the transparent member on the chip. The package may further comprise: a substrate on which the chip is mounted; and a sealing material positioned around the chip on the substrate. The sealing material may be a mold material. The planar size of the transparent member may be smaller than the planar size of the chip.

Description

Package and method for manufacturing the package

[0001] The present technology relates to a package and a method for manufacturing the package. More specifically, the present technology relates to a package in which ribs for supporting a transparent member are provided on an optical element, and a method for manufacturing the package.

[0002] There is a package that houses an imaging element and has a transparent glass plate disposed on the imaging element so that external light is incident on the imaging element through the transparent glass plate. For example, a technology is disclosed that provides a first transparent member disposed on a light receiving surface, a transparent resin disposed on the outer periphery of the first transparent member, and a second transparent member disposed on the transparent resin so as to face the first transparent member (see, for example, Patent Document 1).

[0003] Japanese Patent Application Laid-Open No. 2006-5029

[0004] However, in the above-mentioned conventional technology, the rib that supports the first transparent member on the imaging element is located only between the imaging element and the first transparent member, which means that the bonding strength between the rib and the sealing material is insufficient, and there is a risk that the rib will peel off from the sealing material.

[0005] This technology was developed in light of these circumstances, and aims to improve the bonding strength between the rib that supports the transparent member on the chip and the sealing material.

[0006] The present technology has been made to solve the above-mentioned problems, and the first side of the package includes a chip, a transparent member positioned on the chip so as to be spaced apart from the chip, and a rib positioned from a lower end of the transparent member to a side surface and supporting the transparent member on the chip, thereby providing an effect that a bonding surface with the rib is formed from the lower end of the transparent member to the side surface.

[0007] In addition, the first aspect may further include a substrate on which the chip is mounted, and a sealing material positioned around the chip on the substrate, thereby providing an effect that the bonding surface between the rib and the sealing material is formed from the lower end of the transparent member to the side surface.

[0008] In the first aspect, the material of the sealing material may be a molding material, thereby providing an effect that the sealing materials for a plurality of packages can be formed at once.

[0009] In addition, in the first aspect, a bonding wire may be further provided, the bonding wire being arranged outside the rib and connecting the substrate and the chip, thereby providing the effect of connecting the bonding wire to the chip while reducing the height of the rib below the transparent member.

[0010] In the first aspect, the bottom position of the transparent member may be lower than the top position of the bonding wire, thereby reducing the height of the rib below the transparent member.

[0011] In addition, in the first aspect, the device may further include a die bond material provided in a portion between the chip and the substrate, and the molding material may be positioned around the die bond material between the chip and the substrate, thereby reducing the moisture absorption of the underfill under the chip and bonding the chip and the substrate via the die bond material.

[0012] In the first aspect, the planar size of the transparent member may be smaller than the planar size of the chip, thereby reducing the cost of the transparent member and the fragility of the transparent member.

[0013] In the first aspect, the rib may be formed from the upper end to the side of the transparent member, thereby providing the effect of supporting the transparent member on the chip and protecting the edge of the transparent member.

[0014] In the first aspect, the thickness of the rib between the chip and the transparent member may be 20 μm or more and 100 μm or less, thereby reducing the height of the rib and holding the transparent member on the chip at a distance from the chip.

[0015] In the first aspect, the material of the rib may be an inkjet material, which provides the effect of ensuring dimensional accuracy of the rib while forming the rib from the lower end to the side surface of the transparent member.

[0016] In the first aspect, the material of the rib on the bottom surface of the transparent member may be a solder material, thereby ensuring the rigidity of the rib between the chip and the transparent member.

[0017] In addition, in the first aspect, the rib may have folds formed on at least one of the inner and outer peripheral surfaces, thereby increasing the bonding area of ​​the rib and reducing stray light around the rib.

[0018] The second side surface may also be a package including a chip, a transparent member positioned above the chip and spaced apart from the chip, and a rib formed from the lower end to the upper end of the transparent member to support the transparent member on the chip, thereby providing the effect of supporting the transparent member on the chip while protecting the edge of the transparent member.

[0019] In the second aspect, the material of the rib may be a light-shielding material, which provides the effect of protecting the edge of the transparent member while shielding the periphery of the chip from light.

[0020] A third aspect of the present invention is a method for manufacturing a package, comprising the steps of die-bonding a chip onto a substrate, wire-bonding the chip, placing a transparent member on the chip via a rib, and forming a sealant around the rib to cover the wire-bonded bonding wires, the rib being formed from the lower end to the side of the transparent member. This improves the bonding strength between the sealant and the rib that supports the chip on the substrate, while also forming the sealant around the rib.

[0021] In the third aspect, the ribs may be formed by an inkjet method, which ensures dimensional accuracy of the ribs and allows the ribs to be formed from the lower end of the transparent member to the side surfaces.

[0022] FIG. 1 is a diagram illustrating an example of a configuration of a package according to a first embodiment. FIG. 2 is a cross-sectional view illustrating an example of a manufacturing method of a package according to the first embodiment. FIG. 3 is a cross-sectional view illustrating an example of a manufacturing method of a package according to the first embodiment. FIG. 4 is a plan view illustrating another example of a configuration of the package according to the first embodiment. FIG. 5 is a cross-sectional view illustrating an example of a use of a rib according to the first embodiment as a guide. FIG. 6 is a plan view illustrating yet another example of a configuration of the package according to the first embodiment. FIG. 7 is a diagram illustrating an example of a configuration of a package according to a third embodiment. FIG. 8 is a diagram illustrating an example of a configuration of a package according to a fourth embodiment. FIG. 9 is a diagram illustrating an example of a configuration of a package according to a fifth embodiment. FIG. 10 is a diagram illustrating an example of a configuration of a package according to a sixth embodiment. FIG. 11 is a cross-sectional view illustrating an example of a configuration of a package according to a seventh embodiment. FIG. 12 is a plan view illustrating an example of a configuration of a package according to the seventh embodiment. FIG. 13 is a diagram illustrating an example of a configuration of a package according to an eighth embodiment. FIG. 14 is a cross-sectional view illustrating an example of a manufacturing method of a package according to the eighth embodiment. FIG. 15 is a diagram illustrating an example of a configuration of a package according to a ninth embodiment. FIG. 16 is a diagram illustrating an example of a configuration of a package according to a tenth embodiment. FIG. 17 is a diagram illustrating an example of a configuration of a package according to an eleventh embodiment. FIG. 18 is a diagram illustrating an example of a configuration of a package according to a twelfth embodiment. FIG. 19 is a diagram illustrating an example of a configuration of a package according to a thirteenth embodiment. It is a block diagram showing a schematic configuration example of a vehicle control system.It is an explanatory diagram showing an example of an installation position of an imaging unit.

[0023] Modes for carrying out the present technology (hereinafter referred to as embodiments) will be described below. The descriptions will be made in the following order: 1. First embodiment (an example in which ribs for supporting a transparent substrate on a chip are formed from the bottom end to the side of the transparent substrate) 2. Second embodiment (an example in which ribs for supporting a transparent substrate on a chip are formed from the bottom end to the entire side of the transparent substrate) 3. Third embodiment (an example in which ribs for supporting a transparent substrate on a chip are formed from the bottom end to the top of the transparent substrate) 4. Fourth embodiment (an example in which ribs for supporting a transparent substrate on a chip are formed from the bottom end to the entire side of the transparent substrate, and a sealant is formed around the rib so as to cover the top end of the transparent substrate) 5. Fifth embodiment (an example in which ribs for supporting a transparent substrate on a chip are formed from the bottom end to the side of the transparent substrate, and a sealant is allowed to penetrate into the outer edge of the transparent substrate between the chip and the transparent substrate) 6. Sixth embodiment (an example in which ribs for supporting a transparent substrate on a chip are formed from the bottom end to the side of the transparent substrate, and a cavity is formed in the transparent substrate) 7. 7. Seventh Embodiment (an example in which a die-bonding material is provided in a portion between the chip and the substrate, and a sealing material is allowed to penetrate around the die-bonding material between the chip and the mounting substrate) 8. Eighth Embodiment (an example in which ribs supporting a transparent substrate on a chip are formed from the lower end to the entire side surface of the transparent substrate, and the ribs below the transparent substrate are formed with a solder layer) 9. Ninth Embodiment (an example in which ribs supporting a transparent substrate on a chip are formed from the four corners of the lower end of the transparent substrate to the entire side surface) 10. Tenth Embodiment (an example in which ribs supporting a transparent substrate on a chip are formed from the lower end of the transparent substrate to the side surface of the transparent substrate and the side surface of the chip) 11. Eleventh Embodiment (an example in which ribs supporting a transparent substrate on a face-down mounted chip are formed from the lower end to the side surface of the transparent substrate) 12. Twelfth Embodiment (an example in which ribs supporting a transparent substrate on a face-down mounted chip are formed from the lower end to the side surface of the transparent substrate, and an external terminal can be connected to the chip via a through electrode) 13. Thirteenth Embodiment (an example in which posts are arranged between pad electrodes formed on a chip) 14. Mobile application example

[0024] 1. First Embodiment Fig. 1 is a diagram showing an example of the configuration of a package according to a first embodiment. Note that "a" in the figure is a cross-sectional view showing the example of the configuration of the package 100, and "b" in the figure is a plan view showing the example of the configuration of the package 100. "a" in the figure shows the example of the configuration cut along line A1-A2 in "b" in the figure. Furthermore, the drawings used in the following description may differ in scale and shape from the actual structure to make each configuration easier to understand.

[0025] In the figure, the package 100 includes a mounting substrate 120, a chip 111, bonding wires 116, ribs 124, a sealing material 125, and a transparent substrate 126. In this case, the package 100 can form a hollow package in which the chip 111 is mounted. The mounting substrate 120 is an example of a substrate as defined in the claims. The transparent substrate 126 is an example of a transparent member as defined in the claims.

[0026] The chip 111 is mounted on the mounting substrate 120. The mounting substrate 120 may be a ball grid array (BGA), a pin grid array (PGA), or a land grid array (LGA). The base material of the mounting substrate 120 may be, for example, ceramic or resin. Bonding pads 122 and land electrodes 123 are formed on the mounting substrate 120. Wiring 121 and vias may also be formed on the mounting substrate 120. The bonding pads 122 are arranged on the front surface of the mounting substrate 120. In this case, the bonding pads 122 can be arranged along the four sides of the mounting substrate 120. A bonding wire 116 can be connected to the bonding pads 122. The land electrodes 123 are arranged on the back surface of the mounting substrate 120. An external terminal such as a solder ball 128 can be connected to the land electrodes 123.

[0027] The chip 111 is mounted face-up on the mounting substrate 120. The chip 111 can be bonded to the mounting substrate 120 via a die bond material 127. The die bond material 127 may be a paste material such as Ag paste, a solder material such as Sn, or a die attach film. The die bond material 127 may be formed by an inkjet method. By forming the die bond material 127 by an inkjet method, it is possible to reduce the embedding of the sealing material 125 into the die bond material 127 compared to a method using a die attach film.

[0028] The chip 111 is connected to the mounting substrate 120 via bonding wires 116. At this time, pad electrodes 113 to which the bonding wires 116 are connected can be formed on the chip 111. The bonding wires 116 can be made of a metal such as Au, Cu, or Al.

[0029] A semiconductor element, an optical element, or a MEMS (Micro Electro Mechanical Systems) may be formed on the chip 111. The substrate used for the chip 111 may be a semiconductor substrate, a dielectric substrate, or an organic substrate.

[0030] The light receiving element may be an image sensor such as a CCD (Charged Coupled Device) sensor, a CMOS (Complementary Metal-Oxide Semiconductor) sensor, or an event-based vision sensor. The light received by the image sensor may be visible light, near infrared light (NIR), short wavelength infrared light (SWIR), ultraviolet light, or X-rays. The optical element may be a light receiving element such as a PD (Photo Diode), or a light emitting element such as an LD (Laser Diode), an LED (Light Emitting Diode), or a VCSEL (Vertical Cavity Surface Emitting Laser). The optical element may be an optical switch or a DMD (Digital Micromirror Device). The optical element may be a display element such as a liquid crystal element or an organic EL (Electro Luminescence) element. The material used for the optical element may be a semiconductor such as Si, GaAs, or InGaAs, or LiNbO ３ , or may be a dielectric material such as glass or transparent resin.

[0031] The semiconductor element may include an IC (Integrated Circuit), a transistor, a resistor, a capacitor, etc. The semiconductor element may include a memory, a processor, a signal processing circuit, a data processing circuit, or an interface circuit. The semiconductor element may include a hardware circuit such as an FPGA (Field-Programmable Gate Array) or an ASIC (Application Specific Integrated Circuit). Materials used for the semiconductor element may include Si, GaAs, SiC, GaN, InGaAs, InP, InGaAsP, etc.

[0032] For example, a CMOS image sensor can be formed on the chip 111. In this case, a light receiving region 112 is provided on the chip 111. In the light receiving region 112, pixels and pixel transistors are arranged in a matrix along the row and column directions. Photodiodes or SPADs (Single Photon Avalanche Diodes) may be formed on the pixels. A color filter 114 is formed on the light receiving region 112 for each pixel. An on-chip lens 115 is formed on the color filter 114 for each pixel. The color filter 114 and the on-chip lens 115 are made of a material such as SiO ２ An insulating film such as SiN or SiCN, or a transparent resin such as acrylic or polycarbonate can be used. The color filter 114 may contain a pigment. The color filter 114 may have, for example, a Bayer array or a quad-Bayer array. The color filter 114 may include an RGB filter, a complementary color filter, or a white filter. A lens, a color splitter, or a deflector made of a metasurface may be formed on the light receiving region 112.

[0033] The transparent substrate 126 is placed on the chip 111. At this time, the transparent substrate 126 is supported on the chip 111 via the ribs 124. The planar size of the transparent substrate 126 may be smaller than the planar size of the chip 111. This makes it possible to reduce the cost of the transparent substrate 126 while reducing the fragility of the transparent substrate 126. At this time, the transparent substrate 126 can be placed inside the bonding wires 116. The transparent substrate 126 may be a glass substrate, a quartz substrate, or a transparent resin substrate such as acrylic or polycarbonate. The transparent substrate 126 is made of Al, depending on the wavelength of light received by the chip 111. ２ O ３ , CaF ２ , MgF ２ Alternatively, LiF or the like may be used.

[0034] The ribs 124 support the transparent substrate 126 on the chip 111. The ribs 124 may be positioned from the bottom to the side of the transparent substrate 126. The ribs 124 may be integrated from the bottom to the side of the transparent substrate 126. The thickness D1 of the ribs 124 between the chip 111 and the transparent substrate 126 is preferably 20 μm to 100 μm. In this case, the bottom position of the transparent substrate 126 may be lower than the top position of the bonding wires 116. The top position of the ribs 124 on the side of the transparent substrate 126 may be lower than the position of the upper surface of the transparent substrate 126 in the height direction. In this case, the aspect ratio of the ribs 124 on the side of the transparent substrate 126 is preferably 1 or greater. The ribs 124 may be continuously disposed along the outer periphery of the chip 111. In this case, the ribs 124 may be positioned inside the bonding wires 116. The material of the ribs 124 may be an inkjet material. In this case, the ribs 124 may be made of a thermosetting resin or an ultraviolet-curing resin. For example, the ribs 124 may be made of a resin such as a siloxane-based resin, an acrylic-based resin, or an epoxy-based resin. The ribs 124 may contain an inorganic or organic filler to improve reliability. The filler may be glass. The ribs 124 may be blackened to reduce flare on the light-receiving region 112. For example, the ribs 124 may contain a black pigment such as carbon black, or a filler such as carbon fiber.

[0035] The encapsulant 125 encapsulates the bonding wires 116 on the mounting substrate 120. The encapsulant 125 can be disposed continuously along the outer periphery of the mounting substrate 120. At this time, the encapsulant 125 can be bonded to the chip 111 and the ribs 124.

[0036] The position of the upper surface of the sealing material 125 in the height direction may coincide with or be lower than the position of the upper surface of the transparent substrate 126 in the height direction. In this case, the upper surface of the sealing material 125 can be configured as a mold surface. The positions of the horizontal side surfaces of the sealing material 125 can coincide with the positions of the horizontal side surfaces of the mounting substrate 120. In this case, the horizontal side surfaces of the sealing material 125 and the mounting substrate 120 can be configured as dicing surfaces.

[0037] The sealing material 125 may be a molding resin or a potting resin. The material of the sealing material 125 may be a thermosetting resin or an ultraviolet-curing resin. For example, the material of the sealing material 125 may be a resin such as a silicone-based resin, a siloxane-based resin, an acrylic-based resin, or an epoxy-based resin. The sealing material 125 may contain an inorganic or organic filler to improve reliability. The filler material may be glass. The sealing material 125 may be blackened to reduce flare on the light-receiving region 112. For example, the sealing material 125 may contain a black pigment such as carbon black or a filler such as carbon fiber.

[0038] 2 and 3 are cross-sectional views showing an example of a method for manufacturing a package according to the first embodiment.

[0039] In FIG. 2A, a chip 111 on which a color filter 114 and an on-chip lens 115 are formed for each pixel is mounted on a mounting substrate 120.

[0040] Next, as shown in FIG. 2B, the pad electrode 113 and the bonding pad 122 are connected via the bonding wire 116 .

[0041] 2c, a part of the rib 124 is formed on the chip 111 by the inkjet method. At this time, the part of the rib 124 can be disposed at the position of the outer edge of the lower surface of the transparent substrate 126.

[0042] 2d, the transparent substrate 126 is placed on the ribs 124 on the chip 111. At this time, the position of the outer edge of the lower surface of the transparent substrate 126 can be made to correspond to the position of the ribs 124. Then, the ribs 124 on the outer edge of the lower surface of the transparent substrate 126 are hardened by heat treatment or ultraviolet irradiation, and the transparent substrate 126 is bonded to the ribs 124.

[0043] Next, as shown in Fig. 3A, a portion of the rib 124 is formed on the side surface of the transparent substrate 126 by an inkjet method. Here, to make it easier for the inkjet material to land on the side surface of the transparent substrate 126, the inkjet material may be sprayed obliquely onto the side surface of the transparent substrate 126. At this time, the rib 124 on the side surface of the transparent substrate 126 can be connected to the rib 124 on the underside of the transparent substrate 126. Then, the rib 124 on the side surface of the transparent substrate 126 is hardened by heat treatment or ultraviolet irradiation.

[0044] 3B, the mold KM is moved and pressed against the upper surface of the transparent substrate 126. The mold KM can be formed in a flat plate shape. At this time, a space KS into which molding resin can be injected can be formed between the mold KM and the mounting substrate 120.

[0045] 3c, a molding resin is injected into the space KS and cured to form the sealing material 125 on the mounting substrate 120. The molding may be performed by transfer molding or compression molding. Furthermore, a release film may be placed on the surface of the mold KM before molding, in order to facilitate peeling of the sealing material 125 from the mold KM after molding.

[0046] Next, as shown in FIG. 1, after removing the mold KM, the sealing material 125 and the mounting substrate 120 are diced to separate each package 100 into a single piece.

[0047] 2 and 3 show an example in which the ribs 124 are formed by the inkjet method, but the method for forming the ribs 124 is not necessarily limited to the inkjet method, and the ribs 124 may be formed by methods such as printing, dipping, dispensing, transfer, etc. In this case, the ribs 124 may be formed on the mounting substrate 120, or may be formed on the lower surface or side surface of the transparent substrate 126.

[0048] In addition, in the manufacturing method of Figures 2 and 3, an example is shown in which the sealing material 125 is formed based on molding, but the method of forming the sealing material 125 is not necessarily limited to molding, and the sealing material 125 may be formed by methods such as potting or dispensing.

[0049] FIG. 4 is a plan view showing another example of the configuration of the package according to the first embodiment.

[0050] 4A, the package 100 may be provided with ribs 124A instead of the ribs 124 in FIG. 1. The ribs 124A can be arranged on the side surfaces of the transparent substrate 126 at the four corners of the transparent substrate 126. In this case, the ribs 124A can be used as guides for the transparent substrate 126.

[0051] 4B, the package 100 may be provided with ribs 124B instead of the ribs 124 in FIG. 1. The ribs 124B can be disposed on the side surfaces of the transparent substrate 126, in the center of each side of the transparent substrate 126. In this case, the ribs 124B can be used as guides for the transparent substrate 126.

[0052] Fig. 5 is a cross-sectional view showing an example of use of the rib according to the first embodiment as a guide. Although Fig. 5 shows an example of use of the rib 124B shown in Fig. 4(b), the rib 124A shown in Fig. 4(a) can also be used in the same way.

[0053] 5A, after the same steps as those in FIGS. 2A and 2B, ribs 124B are formed on the mounting substrate 120 by an inkjet method. At this time, the cross section of the ribs 124B can be L-shaped. The bending position of the inner surface of the ribs 124B can be made to correspond to the boundary position between the bottom surface and the side surface of the transparent substrate 126.

[0054] 2b, the transparent substrate 126 is inserted into the inside of the rib 124B while being guided along the inner surface of the rib 124B, thereby positioning the transparent substrate 126. Thereafter, steps similar to those in FIG. 3b and FIG. 3c are carried out.

[0055] FIG. 6 is a plan view showing yet another example of the configuration of the package according to the first embodiment.

[0056] In FIG. 6A, the package 100 may be provided with a rib 124C instead of the rib 124 in FIG. 1. A rib 124C has folds HD formed on its side surface. The folds HD may be vertical, oblique, or random. In this case, the surface area of ​​the outer peripheral surface of the rib 124C can be increased, improving the adhesion between the rib 124C and the sealing material 125. Furthermore, the cushioning properties of the rib 124C can be improved, dispersing the stress applied to the transparent substrate 126 during molding. Furthermore, thermal stress during a temperature cycling test (TCT) can be alleviated, suppressing cracks in the transparent substrate 126.

[0057] In FIG. 6B, the package 100 may be provided with ribs 124D instead of the ribs 124 in FIG. 1. The arrangement density of the ribs 124D may decrease with increasing distance from the transparent substrate 126 to the outside. In order to change the arrangement density of the ribs 124D, the ribs 124D may be dispersed around the periphery of the transparent substrate 126. Here, in order to reduce the arrangement density of the ribs 124D, the granularity or spacing of the ribs 124D may be reduced. In this case, the mechanical properties of the ribs 124D can be gradually changed, which makes it possible to distribute stress applied to the transparent substrate 126 and suppress cracks in the transparent substrate 126 caused by thermal stress, etc.

[0058] 7 is a plan view showing yet another example of the package configuration according to the first embodiment, in which chip 111 and transparent substrate 126 are removed.

[0059] In FIG. 7, the package 100 may be provided with a rib 124E instead of the rib 124 in FIG. 1. A concave-convex portion TU is formed on the inner and outer peripheral surfaces of the rib 124E. The direction of the concave-convex portion TU may be vertical, oblique, or random. The angle of the tip of the concave-convex portion TU may be acute. The concave-convex portion TU may be jagged or jaggy. In this case, light incident on the rib 124E can be scattered, thereby reducing flare.

[0060] In this way, in the first embodiment described above, the ribs 124 that support the transparent substrate 126 on the chip 111 are formed from the lower end to the side surfaces of the transparent substrate 126. This increases the bonding surface area between the ribs 124 and the sealing material 125, and increases the bonding strength between the ribs 124 and the sealing material 125.

[0061] Furthermore, by making the bottom position of the transparent substrate 126 lower than the top position of the bonding wire 116, it is possible to reduce the thickness D1 of the rib 124 between the chip 111 and the transparent substrate 126. This makes it possible to reduce deformation of the rib 124 due to the clamp load when molding the sealing material 125, and to prevent particles from scattering due to damage to the rib 124 and interfacial peeling with the sealing material 125 due to springback of the rib 124 after the clamp load is removed.

[0062] 2. Second Embodiment In the first embodiment described above, the ribs 124 that support the transparent substrate 126 on the chip 111 are formed from the lower end to the side surfaces of the transparent substrate 126. In this second embodiment, the ribs that support the transparent substrate 126 on the chip 111 are formed from the lower end to the entire side surfaces of the transparent substrate 126.

[0063] 8 is a diagram showing an example of the configuration of a package according to the second embodiment. Note that "a" in the figure is a cross-sectional view showing the example of the configuration of the package 200, and "b" in the figure is a plan view showing the example of the configuration of the package 200. "a" in the figure shows the example of the configuration cut along line A1-A2 in "b" in the figure.

[0064] In the figure, this package 200 has ribs 224 instead of the ribs 124 of the first embodiment described above. Other configurations of the package 200 of the second embodiment are similar to the configurations of the package 100 of the first embodiment described above.

[0065] The ribs 224 support the transparent substrate 126 on the chip 111. The ribs 224 can be formed from the lower end to the entire side surface of the transparent substrate 126. The ribs 224 may be integrated from the lower end to the entire side surface of the transparent substrate 126. Other configurations of the ribs 224 in the second embodiment are the same as the configuration of the ribs 124 in the first embodiment described above.

[0066] In this way, in the second embodiment described above, the ribs 224 that support the transparent substrate 126 on the chip 111 are formed from the lower end to the entire side surface of the transparent substrate 126. This increases the bonding surface area between the ribs 224 and the sealing material 125, and increases the bonding strength between the ribs 224 and the sealing material 125.

[0067] 3. Third Embodiment In the first embodiment described above, the ribs 124 that support the transparent substrate 126 on the chip 111 are formed from the lower end to the side surfaces of the transparent substrate 126. In this third embodiment, the ribs that support the transparent substrate 126 on the chip 111 are formed from the lower end to the upper end of the transparent substrate 126.

[0068] 9 is a diagram showing an example of the configuration of a package according to the third embodiment. In the figure, "a" is a cross-sectional view showing the example of the configuration of the package 300, and "b" is a plan view showing the example of the configuration of the package 300. "a" in the figure shows the example of the configuration cut along the A1-A2 line in "b" in the figure.

[0069] In the figure, this package 300 includes ribs 324 and sealing material 325 instead of the ribs 124 and sealing material 125 of the first embodiment described above. The rest of the configuration of the package 300 of the third embodiment is similar to the configuration of the package 100 of the first embodiment described above.

[0070] The ribs 324 support the transparent substrate 126 on the chip 111. The ribs 324 can be formed from the lower end to the upper end of the transparent substrate 126. In this case, the ribs 324 may cover the entire side surface of the transparent substrate 126 or may cover only a portion of the side surface. The position of the upper surface of the ribs 324 in the height direction can be higher than the position of the upper surface of the transparent substrate 126 in the height direction. The ribs 324 may be integrated with the transparent substrate 126 from the lower end to the upper end. The ribs 324 may have light-blocking properties. To impart light-blocking properties to the ribs 324, black pigments such as carbon black or fillers such as carbon fiber may be added to the ribs 324. Other configurations of the ribs 324 of the third embodiment are the same as the configuration of the ribs 124 of the first embodiment described above.

[0071] The encapsulant 325 encapsulates the bonding wires 116 on the mounting substrate 120. The encapsulant 325 can be disposed continuously along the outer periphery of the mounting substrate 120. The heightwise position of the upper surface of the encapsulant 325 may coincide with or be lower than the heightwise position of the upper surfaces of the ribs 324. In this case, a molding die can be pressed against the upper surfaces of the ribs 324 to inject the molding material, thereby preventing the molding material from seeping out (mold flash) into the transparent substrate 126. The upper surface of the encapsulant 325 can be configured as a mold surface. The encapsulant 325 can be bonded to the chip 111 and the ribs 324. Other configurations of the encapsulant 325 of the third embodiment are similar to those of the encapsulant 125 of the first embodiment described above.

[0072] As described above, in the third embodiment, the ribs 324 that support the transparent substrate 126 on the chip 111 are formed from the bottom to the top of the transparent substrate 126. This protects the edges of the transparent substrate 126, making it possible to prevent chipping or cracking of the transparent substrate 126, and also increases the bonding surface between the ribs 324 and the sealing material 325, thereby increasing the bonding strength between the ribs 324 and the sealing material 325. In this case, by providing the ribs 324 with light-blocking properties, stray light incident on the light-receiving region 112 can be reduced without forming a light-blocking film on the transparent substrate 126. This makes it possible to improve the quality of images generated by the imaging device while suppressing an increase in the cost of the transparent substrate 126.

[0073] 4. Fourth Embodiment In the second embodiment described above, the ribs 224 that support the transparent substrate 126 on the chip 111 are formed from the lower end to the entire side surface of the transparent substrate 126. In this fourth embodiment, the ribs 224 that support the transparent substrate 126 on the chip 111 are formed from the lower end to the entire side surface of the transparent substrate 126, and a sealing material is formed around the ribs 224 so as to cover the upper end of the transparent substrate 126.

[0074] 10 is a diagram showing an example of the configuration of a package according to the fourth embodiment. In the figure, "a" is a cross-sectional view showing the example of the configuration of a package 400, and "b" is a plan view showing the example of the configuration of the package 400. "a" in the figure shows the example of the configuration cut along line A1-A2 in "b" in the figure.

[0075] In the figure, this package 400 includes a sealant 425 instead of the sealant 125 of the second embodiment described above. Also, this package 400 includes a stopper 424 in addition to the package 200 of the second embodiment described above. Other configurations of the package 400 of the fourth embodiment are similar to the configuration of the package 200 of the second embodiment described above.

[0076] The stopper 424 defines the position of the sealing material 425 at the upper end of the transparent substrate 126. The stopper 424 can be formed in a frame shape on the transparent substrate 126 at a position away from the side of the transparent substrate 126. In this case, the stopper 424 can be disposed in a position where it does not prevent light from entering the light receiving region 112. The material of the stopper 424 may be the same as the material of the rib 224. The stopper 424 may be formed by an inkjet method, or by a method such as printing or dispensing.

[0077] The sealing material 425 seals the bonding wires 116 on the mounting substrate 120. The sealing material 425 can be disposed continuously along the outer periphery of the mounting substrate 120. In this case, the sealing material 425 can cover the upper end of the transparent substrate 126. The sealing material 425 can be disposed on the upper surface of the transparent substrate 126, from the side surface of the transparent substrate 126 to the position of the stopper 424. The position of the upper surface of the sealing material 425 in the height direction can coincide with the position of the upper surface of the stopper 424 in the height direction. In this case, the upper surface of the sealing material 425 can be configured as a mold surface. Other configurations of the sealing material 425 of the fourth embodiment are similar to the configuration of the sealing material 125 of the first embodiment described above.

[0078] The stopper 424 and the sealant 425 may have a light-blocking property. In order to impart light-blocking properties to the stopper 424 and the sealant 425, a black pigment such as carbon black, a filler such as carbon fiber, or the like may be added to the stopper 424 and the sealant 425.

[0079] As described above, in the fourth embodiment, the ribs 224 that support the transparent substrate 126 on the chip 111 are formed from the lower end to the entire side surface of the transparent substrate 126, and the sealing material 425 is formed around the ribs 224 so as to cover the upper end of the transparent substrate 126. This protects the edges of the transparent substrate 126, making it possible to prevent chipping or cracking of the transparent substrate 126, and also increases the bonding surface area between the ribs 224 and the sealing material 425, thereby increasing the bonding strength between the ribs 224 and the sealing material 425. In this case, by providing the sealing material 425 with light-blocking properties, stray light incident on the light-receiving region 112 can be reduced without forming a light-blocking film on the transparent substrate 126. This makes it possible to improve the quality of images generated by the imaging device while suppressing an increase in the cost of the transparent substrate 126.

[0080] 5. Fifth Embodiment In the first embodiment described above, the ribs 124 that support the transparent substrate 126 on the chip 111 are formed from the lower end to the side surfaces of the transparent substrate 126. In this fifth embodiment, the ribs 124 that support the transparent substrate 126 on the chip 111 are formed from the lower end to the side surfaces of the transparent substrate 126, and a sealant is allowed to penetrate into the outer edge portion of the transparent substrate 126 between the chip 111 and the transparent substrate 126.

[0081] 11 is a diagram showing an example of the configuration of a package according to the fifth embodiment. In the figure, "a" is a cross-sectional view showing the example of the configuration of a package 500, and "b" is a plan view showing the example of the configuration of the package 500. "a" in the figure shows the example of the configuration cut along line A1-A2 in "b" in the figure.

[0082] In the figure, this package 500 includes ribs 524 and a sealing material 525 instead of the ribs 124 and the sealing material 125 of the first embodiment described above. Furthermore, this package 500 includes a stopper 526 in addition to the package 100 of the first embodiment described above. Other configurations of the package 500 of the fifth embodiment are similar to the configuration of the package 100 of the first embodiment described above.

[0083] The stopper 526 defines the position of the sealing material 525 on the outer edge of the transparent substrate 126 between the chip 111 and the transparent substrate 126. The stopper 526 can be formed in a frame shape on the underside of the transparent substrate 126 at a position away from the side of the transparent substrate 126. In this case, the stopper 526 can be arranged around the light receiving region 112. The height of the stopper 526 can be made equal to the distance between the chip 111 and the transparent substrate 126. The material of the stopper 526 may be the same as the material of the rib 224. The stopper 526 may be formed by an inkjet method, or by a method such as printing or dispensing.

[0084] The rib 524 supports the transparent substrate 126 on the chip 111. The rib 524 can be formed from the lower end to the side of the transparent substrate 126. The rib 524 can be disposed at a distance from the stopper 526. The rib 524 has an opening KA. The opening KA can penetrate the rib 524 horizontally below the transparent substrate 126. The opening KA needs to be located at at least one location in the rib 524. However, openings KA may be provided at multiple locations in the rib 524 to ensure uniform penetration of the molding material into the outer edge of the transparent substrate 126 between the chip 111 and the transparent substrate 126. Other configurations of the rib 524 in the fifth embodiment are the same as those of the rib 124 in the first embodiment described above.

[0085] The encapsulant 525 encapsulates the bonding wires 116 on the mounting substrate 120. The encapsulant 525 can be continuously disposed along the outer periphery of the mounting substrate 120. The encapsulant 525 can be bonded to the chip 111, the transparent substrate 126, the rib 524, and the stopper 526. The encapsulant 525 can also be positioned on the outer edge of the transparent substrate 126 between the chip 111 and the transparent substrate 126. The encapsulant 525 can be disposed on the outer edge of the transparent substrate 126 between the chip 111 and the transparent substrate 126, from the inner end of the rib 524 to the position of the stopper 526. In this case, the encapsulant 525 can be formed by molding while injecting a molding material into the outer edge of the transparent substrate 126 between the chip 111 and the transparent substrate 126 through the opening KA. Other configurations of the encapsulant 525 of the fifth embodiment are similar to those of the encapsulant 125 of the first embodiment described above.

[0086] The stopper 526 and the sealant 525 may have a light-blocking property. In order to impart light-blocking property to the stopper 526 and the sealant 525, a black pigment such as carbon black, a filler such as carbon fiber, or the like may be added to the stopper 526 and the sealant 525.

[0087] As described above, in the fifth embodiment, the ribs 524 that support the transparent substrate 126 on the chip 111 are formed from the bottom end to the side of the transparent substrate 126, and the sealant 525 is inserted into the outer edge of the transparent substrate 126 between the chip 111 and the transparent substrate 126. This increases the bonding surface area between the ribs 524 and the sealant 525, thereby increasing the bonding strength between the ribs 524 and the sealant 525. In this case, by providing the sealant 525 with light-blocking properties, stray light entering the light-receiving region 112 can be reduced without forming a light-blocking film on the transparent substrate 126. This makes it possible to improve the quality of images generated by the imaging device while suppressing an increase in the cost of the transparent substrate 126.

[0088] In the above-described fifth embodiment, an example has been shown in which the configuration in which the sealant 525 penetrates into the outer edge portion of the transparent substrate 126 between the chip 111 and the transparent substrate 126 has been applied to the above-described first embodiment. In addition to this, the configuration in which the sealant 525 penetrates into the outer edge portion of the transparent substrate 126 between the chip 111 and the transparent substrate 126 may be applied to any of the above-described second to fourth embodiments.

[0089] 6. Sixth Embodiment In the second embodiment described above, the ribs 124 that support the transparent substrate 126 on the chip 111 are formed from the lower end to the entire side surface of the transparent substrate 126. In this sixth embodiment, the ribs 124 that support the transparent substrate 126 on the chip 111 are formed from the lower end to the entire side surface of the transparent substrate 126, and a cavity is formed in the transparent substrate.

[0090] 12 is a diagram showing an example of the configuration of a package according to the sixth embodiment. Note that "a" in the figure is a cross-sectional view showing the example of the configuration of a package 600, and "b" in the figure is a plan view showing the example of the configuration of the package 600. "a" in the figure shows the example of the configuration cut along line A1-A2 in "b" in the figure.

[0091] In the figure, this package 600 includes a transparent substrate 626 instead of the transparent substrate 126 of the second embodiment described above. The other configuration of the package 600 of the sixth embodiment is similar to the configuration of the package 200 of the second embodiment described above.

[0092] The transparent substrate 626 is placed on the chip 111. At this time, the transparent substrate 626 is supported on the chip 111 via the ribs 224. A cavity CAV is formed on the lower surface of the transparent substrate 626. The cavity CAV can be placed inside the ribs 224. The depth of the cavity CAV can be set so that the transparent substrate 626 is spaced apart from the on-chip lens 115. Other configurations of the transparent substrate 626 of the sixth embodiment are similar to the configuration of the transparent substrate 126 of the second embodiment described above.

[0093] As described above, in the sixth embodiment, the rib 224 that supports the transparent substrate 126 on the chip 111 is formed from the lower end to the entire side surface of the transparent substrate 626, and a cavity CAV is formed in the transparent substrate 626. This increases the bonding surface area between the rib 224 and the sealing material 125, and increases the bonding strength between the rib 224 and the sealing material 125. At this time, the transparent substrate 626 and the on-chip lens 115 can be separated at the position of the cavity CAV. This allows the thickness D1 of the rib 124 between the chip 111 and the transparent substrate 126 to be thin, and reduces deformation of the rib 224 due to a clamp load when the sealing material 125 is molded.

[0094] In the sixth embodiment described above, an example was shown in which the configuration in which a cavity CAV is formed in the transparent substrate 626 is applied to the second embodiment described above. In addition to this, the configuration in which a cavity CAV is formed in the transparent substrate 626 may be applied to any of the first, third, and fourth embodiments described above.

[0095] 7. Seventh Embodiment In the second embodiment described above, the rib 224 that supports the transparent substrate 126 on the chip 111 is formed from the lower end to the entire side surface of the transparent substrate 126. In this seventh embodiment, a die bond material is provided in a portion between the chip 111 and the mounting substrate 120, and a sealing material is allowed to penetrate around the die bond material between the chip 111 and the mounting substrate 120.

[0096] Fig. 13 is a cross-sectional view showing an example of the configuration of a package according to the seventh embodiment, and Fig. 14 is a plan view showing an example of the configuration of a package according to the seventh embodiment. Note that Fig. 14(a) shows an example of a planar pattern of a die bond material, and Fig. 14(b) shows another example of a planar pattern of a die bond material. Fig. 14 also shows an example of the configuration in which the chip 111, the rib 224, and the transparent substrate 126 have been removed.

[0097] 13, this package 700 includes a sealing material 725 and a die bonding material 727 instead of the sealing material 125 and the die bonding material 127 of the second embodiment described above. The other configurations of the package 700 of the seventh embodiment are similar to the configurations of the package 200 of the second embodiment described above.

[0098] The die bond material 727 bonds the chip 111 to the mounting substrate 120. The die bond material 727 can be formed in a portion under the chip 111. In this case, the die bond material 727 can be distributed under the chip 111. For example, the die bond material 727 may be distributed at the four corners and the center under the chip 111. In this case, the planar shape of the die bond material 727 may be a circular die bond material 727A as shown in FIG. 14 a, or a strip-shaped die bond material 727B as shown in FIG. 14 b. In this case, to suppress the occurrence of voids, it is desirable to distribute the die bond material 727B along the flow direction DM of the molding material. The die bond material 727 may be formed by an inkjet method, by coating, or by dispensing. Other configurations of the die bond material 727 of the seventh embodiment are the same as those of the die bond material 127 of the second embodiment described above.

[0099] The sealing material 725 seals the bonding wires 116 on the mounting substrate 120. The sealing material 725 can be disposed continuously along the outer periphery of the mounting substrate 120. The sealing material 725 can also be used as an underfill. In this case, the sealing material 725 can penetrate around the die bond material 727B between the mounting substrate 120 and the chip 111. In this case, the sealing material 725 can be formed by molding while allowing a molding material to penetrate between the chip 111 and the mounting substrate 120 through the gaps between the die bond materials 727B. The moisture absorption rate of the sealing material 725 can be made smaller than that of the die bond material 727. The other configurations of the sealing material 725 of the seventh embodiment are the same as those of the sealing material 125 of the second embodiment described above.

[0100] As described above, in the seventh embodiment, the die bond material 727 is provided in a portion between the chip 111 and the mounting substrate 120, and the sealing material 725 is allowed to penetrate around the die bond material 727 between the chip 111 and the mounting substrate 120. This allows a portion of the die bond material 727 to be replaced with the sealing material 725 as the underfill under the chip 111. This reduces the moisture absorption rate of the underfill under the chip 111, and suppresses the occurrence of the popcorn phenomenon.

[0101] In the seventh embodiment described above, an example was shown in which a configuration in which die bond material 727 is provided in a portion between chip 111 and mounting substrate 120 and sealing material 725 is allowed to penetrate around die bond material 727 between chip 111 and mounting substrate 120 is applied to the second embodiment described above. In addition to this, a configuration in which sealing material 725 is allowed to penetrate the outer edge of transparent substrate 126 between chip 111 and transparent substrate 126 may be applied to any of the first, third to sixth embodiments described above.

[0102] 8. Eighth Embodiment In the second embodiment described above, the ribs 224 that support the transparent substrate 126 on the chip 111 are formed from the lower end to the entire side surface of the transparent substrate 126. In this eighth embodiment, the ribs that support the transparent substrate 126 on the chip 111 are formed from the lower end to the entire side surface of the transparent substrate 126, and the ribs below the transparent substrate 126 are formed of a solder material.

[0103] 15 is a diagram showing an example of the configuration of a package according to the eighth embodiment. Note that "a" in the figure is a cross-sectional view showing the example of the configuration of a package 800, and "b" in the figure is a plan view showing the example of the configuration of the package 800. "a" in the figure shows the example of the configuration cut along line A1-A2 in "b" in the figure.

[0104] In the figure, this package 800 has ribs 824 instead of the ribs 224 of the second embodiment described above. The other configuration of the package 800 of the eighth embodiment is similar to the configuration of the package 200 of the second embodiment described above.

[0105] The ribs 824 support the transparent substrate 126 on the chip 111. The ribs 824 can be formed from the lower end of the transparent substrate 126 to the entire side surface. Of the ribs 824 on the chip 111, the ribs 824 below the chip 111 can be configured to include a solder layer 802. The material of the solder layer 802 can be, for example, a solder material such as Pb—Sn. The material of the solder layer 802 may be lead-free solder. The material of the solder layer 802 may be Sn—Ni-based solder or Au—Sn-based solder.

[0106] To ensure the bonding strength between the solder layer 802 and the chip 111, a metallized layer 801 may be provided between the solder layer 802 and the chip 111. The metallized layer 801 may have, for example, a three-layer structure of Ti / Ni / Au or a two-layer structure of Cr / Au. To ensure the bonding strength between the solder layer 802 and the transparent substrate 126, a metallized layer 803 may be provided between the solder layer 802 and the transparent substrate 126. The metallized layer 803 may have, for example, a three-layer structure of Ti / Pt / Au, Cr / Pt / Au, or Cr / Ni / Au. The other configurations of the rib 824 of the eighth embodiment are the same as the configurations of the rib 224 of the second embodiment described above.

[0107] FIG. 16 is a cross-sectional view showing an example of a method for manufacturing a package according to the eighth embodiment.

[0108] 16A, a metallized layer 801 is formed on the chip 111 at the bonding position of the transparent substrate 126. A solder layer 802 is formed on the bottom surface of the transparent substrate 126 at the bonding position of the chip 111 via a metallized layer 803. Then, after steps similar to those in FIG. 2A and FIG. 2B, the transparent substrate 126 is positioned on the chip 111.

[0109] Next, as shown in FIG. 16B, the solder layer 802 is brought into contact with the metallized layer 801, and the transparent substrate 126 is bonded onto the chip 111 based on a reflow process of the solder layer 802.

[0110] Next, as shown in Fig. 16c, a portion of the rib 824 is formed on the side surface of the transparent substrate 126 by an inkjet method. At this time, the rib 824 on the side surface of the transparent substrate 126 can be connected to the solder layer 802 below the transparent substrate 126. Then, the rib 824 on the side surface of the transparent substrate 126 is hardened by heat treatment or ultraviolet light irradiation. Thereafter, steps similar to those in Fig. 3b and c are carried out.

[0111] As described above, in the eighth embodiment, the ribs 824 that support the transparent substrate 126 on the chip 111 are formed from the lower end to the entire side surface of the transparent substrate 126, and the ribs 824 below the transparent substrate 126 are formed of the solder layer 802. This increases the bonding surface between the ribs 824 and the sealing material 125, while improving the rigidity of the ribs 824 below the transparent substrate 126. This increases the bonding strength between the ribs 824 and the sealing material 125, while reducing deformation of the ribs 824 due to the clamp load when the sealing material 125 is molded.

[0112] In the above-described eighth embodiment, an example was shown in which the configuration in which the rib 824 under the transparent substrate 126 is formed of the solder layer 802 is applied to the above-described second embodiment. In addition to this, the configuration in which the rib 824 under the transparent substrate 126 is formed of the solder layer 802 may be applied to any of the above-described first, third to seventh embodiments.

[0113] 9. Ninth Embodiment In the second embodiment described above, the ribs 224 that support the transparent substrate 126 on the chip 111 are formed from the lower end to the entire side surface of the transparent substrate 126. In this ninth embodiment, the ribs that support the transparent substrate 126 on the chip are formed from the four corners of the lower end of the transparent substrate 126 to the entire side surface.

[0114] 17 is a diagram showing an example of the configuration of a package according to the ninth embodiment. Note that "a" in the figure is a cross-sectional view showing the example of the configuration of a package 900, and "b" in the figure is a plan view showing the example of the configuration of the package 900. "a" in the figure shows the example of the configuration cut along line A1-A2 in "b" in the figure.

[0115] In the figure, this package 900 includes a chip 911 and a rib 924 instead of the chip 111 and the rib 224 of the second embodiment described above. The rest of the configuration of the package 900 of the ninth embodiment is the same as the configuration of the package 200 of the second embodiment described above.

[0116] The chip 911 is connected to the mounting substrate 120 via a bonding wire 116. A pad electrode 113 to which the bonding wire 116 is connected can be formed on the chip 911. In this case, the chip 911 does not require a space for arranging a rib 924 between the light receiving region 112 and the pad electrode 113.

[0117] The ribs 924 support the transparent substrate 126 on the chip 911. The ribs 924 can be formed from the four corners of the lower end of the transparent substrate 126 to the entire side surface. In this case, the ribs 924 under the transparent substrate 126 can be arranged at the four corners of the lower end of the transparent substrate 126, spaced apart from the pad electrodes 113. The ribs 924 under the transparent substrate 126 may be arranged adjacent to the pad electrodes 113 in the arrangement direction of the pad electrodes 113. The material of the ribs 924 under the transparent substrate 126 may be the same as or different from the material of the ribs 924 on the side surface of the transparent substrate 126. In this case, the ribs 924 under the transparent substrate 126 may be configured to include the solder layer 802 of the eighth embodiment described above. The bonding wire 116 can be arranged inside the ribs 924 by passing through the ribs 924 on the side surface of the transparent substrate 126. At this time, the periphery of each bonding wire 116 can be covered with a rib 924 between the pad electrode 113 and the bonding pad 122 .

[0118] As described above, in the ninth embodiment, the ribs 924 that support the transparent substrate 126 on the chip 911 are formed from the four corners of the lower end of the transparent substrate 126 to the entire side surface. At this time, the bonding wires 116 can be disposed inside the ribs 924 by passing them through the ribs 924 on the side surfaces of the transparent substrate 126. This eliminates the need to dispose the pad electrodes 113 to which the bonding wires 116 are connected outside the ribs 924 on the chip 911. Therefore, space for disposing the pad electrodes 113 outside the ribs 924 is not required, and the planar size of the chip 911 can be reduced.

[0119] In the above-described ninth embodiment, the ribs 924 under the transparent substrate 126 are disposed at the four corners of the lower end of the transparent substrate 126. However, the present invention is not limited to this arrangement, and other arrangements are also possible. For example, the ribs 924 under the transparent substrate 126 may be disposed between the pad electrodes 113.

[0120] Furthermore, in the above-described ninth embodiment, an example was shown in which the configuration in which the ribs 924 under the transparent substrate 126 are arranged at the four corners of the lower end of the transparent substrate 126 is applied to the above-described second embodiment. In addition to this, the configuration in which the ribs 924 under the transparent substrate 126 are arranged at the four corners of the lower end of the transparent substrate 126 may be applied to any of the above-described first, third to eighth embodiments.

[0121] 10. Tenth Embodiment In the first embodiment described above, the ribs 124 that support the transparent substrate 126 on the chip 111 are formed from the lower end to the side surfaces of the transparent substrate 126. In this tenth embodiment, the ribs that support the transparent substrate 126 on the chip 111 are formed from the lower end of the transparent substrate 126 to the side surfaces of the transparent substrate 126 and the side surfaces of the chip 111.

[0122] 18 is a diagram showing an example of the configuration of a package according to the tenth embodiment. Note that "a" in the figure is a cross-sectional view showing the example of the configuration of the package 1000, and "b" in the figure is a plan view showing the example of the configuration of the package 1000. "a" in the figure shows the example of the configuration cut along line A1-A2 in "b" in the figure.

[0123] In the figure, this package 1000 includes a rib 1024 and a chip 1011 instead of the rib 124 and the chip 111 of the first embodiment described above. The rest of the configuration of the package 1000 of the tenth embodiment is the same as the configuration of the package 100 of the first embodiment described above.

[0124] The chip 1011 is connected to the mounting substrate 120 via a bonding wire 116. A pad electrode 113 to which the bonding wire 116 is connected can be formed on the chip 1011. In this case, the chip 1011 does not require a space for arranging the rib 1024 between the light receiving region 112 and the pad electrode 113. The planar size of the chip 1011 may be equal to or larger than the planar size of the transparent substrate 126.

[0125] The rib 1024 supports the transparent substrate 126 on the chip 1011. The rib 1024 can be formed from the lower end of the transparent substrate 126 to the side surfaces of the transparent substrate 126 and the side surfaces of the chip 111. In this case, the rib 1024 can cover the pad electrodes 113 and bonding wires 116 of the chip 1011. The rib 1024 may be integrated from the lower end of the transparent substrate 126 to the side surfaces of the transparent substrate 126 and the side surfaces of the chip 111. The rib 1024 may also cover the side surfaces of the die bond material 127. In this case, the rib 1024 may reach the mounting substrate 120. The other configurations of the rib 1024 in the tenth embodiment are the same as the configuration of the rib 124 in the first embodiment described above.

[0126] In this way, in the above-described tenth embodiment, the ribs 1024 that support the transparent substrate 126 on the chip 111 are formed from the lower end of the transparent substrate 126 to the side surfaces of the transparent substrate 126 and the side surfaces of the chip 111. This increases the bonding surface area between the ribs 1024 and the sealing material 125, and increases the bonding strength between the ribs 1024 and the sealing material 125.

[0127] 11. Eleventh Embodiment In the first embodiment described above, the ribs 124 that support the transparent substrate 126 on the chip 111 are formed from the bottom end to the side surfaces of the transparent substrate 126. In this eleventh embodiment, the ribs 124 that support the transparent substrate 126 on the back surface of a face-down mounted chip are formed from the bottom end to the side surfaces of the transparent substrate 126.

[0128] 19 is a diagram showing an example of the configuration of a package according to the eleventh embodiment. In the figure, "a" is a cross-sectional view showing the example of the configuration of a package 1100, and "b" is a plan view showing the example of the configuration of the package 1100. "a" in the figure shows the example of the configuration cut along the A1-A2 line in "b" in the figure.

[0129] In the figure, this package 1100 includes a chip 1111 and a mounting substrate 1120 instead of the chip 111 and the mounting substrate 120 of the first embodiment described above. The rest of the configuration of the package 1100 of the eleventh embodiment is the same as the configuration of the package 100 of the first embodiment described above.

[0130] A chip 1111 is mounted on a mounting substrate 1120. A land electrode 1112 is formed on the front side of the mounting substrate 1120. A land electrode 123 is formed on the back side of the mounting substrate 1120. Wiring 1121 and vias may be formed on the mounting substrate 1120. Other configurations of the mounting substrate 1120 of the eleventh embodiment are similar to the configuration of the mounting substrate 120 of the first embodiment described above.

[0131] The chip 1111 is mounted face-down on the mounting substrate 1120. At this time, the chip 1111 may be flip-chip mounted on the mounting substrate 1120. For example, a back-illuminated imaging element may be formed on the chip 1111. At this time, a light-receiving region 112 is formed on the back side of the chip 1111. A color filter 114 and an on-chip lens 115 are formed for each pixel on the light-receiving region 112. At this time, a transparent substrate 126 is supported on the back side of the chip 1111 via ribs 124. A wiring layer is formed on the front side of the chip 1111. Land electrodes 1114 are formed on the wiring layer on the front side of the chip 1111. At this time, the chip 1111 can be flip-chip mounted on the mounting substrate 1120 by connecting the land electrodes 1112 and 1114 via solder balls 1113. The chip 1111 may have a through electrode or a through via formed therein that connects the light receiving region 112 on the back side of the chip 1111 with the wiring layer on the front side of the chip 1111 .

[0132] In this way, in the eleventh embodiment described above, the ribs 124 that support the transparent substrate 126 on the back surface of the face-down mounted chip are formed from the lower end to the side of the transparent substrate 126. This increases the bonding surface area between the ribs 124 and the sealing material 125, making it possible to increase the bonding strength between the ribs 124 and the sealing material 125, and also makes it possible to eliminate the need for bonding wires 116 for connecting the chip 1111 to the external terminals, thereby enabling the package 1100 to be made smaller.

[0133] In the above-described eleventh embodiment, an example was shown in which a configuration in which ribs 124 for supporting transparent substrate 126 on the back surface of face-down mounted chip 1111 are formed from the lower end to the side surface of transparent substrate 126 is applied to the above-described first embodiment. In addition to this, a configuration in which ribs 124 for supporting transparent substrate 126 on the back surface of face-down mounted chip 1111 are formed from the lower end to the side surface of transparent substrate 126 may be applied to any of the above-described second to sixth and eighth to tenth embodiments.

[0134] 12. Twelfth Embodiment In the first embodiment described above, the ribs 124 that support the transparent substrate 126 on the chip 111 are formed from the bottom end to the side surfaces of the transparent substrate 126. In this twelfth embodiment, the ribs that support the transparent substrate on the back surface of a face-down mounted chip are formed from the bottom end to the side surfaces of the transparent substrate, making it possible to connect external terminals to the chip via through electrodes.

[0135] 20 is a diagram showing an example of the configuration of a package according to the twelfth embodiment. Note that "a" in the figure is a cross-sectional view showing the example of the configuration of a package 1200, and "b" in the figure is a plan view showing the example of the configuration of the package 1200. "a" in the figure shows the example of the configuration cut along line A1-A2 in "b" in the figure.

[0136] In the figure, the package 1200 includes a circuit chip P11 and a sensor chip P12. The sensor chip P12 is stacked on the circuit chip P11. The planar size and shape of the circuit chip P11 can be made equal to those of the sensor chip P12. In this case, the horizontal end positions of the circuit chip P11 can be aligned with the horizontal end positions of the sensor chip P12. This allows the package 1200 to form a wafer-level chip size package (WLCSP).

[0137] A photoelectric conversion element is formed on the sensor chip P12. The photoelectric conversion element may be an image sensor such as a CMOS sensor or a SPAD sensor. In this case, a pixel region may be provided on the sensor chip P12. A plurality of pixels may be formed in the pixel region. The sensor chip P12 includes a semiconductor substrate 1212. A color filter 114 and an on-chip lens 115 are formed for each pixel on the pixel region of the semiconductor substrate 1212. In this case, a transparent substrate 126 is supported on the back surface side of the sensor chip P12 via ribs 124.

[0138] A wiring layer 1221 is formed on the semiconductor substrate 1212. The wiring layer 1221 is provided with wiring 1222 embedded in an insulating layer and bonding electrodes 1224. The wiring layer 1221 is also provided with vias 1223 used for interlayer connection. The bonding electrodes 1224 can be used to directly bond the sensor chip P12 and the circuit chip P11.

[0139] A circuit layer is formed on the circuit chip P11. A semiconductor element is formed on the circuit layer. The semiconductor element may be a memory, a processor, a signal processing circuit, a data processing circuit, or an interface circuit.

[0140] The circuit chip P11 includes a semiconductor substrate 1242. A gate electrode embedded in an insulating layer is formed on the semiconductor substrate 1242. In this case, a channel region located under the gate electrode and impurity diffusion layers located on both sides of the channel region may be formed in the semiconductor substrate 1242.

[0141] A wiring layer 1231 is formed on the semiconductor substrate 1242. The wiring layer 1231 is provided with wiring 1232 embedded in an insulating layer and bonding electrodes 1234. The wiring layer 1231 is also provided with vias 1233 used for interlayer connection. The bonding electrodes 1234 can be used to directly bond the sensor chip P12 and the circuit chip P11. Hybrid bonding can be used to directly bond the sensor chip P12 and the circuit chip P11. In this case, the bonding electrodes 1224 and 1234 are arranged in opposing positions. The bonding electrodes 1224 and 1234 can be bonded to each other based on metal bonding such as Cu-Cu bonding.

[0142] A through electrode 1235 is embedded in the semiconductor substrate 1242. The through electrode 1235 penetrates from the back surface side of the support substrate 1241 to the position of the wiring layer 1231 and is connected to the wiring layer 1231. A rewiring 1236 is formed on the back surface side of the support substrate 1241. The rewiring 1236 is connected to the through electrode 1235. The through electrode 1235 and the rewiring 1236 are insulated from the semiconductor substrate 1242 via an insulating layer 1241. The inner surface of the through electrode 1235 and the rewiring 1236 are covered with an insulating layer 1237. The rewiring 1236 is connected to the solder ball 128 through the insulating layer 1237. The through electrode 1235 and the rewiring 1236 may be made of the same thin film or may be formed integrally.

[0143] The material of each semiconductor substrate 1212, 1242 may be Si, GaAs, SiC, GaN, InGaAs, InP, etc. The material of each semiconductor substrate 1212, 1242 may be the same or different.

[0144] The material of the insulating layer used for each of the wiring layers 1221 and 1231 is, for example, SiO ２ The insulating layer 1237 may be made of a resin such as a solder resist, or may be made of SiO ２ , SiN, or SiCN. The wirings 1222, 1232, rewirings 1236, vias 1223, 1233, and bonding electrodes 1224, 1234 may be made of a metal such as Al, Cu, AlCu, AlSiCu, or Co. The through electrode 1235 may be made of a metal such as Cu, Ti, Ta, Al, W, Ni, Ru, or Co, or may have a layered structure of multiple materials. The through electrode 1235 and the rewirings 1236 may be made of the same material.

[0145] As described above, in the twelfth embodiment, the ribs 124 that support the transparent substrate 126 on the back surface of the face-down mounted sensor chip P12 are formed from the lower end to the side surfaces of the transparent substrate 126, and external terminals can be connected to the sensor chip P12 via the through electrodes 1235. This increases the bonding surface area between the ribs 124 and the sealing material 125, making it possible to increase the bonding strength between the ribs 124 and the sealing material 125, and also makes it possible to eliminate the need for bonding wires 116 for connecting the sensor chip P12 to the external terminals while stacking the sensor chip P12 on the circuit chip P11, thereby enabling the package 1200 to be made smaller.

[0146] In the above-described twelfth embodiment, an example was shown in which a configuration was applied to the above-described first embodiment in which ribs 124 supporting the transparent substrate 126 on the back surface of the face-down mounted sensor chip P12 are formed from the lower end to the side surfaces of the transparent substrate 126, and external terminals are connected to the sensor chip P12 via the through electrodes 1235. In addition to this, a configuration in which ribs 124 supporting the transparent substrate 126 on the back surface of the face-down mounted sensor chip P12 are formed from the lower end to the side surfaces of the transparent substrate 126, and external terminals are connected to the sensor chip P12 via the through electrodes 1235 may be applied to any of the above-described second to sixth and eighth to tenth embodiments.

[0147] 13. Thirteenth Embodiment In the first embodiment described above, the ribs 124 that support the transparent substrate 126 on the chip 111 are formed from the lower end to the side surface of the transparent substrate 126. In this thirteenth embodiment, posts are arranged between the pad electrodes 113 formed on the chip 111.

[0148] 21 is a diagram showing a configuration example of a package according to the thirteenth embodiment, in which a is a plan view showing the configuration example of a package 1300, and b is a perspective view showing a part of the package 1300.

[0149] In the figure, this package 1300 is obtained by adding posts 1301 to the package 100 of the first embodiment described above. The other configuration of the package 1300 of the thirteenth embodiment is the same as the configuration of the package 100 of the first embodiment described above.

[0150] The posts 1301 can isolate the bonding wires 116. The posts 1301 are positioned between the pad electrodes 113. It is desirable that the height of the posts 1301 is higher than the top positions of the bonding wires 116. The material of the posts 1301 can be an insulator such as resin or ceramic. The posts 1301 may be formed by adhering a molded product onto the chip 111, or by forming the posts 1301 on the chip 111 by an inkjet method.

[0151] As described above, in the thirteenth embodiment, the posts 1301 are arranged between the pad electrodes 113 formed on the chip 111. This prevents the bonding wires 116 from falling at the positions of the posts 1301 even if a wire sweep occurs due to molding when the sealing material 125 is formed. This prevents the adjacent bonding wires 116 from contacting each other, thereby reducing short-circuit defects.

[0152] The configuration in which posts 1301 are arranged between pad electrodes 113 formed on chip 111 may be applied to any of the second to eighth embodiments in addition to the first embodiment described above.

[0153] 14. Application Examples to Mobile Bodies The technology according to the present disclosure (the present technology) can be applied to various products. For example, the technology according to the present disclosure may be realized as a device mounted on any type of mobile body, such as an automobile, an electric vehicle, a hybrid electric vehicle, a motorcycle, a bicycle, personal mobility, an airplane, a drone, a ship, or a robot.

[0154] FIG. 22 is a block diagram showing a schematic configuration example of a vehicle control system, which is an example of a mobile object control system to which the technology according to the present disclosure can be applied.

[0155] The vehicle control system 12000 includes a plurality of electronic control units connected via a communication network 12001. In the example shown in Fig. 22, the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an outside-vehicle information detection unit 12030, an inside-vehicle information detection unit 12040, and an integrated control unit 12050. Also shown as functional components of the integrated control unit 12050 are a microcomputer 12051, an audio / video output unit 12052, and an in-vehicle network I / F (interface) 12053.

[0156] The drivetrain control unit 12010 controls the operation of devices related to the drivetrain of the vehicle in accordance with various programs. For example, the drivetrain control unit 12010 functions as a control device for a drive force generating device for generating a drive force of the vehicle, such as an internal combustion engine or a drive motor, a drive force transmission mechanism for transmitting the drive force to the wheels, a steering mechanism for adjusting the steering angle of the vehicle, and a braking device for generating a braking force of the vehicle.

[0157] The body system control unit 12020 controls the operation of various devices equipped in the vehicle body according to various programs. For example, the body system control unit 12020 functions as a control device for a keyless entry system, a smart key system, a power window device, or various lamps such as headlamps, backup lamps, brake lamps, turn signals, and fog lamps. In this case, radio waves transmitted from a portable device that serves as a key or signals from various switches can be input to the body system control unit 12020. The body system control unit 12020 receives these radio waves or signals and controls the vehicle's door lock device, power window device, lamps, etc.

[0158] The outside-vehicle information detection unit 12030 detects information outside the vehicle equipped with the vehicle control system 12000. For example, an imaging unit 12031 is connected to the outside-vehicle information detection unit 12030. The outside-vehicle information detection unit 12030 causes the imaging unit 12031 to capture images outside the vehicle and receives the captured images. The outside-vehicle information detection unit 12030 may perform object detection processing or distance detection processing for people, cars, obstacles, signs, characters on the road surface, etc. based on the received images.

[0159] The imaging unit 12031 is an optical sensor that receives light and outputs an electrical signal corresponding to the amount of light received. The imaging unit 12031 can output the electrical signal as an image or as distance measurement information. The light received by the imaging unit 12031 may be visible light or invisible light such as infrared light.

[0160] The in-vehicle information detection unit 12040 detects information inside the vehicle. For example, a driver state detection unit 12041 that detects the state of the driver is connected to the in-vehicle information detection unit 12040. The driver state detection unit 12041 includes, for example, a camera that captures an image of the driver, and the in-vehicle information detection unit 12040 may calculate the degree of fatigue or concentration of the driver based on the detection information input from the driver state detection unit 12041, or may determine whether the driver is dozing off.

[0161] The microcomputer 12051 can calculate control target values ​​for the driving force generating device, steering mechanism, or braking device based on the information inside and outside the vehicle acquired by the outside-vehicle information detection unit 12030 or the inside-vehicle information detection unit 12040, and output control commands to the drive system control unit 12010. For example, the microcomputer 12051 can perform cooperative control aimed at realizing the functions of an ADAS (Advanced Driver Assistance System), including vehicle collision avoidance or impact mitigation, following driving based on the distance between vehicles, maintaining vehicle speed, vehicle collision warning, vehicle lane departure warning, etc.

[0162] In addition, the microcomputer 12051 can perform cooperative control for the purpose of autonomous driving, which allows the vehicle to travel autonomously without relying on driver operation, by controlling the driving force generating device, steering mechanism, braking device, etc. based on information about the surroundings of the vehicle obtained by the outside vehicle information detection unit 12030 or the inside vehicle information detection unit 12040.

[0163] Furthermore, the microcomputer 12051 can output a control command to the body system control unit 12020 based on the information outside the vehicle acquired by the outside information detection unit 12030. For example, the microcomputer 12051 can control the headlamps according to the position of a preceding vehicle or an oncoming vehicle detected by the outside information detection unit 12030, and perform cooperative control aimed at preventing glare, such as switching from high beams to low beams.

[0164] The audio / video output unit 12052 transmits at least one of audio and video output signals to an output device capable of visually or audibly notifying information to vehicle occupants or the outside of the vehicle. In the example of Fig. 22, the output devices are exemplified by an audio speaker 12061, a display unit 12062, and an instrument panel 12063. The display unit 12062 may include, for example, at least one of an on-board display and a head-up display.

[0165] FIG. 23 is a diagram showing an example of the installation position of the imaging unit 12031.

[0166] In FIG. 23, the imaging unit 12031 includes imaging units 12101, 12102, 12103, 12104, and 12105.

[0167] The imaging units 12101, 12102, 12103, 12104, and 12105 are provided, for example, at positions such as the front nose, side mirrors, rear bumper, back door, and the top of the windshield inside the vehicle cabin of the vehicle 12100. The imaging unit 12101 provided on the front nose and the imaging unit 12105 provided on the top of the windshield inside the vehicle cabin mainly acquire images of the front of the vehicle 12100. The imaging units 12102 and 12103 provided on the side mirrors mainly acquire images of the sides of the vehicle 12100. The imaging unit 12104 provided on the rear bumper or back door mainly acquires images of the rear of the vehicle 12100. The imaging unit 12105 provided on the top of the windshield inside the vehicle cabin is mainly used to detect preceding vehicles, pedestrians, obstacles, traffic lights, traffic signs, lanes, etc.

[0168] 23 shows an example of the imaging ranges of the imaging units 12101 to 12104. Imaging range 12111 indicates the imaging range of the imaging unit 12101 provided on the front nose, imaging ranges 12112 and 12113 indicate the imaging ranges of the imaging units 12102 and 12103 provided on the side mirrors, respectively, and imaging range 12114 indicates the imaging range of the imaging unit 12104 provided on the rear bumper or back door. For example, by overlaying the image data captured by the imaging units 12101 to 12104, an overhead image of the vehicle 12100 viewed from above can be obtained.

[0169] At least one of the image capturing units 12101 to 12104 may have a function of acquiring distance information. For example, at least one of the image capturing units 12101 to 12104 may be a stereo camera made up of multiple image capturing elements, or may be an image capturing element having pixels for phase difference detection.

[0170] For example, based on the distance information obtained from the imaging units 12101 to 12104, the microcomputer 12051 can calculate the distance to each three-dimensional object within the imaging ranges 12111 to 12114 and the change in this distance over time (relative speed with respect to the vehicle 12100), thereby extracting as a preceding vehicle, in particular, the three-dimensional object that is the closest three-dimensional object on the path of the vehicle 12100 and traveling in approximately the same direction as the vehicle 12100 at a predetermined speed (e.g., 0 km / h or higher). Furthermore, the microcomputer 12051 can set a vehicle-to-vehicle distance to be maintained in advance in front of the preceding vehicle, and perform automatic braking control (including follow-up stop control), automatic acceleration control (including follow-up start control), etc. In this way, cooperative control can be performed for the purpose of autonomous driving, which runs autonomously without relying on driver operation.

[0171] For example, the microcomputer 12051 classifies and extracts three-dimensional object data regarding three-dimensional objects into two-wheeled vehicles, ordinary vehicles, large vehicles, pedestrians, utility poles, and other three-dimensional objects based on distance information obtained from the imaging units 12101 to 12104, and can use the data for automatic obstacle avoidance. For example, the microcomputer 12051 distinguishes obstacles around the vehicle 12100 into obstacles that are visible to the driver of the vehicle 12100 and obstacles that are difficult to see. The microcomputer 12051 then determines a collision risk that indicates the risk of collision with each obstacle, and when the collision risk is equal to or greater than a set value and a collision is possible, the microcomputer 12051 can provide driving assistance for collision avoidance by outputting an alarm to the driver via the audio speaker 12061 or the display unit 12062, or by performing forced deceleration or avoidance steering via the drive system control unit 12010.

[0172] At least one of the image capturing units 12101 to 12104 may be an infrared camera that detects infrared rays. For example, the microcomputer 12051 can recognize a pedestrian by determining whether a pedestrian is present in the images captured by the image capturing units 12101 to 12104. Such pedestrian recognition is performed, for example, by extracting feature points from the images captured by the image capturing units 12101 to 12104 as infrared cameras and performing pattern matching on a series of feature points that indicate the outline of an object to determine whether the object is a pedestrian. When the microcomputer 12051 determines that a pedestrian is present in the images captured by the image capturing units 12101 to 12104 and recognizes the pedestrian, the audio / image output unit 12052 controls the display unit 12062 to superimpose a rectangular outline on the recognized pedestrian for emphasis. The audio / image output unit 12052 may also control the display unit 12062 to display an icon or the like indicating the pedestrian at a desired position.

[0173] An example of a vehicle control system to which the technology according to the present disclosure can be applied has been described above. The technology according to the present disclosure can be applied to the imaging unit 12031 of the above-described configuration. Specifically, for example, each of the packages 100 to 1300 according to the above-described embodiment can be applied to the imaging unit 12031. By applying the technology according to the present disclosure to the vehicle control system 12000, the reliability of the imaging unit 12031 can be improved.

[0174] Note that the above-described embodiment shows an example for realizing the present technology, and the matters in the embodiment and the matters specifying the invention in the claims correspond to each other. Similarly, the matters specifying the invention in the claims and the matters in the embodiment of the present technology with the same title correspond to each other. However, the present technology is not limited to the embodiment, and can be realized by applying various modifications to the embodiment within the scope of the gist. Furthermore, the effects described in this specification are merely examples and are not limited, and other effects may also be present.

[0175] The present technology can also be configured as follows. (1) A package comprising: a chip; a substrate on which the chip is mounted; a transparent member located on the chip so as to be spaced apart from the chip; and a rib located from a lower end of the transparent member to a side surface thereof and supporting the transparent member on the chip. (2) The package according to (1), further comprising: a substrate on which the chip is mounted; and an encapsulant located on the substrate around the chip. (3) The package according to (2), wherein the encapsulant is a molding material. (4) The package according to (2) or (3), further comprising: a bonding wire disposed outside the rib and connecting the substrate and the chip. (5) The package according to (4), wherein the bottom position of the transparent member is lower than the top position of the bonding wire. (6) The package according to (4), further comprising: a die bond material provided in a portion between the chip and the substrate, the molding material being located around the die bond material between the chip and the substrate. (7) The package according to any one of (1) to (6), wherein the planar size of the transparent member is smaller than the planar size of the chip. (8) The package according to any one of (1) to (7), wherein the rib is formed from the upper end to the side of the transparent member. (9) The package according to any one of (1) to (8), wherein the thickness of the rib between the chip and the transparent member is 20 μm or more and 100 μm or less. (10) The package according to any one of (1) to (9), wherein the material of the rib is an inkjet material. (11) The package according to any one of (1) to (9), wherein the material of the rib on the bottom surface of the transparent member is a solder material. (12) The package according to any one of (1) to (11), wherein the rib has folds formed on at least one of the inner and outer peripheral surfaces. (13) A package comprising: a chip; a transparent member positioned on the chip so as to be spaced from the chip; and a rib formed from the lower end to the upper end of the transparent member and supporting the transparent member on the chip. (14) The package according to (13), wherein the ribs are made of a light-shielding material.(15) A method for manufacturing a package, comprising the steps of die-bonding a chip onto a substrate, wire-bonding the chip, arranging a transparent member on the chip via ribs, and forming a sealing material around the ribs to cover the wire-bonded bonding wires, wherein the ribs are formed from the lower end to the side surfaces of the transparent member. (16) The method for manufacturing a package according to (15) above, wherein the ribs are formed using an inkjet method.

[0176] REFERENCE SIGNS LIST 100 Package 111 Chip 112 Light receiving area 113 Pad electrode 114 Color filter 115 On-chip lens 116 Bonding wire 120 Mounting substrate 121 Wiring 122 Bonding pad 123 Land electrode 124 Rib 125 Sealing material 126 Transparent substrate 127 Die bond material 128 Solder ball

Claims

1. A package comprising: a chip; a transparent member positioned above the chip and spaced apart from the chip; and a rib positioned from the bottom end of the transparent member to the side, supporting the transparent member above the chip.

2. The package according to claim 1, further comprising: a substrate on which the chip is mounted; and an encapsulant positioned on the substrate around the chip.

3. The package according to claim 2, wherein the sealing material is a molding material.

4. The package according to claim 2, further comprising bonding wires arranged outside said ribs and connecting said substrate and said chip.

5. The package according to claim 4, wherein the bottom position of the transparent member is lower than the top position of the bonding wires.

6. The package according to claim 4, further comprising a die bond material provided in a portion between the chip and the substrate, and the molding material is positioned around the die bond material between the chip and the substrate.

7. The package according to claim 1, wherein the planar size of the transparent member is smaller than the planar size of the chip.

8. The package according to claim 1, wherein the ribs are formed from the top end of the transparent member to the side surfaces.

9. The package according to claim 1, wherein the thickness of the rib between the chip and the transparent member is 20 μm or more and 100 μm or less.

10. The package of claim 1, wherein the rib material is an inkjet material.

11. The package according to claim 1, wherein the material of the ribs on the bottom surface of the transparent member is a solder material.

12. The package according to claim 1, wherein the rib has folds formed on at least one of the inner and outer peripheral surfaces.

13. A package comprising: a chip; a transparent member positioned above the chip and spaced apart from the chip; and a rib formed from the lower end to the upper end of the transparent member to support the transparent member above the chip.

14. The package of claim 13, wherein the rib material is a light blocking material.

15. A method for manufacturing a package, comprising the steps of: die-bonding a chip onto a substrate; wire-bonding the chip; arranging a transparent member on the chip via a rib; and forming a sealing material around the rib to cover the wire-bonded bonding wire, wherein the rib is formed from the lower end to the side of the transparent member.

16. The method for manufacturing a package according to claim 15, wherein the ribs are formed by an inkjet method.

Images