Mounting head

Abstract

A mounting head according to an embodiment of the present invention comprises: a base; a first motor attached on the base; a spindle guide connected to the first motor; a spindle which is arranged inside the spindle guide and can rotate and / or move separately from the spindle guide; a motor accommodation portion seated on the upper side of the spindle guide; and a second motor arranged in the motor accommodation portion, wherein the spindle guide and the spindle are moved by the first motor in a Z-axis direction, and the spindle is moved by the second motor in the Z-axis direction separately from the spindle guide.

Description

Real head

[0001] Embodiments of the present invention relate to a mounting head of a mounting device for mounting semiconductor dies or chips on a substrate.

[0002] Semiconductor dies or chips are formed together on a single wafer. The wafer undergoes a cutting process to separate the individual dies, and each die must be individually mounted through a die bonding process.

[0003] An electrical connection is created between the mounted dies and external devices, and the surfaces are then sealed to protect the dies from damage.

[0004] Typical mounting heads used in the above die bonding process perform position correction through imaging to accurately position the die on the substrate. During this process, the mounting head for bonding picks up the die and then precisely aligns the die with respect to the substrate using rotational compensation along the theta axis.

[0005] The mounting head first moves downward (vertically, +Z-axis) to perform the operation of bonding the die to the substrate, and then drives the spindle in a vertical direction parallel to the Z-axis to obtain a precise position.

[0006] The spindle performs rotational motion and vertical motion along the Z-axis. The rotary motor rotates the spindle to compensate for the Theta axis, and the second motor compensates for the Z-axis position or performs precise driving through the vertical motion of the spindle.

[0007] The general head structure described above is configured so that the spindle is separated from the rotation motor when the spindle moves along the Z-axis, and the spindle can rotate through the bearing. However, this structure has the problem of low precision in controlling the bonding position of the die chip to secure bonding strength when bonding the die chip to the substrate.

[0008] According to one aspect of the present invention, the main task is to provide a mounting head that enables precise bonding position control in the Z-axis direction for bonding joints of the mounting head.

[0009] However, these tasks are exemplary, and the tasks to be solved by the present invention are not limited thereto.

[0010] According to one embodiment of the present invention, a mounting head comprises: a base; a first motor mounted on the base; a spindle guide connected to the first motor; a spindle disposed inside the spindle guide and rotatable and / or movable separately from the spindle guide; a motor receiving portion mounted on an upper side of the spindle guide; and a second motor disposed inside the motor receiving portion, wherein the spindle guide and the spindle are moved in the Z-axis direction by the first motor, and the spindle is moved in the Z-axis direction separately from the spindle guide by the second motor.

[0011] The first motor can move the entire head portion connected to the spindle guide in the Z-axis direction, and the second motor can move the spindle and the spindle connection portion connected to the lower end of the spindle, the heater, and the collet in the Z-axis direction.

[0012] A first rotational shaft and a second rotational shaft connected to the first motor; and a coupling connecting the first rotational shaft and the second rotational shaft, wherein a ball screw portion is formed on the second rotational shaft, and the ball screw portion is screw-coupled with the coupling to convert the rotational motion of the first rotational shaft into the linear motion of the second rotational shaft.

[0013] A connecting portion connected to the second rotation shaft; a first base coupled to the connecting portion; and a second base coupled to the first base, wherein the second base has a spindle upper connecting portion and a spindle lower connecting portion formed therein, and the spindle upper connecting portion and the spindle lower connecting portion can be coupled to the upper and lower portions of the spindle guide.

[0014] The above second motor can be formed as a VCM (Voice Coil Motor).

[0015] The second motor includes a permanent magnet portion and a coil portion, and when a driving signal of the second motor is generated, the coil portion of the second motor moves in the Z-axis direction, and the spindle and the collet connected to the spindle can also move in the Z-axis direction together with the coil portion.

[0016] It further includes a control unit that drives the first motor, the second motor, and the rotary motor, and the control unit can separately control the first motor, the second motor, and the rotary motor.

[0017] It further includes a rotation motor that rotates the spindle about the theta axis, and the rotation motor can be placed between the second motor and the spindle inside the motor receiving portion.

[0018] A load cell may be placed between the second motor and the rotary motor.

[0019] A spindle connection part is arranged at the lower end of the spindle, and the spindle connection part can move in the Z-axis direction and rotational direction together with the spindle.

[0020] An encoder can be placed in the circumferential direction of the above spindle connection part.

[0021] A heater is arranged at the lower end of the spindle connection portion, and the heater can move in the Z-axis direction and rotational direction together with the spindle.

[0022] A collet is placed at the lower end of the above heater, and the collet can move in the Z-axis direction and rotational direction together with the spindle.

[0023] Other aspects, features and advantages other than those described above will become apparent from the following detailed description, claims and drawings for carrying out the invention.

[0024] According to one embodiment of the present invention, the mounting head has a rotation motor and first and second motors driven separately so that the bonding position of a component absorbed into a collet can be controlled more precisely.

[0025] In addition, the mounting head according to one embodiment of the present invention can enable more precise rotational position control for the bonding position by eliminating the general bearing structure and directly connecting the rotation motor and the spindle.

[0026] In addition, the mounting head according to one embodiment of the present invention employs a second motor that is positioned above the spindle and more precisely controls the up-and-down movement of the spindle based on the primary position set by the first motor, in addition to the first motor that moves the entire head up and down, thereby enabling doubly precise control of the bonding position of the component absorbed in the collet.

[0027] The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

[0028] FIG. 1 is a front view of a mounting head according to one embodiment of the present invention.

[0029] Figure 2 is a plan view of a mounting head according to one embodiment of the present invention.

[0030] FIG. 3 is a partial cross-sectional view of the main body of the mounting head according to one embodiment of the present invention, taken along the line AA' of FIG. 2.

[0031] FIG. 4 is a partial cross-sectional view of the head portion of the mounting head according to one embodiment of the present invention, taken along the line BB' of FIG. 2.

[0032] FIG. 5 is a block diagram showing a configuration linked to a control unit of a mounting head according to one embodiment of the present invention.

[0033] FIG. 6 is a cross-sectional view taken along line CC' of FIG. 2, showing the basic state of a mounting head according to one embodiment of the present invention.

[0034] Figure 7 is a drawing showing the collet moving downward by the driving of the first motor in Figure 6.

[0035] Figure 8 is a drawing showing the collet moved upward again by the driving of the second motor in Figure 7.

[0036] The present invention is susceptible to various modifications and embodiments. Specific embodiments are illustrated in the drawings and described in detail in the description. However, this is not intended to limit the present invention to specific embodiments, but rather to encompass all modifications, equivalents, and alternatives falling within the spirit and technical scope of the present invention. In describing the present invention, identical components are identified by the same reference numerals even when illustrated in different embodiments.

[0037] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. When describing with reference to the drawings, identical or corresponding components are given the same reference numerals and redundant descriptions thereof will be omitted.

[0038] In the examples below, the terms first, second, etc. are not used in a limiting sense, but are used for the purpose of distinguishing one component from another.

[0039] In the examples below, singular expressions include plural expressions unless the context clearly indicates otherwise.

[0040] In the examples below, terms such as “include” or “have” mean that a feature or component described in the specification is present, and do not preclude the possibility that one or more other features or components may be added.

[0041] For convenience of explanation, the sizes of components in the drawings may be exaggerated or reduced. For example, the sizes and thicknesses of each component shown in the drawings are arbitrarily indicated for convenience of explanation, and thus the present invention is not necessarily limited to what is shown.

[0042] In some embodiments, where implementations are otherwise feasible, specific process sequences may be performed in a different order than described. For example, two processes described in succession may be performed substantially simultaneously, or in a reverse order from the described order.

[0043] The terminology used in this application is only used to describe specific embodiments and is not intended to limit the present invention. In this application, terms such as "comprise" or "have" are intended to indicate the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, but should be understood to not preclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0044] Fig. 1 is a front view of a mounting head according to an embodiment of the present invention. Fig. 2 is a plan view of a mounting head according to an embodiment of the present invention. Fig. 3 is a partial cross-sectional view of a main body of a mounting head according to an embodiment of the present invention, taken along line AA' of Fig. 2. Fig. 4 is a partial cross-sectional view of a head of a mounting head according to an embodiment of the present invention, taken along line BB' of Fig. 2. Fig. 5 is a block diagram showing a configuration linked to a control unit of a mounting head according to an embodiment of the present invention.

[0045] Hereinafter, referring to FIGS. 1 to 5, a mounting head according to one embodiment of the present invention includes a base (101), a first motor (100) mounted on the base (101), a spindle guide (30) connected to the first motor (100), a spindle (500) disposed inside the spindle guide (30) and capable of rotating and / or moving separately from the spindle guide (30), and a motor receiving portion (20) mounted on the upper side of the spindle guide (30).

[0046] At this time, the spindle guide (30) and spindle (500) are moved in the Z-axis direction by the first motor (100), and the spindle (500) is moved in the Z-axis direction separately from the spindle guide (30) by the second motor (200).

[0047] The mounting head according to the present embodiment may include a main body (1) and a head part (2). The main body (1) forms the main body of the mounting head, and serves as a position reference point of the mounting head, while simultaneously allowing the head part (2) to be moved to determine the position of the head part (2). The head part (2) moves around the main body (1) and can bond a semiconductor die or chip to a substrate.

[0048] The main body (1) may include a base (101). A first motor (100) may be mounted on the base (101). The first motor (100) is connected to a first rotational axis (110), and when the first motor (100) is driven, the first rotational axis (110) may rotate around an axis parallel to the Z1 axis of FIG. 4.

[0049] The first rotation shaft (110) can be connected to the second rotation shaft (120) on the lower side through a coupling (130). A ball screw part (121) is formed on the inner side of the second rotation shaft (120), and the ball screw part (121) can be coupled to the coupling (130). When the first motor (100) is driven, the rotational motion of the first rotation shaft (110) is transmitted to the rotational motion of the second rotation shaft (120), and at this time, the rotational motion of the first rotation shaft (110) can be converted into the linear motion of the second rotation shaft in the Z-axis direction by the ball screw part (121) of the second rotation shaft (120). The first rotation shaft (110) and the second rotation shaft (120) can be formed in a long cylindrical rod shape. The outer circumference of the ball screw portion (121) may be formed in a spiral screw shape, and the inner hollow portion of the second rotational shaft (120) may be formed in a spiral recessed shape corresponding to the shape of the outer circumference of the ball screw portion (121). When the ball screw portion (121) rotates, the second rotational shaft (120) may move up and down in the Z-axis direction along the spiral screw shape of the ball screw portion (121).

[0050] The first rotation axis (110) and the second rotation axis (120) can be formed with the Z-axis direction as the longitudinal direction. A rotation axis coupling portion (140) connected to the second rotation axis can be formed at the lower portion of the second rotation axis (120). A connection portion (150) can be formed between the rotation axis coupling portion (140) and the first base (160). The rotation axis coupling portion (140) is coupled to the second rotation axis (120) and can move up and down in the Z-axis direction together with the second rotation axis (120). The connection portion (150) can mutually couple the rotation axis coupling portion (140), the second rotation axis (120), and the first base (160).

[0051] The rotational axis coupling portion (140) may be formed to surround the second rotational axis (120). The first base (160) may be formed in a plate shape with a thickness and a direction perpendicular to the Z-axis direction as the plane direction. The connecting portion (150) may be coupled to the plane direction of the first base (160).

[0052] The first base (160) can be combined with the second base (170). The second base (170) is arranged parallel to the first base (160), and, like the first base (160), has a surface direction perpendicular to the Z-axis direction, and can be formed in a plate shape with a thickness.

[0053] The second base (170) may include a spindle upper connection portion (171) and a spindle lower connection portion (172). The spindle upper connection portion (171) and the spindle lower connection portion (172) may be respectively coupled to the spindle guide upper portion (31) and the spindle guide lower portion (32) of the spindle guide (30). The spindle upper connection portion (171) and the spindle lower connection portion (172) are formed to protrude in the direction in which the spindle guide (30) is located, and the spindle upper connection portion (171) and the spindle lower connection portion (172) may be respectively fitted into the recessed portions of the spindle guide upper portion (31) and the spindle guide lower portion (32).

[0054] The upper part of the spindle guide (31) may be formed to protrude outwardly from the spindle guide from the upper periphery of the spindle guide (30). The lower part of the spindle guide (32) may be formed to protrude outwardly from the spindle guide from the lower periphery of the spindle guide (30).

[0055] The head portion (2) may include a spindle guide (30) in which a spindle (500) is accommodated, and a motor receiving portion (20) arranged on the upper side of the spindle guide. Inside the motor receiving portion (20), a second motor (200), a rotational motor (400) connected to the second motor (200), and a load cell (300) arranged between the second motor (200) and the rotational motor (400) may be arranged. The second motor (200), the rotational motor (400), and the load cell (300) may move up and down in the Z-axis direction together with the motor receiving portion (20).

[0056] The spindle guide (30) can accommodate a spindle (500). The spindle (500) is connected to a rotation motor (400) and can move up and down in the Z-axis direction together with the rotation motor (400). The spindle guide (30) can move up and down in the Z-axis direction together with a motor receiving portion (20) coupled to the spindle guide from the upper side.

[0057] A spindle connection part (40) coupled with the spindle (500) may be arranged on the lower side of the spindle (500). An encoder (600) may be arranged on the side of the spindle connection part (40). An air gyro (50) coupled with the spindle connection part (40) is coupled on the lower side of the spindle connection part (40). The air gyro (50) may balance the head part (2) so that the head part (2) can maintain balance in the horizontal direction as a whole. A heater (700) may be arranged on the lower side of the air gyro (50). A collet (800) coupled with the heater (700) may be placed on the lower side of the heater (700). According to the present embodiment, the first motor (100) moves the entire head portion (2) connected to the spindle guide (30) in the Z-axis direction, and the second motor (200) moves the spindle (500) and the spindle connection portion (40) connected to the lower end of the spindle (500), the heater (700), and the collet (800) in the Z-axis direction.

[0058] That is, the first motor (100) moves all components of the head portion (2) to bring the component (C) adsorbed on the collet (800) closer to the surface of the substrate, thereby primarily determining the bonding position of the component. Thereafter, the height position difference that occurs as the solder for bonding the component melts can be precisely compensated for through the second motor (200).

[0059] For example, when melting and then solidifying the solder in a collet to bond a component to a substrate, the collet and spindle may thermally expand due to the temperature rise in the collet. This can lead to errors in the mounting position when precisely mounting the component to the desired location on the substrate. Furthermore, as the solder melts, it moves downward, requiring the collet to be slightly raised to compensate for the downward movement of the solder as it melts.

[0060] In this way, in addition to the rotation motor (400) for compensating for the misalignment of the Theta (θ) axis and the first motor (100) for controlling the bonding position in the Z-axis direction, compensation for a minute position error that may occur during bonding work at the position of the collet (800) primarily controlled by the first motor (100) as in this embodiment can be secondarily resolved through the operation of the second motor (200), so that the bonding position of the component (C) can be controlled more precisely.

[0061] In addition, according to this embodiment, a general bearing structure is deleted, and instead, a structure is adopted in which a rotation motor (400) and a spindle (500) for Theta axis compensation are directly coupled and rotate together, so that Theta value compensation through rotational position control can be performed more precisely.

[0062] According to the present embodiment, a control unit (con) may be further included. The control unit (con) may control the operation of the first motor (100), the second motor (200), and the rotary motor (400). At this time, the control unit (con) may separately control the first motor (100), the second motor (200), and the rotary motor (400).

[0063] For example, when mounting a component on a substrate, the control unit (con) transmits a control signal to the first motor (100), and according to the control signal, the first motor (100) can be driven so that the collet of the head unit (2) approaches downward (+Z direction) close to the substrate while holding the component, or so that it touches the substrate. In addition, when the solder moves downward during the soldering process for bonding the component to the substrate, the control unit (con) transmits a control signal to the second motor (200), and according to the control signal, the second motor (200) can minutely move the position of the collet (800) connected to the second motor (200) so that the collet (800) of the head unit (2) moves upward (-Z direction) by the amount that it is lowered by the solder. In addition, when the Theta angle error of a component bonded to a substrate needs to be corrected, the control unit (con) transmits a control signal to the rotation motor (400), and the rotation motor (400) can adjust the rotation angle of the component bonded to the substrate according to the control signal. The rotation motor (400) is connected to the second motor (200), and when the second motor (200) is driven and the coil unit (220) is lowered downward, it is lowered downward together with the coil unit (220) to adjust the rotation angle of the component.

[0064] The control unit (con) can lower the collet (800) to the contact surface of the substrate or component (C) and the substrate (S) of the first motor (100). At this time, if the component (C) of the collet (800) and the solder formed on the component (C) touch the substrate or the contact surface of the substrate, the control unit (con) can stop the operation of the first motor (100).

[0065] Afterwards, if it is necessary to finely adjust the position of the collet (800) due to the descent of the solder, etc., the control unit (con) can adjust the position of the collet (800) using the second motor (200) while the operation of the first motor (100) is stopped. At this time, the control unit (con) is arranged to be in contact with the second motor (200), and receives force information applied to the load cell (300) through the load cell (300) arranged between the collet (800) and the second motor (200), and can control the operation of the second motor (200) based on the force information applied to the load cell (300). The load cell (300) may be arranged between the rotary motor (400) and the second motor (200).

[0066] At this time, the load cell (300) can measure the force pressing the load cell (300), the reaction force generated when the collet (800) contacts the substrate with solder, the magnitude of the force generated by the solder melting and deformation, etc. The value measured through the load cell (300) is transmitted to the control unit (con), and the control unit (con) can control the operation of the second motor (200) based on the magnitude of the force transmitted from the load cell (300). For example, when the magnitude of the force transmitted from the load cell (300), i.e., the reaction force, is relatively large, the position of the collet (800) can be raised relatively more. Conversely, when the magnitude of the force transmitted from the load cell (300), i.e., the reaction force, is relatively small, the position of the collet (800) can be raised relatively less.

[0067] According to the present embodiment, a first rotation shaft (110) and a second rotation shaft (120) connected to a first motor and a coupling (130) connecting the first rotation shaft (110) and the second rotation shaft (120) may be further included. At this time, a ball screw part (121) is formed on the second rotation shaft (120), and the ball screw part (121) may be coupled with the coupling (130) together with the first rotation shaft (110). Here, the coupling (130) may convert the rotational motion of the first rotation shaft (110) into the rotational motion of the ball screw part (121). The rotational motion of the ball screw part (121) may be converted into the linear motion of the second rotation shaft (120) by the screw structure. Through this, as the second rotation shaft (120) moves in the Z-axis direction, the entire head part (2) may move up and down in the Z-axis direction together with the second rotation shaft (120).

[0068] According to the present embodiment, it further includes a connecting portion (150) connected to a second rotation shaft (120), a first base (160) connected to the connecting portion (150), and a second base (170) connected to the first base (160), and a spindle upper connecting portion (171) and a spindle lower connecting portion (172) are formed on the second base (170), and the spindle upper connecting portion (171) and the spindle lower connecting portion (172) can be connected to the upper portion (31) and the lower portion (32) of the spindle guide (30).

[0069] According to the present embodiment, the second motor (200) of the head unit (2) may be formed as a VCM (Voice Coil Motor) motor. Accordingly, the second motor (200) may include a permanent magnet unit (210) and a coil unit (220). When the second motor (200) is driven in response to the generation of a driving signal, the permanent magnet unit (210) maintains a state of being coupled to the inner upper portion of the motor receiving unit (20), and the coil unit (220) moves downward with respect to the permanent magnet unit (210), and the Z-axis direction width of the second motor (200) may increase. As the Z-axis width of the second motor (200) increases, the rotation motor (400), spindle (500), spindle connection (40), heater (700), and collet (800) connected to the lower end of the second motor (200) move by the increased width of the second motor (200), so that the bonding position of the component (C) adsorbed on the lower end of the collet (800) can be finely adjusted.

[0070] The rotary motor (400) can rotate the spindle (500) around the theta axis. The rotary motor (400) is placed inside the motor receiving portion (20), and can be placed between the second motor (200) and the spindle (500) inside the motor receiving portion (20).

[0071] A spindle (500) may be placed below the rotary motor (400). The spindle (500) is coupled to the rotary motor (400) and can rotate integrally when the rotary motor (400) rotates. In addition, the spindle (500) can be moved up and down in the Z-axis direction to correspond to the degree of width change of the second motor as the Z-axis width of the second motor changes when the second motor (200) is driven. The spindle (500) is placed on the inner hollow portion of the spindle guide (30) and can move and rotate independently from the spindle guide (30). The inner hollow portion of the spindle guide (30) is formed as a cylindrical space and is designed so that friction does not occur with the spindle guide when the spindle (500) rotates and moves up and down. The spindle (500) can be rotated around the Z1 axis.

[0072] A spindle connection part (40) may be arranged at the lower end of the spindle (500). At this time, the spindle connection part (40) may move in the Z-axis direction and the rotational direction together with the spindle (500). Here, an encoder (600) may be arranged in the lateral circumferential direction of the spindle connection part (40). The encoder (600) is arranged at a position adjacent to a heater (700) that increases the temperature of the collet (800), so as to measure thermal expansion displacement values ​​for peripheral components such as the spindle (500), the spindle connection part (40), and the collet (800). According to the present embodiment, the encoder (600) may include a Theta-axis displacement measuring part and a Z-axis displacement measuring part. Accordingly, the encoder (600) can measure both the Theta-axis displacement and the Z-axis displacement according to thermal expansion.

[0073] The displacement measured through the encoder (600) can be transmitted to the control unit (con). The control unit (con) can further reflect the displacement value measured through the encoder (600) when driving the second motor, thereby controlling the Z-axis and Theta-axis positions of the collet (800) more precisely.

[0074] A heater (700) may be placed at the lower end of the spindle connection portion (40). The heater (700) may be moved in the Z-axis direction and the rotational direction together with the spindle (500). The heater (700) may be heated to a temperature higher than the melting temperature of the solder formed on the component (C) to melt the solder. In addition, when the solder is to be solidified again for bonding, the control portion (con) turns off the heater (700) so that the solder can solidify through external air.

[0075] A collet (800) can be placed at the lower end of the heater (700). The collet (800) can also be moved in the Z-axis direction and rotational direction together with the spindle (500).

[0076] The collet (800) can vacuum-absorb a component (C), for example, a die or a chip. The control unit (con) transmits an absorption signal to the collet (800), and the collet (800) can absorb and transport the component (C) according to the absorption signal. At this time, solder can be formed at the part where the component (C) meets the substrate (S) and the adhesive surface of the substrate. When the molten solder meets the substrate or the adhesive surface of the substrate, and the solder solidifies in the contact state, the component (C) can be mounted on the substrate (S).

[0077] Fig. 6 is a cross-sectional view taken along line CC' of Fig. 2, showing the basic state of the mounting head according to one embodiment of the present invention. Fig. 7 is a drawing showing the collet moved downward by the driving of the first motor in Fig. 6. Fig. 8 is a drawing showing the collet moved upward again by the driving of the second motor in Fig. 7.

[0078] Fig. 6 is a drawing showing the basic state of the mounting head. At this time, as shown in Fig. 7, when the first motor is driven through the control unit (con), the first motor (100) can move the entire head unit (2) to the lower side where the substrate (S) is located. At this time, the solder (sol) formed on the lower side of the component (C) can come into contact with the substrate (S) or the adhesive surface of the substrate.

[0079] Referring to Fig. 8, it can be confirmed that as the solder (sol) is melted by the heating of the heater (700) and the melted solder (sol) moves downward, the collet (800) moves relatively upward. It can be confirmed that the collet (800) moves upward by the amount of width reduced as the permanent magnet portion (210) and coil portion (220) of the second motor (200) move.

[0080] While the present invention has been described with reference to the embodiments illustrated in the drawings, these are merely examples. Those skilled in the art will readily appreciate that various modifications and equivalent alternative embodiments are possible based on the embodiments described herein. Therefore, the true scope of technical protection of the present invention should be determined based on the appended claims.

[0081] Specific technical details described in the embodiments are merely examples and do not limit the technical scope of the embodiments. In order to describe the invention concisely and clearly, descriptions of conventional general techniques and configurations may be omitted. In addition, the connection or absence of connection between the lines of components illustrated in the drawings are merely examples of functional connections and / or physical or circuit connections, and in an actual device, they may be expressed as various functional connections, physical connections, or circuit connections that are replaceable or additional. In addition, if there is no specific mention such as "essential" or "important," it may not be a component absolutely necessary for the application of the present invention.

[0082] The terms "above" and "above" or similar designators used in the description and claims of the invention can refer to both singular and plural numbers, unless specifically limited. In addition, when a range is described in an embodiment, it is intended that the invention includes the application of individual values ​​falling within the range (unless otherwise stated), and it is equivalent to describing each individual value constituting the range in the description of the invention. In addition, unless the order of steps constituting a method according to an embodiment is explicitly stated or stated to the contrary, the steps can be performed in any appropriate order. The embodiments are not necessarily limited by the order in which the steps are described. The use of all examples or exemplary terms (e.g., "for example," etc.) in the embodiments is merely for the purpose of describing the embodiments in more detail, and the scope of the embodiments is not limited by the examples or exemplary terms, unless otherwise limited by the claims. In addition, those skilled in the art will recognize that various modifications, combinations, and variations can be configured according to design conditions and factors within the scope of the appended claims or their equivalents.

Claims

1. Base; A first motor mounted on the above base; A spindle guide connected to the first motor; A spindle disposed inside the spindle guide and capable of rotating and / or moving separately from the spindle guide; A motor receiving portion mounted on the upper side of the spindle guide; and Including a second motor arranged inside the motor receiving portion, The above spindle guide and the spindle are moved in the Z-axis direction by the first motor, The spindle is moved in the Z-axis direction separately from the spindle guide by the second motor, and the mounting head.

2. In paragraph 1, The above first motor moves the entire head portion connected to the spindle guide in the Z-axis direction, The second motor is a mounting head that moves the spindle and the spindle connection part connected to the lower end of the spindle, the heater, and the collet in the Z-axis direction.

3. In paragraph 1, A first rotation shaft and a second rotation shaft connected to the first motor; and Further comprising a coupling connecting the first rotation axis and the second rotation axis, A ball screw portion is formed on the second rotation axis, A mounting head in which the ball screw portion is screw-coupled with the coupling to change the rotational motion of the first rotational axis into linear motion of the second rotational axis.

4. In paragraph 3, A connecting portion connected to the second rotation axis; a first base coupled to the above connecting portion; and Further comprising a second base coupled to the first base, The second base above has a spindle upper connection portion and a spindle lower connection portion formed therein, The mounting head, wherein the spindle upper connection portion and the spindle lower connection portion are connected to the upper and lower portions of the spindle guide.

5. In paragraph 1, The above second motor is formed as a VCM (Voice Coil Motor), a mounting head.

6. In paragraph 5, The above second motor, Includes a permanent magnet section and a coil section, A mounting head in which, when a driving signal of the second motor is generated, the coil portion of the second motor moves in the Z-axis direction, and the spindle and the collet connected to the spindle also move in the Z-axis direction together with the coil portion.

7. In paragraph 1, Further comprising a control unit for driving the first motor, the second motor and the rotary motor, The above control unit, A mounting head that separately controls the first motor, the second motor, and the rotary motor.

8. In paragraph 1, It further includes a rotary motor that rotates the spindle about the theta axis, The above rotary motor is a mounting head disposed between the second motor and the spindle inside the motor receiving portion.

9. In paragraph 8, A mounting head in which a load cell is placed between the second motor and the rotary motor.

10. In paragraph 1, A spindle connection part is arranged at the lower end of the above spindle, The spindle connection part is a mounting head that moves in the Z-axis direction and rotational direction together with the spindle.

11. In paragraph 10, A mounting head in which an encoder is arranged in the circumferential direction of the above spindle connection portion.

12. In paragraph 10, A heater is placed at the lower end of the above spindle connection, The above heater is a mounting head that moves in the Z-axis direction and rotational direction together with the above spindle.

13. In paragraph 12, A collet is placed at the bottom of the above heater, The above collet is a mounting head that moves in the Z-axis direction and rotational direction together with the above spindle.

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