Semiconductor packaging apparatus

Abstract

Disclosed in the present invention is an apparatus. The apparatus is used in a semiconductor packaging process. A conventional method of using magazines to carry workpieces to be processed is eliminated, and the apparatus instead uses a conveying track or an automated guided vehicle to deliver the workpieces to a rack with a simple structure, or retrieve the workpieces from the rack, such that the labor cost and the cost of the magazines can be reduced during the process of mass-producing packages.

Description

A semiconductor packaging device Technical Field

[0001] This technology relates to production equipment used in semiconductor packaging manufacturing processes, as well as handling devices that operate in conjunction with such production equipment. Background Technology

[0002] In the conventional semiconductor packaging process, from the moment a chip is bonded to a lead frame or substrate to form an object (see Figure 2), until the object is divided into individual packages, the process involves chip bonding / flip chip bonding machines, plasma cleaning machines, and wire bonding machines. Production equipment such as bonding machines, molding machines, printers, and order cutters, each with its own processing devices for different processes like wire bonding or glue injection, still relies on magazines (used for over 30 years) to carry items for processing. These magazines, depending on their design, can hold 5 to 40 items or more. The addition of infeed or unfeeding devices for these magazines increases the size, weight, space, and cost of the equipment. Meanwhile, the known area of ​​frames, circuit boards, or supports for wafers is less than 100mm x 300mm, but the area is increasing, further increasing the size, weight, space, and cost of production equipment. Figure 1 shows a schematic diagram of conventional production equipment, using K&S as an example. Taking the GEN-S series RAPID fully automatic wire bonding machine as an example, the wire bonding machine 1 consists of an infeed device LD, an outfeed device UL, a main operating system OS, a platform 14, and a control box 18. The main operating system OS is connected to the platform 14 and has a display 11, a microscope 13, a processing platform 19, and a base 10. The processing platform 19 has a conveying device and a processing area composed of a pressure plate and a hot plate. The conveying device consists of components such as a clamp and a drive mechanism for moving the clamp position. The clamp moves to the infeed device LD to pick up the object located in the material box 30 and moves the object to the processing area multiple times from the front end. After the end of the object is also processed, the clamp picks up the object and moves it into the material box 30 located in the outfeed device UL. This cycle is repeated continuously so that the wire bonding machine 1 can automatically perform processing operations. The infeed device LD and the outfeed device UL are both connected to the platform 14. When the length, width, and height of the object containing the wafer are 300mm*100mm*0.The length, width, and height of the feeding device LD and the discharging device UL are all greater than 400mm*400mm*400mm. The feeding device LD and the discharging device UL are located on the feeding side or the discharging side of the processing platform 19, respectively, and are composed of an electronic circuit module, a drive device, a carrier 12, a guide rail L1, and a two-piece material box platform M, respectively. The carrier 12 is used to carry the material box 30, and the material box 30 can be moved up and down by the drive device, the guide rail L1, and the carrier 12, so that each item in the material box 30 is fed into the processing platform 19 one by one. The material box 30 of the discharging device UL automatically receives the items sent out from the processing platform 19 one by one until there are no items in the material box 30 on the feeding side, or the material box 30 on the discharging side is empty. After the material box 30 is filled with items, the feeding device LD automatically replaces it with another material box 30 carrying items to be processed, while the discharging device UL automatically replaces it with another empty material box 30. This cycle allows the wire bonding machine 1 to continuously perform processing operations. The control box 18 is connected to the platform 14, housing the electronic circuitry of the feeding device LD, the discharging device UL, and the main operating system OS, used to operate the production equipment. As businesses require cost reduction and more efficient management, manually or using automated guided vehicles (AGVs) to place or retrieve the material boxes 30 from the production equipment is no longer sufficient. Besides the high costs of labor and material boxes, the large size and weight of the material boxes 30 also make the handling platform costly or unreliable, thus inefficient.

[0003] Summary of the Invention

[0004] The object containing the chip is significantly smaller in height and weight than the box, which allows the feeding and / or discharging devices of new or known production equipment to be removed and replaced with a simple, small, and lightweight rack. This makes it easier to implement a low-height, low-weight, and low-cost handling platform when moving the object. Attached Figure Description

[0005] Figure 1: A schematic diagram of a conventional wire forming machine with a feeding device and a discharging device;

[0006] Figure 2: Schematic diagram of a wire punching machine with a shelf;

[0007] Figure 3: Schematic diagram of production equipment with storage space;

[0008] Figures 4-5: Schematic diagrams of the wire bonding machine and the transport platform;

[0009] Figure 6: Schematic diagram of a wire punching machine with a shelf;

[0010] Figure 7: Schematic diagram of multiple wire bonding machines sharing a microscope.

[0011] Symbol Explanation

[0012] 1, 1A, 1B, 1C, 1D. Wire bonding machine 10..........base

[0013] 11.........Displays 12, 12a, 72, 72a, 82. Carrier

[0014] 13.........Microscope 14.........Platform

[0015] 16, 17...shelves 18...control box

[0016] 19........Processing platform 20........Storage space

[0017] 30..........Box 40, 40a..........Object

[0018] 70, 7T, 80... transport platforms; 71, 81, L1... guide rails

[0019] 74, 74a, 84.... Transport vehicle 75, 85, 1R.... Extend arms

[0020] 90..........Support LD........Feeding device

[0021] M.........Material Box Station OS............Main Operating System

[0022] R.........Bar reader SK..........shelf

[0023] UL........Discharge device Y.........Conductor

[0024] Z.........Transmission line Zb........Identification component Detailed Implementation

[0025] This invention, using a direct object handling method, is applicable to production equipment such as wafer mounters, plasma cleaning machines, wire bonding machines, molding machines, printers, and order cutters for manufacturing packages. Figure 2 is a schematic diagram of a production equipment using a wire bonding machine as an example. This wire bonding machine 1A is based on the conventional K&S... Based on the GEN-S series RAPID fully automatic wire bonding machine, this machine is optimized without a feed (LD) and discharge (UL) device. It consists of a main operating system (OS), a platform 14, a control box 18, and two racks 16 and 17. The main operating system (OS) has the same features and symbols as the conventional main operating system (OS) shown in Figure 1. It is also connected to the platform 14 and includes a processing platform 19 and processing equipment. This processing equipment includes the main processing technology; in this embodiment, it is the wire bonding process. The processing platform 19 has a processing area, fixtures, and a drive mechanism for moving the fixtures to automatically transport objects 40 containing wafers. The side of the processing platform 19 can be configured as either a feed side or a discharge side, allowing objects to automatically move from the feed side of the processing platform 19 to the processing area, or automatically move from the processing area to the discharge side of the processing platform 19, depending on the production equipment. The infeed and discharge sides can be located on the same side or in the same position. The control box 18 is connected to the platform 14 to house the various electronic circuit modules for executing the operation of the wire bonding machine 1A. The two racks 16 and 17 are located on the infeed side or discharge side of the processing platform 19, respectively, and are respectively set to correspond to the processing platform 19 to facilitate the automatic feeding or retrieval of the object 40 into or out of the processing platform 19. Among them, the rack 16 is located on the infeed side, and the object 40 in the rack 16 can be automatically fed into the processing platform 19 by means of a clamp. Since the wire bonding machine 1A does not have the conventionally complex feeding device (LD) and discharging device (LD), and the racks 16 and 17 carry an object 40, the racks can be designed with a simple structure according to the volume of the object 40, so that the rack can be composed of at least one metal or plastic component, such as the object 40 having a volume of 300mm*100mm*0.If the height is 2mm, the volume of shelves 16 and 17 can be designed to be 300mm*110mm*4mm, making the volume of shelves 16 and 17 significantly smaller than the 400mm*400mm*400mm volume of the conventional feeding device (LD) and discharging device (UL) in Figure 1. In particular, the height of the feeding device (LD) of 400mm is 100 times that of the height of shelves 16 and 17 of 4mm. At the same time, the object 40 can be moved to shelf 16 or taken out of shelf 17 by personnel or a handling platform (70_Figure 4). In addition to the above advantages, the wire bonding machine 1A has at least the following advantages compared with the conventional wire bonding machine 1 in Figure 1: 1) Low equipment cost: Because the wire bonding machine 1A does not have a feeding device (LD) and a discharging device (UL), and the control box 18 is not 1) Reduced cost: The electronic circuit modules for accommodating the feed (LD) and discharge (UL) devices can be accommodated, thus lowering the unit purchase price; 2) Lower shelf cost: When producing items 40 of the same width, the shelves 16 and 17 installed on the wire bonding machine 1A do not need to be replaced, resulting in significantly lower usage of shelves 16 and 17 compared to the material box 30, reducing the cost of purchasing, storing, and managing material boxes; 3) Improved management efficiency: Since the wire bonding machine 1A lacks feed (LD) and discharge (UL) devices, ample space can be freed up on the feed or discharge side of the processing platform 19 for installing cameras, readers, or other equipment. These cameras or readers can capture data from barcodes, QR codes, or RFID tags associated with the items 40, which can be used for error prevention, production scheduling, and analysis to improve management efficiency.

[0026] Figure 3 is a schematic diagram of a production equipment with storage space, using a fully automatic wire bonding machine as an example. The diagrams within the dotted circles in the upper right and upper left corners of Figure 3 are top views of shelves 16 and 17, respectively. The symbol and features of the wire bonding machine 1B are similar to those of the wire bonding machine 1A shown in Figure 2. For similarities, please refer to the description in Figure 2. The difference is that a display (11) is not provided. The wire bonding machine 1B can be equipped with storage space 20, which can be in the form of a bracket, box, or platform, etc., for placing items such as wire boxes, capillary pins, hot plates, or pressure plates, or as a platform for personnel to inspect products. These items are transported and placed in storage space 20 using a transport platform (70 - see Figure 4). The storage space 20 can be set within or around the wire forming machine 1B. Figure 3 shows that the storage space 20 located in the shelf 16 area holds a box for a copper wire, so that the wire does not need to be delivered by personnel, thus saving manpower. The processed object 40 can be moved to the surface of the support 90 located around the shelf 17, and the surface of the support 90 is made into the storage space 20. Accordingly, personnel can use a microscope (13-see Figure 7) to inspect the objects placed on the shelves 16 and 17 of the wire forming machine 1B or on the storage space 20. In addition to reducing the time for personnel to move the object 40 out of the wire forming machine 1B to other locations for inspection and return, it can also avoid the phenomenon of mixing materials when personnel put the object 40 back into the wire forming machine 1B by placing it in the wrong wire forming machine (1B).

[0027] By using shelves to support objects, the production equipment, in addition to possessing the features and advantages shown in Figures 2 and 3, can also utilize a transport platform to move objects. This transport platform is an unmanned transport device and can be installed on the ceiling, floor, wall, column, or in front of or behind the production equipment to reduce personnel and costs associated with moving objects. The transport platform can directly pick up / place objects 40 on shelves 16 and 17 or on the work platform 19, allowing the wire-casting machine to have or not have shelves 16 and 17 as needed. Figure 4 is a schematic diagram of a fully automatic wire-casting machine and a transport platform, illustrating the use of wire-casting machines 1B and 1C with shelves 16 and 17 as examples. The features and symbols of wire-casting machines 1B and 1C are similar to those of wire-casting machines 1A and 1B in Figures 2 and 3; for similarities, please refer to the descriptions in Figures 2 and 3. The transport platform 80 is mounted on the floor and includes a guide rail 81, a carrier 82, a transport cart 84, and an extendable arm 85. The carrier 82 carries the object 40. The transport cart 84, after engaging with the guide rail 81, can move according to programmed instructions. Since the transport platform 80 is mounted on the floor, the guide rail 81 can be replaced with wheels. The extendable arm 85 is a repositionable robotic arm that engages with the transport cart 84 and the carrier 82, and is located between the transport cart 84 and the carrier 82. The extendable arm 85 allows the carrier 82 to be moved to a designated position, delivering the object 40 to the working platform 19 or racks 17 or 16 of the wire bonding machines 1B and 1C, and also to the working platform 19 or racks 17 or 16 of the wire bonding machines 1B and 1C. 40 is removed. Additionally, the transport platform 80 may also have an area for storing items 40 or material boxes 30. Another transport platform 70 is mounted on the ceiling and has a guide rail 71, a carrier 72, and a transport cart 74. The transport cart 74 can be driven by a motor, magnet, or other suitable method. The transport cart 74 can be located above, below, or to the side of the guide rail 71. After the transport cart 74 is engaged with the guide rail 71, it can move according to programmed instructions. The carrier 72 is engaged with the transport cart 74 and used to carry items 40. Simultaneously, the transport platform 70 may also have an extendable arm 75, which engages with the transport cart 74 and the carrier 72 and is located between the transport cart 74 and the carrier 72. The extendable arm 75 allows the carrier 72 to be moved to a designated position. Item 40 is delivered to the working platform 19 or racks 17 or 16 of the wire bonding machines 1B and 1C, and is taken out from the working platform 19 or racks 17 or 16 of the wire bonding machines 1B and 1C. When the transport platform 70 does not have an extension arm (75), other carriers or the carrier 82 of the transport platform 80 can be used to take the item 40 out of the carrier 72 of the transport platform 70 and move it to the working platform 19 or racks 16 or 17 of the wire bonding machines 1B and 1C, and take the item 40 out of the working platform 19 or racks 16 or 17 of the wire bonding machines 1B and 1C and move it to the carrier 72. Alternatively, the rack (16) of the wire bonding machine 1C can be combined with the extension arm 1R so that the rack 16 can be moved to a designated position to place or take out the item 40 into the carrier 72 of the transport platform 70.Alternatively, the transport platform 70 may have a power transmission line Z and a conductor Y. The power transmission line Z is disposed around or connected to the guide rail 71. Figure 4 shows it disposed around the guide rail 71 to receive and transmit external power. The conductor Y is located between the power transmission line Z and the transport vehicle 74 to receive and transmit power from the conductor Z to power the transport vehicle 74, enabling the battery, drive motor, and other electrical components (not shown) inside the transport vehicle 74 to operate normally. Meanwhile, the transport platform 70 has the power transmission line Z and the conductor... The characteristics of Y are independent of the handling of objects 40, allowing the transport platform 70 with the transmission line Z and conductor Y to be used in various indoor environments or processes, not just in the process of manufacturing packaging systems. Based on the above description, compared with the conventional wire bonding machine 1 and the material box 30 transporting objects 40 in Figure 1, it has at least the following advantages: 1) Low cost: The conventional material box 30 is about 200mm high, while the object 40 is less than 0.2mm high. When the material box 30 carries 40 objects 40, its volume is low. 1) The height and weight are significantly greater than that of object 40. Specifically, the height of material box 30 is approximately 1,000 times that of object 40. Therefore, when handling material box 30, platforms 70 and 80 are used, high-load, large-volume, and heavy-duty guide rails, load-bearing devices, handling carts, and extendable arms are required. Conversely, when handling object 40, platforms 70 and 80 can use low-load, small-volume, and lightweight guide rails, load-bearing devices, handling carts, and extendable arms. Therefore, for handling object 40, platforms 70 and 80, with their lower unit price, can be used. 2) High reliability: The guide rail is designed for handling object 40. If handling material box 30, the guide rail is prone to significant deformation after prolonged use due to the large size and weight of the handling platforms 70 and 80, the handling cart, and the extendable arm. This deformation could even render the guide rail unusable. To avoid deformation, a higher-grade and more expensive guide rail would be required. However, for handling object 40, the guide rail is less prone to deformation due to the smaller size and lighter weight of the handling platforms 70 and 80, the handling cart, and the extendable arm, resulting in higher reliability when handling object 40.

[0028] Figure 5 is a schematic diagram of a wire-casting machine and a transport platform. This transport platform 7T is similar to the transport platform 70 in Figure 4. For similarities, please refer to Figure 4 for explanation. The differences are in the transport vehicles and carriers. First, referring to the upper right of the figure, the transport vehicle 74 is connected in series with at least one transport vehicle 74a, so that the two transport vehicles 74 and 74a are like a train, which can transport at least two items 40 in one trip. Moreover, the transport vehicle 74a can reduce weight and cost by not having a power unit due to the traction of the transport vehicle 74. Next, referring to the center position at the top of the figure, one transport vehicle 74 is connected in series or in parallel with at least two carriers 72. The arrangement of the transport vehicles allows the trolley 74 to carry at least two items 40 in one trip. Referring to the upper left and lower left of the figure, the lower left is a side view of the carrier 72a in different embodiments. Each carrier 72a can carry at least two items 40, allowing the transport vehicle 74 to carry at least two items 40 in one trip. Various combinations derived from the transport vehicles 74, 74a, and carriers 72, 72a can reduce costs because the transport vehicle 74 carries at least two items 40 in one trip. For example, referring to the upper right or upper center of Figure 5, when carrier 72 is replaced by carrier 72a, the transport vehicle 74... At least four items 40 can be transported in one trip, making transportation more efficient and less costly. In addition, the carrier 72a can also be designed to carry only one item 40 as needed, making the carrier 72a more practical. The features and symbols of the wire-casting machine 1B are similar to those of the wire-casting machines 1A-1B in Figures 2-4. For the similarities, please refer to the descriptions in Figures 2-4. The difference is the rack, which can be used in combination with different carriers 72 and 72a according to different needs. For example, when the rack 16 is combined with the carrier 72a without items 40, the carrier 72a can support items from the transport platform 7T. For example, the shelf 16 can directly receive the carrier 72a from the transport platform 7T, and the carrier 72a has at least one item 40. Or, for example, after the carrier 72a on the shelf 17 carries the item 40, the carrier 72a can be moved away from the wire bonding machine 1B by the transport platform 7T as needed, or only the item 40 on the carrier 72a can be moved away from the wire bonding machine 1B. Through the above different usage methods of the shelf, the shelves 16 and 17 can hold at least one or two more items 40. Accordingly, the number of times the transport vehicle 74 is moved and the cost can be reduced.In addition, each of the aforementioned carriers 72 and 72a can be combined with different identification components Zb such as barcodes, QR codes, or RFID tags for production management or material tracking. Furthermore, the transport platforms 70 and 7T in Figures 4 and 5 are for transporting objects 40. The total height of the transport platforms 70 and 7T when transporting objects 40 is significantly lower than the total height of the transport platform of the conventional material box (30-Figure 1), typically reduced by the height of one material box or at least 15 centimeters. This allows sufficient space below the transport platforms 70 and 7T to install storage racks SK. Taking Figure 5 as an example, the storage racks SK are used to store objects 40 or material boxes, especially for storage. The storage rack SK for placing items 40 is located around the perimeter of the guide rail 71 and can be engaged or disengaged from the transport platforms 70 and 7T. It is positioned so as not to interfere with the transport vehicles 74 transporting items 40. It can be located below or on the lower side of the carriers 72 and 72a, particularly below them. Therefore, installing the storage rack SK reduces the number of storage cabinets for storing material boxes on the floor and minimizes the distance and time required for the carriers 72 and 72a to retrieve items 40, thereby reducing the space required for storage cabinets and the number and cost of the transport vehicles 74.

[0029] According to the method of handling objects, conventional production equipment can be modified to the style of the embodiments in Figures 2 to 5, or it can be slightly modified to achieve the method of handling objects. Figure 6 is a schematic diagram of a production equipment with a fully automatic wire bonding machine as an example. The symbol and features of the wire bonding machine 1D are similar to those of the conventional wire bonding machine 1 in Figure 1. For the similarities, please refer to the description in Figure 1. The difference is that the carrier 12a of the feeding device LD and the discharging device UL is combined with the racks 16 and 17, instead of carrying the conventional material box (30). In this embodiment, it is combined with one rack 16 and two racks 17 respectively. The racks 16 and 17 are used to carry objects 40, so that multiple racks 17 can be stacked together, or one rack 16 can carry one or more objects 40, so that the carrier 12a can carry multiple objects 40 by means of the racks 16 and 17. At the same time, the upper part or the short or long side of the shelves 16 and 17 can be open space, so that personnel or the carriers (72 and 82) of the transport platform (70, 80 - Fig. 4) can easily put or take out the item 40 from the shelves 16 and 17. Accordingly, the modified wire-making machine 1D, by means of the optimized carrier 12a and shelves 16 and 17, can also reduce the number of shelves or boxes and the cost. When using the transport platform (70, 80) to transport items, there is no need to modify or slightly modify the carrier of the transport platform. The shelves 16 and 17 are less restricted and more practical than the box (30). In addition, the conventional box (30) only has open space on the short side, and the item 40 can only be put or taken out from the short side. This makes it difficult or impossible for the extension arm and carrier of the transport platform (70, 80) to put or take out the item 40 into the box (30) and thus inefficient.

[0030] As the capabilities of equipment for producing packages become increasingly sophisticated, the underutilization of non-critical components in conventional production equipment leads to waste. Simultaneously, because production equipment does not use material boxes for handling, space previously allocated to infeed and / or unfeeding devices can be freed up for non-critical components. This allows multiple production machines to share a single non-critical component, reducing costs. Figure 7 is a schematic diagram of an embodiment where multiple production machines share a non-critical component, using a wire bonding machine and microscope as examples to illustrate the features and characteristics of the wire bonding machine 1B, 1C, and 1D. Similar to wire bonding machines 1B and 1C in Figures 2-4, please refer to the descriptions in Figures 2-4 for similarities. The difference is: the base, which is used for connecting the microscope, may or may not be connected to the wire bonding machine. In particular, it can be placed in the space freed up by the original feeding or discharging device of the wire bonding machine, or placed between two wire bonding machines. First, referring to wire bonding machine 1D and the adjacent wire bonding machine 1C, a base 10 and a microscope 13 are set in the space on the left side of wire bonding machine 1C, so that the microscope 13 can be connected to the two wire bonding machines 1C and 1D. The two wire bonding machines 1C and 1D can be switched between each other, allowing them to share a microscope 13. Next, referring to wire bonding machine 1B and the adjacent wire bonding machine 1C, a base 10 is installed in the space to the left of wire bonding machine 1C, and another base 10 and microscope 13 are installed in the space to the right of wire bonding machine 1B. The microscope 13 can be switched between the two wire bonding machines 1B and 1C, allowing them to share a microscope 13. Simultaneously, one or more additional wire bonding machines can be added between wire bonding machines 1B and 1C, enabling three... One or more wire bonding machines share one microscope 13. Next, referring to wire bonding machines 1B, 1C, and 1D, the base 10 is moved out of wire bonding machines 1B, 1C, and 1D and placed above or in front of wire bonding machines 1B, 1C, and 1D. In this embodiment, it is placed above the wire bonding machines. After the microscope 13 is engaged with the base 10, it can be switched between wire bonding machines 1B, 1C, and 1D, so that four wire bonding machines share one microscope 13. All of the above methods can reduce the number of microscopes and costs by allowing multiple wire bonding machines to share one microscope.

[0031] The above embodiments are merely illustrative of the principles and effects of this technology. Therefore, any equivalent modifications or alterations made without departing from the features of this disclosed technology should still be covered by the scope of the claims of this request.

Claims

1. A production apparatus suitable for wafer loading machines, plasma cleaning machines, wire bonding machines, molding machines, printers, and cutters for manufacturing packages, comprising a main operating system, a platform, and a control box, wherein the main operating system is coupled to the platform and comprises a processing platform and processing devices, the processing devices comprising the main processing technology, the processing platform having a processing area, fixtures, and a drive mechanism for moving the fixtures to automatically transport objects, and the side of the processing platform being configured as an infeed side or an outfeed side, such that objects can automatically move from the infeed side of the processing platform to the processing area, or automatically move from the processing area to the outfeed side, wherein the objects are coupled to at least one wafer.

2. The production equipment according to claim 1, characterized in that, The items are either delivered to the feed side of the production equipment by the transport platform, or removed from the discharge side of the production equipment by the transport platform.

3. The production equipment according to claim 1, characterized in that, It has a shelf for placing objects. The shelf is located on the inlet or outlet side of the processing platform and is set up correspondingly to the processing platform.

4. The production equipment according to claim 3, characterized in that, The items are either delivered to the feed side shelf by the transport platform or removed from the discharge side shelf by the transport platform.

5. The production equipment according to claim 3, characterized in that, The shelf is joined to a carrier, which carries at least one object, or the carrier has an identification component for identifying the object.

6. The production equipment according to claim 1, characterized in that, The production equipment is implemented as a wire bonding machine. At least one other wire bonding machine is added at the adjacent position of the wire bonding machine. At the same time, a base and a microscope are provided for the use of the wire bonding machine. The base can be connected to or not connected to the wire bonding machine, so that two or more wire bonding machines share a microscope. When the microscope is connected to the base, the microscope can be switched between at least two wire bonding machines, so that two or more wire bonding machines share a microscope.

7. The production equipment according to claim 1, characterized in that, The production equipment has storage space within or around the area for placing objects or other items. The items are transported to the storage space by a handling platform, and personnel can inspect the objects placed on the shelves or in the storage space using a microscope.

8. The production equipment according to claim 1, characterized in that, A camera or barcode reader is provided, located around the shelf, to capture identification component data associated with the object or carrier.

9. The production equipment according to claim 1, characterized in that, It has a feeding device and / or a discharging device, which are connected to the platform and located on the feeding side or the discharging side of the main operating system, respectively. The feeding device and the discharging device have at least a drive device, a guide rail, a carrier and a shelf. The carrier carries at least one shelf, which is used to carry objects that are combined with wafers.

10. A transport platform, used in conjunction with the production equipment according to any one of claims 1-9, the transport platform being for transporting objects, mounted on a ceiling or wall column, and having a transport cart, a carrier, and a guide rail, the carrier being for carrying objects, the transport cart being moved to a position according to programmed instructions after being combined with the guide rail, the carrier being combined with the transport cart to deliver objects to the shelf of the production equipment, or to remove objects from the shelf of the production equipment, wherein the objects are engaged with at least one wafer.

11. The transport platform according to claim 10, characterized in that, in, The transport platform shall have a transport vehicle that carries at least two carriers, which are connected in series or side by side, or the two transport vehicles shall be connected in series together.

12. The transport platform according to claim 10, characterized in that, The transport platform has an extendable arm located between the carrier and the transport vehicle to deliver items to the racks of the production equipment or to retrieve items from the racks of the production equipment.

13. The transport platform according to claim 10, characterized in that, The transport platform has storage racks located around the guide rails for placing items, and are positioned in a way that does not interfere with the transport vehicle's movement of items, either below or on the side below the carrier, especially below the carrier.

14. A transport platform used in conjunction with the production equipment according to any one of claims 1-9, the transport platform being mounted on a floor and moving according to programmed instructions, having a carrier, a transport cart, and an extendable arm, the carrier being for carrying objects, the extendable arm being a position-adjustable robotic arm engaged with the transport cart and the carrier and located between the transport cart and the carrier, the extendable arm moving the carrier to a designated position to place objects into or remove objects from the racks of the production equipment, while the objects are engaged with at least one wafer.

15. The transport platform according to claim 14, characterized in that, The transport platform has a storage bin for storing objects, which allows an extended arm to pick up objects from the bin or return objects to the bin.

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