Power conversion device and control panel

Abstract

A power conversion device (10) is provided with a heat sink (4), a semiconductor module (2A), a fin (8), a peripheral circuit member (5), and a heat diffusion member (9). The heat sink (4) has a first surface (41). The semiconductor module (2A) is disposed on the first surface (41). The fin (8) is positioned apart from the semiconductor module (2A). The peripheral circuit member (5) is disposed between the semiconductor module (2A) and the fin (8) in a planar view of the first surface (41). The heat diffusion member (9) extends so as to overlap, in a planar view, at least one of the fin (8), the semiconductor module (2A), and the peripheral circuit member (5).

Description

Power converters and control panels

[0001] The present disclosure relates to a power conversion device and a control panel.

[0002] Conventionally, control panels installed in elevator hoistways have been known. Because hoistways are narrow, miniaturization of control panels is required. The control panel has a power conversion device inside, and miniaturization of the control panel is possible by reducing the height of the power conversion device. In Japanese Patent Application Laid-Open Publication No. 2005-261016, fins arranged on a heat sink and semiconductor modules constituting a power conversion circuit are arranged in the same area, thereby miniaturizing the power conversion device.

[0003] Japanese Patent Application Laid-Open No. 2005-261016

[0004] However, since peripheral circuit components constituting peripheral circuits other than the power conversion circuit are arranged on the heat sink, there is room for improvement in miniaturization while increasing the packaging density of the power conversion device.

[0005] The present disclosure has been made to solve the above-mentioned problems, and an object of the present disclosure is to provide a power conversion device that is miniaturized while improving packaging density, and a control panel equipped with the power conversion device.

[0006] A power conversion device according to the present disclosure includes a heat sink, a semiconductor module, fins, peripheral circuit members, and a heat diffusion member. The heat sink has a first surface. The semiconductor module is disposed on the first surface. The fins are disposed spaced apart from the semiconductor module. The peripheral circuit members are disposed between the semiconductor module and the fins in a plan view of the first surface. The heat diffusion member extends to overlap the fins and at least one of the semiconductor module and the peripheral circuit members in a plan view.

[0007] A control panel according to the present disclosure includes the above-described power conversion device and a resistor.

[0008] According to the above, it is possible to obtain a power conversion device that is miniaturized while improving packaging density, and a control panel that includes the power conversion device.

[0009] 1 is a schematic diagram showing the internal structure of an elevator hoistway according to embodiment 1. FIG. 2 is a circuit diagram of a control panel according to embodiment 1. FIG. 3 is a schematic perspective view of a power conversion device according to embodiment 1. FIG. 4 is a schematic perspective view of a power conversion device according to embodiment 1. FIG. 5 is a schematic plan view of a power conversion device according to embodiment 1. FIG. 6 is a schematic plan view of a power conversion device according to embodiment 1. FIG. 7 is a schematic side view of a power conversion device according to embodiment 1. FIG. 8 is a schematic plan view of a power conversion device according to embodiment 1. FIG. 9 is a schematic side view of a power conversion device according to embodiment 2. FIG. 10 is a schematic side view of a power conversion device according to embodiment 3. FIG. 11 is a schematic plan view of a control panel according to embodiment 4. FIG. 12 is a schematic side view of a control panel according to embodiment 4. FIG. 13 is a circuit diagram of a control panel according to embodiment 5. FIG. 14 is a schematic side view of a power conversion device according to embodiment 5. FIG. 15 is a schematic side view of a first variant of a power conversion device according to embodiment 5. FIG. 16 is a schematic side view of a second variant of a power conversion device according to embodiment 5.

[0010] Hereinafter, embodiments of the present disclosure will be described. Unless otherwise specified, the same or corresponding parts in the following drawings will be denoted by the same reference numerals, and the description thereof will not be repeated.

[0011] Embodiment 1. <Elevator Configuration> Figure 1 is a schematic diagram showing the internal structure of an elevator hoistway 200 according to Embodiment 1. The elevator shown in Figure 1 is an elevator with a rope drive system. The elevator according to Embodiment 1 does not have a machine room for accommodating a hoisting machine 700 and a control panel 100. Inside the elevator hoistway 200, the control panel 100, a conveying unit 300, a wire 400, two pulleys 500, a weight 600, and the hoisting machine 700 are arranged.

[0012] The transport unit 300 carries passengers or loads objects to be transported. The transport unit 300 is, for example, a car. The transport unit 300 moves up and down inside the elevator shaft 200.

[0013] Two pulleys 500 are disposed below the conveying unit 300. The wires 400 are connected to the pulleys 500. The wires 400 support the conveying unit 300. The pulleys 500 are disposed between the wires 400 and the conveying unit 300.

[0014] The weight 600 is suspended from the wire 400 so that the conveying section 300 and the weight 600 are balanced.

[0015] The wire 400 is connected to a hoist 700. The hoist 700 includes, for example, a motor. The hoist 700 winds up or winds down the wire 400, thereby raising or lowering the conveying section 300.

[0016] As described above, the elevator according to the first embodiment does not have a machine room for accommodating the hoisting machine 700 and the control panel 100. Therefore, the control panel 100 and the hoisting machine 700 are arranged inside the hoistway 200. The control panel 100 is arranged, for example, on the inner wall of the hoistway 200. The control panel 100 may be arranged between the inner wall of the hoistway 200 and the area in which the conveying unit 300 travels. The control panel 100 may have a thin shape so as not to interfere with the movement of the conveying unit 300. Note that the position of the hoisting machine 700 or the number of pulleys 500 are not limited to these.

[0017] The control panel 100 is electrically connected (not shown) to the hoisting machine 700. The control panel 100 supplies power to the hoisting machine 700 so that the hoisting machine 700 operates as desired.

[0018] 2 is a circuit diagram of a control panel 100 according to the first embodiment. The control panel 100 includes an inverter circuit 1, a peripheral circuit 2, and a resistor 20. The inverter circuit 1 includes, for example, a semiconductor module 2A, a semiconductor module 2B, a capacitor module 3, a heat sink 4 (not shown), and a wiring member (not shown). The wiring member electrically connects the semiconductor module 2A, the semiconductor module 2B, the capacitor module 3, and the heat sink 4.

[0019] The semiconductor module 2A is electrically connected to the hoisting machine 700. The semiconductor module 2B is electrically connected to a busbar 701 of the building in which the elevator is installed. The semiconductor module 2B receives three-phase AC power from the busbar 701. The received three-phase AC power is converted by the inverter circuit 1. The inverter circuit 1 controls the hoisting machine 700 by converting the three-phase AC power.

[0020] The peripheral circuit 2 is a circuit that ensures the proper functioning of circuits included in the control panel 100, such as the inverter circuit 1. The peripheral circuit 2 is, for example, a control circuit, a safety circuit, a power supply circuit, etc. The peripheral circuit 2 includes peripheral circuit members 5. The peripheral circuit members 5 may be, for example, power supply circuit components that supply power to each circuit. The peripheral circuit 2 is not limited to the hoisting machine 700 and the bus bar 701, but may also be connected to other devices 702, for example.

[0021] The control panel 100 includes a power conversion device 10. The control panel 100 may include circuit components other than the power conversion device 10, such as a resistor 20.

[0022] The power conversion device 10 includes components that constitute an inverter circuit 1. The power conversion device 10 may also include peripheral circuit members 5 that constitute a peripheral circuit 2.

[0023] The resistor 20 is electrically connected to the inverter circuit 1. When the hoisting machine 700 performs a regenerative operation, regenerative power is generated in the hoisting machine 700. The regenerative power is consumed as Joule heat generated in the resistor 20.

[0024] <Configuration of power conversion device> Figures 3 and 4 are schematic perspective views of the power conversion device 10 according to embodiment 1. Figures 5 and 6 are schematic plan views of the power conversion device 10 according to embodiment 1. Figure 7 is a schematic side view of the power conversion device 10 according to embodiment 1. Note that in Figures 4, 6, and 7, the outline of the wind tunnel 6 is shown by a dotted line, and for the sake of convenience of explanation, Figures 4, 6, and 7 illustrate the internal structure of the wind tunnel 6.

[0025] As described above, the power conversion device 10 shown in Figures 3 to 7 is housed inside the control panel 100. The power conversion device 10 mainly includes the inverter circuit 1 and the peripheral circuit members 5 of the peripheral circuit 2. Specifically, as shown in Figures 3 and 4, the power conversion device 10 includes the heat sink 4, the semiconductor module 2A, the semiconductor module 2B, the capacitor module 3, the peripheral circuit members 5, the air channel 6, the fan 7, the fins 8, and the heat diffusion member 9 (see Figure 7).

[0026] The inverter circuit 1 is composed of a heat sink 4, a semiconductor module 2A, a semiconductor module 2B, and a capacitor module 3.

[0027] The vertically upward direction is defined as the y direction. The vertically downward direction (-y direction) is the direction in which gravitational acceleration is applied. As shown in Figures 3 to 7, the directions perpendicular to the z direction are defined as the x direction and y direction. The y direction is perpendicular to the x direction.

[0028] The heat sink 4 has a first surface 41, a second surface 42, a third surface 43, and a fourth surface 44. The z direction is perpendicular to the first surface 41. The x direction and the y direction are horizontal to the first surface 41. The x direction is the short-side direction of the first surface 41. The y direction is the long-side direction of the first surface 41.

[0029] The second surface 42 is located opposite the first surface 41 in the z direction. That is, the first surface 41 and the second surface 42 are both end surfaces of the heat sink 4 in the z direction. The third surface 43 and the fourth surface 44 are continuous with the first surface 41 and the second surface 42, respectively. The third surface 43 is located opposite the fourth surface 44 in the y direction. That is, the third surface 43 and the fourth surface 44 are both end surfaces of the heat sink 4 in the y direction.

[0030] As shown in FIG. 4, on the first surface 41, the semiconductor module 2A, the semiconductor module 2B, the capacitor module 3, the peripheral circuit members 5, the air channel 6, the fan 7, and the fins 8 are arranged.

[0031] The semiconductor module 2A and the semiconductor module 2B may be connected to the first surface 41 by any method. Each of the semiconductor module 2A and the semiconductor module 2B may be fixed to the first surface 41 using a contact thermal resistance reducing member (not shown) such as thermally conductive grease.

[0032] 5 and 6, the semiconductor module 2B is disposed between the partition member 61 and the semiconductor module 2A in the y direction. Each of the semiconductor module 2A and the semiconductor module 2B may have a screw terminal. The screw terminals are connected to wiring members. The semiconductor module 2A and the semiconductor module 2B are connected to each other via wiring members (not shown). The wiring members may be, for example, electric wires or bus bars.

[0033] The capacitor module 3 includes a capacitor circuit board, a plurality of capacitors, and a support portion. The capacitor circuit board is disposed at a distance from the first surface 41. The capacitor circuit board is supported by the support portion. A plurality of capacitors are disposed on the front surface of the capacitor circuit board. The rear surface of the capacitor circuit board is directly connected to the semiconductor module 2A. This configuration can suppress a voltage rise that occurs when the semiconductor module 2A is switched. As a result, the capacitance of the capacitor circuit board can be reduced. In other words, the capacitor module can be made smaller.

[0034] 6, the peripheral circuit members 5 are disposed between the partition members 61 and the fins 8 in the y direction. From a different perspective, the peripheral circuit members 5 are disposed between the semiconductor module 2A and the fins 8, and between the semiconductor module 2B and the fins 8 in the y direction.

[0035] 7, the peripheral circuit members 5 are arranged on the first surface 41 side where the semiconductor modules 2A, 2B, and fins 8 are arranged. From a different perspective, the peripheral circuit members 5 are arranged in the region where the first surface 41 is arranged when viewed from the second surface 42 in the z direction.

[0036] 7, the peripheral circuit member 5 includes a peripheral circuit board, a plurality of components, and a support portion. The peripheral circuit board is disposed apart from the first surface 41. The peripheral circuit board is supported by the support portion. A plurality of components are disposed on the front and back surfaces of the peripheral circuit board.

[0037] The fins 8 are arranged at a distance from the semiconductor module 2A. The power conversion device 10 is arranged inside the control panel 100 so that the fins 8 face vertically upward (y direction) when viewed from the semiconductor module 2A.

[0038] 7, the fins 8 are arranged on the first surface 41 side where the semiconductor module 2A, the semiconductor module 2B, and the peripheral circuit members 5 are arranged. From a different perspective, the fins 8 are arranged in the region where the first surface 41 is arranged in the z direction when viewed from the second surface 42. As shown in FIG. 7, the fins 8, the semiconductor module 2A, and the semiconductor module 2B are arranged on the same plane.

[0039] Arranging the fins 8 on the second surface 42 increases the height H of the power conversion device 10 in the z direction. On the other hand, in the power conversion device 10 according to the first embodiment, arranging the fins 8 on the first surface 41 can reduce the height H of the power conversion device 10 in the z direction. As a result, the power conversion device 10 can be made more compact. The height H is the height of the power conversion device 10 in the z direction, and is, for example, the distance from the second surface 42 to the upper wall 63 (see FIG. 7 ).

[0040] The fins 8 may be formed of multiple metal plates or may be formed of a single corrugated fin processed into an accordion-like shape. The fins 8 may be fixed to the heat sink 4 by any method. Specifically, the fins 8 may be fixed to the heat sink 4 by being crimped to the first surface 41, or may be fixed to the heat sink 4 by brazing.

[0041] 6 , in a plan view of the first surface 41, the semiconductor module 2A, the semiconductor module 2B, and the peripheral circuit members 5 are each arranged so as to overlap a portion of the fin 8 in the y direction. In other words, when viewed from the y direction, the semiconductor module 2A, the semiconductor module 2B, and the peripheral circuit members 5 are each arranged so as to overlap a portion of the fin 8.

[0042] Fig. 8 is a schematic plan view of the power conversion device 10 according to embodiment 1. In Fig. 8, the outlines of the cavity h, the semiconductor module 2A, the semiconductor module 2B, the peripheral circuit member 5, the fins 8, and the heat diffusion member 9 are indicated by dotted lines so that the positional relationship between the cavity h, the semiconductor module 2A, the semiconductor module 2B, the peripheral circuit member 5, the fins 8, and the heat diffusion member 9 can be understood.

[0043] As shown in Fig. 8, a cavity h is provided inside the heat sink 4. The number of cavities h formed inside the heat sink 4 may be one, two or more, or as shown in Fig. 8, five.

[0044] Specifically, the cavity h includes cavities h1, h2, h3, h4, and h5. Each of the cavities h1, h2, h3, h4, and h5 may be a through-hole formed to reach from the third surface 43 to the fourth surface 44.

[0045] A heat diffusion member 9 is disposed inside the cavity h. The heat diffusion member 9 may be fixed inside the cavity h by any method. Specifically, the heat diffusion member 9 may be fixed inside the cavity h by crimping, brazing, or soldering.

[0046] 8, the heat diffusion member 9 includes heat diffusion members 91, 92, 93, 94, and 95. That is, the heat diffusion members 91, 92, 93, 94, and 95 are disposed inside the cavities h1, h2, h3, h4, and h5, respectively. The heat diffusion member 9 extends in the y direction. The heat diffusion member 9 can transport heat from one end to the other end.

[0047] The heat diffusion member 9 may be, for example, a heat pipe or a vapor chamber. The heat pipe is cylindrical. The vapor chamber may be a vessel in which a small amount of working fluid is vacuum-sealed. The vessel may have a capillary structure on its inner wall.

[0048] As shown in FIGS. 3 and 4 , an air channel 6 is formed on the first surface 41. As will be described later, the interior of the air channel 6 forms an airflow path (air passage). The air channel 6 is formed by a partition member 61, a pair of side walls 62, and an upper wall 63. As shown in FIG. 5 , the partition member 61 is disposed between the semiconductor module 2A and the peripheral circuit member 5 in a plan view of the first surface 41. The partition member 61 is also disposed between the semiconductor module 2B and the peripheral circuit member 5 in a plan view of the first surface 41. In this manner, the partition member 61 blocks the movement of air between the semiconductor modules 2A and 2B and the peripheral circuit member 5. In other words, the air flowing into the air channel 6 does not move toward the semiconductor modules 2A and 2B.

[0049] The semiconductor modules 2A and 2B operate at a higher temperature than the peripheral circuit members 5. Therefore, if the peripheral circuit members 5 are placed near the semiconductor modules 2A and 2B, the peripheral circuit members 5 may become too hot due to air and radiation. As a result, the frequency of failures in the peripheral circuit members 5 may increase, and the circuit may operate unexpectedly. In particular, if the peripheral circuit members 5 and the semiconductor module 2A are placed inside the air tunnel 6, the temperature inside the air tunnel 6 will rise. As a result, heat dissipation from the peripheral circuit members 5 will be hindered.

[0050] On the other hand, in the power conversion device 10 according to the first embodiment, the semiconductor module 2A and the peripheral circuit members 5 are arranged to be separated from each other by the partition member 61. Therefore, the peripheral circuit members 5 are insulated from the semiconductor module 2A by heat. As a result, the peripheral circuit members 5 can be used at an appropriate temperature.

[0051] The pair of side walls 62 face each other in the x direction. The pair of side walls 62 are arranged to sandwich the peripheral circuit member 5, the fan 7, and the fins 8. The top wall 63 is continuous with the pair of side walls 62. The top wall 63 faces the first surface 41 in the z direction. The top wall 63 is arranged spaced apart from the first surface 41 in the z direction. In this manner, the air tunnel 6 is formed by the partition member 61, the pair of side walls 62, and the top wall 63.

[0052] As shown in Fig. 7 , the fan 7 is disposed inside the air tunnel 6. The fan 7 blows air to the fins 8. In the first embodiment, the fan 7 is disposed between the fins 8 and the peripheral circuit members 5 in the y direction. The number of fans 7 may be one, two as shown in Fig. 4 , or three or more. The number of fans 7 may be increased depending on the total heat generation amount of the power conversion device 10.

[0053] An opening 65 through which wind flows in is provided in a part of the air tunnel 6. In a plan view of the first surface 41, the opening 65 is arranged so as to overlap with the peripheral circuit member 5. The opening 65 is arranged between the control panel 100 and the elevator shaft 200. The opening 65 is formed by a pair of side walls 62, an upper wall 63, and a partition member 61.

[0054] 3, a filter 64 is disposed so as to cover the opening 65. The filter 64 is, for example, a dust filter. In this manner, when wind flows into the wind tunnel 6 from the opening 65, dust can be prevented from entering the wind tunnel 6.

[0055] An opening 66 through which air flows out is provided in a part of the air tunnel 6. The opening 66 is disposed in a position facing the partition member 61 in the air tunnel 6. The opening 66 is formed by a pair of side walls 62, an upper wall 63, and the first surface 41.

[0056] The air path formed when the fan 7 is driven will be described. When the fan 7 is driven, air flows into the air tunnel 6 from the opening 65. As the air flows into the air tunnel 6 from the opening 65, it passes through the filter 64. The air that has passed through the filter 64 passes through the fan 7 inside the air tunnel 6. The air that has passed through the fan 7 passes through gaps formed in the fins 8. The air that has passed through the gaps formed in the fins 8 flows out through the opening 66. In this manner, heat generated in the peripheral circuit components 5 comes into contact with the air that has flowed into the air tunnel 6 and is dissipated by forced convection.

[0057] Here, a feature of the power conversion device 10 according to the first embodiment is that, as shown in FIG. 8, in a plan view of the first surface 41, the heat diffusion member 9 extends so as to overlap the fins 8 and at least one of the semiconductor module 2A and the peripheral circuit member 5.

[0058] 8, a portion of the semiconductor module 2B overlaps with the semiconductor module 2A in the y direction. A portion of the semiconductor module 2B does not have to overlap with the semiconductor module 2A in the y direction. A portion of the peripheral circuit member 5 overlaps with the semiconductor module 2A and the semiconductor module 2B in the y direction. The peripheral circuit member 5 does not have to overlap with the semiconductor module 2A and the semiconductor module 2B in the y direction. In other words, the peripheral circuit member 5 may overlap with at least one of the semiconductor module 2A and the semiconductor module 2B in the y direction.

[0059] 8 , in a plan view of the first surface 41, the heat diffusion member 91 is arranged to overlap the fins 8, the peripheral circuit member 5, and the semiconductor module 2B. In a plan view of the first surface 41, the heat diffusion member 92 is arranged to overlap the fins 8, the peripheral circuit member 5, the semiconductor module 2B, and the semiconductor module 2A. In a plan view of the first surface 41, the heat diffusion members 93 and 94 are arranged to overlap the fins 8, the peripheral circuit member 5, and the semiconductor module 2A. In a plan view of the first surface 41, the heat diffusion member 95 is arranged to overlap the fins 8 and the semiconductor module 2A.

[0060] Since the amount of heat generated in the semiconductor module 2A is relatively large, a large number of heat diffusion members 9 may overlap the semiconductor module 2A. Since the amount of heat generated in the semiconductor module 2B is relatively smaller than that of the semiconductor module 2A, the number of heat diffusion members 9 overlapping the semiconductor module 2B may be smaller than the number of heat diffusion members 9 overlapping the semiconductor module 2A.

[0061] For example, if the amount of heat generated in semiconductor module 2A is about four times that generated in semiconductor module 2B, the number of heat diffusion members 9 overlapping semiconductor module 2A may be four. The number of heat diffusion members 9 overlapping semiconductor module 2B may be one. In this way, semiconductor module 2A and semiconductor module 2B can operate at temperatures close to each other.

[0062] In a plan view of the first surface 41, the semiconductor modules 2A and 2B are arranged in a staggered pattern. Therefore, the length of the heat diffusion member 91 in the y direction may be shorter than the length of each of the heat diffusion members 92, 93, 94, and 95 in the y direction. In this manner, the arrangement or size of the heat diffusion member 9 is adjusted depending on the arrangement of components arranged on the heat sink 4 or the heat generation amount of these components, thereby efficiently dissipating heat from the fins 8. As a result, the heat dissipation performance of the power converter 10 is improved, allowing for an increased number of components, such as peripheral circuit components 5, that can be mounted on the power converter 10. In other words, a more compact power converter 10 can be obtained while improving the mounting density. Note that "mounting density" here refers to the ratio of components to the total volume of the power converter 10.

[0063] Here, the heat dissipation paths in the semiconductor module 2A, the semiconductor module 2B, the capacitor module 3, and the peripheral circuit member 5 will be described.

[0064] The semiconductor modules 2A and 2B dissipate heat through forced convection and natural convection. Heat generated in the semiconductor modules 2A and 2B is transferred to the heat sink 4. The heat transferred to the heat sink 4 is then transferred to the heat diffusion member 9. The heat transferred to the heat diffusion member 9 is transferred from one end to the other end of the heat diffusion member 9 and then to the fins 8. Because the fan 7 brings air into contact with the fins 8, the heat transferred to the fins 8 is dissipated by forced convection. Furthermore, the heat generated in the semiconductor modules 2A and 2B is dissipated by natural convection through direct contact with the air.

[0065] The heat generated in the capacitor module 3 is dissipated by natural convection when the capacitor module 3 comes into direct contact with air.

[0066] The peripheral circuit member 5 dissipates heat by forced convection. The heat generated in the peripheral circuit member 5 is dissipated by forced convection when it comes into contact with the air flowing into the air channel 6.

[0067] <Operation and Effect> A power conversion device 10 according to the present disclosure includes a heat sink 4, a semiconductor module 2A, fins 8, peripheral circuit members 5, and a heat diffusion member 9. The heat sink 4 has a first surface 41. The semiconductor module 2A is disposed on the first surface 41. The fins 8 are disposed spaced apart from the semiconductor module 2A. The peripheral circuit members 5 are disposed between the semiconductor module 2A and the fins 8 in a plan view of the first surface 41. The heat diffusion member 9 extends so as to overlap the fins 8 and at least one of the semiconductor module 2A and the peripheral circuit members 5 in a plan view.

[0068] In this way, by changing the arrangement of the heat diffusion member 9 depending on the arrangement of the components arranged on the heat sink 4 or the heat generation amount of the components, heat can be efficiently released from the fins 8. As a result, the heat dissipation performance of the power conversion device 10 is improved, and it is possible to increase the number of components such as peripheral circuit members 5 that can be mounted on the power conversion device 10. In other words, it is possible to obtain a power conversion device 10 that is miniaturized while improving the mounting density.

[0069] According to the power conversion device 10, the direction in which the fins 8 are arranged is vertically upward (y direction) when viewed from the semiconductor module 2A.

[0070] In this way, it is possible to obtain a miniaturized power conversion device 10 while improving the packaging density. As a result, the control panel 100 can be made thinner, and can be placed in the elevator shaft 200. By making the control panel 100 thinner, the control panel 100 is prevented from interfering with the movement of the transport unit 300.

[0071] The power conversion device 10 includes a fan 7. The fan 7 blows air to the fins 8. This allows the heat generated in the peripheral circuit members 5 and the semiconductor module 2A to be efficiently released by forced convection.

[0072] The power converter 10 includes a partition member 61. The partition member 61 is disposed between the semiconductor module 2A and the peripheral circuit member 5 when the first surface 41 is seen in plan view.

[0073] In this way, the partition member 61 blocks the movement of air between the semiconductor module 2A and the peripheral circuit member 5. In other words, the air flowing into the air channel 6 does not move toward the semiconductor module 2A. By arranging the peripheral circuit member 5 in the air path, the peripheral circuit member 5 can be directly cooled. In other words, the air comes into contact with the peripheral circuit member 5, allowing the peripheral circuit member 5 to efficiently dissipate heat through forced convection. As a result, the peripheral circuit member 5 can be used at an appropriate temperature. In this way, the peripheral circuit member 5 can be made smaller.

[0074] Furthermore, in a plan view of the first surface 41, the heat diffusion member 9 extends so as to overlap the fins 8 and at least one of the semiconductor module 2A and the peripheral circuit member 5, thereby enabling the inverter circuit 1 and the peripheral circuit member 5 to be cooled by a single air path. In other words, heat generated in the semiconductor module 2A, the semiconductor module 2B, and the peripheral circuit member 5 is transferred to the fins 8 via the heat diffusion member 9, and therefore, by arranging the fins 8 in the air path, the heat dissipation performance of the power conversion device 10 is improved. As a result, the number of components used for the fan 7 or the air channel 6 can be reduced, allowing the control panel 100 to be made smaller.

[0075] Furthermore, the semiconductor module 2A and the peripheral circuit members 5 are disposed apart from each other via the partition member 61. Therefore, the peripheral circuit members 5 are insulated from the semiconductor module 2A by heat, and as a result, the peripheral circuit members 5 can be used at an appropriate temperature.

[0076] According to the power conversion device 10 described above, the fan 7 is disposed between the fins 8 and the peripheral circuit member 5 in a plan view of the first surface 41 .

[0077] This allows forced convection to dissipate heat from the peripheral circuit members 5. In the power converter 10, the semiconductor module 2A and the fins 8 are arranged on the same plane.

[0078] In this way, the height H of the power conversion device 10 is reduced, and as a result, the power conversion device 10 can be made smaller.

[0079] Second Embodiment <Configuration of Power Conversion Apparatus> Fig. 9 is a schematic side view of a power conversion apparatus 10 according to a second embodiment. Fig. 9 corresponds to Fig. 7. The power conversion apparatus 10 shown in Fig. 9 basically has the same configuration as the power conversion apparatus 10 shown in Figs. 1 to 8 and can obtain the same effects, but the arrangement of the fan 7 is different.

[0080] Specifically, the fan 7 is arranged along the opening 65. The fan 7 is arranged directly below the filter 64 in the z direction. In the z direction, the fan 7 is arranged between the peripheral circuit member 5 and the filter 64.

[0081] The air path formed when the fan 7 is driven will be described. When the fan 7 is driven, wind flows into the wind tunnel 6 from the opening 65. As the wind flows into the wind tunnel 6 from the opening 65, it passes through the filter 64. The wind that has passed through the filter 64 passes through the fan 7. The wind that has passed through the fan 7 passes through gaps formed in the fins 8 inside the wind tunnel 6. The wind that has passed through the gaps formed in the fins 8 flows out from the opening 66.

[0082] By doing so, it is possible to reduce the width L of the power conversion device 10 in the y direction. The width L in the y direction is the distance in the y direction from the third surface 43 to the fourth surface 44 of the heat sink 4, as shown in Fig. 9 . In a plan view of the first surface 41, the fan 7 is arranged so as to overlap the peripheral circuit member 5, so that the width L can be reduced. As a result, it is possible to reduce the size of the power conversion device 10 in the y direction.

[0083] Furthermore, the visibility of the rotation state of the fan 7 is improved. The control panel 100 disposed in the elevator hoistway 200 is periodically maintained. At that time, it is necessary to check whether the fan 7 is operating normally. When performing maintenance on the power conversion device 10 according to the second embodiment, the working surface of the worker coincides with the rotation plane of the fan 7. Therefore, the rotation state of the fan 7 can be easily checked through the filter 64.

[0084] Furthermore, the heat dissipation performance of the peripheral circuit member 5 is locally improved. By arranging the peripheral circuit member 5 downwind of the fan 7, the fan 7 can directly blow air onto the peripheral circuit member 5. Therefore, even if a localized area of ​​heat generation occurs in the peripheral circuit member 5, the temperature of that area can be suppressed.

[0085] Third Embodiment <Configuration of Power Conversion Apparatus> Fig. 10 is a schematic side view of a power conversion apparatus 10 according to a third embodiment. Fig. 10 corresponds to Fig. 7. Fig. 11 is a schematic plan view of the power conversion apparatus 10 according to the third embodiment. Fig. 11 corresponds to Fig. 8. The power conversion apparatus 10 shown in Figs. 10 and 11 basically has the same configuration as the power conversion apparatus 10 shown in Figs. 1 to 8 and can obtain the same effects, but the arrangement of the fins 8 is different.

[0086] Specifically, the heat diffusion member 9 includes an exposed portion 9a. The exposed portion 9a is formed at the other end of the heat diffusion member 9. The exposed portion 9a extends from the inside (cavity h) of the heat sink 4 to the outside.

[0087] By doing this, the heat diffusion member 9 is exposed to the outside of the heat sink 4, and when the exposed portion 9a comes into contact with the wind, the heat generated in each of the semiconductor modules 2A and 2B is efficiently dissipated from the fins 8.

[0088] 10 , the exposed portion 9 a is bent in a direction perpendicular to the first surface 41. In a side view of the heat diffusion member 9, the exposed portion 9 a has an L-shape. From a different perspective, the exposed portion 9 a is bent in the z direction from the second surface 42 toward the region where the first surface 41 is located.

[0089] The fins 8 do not have to be arranged on the first surface 41. As described above, it is sufficient that the fins 8 are arranged on the first surface 41 side where the semiconductor modules 2A, 2B, and peripheral circuit members 5 are arranged. From a different perspective, it is sufficient that the fins 8 are arranged in the region where the first surface 41 is arranged as viewed from the second surface 42 in the z direction, and they may be arranged spaced apart from the first surface 41 in the z direction.

[0090] The fins 8 are connected to the bent portions of the exposed portion 9 a. The fins 8 may be connected to the exposed portion 9 a by any method, and may be fixed to the exposed portion 9 a by, for example, crimping a plurality of metal plates to the exposed portion 9 a. The plurality of metal plates may be arranged parallel to the first surface 41 of the heat sink 4.

[0091] 11 , in a plan view of the first surface 41, the bent portions of the exposed portion 9 a may be arranged in a staggered pattern. In this way, the bent portions of the exposed portion 9 a are spaced apart from each other. As a result, the variation in temperature distribution of the fins 8 is suppressed. The suppression of the variation in temperature distribution improves the heat dissipation performance of the power conversion device 10.

[0092] <Effects> According to the power conversion device 10, the heat diffusion member 9 includes the exposed portion 9 a. The exposed portion 9 a extends from the inside (cavity h) of the heat sink 4 to the outside. The exposed portion 9 a is bent in a direction perpendicular to the first surface 41.

[0093] In this way, the heat diffusion member 9 is exposed to the outside of the heat sink 4, and when the exposed portion 9a comes into contact with the wind, the heat generated in each of the semiconductor modules 2A and 2B is efficiently dissipated from the fins 8.

[0094] Furthermore, by arranging the bent portions of the exposed portion 9 a in a staggered pattern, the bent portions of the exposed portion 9 a are spaced apart from each other, which reduces the variation in temperature distribution of the fins 8 and improves the heat dissipation performance of the power conversion device 10.

[0095] Furthermore, the improvement in heat dissipation performance of the power conversion device 10 allows the area of ​​the fins 8 to be reduced when viewed from the top of the first surface 41. As a result, the area occupied by the fins 8 in the power conversion device 10 can be reduced. Also, the width L of the heat sink 4 in the y direction can be reduced. This allows the power conversion device 10 to be made smaller and lighter.

[0096] Fourth Embodiment <Configuration of Control Panel> Figures 12 and 13 are schematic plan views of a control panel 100 according to a fourth embodiment. Figure 14 is a schematic side view of the control panel 100 according to the fourth embodiment. Figure 13 shows the internal structure of the housing 30, with the top wall 31 of the housing 30 not shown. In Figure 13, the outline of the wind tunnel 6 is indicated by a dotted line. The control panel 100 shown in Figures 12 to 14 includes a power conversion device 10, a resistor unit 21, and the housing 30. Although not shown, the control panel 100 may also include a door that can be opened by an operator.

[0097] As shown in Fig. 14, the power conversion device 10 and the resistance unit 21 are disposed in the internal space of a housing 30. Specifically, the housing 30 has an upper wall 31 and a lower wall 32. The internal space of the housing 30 is formed by the upper wall 31 and the lower wall 32. The upper wall 31 is, for example, a work surface. The lower wall 32 faces the upper wall 31 in the z direction. The lower wall 32 faces, for example, an inner wall of the elevator shaft 200.

[0098] The material constituting the housing 30 is, for example, metal. As shown in FIG. 14 , the power conversion device 10 and the resistor unit 21 are arranged on a bottom wall 32. The heat sink 4 is connected to the bottom wall 32 at a second surface 42. In the y direction, the resistor unit 21 is arranged downwind of the air channel 6. Specifically, as shown in FIG. 14 , the resistor unit 21 is arranged at the top (the highest region in the y direction) of the housing 30. From a different perspective, in the y direction, the air channel 6 is arranged between the resistor unit 21 and the semiconductor module 2A.

[0099] In this way, the air that comes into contact with the resistance unit 21 is forced to move upward by the fan 7. In other words, the air that has come into contact with the resistance unit 21 and has become hot flows out through the openings n2 and n3 without stagnating.

[0100] The resistor unit 21 includes a resistor 20. As described above, the resistor 20 is electrically connected to the inverter circuit 1. When the elevator performs regenerative operation, regenerative power is generated in the hoisting machine 700. The regenerative power is consumed as heat by the resistor 20. Therefore, the resistor unit 21 becomes hot when consuming power.

[0101] The number of resistance units 21 may be one or more, and may be four as shown in Fig. 13. The resistance units 21 are fixed to the lower wall 32. The resistance units 21 may be attached to the lower wall 32 using one metal fitting 22, or may be attached to the lower wall 32 using two metal fittings 22.

[0102] 12, openings n1, n2, and n3 are formed in the housing 30. Opening n1 is provided in the upper wall 31. In a plan view of the first surface 41, opening n1 is disposed so as to overlap opening 65. Wind flows in through opening n1.

[0103] As shown in Fig. 12, opening n2 is provided in the upper wall 31. In a plan view of the first surface 41, opening n2 is arranged to overlap the area in the y direction where the resistance unit 21 is arranged. As shown in Fig. 13, opening n3 is provided in the lower wall 32. In a plan view of the first surface 41, opening n3 is arranged to overlap the area in the y direction where the resistance unit 21 is arranged. The wind that has passed through the wind tunnel 6 flows out from opening n2 and opening n3.

[0104] 12 and 13 , the shape of each of the openings n2 and n3 in the plan view of the first surface 41 may be rectangular. The shape of each of the openings n2 and n3 in the plan view of the first surface 41 may be circular or wire mesh. The upper wall 31 and the lower wall 32 may be slit-punched metal in which a plurality of slits are formed as the openings n1 and n2.

[0105] The airflow path FP formed when the fan 7 is driven will be described. When the fan 7 is driven, wind flows into the air tunnel 6 through the openings n1 and 65. As the wind flows into the air tunnel 6 from the opening 65, it passes through the filter 64. The wind that has passed through the filter 64 passes through the air tunnel 6. The wind that has passed through the air tunnel 6 passes through the fan 7. The wind that has passed through the fan 7 passes through gaps formed in the fins 8. The wind that has passed through the gaps formed in the fins 8 flows from the opening 66 into the area where the resistor unit 21 is located. By flowing into the area where the resistor unit 21 is located, the wind comes into contact with the resistor unit 21. Heat generated in the resistor unit 21 is dissipated by forced convection. The heat that has come into contact with the resistor unit 21 flows out of the control panel 100 through the openings n2 and n3. In this manner, the resistor unit 21 can be cooled.

[0106] <Operation and Effect> The control panel 100 according to the present disclosure includes the power conversion device 10 and the resistor 20 .

[0107] In this way, when the elevator performs a regenerative operation, regenerative power is generated in the hoisting machine 700. As a result, the regenerative power is consumed as heat by the resistor 20.

[0108] The control panel 100 has an air passage FP formed therein through which air passes from the power converter 10 toward the resistor 20 .

[0109] In this way, the resistor unit 21 can be cooled by forced convection. Also, the temperatures of the peripheral circuit members 5, semiconductor module 2A, and semiconductor module 2B can be reduced. As a result, the heat dissipation performance of the power conversion device 10 and the control panel 100 is improved, and the number of components such as the peripheral circuit members 5 that can be mounted on the power conversion device 10 can be increased. In other words, it is possible to obtain a miniaturized power conversion device 10 and a control panel 100 including the power conversion device 10 while improving the mounting density.

[0110] Fifth Embodiment <Circuit of Control Panel> Fig. 15 is a circuit diagram of a control panel 100 according to a fifth embodiment. Fig. 15 corresponds to Fig. 2. The control panel 100 shown in Fig. 15 basically has the same configuration as the control panel 100 shown in Fig. 2 and can obtain the same effects, but differs in that the inverter circuit 1 includes a reactor 15 as the coil 11.

[0111] 15 , reactor 15 is electrically connected to semiconductor module 2A, semiconductor module 2B, and peripheral circuit 2. In this way, inverter circuit 1 is provided with reactor 15, thereby reducing harmonic currents generated from inverter circuit 1. As a result, the influence of harmonic currents on the building's power supply system and peripheral circuit 2 of inverter circuit 1 can be suppressed.

[0112] The reactor 15 may be a core type such as a toroidal reactor, or may be a shell type. The reactor 15 includes an electric wire and a core around which the electric wire is wound. The core may be a dust core or may be made of steel.

[0113] <Configuration of power conversion device> Fig. 16 is a schematic side view of a power conversion device 10 according to embodiment 5. Fig. 16 corresponds to Fig. 9. As shown in Fig. 16, the power conversion device 10 includes a coil device 14. The coil device 14 includes a coil 11 (reactor 15), a case 12, and a sealing portion 13.

[0114] As shown in Fig. 16, the coil 11 is housed in the case 12. The sealing portion 13 is filled in so that no gap is formed between the inner wall of the case 12 and the coil 11. From a different perspective, the coil 11 and the sealing portion 13 are disposed inside the case 12. Note that in Fig. 16, part of the case 12 is not shown so that the positions of the coil 11 and the sealing portion 13 can be seen.

[0115] The material that constitutes the case 12 may be a thermally conductive material, such as aluminum (Al) or iron (Fe). The material that constitutes the sealing portion 13 may be, for example, a resin. The sealing portion 13 may contain a particulate filler. The filler may be made of non-conductive aluminum hydroxide or alumina.

[0116] The coil device 14 is disposed on the first surface 41. The case 12 is fixed to the heat sink 4 and is in contact with the first surface 41. In this manner, heat generated in the coil 11 is transferred to the heat sink 4 via the case 12. By improving the heat dissipation performance of the coil 11, the power conversion device 10 can be made smaller.

[0117] The coil device 14 does not need to include the case 12 and the sealing portion 13. In other words, as long as the heat generated in the coil 11 is transferred to the heat sink 4, the coil 11 may be fixed directly to the heat sink 4.

[0118] In the power conversion device 10 according to the fifth embodiment, the case 12 is arranged at a distance from the partition member 61 and each of the semiconductor modules 2A and 2B, but the case 12 may also be arranged so as to be in contact with the partition member 61.

[0119] The relationship between the amounts of heat generated by the semiconductor module 2A, semiconductor module 2B, coil 11, and peripheral circuit member 5 arranged on the first surface 41 will now be described. The amounts of heat generated increase in the order of semiconductor module 2A, semiconductor module 2B, coil 11, and peripheral circuit member 5. In other words, of the semiconductor module 2A, semiconductor module 2B, coil 11, and peripheral circuit member 5, the amount of heat generated by the semiconductor module 2A is the largest, and the amount of heat generated by the peripheral circuit member 5 is the smallest. The amount of heat generated by the coil 11 is smaller than that of the semiconductor module 2B, but larger than that of the peripheral circuit member 5.

[0120] 16 , in consideration of the relationship between the amounts of heat generated by the semiconductor module 2A, the semiconductor module 2B, the coil 11, and the peripheral circuit member 5, the semiconductor module 2A, the semiconductor module 2B, the coil 11, and the peripheral circuit member 5 may be arranged in this order from left to right along the y direction. From a different perspective, the coil device 14 may be arranged between the semiconductor modules 2A, 2B and the peripheral circuit member 5 in the y direction, and the coil 11 may be arranged between the semiconductor modules 2A, 2B and the partition member 61 in the y direction in a plan view of the first surface 41. In this way, the heat diffusion member 9 can be used to efficiently dissipate heat from electronic components such as the semiconductor module 2A, the semiconductor module 2B, the coil 11, and the peripheral circuit member 5.

[0121] The arrangement of the electronic components arranged on the first surface 41 may be changed depending on the amount of heat generated by each electronic component.

[0122] The coil 11 is disposed outside the air tunnel 6 (between the bulkhead 61 and the semiconductor modules 2A, 2B). This arrangement allows the wiring connecting the coil 11 to the semiconductor modules 2A, 2B to be shortened. As a result, a miniaturized power conversion device 10 can be obtained.

[0123] <Configuration of Modification 1 of Power Converter> Fig. 17 is a schematic side view of Modification 1 of the power converter 10 according to Embodiment 5. Fig. 17 corresponds to Fig. 16 . The power converter 10 shown in Fig. 17 basically has the same configuration as the power converter 10 shown in Fig. 16 and can achieve the same effects, but differs in that the case 12 and the partition member 61 are integrally configured. From a different perspective, a portion of the case 12 is formed by the partition member 61. In other words, the material constituting the case 12 may be the same as the material constituting the partition member 61.

[0124] In this way, the case 12 and the partition member 61 are integrally configured, which allows for further miniaturization of the power conversion device 10. Furthermore, fewer components are required to manufacture the power conversion device 10, which reduces the cost of the power conversion device 10.

[0125] <Configuration of Modified Example 2 of Power Conversion Apparatus> Fig. 18 is a schematic side view of Modified Example 2 of power conversion apparatus 10 according to embodiment 5. Fig. 18 corresponds to Fig. 17. Power conversion apparatus 10 shown in Fig. 18 basically has the same configuration as power conversion apparatus 10 shown in Fig. 17 and can obtain the same effects, but differs in that fins 8 (second fin portions 82) are provided on partition member 61 that forms part of case 12.

[0126] The fins 8 include a first fin portion 81 and a second fin portion 82. The first fin portion 81 is disposed downwind of the peripheral circuit member 5 and is provided on the first surface 41 of the heat sink 4. The second fin portion 82 is provided on the partition member 61 that forms part of the case 12. In other words, the peripheral circuit member 5 is sandwiched between the first fin portion 81 and the second fin portion 82 in the y direction. The fan 7 is disposed directly below the filter 64 in the z direction. The second fin portion 82 is disposed below the fan 7 in the z direction.

[0127] When the fan 7 is driven, wind flows into the wind tunnel 6 from the opening 65. When the wind flows into the wind tunnel 6 from the opening 65, it passes through the filter 64. The wind that has passed through the filter 64 passes through the fan 7. Within the wind tunnel 6, the wind that has passed through the fan 7 passes not only through the gaps formed in the first fin portion 81 but also through the gaps formed in the second fin portion 82.

[0128] In this way, the heat generated in the coil 11 is dissipated by forced convection when it comes into contact with the air flowing into the air tunnel 6. In other words, the coil 11 is cooled not only by the heat sink 4 but also by forced convection when it comes into contact with the air flowing into the air tunnel 6. As a result, the coil 11 can be further miniaturized.

[0129] <Operation and Effect> The power conversion device 10 includes the coil 11. The coil 11 is disposed between the semiconductor modules 2A, 2B and the partition member 61 in a plan view.

[0130] This allows the semiconductor modules 2A, 2B, coil 11, and peripheral circuit members 5 to efficiently dissipate heat in accordance with the heat generation amount of the electronic components. Also, the wiring members connecting the coil 11 and the semiconductor modules 2A, 2B can be shortened. As a result, a miniaturized power conversion device 10 can be obtained.

[0131] The power conversion device 10 includes a case 12. The case 12 houses the coil 11. The case 12 is fixed to the heat sink 4.

[0132] In this way, heat generated in the coil 11 is transferred to the heat sink 4 via the case 12. By improving the heat dissipation performance of the coil 11, the power conversion device 10 can be made smaller.

[0133] According to the power conversion device 10, the case 12 and the partition member 61 are integrally formed.

[0134] This allows for further miniaturization of the power conversion device 10. Furthermore, fewer components are required to manufacture the power conversion device 10, which reduces the cost of the power conversion device 10.

[0135] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The basic scope of the present disclosure is defined by the claims, not the above description, and is intended to include all modifications within the meaning and scope of the claims.

[0136] REFERENCE SIGNS LIST 1 inverter circuit, 2 peripheral circuit, 2A semiconductor module, 2B semiconductor module, 3 capacitor module, 4 heat sink, 5 peripheral circuit member, 6 wind tunnel, 7 fan, 8 fin, 81 first fin portion, 82 second fin portion, 9, 91, 92, 93, 94, 95 heat diffusion member, 9a exposed portion, 10 power conversion device, 11 coil, 12 case, 13 sealing portion, 14 coil device, 15 reactor, 20 resistor, 21 resistor unit, 22 metal fitting, 30 housing, 31 upper wall, 32 lower wall, 41 first surface, 42 second surface, 43 third surface, 44 fourth surface, 61 partition member, 62 side wall, 63 upper wall, 64 filter, 65 opening, 66 opening, 100 control panel, 200 elevator shaft, 300 conveying section, 400 wire, 500 pulley, 700 hoisting machine, 701 busbar, 702 equipment, FP air path, h, h1, h2, h3, h4, h5 cavity, L width, H height, n1, n2, n3 opening.

Claims

1. A power conversion device comprising: a heat sink having a first surface; a semiconductor module arranged on the first surface; fins arranged at a distance from the semiconductor module; peripheral circuit members arranged between the semiconductor module and the fins in a planar view of the first surface; and a heat diffusion member extending to overlap the fins and at least one of the semiconductor module and the peripheral circuit members in the planar view.

2. The power conversion device according to claim 1, wherein the fins are arranged vertically upward when viewed from the semiconductor module.

3. The power conversion device according to claim 1 or 2, further comprising a fan for blowing air onto the fins.

4. The power conversion device according to claim 3, further comprising a partition member disposed between the semiconductor module and the peripheral circuit member in the plan view.

5. The power conversion device according to claim 4, further comprising a coil disposed between the semiconductor module and the partition member in the plan view.

6. The power conversion device according to claim 5, further comprising a case for accommodating said coil, said case being fixed to said heat sink.

7. The power conversion device according to claim 6, wherein the case and the partition member are integrally formed.

8. The power conversion device according to any one of claims 3 to 7, wherein the fan is disposed between the fins and the peripheral circuit members in the plan view.

9. A power conversion device as described in any one of claims 1 to 8, wherein the heat diffusion member includes an exposed portion extending from the inside to the outside of the heat sink, and the exposed portion is bent along a direction perpendicular to the first surface.

10. A power conversion device according to any one of claims 1 to 9, wherein the semiconductor module and the fins are arranged on the same plane.

11. A control panel comprising the power conversion device according to any one of claims 1 to 10 and a resistor.

12. The control panel according to claim 11, wherein the control panel is formed with an air passage through which air passes from the power conversion device toward the resistor.

Images