Imaging device for satellite

Abstract

According to an embodiment, an imaging device for a satellite may comprise: a support frame; an optical system installed on the support frame; an imaging module having an image sensor capable of detecting light transmitted from the optical system; a control module having an image processor capable of generating an image by using the light detected by the image sensor; a module support having one side supporting the imaging module and the other side fixed to the control module; and wiring for interconnecting the imaging module and the control module. The thermal expansion coefficient of the module support may be higher than the thermal expansion coefficient of the support frame.

Description

Imaging device for artificial satellites

[0001] The disclosure below relates to an imaging device for artificial satellites.

[0002] An artificial satellite is an artificial device launched by a rocket to orbit a planet, and can take images of the Earth using the imaging device mounted on the satellite.

[0003] Imaging devices for satellites typically include multiple optical elements and supporting structures. To achieve the designed optical performance, the fabrication, assembly, and alignment of each component of the imaging device are crucial.

[0004] Meanwhile, the manufacturing, assembly, and alignment of these components can be performed in a clean room at temperatures of approximately 20 degrees Celsius. However, actual satellites operate in diverse space environments, making thermal deformation of the structure highly likely. Consequently, image quality may deteriorate as the optical system's focus shifts from the designed position.

[0005] The related art mentioned above is possessed or acquired during the process of deriving the present disclosure and cannot necessarily be said to be prior art disclosed to the general public prior to the filing of the present disclosure.

[0006] According to one embodiment, an imaging device for an artificial satellite includes: a support frame; an optical system installed on the support frame; an imaging module having an image sensor capable of detecting light transmitted from the optical system; a control module having an image processor capable of generating an image using light detected by the image sensor; a module supporter having one side supporting the imaging module and the other side fixed to the control module; and wiring interconnecting the imaging module and the control module, wherein a thermal expansion coefficient of the module supporter may be higher than a thermal expansion coefficient of the support frame.

[0007] According to one embodiment, the length of the wiring is formed to be longer than the distance between the imaging module and the control module based on room temperature, and the wiring can be formed of a flexible material so that the shape can be changed in response to a change in the volume of the module support according to the ambient temperature.

[0008] In one embodiment, the coefficient of thermal expansion of the module support is 20.0 x 10- 6 / ℃ is greater than, and the coefficient of thermal expansion of the support frame is 2.0 x 10 -6 / may be less than ℃.

[0009] In one embodiment, the imaging device for the artificial satellite may not include a heater on the module support that provides a higher amount of heat per unit time than the image sensor and the image processor.

[0010] According to one embodiment, the imaging device for the artificial satellite may further include a heat sink disposed on the opposite side of the module support with respect to the control module.

[0011] According to one embodiment, the control module further includes a control board supporting the image processor, and the image processor can be arranged on the opposite side of the module support body with respect to the control board.

[0012] According to one embodiment, the module support may include: a body portion; a first fastening portion formed on the body portion and configured to fix the image sensor to the module support; and a second fastening portion formed on the body portion and configured to fix the control module to the module support.

[0013] According to one embodiment, the module support may further include: a support protrusion for supporting the image sensor; a plurality of leg portions extending long from the body portion; and a guide groove positioned between the plurality of leg portions and through which the wiring can pass.

[0014] According to one embodiment, the imaging module may further include a sensor board on which the image sensor is installed; and a sensor fixture for fixing the image sensor on the sensor board.

[0015] Figure 1 is a drawing showing an artificial satellite orbiting a planet according to one embodiment.

[0016] FIG. 2 is a drawing showing an imaging device for an artificial satellite according to one embodiment.

[0017] FIG. 3 is a perspective view showing an imaging module and peripheral components combined according to one embodiment.

[0018] FIG. 4 is an exploded perspective view showing the connection structure of an imaging module and peripheral components according to one embodiment.

[0019] Figure 5 is a perspective view of a module support according to one embodiment.

[0020] FIG. 6 is a drawing showing an imaging device for an artificial satellite according to one embodiment.

[0021] Specific structural or functional descriptions of the embodiments are disclosed for illustrative purposes only and may be modified and implemented in various forms. Therefore, the actual implementation is not limited to the specific embodiments disclosed, and the scope of this specification includes modifications, equivalents, or alternatives included in the technical concepts described in the embodiments.

[0022] Although terms such as "first" or "second" may be used to describe various components, these terms should be interpreted solely to distinguish one component from another. For example, a first component may be referred to as a second component, and similarly, a second component may also be referred to as a first component.

[0023] When it is said that a component is "connected" to another component, it should be understood that it may be directly connected or connected to that other component, but there may also be other components in between.

[0024] Singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, the terms "comprises" or "has" should be understood to indicate the presence of a described feature, number, step, operation, component, part, or combination thereof, but not to exclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0025] In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" may include any one of the items listed together in that phrase, or all possible combinations thereof.

[0026] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art. Terms defined in commonly used dictionaries should be interpreted to have a meaning consistent with their meaning in the context of the relevant technology, and will not be interpreted in an idealized or overly formal sense unless explicitly defined herein.

[0027] Hereinafter, embodiments will be described in detail with reference to the attached drawings. In the description with reference to the attached drawings, identical components are assigned the same reference numerals regardless of the drawing numbers, and redundant descriptions thereof will be omitted.

[0028] Components included in one embodiment and components with common functions will be described using the same names in other embodiments. Unless otherwise stated, the descriptions given in one embodiment may also apply to other embodiments, and detailed descriptions will be omitted to the extent of overlap.

[0029]

[0030] Figure 1 is a drawing showing an artificial satellite orbiting a planet according to one embodiment.

[0031] Referring to FIG. 1, an artificial satellite (A) according to one embodiment may orbit along a set orbit around a planet (E) (e.g., Earth). The artificial satellite (A) may include an imaging device for photographing the planet (E) or a space environment. The imaging device may include a plurality of optical elements and an image sensor for detecting light received therethrough. In order to improve the quality of an image captured by the imaging device, the image sensor may be arranged in consideration of a focal length determined according to the shape and positional relationship of the plurality of optical elements.

[0032] Meanwhile, the artificial satellite (A) is subjected to diverse and extreme space environments. For example, the temperatures can differ significantly when the artificial satellite (A) is located close to the sun (S) and when the artificial satellite (A) is located in the umbra region, which is located on the opposite side of the sun (S) from the planet (E). In this process, thermal deformation of the structure of the artificial satellite (A) can easily occur, which causes a shift in the focal position of the imaging device, potentially degrading the quality of the image captured using the imaging device. Therefore, to prevent such deterioration of image quality, a means of adjusting the focal length is required.

[0033]

[0034] FIG. 2 is a drawing showing an imaging device for an artificial satellite according to one embodiment.

[0035] Referring to FIG. 2, an imaging device (1) for an artificial satellite according to one embodiment may include a support frame (11), an optical system (12, 13), an imaging module (14), a control module (15), a module support (16), and wiring (17).

[0036] The support frame (11) is configured to be fixed to internal components of an imaging device (1) for an artificial satellite and to support the internal components. The support frame (11) may be directly connected to each internal component, or indirectly connected to another internal component through one internal component. For example, the support frame (11) may be directly connected to the optical system (12, 13) and the control module (15), and may not be directly connected to the imaging module (14) and the module support (16). For example, the primary mirror (12) of the optical system (12, 13) may be installed on one side of the support frame (11), the control module (15) may be installed on the other side, and the secondary mirror (13) of the optical system (12, 13) may be installed on a portion of the support frame (11) located between the primary mirror (12) and the control module (15). The support frame (11) may be formed of a material having a low coefficient of thermal expansion to reduce changes in the distance between internal components directly connected to the support frame (11) due to heat. For example, the coefficient of thermal expansion of the support frame (11) may be 2.0 x 10 -6 / ℃ can be formed of a material smaller than that. For example, the support frame (11) can be formed of invar (e.g., invar 36). With this configuration, even when the module support (16) is thermally deformed as described below, the change in the distance between internal components directly connected to the support frame (11) can be reduced. Meanwhile, although FIG. 2 exemplarily illustrates a case in which the support frame (11) is integrally formed as a single component, it should be noted that the support frame (11) may be formed by assembling or welding a plurality of components. It should be noted that the specific shape and structure of the support frame (11) are not limited unless otherwise stated.

[0037] The optical system (12, 13) can refract and / or reflect light transmitted from space and transmit it to the imaging module (14). The optical system (12, 13) can be installed on the support frame (11). For example, the optical system (12, 13) can include a primary mirror (12) that reflects light incident from the outside, and a secondary mirror (13) that re-reflects the light reflected by the primary mirror (12) toward the imaging module (14). For example, the primary mirror (12) can be arranged closer to the imaging module (14) than the secondary mirror (13). Meanwhile, it should be noted that the optical system (12, 13) does not have to be composed of only the primary mirror (12) and the secondary mirror (13). For example, the optical system (12, 13) may further include at least one optical element arranged between the secondary mirror (13) and the imaging module (14). For example, it is noted that the optical system (12, 13) may include at least one optical element (e.g., a lens) that refracts light instead of having a reflector.

[0038] The imaging module (14) may include an image sensor (141, see FIG. 4) that detects light transmitted from the optical system (12, 13). According to one embodiment, when taking a picture using the imaging device (1), the image sensor (141) may be positioned at the focal length of the optical system (12, 13), thereby improving the quality of the image. For example, the imaging module (14) may not be directly connected to the support frame (11), but may be indirectly connected to the support frame (11) through the module support (16). With this configuration, when the focal length of the optical system (12, 13) changes due to thermal deformation of the support frame (11), the position of the image sensor (141) may be adjusted by applying heat to the module support (16) so that the image sensor (141) is positioned to match the changed focal length of the optical system (12, 13). Meanwhile, when the module support (16) expands due to heat, the image sensor (141) moves in a direction approaching the optical system (12, 13). In addition, since space generally has a lower temperature than room temperature, the image sensor (141) may be positioned at a position further away from the optical system (12, 13) than the focal length of the optical system (12, 13) based on room temperature. An exemplary configuration of the imaging module (14) will be described below with reference to FIG. 3 and below.

[0039] The control module (15) may be equipped with an image processor (152, see FIG. 4) capable of generating an image using light detected by the image sensor (141). The image processor (152) may be, for example, an FPGA (field programmable gate array), but is not limited thereto. The control module (15) may heat the module support (16) by turning on electronic components (e.g., the image processor (152) and / or the image sensor (141)) provided in the imaging device (1). Here, the electronic components are components arranged adjacent to the module support (16), and may include the image processor (152) provided in the control module (15) and the image sensor (141) included in the imaging module (14). For example, the imaging device (1) may not be equipped with a heater that provides a higher amount of heat per unit time to the module support (16) than the image sensor (141) and the image processor (152). For example, a component (e.g., a resistance heating wire) that generates more heat per unit time than the image sensor (141) may not be provided between the module support (16) and the image sensor (141). For example, a component (e.g., a resistance heating wire) that generates more heat per unit time than the image processor (152) may not be provided between the module support (16) and the image processor (152).

[0040] According to one embodiment, the module support (16) can be heated or cooled only by using the ON or OFF operation of the electronic components provided for image capturing, without having a separate heater or constant temperature system. In other words, the position of the image sensor (141) can be adjusted by controlling the operation of the electronic components provided for image capturing, without having a separate heater or mechanical focus adjustment stage. According to this configuration, it becomes possible to adjust the position of the image sensor (141) even in an imaging device (1) mounted on a small satellite, such as a cube satellite, which is known to be difficult to adjust the focal length. In addition, even if it is not a small satellite, since there is no need to have a separate means for focus adjustment, the volume and weight of the imaging device (1) or the artificial satellite (A) mounted thereon can be reduced. Meanwhile, it is known that the sensitivity of focus adjustment is typically high in the order of positional change of the primary mirror (12), positional change of the secondary mirror (13), and positional change of the image sensor (141). Therefore, as in one embodiment, when the position of the image sensor (141) is utilized as a focus adjustment factor, there is an advantage in that the focus can be adjusted more precisely. An exemplary configuration of the control module (15) will be described below with reference to FIG. 3 and below.

[0041] One side of the module support (16) supports the imaging module (14), and the other side of the module support (16) can be fixed to the control module (15). The thermal expansion coefficient of the module support (16) can be higher than the thermal expansion coefficient of the support frame (11). According to this configuration, as described above, in the imaging device (1), even when the structure supporting the optical system (12, 13) is deformed (e.g., contracted or expanded) due to environmental influences and the focus position of the optical system (12, 13) deviates from the position of the image sensor (141), the image sensor (141) can be corrected to be positioned at the changed focus by thermally deforming the module support (16) supporting the image sensor (141). For example, the thermal expansion coefficient of the module support (16) can have a value that is 100 times or more larger than the thermal expansion coefficient of the support frame (11). For example, the thermal expansion coefficient of the module support (16) is 20.0 x 10 -6 / ℃ may be greater than. For example, the module support (16) may be formed of aluminum (e.g., Al6082-T6).

[0042] The wiring (17) can interconnect the imaging module (14) and the control module (15). For example, the length of the wiring (17) can be formed longer than the distance between the imaging module (14) and the control module (15) based on room temperature. With this structure, even when the module support (16) is thermally deformed, the problem of the wiring (17) being damaged due to tension being applied to the wiring (17) can be reduced. For example, the wiring (17) can be formed of a flexible material so that its shape can change in response to changes in the volume of the module support (16) depending on the ambient temperature. For example, the wiring (17) can be formed of a flexible printed circuit board (FPCB). With this configuration, the problem of the wiring (17) being damaged by external force can be reduced even when the distance between the imaging module (14) and the control module (15) changes due to repeated thermal deformation of the module support (16).

[0043]

[0044] Fig. 3 is a perspective view showing the combined appearance of an imaging module and peripheral components according to one embodiment. Fig. 4 is an exploded perspective view showing the connection structure of an imaging module and peripheral components according to one embodiment.

[0045] Referring to FIGS. 3 and 4, the imaging device (1) for an artificial satellite (A) according to one embodiment may further include a heat sink (18) disposed on the opposite side of the module support (16) with respect to the control module (15). The heat sink (18) can reduce heat generated from the image processor (152) from being excessively transferred to the module support (16), thereby reducing unnecessary thermal deformation of the module support (16). In other words, the amount of heat per unit time transferred from the image processor (152) to the module support (16) through the heat sink (18) can be reduced, and the position of the image sensor (141) using the heat generation of the image processor (152) can be adjusted more precisely.

[0046] A control module (15) according to one embodiment may include a control board (151), an image processor (152), and a connector (153). The control board (151) may function as a base for supporting the image processor (152). The image processor (152) may be placed on the opposite side of the module support (16) with respect to the control board (151). The connector (153) is a portion coupled to the wiring (17) and may electrically connect the image processor (152) and the image sensor (141).

[0047] For example, when the control module (15) and the module support (16) are combined, the image processor (152) can be arranged to overlap the center of the module support (16). For example, the image processor (152) can be arranged at the center of the control board (151). With this structure, the amount of heat transferred from the image processor (152) to the module support (16) is not biased to one side, but can be uniformly transferred based on the center of the module support (16). Therefore, in the process of changing the position of the image sensor (141) due to thermal deformation of the module support (16), the problem of the image sensor (141) tilting to one side can be reduced. In other words, before and after thermal deformation of the module support (16), it can help the image sensor (141) to be arranged in a direction perpendicular to the optical axis direction. Meanwhile, it should be noted that this is only one embodiment and that the image processor (152) does not necessarily have to be positioned at the exact center of the module support (16). For example, it should be noted that the image processor (152) may be positioned at the center of the horizontal direction (e.g., + / - Y-axis direction) of the module support (16) or at the center of the vertical direction (e.g., + / - Z-axis direction) of the module support (16).

[0048] An imaging module (14) according to one embodiment may include an image sensor (141), a sensor board (142) on which the image sensor (141) is installed, a sensor fixture (143) for fixing the image sensor (141) on the sensor board (142), and an insulator (144).

[0049] For example, the image sensor (141) may be fixed between the sensor fixture (143) and the sensor board (142). For example, an insertion groove into which the image sensor (141) can be inserted may be formed on the back surface of the sensor fixture (143). Through this configuration, the image sensor (141) can be stably installed on the sensor board (142) even when the module support (16) is thermally deformed.

[0050] The sensor board (142) may include, for example, a board hole (H). A portion of the module support (16) may pass through the board hole (H) to support the image sensor (141). With this structure, the problem of the sensor board (142) being detached from the module support (16) can be reduced.

[0051] The sensor fixture (143) may be fixed to the module support (16) with the image sensor (141) and the sensor board (142) interposed therebetween. For example, fasteners for fastening the sensor fixture (143) and the module support (16) to each other may be coupled to each corner of a polygon (e.g., a square) surrounding the image sensor (141). For example, the thermal expansion coefficient of the sensor fixture (143) may be lower than the thermal expansion coefficient of the module support (16). Through such a configuration, the degree to which the module support (16) changes in a plane perpendicular to the optical axis may be reduced. For example, the thermal expansion coefficient of the sensor fixture (143) may be higher than the thermal expansion coefficient of the support frame (11). For example, the thermal expansion coefficient of the sensor fixture (143) may be higher than the thermal expansion coefficient of the support frame (11) and lower than the thermal expansion coefficient of the module support (16). According to this configuration, the difference in thermal expansion coefficient between the sensor fixture (143) and the module support (16) can reduce excessive fatigue from accumulating on the module support (16) during the thermal deformation process. For example, the thermal expansion coefficient of the sensor fixture (143) is 5.0 x 10-6 / ℃ greater than 15.0 x 10 -6 / may have a value less than ℃. For example, the sensor fixture (143) may be formed of a titanium alloy (e.g., titanium alloy grade 5, Ti-6Al-4V).

[0052] The sensor fixture (143) may not be directly connected to the support frame (11), but may be indirectly connected to the support frame (11) via the module support (16) and the control module (15). With this structure, there is a possibility that the weight of the sensor fixture (143) itself may affect a component (e.g., the module support (16)) directly connected to the sensor fixture (143). In order to reduce the influence due to the self-weight of the sensor fixture (143) while having sufficient strength, the sensor fixture (143) may be formed of a material (e.g., titanium alloy grade 5, Ti-6Al-4V) having a lower density than the support frame (11).

[0053] The sensor fixture (143) may have a lower thermal conductivity than the module support (16). With this configuration, the rate at which heat generated from the image sensor (141) is transferred to the module support (16) can be increased. For example, the thermal conductivity of the sensor fixture (143) may be less than 1 / 10 times that of the module support (16). For example, the sensor fixture (143) may be formed of a material (e.g., titanium alloy grade 5, Ti-6Al-4V) having a thermal conductivity (e.g., 6.7 W / mK) that is less than 1 / 20 times that of the thermal conductivity (e.g., 205 W / mK) of a material (e.g., aluminum) forming the module support (16).

[0054] An insulator (144) may be installed between the sensor fixture (143) and the module support (16). The insulator (144) may be formed of a material (e.g., synthetic resin) having a lower thermal conductivity than the module support (16). With this configuration, the amount of heat transferred from the module support (16) to the sensor fixture (143) may be reduced, and the ratio of heat generated from electronic components used for thermal deformation of the module support (16) may be increased. For example, the insulator (144) may be formed of a material (e.g., polyetheretherketone (PEEK)) having a thermal conductivity (0.25 W / mK) that is less than 1 / 100 times the thermal conductivity (e.g., 205 W / mK) of a material (e.g., aluminum) forming the module support (16).

[0055]

[0056] Figure 5 is a perspective view of a module support (16) according to one embodiment.

[0057] Referring to FIGS. 4 and 5, a module support (16) according to one embodiment may include a body portion (161), a first fastening portion (162), a second fastening portion (163), a support protrusion (166), a plurality of leg portions (164), and a guide groove (165).

[0058] The first fastening portion (162) is a portion for fixing the image sensor (141) to the module support (16) and may be formed on the body portion (161). For example, the first fastening portion (162) may be formed along the circumferential direction of the body portion (161).

[0059] The second fastening portion (163) is a portion for fixing the control module (15) to the module support (16) and may be formed in the body portion (161). For example, the second fastening portion (163) may be formed at each end of the leg portion (164).

[0060] The support protrusion (166) is a part for supporting the image sensor (141) and can be formed to protrude from the body part (161). The image sensor (141) or the sensor board (142) can be adhered to the end of the support protrusion (166). For example, a thermally conductive adhesive can be applied to the end of the support protrusion (166). With this configuration, the efficiency of transferring heat generated from the image sensor (141) to the module support (16) through the support protrusion (166) can be improved. With respect to a plane perpendicular to the optical axis direction, the cross-section of the support protrusion (166) can be smaller than the cross-section of the body part (161). With this structure, instead of fixing the entire area of ​​the image sensor (141) or the sensor board (142) to be in surface contact with the module support (16), only the area corresponding to the end of the support protrusion (166) can be fixed to be in surface contact. Accordingly, the problem of the image sensor (141) or sensor board (142) being detached from the module support (16) can be reduced depending on the difference in thermal strain in the plane direction perpendicular to the optical axis direction between the image sensor (141) or sensor board (142) and the module support (16).

[0061] The leg portion (164) may have a shape that extends long from the body portion (161). The leg portion (164) is arranged between the body portion (161) and the second fastening portion (163), and has a relatively flexible property compared to the body portion (161) depending on its shape, thereby reducing internal stress that may occur due to a difference in thermal expansion coefficient between the control board (151) and the body portion (161).

[0062] The leg portion (164) is connected to the heat sink (18) through a fastening member (e.g., a screw) that penetrates the control module (15), thereby allowing the amount of heat applied to the leg portion (164) to be discharged through the heat sink (18). Accordingly, the amount of thermal deformation of the leg portion (164) can be relatively reduced, thereby reducing internal stress that may occur in the leg portion (164) during the thermal deformation process.

[0063] A guide groove (165) may be positioned between a plurality of leg portions (164). Through the guide groove (165), a wiring (17) connecting the imaging module (14) and the control module (15) may be connected. With this configuration, the length of the wiring (17) can be relatively shortened, and consequently, the problem of an increase in the volume of the entire product caused by the wiring (17) being installed by bypassing the module support (16) can be reduced.

[0064]

[0065] FIG. 6 is a drawing showing an imaging device for an artificial satellite according to one embodiment.

[0066] Referring to FIG. 6, an imaging device (1) for an artificial satellite according to one embodiment may include a support frame (11), an optical system (12, 13), an imaging module (14), a control module (15), a module support (16), and wiring (17).

[0067] For example, the support frame (11) may be directly connected to the optical system (12, 13) and the control module (15), and may not be directly connected to the imaging module (14) and the module support (16). As described above, although the support frame (11) is exemplarily illustrated as being integrally formed as a single component, it should be noted that the support frame (11) may alternatively be formed by assembling or welding a plurality of components. Unless otherwise stated, it should be noted that the specific shape and structure of the support frame (11) are not limited.

[0068]

[0069] Although the embodiments described above have been described with limited drawings, those skilled in the art will appreciate that various technical modifications and variations can be applied based on the described embodiments. For example, appropriate results can still be achieved even if the described techniques are performed in a different order than described, and / or components of the described systems, structures, devices, circuits, etc. are combined or combined in a different manner than described, or are replaced or substituted with other components or equivalents.

[0070] Therefore, other implementations, other embodiments, and equivalents to the claims also fall within the scope of the claims described below.

Claims

1. Support frame; An optical system installed on the above support frame; An imaging module having an image sensor capable of detecting light transmitted from the optical system; A control module having an image processor capable of generating an image using light detected by the image sensor; A module supporter having one side supporting the imaging module and the other side fixed to the control module; and Includes wiring interconnecting the imaging module and the control module, The thermal expansion coefficient of the above module support is higher than the thermal expansion coefficient of the above support frame. Imaging device for artificial satellites.

2. In paragraph 1, The length of the above wiring is formed to be longer than the distance between the imaging module and the control module at room temperature, The above wiring is formed of a flexible material so that its shape can change in response to changes in the volume of the module support according to the ambient temperature. Imaging device for artificial satellites.

3. In paragraph 1, The coefficient of thermal expansion of the above module support is 20.0 x 10 -6 / greater than ℃, The coefficient of thermal expansion of the above support frame is 2.0 x 10 -6 / less than ℃, Imaging device for artificial satellites.

4. In paragraph 1, The above imaging device for artificial satellites, The above module support does not have a heater that provides a higher amount of heat per unit time than the image sensor and the image processor. Imaging device for artificial satellites.

5. In paragraph 1, The above imaging device for artificial satellites, Based on the above control module, further comprising a heat sink arranged on the opposite side of the module support, Imaging device for artificial satellites.

6. In paragraph 1, The above control module further includes a control board supporting the image processor, The image processor is arranged on the opposite side of the module support with respect to the control board. Imaging device for artificial satellites.

7. In paragraph 1, The above module support is, body; A first fastening portion formed on the body portion and for fixing the image sensor to the module support; A second fastening portion formed on the body portion and configured to fix the control module to the module support, Imaging device for artificial satellites.

8. In paragraph 7, The above module support is, A support protrusion for supporting the image sensor; a plurality of leg portions extending long from the above body portion; and further comprising a guide groove positioned between the plurality of leg sections and through which the wiring can pass; Imaging device for artificial satellites.

9. In paragraph 1, The above imaging module, a sensor board on which the image sensor is installed; and Further comprising a sensor fixture for fixing the image sensor on the sensor board, Imaging device for artificial satellites.

Images