Multi-sensing array system and method

Abstract

A force-sensing array with multi-sensing capabilities, and more specifically a multi-sensing array systems and methods that relate to the monitoring of the interaction between a sitting person and the surface upon which they are sitting. The multi-sensing array can be used to remotely monitor the said interaction.

Description

MULTI-SENSING ARRAY SYSTEM AND METHODFEDERALLY SPONSORED RESEARCH AND DEVELOPMENT

[0001] This invention was made with Government support by the National Institute On Aging of the National Institutes of Health under Award Number R41 AG080965.COOPERATION WITH DEPARTMENT OF VETERANS AFFAIRS

[0002] This invention was made in part with the cooperation with the United States Government as Represented by the Department of Veterans Affairs.FIELD

[0003] This disclosure relates to multi-sensing arrays and, more specifically, to multi-sensing array systems and methods that relate to monitoring the interaction between a person and the surface (e.g., sitting, laying, standing, etc.) upon which they are sitting. Such systems can include real-time reporting of the interactions of the person and the surface.BACKGROUND

[0004] An integrated system to monitor seat-interface conditions during prolonged sitting by an end-user does not exist commercially. The commercially available systems do not meet the needs of the end-user for improved usability of combined software and sensor mapping, sensor durability, form factoring, and sensitivity.

[0005] Currently, the average pressure injury costs around $45k per hospitalization to treat and causes lifelong negative consequences for those living with a spinal cord injury (“SCI”). Approximately 35% of individuals living in the USA with an SCI have a pressure injury at any given time. The problem to be solved is a reduction in healthcare costs and improvement in quality of life by reducing the risk of needing surgeries, bed rest, fewer doctors’ visits, and a longer life while helping provide awareness to users about their seating / bed habits and activities.SUMMARY

[0006] According to this disclosure, an embodiment of a conductive array can comprise a series of trace rows, which may be comprised of a conductive substrate; a series of trace columns, which may be comprised of a conductive substrate; where the series of trace rows and trace columns can form a grid that may have a series of intersections; a series of resistive elements, wherein each resistive element of the series of resistive elements can create an interconnection between a singletrace row and a single trace column at each intersection on the grid, There can also be a first spacer layer, disposed on the series of resistive elements and can also be disposed between the series of trace rows; and a second spacer layer opposite the first spacer layer, that can be disposed on the series of resistive elements and also be disposed between the series of trace columns.

[0007] In another embodiment of the conductive array, there may be a further inclusion of a first support layer and a second support layer, wherein the first support layer can be disposed on a side of the series of trace rows opposite the first spacer layer; and wherein the second support layer can be disposed on a side of the series of trace columns opposite the second spacer layer. The support layers can also be welded about their perimeter, where the welding can form a waterproof or water-resistant seal.

[0008] In another embodiment of the conductive array, there may further be a detection system that can be in electrical communication with each trace row of the series of trace rows and each trace column of the series of trace columns, wherein the detection system may obtain a series of resistance measurements from the interactions between the series of trace rows and each trace column of the series of trace columns. In a variation of this embodiment, there may also be the detection system that can be configured to apply an algorithm to the series of resistance measurements to mitigate a ghosting effect produced by the adjacent resistive elements in the grid.

[0009] In another embodiment, the conductive array may further include an electronics module, where the electronics module can be interconnected to the conducive array.

[0010] In another embodiment, that can include the electronics module, the electronics module can also include any one, or all, of a series of sensors that can be from a group consisting of at least a pressure sensor, a moisture sensor, a volatile organic compound sensor, a shear sensor, a magnetometer, and a temperature sensor.

[0011] In another embodiment of the conductive array, there may be at least one spacer layer that can be adhered to the series of resistive elements.

[0012] According to this disclosure, an embodiment of a system for a multi-sensing can comprise an app, a sensor array that can have a computer processor having firmware. The system may also include a pressure sensor, a shear sensor, a moisture sensor, and a user interface, wherein the user interface can be structured and configured to provide real-time feedback from the sensor array; and wherein the app may analyze the real-time feedback to provide instructions to prevent injury to the end-user

[0013] The system for a multi-sensing can also include a series of conductive trace rows and a series of conductive trace columns. In such an embodiment, the trace rows and trace columns can form a grid. At each of the grid’s intersections, a resistive element of a series of resistive elementscreates an interconnection between a single trace row and a single trace column. Such an embodiment may also include at least one spacer layer that can be disposed between the series of resistive elements and the series of trace rows, or the series of trace columns. In a variation of that embodiment, there may be two spacer layers, where each spacer layer can be disposed on one side of the layer of resistive elements.

[0014] In an additional embodiment of a force-sensing conductive array, there can be a series of trace conductive rows and a series of conductive trace columns, where the two conductive series can form a grid that can have a series of intersections. At each intersection of the grid, there can be a resistive element of a series of resistive elements that may be disposed between the series of trace rows and trace columns. Each resistive element may be able to create an interconnection between a single trace row and a single trace column. This embodiment of a force-sensing conductive array may also include at least one spacer layer, which can be disposed between the series of resistive elements and the series of trace rows, or the series of trace columns.

[0015] In another embodiment of this conductive array, there may be a further inclusion of a first support layer and a second support layer, wherein the first support layer can be disposed on a side of the series of trace rows opposite the first spacer layer; and wherein the second support layer can be disposed on a side of the series of trace columns opposite the second spacer layer. The support layers can also be welded about their perimeter, where the welding can form a waterproof seal.

[0016] Such an embodiment of the conductive array may further include a detection system that can be in electrical communication with each trace row of the series of trace rows and each trace column of the series of trace columns, wherein the detection system may obtain a series of resistance measurements from the interactions between the series of trace rows and each trace column of the series of trace columns. In a variation of this embodiment, there may also be the detection system that can be configured to apply an algorithm to the series of resistance measurements to mitigate a ghosting effect produced by the adjacent resistive elements in the grid.

[0017] In another embodiment, the conductive array may further include an electronics module, where the electronics module can be interconnected to the conducive array.

[0018] In another embodiment, that can include the electronics module, the electronics module can also include any one, or all, of a series of sensors that can be from a group consisting of at least a pressure sensor, a moisture sensor, a volatile organic compound sensor, a shear sensor, a magnetometer, and a temperature sensor.

[0019] The above summary is not intended to describe each and every example or every implementation of the disclosure. The description that follows more particularly exemplifies various illustrative embodimentsBRIEF DESCRIPTION OF THE DRAWINGS

[0020] The following description should be read with reference to the drawings. The drawings, which are not necessarily to scale, depict examples and are not intended to limit the scope of the disclosure. The disclosure may be more completely understood in consideration of the following description with respect to various examples in connection with the accompanying drawings.

[0021] FIG. l is a top plan view of an embodiment of the sensor array.

[0022] FIG. 2 is an exploded view of the layers of an embodiment of the sensor array.

[0023] FIG. 3 is a side view of the layers of an embodiment of the sensor array.

[0024] FIG. 3 A is a partial section view of the embodiment of FIG. 3.

[0025] FIG. 4A is a schematic diagram of a partial electrical configuration of an embodiment of the sensor array.

[0026] FIG. 4B is a schematic diagram of a partial electrical configuration of an embodiment of the sensor array.

[0027] FIG. 5 is a top plan view of another partial embodiment of a sensor array.

[0028] FIG. 6A is a top plan view of a partial embodiment of a single force-combining cap.

[0029] FIG. 6B is a side plan view of a partial embodiment of a single force-combining cap.

[0030] FIG. 6C is an additional side plan view of a partial embodiment of a single forcecombining cap.

[0031] FIG. 6D is a side plan view of a force being applied to the partial embodiment of a single force-combining cap.

[0032] FIG. 7A is a side plan view of a partial embodiment of a planar diode.

[0033] FIG. 7B is a side plan view of a partial embodiment of a planar diode integrated into a sensor array.

[0034] FIG. 7C is a side plan view of another partial embodiment of a planar diode integrated into a sensor array.

[0035] FIG. 8 is a flow chart describing a method of analyzing the data acquired from a sensor array.

[0036] FIG. 9 is a flow chart describing a method for sensor resistance correction using an inverse approach.

[0037] FIG. 10 is a flow chart describing a method for sensor resistance correction using a machine-learning approach.

[0038] FIG. 11 is an exploded view of the layers of another embodiment of the sensor array.

[0039] FIG. 12 is an exploded view of the layers of another embodiment of the sensor array.DETAILED DESCRIPTION

[0040] The present disclosure relates to multi-sensing arrays and, more specifically, to multisensing array systems and methods that relate to the monitoring of the interaction between a sitting person and the surface upon which they are sitting. Various embodiments are described in detail with reference to the drawings, in which like reference numerals may be used to represent like parts and assemblies throughout the several views. Reference to various embodiments does not limit the scope of the systems and methods disclosed herein. Examples of construction, dimensions, and materials may be illustrated for the various elements; those skilled in the art will recognize that many of the examples provided have suitable alternatives that may be utilized. Any examples set forth in this specification are not intended to be limiting and merely set forth some of the many possible embodiments for the systems and methods. It is understood that various omissions and substitutions of equivalents are contemplated as circumstances may suggest or render expedient. Still, these are intended to cover applications or embodiments without departing from the disclosure's spirit or scope. Also, it is to be understood that the phraseology and terminology used herein are for the purpose of description and should not be regarded as limiting.

[0041] This system can primarily be a seated sensing overlay that detects factors that contribute to pressure injuries. This can be accomplished by including sensors for the detection of pressure (primarily) and optional displacement representing shear forces(secondarily), along with other sensors for the detection of temperature, and moisture, which can contribute to the development of pressure injuries. This system novelty can come from its incorporation of a durable, low hysteresis / sensor drift and low sensor creep force sensing array. Other novelty may be derived with the inclusion of an optional multi-sensing technology that may provide a cost-effective solution. There may also be an advanced software-user interface allowing users and / or clinicians to observe, in real-time, the data from the sensors. There may also be the ability to perform remote patient monitoring, remote patient therapy, remote data collection, hospital call systems, in-patient care facility call systems, data collection, and can enable remote health therapy. Additionally, there may be an option to receive alerts powered by algorithms, machine learning, and artificialintelligence. Such alerts may be provided to users and / or clinicians via sensing hardware, a mobile application, a clinician digital portal interface, or a digital clinical monitoring interface.

[0042] A system for a multi-sensing array, as disclosed in the instant application, may include a mat that can include a series of layers of alternating conductivity and resistivity. The various layers can comprise a series of conductive rows and columns that may be constructed of conductive fabric, conductive foil, conductive ink on a substrate, other conductively coated substrates (e.g., plastics, foams, films), metal meshes, or a pattern of conductive ink applied to a sheet of fabric. Such conductive fabric may be constructed with metal fibers, while other embodiments can utilize a conductive fabric that can be constructed from non-conductive fibers coated with a conductive material. In another embodiment, conductive ink may be applied to a sheet of non-conductive fabric. An array may be constructed wherein the rows and columns form a grid pattern or an arbitrary pattern. Such arrangements may be formed to ensure a proper fit for a desired anatomical distribution of sensors. Situated between the series of conductive rows and columns may be other layers, such as resistive layers and spacer layers.

[0043] A resistive layer may comprise many different iterations. For example, the resistive layer may be constructed with resistive elements that can create an interconnect between the rows and columns. The resistive elements can be constructed from a controlled resistance fabric, a controlled resistance foil, a controlled resistance ink disposed on a substrate, a piezoresistive material, or a patterned resistive ink applied to a sheet of material, such as a fabric. Additionally, the inclusion of a diode, for example, a planar diode, to the resistive element may provide a unidirectional current flow between the series of conductive rows and columns while passing through the resistive element.

[0044] Spacer materials may also be included in the multi-sensing array. Such spacers can be constructed with a variety of materials, including, but not limited to, tulle fabric, fabric meshes, loose fabric weaves, stretchable mesh / netting, sponge-like material, or any porous material allowing for partial contact and separation of the layers of the multi-sensing array. Other non- conductive spacer materials have been contemplated, where they may be applied to row / column / resi stive element layers to create a spacing effect, e.g., a silicon dot matrix pattern or other patterns that can create a structure that separates layers but is compressible under pressure which may allow contact between the other layers in the multi-sensing array.

[0045] The combination of layers may be stabilized to fix the orientation and positions of the elements of the individual layers, thereby maintaining their structure during use. This can be achieved with a variety of adhesion techniques known in the art. For example, the layers may bebonded with adhesive glues, sewing between elements, heat, ultrasonic or radio-frequency welding, or reflowing materials.

[0046] Additional usages are contemplated with the multi-sensing array, where force-sensing elements may be arranged to further detect sheer and displacement forces. For example, four adjacent resistive element sensors could be combined together using a semi-rigid dome being placed above the four adjacent resistive element sensors. Thereby, downward pressure could be calculated from the combination of the forces measured on the four resistive element sensors under the semi-rigid dome, while the differential between pressure on the four resistive element sensors could provide an indication of sheer force (both direction and amplitude).

[0047] The series of conductive rows and columns may be connected to a detection system. The detection system can be a set of control / measurement electronics that can be comprised of microcontrollers, multiplexing switches(to select rows and columns), resistance measuring circuits (e.g., ADC and a voltage divider or a transimpedance amplifier), communication interface (e.g., wireless interface to a mobile application, or a USB interface to a computer), power system(e.g., rechargeable battery), complementary sensors (e.g., humidity, motion, orientation, and temperature sensors), a microprocessor s), data storage, displays, lights, speakers, and other communication elements.

[0048] The connection between the series of conductive rows and columns and the detection system may be provided by the inclusion of flexible wires to interconnect the sensor and control / measurement electronics of the detection system. Such wired connections may include ribbon cable with an IDC connector, POGO connectors, a FlexPCB conductive contact surface that can mate with the sensor row / column, and a PCB-friendly interconnect (e.g., some type of flexible ZIF connector), or other types of wires and connectors.

[0049] A system that includes the multi-sensing array may have an attachment mechanisms to maintain the position of the sensor on a seat or other contact surface (tie downs, VELCRO®, etc.), silicone coating, or other coating to add friction between the underlaying surface and the multisensing array, a cable management system for routing and placing the detection system in an unobtrusive location for the user, and an outer enclosure that can provide a durable waterproof layer that protects the sensor from environmental damage. One embodiment may also incorporate a contact moisture sensor disposed in the outer layer to detect water-based liquids.

[0050] A potential goal of developing a multi-sensing arrayis to create a pressure-variable resistance between the conductive rows and columns, which then can be scanned to generate an image of pressure distribution across a grid. Providing components where at least one has a three-dimensional (“3D”) structure, the contact between a conductive element and a resistive element may be made variable. Such an arrangement can allow the 3D structure to act as both a spring and a variable contact area. In such an arrangement, the variable pressure can then translate into variable resistance.

[0051] A separation element placed between the conductive and resistive elements may be able to modulate the force-dependent behavior of the resistive element and allow for a quick return to a high-resistance state when there is no longer a load placed on the resistive element.

[0052] The selection of materials for the resistive element may be significant when modulating the spring-like behavior. Some embodiments may use fabric as the resistive element as it may have a significant 3D structure that can provide a fine enough scale to yield smooth changes in resistance under changing pressure.

[0053] In such an embodiment, an electronic system may measure resistance between rows and columns to determine pressure at a given grid point. In some variations, an algorithm may be used to account for sources of resistance / conductance other than the resistive row / column element. Measurements can be made at the row and column, but current may be able to flow through multiple resistive elements, which can lead to an effect known as “ghosting,” where adjacent grid elements can affect the measured resistance of a given grid element. Such algorithms may use linear algebra-based circuit simulation methods to calculate individual element resistance directly. Other embodiments using algorithms may use optimization-based approaches for inversely calculating individual element resistance in combination with a forward row-column resistance measurement method. The optimization approach can iteratively guess at individual grid element resistances and make adjustments until the predicted row-column measurements match the actual measurements. Further algorithms may use AI / ML / heuristic circuit simulation approaches, such as neural networks, to estimate the resistances of individual grid elements. In another embodiment, diodes may be added to the resistive element to simplify the measurement of resistance. Such diodes can be constructed as a planar diode, where current can only flow through the x-y plane in one direction of the z-axis. Additionally, changes in resistance that may arise due to drift, creep, temperature, and aging may be modeled and accounted for using an algorithm to minimize such effects.1. Illustrated in FIGs. l and 2 is an embodiment of a multi-sensing array 100, a finished mat assembly shown to have an outer support layer 170 (the uppermost outer support layer is not shown in FIG. 1 to provide a view of the internal layers) that can enclose a series of conductive trace rows and conductive trace columns and all the layers therebetween. The outer support layer 170 in this particular embodiment can be comprised of a ProSoft® Nylon Stretch fabric;other fabrics for an outer support layer have been contemplated and may include fabrics that are waterproof, stretchable, and easy to clean. The outer support layer 170 can include an ultrasonic weld about the perimeter that binds the upper and lower outer support layers 170 to provide a fully waterproofed multi-sensing array. Also shown in FIG. l is an exemplary wire harness 200 connected to wire 220 that has an ending at a series of wire / trace connections 210; the wire / trace connections 210 can be achieved with the use of an iron-on adhesive being cut into small squares and used to electrically and mechanically connect the wire strands 220 to the respective traces. In an alternative to the use of wires for the connections between the traces and the harness flexible printed circuit boards can be utilized. Such a wire harness can also be utilized in the same manner as the embodiments of FIGs. 11 & 12, where there can be a single spacer layer applied. Furthermore, wire harness 200 may include an electronics architecture / module having a communication interface, as discussed supra. Such wire harness 200 may also include additional sensors for the detection of moisture and / or temperature. There may also be include a variety of other sensors including a moisture sensor, a humidity sensor, a volatile organic compound sensor, a shear sensor, and sensors that detect inertial measurements, i.e., an accelerometer and / or a magnetometer.

[0054] Within these embodiments of multi-sensing array 100, there may be resistive elements 140, as illustrated in FIGs.1-3 A. The resistive elements 140 can be comprised of one-inch squares of Eeonyx® conductive fabric; for example, the LTT-SLPA-15K conductive polymer coated fabric by Eeonyx®. Other high-resistance materials that allow for a highly variable resistance reading over a range of pressures may also be used.

[0055] An internal view of the multi-sensing array 100 is illustrated in FIGs. 3 and 3 A, where trace rows 110 are running on the horizontal and resistive elements 140 are placed in a grid-like pattern under a first spacer layer 150. A second spacer layer 152, is shown in FIGs. 2-3 A and can be disposed under the grid of resistive elements 140. The spacer layers 150 and 152 of this embodiment can be constructed with Pelion® SKI 35 Sheer-Knit Mesh with an adhesive on one side. The spacer layers may have non-uniform geometries to allow for greater stretch in some or all dimensions. Other materials are contemplated for the spacer layers, where the material can create a separation between low-resistance traces(e.g., trace rows 110 and 120) and high- resistance elements(e.g., resistive elements 140); the material should allow for variable resistance over a range of pressures applied to areas of a multi-sensing array. Other embodiments may include a single spacer layer where such a layer may be disposed between a series of trace rows and a series of resistive materials, or a single spacer layer may be disposed between a series of trace columns and a series of resistive materials.

[0056] For example, in FIG. 11, an embodiment of a multi-sensing array 1300, similar to the multi-sensing array 100, except that there is a single spacer layer 1352 that can be disposed between the resistive elements 1340 and the trace columns 1320. In this embodiment, the trace rows 1310 and trace columns 1320 can be fused to the surface of the outer support layer 1370 with an adhesive material at the perimeter of the outer support layers 1370; this can also provide a waterproof multi-sensing array. The multi-sensing array 1300 can essentially function the same as the multi-sensing array 100; the removal of a spacer layer may provide a thinner and / or more flexible multi-sensing array.

[0057] An additional embodiment in FIG. 12 of a multi-sensing array 1400 is similar to the multisensing array 100 except that there is a single spacer layer 1450 that can be disposed between the resistive elements 1440 and the trace rows 1410. Just as with the multi-sensing array 1300 and multi-sensing array 100, the multi-sensing array 1400 can be constructed in a similar fashion and function in a similar manner; the removal of a spacer layer may provide a thinner and / or more flexible multi-sensing array.

[0058] In FIGs. 1-3 A, The trace rows 110 and trace columns 120 in this embodiment of multisensing array 100 can be fused to the surface of the outer support layer 170 with an adhesive material. For example, ULTRAHOLD® iron-on adhesive can be used as an adhesive material. Other embodiments may include a complex layout that is not necessarily a simple grid of rows and columns. In one embodiment, the width of a series of trace rows and trace columns may vary to account for a series of resistive elements that vary in size. For example, the series of resistive elements may be smaller in areas of a multi-sensing array that may be subject to higher use and pressure application to increase the sensing resolution, e.g., a central area of a multi-sensing array that is being used as a seating mat may see higher force than an exterior of that multi-sensing array where force may be less and the sensitivity demands are lower. In other non-seating applications, the arrangement of the rows and columns and resistive elements may take on other geometries to address areas that also need higher sensitivity.

[0059] FIGs. 1-3 A demonstrates an embodiment where the trace rows 110 and trace columns 120 are aligned in a perpendicular fashion where the resistive elements are aligned therebetween along with the spacer layers 150 and 152. Also shown in FIG. 1 of this embodiment of multi-sensing array 100, is a nearly finished mat assembly having the upper outer support layer 170 unapplied to demonstrate the placement of the resistive elements 140 and a possible wiring connection; the lower outer support layer 170 is the lowest most layer having the wiring harness 200 and wires 220 disposed on the upper surface of support layer 170. FIG. 3 provides a cross-sectionalschematic of an embodiment of a multi-sensing array 100 along with an exploded section of FIG. 3A.

[0060] FIGs. 4A and 4B provide schematic diagrams of different embodiments of an array with and without diodes, respectively. As described supra, these wiring options can be used in conjunction with the algorithmic analysis to determine pressure variations within the array when a load is applied.

[0061] Regarding FIG. 5, this illustration is an embodiment of a sensor array 500 where the trace rows 510 and trace columns 520 can be comprised of different widths and lengths. These variations may provide a sensor array that can increase sensor resolution by increasing the density of sensor input in areas of the sensor array in a seating mat arrangement where a user may be most prone to injury during prolonged periods of sitting. In the embodiment of sensor array 500, the arrangement of the trace rows 510 and trace columns 520 can be in an anatomically distributed arrangement; the increased resolution may help prevent injury to a user. Resistive elements can be arranged at the intersections of each of the trace rows 510 and trace columns 520 in the same layer arrangement as the sensor array 100.

[0062] Regarding FIGs. 6A-6D, these illustrations disclose an embodiment of a sensor array 600 where a force combining cap 680 may be disposed on the upper surface of several trace rows 610 in such a way that the force combining cap 680 may bound an area of the sensor array 600 that includes multiple resistive elements 640. For example, in FIGs. 6A and 6B, the force combining cap 680 bounds an area of the sensor array 600 that includes four resistive elements 640. Other embodiments may have an arrangement where the force combining cap 680 may cover as little as two resistive elements 640. The purpose of the force combining cap 680 is to distribute orthogonal force evenly across the resistive elements 640 and to distribute vectored force unevenly across the resistive elements 640; this even / uneven distribution is illustrated in FIGs. 6C and 6D, respectively, where the force is illustrated with the large arrow showing the force’s direction. The force combining cap 680 may allow the sensor array 600 to detect sheer force being applied to the sensor array 600. The detection of sheer force may help to further prevent injury to a user by providing additional information regarding the pressure occurring between the user and the sensor array 600.

[0063] An algorithm can be implemented with the use of sensor data collected from elements under a force-combining cap and sensor array elements that are near the elements under a forcecombining cap to determine when there is a pressure shift related to the user changing their position. Shift detection criteria can have a triggering event under several criteria. For example, there could be a change in the Center of Pressure (“COP”) or a change in a Peak Pressure Index(“PPI”). PPI may use a sliding window method over a sensor array to get the average pressure of a 4-cell region. A shift detection may occur when: (1) there is a reduction of any of the top N PPI (where N may be 5, but this can be changed to make detection more or less restrictive; the default reduction is about 75%,), (2) or the COP can be moved more than two cells away from its current location.

[0064] Regarding FIG. 7A, this illustration discloses an embodiment of a sensor array 700 that may include a diode 760 structured within the sensor array 700. The inclusion of a diode 760 as a planar diode to the resistive element may provide a unidirectional current flow between the series of trace rows 710 and trace columns 720, while passing through the resistive element 740. Diode 760 may be added to the resistive element to simplify the measurement of resistance. Such diodes 760 can be constructed as a planar diode, where current can only flow through the x-y plane in one direction of the z-axis. Individual diodes 760 can be disposed between the resistive grid element and the series of trace rows 710 and trace columns 720, and may prevent crosstalk or “ghosting” between the sensor array 700. Additionally, changes in resistance due to drift, creep, temperature, and aging can be modeled and accounted for using an algorithm to minimize such effects. The planar diode 760 may be constructed by bonding an insulating sheet over the body of the diode to create a planar separation between the two ends of the diode. Thus, one end can be connected to a top conducting sheet, i.e., the series of trace rows 710, and the other end can be connected to a bottom conductive sheet, i.e., the trace columns 720. Therefore, all current has to go through the planar diode in order to go from the series of trace rows 710 and trace columns 720 or vice-versa. Outer support layers may be disposed above and below the trace and columns in a similar manner as sensor array 100.

[0065] Regarding FIG. 7B, where an illustration discloses an embodiment of a sensor array 800 that may include a diode 860 structured within the sensor array 800. In the embodiment of FIG. 7B, the layer arrangement can be structured where a first layer can be a series of trace rows 810 followed by a spacer layer 850, a planar diode 860 layer, resistive element 840 layer, a spacer layer 852, and a bottom layer of a series of trace columns 820. This arrangement may provide the benefit of allowing only unidirectional flow of current through sensor layers and, in turn, facilitate resistance measurement of a single sensor element. Outer support layers may be disposed above and below the trace and columns in a similar manner as sensor array 100.

[0066] Regarding FIG. 7C, where an illustration discloses an embodiment of a sensor array 900 that may include a diode 960 structured within the sensor array 900. In the embodiment of FIG. 7C, the layer arrangement can be structured where a first layer can be a series of trace rows 910 followed by a planar diode 960 layer, a spacer layer 950, resistive element 940 layer, a spacerlayer 952, and a bottom layer of a series of trace columns 920. This arrangement may also provide the benefit of allowing only unidirectional flow of current through sensor layers and, in turn, facilitate resistance measurement of a single sensor element. Outer support layers may be disposed above and below the trace and columns in a similar manner as sensor array 100.

[0067] Regarding FIG. 8, where a flow chart lays out an electronics / software architecture 1000 for a sensor array 1010. The electronics / software architecture 1000 comprises an analog front end 1020 that may be capable of measuring resistance between all the trace row and trace column pairs, a Communication Interface 1030 that can be configured to send resistance data to a processing module (e.g., using Bluetooth LE), a processing module 1040 which may be structured and configured to calculate any underlying single row / column element resistances based on total row / column resistances (the processing module 1040 may be present on the same PCB as the other modules or as a separate computing device, e.g., a mobile phone.) Since the calculation is a mathematical transformation of the underlying analog measurements, the raw analog row / column measurements are sent to the mobile application where computing power is more available. Currently, Bluetooth 4.2 is used to send the raw analog data; however, any communication method would be sufficient (with the necessary bandwidth). The processing module 1040 may further comprise communication ports that can transmit data to a user interface 1045, and / or to a cloud storage backend 1050, wherein the cloud storage backend 1050 may further communicate with an administrative interface 1052 and / or a clinician interface 1054.

[0068] Regarding FIG. 9, where a flow chart lays out a method for sensor resistance correction using an inverse approach 1100. This optimization method may comprise the steps of measuring total resistance between n rows and m columns 1120 of array 1110, where the array is represented as n x m. This can be followed by the step of simulating circuit row / column measurements 1130 (n x m simulated resistance) using an electrical modeling software, e.g., SPICE. Initial resistances can be generated using previously optimized element-wise resistances or with random resistances. After the simulation, a further step of numerical optimizing 1140 algorithms to minimize error by adjusting element-wise resistances until error is minimized below a threshold using process 1142 (Absolute sum of n x m errors), process 1144 (n x m adjusted element-wise resistances). A final step may then occur where the error threshold is reached; optimal element-wise resistances are selected via process 1150 and used as the inferred element-wise resistances.

[0069] Regarding FIG. 10, where a flow chart lays out a method for sensor resistance correction 1200 using a machine learning approach. Having the steps using arbitrary sensor states are generated at process 1210 (n x m element-wise resistance) to populate training data, using a circuit simulation algorithm 1220 (n x m simulate row / column resistance) is used to simulate totalrow / column resistances, using an AI / ML approach 1230 (n x m predicted element-wise resistance) to predict the element-wise resistances based on the simulated row / column resistances, using an AI / ML algorithm 1240 (absolute sum of n x m errors) to minimizes error until error is minimized below a threshold, followed by the step of reaching an error threshold 1250 (n x m element-wise resistance) that includes optimal weights are selected and used as the inferred element-wise resistances. Generating the data for training can be accomplished by using a numerical circuit simulation (also called a SPICE simulation), which can accurately simulate an electrical circuit. Arbitrary values for the internal resistances of the sensor array can be chosen either at random or from patterns that simulate expected seating pressure profiles. The circuit simulation software then adds a voltage source between a row and column pair and calculates the amount of current that flows using a variety of circuit laws; this allows the calculation of an overall row / column resistance value using Ohm’s law (circuit simulation returns a known voltage and current, so thus a resistance can be calculated -> voltage / current = resistance). The ML / Al algorithm attempts to guess the internal resistances based on the row / current resistance measurements and iteratively improves the prediction based on the given ML / Al algorithm. Since the training data is generated from a simulation, data can be generated quickly, and a large space of possible resistances can be used to train the algorithm.

[0070] Persons of ordinary skill in arts relevant to this disclosure and subject matter hereof will recognize that embodiments may comprise fewer features than illustrated in any individual embodiment described by example or otherwise contemplated herein. Embodiments described herein are not meant to be an exhaustive presentation of ways in which various features may be combined and / or arranged. Accordingly, the embodiments are not mutually exclusive combinations of features; rather, embodiments can comprise a combination of different individual features selected from different individual embodiments, as understood by persons of ordinary skill in the relevant arts. Moreover, elements described with respect to one embodiment can be implemented in other embodiments even when not described in such embodiments unless otherwise noted. Although a dependent claim may refer in the claims to a specific combination with one or more other claims, other embodiments can also include a combination of the dependent claim with the subject matter of each other dependent claim or a combination of one or more features with other dependent or independent claims. Such combinations are proposed herein unless it is stated that a specific combination is not intended. Furthermore, it is also intended to include features of a claim in any other independent claim, even if this claim is not directly made dependent on the independent claim.

Claims

CLAIMS1. A force-sensing conductive array, comprising: a series of trace rows comprised of a conductive substrate; a series of trace columns comprised of a conductive substrate; the series of trace rows and trace columns form a grid having a series of intersections; a series of resistive elements, wherein each resistive element of the series of resistive elements creates an interconnection between a single trace row and a single trace column at each intersection of the grid; a first spacer layer, disposed between the series of resistive elements and the series of trace rows; and a second spacer layer, being disposed between the series of resistive elements and the series of trace columns.

2. The force sensing conductive array of claim 1, further comprising a first support layer and a second support layer, wherein the first support layer is disposed on a side of the series of trace rows opposite the first spacer layer; and wherein the second support layer is disposed on a side of the series of trace columns opposite the second spacer layer.

3. The force sensing conductive array of claim 1 further comprising a detection system that is in electrical communication with each trace row of the series of trace rows and each trace column of the series of trace columns, wherein the detection system obtains a series of resistance measurements from the interactions between the series of trace rows and each trace column of the series of trace columns.

4. The force sensing conductive array of claim 3, wherein the detection system is configured to apply an algorithm to the series of resistance measurements to mitigate a ghosting effect produced by the adjacent resistive elements in the grid.

5. The force sensing conductive array of claim 1, further comprising an electronics module, wherein the electronics module is interconnected to the conducive array.

6. The force sensing conductive array of claim 5, wherein the electronics module further comprises at least one of sensor chosen from the group consisting of a moisture sensor, ahumidity sensor, a volatile organic compound sensor, a shear sensor, a temperature sensor, and inertial movement sensors.

7. The force sensing conductive array of claim 1, wherein the first spacer layer and the second spacer layer are adhered to the series of resistive elements.

8. The force sensing conductive array of claim 2, wherein the first support layer and the second support layer and bonded about their perimeter to form a waterproof seal.

9. A system for a multi-sensing array comprising: an application, wherein the application is configured to run on an electronic device; a sensor array having: an electronics module with a processor having firmware; a user interface, wherein the user interface is structured and configured to provide realtime feedback from the sensor array; and wherein the application analyzes the real-time feedback to provide instructions to prevent injury to the user.

10. The system for a multi-sensing array of claim 9 wherein the sensor array further comprises: a series of trace rows comprised of a conductive substrate; a series of trace columns comprised of a conductive substrate; the series of trace rows and trace columns form a perpendicular grid having a series of intersections; a series of resistive elements disposed between the series of trace rows and trace columns, wherein each resistive element of the series of resistive elements creates an interconnection between a single trace row and a single trace column at each intersection on the grid; at least one spacer layer, disposed between the series of resistive elements and the series of trace rows, or the series of trace columns.

11. A force sensing conductive array, comprising: a series of trace rows comprised of a conductive substrate; a series of trace columns comprised of a conductive substrate; the series of trace rows and trace columns form a grid having a series of intersections;a series of resistive elements disposed between the series of trace rows and trace columns, wherein each resistive element of the series of resistive elements creates an interconnection between a single trace row and a single trace column at each intersection on the grid; at least one spacer layer, disposed between the series of resistive elements and the series of trace rows, or the series of trace columns.

12. The force sensing conductive array of claim 11, further comprising a first support layer and a second support layer, wherein the first support layer is disposed on a side of the series of trace rows opposite the first spacer layer; and wherein the second support layer is disposed on a side of the series of trace columns opposite the second spacer layer.

13. The force sensing conductive array of claim 11 further comprising a detection system that is in electrical communication with each trace row of the series of trace rows and each trace column of the series of trace columns, wherein the detection system obtains a series of resistance measurements from the interactions between the series of trace rows and each trace column of the series of trace columns.

14. The force sensing conductive array of claim 13, wherein the detection system is configured to apply an algorithm to the series of resistance measurements to mitigate a ghosting effect produced by the adjacent resistive elements in the grid.

15. The force sensing conductive array of claim 11, further comprising an electronics module, wherein the electronics module is interconnected to the conducive array.

16. The force sensing conductive array of claim 15, wherein the electronics module further comprises at least one of sensor chosen from the group consisting of a moisture sensor, a humidity sensor, a volatile organic compound sensor, a shear sensor, a temperature sensor, and inertial movement sensors.

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