Aerosol generating device

Abstract

An aerosol generating device, comprising a microwave heating assembly (200). The microwave heating assembly (200) comprises an outer conductor unit (2) and an inner conductor unit (3); the outer conductor unit (2) is provided with a cavity (23); and the inner conductor unit (3) is arranged in the cavity (23). The aerosol generating device further comprises a radio frequency board (1) and an oscillator mounted on the radio frequency board (1). Part of the radio frequency board (1) is inserted into the cavity (23) and is magnetically coupled to the inner conductor unit (3). The aerosol generating device directly transmits microwave energy by means of the radio frequency board (1). By directly inserting part of the radio frequency board (1) into the outer conductor unit (2) so as to be magnetically coupled to the inner conductor unit (3), the need for microwave feeding terminals is eliminated, thereby forming a more compact energy coupling structure.

Description

Aerosol generating device TECHNICAL FIELD

[0001] The present application relates to the technical field of aerosol generation, and in particular to an aerosol generating device. BACKGROUND

[0002] The aerosol generating device can heat an aerosol generating article by using microwave heating.

[0003] In the related art, the aerosol generating device includes a microwave generating assembly and a microwave heating assembly; the microwave heating assembly includes a microwave feed-in terminal and an inner conductor unit; the microwave generating assembly needs to pass through the microwave feed-in terminal to transmit microwave energy to the inner conductor unit. SUMMARY

[0004] The present application relates to the technical field of aerosol generation, and in particular to an aerosol generating device.

[0005] The technical problem solved by the present application is to provide an aerosol generating device.

[0006] In some embodiments, the RF board includes a board body and a transmission line structure formed on the board body; part of the transmission line structure is arranged in the cavity and magnetically coupled to the inner conductor unit.

[0007] In some embodiments, the board body includes a main board and a plug-in board connected to the main board; the main board is arranged outside the outer conductor unit, and the plug-in board is used to be inserted into the cavity.

[0008] The transmission line structure includes a second microstrip line formed on the main board and a first microstrip line formed on the plug-in board; the oscillator is connected to the first microstrip line through the second microstrip line, and the first microstrip line is used to be magnetically coupled to the inner conductor unit.

[0009] In some embodiments, the shape structure of the first conductive strip of the first microstrip line includes one or a combination of strip structure and planar structure.

[0010] In some embodiments, the shape of the first conductive strip of the first microstrip line includes one or a combination of at least two patterns of spiral shape, grid shape, square shape and trapezoidal shape.

[0011] In some embodiments, the first microstrip line is disposed outside the inner conductor unit;

[0012] The plug-in board comprises a first dielectric layer and a first conductive layer, the first conductive layer is disposed on the side of the first dielectric layer facing away from the inner conductor unit; the first conductive strip of the first microstrip line is disposed on the first conductive layer;

[0013] Alternatively, the plug-in board comprises a first dielectric layer and a first conductive layer, the first conductive layer is disposed on the side of the first dielectric layer facing the inner conductor unit; the first conductive strip of the first microstrip line is disposed on the first conductive layer.

[0014] Alternatively, the plug-in board comprises a first conductive layer, a first dielectric layer and a first ground layer, the first dielectric layer is disposed between the first conductive layer and the first ground layer; the first conductive strip of the first microstrip line is disposed on the first conductive layer and faces the inner conductor unit.

[0015] In some embodiments, the outer conductor unit is in a cylindrical shape, comprising a first end and a second end opposite to the first end;

[0016] The plug-in board is disposed to be inserted into the cavity from the end wall of the first end.

[0017] In some embodiments, the inner conductor unit is in an elongated structure, the first microstrip line is disposed on the outer circumference of the inner conductor unit, and the plane where the first microstrip line is located is parallel to the axial direction of the inner conductor unit.

[0018] In some embodiments, the inner conductor unit comprises a conductor column and a probe, one end of the conductor column is connected to the end wall of the first end, and the other end of the conductor column is connected to the probe;

[0019] The plug-in board is disposed on the outer circumference of the conductor column, and the plane where the plug-in board is located is parallel to the axial direction of the conductor column.

[0020] In some embodiments, the inner conductor unit further comprises a conductor disc, the conductor disc is combined to the end of the conductor column away from the first end; the probe is embedded in the conductor disc.

[0021] The present application has the following beneficial effects: the present aerosol generating device directly transmits microwave energy by using a radio frequency board, directly inserts part of the structure of the radio frequency board into the outer conductor unit, and magnetically couples with the inner conductor unit, thereby omitting the microwave feeding terminal and forming a more concise energy coupling structure. BRIEF DESCRIPTION OF DRAWINGS

[0022] The application will be further described below in conjunction with the accompanying drawings and embodiments. In the drawings:

[0023] Fig. 1 is a schematic view of the structure of the microwave heating assembly and the RF board in some embodiments of the application;

[0024] Fig. 2 is a longitudinal sectional view of the microwave heating assembly and the RF board in the first angle in Embodiment 1 of the application;

[0025] Fig. 3 is a schematic view of the partial structure of the RF board in Embodiment 1 of the application;

[0026] Fig. 4 is a longitudinal sectional view of the microwave heating assembly and the RF board in the second angle in Embodiment 1 of the application;

[0027] Fig. 5 is a circuit distribution diagram between the microwave heating assembly and the RF board in an embodiment of the application;

[0028] Fig. 6 is a longitudinal sectional view of the microwave heating assembly and the RF board in the second angle in Embodiment 2 of the application;

[0029] Fig. 7 is a schematic view of the partial structure of the RF board in Embodiment 2 of the application.

[0030] Reference signs:

[0031] Microwave heating assembly 200; aerosol generating article 300;

[0032] RF board 1; board body 11; plug-in board 111; first conductive layer 1111; first dielectric layer 1112; first ground layer 1113; main board 112; second conductive layer 1121; second dielectric layer 1122; second ground layer 1123; transmission line structure 12; first microstrip line 121; first conductive strip 1211; second microstrip line 122; second conductive strip 1221; outer conductor unit 2; first end 21; second end 22; cavity 23; conductor sidewall 24; conductor end wall 25; plug-in hole 26; inner conductor unit 3; conductor column 31; conductor disc 32; probe 33; receiving seat 4; receiving part 41; receiving cavity 42; air passage 43. DETAILED DESCRIPTION

[0033] In order to make the technical features, objectives and effects of the present application clearer, the specific embodiments of the present application will be described in detail below. In the following description, it should be understood that the directions or positional relationships indicated by "front", "back", "upper", "lower", "left", "right", "vertical", "horizontal", "vertical", "horizontal", "top", "bottom", "inner", "outer", "head", "tail" and the like are based on the directions or positional relationships shown in the drawings, constructed and operated in a specific direction, and are only for the convenience of describing the technical solutions, and do not indicate that the devices or elements indicated must have a specific direction, so it cannot be understood as a limitation on the present application.

[0034] It should also be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing", "setting" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements or the interaction relationship between two elements. When an element is referred to as "on" or "below" another element, the element can be "directly" or "indirectly" above the other element, or there can be one or more intervening elements. The terms "first", "second", "third" and the like are only for the convenience of describing the technical solutions, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of indicated technical features, so the features with "first", "second", "third" and the like can be explicitly or implicitly include one or more of the features. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0035] In the following description, specific details such as specific system structures, techniques, etc. are presented for the purpose of illustration, not for the purpose of limitation, so as to thoroughly understand the embodiments of the present application. However, it should be clear to those skilled in the art that the present application can also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits and methods are omitted to avoid unnecessary details that hinder the description of the present application.

[0036] The present application constructs an aerosol generating device which can heat the aerosol generating article 300 (see FIG. 3, but note that FIG. 3 only shows part of the aerosol generating article 300) by microwaves to atomize and generate aerosol, and for the user to smoke or inhale. In some embodiments, the aerosol generating article 300 is a solid aerosol generating article 300 such as a processed plant leaf article. Understandably, in other embodiments, the aerosol generating article 300 can also be a liquid aerosol generating article 300.

[0037] Referring to FIG. 1, the aerosol generating device can include a microwave generating assembly and a microwave heating assembly 200. The microwave generating assembly is configured to generate microwave energy, which can be delivered to the inside of the microwave heating assembly 200 and form a microwave field acting on the aerosol generating article 300 inside, thereby achieving microwave heating.

[0038] In some embodiments, referring to FIG. 2, the microwave heating assembly 200 can include an outer conductor unit 2 and an inner conductor unit 3. The outer conductor unit 2 has a first end 21 and a second end 22 opposite to the first end 21, and can define a cavity 23 between the first end 21 and the second end 22. The outer conductor unit 2 is configured to be electrically conductive at least on the inner wall surface thereof. The inner conductor unit 3 has a fixed end and a free end opposite to the fixed end. The fixed end of the inner conductor unit 3 is in ohmic contact with the first end 21 of the outer conductor unit 2, forming a short-circuit end of the microwave heating assembly 200. The free end of the inner conductor unit 3 is located in the cavity 23 without contacting the outer conductor unit 2, forming an open-circuit end of the microwave heating assembly 200.

[0039] As can be understood, when the aerosol generating device is used, the aerosol generating article 300 can be inserted into the cavity 23 as shown in FIG. 2, and the free end of the inner conductor unit 3 can be inserted into the inside of the aerosol generating article 300 at this time. Of course, the free end of the inner conductor unit 3 can also be disposed on the side of the aerosol generating article 300, which is not specifically limited. During the operation of the aerosol generating device, the microwave energy delivered from the microwave generating assembly can be released from the free end of the inner conductor unit 3 and act on the aerosol generating article 300.

[0040] In some embodiments, referring to FIG. 1, the microwave generating assembly can include a radio frequency board 1 and an oscillator (not shown) disposed on the radio frequency board 1. The oscillator can generate a microwave signal, and the radio frequency board 1 can function to transmit, modulate, amplify, and process the microwave signal.

[0041] The radio frequency board 1 can include a board body 11 and a transmission line structure 12 formed on the board body 11, and the transmission line structure 12 can be configured to transmit the microwave signal. In the present disclosure, referring to FIG. 2, a part of the board body 11 and the transmission line structure 12 can be configured to be directly inserted into the cavity 23 from the outside of the outer conductor unit 2 and located outside the inner conductor unit 3, so that the part of the transmission line structure 12 can deliver the microwave energy to the inner conductor unit 3 in a magnetic coupling manner. It should be noted that the magnetic coupling manner has the characteristic of contactless transmission, that is, the energy can be delivered without physical contact.

[0042] It can be explained that in the related art, the energy between the radio frequency board 1 and the inner conductor unit 3 needs to be transmitted by a microwave feed terminal. One end of the microwave feed terminal is connected with the radio frequency board 1, and the other end is connected with the inner conductor unit 3, but the microwave feed terminal and the inner conductor unit 3 are prone to poor contact, tip discharge due to thermal expansion and cold shrinkage, part size deviation, insertion loss and other reasons, thereby causing the energy utilization efficiency to be low and the radio frequency board 1 to be burned. The situation occurs. And the present application directly inserts part of the structure of the radio frequency board 1 into the cavity 23 and magnetically couples with the inner conductor unit 3. On the one hand, a more simple energy coupling structure can be formed, saving the cost of the microwave feed terminal, and on the other hand, the problems of poor contact and tip discharge can be avoided.

[0043] Continuing as shown in FIG. 2, the board body 11 can be a PCB circuit board, which can include a main plate 112 and a plug-in plate 111 connected with the main plate 112. Among them, the main plate 112 is arranged outside the outer conductor unit 2, and the plug-in plate 111 is arranged to be inserted and arranged in the cavity 23, located outside the inner conductor unit 3. Optionally, the main plate 112 and the plug-in plate 111 can be integrally formed, such as being cut from a whole plate; the main plate 112 and the plug-in plate 111 can also be combined by connection methods such as bonding, which is not limited.

[0044] The transmission line structure 12 can be formed on the board body 11 by printing. The transmission line structure 12 can be a microstrip line; as shown in FIG. 2, the microstrip line can include a second microstrip line 122 formed on the main plate 112, and a first microstrip line 121 formed on the plug-in plate 111. Understandably, the second microstrip line 122 and the first microstrip line 121 are located in the same plane, and the oscillator is connected with the first microstrip line 121 through the second microstrip line 122. The first microstrip line 121 is arranged to be magnetically coupled with the inner conductor unit 3.

[0045] Further optionally, referring to FIG. 3, the main plate 112 can include a second conductive layer 1121, a second dielectric layer 1122 and a second ground layer 1123. Among them, the second conductive layer 1121 provides the basis for laying the circuit; the second dielectric layer 1122 is an insulating layer arranged between the second signal layer and the second ground layer 1123; the ground layer is a metal ground. The second microstrip line 122 includes a second conductive strip 1221, which can be arranged on the second conductive layer 1121 of the main plate 112.

[0046] The plug-in board 111 can at least include a first conductive layer 1111 and a first dielectric layer 1112. The first conductive layer 1111 provides a basis for the circuit layout and is laid on the first dielectric layer 1112; the first dielectric layer 1112 is an insulating layer. The first microstrip line 121 includes a first conductive strip 1211, which can be arranged on the first conductive layer 1111 of the plug-in board 111.

[0047] Understandably, since the ground layer affects the magnetic coupling between the conductive strip of the microstrip line and the inner conductor unit 3, in the present application, no ground layer is arranged between the conductive strip and the inner conductor unit 3. In other words, in the case where the first conductive strip 1211 is arranged to face the inner conductor unit 3, the plug-in board 111 can include the first conductive layer 1111, the first dielectric layer 1112 and the first ground layer 1113, the first ground layer 1113 being arranged on the side of the first dielectric layer 1112 away from the inner conductor unit 3, the first conductive layer 1111 being arranged on the side of the first dielectric layer 1112 facing the inner conductor unit 3; the first conductive strip 1211 is arranged between the inner conductor unit 3 and the first dielectric layer 1112. In the case where the first conductive strip 1211 is arranged to face away from the inner conductor unit 3, i.e. as shown in the embodiment of FIG. 4, the plug-in board 111 can include the first conductive layer 1111 and the first dielectric layer 1112, and the plug-in board 111 does not include the first ground layer 1113 at least on the part of the plug-in board 111 inside the cavity 23, the first conductive layer 1111 being arranged on the side of the first dielectric layer 1112 away from the inner conductor unit 3, and the side of the first dielectric layer 1112 facing the inner conductor unit 3 can be straight to the inner conductor unit 3; the first conductive strip 1211 is arranged between the first dielectric layer 1112 and the cavity wall of the outer conductor unit 2.

[0048] Optionally, referring back to FIG. 3, the second conductive strip 1221 can be in the shape of a long strip, one end of which can be connected to the oscillator and the other end of which can be connected to the first conductive strip 1211. The first conductive strip 1211 can be in the shape of a strip such as a spiral or a grid. Of course, the first conductive strip 1211 can also be in the shape of a plane such as a square or a trapezoid, which is not limited herein. Understandably, the shape and length of the second conductive strip 1221 and the first conductive strip 1211 can be designed and adjusted according to product requirements to ensure high-quality transmission of microwave signals, for example, the characteristic impedance of the conductive strip can be affected by changing the shape of the conductive strip (e.g. making it curved or having corners).

[0049] The following experimental data illustrates the effect of the radio frequency board 1 of the present application:

[0050] Referring to FIG. 5, which illustrates the electric field distribution of the microwave heating assembly 200 in operation, the electric field distribution refers to the variation of the electric field intensity of the microwave in space, which reflects the energy density and the propagation direction of the microwave. As can be seen, the RF board 1 is not in contact with the inner conductor unit 3, but microwave energy can be transferred therebetween, and the transferred microwave energy can be mainly released at the free end of the inner conductor unit 3.

[0051] To further illustrate the present application, the microwave generating assembly and the microwave heating assembly 200 are described in detail below by citing several specific embodiments. In addition, for the sake of simplicity and easy understanding, the side / end of the components close to the second end 22 of the outer conductor unit 2 is referred to as the top side / end, and the side / end of the components away from the second end 22 of the outer conductor unit 2 is referred to as the bottom side / end.

[0052] Embodiment 1

[0053] Referring to the structure of the microwave heating assembly 200, as described above, the microwave heating assembly 200 can include the outer conductor unit 2 and the inner conductor unit 3. In addition, referring to FIG. 4, the microwave heating assembly 200 can further include the housing 4, which can be fixedly or detachably installed at the second end 22 of the outer conductor unit 2 (it should be noted that FIG. 4 only illustrates part of the structure of the housing 4, and the structure of the housing 4 for installation on the outer conductor unit 2 is omitted), and which defines a housing cavity 42 for housing the aerosol generating article 300, and the free end of the inner conductor unit 3 can extend into the housing cavity 42.

[0054] Of course, the housing 4 is not an essential component in the present application, and it is applied as a preferred solution in the present application, which can protect the cavity 23 and part of the structure of the inner conductor unit 3 from being or as far as possible from being contaminated by the mist. In other embodiments, the housing cavity 42 can also be formed directly in the cavity 23. For example, the aerosol generating article 300 can be directly inserted into the cavity 23 from the second end 22 of the outer conductor unit 2, and the space occupied by the aerosol generating article 300 in the cavity 23 can be regarded as the housing cavity 42.

[0055] Referring to FIG. 4, the outer conductor unit 2 can include a conductive conductor side wall 24 and a conductor end wall 25. The conductor side wall 24 can be cylindrical, but the conductor side wall 24 is not limited to being cylindrical, and can be square, irregular, or other shapes. The conductor end wall 25 is closed to the bottom end of the conductor side wall 24 to form the first end 21, and the top end of the conductor side wall 24 forms the second end 22. The conductor side wall 24 and the conductor end wall 25 together define the cavity 23, which is cylindrical. In addition, the conductor end wall 25 is provided with an axial through-hole 26, which allows the plug 111 of the RF board 1 to be inserted into the cavity 23.

[0056] The inner conductor unit 3 can be a longitudinal structure, which can include a microwave matching structure and a microwave radiation structure. The microwave matching structure is arranged between the conductor end wall 25 of the outer conductor unit 2 and the receiving seat 4, and is connected to the conductor end wall 25 of the outer conductor unit 2. The microwave radiation structure is combined with the microwave matching structure, and at least part of the structure is located in the receiving cavity 42 for the aerosol generating article 300 to be inserted thereon.

[0057] The microwave matching structure can include a conductor column 31 and a conductor disc 32.

[0058] As shown in FIG. 4, the conductor column 31 can be cylindrical, and the diameter is smaller than the inner diameter of the outer conductor unit 2. Of course, the conductor column 31 is not limited to being cylindrical, and can be square, elliptical, stepped, irregular, or other shapes, which are not limited. The conductor column 31 can stand on the conductor end wall 25 of the outer conductor unit 2. The bottom end of the conductor column 31 can be regarded as the fixed end of the inner conductor unit 3.

[0059] The conductor disc 32 can be disc-shaped, and the diameter can be smaller than the inner diameter of the outer conductor unit 2 and larger than the diameter of the conductor column 31. Of course, the shape of the conductor disc 32 is not limited to being disc-shaped, and can be square, circular truncated cone, or the like, which are not limited. The conductor disc 32 can be directly and integrally formed on the top end of the conductor column 31, or can be in ohmic contact with the conductor column 31.

[0060] It can be understood that the conductor disc 32 is used to increase inductance and capacitance, so as to further reduce the overall size of the microwave heating assembly 200. In other embodiments, the microwave matching structure can only include the conductor column 31, and the microwave radiation structure is directly combined with the conductor column 31.

[0061] As shown in Figure 4, the microwave radiation structure may include an elongated probe 33; the bottom end of the probe 33 is embedded in the microwave matching structure and forms a good ohmic contact with the microwave matching structure, while the top end of the probe 33 extends into the receiving cavity 42. Optionally, the probe 33 may be embedded in the conductor disk 32, or it may pass through the conductor disk 32 and be inserted into the conductor post 31.

[0062] The housing 4 can be made of a high-temperature resistant material with low dielectric loss to effectively prevent microwave absorption. Referring to Figure 4, the housing 4 may include a housing portion 41 and a fixing portion (not shown) connected to the housing portion 41. The housing portion 41 is used to house the aerosol generating article 300; the fixing portion is used to axially seal the second end 22 of the outer conductor unit 2 and fix the housing portion 41 within the cavity 23.

[0063] The fixing part can be annular and coaxially coupled to the top of the receiving part 41. The outer diameter of the fixing part is slightly larger than the inner diameter of the outer conductor unit 2, and it can be installed at the second end 22 of the outer conductor unit 2.

[0064] The receiving portion 41 may be cylindrical, with an outer diameter smaller than the inner diameter of the outer conductor unit 2, and together with the fixing portion, defines an axial receiving cavity 42 for receiving the aerosol generating article 300. The top of the receiving portion 41 is open and communicates with the interior of the fixing portion; and the bottom of the receiving portion 41 can support the aerosol generating article 300. The aerosol generating article 300 can extend through the fixing portion into the receiving portion 41 and sit on the bottom of the receiving portion 41.

[0065] In addition, a number of air passages 43 may be formed in the housing 4. These air passages 43 may be formed on the inner side wall of the fixing part, the inner side wall of the housing part 41 and its inner bottom wall, so that ambient air can reach the bottom of the aerosol generating product 300 through the air passages 43.

[0066] Next, consider the microwave generating component. As described above, the microwave generating component may include an RF board 1 and an oscillator disposed on the RF board 1.

[0067] Referring to Figure 2, part of the structure of the radio frequency board 1 is configured to be directly inserted into the cavity 23 from the outside of the outer conductor unit 2 to transmit microwave energy to the inner conductor unit 3 in a magnetic coupling manner; and, when the radio frequency board 1 is installed on the outer conductor unit 2, it can be connected parallel to the axial direction of the outer conductor unit 2.

[0068] The radio frequency board 1 may include a board body 11 and a transmission line structure 12 formed on the board body 11; the board body 11 may include a motherboard 112 and a plug-in board 111; the transmission line structure 12 may be a microstrip line, including a second microstrip line 122 formed on the motherboard 112 and a first microstrip line 121 formed on the plug-in board 111.

[0069] Please continue to refer to FIG. 4, the plugboard 111 can be inserted into the cavity 23 from the jack 26 on the outer conductor unit 2, optionally, the plugboard 111 can be fixedly connected at the jack 26 by clamping, bonding and the like. After the plugboard 111 is inserted, the plugboard 111 is located on the outer circumference of the conductor column 31 and maintains a distance with the conductor column 31; and the plane where the plugboard 111 is located is parallel to the axial direction of the conductor column 31.

[0070] In this embodiment, as shown in FIG. 4, the mainboard 112 can include a second conductive layer 1121, a second dielectric layer 1122 and a second ground layer 1123.

[0071] The plugboard 111 can include a first conductive layer 1111 and a first dielectric layer 1112, after the plugboard 111 is inserted into the cavity 23, the first conductive layer 1111 is located on the side of the first dielectric layer 1112 which is away from the conductor column 31; the first conductive strip 1211 of the first microstrip line 121 is in a spiral strip structure, formed on the first conductive layer 1111 and faces the conductor side wall 24 of the outer conductor unit 2.

[0072] It can be explained that the closer the first microstrip line 121 is to the conductor column 31, the higher the coupling efficiency is, but if it is too close to the conductor column 31, it may cause tip discharge; secondly, since the shape, size and other factors of the microstrip line can affect the coupling efficiency, the distance between the first microstrip line 121 and the conductor column 31 needs to be adjusted according to the design of the microstrip line, which is not limited here.

[0073] Embodiment 2

[0074] Referring to FIG. 6, the microwave generating assembly of this embodiment is an improvement based on embodiment 1. The specific improvement is to adjust the orientation of the first microstrip line 121 and change the shape of the first conductive strip 1211 of the first microstrip line 121. The structure of the microwave heating assembly 200 can refer to embodiment 1, which will not be repeated here.

[0075] In this embodiment, as shown in FIG. 6, the plugboard 111 of the radio frequency board 1 can include a first conductive layer 1111, a first dielectric layer 1112 and a first ground layer 1113; wherein the first conductive layer 1111 is arranged on the side facing the conductor column 31, and the first ground layer 1113 is located on the side of the first conductive layer 1111 which is away from the inner conductor unit 3.

[0076] The first conductive strip 1211 of the first microstrip line 121 is formed on the first conductive layer 1111 and faces the conductor column 31. In this embodiment, as shown in FIG. 7, the shape of the first conductive strip 1211 of the first microstrip line 121 is in a grid-shaped strip structure.

[0077] In summary, two embodiments are exemplified in the present application to illustrate the structure of the radio frequency board 1 and the microwave heating assembly 200 and the connection relationship between the two. In the embodiments, part of the structure of the radio frequency board 1 can be directly inserted into the cavity 23 and magnetically coupled with the inner conductor unit 3, which can form a more concise energy coupling structure on the one hand, save the cost of the microwave feeding terminal on the other hand, and avoid the problems of poor contact and tip discharge.

[0078] It should be noted that referring to FIG. 4, the plug-in board 111 can be divided into a first structure part (not shown) located in the cavity 23 and a second structure part (not shown) located in the jack 26. Since the magnetic coupling cannot be disturbed by the ground layer, there cannot be a ground layer between the conductive strip and the conductor column 31, that is, the first structure part can only be provided with a conductive layer and a dielectric layer, and whether the second structure part is provided with a ground layer does not affect the magnetic coupling and can be set according to product requirements.

[0079] Secondly, although the above embodiments only exemplify the case that the plug-in board 111 and the first microstrip line 121 are arranged below the conductor disc 32, in essence, the plug-in board 111 and the first microstrip line 121 can also be arranged to continue extending upwards, such as being arranged on the outer circumference of the microwave radiation structure (probe 33), and this arrangement can also make the design of the microstrip line easier and reduce the difficulty of achieving the desired coupling efficiency. In summary, the plug-in board 111 and the first microstrip line 121 can be arranged on the outer circumference of the inner conductor unit (3).

[0080] It can be understood that the above embodiments only express the preferred embodiments of the present application, which are described in more detail and in detail, but cannot be understood as a limitation on the scope of the patent of the present application; it should be noted that for ordinary skilled persons in the art, the above technical features can be freely combined without departing from the concept of the present application, and some modifications and improvements can also be made, which all belong to the protection scope of the present application; therefore, any equivalent transformation and modification within the scope of the claims of the present application shall belong to the scope of the claims of the present application.

Claims

1. An aerosol generating device, comprising a microwave heating assembly (200), the microwave heating assembly (200) comprising an outer conductor unit (2) and an inner conductor unit (3), the outer conductor unit (2) having a cavity (23), the inner conductor unit (3) being disposed within the cavity (23), characterized in that, The aerosol generating device also includes a radio frequency board (1) and an oscillator mounted on the radio frequency board (1). Part of the structure of the radio frequency board (1) is inserted into the cavity (23) and magnetically coupled to the inner conductor unit (3).

2. The aerosol generating device according to claim 1, characterized in that, The radio frequency board (1) includes a board body (11) and a transmission line structure (12) formed on the board body (11); a portion of the transmission line structure (12) is disposed in the cavity (23) and magnetically coupled to the inner conductor unit (3).

3. The aerosol generating device according to claim 2, characterized in that, The plate (11) includes a main board (112) and a plug plate (111) connected to the main board (112); the main board (112) is disposed outside the outer conductor unit (2), and the plug plate (111) is used to be inserted into the cavity (23); The transmission line structure (12) includes a second microstrip line (122) formed on the motherboard (112) and a first microstrip line (121) formed on the plug-in board (111); the oscillator is connected to the first microstrip line (121) through the second microstrip line (122), and the first microstrip line (121) is used for magnetic coupling with the inner conductor unit (3).

4. The aerosol generating device according to claim 3, characterized in that, The shape and structure of the first conductive strip (1211) of the first microstrip line (121) includes one or a combination of strip structure and planar structure.

5. The aerosol generating device according to claim 4, characterized in that, The shape of the first conductive strip (1211) of the first microstrip line (121) includes one or a combination of at least two of the following shapes: spiral, grid, square and trapezoidal.

6. The aerosol generating apparatus according to claim 3, characterized in that, The first microstrip line (121) is disposed on the outside of the inner conductor unit (3); The insert plate (111) includes a first dielectric layer (1112) and a first conductive layer (1111), wherein the first conductive layer (1111) is disposed on the side of the first dielectric layer (1112) facing away from the inner conductor unit (3); the first conductive strip (1211) of the first microstrip line (121) is disposed on the first conductive layer (1111); Alternatively, the insert (111) includes a first dielectric layer (1112) and a first conductive layer (1111), wherein the first conductive layer (1111) is disposed on the side of the first dielectric layer (1112) facing the inner conductor unit (3); and the first conductive strip (1211) of the first microstrip line (121) is disposed on the first conductive layer (1111). Alternatively, the insert (111) includes a first conductive layer (1111), a first dielectric layer (1112), and a first ground layer (1113), wherein the first dielectric layer (1112) is disposed between the first conductive layer (1111) and the first ground layer (1113); the first conductive strip (1211) of the first microstrip line (121) is disposed on the first conductive layer (1111) and faces the inner conductor unit (3).

7. The aerosol generating device according to claim 3, characterized in that, The outer conductor unit (2) is cylindrical and includes a first end (21) and a second end (22) opposite to the first end (21). The insert plate (111) is configured to be inserted into the cavity (23) from the end wall of the first end (21).

8. The aerosol generating apparatus according to claim 7, characterized in that, The inner conductor unit (3) has a longitudinal structure. The first microstrip line (121) is disposed on the outer circumferential direction of the inner conductor unit (3), and the plane where the first microstrip line (121) is located is parallel to the axial direction of the inner conductor unit (3).

9. The aerosol generating apparatus according to claim 7, characterized in that, The inner conductor unit (3) includes a conductor post (31) and a probe (33). One end of the conductor post (31) is connected to the end wall of the first end (21), and the probe (33) is connected to the other end of the conductor post (31). The insert plate (111) is disposed on the outer circumferential direction of the conductor post (31), and the plane of the insert plate (111) is parallel to the axial direction of the conductor post (31).

10. The aerosol generating apparatus according to claim 9, characterized in that, The inner conductor unit (3) also includes a conductor disk (32), which is attached to the end of the conductor post (31) away from the first end (21); the probe (33) is embedded in the conductor disk (32).

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