Printed circuit board unit for an optical sensor unit

Abstract

The present invention relates to a printed circuit board unit (10) for an optical sensor unit (100), wherein the printed circuit board unit (10) comprises a printed circuit board element (12), wherein the printed circuit board element (12) has a substantially circumferential edge region (14), wherein the edge region (14) is substantially completely provided with an edge metallisation, wherein the printed circuit board element (12) has a surface (16) which adjoins and / or continues from the edge region (14), wherein the printed circuit board element (12) comprises a conductor track element (18) on the surface (16), wherein the conductor track element (18) comprises at least one predetermined pattern (20), wherein the at least one predetermined pattern (20) is designed to provide thermal energy in order to remove condensation and / or ice from a lens element (102) of the optical sensor unit (100).

Description

[0001] Description

[0002] title Sensor unit

[0003] State of the art

[0004] The present invention relates to a printed circuit board unit for an optical sensor unit, an optical sensor unit, a method for assembling an optical sensor unit and a vehicle.

[0005] Currently, numerous solutions exist for cleaning and maintaining lenses in the automotive sector. Due to the increasing number of optical sensor units in vehicles and the rising demands for both detection accuracy and quality, the need for innovative and robust optical sensor units is constantly growing.

[0006] The continuous reduction of weight in the vehicle sector to reduce fuel consumption, as well as increasing competition, is causing cost pressure, leading to a greater demand for cheaper and more efficient vehicle components.

[0007] Disclosure of the invention

[0008] The printed circuit board unit according to the invention for an optical sensor unit with the features of claim 1 has the advantage over known designs that a large number of components for the formation of a lens heater can be saved, thus providing more layout area on the printed circuit board unit for other circuits. Furthermore, the heating power can preferably be significantly increased by providing the conductor elements on a first side as well as a second side. Also further preferably, the heating power can be higher, lower, and / or the same depending on the heating concept. A further advantage is that the lens heating can be provided by elements that are already present in printed circuit board series production, thus eliminating the need for additional elements and assembly steps.In this process, the elements can be manufactured cost-neutrally during printed circuit board production using a structured etching process, parallel to the other conductor track structures. Furthermore, by utilizing the edge, no-go zones can be eliminated and these areas can be used for circuits or other functional elements on the printed circuit board assembly.

[0009] According to the invention, this is achieved by the printed circuit board unit for an optical sensor unit comprising a printed circuit board element, wherein the printed circuit board element has a substantially circumferential edge region, wherein the edge region has substantially all of its edge metallization, wherein the printed circuit board element has a surface which adjoins and / or extends the edge region, wherein the printed circuit board element has a conductor track element on its surface, wherein the conductor track element has at least one predetermined pattern, wherein the at least one predetermined pattern is configured to provide thermal energy to dissipate dew and / or icing of a lens element.

[0010] In other words, the conductive trace element along the predetermined pattern can generate heating power to defrost and / or ice the lens element without requiring additional heating elements on the printed circuit board (PCB). Preferably, the cooling can be achieved solely via the top and / or bottom surface of the PCB. Essentially the same conductive trace elements used for contacting functional elements and circuits on the PCB can be used to form the conductive trace element.

[0011] The dependent claims describe preferred embodiments of the invention.

[0012] A meander pattern is also preferred as the predetermined pattern.

[0013] An advantage of this embodiment is that the meandering pattern increases the surface area for radiating heating power. Preferably, the surface has a plurality of corners, with the predetermined pattern arranged at at least two corners, and / or with at least two corners of the plurality of corners each having a hole for mounting and / or aligning the printed circuit board assembly.

[0014] An advantage of this embodiment is that, in addition to the predetermined patterns at the corners of the surface, holes for mounting and alignment can also be provided, thus improving the handling of the printed circuit board assembly. Furthermore, the predetermined patterns can preferably also be used with other shapes of printed circuit boards, such as round printed circuit boards.

[0015] Preferably, the printed circuit board unit comprises a plurality of printed circuit board elements, each of the plurality of printed circuit board elements having a surface with the conductor track having the predetermined pattern.

[0016] One advantage of this design is that the heating power can be generated across several layers in the printed circuit board unit, thus increasing the overall heating power.

[0017] Preferably, at least one bridge for heat transfer is arranged between two printed circuit board elements of the plurality of printed circuit board elements.

[0018] One advantage of this design is that heat energy can be transferred more efficiently within the printed circuit board assembly, and the stability of the assembly can also be improved. In addition to the heat transfer bridge, the numerous circuit board elements can be connected by at least one conductor for power transmission.

[0019] Preferably, the printed circuit board element has a second surface, wherein the second surface is arranged substantially opposite the surface on the printed circuit board element, and wherein the second surface has a second conductor element with the predetermined pattern. An advantage of this embodiment is that the predetermined patterns can be arranged on both a front and a back side of the printed circuit board element in order to generate heating power.

[0020] Another aspect of the invention relates to an optical sensor unit comprising a printed circuit board unit as described above and below, and a lens element, wherein the printed circuit board unit is arranged relative to the lens element according to a predetermined orientation, such that the printed circuit board unit is configured to free the lens element from dew and / or icing by means of a conductor element having at least one predetermined pattern.

[0021] Preferably, the optical sensor unit comprises a housing unit on which the lens element and the circuit board unit are arranged, wherein a thermally conductive material is arranged between the housing unit and the circuit board unit to improve the removal of dew and / or icing from the lens element.

[0022] One advantage of this embodiment is that heat distribution can be improved, thus enabling uniform and rapid heating of the lens element.

[0023] Another aspect of the invention relates to a method for assembling an optical sensor unit, as described above and below, which comprises the following steps:

[0024] - Providing a housing unit with a lens element,

[0025] - Inserting a printed circuit board unit into and / or onto the housing unit according to a predetermined orientation, such that the printed circuit board unit is configured to free the lens element from dew and / or icing by means of a conductor element with at least one predetermined pattern.

[0026] Preferably the method further comprises the following steps:

[0027] - Applying a thermally conductive material to the housing unit,

[0028] - Applying the printed circuit board unit to the thermal interface material to attach the printed circuit board unit to the housing unit. The method preferably further comprises the step of:

[0029] - Aligning the printed circuit board assembly with the housing assembly when the printed circuit board assembly is in contact with the thermal interface material to set the predetermined alignment.

[0030] Another aspect of the invention relates to a vehicle which has a printed circuit board unit as described above and below, an optical sensor unit as described above and below and / or a component which was manufactured using the method as described above and below.

[0031] Brief description of the drawings

[0032] Exemplary embodiments of the invention are described in detail below with reference to the accompanying drawings. The drawing shows:

[0033] Figures 1 to 9 show a printed circuit board unit according to one embodiment,

[0034] Figures 10 and 11 are a flowchart illustrating steps of the procedure according to one embodiment.

[0035] Figure 12 shows a vehicle according to one embodiment.

[0036] Embodiments of the invention

[0037] Preferably, all identical elements, units and / or steps in all figures are labelled with the same reference symbols.

[0038] Figure 1 shows a printed circuit board unit 10 according to one embodiment. The printed circuit board unit 10 for an optical sensor unit 100 has a printed circuit board element 12, wherein the printed circuit board element 12 has a substantially circumferential edge region 14, wherein the edge region 14 has substantially all of its surface metallization, wherein the printed circuit board element 12 has a surface 16 which adjoins and / or extends the edge region 14, wherein the printed circuit board element 12 has a conductor element 18 on the surface 16, wherein the conductor element 18 has at least one predetermined pattern 20, wherein the at least one predetermined pattern 20 is configured to provide thermal energy to dissipate condensation and / or icing from a lens element 102.As shown in Figure 1, the printed circuit board unit 10 can have a substantially rectangular and / or square cross-section. Preferably, the printed circuit board unit 10 can have at least one printed circuit board element 12 or a plurality of printed circuit board elements 30. Each of these printed circuit board elements 12, 30 can preferably have a circumferential edge region 14, which includes edge metallization. The edge metallization is substantially complete in the edge region 14, wherein "substantially complete" includes, in particular, manufacturing tolerances. More preferably, the printed circuit board element can have a substantially complete circumferential edge region 14, wherein "substantially complete" includes, in particular, manufacturing tolerances.

[0039] As shown in Figure 1, the predetermined pattern 20 is designed as a meander pattern. More preferably, the surface 16 can have a plurality of corners 22, wherein the predetermined pattern 20 is arranged at at least two corners 24 and a bore 28 is arranged in a further two corners 24 and / or the same two corners 24. For example, the printed circuit board element 12, as shown in Figure 1, can have both a bore 28 and the predetermined pattern 20 in each corner.

[0040] Figure 2 shows a printed circuit board unit 10 according to one embodiment. As shown in Figure 2, the printed circuit board unit 10 can have a plurality of printed circuit board elements 30, each of the plurality of printed circuit board elements 30 having a surface 16 with a conductor element 18 having a predetermined pattern 20. More preferably, each of the plurality of printed circuit board elements 30 can have a first surface 16 and a second surface 32, these being substantially opposite each other, particularly due to manufacturing tolerances, with a conductor element 34 having a predetermined pattern 20 arranged on both surfaces.

[0041] Figure 3 shows a printed circuit board assembly 10 according to one embodiment. As can be seen in Figure 3, the printed circuit board assembly 10 has a printed circuit board element 12 with a circumferential edge region 14. The circumferential edge region 14 has an edge metallization. Preferably, the printed circuit board element 12 also has a surface 16 which adjoins and / or extends from the edge region 14, and on which a conductor element 18 is arranged. The conductor element 18 has a predetermined pattern, which can, for example, be designed as a meander pattern or similar. As can be seen in Figure 3, the printed circuit board element 12 has two bores 28, in particular for aligning and / or fastening the printed circuit board assembly 10. A predetermined pattern 20 can be arranged on the printed circuit board element 12 diagonally opposite the bores 28.

[0042] Figure 4 shows a printed circuit board unit 10 according to one embodiment. The printed circuit board unit 10 has a plurality of printed circuit board elements 30. The plurality of printed circuit board elements 30 can, in particular, have a web 31 for improved positioning. Preferably, the printed circuit board elements can be stacked on top of each other.

[0043] Figure 5 shows a printed circuit board unit 10 according to one embodiment. The printed circuit board unit 10 preferably has at least one printed circuit board element 12 with an edge region 14 having edge metallization. More preferably, the printed circuit board element 12 can, in addition to the edge region 14, have a surface 16 on which at least one conductor track element 18 is arranged, having a predetermined pattern 20.

[0044] Figure 6 shows a printed circuit board unit 10 according to one embodiment. The printed circuit board unit 10 is preferably arranged on an optical sensor unit 100. The optical sensor unit 100 preferably comprises a lens element 102, wherein the printed circuit board unit 10 is configured to clear the lens element of dew and / or icing by means of the predetermined pattern 20 of the conductor track element 18. Preferably, the optical sensor unit 100 comprises a housing unit 104 on which the printed circuit board unit 10 can be arranged. Preferably, a thermal interface material 106 is arranged between the housing unit 104 and the printed circuit board unit 10. The thermal interface material 106 can, in particular, be a UV-activated thermal interface material, which can be inserted into a groove of the housing unit 104. The printed circuit board unit 10 can then be aligned with the groove or with the housing unit 104.Subsequently, the thermal interface material can be cured using a UV flash or similar device to secure the circuit board unit 10 to the housing unit 104.

[0045] Figure 7 shows a printed circuit board unit 10 according to one embodiment. As shown in Figure 7, the printed circuit board unit 10 is arranged on the housing unit 104. Preferably, the housing unit 104 has four recesses or similar features in which the thermally conductive material 106 is arranged four times, in order to be able to arrange the printed circuit board unit 10 on the optical sensor unit 100.

[0046] Figure 8 shows a printed circuit board unit 10 according to one embodiment. The printed circuit board unit 10 is arranged on a gripper 107, which can engage in the bores 28 of the printed circuit board unit 10. This allows the printed circuit board unit 10 to be aligned with the housing unit 104 of the optical sensor unit 100. Preferably, the thermal interface material 106 can be cured when the printed circuit board unit 10 is aligned by means of the gripper 107, in order to maintain the alignment between the printed circuit board unit 10 and the lens element 102.

[0047] Figure 9 shows a printed circuit board unit 10 according to one embodiment. The printed circuit board unit 10 preferably has two bores 28 for aligning the printed circuit board unit 10, in particular with respect to the housing unit 104.

[0048] Figure 10 shows a flowchart illustrating the steps of method 200 according to one embodiment. Method 200 for assembling an optical sensor unit 10, as described above and below, comprises the following steps:

[0049] - Providing S1 of a housing unit 104 with a lens element 102,

[0050] - Insert S2 of a printed circuit board unit 10 into and / or onto the housing unit 104 according to a predetermined orientation, such that the printed circuit board unit 10 is configured to defrost and / or ice the lens element 102 with a conductor track element 18 having at least one predetermined pattern 20. Figure 11 shows a flowchart illustrating steps of method 200 according to one embodiment. Method 200 preferably includes the same steps S1 and S2 as already described with reference to Figure 10. Preferably, method 200 further includes the steps:

[0051] - Applying S3 of a thermal conductivity material 106 to a housing unit 104 as well as

[0052] - Applying S4 of the printed circuit board unit 10 to the thermal conductivity material 106 for attaching the printed circuit board unit 10 to the housing unit 104.

[0053] Preferably, the method 200 further includes the step of aligning S5 of the printed circuit board unit 10 to the housing unit 104 when the printed circuit board unit 10 is in contact with the thermal interface material 106 in order to set the predetermined alignment.

[0054] Figure 12 shows a vehicle 300 according to one embodiment. The vehicle 300 preferably comprises a printed circuit board unit 10, as described above and below, an optical sensor unit 100, as described above and below, and / or a component which was manufactured using the method 200, as described above and below.

Claims

Claims 1. Printed circuit board unit (10) for an optical sensor unit (100), wherein the printed circuit board unit (10) has a printed circuit board element (12), wherein the printed circuit board element (12) has a substantially circumferential edge region (14) having an edge region (14) having an edge metallization substantially throughout, the printed circuit board element (12) having a surface (16) which adjoins and / or extends the edge region (14), the printed circuit board element (12) having a conductor track element (18) on the surface (16), the conductor track element (18) having at least one predetermined pattern (20), the at least one predetermined pattern (20) being configured to provide thermal energy to resolve dew formation and / or icing of a lens element (102) of the optical sensor unit (100).

2. Printed circuit board unit (10) according to claim 1, wherein the predetermined pattern (20) is a meander pattern 3. Printed circuit board unit (10) according to one of the preceding claims, wherein the surface (16) has a plurality of corners (22), wherein at least two corners (24) each have the predetermined pattern (20) arranged and / or, wherein at least two corners (24) of the plurality of corners (22) each have a bore (28) for fastening and / or aligning the printed circuit board unit (10).

4. Printed circuit board unit (10) according to one of the preceding claims, wherein the printed circuit board unit (10) comprises a plurality of printed circuit board elements (30), each of the plurality of printed circuit board elements (30) having the surface (16) with the printed circuit board element (12) having the predetermined pattern (20).

5. Printed circuit board unit (10) according to claim 4, wherein at least one web (31) for heat transfer is arranged between two printed circuit board elements (12) of the plurality of printed circuit board elements (30).

6. Printed circuit board unit (10) according to one of the preceding claims, wherein the printed circuit board element (12) has a second surface (32), wherein the second surface (32) is arranged substantially opposite the surface (16) on the printed circuit board element (12), wherein the second surface (32) has a second conductor element (34) with the predetermined pattern (20).

7. Optical sensor unit (100) comprising a printed circuit board unit (10) according to one of the preceding claims and a lens element (102), wherein the printed circuit board unit (10) is arranged in a predetermined orientation relative to the lens element (102) such that the printed circuit board unit (10) is configured to free the lens element (102) from dew and / or icing with a printed circuit board element (12) having at least one predetermined pattern (20).

8. Optical sensor unit (100) according to claim 7, wherein the optical sensor unit (100) has a housing unit (104) on which the lens element (102) and the circuit board unit (10) are arranged, wherein a thermal conductivity material (106) is arranged between the housing unit (104) and the circuit board unit (10) to improve the removal of dew and / or icing from the lens element (102).

9. Method (200) for assembling an optical sensor unit (10) according to one of claims 7 to 8, comprising the steps: - Providing (S1) a housing unit (104) with a lens element (102), - Inserting (S2) a printed circuit board unit (10) into and / or onto the housing unit (104) according to a predetermined orientation, such that the printed circuit board unit (10) is configured to free the lens element (102) from dew and / or icing by means of a conductor element (18) having at least one predetermined pattern (20).

10. Method (200) according to claim 9, further comprising the steps: - Applying (S3) a thermal conductivity material (106) to the housing unit (104), - Applying (S4) the printed circuit board unit (10) to the thermal interface material (106) to attach the printed circuit board unit (10) to the housing unit (104).

11. Method (200) according to claim 10, further comprising the step: - Aligning (S5) the printed circuit board unit (10) with the housing unit (104) when the printed circuit board unit (10) is in contact with the thermal interface material (106) to set the predetermined alignment.

12. Vehicle (300) comprising a printed circuit board unit (10) according to one of claims 1 to 6, an optical sensor unit (100) according to one of claims 7 to 8 and / or a component which was manufactured by the method (200) according to one of claims 9 to 11.

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