Capacitor module and power conversion device

Abstract

This capacitor module comprises a case (30), a capacitor element (40), a bus bar (50), a sealing body (60), and a lid member (70) that is disposed on an opening of the case (30). The sealing body (60) seals the capacitor element (40) and the gap between the lid member (70) and the case (30). The sealing body (60) is configured to include silicon rubber or urethane, and has an element sealing body (61) that seals the capacitor element (40). The lid member (70) is disposed on the sealing body (60) and is more excellent in moisture resistance than the element sealing body (61).

Description

Capacitor module and power conversion device CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application is based on Patent Application No. 2024-101464 filed in Japan on June 24, 2024, the contents of which are incorporated by reference in their entirety.

[0002] The disclosure herein relates to a capacitor module and a power conversion device.

[0003] Patent Document 1 discloses a capacitor. The contents of the prior art documents are incorporated by reference as explanations of the technical elements in this specification.

[0004] Japanese Patent Application Laid-Open No. 2003-338423

[0005] In Patent Document 1, the capacitor case is filled with epoxy resin to seal the capacitor element, and then urethane is filled on top of the epoxy resin. When the epoxy resin is formed, thermal stress can cause cracks in the epoxy resin, potentially reducing its moisture resistance. For example, if only urethane is filled, cracks can be suppressed, but the capacitor case must be increased in size in the depth direction in order to ensure moisture resistance. From the above perspectives and other perspectives not mentioned, further improvements are needed in capacitor modules and power conversion devices.

[0006] An object of the present disclosure is to provide a capacitor module and a power conversion device that can ensure moisture resistance while suppressing an increase in size.

[0007] One disclosed aspect of the capacitor module comprises a case with an opening on one side, a capacitor element housed in the case, a bus bar electrically connected to the capacitor element, a sealing body arranged in the case, and a lid member arranged in the opening, wherein the sealing body seals the capacitor element and a gap between the lid member and the case, the sealing body is composed of silicone rubber or urethane and has an element sealing body that seals the capacitor element, and the lid member is arranged on the sealing body and has better moisture resistance than the element sealing body.

[0008] According to the disclosed capacitor module, the element encapsulation body is made of silicone rubber or urethane, which can suppress cracks caused by thermal stress. Furthermore, a lid member, which has better moisture resistance than the element encapsulation body, is placed on the encapsulation body, and moisture resistance is ensured by the encapsulation body and the lid member. This configuration can suppress an increase in the physical size of the case in the depth direction. Therefore, moisture resistance can be ensured while suppressing an increase in physical size.

[0009] Another aspect of the disclosed power conversion device includes: a capacitor module having a case with one open side, a capacitor element housed in the case, a bus bar electrically connected to the capacitor element, a sealing body disposed in the case, and a lid member disposed in the opening; a semiconductor module having a semiconductor element; and a circuit board having a drive circuit that drives the semiconductor element and a control circuit that controls the drive circuit; the sealing body seals the capacitor element and a gap between the lid member and the case; the sealing body is composed of silicone rubber or urethane and has an element sealing body that seals the capacitor element; the lid member is disposed on the sealing body and has better moisture resistance than the element sealing body; the lid member has a first support portion that supports the circuit board on the lid member; and a second support portion that supports the circuit board on the semiconductor module.

[0010] According to the disclosed power conversion device, the element encapsulation body is made of silicone rubber or urethane, which reduces cracks caused by thermal stress. Furthermore, a lid member, which has better moisture resistance than the element encapsulation body, is placed on the encapsulation body, and moisture resistance is ensured by the encapsulation body and lid member. This reduces the increase in the physical size of the case in the depth direction. Therefore, moisture resistance can be ensured while reducing the increase in physical size. By using a lid member and providing a first support portion on the lid member, the space above the capacitor module, which reduces the increase in physical size, can be utilized, allowing a circuit board having a drive circuit unit and a control circuit unit to be placed above the capacitor module.

[0011] The various aspects disclosed in this specification employ different technical means to achieve their respective objectives. The reference numerals in parentheses in the claims are intended to exemplarily indicate the corresponding parts of the embodiments described below, and are not intended to limit the technical scope. The objectives, features, and advantages disclosed in this specification will become more apparent by reference to the following detailed description and the accompanying drawings.

[0012] 8 is a diagram showing a power conversion circuit and a drive system to which a capacitor module and a power conversion device are applied; FIG. 9 is a plan view showing the power conversion device according to the first embodiment; FIG. 10 is a plan view showing a capacitor module; FIG. 11 is a cross-sectional view taken along line IV-IV in FIG. 3; FIG. 12 is a cross-sectional view taken along line VV in FIG. 3; FIG. 13 is a cross-sectional view showing a modified example; FIG. 14 is a cross-sectional view showing a modified example; FIG. 15 is a plan view showing a capacitor module and a power conversion device according to a second embodiment; FIG. 16 is a cross-sectional view taken along line IX-IX in FIG. 8; FIG. 17 is a cross-sectional view showing a modified example.

[0013] Hereinafter, several embodiments will be described with reference to the drawings. Note that in each embodiment, corresponding components are designated by the same reference numerals, and redundant description may be omitted. When only a portion of the configuration is described in each embodiment, the configuration of another embodiment previously described may be applied to the remaining portion of the configuration. Furthermore, in addition to the combinations of configurations explicitly stated in the description of each embodiment, configurations of several embodiments may be partially combined together even if not explicitly stated, provided that there is no particular problem with the combination.

[0014] (First Embodiment) A capacitor module of this embodiment is applied to, for example, a mobile body using a rotating electric machine as a drive source. The mobile body is, for example, an electric vehicle such as a battery electric vehicle (BEV), a hybrid electric vehicle (HEV), or a plug-in hybrid electric vehicle (PHEV), an electric flying object such as a drone or an electric vertical take-off and landing aircraft (eVTOL), a ship, construction machinery, or agricultural machinery. BEV is an abbreviation for Battery Electric Vehicle. HEV is an abbreviation for Hybrid Electric Vehicle. eVTOL is an abbreviation for electronic Vertical Take-Off and Landing aircraft. An example of application to a vehicle will be described below.

[0015] 1 shows an example of a vehicle drive system 1. The drive system 1 includes a DC power supply 2, a motor generator 3, and a power conversion circuit 4.

[0016] The DC power supply 2 is a DC voltage source formed by a rechargeable secondary battery. The secondary battery is, for example, a lithium-ion battery or a nickel-metal hydride battery. The motor generator 3 is a three-phase AC rotating electric machine. The motor generator 3 functions as a drive source for the vehicle, i.e., an electric motor. The motor generator 3 functions as a generator during regeneration. The power conversion circuit 4 converts power between the DC power supply 2 and the motor generator 3.

[0017] 1 shows an example of a power conversion circuit 4. The power conversion circuit 4 shown in FIG.

[0018] The smoothing capacitor 5 mainly smoothes the DC voltage supplied from the DC power supply 2. The smoothing capacitor 5 is connected to a P line 7, which is a power supply line on the high potential side, and an N line 8, which is a power supply line on the low potential side. The P line 7 is connected to the positive electrode of the DC power supply 2, and the N line 8 is connected to the negative electrode of the DC power supply 2. The positive electrode of the smoothing capacitor 5 is connected to the P line 7 between the DC power supply 2 and the inverter 6. The negative electrode of the smoothing capacitor 5 is connected to the N line 8 between the DC power supply 2 and the inverter 6. The smoothing capacitor 5 is connected in parallel to the DC power supply 2.

[0019] The inverter 6 is a DC-AC conversion circuit. In accordance with switching control by the control circuit, the inverter 6 converts a DC voltage into a three-phase AC voltage and outputs it to the motor generator 3. This drives the motor generator 3 to generate a predetermined torque. During regenerative braking of the vehicle, the inverter 6 converts the three-phase AC voltage generated by the motor generator 3 in response to rotational force from the wheels into a DC voltage in accordance with switching control by the control circuit and outputs it to the P line 7. In this way, the inverter 6 performs bidirectional power conversion between the DC power source 2 and the motor generator 3.

[0020] The inverter 6 is configured with upper and lower arm circuits 9 for three phases. The upper and lower arm circuits 9 are sometimes referred to as legs. Each upper and lower arm circuit 9 has an upper arm 9H and a lower arm 9L. The upper arm 9H and the lower arm 9L are connected in series between the P line 7 and the N line 8, with the upper arm 9H on the P line 7 side. Hereinafter, the upper arm 9H and the lower arm 9L may be simply referred to as arms 9H and 9L.

[0021] The connection point between the upper arm 9H and the lower arm 9L, i.e., the midpoint of the upper and lower arm circuits 9, is connected to the corresponding phase winding 3a of the motor generator 3 via an output line 10. Of the upper and lower arm circuits 9, the U-phase upper and lower arm circuit 9U is connected to the U-phase winding 3a via the output line 10. The V-phase upper and lower arm circuit 9V is connected to the V-phase winding 3a via the output line 10. The W-phase upper and lower arm circuit 9W is connected to the W-phase winding 3a via the output line 10.

[0022] The number of switching elements constituting each arm 9H, 9L is not particularly limited. It may be one or more. In the illustrated upper arm 9H, three switching elements are connected in parallel. In the lower arm 9L, three switching elements are connected in parallel. In other words, each of the six arms 9H, 9L of the three-phase upper and lower arm circuit 9 is composed of three switching elements connected in parallel to each other.

[0023] The illustrated switching element is an n-channel MOSFET 11. MOSFET is an abbreviation for Metal Oxide Semiconductor Field Effect Transistor. The three MOSFETs 11 on the high side connected in parallel are turned on and off at the same timing by a common gate drive signal (drive voltage). The three MOSFETs 11 on the low side connected in parallel are turned on and off at the same timing by a common gate drive signal (drive voltage).

[0024] A freewheeling diode 12 is connected in antiparallel to each MOSFET 11. The diode 12 may be a parasitic diode (body diode) or an external diode. In the upper arm 9H, the drain of the MOSFET 11 is connected to the P line 7. In the lower arm 9L, the source of the MOSFET 11 is connected to the N line 8. The source of the MOSFET 11 in the upper arm 9H and the drain of the MOSFET 11 in the lower arm 9L are connected to each other. The anode of the diode 12 is connected to the source of the corresponding MOSFET 11, and the cathode is connected to the drain.

[0025] The switching element is not limited to the MOSFET 11. For example, an IGBT may be used. IGBT is an abbreviation for Insulated Gate Bipolar Transistor. In the case of an IGBT, a freewheeling diode is also connected in anti-parallel.

[0026] As illustrated in FIG. 1 , the power conversion circuit 4 may include a drive control unit (DCU) 13. The drive control unit 13 may include, for example, a processor, a memory, and a storage. The processor executes various processes by accessing the memory. The memory is a rewritable volatile storage medium. The memory is, for example, a RAM. RAM is an abbreviation for Random Access Memory. The storage is a rewritable nonvolatile memory. The storage may be realized by at least one type of non-transitory tangible storage medium, such as a semiconductor memory, a magnetic medium, or an optical medium. The storage may include multiple types of storage media, such as a ROM and a flash memory. ROM is an abbreviation for Read Only Memory.

[0027] The storage stores a program to be executed by the processor. The processor executes multiple instructions in the program to establish multiple functional units. The processing performed by the drive control unit 13 may be realized by software processing in which the processor executes the program, or may be realized by hardware processing using a dedicated electronic circuit. It may also be realized by a combination of software processing and hardware processing.

[0028] The drive control unit 13 has, for example, a drive circuit (DC) 14 and a control circuit (CC) 15. The drive circuit 14 supplies a drive voltage to the gate of the MOSFET 11 of the corresponding arm based on a drive command from the control circuit 15. The drive circuit 14 drives the corresponding MOSFET 11, i.e., turns it on and off, by applying the drive voltage. The drive circuit 14 is sometimes referred to as a driver.

[0029] The control circuit 15 generates a drive command for operating the MOSFET 11 and outputs it to the drive circuit 14. The control circuit 15 generates the drive command based on, for example, a torque request input from a host ECU (not shown) and signals detected by various sensors. The control circuit 15 controls the operation of the drive circuit 14. ECU is an abbreviation for Electronic Control Unit.

[0030] The various sensors are, for example, a current sensor 16, a rotation angle sensor, and a voltage sensor. The current sensor 16 detects the phase current flowing through the winding 3a of each phase. The rotation angle sensor detects the rotation angle of the rotor of the motor generator 3. The voltage sensor detects the voltage across the smoothing capacitor 5. The control circuit 15 outputs, for example, a PWM signal as a drive command. PWM is an abbreviation for Pulse Width Modulation. The power conversion circuit 4 may include at least one of the above sensors. The illustrated power conversion circuit 4 includes a current sensor 16.

[0031] The power conversion circuit 4 may include a converter. The converter is a DC-DC conversion circuit configured to be able to convert a DC voltage into, for example, a DC voltage of a different value. The converter is provided between the DC power supply 2 and the smoothing capacitor 5. The converter is configured to include, for example, a reactor and the above-mentioned upper and lower arm circuits 9. This configuration allows for voltage step-up and step-down. The power conversion circuit 4 may also include a filter capacitor. The filter capacitor is provided between the DC power supply 2 and the converter.

[0032] The power conversion circuit 4 may include a snubber circuit. The snubber circuit is connected in parallel to the upper and lower arm circuits 9. The snubber circuit reduces the inductance of the upper and lower arm circuits 9. The snubber circuit absorbs a transient high voltage, known as a switching surge, that occurs when switching elements (MOSFETs 11) that constitute the upper and lower arm circuits 9. The provision of the snubber circuit enables the inverter 6 to perform high-speed switching.

[0033] <Power Conversion Device> Fig. 2 shows an example of a power conversion device including a capacitor module. In Fig. 2, the circuit board is shown by a dashed line in order to clarify the elements directly below the circuit board.

[0034] 2 provides the above-described power conversion circuit 4. The power conversion device 20 includes a cooler 21, a semiconductor module 22, a capacitor module 23, a current sensor 24, and a circuit board 25. The illustrated power conversion device 20 includes a plurality of semiconductor modules 22. First, the elements of the power conversion device 20 other than the capacitor module 23 will be described.

[0035] In the following, the depth direction of the case of the capacitor module 23 is referred to as the Z direction. The direction perpendicular to the Z direction is referred to as the X direction, and the direction perpendicular to both the X direction and the Z direction is referred to as the Y direction. The X direction, Y direction, and Z direction are mutually perpendicular. Unless otherwise specified, the shape viewed from the Z direction, in other words, the shape along the XY plane defined by the X direction and the Y direction, is referred to as the planar shape. The planar view from the Z direction may sometimes be simply referred to as the planar view.

[0036] The cooler 21 cools other elements constituting the power conversion device 20, which are arranged on the cooler 21. The cooler 21 may be, for example, a heat sink. The heat sink may have fins on the back side. The cooler 21 may have a flow path through which a refrigerant flows. The refrigerant may be, for example, a phase-change refrigerant such as water or ammonia, or a phase-non-change refrigerant such as an ethylene glycol-based refrigerant. The refrigerant may be, for example, LLC. LLC is an abbreviation for long life coolant.

[0037] The cooler 21 may be part of a housing that houses the semiconductor module 22, the capacitor module 23, and the current sensor 24, or may be provided separately from the housing. The cooler 21 and the components arranged on the cooler 21 may be thermally connected via a bonding material such as solder, or may be thermally connected via a thermally conductive member. The thermally conductive member may be referred to as TIM, GF, or the like. TIM is an abbreviation for Thermal Interface Material. GF is an abbreviation for Gap Filler.

[0038] The semiconductor modules 22 constitute the upper and lower arm circuits 9, i.e., the inverter 6. The semiconductor modules 22 may also be referred to as power modules, semiconductor devices, etc. The illustrated power conversion device 20 includes three semiconductor modules 22. The multiple semiconductor modules 22 include a semiconductor module 22U that constitutes the upper and lower arm circuit 9U, a semiconductor module 22V that constitutes the upper and lower arm circuit 9V, and a semiconductor module 22W that constitutes the upper and lower arm circuit 9W.

[0039] The semiconductor modules 22 have, for example, a common structure. The illustrated semiconductor module 22 includes a main body 221 and external connection terminals protruding from the main body 221. The main body 221 includes semiconductor elements 222H and 222L, a sealing body 223, and the like.

[0040] The semiconductor elements 222H and 222L are formed by forming switching elements on semiconductor substrates made of materials such as silicon (Si) or wide-bandgap semiconductors with a wider bandgap than silicon. The switching elements have a vertical structure so that the main current flows in the thickness direction of the semiconductor substrate. Wide-bandgap semiconductors include, for example, silicon carbide (SiC), gallium nitride (GaN), gallium oxide (Ga2O3), and diamond.

[0041] The illustrated semiconductor elements 222H, 222L are formed by forming the above-described n-channel MOSFET 11 and diode 12 on a semiconductor substrate made of SiC. The MOSFET 11 has a vertical structure so that a main current flows in the thickness direction of the semiconductor elements 222H, 222L (semiconductor substrate). The semiconductor elements 222H, 222L have main electrodes (not shown) on both sides of the semiconductor elements 222H, 222L in the thickness direction. The semiconductor elements 222H, 222L have a source electrode on the front surface and a drain electrode on the back surface as main electrodes. The source electrode is formed on a portion of the front surface. The drain electrode is formed on almost the entire back surface.

[0042] The main current flows between the drain electrode and the source electrode. The semiconductor elements 222H, 222L have signal electrode pads (not shown) on the surface where the source electrode is formed. The semiconductor elements 222H, 222L are arranged so that their thickness direction is approximately parallel to the Z direction. One semiconductor module 22 includes three semiconductor elements 222H that form the upper arm 9H and three semiconductor elements 222L that form the lower arm 9L. The three semiconductor elements 222H that form one arm are aligned in the X direction. Similarly, the three semiconductor elements 222L are aligned in the X direction. The semiconductor elements 222H and semiconductor elements 222L that form one arm are aligned in the Y direction.

[0043] The sealing body 223 seals some of the other elements that make up the semiconductor module 22. The remaining parts of the other elements are exposed outside the sealing body 223. The sealing body 223 seals the semiconductor elements 222H, 222L, and parts of the external connection terminals. Other parts of the external connection terminals protrude outside the sealing body 223. The sealing body 223 is made of, for example, resin. The illustrated sealing body 223 is molded by transfer molding using epoxy resin. The sealing body 223 has a generally rectangular shape when viewed from above. The sealing body 223 forms the outer periphery of the main body 221.

[0044] The sealing body 223 may be formed by potting. The sealing body 223 is filled into the accommodation space formed by the housing (not shown) and the cooler 21, and seals the semiconductor elements 222H, 222L, etc., arranged in the accommodation space.

[0045] The external connection terminals are terminals for electrically connecting the semiconductor module 22 to external devices. The external connection terminals include a P-terminal 224P, an N-terminal 224N, and an O-terminal 224O as main terminals electrically connected to the main electrodes of the semiconductor elements 222H and 222L. The P-terminal 224P is electrically connected to the drain electrode of the semiconductor element 222H. The N-terminal 224N is electrically connected to the source electrode of the semiconductor element 222L. The O-terminal 224O is electrically connected to the connection point (midpoint) between the source electrode of the semiconductor element 222H and the drain electrode of the semiconductor element 222L.

[0046] The P terminal 224P and the N terminal 224N extend from the main body 221 toward the capacitor module 23. The illustrated semiconductor module 22 has one P terminal 224P and two N terminals 224N. The P terminal 224P and the N terminal 224N protrude to the outside from the surface of the main body 221 that faces the capacitor module 23. In the X direction, the P terminal 224P is disposed between the N terminals 224N. The O terminal 224O extends from the main body 221 toward the current sensor 24. The O terminal 224O protrudes to the outside from the side surface opposite the surface that faces the capacitor module 23. In addition to the terminals described above, the external connection terminals also include signal terminals (not shown).

[0047] In addition to the above-mentioned elements, the semiconductor module 22 also includes wiring members (not shown). The wiring members provide a wiring function that electrically connects the main electrodes and main terminals of the semiconductor elements 222H, 222L. The wiring members provide a heat dissipation function that dissipates heat from the semiconductor elements 222H, 222L. The wiring members may be, for example, a substrate with metal bodies arranged on both sides of an insulating base material, or may be a heat sink that is a metal member. The heat sink may be provided as part of the lead frame. The entire wiring member may be sealed with the sealing body 223, or a portion may be exposed from the main body 221. Exposing the wiring member can improve heat dissipation.

[0048] The semiconductor modules 22 are disposed on the cooler 21. As described above, the main body 221 of the semiconductor module 22 may be fixed to the cooler 21 via a bonding material, or may be thermally connected to the cooler 21 via a heat-conducting member. As shown in Fig. 2, the three semiconductor modules 22 are lined up in the X direction. The three semiconductor modules 22 are lined up in the order of semiconductor module 22U, semiconductor module 22V, and semiconductor module 22W. In addition, the side surfaces of adjacent semiconductor modules 22 face each other in the X direction with a predetermined gap therebetween.

[0049] The current sensor 24 serves as the current sensor 16 described above. The current sensor 24 is configured to detect phase currents individually. The current sensor 24 may be a magnetic detection type sensor equipped with a magnetoelectric conversion element, or a resistance detection type sensor equipped with a shunt resistor. The illustrated current sensor 24 is a magnetic detection type. The current sensor 24 includes a bus bar 241 provided corresponding to each phase, and a main body 242. The bus bar 241 has its thickness in the Z direction and extends in the Y direction.

[0050] The illustrated main body 242 includes a Hall element (a magnetoelectric conversion element), a resin member, a core, and a substrate (not shown). For convenience, FIG. 2 shows the outer shell of the resin member as the main body 242. The main body 242 includes three Hall elements and three cores corresponding to the bus bars 241. The Hall elements are mounted on the substrate and disposed in the gaps of the corresponding cores. The cores and bus bars 241 are held in the resin member. The bus bars 241 pass through the annular regions of the corresponding cores. The substrate is fixed to the resin member.

[0051] The circuit board 25 provides the drive control unit 13 described above. The circuit board 25 includes a printed circuit board in which conductors are arranged on an insulating substrate, and electronic components and connectors mounted on the printed circuit board. The conductors include wiring elements. The wiring elements and electronic components form a circuit. The drive circuit 14 and control circuit 15 described above are configured on the circuit board 25. The circuit board 25 is arranged above the semiconductor module 22, the capacitor module 23, and the current sensor 24 so as to overlap with the semiconductor module 22, the capacitor module 23, and the current sensor 24 in a planar view. The illustrated circuit board 25 is arranged to encompass most of the semiconductor module 22, the capacitor module 23, and the current sensor 24 in a planar view. Other elements that constitute the power conversion device 20 are electrically connected to the circuit board 25.

[0052] In the illustrated power conversion device 20, the semiconductor module 22, the capacitor module 23, and the current sensor 24 are aligned in the Y direction. The semiconductor module 22 is disposed between the capacitor module 23 and the current sensor 24 in the Y direction.

[0053] <Capacitor Module> Fig. 3 is a plan view showing an example of a capacitor module, and Fig. 4 is a cross-sectional view taken along line IV-IV in Fig. 3 .

[0054] The capacitor module 23 provides the above-mentioned smoothing capacitor 5. The capacitor module 23 includes a case 30, a capacitor element 40, a bus bar 50, a sealing body 60, and a cover member 70.

[0055] The case 30 may be formed using a metal material such as aluminum, or a resin material such as PPS or PBT. The case 30 may be formed using a metal laminate film. The case 30 is, for example, a molded body. The case 30 has a bottomed cylindrical shape. The case 30 has a bottom wall 31 and a side wall 32. The case 30 is disposed on the cooler 21 so that the outer surface of the bottom wall 31 faces the cooler 21 in the Z direction. The illustrated bottom wall 31 has a generally rectangular planar shape with the X direction as its longitudinal direction, and the side wall 32 has a generally rectangular annular planar shape. The side wall 32 includes four side walls 321, 322, 323, and 324. The side wall 322 is the side wall 32 opposite the side wall 321 in the X direction. The side wall 324 is the side wall 32 opposite the side wall 323 in the Y direction. In the case of a metal case, the case 30 may be formed by a part of the cooler 21 .

[0056] The capacitor element 40 is, for example, a film capacitor element. The capacitor element 40 is formed by winding a film around an axis that is approximately parallel to the Z direction. The capacitor element 40 has a substantially rectangular shape in plan view. The capacitor element 40 has electrodes 41 on one surface and on the opposite surface. The electrodes 41 are sometimes referred to as metallikon electrodes. One of the electrodes 41 is a P-electrode 41P, and the other is an N-electrode 41N.

[0057] The one surface and the back surface, which are electrode formation surfaces, may be surfaces in the Z direction or surfaces in a direction perpendicular to the Z direction. In the exemplary capacitor element 40, the one surface and the back surface are surfaces in the Z direction. In other words, the back surface is the surface opposite the one surface in the Z direction. The back surface is the lower surface facing the bottom wall 31 in the Z direction, and the one surface is the upper surface. The capacitor element 40 has a negative N-electrode 41N on one surface and a positive P-electrode 41P on the back surface.

[0058] The capacitor module 23 may include only one capacitor element 40 or multiple capacitor elements 40. In a configuration including multiple capacitor elements 40, the capacitor elements 40 are aligned in at least one direction perpendicular to the Z direction. The illustrated capacitor module 23 includes four capacitor elements 40. The capacitor elements 40 are aligned in the X direction.

[0059] The bus bars 50 include a P bus bar 50P connected to the P electrode 41P and an N bus bar 50N connected to the N electrode 41N. The P bus bar 50P and the N bus bar 50N each have an electrode connection portion 51, a protrusion 52, and a linking portion 53. The electrode connection portion 51 is a portion that connects to the corresponding electrode 41. The protrusion 52 is a portion that protrudes outward from the sealing body 60. The protrusion 52 includes a terminal portion for connecting to other devices such as the semiconductor module 22. The terminal portion of the P bus bar 50P is connected to the P terminal 224P of the semiconductor module 22 as shown in FIG. 2 . Similarly, the terminal portion of the N bus bar 50N is connected to the N terminal 224N. The linking portion 53 is a portion that connects the electrode connection portion 51 and the protrusion 52.

[0060] The electrode connection portion 51 and the linking portion 53 are covered by the sealing body 60. The protrusion 52 is disposed outside the sealing body 60. The illustrated P bus bar 50P and N bus bar 50N are drawn from the corresponding electrodes 41 toward the side wall 323. The P bus bar 50P and N bus bar 50N protrude from the sealing body 60 near the side wall 323. The plate thickness direction of the electrode connection portion 51 is approximately parallel to the Z direction. The linking portion 53 is continuous with the electrode connection portion 51 and includes a portion extending in the Y direction and a portion extending in the Z direction. The linking portion 53 is approximately L-shaped in the YZ plane. The protrusion 52 extends from the linking portion 53 toward the semiconductor module 22. The P bus bar 50P and the N bus bar 50N are disposed such that their plate surfaces face each other over most of the entire length of the protrusion 52. An insulating member may be disposed between the protruding portions 52 of the P bus bar 50P and the N bus bar 50N.

[0061] The sealing body 60 is made of an electrically insulating resin material. The sealing body 60 is formed by potting. It is filled into the case 30 to seal the capacitor element 40. The sealing body 60 seals a portion of the bus bar 50. The sealing body 60 also fills the gap between the case 30 and the lid member 70, sealing the gap. The sealing body 60 also fills the injection port 73 of the lid member 70, sealing the injection port 73.

[0062] The sealing body 60 has at least an element sealing body 61 that seals the capacitor element 40. The element sealing body 61 is made of a material that is more elastic than epoxy resin. The element sealing body 61 is made of a material that is softer than epoxy resin. The element sealing body 61 is made of, for example, silicone rubber or urethane.

[0063] The illustrated sealing body 60 has only an element sealing body 61. That is, the element sealing body 61 seals not only the capacitor element 40 but also the gap between the case 30 (side wall 32) and the lid member 70 (lid portion 71), and the injection port 73. Gaps are provided between the lid portion 71 and each of the side walls 321 to 324. The bus bar 50 protrudes from the sealing body 60 in the gap between the lid portion 71 and the side wall 323. The sealing body 60 is also provided in the gap between the lid portion 71 and the protruding portion 52 of the bus bar 50. The top surface of the sealing body 60 (element sealing body 61) is approximately flush with the top surface of the lid portion 71.

[0064] The lid member 70 includes a lid portion 71 and a holding portion 72. The lid member 70 is a resin molded body. A metal member may be inserted into the lid member 70 for the purposes of improving moisture resistance and fixing strength. The lid portion 71 is disposed in the opening of the cylindrical case 30 with a bottom. The lid portion 71 is disposed within a predetermined range from the upper end of the side wall 32 in the depth direction (Z direction). The lid portion 71 is disposed so as to cover (block) most of the opening. The lid portion 71 is disposed on the sealing body 60. The sealing body 60 is in contact with the underside of the lid portion 71. The lid portion 71 has a generally rectangular planar shape. The lid portion 71 is made of a material that has better moisture resistance than the element sealing body 61. The lid portion 71 is made of, for example, polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), epoxy resin, fluorine-based resin such as PTFE, acrylic, or polycarbonate. The cover member 70 may be formed using a metal laminate film having a metal layer such as an aluminum layer as an intermediate layer.

[0065] The retaining portion 72 is continuous with the lid portion 71 and extends from the lid portion 71. The retaining portion 72 holds the lid portion 71 in the predetermined position. The illustrated lid member 70 has a plurality of retaining portions 72 distributed in a dispersed manner. The illustrated retaining portion 72 is provided on each of the short side walls 32 and one of the long side walls 32 of the four rectangular annular side walls 32. At least a portion of the retaining portion 72 is fixed to the side wall 32 of the case 30 and / or the cooler 21. The retaining portion 72 may be formed using the same material as the lid portion 71. The retaining portion 72 may be inserted into the lid portion 71. The retaining portion 72 may include an insert part, such as an insert collar for fastening, at the portion where it is fixed to the cooler 21 or the like.

[0066] The lid member 70 has an injection port 73 for injecting (filling) the sealant 60 into the case 30. The lid member 70 has at least one injection port 73. The sealant 60 is formed by injecting resin into the case 30 through the injection port 73. The injection port 73 is a notch formed in the lid portion 71. The injection port 73 penetrates the lid portion 71 in the Z direction and opens at the outer peripheral end (side surface) of the lid member 70.

[0067] The lid member 70 has three injection ports 73. The injection ports 73 are provided at both ends of the long side of the lid portion 71, which has a generally rectangular shape in plan view, that faces the side wall 323. One of the injection ports 73 is provided at a corner between the long side that faces the side wall 323 and the short side that faces the side wall 321. The other injection port 73 is provided at a corner between the long side that faces the side wall 323 and the short side that faces the side wall 322. The other injection port 73 is provided near the center of the long side of the lid portion 71 that faces the side wall 324.

[0068] In other words, all of the injection ports 73 are provided in positions that do not overlap the capacitor elements 40 in a plan view. Furthermore, the injection ports 73 on the side wall 323 side are provided in positions that overlap the coupling portions 53 in a plan view. In other words, the injection ports 73 on the side wall 323 side are provided so as to overlap the portions of the bus bars 50 that are sealed in the sealing body 60 and that extend from the electrode connection portions 51. The injection ports 73 are provided so as to overlap the coupling portions 53 of the P bus bar 50P and the N bus bar 50N. The lid member 70 has an outer peripheral shape that overlaps the entire capacitor element 40 in a plan view.

[0069] Summary of First Embodiment The capacitor module 23 of this embodiment includes a case 30, a capacitor element 40, a bus bar 50, a sealing body 60, and a lid member 70. The lid member 70 is disposed in the opening of the case 30. The sealing body 60 seals the capacitor element 40 and the gap between the lid member 70 and the case 30. The sealing body 60 is made of a material containing silicone rubber or urethane, and has an element sealing body 61 that seals the capacitor element 40. The lid member 70 is disposed on the sealing body 60 and has better moisture resistance than the element sealing body 61.

[0070] In this way, the element encapsulant 61 is made of silicone rubber or urethane, which has better elasticity than epoxy resin, so cracks due to thermal stress can be suppressed and moisture resistance can be ensured. Furthermore, the lid member 70, which has better moisture resistance than the element encapsulant 61, is placed on the encapsulant 60, and moisture resistance is ensured by the encapsulant 60 and the lid member 70. This makes it possible to suppress an increase in the physical size of the case 30 in the depth direction (Z direction) compared to a configuration in which moisture resistance is ensured by the element encapsulant 61 alone. As a result, moisture resistance can be ensured while suppressing an increase in physical size.

[0071] As illustrated, bus bar 50 may have a connection portion with capacitor element 40, protrusion 52, and coupling portion 53. Cover member 70 may have an injection port 73 for injecting sealant 60 into case 30. Sealant 60 may seal injection port 73. In addition, injection port 73 may be provided at a position overlapping coupling portion 53 in a plan view. In the illustrated capacitor module 23, electrode connection portion 51 corresponds to the connection portion with capacitor element 40.

[0072] By providing injection port 73 directly above connecting portion 53 in this way, the moisture absorption path from injection port 73 to capacitor element 40 can be made longer than in a configuration in which injection port 73 is provided directly above capacitor element 40. Therefore, moisture resistance can be ensured while suppressing the size in the Z direction.

[0073] As illustrated, the lid member 70 may have an injection port 73 for injecting the sealing body 60 into the case 30. The sealing body 60 may seal the injection port 73. In addition, the injection port 73 may be provided in a position that does not overlap the capacitor element 40 in a plan view. This makes it possible to lengthen the moisture absorption path from the injection port 73 to the capacitor element 40 compared to a configuration in which the injection port 73 is provided in a position that overlaps the capacitor element 40. Therefore, it is possible to ensure moisture resistance while suppressing the size in the Z direction.

[0074] As shown in the example, a notch provided in lid member 70 may serve as injection port 73. By providing the notch at the outer peripheral edge of lid member 70 (lid portion 71), injection port 73 can be located away from capacitor element 40. In other words, the moisture absorption path is lengthened, making it easier to ensure moisture resistance.

[0075] <Modifications> The injection port is not limited to a notch provided in the lid portion 71 (lid member 70). For example, as shown in FIG. 6, a through hole provided in the lid member 70 may serve as the injection port 74. FIG. 6 corresponds to FIG. 4. In FIG. 6, the injection port 74 is provided at a position overlapping the connecting portion 53 in a plan view. Furthermore, the injection port 74 is provided at a position not overlapping the capacitor element 40 in a plan view. Therefore, it is possible to ensure moisture resistance while suppressing the size in the Z direction.

[0076] Although the example in which the sealing body 60 includes only the element sealing body 61 has been shown, this is not limiting. For example, as shown in FIG. 7 , the sealing body 60 may include the element sealing body 61 and an upper sealing body 62. FIG. 7 corresponds to FIG. 5 . The element sealing body 61 corresponds to the first sealing body, and the upper sealing body 62 corresponds to the second sealing body. The upper sealing body 62 is disposed on the element sealing body 61, which is the lower sealing body. The sealing body 60 has a layered structure (two-layer structure) of the element sealing body 61 and the upper sealing body 62. The upper sealing body 62 is composed of a material, such as a fluorine-based resin, that has better moisture resistance than the element sealing body 61. In FIG. 7 , the upper sealing body 62 is in contact with the underside of the lid portion 71. The upper sealing body 62 seals the gap between the lid portion 71 and the case 30 and the injection port 73.

[0077] 7, the element encapsulant 61 containing silicone rubber or urethane can suppress cracks due to thermal stress. Furthermore, since the upper encapsulant 62 is disposed on the element encapsulant 61, it is possible to further suppress an increase in size in the Z direction while ensuring moisture resistance, compared to a configuration in which the encapsulant 60 has only the element encapsulant 61. Note that the element encapsulant 61 may be configured to contact the underside of the lid 71, and the upper encapsulant 62 may seal the gap between the lid 71 and the case 30, as well as the injection port 73.

[0078] Second Embodiment This embodiment is a modification of the preceding embodiment as a basic form, and the description of the preceding embodiment can be used. In the preceding embodiment, the cover member does not have a support portion for the circuit board. Instead, the cover member may be provided with a support portion for the circuit board. Furthermore, the cooler or the semiconductor module may be provided with a support portion for the circuit board.

[0079] Fig. 8 is a plan view showing an example of a capacitor module and a power conversion device according to this embodiment. Fig. 8 corresponds to Fig. 2. Fig. 9 is a cross-sectional view taken along line IX-IX shown in Fig. 8. For convenience, the circuit board 25 is simplified in Fig. 9.

[0080] The capacitor module 23 includes a cover member 70, similar to the configuration described in the preceding embodiment. The cover member 70 has a support portion 75 for supporting the circuit board 25 above the capacitor module 23. The support portion 75 extends upward in the Z direction from the cover portion 71. The cover member 70 has a plurality of support portions 75. The plurality of support portions 75 are dispersedly arranged in a plan view.

[0081] The semiconductor module 22 has a housing 225 and a support portion 226. The housing 225 is arranged to surround the semiconductor elements 22H, 22L for three phases in a plan view. The housing 225 is frame-shaped. The housing 225 is partitioned for each phase. The housing 225, when fixed to the cooler 21, provides a storage space for the sealant 223 together with the cooler 21. The housing 225 is, for example, a resin molded body. The signal terminal 224S is mounted on the circuit board 25. The support portion 226 extends upward in the Z direction from the housing 225. The semiconductor module 22 has a plurality of support portions 226. The plurality of support portions 226 are dispersedly arranged in a plan view.

[0082] The semiconductor module 22 includes signal terminals 224S as external connection terminals. The signal terminals 224S are electrically connected to pads of the corresponding semiconductor elements 222H and 222L. The illustrated signal terminals 224S are held in a housing 225. A portion of the signal terminals 224SZ extends upward in the Z direction from the housing 225 and is mounted on the circuit board 25.

[0083] The main body 242 of the current sensor 24 has a Hall element 243, a core 244, a resin member 245, a substrate 246, and a signal terminal 247. The Hall element 243 is mounted on the substrate 246 while being disposed in the gap of the core 244. The core 244 is held by the resin member 245. The bus bar 241 is held by the resin member 245 so as to pass through the annular region of the core 244. The substrate 246 is fixed to the resin member 245 by crimping or the like (not shown). The signal terminal 247 is mounted on the substrate 246. The signal terminal 227 extends upward in the Z direction from the substrate 246 and is mounted on the circuit board 25. The signal terminal 247 electrically connects the substrate 246 and the circuit board 25.

[0084] The circuit board 25 is supported by a plurality of support portions 226 and 75. The circuit board 25 is fixed to the support portions 226 and 75 by fastening means such as screws. The other configurations are the same as those described in the preceding embodiment.

[0085] Summary of the Second Embodiment As illustrated, the lid member 70 may have a support portion 75 that supports other components on the lid member 70. As described in the preceding embodiment, providing the lid member 70 can ensure moisture resistance while suppressing an increase in size. To suppress an increase in size in the Z direction, the space above the capacitor module 23 can be utilized. Furthermore, the lid member 70 allows the support portion 75 to be positioned so as to overlap the sealing body 60 in a plan view. This allows other components to be placed in the empty space above the capacitor module 23. Furthermore, the lid member 70 is disposed on the sealing body 60, which seals the gap between the lid member 70 and the case 30 and the injection ports 73 and 74. In other words, the lid member 70 is fixed by the sealing body 60. This improves the vibration resistance of the lid member 70 and, ultimately, the other components.

[0086] In a configuration in which the support portion 75 supports the circuit board 25 as another member, the circuit board 25 can be placed on the capacitor module 23 while suppressing an increase in size in the Z direction. The circuit board 25 having the drive circuit 14 and the control circuit 15, i.e., a circuit board 25 with a large area, can be placed not only on the semiconductor module 22 but also on the capacitor module 23. In addition, the vibration resistance of the circuit board 25 can be improved. Compared to a configuration in which the circuit board is divided into a drive board and a control board to improve vibration resistance, the size can be made smaller. In addition, costs can be reduced.

[0087] The power conversion device 20 includes a capacitor module 23 having a lid member 70, a semiconductor module 22, and a circuit board 25. Similar to the capacitor module 23 described in the previous embodiment, a sealing body 60 seals the capacitor element 40 and the gap between the lid member 70 and the case 30. The sealing body 60 is made of silicone rubber or urethane and has an element sealing body 61 that seals the capacitor element 40. The lid member 70 is disposed on the sealing body 60 and has better moisture resistance than the element sealing body 61. The lid member 70 has a first support portion that supports the circuit board 25 on the capacitor module 23. The power conversion device 20 includes a second support portion that supports the circuit board 25 on the semiconductor module 22. In the illustrated power conversion device 20, the support portion 75 corresponds to the first support portion, and the support portion 226 corresponds to the second support portion.

[0088] With this configuration, as described above, it is possible to place the circuit board 25 on the capacitor module 23 while suppressing an increase in size in the Z direction. The circuit board 25 having the drive circuit 14 and the control circuit 15, i.e., the circuit board 25 with a large area, can be placed not only on the semiconductor module 22 but also on the capacitor module 23. Furthermore, the vibration resistance of the circuit board 25 can be improved.

[0089] As illustrated, the power conversion device 20 may include the current sensor 24, and the signal terminal 224S of the semiconductor module 22 and the signal terminal 247 of the current sensor 24 may be mounted on the circuit board 25. Based on the phase current detected by the current sensor 24, the driving of the semiconductor elements 222H, 222L of the semiconductor module 22 can be controlled.

[0090] <Modifications> Although an example has been shown in which the support portion 226 of the semiconductor module 22 serves as the second support portion, the present invention is not limited to this. The second support portion may be an element other than the capacitor module 23. For example, as shown in FIG. 10 , the cooler 21 may have a support portion 211. FIG. 10 corresponds to FIG. 9 . The support portion 211 extends upward in the Z direction from a peripheral portion of the semiconductor module 22 in the cooler 21. The semiconductor module 22 does not have a housing 225 or a support portion 226. Although not shown, the current sensor 24 may have a support portion (second support portion).

[0091] The configuration shown in this embodiment may be combined with the configuration shown in the modified example of the preceding embodiment.

[0092] While the capacitor module 23 has the configuration described in the preceding embodiment and includes the support portion 75, the present invention is not limited to this. The material of the sealing body 60 is not limited to silicone rubber or urethane. The material of the lid member 70 is not limited to a material with better moisture resistance than the element sealing body 61. By disposing the lid member 70 on the sealing body 60 at the opening of the case 30 and using the sealing body 60 to seal not only the capacitor element 40 but also the gap between the lid member 70 and the case 30, the vibration resistance of other components supported by the support portion 75 can be improved. Furthermore, providing the support portion 75 on the lid member 70 can prevent the module size from increasing in the Z direction.

[0093] (Other Embodiments) The disclosure in this specification and drawings, etc. is not limited to the exemplified embodiments. The disclosure encompasses the exemplified embodiments and modifications thereto by those skilled in the art. For example, the disclosure is not limited to the combinations of parts and / or elements shown in the embodiments. The disclosure can be implemented in various combinations. The disclosure can have additional parts that can be added to the embodiments. The disclosure encompasses the omission of parts and / or elements from the embodiments. The disclosure encompasses the substitution or combination of parts and / or elements between one embodiment and another embodiment. The disclosed technical scope is not limited to the description of the embodiments. Some disclosed technical scopes are defined by the claims, and should be interpreted as including all modifications within the meaning and scope equivalent to the claims.

[0094] The disclosure in the specification, drawings, etc. is not limited by the claims. The disclosure in the specification, drawings, etc. encompasses the technical ideas described in the claims, and extends to more diverse and broader technical ideas than the technical ideas described in the claims. Therefore, various technical ideas can be extracted from the disclosure in the specification, drawings, etc. without being bound by the claims.

[0095] When an element or layer is referred to as being "on," "coupled," "connected," or "coupled," it may be directly on, coupled, connected, or coupled to another element or layer, and intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on," "directly coupled," "directly connected," or "directly coupled" to another element or layer, no intervening elements or layers are present. Other terms used to describe relationships between elements should be construed in a similar manner (e.g., "between" vs. "directly between," "adjacent" vs. "directly adjacent," etc.). As used in this specification, the term "and / or" includes any and all combinations of one or more of the associated listed items. That is, a reference to A and / or B means at least one of A and B.

[0096] Spatially relative terms such as "inside," "outside," "back," "below," "low," "top," "top," and the like are used herein to facilitate the description of one element or feature's relationship to other elements or features, as illustrated. Spatially relative terms may be intended to encompass different orientations of the device during use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures were turned over, elements described as "below" or "directly below" other elements or features would then be oriented "above" the other elements or features. Thus, the term "bottom" can encompass both an orientation of top and bottom. The device may also be oriented in other ways (rotated 90 degrees or at other orientations), and the spatially relative descriptors used in this specification would be interpreted accordingly.

[0097] (Disclosure of Technical Ideas) This specification discloses multiple technical ideas described in the following multiple clauses. Some clauses may be described in a multiple dependent form, with the subsequent clause alternatively referring to the preceding clause. Furthermore, some clauses may be described in a multiple dependent form, with the subsequent clause referring to another multiple dependent clause. These multiple dependent clauses define multiple technical ideas.

[0098] <Technical Idea 1> A capacitor module comprising: a case (30) having an opening on one side; a capacitor element (40) housed in the case; a bus bar (50) electrically connected to the capacitor element; a seal (60) disposed on the case; and a lid member (70) disposed on the opening, wherein the seal seals the capacitor element and a gap between the lid member and the case, the seal containing silicone rubber or urethane and having an element seal (61) that seals the capacitor element, and the lid member is disposed on the seal and has better moisture resistance than the element seal.

[0099] <Technical Idea 2> The capacitor module according to Technical Idea 1, wherein the bus bar has a connection portion (51) with the capacitor element, a protrusion (52) arranged outside the sealing body, and a linking portion (53) connecting the connection portion and the protrusion, the lid member has an injection port (73, 74) for injecting the sealing body into the case, the sealing body seals the injection port, and the injection port is provided at a position overlapping the linking portion in a plan view in the depth direction of the case.

[0100] <Technical Idea 3> The capacitor module according to Technical Idea 1 or Technical Idea 2, wherein the lid member has an injection port (73, 74) for injecting the sealing body into the case, the sealing body seals the injection port, and the injection port is provided at a position that does not overlap with the capacitor element in a plan view in the depth direction of the case.

[0101] <Technical Concept 4> The capacitor module according to Technical Concept 2 or 3, wherein the injection port (73) is a notch provided in the lid member.

[0102] <Technical Concept 5> The capacitor module according to Technical Concept 2 or 3, wherein the injection port (74) is a through-hole provided in the lid member.

[0103] <Technical Concept 6> The capacitor module according to any one of Technical Concepts 1 to 5, wherein the sealing body has better moisture resistance than a first sealing body which is the element sealing body, and includes a second sealing body (62) disposed on the first sealing body.

[0104] <Technical Concept 7> The capacitor module according to any one of Technical Concepts 1 to 6, wherein the cover member has a support portion (75) for supporting another member on the cover member.

Claims

1. A capacitor module comprising: a case (30) having an opening on one side; a capacitor element (40) housed in the case; a bus bar (50) electrically connected to the capacitor element; a seal (60) disposed on the case; and a lid member (70) disposed on the opening, wherein the seal seals the capacitor element and a gap between the lid member and the case, the seal comprising silicone rubber or urethane and having an element seal (61) that seals the capacitor element, and the lid member is disposed on the seal and has better moisture resistance than the element seal member.

2. A capacitor module as described in claim 1, wherein the bus bar has a connection portion (51) with the capacitor element, a protrusion (52) arranged outside the sealing body, and a connecting portion (53) connecting the connection portion and the protrusion, the lid member has an injection port (73, 74) for injecting the sealing body into the case, the sealing body seals the injection port, and the injection port is located at a position overlapping the connecting portion when viewed in a plane in the depth direction of the case.

3. A capacitor module as described in claim 1, wherein the lid member has an injection port (73, 74) for injecting the sealing body into the case, the sealing body seals the injection port, and the injection port is located at a position that does not overlap with the capacitor element when viewed in a plan view in the depth direction of the case.

4. A capacitor module according to claim 2 or 3, wherein the injection port (73) is a notch provided in the cover member.

5. A capacitor module according to claim 2 or 3, wherein the injection port (74) is a through hole provided in the cover member.

6. A capacitor module according to any one of claims 1 to 3, wherein the sealing body has better moisture resistance than the first sealing body, which is the element sealing body, and has a second sealing body (62) disposed on the first sealing body.

7. A capacitor module according to any one of claims 1 to 3, wherein the cover member has a support portion (75) for supporting another member on the cover member.

8. A capacitor module (23) having a case (30) with one side open, a capacitor element (40) housed in the case, a bus bar (50) electrically connected to the capacitor element, a sealing body (60) disposed in the case, and a lid member (70) disposed in the opening; a semiconductor module (22) having semiconductor elements (222H, 222L); and a circuit board (25) having a drive circuit (14) for driving the semiconductor element and a control circuit (15) for controlling the drive circuit, wherein the sealing body seals the capacitor element and a gap between the lid member and the case, the sealing body being composed of silicone rubber or urethane and having an element sealing body (61) for sealing the capacitor element, the lid member being disposed on the sealing body and having superior moisture resistance to the element sealing body, and the lid member having a first support portion (75) for supporting the circuit board on the capacitor module, A power conversion device comprising a second support portion (211, 226) that supports the circuit board on the semiconductor module.

9. The power conversion device according to claim 8, wherein the second support portion (226) is provided on the semiconductor module.

10. A power conversion device according to claim 8 or claim 9, further comprising a current sensor (24), wherein the signal terminal (224S) of the semiconductor module and the signal terminal (247) of the current sensor are mounted on the circuit board.

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