Application apparatus for medical device

Abstract

An application apparatus for a medical device, which is an application apparatus for applying a medical device to a host, the medical device comprising a sensor and an electronic assembly, the electronic assembly comprising a power supply module and a switch module, the power supply module being configured for providing electrical energy, the switch module being configured for controlling the power supply module, the switch module comprising a plurality of contacts and having a closed state and an open state, and a gap being provided between every two contacts among the plurality of contacts; the application apparatus comprises a guide member configured for guiding the sensor to be at least partially applied to the host, and when the guide member moves relative to the electronic assembly, the guide member engages the plurality of contacts of the switch module so as to enable the switch module to switch between the closed state and the open state. The application apparatus is capable of prolonging the shelf life of the medical device.

Description

Applicator for medical devices TECHNICAL FIELD

[0001] The utility model relates to biomedical engineering industry field, concretely relates to an applicator for medical devices. BACKGROUND

[0002] There are usually a plurality of analytes in the interstitial fluid or blood of a human body, and the health condition of the human body can be abnormal when the concentration of the analyte in the body (such as the concentration of glucose) is too high or too low. Therefore, in order to know the concentration of the analyte in the body in time so as to adjust the concentration level of the analyte in time by adjusting diet or applying drug treatment and the like, the concentration of the analyte in the body is usually acquired in real time and continuously by a continuous analyte monitor.

[0003] In the prior art, in order to enable the power supply of the continuous analyte monitor to provide sufficient and long-lasting electric energy for the continuous analyte monitor, so as to enable the continuous analyte monitor to have a desired service life, the standby state and the working state of the continuous analyte monitor are usually switched by setting a switch on the continuous analyte monitor, so as to reduce the electric quantity of the power supply consumed due to the continuous analyte monitor starting to monitor too early, thereby affecting the service life of the continuous analyte monitor.

[0004] However, the continuous analyte monitor in the prior art generally realizes the switch function by adding additional semiconductor components, and these semiconductor components can cause the power supply of the continuous analyte monitor to generate a leakage current, thereby causing the shelf life of the continuous analyte monitor to be shortened. SUMMARY

[0005] The utility model is proposed in view of the above-mentioned prior art, and the purpose is to provide an applicator for medical devices capable of prolonging the shelf life of the medical devices.

[0006] To this end, the utility model provides an applicator for medical devices, which is used for applying the medical devices to a host, the medical devices comprising a sensor and an electronic assembly, the electronic assembly comprising a power module and a switch module, the power module being configured to provide electric energy, the switch module being configured to control the power module, the switch module comprising a plurality of contacts and having a closed state and an open state, each two of the plurality of contacts having a gap therebetween; the applicator comprising a guide member, the guide member being configured to guide the sensor to be at least partially applied to the host, when the guide member moves relative to the electronic assembly, the guide member cooperates with the plurality of contacts of the switch module to switch the switch module between the closed state and the open state.

[0007] In the utility model, through setting power module, switch module and multiple contacts on the switch module on electronic assembly, and setting guide component on applying device, when using medical instrument (for example, when applying device applies medical instrument), guide component moves relative to electronic assembly, makes guide component cooperate with multiple contacts on electronic assembly, changes contact condition of guide component and electronic assembly, makes switch module switch between closed state and disconnected state.

[0008] In addition, in the applying device of the medical instrument, the guide component comprises a conductive part, and the conductive part is configured to conduct the multiple contacts, wherein when the conductive part contacts the multiple contacts of the switch module, the switch module is in the closed state, and when the conductive part of the guide component does not contact the multiple contacts of the switch module, the switch module is in the disconnected state. In this case, the conductive part is in physical contact with the contacts, which helps the guide component to contact the contacts, thereby improving the possibility of conducting the contacts.

[0009] In addition, in the applying device of the medical instrument, the guide component further comprises a supporting seat and a sharp object, the supporting seat is configured to clamp the sharp object, the sharp object is configured to at least partially accommodate the sensor, and the conductive part is arranged on the sharp object and attached to the supporting seat. In this case, since the conductive part is arranged on the sharp object and attached to the supporting seat, the structure of the guide component can be compact.

[0010] In addition, in the applying device of the medical instrument, the guide component further comprises a sharp object, the sharp object is configured to at least partially accommodate the sensor, and the sharp object and the conductive part are integrally formed. Thus, the structure of the applying device can be simplified.

[0011] In addition, in the medical device application device, optionally, each contact has a groove configured to accommodate the conductive piece, and the profile of the groove matches the profile of the part of the conductive piece in contact with the contact. In this case, the conductive piece contacts the contact by being accommodated in the groove, which can limit the conductive piece from moving undesirably to break contact with the contact when the switch module is in the closed state, thereby improving the reliability of the medical device. In addition, by matching the profile of the groove with the profile of the contact part, the conductive piece can be more closely matched with the groove, thereby improving the reliability of the medical device.

[0012] In addition, in the medical device application device, optionally, the conductive piece is sheet-shaped. In this case, the conductive piece is accommodated in the groove, and the area in contact with the contact can be increased to improve the stability of the conductive piece.

[0013] In addition, in the medical device application device, optionally, the electronic assembly has a mounting position configured to pass through and mount the guide member in the electronic assembly, and at least part of each contact is located in the mounting position. In this case, since at least part of the contact is located in the mounting position, the guide member can be easily matched with the contact when the guide member is mounted in the electronic assembly.

[0014] In addition, in the medical device application device, optionally, the plurality of contacts and the conductive piece are arranged in the direction of installation of the guide member into the electronic assembly. In this case, since the contacts and the conductive piece are arranged in the direction of installation of the guide member into the electronic assembly, when the application device completes the application of the medical device and the guide member is withdrawn, the conductive piece on the guide member can be disconnected from the contact while the guide member is withdrawn, thereby enabling the switch module to be switched to the open state more quickly.

[0015] In addition, in the medical device application device, optionally, the initial state of the switch module is the closed state to make the electronic assembly in an off mode, and the switch module is configured to make the electronic assembly in an operating mode when it is in the open state for the first time; or the initial state of the switch module is the open state to make the electronic assembly in an off mode, and the switch module is configured to make the electronic assembly in an operating mode when it is in the closed state for the first time. In this way, the mode of the electronic assembly can be changed by changing the state of the switch module.

[0016] In addition, in the application device for medical apparatuses, the electronic assembly further comprises a processing module and a controller, the processing module is configured to process signals of the sensor; when the switch module is in the closed state, the controller is configured to control the power module to stop supplying power to the processing module, or the controller is configured to send a shutdown signal to the processing module to make the processing module power off; when the switch module is in the open state for the first time, the controller is configured to stop controlling the power module, or the controller is configured to stop sending the shutdown signal to the processing module to make the processing module power on, and the processing module is further configured to make the power module in a lock mode to keep the processing module powered on or make the processing module in the lock mode to keep the processing module powered on when the processing module is powered on; or when the switch module is in the open state, the controller is configured to stop controlling the power module, or the controller is configured to stop sending a working signal to the processing module to make the processing module power off; when the switch module is in the closed state for the first time, the controller is configured to control the power module to supply power to the processing module, or the controller is configured to send the working signal to the processing module to make the processing module power on, and the processing module is further configured to make the power module in the lock mode to keep the processing module powered on or make the processing module in the lock mode to keep the processing module powered on when the processing module is powered on. In this case, after the processing module is powered on, the state of the switch module can not affect the processing module, and thus the reliability of the medical apparatuses can be improved.

[0017] According to the application device for medical apparatuses, the shelf life of the medical apparatuses can be prolonged. BRIEF DESCRIPTION OF DRAWINGS

[0018] The application will now be explained in further detail, by way of example only, with reference to the accompanying drawings.

[0019] Fig. 1 is a diagram showing an application scenario of the medical apparatuses according to the present application.

[0020] Fig. 2 is a diagram showing the structure of the application device and the guide member according to the present application.

[0021] Fig. 3 is a diagram showing the structure of the guide member according to the present application.

[0022] Fig. 4A is a block diagram showing the electronic assembly according to the present application.

[0023] Fig. 4B is a diagram showing the structure of the electronic assembly according to the present application.

[0024] Fig. 5 is a schematic view showing the position of the switch module according to the present application.

[0025] Fig. 6A is a schematic view showing a first embodiment of the connection of the conductive member to the contact according to the present application.

[0026] Fig. 6B is a schematic view showing a second embodiment of the connection of the conductive member to the contact according to the present application.

[0027] Fig. 7 is a schematic view showing the distribution of the contacts according to the present application.

[0028] Fig. 8 is a schematic view showing the structure of the sensor according to the present application.

[0029] Fig. 9A is a schematic view showing the assembly structure of the guide member, the processing module, and the sensor according to the present application.

[0030] Fig. 9B is a schematic view showing another view direction of the assembly structure of the guide member, the processing module, and the sensor according to the present application.

[0031] Fig. 10A is a schematic view showing the principle of controlling the switch module to turn off the processing module in the first embodiment of the controller according to the present application.

[0032] Fig. 10B is a schematic view showing the principle of controlling the switch module to turn on the processing module in the first embodiment of the controller according to the present application.

[0033] Fig. 10C is a schematic view showing the principle of controlling the switch module to turn off the processing module in the second embodiment of the controller according to the present application.

[0034] Fig. 10D is a schematic view showing the principle of controlling the switch module to turn on the processing module in the second embodiment of the controller according to the present application.

[0035] Fig. 11A is a schematic view showing the principle of controlling the switch module to turn off the processing module in the third embodiment of the controller according to the present application.

[0036] Fig. 11B is a schematic view showing the principle of controlling the switch module to turn on the processing module in the third embodiment of the controller according to the present application.

[0037] Fig. 11C is a schematic view showing the principle of controlling the switch module to turn off the processing module in the fourth embodiment of the controller according to the present application.

[0038] Fig. 11D is a schematic diagram showing the principle of the control switch module energizing the processing module in the fourth embodiment of the controller.

[0039] Reference signs: 1…application device, 11…guiding member, 111…conductive piece, 112…sharp object, 1121…accommodation groove, 113…support seat, 2…medical instrument, 21…electronic assembly, 211…housing, 212…processing module, 213…power module, 214…mounting position, 215…switch module, 2151…contact, 21511…groove, 216…controller, 22…sensor, 221…connecting part, 222…implanting part, 23…sensor seat, 231…mounting groove, 3…external device, D…application direction. DETAILED DESCRIPTION

[0040] Hereinafter, preferred embodiments of the present application will be described in detail with reference to the accompanying drawings. In the following description, the same parts are assigned with the same reference numerals, and overlapping description will be omitted. In addition, the drawings are schematic diagrams, and the ratio of the dimensions between the parts or the shape of the parts, etc. can be different from the actual ones.

[0041] It should be noted that the terms "comprising" and "having" and any variations thereof, such as a series of steps or units included or having a process, method, system, product or device, are not necessarily limited to those steps or units clearly listed, but can include or have other steps or units that are not clearly listed or inherent to the process, method, product or device.

[0042] It should be noted that in this document, the relative position and direction terms such as "up", "towards up", "down", "towards down", "vertical direction", "left side", "towards left side", "left", "towards left", "right side", "towards right side", "right", "towards right", "horizontal direction", "front", "towards front", "back", "towards back", "front-back direction" are referred to the usual operation posture, and should not be considered as limiting.

[0043] The present application relates to an application device of a medical instrument (hereinafter can be referred to as an application device), which is used for applying a medical instrument to a host.

[0044] The application device related to the utility model moves relative to the medical instrument through the guide component, and the electronic component of the medical instrument is switched to the working mode. In addition, the application device related to the utility model moves relative to the medical instrument through the guide component, the physical contact condition of the guide component and the contact of the electronic component can be changed, and the possibility of the leakage current generated by the power supply can be reduced, thereby the shelf life of the medical instrument can be prolonged, and the reliability of the medical instrument can be improved.

[0045] In some examples, the application device related to the utility model can also be called a boosting device, a conveying device, an implanting device, a patching device or an auxiliary device. In addition, the medical instrument related to the utility model can also be called a monitor, a continuous analyte monitor, a detection device, a sensor component or an information acquisition device.

[0046] Hereinafter, the application device of the medical instrument related to the utility model will be described in detail in combination with the drawings.

[0047] Fig. 1 is a diagram showing the application scene of the medical instrument 2 related to the utility model example. Fig. 2 is a structural schematic diagram showing the application device 1 and the guide component 11 related to the utility model example.

[0048] In some examples, referring to Fig. 1, the application device 1 can be used to apply the medical instrument 2 to a host. For example, the application device 1 can be used to apply the medical instrument 2 to the skin surface of the host.

[0049] In some examples, the medical instrument 2 can be a sensor device. In some examples, the medical instrument 2 can be an analyte sensor device. In some examples, the medical instrument 2 can be configured to generate information of a specific analyte in a body fluid based on the body fluid (for example, subcutaneous interstitial fluid) of the host, for example, react with the analyte in the interstitial fluid and generate the analyte information, in which case, by reacting with the analyte in the body fluid through the medical instrument 2, the analyte information in the body fluid can be conveniently obtained.

[0050] In some examples, the analyte can be one or more of glucose, acetylcholine, amylase, bilirubin, cholesterol, chorionic gonadotropin, creatine kinase, creatine, creatinine, DNA, fructosamine, glutamine, growth hormone, hormone, ketone body, lactate, oxygen, peroxide, prostate specific antigen, prothrombin, RNA, thyroid stimulating hormone or troponin.

[0051] In some examples, the medical instrument 2 can send the analyte information to the external device 3. Thus, the host can conveniently obtain the analyte information. In some examples, the medical instrument 2 can send the analyte information to the external device 3 in a wireless transmission manner. In addition, the external device 3 can be a mobile intelligent terminal.

[0052] In some examples, referring to FIG. 2, the application device 1 can include a guide member 11. In some examples, the guide member 11 can be configured to guide the medical instrument 2 to be applied to the host. In some examples, the guide member 11 can be at least partially housed in the medical instrument 2.

[0053] In some examples, when the application device 1 and the medical instrument 2 are in a shelf life (i.e., out of the factory), at least a portion of the guide member 11 and the medical instrument 2 can be located inside the application device 1.

[0054] In some examples, the guide member 11 can pass through and be mounted in the medical instrument 2. In some examples, the guide member 11 can guide at least a portion of the medical instrument 2 to be applied to the subcutaneous of the host.

[0055] In some examples, the application device 1 can have a proximal end that is close to the host when in operation, and a distal end that is away from the host. In some examples, when the application device 1 applies the medical instrument 2, the application device 1 can apply a force to the guide member 11 and the medical instrument 2 towards the proximal end. Thus, the guide member 11 and the medical instrument 2 can be moved towards the proximal end of the application device 1 to apply the medical instrument 2 to the host.

[0056] In some examples, when the guide member 11 and the medical instrument 2 are moved towards the proximal end, the guide member 11 can remain relatively stationary with respect to the medical instrument 2.

[0057] In some examples, when the application device 1 applies the medical instrument 2 to the host, the medical instrument 2 can be applied to the host. The application device 1 can apply a force to the guide member 11 towards the distal end. Thus, the guide member 11 can be moved relative to the medical instrument 2 and towards the distal end of the application device 1.

[0058] In some examples, referring to FIG. 2, the application direction D can be a direction of movement of the medical instrument 2 when the application device 1 applies the medical instrument 2. In some examples, the application direction D can be a direction from the distal end that is away from the host towards the proximal end that is close to the host.

[0059] FIG. 3 is a structural schematic diagram of the guide member 11 according to an example of the present application.

[0060] In some examples, the guide member 11 can be configured to guide the sensor 22 (described later) to be at least partially applied to the host. In some examples, the guide member 11 can move relative to the electronic component 21 (described later) of the medical instrument 2.

[0061] In some examples, the guide member 11 can cooperate with the contacts 2151 (to be described later) of the switch module 215 to switch the state of the switch module 215. Specifically, the guide member 11 can be in contact with or not in contact with the contacts 2151 of the switch module 215.

[0062] In some examples, the guide member 11 can be at least partially made of an electrically conductive material. In some examples, the portion of the guide member 11 that is in contact with the contacts 2151 of the switch module 215 can be made of an electrically conductive material. In this way, the guide member 11 can be able to conduct the plurality of contacts 2151 of the switch module 215.

[0063] In some examples, referring to FIG. 3, the guide member 11 can include an electrically conductive piece 111. In some examples, the electrically conductive piece 111 can be configured to conduct the plurality of contacts 2151. In other words, the guide member 11 can contact the contacts 2151 through the electrically conductive piece 111.

[0064] In some examples, the electrically conductive piece 111 can be in the shape of a sheet. In this way, the electrically conductive piece 111 can be able to be accommodated in the groove 21511 (to be described later), and the area in contact with the contacts 2151 can be increased to improve the stability of conducting the contacts 2151.

[0065] In some examples, the electrically conductive piece 111 can be in the shape of a block. In this way, the electrically conductive piece 111 can be less likely to be deformed, thereby facilitating cooperation with the contacts 2151.

[0066] In some examples, the electrically conductive piece 111 can be made of an electrically conductive material. In this way, the electrically conductive piece 111 can be able to conduct the contacts 2151.

[0067] In some examples, the electrically conductive piece 111 can contact the plurality of contacts 2151 of the switch module 215. In this way, the switch module 215 can be in a closed state. In some examples, the electrically conductive piece 111 can not contact the plurality of contacts 2151 of the switch module 215. In this way, the switch module 215 can be in an open state. In this case, by causing the electrically conductive piece 111 to cooperate with the contacts 2151 in a physically contacting manner, the guide member 11 can be facilitated to be in contact with the contacts 2151, thereby being able to improve the possibility of conducting the contacts 2151.

[0068] In some examples, referring to FIG. 3, the guide member 11 can further include a sharp 112. In some examples, the sharp 112 can be configured to guide the sensor 22 to be at least partially applied to the host. In some examples, the sharp 112 can be fixed to a support 113 (to be described later). In some examples, the sharp 112 and the support 113 can be movable relative to the electronic assembly 21 of the medical instrument 2.

[0069] In some examples, the sharp 112 can be configured to at least partially accommodate the sensor 22. In some examples, the sharp 112 can have an accommodation groove 1121. In some examples, the accommodation groove 1121 of the sharp 112 can at least partially accommodate the sensor 22. Thereby, it can be facilitated to apply the sensor 22 to the host.

[0070] In some examples, an end of the sharp 112 close to the host can be pointed. Thereby, it can be facilitated to guide the sharp 112 to apply the sensor 22 to the host.

[0071] In some examples, the electrically conductive member 111 can be provided on the sharp 112. Thereby, it can be facilitated to move the electrically conductive member 111 with the sharp 112 relative to the electronic component 21.

[0072] In some examples, the electrically conductive member 111 and the sharp 112 can be integrally formed. Thereby, it can be facilitated to simplify the structure of the application device 1.

[0073] In some examples, the electrically conductive member 111 and the sharp 112 can be separate. Thereby, it can be facilitated to reduce the possibility of the contact 2151 being mistakenly guided on by the sharp 112.

[0074] In some examples, referring to FIG. 3, the guiding member 11 can further include a support seat 113. In some examples, the support seat 113 can be configured to clamp the sharp 112. Thereby, it can be facilitated to fix the sharp 112 to the support seat 113.

[0075] As mentioned above, the electrically conductive member 111 can be provided on the sharp 112. In some examples, the electrically conductive member 111 can be provided on the sharp 112 and abut the support seat 113. Thereby, it can be facilitated to make the structure of the guiding member 11 compact.

[0076] In some examples, the electrically conductive member 111 can be at least partially embedded in the support seat 113. Thereby, it can be facilitated to make the structure of the guiding member 11 compact. In some examples, the support seat 113 can have a groove. The electrically conductive member 111 can be at least partially embedded in the groove of the support seat 113.

[0077] FIG. 4A is a block diagram showing the electronic component 21 involved in the examples of the present application. FIG. 4B is a structural schematic diagram showing the electronic component 21 involved in the examples of the present application.

[0078] In some examples, the medical instrument 2 can include an electronic assembly 21. In some examples, referring to FIG. 4A, the electronic assembly 21 can include a housing 211. In some examples, referring to FIG. 4B, the housing 211 can house a processing module 212 and a power module 213. In this case, the interior components of the electronic assembly 21 can be protected by the housing 211, the influence of external interference factors (e.g., liquid) on the electronic assembly 21 can be reduced, and the shelf life of the medical instrument 2 can be prolonged.

[0079] In some examples, referring to FIG. 4A, the electronic assembly 21 can include the power module 213. In some examples, the power module 213 can be configured to provide electrical energy. For example, the power module 213 can power the electronic assembly 21.

[0080] In some examples, the power module 213 can include a battery. For example, the battery can be a coin cell battery.

[0081] In some examples, referring to FIG. 4A, the electronic assembly 21 can include the processing module 212. In some examples, the processing module 212 can be configured to process signals of the sensor 22. For example, the processing module 212 can process analyte concentration signals obtained by the sensor 22 to obtain analyte information.

[0082] In some examples, referring to FIG. 4A, the electronic assembly 21 can have a mounting site 214. In some examples, the mounting site 214 can be configured to allow the guide member 11 to pass through.

[0083] In some examples, referring to FIG. 4B, the mounting site 214 can be a hole. In some examples, the mounting site 214 can be a through hole, in other words, the mounting site 214 can pass through the electronic assembly 21. In this way, the guide member 11 can be facilitated to pass through the mounting site 214 to guide the sensor 22 to be applied to the host.

[0084] FIG. 5 is a schematic diagram showing the position of a switch module 215 involved in the examples of the present application.

[0085] In some examples, referring to FIG. 5, the electronic assembly 21 can include the switch module 215. In some examples, the switch module 215 can be configured to control the power module 213. Specifically, the switch module 215 can switch the state of the power module 213. For example, the switch module 215 can switch between the power supply and non-power supply states of the power module 213.

[0086] In some examples, the switch module 215 can have a closed state and an open state.

[0087] In some examples, the switch module 215 can include a plurality of contacts 2151. In some examples, the plurality of contacts 2151 can cooperate with the conductive member 111 to switch the switch module 215 between the closed state and the open state. For example, the switch module 215 can be in the closed state when the conductive member 111 contacts the plurality of contacts 2151. For another example, the switch module 215 can be in the open state when the conductive member 111 does not contact the plurality of contacts 2151.

[0088] In some examples, the contacts 2151 can be made of a flexible conductive material. In this case, by using the flexible conductive material to make the contacts 2151, the contacts 2151 can be more tightly fitted with the conductive member 111, thereby improving the reliability of the medical instrument 2.

[0089] In some examples, referring to FIG. 5, each of the contacts 2151 can have a groove 21511. In some examples, the groove 21511 can be configured to accommodate the conductive member 111. In this way, when the switch module 215 is in the closed state, the conductive member 111 can be limited from undesirably moving to break the contact between the conductive member 111 and the contacts 2151, thereby improving the reliability of the medical instrument 2.

[0090] In some examples, the groove 21511 of the contacts 2151 can contact a portion of the conductive member 111. Hereinafter, the portion of the conductive member 111 that contacts the groove 21511 is referred to as a contact portion.

[0091] In some examples, the profile of the groove 21511 can match the profile of the contact portion. Specifically, the profile of the contact portion can be similar to the profile of the groove 21511. In this way, the conductive member 111 can be more tightly fitted with the groove 21511, thereby improving the reliability of the medical instrument 2.

[0092] In some examples, the size of the contact portion can be slightly larger than the size of the groove 21511. In this case, by making the contacts 2151 form an interference fit with the conductive member 111, the contacts 2151 can be more tightly fitted with the conductive member 111, thereby improving the stability of the conductive member 111 to conduct the contacts 2151.

[0093] In some examples, the contacts 2151 can not have the groove 21511. That is, the contacts 2151 can not accommodate the conductive member 111. In this case, by changing the structure of the contacts 2151, the contacts 2151 can be less restrictive of the conductive member 111 in space, thereby facilitating the movement of the conductive member 111 to break the contact with the contacts 2151.

[0094] In some examples, at least part of each contact 2151 can be located in the mounting position 214, in other words, the contact 2151 can be at least partially located in the mounting position 214.

[0095] In some examples, one end of the contact 2151 can extend to the mounting position 214. In some examples, referring to FIG. 5, the groove 21511 part of the contact 2151 can be located in the mounting position 214. Thus, when the guide member 11 is mounted on the electronic assembly 21, the guide member 11 can be facilitated to cooperate with the contact 2151.

[0096] FIG. 6A is a schematic view showing a first embodiment of the connection between the conductive member 111 and the contact 2151 according to the examples of the present application. FIG. 6B is a schematic view showing a second embodiment of the connection between the conductive member 111 and the contact 2151 according to the examples of the present application.

[0097] In some examples, referring to FIG. 6A, the groove 21511 of the contact 2151 can be partially in contact with the conductive member 111. Thus, the conductive member 111 can be facilitated to break the contact with the contact 2151.

[0098] In some examples, referring to FIG. 6B, the groove 21511 of the contact 2151 can be fully in contact with the conductive member 111. In this case, by increasing the contact area between the conductive member 111 and the contact 2151, the reliability of the medical instrument 2 can be improved.

[0099] FIG. 7 is a schematic view showing a distribution manner of the contact 2151 according to the examples of the present application.

[0100] In some examples, referring to FIG. 7, a gap can be provided between each two contacts 2151 of the plurality of contacts 2151. In other words, each two contacts 2151 can be spaced apart by a predetermined distance. In this case, by spacing apart the contacts 2151 in space by a certain distance, the contacts 2151 can be prevented from physically contacting each other, and the possibility of the contacts 2151 being mistakenly conducted can be reduced, thereby the reliability of the medical instrument 2 can be improved.

[0101] In some examples, the contacts 2151 can be symmetrically distributed on the electronic assembly 21. In some examples, referring to FIG. 7, the contacts 2151 can be symmetrically distributed on the mounting position 214.

[0102] In some examples, the contacts 2151 can be asymmetrically distributed on the electronic assembly 21.

[0103] In some examples, referring to FIG. 7, the number of the contacts 2151 can be two. For example, in the example shown in FIG. 7, the contacts 2151 can include a first contact 2151a and a second contact 2151b.

[0104] In some examples, a gap can exist between the first contact 2151a and the second contact 2151b. In this case, by spatially spacing the first contact 2151a and the second contact 2151b apart by a certain distance, physical contact between the first contact 2151a and the second contact 2151b can be avoided, the possibility of the first contact 2151a and the second contact 2151b being mistakenly turned on can be reduced, and thus the reliability of the medical instrument 2 can be improved.

[0105] In some examples, the first contact 2151a and the second contact 2151b can be symmetrically distributed. In this way, the contact 2151 can be facilitated to cooperate with the conductive member 111.

[0106] In some examples, the contact 2151 can be multiple, for example, two, three, four, or more.

[0107] FIG. 8 is a structural schematic diagram of a sensor 22 according to an example of the present application.

[0108] In some examples, the medical instrument 2 can further include a sensor 22. In some examples, the sensor 22 can be mounted to the electronic assembly 21. In some examples, the sensor 22 can be configured to acquire analyte information in a body fluid and transmit the analyte information to the electronic assembly 21.

[0109] In some examples, referring to FIG. 8, the sensor 22 can include a connecting portion 221 and an implanted portion 222.

[0110] In some examples, the connecting portion 221 can be configured to be electrically connected with the electronic assembly 21. In this way, the electronic assembly 21 can acquire analyte information of the sensor 22.

[0111] In some examples, the implanted portion 222 can be configured to be implanted subcutaneously in a host to react with analytes in interstitial fluid and acquire analyte information in the interstitial fluid.

[0112] In some examples, the implanted portion 222 can be flexible. In this way, the foreign body sensation of the host can be reduced.

[0113] In some examples, the sharp 112 of the guide member 11 can be configured to accommodate the implanted portion 222 of the sensor 22. In some examples, the accommodation groove 1121 of the guide member 11 can be configured to accommodate the implanted portion 222, in other words, the implanted portion 222 can be located in the accommodation groove 1121.

[0114] Figure 9A is a schematic view showing the assembly structure of the guide member 11, the processing module 212, and the sensor 22 according to the present application. In Figure 9A, the structure of the electronic assembly 21 is simplified for a clearer illustration, but should not be construed as a limitation of the present application.

[0115] In some examples, referring to Figure 9A, the guide member 11 can be mounted to the electronic assembly 21 through the mounting site 214. In this way, the guide member 11 can be facilitated to guide the sensor 22 to be applied to the host; in addition, the guide member 11 can be facilitated to cooperate with the contacts 2151.

[0116] In some examples, referring to Figure 9A, the guide member 11 can cooperate with the plurality of contacts 2151 of the switch module 215 to switch the state of the switch module 215. Specifically, the guide member 11 can contact the plurality of contacts 2151 to turn on the plurality of contacts 2151 to make the switch module 215 in a closed state; in addition, the guide member 11 can not contact the plurality of contacts 2151 to turn off the plurality of contacts 2151, so that the switch module 215 is in an open state.

[0117] In some examples, by switching the state of the switch module 215, the mode of the electronic assembly 21 can be changed.

[0118] In some examples, when the guide member 11 is mounted to the electronic assembly 21 (i.e. during the shelf life), the guide member 11 can contact the plurality of contacts 2151. In other words, the guide member 11 can turn on the plurality of contacts 2151.

[0119] In some examples, when the guide member 11 and the medical device 2 move together in the application direction D, the guide member 11 can maintain the contact with the plurality of contacts 2151.

[0120] In some examples, the guide member 11 can move relative to the electronic assembly 21. In some examples, when the guide member 11 moves away from the electronic assembly 21 (i.e. when the guide member 11 moves in a direction opposite to the application direction D), the guide member 11 can turn off the contact with the plurality of contacts 2151. In this case, by the relative movement of the guide member 11 and the electronic assembly 21, the switch module 215 can be switched between the closed state and the open state.

[0121] In some examples, referring to Figure 9A, the application direction D of the application device 1 to apply the medical device 2 can be consistent with the direction in which the guide member 11 is mounted into the electronic assembly 21. In this case, after the medical device 2 is applied to the host, the conductive part 111 on the guide member 11 can be turned off from the contact with the contacts 2151 while the guide member 11 moves towards the distal end of the application device 1, so that the mode of the electronic assembly 21 can be facilitated to be switched.

[0122] In some examples, referring to FIG. 9A, the plurality of contacts 2151 and the conductive member 111 can be arranged in a direction in which the conductive member 111 is installed into the electronic assembly 21 along the guide member 11. In this case, after the medical instrument 2 is applied to the host, since the contacts 2151 and the conductive member 111 are arranged in the direction in which the conductive member 111 is installed into the electronic assembly 21 along the guide member 11, the conductive member 111 on the guide member 11 can be caused to break contact with the contacts 2151 while the guide member 11 moves toward the distal end of the application device 1, thereby enabling the switch module 215 to be switched to the open state more quickly.

[0123] In some examples, the guide member 11 can switch the switch module 215 between the open state and the closed state. In some examples, the switch module 215 can be in the closed state when the conductive member 111 contacts the contacts 2151, and the switch module 215 can be in the open state when the conductive member 111 does not contact the contacts 2151.

[0124] In some examples, the guide member 11 can trigger the electronic assembly 21 to switch between the off mode and the working mode. In some examples, the switch module 215 can trigger the electronic assembly 21 to switch between the off mode and the working mode.

[0125] In some examples, referring to FIG. 9A, the medical instrument 2 further includes a sensor seat 23. In some examples, the sensor seat 23 can have a mounting groove 231. In some examples, the mounting groove 231 can be configured to mount the guide member 11. In some examples, the conductive member 111 of the guide member 11 can be mounted in the mounting groove 231.

[0126] FIG. 9B is a schematic diagram showing another view direction of the assembly structure of the guide member 11, the processing module 212, and the sensor 22 involved in the examples of the present application. In FIG. 9B, the structure of the electronic assembly 21 is simplified for clearer illustration, but should not be understood as a limitation of the present application.

[0127] As described above, referring to FIG. 9B, the sharp 112 can be configured to at least partially accommodate the sensor 22. In some examples, the sharp 112 can have an accommodation groove 1121. In some examples, the accommodation groove 1121 of the sharp 112 can at least partially accommodate the sensor 22. In this way, the sensor 22 can be facilitated to be applied to the host.

[0128] In some examples, referring to FIG. 9B, in some examples, the sensor seat 23 can be configured to accommodate the connecting portion 221 of the sensor 22. In some examples, the connecting portion 221 can be located within the sensor seat 23. In some examples, the implanted portion 222 of the sensor 22 can be located outside the sensor seat 23. Thereby, the processing module 212 can be enabled to acquire analyte information through the connecting portion 221 and the implanted portion 222.

[0129] FIG. 10A is a schematic diagram illustrating the principle of the controller 216 controlling the switch module 215 to power off the processing module 212 in the first embodiment. FIG. 10B is a schematic diagram illustrating the principle of the controller 216 controlling the switch module 215 to power on the processing module 212 in the first embodiment. FIG. 10C is a schematic diagram illustrating the principle of the controller 216 controlling the switch module 215 to power off the processing module 212 in the second embodiment. FIG. 10D is a schematic diagram illustrating the principle of the controller 216 controlling the switch module 215 to power on the processing module 212 in the second embodiment.

[0130] As described above, the switch module 215 can have a closed state and an open state. In some examples, the switch module 215 can control the mode of the electronic assembly 21 when the switch module 215 switches between the closed state and the open state.

[0131] In some examples, the switch module 215 can have an initial state. In some examples, the initial state can be the state of the switch module 215 when the medical instrument 2 is in the shelf period, in other words, the initial state can be the state of the switch module 215 when the applicator 1 has not applied the medical instrument 2.

[0132] In some examples, the electronic assembly 21 can have an off mode and an on mode. In some examples, the processing module 212 can have two states of power off and power on.

[0133] In some examples, the electronic assembly 21 can be in the off mode when the processing module 212 is powered off. In some examples, the electronic assembly 21 can be in the on mode when the processing module 212 is powered on.

[0134] In some examples, the processing module 212 can be configured to stop processing the signal of the sensor 22 when the processing module 212 is powered off. In some examples, the processing module 212 can also be configured to process the signal of the sensor 22 when the processing module 212 is powered on.

[0135] In some examples, the closed state of the switch module 215 can be a state of the switch module 215 when the guide member 11 is in contact with the plurality of contacts 2151. In some examples, the initial state of the switch module 215 can be the closed state. In some examples, when the initial state of the switch module 215 is the closed state, the switch module 215 can control the electronic assembly 21 to be in the off mode.

[0136] In some examples, the open state of the switch module 215 can be a state of the switch module 215 when the guide member 11 is not in contact with the plurality of contacts 2151. In some examples, the switch module 215 can be configured to cause the electronic assembly 21 to be in the working mode when the switch module 215 is in the open state for the first time, i.e. when the guide member 11 is not in contact with the plurality of contacts 2151 for the first time. Thus, the mode of the electronic assembly 21 can be changed by changing the state of the switch module 215.

[0137] In some examples, referring back to FIG. 4A, the electronic assembly 21 can include a controller 216. In some examples, the controller 216 can be configured to control the power module 213 and the processing module 212. In some examples, the controller 216 can control the power module 213 to supply power to the processing module 212 based on the state of the switch module 215.

[0138] In some examples, referring to FIG. 10A, when the switch module 215 is in the closed state, the controller 216 can be configured to control the power module 213 to stop supplying power to the processing module 212 to cause the processing module 212 to be powered off.

[0139] In some examples, referring to FIG. 10B, when the switch module 215 is in the open state for the first time, the controller 216 can be configured to stop controlling the power module 213 to cause the processing module 212 to be powered on.

[0140] In some examples, referring to FIG. 10C, when the switch module 215 is in the closed state, the controller 216 can be configured to send an off signal to the processing module 212 to cause the processing module 212 to be powered off. In this case, the electronic assembly 21 can be controlled to be in the off mode when the switch module 215 is in the closed state.

[0141] In some examples, the off signal can change the pin level of the processing module 212. In some examples, the power module 213 can detect the pin level of the processing module 212 to stop supplying power to the processing module 212.

[0142] In some examples, referring to FIG. 10D, when the switch module 215 is in the off state for the first time, the controller 216 can be configured to stop sending the off signal to the processing module 212 to power on the processing module 212. In this case, when the switch module 215 is in the off state, the controller 216 can control the electronic assembly 21 to be in the working mode by stopping sending the off signal to change the pin level of the processing module 212.

[0143] In some examples, referring to FIG. 10B, when the processing module 212 is powered on, the processing module 212 can be configured to make the power module 213 in the locked mode to keep the processing module 212 powered on.

[0144] In some examples, when the power module 213 is in the locked mode, the power module 213 can not be controlled by the controller 216. Thus, the power module 213 can keep supplying power to the processing module 212 regardless of the state of the switch module 215.

[0145] In some examples, referring to FIG. 10D, when the processing module 212 is powered on, the processing module 212 can be configured to make the processing module 212 in the locked mode to keep the processing module 212 powered on. In some examples, when the processing module 212 is in the locked mode, the processing module 212 can not be controlled by the controller 216. Thus, the processing module 212 can keep powered on regardless of the state of the switch module 215.

[0146] FIG. 11A is a schematic diagram showing the principle of the controller 216 of the third embodiment of the present application controlling the switch module 215 to power off the processing module 212. FIG. 11B is a schematic diagram showing the principle of the controller 216 of the third embodiment of the present application controlling the switch module 215 to power on the processing module 212. FIG. 11C is a schematic diagram showing the principle of the controller 216 of the fourth embodiment of the present application controlling the switch module 215 to power off the processing module 212. FIG. 11D is a schematic diagram showing the principle of the controller 216 of the fourth embodiment of the present application controlling the switch module 215 to power on the processing module 212. It should be noted that in the control principles of the third and fourth embodiments of the controller 216, the change of the contact condition of the guide member 11 and the medical instrument 2 is different from that in the first and second embodiments, and the same parts will not be described again. In addition, the contact condition can refer to whether the guide member 11 and the medical instrument 2 are in contact.

[0147] In some examples, when the applicator 1 and the medical instrument 2 are in the shelf period (i.e., at the time of factory shipment), the guide member 11 and the medical instrument 2 can be located together inside the applicator 1. In some examples, the guide member 11 can pass through and be installed in the medical instrument 2.

[0148] In some examples, the guide member 11 can not be in contact with the contacts 2151 of the medical instrument 2 when the guide member 11 is installed on the electronic assembly 21, i.e. during shelf life. In particular, the guide member 11 can be at a predetermined distance from the medical instrument 2 in the application direction D. In this case, when the application device 1 and the medical instrument 2 are in shelf life, by breaking the contact between the guide member 11 and the contacts 2151, the possibility of power leakage of the power module 213 due to the conduction between the contacts 2151 can be reduced, thereby prolonging the shelf life of the medical instrument 2.

[0149] In some examples, the medical instrument 2 can be kept relatively stationary with the application device 1 before the guide member 11 contacts the medical instrument 2. In some examples, the guide member 11 can contact the medical instrument 2 and drive the medical instrument 2 to move together towards the proximal end of the application device 1 after the guide member 11 moves a predetermined distance towards the proximal end of the application device 1. In some examples, the guide member 11 can contact the contacts 2151 of the medical instrument 2 after the guide member 11 moves a predetermined distance towards the proximal end of the application device 1.

[0150] In some examples, the guide member 11 can move in a direction opposite to the application direction D. In some examples, the guide member 11 can move relative to the medical instrument 2 in a direction opposite to the application direction D.

[0151] In some examples, the open state of the switch module 215 can be the state of the switch module 215 when the guide member 11 breaks the contact with the plurality of contacts 2151. In some examples, the initial state of the switch module 215 can be the open state. In some examples, when the initial state of the switch module 215 is the open state, the switch module 215 can control the electronic assembly 21 to be in the off mode.

[0152] In some examples, the closed state of the switch module 215 can be the state of the switch module 215 when the guide member 11 conducts the plurality of contacts 2151. In some examples, the switch module 215 can be configured to cause the electronic assembly 21 to be in the working mode when the switch module 215 is in the closed state for the first time, i.e. when the guide member 11 conducts the plurality of contacts 2151 for the first time. In this way, the mode of the electronic assembly 21 can be changed by changing the state of the switch module 215.

[0153] In some examples, referring to FIG. 11A, when the switch module 215 is in the open state, the controller 216 can be configured to stop controlling the power module 213 to power off the processing module 212.

[0154] In some examples, referring to FIG. 11B, when the switch module 215 is first in the closed state, the controller 216 can be configured to control the power module 213 to supply power to the processing module 212 to power on the processing module 212.

[0155] In some examples, referring to FIG. 11C, when the switch module 215 is in the open state, the controller 216 can be configured to stop sending the working signal to the processing module 212 to power off the processing module 212. In this case, the electronic assembly 21 can be controlled to be in the off mode when the switch module 215 is in the open state.

[0156] In some examples, the working signal can change the pin level of the processing module 212. In some examples, the power module 213 can detect the pin level of the processing module 212 to stop supplying power to the processing module 212.

[0157] In some examples, referring to FIG. 11D, when the switch module 215 is first in the closed state, the controller 216 can be configured to send the working signal to the processing module 212 to power on the processing module 212. In this case, the controller 216 can change the pin level of the processing module 212 through the working signal when the switch module 215 is in the closed state, and the electronic assembly 21 can be controlled to be in the working mode.

[0158] In some examples, referring to FIG. 11B, when the processing module 212 is powered on, the processing module 212 can be configured to make the power module 213 in the lock mode to keep the processing module 212 powered on. In some examples, when the power module 213 is in the lock mode, the power module 213 can not be controlled by the controller 216. Thus, the power module 213 can be kept to supply power to the processing module 212 regardless of the state of the switch module 215.

[0159] In some examples, referring to FIG. 11D, when the processing module 212 is powered on, the processing module 212 can be configured to make the processing module 212 in the lock mode to keep the processing module 212 powered on. In some examples, when the processing module 212 is in the lock mode, the processing module 212 can not be controlled by the controller 216. Thus, the processing module 212 can be kept powered on regardless of the state of the switch module 215.

[0160] In the utility model, through setting contact 2151 on switch module 215 of electronic assembly 21, setting conducting part 111 on guide component 11, when guide component 11 and electronic assembly 21 produce relative movement, the contact condition of conducting part 111 of guide component 11 and contact 2151 of switch module 215 can be changed, thereby can make switch module 215 switch between open state and closed state;In addition, the state of switch module 215 is switched by changing the physical contact condition of conducting part 111 of guide component 11 and contact 2151 of switch module 215, the possibility of power generation leakage current can be reduced, thereby the shelf life of medical instrument 2 can be prolonged.

[0161] Although the utility model has been specifically described above in combination with the drawings and examples, it can be understood that the above description does not limit the utility model in any form. The person skilled in the art can deform and change the utility model according to the needs without deviating from the essential spirit and scope of the utility model, and these deformations and changes all fall within the scope of the utility model.

Claims

1. An applicator of a medical device for applying the medical device to a host, the applicator comprising: The medical instrument comprises a sensor and an electronic assembly, the electronic assembly comprises a power module configured to provide electric energy and a switch module configured to control the power module, the switch module comprises a plurality of contacts and has a closed state and an open state, each two of the plurality of contacts have a gap therebetween; the application device comprises a guide member configured to guide the sensor to be applied to a host at least partially, the guide member cooperates with the plurality of contacts of the switch module to switch the switch module between the closed state and the open state when the guide member moves relative to the electronic assembly.

2. The applicator of medical devices according to claim 1, characterized in that, The guide member comprises an electrically conductive member configured to conduct the plurality of contacts, wherein the switch module is in the closed state when the electrically conductive member contacts the plurality of contacts of the switch module, and the switch module is in the open state when the electrically conductive member of the guide member does not contact the plurality of contacts of the switch module.

3. The applicator of claim 2, wherein the at least one of the plurality of arms is configured to be moved from the first position to the second position by a user. The guide member further comprises a support seat configured to hold a sharp, and the sharp is configured to accommodate the sensor at least partially, and the electrically conductive member is arranged on the sharp and abuts against the support seat.

4. The applicator of claim 2, wherein the at least one of the plurality of arms is configured to be moved from the first position to the second position by a user. The guide member further comprises a sharp configured to accommodate the sensor at least partially, and the sharp and the electrically conductive member are integrally formed.

5. The applicator of claim 2, wherein the at least one of the plurality of arms is configured to be moved from the first position to the second position by a user. Each of the contacts has a groove configured to accommodate the electrically conductive member, and the profile of the groove matches the profile of the part of the electrically conductive member that contacts the contact.

6. The applicator of medical devices according to claim 5, characterized in that, The electrically conductive member is in the shape of a sheet.

7. The applicator of medical devices according to claim 1, characterized in that, The electronic assembly has a mounting position configured to allow the guide member to pass through and be mounted on the electronic assembly, and at least part of each of the contacts is located in the mounting position.

8. The applicator of claim 2, wherein the applicator is a medical device applicator. The plurality of contacts and the electrically conductive member are arranged in the direction in which the guide member is mounted on the electronic assembly.

9. The applicator of medical devices according to any one of claims 1 to 8, characterized in that, The initial state of the switch module is the closed state to make the electronic component in an off mode, and the switch module is configured to make the electronic component in an on mode when first in the open state; or the initial state of the switch module is the open state ， to make the electronic component in an off mode, and the switch module is configured to make the electronic component in an on mode when first in the closed state.

10. The applicator of claim 9, wherein the applicator is a medical device applicator. The electronic assembly further comprises a processing module configured to process signals of the sensor and a controller. When the switch module is in the closed state, the controller is configured to control the power module to stop supplying power to the processing module, or the controller is configured to send an off signal to the processing module to make the processing module powered off, when the switch module is in the open state for the first time, the controller is configured to stop controlling the power module, or the controller is configured to stop sending the off signal to the processing module to make the processing module powered on, and the processing module is further configured to make the power module in a lock mode to keep the processing module powered on or make the processing module in a lock mode to keep the processing module powered on when the processing module is powered on. Or When the switch module is in the open state, the controller is configured to stop controlling the power module or the controller is configured to stop sending a working signal to the processing module to make the processing module power off, when the switch module is in the closed state for the first time, the controller is configured to control the power module to supply power to the processing module or the controller is configured to send the working signal to the processing module to make the processing module power on, and the processing module is further configured to make the power module in the locked mode to make the processing module keep powered on or make the processing module in the locked mode to make the processing module keep powered on when the processing module is powered on.

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