Substrate bonding device

Abstract

This substrate bonding device includes: a first chuck; a second chuck disposed beneath the first chuck; at least one actuator for shifting a first substrate retained by the first chuck and a second substrate retained by the second chuck relative to each other; a case housing the first chuck and the second chuck; a blower fan for blowing air into the case interior; and an air guide for guiding toward the first chuck, via a first ventilation port, air supplied into the case interior by the blower fan. The first ventilation port is disposed above the first chuck in such a way as to overlap the first chuck when viewed perpendicularly.

Description

Substrate bonding equipment

[0001] The present invention relates to a substrate bonding apparatus for bonding two substrates, including, for example, semiconductor wafers, substrates for FPDs (Flat Panel Displays) such as liquid crystal displays and organic electroluminescence (EL) displays, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photomasks, ceramic substrates, and substrates for solar cells.

[0002] Patent Document 1 discloses a bonding apparatus. Paragraph 0100 of Patent Document 1 states that "an airflow from air inlet 105 toward exhaust outlet 103 is formed in processing region T2 by air blower unit 106." Paragraph 0042 of Patent Document 1 states that "air inlet 105 is provided in the ceiling of processing vessel 100." Paragraph 0049 of Patent Document 1 states that "upper chuck 140 is supported by upper chuck support 150 provided above upper chuck 140. Upper chuck support 150 is provided on the ceiling surface of processing vessel 100."

[0003] JP 2015-18926 A

[0004] In the bonding apparatus described in Patent Document 1, an upper chuck is supported on an upper chuck support portion provided on the ceiling surface of a processing vessel, and air from a blower unit is supplied into the processing vessel through an air inlet provided on the ceiling of the processing vessel. This can cause air to stagnate near the upper chuck. Foreign matter such as particles tends to accumulate in the area where air is stagnant. If such foreign matter adheres to the substrates, bonding defects can occur. If foreign matter adheres to two bonded substrates, the cleanliness of the substrates decreases.

[0005] At least one embodiment of the present invention provides a substrate bonding apparatus that can reduce stagnation of air within a housing that houses a first chuck and a second chuck.

[0006] One embodiment of the present invention provides a substrate bonding device including: a first chuck that holds a first substrate; a second chuck that is positioned below the first chuck and that holds a second substrate; at least one actuator that bonds the first substrate and the second substrate by relatively moving the first substrate held by the first chuck and the second substrate held by the second chuck; a housing that houses the first chuck and the second chuck; a blower fan that sends air into the housing; and an air guide that has a first air vent positioned above the first chuck so as to overlap with the first chuck when viewed vertically, and that guides the air supplied by the blower fan into the housing via the first air vent toward the first chuck.

[0007] In the above embodiment, at least one of the following features may be added to the substrate bonding apparatus.

[0008] The substrate bonding apparatus accommodates the first chuck and the second chuck within the housing, and further includes an air flow path that guides, within the housing, air supplied into the housing by the blower fan.

[0009] The at least one actuator includes a horizontal actuator that moves the second chuck horizontally relative to the first chuck, and the second chuck is positioned within the air flow path regardless of whether the second chuck is positioned at any horizontal position.

[0010] The at least one actuator joins the first substrate held by the first chuck and the second substrate held by the second chuck while the first substrate and the second substrate are positioned within the air flow path.

[0011] The air pressure in the air flow path is higher than the air pressure in the housing excluding the air flow path.

[0012] The substrate bonding apparatus further includes a first frame supporting the first chuck, the first frame being a gate-shaped frame including a first beam portion disposed above the first chuck and two first pillar portions extending downward from the first beam portion so as to face each other horizontally through the first chuck, and the first air vent is provided in the first beam portion serving as the air guide.

[0013] The first column portion includes an exhaust port for discharging air between the two first column portions, and the exhaust port opens at a position on the surface of the first column portion below the first chuck.

[0014] The substrate joining device further includes a frame cover extending vertically outside the first frame along the space between the two first pillar portions, and a supply duct that guides air supplied into the housing by the blower fan to the first air vent and the space within the frame cover.

[0015] The substrate bonding apparatus further includes a base disposed below the second chuck, and a base cover that guides air discharged from the space within the first frame and air discharged from the space within the frame cover along the upper surface of the base.

[0016] The at least one actuator includes a horizontal actuator that moves the second chuck horizontally relative to the first chuck between a position within the first frame and a position between the base and the base cover.

[0017] The at least one actuator includes an inversion actuator that inverts the first chuck between an upward position in which the first substrate held by the first chuck faces upward and a downward position in which the first substrate held by the first chuck faces downward, and the first air vent overlaps the first chuck when viewed vertically whether the first chuck is in the upward position or the downward position.

[0018] 7 is a schematic diagram showing an example of the appearance of two substrates before and after bonding. FIG. 8 is a schematic diagram showing an example of cross sections of two substrates before and after bonding. FIG. 9 is a process diagram for explaining a substrate bonding method according to an embodiment of the present invention. FIG. 10 is a schematic plan view of a substrate bonding apparatus according to an embodiment of the present invention. FIG. 11 is a schematic diagram of a bonding unit provided in the substrate bonding apparatus, viewed horizontally. FIG. 12 is a schematic diagram of the bonding unit, viewed vertically from above. FIG. 13 is a schematic diagram of a portion of the bonding unit including a first chuck, viewed horizontally from the rear. FIG. 14 is a schematic diagram showing a horizontal cross section of the bonding unit taken along line VII-VII shown in FIG. 6. FIG. 15 is a schematic diagram of a portion of the bonding unit including a second chuck, viewed horizontally from the rear. FIG. 16 is a schematic diagram of a portion of the bonding unit including the second chuck, viewed vertically from above. FIG. 17 is a schematic diagram for explaining an example of a procedure for bonding a first substrate and a second substrate using a bonding unit. FIG. 18 is a schematic diagram for explaining an example of a procedure for bonding a first substrate and a second substrate using a bonding unit. FIG. 19 is a conceptual diagram for explaining air flow within a housing. FIG. 19 is a schematic diagram of the bonding unit, viewed horizontally from the side. FIG. 19 is a schematic diagram of the bonding unit, viewed vertically from above. FIG. 1 is a schematic diagram of a joint unit viewed horizontally from the front; FIG. 2 is a schematic diagram of a joint unit viewed horizontally from the rear; FIG. 3 is a schematic diagram of a supply duct viewed vertically from above; FIG. 4 is a schematic diagram of a supply duct viewed vertically from below; FIG. 5 is an external view and a cross-sectional view of a collective exhaust box; FIG. 6 is a schematic diagram of a first frame and a second frame viewed vertically from above; and FIG. 7 is a schematic diagram showing a cross section of the first frame cut along a vertical plane passing through the first air vent and the exhaust port.

[0019] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0020] In the following description, a bonded substrate W refers to two bonded substrates W, a pre-bonded substrate W refers to one substrate W before being bonded, and a bonded substrate W refers to one substrate W after being bonded. Bonding is synonymous with bonding. A first substrate W1 refers to a pre-bonded substrate W. A second substrate W2 refers to another pre-bonded substrate W. The bonded first substrate W1 and second substrate W2 refer to a bonded substrate W. The two bonded substrates W also refer to a bonded substrate W. When it does not matter whether it is a bonded substrate W, a pre-bonded substrate W, or a bonded substrate W, it will simply be referred to as a substrate W.

[0021] FIG. 1A is a schematic diagram showing an example of the appearance of two substrates W before and after bonding. FIG. 1B is a schematic diagram showing an example of the cross-sections of two substrates W before and after bonding. As shown in FIG. 1A, the first substrate W1 and the second substrate W2 are flat circular plates with the same diameter. The diameters of the first substrate W1 and the second substrate W2 may be 300 mm or other values. The first substrate W1 includes a circular substrate WD1, and the second substrate W2 includes a circular substrate WD2. The substrate WD1 and the substrate WD2 are made of a semiconductor such as single crystal silicon. The substrate WD1 and the substrate WD2 may also be made of a material other than a semiconductor.

[0022] Both the substrate WD1 and the substrate WD2 include a circular front surface and a back surface that are parallel to each other, and an annular end surface that connects the outer edges of the front surface and the back surface. The front surface and the back surface of the substrate WD1 are two flat surfaces that are parallel to each other. The front surface and the back surface of the substrate WD2 are similar. The front surfaces of the substrate WD1 and the substrate WD2 are device formation surfaces on which devices such as transistors are formed. The back surfaces of the substrate WD1 and the substrate WD2 are non-device formation surfaces on which devices are not formed. Both the front surface and the back surface of the substrate WD1 or the substrate WD2 may be device formation surfaces.

[0023] The outer periphery of the substrate WD1 forms a V-shaped notch that opens at the end face of the substrate WD1 when the substrate WD1 is viewed in a direction perpendicular to the surface of the substrate WD1. The outer periphery of the substrate WD1 may form an orientation flat (so-called orientation flat) instead of a notch. The notch and orientation flat indicate the crystal orientation of the substrate WD1 or the substrate WD2. The first substrate W1 is positioned in the circumferential direction of the first substrate W1 based on the notch or orientation flat of the first substrate W1. The same applies to the second substrate W2.

[0024] 1B , the first substrate W1 includes a device layer WC1 covering the surface of the base material WD1 and a bonding layer WB1 covering the surface of the device layer WC1. The second substrate W2 includes a device layer WC2 covering the surface of the base material WD2 and a bonding layer WB2 covering the surface of the device layer WC2. Devices such as transistors are disposed on the device layers WC1 and WC2. The devices are covered with the bonding layers WB1 and WB2.

[0025] The bonding layer WB1 of the first substrate W1 may be a transparent or semi-transparent insulating layer. The same applies to the bonding layer WB2 of the second substrate W2. The bonding layers WB1 and WB2 may be silicon oxide films or thin films of materials other than silicon oxide. In the former case, the bonding layers WB1 and WB2 may be silicon oxide films made using TEOS (tetraethoxysilane). The bonding layer WB1 may be made of a single material or multiple materials. In the latter case, the metal and insulating material may be exposed on the surface of the bonding layer WB1. The same applies to the bonding layer WB2.

[0026] The surface of the bonding layer WB1 of the first substrate W1 is the bonding surface WA1 of the first substrate W1. The surface of the base material WD1 of the first substrate W1 opposite the device layer WC1 is the non-bonding surface WE1 of the first substrate W1. The bonding surface WA1 and non-bonding surface WE1 of the first substrate W1 are two parallel planes that are in contact with the atmosphere of the space in which the first substrate W1 is disposed. The surface of the bonding layer WB2 of the second substrate W2 is the bonding surface WA2 of the second substrate W2. The surface of the base material WD2 of the second substrate W2 opposite the device layer WC2 is the non-bonding surface WE2 of the second substrate W2. The bonding surface WA2 and non-bonding surface WE2 of the second substrate W2 are two parallel planes that are in contact with the atmosphere of the space in which the second substrate W2 is disposed. The first substrate W1 and the second substrate W2 are bonded together such that the bonding surface WA1 of the first substrate W1 and the bonding surface WA2 of the second substrate W2 face each other.

[0027] 2 is a process diagram illustrating a substrate bonding method according to one embodiment of the present invention. When bonding a first substrate W1 and a second substrate W2, an activation step (step S1 in FIG. 2) is performed to activate the bonding surface WA1 of the first substrate W1 and the bonding surface WA2 of the second substrate W2, followed by a cleaning step (step S2 in FIG. 2) to clean and dry the two activated substrates W. This is followed by an inversion step (step S3 in FIG. 2) to invert one of the first substrate W1 and the second substrate W2.

[0028] After one of the first substrate W1 and the second substrate W2 has been inverted, an alignment confirmation process (step S4 in Figure 2) is performed to confirm the alignment that represents the relative position and angle of the first substrate W1 and the second substrate W2, an alignment adjustment process (step S5 in Figure 2) is performed to adjust the alignment of the first substrate W1 and the second substrate W2 based on the confirmed alignment, and a substrate contact process (step S6 in Figure 2) is performed to bond the first substrate W1 and the second substrate W2 by bringing them into contact with each other after the alignment has been adjusted.

[0029] The activation step may be a plasma treatment in which plasma such as oxygen plasma is applied to the bonding surface WA1 of the first substrate W1 and the bonding surface WA2 of the second substrate W2. In this case, moisture in the air or moisture supplied to the substrate W during the cleaning step comes into contact with the bonding surface WA1 of the first substrate W1 and the bonding surface WA2 of the second substrate W2 that have been irradiated with the plasma, forming hydrophilic groups such as hydroxyl groups (OH groups) on the bonding surface WA1 of the first substrate W1 and the bonding surface WA2 of the second substrate W2. The plasma treatment is an example of surface modification that modifies the surface of the substrate W. The activation step may also be a wet treatment in which a hydrophilizing liquid that forms hydrophilic groups is supplied to the bonding surface WA1 of the first substrate W1 and the bonding surface WA2 of the second substrate W2.

[0030] The substrate contacting step may be a step of directly bonding two substrates W in the atmosphere at room temperature (e.g., 20 to 30°C). The substrate contacting step may be a step of performing face-to-face bonding in which the two substrates W are bonded together so that their surfaces face each other. In this case, the surfaces of the two substrates W correspond to the bonding surface WA1 of the first substrate W1 and the bonding surface WA2 of the second substrate W2. The substrate contacting step may be a step of bonding two substrates W together without pressing one of the two substrates W against the other of the two substrates W, or by pressing one of the two substrates W against the other of the two substrates W with a pressure that does not damage devices formed on the two substrates W.

[0031] 1B shows a cross section of the first substrate W1 and the second substrate W2 cut along a plane perpendicular to the first substrate W1 and the second substrate W2. The ratio of the thickness of the device layer WC1 and the device layer WC2 to the thickness of the bonding layer WB1 and the bonding layer WB2 shown in FIG. 1B is not necessarily the same as the actual ratio. FIG. 1B shows an example in which hydroxyl groups, which are an example of hydrophilic groups, are formed on the bonding surface WA1 of the first substrate W1 and the bonding surface WA2 of the second substrate W2 before bonding. In this example, oxygen atoms (O) in the hydroxyl groups are bonded to silicon atoms (Si) in the bonding layers WB1 and WB2.

[0032] Before bonding, the bonding surface WA1 of the first substrate W1 and the bonding surface WA2 of the second substrate W2 are terminated with multiple hydroxyl groups. When the bonding surface WA1 of the first substrate W1 and the bonding surface WA2 of the second substrate W2 are brought into contact, the first substrate W1 and the second substrate W2 are bonded together due to the intermolecular force acting between the two hydroxyl groups. In some cases, water molecules are released from the two hydroxyl groups, and silicon atoms in the bonding layer WB1 of the first substrate W1 and silicon atoms in the bonding layer WB2 of the second substrate W2 are bonded together via oxygen atoms. In this manner, the first substrate W1 and the second substrate W2 are bonded together.

[0033] Next, the substrate bonding apparatus 1 that bonds two substrates W as described above will be described.

[0034] Figure 3 is a schematic plan view of a substrate bonding apparatus 1 according to one embodiment of the present invention. In the description of Figure 3, the up-down direction, left-right direction, and front-rear direction refer to the up-down direction, left-right direction, and front-rear direction of the substrate bonding apparatus 1 unless otherwise specified. The up-down direction is the vertical direction. The left-right direction and the front-rear direction are two horizontal directions that are perpendicular to each other. The left-right direction is the arrangement direction of multiple carriers CA held on multiple load ports LP. Each carrier CA is held on the load port LP with the opening of the carrier CA facing rearward.

[0035] The substrate bonding apparatus 1 is an apparatus for bonding two disk-shaped substrates W, such as semiconductor wafers. The substrate bonding apparatus 1 includes a plurality of load ports LP, each of which has a carrier CA, such as a FOUP (Front-Opening Unified Pod), placed thereon, for accommodating a plurality of substrates W, a plurality of processing units 2 for processing the substrates W transferred from the plurality of load ports LP, a transfer system TS for transferring the substrates W between the plurality of load ports LP and the plurality of processing units 2, and an outer wall 1a forming an enclosed space accommodating the plurality of processing units 2 and the transfer system TS. The substrate bonding apparatus 1 further includes a control device 3 for controlling the substrate bonding apparatus 1.

[0036] 3 shows an example in which three load ports LP are provided. The three load ports LP include a first load port LP1 on which a carrier CA accommodating a first substrate W1 is placed, a second load port LP2 on which a carrier CA accommodating a second substrate W2 is placed, and a third load port LP3 on which a carrier CA accommodating the bonded first and second substrates W1 and W2 is placed. The first load port LP1 and the second load port LP2 are load ports on which carriers CA accommodating substrates W to be bonded in the substrate bonding apparatus 1 are placed. The third load port LP3 is an unload port on which a carrier CA accommodating two substrates W bonded in the substrate bonding apparatus 1 is placed.

[0037] The processing units 2 include a pre-activation aligner 2 a, an activation unit 2 b, a pre-bonding cleaning unit 2 c, a pre-bonding aligner 2 d, and a bonding unit 2 e. Fig. 3 shows an example in which two of each of the pre-activation aligner 2 a, activation unit 2 b, pre-bonding cleaning unit 2 c, and pre-bonding aligner 2 d are provided. Unless otherwise specified, the bonding unit 2 e described in this specification bonds substrates W under atmospheric pressure.

[0038] The pre-activation aligner 2a is a unit that positions the substrate W in the circumferential direction of the substrate W based on the notch or orientation flat. The same applies to the pre-bonding aligner 2d. The activation unit 2b is a unit that performs plasma treatment to activate the front or back surface of the substrate W by bringing plasma into contact with the front or back surface of the substrate W. The pre-bonding cleaning unit 2c is a unit that cleans the substrate W by supplying a cleaning liquid to the substrate W. The bonding unit 2e is a unit that bonds two substrates W by bringing them into contact with each other.

[0039] The transport system TS transports substrates W from the first load port LP1 and the second load port LP2 to the plurality of processing units 2, and transports substrates W from the plurality of processing units 2 to the third load port LP3. The transport system TS further transports substrates W between the plurality of processing units 2. The transport system TS may include at least one transport robot TR that transports one or more substrates W in a horizontal position on a transport path TP indicated by a thick line in Figure 3.

[0040] The transport robot TR includes at least one hand TH that holds one substrate W in a horizontal position. The hand TH may be a grip-type, vacuum-type, electrostatic-type, or Bernoulli-type hand, or may be a hand of another type. The transport robot TR moves along the transport path TP while holding the substrate W horizontally with the hand TH. Figure 3 shows an example in which the transport path TP extends from each of the first load port LP1 and the second load port LP2 to a plurality of processing units 2, and returns from the plurality of processing units 2 to the third load port LP3.

[0041] The control device 3 controls the electrical and electronic devices provided in the substrate bonding apparatus 1. The control device 3 includes a CPU (central processing unit) 3a that processes information such as executing programs, and a memory 3b that stores information such as programs to be executed by the CPU 3a. The control device 3 controls the substrate bonding apparatus 1 to transport and process the substrates W as described below. In other words, the control device 3 is programmed to transport and process the substrates W as described below.

[0042] Next, the joining unit 2e will be described.

[0043] FIG. 4 is a schematic diagram of a bonding unit 2e provided in the substrate bonding apparatus 1, viewed horizontally. FIG. 5 is a schematic diagram of the bonding unit 2e viewed vertically from above. FIG. 6 is a schematic diagram of a portion of the bonding unit 2e including the first chuck 11, viewed horizontally from the rear. FIG. 7 is a schematic diagram showing a horizontal cross section of the bonding unit 2e taken along line VII-VII shown in FIG. 6. FIG. 8 is a schematic diagram of a portion of the bonding unit 2e including the second chuck 21, viewed horizontally from the rear. FIG. 9 is a schematic diagram of a portion of the bonding unit 2e including the second chuck 21, viewed vertically from above. FIGS. 10 and 11 are schematic diagrams for explaining an example of a procedure for bonding the first substrate W1 and the second substrate W2 using the bonding unit 2e. The second camera 32, the inspection camera 33, and the bracket 34 are not shown in FIG. 5.

[0044] X, Y, and Z shown in Figures 4 to 11 represent the X direction, Y direction, and Z direction. In the following description, the X direction and Y direction are horizontal directions that are perpendicular to each other, and the Z direction is a vertical direction that is perpendicular to the X direction and Y direction. The X direction, Y direction, and Z direction correspond to the front-to-back, left-to-right, and up-to-down directions of the joint unit 2e, respectively. The positive sides of the X direction, Y direction, and Z direction correspond to the front, right, and up directions of the joint unit 2e, respectively. The up-to-down direction is the vertical direction. The content of this paragraph also applies to Figure 12 and subsequent figures.

[0045] 4, the bonding unit 2e includes a housing 6 that houses the first substrate W1 and the second substrate W2, a first chuck 11 that holds the first substrate W1 horizontally within the housing 6, and a second chuck 21 that holds the second substrate W2 horizontally within the housing 6. As will be described later, the first chuck 11 is turned upside down. FIGS. 4 to 9 show a state in which the first chuck 11 faces upward.

[0046] The housing 6 includes a partition wall 8 that forms at least one passage opening through which the substrate W passes and an internal space in which the substrate W that has passed through the at least one passage opening is placed, and at least one door 7 that opens and closes the at least one passage opening. Figure 4 shows an example in which two passage openings (a first passage opening 6a and a second passage opening 6b) and two doors 7 are provided. The door 7 is closed except when the first substrate W1 and the second substrate W2 are being inserted into or removed from the housing 6 through the passage openings.

[0047] The housing 6 includes a cylindrical peripheral wall 8p extending vertically and an upper wall 8u closing the upper end of the peripheral wall 8p. FIG. 4 shows an example in which the housing 6 is a rectangular parallelepiped. In this case, the peripheral wall 8p includes a front wall 8f and a rear wall 8r that face each other from the front to the rear with a gap between them. The first passage opening 6a and the second passage opening 6b open on the front surface of the housing 6 (in front of the front wall 8f). FIG. 4 shows an example in which the first passage opening 6a and the second passage opening 6b are arranged vertically on the front surface of the housing 6 such that the first passage opening 6a is located above the second passage opening 6b. In this example, the first substrate W1 is loaded into the housing 6 through the first passage opening 6a, the second substrate W2 is loaded into the housing 6 through the second passage opening 6b, and the joined first and second substrates W1 and W2 are unloaded from the housing 6 through the second passage opening 6b.

[0048] The first chuck 11 is a chuck that holds the first substrate W1 without contacting the bonding surface WA1 of the first substrate W1. The second chuck 21 is a chuck that holds the second substrate W2 without contacting the bonding surface WA2 of the second substrate W2. The first substrate W1 is held by the first chuck 11 so that the center of the first substrate W1 coincides with the center of the first chuck 11. The second substrate W2 is held by the second chuck 21 so that the center of the second substrate W2 coincides with the center of the second chuck 21. The first chuck 11 and the second chuck 21 are vacuum chucks that hold the substrate W by suction force generated by gas attraction or electrostatic chucks that hold the substrate W by electrical suction force. The first chuck 11 and the second chuck 21 may be chucks other than these.

[0049] The joining unit 2e includes at least one actuator AC that moves the first chuck 11 and the second chuck 21 relative to each other. An actuator is a device that converts driving energy, such as electrical, fluid, magnetic, thermal, or chemical energy, into mechanical work, i.e., the movement of a tangible object. Actuators include electric motors (rotary motors), linear motors, air cylinders, and other devices.

[0050] As shown in Fig. 6, the at least one actuator AC includes a first rotation actuator AA, an inversion actuator AI, and a Z actuator AZ. As shown in Fig. 7, the at least one actuator AC further includes a second rotation actuator AB, a Y actuator AY, and an X actuator AX.

[0051] The X actuator AX is an actuator that moves at least one of the first chuck 11 and the second chuck 21 in the front-rear direction, thereby relatively moving the first chuck 11 and the second chuck 21 in the front-rear direction. The Y actuator AY is an actuator that moves at least one of the first chuck 11 and the second chuck 21 in the left-right direction, thereby relatively moving the first chuck 11 and the second chuck 21 in the left-right direction. The Z actuator AZ is an actuator that moves at least one of the first chuck 11 and the second chuck 21 in the up-down direction, thereby relatively moving the first chuck 11 and the second chuck 21 in the up-down direction.

[0052] The first rotation actuator AA is an actuator that rotates the first chuck 11 around the center of the first chuck 11. The second rotation actuator AB is an actuator that rotates the second chuck 21 around the center of the second chuck 21. The reversal actuator AI is an actuator that rotates one of the first chuck 11 and the second chuck 21 by 180 degrees around a horizontal straight line.

[0053] 4 to 11 show an example in which the X actuator AX moves the second chuck 21 in the front-to-rear direction, the Y actuator AY moves the second chuck 21 in the left-to-right direction, and the Z actuator AZ moves the first chuck 11 in the up-and-down direction. In this example, the inversion actuator AI rotates the first chuck 11 180 degrees around a horizontal line. The X actuator AX is an example of a horizontal actuator. The Y actuator AY is another example of a horizontal actuator.

[0054] 5 shows an example in which the first chuck 11 is supported on the pedestal 10 via a first stage 12, two support bases 13, and a first frame 15, and the second chuck 21 is supported on the pedestal 10 via a Y-stage 22 and an X-stage 23. The bonding unit 2e may further include a vibration isolation table 9 that reduces vibration of the pedestal 10. The vibration isolation table 9 is disposed between the floor of the clean room and the pedestal 10. The vibration isolation table 9 may include a vibration sensor that detects vibration of at least one of the floor of the clean room and the pedestal 10, and a vibration isolation actuator that reduces vibration of the pedestal 10 by moving the pedestal 10 based on the detection value of the vibration sensor.

[0055] 6 , the first chuck 11 is supported by the first stage 12 via a first rotation actuator AA. The first rotation actuator AA rotates the first chuck 11 relative to the first stage 12. The first stage 12 is supported by a first frame 15 via an inversion actuator AI, a support base 13, and a Z actuator AZ. The first frame 15 is fixed to the base 10.

[0056] When the Z actuator AZ translates the first stage 12 in the vertical direction relative to the first frame 15, the first chuck 11, first rotation actuator AA, inversion actuator AI, and support base 13 also translate in the vertical direction relative to the first frame 15. When the inversion actuator AI rotates the first stage 12 relative to the first frame 15 around a horizontal rotation center RC extending in the left-right direction, the first chuck 11 and first rotation actuator AA also rotate around the rotation center RC relative to the first frame 15.

[0057] The first frame 15 is a gate-shaped frame including a first beam 16 and two first pillars 17. The two first pillars 17 extend upward from the base 10, facing each other in the left-right direction. The first beam 16 spans the two first pillars 17, extending in the left-right direction. The first chuck 11, the first rotation actuator AA, the first stage 12, the reversal actuator AI, and the support base 13 are disposed between the two first pillars 17. The first chuck 11 is disposed above the first stage 12 in an upward orientation. When the reversal actuator AI reverses the first stage 12, the first chuck 11 is disposed below the first stage 12 in a downward orientation (see FIG. 11 ). The first chuck 11 is disposed within the first frame 15, whether the first chuck 11 is in the upward orientation or the downward orientation.

[0058] The reversing actuator AI may include two electric motors arranged on both the left and right sides of the first stage 12. In this case, the Z actuator AZ may include two electric motors. The rotation of the two electric motors of the Z actuator AZ may be converted into vertical translation of the two support bases 13 by two sets of ball screws 14s and ball nuts 14n. As shown in FIGS. 6 and 7 , the two sets of ball screws 14s and ball nuts 14n are arranged along the inner surfaces (inner surfaces in the left-right direction) of the two first pillar portions 17. The support bases 13 are supported by the first frame 15 via linear guides LM that guide the support bases 13 in the vertical direction. When the two support bases 13 translate vertically relative to the first frame 15, the first chuck 11, the first rotation actuator AA, the first stage 12, and the reversing actuator AI also translate vertically relative to the first frame 15.

[0059] 8 and 9, the second chuck 21 is disposed on the Y stage 22. The second rotation actuator AB is disposed between the second chuck 21 and the Y stage 22. The second rotation actuator AB rotates the second chuck 21 relative to the Y stage 22. The Y stage 22 is disposed on the X stage 23. The X stage 23 is disposed on the pedestal 10. The Y stage 22 is supported by the X stage 23 via a linear guide LM that guides the Y stage 22 in the left-right direction. The X stage 23 is supported by the pedestal 10 via a linear guide LM that guides the X stage 23 in the front-rear direction.

[0060] The Y stage 22 and the X stage 23 are an example of a second stage that supports the second chuck 21. When the Y actuator AY translates the Y stage 22 in the left-right direction relative to the X stage 23, the second chuck 21 and the second rotation actuator AB also translate in the left-right direction relative to the X stage 23. When the X actuator AX translates the X stage 23 in the front-rear direction relative to the pedestal 10, the second chuck 21, the second rotation actuator AB, and the Y stage 22 also translate in the front-rear direction relative to the pedestal 10.

[0061] 8 and 9, the bonding unit 2e includes a first camera 31 that detects the position and angle of the first substrate W1 held by the first chuck 11, a second camera 32 that detects the position and angle of the second substrate W2 held by the second chuck 21, and an inspection camera 33 that detects the relative position and angle of the bonded first substrate W1 and second substrate W2. As shown in Figures 6 and 7, the bonding unit 2e further includes an alignment camera 30 that detects the relative position and angle of the first substrate W1 and second substrate W2 before they are bonded.

[0062] The inspection camera 33 is an infrared camera that generates still images or videos by converting infrared rays into electrical signals. The inspection camera 33 may also serve as at least one of the first camera 31, the second camera 32, and the alignment camera 30, or may be a separate camera. FIGS. 6 to 9 show an example of the latter. The first camera 31 may be an infrared camera or a visible light camera that generates still images or videos by converting visible light into electrical signals. In the latter case, the first camera 31 may include multiple visible light cameras with different fields of view. The same applies to the second camera 32 and the alignment camera 30. FIGS. 6 to 9 show an example in which the first camera 31, the second camera 32, and the alignment camera 30 each include two visible light cameras with different fields of view.

[0063] If the first camera 31 is a visible light camera, the first camera 31 may check the alignment of the first substrate W1 by photographing a transparent first mark display plate 38a (see FIGS. 6 and 7) on which first reference marks are marked, in addition to the first substrate W1. Similarly, if the second camera 32 is a visible light camera, the second camera 32 may check the alignment of the second substrate W2 by photographing a second mark display plate 38b (see FIGS. 8 and 9) on which second reference marks are marked, in addition to the second substrate W2.

[0064] 6 to 9 show an example in which the first mark display plate 38a is attached to the first stage 12 and the second mark display plate 38b is attached to the Y stage 22. When the first stage 12 moves relative to the base 10, the first chuck 11 and the first mark display plate 38a move in the same direction and by the same amount as the first stage 12. The same applies when the Y stage 22 moves relative to the base 10.

[0065] The alignment camera 30 photographs the transparent first mark display plate 38a through a through-hole that passes vertically through the first stage 12. When the alignment camera 30 photographs both the first mark display plate 38a and the second mark display plate 38b simultaneously, the relative positions and angles of the first mark display plate 38a and the second mark display plate 38b can be determined. When the first camera 31 photographs the first substrate W1 held in the first chuck 11 and the first mark display plate 38a, the position and angle of the first substrate W1 relative to the first mark display plate 38a can be determined. Similarly, when the second camera 32 photographs the second substrate W2 held in the second chuck 21 and the second mark display plate 38b, the position and angle of the second substrate W2 relative to the second mark display plate 38b can be determined.

[0066] Therefore, the relative positions and angles of the first substrate W1 and the second substrate W2 can be indirectly determined by taking images with the first camera 31, the second camera 32, and the alignment camera 30. By adjusting the relative positions and angles of the first mark display plate 38a and the second mark display plate 38b while taking images of them with the alignment camera 30, it is possible to adjust the alignment of the first substrate W1 and the second substrate W2 before they are bonded.

[0067] As shown in Figures 6 and 7, the alignment camera 30 is attached to the first stage 12. The alignment camera 30 moves parallel to the up and down direction together with the first stage 12. The alignment camera 30 also rotates around the center of rotation RC together with the first stage 12. As shown in Figures 8 and 9, the first camera 31 is attached to the Y stage 22 with the lens facing the subject facing upward. The first camera 31 moves horizontally in the front-to-back and left-to-right directions relative to the base 10 together with the Y stage 22.

[0068] The second camera 32 is attached to the bracket 34 with the lens facing the subject facing downward. The inspection camera 33 is also attached to the bracket 34 with the lens facing the subject facing downward. The bracket 34 is supported by the base 10 via a second frame 35. The second frame 35 is fixed to the base 10. Therefore, the second camera 32 and the inspection camera 33 are also fixed to the base 10.

[0069] As shown in FIG. 8 , the second frame 35 is a gate-shaped frame including a second beam 36 and two second pillars 37. The two second pillars 37 extend upward from the base 10 so as to face each other in the left-right direction. The second beam 36 spans the two second pillars 37 while extending in the left-right direction. The bracket 34 is attached to the second beam 36. As shown in FIGS. 10 and 11 , the second frame 35 is disposed behind the first frame 15. FIGS. 10 and 11 show an example in which the two second pillars 37 of the second frame 35 are in contact with the two first pillars 17 of the first frame 15. The upper surface of the second beam 36, which corresponds to the upper surface of the second frame 35, is disposed lower than the lower surface of the first beam 16.

[0070] The X actuator AX moves the second chuck 21 to a plurality of positions including a delivery position, a photographing position, and an alignment adjustment position. Fig. 10 shows an example in which the second chuck 21 is positioned at the photographing position (position on the right side of the drawing) and the alignment adjustment position (position on the left side of the drawing).

[0071] The transfer position is a position where the second substrate W2 is placed on the second chuck 21, or where the bonded first and second substrates W1 and W2 are removed from the second chuck 21. The photographing position is a position where the second camera 32 photographs the second substrate W2 held on the second chuck 21, or where the inspection camera 33 photographs the first and second substrates W1 and W2 held on the second chuck 21. The alignment adjustment position is a position where the alignment between the first substrate W1 held on the first chuck 11 and the second substrate W2 held on the second chuck 21 is adjusted. The alignment adjustment position is also a bonding position where the first and second substrates W1 and W2 are bonded. The alignment adjustment position is a range that extends in at least one of the front-to-rear and left-to-right directions. The same applies to the photographing position. The transfer position and the alignment adjustment position are positions within the first frame 15. The photographing position may be a position within the first frame 15 or a position where at least a portion of the second chuck 21 is disposed within the first frame 15 .

[0072] Next, an example of a procedure for bonding the first substrate W1 and the second substrate W2 will be described.

[0073] When the first substrate W1 and the second substrate W2 are bonded by the bonding unit 2e, the first substrate W1 is carried into the housing 6 through the first passage opening 6a (see FIG. 4) and placed on the first chuck 11, which is in an upward position and located within the first frame 15. The first chuck 11 is then inverted within the first frame 15. This changes the position of the first chuck 11 to a downward position, with the first substrate W1 facing downward. The first camera 31 is then moved toward the first chuck 11 by the X actuator AX, and an image of the first substrate W1 and the first mark display plate 38a held by the first chuck 11 is taken by the first camera 31.

[0074] Meanwhile, the second substrate W2 is carried into the housing 6 through the second passage opening 6b (see FIG. 4), and the second substrate W2 is placed on the second chuck 21 located in the first frame 15. Thereafter, the second chuck 21 is moved toward the second camera 32 by the X actuator AX, and the second substrate W2 and the second mark display plate 38b held by the second chuck 21 are photographed by the second camera 32. The second substrate W2 may be carried in simultaneously with the carrying in of the first substrate W1, or may be carried in before or after that carrying in.

[0075] After the first camera 31 and the second camera 32 have taken their images, the second chuck 21 is moved horizontally by the X actuator AX to a position where the first mark display plate 38a and the second mark display plate 38b are spaced apart and vertically opposed to each other, as shown in FIG. 10 . Then, while the alignment camera 30 is capturing images of the first mark display plate 38a and the second mark display plate 38b, the second chuck 21 is moved horizontally by at least one of the X actuator AX and the Y actuator AY. This adjusts the alignment of the first substrate W1 and the second substrate W2. Then, as shown in FIG. 11 , the first chuck 11 is lowered by the Z actuator AZ, bringing the first substrate W1 into contact with the second substrate W2. This bonds the first substrate W1 and the second substrate W2.

[0076] After the first substrate W1 and the second substrate W2 are bonded, the first chuck 11 is raised by the Z actuator AZ while the first chuck 11 releases its hold on the first substrate W1. This causes the first chuck 11 to move upward away from the first substrate W1. The second chuck 21 is then moved toward the inspection camera 33 by the X actuator AX, and the first substrate W1 and the second substrate W2 held by the second chuck 21 are photographed by the inspection camera 33. This confirms the alignment of the bonded first substrate W1 and second substrate W2. The second chuck 21 is then moved toward the second passage opening 6b by the X actuator AX, and the bonded first substrate W1 and second substrate W2 are carried out of the housing 6 through the second passage opening 6b.

[0077] Next, the air flow inside the housing 6 will be described.

[0078] Fig. 12 is a conceptual diagram for explaining the flow of air inside the housing 6. As shown in Fig. 12, the joining unit 2e includes an FFU (fan filter unit) 43 that supplies air into the housing 6, and an air flow path 50 that guides the air supplied by the FFU 43 inside the housing 6. In Fig. 12, the air flow path 50 is indicated by a thick line.

[0079] The FFU 43 includes a housing 44 having an intake port 43i and an exhaust port 43o, a blower fan 46 that draws air into the intake port 43i and discharges the air sucked into the intake port 43i from the exhaust port 43o, an electric motor 47 that rotates the blower fan 46, and an air filter 45 that removes foreign matter from the air at any position on the path along which the air passes from the intake port 43i to the exhaust port 43o.

[0080] The blower fan 46 and the electric motor 47 are disposed within the housing 44. The air filter 45 is attached to the housing 44. The air filter 45 may be disposed both upstream and downstream of the blower fan 46, or may be disposed only upstream or downstream of the blower fan 46. In either case, the FFU 43 sends clean air (air filtered by the air filter 45) downward from the discharge port 43o.

[0081] The FFU 43 is disposed above the housing 6. The FFU 43 is attached to the housing 6. The FFU 43 is supported by the housing 6. The discharge port 43o of the FFU 43 is disposed above an opening provided in the ceiling surface (the lower surface of the upper wall 8u) of the housing 6. The clean air flowing downward from the discharge port 43o enters the housing 6 through the opening in the ceiling surface of the housing 6. The FFU 43 continues to send clean air downward from the discharge port 43o at least while the substrate W is inside the housing 6. Therefore, a downward flow of clean air continues to be formed inside the housing 6 at least while the substrate W is inside the housing 6. Hereinafter, the clean air may be simply referred to as air.

[0082] The FFU 43 may further include at least one of an air heater that heats the air sent into the housing 6 by the blower fan 46, an air cooler that cools the air, a dehumidifier that reduces the humidity of the air, and a humidifier that increases the humidity of the air. Alternatively, an external device including at least one of the air heater, air cooler, dehumidifier, and humidifier may supply the air to be sent into the housing 6 by the blower fan 46 to the FFU 43. One or more of the air heater, air cooler, dehumidifier, and humidifier may be provided in the FFU 43, and the remaining may be provided in an external device. FIG. 12 shows an example in which an air conditioning unit 41 including an air heater and an air cooler is connected to the FFU 43 via an air duct 42. Air in the clean room is supplied to the FFU 43 via the air conditioning unit 41 and the air duct 42.

[0083] The air flow path 50 guides the air supplied into the housing 6 by the FFU 43 toward the first chuck 11 and the second chuck 21. In other words, the air flow path 50 accommodates the first chuck 11 and the second chuck 21. When the first chuck 11 is operable relative to the housing 6, air from the FFU 43 is supplied to the first chuck 11 by the air flow path 50 regardless of the position of the first chuck 11. The same applies to the second chuck 21.

[0084] The air flow path 50 includes an inlet 50i through which air supplied by the FFU 43 enters, an outlet 50o through which the air that has flowed into the inlet 50i is discharged, and an air path through which the air flowing from the inlet 50i to the outlet 50o passes. Fig. 12 shows an example in which one inlet 50i and one outlet 50o are provided. In this example, a supply duct 61 (described later) forms the inlet 50i, and a collective exhaust box 71 (described later) forms the outlet 50o.

[0085] The number of inlets 50i may be two or more. The same applies to the number of outlets 50o. There may be one of the inlet 50i and the outlet 50o, and two or more of the other of the inlet 50i and the outlet 50o. At least one of the inlet 50i and the outlet 50o may be located on the outer surface (outer surface) of the housing 6, or may be located inside or outside the housing 6.

[0086] The inlet 50i is disposed above the first chuck 11 and the second chuck 21. The inlet 50i is disposed above the upper ends of the first frame 15 and the second frame 35. The outlet 50o is disposed below the first chuck 11 and the second chuck 21. The outlet 50o is disposed below the lower ends of the first frame 15 and the second frame 35. The outlet 50o is disposed below the upper surface of the base 10. The outlet 50o is disposed rearward of the rear surface of the base 10.

[0087] When viewed in the vertical direction, the inlet 50i may or may not overlap the first frame 15. The same applies to the second frame 35. When viewed in the vertical direction, the inlet 50i may be positioned so that the inlet 50i overlaps one of the first frame 15 and the second frame 35 and does not overlap the other of the first frame 15 and the second frame 35. Figure 12 shows an example in which the inlet 50i overlaps both the first frame 15 and the second frame 35 when viewed in the vertical direction.

[0088] The air path of the air flow channel 50 includes a first flow path 51a that extends through the first frame 15 toward the outlet 50o. Figure 12 shows an example in which the air path includes, in addition to the first flow path 51a, a second flow path 51b and a third flow path 51c. The second flow path 51b is a flow path that extends through the second frame 35 toward the outlet 50o without passing through the first frame 15. The third flow path 51c is a flow path that extends toward the outlet 50o without passing through the first frame 15 or the second frame 35.

[0089] The first flow path 51a includes an upstream vertical flow path 52 extending downward from a position above the first frame 15 to a position within the first frame 15, a horizontal flow path 55 extending horizontally from the upstream vertical flow path 52 along the upper surface of the base 10, and a downstream vertical flow path 56 extending downward from the horizontal flow path 55 along the rear surface of the base 10. Fig. 12 shows an example in which the first flow path 51a includes, in addition to the upstream vertical flow path 52, two side flow paths 57 and a bypass flow path 58. In this example, the side flow path 57 and the bypass flow path 58 extend from the upstream vertical flow path 52 to a collecting exhaust box 71 described later.

[0090] The side flow passage 57 is a flow passage that extends from the upstream vertical flow passage 52 to a position on the right or left side of the first frame 15. The side flow passage 57 penetrates the first frame 15. The side flow passage 57 includes an exhaust port H3, which will be described later. The bypass flow passage 58 is a flow passage that extends from the upstream vertical flow passage 52 to a side opposite the outlet 50o with respect to the upstream vertical flow passage 52, and then extends toward the outlet 50o. The bypass flow passage 58 extends forward from a position below the first chuck 11 in the space within the first frame 15, without penetrating the first frame 15.

[0091] The second flow path 51b is a flow path that extends downward from a position above the upper ends of the first frame 15 and the second frame 35 to a position inside the second frame 35. The third flow path 51c is a flow path that extends downward outside the first frame 15 and the second frame 35 from a position above the upper ends of the first frame 15 and the second frame 35 to a position below the upper ends of the first frame 15 and the second frame 35. The second flow path 51b and the third flow path 51c merge into a lateral flow path 55 of the first flow path 51a. Air flowing in the second flow path 51b and the third flow path 51c enters the lateral flow path 55.

[0092] The upstream vertical flow path 52 of the first flow path 51a includes an upstream common flow path 53 extending downward from the ceiling surface of the housing 6, a first vent port H1 vertically penetrating the first beam portion 16 of the first frame 15, and a first intra-frame flow path 54 formed by the lower surface of the first beam portion 16, the inner surfaces of the two first pillar portions 17, and the upper surface of the base 10. The first vent port H1 extends downward from the upstream common flow path 53 to the first intra-frame flow path 54. The upstream common flow path 53 is a flow path formed by a supply duct 61, which will be described later. The upstream common flow path 53 is shared by the first flow path 51a, the second flow path 51b, and the third flow path 51c. The second flow path 51b and the third flow path 51c branch off from the first flow path 51a between the inlet 50i and the first vent port H1. In FIG. 12, for the sake of convenience, the first flow path 51a, the second flow path 51b, and the third flow path 51c are depicted as separate flow paths.

[0093] The second flow path 51b includes a downstream common flow path 59 extending downward from the upstream common flow path 53, a second vent hole H2 vertically penetrating the second beam portion 36 of the second frame 35, and a second in-frame flow path 60 formed by the lower surface of the second beam portion 36, the inner surfaces of the two second pillar portions 37, and the upper surface of the base 10. The second vent hole H2 extends downward from the downstream common flow path 59 to the second in-frame flow path 60. The downstream common flow path 59 is a flow path formed by a frame cover 64, which will be described later. The downstream common flow path 59 is shared by the second flow path 51b and the third flow path 51c. The third flow path 51c branches off from the second flow path 51b between the upstream common flow path 53 and the first vent hole H1. For convenience, FIG. 12 depicts the second flow path 51b and the third flow path 51c as separate flow paths.

[0094] The horizontal flow path 55 of the first flow path 51a is connected to the first in-frame flow path 54. The side flow path 57 and the bypass flow path 58 of the first flow path 51a are also connected to the first in-frame flow path 54. The horizontal flow path 55 extends rearward from the first in-frame flow path 54, and the bypass flow path 58 extends forward from the first in-frame flow path 54. The side flow path 57 extends laterally from the first in-frame flow path 54. The second in-frame flow path 60 of the second flow path 51b merges with the horizontal flow path 55 within the second frame 35. The downstream common flow path 59 of the second flow path 51b is connected to the first in-frame flow path 54. The second in-frame flow path 60 of the second flow path 51b is also connected to the first in-frame flow path 54. The second in-frame flow path 60 is disposed between the first in-frame flow path 54 and the third flow path 51c.

[0095] Next, the physical elements that make up the air flow path 50 will be described.

[0096] Hereinafter, the space between the two first pillar portions 17 may be referred to as the space within the first frame 15, and the space between the two second pillar portions 37 may be referred to as the space within the second frame 35.

[0097] Fig. 13 is a schematic diagram of the joint unit 2e viewed horizontally from the side. Fig. 14 is a schematic diagram of the joint unit 2e viewed vertically from above. Fig. 15 is a schematic diagram of the joint unit 2e viewed horizontally from the front. Fig. 16 is a schematic diagram of the joint unit 2e viewed horizontally from the rear. In Fig. 15, the second camera 32, the inspection camera 33, and the bracket 34 are not shown.

[0098] Fig. 17 is a schematic view of the supply duct 61 viewed vertically from above. Fig. 18 is a schematic view of the supply duct 61 viewed vertically from below. Fig. 19 is an external view and a cross-sectional view of the collective exhaust box 71. The left side of Fig. 19 is a schematic view of the collective exhaust box 71 viewed vertically from above, and the right side of Fig. 19 is a cross-sectional view showing a horizontal cross section of the collective exhaust box 71.

[0099] 12 , the air flow path 50 includes a supply duct 61 that extends downward from the ceiling surface of the housing 6 to the first frame 15, a frame cover 64 that extends from the supply duct 61 toward the base 10 along the first frame 15 on the outside, and a base cover 67 that extends rearward from the frame cover 64 along the base 10. The air flow path 50 further includes a collective exhaust box 71 into which air that has passed through at least one of the supply duct 61, the frame cover 64, and the base cover 67 flows. FIG. 12 shows an example in which the supply duct 61 is disposed above the first frame 15 and the second frame 35, and the frame cover 64 extends downward along the first frame 15 and the second frame 35.

[0100] When the air flow path 50 includes at least one of the side flow path 57 and the bypass flow path 58, the air flow path 50 includes at least one exhaust duct that guides air inside the first frame 15 to the collective exhaust box 71. When there are two side flow paths 57 and two bypass flow paths 58, the at least one exhaust duct includes two exhaust ducts 73 that extend from the two first pillar portions 17 of the first frame 15 toward the collective exhaust box 71, and an exhaust duct 74 that extends toward the collective exhaust box 71 from a position on the opposite side of the first frame 15 from the base cover 67.

[0101] 12 , the upstream vertical flow path 52, the horizontal flow path 55, and the downstream vertical flow path 56 of the first flow path 51a are formed by the supply duct 61, the first frame 15, the base 10, and the base cover 67. The side flow path 57 of the first flow path 51a is formed by the exhaust duct 73 and the collective exhaust box 71, and the bypass flow path 58 of the first flow path 51a is formed by the exhaust duct 74 and the collective exhaust box 71. The second flow path 51b is formed by the supply duct 61, the first frame 15, the second frame 35, and the frame cover 64. The third flow path 51c is formed by the supply duct 61, the second frame 35, and the frame cover 64.

[0102] As described above, the first frame 15 includes a first beam 16 and two first pillars 17, and the second frame 35 includes a second beam 36 and two second pillars 37. As shown in FIG. 15 , the first frame 15 defines a first opening 15o between the two first pillars 17, the first opening 15o being open to the front and rear. Similarly, the second frame 35 defines a second opening 35o between the two second pillars 37, the second opening 35o being open to the front and rear. The first opening 15o is located in front of the second opening 35o. The front wall 8f of the housing 6 is located in front of the first opening 15o (see FIG. 12 ). When the first passage opening 6a and the second passage opening 6b are closed by the two doors 7, the entire first opening 15o of the first frame 15 is covered by the doors 7 and the housing 6 when viewed horizontally in the front-to-rear direction.

[0103] The upper surface of the second beam portion 36 is located lower than the lower surface of the first beam portion 16. As shown in FIG. 15 , when viewed horizontally in the front-to-rear direction, the second beam portion 36 divides the space within the first frame 15 into an upper space 15u and a lower space 15L. The upper space 15u is located above the second beam portion 36 when the space within the first frame 15 is viewed horizontally in the front-to-rear direction. The lower space 15L is located below the second beam portion 36 when the space within the first frame 15 is viewed horizontally in the front-to-rear direction. When viewed horizontally in the front-to-rear direction, the upper space 15u does not overlap the space within the second frame 35, and the lower space 15L overlaps the space within the second frame 35. Because the two second pillar portions 37 are in contact with the two first pillar portions 17, the lower space 15L is connected to the space within the second frame 35.

[0104] Supply duct 61 extends downward from the ceiling surface of housing 6 to first beam portion 16 of first frame 15. When at least one of second flow path 51b and third flow path 51c is provided, as shown in Figures 13 and 14, supply duct 61 includes an overlap portion 62 arranged above first frame 15 so as to overlap first frame 15 when viewed vertically, and an overhang portion 63 protruding horizontally from first frame 15 so as not to overlap first frame 15 when viewed vertically.

[0105] As shown in Fig. 16, the frame cover 64 extends downward from the overhang portion 63. Fig. 16 shows an example in which the area of ​​the horizontal cross section of the space within the overhang portion 63 continuously increases as the distance from the upper end of the overhang portion 63 increases downward. Fig. 15 shows an example in which the area of ​​the horizontal cross section of the space within the overlap portion 62 continuously decreases as the distance from the upper end of the overlap portion 62 decreases downward.

[0106] 17 and 18 , the supply duct 61 includes an inlet 61i through which air sent from the FFU 43 enters, and an outlet 61o through which the air that has flowed into the inlet 61i exits. The inlet 61i is formed by the annular upper end of the supply duct 61. The outlet 61o is formed by the annular lower end of the supply duct 61. The inlet 61i corresponds to the inlet 50i of the air flow path 50.

[0107] The inlet 61i is disposed above the outlet 61o so as to overlap the outlet 61o when viewed vertically. The area of ​​the inlet 61i may be equal to, larger than, or smaller than the area of ​​the outlet 61o. The inlet 61i and the outlet 61o overlap the first vent H1 of the first frame 15 when viewed vertically. When at least one of the second flow path 51b and the third flow path 51c is provided, the inlet 61i and the outlet 61o also overlap the space within the frame cover 64 when viewed vertically.

[0108] As shown in FIG. 12 , the discharge port 43o of the FFU 43 is disposed above the inlet 61i of the supply duct 61 so as to overlap the inlet 61i when viewed vertically. The area of ​​the discharge port 43o may be equal to, or larger or smaller than, the area of ​​the inlet 61i. When the inlet 61i of the supply duct 61 and the discharge port 43o of the FFU 43 are projected onto a horizontal plane, any part of the contour of the discharge port 43o may be located on or inside the contour of the inlet 61i. In this case, all of the air supplied from the FFU 43 into the housing 6 enters the supply duct 61 from the inlet 61i of the supply duct 61.

[0109] As shown in FIGS. 13 and 14 , the frame cover 64 extends downward from the supply duct 61 along the rear surface of the first frame 15 to the upper surface of the second beam portion 36 of the second frame 35. The frame cover 64 further extends downward from the upper surface of the second beam portion 36 along the rear surface of the second frame 35 to a base cover 67. The frame cover 64 includes a vertical rear plate 65 disposed rearward of the first frame 15 and the second frame 35, and two vertical side plates 66 extending forward from the right and left ends of the rear plate 65 to the rear surfaces of the first frame 15 and the second frame 35. The rear plate 65 faces the first frame 15 and the second frame 35 horizontally in the front-to-rear direction with a gap therebetween. The two side plates 66 face the left-to-right direction with a gap therebetween. The side plate 66 is in contact with the rear surface of the first frame 15 , the rear surface of the second frame 35 , and the upper surface of the second beam portion 36 of the second frame 35 .

[0110] 16 , when viewed horizontally in the front-rear direction, the frame cover 64 overlaps a portion of the space within the first frame 15 and a portion of the space within the second frame 35. When viewed horizontally in the front-rear direction, the base cover 67 overlaps the remainder of the space within the first frame 15 and the remainder of the space within the second frame 35. Therefore, when viewed horizontally in the front-rear direction, the entire first opening 15o of the first frame 15 (see FIG. 15 ) is covered by the frame cover 64 and the base cover 67.

[0111] The space within the first frame 15 (specifically, the upper space 15u) is connected to the space within the frame cover 64 through the first opening 15o of the first frame 15. Similarly, the space within the second frame 35 is connected to the space within the frame cover 64 through the second opening 35o of the second frame 35. The space within the second frame 35 is further connected to the space within the base cover 67 (the space between the base cover 67 and the upper surface of the base 10) through the second opening 35o of the second frame 35 (see FIG. 15 ). The space within the base cover 67 is connected to the space within the frame cover 64.

[0112] 13 and 14 , the base cover 67 is disposed below the frame cover 64. The base cover 67 extends rearward from the frame cover 64 and the second frame 35 along the top surface, right side surface, and left side surface of the base 10. The base cover 67 includes an upper plate 68 disposed above the base 10, two side covers 70 disposed on both the left and right sides of the base 10, and a rear plate 69 disposed rearward of the base 10.

[0113] The upper plate 68 extends rearward from the frame cover 64 along the top surface of the base 10. Two side covers 70 extend downward from the right and left ends of the upper plate 68 along the right and left sides of the base 10. The upper plate 68 and the side covers 70 extend rearward from the second frame 35. The rear plate 69 extends downward from the rear end of the upper plate 68 along the rear surface of the base 10. When viewed horizontally in the front-to-rear direction, the rear plate 69 overlaps the second chuck 21. The second chuck 21 moves horizontally in the front-to-rear and left-to-right directions between the upper plate 68 and the base 10.

[0114] The lower end of the side cover 70 is disposed below the upper surface of the base 10. The same is true for the lower end of the rear plate 69. The space between the side cover 70 and the side surface of the base 10 may be closed so that gas inside the base cover 67 cannot move downward from the lower end of the side cover 70, or may be open so that gas can move downward from the lower end of the side cover 70. Similarly, the space between the rear plate 69 and the rear surface of the base 10 may be closed so that gas inside the base cover 67 cannot move downward from the lower end of the rear plate 69, or may be open so that gas can move downward from the lower end of the rear plate 69.

[0115] A portion of the horizontal flow passage 55 (see FIG. 12 ) of the first flow passage 51 a is formed by the upper plate 68, the two side covers 70, and the upper surface of the base 10. The downstream vertical flow passage 56 (see FIG. 12 ) of the first flow passage 51 a is formed by the rear plate 69 and the rear surface of the base 10. FIG. 12 shows an example in which the space between the rear plate 69 and the rear surface of the base 10 is open so that gas inside the base cover 67 can move downward from the lower end of the rear plate 69. In this example, the lower end of the downstream vertical flow passage 56 is open. Air flowing downstream in the horizontal flow passage 55 moves to the downstream vertical flow passage 56 and is then released from the lower end of the downstream vertical flow passage 56 into the space below the downstream vertical flow passage 56. This air is then sucked into the collective exhaust box 71 through a suction port 71 p (see FIG. 19 ), which will be described later. Instead of releasing the air in the downstream vertical flow passage 56 into the space inside the housing 6, the air in the downstream vertical flow passage 56 may be guided to the collective exhaust box 71 by a tangible object such as an exhaust duct.

[0116] As shown in Fig. 12, the collective exhaust box 71 is disposed below the first chuck 11 and the second chuck 21. The collective exhaust box 71 is disposed behind the rear surface of the base 10. The collective exhaust box 71 is disposed below the lower end of the rear surface of the base 10. The collective exhaust box 71 may be disposed on the floor of the clean room, or may be disposed at a position above and spaced apart from the floor. Fig. 12 shows an example of the latter. The arrangement of the collective exhaust box 71 is not limited to the arrangement described in this paragraph.

[0117] The collective exhaust box 71 includes a box portion 71b into which air flows and a ring portion 71r that discharges the air that has flowed into the box portion 71b to the outside of the collective exhaust box 71. The exhaust ducts 73 and 74 are attached to the box portion 71b. The box portion 71b is disposed within the housing 6. The ring portion 71r protrudes rearward from the rear surface of the housing 6. The ring portion 71r forms the outlet 50o of the air flow path 50. The factory exhaust duct 72 is attached to the ring portion 71r. The factory exhaust duct 72 is connected to exhaust equipment installed in the factory where the substrate bonding apparatus 1 is installed. The suction force generated by the exhaust equipment is transmitted to the collective exhaust box 71 via the factory exhaust duct 72. As a result, the air in the exhaust ducts 73 and 74 is drawn into the collective exhaust box 71.

[0118] As shown in FIG. 19 , the joining unit 2e may include an exhaust valve 73v that changes the flow rate of air flowing downstream through the exhaust duct 73 and an exhaust valve 74v that changes the flow rate of air flowing downstream through the exhaust duct 74. The exhaust valve 73v may be a manual valve operated by a human hand, or an automatic valve including an electric actuator or a pneumatic actuator. The same applies to the exhaust valve 74v. The collective exhaust box 71 may include at least one suction port 71p opening on the surface of the box portion 71b. In the example shown in FIG. 19 , multiple slit-shaped suction ports 71p open on the top surface of the box portion 71b. In this example, the collective exhaust box 71 not only draws air inside the exhaust ducts 73 and 74, but also air outside the exhaust ducts 73 and 74 through at least one suction port 71p.

[0119] The downstream end of the exhaust duct 73 is attached to the collective exhaust box 71. The upstream end of the exhaust duct 73 is attached to the first pillar portion 17 of the first frame 15. An exhaust port H3, which will be described later, is provided in the first pillar portion 17. The exhaust duct 73 may or may not be inserted into the exhaust port H3. In the former case, the exhaust duct 73 may protrude inward from the exhaust port H3. In either case, air within the first frame 15 flows toward the collective exhaust box 71 via the space within the exhaust port H3 and the space within the exhaust duct 73. The collective exhaust box 71 forms an outlet 50o and is positioned below the exhaust port H3. Therefore, the outlet 50o is positioned below the exhaust port H3.

[0120] The downstream end of the exhaust duct 74 is attached to the collective exhaust box 71. In the example shown in FIG. 12 , the upstream end of the exhaust duct 74 is attached to an exhaust relay box 75 that is located on the opposite side of the first frame 15 from the collective exhaust box 71. The exhaust relay box 75 is located behind the front wall 8 f of the housing 6. The exhaust relay box 75 is located along the inner surface (inner surface) of the front wall 8 f. The exhaust relay box 75 is located in front of the first frame 15 and the base 10. The exhaust duct 74 extends rearward from the exhaust relay box 75. Air inside the first frame 15 flows toward the collective exhaust box 71 via the space inside the exhaust relay box 75 and the space inside the exhaust duct 74.

[0121] As shown in FIG. 15 , the exhaust relay box 75 includes an inlet 75i through which air from within the first frame 15 enters, and an outlet 75o through which the air that has flowed into the inlet 75i is discharged into the exhaust duct 74. The inlet 75i and the outlet 75o face rearward. The inlet 75i is located in front of the first opening 15o of the first frame 15. The inlet 75i is located below the first passage opening 6a and the second passage opening 6b that open on the front surface of the housing 6. The outlet 75o is located lower than the inlet 75i. The outlet 75o is located lower than the upper surface of the base 10. The exhaust duct 74 extends rearward from the outlet 75o.

[0122] The air pressure in the air flow path 50 is changed according to several conditions, including the pressure at which the FFU 43 supplies air, the opening degree of the exhaust valve 73v arranged in the exhaust duct 73, the opening degree of the exhaust valve 74v arranged in the exhaust duct 74, and the pressure at which the exhaust equipment discharges air. The control device 3 (see FIG. 12 ) controls the FFU 43 to change the supply pressure of air sent by the FFU 43 into the housing 6. The control device 3 may maintain the air pressure in the air flow path 50 at a value equal to the air pressure in the housing 6 excluding the air flow path 50, or may maintain it at a value higher or lower than that air pressure. If the exhaust valves 73v and 74v are automatic valves, the control device 3 may maintain the air pressure in the air flow path 50 as described above by controlling the FFU 43, the exhaust valve 73v, and the exhaust valve 74v. The air pressure in the housing 6 may be equal to atmospheric pressure, or may be higher or lower than atmospheric pressure.

[0123] Next, the first ventilation port H1, the exhaust port H3, and the second ventilation port H2 will be described.

[0124] Fig. 20 is a schematic diagram of the first frame 15 and the second frame 35 viewed vertically from above. Fig. 21 is a schematic diagram showing a cross section of the first frame 15 taken along a vertical plane passing through the first ventilation port H1 and the exhaust port H3.

[0125] As described above, the first frame 15 defines the first ventilation opening H1 and the exhaust opening H3. The first ventilation opening H1 is an example of a ventilation opening provided in an air guide. The first ventilation opening H1 is part of the upstream vertical flow passage 52 (see FIG. 12) of the first flow passage 51a. The exhaust opening H3 is part of the lateral flow passage 57 (see FIG. 12) of the first flow passage 51a.

[0126] As shown in FIG. 21 , the first ventilation port H1 penetrates the first beam portion 16 of the first frame 15 from top to bottom. The first ventilation port H1 opens on the upper and lower surfaces of the first beam portion 16 and extends from the upper surface of the first beam portion 16 to the lower surface of the first beam portion 16. The first ventilation port H1 is disposed above the first chuck 11 so as to overlap with the first chuck 11 when viewed vertically. When viewed vertically, the first ventilation port H1 may overlap the entire first chuck 11 or only a portion of the first chuck 11. FIG. 20 shows an example of the latter. In this example, the first ventilation port H1 has a rectangular shape that is elongated in the front-rear direction, and the inner surface of the first ventilation port H1 is continuous in the circumferential direction of the first ventilation port H1 around the entire circumference of the first ventilation port H1.

[0127] The first ventilation opening H1 may be square, rectangular, circular, or elliptical, or may be other than these. The inner surface of the first ventilation opening H1 may be discontinuous in the circumferential direction of the first ventilation opening H1. In this case, the first ventilation opening H1 may be open on at least one of the front, rear, right, and left sides of the first beam portion 16 in addition to the upper and lower surfaces of the first beam portion 16. The first ventilation opening H1 may be a notch. The first pillar portion 17 may be two separate frames spanning the two first pillar portions 17, spaced apart from each other in the front and rear. In this case, the first ventilation opening H1 may be the space between the two separate frames. The same applies to the exhaust opening H3.

[0128] 21 , the discharge port 43o of the FFU 43 is disposed above the first vent port H1 and overlaps part or all of the first vent port H1 when viewed vertically. Air filtered by the air filter 45 flows downward from the discharge port 43o of the FFU 43 and enters the first vent port H1. This allows air to be directly supplied from the FFU 43 to the first vent port H1, ensuring that the air from the FFU 43 is supplied to the vicinity of the first chuck 11. In particular, when the discharge port 43o of the FFU 43 overlaps the entire first vent port H1 when viewed vertically, the air from the FFU 43 can be supplied uniformly to the first vent port H1, improving the uniformity of the airflow near the first chuck 11.

[0129] The exhaust port H3 opens on the inner and outer surfaces (outer surfaces in the left-right direction) of the first column portion 17, and extends horizontally in the left-right direction from the inner surface of the first column portion 17 to the outer surface of the first column portion 17. In addition to or instead of the outer surface of the first column portion 17, the exhaust port H3 may also open on at least one of the front and rear surfaces of the first column portion 17. The two exhaust ports H3 face each other horizontally in the left-right direction. The two exhaust ports H3 may be offset in at least one of the up-down direction and the front-to-back direction so as not to overlap when viewed left-to-right.

[0130] The exhaust port H3 may be disposed at the same height as the first chuck 11, or may be disposed above or below the first chuck 11. If the first chuck 11 is movable up and down, the exhaust port H3 may be disposed below the first chuck 11 regardless of the position of the first chuck 11. Alternatively, the exhaust port H3 may be disposed below the first chuck 11 only when the first chuck 11 is disposed within a part of the range in which the first chuck 11 moves.

[0131] The exhaust port H3 is separated from the first vent port H1 in the horizontal and vertical directions. The area of ​​one first vent port H1 may be equal to, or larger or smaller than, the area of ​​one exhaust port H3. The number of first vent ports H1 may be two or more. The number of exhaust ports H3 may be one, or three or more. The total area of ​​all first vent ports H1 may be equal to, or larger or smaller than the total area of ​​all exhaust ports H3. FIGS. 20 and 21 show an example in which the area of ​​one first vent port H1 is larger than the area of ​​one exhaust port H3, and the total area of ​​all first vent ports H1 is larger than the total area of ​​all exhaust ports H3.

[0132] In the example shown in FIG. 20 , the second frame 35 forms a second ventilation hole H2. The second ventilation hole H2 is part of the second flow path 51b (see FIG. 12 ). The second ventilation hole H2 penetrates the second beam portion 36 of the second frame 35 from top to bottom. The second ventilation hole H2 opens at the upper and lower surfaces of the second beam portion 36 and extends from the upper surface of the second beam portion 36 to the lower surface of the second beam portion 36. The second ventilation hole H2 may be square, rectangular, circular, or elliptical, or may have a shape other than these. The number of second ventilation holes H2 may be two or more. The inner surface of the second ventilation hole H2 may be continuous in the circumferential direction of the second ventilation hole H2 around the entire circumference of the second ventilation hole H2, or may be discontinuous in the circumferential direction of the second ventilation hole H2. FIG. 20 shows the latter example. In this example, the second ventilation opening H2 is open on the front surface of the second beam portion 36 in addition to the upper and lower surfaces of the second beam portion 36.

[0133] The second vent port H2 is disposed below the first vent port H1. The second vent port H2 is disposed above the second chuck 21. The second vent port H2 may be disposed at the same height as the first chuck 11, or may be disposed above or below the first chuck 11. Similarly, the second vent port H2 may be disposed at the same height as the exhaust port H3 of the first frame 15, or may be disposed above or below the exhaust port H3. The total area of ​​all the second vent ports H2 may be equal to the total area of ​​all the first vent ports H1, or may be larger or smaller than this total area. The total area of ​​all the second vent ports H2 may be equal to the total area of ​​all the exhaust ports H3, or may be larger or smaller than this total area.

[0134] FIG. 20 illustrates an example in which the second beam portion 36 of the second frame 35 has a U-shape that opens toward the first frame 15 when viewed vertically. The second beam portion 36 may also have a U-shape that opens toward the opposite side from the first frame 15. In either case, the second beam portion 36 includes a middle portion 36i extending horizontally in the left-right direction and two side portions 36s extending horizontally forward from both ends of the middle portion 36i. The upper surfaces of the middle portion 36i and the side portions 36s are arranged on a single horizontal plane that corresponds to the upper surface of the second beam portion 36. In the example shown in FIG. 20, the front end surface of the middle portion 36i is located rearward of the front end surfaces of the two side portions 36s. The inner surface of the second ventilation opening H2 includes two side surfaces that extend rearward when viewed vertically and a bottom surface that extends from one of the two side surfaces to the other of the two side surfaces. The bottom surface of the second ventilation opening H2 corresponds to the front end surface of the middle portion 36i. The space inside the second ventilation port H2 is connected to the space inside the first frame 15.

[0135] The bracket 34 that holds the second camera 32 and the inspection camera 33 is attached to the second beam 36 and supported by the second frame 35. When viewed vertically, the bracket 34 protrudes forward from the second beam 36. When viewed vertically, at least a portion of the second camera 32 is disposed within the second air vent H2. The same is true for the inspection camera 33. The second camera 32 and the inspection camera 33 are disposed within the frame cover 64 (see FIG. 12 ). Therefore, air within the frame cover 64 flows downward along the second camera 32 and the inspection camera 33.

[0136] Next, the effects of this embodiment will be described.

[0137] In this embodiment, the first substrate W1 held by the first chuck 11 and the second substrate W2 held by the second chuck 21 are joined by relatively moving the first substrate W1 and the second substrate W2. The first chuck 11 and the second chuck 21 are housed in a housing 6. As shown in Fig. 21 , a first vent H1 provided in a first beam portion 16, which is an example of an air guide, is disposed above the first chuck 11 so as to overlap with the first chuck 11 when viewed vertically. In other words, when the first chuck 11 and the first vent H1 are projected onto a horizontal plane, the space inside the inner surface of the first vent H1 overlaps part or all of the first chuck 11.

[0138] 21 , the air supplied into the housing 6 by the blower fan 46 passes downward through the first ventilation port H1 and heads toward the first chuck 11. This allows an air current flowing downward from the first ventilation port H1 toward the first chuck 11 to be formed inside the housing 6. Therefore, compared to the case where such an air current does not exist, it is possible to reduce the amount of air stagnation near the first chuck 11. In other words, it is possible to achieve at least one of miniaturization of the area where air stagnates and a reduction in the number of such areas.

[0139] Foreign matter such as particles tends to accumulate in areas where air stagnates. If such foreign matter adheres to the bonding surface WA1 of the first substrate W1 or the bonding surface WA2 of the second substrate W2, bonding defects may occur. Therefore, by reducing the amount of air stagnation near the first chuck 11, the yield of the bonded first substrate W1 and second substrate W2 can be increased. Furthermore, the second chuck 21 is disposed below the first chuck 11. Air that passes downward near the first chuck 11 can flow near the second chuck 21. This can also reduce the amount of air stagnation near the second chuck 21.

[0140] In this embodiment, air supplied into the housing 6 by the blower fan 46 is guided within the housing 6 by the air flow path 50. As shown in Fig. 21 , the air flow path 50 accommodates the first chuck 11 and the second chuck 21 within the housing 6. Therefore, the air from the blower fan 46 can be reliably supplied to the first chuck 11 and the second chuck 21, and air stagnation near the first chuck 11 and the second chuck 21 can be reduced. Furthermore, a stronger airflow can be formed near the first chuck 11 and the second chuck 21 than when the air from the blower fan 46 is diffused throughout the entire internal space of the housing 6.

[0141] In this embodiment, the second chuck 21 is moved horizontally by at least one of the X actuator AX and the Y actuator AY, which are examples of horizontal actuators. Regardless of the position in the horizontal direction in which the second chuck 21 is disposed, the second chuck 21 is disposed within the air flow path 50. In other words, the second chuck 21 moves only within the air flow path 50. Therefore, regardless of the position in the horizontal direction in which the second chuck 21 is disposed, air from the blower fan 46 can be supplied to the second chuck 21, and stagnation of air near the second chuck 21 can be reduced.

[0142] 21 , the first substrate W1 and the second substrate W2 are bonded within the air flow path 50. In other words, when the first substrate W1 and the second substrate W2 are bonded, the first substrate W1 and the second substrate W2 are disposed within the air flow path 50. The air flow path 50 includes a bonding position where the first substrate W1 held by the first chuck 11 and the second substrate W2 held by the second chuck 21 are bonded. Therefore, it is possible to reduce foreign matter that enters between the first substrate W1 and the second substrate W2 before bonding the first substrate W1 and the second substrate W2 or while bonding of the first substrate W1 and the second substrate W2 is in progress.

[0143] In this embodiment, the air pressure inside the air flow path 50 is maintained at a positive pressure higher than the air pressure inside the housing 6 excluding the air flow path 50. In this case, the air pressure in the entire space inside the air flow path 50 may be positive, or only a part of the space inside the air flow path 50 may be positive. At least the air pressure on the surface of the first chuck 11 and the air pressure on the surface of the second chuck 21 may be positive. If the air pressure inside the air flow path 50 is positive, foreign matter is less likely to enter the air flow path 50 even if the air flow path 50 is not sealed. This makes it possible to reduce the amount of foreign matter adhering to the first substrate W1 and the second substrate W2, thereby improving the quality of the bonded first substrate W1 and second substrate W2.

[0144] In this embodiment, the first chuck 11 is supported by the first frame 15. Therefore, the degree of freedom in arranging the first chuck 11 is increased compared to when the first chuck 11 is arranged on the ceiling surface of the housing 6. The first frame 15 is a gate-shaped frame including a first beam portion 16 and two first pillar portions 17. The first beam portion 16 blocks the airflow flowing downward toward the first chuck 11. The first ventilation port H1 is provided in the first beam portion 16 as an air guide. Therefore, the airflow can be guided to the first chuck 11 through the first ventilation port H1, thereby reducing air stagnation near the first chuck 11.

[0145] In this embodiment, air between the two first columnar portions 17 is exhausted through an exhaust port H3 that opens on the surface of the first columnar portion 17. The first frame 15 is a gate-shaped frame that includes a first opening 15o that opens between the two first columnar portions 17. The air between the two first columnar portions 17 can exit the first frame 15 through the first opening 15o of the first frame 15. By providing the exhaust port H3 on the first columnar portion 17, it is possible to increase the number of paths for exhausting air between the two first columnar portions 17. This makes it possible to reduce air stagnation within the first frame 15. Furthermore, by locating the exhaust port H3 below the first chuck 11, it is possible to reduce air stagnation within the first frame 15 while reducing airflow turbulence near the first chuck 11.

[0146] In this embodiment, air supplied into the housing 6 by the blower fan 46 is guided to the first air vent H1 by the supply duct 61. The supply duct 61 also guides the air from the blower fan 46 into the space within the frame cover 64. The frame cover 64 extends vertically outside the first frame 15 along the space between the two first pillars 17. Since the air from the blower fan 46 is also supplied into the frame cover 64, the air pressure within the frame cover 64 increases, making it less likely that an airflow will flow from the space between the two first pillars 17 into the space within the frame cover 64. This reduces airflow turbulence within the first frame 15 while also reducing air stagnation within the first frame 15.

[0147] In this embodiment, the air inside the first frame 15 is not dispersed throughout the interior space of the housing 6, but is guided along the upper surface of the base 10 by the base cover 67. Similarly, the air inside the frame cover 64 is not dispersed throughout the interior space of the housing 6, but is guided along the upper surface of the base 10 by the base cover 67. The second chuck 21 is disposed above the base 10. Therefore, the second chuck 21 is disposed in the airflow formed by the base cover 67. This makes it possible to reduce stagnation of air near the second chuck 21.

[0148] In this embodiment, air from the blower fan 46 is supplied into the first frame 15 through the first air vent H1, and an airflow flowing downward from the first air vent H1 is formed within the first frame 15. Air within the first frame 15 and the frame cover 64 is supplied between the base 10 and the base cover 67, and an airflow flowing in a direction away from the first frame 15 and the frame cover 64 is formed between the base 10 and the base cover 67. The X actuator AX, which is an example of a horizontal actuator, moves the second chuck 21 horizontally relative to the first chuck 11 between a position within the first frame 15 and a position between the base 10 and the base cover 67. Regardless of whether the second chuck 21 is located in either of these two positions, air from the blower fan 46 is supplied to the second chuck 21. This reduces air stagnation near the second chuck 21.

[0149] In this embodiment, the first chuck 11 is inverted between an upward and downward orientation by the inversion actuator AI. As shown in FIG. 21 , whether the first chuck 11 is in the upward or downward orientation, the first vent H1 overlaps the first chuck 11 when viewed vertically. Therefore, whether the first chuck 11 is in the upward or downward orientation, the air from the blower fan 46 that has passed downward through the first vent H1 can be supplied to the first chuck 11, thereby reducing air stagnation near the first chuck 11. Furthermore, when the first chuck 11 is in the upward orientation, the air from the blower fan 46 that has passed downward through the first vent H1 directly hits the first substrate W1, thereby reducing air stagnation near the first substrate W1.

[0150] Next, another embodiment will be described.

[0151] The first frame 15 supporting the first chuck 11 may have a shape other than the gate shape.

[0152] The first ventilation port H1, which is an example of a ventilation port, may be provided in a member other than the first frame 15. For example, the first ventilation port H1 may be provided in a member other than the member that supports the first chuck 11. The first ventilation port H1 may be provided in a member that is supported by the housing 6 without the pedestal 10. The first ventilation port H1 may be omitted.

[0153] The two second pillars 37 of the second frame 35 may be spaced rearward from the two first pillars 17 of the first frame 15. The second frame 35 may be omitted. In this case, the second camera 32 and the inspection camera 33 may be supported by the first frame 15. When the second frame 35 is omitted, the frame cover 64 and the base cover 67 may extend rearward from the first frame 15.

[0154] At least one of the first chuck 11 and the second chuck 21 may be disposed outside the air flow path 50. In this case, at least one of the first chuck 11 and the second chuck 21 may be movable between a position inside the air flow path 50 and a position outside the air flow path 50, or may always be disposed outside the air flow path 50.

[0155] At least one of the second flow path 51b and the third flow path 51c may be a flow path independent of the first flow path 51a. In other words, at least one of the second flow path 51b and the third flow path 51c does not have to intersect with the first flow path 51a. The third flow path 51c may be a flow path independent of the second flow path 51b. At least one of the second flow path 51b and the third flow path 51c may be omitted.

[0156] At least one of the side flow path 57 and the bypass flow path 58 may be omitted. The number of the side flow path 57 may be one. When the bypass flow path 58 is omitted, the air inside the first frame 15 may be discharged forward from the first opening 15o of the first frame 15 into the space inside the housing 6.

[0157] The first substrate W1 may be inverted outside the housing 6. That is, the first chuck 11 may be supported in a downward orientation by the first frame 15. In this case, the inversion actuator AI may be omitted.

[0158] The position of the first chuck 11 in the horizontal direction may change before and after the first chuck 11 is inverted (before and after it is rotated 180 degrees). In this case, the first vent hole H1 may overlap the first chuck 11 when viewed in the vertical direction only when the first chuck 11 is in the upward or downward position. Alternatively, the first vent hole H1 may overlap the first chuck 11 when viewed in the vertical direction whether the first chuck 11 is in the upward or downward position.

[0159] Any two or more of the above-described features may be combined. Any two or more of the above-described steps may be combined.

[0160] Although the embodiments of the present invention have been described in detail, these are merely examples used to clarify the technical contents of the present invention, and the present invention should not be construed as being limited to these examples. The spirit and scope of the present invention are limited only by the appended claims.

[0161] This application claims priority from Japanese Patent Application No. 2024-109158, filed on July 5, 2024, the entire contents of which are incorporated herein by reference.

Claims

1. A substrate bonding device comprising: a first chuck for holding a first substrate; a second chuck, positioned below the first chuck, for holding a second substrate; at least one actuator for bonding the first substrate held by the first chuck and the second substrate held by the second chuck by relatively moving the first substrate held by the first chuck and the second substrate held by the second chuck; a housing containing the first chuck and the second chuck; a blower fan for sending air into the housing; and an air guide having a first air vent positioned above the first chuck so as to overlap the first chuck when viewed vertically, and for guiding air supplied by the blower fan towards the first chuck via the first air vent.

2. The substrate bonding apparatus according to claim 1, further comprising an air flow path that houses the first chuck and the second chuck within the housing and guides the air supplied into the housing by the blower fan within the housing.

3. The substrate bonding apparatus according to claim 2, wherein the at least one actuator includes a horizontal actuator that moves the second chuck horizontally relative to the first chuck, and the second chuck is positioned within the air flow path regardless of whether the second chuck is positioned at any position in the horizontal direction.

4. The substrate bonding device according to claim 2 or 3, wherein the at least one actuator bonds the first substrate held by the first chuck and the second substrate held by the second chuck while the first substrate and the second substrate are positioned within the air flow path.

5. A substrate bonding device according to any one of claims 2 to 4, wherein the air pressure within the air flow path is higher than the air pressure within the housing excluding the air flow path.

6. The substrate bonding apparatus according to any one of claims 1 to 5, further comprising a first frame supporting the first chuck, the first frame being a gate-shaped frame including a first beam portion disposed above the first chuck and two first pillar portions extending downward from the first beam portion so as to face each other horizontally across the first chuck, and the first air vent being provided in the first beam portion acting as the air guide.

7. A substrate bonding device as described in claim 6, wherein the first column includes an exhaust port for discharging air between the two first column portions, and the exhaust port opens at a position on the surface of the first column portion below the first chuck.

8. A substrate bonding device as described in claim 6 or 7, further comprising: a frame cover extending vertically outside the first frame along the space between the two first pillar portions; and a supply duct that guides air supplied into the housing by the blower fan to the first air vent and the space within the frame cover.

9. The substrate bonding apparatus according to claim 8, further comprising: a pedestal disposed below the second chuck; and a pedestal cover that guides air discharged from the space within the first frame and air discharged from the space within the frame cover along the upper surface of the pedestal.

10. The substrate bonding apparatus of claim 9, wherein the at least one actuator includes a horizontal actuator that moves the second chuck horizontally relative to the first chuck between a position within the first frame and a position between the base and the base cover.

11. The substrate bonding apparatus according to any one of claims 1 to 10, wherein the at least one actuator includes an inversion actuator that inverts the first chuck between an upward position in which the first substrate held by the first chuck faces upward and a downward position in which the first substrate held by the first chuck faces downward, and the first vent port overlaps the first chuck when viewed vertically whether the first chuck is in the upward position or the downward position.

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