Component assembly used in semiconductor manufacturing device, electrode plate used in substrate processing device, positioning method, and semiconductor manufacturing device

Abstract

Provided is technology that enables positioning to be performed easily when components are being assembled in a semiconductor manufacturing device. This component assembly, for use in a semiconductor manufacturing device, comprises a first component which has a first surface, a first positioning pin which is disposed on the first surface and which is configured to protrude above the first surface, and a second positioning pin which is disposed on the first surface and which is configured to protrude above the first surface, wherein the height of the first positioning pin with respect to the first surface is greater than the height of the second positioning pin with respect to the first surface.

Description

Parts assembly used in semiconductor manufacturing equipment, electrode plate used in substrate processing equipment, positioning method, and semiconductor manufacturing equipment

[0001] SUMMARY OF THE INVENTION Exemplary embodiments of the present disclosure relate to a component assembly used in a semiconductor manufacturing apparatus, an electrode plate used in a substrate processing apparatus, a positioning method, and a semiconductor manufacturing apparatus.

[0002] 2. Description of the Related Art Japanese Patent Application Laid-Open No. 2003-129999 discloses a technique for semiconductor manufacturing equipment in which components such as electrode plates and cooling plates are assembled together.

[0003] Japanese Patent Application Laid-Open No. 2020-91942

[0004] The present disclosure provides a technique for easily positioning components when assembling them in a semiconductor manufacturing device.

[0005] In one exemplary embodiment of the present disclosure, a component assembly used in a semiconductor manufacturing apparatus includes a first component having a first surface, a first positioning pin disposed on the first surface and configured to protrude above the first surface, and a second positioning pin disposed on the first surface and configured to protrude above the first surface, wherein the height of the first positioning pin relative to the first surface is greater than the height of the second positioning pin relative to the first surface.

[0006] According to one exemplary embodiment of the present disclosure, it is possible to provide a technique that can easily perform positioning when assembling components in a semiconductor manufacturing device.

[0007] 1 is a diagram for explaining an example of the configuration of a component assembly used in a semiconductor manufacturing apparatus. FIG. 2 is a diagram for explaining an example of the configuration of a component assembly used in a semiconductor manufacturing apparatus. FIG. 3 is a diagram for explaining an example of the configuration of a plurality of positioning pins arranged on a first surface of a first component. FIG. 4 is a diagram for explaining an example of the flow of a method for positioning a first component and a second component. FIG. 5 is a diagram for explaining an example of the flow of step ST2 of the positioning method. FIG. 6 is a diagram for explaining an example of a state in which a first positioning pin is pressed against a second surface of a second component. FIG. 7 is a diagram for explaining an example of a state in which the position of the first positioning pin is aligned with the position of a first hole in the second surface. FIG. 8 is a diagram for explaining an example of a state in which the first positioning pin is inserted into the first hole. FIG. 9 is a diagram for explaining an example of the flow of step ST3 of the positioning method. FIG. 10 is a diagram for explaining an example of a state in which the position of a second positioning pin is aligned with the position of a second hole in the second surface. FIG. 11 is a diagram for explaining an example of a state in which the second positioning pin is inserted into the second hole. FIG. 12 is a diagram for explaining an example of a flow of step ST4 of the positioning method. FIG. 13 is a diagram for explaining an example of a state in which the position of a third positioning pin is aligned with the position of a third hole in the second surface. 10 is a diagram for explaining an example of a state in which a third positioning pin is inserted into a third hole. FIG. 11 is a diagram for explaining another example of arrangement of the positioning pins. FIG. 12 is a diagram for explaining another example of a configuration of the first component and the positioning pin. FIG. 13 is a diagram for explaining another example of a configuration of the first component and the positioning pin. FIG. 14 is a diagram for explaining another example of a configuration of the first component and the positioning pin. FIG. 15 is a diagram for explaining another example of a configuration of the depth of the recess of the first component and the length of the positioning pin. FIG. 16 is a diagram for explaining another example of a configuration of a plurality of positioning pins arranged on a first surface of the first component. FIG. 17 is a diagram for explaining a third component. FIG. 18 is a diagram for explaining an example of a configuration of two integrated positioning pins. FIG. 19 is a diagram for explaining an example of a configuration of a positioning pin having a rectangular parallelepiped shape. FIG. 19 is a diagram for explaining an example of a configuration of a component assembly used in a semiconductor manufacturing apparatus in a second embodiment. FIG. 19 is a diagram for explaining an example of an inclination angle of a tapered portion of a positioning pin. FIG. 19 is a diagram for explaining an example of a flow of a method for positioning a first component relative to a second component in a second embodiment. FIG. 19 is a diagram for explaining a state in which a part of the tapered portion of the positioning pin is inserted into a hole in process STa1.FIG. 1 is a top view for explaining a state in which a portion of a tapered portion of a positioning pin is inserted into a hole in process STa1. FIG. 2 is a view for explaining a state in which a first component is rotated around a vertical axis in process STa2. FIG. 3 is a top view for explaining a state in which a first component is rotated around a vertical axis in process STa2. FIG. 4 is a view for explaining a state in which a straight portion of a positioning pin is inserted into a hole in process STa3. FIG. 5 is a view for explaining a state in which a straight portion of a positioning pin is inserted into a hole in process STa3. FIG. 6 is a view for explaining an example of a semiconductor manufacturing apparatus using a part assembly. FIG. 7 is a view for explaining another example of the configuration of the ceiling of a chamber in a plasma processing apparatus.

[0008] Hereinafter, each embodiment of the present disclosure will be described.

[0009] In one exemplary embodiment, a component assembly for use in a semiconductor manufacturing apparatus is provided, comprising: a first component having a first surface; a first positioning pin disposed on the first surface and configured to protrude above the first surface; and a second positioning pin disposed on the first surface and configured to protrude above the first surface, wherein a height of the first positioning pin relative to the first surface is greater than a height of the second positioning pin relative to the first surface.

[0010] In one exemplary embodiment, the first component has a first recess disposed on the first surface and configured to receive a first locating pin, and a second recess disposed on the first surface and configured to receive a second locating pin.

[0011] In one exemplary embodiment, the depth of the first recess is less than the depth of the second recess, and the length of the first locating pin is equal to the length of the second locating pin.

[0012] In one exemplary embodiment, the depth of the first recess is equal to the depth of the second recess, and the length of the first locating pin is greater than the length of the second locating pin.

[0013] In one exemplary embodiment, the first component is an electrode plate used in a substrate processing apparatus.

[0014] In one exemplary embodiment, the assembly further includes a second part with which the first part is positioned, the second part having a second surface, a first hole disposed on the second surface, and a second hole disposed on the second surface, the second part being configured such that the first positioning pin disposed on the first part is inserted into the first hole and the second positioning pin disposed on the first part is inserted into the second hole.

[0015] In one exemplary embodiment, the first component is an electrode plate used in a substrate processing apparatus, and the second component is an electrode support used in the substrate processing apparatus.

[0016] In one exemplary embodiment, the device further includes a third positioning pin disposed on the first surface and configured to protrude above the first surface, the height of the third positioning pin relative to the first surface being smaller than the height of the second positioning pin relative to the first surface.

[0017] In one exemplary embodiment, an electrode plate for use in a substrate processing apparatus is provided, the electrode plate having a first recess disposed on a first surface and configured to allow a first positioning pin to be inserted therein, and a second recess disposed on the first surface and configured to allow a second positioning pin to be inserted therein, wherein the depth of the first recess is smaller than the depth of the second recess.

[0018] In one exemplary embodiment, the second recess further includes a third recess disposed on the first surface and configured to allow a third positioning pin to be inserted therein, and the depth of the second recess is smaller than the depth of the third recess.

[0019] In one exemplary embodiment, a positioning method is provided, including: (a) preparing a first component and a second component to be used in a semiconductor manufacturing apparatus, wherein the first component has a first surface, and a first positioning pin and a second positioning pin are arranged on the first surface, and the height of the first positioning pin relative to the first surface is greater than the height of the second positioning pin relative to the first surface; and the second component has a second surface, and a first hole and a second hole are arranged on the second surface; (b) inserting the first positioning pin of the first component into the first hole of the second component; and (c) after (b), inserting the second positioning pin of the first component into the second hole of the second component.

[0020] In one exemplary embodiment, (a) includes inserting a first locating pin into a first recess located on a first surface of the first component and inserting a second locating pin into a second recess located on a second surface of the second component.

[0021] In one exemplary embodiment, in (a), the length of the first positioning pin and the length of the second positioning pin are equal, and the depth of the first recess is smaller than the depth of the second recess.

[0022] In one exemplary embodiment, (b) includes the steps of: (b-1) holding a first component using a component conveying device, and, while the component conveying device is pressing a first positioning pin of the first component against a second surface of the second component, moving the first component horizontally using the component conveying device to align the position of the first positioning pin with the position of the first hole; and (b-2) after (b-1), moving the first component vertically using the component conveying device and inserting the first positioning pin into the first hole.

[0023] In one exemplary embodiment, (c) includes the steps of: (c-1) moving the first part horizontally using the part conveying device while the second positioning pin of the first part is pressed against the second surface of the second part using the part conveying device, and aligning the position of the second positioning pin with the position of the second hole; and (c-2) after (c-1), moving the first part vertically using the part conveying device, and inserting the second positioning pin into the second hole.

[0024] In one exemplary embodiment, in (a), a third positioning pin is further arranged on the first surface, the height of the second positioning pin relative to the first surface is greater than the height of the third positioning pin relative to the first surface, and a third hole is further arranged on the second surface; and (d) after (c), the method further includes a step of inserting the third positioning pin of the first part into the third hole of the second part.

[0025] In one exemplary embodiment, a semiconductor manufacturing apparatus includes: a first component, the first component having a first surface on which a first positioning pin and a second positioning pin are arranged, and a height of the first positioning pin relative to the first surface is greater than a height of the second positioning pin relative to the first surface; a second component on which the first component is positioned, the second component having a second surface on which a first hole and a second hole are arranged; a component conveying device configured to hold and convey the first component; and a controller configured to control the component conveying device, wherein the controller (a) controls the component conveying device to hold the first component and to convey the first positioning pin of the first component to the second component; (b) after (a), moving the first component in the vertical direction using the component conveying device and inserting the first positioning pin into the first hole; (c) after (b), moving the first component in the horizontal direction using the component conveying device while a second positioning pin of the first component is abutted against the second surface of the second component using the component conveying device and aligning the position of the second positioning pin with the position of the second hole; and (d) after (c), moving the first component in the vertical direction using the component conveying device and inserting the second positioning pin into the second hole.

[0026] In one exemplary embodiment, in (a), a third positioning pin is further arranged on the first surface, the height of the second positioning pin relative to the first surface is greater than the height of the third positioning pin relative to the first surface, and a third hole is further arranged on the second surface, and the control unit is configured to further perform a step of inserting the third positioning pin of the first part into the third hole of the second part after (e) and (d).

[0027] In one exemplary embodiment, a component assembly for use in a semiconductor manufacturing apparatus is provided, the component assembly comprising: a first component having a first surface; and a plurality of positioning pins disposed on the first surface and configured to protrude above the first surface, each of the plurality of positioning pins having a straight portion with a constant diameter and a tapered portion connected to a tip of the straight portion and configured to gradually become thinner as it approaches the tip.

[0028] In one exemplary embodiment, the part assembly further comprises a second part to which the first part is positioned, the second part having a second surface and a plurality of holes disposed on the second surface into which the plurality of locating pins are inserted.

[0029] In one exemplary embodiment, the first component is an electrode plate used in a substrate processing apparatus, and the second component is an electrode support used in the substrate processing apparatus.

[0030] In one exemplary embodiment, a semiconductor manufacturing apparatus includes: a first component, the first component having a first surface on which a plurality of positioning pins configured to protrude above the first surface are arranged, each of the plurality of positioning pins having a straight portion with a constant diameter and a tapered portion connected to a tip of the straight portion and configured to gradually become thinner as it approaches the tip; a second component on which the first component is positioned, the second component having a second surface on which a plurality of holes corresponding to the plurality of positioning pins are arranged; a component conveying device configured to hold and convey the first component; and a control unit configured to control the component conveying device. and a control unit configured to execute the following steps: (a) using a component conveying device to hold a first component and insert a portion of each of the tapered portions of the plurality of positioning pins into a plurality of corresponding holes in a second component; (b) after (a), using the component conveying device to rotate the first component around a vertical axis while allowing the first component to move freely horizontally, and bring a portion of each of the tapered portions of the plurality of positioning pins into contact with the inner walls of each of the corresponding holes; and (c) after (b), using the component conveying device to move the first component vertically while allowing the first component to rotate freely around the vertical axis, and insert a straight portion of each of the plurality of positioning pins into a plurality of corresponding holes.

[0031] Hereinafter, each embodiment of the present disclosure will be described in detail with reference to the drawings. In each drawing, the same or similar elements are designated by the same reference numerals, and redundant explanations will be omitted. Unless otherwise specified, the positional relationships, such as up, down, left, and right, will be described based on the positional relationships shown in the drawings. The dimensional ratios in the drawings do not represent actual ratios, and the actual ratios are not limited to the ratios shown in the drawings.

[0032] 1 is a diagram illustrating a configuration example of a component assembly 200 used in a semiconductor manufacturing apparatus. In one embodiment, the component assembly 200 includes a first component 210, a second component 211, a first positioning pin 212, a second positioning pin 213, and a third positioning pin 214.

[0033] In one embodiment, the first component 210 is positioned relative to the second component 211. The first component 210 has a generally circular plate shape. The first component 210 has a first surface 230. As shown in FIG. 2 , a first recess 240, a second recess 241, and a third recess 242 are formed in the first surface 230. The first recess 240, the second recess 241, and the third recess 242 are arranged at different positions on the first surface 230.

[0034] In one embodiment, the first recess 240 is configured so that the first positioning pin 212 can be inserted therein. The first recess 240 has a diameter that is the same as or slightly larger than the diameter of the first positioning pin 212. The second recess 241 is configured so that the second positioning pin 213 can be inserted therein. The second recess 241 has a diameter that is the same as or slightly larger than the diameter of the second positioning pin 213. The third recess 242 is configured so that the third positioning pin 214 can be inserted therein. The third recess 242 has a diameter that is the same as or slightly larger than the diameter of the third positioning pin 214. In one embodiment, the depth D1 of the first recess 240 is smaller than the depth D2 of the second recess 241. The depth D2 of the second recess 241 is smaller than the depth D3 of the third recess 242 (D1<D2<D3).

[0035] In one embodiment, the first positioning pin 212, the second positioning pin 213, and the third positioning pin 214 have a cylindrical shape. The length L1 of the first positioning pin 212 is equal to the length L2 of the second positioning pin 213 and the length L3 of the third positioning pin 214. As a result, as shown in FIG. 3 , the height H1 of the first positioning pin 212 relative to the first surface 230 when inserted into the first recess 240 is greater than the height H2 of the second positioning pin 213 relative to the first surface 230 when inserted into the second recess 241. Furthermore, the height H2 of the second positioning pin 213 relative to the first surface 230 is greater than the height H3 of the third positioning pin 214 relative to the first surface 230 when inserted into the third recess 242. That is, the heights H1, H2, and H3 of the three positioning pins 212, 213, and 214 arranged on the first surface 230 are different from one another (H1 > H2 > H3). The first component 210 may be made of the same material as the first positioning pin 212, the second positioning pin 213, and the third positioning pin 214, or may be made of a different material.

[0036] In one embodiment, as shown in Fig. 1 , the second component 211 has a generally circular plate shape. The second component 211 has a second surface 250. As shown in Figs. 1 and 2 , a first hole 260, a second hole 261, and a third hole 262 are formed in the second surface 250. The first hole 260, the second hole 261, and the third hole 262 are arranged at different positions on the second surface 250. The first hole 260, the second hole 261, and the third hole 262 are arranged so that when the first positioning pin 212 arranged on the first part 210 is inserted into the first hole 260, the second positioning pin 213 arranged on the first part 210 is inserted into the second hole 261, and the third positioning pin 214 arranged on the first part 210 is inserted into the third hole 262, the first part 210 is positioned in the correct position relative to the second part 211.

[0037] In one embodiment, the first hole 260 has a diameter slightly larger than that of the first positioning pin 212. The second hole 261 has a diameter slightly larger than that of the second positioning pin 213. The third hole 262 has a diameter slightly larger than that of the third positioning pin 214. Taking into account thermal expansion of the first component 210 and the second component 211, the first hole 260, the second hole 261, and the third hole 262 may be formed larger than the corresponding positioning pins 212, 213, and 214. In one embodiment, the first hole 260, the second hole 261, and the third hole 262 penetrate the second component 211 in the vertical direction. The first hole 260, the second hole 261, and the third hole 262 may be blind holes. The second part 211 may be made of the same material as or a different material from the first positioning pin 212, the second positioning pin 213, and the third positioning pin 214. The material of the first positioning pin 212, the second positioning pin 213, and the third positioning pin 214 may have a lower hardness than the material of the second part 211. The number of holes formed in the second part 211 may be equal to or greater than the number of positioning pins.

[0038] 4 is a diagram illustrating an example of a flow of a method for positioning a first component relative to a second component (hereinafter also referred to as "this positioning method"). In one embodiment, this positioning method includes a step ST1 of preparing a first component 210 and a second component, a step ST2 of inserting a first positioning pin 212 into a first hole 260, a step ST3 of inserting a second positioning pin 213 into a second hole 261, and a step ST4 of inserting a third positioning pin 214 into a third hole 262. In this positioning method, all or part of steps ST1 to ST4 may be performed by an operator, or may be performed by a control unit, a component conveying device, or the like included in the semiconductor manufacturing apparatus described below.

[0039] 2, in process ST1, a first component 210, a first positioning pin 212, a second positioning pin 213, and a third positioning pin 214 are prepared, and the first positioning pin 212 is inserted into a first recess 240 of the first component 210, the second positioning pin 213 is inserted into a second recess 241 of the first component 210, and the third positioning pin 214 is inserted into a third recess 242 of the first component 210. At this time, as shown in FIG. 3, a height H1 of the first positioning pin 212 from the first surface 230 is greater than a height H2 of the second positioning pin 213 from the first surface 230, and the height H2 of the second positioning pin 213 from the first surface 230 is greater than a height H3 of the third positioning pin 214 from the first surface 230. That is, three positioning pins 212, 213, and 214 having different heights are arranged on a first surface 230 of a first component 210.

[0040] In step ST2, the first positioning pin 212 of the first component 210 is inserted into the first hole 260 of the second component 211. In one embodiment, as shown in FIG. 5, step ST2 may include an alignment step ST2-1 and an insertion step ST2-2.

[0041] In process ST2-1, a component conveying device such as a robot arm holds the first component 210, and the component conveying device presses the tip of the first positioning pin 212 of the first component 210 against the second surface 250 of the second component 211, as shown in FIG. 6 . While the first component 210 is pressed against the second surface 250, the component conveying device moves the first component 210 horizontally to align the position of the first positioning pin 212 with the position of the first hole 260, as shown in FIG. 7 . At this time, the first component 210 may move in a first direction within a horizontal plane, a second direction perpendicular to the first direction, and a rotational direction. At this time, the first component 210 may be moved horizontally so that the resistance acting on the first positioning pin 212 when pressed against the second surface 250 of the second component 211 is not exceeded, while a sensor detects the resistance. This prevents damage to the second component 211. Furthermore, the first part 210 can be moved horizontally while a sensor detects the resistance acting on the first positioning pin 212 when pressed against the second surface 250 of the second part 211, and the position at which the resistance becomes equal to or less than a given value can be determined as the position where the position of the first positioning pin 212 and the position of the first hole 260 are aligned.

[0042] In step ST2-2 shown in FIG. 5, the component conveying device moves the first component 210 in the vertical direction, and the first positioning pin 212 is inserted into the first hole 260 as shown in FIG.

[0043] 4, the second positioning pin 213 of the first component 210 is inserted into the second hole 261 of the second component 211. In one embodiment, as shown in FIG. 9, the process ST3 may include an alignment process ST3-1 and an insertion process ST3-2.

[0044] In process ST3-1, while the part conveying device presses the second positioning pin 213 of the first part 210 against the second surface 250 of the second part 211, the part conveying device moves the first part 210 horizontally to align the position of the second positioning pin 213 with the position of the second hole 261, as shown in FIG. 10 . At this time, the first part 210 may move in a first direction within the horizontal plane, a second direction perpendicular to the first direction, and a rotational direction. At this time, while a sensor detects the resistance acting on the second positioning pin 213 when pressed against the second surface 250 of the second part 211, the first part 210 may be moved horizontally so that the resistance does not exceed a given value. This makes it possible to suppress damage to the second part 211. In addition, the first part 210 can be moved horizontally while a sensor detects the resistance acting on the second positioning pin 213 when pressed against the second surface 250 of the second part 211, and the position at which the resistance becomes equal to or less than a given value can be determined as the position where the position of the second positioning pin 213 and the position of the second hole 261 are aligned.

[0045] In step ST3-2 shown in FIG. 9, the component conveying device moves first component 210 in the vertical direction, and second positioning pin 213 is inserted into second hole 261 as shown in FIG.

[0046] Next, in step ST4, the second positioning pin 213 of the first component 210 is inserted into the second hole 261 of the second component 211. In one embodiment, as shown in FIG. 12 , step ST4 may include an alignment step ST4-1 and an insertion step ST4-2.

[0047] Next, in process ST4-1, the part conveying device presses the third positioning pin 214 of the first part 210 against the second surface 250 of the second part 211, and then the part conveying device moves the first part 210 horizontally to align the position of the third positioning pin 214 with the position of the third hole 262, as shown in FIG. 13 . At this time, the first part 210 may move in a first direction within the horizontal plane, a second direction perpendicular to the first direction, and a rotational direction. At this time, the first part 210 may be moved horizontally so that the resistance acting on the third positioning pin 214 when pressed against the second surface 250 of the second part 211 does not exceed a given value, while a sensor detects the resistance. This makes it possible to prevent damage to the second part 211. In addition, the first part 210 can be moved horizontally while a sensor detects the resistance acting on the third positioning pin 214 when pressed against the second surface 250 of the second part 211, and the position at which the resistance becomes equal to or less than a given value can be determined as the position where the position of the third positioning pin 214 and the position of the third hole 262 are aligned.

[0048] 12, the component conveying device moves first component 210 in the vertical direction, and inserts third positioning pin 214 into third hole 262, as shown in FIG. 14. In this way, three positioning pins 212-214 are inserted into holes 260-261 of second component 211, and first component 210 is positioned relative to second component 211.

[0049] The first part 210 and the second part 211 may then be secured to one another by a securing member.

[0050] According to this exemplary embodiment, a component assembly 200 used in a semiconductor manufacturing apparatus includes a first component 210 having a first surface 230, a first positioning pin 212 disposed on the first surface 230, a second positioning pin 213 disposed on the first surface 230, and a third positioning pin 214 disposed on the first surface 230. A height H1 of the first positioning pin 212 relative to the first surface 230 is greater than a height H2 of the second positioning pin 213 relative to the first surface 230, and the height H2 of the second positioning pin 213 relative to the first surface 230 is greater than a height H3 of the third positioning pin 214 relative to the first surface 230. As a result, when positioning the first component 210 to the second component 211, the first positioning pin 212 of the first component 210 can be inserted into the first hole 260 of the second component 211, then the second positioning pin 213 of the first component 210 can be inserted into the second hole 261 of the second component 211, and then the third positioning pin 214 of the first component 210 can be inserted into the third hole 262 of the second component 211. In this way, since multiple positioning pins can be inserted into the holes one by one in sequence, the task of aligning the positions of the positioning pins with the positions of the holes (the task of searching for the positions of the holes) is simplified. As a result, positioning can be easily performed when assembling components in semiconductor manufacturing equipment. Positioning can also be easily performed using a component conveying device.

[0051] In this exemplary embodiment, the first component 210 has a first recess 240 configured to allow insertion of the first positioning pin 212, a second recess 241 configured to allow insertion of the second positioning pin 213, and a third recess 242 configured to allow insertion of the third positioning pin 214, wherein the depth D1 of the first recess 240 is smaller than the depth D2 of the second recess 241, which is smaller than the depth D3 of the third recess 242, and the length L1 of the first positioning pin 212, the length L2 of the second positioning pin 213, and the length L3 of the third positioning pin 214 are equal. In this case, for example, the multiple positioning pins may be inserted into any of the multiple recesses, simplifying the task of inserting the multiple positioning pins.

[0052] 15 , when the first component 210 has a substantially circular plate shape, one of the plurality of positioning pins may be disposed at the center of the first component 210, and the other positioning pins may be disposed on the outer periphery of the first component 210. The first positioning pin 212, which has the greatest height relative to the first surface 230, may be disposed at the center of the first component 210, and the second positioning pin 213 and the third positioning pin 214 may be disposed on the outer periphery of the first component 210.

[0053] In the above embodiment, the first component 210 has a substantially circular plate shape, but may have other shapes. As shown in Fig. 16 , the first component 210 may have an annular shape, and positioning pins 212, 213, and 214 may be arranged on a first surface 230 of the upper surface. As shown in Fig. 17 , the first component 210 may have a rectangular plate shape, and positioning pins 212, 213, and 214 may be arranged on a first surface 230 of the upper surface. As shown in Fig. 18 , the first component 210 may have a rectangular plate shape with a cylindrical hole in the center, and positioning pins 212, 213, and 214 may be arranged on a first surface 230 of the upper surface.

[0054] 19 , the depth D1 of the first recess 240 of the first component 210, the depth D2 of the second recess 241, and the depth D3 of the third recess 242 may be equal, and the length L1 of the first positioning pin 212 may be greater than the length L2 of the second positioning pin 213, which in turn may be greater than the length L3 of the third positioning pin 214. In this case, as shown in FIG. 20 , the height H1 of the first positioning pin 212 inserted into the first recess 240 is greater than the height H2 of the second positioning pin 213 inserted into the second recess 241, and the height H2 of the second positioning pin 213 is greater than the height H3 of the third positioning pin 214 inserted into the third recess 242.

[0055] In one embodiment, as shown in FIG. 21 , the part assembly 200 may further include a third part 270 positioned relative to the second part 211. The third part 270 may be positioned simultaneously with the first part 210 or sequentially thereafter. The first part 210 may have a circular plate shape, and the third part 270 may have an annular shape disposed around the first part 210. The third part 270 may have a third surface 280 that is flush with the first surface 230. A fourth positioning pin 290, a fifth positioning pin 291, and a sixth positioning pin 292 may be disposed on the third surface 280 of the third part 270. The fourth positioning pin 290, the fifth positioning pin 291, and the sixth positioning pin 292 may be inserted into recesses disposed on the third surface 280, similar to the first part 210. The height H4 of the fourth positioning pin 290 relative to the third surface 280 may be greater than the height H5 of the fifth positioning pin 291 relative to the third surface 280, and the height H5 of the fifth positioning pin 291 relative to the third surface 280 may be greater than the height H6 of the sixth positioning pin 292 relative to the third surface 280. Furthermore, the height H3 of the third positioning pin 214 may be greater than the height H4 of the fourth positioning pin 290. That is, the height H1 of the first positioning pin 212, the height H2 of the second positioning pin 213, the height H3 of the third positioning pin 214, the height H4 of the fourth positioning pin 290, the height H5 of the fifth positioning pin 291, and the height H6 of the sixth positioning pin 292 may be gradually smaller in this order.

[0056] The second surface 250 of the second part 211 may have a fourth hole 295 into which the fourth positioning pin 290 is inserted, a fifth hole 296 into which the fifth positioning pin 291 is inserted, and a sixth hole 297 into which the sixth positioning pin 292 is inserted.

[0057] In this case, after the first part 210 is positioned on the second part 211, the fourth positioning pin 290 of the third part 270 is aligned and inserted into the fourth hole 295 of the second part 211, then the fifth positioning pin 291 is aligned and inserted into the fifth hole 296, and then the sixth positioning pin 292 is aligned and inserted into the sixth hole 297.

[0058] In the above embodiment, the first positioning pin 212, the second positioning pin 213, and the third positioning pin 214 are separate from the first component 210, but they may be integrated with the first component 210. That is, the first positioning pin 212, the second positioning pin 213, and the third positioning pin 214 may be pre-positioned on the first surface 230 of the first component 210. Similarly, the fourth positioning pin 290, the fifth positioning pin 291, and the sixth positioning pin 292 may be integrated with the third component 270.

[0059] The number of positioning pins arranged on the first component 210 and / or the third component 270 may be two. For example, in the above embodiment, the component assembly 200 may not include the third positioning pin 214 or the sixth positioning pin 292. Furthermore, the number of positioning pins arranged on the first component 210 and / or the third component 270 is not limited to two or three, and may be four or more. The four or more positioning pins may have different heights from the first surface 230 and / or the third surface 280.

[0060] In the above-described embodiments, two positioning pins may be integrated. For example, as shown in FIG. 22 , the first positioning pin 212 and the second positioning pin 213, the first positioning pin 212 and the third positioning pin 214, or the second positioning pin 213 and the third positioning pin 214 may be integrated. In this case, for example, the integrated first positioning pin 212 and the second positioning pin 213 may have a first cylindrical portion 500 and a second cylindrical portion 501 disposed on the first cylindrical portion 500. The diameter of the second cylindrical portion 501 is smaller than the diameter of the first cylindrical portion 500, and the central axis of the second cylindrical portion 501 is offset from the central axis of the first cylindrical portion 500. The first cylindrical portion 500 may function as the second positioning pin 213, and the first cylindrical portion 500 and the second cylindrical portion 501 may function as the first positioning pin 212. In this case, the second cylindrical portion 501 may be inserted into the corresponding first hole 260, and then the first cylindrical portion 500 may be inserted into the corresponding second hole 261.

[0061] The shape of the positioning pins is not limited to that of the above embodiment. The positioning pins may have, for example, a rectangular parallelepiped shape that is elongated in the horizontal direction. For example, as shown in FIG. 23 , the first positioning pin 212 may have a rectangular parallelepiped shape that is elongated in the horizontal direction, and the second positioning pin 213 may have a rectangular parallelepiped shape that is different from the first positioning pin 212. In this case, the first hole 260 corresponding to the first positioning pin 212 and the second hole 261 corresponding to the second positioning pin 213 may have a rectangular parallelepiped shape. Then, the first positioning pin 212 may be inserted into the corresponding first hole 260, and then the second positioning pin 213 may be inserted into the corresponding second hole 261.

[0062] The component conveying device may be a conveying robot having an articulated arm. The component conveying device may have a component holder (arm) configured to hold a first component, and the component holder may be movable in horizontal directions (X-axis direction and Y-axis direction) and vertical directions (Z-axis direction) (three-dimensional directions) and rotatable about a vertical axis.

[0063] When the component conveying device holds the first component and inserts the positioning pin into the hole of the second component, a camera attached to the component conveying device or the semiconductor manufacturing equipment may be used to determine the position (coordinates) of the hole in the second component, and the hole position information may be fed back to the component conveying device, causing the component conveying device to move the positioning pin of the first component to the position of the hole. Alternatively, the hole position (coordinates) may be fixed in advance so that the component conveying device and the semiconductor manufacturing equipment are positioned appropriately, and the hole position information may be fed forward to the component conveying device, causing the component conveying device to move the positioning pin of the first component to the position of the hole.

[0064] 24 is a diagram for explaining a configuration example of a part assembly 600 used in a semiconductor manufacturing apparatus according to Embodiment 2. In one embodiment, the part assembly 600 includes a first part 210, a second part 211, and three positioning pins 610.

[0065] In one embodiment, first component 210 has first surface 230. Three positioning pins 610 are configured to protrude above first surface 230. Each of three positioning pins 610 has a straight portion 650 with a constant diameter and a tapered portion 651 connected to the tip of straight portion 650 and configured to gradually become thinner as it approaches the tip.

[0066] The straight portion 650 has a cylindrical shape. The tapered portion 651 has a tapered cylindrical shape. As shown in FIG. 25 , the tapered portion 651 has a tapered outer peripheral surface 651a. The tapered outer peripheral surface 651a has an inclination angle α1 in the range of 15° to 45° with respect to the vertical direction (Z direction). The three positioning pins 610 may have the same shape and dimensions.

[0067] As shown in FIG. 24 , the second component 211 has a second surface 250. The second surface 250 has three holes 620 into which three positioning pins 610 are inserted. The three holes 620 are arranged so that when the three positioning pins 610 of the first component 210 are inserted into the corresponding three holes 620, the first component 210 is positioned at a correct position relative to the second component 211. The three holes 620 may be through holes or holes with a bottom (recesses). The other configurations of the first component 210 and the second component 211 may be similar to those of the first embodiment.

[0068] <Example of a Method for Positioning a First Component Relative to a Second Component> FIG. 26 is a diagram illustrating an example of a flow of a method for positioning a first component relative to a second component (hereinafter also referred to as "this positioning method") in the second embodiment. In one embodiment, this positioning method includes steps STa1 to STa3. This positioning method may be performed by a control unit of a semiconductor manufacturing apparatus using a component conveying device. The control unit may be one or more circuits, or may be provided as an integrated unit or partially separated. Note that all or some of steps STa1 to STa3 of this positioning method may be performed by an operator.

[0069] In process STa1, the first component 210 is held by the component conveyance device, and as shown in FIGS. 27 and 28 , portions of the tapered portions 651 of each of the plurality of positioning pins 610 of the first component 210 are inserted into the corresponding plurality of holes 620 of the second component 211. At this time, the insertion amount of the positioning pins 610 may be within a range of 1 mm to 10 mm. The positions of the holes 620 of the second component 211 may be detected by a camera, and the component conveyance device may move the first component 210 and insert the plurality of positioning pins 610 into the plurality of holes 620 based on the detected position information of the holes 620. Alternatively, the positions of the holes 620 of the second component 211 may be set in advance based on the positional relationship between the semiconductor manufacturing equipment and the component conveyance device, and the first component 210 may be moved and insert the plurality of positioning pins 610 into the plurality of holes 620 based on the set position information of the holes 620.

[0070] 29 and 30 , in process STa2, the component conveying device puts first component 210 into a state in which it can move freely in the horizontal directions (X-axis and Y-axis directions), and rotates first component 210 around the vertical axis (Z-axis), so that a portion of tapered portion 651 of each of the plurality of positioning pins 610 comes into contact with the inner wall of each of the corresponding plurality of holes 620. At this time, first, the component conveying device puts first component 210 into a state in which it can move freely in the X-axis and Y-axis directions, and rotates first component 210 around the Z-axis (process STa2-1 in FIG. 26 ). Then, it is determined whether the amount of movement of the component conveying device (first component 210) in the X-axis and Y-axis directions has reached zero (step STa2-2 in FIG. 26), and if the amount of movement of the component conveying device in the X-axis and Y-axis directions is not zero, the rotation of first component 210 about the Z-axis is continued, and if the amount of movement of first component 210 in the X-axis and Y-axis directions has reached zero, the rotation of first component 210 about the Z-axis is stopped (step STa2-3 in FIG. 26). In this way, the center C1 of first component 210 and the center C2 of second component 211 are aligned.

[0071] 31 and 32 , in process STa3, the part conveying device moves first part 210 in the vertical direction while allowing it to freely rotate around the Z axis, and inserts each straight portion 650 of the plurality of positioning pins 610 into the corresponding plurality of holes 620. In this way, the position of first part 210 in the rotational direction is finely adjusted while the plurality of positioning pins 610 is inserted into the corresponding plurality of holes 620. As a result, first part 210 is positioned relative to second part 211.

[0072] According to this exemplary embodiment, a component assembly 600 used in a semiconductor manufacturing apparatus includes a first component 210 and a plurality of positioning pins 610 configured to protrude above a first surface 230 of the first component 210. Each of the plurality of positioning pins 610 has a straight portion 650 having a constant diameter, and a tapered portion 651 connected to the tip of the straight portion 650 and configured to gradually become thinner as it approaches the tip. As a result, when positioning the first component 210 to the second component 211, the following steps can be performed: (a) using a component conveying device to hold the first component 210 and insert a portion of the tapered portion 651 of each of the plurality of positioning pins 610 into a corresponding plurality of holes 620 in the second component 211; (b) after (a), using the component conveying device to position the first component 210 so that it can move freely horizontally and rotate the first component 210 around the vertical axis, so that a portion of the tapered portion 651 of each of the plurality of positioning pins 610 comes into contact with the inner walls of the corresponding plurality of holes 620; and (c) after (b), using the component conveying device to position the first component 210 so that it can rotate freely around the vertical axis and move the first component 210 in the vertical direction, so that the straight portion 650 of each of the plurality of positioning pins 610 is inserted into the corresponding plurality of holes 620. In this case, the work of inserting the tips of the positioning pins 610 into the corresponding holes 620 in the second component 211 is simplified, and the work of aligning the positions of the positioning pins with the positions of the holes (the work of searching for the positions of the holes) is also simplified, so that positioning can be easily performed when assembling components in a semiconductor manufacturing device. Positioning can also be easily performed using a component conveying device.

[0073] <Example of Semiconductor Manufacturing Apparatus in Which Part Assembly is Used> In one embodiment, the semiconductor manufacturing apparatus in which the part assembly is used includes a plasma processing apparatus, which is an example of a substrate processing apparatus.

[0074] An example of the configuration of a plasma processing system will be described below. Fig. 33 is a diagram for explaining an example of the configuration of a capacitively coupled plasma processing apparatus.

[0075] The plasma processing system includes a capacitively coupled plasma processing apparatus 1 and a controller 2. The capacitively coupled plasma processing apparatus 1 includes a plasma processing chamber 10, a gas supply unit 20, a power supply system 30, and an exhaust system 40. The plasma processing apparatus 1 also includes a substrate support 11 and a gas inlet. The gas inlet is configured to introduce at least one process gas into the plasma processing chamber 10. The gas inlet includes a showerhead 13. The substrate support 11 is disposed within the plasma processing chamber 10. The showerhead 13 is disposed above the substrate support 11. In one embodiment, the showerhead 13 forms at least a portion of the ceiling of the plasma processing chamber 10. The plasma processing chamber 10 has a plasma processing space 10s defined by the showerhead 13, a sidewall 10a of the plasma processing chamber 10, and the substrate support 11. The plasma processing chamber 10 has at least one gas inlet for supplying at least one processing gas to the plasma processing space 10s and at least one gas outlet for exhausting gas from the plasma processing space 10s. The plasma processing chamber 10 is grounded. The showerhead 13 and the substrate support 11 are electrically insulated from the housing of the plasma processing chamber 10.

[0076] The substrate support 11 includes a main body 111 and a ring assembly 112. The main body 111 has a central region 111a for supporting a substrate W and an annular region 111b for supporting the ring assembly 112. A wafer is an example of a substrate W. The annular region 111b of the main body 111 surrounds the central region 111a of the main body 111 in a plan view. The substrate W is disposed on the central region 111a of the main body 111, and the ring assembly 112 is disposed on the annular region 111b of the main body 111 so as to surround the substrate W on the central region 111a of the main body 111. Therefore, the central region 111a is also called a substrate support surface for supporting the substrate W, and the annular region 111b is also called a ring support surface for supporting the ring assembly 112.

[0077] In one embodiment, the main body 111 includes a base 1110 and an electrostatic chuck 1111. The base 1110 includes a conductive member. The conductive member of the base 1110 may function as a lower electrode. The electrostatic chuck 1111 is disposed on the base 1110. The electrostatic chuck 1111 includes a ceramic member 1111a and an electrostatic chuck electrode 1111b disposed within the ceramic member 1111a. The electrostatic chuck electrode 1111b is also referred to as a clamping electrode. In one embodiment, the electrostatic chuck electrode 1111b is electrically connected or coupled to a chuck power supply. The chuck power supply may be a DC power supply or an AC power supply. The ceramic member 1111a has a central region 111a. In one embodiment, the ceramic member 1111a also has an annular region 111b. Note that the annular region 111b may be formed on another member surrounding the electrostatic chuck 1111, such as an annular electrostatic chuck or an annular insulating member. In this case, the ring assembly 112 may be disposed on the annular electrostatic chuck or the annular insulating member, or may be disposed on both the electrostatic chuck 1111 and the annular insulating member. At least one bias electrode electrically connected to or coupled to a power supply 31 and / or a power supply 32 (described later) may be disposed within the ceramic member 1111a. In this case, the at least one bias electrode functions as a lower electrode. Alternatively, the conductive member of the base 1110 and the bias electrode within the ceramic member 1111a may function as multiple lower electrodes. In one embodiment, the first voltage generation unit 32a, which functions as a voltage pulse generation unit (described later), is electrically connected to or coupled to the bias electrode within the ceramic member 1111a, and the first RF generation unit 31a (described later) is electrically connected to or coupled to the conductive member of the base 1110. The electrostatic chuck electrode 1111b may function as a lower electrode. The substrate support 11 therefore comprises at least one bottom electrode.

[0078] The ring assembly 112 includes one or more annular members. In one embodiment, the one or more annular members include one or more edge rings and at least one cover ring. The edge rings are formed of a conductive or insulating material, and the cover rings are formed of an insulating material.

[0079] The substrate support 11 may also include a temperature adjustment module configured to adjust at least one of the electrostatic chuck 1111, the ring assembly 112, and the substrate to a target temperature. The temperature adjustment module may include a heater, a heat transfer medium, a flow passage 1110a, or a combination thereof. A heat transfer fluid such as brine or a gas flows through the flow passage 1110a. In one embodiment, the flow passage 1110a is formed in the base 1110, and one or more heaters are disposed in the ceramic member 1111a of the electrostatic chuck 1111. The substrate support 11 may also include a heat transfer gas supply configured to supply a heat transfer gas to a gap between the backside of the substrate W and the central region 111a.

[0080] The showerhead 13 is configured to introduce at least one process gas from the gas supply unit 20 into the plasma processing space 10s. The showerhead 13 has at least one gas supply port 13a, at least one gas diffusion chamber 13b, and multiple gas inlets 13c. The process gas supplied to the gas supply port 13a passes through the gas diffusion chamber 13b and is introduced into the plasma processing space 10s from the multiple gas inlets 13c. The showerhead 13 also includes at least one upper electrode. In addition to the showerhead 13, the gas inlet may also include one or more side gas injectors (SGIs) attached to one or more openings formed in the sidewall 10a.

[0081] The gas supply unit 20 may include at least one gas source 21 and at least one flow controller 22. In one embodiment, the gas supply unit 20 is configured to supply at least one process gas from a corresponding gas source 21 to the showerhead 13 via a corresponding flow controller 22. Each flow controller 22 may include, for example, a mass flow controller or a pressure-controlled flow controller. Additionally, the gas supply unit 20 may include one or more flow modulation devices to modulate or pulse the flow rate of the at least one process gas.

[0082] The power supply system 30 includes a power supply 31 electrically connected or coupled to the plasma processing chamber 10. In one embodiment, the power supply 31 is electrically connected or coupled to the plasma processing chamber 10 via at least one impedance matcher. The impedance matcher may be a mechanically controlled matcher or an electronically controlled matcher. The power supply 31 is configured to supply at least one radio frequency (RF) signal (RF power) to at least one lower electrode and / or at least one upper electrode. This generates plasma from at least one process gas supplied to the plasma processing space 10s. Therefore, the power supply 31 can function as at least a part of a plasma generating unit configured to generate plasma from one or more process gases in the plasma processing chamber 10. Furthermore, by supplying a bias RF signal to the at least one lower electrode, a bias potential is generated on the substrate W, thereby attracting ion components in the formed plasma to the substrate W.

[0083] The power supply 31 includes a first RF generator 31a and a second RF generator 31b. The first RF generator 31a is electrically connected or coupled to at least one lower electrode and / or at least one upper electrode and is configured to generate a source RF signal (source RF power) to generate plasma in the plasma processing space 10s. In one embodiment, the first RF generator 31a is electrically connected or coupled to at least one lower electrode and / or at least one upper electrode via at least one impedance matcher. In one embodiment, the source RF signal has a frequency in the range of 10 MHz to 150 MHz. In one embodiment, the first RF generator 31a may be configured to generate multiple source RF signals having different frequencies. The generated one or more source RF signals are supplied to at least one lower electrode and / or at least one upper electrode.

[0084] The second RF generator 31b is electrically connected or coupled to at least one lower electrode and configured to generate a bias RF signal (bias RF power). In one embodiment, the second RF generator 31b is electrically connected or coupled to at least one lower electrode via at least one impedance matcher. When the first RF generator 31a is electrically connected or coupled to a lower electrode, the second RF generator 31b may be electrically connected or coupled to the same lower electrode or to another lower electrode. The frequency of the bias RF signal may be the same as or different from the frequency of the source RF signal. In one embodiment, the bias RF signal has a frequency lower than the frequency of the source RF signal. In one embodiment, the bias RF signal has a frequency in the range of 100 kHz to 60 MHz. In one embodiment, the second RF generator 31b may be configured to generate multiple bias RF signals having different frequencies. The generated one or more bias RF signals are supplied to at least one lower electrode. In various embodiments, at least one of the source RF signal and the bias RF signal may be pulsed.

[0085] The power supply system 30 may also include a power supply 32 electrically connected or coupled to the plasma processing chamber 10. The power supply 32 includes a first voltage generator 32a and a second voltage generator 32b. In one embodiment, the first voltage generator 32a is electrically connected or coupled to at least one lower electrode and configured to generate a first voltage signal. The generated first voltage signal is applied to the at least one lower electrode. In one embodiment, the second voltage generator 32b is electrically connected or coupled to at least one upper electrode and configured to generate a second voltage signal. The generated second voltage signal is applied to the at least one upper electrode.

[0086] In various embodiments, the first and / or second voltage signals may be pulsed. In this case, the first voltage generator 32a and / or the second voltage generator 32b function as a voltage pulse generator configured to generate a sequence of voltage pulses. Thus, the sequence of voltage pulses is applied to at least one lower electrode and / or at least one upper electrode. In one embodiment, the sequence of voltage pulses includes multiple cycles, each cycle including a burst of voltage pulses during a first period and a constant reference voltage during a second period. That is, the bursts of voltage pulses are repeated in the sequence of voltage pulses. The absolute value of the voltage level of the voltage pulses is greater than the absolute value of the voltage level of the reference voltage. The voltage pulses may have an arbitrary waveform, such as a rectangular, trapezoidal, triangular, or combination thereof, and the arbitrary waveform may vary over time. The voltage pulses may have either positive or negative polarity. Furthermore, the sequence of voltage pulses may include one or more positive polarity voltage pulses and one or more negative polarity voltage pulses within one cycle. The first and second voltage generating units 32a and 32b may be provided in addition to the power supply 31, or the first voltage generating unit 32a may be provided instead of the second RF generating unit 31b.

[0087] The exhaust system 40 may be connected to, for example, a gas exhaust port 10e provided at the bottom of the plasma processing chamber 10. The exhaust system 40 may include a pressure regulating valve and a vacuum pump. The pressure in the plasma processing space 10s is regulated by the pressure regulating valve. The vacuum pump may include a turbomolecular pump, a dry pump, or a combination thereof.

[0088] The control unit 2 processes computer-executable instructions that cause the plasma processing apparatus 1 to perform the various steps described in this disclosure. The control unit 2 may be configured to control each element of the plasma processing apparatus 1 to perform the various steps described herein. In one embodiment, part or all of the control unit 2 may be included in the plasma processing apparatus 1. The control unit 2 is realized by, for example, a computer 2a. The control unit 2 may include a processing unit 2a1, a memory unit 2a2, and a communication interface 2a3. The functions performed by the processing unit 2a1 described in this disclosure may be implemented in circuitry or processing circuitry, including general-purpose processors, application-specific processors, integrated circuits, ASICs (Application Specific Integrated Circuits), CPUs (Central Processing Units), conventional circuitry, and / or combinations thereof, programmed to perform the described functions. A processor is considered to be a circuit or processing circuit including transistors and other circuitry. The processor may also be a programmed processor that executes a program stored in the memory unit 2a2. This program may be stored in the memory unit 2a2 in advance or may be acquired via a medium when needed. The acquired program is stored in the storage unit 2a2 and read from the storage unit 2a2 by the processing unit 2a1 for execution. The medium may be various storage media readable by the computer 2a or a communication line connected to the communication interface 2a3. The storage unit 2a2 may include a random access memory (RAM), a read-only memory (ROM), a hard disk drive (HDD), a solid state drive (SSD), or a combination thereof. The communication interface 2a3 may communicate with the plasma processing apparatus 1 via a communication line such as a local area network (LAN).In this disclosure, a circuit, unit, or means is hardware that is programmed to implement or configured to implement a described function. The hardware may be any hardware described in this disclosure or any hardware that is programmed to implement or known to implement the described function. If the hardware is a processor, which is considered a type of circuit, the circuit, means, or unit is a combination of hardware and software used to configure the hardware and / or processor.

[0089] <Configuration of Showerhead 13> The showerhead 13 described above may be composed of multiple components. The showerhead 13 may include an upper electrode assembly 300. In one embodiment, the upper electrode assembly 300 includes a showerhead electrode 310 and an electrode support (cooling plate) 311 that is disposed above the showerhead electrode 310 and supports the showerhead electrode 310. The showerhead electrode 310 has a substantially circular plate shape. The showerhead electrode 310 has multiple gas inlets 13c. The showerhead electrode 310 constitutes an upper electrode to which a source RF signal or a DC signal is supplied from the power supply system 30. The showerhead electrode 310 is formed of a conductive material. The material of the showerhead electrode 310 is not particularly limited, but may be, for example, carbon (C: graphite, etc.), silicon (Si), silicon carbide (SiC), or a combination of these materials.

[0090] The electrode support 311 has a generally circular plate shape with a recess on its lower surface. The electrode support 311 is stacked on the upper surface of the showerhead electrode 310, thereby forming a gas diffusion chamber 13b between the electrode support 311 and the showerhead electrode 310. The electrode support 311 is provided so as to be in close contact with the showerhead electrode 310, and has an internal cooling mechanism (not shown). This allows the electrode support 311 to transfer heat between itself and the showerhead electrode 310, which becomes hot due to the heat input from the plasma, and allows the cooling mechanism to cool the showerhead electrode 310.

[0091] The cooling mechanism for the electrode support 311 has a spiral or annular coolant flow path (not shown) extending in the circumferential direction of the electrode support 311. The cooling mechanism circulates a low-temperature coolant by supplying and discharging it from a chiller unit provided outside the plasma processing chamber 10 to the coolant flow path of the electrode support 311. The coolant may be cooling water, Galden (registered trademark), or the like. The electrode support 311 may be formed of a material with high thermal conductivity to cool the showerhead electrode 310. The material of the electrode support 311 is not particularly limited, but may be, for example, anodized aluminum or an aluminum alloy.

[0092] In the plasma processing apparatus 1 configured as described above, the upper electrode assembly 300 may be the component assembly 200, 600, the shower head electrode (electrode plate) 310 may be the first component 210, and the electrode support 311 may be the second component 211.

[0093] In one embodiment of the plasma processing apparatus 1, the electrostatic chuck 1111 may be the first component 210, and the base 1110 may be the second component 211. The ring assembly 112 may be the first component 210, and the electrostatic chuck 1111 may be the second component 211. The chamber 10 may be the first component 210, and a vacuum transfer chamber (not shown) adjacent to the chamber 10 may be the second component 211. Alternatively, the first component 210 and the second component 211 may be other components used in the plasma processing apparatus 1 and aligned with each other.

[0094] 34 , the plasma processing apparatus 1 may include an inner upper electrode 400, an outer upper electrode 401, an inner clamp 402, an outer clamp 403, an outer grounding member 404, an electrode support 405, a first insulator 406, and a second insulator 407 at the ceiling of the chamber 10. The electrode support 405 has a substantially circular plate shape and is disposed at the center of the ceiling of the chamber 10. The first insulator 406 has an annular shape and is disposed so as to surround the outer wall of the electrode support 405. The second insulator 407 has an annular shape and is disposed so as to surround the outer wall of the first insulator 406. The outer wall of the second insulator 407 is connected to the side wall 10 a of the chamber 10.

[0095] The inner upper electrode 400 has a circular plate shape and is disposed below the electrode support 405, facing the substrate support surface of the substrate support 11. The diameter of the lower surface of the inner upper electrode 400 is approximately the same as the diameter of the substrate W on the substrate support 11. The inner upper electrode 400 is fixed to the electrode support 405 by an annular inner clamp 402. The outer upper electrode 401 has an annular shape and is disposed outside the inner upper electrode 400. The outer upper electrode 401 is disposed to face an edge ring disposed around the substrate support 11. The outer upper electrode 401 has diameters (inner and outer diameters) that are approximately the same as or larger than those of the edge ring. The outer upper electrode 401 is fixed to a first insulator 406 by an annular outer clamp 403. The outer upper electrode 401 is electrically insulated from the inner upper electrode 400. A gap may be formed between the outer upper electrode 401 and the inner upper electrode 400, or a ring-shaped insulator may be disposed therebetween. A source RF signal or a DC signal is supplied to the outer upper electrode 401 and the inner upper electrode 400 from the power supply system 30. The outer grounding member 404 has an annular shape and is disposed outside the outer upper electrode 401. The upper surface of the outer grounding member 404 is in close contact with the lower surface of the second insulator 407, and the outer wall of the outer grounding member 404 is connected to the side wall 10a of the chamber 10.

[0096] 34 , the electrode support 405 may be the second part 211. In this case, the inner upper electrode 400 may be the first part 210. The inner clamp 402 may be the third part 270.

[0097] The first insulator 406 may be the second component 211. In this case, the outer upper electrode 401 may be the first component 210. The outer clamp 403 may be the third component 270. Furthermore, the second insulator 407 may be the second component 211, in which case the outer grounding member 404 may be the first component 210.

[0098] In the above embodiments, the first component 210, the second component 211, and the third component 270 may be annular or disk-shaped. The first component 210, the second component 211, and the third component 270 may be a ground ring, a deposit shield, or the like located around an upper electrode in a substrate processing apparatus. The positioning pin may be made of a resin or a metal. The hole into which the positioning pin is inserted may be a through-hole or a hole with a bottom (recess). The first component 210 may be a consumable component used in a plasma processing apparatus. In this case, the consumable component may be distributed with the positioning pin attached.

[0099] Embodiments of the present disclosure further include the following aspects.

[0100] 1. A position adjustment method comprising the steps of: providing a first component, a second component adjacent to the first component, and a plurality of pins that are configured to protrude from a first surface of the first component, the plurality of pins including at least two or more pins that protrude from the first surface toward the first surface by different lengths; and inserting the plurality of pins into a plurality of holes formed in the second component on a surface opposite to the first surface at positions corresponding to the plurality of pins, in descending order of length of protrusion from the first surface. 2. An electrode assembly comprising an electrode plate and a plurality of pins that are inserted into recesses formed on the first surface of the electrode plate, the plurality of pins including at least two or more pins that protrude from the first surface toward the first surface by different lengths. 3. An electrode plate comprising a body having a first surface and a second surface opposite the first surface, wherein the body has a first recess extending from the first surface to the second surface, and a second recess formed on the first surface at a position different from the first recess and extending from the first surface to the second surface, and wherein the depth of the first recess is different from the depth of the second recess.

[0101] (Supplementary Note 1) A component assembly for use in a semiconductor manufacturing apparatus, comprising: a first component having a first surface; a first positioning pin disposed on the first surface and configured to protrude above the first surface; and a second positioning pin disposed on the first surface and configured to protrude above the first surface, wherein a height of the first positioning pin relative to the first surface is greater than a height of the second positioning pin relative to the first surface.

[0102] (Supplementary Note 2) A component assembly used in the semiconductor manufacturing apparatus described in Supplementary Note 1, wherein the first component has: a first recess disposed on the first surface and configured to allow the first positioning pin to be inserted; and a second recess disposed on the first surface and configured to allow the second positioning pin to be inserted.

[0103] (Supplementary Note 3) A component assembly used in a semiconductor manufacturing apparatus according to Supplementary Note 2, wherein the depth of the first recess is smaller than the depth of the second recess, and the length of the first positioning pin is equal to the length of the second positioning pin.

[0104] (Supplementary Note 4) A component assembly used in a semiconductor manufacturing apparatus according to Supplementary Note 2, wherein the depth of the first recess is equal to the depth of the second recess, and the length of the first positioning pin is greater than the length of the second positioning pin.

[0105] (Supplementary Note 5) The parts assembly used in a semiconductor manufacturing apparatus according to any one of Supplementary Notes 1 to 4, wherein the first part is an electrode plate used in a substrate processing apparatus.

[0106] (Supplementary Note 6) A component assembly used in a semiconductor manufacturing apparatus according to any one of Supplementary Notes 1 to 5, further comprising: a second component on which the first component is positioned, the second component having a second surface, a first hole disposed on the second surface, and a second hole disposed on the second surface, the second component configured such that the first positioning pin disposed on the first component is inserted into the first hole, and the second positioning pin disposed on the first component is inserted into the second hole.

[0107] (Supplementary Note 7) The component assembly used in semiconductor manufacturing equipment according to Supplementary Note 6, wherein the first component is an electrode plate used in a substrate processing apparatus, and the second component is an electrode support used in the substrate processing apparatus.

[0108] (Appendix 8) A component assembly used in a semiconductor manufacturing apparatus according to any one of Appendices 1 to 7, further comprising a third positioning pin arranged on the first surface and configured to protrude above the first surface, wherein the height of the third positioning pin relative to the first surface is smaller than the height of the second positioning pin relative to the first surface.

[0109] (Supplementary Note 9) An electrode plate for use in a substrate processing apparatus, comprising: a first recess disposed on a first surface and configured to allow a first positioning pin to be inserted therein; and a second recess disposed on the first surface and configured to allow a second positioning pin to be inserted therein; wherein a depth of the first recess is smaller than a depth of the second recess.

[0110] (Supplementary Note 10) An electrode plate for use in the substrate processing apparatus described in Supplementary Note 9, further comprising: a third recess disposed on the first surface and configured to allow a third positioning pin to be inserted therein; and a depth of the second recess being smaller than a depth of the third recess.

[0111] (Supplementary Note 11) A positioning method comprising: (a) preparing a first component and a second component to be used in a semiconductor manufacturing apparatus, wherein the first component has a first surface, and a first positioning pin and a second positioning pin are arranged on the first surface, and a height of the first positioning pin from the first surface is greater than a height of the second positioning pin from the first surface; and the second component has a second surface, and a first hole and a second hole are arranged on the second surface; (b) inserting the first positioning pin of the first component into the first hole of the second component; and (c) after (b), inserting the second positioning pin of the first component into the second hole of the second component.

[0112] (Supplementary Note 12) The positioning method according to Supplementary Note 11, wherein (a) includes a step of inserting the first positioning pin into a first recess disposed on the first surface of the first component, and inserting the second positioning pin into a second recess disposed on the second surface of the second component.

[0113] (Supplementary Note 13) The positioning method according to Supplementary Note 12, wherein in (a), the length of the first positioning pin and the length of the second positioning pin are equal, and the depth of the first recess is smaller than the depth of the second recess.

[0114] (Supplementary Note 14) The positioning method according to any one of Supplementary Notes 11 to 13, wherein (b) comprises: (b-1) a step of holding the first component by a component conveying device, and in a state in which the component conveying device abuts the first positioning pin of the first component against the second surface of the second component, moving the first component in a horizontal direction by the component conveying device to align the position of the first positioning pin with the position of the first hole; and (b-2) after (b-1), a step of moving the first component in a vertical direction by the component conveying device, and inserting the first positioning pin into the first hole.

[0115] (Supplementary Note 15) The positioning method according to Supplementary Note 14, wherein (c) comprises: (c-1) a step of moving the first component in a horizontal direction using the component conveying device while the second positioning pin of the first component is abutted against the second surface of the second component by the component conveying device, and aligning the position of the second positioning pin with the position of the second hole; and (c-2) after (c-1), a step of moving the first component in a vertical direction using the component conveying device, and inserting the second positioning pin into the second hole.

[0116] (Supplementary Note 16) The positioning method according to any one of Supplementary Notes 11 to 15, further comprising: in (a), a third positioning pin is further arranged on the first surface, the height of the second positioning pin from the first surface is greater than the height of the third positioning pin from the first surface, and a third hole is further arranged in the second surface; and (d) after (c), a step of inserting the third positioning pin of the first component into the third hole of the second component.

[0117] (Supplementary Note 17) A semiconductor manufacturing apparatus includes: a first component, the first component having a first surface on which a first positioning pin and a second positioning pin are arranged, and a height of the first positioning pin relative to the first surface is greater than a height of the second positioning pin relative to the first surface; a second component on which the first component is positioned, the second component having a second surface on which a first hole and a second hole are arranged; a component conveying device configured to hold and convey the first component; and a control unit configured to control the component conveying device, wherein the control unit is configured to perform the following steps: (a) holding the first component with the component conveying device, and, with the component conveying device abutting the first positioning pin of the first component against the second surface of the second component, moving the first component in a horizontal direction with the component conveying device to align the position of the first positioning pin with the position of the first hole; (b) after (a), moving the first component in a vertical direction using the component conveying device and inserting the first positioning pin into the first hole; (c) after (b), moving the first component in a horizontal direction using the component conveying device while the second positioning pin of the first component is abutting the second surface of the second component using the component conveying device and aligning the position of the second positioning pin with the position of the second hole; and (d) after (c), moving the first component in a vertical direction using the component conveying device and inserting the second positioning pin into the second hole.

[0118] (Supplementary Note 18) The semiconductor manufacturing apparatus of Supplementary Note 17, wherein in (a), a third positioning pin is further arranged on the first surface, the height of the second positioning pin from the first surface is greater than the height of the third positioning pin from the first surface, and a third hole is further arranged in the second surface, and the control unit is configured to further perform (e) after (d), a step of inserting the third positioning pin of the first component into the third hole of the second component.

[0119] (Supplementary Note 19) A component assembly for use in a semiconductor manufacturing apparatus, comprising: a first component having a first surface; and a plurality of locating pins disposed on the first surface and configured to protrude above the first surface, each of the plurality of locating pins having a straight portion with a constant diameter and a tapered portion connected to a tip of the straight portion and configured to gradually become thinner as it approaches the tip.

[0120] (Supplementary Note 20) The component assembly used in the semiconductor manufacturing apparatus according to Supplementary Note 19, further comprising: a second component on which the first component is positioned, the second component having a second surface and a plurality of holes disposed on the second surface and into which the plurality of positioning pins are inserted.

[0121] (Supplementary Note 21) The component assembly used in a semiconductor manufacturing apparatus according to Supplementary Note 20, wherein the first component is an electrode plate used in a substrate processing apparatus, and the second component is an electrode support used in the substrate processing apparatus.

[0122] (Supplementary Note 22) A semiconductor manufacturing apparatus includes: a first component, the first component having a first surface, on which a plurality of positioning pins configured to protrude above the first surface are arranged, each of the plurality of positioning pins having a straight portion with a constant diameter and a tapered portion connected to a tip of the straight portion and configured to gradually become thinner as it approaches the tip; a second component on which the first component is positioned, the second component having a second surface, on which a plurality of holes corresponding to the plurality of positioning pins are arranged; a component conveying device configured to hold and convey the first component; and a control unit configured to control the component conveying device, wherein the control unit is configured to: (a) hold the first component by the component conveying device, and insert part of the tapered portion of each of the plurality of positioning pins into the corresponding plurality of holes of the second component; (b) after (a), using the part transport device to rotate the first part around a vertical axis while allowing the first part to move freely in the horizontal direction, and bring the part of the tapered portion of each of the plurality of positioning pins into contact with the inner walls of each of the corresponding holes; and (c) after (b), using the part transport device to move the first part around a vertical axis while allowing the first part to rotate freely around the vertical axis, and insert the straight portion of each of the plurality of positioning pins into the corresponding holes.

[0123] (Supplementary Note 23) (a) a step of preparing a first component and a second component used in a semiconductor manufacturing apparatus, wherein the first component has a first surface, and a plurality of positioning pins configured to protrude above the first surface are arranged on the first surface, and each of the plurality of positioning pins has a straight portion having a constant diameter and a tapered portion connected to a tip of the straight portion and configured to gradually become thinner as it approaches the tip, and the second component has a second surface, and a plurality of holes into which the plurality of positioning pins are inserted are arranged on the second surface; (b) a step of inserting a portion of the tapered portion of each of the plurality of positioning pins into the plurality of corresponding holes of the second component; (c) after (b), a step of rotating the first component around a vertical axis while allowing the first component to move freely in a horizontal direction, and bringing the portion of the tapered portion of each of the plurality of positioning pins into contact with the inner wall of each of the plurality of corresponding holes; (d) after (c), moving the first component in a vertical direction while allowing the first component to freely rotate about a vertical axis, and inserting the straight portions of each of the plurality of positioning pins into the corresponding holes.

[0124] The above embodiments are described for the purpose of explanation and are not intended to limit the scope of the present disclosure. Various modifications can be made to the above embodiments without departing from the scope and spirit of the present disclosure. For example, some components in one embodiment can be added to other embodiments. Also, some components in one embodiment can be replaced with corresponding components in other embodiments.

[0125] REFERENCE SIGNS LIST 1... plasma processing apparatus, 10... chamber, 200... component assembly, 210... first component, 211... second component, 212... first positioning pin, 213... second positioning pin, 214... third positioning pin, 230... first surface, 240... first recess, 241... second recess, 242... third recess, 250... second surface, 260... first hole, 261... second hole, 262... third hole, W... substrate

Claims

1. A component assembly for use in semiconductor manufacturing equipment, comprising: a first component having a first surface; a first positioning pin disposed on the first surface and configured to protrude above the first surface; and a second positioning pin disposed on the first surface and configured to protrude above the first surface, wherein the height of the first positioning pin relative to the first surface is greater than the height of the second positioning pin relative to the first surface.

2. A component assembly used in a semiconductor manufacturing apparatus as described in claim 1, wherein the first component has: a first recess disposed on the first surface and configured to allow the first positioning pin to be inserted therein; and a second recess disposed on the first surface and configured to allow the second positioning pin to be inserted therein.

3. A component assembly used in a semiconductor manufacturing apparatus as described in claim 2, wherein the depth of the first recess is smaller than the depth of the second recess, and the length of the first positioning pin is equal to the length of the second positioning pin.

4. A component assembly used in a semiconductor manufacturing apparatus according to claim 2, wherein the depth of the first recess is equal to the depth of the second recess, and the length of the first positioning pin is greater than the length of the second positioning pin.

5. The part assembly used in a semiconductor manufacturing apparatus according to claim 1, wherein the first part is an electrode plate used in a substrate processing apparatus.

6. A component assembly for use in a semiconductor manufacturing apparatus as described in claim 1, further comprising a second component on which the first component is positioned, the second component having a second surface, a first hole disposed on the second surface, and a second hole disposed on the second surface, the second component being configured so that the first positioning pin disposed on the first component is inserted into the first hole, and the second positioning pin disposed on the first component is inserted into the second hole.

7. The component assembly used in a semiconductor manufacturing apparatus according to claim 6, wherein the first component is an electrode plate used in a substrate processing apparatus, and the second component is an electrode support used in the substrate processing apparatus.

8. A component assembly for use in a semiconductor manufacturing apparatus according to claim 1, further comprising a third positioning pin disposed on the first surface and configured to protrude above the first surface, wherein the height of the third positioning pin relative to the first surface is smaller than the height of the second positioning pin relative to the first surface.

9. An electrode plate for use in a substrate processing apparatus, comprising: a first recess disposed on a first surface and configured to allow a first positioning pin to be inserted therein; and a second recess disposed on the first surface and configured to allow a second positioning pin to be inserted therein; wherein the depth of the first recess is smaller than the depth of the second recess.

10. An electrode plate for use in a substrate processing apparatus as described in claim 9, further comprising a third recess disposed on the first surface and configured to allow a third positioning pin to be inserted therein, wherein the depth of the second recess is smaller than the depth of the third recess.

11. A positioning method comprising: (a) a step of preparing a first component and a second component to be used in a semiconductor manufacturing device, wherein the first component has a first surface, a first positioning pin and a second positioning pin are arranged on the first surface, the height of the first positioning pin relative to the first surface is greater than the height of the second positioning pin relative to the first surface, and the second component has a second surface, a first hole and a second hole are arranged on the second surface; (b) a step of inserting the first positioning pin of the first component into the first hole of the second component; and (c) after (b), a step of inserting the second positioning pin of the first component into the second hole of the second component.

12. The positioning method according to claim 11, wherein (a) includes the step of inserting the first positioning pin into a first recess disposed on the first surface of the first component, and inserting the second positioning pin into a second recess disposed on the second surface of the second component.

13. The positioning method according to claim 12, wherein in (a), the length of the first positioning pin and the length of the second positioning pin are equal, and the depth of the first recess is smaller than the depth of the second recess.

14. The positioning method according to claim 11, wherein (b) comprises the steps of: (b-1) holding the first component using a component conveying device, and using the component conveying device to bring the first positioning pin of the first component into contact with the second surface of the second component, and then moving the first component horizontally using the component conveying device to align the position of the first positioning pin with the position of the first hole; and (b-2) after (b-1), using the component conveying device to move the first component vertically and insert the first positioning pin into the first hole.

15. The positioning method according to claim 14, wherein (c) comprises the steps of: (c-1) moving the first component horizontally using the component conveying device while the second positioning pin of the first component is in contact with the second surface of the second component, and aligning the position of the second positioning pin with the position of the second hole; and (c-2) after (c-1), moving the first component vertically using the component conveying device, and inserting the second positioning pin into the second hole.

16. The positioning method according to claim 11, further comprising: (a) a third positioning pin is further arranged on the first surface, the height of the second positioning pin from the first surface is greater than the height of the third positioning pin from the first surface, and a third hole is further arranged on the second surface; and (d) after (c), a step of inserting the third positioning pin of the first component into the third hole of the second component.

17. A semiconductor manufacturing apparatus comprising: a first component, the first component having a first surface on which a first positioning pin and a second positioning pin are arranged, and a height of the first positioning pin relative to the first surface is greater than a height of the second positioning pin relative to the first surface; a second component on which the first component is to be positioned, the second component having a second surface on which a first hole and a second hole are arranged; a component transport device configured to hold and transport the first component; and a control unit configured to control the component transport device, wherein the control unit performs the following steps: (a) holding the first component with the component transport device, and, with the component transport device abutting the first positioning pin of the first component against the second surface of the second component, moving the first component in a horizontal direction with the component transport device to align the position of the first positioning pin with the position of the first hole; (b) after (a), moving the first component in a vertical direction using the component conveying device and inserting the first positioning pin into the first hole; (c) after (b), moving the first component in a horizontal direction using the component conveying device while the second positioning pin of the first component is abutting the second surface of the second component using the component conveying device and aligning the position of the second positioning pin with the position of the second hole; and (d) after (c), moving the first component in a vertical direction using the component conveying device and inserting the second positioning pin into the second hole.

18. The semiconductor manufacturing apparatus of claim 17, wherein in (a), a third positioning pin is further arranged on the first surface, the height of the second positioning pin from the first surface is greater than the height of the third positioning pin from the first surface, and a third hole is further arranged in the second surface, and the control unit is configured to further perform (e) after (d), a step of inserting the third positioning pin of the first component into the third hole of the second component.

19. A component assembly for use in semiconductor manufacturing equipment, comprising: a first component having a first surface; and a plurality of positioning pins disposed on the first surface and configured to protrude above the first surface, each of the plurality of positioning pins having a straight portion with a constant diameter and a tapered portion connected to the tip of the straight portion and configured to gradually become thinner as it approaches the tip.

20. The component assembly used in a semiconductor manufacturing apparatus according to claim 19, further comprising: a second component on which the first component is positioned, the second component having a second surface and a plurality of holes disposed on the second surface and into which the plurality of positioning pins are inserted.

21. The component assembly used in a semiconductor manufacturing apparatus according to claim 20, wherein the first component is an electrode plate used in a substrate processing apparatus, and the second component is an electrode support used in the substrate processing apparatus.

22. A semiconductor manufacturing apparatus comprising: a first component having a first surface on which a plurality of positioning pins configured to protrude above the first surface are arranged, each of the plurality of positioning pins having a straight portion with a constant diameter and a tapered portion connected to the tip of the straight portion and configured to gradually become thinner as it approaches the tip; a second component on which the first component is positioned, the second component having a second surface on which a plurality of holes corresponding to the plurality of positioning pins are arranged; a component transport device configured to hold and transport the first component; and a control unit configured to control the component transport device, wherein the control unit performs the following steps: (a) holding the first component by the component transport device, and inserting a portion of the tapered portion of each of the plurality of positioning pins into the corresponding plurality of holes of the second component; (b) after (a), using the part transport device to rotate the first part around a vertical axis while allowing the first part to move freely in the horizontal direction, and bring the part of the tapered portion of each of the plurality of positioning pins into contact with the inner walls of each of the corresponding holes; and (c) after (b), using the part transport device to move the first part around a vertical axis while allowing the first part to rotate freely around the vertical axis, and insert the straight portion of each of the plurality of positioning pins into the corresponding holes.

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