Sheet-shaped sintering bonding material

Abstract

The present invention relates to: a sheet-shaped sintering bonding material comprising a metal layer that is composed of a sheet-shaped or foil-shaped metal, and adhesive layers, on both surfaces of the metal layer, that include metal nanoparticles and a solvent and that are tacky, wherein the metal nanoparticles are composite metal nanoparticles in which an organic coating layer composed of one or more aliphatic carboxylic acids having 1-10 or 12 carbon atoms is formed around a metal nucleus composed of an aggregate of metal atoms and having an average particle diameter of 1-200 nm; a bonding portion where the sheet-shaped sintering bonding material and bonding members are bonded; and an electric device, an electronic device, a semiconductor component, or a heat dissipation component using the bonding portion.

Description

Sheet-type sintered bonding material

[0001] The present invention relates to a sheet-shaped sintered bonding material, and to an electric device, an electronic device, a semiconductor part, and a heat dissipation part using the sheet-shaped sintered bonding material.

[0002] In the manufacture of semiconductor modules such as power control units mounted on xEVs (xEVs) such as electric vehicles, hybrid electric vehicles, plug-in hybrid electric vehicles, and fuel cell vehicles, a known method of joining semiconductor chips and heat dissipation components to lead frames, insulating circuit boards, etc. is to place a sheet of joining material, rather than a paste, between the substrate and the semiconductor chip or heat dissipation component and perform sintering bonding, from the viewpoint that it does not require a printing process and is easy to bond, regardless of the size of the semiconductor chip or heat dissipation component.

[0003] Examples of the bonding material include a heating bonding material (Patent Document 1) having a metal layer formed from a bulk metal material and metal bonding layers laminated on both sides of the metal layer by coating, supporting, or the like, wherein the bulk material is a metal element selected from copper, silver, gold, platinum, and palladium, or an alloy composed of at least two or more metals selected from copper, silver, platinum, and palladium, the bulk material being a foil, a metal mesh, or a porous metal body, the metal layer being coated with a polymer dispersant and formed into a film by dispersing metal fine particles, made of at least one element selected from the group consisting of metal elements, alloys, and metal compounds, in an organic solvent, and the metal fine particles having an average primary particle size of 5 to 500 nm.

[0004] Patent No. 6851810

[0005] However, the inventors have confirmed that the sheet-like bonding material is formed from a layer of polymer dispersant coated on a metal layer or a bonding layer in which metal nanoparticles are dispersed. However, when the components to be bonded are mounted on the sheet-like bonding material during assembly, the lack of tackiness of the sheet-like bonding material causes the substrate and electronic components, such as semiconductor chips, to move from their original positions (so-called misalignment). If sintered as is, the substrate product itself will not exhibit the desired performance, such as the intended electrical conductivity and thermal conductivity, causing defects and reducing productivity. Furthermore, as mentioned above, it has been found that insufficient adhesion between the components to be bonded and the sheet-like bonding material causes the components to move, resulting in gaps between the components and the sheet-like bonding material. These gaps can cause voids (voids) during sintering and bonding, which can become hot spots and cause defects in the product.

[0006] Tackiness refers to the ability of a material to stick to an adherend (attachment surface) in a short time when lightly touched, and refers to the property of having a sticky or tacky feel on the surface. In the present invention, it refers to the property of utilizing the adhesiveness or stickiness of the sheet-like sintered bonding material to bond and fix components to be joined (bonding components) that constitute electrical equipment, electronic equipment, semiconductor parts, heat dissipation parts, etc. by contacting or pressurizing them at room temperature or when heated.

[0007] Therefore, the present invention is intended to solve the above-mentioned problems, and specifically to provide a sheet-like sintered bonding material that has excellent tackiness to bonding members that make up electrical equipment, electronic equipment, semiconductor components, heat dissipation components, etc., and that allows various components to be stably fixed in desired positions due to this tackiness, thereby preventing defects due to "misalignment" and contributing to improved productivity, as well as a bonding portion, electrical equipment, electronic equipment, semiconductor components, and heat dissipation components that use the sheet-like sintered bonding material.

[0008] That is, a first embodiment of the present invention is a sheet-shaped sintered bonding material comprising: a metal layer made of a plate-shaped or foil-shaped metal; and adhesive layers having tackiness, containing metal nanoparticles and a solvent, formed on both sides of the metal layer. The metal nanoparticles are composite metal nanoparticles in which a metal core having an average particle size of 1 to 200 nm and composed of an aggregate of metal atoms is surrounded by an organic coating layer composed of one or more aliphatic carboxylic acids having 1 to 10 or 12 carbon atoms. The solvent may include one or more high-viscosity solvents. The content of the high-viscosity solvent in the adhesive layer may be 0.1 to 20.0 mass%. The thickness of the metal layer may be 10 to 1000 μm, and the thickness of the adhesive layer may be 20 to 100 μm. The metal atoms constituting the metal nanoparticles may be copper, gold, platinum, palladium, or silver, or a composite thereof. The adhesive layers on both sides of the metal layer may be capable of fixing a bonding member after mounting it on the sheet-shaped sintered bonding material. The adhesive layer may contain metal nanoparticles, a filler, a solvent, and a dispersant. One or both surfaces of the metal layer may be surface-treated with one or more metals selected from the group consisting of copper, gold, silver, platinum, and palladium, or composites thereof.

[0009] A second embodiment of the present invention is a joint formed by the sheet-shaped sintered joint material, or an electric device, an electronic device, a semiconductor part, or a heat dissipation part using the joint.

[0010] The sheet-like sintered bonding material of the present invention has superior tackiness to the components (bonding members) to be bonded that constitute electrical equipment, electronic devices, semiconductor components, heat dissipation components, etc., compared to conventional products. The sheet-like sintered bonding material to which tackiness has been imparted allows the bonding members to be firmly adhered and fixed to the sheet-like bonding material in the pre-bonding process, making it possible to prevent defects due to "misalignment." Since the bonding members do not move during the process, productivity such as handleability and yield can be improved, and electrical equipment, electronic devices, semiconductor components, heat dissipation components, etc. with desired performance can be efficiently manufactured.

[0011] This is an SEM photograph showing the results of observing the bonded cross section after the temporarily bonded sample obtained in Test Example 1 was baked and bonded, and then the sample was embedded in resin and polished in Test Example 3.

[0012] The sheet-shaped sintered bonding material of the present invention is a bonding material having a metal layer made of a plate-shaped or foil-shaped metal, and adhesive layers having tackiness, containing metal nanoparticles and a solvent, on both sides of the metal layer.

[0013] The plate- or foil-like metal constituting the metal layer refers to a metal member having a thickness of 10 μm or more. While a uniform thickness is preferred for the plate- or foil-like metal, it is not essential. The plate- or foil-like metal may also have holes, such as perforated metal, if necessary. When holes are present or the metal is a mesh, there are no limitations on the size or number of holes within the scope of the effects of the present invention. In the case of a mesh, there are no limitations on the thickness of the metal wire or the size of the openings in the mesh. The foil- or plate-like metal does not need to be solid; depending on the application, it may be made of woven wire or short metal fibers. In the present invention, from the viewpoints of bonding reliability and workability, the thickness of the metal layer is preferably 10 to 1,000 μm, more preferably 10 to 100 μm, even more preferably 20 to 70 μm, and particularly preferably 20 to 50 μm.

[0014] The area of ​​the metal layer is not particularly limited and may be adjusted appropriately depending on the area of ​​components required for joining in electrical devices, electronic devices, semiconductor parts, heat dissipation parts, etc.

[0015] Examples of materials for the metal layer include, but are not limited to, iron, copper, silver, gold, aluminum, nickel, platinum, palladium, alloys of two or more of these, and stainless steel.

[0016] In addition, both or one side of the metal layer may be surface-treated with one or more metals selected from the group consisting of copper, gold, silver, platinum, and palladium, or composites thereof. Examples of the surface treatment include dry plating such as physical vapor deposition (PVD) and chemical vapor deposition (CVD), wet plating such as electroplating and electroless plating, chemical conversion treatment (fermite), anodizing (alumite), hot-dip galvanization, and sputtering, and can be appropriately selected within the scope of the effects of the present invention. There are no particular limitations on the combination of the metal constituting the metal layer and the metal constituting the thin film formed by the surface treatment. There are also no particular limitations on the thickness of the thin film.

[0017] In the present invention, layers (adhesive layers) of a desired thickness are formed on both sides of the metal layer. When the surfaces of these adhesive layers are brought into contact with or pressurized by bonding components constituting electrical devices, electronic devices, semiconductor components, heat dissipation components, etc. at room temperature or elevated temperature, these bonding components can be bonded and fixed in the desired positions. In the present invention, the mounting of bonding components while contacting or pressurizing at room temperature or elevated temperature as described above is referred to as "mounting." The heating temperature is not particularly limited as long as it develops tackiness in the adhesive layer. Furthermore, the degree of contact or pressure is not particularly limited as long as it adheres the surface of the adhesive layer to the surface of the bonding component without moving. An example of a bonding method for bonding a substrate to a bonding object includes the following steps: Step 1: Attach the sheet-like sintered bonding material of the present invention to a predetermined position on the substrate. Step 2: Then, mount the bonding component, such as a chip, on the sheet-like sintered bonding material of the present invention. Step 3: After mounting the bonding component, temporarily fix the substrate, the sheet-like sintered bonding material of the present invention, and the bonding component by applying the desired pressure and heat. The temporary fixing allows the sheet-like sintered bonding material of the present invention to exhibit tackiness, and this provides the excellent effect of preventing displacement of the bonded objects during subsequent handling and other processes.

[0018] In the present invention, the tackiness may be "hot tackiness" which occurs when the material has no tackiness at room temperature but becomes adhesive when heated. In this case, the sheet-shaped sintered bonding material can be easily handled even when it has no tackiness at room temperature.

[0019] The sheet-like sintered bonding material that has been bonded and fixed (also called temporary bonding) to the bonding member as described above can be peeled off if necessary.

[0020] In the present invention, the presence or absence of tackiness is evaluated by placing a 10 mm x 10 mm sheet-like sintered bonding material on a 50 mm x 50 mm, 1 mm thick metal plate of copper, aluminum, or the like, and then placing another 10 mm x 10 mm, 1 mm thick metal plate of copper, aluminum, or the like on top of the sheet-like sintered bonding material, and applying pressure at room temperature or while heating as described above.If the material does not fall when turned upside down, it is evaluated as having tackiness or hot tackiness.

[0021] The sheet-shaped sintered bonding material of the present invention has tackiness as described above, so that it can stably fix various parts at desired positions. The strength of this fixation is not particularly limited, as long as the parts to be joined do not move to a position different from their original positions (misalignment). For example, when a shear test piece according to JIS Z 3198-5 is made using the sheet-shaped sintered bonding material of the present invention and the shear strength is measured, if the strength is 0.01 MPa or more, the parts constituting electrical equipment, electronic equipment, semiconductor parts, and heat dissipation parts can be stably fixed.

[0022] The metal nanoparticles contained in the adhesive layer are composite metal nanoparticles in which an organic coating layer made of one or more aliphatic carboxylic acids having 1 to 10 or 12 carbon atoms is formed around a metal core having an average particle size of 1 to 200 nm and made of an aggregate of metal atoms.

[0023] The metal atoms constituting the metal nanoparticles may be, from the viewpoint of easily exerting the effects of the present invention, a metal element comprising copper, gold, platinum, palladium or silver, or a composite thereof.

[0024] Examples of aliphatic carboxylic acids having 1 to 10 or 12 carbon atoms include saturated fatty acids such as formic acid, acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, enanthic acid, caprylic acid, pelargonic acid, capric acid, and lauric acid; dicarboxylic acids such as oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, fumaric acid, and maleic acid; and tricarboxylic acids such as aconitic acid, but are not particularly limited thereto.

[0025] The particle size of the metal nanoparticles can be calculated by measuring the diameter under an electron microscope, for example.

[0026] The metal nanoparticles can be produced based on the methods described in, for example, Japanese Patent Nos. 4680313, 5256281, 5306322, and 5398935.

[0027] The two adhesive layers formed on the surface of the metal layer may contain the same metal nanoparticles, or may contain metal nanoparticles of different types or sizes. Furthermore, one adhesive layer may contain only one type of metal nanoparticle, or two or more types may be mixed. For example, when composite silver nanoparticles are used, the two adhesive layers may contain only composite silver nanoparticles, or one adhesive layer may contain composite silver nanoparticles and the other adhesive layer may contain composite metal nanoparticles other than silver, or one adhesive layer may contain composite silver nanoparticles and the other adhesive layer may contain composite silver nanoparticles and composite metal nanoparticles other than silver. Furthermore, even composite metal nanoparticles made of the same material may contain two or more types of particles of different sizes.

[0028] The solvent contained in the adhesive layer is a highly viscous solvent that can exhibit tackiness by containing the metal nanoparticles, and therefore is easily volatilized during sintering, which has the advantage of reducing the occurrence of voids in the bonding layer formed by sintering the metal nanoparticles.

[0029] The highly viscous solvent is not limited as long as it does not inhibit the sintering of the metal nanoparticles, and examples thereof include terpenes, polyols, etc. Examples of terpenes include terpineol, Tersorb THA90, isobornylcyclohexanol, etc. Examples of polyols include ethylene glycol, glycerin, triethanolamine, etc., and polyols containing fine particles such as polyethylene glycol, styrene-acrylonitrile copolymer, and polyurea, with isobornylcyclohexanol being preferred. The highly viscous solvent used as the solvent may be one type or a mixture of two or more types.

[0030] In addition, from the viewpoint of tackiness to a bonding member such as a semiconductor chip, the content of the high-viscosity solvent in the adhesive layer is preferably 0.1 to 20.0 mass %, and more preferably 0.1 to 5.0 mass %. In the present invention, the content of the high-viscosity solvent can be calculated, for example, by subtracting the amount of solvent volatilized during drying from the content of the high-viscosity solvent in a paste containing metal nanoparticles and a solvent used to form the adhesive layer.

[0031] In the present invention, a low-viscosity solvent may be used in addition to the high-viscosity solvent for viscosity adjustment. The low-viscosity solvent may be any solvent that can adjust the viscosity when mixed with the high-viscosity solvent, and there are no particular limitations on the type or content of the low-viscosity solvent.

[0032] The adhesive layer may contain a filler and a dispersant. The filler is not particularly limited as long as it can be used in a conductive paste, etc., and examples thereof include particulate metal fillers of one or more types selected from gold, silver, copper, platinum, and palladium. The dispersant is not particularly limited as long as it can be used in conductive pastes and the like, and examples thereof include saturated fatty acids having 4 to 18 carbon atoms, such as butanoic acid, hexanoic acid, octanoic acid, decanoic acid, lauric acid, myristic acid, pentadecylic acid, palmitic acid, and stearic acid; unsaturated fatty acids having 14 to 18 carbon atoms, such as myristoleic acid, palmitoleic acid, oleic acid, elaidic acid, linoleic acid, and linolenic acid; aliphatic amines, such as octylamine, laurylamine, oleylamine, myristylamine, and dodecyldimethylamine; tertiary amines, such as didodecyldimethylamine and trioctylamine; aromatic amines, such as naphthalenediamine; higher amines, such as octadecylamine; triamines, such as pentamethyldiethylenetriamine; and heterocyclic aromatic amines, such as pyridine.

[0033] The adhesive layer may also contain a binder such as a solid solvent or a polymer. The type and amount of the binder such as a solid solvent or a polymer are not particularly limited as long as the adhesive layer can exhibit the desired effect.

[0034] The composition of the metal nanoparticles, filler, and dispersant in the adhesive layer is not particularly limited as long as the content is such that the bonding member can be fixed after mounting, depending on the type of material of each component.

[0035] The thickness of the adhesive layer may be adjusted depending on the purpose of sintering and is not particularly limited. However, from the viewpoint of easily fixing bonding members constituting, for example, electrical devices, electronic devices, semiconductor components, heat dissipation components, etc., in the desired positions, a thickness of 20 to 100 μm is preferred, and 20 to 70 μm is more preferred. Furthermore, the thickness of the adhesive layer provided on one side of the metal layer may be constant, or may have thin and thick portions, as long as the effects of the present invention are obtained. For example, the thickness may increase gradually from one direction to the other. Furthermore, the thicknesses of the adhesive layers provided on both sides of the metal layer may be the same or different, as long as the effects of the present invention are obtained. For example, electronic devices and semiconductor modules may have thickness limitations due to their design. However, the sheet-shaped sintered bonding material of the present invention firmly bonds and fixes bonding members, so that bonding strength can be maintained at a constant and sufficient level within the above-mentioned adhesive layer thickness range without decreasing.

[0036] The sheet-shaped sintered bonding material of the present invention can be produced, for example, by adhering a mixture containing the metal nanoparticles and the solvent, and if necessary, the filler and dispersant, to both sides of a plate-shaped or foil-shaped metal that will become the metal layer using a known method to form an adhesive layer, and if necessary, drying the adhesive layer until the solvent content in the adhesive layer reaches the desired amount.

[0037] The method for mixing the metal nanoparticles with the solvent is not particularly limited as long as it is possible to mix the metal nanoparticles.

[0038] Methods for applying the mixture to both sides of a plate-shaped or foil-shaped metal include, but are not limited to, screen printing, spray coating, roll coating, spin coating, dispensing, and inkjet methods.

[0039] Furthermore, when producing the sheet-shaped sintered bonding material of the present invention, the adhesive layers on both sides of the metal layer contain metal nanoparticles, which results in excellent physical properties such as electrical conductivity, thermal conductivity, bonding characteristics, and bonding reliability.

[0040] The sheet-shaped sintered bonding material of the present invention obtained as described above can bond various bonding target members (bonding members) constituting electric devices, electronic devices, semiconductor parts or heat dissipation parts.

[0041] In the present invention, the members to be joined (joining members) are not particularly limited as long as they are members constituting electrical equipment, electronic equipment, semiconductor parts or heat dissipation parts.

[0042] The bonding method may be the same as that of conventional sheet-like bonding materials. For example, in electrical equipment, electronic devices, semiconductor components, or heat dissipation components, one adhesive layer of the sheet-like sintered bonding material of the present invention is adhered to the surface of the component A to be bonded, and then another component B to be bonded is adhered to the other adhesive layer to form a laminated structure consisting of component A, sheet-like sintered bonding material, and component B. Then, this laminated structure is heated and sintered to a desired temperature, sintering the metal nanoparticles contained in the adhesive layer to form a metal sintered product, which can be bonded. In the present invention, the sintering conditions, such as the temperature and time, are not particularly limited as long as they are a temperature at which the metal nanoparticles used can be sintered.

[0043] The bonded part has a laminated structure of component A - bonding layer made of sintered metal nanoparticles - metal layer - bonding layer made of sintered metal nanoparticles - component B, and both bonding layers have a uniform thickness and few voids, allowing components A and B to be firmly bonded without misalignment. Furthermore, the part has a bonding layer made of uniform metal nanoparticles, and there is very little void or crack occurrence in the bonding layer or bonding interface, which can contribute to the production of highly reliable bonds and components.

[0044] In the following examples, the following materials were used. (Metal Paste) Metal Paste 1: (Commercially available product, a paste-like composition containing composite silver nanoparticles (average particle size of metal cores: 1 to 200 nm, material of organic coating layer covering the metal cores: aliphatic carboxylic acid having 1 to 10 or 12 carbon atoms), solvent (isobornylcyclohexanol), filler (silver-coated copper filler with particle size of 5 μm), and dispersant (linoleic acid). (Metal Layer) Metal Foil 1: Copper foil, thickness: 30 μm

[0045] Example 1 [Method for manufacturing sheet-like sintered bonding material 1] Sheet-like sintered bonding material 1 was produced using the materials shown in Table 1. That is, metal paste 1 was applied to both sides of metal foil 1 so that the adhesive layer thickness after drying was 50 μm, and the material was placed in a high-temperature incubator set at 100°C and dried for 20 minutes. The total thickness was 130 μm, and the solvent content was 2 mass%. The coating method used was screen printing, a #120 metal mesh (opening ratio 41%, wire diameter 23 μm, mesh thickness 41 μm), and a squeegee with an A hardness of 80.

[0046] The measurement results for each part of each of the resulting bonding materials are shown in Table 1.

[0047]

[0048] Test Example 1 Evaluation of Sheet-Like Bonding Material Samples: (1) Evaluation of Tackiness (Temporary Bonding) Between oxygen-free copper test piece A (size: thickness 2 mm, diameter 5 mm) and oxygen-free copper test piece B (size: thickness 5 mm, diameter 10 mm), the sheet-like bonding material 1 produced in Example 1 was placed, and a baking device (upper and lower pulse heat unit bonding device) manufactured by Nippon Avionics Co., Ltd. was used. Temporary bonding was performed at a temperature of 180 ° C., a pressure of 2.5 MPa, and a holding time of 10 seconds to obtain a temporary bonded product 1. In order to confirm the tackiness of the temporary bonded product 1, test piece B was held so that test piece A was facing downward, and even if it was gently shaken up and down and left and right, it was confirmed that the bonded state was maintained and test piece A did not peel off or fall.

[0049] Test Example 2 Evaluation of Sheet-Like Bonding Material Sample: (2) Measurement of Shear Strength The shear strength was measured in accordance with JIS Z 3198-5. Specifically, the test piece prepared in Test Example 1 was used as a No. 2 shear test piece in accordance with JIS Z 3198-5, and the shear strength was measured using a TENSILON strength tester manufactured by A&D Co., Ltd., confirming a shear strength of 0.1 MPa (2 N). In addition, it was confirmed with an optical microscope that there were no voids on the fracture surface of the sample on which the shear strength was measured. Therefore, it can be seen that the sheet-like sintered bonding material of the present invention has excellent tackiness to the bonding members, and this tackiness allows various parts to be stably fixed in the desired position in the temporary bonded state.

[0050] Test Example 3: Confirmation of Bonding Strength The temporarily bonded samples obtained in Test Example 1 were bonded using a baking device (upper and lower pulse heat unit bonding device) manufactured by Nippon Avionics Co., Ltd., at a temperature of 300°C, a pressure of 10 MPa, and a holding time of 180 seconds.

[0051] The shear strength was measured using a TENSILON strength tester manufactured by A&D Co., Ltd., and a strength of 56 MPa was confirmed.

[0052] Furthermore, to confirm the bonding condition, the bonded sample was embedded in resin, polished, and the bonded cross section was observed using a JEOL JCM-5700. The results are shown in Figure 1. As shown in the enlarged SEM photograph in Figure 1, it was confirmed that there were no voids or cracks in the bonded interface or bonded layer, and that the bond was good.

[0053] Examples 2 to 4 Three types of sheet-like sintered bonding materials were produced in the same manner as in Example 1, except that the thicknesses of bonding layers 1 and 2 after drying were changed as shown in Table 2.

[0054] Next, except that the sheet-like sintered bonding materials obtained in Examples 2 to 4 were used, test pieces A and B were temporarily bonded in the same manner as in Test Example 1. For the three types of temporarily bonded materials obtained, even when test piece B was held so that test piece A was facing downward and gently shook up and down and left and right, the bonded state was maintained and test piece A did not peel off or fall off, confirming that all of the sheet-like sintered bonding materials obtained in Examples 2 to 4 had tackiness.

[0055] The three types of temporarily bonded materials were bonded using a baking device (upper and lower pulse heat unit bonding device) manufactured by Nippon Avionics Co., Ltd., at a temperature of 300°C, a pressure of 10 MPa, a bonding time of 180 seconds, and a holding time of 150 seconds, as in Test Example 3. A random portion of the resulting sheet-like bonded material was selected and cut out as a No. 2 shear test piece in accordance with JIS Z 3198-5. The shear strength was measured using a TENSILON strength tester manufactured by A&D Co., Ltd., and the average value was calculated. The results are shown in Table 2.

[0056]

[0057] From the results shown in Table 2, when the thickness of adhesive layer 1 and adhesive layer 2 in the sheet-shaped sintered bonding material after drying is 20 μm or more, as in Examples 2 to 4, even if there is a difference in thickness between adhesive layer 1 and adhesive layer 2, there is no significant change in the bonding strength, and it was found that all of them exhibit a sufficient adhesive strength of 10 MPa or more.

[0058] From the above, it can be seen that even if the thickness of each adhesive layer on both sides of the sheet-shaped sintered bonding material is changed, there is no significant change in tackiness, and it is possible to prevent defects due to "misalignment." Since each bonding member does not move during the process, it is possible to improve productivity such as handleability and yield. Moreover, even if the thickness of the bonding layer varies, a certain level of bonding strength or more can be obtained, so it is possible to efficiently manufacture electrical equipment, electronic equipment, semiconductor parts, heat dissipation parts, etc. with desired performance.

Claims

1. A sheet-like sintered bonding material comprising: a metal layer made of a plate-like or foil-like metal; and adhesive layers having tackiness, containing metal nanoparticles and a solvent, on both sides of the metal layer; wherein the metal nanoparticles are composite metal nanoparticles in which an organic coating layer made of one or more aliphatic carboxylic acids having 1 to 10 or 12 carbon atoms is formed around a metal core having an average particle size of 1 to 200 nm and made of an aggregate of metal atoms.

2. The sheet-shaped sintered composite material according to claim 1, wherein the solvent comprises one or more highly viscous solvents.

3. A sheet-like sintered bonding material according to claim 1 or 2, wherein the content of the highly viscous solvent in the adhesive layer is 0.1 to 20.0 mass %.

4. A sheet-like sintered bonding material according to claim 1 or 2, wherein the thickness of said metal layer is 10 to 1000 μm, and the thickness of said adhesive layer is 20 to 100 μm.

5. A sheet-shaped sintered bonding material according to claim 1 or 2, wherein the metal atoms constituting the metal nanoparticles are a single metal selected from the group consisting of copper, gold, platinum, palladium, and silver, or a composite thereof.

6. A sheet-shaped sintered bonding material according to claim 1 or 2, wherein the adhesive layers on both sides of the metal layer enable the bonding members to be fixed after being mounted on the sheet-shaped sintered bonding material.

7. The sheet-shaped sintered bonding material according to claim 1 or 2, wherein the adhesive layer contains metal nanoparticles, a filler, a solvent, and a dispersant.

8. A sheet-like sintered bonding material according to claim 1 or 2, wherein one or both surfaces of the metal layer are surface-treated with one or more metals selected from the group consisting of copper, gold, silver, platinum, and palladium, or composites thereof.

9. A joint formed by joining the sheet-like sintered joining material according to claim 1 or 2 with a joining member, or an electric device, electronic device, semiconductor part or heat dissipation part in which said joint is used.

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