Electronic device comprising structure for heat dissipation

Abstract

An electronic device, according to an embodiment, may comprise: a bracket comprising a seating portion; a printed circuit board disposed toward the bracket; a heating component disposed on one surface of the printed circuit board, the surface facing the bracket; a battery spaced apart from the heating component and accommodated in the bracket; and a vapor chamber mounted to the seating portion of the bracket. The vapor chamber may comprise a first portion disposed above the heating component, a second portion interposed between the battery and the seating portion, and a third portion extending from the first portion to the second portion.

Description

Electronic device including a structure for heat dissipation

[0001] The present disclosure relates to an electronic device including a structure for heat dissipation.

[0002] Electronic devices may include various electronic components. These devices may be miniaturized to be worn or carried by a user. As the electronic components within these miniaturized electronic devices operate in response to user requests, heat may be generated within the electronic devices. These electronic devices may require a structure for dissipating the heat generated within the electronic devices.

[0003] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] An electronic device is disclosed. The electronic device may include a bracket including a mounting portion, a printed circuit board disposed on the bracket, a heat generating component disposed on one side of the printed circuit board facing the bracket, a battery accommodated in the bracket and spaced apart from the heat generating component, and a vapor chamber on the mounting portion of the bracket. The vapor chamber may include a first portion disposed above the heat generating component, a second portion interposed between the battery and the mounting portion, and a third portion extending from the first portion to the second portion.

[0005] An electronic device is disclosed. The electronic device may include a bracket including a mounting portion, a printed circuit board disposed toward the bracket, a heat-generating component disposed on one surface of the printed circuit board facing the bracket, a shield can disposed on the one surface of the printed circuit board, the shield can including a through hole and surrounding the heat-generating component, a shielding sheet attached to the shield can to cover the through hole of the shield can, a heat-conducting member interposed between the heat-generating component and the shielding sheet through the through hole of the shield can, a battery accommodated in the bracket and spaced apart from the heat-generating component, and a vapor chamber mounted to the mounting portion of the bracket. The vapor chamber may include a first portion attached to the shielding sheet, a second portion interposed between the battery and the mounting portion, and a third portion extending from the first portion to the second portion.

[0006] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0007] Figure 2a illustrates an unfolded state of an exemplary electronic device.

[0008] Figure 2b illustrates a folded state of an exemplary electronic device.

[0009] Figure 2c is an exploded view of an exemplary electronic device.

[0010] Figure 3a illustrates an unfolded state of an exemplary electronic device.

[0011] Figure 3b illustrates a folded state of an exemplary electronic device.

[0012] Figure 4 illustrates a portion of an exemplary electronic device.

[0013] Figure 5a illustrates a portion of an exemplary electronic device.

[0014] Figure 5b is a partially exploded perspective view of an exemplary electronic device.

[0015] Figure 5c illustrates a portion of an exemplary electronic device.

[0016] Figures 6a and 6b illustrate portions of exemplary electronic devices.

[0017] Figures 6c, 6d, and 6e illustrate a vapor chamber of an exemplary electronic device.

[0018] FIG. 7A is a cross-sectional view of a vapor chamber of an exemplary electronic device taken along line A-A' of FIG. 6A.

[0019] FIG. 7b is a top plan view of a first plate of a vapor chamber of an exemplary electronic device.

[0020] Figure 7c is a plan view of a second plate of a vapor chamber of an exemplary electronic device.

[0021] FIG. 7d illustrates a portion of a second plate of a vapor chamber of an exemplary electronic device.

[0022] Figure 8 illustrates a structure for heat dissipation of an exemplary electronic device.

[0023] Figure 9a is a drawing showing an exemplary electronic device.

[0024] Figure 9b is an exploded perspective view of an exemplary electronic device.

[0025] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0026] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0027] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0028] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0029] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0030] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0031] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0032] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0033] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0034] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0035] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0036] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0037] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0038] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0039] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0040] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0041] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0042] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0043] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0044] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0045] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0046] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0047] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or server (108)). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0048] Figure 2a illustrates an unfolded state of an exemplary electronic device. Figure 2b illustrates a folded state of an exemplary electronic device. Figure 2c is an exploded view of an exemplary electronic device.

[0049] Referring to FIGS. 2A, 2B, and 2C, the electronic device (101) may include a housing (200) including a first housing part (210) and a second housing part (220), a display (230), at least one camera (240) (e.g., the camera module (180) of FIG. 1), a hinge structure (250), and / or at least one electronic component (260).

[0050] The first housing part (210) and the second housing part (220) may form at least a portion of an outer surface of the electronic device (101) that can be gripped by a user. At least a portion of the outer surface of the electronic device (101) defined by the first housing part (210) and the second housing part (220) may come into contact with a portion of the user's body when the electronic device (101) is used by the user. According to one embodiment, the first housing part (210) may include a first front surface (211), a first rear surface (212) facing the first front surface (211) and spaced apart from the first front surface (211), and first side surfaces (213) surrounding at least a portion of the first front surface (211) and the first rear surface (212). The first side surfaces (213) may connect the periphery of the first front surface (211) and the periphery of the first rear surface (212). The first front surface (211), the first rear surface (212), and the first side surfaces (213) may define an internal space of the first housing part (210). According to one embodiment, the first housing part (210) may provide a space formed by the first front surface (211), the first rear surface (212), and the first side surfaces (213) as a space for arranging components of the electronic device (101).

[0051] The second housing part (220) may include a second front surface (221), a second rear surface (222) facing the second front surface (221) and spaced apart from the second front surface (221), and second side surfaces (223) surrounding at least a portion of the second front surface (221) and the second rear surface (222). The second side surfaces (223) may connect a periphery of the second front surface (221) and a periphery of the second rear surface (222). The second front surface (221), the second rear surface (222), and the second side surfaces (223) may define an interior space of the second housing part (220). According to one embodiment, the second housing part (220) may provide a space formed by a second front surface (221), a second rear surface (222), and second side surfaces (223) surrounding at least a portion of the second front surface (221) and the second rear surface (222), as a space for mounting components of the electronic device (101). According to one embodiment, the second housing part (220) may be coupled to the first housing part (210) so as to be rotatable with respect to the first housing part (210).

[0052] Each of the first housing part (210) and the second housing part (220) may include a first protective member (214) and a second protective member (224), respectively. The first protective member (214) and the second protective member (224) may be disposed on the first front surface (211) and the second front surface (221) along the periphery of the display (230). According to one embodiment, the first protective member (214) and the second protective member (224) may prevent foreign substances (e.g., dust or moisture) from entering through the gap between the display (230) and the first housing part (210) and the second housing part (220). For example, the first protective member (214) may surround an edge of the first flat portion (231) of the display (230), and the second protective member (224) may surround an edge of the second flat portion (232) of the display (230). The first protective member (214) may be formed by being attached to the first side surfaces (213) of the first housing part (210), or may be formed integrally with the first side surfaces (213). The second protective member (224) may be formed by being attached to the second side surfaces (223) of the second housing part (220), or may be formed integrally with the second side surfaces (223).

[0053] The first side surfaces (213) and the second side surfaces (223) may include a conductive material, a non-conductive material, or a combination thereof. For example, the second side surfaces (223) may include at least one conductive portion (225) and at least one non-conductive portion (226). The at least one conductive portion (225) may include a plurality of conductive portions that are each spaced apart from each other. The at least one non-conductive portion (226) may be disposed between the plurality of conductive portions. The plurality of conductive portions may be isolated (e.g., electrically isolated) from each other by the at least one non-conductive portion (226) disposed between the plurality of conductive portions. In one embodiment, the plurality of conductive portions and the plurality of non-conductive portions may together form an antenna radiator. The electronic device (101) may be capable of communicating with an external electronic device through the antenna radiator formed by the plurality of conductive portions and the plurality of non-conductive portions.

[0054] The display (230) may be configured to display visual information. According to one embodiment, the display (230) may be disposed on a first front surface (211) of the first housing part (210) and a second front surface (221) of the second housing part (220) across the hinge structure (250). For example, the display (230) may include a first planar portion (231) disposed on the first front surface (211) of the first housing, a second planar portion (232) disposed on the second front surface (221) of the second housing, and a foldable portion (233) disposed between the first planar portion (231) and the second planar portion (232). The first planar portion (231), the second planar portion (232), and the foldable portion (233) may form a front surface of the display (230). According to one embodiment, the display (230) may further include a sub-display (235) disposed on the second rear surface (222) of the second housing part (220). For example, the display (230) may be referred to as a flexible display. According to one embodiment, the display (230) may include a window exposed toward the outside of the electronic device (101). The window may protect the surface of the display (230) and may include a substantially transparent material to transmit visual information provided by the display (230) to the outside of the electronic device (101). For example, the window may include, but is not limited to, glass (e.g., UTG, ultra-thin glass) and / or a polymer (e.g., PI, polyimide).

[0055] At least one camera (240) may be configured to acquire an image based on receiving light from a subject external to the electronic device (101). According to one embodiment, the at least one camera (240) may include first cameras (241), second cameras (242), and / or third cameras (243). The first cameras (241) may be disposed in the first housing part (210). For example, the first cameras (241) may be disposed inside the first housing part (210) and at least a portion of the first cameras (241) may be visible through the first rear surface (212) of the first housing part (210). The first cameras (241) may be supported by a bracket within the first housing part (210). The first housing part (210) may include at least one opening (241a) that overlaps the first cameras (241) when viewed from above on the first rear surface (212). The first cameras (241) may acquire images based on receiving light from the outside of the electronic device (101) through the at least one opening (241a).

[0056] The second camera (242) may be disposed in the second housing part (220). For example, the second camera (242) may be disposed inside the second housing part (220) and may be visible through the sub-display (235). The second housing part (220) may include at least one opening (242a) that overlaps the second camera (242) when the second rear surface (222) is viewed from above. The second camera (242) may acquire an image based on receiving light from the outside of the electronic device (101) through the at least one opening (242a).

[0057] The third camera (243) may be disposed in the first housing part (210). For example, the third camera (243) may be disposed inside the first housing part (210) and at least a portion thereof may be visible through the first front surface (211) of the first housing part (210). As another example, the third camera (243) may be disposed inside the first housing part (210) and at least a portion thereof may be visible through the first flat surface portion (231) of the display (230). The first flat surface portion (231) of the display (230) may include at least one opening that overlaps the third camera (243) when the display (230) is viewed from above. The third camera (243) may acquire an image based on receiving light from the outside of the display (230) through the at least one opening.

[0058] The second camera (242) and the third camera (243) may be positioned below the display (230) (e.g., toward the inside of the first housing part (210) or the inside of the second housing part (220). For example, the second camera (242) and the third camera (243) may be under-display cameras (UDCs). When the second camera (242) and the third camera (243) are under-display cameras, an area of ​​the display (230) corresponding to the respective positions of the second camera (242) and the third camera (243) may not be an inactive area. For example, when the second camera (242) and the third camera (243) are under-display cameras, an area of ​​the display (230) corresponding to the respective positions of the second camera (242) and the third camera (243) may have a lower pixel density than the pixel density of other areas of the display (230). The inactive area of ​​the display (230) may refer to an area of ​​the display (230) that does not include pixels or does not emit light outside of the electronic device (101). For another example, the second camera (242) and the third camera (243) may be punch-hole cameras. When the second camera (242) and the third camera (243) are punch-hole cameras, an area of ​​the display (230) corresponding to the respective positions of the second camera (242) and the third camera (243) may be an inactive area. For example, when the second camera (242) and the third camera (243) are punch-hole cameras, an area of ​​the display (230) corresponding to the respective positions of the second camera (242) and the third camera (243) may include an opening that does not include pixels.

[0059] The hinge structure (250) can rotatably connect the first housing part (210) and the second housing part (220). The hinge structure (250) can be positioned between the first housing part (210) and the second housing part (220) of the electronic device (101) so that the electronic device (101) can be bent, curved, or folded. For example, the hinge structure (250) can be positioned between a portion of the first side surfaces (213) and a portion of the second side surfaces (223) that face each other. The hinge structure (250) can change the electronic device (101) into an unfolding state in which the first front surface (211) of the first housing part (210) and the second front surface (221) of the second housing part (220) face each other in substantially the same direction, or into a folding state in which the first front surface (211) and the second front surface (221) face each other. When the electronic device (101) is in a folded state, the first housing part (210) and the second housing part (220) can be folded or overlapped by facing each other.

[0060] When the electronic device (101) is in a folded state, the direction in which the first front surface (211) faces and the direction in which the second front surface (221) faces may be different from each other. For example, when the electronic device (101) is in a folded state, the direction in which the first front surface (211) faces and the direction in which the second front surface (221) faces may be opposite to each other. For another example, when the electronic device (101) is in a folded state, the direction in which the first front surface (211) faces and the direction in which the second front surface (221) faces may be inclined with respect to each other. When the direction in which the first front surface (211) faces is inclined with respect to the direction in which the second front surface (221) faces, the first housing part (210) may be inclined with respect to the second housing part (220). However, the present invention is not limited thereto. For example, in the folded state of the electronic device (101), the first rear surface (212) of the first housing part (210) may face the second rear surface (222) of the second housing part (220). When the first rear surface (212) and the second rear surface (222) face each other in the folded state of the electronic device (101), the direction in which the first front surface (211) faces and the direction in which the second front surface (221) faces may be opposite to each other. When the first rear surface (212) and the second rear surface (222) face each other in the folded state of the electronic device (101), the display (230) may be directly exposed to the outside in the folded state of the electronic device (101).

[0061] The electronic device (101) may be foldable based on a folding axis (f). The folding axis (f) may refer to an imaginary line extending through the hinge cover (251) in a direction substantially parallel to the longitudinal direction of the electronic device (101), but is not limited thereto. For example, the folding axis (f) may be an imaginary line extending in a direction substantially perpendicular to the longitudinal direction of the electronic device (101). When the folding axis (f) extends in a direction substantially perpendicular to the longitudinal direction of the electronic device (101), the hinge structure (250) may extend in a direction parallel to the folding axis (f) to connect the first housing part (210) and the second housing part (220). The first housing part (210) and the second housing part (220) may be rotatable by the hinge structure (250) extending in a direction substantially perpendicular to the longitudinal direction of the electronic device (101).

[0062] The hinge structure (250) may include a hinge cover (251), a first hinge plate (252), a second hinge plate (253), and a hinge module (254). The hinge cover (251) may surround internal components of the hinge structure (250) and form an outer surface of the hinge structure (250). According to one embodiment, the hinge cover (251) surrounding the hinge structure (250) may be at least partially exposed to the outside of the electronic device (101) through a space between the first housing part (210) and the second housing part (220) when the electronic device (101) is in a folded state. According to an embodiment, when the electronic device (101) is in an unfolded state, the hinge cover (251) may be covered by the first housing part (210) and the second housing part (220) and may not be exposed to the outside of the electronic device (101).

[0063] The first hinge plate (252) and the second hinge plate (253) are coupled to the first housing part (210) and the second housing part (220), respectively, so that the first housing part (210) and the second housing part (220) can be rotatably connected. For example, the first hinge plate (252) can be coupled to the first bracket (215) of the first housing part (210), and the second hinge plate (253) can be coupled to the second bracket (227) of the second housing part (220). As the first hinge plate (252) and the second hinge plate (253) are coupled to the first bracket (215) and the second bracket (227), respectively, the first housing part (210) and the second housing part (220) can be rotated according to the rotation of the first hinge plate (252) and the second hinge plate (253).

[0064] The hinge module (254) can rotate the first hinge plate (252) and the second hinge plate (253). For example, the hinge module (254) can rotate the first hinge plate (252) and the second hinge plate (253) about the folding axis (f) by including gears that are interlocked with each other and can rotate. According to one embodiment, the hinge module (254) can be a plurality of pieces. For example, the plurality of hinge modules (254) can be arranged spaced apart from each other at both ends of the first hinge plate (252) and the second hinge plate (253), respectively.

[0065] The first housing part (210) may include a first bracket (215) and a first cover (216), and the second housing part (220) may include a second bracket (227) and a second cover (228). The first bracket (215) and the first cover (216) may support components of the electronic device (101). The first bracket (215) may define the first housing part (210) by being coupled with the first cover (216). The first cover (216) may define a portion of the outer surface of the first housing part (210). The second bracket (227) and the second cover (228) may support components of the electronic device (101). The second bracket (227) can define a second housing part (220) by being combined with the second cover (228). The second cover (228) can define a portion of the outer surface of the second housing part (220). For example, the display (230) can be disposed on one side of the first bracket (215) and one side of the second bracket (227). The first cover (216) can be disposed on the other side of the first bracket (215) opposite to the one side of the first bracket (215). The second cover (228) can be disposed on the other side of the second bracket (227) opposite to the one side of the second bracket (227). The sub-display (235) can be disposed between the second bracket (227) and the second cover (228).

[0066] A portion of the first bracket (215) may be surrounded by the first side surfaces (213), and a portion of the second bracket (227) may be surrounded by the second side surfaces (223). For example, the first bracket (215) may be formed integrally with the first side surfaces (213), and the second bracket (227) may be formed integrally with the second side surfaces (223). For another example, the first bracket (215) may be formed separately from the first side surfaces (213), and the second bracket (227) may be formed separately from the second side surfaces (223).

[0067] At least one electronic component (260) may implement various functions to be provided to a user. According to one embodiment, at least one electronic component (260) may include a first printed circuit board (261), a second printed circuit board (262), a flexible printed circuit board (263), a battery (264) (e.g., battery (189) of FIG. 1), and / or an antenna (265) (e.g., antenna module (197) of FIG. 1). The first printed circuit board (261) and the second printed circuit board (262) may each form an electrical connection between components within the electronic device (101). For example, components for implementing the overall function of the electronic device (101) (e.g., the processor (120) of FIG. 1) may be placed on the first printed circuit board (261), and at least one electronic component for implementing a part of the function of the first printed circuit board (261) may be placed on the second printed circuit board (262). As another example, components for the operation of the sub-display (235) placed on the second rear surface (222) may be placed on the second printed circuit board (262).

[0068] A first printed circuit board (261) may be disposed within a first housing part (210). For example, the first printed circuit board (261) may be disposed on one surface of a first bracket (215). According to one embodiment, a second printed circuit board (262) may be disposed within a second housing part (220). For example, the second printed circuit board (262) may be spaced apart from the first printed circuit board (261) and disposed on one surface of a second bracket (227). A flexible printed circuit board (263) may connect the first printed circuit board (261) and the second printed circuit board (262). For example, the flexible printed circuit board (263) may extend from the first printed circuit board (261) to the second printed circuit board (262).

[0069] The battery (264) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, and / or a fuel cell. At least a portion of the battery (264) may be disposed substantially on the same plane as the first printed circuit board (261) or the second printed circuit board (262).

[0070] The antenna (265) may be configured to receive power or a signal from outside the electronic device (101). According to one embodiment, the antenna (265) may be disposed between the first cover (216) and the battery (264). The antenna (265) may include, for example, a near field communication (NFC) antenna, an antenna module, and / or a magnetic secure transmission (MST) antenna. The antenna (265) may, for example, perform short-range communication with an external device and / or wirelessly transmit and receive power required for charging.

[0071] Fig. 3a illustrates an unfolded state of an exemplary electronic device. Fig. 3b illustrates a folded state of an exemplary electronic device.

[0072] The electronic device (101) exemplarily illustrated and described in FIGS. 3A and 3B may include a housing (200) including a first housing part (210) and a second housing part (220) rotatable with respect to the first housing part (210), like the electronic device (101) exemplarily illustrated and described in FIGS. 2A to 2C. The electronic device (101) exemplarily illustrated and described in FIGS. 3A and 3B may be referred to as a foldable electronic device in that it includes a display (230) including a foldable portion (233) that is deformable by a hinge structure (250) (or hinge assembly) configured to rotate the second housing part (220) with respect to the first housing part (210), like the electronic device (101) exemplarily illustrated and described in FIGS. 2A to 2C. For example, the folding axis (f) of the electronic device (101) exemplarily illustrated and described in FIGS. 3A and 3B may be parallel to the x-axis, as illustrated. The folding axis (f) of the electronic device (101) exemplarily illustrated and described in FIGS. 2A to 2C may be parallel to the y-axis, which is orthogonal to the x-axis, unlike the electronic device (101) exemplarily illustrated and described in FIGS. 3A and 3B. However, the electronic device (101) exemplarily illustrated and described in FIGS. 2A to 3B is a non-limiting example, and the electronic device (101) may have various foldable form factors (e.g., a multi-foldable electronic device that can be folded multiple times). Hereinafter, the electronic device (101) exemplarily illustrated in FIGS. 3A and 3B will be described with reference to the description of the components having the same reference numerals in FIGS. 2A to 2C.

[0073] An electronic device (101) may include a housing (200) including a first housing part (210) and a second housing part (220), and a hinge structure (or hinge assembly) (250). The first housing part (210) may be rotatably connected to the hinge structure (250). The first housing part (210) may be rotatable relative to the second housing part (220) via the hinge structure (250). The second housing part (220) may be rotatably connected to the hinge structure (250). The second housing part (220) may be rotatable relative to the first housing part (210) via the hinge structure (250).

[0074] The first housing part (210) may include a first front surface (211), a first rear surface (212) facing away from the first front surface (211), and first side surfaces (213) surrounding at least a portion of the first front surface (211) and the first rear surface (212). The first housing part (210) may provide a space for arranging components of the electronic device (101). The first housing part (210) may include a conductive material, a non-conductive material, or a combination thereof.

[0075] The second housing part (220) may include a second front surface (221), a second rear surface (222) facing and separated from the second front surface (221), and second side surfaces (223) surrounding at least a portion of the second front surface (221) and the second rear surface (222). The second housing part (220) may provide a space for arranging components of the electronic device (101).

[0076] The hinge structure (250) may be connected to the first housing part (210) and the second housing part (220), respectively. For example, the hinge structure (250) may include a first hinge plate (e.g., the first hinge plate (252) of FIG. 2C) and a second hinge plate (e.g., the second hinge plate (253) of FIG. 2C) configured to be rotatable. The first hinge plate may be connected to the first housing part (210), and the first housing part (210) may be rotated by the first hinge plate. The second hinge plate may be connected to the second housing part (220), and the second housing part (220) may be rotated by the second hinge plate.

[0077] The electronic device (101) can be folded or unfolded based on a folding axis (f) passing through the hinge structure (250) according to the rotation of the first housing part (210) and the second housing part (220). The hinge structure (250) can be positioned between the first housing part (210) and the second housing part (220) so that the electronic device (101) can be folded based on the folding axis (f).

[0078] The hinge structure (250) may include a hinge cover (251) for covering an internal structure constituting the mechanism of the hinge structure. The hinge cover (251) may be exposed to the outside or covered by the first housing part (210) and the second housing part (220) depending on the degree to which the electronic device (101) is folded. For example, while the electronic device (101) is in a folded state (e.g., FIG. 3b), the hinge cover (251) may be at least partially exposed between the first housing part (210) and the second housing part (220). For example, while the electronic device (101) is in an unfolded state (e.g., FIG. 3a), the hinge cover (251) may be covered by the first housing part (210) and the second housing part (220).

[0079] The electronic device (101) may include a display (230) (e.g., the display module (160) of FIG. 1) disposed within a space provided by a first housing part (210) and a second housing part (220). For example, the display (230) may be at least partially accommodated within a recess formed in a first front surface (211) of the first housing part (210) and a second front surface (221) of the second housing part (220). The display (230) may include a first flat portion (231) aligned with respect to the first housing part (210), a second flat portion (232) spaced apart from the first flat portion (231) and aligned with respect to the second housing part (220), and a foldable portion (233) aligned with respect to a hinge structure (250) and extending from the first flat portion (231) to the second flat portion (232). The display (230) may be referred to as a foldable display or a flexible display. The first planar portion (231), the second planar portion (232), and the foldable portion (233) may form a surface of the display (230). The surface of the display (230) may at least partially form a first front surface (211) of the first housing part (210) and a second front surface (221) of the second housing part (220). The first planar portion (231), the second planar portion (232), and the foldable portion (233) may define a first display area, a second display area, and a third display area of ​​the display (230), respectively, on which visual information may be displayed.

[0080] The electronic device (101) may include a sub-display (235) (e.g., the display module (160) of FIG. 1) disposed within the first housing part (210). The sub-display (235) may be visible through the second rear surface (222) of the first housing part (210).

[0081] The electronic device (101) may include a plurality of cameras (e.g., the camera module (180) of FIG. 1). For example, the electronic device (101) may include cameras (234, 236). The camera (234) may be positioned within the first housing part (210) so as to obtain an image through a portion of the first rear surface (212). The camera (236) may be positioned below the first flat portion (231) of the display (230). The camera (236) may be aligned with an opening that at least partially penetrates the first flat portion (231) and obtain an image through the hole. The camera (236) may be positioned within a screen display area of ​​the display (230), but is not limited thereto.

[0082] Hereinafter, the states of the electronic device (101) will be described. The electronic device (101) may include a plurality of states, including an unfolded state (e.g., FIG. 3a) and a folded state (e.g., FIG. 3b). The electronic device (101) may transform or change in the unfolded state and the folded state. In addition, the electronic device (101) may include a plurality of intermediate states between the unfolded state and the folded state. Depending on the state of the electronic device (101), the angle between the first housing part (210) and the second housing part (220) may vary.

[0083] Referring to FIG. 3A, in the unfolded state, the first housing part (210) and the second housing part (220) may form a first angle. For example, the first angle may be about 180 degrees. The first planar portion (231), the second planar portion (232), and the foldable portion (233) of the display (230) may form a substantially flat surface. The direction in which the first front surface (211) (or the first planar portion (231)) of the first housing part (210) faces (e.g., the +z direction) and the direction in which the second front surface (221) (or the second planar portion (232)) of the second housing part (220) faces (e.g., the +z direction) may be substantially the same.

[0084] Referring to FIG. 3B, in the unfolded state of the electronic device (101), the first housing part (210) and the second housing part (220) can be folded to face each other by rotating around the folding axis (f). The first housing part (210) and the second housing part (220) can be overlapped to form a second angle smaller than the first angle. For example, the second angle can be about 0 degrees. The foldable portion (233) of the display (230) can be bent to correspond to the second angle. The first front surface (211) of the first housing part (210) can face the second front surface (221) of the second housing part (220) or overlap with the second front surface (221). The first housing part (210) and the second housing part (220) can be in at least partial contact, but are not limited thereto. The direction in which the first front surface (211) of the first housing part (210) faces (e.g., +z direction) and the direction in which the second front surface (221) of the second housing part (220) faces (e.g., -z direction) may be opposite to each other. In the folded state, at least a portion of the display (230) may not be visible from the outside of the electronic device (101), and the sub-display (235) may be visible from the outside of the electronic device (101).

[0085] Figure 4 illustrates a portion of an exemplary electronic device.

[0086] Referring to FIG. 4, the electronic device (101) may include a housing (200) including a bracket (410) (e.g., the first bracket (215) of FIG. 2c), a heat dissipation sheet (420), a printed circuit board (430), and a battery (264). The housing (200) may be the first housing part (210) among the first housing part (210) and the second housing part (220) of the electronic device (101) exemplarily illustrated and described in FIGS. 2a to 3b, but embodiments of the present disclosure are not limited thereto.

[0087] The bracket (410) may support the display (230) of the electronic device (101) and / or structures disposed under the display (230) to support the display (230). For example, the bracket (410) may form at least a portion of the exterior of the housing (200). For example, the bracket (410) may provide a space for accommodating electronic components within the electronic device (101). At least some of the electronic components may be electrically connected to the display (230). However, embodiments of the present disclosure are not limited thereto.

[0088] The bracket (410) may include a mounting portion (411). The mounting portion (411) may be disposed below the display (230) of the electronic device (101). For example, the mounting portion (411) may face at least a portion of the display (230). For example, at least a portion of electronic components of the electronic device (101) may be mounted or arranged on the mounting portion (411). For example, the mounting portion (411) may define one side facing the display (230) (e.g., the second side (411b) of FIG. 5b) and another side opposite to the one side (e.g., the first side (411a) of FIG. 5a). For example, some of the electronic components of the relatively bulky electronic device (101) (e.g., battery (264), printed circuit board (430) of FIG. 5B) may be placed on the other surface of the mounting portion (411) for the display (230). For example, the mounting portion (411) may be surrounded by a peripheral portion (or a side bezel structure) of the housing (200). The mounting portion (411) and the peripheral portion may be formed of different materials, but embodiments of the present disclosure are not limited thereto.

[0089] The bracket (410) may include a sidewall (412). For example, the sidewall (412) may protrude from the mounting portion (411) to form a space for accommodating electronic components within the housing (200) together with the mounting portion (411). For example, the sidewall (412) may protrude from one side of the mounting portion (411) facing the display (230) (e.g., the second side (411b) of FIG. 5b) and the other side opposite to the one side (e.g., the first side (411a) of FIG. 5a), such that the other side may come into contact with or be coupled to a rear cover of the housing (200) facing the other side (e.g., the first cover (216) of FIG. 2c). However, embodiments of the present disclosure are not limited thereto.

[0090] The battery (264) may be mounted on the mounting portion (411) of the bracket (410). The battery (264) may be supported by the mounting portion (411) and / or the side wall (412) of the bracket (410). The battery (264) may be placed in the internal space of the housing (200) formed by the mounting portion (411) and the side wall (412) of the bracket (410). For example, since the battery (264) may have a relatively large volume, it may be attached on one side of the mounting portion (411) facing the display (230) (e.g., the second side (411b) of FIG. 5b) and the other side opposite to the one side (e.g., the first side (411a) of FIG. 5a). For example, the battery (264) may be configured to be rechargeable for driving the electronic device (101) and / or electronic components within the electronic device (101). However, embodiments of the present disclosure are not limited thereto.

[0091] A printed circuit board (430) may be placed on a bracket (410) (or a mounting portion (411)). Electronic components for driving and / or performing functions of the electronic device (101) may be coupled to the printed circuit board (430). For example, the printed circuit board (430) may be accommodated in the bracket (410) together with a battery (264). For example, the printed circuit board (430) may be connected to the battery (264) to supply power to the electronic device (101) and / or electronic components within the electronic device (101) through the battery (264). For example, a power management integrated circuit (PMIC) in the printed circuit board (430) may be connected to the battery (264) through a flexible printed circuit board (FPCB) to supply power to the electronic device (101). For example, the printed circuit board (430) may be placed adjacent to the battery (264) for connection to the battery (264). The printed circuit board (430) may be placed, for example, on one side of the mounting portion (411) of the bracket (410) (e.g., the first side (411a) of FIG. 5B) together with the battery (264). For example, the printed circuit board (430) may be placed along the battery (264) or next to the battery (264). For example, the printed circuit board (430) may be placed within a space surrounded by the mounting portion (411) of the bracket (410), the side wall (412) of the bracket (410), and the rear cover of the housing (200) (e.g., the first cover (216) of FIG. 2A). However, embodiments of the present disclosure are not limited thereto.

[0092] The bracket (410) may include a partition wall (415). For example, the partition wall (415) may protrude from the mounting portion (411) to define a space for accommodating electronic components together with the side wall (412) of the bracket (410). For example, the partition wall (415) may protrude from one side of the mounting portion (411) facing the display (230) (e.g., the second side (411b) of FIG. 5b) and the other side opposite to the one side (e.g., the first side (411a) of FIG. 5a) toward the rear cover of the housing (200) facing the other side (e.g., the first cover (216) of FIG. 2c). For example, the partition wall (415) may support the battery (264) by coming into contact with the battery (264). The partition wall (415) can support the battery (264) to reduce the battery (264) from moving or being detached from the mounting portion (411) due to external impact. For example, the partition wall (415) can be at least partially positioned between the battery (264) and the printed circuit board (430). The battery (264) can be isolated or separated from the printed circuit board (430) by the partition wall (415). However, embodiments of the present disclosure are not limited thereto.

[0093] The electronic component (401) may be arranged on a printed circuit board and may emit heat while the electronic device (101) is operating. For example, the electronic component (401) may be a processor of the electronic device (101) that generates relatively large amounts of heat (e.g., the processor (120) of FIG. 1). For example, the electronic component (401) may be coupled to one side (e.g., one side (430a) of FIG. 5B) facing the mounting portion (411) of the printed circuit board (430). For example, the electronic component (401) may perform data processing or calculations as the electronic device (101) operates. For example, the electronic component (401) may emit heat to the surroundings of the electronic component (401) as it performs data processing or calculations. The electronic component (401) may be referred to as a heat generating component or a heat generating body in that it is an element that generates heat, but embodiments of the present disclosure are not limited thereto. The electronic device (101) may include a heat dissipation structure to reduce damage to the electronic component (401) and / or one or more other electronic components around the electronic component (401) due to heat emitted from the electronic component (401).

[0094] A heat dissipation sheet (420) may be attached to a mounting portion (411) of a bracket (410). The heat dissipation sheet (420) may be positioned toward a printed circuit board (430) and / or an electronic component (401) disposed on the printed circuit board (430). For example, the heat dissipation sheet (420) may at least partially overlap the electronic component (401) and / or the printed circuit board (430) when the mounting portion (411) is viewed from above (e.g., when viewed in the +z direction). For example, the heat dissipation sheet (420) may be positioned above the electronic component (401). Within the present disclosure, when expressions of a positional relationship between one element and another (e.g., “on,” “above or over,” “below or beneath,” “under,” “next to”) are mentioned, it should be understood that, unless expressions such as “rightly” or “directly” are used, there may be one or more intervening elements between the two elements, and it should be noted that the arrangement relationship between the two elements is not limited. For example, “a heat dissipation sheet (420) disposed above the electronic component (401)” may mean “a heat dissipation sheet (420) disposed over the electronic component (401)” with respect to the +z direction. For example, "a heat dissipation sheet (420) disposed above the electronic component (401)" may mean "a heat dissipation sheet (420) disposed under the electronic component (401)" based on the -z direction. For example, "a heat dissipation sheet (420) disposed above the electronic component (401)" may mean "a heat dissipation sheet (420) facing the electronic component (401) and spaced apart from the electronic component (401)". However, embodiments of the present disclosure are not limited thereto.

[0095] For example, since the heat dissipation sheet (420) is arranged toward the electronic component (401), it can receive at least a portion of the heat emitted from the electronic component (401). The heat dissipation sheet (420) can reduce damage to the electronic component (401) and / or one or more other electronic components around the electronic component (401) due to the heat by dissipating the heat received from the electronic component (401). The heat dissipation sheet (420) may include a material having relatively high thermal conductivity (e.g., graphite), but embodiments of the present disclosure are not limited thereto.

[0096] The size (or area) of the heat dissipation sheet (420) for the electronic component (401) may be limited by the partition wall (415) of the bracket (410) for supporting the battery (264). For example, the heat dissipation sheet (420) may be isolated or separated from the battery (264) by the partition wall (415). Since the portion of the mounting portion (411) to which the heat dissipation sheet (420) can be attached is limited by the partition wall (415), the performance of the electronic device for the heat dissipation of the electronic component (401) may be degraded. Through the diagrams below in FIG. 5A, the vapor chamber (500) of the electronic device (101) for the heat dissipation of the electronic component (401) and the internal structure of the electronic device (101) for the arrangement of the vapor chamber (500) are exemplarily described.

[0097] Figure 5a illustrates a portion of an exemplary electronic device. Figure 5b is a partially exploded perspective view of the exemplary electronic device. Figure 5c illustrates a portion of the exemplary electronic device.

[0098] Referring to FIGS. 5A, 5B, and 5C, the electronic device (101) may include a bracket (410) including a mounting portion (411) (e.g., the first bracket (215) of FIG. 2C), a printed circuit board (430), a heat-generating component (e.g., an electronic component (401) such as the processor (120) of FIG. 1), a battery (264), and a vapor chamber (500). Hereinafter, redundant descriptions of components having the same reference numerals as those described in FIG. 4 may be omitted.

[0099] Unlike FIG. 4, the partition wall (415) for supporting the battery (264) of the bracket (410) according to one embodiment may be omitted. In one embodiment, a vapor chamber (500) may be mounted on the mounting portion (411) of the bracket (410) instead of the heat dissipation sheet (420). The vapor chamber (500) may be mounted on a portion of the mounting portion (411) where the printed circuit board (430) and the battery (264) are disposed, thereby increasing the area for heat dissipation of the electronic component (401) relative to the heat dissipation sheet (420) of FIG. 4.

[0100] For example, the vapor chamber (500) may include a first portion (501) positioned above a heat-generating component (e.g., an electronic component (401)), a second portion (502) interposed between a battery (264) and a mounting portion (411) of a bracket (410), and a third portion (503) extending from the first portion (501) to the second portion (502).

[0101] For example, the first portion (501) may be a portion where the printed circuit board (430) is mounted. The first portion (501) may be a portion that overlaps the printed circuit board (430) when the printed circuit board (430) is viewed from above (e.g., when viewed in the +z direction). For example, the first portion (501) may be covered by the printed circuit board (430). For example, the first portion (501) may be a portion that at least partially overlaps the electronic component (401) when the vapor chamber (500) is viewed from above (e.g., when viewed in the +z direction). For example, the first portion (501) may be a portion that receives heat from the electronic component (401). For example, the first portion (501) may be a portion that faces the electronic component (401) or is in contact with the electronic component (401). For example, the first portion (501) may be faced away from the electronic component (401). For example, the first portion (501) may be a portion that receives heat from the electronic component (401) through other internal heat dissipation structures of the electronic device (101) (e.g., a shielding sheet (450) or a heat conducting member (460)) or comes into contact with the other internal heat dissipation structures. For example, at least a portion of the liquid fluid within the first portion (501) may be vaporized by heat transferred from the electronic component (401) to the first portion (501). The first portion (501) may be configured to diffuse the heat released from the electronic component (401) through the third portion (503) and the second portion (502) or to cool the electronic component (401) by vaporizing the liquid fluid within the first portion (501). The above first part (501) may be referred to as an evaporation part and / or heat source of the vapor chamber (500) in that it is a part where the liquid fluid within the space of the enclosure (510) is vaporized by heat emitted from the electronic component (401), but embodiments of the present disclosure are not limited thereto.

[0102] For example, the second part (502) may be spaced apart from the first part (501). The second part (502) may be a part disposed between the mounting part (411) of the bracket (410) and the battery (264). For example, the second part (502) may be a part covered by the battery (264). For example, the second part (502) may be a part to which the battery (264) is attached, thereby fixing the position of the battery (264) within the electronic device (101). For example, the second part (502) may be a part configured to have a temperature lower than the temperature of the first part (501) that receives heat from the electronic component (401) by being spaced apart from the first part (501). For example, the second portion (502) may be a portion where a gaseous fluid that has moved from the first portion (501) through the third portion (503) to the second portion (502) releases heat. The gaseous fluid within the second portion (502) may be liquefied by releasing heat to the outside of the vapor chamber (500) within the second portion (502). The second portion (502) may be referred to as a condensing portion of the vapor chamber (500) in that it is a portion where a gaseous fluid within the space of the enclosure (510) is liquefied, but embodiments of the present disclosure are not limited thereto. The electronic device (101) may include a vapor chamber (500) including a second portion (502) interposed between the battery (264) and the mounting portion (411), thereby improving the heat dissipation performance of the electronic device (101) against heat emitted from the electronic component (401) and reducing damage to the electronic component (401) and / or one or more other electronic components (402) around the electronic component (401) due to the heat.

[0103] For example, the third part (503) can connect the first part (501) and the second part (502). For example, as illustrated in FIG. 5c, unlike FIG. 4, since the partition wall (415) of the bracket (410) is omitted, the third part (503) can extend from the first part (501) to the second part (502). For example, the third part (503) can be a part that provides a path for the movement of fluid between the first part (501) and the second part (502). The third part (503) can be positioned between the first part (501) and the second part (502). For example, the third part (503) can extend from the first part (501) to the second part (502). For example, the third portion (503) may provide a passage (e.g., a plurality of channels (540)) for a gaseous fluid to move from the first portion (501) to the second portion (502) by connecting the internal space of the first portion (501) and the internal space of the third portion (503), or may provide a passage for a liquid fluid to pass through the wick structure (520) so as to move from the second portion (502) to the first portion (501) through the wick structure (520). For example, the third portion (503) may be omitted. Parts of the vapor chamber (500) (e.g., the first part (501), the second part (502), and / or the third part (503)) are merely exemplarily described within the present disclosure according to their respective functions and arrangements for convenience of illustration and description; for example, a part of the third part (503) may be defined as a part of the first part (501), and the remaining part of the third part (503) may be defined as a part of the second part (502). The third part (503) may be referred to as a neck portion of the vapor chamber (500) in that it is a part connecting the first part (501) and the second part (502), but embodiments of the present disclosure are not limited thereto.

[0104] The vapor chamber (500) may include an enclosure (510) including a first plate (511) attached to a mounting portion (411) of a bracket (410), and a second plate (512) coupled with the first plate (511) and attached to a battery (264). The vapor chamber (500) may include a fluid within the enclosure (510), and a wick structure (520) disposed within the enclosure (510) and in contact with the second plate (512).

[0105] For example, the first plate (511) and the second plate (512) of the enclosure (510) may be configured to seal a space for a fluid within the enclosure (510) by being coupled to each other. The fluid within the space may be referred to as a cooling material in that it is configured to cool the electronic component (401) through a phase change. The fluid may be vaporizable by heat transferred from the electronic component (401) to the vapor chamber (500). The fluid may be liquefied as heat is released from the vapor chamber (500). The fluid may be, for example, but is not limited to, water. For example, the portions (e.g., the first portion (501), the second portion (502), and / or the third portion (503)) can form a space for diffusing heat emitted from the electronic component (401) or cooling the electronic component (401) by utilizing a phase change of a fluid within the vapor chamber (500). For example, the enclosure (510) can define or form portions (e.g., the first portion (501), the second portion (502), and / or the third portion (503)) of the vapor chamber (500). For example, the enclosure (510) can form an outer appearance of the vapor chamber (500). The enclosure (510) can include, but is not limited to, a metal having relatively high thermal conductivity.

[0106] For example, the first plate (511) may be a plate supported or attached by the housing (200) (or the bracket (410)) of the electronic device (101). The first plate (511) may be a plate facing the display (230) (or the first flat portion (231) of the display (230)) of the electronic device (101). The second plate (512) coupled to the first plate (511) may be a plate that receives heat from the electronic component (401). The second plate (512) may be a plate facing the printed circuit board (430) and / or the battery (264). For example, the second plate (512) may be fastened to the first plate (511). The second plate (512) may, together with the first plate (511), provide a space for the fluid of the vapor chamber (500). For example, the second plate (512) may, together with the first plate (511), define portions of the vapor chamber (500) and / or the enclosure (510) (e.g., the first portion (501), the second portion (502), and / or the third portion (503). For example, the second plate (512) may have a shape that overlaps the first plate (511) when the vapor chamber (500) is viewed from above (e.g., when viewed in the +z direction), but embodiments of the present disclosure are not limited thereto.

[0107] For example, the wick structure (520) may be disposed in the internal space of the vapor chamber (500). The wick structure (520) may be disposed between the first plate (511) and the second plate (512) of the enclosure (510). The wick structure (520) may extend, for example, from the first portion (501) of the vapor chamber (500), across the third portion (503), and to the second portion (502). For example, the wick structure (520) may include a porous structure and / or a capillary structure for absorbing a liquid fluid within the vapor chamber (500). For example, the wick structure (520) may be mounted on the second plate (512) within the vapor chamber (500). Since the wick structure (520) is in contact with the second plate (512) arranged toward the electronic component (401), the liquid fluid within the wick structure (520) can be vaporized by heat transferred from the electronic component (401) through the second plate (512). The wick structure (520) may include, for example, at least one of a mesh wick for absorbing the liquid fluid and a sintering wick, but embodiments of the present disclosure are not limited thereto.

[0108] The first plate (511) may include a plurality of pillars (530) protruding from the first plate (511) toward the second plate (512) within the enclosure (510). For example, the plurality of pillars (530) may contact the wick structure (520) by protruding from the bottom surface of the first plate (511) toward the wick structure (520) within the vapor chamber (500). For example, the plurality of pillars (530) may support the wick structure (520) and / or the second plate (512) within the enclosure (510), thereby reducing damage to the enclosure (510) (or the vapor chamber (500)) due to external impact.

[0109] The first plate (511) of the vapor chamber (500) (or at least a portion of the enclosure (510)) may be formed from a portion of the bracket (410) (or the mounting portion (411)) or may be implemented as a portion of the bracket (410). However, embodiments of the present disclosure are not limited thereto.

[0110] The vapor chamber (500) may include a plurality of channels (540) within the vapor chamber (500) surrounded by an enclosure (510) and a wick structure (520). Through the plurality of channels (540), a gaseous fluid within the vapor chamber (500) may move. For example, the plurality of channels (540) may be defined by a plurality of pillars (530) protruding from a first plate (511). The plurality of channels (540), like the wick structure (520), may extend from a first portion (501) of the vapor chamber (500) across a third portion (503) to a second portion (502). However, embodiments of the present disclosure are not limited thereto.

[0111] The vapor chamber (500) may be configured to diffuse heat transferred from a heat-generating component (e.g., an electronic component (401)) to the first portion (501) through the third portion (503) to the second portion (502). For example, the first portion (501) of the vapor chamber (500) may receive heat emitted from the electronic component (401). Through the heat transferred to the first portion (501), a fluid may be vaporized from a wick structure (520) within the first portion (501). The vaporized fluid may diffuse to the second portion (502) through the third portion (503) through a plurality of channels (540) within the vapor chamber (500). The fluid in a gaseous state that has absorbed the heat can disperse the heat by diffusing from the first part (501) through the third part (503) to the second part (502). The fluid can be cooled by releasing heat around the vapor chamber (500) as it moves away from the electronic component (401). The fluid in a gaseous state can be cooled while moving to the second part (502) through the third part (503), thereby condensing within the third part (503). The condensed liquid fluid can be absorbed into the wick structure (520) within the vapor chamber (500). The liquid fluid can move from the second part (502) through the third part (503) to the first part (501) through the wick structure (520). However, embodiments of the present disclosure are not limited thereto.

[0112] According to one embodiment, the area (A2) of the second portion (502) of the vapor chamber (500) may be larger than the area (A1) of the first portion (501) of the vapor chamber (500). For example, the width of the second portion (502) may be larger than the width of the first portion (501). For example, the internal volume of the second portion (502) may be larger than the internal volume of the first portion (501). For example, when the mounting portion (411) is viewed from above (e.g., when viewed in the +z direction), the area (A1) of the first portion (501) overlapping the electronic component (401) may be smaller than the area (A2) of the second portion (502) overlapping the battery (264). Since the area (A2) of the second portion (502) is larger than the area (A1) of the first portion (501), the vapor chamber (500) can diffuse heat transferred from the electronic component (401) to the first portion (501) to the second portion (502) through the third portion (503). By diffusing the heat to the second portion (502), the vapor chamber (500) can improve the heat dissipation performance of the electronic device (101) for heat emitted from the electronic component (401) and reduce damage to the electronic component (401) and / or one or more other electronic components (402) around the electronic component (401) due to the heat.

[0113] In one embodiment, instead of the vapor chamber (500), the heat dissipation sheet (420) of FIG. 4 may be disposed. For example, instead of portions of the vapor chamber (500) (e.g., the first portion (501), the second portion (502), and / or the third portion (503)), the heat dissipation sheet (420) of FIG. 4 may be disposed. At least a portion of the heat dissipation sheet (420) may be interposed between the battery (264) and the mounting portion (411). The remaining portion of the heat dissipation sheet (420) may be disposed between the printed circuit board (430) (or a heat-generating component (e.g., an electronic component (401)), but embodiments of the present disclosure are not limited thereto.

[0114] The electronic device (101) may include a display (230) disposed on a bracket (410). A vapor chamber (500) may be spaced from the display (230) by the bracket (410). For example, a mounting portion (411) of the bracket (410) may define a first surface (411a) to which the vapor chamber (500) is attached, and a second surface (411b) opposite to the first surface (411a). The second surface (411b) may face the display (230) of the electronic device (101). For example, at least a portion of the mounting portion (411) of the bracket (410) may be disposed between the display (230) and the vapor chamber (500). The remaining portion of the mounting portion (411) may be disposed between the display (230) and the battery (264). By separating the vapor chamber (500) and / or the battery (264) from the display (230) by the bracket (410), the electronic device (101) can improve the visibility of the display (230) and reduce damage to the display (230) due to external impact.

[0115] Referring to FIG. 5B, the electronic device (101) may include a housing (200) including a first housing part (210) defining a bracket (410) and a second housing part (220), and a hinge structure (250) rotatably connecting the first housing part (210) and the second housing part (220). The display (230) may include a first planar part (231) coupled to the first housing part (210) and disposed on a mounting portion (411) of the bracket (410), a second planar part (232) coupled to the second housing part (220) and spaced apart from the first planar part (231), and a foldable part (233) extending from the first planar part (231) to the second planar part (232) and deformable by the hinge structure (250). For example, when referring to FIGS. 2A to 3B together, the vapor chamber (500), the printed circuit board (430), and the battery (264) may be disposed within the first housing part (210) of the housing (200). The bracket (410) that provides the mounting portion (411) on which the vapor chamber (500) is mounted may be referred to as the first bracket (215) of FIG. 2C. For example, the vapor chamber (500), the printed circuit board (430), and the battery (264) may be disposed between the bracket (410) of the first housing part (210) and the first cover (216). However, embodiments of the present disclosure are not limited thereto, and for example, the structure in which the vapor chamber (500), the battery (264), and the printed circuit board (430) on which the electronic component (401) is mounted within the first housing part (210) are arranged can be similarly applied to structures and / or components between the second bracket (227) and the second cover (228) of the second housing part (220) that are rotatably coupled with the first housing part (210).

[0116] According to one embodiment, the electronic component (401) may be disposed on one side (430a) facing the bracket (410). For example, the electronic device (101) may include a shield can (440) disposed on the one side (430a) and surrounding the electronic component (401). The shield can (440) may include a through hole (445) formed on the electronic component (401). For example, the shield can (440) may be coupled to one side (430a), which may be a part of a printed circuit board (430) to which the electronic component (401) is coupled, thereby shielding the electronic component (401). The through hole (445) of the shield can (440) may overlap with the electronic component (401) when the electronic component (401) is viewed from above (e.g., when viewed in the +z direction). The above through hole (445) can pass through a heat conducting member (460) attached to the electronic component (401). For example, the through hole (445) can be a path for at least a portion of the heat emitted from the electronic component (401) to be emitted through the heat conducting member (460) disposed on the electronic component (401).

[0117] For example, the shield can (440) may be connected to the ground within the electronic device (101). For example, the shield can (440) may be electrically connected to the ground of the electronic device (101) through the printed circuit board (430). By being connected to the ground, the shield can (440) may emit electromagnetic waves emitted from the electronic component (401) to the ground. By emitting the electromagnetic waves to the ground, the shield can reduce degradation of performance of one or more other electronic components (402) around the electronic component (401) due to the electromagnetic waves.

[0118] According to one embodiment, the electronic device (101) may include a shielding sheet (450) that is attached to a shield can (440) and covers a through hole (445) of the shield can (440), and a thermally conductive member (460) that is interposed between the electronic component (401) and the shielding sheet (450) through the through hole (445). For example, the shielding sheet (450) may be disposed between the shield can (440) and the vapor chamber (500) (or the first portion (501) of the vapor chamber (500). The shielding sheet (450) may be in contact with the thermally conductive member (460) that has passed through the through hole (445). The shielding sheet (450) may shield the electronic component (401) together with the shield can (440) by covering the through hole (445). For example, the shielding sheet (450) may be electrically connected to the shield can (440) by including a conductive material. The shielding sheet (450) may be configured to transmit electromagnetic waves emitted from the electronic component (401) to the shield can (440) connected to the ground, but the embodiment is not limited thereto.

[0119] For example, the thermally conductive member (460) can be attached on the electronic component (401). The thermally conductive member (460) can be interposed between the electronic component (401) and the shielding sheet (450). The thermally conductive member (460) can be in contact with the shielding sheet (450) through the through hole (445) of the shield can (440). For example, the thermally conductive member (460) can be in contact with the electronic component (401) and the shielding sheet (450). For example, the thermally conductive member (460) can transfer at least a portion of the heat emitted from the electronic component (401) to the shielding sheet (450) on the thermally conductive member (460) and / or to the first portion (501) of the vapor chamber (500) through conduction heat transfer. For example, the thermally conductive member (460) may be fastened between the shielding sheet (450) and the electronic component (401) by being attached to the shielding sheet (450). However, embodiments of the present disclosure are not limited thereto, and for example, one or more other thermally conductive members may be disposed between the vapor chamber (500) and the shielding sheet (450).

[0120] For example, the thermally conductive member (460) may penetrate (e.g., be within) at least a portion of the through hole (445) of the shield can (440). For example, the thermally conductive member (460) may be attached to a shielding sheet (450) that covers the through hole (445) by passing through the through hole (445). For example, the thermally conductive member (460) may provide a path for heat emitted from the electronic component (401) to be transferred to the shielding sheet (450) and the vapor chamber (500) through the through hole (445). For example, the thermally conductive member (460) may include a material having relatively high thermal conductivity. The thermally conductive member (460) may be referred to as a TIM (thermal interface material) in that it is interposed between the electronic component (401) and the shielding sheet (450), but is not limited thereto. The electronic device (101) may include a heat conducting member (460) that transfers at least a portion of the heat emitted from the electronic component (401) through the through hole (445) of the shield can (440) to the shield sheet (450) and / or the vapor chamber (500), thereby reducing the performance degradation of the electronic component (401) surrounded by the shield can (440) due to the heat emitted from the electronic component (401).

[0121] According to one embodiment, the electronic device (101) may include an adhesive member (550) for attaching the battery (264) to the vapor chamber (500). For example, the adhesive member (550) may be interposed between the second portion (502) of the vapor chamber (500) and the battery (264). Through the adhesive member (550), the battery (264) may be fixed on the second plate (512) of the vapor chamber (500). For example, for replacement of the vapor chamber (500) and / or the battery (264), it may be required to separate the battery (264) from the vapor chamber (500) or to press the battery (264) onto the vapor chamber (500) through the adhesive member (550). When the battery (264) is separated from the vapor chamber (500) or compressed onto the vapor chamber (500), the vapor chamber (500) may be damaged by the adhesive force of the adhesive member (550) or by the compression. In addition, the thickness of the vapor chamber (500) may be relatively reduced due to the thickness of the adhesive member (550), thereby deteriorating the performance of the vapor chamber (500). The electronic device (101) may include a structure for reducing damage to the vapor chamber (500) and improving the performance of the vapor chamber (500). The structure is exemplarily described in the drawings below of FIG. 6A.

[0122] Figures 6a and 6b illustrate portions of an exemplary electronic device. Figures 6c, 6d, and 6e illustrate a vapor chamber of the exemplary electronic device.

[0123] Referring to FIGS. 6a, 6b, 6c, 6d, and 6e, the electronic device (101) includes a bracket (410) including a mounting portion (411) (e.g., the first bracket (215) of FIG. 2c), a printed circuit board (e.g., the printed circuit board (430) of FIG. 5b) disposed toward the bracket (410), a heat generating component (e.g., the processor (120) of FIG. 1, or the heat generating component (e.g., the electronic component (401) of FIG. 5b)) disposed on one side (e.g., one side (430a) of FIG. 5c) of the printed circuit board (430) facing toward the bracket (410), a battery (264) spaced from the heat generating component (e.g., the electronic component (401)) and accommodated in the bracket (410), and a battery (264) disposed on the mounting portion (411) of the bracket (410). The electronic device (101) may include a vapor chamber (500) on which the heat-generating component (e.g., electronic component (401)) is mounted. The vapor chamber (500) may include a first part (501) disposed on the heat-generating component (e.g., electronic component (401)), a second part (502) interposed between the battery (264) and the mounting part (411), and a third part (503) extending from the first part (501) to the second part (502). However, the embodiments of the present disclosure are not limited thereto, and the electronic device (101) may include structures and / or configurations (e.g., a display (230), a shield can (440), a shielding sheet (450), or a heat-conducting member (460)) exemplarily illustrated and described in FIGS. 5A to 5C. For example, the housing (200) exemplarily illustrated and described in FIGS. 6A and 6B may be a housing of a foldable electronic device exemplarily illustrated and described in FIGS. 2A to 5C. It may be referred to as the first housing part (210).The first housing part (210) may be rotatably coupled to the second housing (e.g., the second housing part (220) of FIG. 2a) by a hinge structure (e.g., the hinge structure (250) of FIG. 2c), but the embodiments of the present disclosure are not limited thereto, and in the following description, redundant descriptions of components having the same reference numerals as those described in FIGS. 2a to 5c may be omitted.

[0124] Referring to FIG. 6A, a battery (264) may be attached to the second portion (502) of the vapor chamber (500). For example, after an adhesive member (550) is attached to the battery (264), the adhesive member (550) may be attached to the enclosure (510) of the vapor chamber (500), such that the battery (264) may be attached to the vapor chamber (500) via the adhesive member (550). For example, a second plate (512) of the enclosure (510) included in the second portion (502) of the vapor chamber (500) may include an adhesive surface (502a) to which the adhesive member (550) is attached. The adhesive surface (502a) may have a shape corresponding to a shape of the adhesive member (550) attached to the battery (264). For example, the adhesive surface (502a) can guide the position for attaching the battery (264) on the second part (502) of the vapor chamber (500) by having a shape corresponding to the shape of the adhesive member (550).

[0125] Referring to FIG. 6B, a battery (264) may be attached to the second portion (502) of the vapor chamber (500). According to one embodiment, the electronic device (101) may include a fastener (600) disposed on the third portion (503) of the vapor chamber (500) and configured to fasten the vapor chamber (500) to the bracket (410) by being coupled with the bracket (410). For example, the fastener (600) may be coupled with a mounting portion (411) of the bracket (410) to fasten the third portion (503) of the vapor chamber (500) to the mounting portion (411). For example, the fastener (600) may be in contact with the battery (264) to support the battery (264). The fixing member (600) may, for example, press the battery (264) toward the side wall (412) of the bracket (410). The fixing member (600) may reduce the battery (264) from being separated from the space between the fixing member (600) and the side wall (412) due to external impact by supporting the battery (264). However, the embodiments of the present disclosure are not limited thereto.

[0126] Referring to FIG. 6C, at least a portion of the vapor chamber (500) may have different thicknesses. For example, the thickness (t1) of the first portion (501) of the vapor chamber (500) may be greater than the thickness (t2) of the second portion (502) of the vapor chamber (500). For example, the difference between the thickness (t1) of the first portion (501) and the thickness (t2) of the second portion (502) may correspond to the thickness of the adhesive member (550), but the embodiment is not limited thereto. For example, the enclosure (510) may include a step within the third portion (503). By including the step, the enclosure (510) may be configured such that the thickness of the internal space of the first portion (501) is greater than the thickness of the internal space of the second portion (502). The vapor chamber (500) can improve the performance of the vapor chamber (500) by being configured such that the thickness (t1) of the first portion (501) is greater than the thickness (t2) of the second portion (502). However, embodiments of the present disclosure are not limited thereto. According to embodiments, the thicknesses (e.g., thicknesses t1, t2, t3, and t4) may be in the z direction.

[0127] For example, the second plate (512) positioned in the second portion (502) may include an adhesive surface (502a) to which an adhesive member (550) is attached, and a protruding surface (502b) that protrudes from the adhesive surface (502a) toward the battery (264) and thus comes into contact with the battery (264). For example, a thickness (t3) of the adhesive member (550) may correspond to a thickness (t4) of the protruding surface (502b). For example, the adhesive surface (502a) may be recessed from the protruding surface (502b). The vapor chamber (500) may be configured such that the thicknesses of the second portions (502) are different from each other, thereby improving the performance of the vapor chamber (500). However, embodiments of the present disclosure are not limited thereto.

[0128] Referring to FIGS. 6A to 6E, the plurality of pillars (530) within the vapor chamber (500) may have various shapes and / or patterns. For example, referring to FIGS. 6A and 6B, the first plate (511) of the enclosure (510) may include first pillars (531), second pillars (532), and third pillars (533). For example, the first pillars (531) may each have a circular shape when the enclosure (510) is viewed from above (e.g., when viewed in the +z direction). The second pillars (532) can form a movement path (or a plurality of channels (540) of FIG. 5C) of a gaseous fluid within the vapor chamber (500) moving from the first portion (501) to the second portion (502) by forming a pattern that is arranged in a direction (e.g., -y direction) from the first portion (501) to the second portion (502). For example, the third pillars (533) can be formed in the third portion (503) and the second portion (502). The third pillars (533) can extend from the third portion (503) to the second portion (502), thereby forming a diffusion path (or a plurality of channels (540) of FIG. 5C) of a gaseous fluid within the vapor chamber (500) moving from the third portion (503) to the second portion (502). For example, the third columns (533) may each be at least partially bent. For example, referring to FIGS. 6D and 6E, the plurality of columns (530) may include fourth columns (534) that form a pattern that is arranged in a direction inclined in a direction (e.g., -y direction) from the first portion (501) toward the second portion (502), and fifth columns (535) that extend from the third portion (503) to the second portion (502). Unlike the third columns (533), the fifth columns (535) may have a straight shape. However, embodiments of the present disclosure are not limited thereto.The plurality of pillars (530) can improve the performance of the vapor chamber (500) by including pillars having different shapes and / or patterns.

[0129] Referring to FIGS. 6D and 6E, at least some of the plurality of pillars (530) may be welded to the second plate (512). For example, the vapor chamber (500) may include at least one weld portion where the plurality of pillars (530) and the second plate (512) are welded to each other. For example, referring to FIG. 6D, the third portion (503) of the vapor chamber (500) may include a first weld portion (610) where at least some of the first pillars (531) and the second plate (512) are welded to each other. The first weld portion (610) may be disposed, for example, within the third portion (503) connected to the second portion (502) of the vapor chamber (500). For example, referring to FIG. 6E, the second portion (502) of the vapor chamber (500) may include a second weld portion (620) in which at least some of the fifth pillars (535) and the second plate (512) are welded to each other. The second weld portion (620) may be disposed within the second portion (502) of the vapor chamber (500) to which the battery (264) is attached. However, embodiments of the present disclosure are not limited thereto. The vapor chamber (500) may include one or more weld portions in which at least some of the plurality of pillars (530) and the second plate (512) are welded to each other within the enclosure (510), thereby reducing damage to the vapor chamber (500) while the battery (264) is pressed onto or separated from the vapor chamber (500).

[0130] FIG. 7A is a cross-sectional view of a vapor chamber of an exemplary electronic device taken along line A-A' of FIG. 6A. FIG. 7B is a top plan view of a first plate of a vapor chamber of an exemplary electronic device. FIG. 7C is a top plan view of a second plate of a vapor chamber of an exemplary electronic device. FIG. 7D illustrates a portion of a second plate of a vapor chamber of an exemplary electronic device.

[0131] Referring to FIGS. 7A, 7B, 7C, and 7D, a vapor chamber (500) (or an enclosure (510) of the vapor chamber (500)) disposed within the electronic device (101) exemplarily illustrated and described in FIGS. 5A to 6B is exemplarily illustrated and described. The electronic device (101) may include a bracket (e.g., the first bracket (215) of FIG. 2c, the bracket (410) of FIG. 5a) including a mounting portion (e.g., the mounting portion (411) of FIG. 5a), a printed circuit board (e.g., the printed circuit board (430) of FIG. 5b) disposed toward the bracket (410), a heat-generating component (e.g., the processor (120) of FIG. 1, the heat-generating component (e.g., the electronic component (401) of FIG. 5b) disposed on one side (e.g., one side (430a) of FIG. 5c) of the printed circuit board (430) facing toward the bracket (410), and a battery (264) spaced apart from the heat-generating component (401) and accommodated in the bracket (410). The vapor chamber (500) may include the mounting portion (e.g., the electronic component) of the bracket (410). The vapor chamber (500) may include a first part (e.g., the first part (501) of FIG. 5A) disposed on the heat-generating part (e.g., the electronic part (401)), a second part (e.g., the second part (502) of FIG. 5A) interposed between the battery (264) and the mounting part (411), and a third part (e.g., the third part (503) of FIG. 5A) extending from the first part (501) to the second part (502). However, the embodiments of the present disclosure are not limited thereto, and the electronic device (101) may include structures and / or configurations (e.g., the housing (200), the display (230), the hinge structure (250), the shield can (440), the shielding sheet (450), the heat-conducting member (460), or the fixing member (501)) exemplarily illustrated and described in FIGS. 5A to 6E. Absence (600)) may be included.However, embodiments of the present disclosure are not limited thereto, and in the following description, redundant descriptions of components having the same reference numerals as those described in FIGS. 2A to 6E may be omitted.

[0132] The vapor chamber (500) may include an enclosure (510) including a first plate (511) attached to a mounting portion (411) of a bracket (410), and a second plate (512) coupled with the first plate (511) and attached to a battery (264). The vapor chamber (500) may include a fluid within the enclosure (510) and a wick structure (520) disposed within the enclosure (510) and in contact with the second plate (512). The first plate (511) may include a plurality of posts (530) protruding from the first plate (511) toward the second plate (512) within the vapor chamber (500). For example, the plurality of pillars (530) of the first plate (511) may include pillars having different shapes and / or patterns (e.g., the first pillar (531), the fourth pillar (534), and the fifth pillar (535)), as illustrated in FIG. 7b.

[0133] According to one embodiment, the second plate (512) may include a plurality of channels (700) recessed from a bottom surface (512a) of the second plate (512) for moving a liquid fluid between the wick structure (520) and the second plate (512). For example, the plurality of channels (700) may be recessed from the bottom surface (512a) of the second plate (512) within the vapor chamber (500). For example, the plurality of channels (700) may be covered by the wick structure (520). For example, the plurality of channels (700) may be configured to move a liquid fluid within the plurality of channels (700) by forming a microtubular structure. The above plurality of euros (700) may be formed, for example, through an etching process of the enclosure (510) (or the second plate (512)), but embodiments of the present disclosure are not limited thereto.

[0134] Referring to FIGS. 7C and 7D , the second plate (512) may include corner regions (720) arranged along an edge of the second plate (512), and a center region (710) surrounded by the corner regions (720). The plurality of flow paths (700) may include first flow paths (701) formed in the center region (710) and having a first pattern (p1), and second flow paths (702) formed in at least some of the corner regions (720), connected to the first flow paths (701), and having a second pattern (p2) different from the first pattern (p1). For example, the first flow paths (701) may form a first pattern (p1) that is a linear pattern. The first flow paths (701) may be formed, for example, in the center region (710) of the second plate (712), and in the second corner region (722) and the fourth corner region (724) among the corner regions (the first corner region (721), the second corner region (722), the third corner region (723), and the fourth corner region (724)). For example, the second flow paths (702) may be formed, as shown, in the first corner region (721) and the third corner region (723) facing the first corner region (721) among the corner regions (e.g., the first corner region (721), the second corner region (722), the third corner region (723), and the fourth corner region (724)). The second flow paths (702) may form, for example, a second pattern (p2) that is a radial pattern, different from the first pattern (p1) that is a linear pattern. The second plate (712) includes the second flow paths (702) that form a radial pattern in at least some of the corner regions (720), thereby reducing stagnation of liquid fluid in the corner regions (720) and improving the performance of the vapor chamber (500).

[0135] The plurality of flow paths (700) may include one or more third flow paths (703) formed along an edge of the second plate (512) and configured to circulate a liquid fluid along the edge of the second plate (512), and one or more fourth flow paths (704) providing a passage for connecting at least some of the first flow paths (701) and the second flow paths (702) with the one or more third flow paths (703).

[0136] For example, one or more third flow paths (703) may surround the first flow paths (701) and the second flow paths (702). For example, one or more third flow paths (703) may have a shape corresponding to a shape of an edge of the second plate (512). The one or more third flow paths (703) may be configured to circulate a liquid fluid within the vapor chamber (500) along the edge by being formed along the edge of the second plate (512). For example, one or more fourth flow paths (704) may connect the first flow paths (701) and / or the second flow paths (702) with one or more third flow paths (703). The one or more fourth passages (704) may be formed by removing a portion of the bottom surface (512a) of the second plate (512) forming the one or more third passages (703), but embodiments of the present disclosure are not limited thereto. The enclosure (510) of the vapor chamber (500) may include a plurality of passages (700) for moving a liquid fluid of the vapor chamber (500), thereby improving the performance of the vapor chamber (500).

[0137] Figure 8 illustrates a structure for heat dissipation of an exemplary electronic device.

[0138] Referring to FIG. 8, a structure for heat dissipation of the electronic device (101) including a vapor chamber (500) disposed within the electronic device (101) exemplarily illustrated and described in FIGS. 5a to 6b is exemplarily illustrated and described. The electronic device (101) may include a bracket (e.g., the first bracket (215) of FIG. 2A, the bracket (410) of FIG. 5A) including a mounting portion (e.g., the mounting portion (411) of FIG. 5A), a printed circuit board (e.g., the printed circuit board (430) of FIG. 5B) disposed toward the bracket (410), a heat-generating component (e.g., the processor (120) of FIG. 1, the heat-generating component (e.g., the electronic component (401) of FIG. 5B)) disposed on one side (e.g., one side (430a) of FIG. 5C) of the printed circuit board (430) facing toward the bracket (410), and a battery (e.g., the battery (264) of FIG. 2C) spaced apart from the heat-generating component (e.g., the electronic component (401)) and accommodated in the bracket (410). The vapor chamber (500) is The vapor chamber (500) may include a first part (501) disposed on the heat-generating component (e.g., electronic component (401)), a second part (502) interposed between the battery (264) and the mounting part (411), and a third part (503) extending from the first part (501) to the second part (502). However, the embodiments of the present disclosure are not limited thereto, and the electronic device (101) may include structures and / or configurations (e.g., a housing (200), a display (230), a hinge structure (250), a shield can (440), a shield sheet (450), a heat-conducting member (460), a fixing member (600), or a plurality of paths (700) of the vapor chamber (500)) exemplarily illustrated and described in FIGS. 5A to 7D. there is.However, embodiments of the present disclosure are not limited thereto, and in the following description, redundant descriptions of components having the same reference numerals as those described in FIGS. 2A to 6E may be omitted.

[0139] The housing (200) of the electronic device (101) may include a first housing (e.g., the first housing part (210) of FIG. 2A) defining a bracket (410) on which the vapor chamber (500) is mounted, and a second housing (e.g., the second housing part (220) of FIG. 2A). The electronic device (101) may include a hinge structure (250) that rotatably couples the first housing part (210) and the second housing part (220). The electronic device (101) may include a heat dissipation member (800) extending from the second part (502) of the vapor chamber (500) across the hinge structure (250) into the second housing part (220).

[0140] For example, the heat dissipation member (800) may include a first heat dissipation part (801) connected to the vapor chamber (500) (or a second part (502) of the vapor chamber (500), a second heat dissipation part (802) connected to the first heat dissipation part (801) and disposed on a hinge structure (250), and a third heat dissipation part (803) connected to the second heat dissipation part (802) and disposed within a second housing part (220). The first heat dissipation part (801) may be disposed, for example, within the first housing part (210) in which the vapor chamber (500) is disposed. The second heat dissipation member (802) may be attached to, for example, at least a portion of the hinge structure (250), thereby dissipating heat transferred from the vapor chamber (500) to the first heat dissipation member (801) through the hinge structure (250). The third heat dissipation member (803) may be attached to a portion of the second housing part (220) (for example, the second bracket (217) of FIG. 2C), thereby dissipating heat transferred from the second heat dissipation member (802) through the second housing part (220). However, the embodiments supported in the present disclosure are not limited thereto. The electronic device (101) may include a heat dissipation member (800) connected to the vapor chamber (500), thereby improving heat dissipation performance of the electronic device (101) with respect to heat emitted from the electronic component (401) within the electronic device (101).

[0141] Figure 9a is a drawing showing an exemplary electronic device.

[0142] Referring to FIG. 9A, an electronic device (101) according to one embodiment may include a housing (200) forming an exterior of the electronic device (101). For example, the housing (200) may include a front surface (900A), a rear surface (900B), and a side surface (900C) surrounding a space between the front surface (900A) and the rear surface (900B). According to one embodiment, the housing (200) may also refer to a structure forming at least a portion of the front surface (900A), the rear surface (900B), and / or the side surface (900C).

[0143] The electronic device (101) may include a substantially transparent front plate (902). In one embodiment, the front plate (902) may form at least a portion of the front surface (900A). In one embodiment, the front plate (902) may include, but is not limited to, a glass plate or a polymer plate including various coating layers.

[0144] The electronic device (101) may include a substantially opaque back plate (911). In one embodiment, the back plate (911) may form at least a portion of the back surface (900B). In one embodiment, the back plate (911) may be formed of a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.

[0145] The electronic device (101) may include a side bezel structure (or side member) (918). In one embodiment, the side bezel structure (918) may be coupled with the front plate (902) and / or the back plate (911) to form at least a portion of the side surface (900C) of the electronic device (101). For example, the side bezel structure (918) may form the entire side surface (900C) of the electronic device (101), or, for another example, the side bezel structure (918) may form the side surface (900C) of the electronic device (101) together with the front plate (902) and / or the back plate (911).

[0146] When the side surface (900C) of the electronic device (101) is partially formed by the front plate (902) and / or the rear plate (911), the front plate (902) and / or the rear plate (911) may include a region that extends seamlessly from its edge portion toward the rear plate (911) and / or the front plate (902). For example, the extending region of the front plate (902) and / or the rear plate (911) may be located at both ends of a long edge of the electronic device (101), for example, but the present disclosure is not limited to the above-described example.

[0147] The side bezel structure (918) may include a metal and / or a polymer. In one embodiment, the back plate (911) and the side bezel structure (918) may be formed integrally and may include the same material (e.g., a metal material such as aluminum), but is not limited thereto. For example, the back plate (911) and the side bezel structure (918) may be formed as separate components and / or may include different materials.

[0148] The electronic device (101) may include at least one of a display (901), an audio module (e.g., a first microphone hole (903), a second microphone hole (904), and a speaker hole (907)), a sensor module, camera modules (e.g., a first camera (905), a second camera (912), and a flash (913)), a key input device (917), a light-emitting element, and / or a connector hole (908). According to one embodiment, the electronic device (101) may omit at least one of the above components (e.g., the key input device (917) and / or the light-emitting element) or may additionally include other components.

[0149] The display (901) may be visually exposed through a significant portion of the front plate (902). For example, at least a portion of the display (901) may be visible through the front plate (902) forming the front surface (900A). For example, the display (901) may be disposed on the back surface of the front plate (902).

[0150] The outer shape of the display (901) may be formed to be substantially the same as the outer shape of the front plate (902) adjacent to the display (901). According to one embodiment, in order to expand the area where the display (901) is visually exposed, the gap between the outer shape of the display (901) and the outer shape of the front plate (902) may be formed to be substantially the same.

[0151] The display (901) (or the front surface (900A) of the electronic device (101)) may include a screen display area (901A). According to one embodiment, the display (901) may provide visual information to the user through the screen display area (901A). When the front surface (900A) is viewed from the front, the screen display area (901A) is illustrated as being positioned on the inside of the front surface (900A) and spaced apart from the outer edge of the front surface (900A), but is not limited thereto. For example, when the front surface (900A) is viewed from the front, at least a portion of an edge part of the screen display area (901A) may substantially coincide with an edge part of the front surface (900A) (or the front plate (902)).

[0152] The screen display area (901A) may include a sensing area (901B) configured to acquire the user's biometric information. Here, the meaning of "the screen display area (901A) includes the sensing area (901B)" may be understood to mean that at least a portion of the sensing area (901B) may overlap the screen display area (901A). For example, the sensing area (901B) may be an area capable of displaying visual information via the display (901) like other areas of the screen display area (901A) and additionally capable of acquiring the user's biometric information (e.g., a fingerprint). According to one embodiment, the sensing area (901B) may be formed in the key input device (917).

[0153] The display (901) may include an area where a first camera (905) is positioned. In one embodiment, an opening is formed in the area of ​​the display (901), and the first camera (905) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the front (900A). In this case, the screen display area (901A) may surround at least a portion of an edge part of the opening. In one embodiment, the first camera (905) (e.g., an under display camera (UDC)) may be positioned below the display (901) so as to overlap the area of ​​the display (901). In this case, the display (901) may provide visual information to the user through the area, and additionally, the first camera (905) may acquire an image corresponding to a direction facing the front (900A) through the area of ​​the display (901).

[0154] The display (901) may be combined with or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen.

[0155] The audio module (903, 904, 907) may include a microphone hole (e.g., a first microphone hole (903) and a second microphone hole (904)) and a speaker hole (907).

[0156] The microphone hole may include a first microphone hole (903) formed in a portion of the side (900C) and a second microphone hole (904) formed in a portion of the rear (900B). A microphone may be placed inside the microphone hole (e.g., the first microphone hole (903) and the second microphone hole (904)) to acquire external sounds. The microphone may include multiple microphones to detect the direction of the sound.

[0157] The second microphone hole (904) formed in a portion of the rear surface (900B) may be positioned adjacent to camera modules (e.g., the first camera (905), the second camera (912), and the flash (913)). For example, the second microphone hole (904) may acquire sound according to the operation of the camera modules (e.g., the first camera (905), the second camera (912), and the flash (913)). However, the present invention is not limited thereto.

[0158] The speaker hole (907) may include an external speaker hole and a call receiver hole. The external speaker hole (e.g., speaker hole (907)) may be formed in a part of the side surface (900C) of the electronic device (101). In one embodiment, the external speaker hole (e.g., speaker hole (907)) may be implemented as a single hole with the first microphone hole (903). In some embodiments, the call receiver hole may be formed in another part of the side surface (900C). For example, the call receiver hole may be formed on the side surface (900C) opposite the external speaker hole (e.g., speaker hole (907)). For example, based on the city of FIG. 9A, an external speaker hole (e.g., speaker hole (907)) may be formed on a side (900C) corresponding to the lower portion of the electronic device (101), and a call receiver hole may be formed on a side (900C) corresponding to the upper portion of the electronic device (101). However, this is not limited thereto, and the call receiver hole may be formed at a location other than the side (900C). For example, the call receiver hole may be formed by a spaced space between the front plate (902) (or, display (901)) and the side bezel structure (918).

[0159] The electronic device (101) may include at least one speaker configured to output sound to the outside of the housing through an external speaker hole (e.g., speaker hole (907)) and / or a call receiver hole.

[0160] The sensor module can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. For example, the sensor module can include at least one of a proximity sensor, a hear rate monitor (HRM) sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, and / or an illuminance sensor.

[0161] The camera module may include a first camera (905) positioned to face the front (900A) of the electronic device (101), a second camera (912) positioned to face the same direction as the direction facing the rear (e.g., the rear (900B)), and a flash (913).

[0162] The second camera (912) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera (912) is not necessarily limited to including multiple cameras and may include a single camera.

[0163] The first camera (905) and the second camera (912) may include one or more lenses, image sensors, and / or image signal processors.

[0164] The flash (913) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, nine or more lenses (e.g., an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be arranged on one side of the electronic device (101).

[0165] The key input device (917) may be positioned on a side (900C) of the electronic device (101). In one embodiment, the electronic device (101) may not include some or all of the key input devices (917), and the key input devices (917) that are not included may be implemented in another form, such as soft keys, on the display (901).

[0166] A connector hole (908) may be formed on a side surface (900C) of the electronic device (101) to accommodate a connector of an external device. A connection terminal electrically connected to the connector of the external device may be arranged within the connector hole (908). The electronic device (101) according to one embodiment may include an interface module for processing electrical signals transmitted and received through the connection terminal.

[0167] The electronic device (101) may include a light-emitting element. For example, the light-emitting element may be disposed on the front surface (900A) of the housing. The light-emitting element may provide status information of the electronic device (101) in the form of light. For example, the light-emitting element may provide a light source that is linked to the operation of the first camera (905). For example, the light-emitting element may include a light-emitting diode (LED), an infrared (IR) LED, and / or a xenon lamp.

[0168] Figure 9b is an exploded perspective view of an exemplary electronic device.

[0169] In the following, redundant descriptions of configurations having the same reference numerals as the configurations described above may be omitted.

[0170] Referring to FIG. 9b, an electronic device (101) according to one embodiment may include a frame structure (940), a first printed circuit board (950), a second printed circuit board (952), a cover plate (960), and a battery (970).

[0171] The frame structure (940) may include a side bezel structure (918) forming an exterior of the electronic device (101) (e.g., side surface (900C) of FIG. 9A) and a support portion (943) extending inwardly from the side bezel structure (918). The frame structure (940) may be disposed between the display (901) and the back plate (911). The side bezel structure (918) of the frame structure (940) may surround a space between the back plate (911) and the front plate (902) (and / or the display (901)), and the support portion (943) of the frame structure (940) may extend from the side bezel structure (918) within the space.

[0172] The frame structure (940) may support or accommodate other components included in the electronic device (101). For example, a display (901) may be disposed on one side of the frame structure (940) facing one direction (e.g., +z direction), and the display (901) may be supported by a support portion (943) of the frame structure (940). For example, a first printed circuit board (950), a second printed circuit board (952), a battery (970), and a second camera (912) may be disposed on the other side of the frame structure (940) facing the opposite direction (e.g., -z direction). The first printed circuit board (950), the second printed circuit board (952), the battery (970), and the second camera (912) may be respectively mounted in recesses defined by the side bezel structure (918) and / or the support portion (943) of the frame structure (940). For example, the vapor chamber (500) exemplarily illustrated and described in FIGS. 5A to 8 may be disposed between the support portion (943) of the frame structure (940) and the display (901). However, embodiments of the present disclosure are not limited thereto, and the vapor chamber (500) may include, for example, a first portion (501) disposed between a first printed circuit board (950) and the support portion (943), a second portion (502) disposed between a battery (970) and the support portion (943), and a third portion (503) connecting the first portion (501) and the second portion (502), similar to the vapor chamber (500) exemplarily illustrated and described in FIGS. 5A to 8. However, embodiments of the present disclosure are not limited thereto.

[0173] The first printed circuit board (950), the second printed circuit board (952), and the battery (970) may be respectively coupled to the frame structure (940). For example, the first printed circuit board (950) and the second printed circuit board (952) may be fixedly disposed to the frame structure (940) via a coupling member such as a screw. For example, the battery (970) may be fixedly disposed to the frame structure (940) via an adhesive member (e.g., double-sided tape). However, the present invention is not limited to the above-described examples.

[0174] The cover plate (960) may be placed between the first printed circuit board (950) and the back plate (911). According to one embodiment, the cover plate (960) may be placed on the first printed circuit board (950). For example, the cover plate (960) may be placed on a surface of the first printed circuit board (950) facing the -z direction.

[0175] The cover plate (960) may at least partially overlap the first printed circuit board (950) with respect to the z-axis. According to one embodiment, the cover plate (960) may cover at least a portion of the first printed circuit board (950). Through this, the cover plate (960) may protect the first printed circuit board (950) from physical impact or prevent detachment of a connector coupled to the first printed circuit board (950).

[0176] The cover plate (960) may be fixedly positioned on the first printed circuit board (950) via a joining member (e.g., a screw), or may be joined to the frame structure (940) together with the first printed circuit board (950) via the joining member.

[0177] The display (901) may be positioned between the frame structure (940) and the front plate (902). For example, the front plate (902) may be positioned on one side (e.g., in the +z direction) of the display (901), and the frame structure (940) may be positioned on the other side (e.g., in the -z direction).

[0178] The front plate (902) can be coupled with the display (901). For example, the front plate (902) and the display (901) can be bonded to each other through an optical adhesive member (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.

[0179] The front plate (902) may be coupled with the frame structure (940). For example, the front plate (902) may include an outer portion extending outside the display (901) when viewed in the z-axis direction, and may be coupled to the frame structure (940) through an adhesive member (e.g., double-sided tape) disposed between the outer portion of the front plate (902) and the frame structure (940) (e.g., side bezel structure (918)). However, the present invention is not limited to the above-described examples.

[0180] The first printed circuit board (950) and / or the second printed circuit board (952) may be equipped with a processor, a memory, and / or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, and / or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, and may include a USB connector, an SD card / MMC connector, and / or an audio connector. According to one embodiment, the first printed circuit board (950) and the second printed circuit board (952) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0181] The battery (970) may power at least one component of the electronic device (101). For example, the battery (970) may include a rechargeable secondary battery or a fuel cell. At least a portion of the battery (970) may be disposed substantially coplanar with the first printed circuit board (950) and / or the second printed circuit board (952).

[0182] The electronic device (101) may include an antenna module. The antenna module may be positioned between the rear plate (911) and the battery (970). The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly transmit and receive power with the external device.

[0183] A first camera (905) (e.g., a front camera) may be positioned on at least a portion of the frame structure (940) (e.g., a support portion (943)) such that the lens can receive external light through a portion of the front plate (902) (e.g., the front (900A) of FIG. 9A) (e.g., the camera area (937)).

[0184] A second camera (912) (e.g., a rear camera) may be positioned between the frame structure (940) and the rear plate (911). The second camera (912) may be electrically connected to the first printed circuit board (950) via a connecting member (e.g., a connector). In one embodiment, the second camera (912) may be positioned such that the lens can receive external light through the camera area (984) of the rear plate (911) of the electronic device (101).

[0185] The camera area (984) may be formed on the surface of the rear plate (911) (e.g., the rear surface (900B) of FIG. 9A). According to one embodiment, the camera area (984) may be formed to be at least partially transparent so that external light may be incident on the lens of the second camera (912). According to one embodiment, at least a portion of the camera area (984) may protrude from the surface of the rear plate (911) by a predetermined height. However, the present invention is not limited thereto, and the camera area (984) may also form a substantially same plane as the surface of the rear plate (911).

[0186] The housing (e.g., the housing (200) of FIG. 9A) of the electronic device (101) may refer to a configuration or structure that forms at least a portion of the exterior of the electronic device (101). In this respect, at least a portion of the front plate (902), the frame structure (940), and / or the rear plate (911) that form the exterior of the electronic device (101) may be referred to as the housing (200) of the electronic device (101).

[0187] According to the above, the electronic device (e.g., the electronic device (101) of FIG. 1) may include a bracket (e.g., the first bracket (215) of FIG. 2c, the bracket (410) of FIG. 4) including a mounting portion (e.g., the mounting portion (411) of FIG. 4), a printed circuit board (e.g., the printed circuit board (430) of FIG. 4) disposed toward the bracket, a heat generating component (e.g., the processor (120) of FIG. 1, the electronic component (401) of FIG. 4) disposed on one surface of the printed circuit board facing toward the bracket (e.g., one surface (430a) of FIG. 5b), a battery (e.g., the battery (264) of FIG. 2c) accommodated in the bracket and spaced apart from the heat generating component), and a vapor chamber (e.g., the vapor chamber (500) of FIG. 5a) mounted to the mounting portion of the bracket. The vapor chamber may include a first portion (e.g., a first portion (501) of FIG. 5A) disposed above the heat-generating component, a second portion (e.g., a second portion (502) of FIG. 5A) interposed between the battery and the mounting portion, and a third portion (e.g., a third portion (503) of FIG. 5A) extending from the first portion to the second portion.

[0188] For example, the vapor chamber may be configured to diffuse heat transferred from the heat generating component to the first portion through the third portion to the second portion.

[0189] For example, the area of ​​the second portion of the vapor chamber (e.g., A2 in FIG. 5a) may be larger than the area of ​​the first portion of the vapor chamber (e.g., A1 in FIG. 5a).

[0190] For example, the electronic device may further include a display (e.g., display (230) of FIG. 2A) disposed on the bracket. The vapor chamber may be separated or isolated from the display by the bracket.

[0191] For example, the electronic device may include a housing (e.g., housing (200) of FIG. 2A) including a first housing part (e.g., first housing part (210) of FIG. 2A) defining the bracket and a second housing part (e.g., second housing part (220) of FIG. 2A), and a hinge assembly (e.g., hinge structure (250) of FIG. 2B) rotatably coupling the first housing part and the second housing part. The display may include a first planar portion (e.g., the first planar portion (231) of FIG. 2A) coupled to the first housing part and positioned on the mounting portion of the bracket, a second planar portion (e.g., the second planar portion (232) of FIG. 2A) coupled to the second housing part and spaced apart from the first planar portion, and a foldable portion (e.g., the foldable portion (233) of FIG. 2A) extending from the first planar portion to the second planar portion and deformable by the hinge assembly.

[0192] For example, the second portion of the vapor chamber may further include a heat dissipation member (e.g., heat dissipation member (800) of FIG. 8) extending across the hinge assembly into the second housing part.

[0193] For example, the vapor chamber may include an enclosure (e.g., an enclosure (510) of FIG. 5c) including a first plate attached to the mounting portion (e.g., a first plate (511) of FIG. 5c) and a second plate (e.g., a second plate (512) of FIG. 5c) coupled to the first plate and attached to the battery, a fluid within the enclosure, and a wick structure (e.g., a wick structure (520) of FIG. 5c) disposed within the enclosure and in contact with the second plate. The second plate may include a plurality of flow paths (e.g., a plurality of flow paths (700) of FIG. 7a) recessed from a bottom surface of the second plate for movement of the fluid in a liquid state between the wick structure and the second plate.

[0194] For example, the second plate may include corner regions (e.g., corner regions (720) of FIG. 7C) arranged along an edge of the second plate, and a center region (e.g., center region (710) of FIG. 7C) surrounded by the corner regions. The plurality of flow paths may include first flow paths (e.g., first flow paths (701) of FIG. 7C) formed in the center region and having a first pattern (e.g., p1 of FIG. 7C), and second flow paths (e.g., second flow paths (702) of FIG. 7C) formed in the corner regions, connected to the first flow paths, and having a second pattern (e.g., p2 of FIG. 7C) at least partially different from the first pattern.

[0195] For example, the second pattern may be a radial pattern.

[0196] For example, the plurality of passages may include one or more third passages (e.g., one or more third passages (703) of FIG. 7c) formed along an edge of the second plate and configured to circulate the fluid in a liquid state along the edge of the second plate, and one or more fourth passages (e.g., one or more fourth passages (704) of FIG. 7c) providing a passage for connecting at least some of the second passages with the one or more third passages.

[0197] For example, the vapor chamber may further include an enclosure including a first plate attached to the mounting portion, and a second plate coupled to the first plate and attached to the battery. The electronic device may further include an adhesive member (e.g., adhesive member (550) of FIG. 5C) disposed between the second plate and the battery.

[0198] For example, the second plate included in the second portion may include an adhesive surface to which the adhesive member is attached (e.g., an adhesive surface (502a) in FIG. 6c), and a protruding surface (e.g., a protruding surface (502b) in FIG. 6c) that protrudes from the adhesive surface toward the battery and thereby comes into contact with the battery.

[0199] For example, the first plate may include a plurality of posts (e.g., a plurality of posts (530) of FIG. 5c) protruding from the first plate toward the second plate within the enclosure, at least some of which are welded to the second plate.

[0200] For example, the electronic device may further include a fastener (e.g., a fastener (600) of FIG. 6B) that is positioned on the third portion of the vapor chamber and is coupled to the bracket to fasten the vapor chamber to the bracket.

[0201] For example, the thickness of the first portion of the vapor chamber (e.g., thickness (t1) in FIG. 6c) may be greater than the thickness of the second portion of the vapor chamber (e.g., thickness (t2) in FIG. 6c).

[0202] According to the above, the electronic device may include a bracket including a mounting portion, a printed circuit board arranged toward the bracket, a heat generating component arranged on one surface of the printed circuit board facing the bracket, a shield can (e.g., a shield can (440) of FIG. 5b) arranged on the one surface of the printed circuit board and including a through hole (e.g., a through hole (445) of FIG. 5b) surrounding the heat generating component, a shielding sheet (e.g., a shielding sheet (450) of FIG. 5b) attached to the shield can to cover the through hole of the shield can), a heat conducting member (e.g., a heat conducting member (460) of FIG. 5c) interposed between the heat generating component and the shielding sheet through the through hole of the shield can, a battery spaced apart from the heat generating component and accommodated in the bracket, and a vapor chamber mounted on the mounting portion of the bracket. The vapor chamber may include a first portion attached to the shielding sheet, a second portion interposed between the battery and the mounting portion, and a third portion extending from the first portion to the second portion.

[0203] For example, the vapor chamber may be configured to diffuse heat transferred from the heat generating component to the first portion through the third portion to the second portion. The area of ​​the second portion of the vapor chamber may be larger than the area of ​​the first portion of the vapor chamber.

[0204] For example, the vapor chamber may further include an enclosure comprising a first plate attached to the mounting portion, a second plate coupled to the first plate and attached to the battery, the second plate defining corner regions and a center region surrounded by the corner regions, a fluid within the enclosure, and a wick structure disposed within the enclosure and in contact with the second plate. The second plate may include a plurality of channels recessed from a bottom surface of the second plate for movement of the liquid fluid between the wick structure and the second plate. The plurality of channels may include first channels formed in the center region and having a first pattern, and second channels formed in the corner regions and connected to the first channels, the second channels having a second pattern, at least a portion of which is a radial pattern different from the first pattern.

[0205] For example, the plurality of passages may include one or more third passages formed along an edge of the second plate and configured to circulate the fluid in a liquid state along the edge of the second plate, and one or more fourth passages providing a passage for connecting at least some of the second passages with the one or more third passages.

[0206] For example, the electronic device may further include an adhesive member disposed between the vapor chamber and the battery. The second portion may include an adhesive surface to which the adhesive member is attached, and a protruding surface that protrudes from the adhesive surface toward the battery and thereby comes into contact with the battery.

[0207] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0208] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0209] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0210] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0211] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0212] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, Bracket including the mounting portion; A printed circuit board placed on the above bracket; A heating component arranged on one side of the printed circuit board facing the bracket; A battery spaced apart from the above heat generating component and housed in the bracket; and including a vapor chamber on the mounting portion of the above bracket, The above vapor chamber, A first part disposed on the above-mentioned heating component, A second part interposed between the battery and the mounting part, and comprising a third portion extending from the first portion of the vapor chamber to the second portion of the vapor chamber; Electronic devices.

2. In paragraph 1, The above vapor chamber, configured to spread the heat transferred from the above-mentioned heat generating component to the above-mentioned first part through the above-mentioned third part to the above-mentioned second part, Electronic devices.

3. In paragraph 1, The area of ​​the second portion of the vapor chamber is greater than the area of ​​the first part of the vapor chamber, Electronic devices.

4. In paragraph 1, Further comprising a display arranged on the above bracket, The above vapor chamber, Separated from the display by the above bracket, Electronic devices.

5. In paragraph 4, A housing comprising a first housing part defining the bracket and a second housing part; and Further comprising a hinge assembly that rotatably connects the first housing part and the second housing part, The above display is, A first flat portion coupled to the first housing part and positioned on the mounting portion of the bracket; a second planar portion coupled to the second housing part and spaced apart from the first planar portion, and A foldable portion extending from the first plane portion to the second plane portion and configured to be deformed by the hinge assembly, Electronic devices.

6. In paragraph 5, Further comprising a heat dissipation member extending from the second portion of the vapor chamber, across the hinge assembly, into the second housing part; Electronic devices.

7. In paragraph 1, The above vapor chamber, An enclosure comprising a first plate attached to the mounting portion, and a second plate coupled to the first plate and attached to the battery; The fluid within the enclosure, and A wick structure disposed within the enclosure and in contact with the second plate, The above second plate, A plurality of channels recessed from the bottom surface of the second plate for movement of the liquid fluid between the wick structure and the second plate, Electronic devices.

8. In paragraph 7, The above second plate, Corner regions arranged along the edge of the second plate, and including a center area surrounded by the above corner areas, The above mentioned multiple euros are, First euros formed in the above center area and having a first pattern, and formed in at least some of the corner regions, and including second euros connected to the first euros and having a second pattern different from the first pattern, Electronic devices.

9. In paragraph 8, The second pattern above is, A radial pattern, Electronic devices.

10. In paragraph 8, The above mentioned multiple euros are, One or more third channels formed along the edge of the second plate and configured to circulate the fluid in a liquid state along the edge of the second plate, and Further comprising one or more fourth euros configured to function as a passage between at least one of the first euros and the second euros and the one or more third euros, Electronic devices.

11. In paragraph 1, The above vapor chamber, A first plate attached to the above-mentioned mounting portion, and An enclosure comprising a second plate coupled to the first plate and attached to the battery, The above electronic device, Further comprising an adhesive member disposed between the second plate and the battery, Electronic devices.

12. In paragraph 11, A portion of said second plate is within said second portion, and said portion of said second plate is within said second portion. an adhesive surface to which the adhesive member is attached, and Including a protruding surface that comes into contact with the battery by protruding toward the battery from the adhesive surface, Electronic devices.

13. In paragraph 11, The above first plate, A plurality of pillars protruding from the first plate toward the second plate within the enclosure, at least some of which are welded to the second plate, Electronic devices.

14. In paragraph 1, Further comprising a fixing member disposed on the third portion of the vapor chamber and configured to fix the vapor chamber to the bracket. Electronic devices.

15. In paragraph 1, The thickness of the first portion of the vapor chamber is: Thicker than the thickness of the second part of the vapor chamber, Electronic devices.

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