Substrate bonding apparatus

Abstract

A substrate bonding apparatus according to the present invention comprises: a first chuck in contact with a first rear surface so as to support a first substrate including a first bonding surface and the first rear surface facing away from the first bonding surface; a second chuck in contact with a second rear surface so as to support a second substrate including a second bonding surface facing the first bonding surface and the second rear surface facing away from the second bonding surface; an adsorption unit for adsorbing and supporting an outer peripheral portion of the second rear surface before the second rear surface is supported by the second chuck; and a chuck driving unit for moving the first chuck and / or the second chuck such that the first bonding surface and the second bonding surface come in close contact.

Description

substrate bonding device

[0001] The present invention relates to a substrate bonding device, and more specifically, to a substrate bonding device that bonds a pair of substrates so that the bonding surfaces that are to be bonded face to face are not contaminated.

[0002] For example, a bonded substrate that bonds a pair of substrates, such as a bonded substrate that bonds a carrier substrate to a device substrate, can be used in a semiconductor manufacturing process.

[0003] A substrate bonding device can support a pair of substrates facing each other and spaced apart from each other, and move them toward each other to closely bond the pair of substrates. However, during the process of supporting and moving the substrates, the bonding surfaces of the substrates or the device that transports the substrates may become contaminated.

[0004] The background technology of the present invention is disclosed in Korean Patent Publication No. 10-2015-0136848 (published on December 8, 2015, title of the invention: Substrate bonding device).

[0005] The present invention was created to improve the above-mentioned problems, and the purpose of the present invention is to provide a substrate bonding device in which the bonding surface of the substrate or the device for transporting the substrate is not contaminated.

[0006] A substrate bonding device according to the present invention comprises: a first chuck for supporting a first substrate including a first bonding surface and a first back surface facing the first bonding surface by contacting the first back surface; a second chuck for supporting a second substrate including a second bonding surface facing the first bonding surface and a second back surface facing the second bonding surface by contacting the second back surface; a suction unit for suction-supporting an outer peripheral portion of the second back surface before the second back surface is supported by the second chuck; and a chuck driving unit for moving at least one of the first chuck and the second chuck so that the first bonding surface and the second bonding surface are brought into close contact with each other.

[0007] The second chuck is positioned above the first chuck, and the substrate bonding device may further include a substrate transfer arm that contacts and supports the second back surface and transfers the second substrate to a position aligned with the suction unit, and when the suction unit suction-supports the second back surface, separates from the second substrate and returns to the original position.

[0008] The above suction unit may include a plurality of suction plates arranged spaced apart from each other; a suction plate support pole that supports the suction plates and extends parallel to the thickness direction of the second chuck; and a suction plate lifting actuator that provides power to move the suction plates parallel to the thickness direction of the second chuck.

[0009] The above suction plate can be raised and lowered to avoid the substrate transfer arm.

[0010] The second chuck includes a plurality of suction plate receiving portions in which a plurality of the suction plates are received, and a distance from the center of the second chuck to the suction plate support pole may be greater than the size of the radius of the second chuck.

[0011] The second chuck includes a plurality of suction plate receiving portions in which a plurality of the suction plates are received, and the suction plate support pole can extend through the second chuck.

[0012] The above substrate bonding device may further include a bellows press including a corrugated pipe into which air is injected, and when the first substrate and the second substrate come into contact, the corrugated pipe expands to uniformly distribute the adhesive force between the first substrate and the second substrate over the entire area of ​​the first bonding surface and the second bonding surface.

[0013] The above-mentioned corrugated pipe may include a metal material.

[0014] The above bellows press can press the second chuck toward the first chuck.

[0015] The substrate bonding device may further include a vacuum chamber having an internal space for accommodating the first chuck and the second chuck, and in which a negative pressure is formed in the internal space when the first substrate and the second substrate are bonded.

[0016] The vacuum chamber may include a first chamber member that supports one of the first chuck and the second chuck; and a second chamber member that moves in a direction approaching the first chamber member and in a direction away from the first chamber member so that the internal space is formed.

[0017] The first chuck may include a first chuck heater for heating the first substrate, and the second chuck may include a second chuck heater for heating the second substrate.

[0018] The substrate bonding device may further include a substrate alignment stage that changes the position and angle of at least one chuck among the first chuck and the second chuck so that the first substrate and the second substrate are aligned with respect to each other.

[0019] The above substrate bonding device may further include a camera unit that captures the position and angle of the first substrate and the second substrate.

[0020] The camera unit may include a camera that moves between the first chuck and the second chuck when the first chuck and the second chuck are spaced apart to capture the position and angle of the first substrate and the second substrate, and returns to the original position before at least one of the first chuck and the second chuck approaches the other chuck.

[0021] According to the present invention, the bonding process between the first and second substrates is performed without contacting the bonding surfaces of the first and second substrates, so the first and second substrates are not contaminated, and the transfer arm that transports the first and second substrates is also not contaminated. Accordingly, the quality of the bonded substrates can be improved, and productivity can also be increased.

[0022] According to the present invention, since the suction unit adsorbs and supports the outer periphery of the second substrate and moves to the second chuck to attach the second substrate to the second chuck, the second substrate can be stably attached to the second chuck regardless of the shape of the warpage of the second substrate. Accordingly, defects in the substrate bonding operation can be suppressed, and the yield of good products of the bonded substrate can be improved.

[0023] Figure 1 is a configuration diagram of a substrate bonding device according to one embodiment of the present invention.

[0024] Figure 2 is a bottom view of the second chuck of Figure 1.

[0025] Figures 3 to 7 are drawings sequentially illustrating a method of bonding a pair of substrates using the substrate bonding device of Figure 1.

[0026] Figures 8 and 9 are drawings sequentially illustrating a process in which a substrate convexly bent downwards is supported by a second chuck in surface contact.

[0027] Figures 10 and 11 are drawings sequentially illustrating a process in which a substrate convexly bent upwards is supported by a second chuck in surface contact.

[0028] FIG. 12 is a schematic diagram showing a portion of a substrate bonding device according to another embodiment of the present invention.

[0029] Hereinafter, a substrate bonding device according to an embodiment of the present invention will be described in detail with reference to the attached drawings. The terminology used in this specification is intended to adequately express preferred embodiments of the present invention and may vary depending on the intent of the user or operator, or the customary practices in the field to which the present invention pertains. Therefore, the definitions of these terms should be based on the contents throughout this specification.

[0030] FIG. 1 is a schematic diagram of a substrate bonding device according to one embodiment of the present invention, FIG. 2 is a bottom view of the second chuck of FIG. 1, and FIGS. 3 to 7 are drawings sequentially illustrating a method of bonding a pair of substrates using the substrate bonding device of FIG. 1. Referring to FIGS. 1 to 7, a substrate bonding device (100) according to one embodiment of the present invention is a device that automatically bonds a pair of substrates (10, 20) so that they overlap each other to form a bonded substrate (30).

[0031] A pair of substrates (10, 20) includes a first substrate (10) including a first bonding surface (11) and a first back surface (13) facing away from the first bonding surface (11), and a second substrate (20) including a second bonding surface (21) and a second back surface (23) facing away from the second bonding surface (21). For example, the first substrate (10) may be a device substrate, and the second substrate (20) may be a carrier substrate. The first substrate (10), the second substrate (20), and the bonding substrate (30) (see FIG. 7) may be wafers having a circular planar shape.

[0032] The substrate bonding device (100) includes a first chuck (120), a second chuck (130), a suction unit (150), and a chuck driving unit (140). The first chuck (120) supports the first substrate (10) by contacting the first back surface (13) of the first substrate (10). The planar shape of the first substrate supporting surface, or upper surface, of the first chuck (120) may be circular to correspond to the planar shape of the first substrate (10). The size of the radius of the upper surface of the first chuck (120) may be larger than the size of the radius of the first substrate (10).

[0033] The first chuck (120) can support the first back surface (13) of the first substrate (10) by making surface contact therewith, for example, by an adsorption method that forms a negative pressure on the upper surface, or by an electrostatic method that charges the first substrate (10). The first chuck (120) can include a first chuck heater (122) for heating the first substrate (10) therein.

[0034] The second chuck (130) supports the second substrate (20) by contacting the second back surface (23) of the second substrate (20). The second chuck (130) may be placed on the upper side of the first chuck (120). The planar shape of the second substrate support surface, or lower surface, of the second chuck (130) may be circular to correspond to the planar shape of the second substrate (20). The size of the radius of the lower surface of the second chuck (130) may be larger than the size of the radius of the second substrate (20).

[0035] The second chuck (130) can support the second back surface (23) of the second substrate (20) by making surface contact with it, for example, by an adsorption method that forms a negative pressure on the lower surface, or by an electrostatic method that charges the second substrate (20). The second chuck (130) can include a second chuck heater (132) for heating the second substrate (20) therein.

[0036] The suction unit (150) suction-supports the outer periphery of the second back surface (23) before the second back surface (23) of the second substrate (30) is supported by the second chuck (130). The suction unit (150) may include a plurality of suction plates (152), suction plate support poles (155), suction plate support brackets (154), and suction plate lifting and lowering actuators (151).

[0037] A plurality of suction plates (152) may be spaced apart from each other along the outer periphery of the second substrate (20). When the shape of the lower surface of the second chuck (130) on which the second substrate (20) is supported is circular like the shape of the second substrate (20), the plurality of suction plates (152) may be spaced apart from each other along the outer periphery of the second chuck (130). The plurality of suction plates (152) may be spaced apart from each other at equal angular intervals with respect to the center (CX) of the lower surface of the second chuck (130).

[0038] The suction plate (152) may include an opening that is directed downward, that is, opens toward the first chuck (120) to suck in air so that a negative pressure is formed, and that is directed downward. Although not shown in the drawing, the suction unit (150) may further include a vacuum pump that forms a negative pressure in a plurality of suction plates (152), and an intake passage that connects the vacuum pump and the suction plates (152) so that air can flow.

[0039] The suction plate support pole (155) supports the suction plate (152) and can extend in a direction parallel to the thickness of the second chuck (130), that is, in the vertical direction. The suction plate support bracket (154) can connect the suction plate (152) and the suction plate support pole (155). The suction plate (152) can be supported at one end of the suction plate support bracket (154), and the other end of the suction plate support bracket (154) can be supported at the lower end of the suction plate support pole (155).

[0040] As illustrated in FIG. 2, the suction plate support pole (155) may be positioned outside the outer circumference of the second chuck (130). Therefore, the distance (DP) from the center (CX) of the second chuck (130) to the suction plate support pole (155) may be greater than the size of the radius (DI) of the second chuck (130). The horizontal distance from the center (CX) of the second chuck (130) to the suction plate (152) may be smaller than the size of the radius (DI) of the second chuck (130).

[0041] A horizontal distance from the center (CX) of the second chuck (130) to the suction plate (152) in a radial direction from the center (CX) of the second chuck (130) may be greater than a horizontal distance from the outer periphery of the second chuck (130) to the suction plate (152). Accordingly, the suction plate (152) may be positioned closer to the outer periphery of the suction plate (152) than the central portion close to the center (CX) of the second chuck (130) and overlapping with the outer periphery.

[0042] One end of the suction plate support bracket (154) may support the suction plate (152), and the other end may be connected to the lower end of the suction plate support pole (155). The suction plate support bracket (154) may extend radially with respect to the center (CX) of the second chuck (130). The combined suction plate support pole (155) and suction plate support bracket (154) may have a cross-section in the shape of the letter L.

[0043] The suction plate lifting actuator (151) provides power to move the suction plate (152) parallel to the thickness direction of the second chuck (130). The suction plate lifting actuator (151) may be connected to the upper end of the suction plate support pole (155) so as to be capable of transmitting power. The suction plate lifting actuator (151) may include, for example, an electric motor or a hydraulic cylinder. The suction plate support pole (155), the suction plate support bracket (154), and the suction plate lifting actuator (151) may be provided in a number corresponding to the suction plate (152) one-to-one, respectively.

[0044] The substrate bonding device (100) may further include a frame (101). The frame (101) may include a plurality of pillars (102) extending upwardly from the outside of the first chuck (120) and the second chuck (130), and a horizontal plate (104) supported by the plurality of pillars (102) and positioned above the first chuck (120) and the second chuck (130). A suction plate lifting actuator (151) may be supported on the horizontal plate (104). A suction plate support pole (155) may extend downward through the horizontal plate (104).

[0045] The second chuck (130) may include a plurality of suction plate receiving portions (134) in which a plurality of suction plates (152) are received. The suction plate receiving portions (134) may be grooves extending upward from the lower surface of the second chuck (130).

[0046] A plurality of suction plates (152) can come out of the plurality of suction plate receiving portions (134) and descend below the second chuck (130) to adsorb the outer periphery of the second substrate (20). When the plurality of suction plates (134) adsorb the outer periphery of the second substrate (20) and rise, the gap between the lower surface of the second chuck (130) and the second back surface (23) is narrowed.

[0047] When the second back surface (23) comes into contact with the lower surface of the second chuck (130), the second substrate (20) can be supported by the second chuck (130) in surface contact. At this time, the suction by the plurality of suction plates (152) is stopped, and the plurality of suction plates (152) can be stored in the plurality of suction plate storage portions (134). The height of the lower end of the suction plate (152) can be higher than the height of the lower end of the second chuck (130) so that the lower end of the suction plate (152) does not protrude downward from the lower surface of the second chuck (130).

[0048] A plurality of suction plate receiving portions (134) can be arranged at equiangular intervals with respect to the center (CX) of the lower surface of the second chuck (130) to correspond to a plurality of suction plates (152). Each suction plate receiving portion (134) includes a groove that is open to the outer surface and lower surface of the second chuck (130) and closed to the upper surface of the second chuck (130). However, the suction plate receiving portion may also include a through hole that is open to the outer surface of the second chuck (130) and penetrates in the thickness direction of the second chuck (130).

[0049] The suction plate support pole (155) may be located outside the outer circumference of the second chuck (130). Therefore, the distance (DP) from the center (CX) of the second chuck (130) to the suction plate support pole (155) may be greater than the size of the radius (DI) of the second chuck (130). When the suction plate (152) is stored in the suction plate receiving portion (134), the suction plate support bracket (154) is also stored in the suction plate receiving portion (134), and when the suction plate (152) descends with respect to the second chuck (130) and comes out of the suction plate receiving portion (134), the suction plate support bracket (154) may also come out of the suction plate receiving portion (134).

[0050] The chuck driving unit (140) moves the second chuck (130) so that the first bonding surface (11) of the first substrate (10) and the second bonding surface (21) of the second substrate (20) are in close contact. In other words, the chuck driving unit (140) elevates the second chuck (130). The chuck driving unit (140) may include an electric motor (141) and a power transmission unit (142) that transmits the power of the electric motor (141) to the second chuck (130).

[0051] The electric motor (141) may be positioned above the horizontal plate (104). The power transmission unit (142) may extend in the vertical direction and may be connected to the second chuck (130) by penetrating the horizontal plate (104). The power transmission unit (142) may be provided in multiple units so as to be connected to different parts of the second chuck (130).

[0052] For example, the power transmission unit (142) may include a screw that extends in the up-and-down direction through the horizontal plate unit (104) and rotates together with the motor shaft (not shown) of the electric motor (141) when it rotates, and a female screw pattern that meshes with the male screw pattern of the screw, and a nut member that is fixedly connected to the second chuck (130).

[0053] Meanwhile, the chuck driving unit (140) is not limited to including an electric motor (141), and may include, for example, a hydraulic cylinder. In addition, instead of moving the second chuck (130), the chuck driving unit may move the first chuck (120) in a direction approaching the second chuck (130) and in an opposite direction. Alternatively, the chuck driving unit may simultaneously move the first chuck (120) and the second chuck (130) in a direction approaching each other and in an opposite direction.

[0054] The substrate bonding device (100) may further include a bellows press (145), a vacuum chamber (110), a substrate alignment stage (138), a camera unit (167), and a substrate transfer arm (170, 175).

[0055] A bellows press (145) may include a corrugated pipe (146), an air pump (148) that injects air into the corrugated pipe (146) or discharges air from the inside of the corrugated pipe (146) to the outside, and an air passage (149) that connects the corrugated pipe (146) and the air pump (148) to enable air flow.

[0056] The corrugated pipe (146) can have air injected into it. When air is injected into the corrugated pipe (146) and the pressure inside the corrugated pipe (146) becomes greater than that outside the corrugated pipe (146), the corrugated pipe (146) can expand to become longer in the vertical direction. Conversely, when air is discharged from the inside of the corrugated pipe (146) to the outside and the pressure inside the corrugated pipe (146) becomes less than that outside the corrugated pipe (146), the corrugated pipe (146) can contract to become shorter in the vertical direction.

[0057] The corrugated pipe (146) may include a metal material. The lower end of the corrugated pipe (146) may be coupled to the second chuck (130), and the upper end of the corrugated pipe (146) may be coupled to the second chamber member (114). The corrugated pipe (146) may be interposed between the second chuck (130) and the second chamber member (114).

[0058] When the second chuck (130) is lowered toward the first chuck (120) and the first substrate (10) and the second substrate (20) come into contact, and the corrugated pipe (146) expands, the adhesive force between the first substrate (10) and the second substrate (20) can be uniformly distributed over the entire area of ​​the first bonding surface (11) and the second bonding surface (21).

[0059] The corrugated pipe (146) interposed between the first chuck (130) and the second chamber member (114) can press the second chuck (130) toward the first chuck (120) when expanded. However, unlike as shown in FIGS. 3 to 7, in another embodiment of the present invention, the corrugated pipe may be interposed between the first chuck (120) and the first chamber member (111) to press the first chuck (120) toward the second chuck (130).

[0060] The power transmission unit (142) may pass through the corrugated pipe (146) or be located outside the corrugated pipe (146). The power transmission unit (142) may suppress horizontal fluctuation of the corrugated pipe (146) and guide the direction in which the corrugated pipe (146) expands or contracts.

[0061] The vacuum chamber (110) may include a first chamber member (111), a second chamber member (114), a vacuum pump (117), and an air path (118). When the first chamber member (111) and the second chamber member (114) are in close contact with each other, an internal space in which the first chuck (120) and the second chuck (130) are accommodated may be provided.

[0062] The first chamber member (111) can support the first chuck (120). The second chamber member (114) can move in a direction approaching the first chamber member (111) and in a direction away from the first chamber member (111) so that an internal space is formed.

[0063] For example, the second chamber member (114) may be fixedly supported on the horizontal plate member (104). When the horizontal plate member (104) is lowered, the second chamber member (114) is lowered and comes into close contact with the first chamber member (111), and a sealed internal space in which the first chuck (120) and the second chuck (130) are housed may be formed.

[0064] When the horizontal plate (104) is raised while the first chamber member (111) and the second chamber member (114) are in close contact, the second chamber member (114) can be separated from the first chamber member (111). When the horizontal plate (104) is raised and lowered, the second chuck (130) and the corrugated pipe (146) can also be raised and lowered together with the second chamber member (114).

[0065] For example, if the column portion (102) includes a screw formed with a male screw pattern, and the horizontal plate portion (104) includes a nut member formed with a female screw pattern that engages the male screw pattern, the horizontal plate portion (104) can be raised and lowered as the screw rotates by the power of the electric motor.

[0066] When the vacuum pump (117) operates while the first chamber member (111) and the second chamber member (114) are in close contact, air in the internal space is discharged to the outside of the first chamber member (111) and the second chamber member (114) through the air passage (118), and a negative pressure may be formed in the internal space. In other words, the air pressure in the internal space may become lower than the surrounding atmospheric pressure.

[0067] In this way, when the first substrate (10) and the second substrate (20) are bonded, a vacuum atmosphere is formed in the internal space, thereby preventing the first bonding surface (11) and the second bonding surface (21) from being contaminated by foreign substances, and the yield of the bonded substrate (30) can be improved.

[0068] Meanwhile, unlike those illustrated in FIGS. 3 to 7, a vacuum chamber of a substrate bonding device according to another embodiment of the present invention may be configured such that a chamber member supporting a second chuck (130) is stationary and a chamber member supporting a first chuck (120) is raised and lowered to form a sealed internal space.

[0069] The substrate alignment stage (138) changes the position and angle of the second chuck (130) so that the first substrate (10) supported on the first chuck (120) and the second substrate (20) supported on the second chuck (130) are aligned vertically with respect to each other. The substrate alignment stage (138) can finely adjust the position and angle of the second substrate (20) by moving the second substrate (20) in a horizontal direction perpendicular to the vertical axis in the up-and-down direction or by rotating the second substrate (20) about the vertical axis.

[0070] However, unlike those illustrated in FIGS. 3 to 7, the substrate alignment stage included in another embodiment of the present invention may align the first substrate (10) and the second substrate (20) by changing the position and angle of the first chuck (120) supporting the first substrate (10).

[0071] The camera unit (167) can capture the position and angle of the first substrate (10) supported on the first chuck (120) and the second substrate (20) supported on the second chuck (130). The camera unit (167) can include a plurality of cameras that move between the first chuck (120) and the second chuck (130) when the first chuck (120) and the second chuck (130) are spaced apart to capture the position and angle of the first substrate (10) and the second substrate (20), and return to the original position before at least one of the first chuck (120) and the second chuck (130) approaches the other chuck.

[0072] Based on the screen captured by multiple cameras, the control unit (not shown) of the substrate bonding device (100) determines whether the first substrate (10) and the second substrate (20) are accurately aligned, and if it is determined that they are not aligned, the control unit (not shown) of the substrate alignment stage (138) can be operated to reduce the alignment error.

[0073] The substrate transfer arm (170, 175) may include a first substrate transfer arm (170) and a second substrate transfer arm (175). The first substrate transfer arm (170) may transfer the first substrate (10) to a position overlapping the first chuck (120) so that the first substrate (10) is supported by the first chuck (120) from the outside of the first chuck (120), or may transfer the bonded substrate (30) from the first chuck (120) to the outside of the first chuck (120).

[0074] The second substrate transfer arm (175) supports the second back surface (23) of the second substrate (20) by contacting it and transfers the second substrate (20) to a position aligned with the suction unit (150), that is, to a position aligned above and below with the plurality of suction plates (152). In addition, when the suction unit (150) suction-supports the second back surface (23), the second substrate transfer arm (175) can be separated from the second substrate (20) and returned to the original position outside the second chuck (130).

[0075] The plurality of suction plates (152) can be raised and lowered to avoid the second substrate transfer arm (175). For example, the second substrate transfer arm (175) can include a plurality of extensions (176) that extend in a straight line parallel to each other. The second substrate transfer arm (175) can reciprocate along a straight path parallel to the longitudinal direction of the plurality of extensions (176) between a loading position where the second substrate (20) is sucked by the plurality of suction plates (152) and an original position outside the second chuck (130).

[0076] The plurality of suction plates (152) can be positioned to avoid the plurality of extensions (176) as illustrated in FIG. 2. Therefore, even if the plurality of suction plates (152) are raised and lowered while the second substrate transfer arm (175) is positioned at the loading position, the second substrate transfer arm (175) and the plurality of suction plates (152) may not collide.

[0077] The second substrate transfer arm (175) can support the second back surface (23) of the second substrate (20) by an adsorption method that forms a negative pressure on the lower surface of a plurality of extension parts (176) or by an electrostatic method that charges the second substrate (20).

[0078] The first substrate transfer arm (170) may also include a plurality of extensions (171) (see FIG. 7) that extend in a straight line and are parallel to each other, similar to the second substrate transfer arm (175). The first substrate (10) may be supported by being placed on the plurality of extensions (171) of the first substrate transfer arm (170). The first substrate transfer arm (170) may reciprocate along a straight path parallel to the longitudinal direction of the plurality of extensions (171) between a loading position where the first substrate (10) is supported on the first chuck (120) and an original position outside the first chuck (120).

[0079] When the first substrate (10) or the bonding substrate (30) is placed on the first chuck (120), the first chuck (120) may further include a plurality of lifting pins (not shown) that protrude from the upper surface and space the first back surface (13) and the upper surface of the first chuck (120) so that the plurality of extensions (171) of the first substrate transfer arm (170) can penetrate between the upper surface of the first chuck (120) and the first back surface (13) of the first substrate (10).

[0080] Hereinafter, a method of bonding substrates (10, 20) using a substrate bonding device (100) will be described with sequential reference to FIGS. 3 to 7. Referring to FIG. 3, first, a first substrate (10) is supported on the upper surface of a first chuck (120).

[0081] The process of the first substrate transfer arm (170) (see FIG. 7) supporting the first substrate (10) and moving from the original position to the loading position, the plurality of lifting pins (not shown) of the first chuck (120) rising to avoid the first substrate transfer arm (170) and supporting the first substrate (10), the first substrate transfer arm (170) returning to the original position, and the plurality of lifting pins lowering to be hidden inside the first chuck (120) can be sequentially performed.

[0082] Next, the second substrate transfer arm (175) contacts and supports the second back surface (23) of the second substrate (20) and moves from the original position to the loading position. An adhesive may be applied to the first bonding surface (11) before the first substrate (10) is transferred by the first substrate transfer arm (170). An adhesive may be applied to the second bonding surface (21) before the second substrate (20) is transferred by the second substrate transfer arm (175).

[0083] FIGS. 8 and 9 are drawings sequentially illustrating a process in which a substrate convexly bent downwards is supported by a second chuck in surface contact, and FIGS. 10 and 11 are drawings sequentially illustrating a process in which a substrate convexly bent upwards is supported by a second chuck in surface contact.

[0084] Referring to FIGS. 4 and 5, a plurality of suction plates (152) are lowered from a plurality of suction plate receiving portions (134) while avoiding a plurality of extension portions (176) of a second substrate transfer arm (175) to suction-support an outer periphery of a second substrate (20). Next, a plurality of suction plates (152) are raised to be received in a plurality of suction plate receiving portions (134), and a second back surface (23) of the second substrate (20) is brought into surface contact so that the second substrate (20) can be supported on the lower surface of the second chuck (130).

[0085] If, as illustrated in FIG. 8, the second substrate (20) is convexly bent downward, that is, if the second substrate (20) is formed to be convexly bent downward, as illustrated in FIG. 9, as the plurality of suction plates (152) rise and the second substrate (20) approaches the second chuck (130), the force pulling the second substrate (20) from the central portion of the lower surface of the second chuck (130) becomes stronger, so that the second substrate (20) spreads out flat and the entire area of ​​the second back surface (23) can come into surface contact with the lower surface of the second chuck (130). Therefore, the second substrate (20) can be reliably attached and supported to the second chuck (130).

[0086] If, as illustrated in FIG. 10, the second substrate (20) is convexly bent upward, that is, if the second substrate (20) is formed to be convexly bent upward, as illustrated in FIG. 11, when the plurality of suction plates (152) rise, the central portion of the second substrate (20) first comes into contact with the lower surface of the second chuck (130) and is pressed downward so that the second substrate (20) is flattened, and when the plurality of suction plates (152) rise so as to be received in the plurality of suction plate receiving portions (134), the entire area of ​​the second back surface (23) can be in surface contact with the lower surface of the second chuck (130). Therefore, the second substrate (20) can be reliably attached and supported to the second chuck (130).

[0087] In this way, according to the substrate bonding device (100) of the present invention, the second substrate (20) can be stably attached to the second chuck (130) regardless of the shape of the warpage of the second substrate (20). Therefore, defects in the substrate bonding operation can be suppressed, and the yield of good products of the bonded substrate (30) can be improved.

[0088] Next, as illustrated in FIG. 5, a plurality of cameras of the camera unit (167) move between the first chuck (120) and the second chuck (130) to capture images of the positions and angles of the first substrate (10) and the second substrate (20), and based on the captured images, the substrate alignment stage (138) changes the position and angle of the second chuck (130) so that the first substrate (10) and the second substrate (20) are aligned. When the first substrate and the second substrate (20) are aligned, the plurality of cameras of the camera unit (167) return to their original positions.

[0089] Referring to FIG. 6, the second chamber member (114) is lowered to be in close contact with the first chamber member (111), so that an internal space is formed between the first chamber member (111) and the second chamber member (114), and the vacuum pump (117) operates to create a vacuum state in which the internal space has a pressure lower than atmospheric pressure.

[0090] Next, the second chuck (130) may be lowered by the operation of the chuck drive unit (140), so that a close contact force may be formed between the first substrate (10) and the second substrate (20). At the same time, the corrugated pipe (146) may expand, so that the close contact force between the first substrate (10) and the second substrate (20) may be uniformly distributed over the entire area of ​​the first bonding surface (11) and the second bonding surface (21), and the close contact force between the first substrate (10) and the second substrate (20) may also be further increased. Accordingly, the bonding quality of the first substrate (10) and the second substrate (20) and the quality of the bonded substrate (30) may be improved.

[0091] Referring to Fig. 7, the second chamber member (114) rises relative to the first chamber member (111), and the second chuck (130) also rises away from the first chuck (120). The bonded substrate (30) in which the first substrate (10) and the second substrate (20) are bonded is placed on the upper surface of the first chuck (120). The first substrate transfer arm (170) moves to the loading position to place the bonded substrate (30) on the plurality of extensions (171) and returns to the original position, so that the bonded substrate (120) can be unloaded from the first chuck (120).

[0092] At this time, the plurality of lifting pins (not shown) of the first chuck (120) rise again to lift the bonded substrate (30) away from the upper surface of the first chuck (120), the plurality of extensions (171) of the first substrate transfer arm (170) avoid the plurality of lifting pins and penetrate between the upper surface and the first back surface (13) of the first chuck (120), and the plurality of lifting pins descend again so as to be hidden inside the first chuck (120), so that the bonded substrate (30) is supported by the plurality of extensions (171), and the first substrate transfer arm (170) returns to its original position. This process can be sequentially performed.

[0093] Since the substrate bonding device (100) of the present invention performs the bonding process of the first substrate (10) and the second substrate (10) without contacting the bonding surfaces (11, 21) of the first substrate (10) and the second substrate (20), the first substrate (10) and the second substrate (20) are not contaminated, and the transfer arms (170, 175) that transfer the first substrate (10) and the second substrate (20) are also not contaminated. Accordingly, the quality of the bonded substrate (30) can be improved, and productivity can also be increased.

[0094] FIG. 12 is a schematic diagram illustrating a portion of a substrate bonding device according to another embodiment of the present invention. Referring to FIGS. 1, 3, 5, 7, and 12, a substrate bonding device (200) according to another embodiment of the present invention may include a first chuck (120), a second chuck (230), a suction unit (250), a chuck driving unit (140), a bellows press (145), a vacuum chamber (110), a substrate alignment stage (138), a camera unit (167), and a substrate transfer arm (170, 175).

[0095] The first chuck (120), chuck drive unit (140), bellows press (145), vacuum chamber (110), substrate alignment stage (138), camera unit (167), and substrate transfer arm (170, 175) are the same as the components indicated by the same reference numerals included in the substrate bonding device (100) mentioned with reference to FIGS. 1 to 7, and therefore, redundant descriptions are omitted.

[0096] The second chuck (230) supports the second substrate (20) by contacting the second back surface (23) of the second substrate (20). The second chuck (230) may be placed on the upper side of the first chuck (120). The suction unit (250) suction-supports the outer periphery of the second back surface (23) of the second substrate (30) before the second back surface (23) of the second substrate (30) is supported by the second chuck (230). The suction unit (250) may include a plurality of suction plates (252), suction plate support poles (255), and suction plate lifting and lowering actuators (251).

[0097] A plurality of suction plates (252) may be spaced apart from each other along the outer periphery of the second substrate (20). When the shape of the lower surface of the second chuck (230) on which the second substrate (20) is supported is circular like the shape of the second substrate (20), the plurality of suction plates (252) may be spaced apart from each other along the outer periphery of the second chuck (230). The plurality of suction plates (252) may be spaced apart from each other at equal angular intervals with respect to the center (CX) of the lower surface of the second chuck (230).

[0098] The suction plate (252) may include an opening that is directed downward, that is, opens toward the first chuck (120) to draw in air so as to form a negative pressure, and may include an opening that is directed downward, that is, opens downward. Although not shown in the drawing, the suction unit (250) may further include a vacuum pump that forms a negative pressure in a plurality of suction plates (252), and an intake passage that connects the vacuum pump and the suction plates (252) so as to allow air flow.

[0099] The suction plate support pole (255) supports the suction plate (252) and can extend in a direction parallel to the thickness of the second chuck (230), that is, in the vertical direction. The suction plate (252) can be supported on the lower end of the suction plate support pole (255).

[0100] The suction plate lifting actuator (251) provides power to move the suction plate (252) parallel to the thickness direction of the second chuck (230). The suction plate lifting actuator (251) may be connected to the upper end of the suction plate support pole (255) so as to be capable of transmitting power. The suction plate lifting actuator (251) may include, for example, an electric motor or a hydraulic cylinder. The suction plate support pole (255) and the suction plate lifting actuator (251) may be provided in a number corresponding to each suction plate (252).

[0101] The substrate bonding device (200) may further include a frame (101) (see FIG. 1). The frame (101) may include a plurality of pillars (102) (see FIG. 1) extending upwardly from the outside of the first chuck (120) (see FIG. 1) and the second chuck (230), and a horizontal plate (104) supported by the plurality of pillars (102) and positioned above the first chuck (120) and the second chuck (230). A suction plate lifting actuator (251) may be supported on the horizontal plate (104). A suction plate support pole (255) may extend downward through the horizontal plate (104).

[0102] The second chuck (230) may include a plurality of suction plate receiving portions (234) in which a plurality of suction plates (252) are received. The suction plate receiving portions (234) may be through holes penetrating the second chuck (230) in the thickness direction. The suction plate support pole (255) may extend through the second chuck (230) to support the suction plates (252).

[0103] A plurality of suction plates (252) can come out of the plurality of suction plate receiving portions (234) and descend below the second chuck (230) to adsorb the outer periphery of the second substrate (20). When the plurality of suction plates (234) adsorb the outer periphery of the second substrate (20) and rise, the gap between the lower surface of the second chuck (230) and the second back surface (23) is narrowed.

[0104] When the second back surface (23) comes into contact with the lower surface of the second chuck (230), the second substrate (20) can be supported by the second chuck (230) in surface contact. At this time, the suction by the plurality of suction plates (252) is stopped, and the plurality of suction plates (252) can be stored in the plurality of suction plate storage portions (234). The height of the lower end of the suction plate (252) can be higher than the height of the lower end of the second chuck (230) so that the lower end of the suction plate (252) does not protrude downward from the lower surface of the second chuck (230).

[0105] While the present invention has been described with reference to the embodiments illustrated in the drawings, these are merely exemplary, and those skilled in the art will appreciate that various modifications and equivalent embodiments are possible. Therefore, the true scope of protection of the present invention should be defined solely by the appended claims.

Claims

1. A first chuck supporting a first substrate including a first bonding surface and a first back surface facing the first bonding surface by contacting the first back surface; A second chuck supporting a second substrate including a second bonding surface facing the first bonding surface and a second back surface facing away from the second bonding surface by contacting the second back surface; An adsorption unit that adsorbs and supports the outer periphery of the second back surface before the second back surface is supported by the second chuck; and A substrate bonding device characterized by comprising a chuck driving unit that moves at least one of the first chuck and the second chuck so that the first bonding surface and the second bonding surface are in close contact with each other.

2. In paragraph 1, The second chuck is placed on the upper side of the first chuck, The above substrate bonding device, A substrate bonding device further comprising a substrate transfer arm that contacts and supports the second back surface and transfers the second substrate to a position aligned with the suction unit, and when the suction unit suction-supports the second back surface, separates from the second substrate and returns to the original position.

3. In paragraph 2, The above adsorption unit is, A plurality of suction cups spaced apart from each other; A suction plate support pole supporting the suction plate and extending parallel to the thickness direction of the second chuck; and A substrate bonding device characterized by including a suction plate lifting actuator that provides power to move the suction plate parallel to the thickness direction of the second chuck.

4. In paragraph 3, A substrate bonding device characterized in that the suction plate is raised and lowered to avoid the substrate transfer arm.

5. In paragraph 3, The second chuck includes a plurality of suction plate receiving portions in which a plurality of the suction plates are received, A substrate bonding device characterized in that the distance from the center of the second chuck to the suction plate support pole is greater than the size of the radius of the second chuck.

6. In paragraph 3, The second chuck includes a plurality of suction plate receiving portions in which a plurality of the suction plates are received, A substrate bonding device characterized in that the above suction plate support pole extends through the second chuck.

7. In paragraph 1, A substrate bonding device further comprising a bellows press, which includes a corrugated pipe into which air is injected, and when the first substrate and the second substrate come into contact, the corrugated pipe expands to uniformly distribute the adhesive force between the first substrate and the second substrate over the entire area of ​​the first bonding surface and the second bonding surface.

8. In paragraph 7, A substrate bonding device characterized in that the above-mentioned corrugated pipe includes a metal material.

9. In paragraph 7, A substrate bonding device characterized in that the bellows press presses the second chuck toward the first chuck.

10. In paragraph 1, A substrate bonding device characterized by further comprising a vacuum chamber having an internal space for accommodating the first chuck and the second chuck, and in which a negative pressure is formed in the internal space when the first substrate and the second substrate are bonded.

11. In paragraph 10, The above vacuum chamber, A first chamber member supporting one of the first chuck and the second chuck; and A substrate bonding device characterized by comprising a second chamber member that moves in a direction approaching the first chamber member and in a direction away from the first chamber member so that the internal space is formed.

12. In paragraph 1, The first chuck includes a first chuck heater for heating the first substrate, A substrate bonding device, characterized in that the second chuck includes a second chuck heater for heating the second substrate.

13. In paragraph 1, A substrate bonding device further comprising a substrate alignment stage for changing the position and angle of at least one chuck among the first chuck and the second chuck so that the first substrate and the second substrate are aligned with respect to each other.

14. In paragraph 13, A substrate bonding device further comprising a camera unit for capturing the position and angle of the first substrate and the second substrate.

15. In paragraph 14, A substrate bonding device characterized in that the camera unit includes a camera that moves between the first chuck and the second chuck when the first chuck and the second chuck are spaced apart to capture the position and angle of the first substrate and the second substrate, and returns to the original position before at least one of the first chuck and the second chuck approaches the other chuck.

Images