Use of tetrafluoroethylene oligomer as refrigerant in semiconductor manufacturing process and energy storage

Abstract

The present invention specifically relates to a use of a tetrafluoroethylene oligomer as a refrigerant in a semiconductor manufacturing process and energy storage. The tetrafluoroethylene oligomer comprises a tetrafluoroethylene pentamer, a tetrafluoroethylene tetramer, and a tetrafluoroethylene hexamer. On the basis of 100 parts by weight of the tetrafluoroethylene oligomer, the content of the tetrafluoroethylene pentamer exceeds 85 parts by weight, and the weight ratio of the tetrafluoroethylene tetramer to the tetrafluoroethylene hexamer is less than 1. The tetrafluoroethylene oligomer refrigerant of the present invention has a suitable boiling point and fluidity, is safe and durable, has stable temperature control and high material compatibility and miscibility, and is particularly suitable for use as a refrigerant in the semiconductor manufacturing process and energy storage.

Description

Applications of tetrafluoroethylene oligomers as refrigerants in semiconductor manufacturing and energy storage Technical Field

[0001] This invention specifically relates to the application of a tetrafluoroethylene oligomer as a refrigerant in semiconductor manufacturing and energy storage. Background Technology

[0002] Semiconductor manufacturing refers to the process of processing semiconductor materials into electronic devices. Semiconductor materials are materials that fall between conductors and insulators, possessing excellent electronic conductivity and electronic isolation properties. Semiconductor manufacturing is one of the core technologies of the semiconductor industry, and its importance is self-evident.

[0003] Semiconductor manufacturing processes mainly include semiconductor wafer etching, semiconductor chip processing, and semiconductor component processing. Throughout the entire semiconductor manufacturing process, the temperature varies considerably, especially during the semiconductor wafer etching stage. The temperature of the semiconductor wafer is relatively high during the etching stage, requiring cooling. Different process units operate at different temperatures. While a refrigerant with an excessively high boiling point can provide sufficient cooling, it also causes environmental damage. Conversely, a refrigerant with an excessively low boiling point cannot provide adequate cooling.

[0004] CN113773176A proposes a fluorinated compound. On the one hand, the fluorinated compound increases its boiling range by compounding with fluorinated oxa-alkanes with a chain length of 12 (trioxadodecane with at least one hydrogen atom grafted with perfluorinated substituted alkane groups). On the other hand, the fluorinated compound lowers its freezing point by compounding with fluorinated alkanes with a chain length of 10 (trioxadecane with at least one hydrogen atom grafted with perfluorinated substituted alkane groups). This allows it to be used as a refrigerant in semiconductor manufacturing processes, ensuring that the refrigerant maintains good fluidity during cooling and improving the cooling efficiency of the refrigerant. However, its preparation process is cumbersome and not easy to promote.

[0005] With increasing energy demand and the widespread adoption of renewable energy, the energy storage industry is experiencing explosive growth against the backdrop of global carbon neutrality, making thermal management the core of energy storage systems. There are three main technical routes for cooling in energy storage thermal management: air cooling, liquid cooling, and phase change cooling. Currently, domestic energy storage systems primarily use forced air cooling, while liquid cooling is already being used abroad. The core difference between air cooling and liquid cooling lies in the heat transfer medium. Specifically, liquid media have the highest heat transfer efficiency, reaching 0.5–10, while air media generally has an efficiency of around a few tenths of a percent. In terms of heat transfer coefficient, air media is lower (25–100), while liquid media is higher (1000–15000). Air cooling involves simple cooling structures, is easy to install, and has lower costs, but its cooling effect is low, it cannot achieve precise temperature control, and it requires large-area heat dissipation channels. Liquid cooling uses coolant convection heat transfer, resulting in more efficient and uniform heat dissipation, and better reliability. In the future, with the demand for energy storage power stations with larger battery capacities and higher system power densities, such as new energy power stations and off-grid energy storage, the energy density and heat generation of energy storage systems will be greater, and the requirements for safety and lifespan will be higher, which will drive the industry to adopt more liquid cooling solutions.

[0006] Among them, submerged liquid-cooled energy storage systems achieve this by immersing the energy storage system in a special insulating coolant. Because the heat-generating energy storage elements are in direct contact with the refrigerant, the heat dissipation efficiency is higher and the noise is lower, making it one of the important technologies in the future energy storage field with very broad application prospects. However, although the refrigerants in current submerged liquid-cooling technology have good cooling effects, their material compatibility and incompatibility are poor. During long-term use, materials such as rubber in the energy storage system may swell, and may even be damaged.

[0007] Therefore, there is an urgent need in this field to develop a refrigerant with a boiling point and flowability suitable for semiconductor manufacturing and energy storage, which is safe and durable, has stable temperature control, and high material compatibility and compatibility during application. Summary of the Invention

[0008] To address the shortcomings of existing technologies, this invention provides an application of tetrafluoroethylene oligomers as refrigerants in semiconductor manufacturing and energy storage. These tetrafluoroethylene oligomer refrigerants have suitable boiling points and flowability, are safe and durable, have stable temperature control, and high material compatibility and compatibility, making them particularly suitable for use as refrigerants in semiconductor manufacturing and energy storage.

[0009] To achieve the above objectives, the present invention provides an application of tetrafluoroethylene oligomers as refrigerants in semiconductor manufacturing and energy storage. The tetrafluoroethylene oligomers include tetrafluoroethylene pentamers, tetrafluoroethylene tetramers, and tetrafluoroethylene hexamers. Based on 100 parts by weight of tetrafluoroethylene oligomers, the weight of tetrafluoroethylene pentamers is higher than 85, and the weight ratio of tetrafluoroethylene tetramers to tetrafluoroethylene hexamers is lower than 1.

[0010] The tetrafluoroethylene oligomer refrigerant of the present invention has suitable boiling point and flowability, is safe and durable, has stable temperature control, and high material compatibility and compatibility, making it particularly suitable for use as a refrigerant in semiconductor manufacturing and energy storage. Attached Figure Description

[0011] Figure 1 is a comparison of the temperature stability of Example 3 and Comparative Examples 1-4 at 40°C. Detailed Implementation

[0012] The endpoints and any values ​​of the ranges disclosed herein are not limited to the precise ranges or values, and these ranges or values ​​should be understood to include values ​​close to these ranges or values. For numerical ranges, the endpoint values ​​of the various ranges, the endpoint values ​​of the various ranges and individual point values, and individual point values ​​can be combined with each other to obtain one or more new numerical ranges, which should be considered as specifically disclosed herein.

[0013] The specific embodiments of the present invention will be described in detail below. However, it should be noted that the scope of protection of the present invention is not limited to these specific embodiments, but is determined by the claims in the appendix.

[0014] All publications, patent applications, patents, and other references mentioned in this specification are incorporated herein by reference. Unless otherwise defined, all technical and scientific terms used in this specification have the meanings commonly understood by those skilled in the art. In case of conflict, the definitions in this specification shall prevail.

[0015] When this specification uses the prefixes "known to those skilled in the art," "prior art," or similar terms to derive materials, substances, methods, steps, apparatus, or components, the objects derived from such prefixes cover those conventionally used in the art at the time the invention was proposed, but also include those that are not currently commonly used but will become generally recognized in the art as suitable for similar purposes.

[0016] It should be noted that the two or more aspects (or embodiments) disclosed in the context of this specification can be arbitrarily combined with each other, and the resulting technical solutions (such as methods or systems) are part of the original disclosure of this specification and also fall within the protection scope of this invention.

[0017] Unless otherwise specified, all percentages, parts, ratios, etc. mentioned in this specification are based on weight, unless being based on weight would not be in accordance with the common understanding of those skilled in the art.

[0018] This invention provides an application of tetrafluoroethylene oligomers as refrigerants in semiconductor manufacturing and energy storage. The tetrafluoroethylene oligomers include tetrafluoroethylene pentamers, tetrafluoroethylene tetramers, and tetrafluoroethylene hexamers. Based on 100 parts by weight of tetrafluoroethylene oligomers, the weight of tetrafluoroethylene pentamers is higher than 85, and the weight ratio of tetrafluoroethylene tetramers to tetrafluoroethylene hexamers is lower than 1.

[0019] Based on the specific requirements of refrigerants in semiconductor manufacturing and energy storage, this invention uses tetrafluoroethylene pentamer as the main component. Its high fluidity ensures that the fluidity is more in line with the semiconductor manufacturing process during application. In order to improve the applicable temperature range of the refrigerant, tetrafluoroethylene tetramer and tetrafluoroethylene hexamer are added. By controlling the weight ratio of tetrafluoroethylene tetramer to tetrafluoroethylene hexamer, the refrigerant has suitable boiling point, viscosity and fluidity in the applicable temperature range of -20°C to 80°C, making it particularly suitable for use as a refrigerant in semiconductor manufacturing and energy storage.

[0020] In some embodiments, the tetrafluoroethylene oligomer contains 0.5 or more parts by weight of tetrafluoroethylene tetramer. Preferably, in some embodiments, the tetrafluoroethylene oligomer contains 0.75 or more parts by weight of tetrafluoroethylene tetramer. Further, in some embodiments, the tetrafluoroethylene oligomer contains 1 to 6 parts by weight of tetrafluoroethylene tetramer. The tetrafluoroethylene tetramer has a low viscosity, and when its content is ensured, the viscosity and flowability of the entire oligomer are more suitable when used at lower temperatures.

[0021] In some embodiments, the tetrafluoroethylene oligomer contains 2 or more parts by weight of tetrafluoroethylene hexamer. Preferably, in some embodiments, the tetrafluoroethylene oligomer contains 3 or more parts by weight of tetrafluoroethylene hexamer.

[0022] In this invention, any tetrafluoroethylene oligomer that meets the aforementioned requirements can achieve the purpose of this invention. According to a preferred embodiment of this invention, the tetrafluoroethylene pentamer has a weight part of 90-97, more preferably 95-97.

[0023] In some embodiments, the tetrafluoroethylene oligomer comprises 87 to 97 parts of tetrafluoroethylene pentamer, 0.5 to 7.5 parts of tetrafluoroethylene tetramer, and 2 to 14.5 parts of tetrafluoroethylene hexamer, based on 100 parts by weight of tetrafluoroethylene oligomer.

[0024] In some embodiments, the tetrafluoroethylene oligomer comprises 87 to 97 parts of tetrafluoroethylene pentamer, 0.5 to 6 parts of tetrafluoroethylene tetramer, and 2.5 to 14 parts of tetrafluoroethylene hexamer, based on 100 parts by weight of tetrafluoroethylene oligomer.

[0025] In some embodiments, the tetrafluoroethylene oligomer comprises 87 to 97 parts of tetrafluoroethylene pentamer, 1 to 6 parts of tetrafluoroethylene tetramer, and 4 to 9 parts of tetrafluoroethylene hexamer, based on 100 parts by weight of tetrafluoroethylene oligomer.

[0026] According to a preferred embodiment of the present invention, the weight ratio of tetrafluoroethylene tetramer to tetrafluoroethylene hexamer is 0.05 to 0.9, and more preferably the weight ratio of tetrafluoroethylene tetramer to tetrafluoroethylene hexamer is 0.05 to 0.65; according to a preferred embodiment of the present invention, the weight ratio of tetrafluoroethylene tetramer to tetrafluoroethylene hexamer is 0.1 to 1 / 3.

[0027] According to a preferred embodiment of the present invention, the weight ratio of the tetrafluoroethylene tetramer to the tetrafluoroethylene hexamer is 0.1 to 0.3. The low weight ratio of the tetrafluoroethylene tetramer to the tetrafluoroethylene hexamer allows the oligomer to function well even at low temperatures (e.g., -20°C).

[0028] In this invention, the boiling point of the tetrafluoroethylene oligomer can be selected within a wide range. The following is an illustrative description, but it does not limit the scope of the invention. According to a preferred embodiment of the invention, the boiling point of the tetrafluoroethylene oligomer is 100–200°C, preferably 125–145°C. The boiling point in this invention refers to the temperature at which the compound undergoes initial distillation at 5% concentration.

[0029] In this invention, kinematic viscosity refers to the flow properties of the refrigerant used in heat dissipation equipment at different temperatures. This parameter affects the heat dissipation effect and the operating temperature of the equipment, and is of great significance for equipment heat dissipation and temperature control. The kinematic viscosity of the tetrafluoroethylene oligomer at 25°C has a wide selectable range. The following is an illustrative description, but it does not limit the scope of the invention. According to a preferred embodiment of the invention, the kinematic viscosity of the tetrafluoroethylene oligomer at 25°C is less than 2 mm. 2 More preferably, the kinematic viscosity of the tetrafluoroethylene oligomer at 25°C is less than 1.5 mm / s. 2 / s.

[0030] In this invention, there are no special requirements for the scope of the semiconductor manufacturing process. The following is an illustrative description, but it does not limit the scope of the invention. According to a preferred embodiment of the invention, the semiconductor manufacturing process includes semiconductor wafer etching, semiconductor chip processing, and semiconductor device processing.

[0031] In this invention, the conditions for the semiconductor process can be selected from a wide range. The following is an illustrative description, but it does not limit the scope of the invention. According to a preferred embodiment of the invention, the conditions for the semiconductor process include a temperature of -20°C to 80°C.

[0032] In this invention, there are no special requirements for the specific application of the tetrafluoroethylene oligomer as a refrigerant in semiconductor manufacturing processes. For example, in Application Example 1 of this invention, a dual-channel MPX-45FG simulation test equipment is used to simulate semiconductor manufacturing processes. The tetrafluoroethylene oligomer refrigerant is loaded into the chiller of the MPX-45FG simulation test equipment, and the temperature control effect of the tetrafluoroethylene oligomer refrigerant in the simulated semiconductor production process is tested using dual-loop PID control algorithm technology. The above is an illustrative description, but it does not limit the scope of this invention.

[0033] In this invention, the tetrafluoroethylene oligomer has a wide range of applications as a refrigerant in energy storage. All heat-generating energy storage components can directly contact the refrigerant for heat dissipation, such as chargers, electrolytic capacitors, inductors, energy storage batteries, and energy storage boxes. In application example 2 of this invention, the application of the refrigerant in energy storage is illustrated by using energy storage batteries and energy storage boxes as examples to illustrate the advantages of this invention, but this does not limit the scope of this invention.

[0034] The tetrafluoroethylene oligomer refrigerant of the present invention has suitable boiling point and flowability, is safe and durable, has stable temperature control, and high material compatibility and compatibility, making it particularly suitable for use as a refrigerant in semiconductor manufacturing and energy storage.

[0035] The present invention will be described in detail below through examples, test examples and application examples. The refrigerant is prepared by mixing the corresponding raw materials.

[0036] Example 1

[0037] A refrigerant comprising, by weight percentage:

[0038] Tetrafluoroethylene pentamer: 90 wt%;

[0039] Tetrafluoroethylene tetramer: 1 wt%;

[0040] Tetrafluoroethylene hexamer: 9 wt%.

[0041] Example 2

[0042] A refrigerant comprising, by weight percentage:

[0043] Tetrafluoroethylene pentamer: 92 wt%;

[0044] Tetrafluoroethylene tetramer: 2 wt%;

[0045] Tetrafluoroethylene hexamer: 6 wt%.

[0046] Example 3

[0047] A refrigerant comprising, by weight percentage:

[0048] Tetrafluoroethylene pentamer: 95 wt%;

[0049] Tetrafluoroethylene tetramer: 1 wt%;

[0050] Tetrafluoroethylene hexamer: 4 wt%.

[0051] Example 4

[0052] A refrigerant comprising, by weight percentage:

[0053] Tetrafluoroethylene pentamer: 87 wt%;

[0054] Tetrafluoroethylene tetramer: 6 wt%;

[0055] Tetrafluoroethylene hexamer: 7wt%.

[0056] Example 5

[0057] A refrigerant comprising, by weight percentage:

[0058] Tetrafluoroethylene pentamer: 90 wt%;

[0059] Tetrafluoroethylene tetramer: 2 wt%;

[0060] Tetrafluoroethylene hexamer: 8 wt%.

[0061] Example 6

[0062] A refrigerant comprising, by weight percentage:

[0063] Tetrafluoroethylene pentamer: 93 wt%;

[0064] Tetrafluoroethylene tetramer: 1.4 wt%;

[0065] Tetrafluoroethylene hexamer: 5.6 wt%.

[0066] Example 7

[0067] A refrigerant comprising, by weight percentage:

[0068] Tetrafluoroethylene pentamer: 97 wt%;

[0069] Tetrafluoroethylene tetramer: 0.5 wt%;

[0070] Tetrafluoroethylene hexamer: 2.5 wt%.

[0071] Example 8

[0072] A refrigerant comprising, by weight percentage:

[0073] Tetrafluoroethylene pentamer: 87 wt%;

[0074] Tetrafluoroethylene tetramer: 0.85 wt%;

[0075] Tetrafluoroethylene hexamer: 12.15 wt%.

[0076] Example 9

[0077] A refrigerant comprising, by weight percentage:

[0078] Tetrafluoroethylene pentamer: 87 wt%;

[0079] Tetrafluoroethylene tetramer: 3 wt%;

[0080] Tetrafluoroethylene hexamer: 10 wt%.

[0081] Example 10

[0082] A refrigerant comprising, by weight percentage:

[0083] Tetrafluoroethylene pentamer: 87 wt%;

[0084] Tetrafluoroethylene tetramer: 5 wt%;

[0085] Tetrafluoroethylene hexamer: 8 wt%.

[0086] Comparative Example 1

[0087] A refrigerant comprising, by weight percentage:

[0088] Tetrafluoroethylene pentamer: 60 wt%;

[0089] Tetrafluoroethylene tetramer: 15 wt%;

[0090] Tetrafluoroethylene hexamer: 13 wt%;

[0091] Tetrafluoroethylene heptameric: 12 wt%.

[0092] Comparative Example 2

[0093] A refrigerant comprising, by weight percentage:

[0094] Tetrafluoroethylene pentamer: 70 wt%;

[0095] Tetrafluoroethylene tetramer: 10 wt%;

[0096] Tetrafluoroethylene hexamer: 10 wt%;

[0097] Tetrafluoroethylene heptameric: 10 wt%.

[0098] Comparative Example 3

[0099] A refrigerant comprising, by weight percentage:

[0100] Tetrafluoroethylene pentamer: 87 wt%;

[0101] Tetrafluoroethylene tetramer: 0 wt%;

[0102] Tetrafluoroethylene hexamer: 13 wt%.

[0103] Comparative Example 4

[0104] A refrigerant comprising, by weight percentage:

[0105] Tetrafluoroethylene pentamer: 87 wt%;

[0106] Tetrafluoroethylene tetramer: 7 wt%;

[0107] Tetrafluoroethylene hexamer: 6 wt%.

[0108] The raw material composition formulations of the refrigerants in the examples and comparative examples are summarized in Table 1, and different refrigerants were prepared.

[0109] Table 1 Refrigerant formulations with different weight ratios of tetrafluoroethylene tetramer and tetrafluoroethylene hexamer

[0110] Test example:

[0111] The prepared refrigerant was subjected to the following performance tests, and the test results are shown in Table 2. Boiling point test: tested in accordance with GB / T 6536-2010.

[0112] Kinematic viscosity: The kinematic viscosity at 25℃ was tested according to the national standard. The kinematic viscosity at 25℃ was tested using a viscometer.

[0113] Saturated vapor pressure test method: NB / SH / T 0769-2019.

[0114] Table 2. Performance data of the refrigerants prepared in the examples and comparative examples.

[0115] In Table 2, the boiling point refers to the temperature at which 5% initial distillation occurs. It can be seen that the viscosity of the tetrafluoroethylene oligomer refrigerant of this invention is lower than that of the comparative example, especially at low temperatures. It possesses suitable boiling point and flowability, making it more suitable for applications in semiconductor manufacturing and energy storage. However, when the tetramer ratio is high, the boiling point decreases, resulting in high operating vapor pressure at high temperatures, which can easily cause cavitation. Conversely, when the hexamer ratio is high, the viscosity increases, leading to greater resistance at low temperatures, resulting in higher pump operating power and a decrease in application performance.

[0116] Application Example 1

[0117] A dual-channel MPX-45FG simulation test equipment was used to simulate semiconductor manufacturing processes. Different refrigerants from the above embodiments were loaded into the chillers of the MPX-45FG simulation test equipment. The temperature control effect of the refrigerants of different embodiments in the simulated semiconductor production process was tested using dual-loop PID control algorithm technology (the working temperature was set to 40℃, and after the equipment was started and ran stably for 30 minutes, the temperature change of the refrigerants of different embodiments was recorded within 4000s). The test results are shown in Table 3. The comparison of the temperature stability of Example 3 and Comparative Examples 1 to 4 at 40℃ is shown in Figure 1.

[0118] Table 3. Temperature control of the refrigerants prepared in the examples and comparative examples when used in simulated semiconductor processes.

[0119] As can be seen from Table 3 and Figure 1, when the tetrafluoroethylene oligomer proposed in this invention is used as a refrigerant in the simulated semiconductor process, the frequency of temperature fluctuations is less, the temperature fluctuation error is smaller, and the temperature control effect is better.

[0120] Application Example 2

[0121] Material compatibility testing of the energy storage box and the energy storage battery: The accelerated aging test method was adopted. The main materials involved in the energy storage box and the energy storage battery were immersed in containers containing the refrigerant of the above embodiment. The containers were then placed in an 80°C incubator and kept at a constant temperature for 1000 hours. Samples were taken every 200 hours to test the mass change rate of the sampled materials. The mass change rate = increase or decrease in mass / original mass * 100%. The evaluation was carried out according to the evaluation criteria in Table 4. The evaluation results are shown in Table 5.

[0122] Table 4 Compatibility Testing Standards

[0123] Table 5. Compatibility test results of refrigerant with energy storage tank and energy storage battery

[0124] As can be seen from Table 5, the tetrafluoroethylene oligomer used as a refrigerant in this invention has better material compatibility and compatibility with the main materials involved in energy storage boxes and energy storage batteries, and has high chemical stability. Long-term immersion in cooling contact will not cause swelling and corrosion to the equipment materials.

[0125] The preferred embodiments of the present invention have been described in detail above; however, the present invention is not limited thereto. Within the scope of the inventive concept, various simple modifications can be made to the technical solutions of the present invention, including combinations of various technical features in any other suitable manner. These simple modifications and combinations should also be considered as the content disclosed in the present invention and are all within the protection scope of the present invention.

Claims

1. The application of a tetrafluoroethylene oligomer as a refrigerant in semiconductor manufacturing and energy storage, characterized in that, The tetrafluoroethylene oligomers include tetrafluoroethylene pentamers, tetrafluoroethylene tetramers, and tetrafluoroethylene hexamers; Based on 100 parts by weight of tetrafluoroethylene oligomer, the weight of tetrafluoroethylene pentamer is higher than 85, and the weight ratio of tetrafluoroethylene tetramer to tetrafluoroethylene hexamer is lower than 1.

2. The application according to claim 1, characterized in that, The tetrafluoroethylene oligomer contains more than 0.5% tetrafluoroethylene tetramer by weight.

3. The application according to claim 1 or 2, characterized in that, The tetrafluoroethylene oligomer contains at least 0.75% tetrafluoroethylene tetramer by weight.

4. The application according to any one of claims 1 to 3, characterized in that, The tetrafluoroethylene oligomer contains 1 to 6 parts by weight of tetrafluoroethylene tetramer.

5. The application according to any one of claims 1 to 4, characterized in that, The tetrafluoroethylene oligomer contains more than 2 parts by weight of tetrafluoroethylene hexamer.

6. The application according to any one of claims 1 to 5, characterized in that, The tetrafluoroethylene oligomer contains more than 3 parts by weight of tetrafluoroethylene hexamer.

7. The application according to any one of claims 1 to 6, characterized in that, in, The weight percentage of tetrafluoroethylene pentamer is 90–97%.

8. The application according to any one of claims 1 to 7, wherein, The weight percentage of tetrafluoroethylene pentamer is 95–97%.

9. The application according to claim 1, characterized in that, Based on 100 parts by weight of tetrafluoroethylene oligomers, the tetrafluoroethylene oligomers include 87 to 97 parts of tetrafluoroethylene pentamers, 0.5 to 7.5 parts of tetrafluoroethylene tetramers, and 2 to 14.5 parts of tetrafluoroethylene hexamers.

10. The application according to claim 1, characterized in that, Based on 100 parts by weight of tetrafluoroethylene oligomers, the tetrafluoroethylene oligomers include 87 to 97 parts of tetrafluoroethylene pentamers, 0.5 to 6 parts of tetrafluoroethylene tetramers, and 2.5 to 14 parts of tetrafluoroethylene hexamers.

11. The application according to claim 1, characterized in that, Based on 100 parts by weight of tetrafluoroethylene oligomers, the tetrafluoroethylene oligomers include 87 to 97 parts of tetrafluoroethylene pentamers, 1 to 6 parts of tetrafluoroethylene tetramers, and 4 to 9 parts of tetrafluoroethylene hexamers.

12. The application according to any one of claims 1 to 11, wherein, The weight ratio of tetrafluoroethylene tetramer to tetrafluoroethylene hexamer is 0.1 to 1 / 3.

13. The application according to any one of claims 1 to 12, wherein, The weight ratio of tetrafluoroethylene tetramer to tetrafluoroethylene hexamer is 0.1 to 0.

3.

14. The application according to any one of claims 1 to 13, wherein, The boiling point of the tetrafluoroethylene oligomer is 100–200°C.

15. The application according to any one of claims 1 to 14, wherein, The boiling point of the tetrafluoroethylene oligomer is 125–145°C.

16. The application according to any one of claims 1 to 15, wherein, The kinematic viscosity of the tetrafluoroethylene oligomer at 25°C is less than 2 mm. 2 / s.

17. The application according to any one of claims 1 to 16, wherein, The kinematic viscosity of the tetrafluoroethylene oligomer at 25°C is less than 1.5 mm. 2 / s.

18. The application according to any one of claims 1 to 17, wherein, The semiconductor manufacturing process includes semiconductor wafer etching, semiconductor chip processing, and semiconductor component processing.

19. The application according to any one of claims 1 to 18, wherein, The conditions for the semiconductor manufacturing process include a temperature of -20°C to 80°C.

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