Coating apparatus, coating method, film layer and device

Abstract

Provided in the embodiments of the present invention are a coating apparatus, a coating method, a film layer and a device. The coating apparatus comprises: a coating cavity, which comprises a coating chamber for storing a substrate to be coated; a liquid feeding device, which is in communication with the coating chamber and is configured to convey into the coating chamber a first gaseous raw material obtained after a liquid raw material is vaporized; and a solid feeding device, which is in communication with the coating chamber and is configured to convey into the coating chamber a second gaseous raw material obtained after a solid raw material is sublimated and cracked. On the basis of the embodiments of the present invention, by means of the precise control of controllable feeding and a coating process, the quality of a film layer and the flexible control of the film thickness are improved.

Description

Coating equipment, coating methods, coating layers and devices

[0001] This application claims priority to Chinese Patent Application No. 202410943605.8, filed on July 12, 2024, entitled “Coating Equipment, Coating Method, Film Layer and Device”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This invention relates to the field of coating technology, and in particular to a coating equipment, coating method, coating layer, and device. Background Technology

[0003] Currently, coating equipment generally uses ordinary CVD technology, which is simple and can only deposit a single layer of film with limited function. Before entering the coating equipment, the product surface needs to undergo surface treatment to improve surface cleanliness and surface energy. The powder is fed into a powder box in the sublimation chamber in a single pass. Vaporization and pyrolysis temperatures are set to generate monomeric gases. During powder vaporization, the vaporization rate is uneven, progressing from slow to fast and back to slow. During the fast vaporization stage, a large amount of powder vaporizes and enters the pyrolysis tube, resulting in insufficient dimer pyrolysis, excessive reactive gases, and the substrate surface reaching its adsorption limit, leading to significant raw material waste. Furthermore, incomplete pyrolysis and non-uniform deposition also affect film quality, resulting in poor microstructure and reduced protective performance. Summary of the Invention

[0004] The embodiments of the present invention provide a coating equipment, a coating method, a coating layer, and a device, which improve the quality of the coating layer and allow for flexible control of the coating thickness through controllable feeding and precise control of the coating process.

[0005] According to one aspect of the present invention, a coating apparatus is provided. The coating apparatus includes:

[0006] A coating cavity, including a coating chamber for placing a substrate to be coated;

[0007] A liquid feeding device, connected to the coating chamber, is used to transport the first gaseous raw material, after vaporization of the liquid raw material, into the coating chamber; and

[0008] A solid feeding device, connected to the coating chamber, is used to transport the second gaseous raw material after the solid raw material has been sublimated and cracked into the coating chamber.

[0009] The solid feeding device includes:

[0010] A silo is used to hold the solid raw materials;

[0011] A sublimation chamber is used to heat and sublimate the solid raw material.

[0012] A rotary feeding mechanism is used to controllably transport the solid raw material in the hopper to the sublimation chamber; and

[0013] A pyrolysis furnace is used to pyrolyze the gas obtained after the solid raw material is sublimated into the second gaseous raw material, and to transport the second gaseous raw material to the coating chamber.

[0014] In some embodiments, the solid raw material is spherical phenelzine, sheet-like phenelzine, or granular phenelzine.

[0015] In some embodiments, the rotary feeding mechanism includes:

[0016] A turntable is set inside the hopper and can rotate around its own central axis. The turntable has a central protrusion and a plurality of turntable holes evenly arranged around the central protrusion. One turntable hole is used to accommodate a spherical or sheet-shaped solid raw material, or one turntable hole is used to accommodate a granular solid raw material of a specific volume.

[0017] A material feeding channel, located below the turntable, connects the hopper and the sublimation chamber; and

[0018] A stop block, located above the turntable, allows the solid raw material in the turntable hole to rotate to the feeding channel, and blocks the remaining solid raw material other than the solid raw material in the turntable hole from rotating to the feeding channel, so that the solid raw material in the turntable hole enters the sublimation chamber through the feeding channel.

[0019] In some embodiments, the turntable feeding mechanism further includes an indexing device for controlling the rotation angle of the turntable.

[0020] In some embodiments, the rotary feeding mechanism further includes a photoelectric detection device for detecting the feeding status of the solid raw material.

[0021] In some embodiments, the turntable has a waiting position and a discharging position, and the photoelectric detection device includes:

[0022] A first photoelectric switch sensor is used to detect whether the solid raw material exists at the material waiting position of the turntable; and

[0023] The second photoelectric switch sensor is used to detect whether the solid raw material exists at the feed position of the turntable.

[0024] In some embodiments, the photoelectric detection device further includes a third photoelectric switch sensor for detecting whether the solid raw material exists at the center of the central protrusion of the turntable.

[0025] In some embodiments, the photoelectric detection device further includes an alarm, which emits an alarm signal when the third photoelectric switch sensor detects that the solid raw material is not present at the center of the central protrusion of the turntable.

[0026] In some embodiments, the coating equipment further includes a gas feeding device connected to the coating chamber for conveying a third gaseous raw material into the coating chamber.

[0027] In some embodiments, the sublimation chamber includes:

[0028] A sublimation chamber, wherein a quick-change receiving tray is provided inside the sublimation chamber for receiving the solid raw material; and

[0029] The outlet is connected to the sublimation chamber and is used to discharge the gas produced by the sublimation of the solid raw material into the pyrolysis furnace.

[0030] In some embodiments, the sublimation chamber further includes a flip-top end cap for sealing the sublimation chamber, the slope of the flip-top end cap being less than 90°.

[0031] In some embodiments, the sublimation chamber further includes a control valve assembly for controlling the delivery of the solid raw material into the sublimation chamber.

[0032] In some embodiments, the control valve assembly includes at least two control valves, which are spaced apart from each other and are used to control the opening and closing of the feeding channel, respectively.

[0033] In some embodiments, each control valve includes a valve core and a heating element for adjusting the temperature of the valve core.

[0034] In some embodiments, the pyrolysis furnace includes:

[0035] Cracking furnace piping; and

[0036] Multiple fins are located inside the pyrolysis furnace pipe.

[0037] In some embodiments, each fin has multiple grooves.

[0038] In some embodiments, the coating chamber is provided with a rotating bracket or a fixed bracket for placing the substrate.

[0039] In some embodiments, the coating chamber is provided with a flow equalization component for equalizing the flow of the second gaseous raw material.

[0040] In some embodiments, the flow equalization component includes:

[0041] A primary flow equalizer is used to diffuse the second gaseous feedstock in all directions; and

[0042] The secondary flow equalizer is located downstream of the primary flow equalizer along the airflow direction of the second gas raw material, and the secondary flow equalizer is provided with a plurality of first vent holes.

[0043] In some embodiments, the flow equalization assembly further includes a third-stage flow equalization plate located downstream of the second-stage flow equalization plate along the airflow direction of the second gas feedstock.

[0044] In some embodiments, the three-stage flow equalizer is provided with a plurality of second vent holes.

[0045] In some embodiments, the three-stage flow equalizer comprises multiple layers of staggered slotted plates.

[0046] In some embodiments, the three-stage flow equalizer includes multiple convection structures.

[0047] In some embodiments, the coating apparatus further includes a vacuum system for evacuating the coating chamber.

[0048] In some embodiments, the vacuum system includes an air extraction line equipped with a pump assembly for extracting air from the coating chamber.

[0049] In some embodiments, the extraction pipeline includes a coarse extraction pipeline and a fine extraction pipeline. The coarse extraction pipeline is connected to the coating chamber, and the fine extraction pipeline is connected to the coating chamber through a cold trap.

[0050] In some embodiments, the vacuum system further includes a valve with an adjustable opening for adjusting the pumping speed of the pumping line to control the stability of the vacuum pressure inside the coating chamber.

[0051] In some embodiments, the vacuum system further includes a first vacuum pressure sensor for detecting pressure in the evacuation line, and the sublimation chamber includes a second vacuum pressure sensor for detecting pressure within the sublimation chamber.

[0052] In some embodiments, the coating equipment further includes an exhaust gas treatment device, which is connected to the extraction pipeline and is used to treat and discharge the gas extracted through the extraction pipeline.

[0053] In some embodiments, the coating equipment further includes a plasma discharge device, which may be an external plasma discharge mechanism or an internal plasma discharge mechanism.

[0054] According to another aspect of the present invention, a coating method is provided, the coating method employing the coating apparatus according to any of the preceding embodiments, the coating method comprising:

[0055] The substrate is placed inside the coating chamber of the coating equipment;

[0056] The temperature inside the evaporation chamber, sublimation chamber, pyrolysis chamber, and / or coating chamber is heated to the process set temperature.

[0057] Evacuate the evaporation chamber, sublimation chamber, pyrolysis chamber and / or coating chamber to 5mTorr-100mTorr;

[0058] The pressure inside the coating chamber is stabilized to the process pressure by controlling the air extraction rate.

[0059] The liquid raw material is vaporized and then transported into the coating chamber via a liquid feeding device to form a first gaseous raw material, and / or the solid raw material is sublimated and then cracked and then transported into the coating chamber via a solid feeding device to form a second gaseous raw material, and / or the gaseous raw material is transported into the coating chamber via a gas feeding device to form a third gaseous raw material.

[0060] In this process, the first gaseous material, the second gaseous material, and / or the third gaseous material undergo chemical reaction individually or together in the coating chamber to deposit a film layer on the surface of the substrate.

[0061] In some embodiments, the coating method further includes:

[0062] The thickness of the film layer on the substrate is monitored by a real-time film thickness monitoring system. When the thickness of the film layer reaches a predetermined thickness, the liquid feeding device, the solid feeding device, and / or the gas feeding device are shut down.

[0063] In some embodiments, the volume of the coating chamber is 50L-2000L.

[0064] In some embodiments, the temperature in the evaporation chamber is 60℃-200℃, the temperature in the sublimation chamber is 80℃-250℃, the temperature in the pyrolysis chamber is 500℃-750℃, and the temperature in the coating chamber is 20℃-80℃.

[0065] In some embodiments, the process pressure within the coating chamber is 1 mTorr-500 mTorr.

[0066] In some embodiments, the solid raw material is spherical phenelzine, sheet-like phenelzine, or granular phenelzine.

[0067] In some embodiments, the spherical, sheet-like, or granular phenelzine is made from at least one of phenelzine N powder, C powder, D powder, F powder, and HT powder.

[0068] In some embodiments, the liquid feedstock includes at least one of the following: an organic compound having at least two unsaturated bonds, an epoxy organic compound, an unsaturated organic compound containing an aromatic ring, a perfluoropolyether and its derivatives, a fluorocarbon compound, an unsaturated organic compound with a long alkyl chain, an optionally substituted linear, branched or cyclic organosilicon compound, a perfluorinated compound mainly composed of -CF3, and a perfluoroolefin.

[0069] According to another aspect of the present invention, a film layer is provided. The film layer is prepared using a coating method according to any embodiment of the present invention.

[0070] According to another aspect of the invention, a device is provided. At least a portion of the surface of the device includes a film layer as described in any embodiment of the invention.

[0071] In some embodiments, the device is an electronic or electrical component, an optical instrument, etc. Specifically, an electrical component may be a printed circuit board (PCB), an electronic product, or a semi-finished electronic assembly. When the device is an electronic product, it includes, but is not limited to, mobile phones, tablets, keyboards, e-readers, wearable devices, displays, headphones, etc. The device may also be any suitable electrical component of an electrical component, specifically, the electrical component may be a resistor, capacitor, transistor, diode, amplifier, relay, transformer, battery, fuse, integrated circuit, switch, LED, LED display, piezoelectric element, optoelectronic component, antenna, or oscillator, etc.

[0072] In other embodiments, the device is made of various plastics, fabrics, glass, metals, etc. Specifically, the metal product may be made of iron, magnesium, aluminum, copper, or their alloys, and the glass product may be a mobile phone lens cover, ski goggles, bathroom glass, eyeglasses, swimming goggles, camera lens, automotive glass, infrared microscope, surgical endoscope, solar panel, etc.

[0073] According to embodiments of the present invention, the feeding system of the coating equipment can simultaneously realize gas feeding, liquid feeding, and solid feeding. This multi-functional feeding method provides conditions for the coating equipment to deposit different film layers. By combining different types and methods of raw materials, the coating equipment can deposit multi-functional composite film layers sequentially or simultaneously, integrating ordinary CVD, PECVD, and ICVD technologies. This solves the problem that existing coating equipment can only achieve single CVD deposition technology, that is, it can only introduce a single type of raw material and can only deposit one type of film layer at a time, requiring multiple start-ups and shutdowns and feeding cycles to complete the composite film layer, resulting in poor film quality and long coating cycles. Attached Figure Description

[0074] Other features and advantages of the invention will be better understood through the following detailed description of alternative embodiments in conjunction with the accompanying drawings, in which the same reference numerals denote the same or similar parts, wherein:

[0075] Figure 1 shows a schematic diagram of a coating apparatus according to an embodiment of the present invention;

[0076] Figure 2 shows a schematic diagram of the solid feeding device of the coating equipment in Figure 1;

[0077] Figure 3 shows a schematic diagram of the rotary feeding mechanism of the solid feeding device in Figure 2;

[0078] Figure 4 shows a cross-sectional schematic diagram of the rotary feeding mechanism of the solid feeding device in Figure 2;

[0079] Figure 5 shows a schematic diagram of the photoelectric detection device of the solid feeding device in Figure 2;

[0080] Figure 6 shows a schematic diagram of the pyrolysis furnace in the coating equipment shown in Figure 1;

[0081] Figure 7 shows a cross-sectional schematic diagram of the pyrolysis furnace of the coating equipment in Figure 1;

[0082] Figure 8A shows a schematic diagram of the coating chamber of the coating equipment in Figure 1;

[0083] Figure 8B shows a schematic diagram of another coating chamber in the coating equipment shown in Figure 1;

[0084] Figure 9 shows a schematic diagram of the flow uniform component of the coating equipment in Figure 1;

[0085] Figure 10 shows a schematic diagram of the external plasma discharge mechanism of the coating equipment in Figure 1;

[0086] Figure 11 shows a schematic diagram of the built-in plasma discharge mechanism of the coating equipment in Figure 1. Detailed Implementation

[0087] The implementation and use of the embodiments are discussed in detail below. However, it should be understood that the specific embodiments discussed are merely illustrative of particular ways of implementing and using the invention, and are not intended to limit the scope of the invention. The descriptions of the structural positions of the various components, such as upper, lower, top, bottom, etc., are not absolute but relative. These directional descriptions are appropriate when the various components are arranged as shown in the figures, but they change accordingly when the positions of the components in the figures change.

[0088] As shown in Figure 1, the coating equipment 100 includes a coating chamber 10, a gas feeding device 20 (see Figure 7), a liquid feeding device 30, and a solid feeding device 40. The coating chamber 10 includes a coating cavity 11 for placing the substrate to be coated. The liquid feeding device 30 is connected to the coating cavity 11 and is used to deliver a first gaseous material, obtained by vaporizing the liquid raw material, into the coating cavity 11. The solid feeding device 40 is connected to the coating cavity 11 and is used to deliver a second gaseous material, obtained by sublimation and cracking of the solid raw material, into the coating cavity 11. The gas feeding device 20 is connected to the coating cavity 11 and is used to deliver a third gaseous material into the coating cavity 11. In some embodiments, the coating equipment 100 may exclude the gas feeding device 20 and include only the liquid feeding device 30 and the solid feeding device 40.

[0089] As shown in Figures 2 to 4, the solid feeding device 40 includes: a hopper 41, a sublimation chamber 42, a rotary feeding mechanism 43, and a pyrolysis furnace 44. The hopper 41 is used to hold multiple solid raw materials, such as spherical, sheet-like, or granular phenelzine pellets, hereinafter referred to as pellets. The hopper 41 can hold thousands of pellets. The top of the hopper 41 is equipped with an end cap (not shown), and a sealing ring is provided between the end cap and the hopper 41 to achieve a seal. The end cap can be opened via a flip-top mechanism, which consists of a shaft, a spring, and a plane bearing. When the hopper 41 is under normal pressure, removing the handle on the hopper 41 allows the spring in the flip-top mechanism to overcome the weight of the end cap, causing it to spring upwards. The end cap can then easily rotate horizontally around the shaft, thereby opening the hopper 41. The end cap of the hopper 41 is equipped with multiple glass windows for detecting the remaining material and the feeding status of the pellets within the hopper.

[0090] The rotary feeding mechanism 43 is located inside the hopper 41 and is used to transport the solid raw materials in the hopper 41 to the sublimation chamber 42. The sublimation chamber 42 is used to heat and sublimate the solid raw materials. The pyrolysis furnace 44 is used to pyrolyze the gas produced by the sublimation of the solid raw materials into a second gaseous raw material, and to transport the second gaseous raw material to the coating chamber 11.

[0091] The rotary feeding mechanism 43 controllably conveys solid raw materials into the sublimation chamber 42 at a set feeding rate. Specifically, the rotary feeding mechanism 43 includes a rotary table 431, a feeding channel 432, and a stop block 433. The rotary table 431 is located inside the hopper 41 and can rotate around its central axis. The rotary table 431 has a central protrusion 4311 and a plurality of rotary table holes 4312 evenly arranged around the central protrusion 4311. The size of the rotary table holes 4312 corresponds to the size of the solid raw material or pellet, and one rotary table hole 4312 is used to accommodate one solid raw material or pellet. A magnetic fluid sealing transmission device 434 is provided below the rotary table 431. A servo motor outside the hopper drives the magnetic fluid sealing transmission device 434 to rotate via a pulley, thereby driving the rotary table 431 to rotate. The feeding channel 432 is located below the rotary table 431 and connects the hopper 41 and the sublimation chamber 42. There can be one, two or more stop blocks 433, located above the turntable 431. They allow solid raw materials or pellets in the turntable hole 4312 to rotate to the discharge channel 432, and prevent the remaining solid raw materials other than those in the turntable hole 4312 from rotating to the discharge channel 432. The solid raw materials or pellets in the discharge channel 432 continue to enter the sublimation chamber 42.

[0092] According to embodiments of the present invention, the feeding system of the coating equipment can simultaneously realize gas feeding, liquid feeding, and solid feeding. This multi-functional feeding method provides conditions for the coating equipment to deposit different film layers. By combining different types and methods of raw materials, the coating equipment can deposit multi-functional composite film layers sequentially or simultaneously, integrating ordinary CVD, PECVD, and ICVD technologies. This solves the problem that existing coating equipment can only achieve single CVD deposition technology, that is, it can only introduce a single type of raw material and can only deposit one type of film layer at a time, requiring multiple start-ups and shutdowns and feeding cycles to complete the composite film layer, resulting in poor film quality and long coating cycles.

[0093] In some embodiments, the turntable feeding mechanism 43 further includes an indexing device for controlling the rotation angle of the turntable 431. For example, when there are six turntable holes 4312, the angle between two adjacent turntable holes 4312 is 60°. The indexing device can control the turntable 431 to rotate 60° each time, so that the solid raw materials or pellets in the turntable holes 4312 can fall into the feeding channel 432 and then be transported to the sublimation chamber 42. The indexing device can be a photoelectric indexing mechanism, thereby improving the accuracy of the turntable 431 rotation and solving the errors caused by synchronous wheel slippage and servo motor rotation.

[0094] As shown in Figure 5, in some embodiments, the turntable feeding mechanism 43 further includes a photoelectric detection device 435 for detecting the feeding status of solid raw materials.

[0095] In some embodiments, the turntable 431 has a waiting position and a discharging position, which correspond to two adjacent turntable holes 4312 of the turntable 431, respectively. The photoelectric detection device 435 includes a first photoelectric switch sensor 4351 and a second photoelectric switch sensor 4352. The first photoelectric switch sensor 4351 is used to detect whether there is solid raw material at the waiting position of the turntable 431, and the second photoelectric switch sensor 4352 is used to detect whether there is solid raw material at the discharging position of the turntable 431. The stop block 433 has a first channel 4331 corresponding to the waiting position and a second channel 4332 corresponding to the discharging position. The first photoelectric switch sensor 4351 is installed in the first channel 4331, and the second photoelectric switch sensor 4352 is installed in the second channel 4332.

[0096] When the first photoelectric switch sensor 4351 at the waiting position detects the presence of pellets, but the second photoelectric switch sensor 4352 at the unloading position does not detect pellets, this is recorded as one instance of pellets being present. When both the first photoelectric switch sensor 4351 and the second photoelectric switch sensor 4352 at the unloading position detect pellets, this is recorded as one instance of pellet jamming. When neither the first photoelectric switch sensor 4351 nor the second photoelectric switch sensor 4352 at the unloading position detects pellets, this is recorded as one instance of empty feed. Upon detecting pellets, the control valve actuates, allowing the pellets to enter the sublimation chamber 42, and the system feed count increases by one. Upon detecting jamming or empty feed, the control valve remains inactive, the system feed count does not increase, and the feed tray 431 continues to rotate for the next feed cycle.

[0097] In some embodiments, the photoelectric detection device 435 further includes a third photoelectric switch sensor 4353, which is disposed above the center of the central protrusion 4311 and is used to detect whether there is solid raw material or pellet at the center of the central protrusion 4311 of the turntable 431.

[0098] In some embodiments, the photoelectric detection device 435 further includes an alarm (not shown) that when the third photoelectric switch sensor 4353 detects that there is no solid raw material or pellet at the center of the central protrusion 4311 of the turntable 431, the alarm will issue an alarm signal.

[0099] Specifically, when a certain amount of solid raw materials or pellets remain, the screw in the center of the turntable 431 will protrude, triggering the pellet balance alarm line and alerting the hopper to a shortage of materials.

[0100] In some embodiments, a groove (not shown) is also provided below the turntable 431. The groove can solve the problem of broken material caused by half a pellet in the turntable 431. During normal operation, the hopper 41 is full of pellets. The pellets enter the turntable hole 4312 on the outer ring of the turntable 431 and rotate with the turntable 431. When it rotates to the waiting position, the stop block 433 blocks the remaining pellets on the turntable 431. Only the pellets in the turntable hole 4312 can enter the waiting position. Then it continues to rotate to the unloading position for unloading. When incomplete or broken pellets enter the turntable hole 4312, if the incomplete pellets are small, the turntable 431 will rotate and the pellets will fall into the groove below the turntable 431. The next pellet will continue to enter the turntable hole 431, and the pellets in the groove will be rotated synchronously by the groove without affecting the rotation of other pellets. When passing the discharge position, the pellets in the turntable hole 431 will be discharged. If the incomplete pellets are large, the pellets will rotate with the turntable 431, and there will be a complete pellet above the pellets. When they reach the stop block 433, the complete pellets will be pushed out of the turntable hole 431, and only the pellets in the turntable hole 431 will be discharged.

[0101] In some embodiments, the sublimation chamber 42 includes a sublimation cavity 421 and an outlet 422. The sublimation cavity 421 is equipped with a quick-change receiving tray 423 for receiving solid raw materials. The outlet 422 communicates with the sublimation cavity 421 and is used to discharge the gas produced after sublimation of the solid raw materials into the cracking furnace 44. The sublimation cavity 421 is heated by cavity wall heating. The pellets are fed into the quick-change receiving tray 423, which can be quickly replaced according to process requirements, facilitating equipment maintenance and promoting the cleanliness of the sublimation cavity 421.

[0102] In some embodiments, the sublimation chamber 42 further includes a flip-top end cap 424 for sealing the sublimation cavity 421. The slope of the flip-top end cap 424 is less than 90°, and the sublimation cavity 421 is sealed by the weight of the flip-top end cap 424 itself and the negative pressure inside the sublimation cavity 421.

[0103] In some embodiments, the sublimation chamber 42 further includes a control valve assembly 425 for controlling the delivery of solid raw materials into the sublimation cavity 421. The control valve assembly 425 includes a first control valve and a second control valve. The first control valve and the second control valve are spaced apart from each other and are used to control the opening and closing of the feed channel 432, respectively.

[0104] The first control valve and the second control valve can be a slide gate valve, a ball valve, a plug valve, etc., as long as they can open and close the material feeding channel 432. The embodiments of the present invention do not limit this.

[0105] The first and second control valves are normally closed. When the pellets are fed, the first control valve opens, and the pellets are fed through the feeding channel 432 into the space between the first and second control valves. Then, the first control valve closes, the second control valve opens, and the pellets are fed into the sublimation chamber 421, at which point the second control valve closes. By using the normally closed first and second control valves to isolate the hopper 41 and the sublimation chamber 421, the pressure in the hopper 41 is stabilized, and dust deposition in other areas is prevented, thus extending the lifespan of the first and second control valves.

[0106] In some embodiments, each control valve includes a valve core and a heating element. The valve core is capable of moving or rotating back and forth to open and close the feed channel 432, and the heating element is used to regulate the temperature of the valve core. Temperature control of the valve core position can be achieved through the heating element, preventing dust accumulation and jamming of the valve core.

[0107] As shown in Figures 6 and 7, the pyrolysis furnace 44 includes a pyrolysis furnace pipe 441 and multiple fins 442. The multiple fins 442 are located inside the pyrolysis furnace pipe 441, and each fin 442 has multiple grooves (not shown) to compensate for thermal deformation. The pyrolysis furnace pipe 441 and the multiple fins 442 can be made of stainless steel materials such as 310S stainless steel and 316 stainless steel. The multiple fins 442 increase the contact area between the pyrolysis furnace 44 and the monomer gas molecules, thereby improving the pyrolysis efficiency. Other structures of the pyrolysis furnace 44 are known to those skilled in the art, and therefore will not be described in detail here.

[0108] According to an embodiment of the present invention, the upper part of the solid feeding device 40 is a hopper 41, which is filled with pellets of uniform size. When the turntable 431 rotates to a specific position, the pellets in the hopper 41 are fed out. The pellets enter the sublimation chamber 42 through the control valve assembly 425 and vaporize into gas. Then, they are decomposed into monomer gas in the pyrolysis chamber 44 and then enter the coating chamber 11. The solid feeding device 40 can control the feeding rate by controlling the time interval of the turntable 431 rotating to feed, and control the vaporization and pyrolysis rates by controlling the temperatures of the sublimation chamber 42 and the pyrolysis chamber 44. This makes the density and rate of the monomer gas entering the coating chamber 11 controllable, which greatly accelerates the coating rate, improves the protective quality of the film, and improves the powder utilization rate in the coating process. It solves the problems of one-time feeding, uncontrollable coating process, limited deposition rate, low powder utilization rate, and poor protective effect in the prior art.

[0109] As shown in Figures 8A and 8B, a rotating support 111 for placing the substrate is provided inside the coating chamber 11. A motor 112 at the bottom of the coating chamber 10 drives a magnetic fluid sealing transmission device to rotate. The magnetic fluid sealing transmission device drives the rotating support 111 to rotate via a transmission mechanism. The rotating support 111 can be a circular frame, and can have various structures, including a fan-shaped frame or a large flat frame. The fan-shaped frame allows for adjustable interlayer spacing via a support plate, while the large flat frame allows for adjustable interlayer spacing via spacers. Rotating the substrate 80 via the rotating support 111 improves the uniformity of the film layer.

[0110] In other embodiments, the coating chamber 11 is provided with a fixing bracket for placing the substrate. The fixing bracket can achieve greater production efficiency while ensuring better uniformity of the film layer.

[0111] In some embodiments, the coating chamber 11 is provided with a flow equalization component 12 for equalizing the flow of the second gaseous raw material.

[0112] As shown in Figure 9, the flow equalization assembly 12 includes a primary flow equalization plate 121 and a secondary flow equalization plate 122. The primary flow equalization plate 121 is used to diffuse the second gaseous raw material in all directions, and the secondary flow equalization plate 122 is located downstream of the primary flow equalization plate 121 along the airflow direction of the second gaseous raw material. The secondary flow equalization plate 122 is provided with a plurality of first vent holes 1221.

[0113] In some embodiments, the flow equalization assembly 12 further includes a third-stage flow equalization plate 123. The third-stage flow equalization plate 123 is located downstream of the second-stage flow equalization plate 122 along the flow direction of the second gas feedstock.

[0114] In some embodiments, the three-stage flow equalizer 123 is provided with a plurality of second vent holes.

[0115] In some embodiments, the three-stage flow equalizer 123 includes multiple layers of staggered slotted plates.

[0116] In some embodiments, the three-stage flow equalizer 123 includes a plurality of convection structures 1231. The convection structure 1231 includes two convection plates 12311, which are arranged opposite each other to form a V-shaped structure, with the top of the V-shaped structure facing the airflow direction of the second gaseous feedstock.

[0117] The monomer gas after pyrolysis in the pyrolysis furnace enters the coating chamber 11 through the air inlet 113 of the coating chamber 10. After passing through the first-stage flow equalizer 121, it forms a trend of diffusion from the center outward along the first-stage flow equalizer 121 to the entire plane. After passing through the second-stage flow equalizer 122 and the third-stage flow equalizer 123, the diffusion becomes more uniform.

[0118] In the embodiment shown in Figure 8A, the second gas feedstock adopts an upper and lower inlet method. The inlet 113 is located at the top and is connected to the solid feed device 40, while the outlet 114 is located at the bottom and is connected to the extraction pipe 51. The first-stage flow equalizer 121 is a disk that converts the vertically flowing airflow into a horizontally flowing airflow and allows it to diffuse rapidly in the horizontal direction. The second-stage flow equalizer 122 has multiple first vent holes 1221, which increases the uniformity of the airflow. The third-stage flow equalizer 123 can further increase the uniformity and at the same time reduce the airflow velocity by increasing the airflow path.

[0119] In the embodiment shown in Figure 8B, the second gas feedstock adopts a side-inlet / side-outlet gas intake method. The gas inlet 113 is located on one side and is connected to the solid feed device 40, while the gas outlet 114 is located on the other side and is connected to the gas extraction pipeline 51. The side-inlet / side-outlet gas intake method makes it easier to control the uniformity of the airflow, eliminating the need for temperature regulation within the cavity. It also prevents large particles from settling downwards under the combined effects of gravity and extraction force, thus avoiding impact on membrane quality. Furthermore, the uniformity of the membrane layer in the side-inlet / side-outlet gas intake method can be achieved through the rotation of the support, while vertical uniformity is mainly achieved by the gas distribution component, ensuring even distribution of the intake air in the vertical direction.

[0120] In some embodiments, the coating chamber 11 is further provided with a flow equalization component for equalizing the flow of a first gaseous feedstock and / or a flow equalization component for equalizing the flow of a third gaseous feedstock. The flow equalization component may include a single-unit flow equalization plate, which may be a short baffle or a long, perforated baffle covering multiple single-unit gas inlets. The single-unit gas enters the chamber and is uniformly dispersed by the single-unit flow equalization plate, thereby improving the uniformity of the film layers between the upper and lower layers.

[0121] In some embodiments, the cavity wall of the coating chamber 10 is provided with a temperature control device, which can realize multi-regional temperature regulation of the cavity wall. By adjusting the temperature of the cavity wall of the coating chamber 10, the deposition rate of the upper and lower layer monomer gases is made consistent under the combined influence of monomer gas density and temperature, so that the thickness of the upper and lower layer coatings is uniform.

[0122] According to an embodiment of the present invention, a flow equalization component is provided in the coating chamber to optimize and improve the uniformity of gas deposition. This optimization includes three methods: adding a flow equalization component between the inlet and the rotating frame, multi-point control of the chamber wall temperature, and using a rotating frame. The monomer gas from the pyrolysis furnace enters the coating chamber through the inlet. After passing through a primary flow equalization plate, it diffuses horizontally outwards from the center to the entire plane. After passing through secondary and tertiary flow equalization plates, the diffusion becomes evenly distributed. Adjusting the temperature of the chamber wall ensures that the deposition rate of the monomer gas in the upper and lower layers is consistent under the combined influence of monomer gas density and temperature, resulting in uniform coating thickness. Simultaneously, during the coating process, the substrate revolves around a central rotation axis, preventing uneven substrate film thickness in fixed areas due to uneven chemical monomer gas density in different regions.

[0123] In conjunction with Figure 1, the coating equipment 100 also includes a vacuum system 50 for evacuating the coating chamber 11.

[0124] The vacuum system 50 includes an evacuation line 51, which is equipped with a pump unit for extracting air from the coating chamber 11. The evacuation line 51 includes a coarse evacuation line and a fine evacuation line. The coarse evacuation line is connected to the coating chamber 11, and the fine evacuation line is connected to the coating chamber 11 via a cold trap 52, which is used to trap condensable gases in the extracted air. Before coating, the chamber is evacuated; first, the chamber is coarsely evacuated, and then finely evacuated after a certain vacuum level is reached.

[0125] In some embodiments, the coating equipment 100 further includes an exhaust gas treatment device 60, which is connected to the extraction pipeline 51 and is used to treat and discharge the gas extracted through the extraction pipeline 51. The exhaust gas treatment device 60 includes, but is not limited to, the recovery or pollution-free treatment of reaction raw materials, process gases, or auxiliary gases containing doping elements such as nitrogen, inert gases, hydrogen, and hydrocarbon gases, before discharging them to the outside environment to prevent environmental pollution and to enable recycling.

[0126] According to an embodiment of the present invention, the coating chamber 11 is connected to the pump unit via two pipelines: a coarse extraction pipeline and a fine extraction pipeline. The coarse extraction pipeline is directly connected to the coating chamber 11, and a cold trap 52 is added between the fine extraction pipeline and the coating chamber 11. During the vacuuming stage, the coarse extraction pipeline is first opened to quickly remove most of the air from the coating chamber 11. After reaching a certain pressure, the fine extraction pipeline is opened. The low-temperature condensation and adsorption effect of the cold trap 52 can accelerate the vacuuming rate and simultaneously enable the coating chamber 11 to obtain a lower ultimate vacuum. During the coating process, the fine extraction pipeline is used. The process mixed gas extracted from the coating chamber 11 is condensed and adsorbed at low temperature by the cold trap 52 before being pumped away by the pump unit and discharged after passing through the exhaust gas treatment device 60. This significantly reduces the impurities entering the pump unit, extends the service life of the pump unit, and effectively filters the exhaust gas, making the equipment more environmentally friendly.

[0127] In some embodiments, the vacuum system 50 further includes a valve 53 that can control the opening degree for adjusting the pumping speed of the pumping line 51 to control the stability of the vacuum pressure in the coating chamber 11.

[0128] In some embodiments, the vacuum system 50 further includes a first vacuum pressure sensor 54 for detecting pressure in the evacuation line 51.

[0129] In some embodiments, the sublimation chamber 42 includes a second vacuum pressure sensor 426 for detecting the pressure inside the sublimation chamber 42.

[0130] In some embodiments, as shown in FIG8A, the coating apparatus 100 further includes a plasma discharge device 70. The plasma discharge device 70 includes an external plasma discharge mechanism or an internal plasma discharge mechanism.

[0131] In some embodiments, as shown in FIG8A, the coating equipment 100 further includes a real-time film thickness monitoring system 90, which monitors the thickness of the film layer on the substrate 80. When the thickness of the film layer reaches a predetermined thickness, the gas feeding device, liquid feeding device and / or solid feeding device are shut down.

[0132] As shown in Figures 10 and 11, the plasma discharge device 70 includes an external plasma discharge mechanism 71 and / or an internal plasma discharge mechanism 72. In the external plasma discharge mechanism, the plasma discharge device is installed on the outer wall of the cavity to perform plasma treatment on the substrate inside the cavity. The plasma discharge device may include a plasma excitation power supply, a matching device, a discharge coil or electrode, a quartz / ceramic plate, a glass cover plate, and a gas equalization flange. The plasma excitation power supply and the matching device enable the discharge coil or electrode to generate glow discharge in the coating cavity. The cavity wall is connected and sealed to the quartz / ceramic plate through the gas equalization flange, which has multiple air inlets and numerous air outlets on the side connected to the cavity, enabling uniform air intake into the cavity. The glass cover plate prevents the film layer from depositing on the quartz / ceramic plate. In the internal plasma discharge mechanism, the plasma excitation power supply applies voltage to the loading rack, causing the loading rack to discharge as an electrode to generate plasma. The plasma excitation power supply can be a radio frequency, intermediate frequency, or pulse power supply. The plasma excitation power supply generates high-energy plasma within the coating chamber 11, which excites the raw material gas to produce active groups, which are then deposited on the surface of the substrate 80 to form a cross-linked structure, thereby forming a film layer on the surface of the substrate 80. On the other hand, the bombardment of the film layer by high-energy ions and electrons in the plasma can make the film layer denser and improve the quality of the film layer.

[0133] In other embodiments, in the built-in plasma discharge mechanism, a plasma excitation power source (such as a radio frequency power source) generates a radio frequency electric field within the coating chamber 11 of the coating chamber 10 by directly loading an electrode plate within the chamber, thereby acting on the gas within the coating chamber 11. Specifically, during coating, the radio frequency power source discharges the gas, such as nitrogen or inert gas and reactant gas, within the coating chamber 11 by providing a radio frequency electric field, thereby creating a plasma environment within the coating chamber 11 and placing the reactant gas in a high-energy state.

[0134] According to an embodiment of the present invention, the side wall discharge coil of the coating chamber is connected to a matching device and a radio frequency power supply. After the coating chamber is evacuated, the alternating current of the radio frequency power supply excites the introduced argon / helium / oxygen and other gases to generate plasma, which acts on the surface of the substrate to perform surface treatment. This solves the cumbersome processing steps of the existing process, which requires the use of plasma equipment to perform surface treatment on the substrate before coating.

[0135] According to another aspect of the present invention, a coating method is provided, which employs the coating apparatus 100 according to any of the preceding embodiments. The coating method includes:

[0136] The substrate is placed inside the coating chamber of the coating equipment;

[0137] The temperature inside the evaporation chamber, sublimation chamber, pyrolysis chamber, and / or coating chamber is heated to the process set temperature.

[0138] Evacuate the evaporation chamber, sublimation chamber, pyrolysis chamber and / or coating chamber to 5mTorr-100mTorr;

[0139] The pressure inside the coating chamber is stabilized to the process pressure by controlling the air extraction rate.

[0140] The liquid raw material is vaporized and then transported into the coating chamber via a liquid feeding device to form a first gaseous raw material, and / or the solid raw material is sublimated and then cracked and then transported into the coating chamber via a solid feeding device to form a second gaseous raw material, and / or the gaseous raw material is transported into the coating chamber via a gas feeding device to form a third gaseous raw material.

[0141] In this process, the first gaseous material, the second gaseous material, and / or the third gaseous material undergo chemical reactions individually or together within the coating chamber and are deposited on the surface of the substrate to form a film layer.

[0142] Among them, one or more of the three forms of monomers—gaseous raw materials, liquid raw materials, and / or solid raw materials—can be transported simultaneously or sequentially.

[0143] The gas feeder here can deliver either a single gas feed or a process gas (such as an inert gas, nitrogen, etc.). The single gas feed can be a carbon source for preparing DLC ​​films, such as methane, ethane, ethylene, propylene, acetylene, etc., or it can be an organosilicon gas, or oxygen, hydrogen, etc.

[0144] In some embodiments, the coating method further includes:

[0145] The thickness of the film layer on the substrate is monitored by a real-time film thickness monitoring system. When the thickness of the film layer reaches a predetermined thickness, the liquid feeding device, the solid feeding device, and / or the gas feeding device are shut down.

[0146] In some embodiments, the volume of the coating chamber is 50L-2000L.

[0147] In some embodiments, the temperature in the evaporation chamber is 60℃-200℃, the temperature in the sublimation chamber is 80℃-250℃, the temperature in the pyrolysis chamber is 500℃-750℃, and the temperature in the coating chamber is 20℃-80℃.

[0148] In some embodiments, the process pressure within the coating chamber is 1 mTorr-500 mTorr.

[0149] In some embodiments, the solid raw material is spherical phenelzine, sheet-like phenelzine, or granular phenelzine.

[0150] In some embodiments, the spherical, sheet-like, or granular phenelzine is made from at least one of phenelzine N powder, C powder, D powder, F powder, and HT powder.

[0151] In some embodiments, the liquid feedstock includes at least one of the following: an organic compound having at least two unsaturated bonds, an epoxy organic compound, an unsaturated organic compound containing an aromatic ring, a perfluoropolyether and its derivatives, a fluorocarbon compound, an unsaturated organic compound with a long alkyl chain, an optionally substituted linear, branched or cyclic organosilicon compound, a perfluorinated compound mainly composed of -CF3, and a perfluoroolefin.

[0152] In some embodiments, any compound that has undergone plasma polymerization or chemical reaction to form a polymer film on the surface of the product may be used. Suitable liquid raw materials that may be used include compounds known in the art capable of producing polymer films on substrates by plasma polymerization or chemical reaction.

[0153] In some embodiments, organic compounds having at least two unsaturated bonds may include, but are not limited to, diethylene glycol divinyl ether, triethylene glycol divinyl ether, 1,4-butanediol divinyl ether, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, 1,3-butanediol dimethacrylate, 1,4-butanediol dimethacrylate, 1,4-butanediol diacrylate, divinyl adipate, neopentyl glycol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, 1,6-hexanediol di(meth)acrylate, 1 6-Hexanediol diacrylate, polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, ethoxylated trimethylolpropane triacrylate, propoxylated trimethylolpropane triacrylate, polydipentaerythritol pentaacrylate, polydipentaerythritol hexaacrylate, 1,5-pentanediol diacrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate, triallyl cyanate, triallylamine, divinylbenzene, diethylene glycol divinyl ether, triethylene glycol divinyl ether, 1,4-butanediol divinyl ether, pentaerythritol triallyl ether, 2,6-dimethyl-2,4,6-octtriene, 1,2,4-trivinylcyclohexane, 1,4-cyclohexanediethanol divinyl ether.

[0154] In some embodiments, the epoxy organic compound may include, but is not limited to, 3,4-epoxycyclohexylmethyl methacrylate, 3,4-epoxycyclohexyl methacrylate, glycidyl methacrylate, 1,2-epoxy-4-vinylcyclohexane, bis(2,3-epoxycyclopentyl) ether, vinylcyclohexene diepoxide, diisoprene diepoxide, bis((3,4-epoxycyclohexyl)methyl) adipate, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexyl carbamate, or dicyclopentadiene diepoxide.

[0155] In some embodiments, the unsaturated organic compound containing an aromatic ring may include, but is not limited to, 2-phenoxyethyl methacrylate, 2-phenoxyethyl acrylate, phenyl acrylate, 2-phenylethyl acrylate, diallyl terephthalate, or phenyl methacrylate.

[0156] In some embodiments, suitable perfluoropolyethers and perfluoropolyether derivatives, as disclosed in CN202311528758.8, the entire contents of which are incorporated herein by reference. For example, perfluoropolyether derivatives may include, but are not limited to, perfluoropolyether methacrylate, perfluoropolyether acrylate, perfluoropolyether carboxylic acid, perfluoropolyether methyl ester, perfluoropolyether dimethylaminopropionamide, perfluoropolyether carbonyl n-butyl thioester, perfluoropolyether amide ethyl alcohol, perfluoropolyether isocyanate, or perfluoropolyether amide acrylate. In some specific embodiments, specific examples of perfluoropolyethers or perfluoropolyether derivatives may also be... and The product name is perfluoropolyether sold.

[0157] In some embodiments, fluorocarbon compounds may include, but are not limited to, 3-(perfluoro-5-methylhexyl)-2-hydroxypropyl methacrylate, 2-(perfluorodecyl)ethyl methacrylate, 2-(perfluorodecyl)ethyl methacrylate, 2-(perfluorohexyl)ethyl methacrylate, 2-(perfluorohexyl)ethyl methacrylate, 2-(perfluorododecyl)ethyl methacrylate, 2-(perfluorododecyl)ethyl methacrylate, 2-perfluorooctyl ethyl methacrylate, 2-perfluorooctyl ethyl methacrylate, 2-(perfluorobutyl)ethyl methacrylate, 2-(perfluorobutyl)ethyl methacrylate, (2H-perfluoropropyl)-2-acrylate, and (perfluorocyclohexyl) methacrylate.

[0158] In some embodiments, the long alkyl chain unsaturated organic compound may include, but is not limited to, tert-butyl acrylate, hexyl acrylate, cyclohexyl acrylate, ethylhexyl acrylate, octyl acrylate, decyl acrylate, isodecyl acrylate, dodecyl acrylate, tetradecyl acrylate, hexadecyl acrylate, octadecyl acrylate, isobornyl acrylate, tert-butyl methacrylate, hexyl methacrylate, cyclohexyl methacrylate, ethylhexyl methacrylate, octyl methacrylate, decyl methacrylate, isodecyl methacrylate, dodecyl methacrylate, tetradecyl methacrylate, hexadecyl methacrylate, octadecyl methacrylate, and isobornyl methacrylate.

[0159] In some embodiments, the optionally substituted linear, branched, or cyclic organosilicon compounds may include, but are not limited to, perfluorodecyltrimethoxysilane, perfluorodecyltriethoxysilane, perfluorodecyltrichlorosilane, perfluorooctyltrimethoxysilane, perfluorooctyltriethoxysilane, perfluorooctyltrichlorosilane, perfluorohexyltrimethoxysilane, perfluorohexyltriethoxysilane, or perfluorohexyltrichlorosilane.

[0160] The coating method of the present invention will be further described below through specific embodiments.

[0161] Example 1

[0162] A method for preparing a multifunctional film using a coating apparatus 100 includes the following steps:

[0163] (1) Place the silicon wafer, metal sheet, grid circuit board, and PLA film into the coating chamber, and add the Piriton C powder pellets into the hopper. The weight of a single pellet is about 2.2g-2.3g.

[0164] (2) Heat the temperatures in the sublimation chamber, pyrolysis chamber and coating chamber to 220℃, 600℃ and 60℃ respectively;

[0165] (3) Evacuate the sublimation chamber, pyrolysis chamber and coating chamber to a chamber bottom pressure of 20mTorr;

[0166] (4) By controlling the pumping rate, the pressure inside the coating chamber is stabilized to 30 mTorr;

[0167] (5) The solid feeding device 40 of the coating equipment 100 adds the Piriton C powder pellets into the corresponding sublimation chamber at a rate of 40s / pellet, and then enters the coating chamber.

[0168] (6) After being sublimated and cracked to activate active monomer molecules, Pyrelin C powder pellets are deposited on the surface of the substrate;

[0169] (7) When the real-time film thickness monitoring system detects that the film thickness has reached the target thickness of 2μm, the solid feeding device 40 of the coating equipment 100 is turned off, and compressed air is introduced into the coating chamber to restore the coating chamber to normal pressure.

[0170] (8) Open the coating chamber and remove the substrate.

[0171] Example 2

[0172] A method for preparing a multifunctional film using a coating apparatus 100 includes the following steps:

[0173] (1) Place silicon wafers, metal sheets, grid circuit boards and PLA films into the coating chamber, add Pirilin C powder pellets into the hopper, and add organic monomers 1,6-hexanediol diacrylate and 3,4-epoxycyclohexyl methacrylate in a mass percentage ratio of 3:1 and then add them to the liquid feeding device.

[0174] (2) The temperatures in the evaporation chamber, sublimation chamber, pyrolysis chamber and coating chamber are respectively raised to 180°C, 140°C, 600°C and 60°C;

[0175] (3) Evacuate the sublimation chamber, pyrolysis chamber and coating chamber to a chamber bottom pressure of 20mTorr;

[0176] (4) By controlling the pumping rate, the pressure inside the coating chamber is stabilized to 30 mTorr;

[0177] (5) The solid feed device 40 of the coating equipment 100 adds Piriton C powder pellets to the corresponding sublimation chamber at 40s / pellet, and the liquid feed device 30 of the coating equipment 100 adds organic monomers to the corresponding evaporation chamber at 200μl / min, and then enters the coating chamber.

[0178] (6) After sublimation and cracking, the organic monomers are activated by plasma discharge to become active monomer molecules and then chemically react together to deposit on the surface of the substrate. The discharge pulse duty cycle is 45%, the pulse frequency is 250Hz, and the pulse discharge power is 50W.

[0179] (7) When the real-time film thickness monitoring system detects that the film thickness has reached the target thickness of 2μm, the solid feeding device 40 and the liquid feeding device 30 of the coating equipment 100 are turned off, and compressed air is introduced into the coating chamber to restore the coating chamber to normal pressure.

[0180] (8) Open the coating chamber and remove the substrate.

[0181] Example 3

[0182] A method for preparing a multifunctional film using a coating apparatus 100 includes the following steps:

[0183] (1) Place silicon wafers, metal sheets, grid circuit boards, and PLA films into the coating chamber, add Pirilin C powder pellets into the hopper, and add organic monomers phenyl acrylate, 1,6-hexanediol diacrylate, and 3,4-epoxycyclohexyl methacrylate to the liquid feeding device after mixing them in a mass percentage ratio of 5:4:1.

[0184] (2) The temperatures in the evaporation chamber, sublimation chamber, pyrolysis chamber and coating chamber are respectively raised to 180°C, 140°C, 600°C and 60°C;

[0185] (3) Evacuate the sublimation chamber, pyrolysis chamber and coating chamber to a chamber bottom pressure of 20mTorr;

[0186] (4) By controlling the pumping rate, the pressure inside the coating chamber is stabilized to 30 mTorr;

[0187] (5) The solid feed device 40 of the coating equipment 100 adds Piriton C powder pellets to the corresponding sublimation chamber at 40s / pellet, and the liquid feed device 30 of the coating equipment 100 adds organic monomers to the corresponding evaporation chamber at 200μl / min, and then enters the coating chamber.

[0188] (6) After sublimation and cracking, the organic monomers are activated by plasma discharge to become active monomer molecules and then chemically react together to deposit on the surface of the substrate. The discharge pulse duty cycle is 45%, the pulse frequency is 250Hz, and the pulse discharge power is 65W.

[0189] (7) When the real-time film thickness monitoring system detects that the film thickness has reached the target thickness of 2μm, the solid feeding device 40 and the liquid feeding device 30 of the coating equipment 100 are turned off, and compressed air is introduced into the coating chamber to restore the coating chamber to normal pressure.

[0190] (8) Open the coating chamber and remove the substrate.

[0191] Example 4

[0192] A method for preparing a multifunctional film using a coating apparatus 100 includes the following steps:

[0193] (1) Place silicon wafers, metal sheets, grid circuit boards, and PLA films into the coating chamber, add Piriton C powder pellets into the hopper, mix organic monomers A (phenyl acrylate, 1,6-hexanediol diacrylate, and 3,4-epoxycyclohexyl methacrylate) in a mass percentage of 5:4:1 and add them to liquid feeder 1, and add organic monomer B (perfluoropolyether (meth) acrylate) to liquid feeder 2.

[0194] (2) The temperatures in the evaporation chamber 1, evaporation chamber 2, sublimation chamber, pyrolysis chamber and coating chamber are respectively heated to 180℃, 120℃, 140℃, 600℃ and 60℃;

[0195] (3) Evacuate the sublimation chamber, pyrolysis chamber and coating chamber to a chamber bottom pressure of 20mTorr;

[0196] (4) By controlling the pumping rate, the pressure inside the coating chamber is stabilized to 30 mTorr;

[0197] (5) The solid feed device 40 of the coating equipment 100 adds Piriton C powder pellets at 40s / pellet to the corresponding sublimation chamber, and the liquid feed device 1 adds organic monomer A at 200μl / min to the corresponding evaporation chamber 1, and then enters the coating chamber.

[0198] (6) After sublimation and cracking, Pirilin C powder pellets and organic monomer A are activated by plasma discharge to become active monomer molecules and then chemically react together to deposit on the surface of the substrate. The discharge pulse duty cycle is 45%, the pulse frequency is 250Hz, and the pulse discharge power is 65W.

[0199] (7) After 2 hours, the liquid feed device 1 is turned off. Then, the solid feed device 40 adds the Pyrelin C powder pellets to the corresponding sublimation chamber at 40s / pellet. The liquid feed device 2 adds the organic monomer B to the corresponding evaporation chamber 2 at 100μl / min. Then, the Pyrelin C powder pellets enter the coating chamber. After the organic monomer B is activated by sublimation and cracking catalysis, the Pyrelin C powder pellets are deposited on the surface of the substrate.

[0200] (8) After 0.5 hours, the deposition ends. The solid feed device 40 and the liquid feed device 2 are shut off. Compressed air is introduced and the chamber is restored to normal pressure.

[0201] (9) Open the coating chamber and remove the substrate.

[0202] Example 5

[0203] A method for preparing a multifunctional film using a coating apparatus 100 includes the following steps:

[0204] (1) Place silicon wafers, metal sheets, grid circuit boards, and PLA films into the coating chamber, add Pirilin C powder pellets into the hopper, and add organic monomers phenyl acrylate, 1,6-hexanediol diacrylate, and 3,4-epoxycyclohexyl methacrylate to the liquid feeding device after mixing them in a mass percentage ratio of 5:4:1.

[0205] (2) The temperatures in the evaporation chamber, sublimation chamber, pyrolysis chamber and coating chamber are respectively raised to 180°C, 140°C, 600°C and 60°C;

[0206] (3) Evacuate the sublimation chamber, pyrolysis chamber and coating chamber to a chamber bottom pressure of 20mTorr;

[0207] (4) By controlling the pumping rate, the pressure inside the coating chamber is stabilized to 30 mTorr;

[0208] (5) The organic monomer is added to the corresponding evaporation chamber at a rate of 200 μl / min through the liquid feeding device 30 of the coating equipment 100, and then enters the coating chamber.

[0209] (6) Organic monomers are activated by plasma discharge to become active monomer molecules and then deposited on the surface of the substrate. The discharge pulse duty cycle is 45%, the pulse frequency is 250Hz, and the pulse discharge power is 65W.

[0210] (7) After 0.5H, the liquid feeding device 30 is turned off, and then the solid feeding device 40 is used to add the Pyrelin C powder pellets into the sublimation chamber at 40s / pellet. Then, the pellets enter the coating chamber. After the Pyrelin C powder pellets are activated by sublimation and cracking, they are deposited on the surface of the substrate as active monomer molecules.

[0211] (8) After 2 hours, the deposition ends. The solid feed device 40 is turned off, and compressed air is introduced into the coating chamber to restore the coating chamber to normal pressure.

[0212] (9) Open the coating chamber and remove the substrate.

[0213] Comparative Example 1

[0214] (1) Place the silicon wafer, metal sheet, gate circuit board, and PLA film into the coating chamber, and add 200g of Pyrelin C powder into the sublimation chamber;

[0215] (2) Heat the temperatures in the sublimation chamber, pyrolysis chamber and coating chamber to 140℃, 600℃ and 60℃ respectively;

[0216] (3) Evacuate the sublimation chamber, pyrolysis chamber and coating chamber to a chamber bottom pressure of 20mTorr;

[0217] (4) By controlling the pumping rate, the pressure inside the coating chamber is stabilized to 30 mTorr;

[0218] (5) After being sublimated and cracked to activate active monomer molecules, Pyrelin C powder is deposited on the surface of the substrate;

[0219] (6) After 3 hours, the deposition ends. The Parylene C powder feeding system is shut off, and compressed air is introduced into the coating chamber to restore the coating chamber to normal pressure.

[0220] (7) Open the coating chamber and remove the substrate.

[0221] Comparative Example 2

[0222] (1) Place the silicon wafer, metal sheet, grid circuit board and PLA film into the coating chamber, and add the organic monomers 1,6-hexanediol diacrylate and 3,4-epoxycyclohexyl methacrylate in a mass percentage ratio of 3:1 to the monomer feeding device.

[0223] (2) Heat the evaporation chamber and the coating chamber to 180℃ and 50℃ respectively;

[0224] (3) Evacuate the sublimation chamber, pyrolysis chamber and coating chamber to a chamber bottom pressure of 20mTorr;

[0225] (4) By controlling the pumping rate, the pressure inside the coating chamber is stabilized to 80 mTorr;

[0226] (5) Add the organic monomer to the corresponding evaporation chamber at a rate of 200 μl / min, then vaporize it and introduce it into the coating chamber;

[0227] (6) Organic monomers are activated by plasma discharge to become active monomer molecules and then deposited on the surface of the substrate. The discharge pulse duty cycle is 45%, the pulse frequency is 250Hz, and the pulse discharge power is 50W.

[0228] (7) After 6 hours, the deposition is completed. The monomer feeding system is shut off, and compressed air is introduced into the coating chamber to restore the coating chamber to normal pressure.

[0229] (8) Open the coating chamber and remove the substrate.

[0230] Comparative Example 3

[0231] (1) Place the silicon wafer, metal sheet, grid circuit board and PLA film into the coating chamber, and add the organic monomers phenyl acrylate, 1,6-hexanediol diacrylate and 3,4-epoxycyclohexyl methacrylate into the monomer feeding device after mixing them in a mass percentage of 5:4:1.

[0232] (2) Heat the evaporation chamber and the coating chamber to 180℃ and 50℃ respectively;

[0233] (3) Evacuate the sublimation chamber, pyrolysis chamber and coating chamber to a chamber bottom pressure of 20mTorr;

[0234] (4) By controlling the pumping rate, the pressure inside the coating chamber is stabilized to 80 mTorr;

[0235] (5) Add the organic monomer to the corresponding evaporation chamber at a rate of 200 μl / min, and then enter the coating chamber;

[0236] (6) Organic monomers are activated by plasma discharge to become active monomer molecules and then deposited on the surface of the substrate. The discharge pulse duty cycle is 45%, the pulse frequency is 250Hz, and the pulse discharge power is 65W.

[0237] (7) After 6 hours, the deposition is completed. The monomer feeding system is shut off, and compressed air is introduced into the coating chamber to restore the coating chamber to normal pressure.

[0238] (8) Open the coating chamber and remove the substrate.

[0239] Table 1. Test results of Examples 1-5 and Comparative Examples 1-3

[0240] Among them, layers A, B, and C represent the upper, middle, and lower layers of the product on the rotating frame inside the cavity.

[0241] According to another aspect of the invention, a film layer is provided, which is prepared by the method described in any embodiment of the invention.

[0242] According to another aspect of the invention, a device is provided, wherein at least a portion of the surface of the device comprises a film layer as described in any embodiment of the invention.

[0243] In some embodiments, the device is an electronic or electrical component, an optical instrument, etc. Specifically, an electrical component may be a printed circuit board (PCB), an electronic product, or a semi-finished electronic assembly. When the device is an electronic product, examples include, but are not limited to, mobile phones, tablets, keyboards, e-readers, wearable devices, displays, headphones, etc. The device may also be any suitable electrical component of an electrical component, specifically, a resistor, capacitor, transistor, diode, amplifier, relay, transformer, battery, fuse, integrated circuit, switch, LED, LED display, piezoelectric element, optoelectronic component, antenna, or oscillator, etc.

[0244] In other embodiments, the device is made of various plastics, fabrics, glass, metals, etc. Specifically, the metal product may be made of iron, magnesium, aluminum, copper, or their alloys, and the glass product may be a mobile phone lens cover, ski goggles, bathroom glass, eyeglasses, swimming goggles, camera lens, automotive glass, infrared microscope, surgical endoscope, solar panel, etc.

[0245] The coating method according to embodiments of the present invention has the following effects:

[0246] (1) Significantly improved controllability of the coating process: The coating equipment adopts a continuous feeding method. By controlling the feeding frequency and parameters such as vaporization and decomposition temperatures, the density of monomer gas in the coating chamber can be controlled, thereby achieving regulation of the coating rate. At the same time, the quality of the coating layer is affected by the deposition environment and deposition rate of the monomer gas. The continuous feeding device can deposit coating layers of different qualities on the substrate surface through parameter control. High coating rate and low quality coating layers and low coating rate and high quality coating layers can be selected according to the protection requirements.

[0247] (2) Significantly reduced cost: The coating equipment uses a continuous feeding method. During the entire coating process, the raw material of the pellets continuously enters the sublimation chamber at a certain frequency, so that the raw material of the pellets vaporizes and decomposes at a uniform speed in each stage. The monomer molecules are uniformly deposited on the surface of the substrate, which reduces the waste of a large amount of powder in the accelerated vaporization and decomposition stage of the raw material of the pellets. This effectively improves the utilization rate of raw materials and the coating rate, increases the coating rate by more than 50%, and significantly reduces the cost of coating per piece.

[0248] (3) It can realize multi-layer and multi-functional composite film layers: The coating feeding system of this equipment has three types of feeding: gas feeding, liquid feeding and solid feeding. During the coating process of the equipment, different processes can be combined in the same coating process, and the working conditions of different film layers can be changed without starting and stopping the equipment, so as to complete multi-layer and multi-functional composite film layers in one go.

[0249] (4) Improved uniformity of film thickness: Due to the use of self-made flow equalization components, multi-point control and adjustment of the temperature of the cavity wall, and the use of a rotating frame, the problem of poor uniformity of film thickness and large difference in film quality caused by uneven distribution of monomer gas in the coating chamber can be effectively eliminated. The film thickness of this coating equipment can be precisely controlled between 0.5-100μm, with a thickness error range of 20%.

[0250] The technical content and features of the present invention have been disclosed above. However, it is understood that those skilled in the art can make various changes and improvements to the disclosed concepts under the inventive concept of the present invention, all of which fall within the protection scope of the present invention. The description of the above embodiments is illustrative rather than restrictive, and the protection scope of the present invention is determined by the claims.

Claims

1. A coating equipment, characterized in that, include: A coating cavity, including a coating chamber for placing a substrate to be coated; A liquid feeding device, connected to the coating chamber, is used to transport the first gaseous raw material, after vaporization of the liquid raw material, into the coating chamber; and A solid feeding device, connected to the coating chamber, is used to transport the second gaseous raw material after the solid raw material has been sublimated and cracked into the coating chamber. The solid feeding device includes: A silo is used to hold the solid raw materials; A sublimation chamber is used to heat and sublimate the solid raw material. A rotary feeding mechanism is used to controllably transport the solid raw material in the hopper to the sublimation chamber; and A pyrolysis furnace is used to pyrolyze the gas obtained after the solid raw material is sublimated into the second gaseous raw material, and to transport the second gaseous raw material to the coating chamber.

2. The coating equipment according to claim 1, characterized in that, The solid raw material is spherical, sheet-like, or granular phenelzine.

3. The coating equipment according to claim 1, characterized in that, The rotary feeding mechanism includes: A turntable is set inside the hopper and can rotate around its own central axis. The turntable has a central protrusion and a plurality of turntable holes evenly arranged around the central protrusion. One turntable hole is used to accommodate a spherical or sheet-shaped solid raw material, or one turntable hole is used to accommodate a granular solid raw material of a specific volume. A material feeding channel, located below the turntable, connects the hopper and the sublimation chamber; and A stop block, located above the turntable, allows the solid raw material in the turntable hole to rotate to the feeding channel, and blocks the remaining solid raw material other than the solid raw material in the turntable hole from rotating to the feeding channel, so that the solid raw material in the turntable hole enters the sublimation chamber through the feeding channel.

4. The coating equipment according to claim 3, characterized in that, The turntable feeding mechanism also includes an indexing device for controlling the rotation angle of the turntable.

5. The coating equipment according to claim 3, characterized in that, The rotary feeding mechanism also includes a photoelectric detection device for detecting the feeding status of the solid raw materials.

6. The coating equipment according to claim 5, characterized in that, The turntable is provided with a material waiting position and a material unloading position, and the photoelectric detection device includes: A first photoelectric switch sensor is used to detect whether the solid raw material exists at the material waiting position of the turntable; and The second photoelectric switch sensor is used to detect whether the solid raw material exists at the feed position of the turntable.

7. The coating equipment according to claim 6, characterized in that, The photoelectric detection device also includes a third photoelectric switch sensor for detecting whether the solid raw material exists at the center of the central protrusion of the turntable.

8. The coating equipment according to claim 7, characterized in that, The photoelectric detection device also includes an alarm. When the third photoelectric switch sensor detects that the solid raw material is not present at the center of the central protrusion of the turntable, the alarm will issue an alarm signal.

9. The coating equipment according to any one of claims 1 to 8, characterized in that, The coating equipment further includes a gas feeding device, which is connected to the coating chamber and is used to transport a third gaseous raw material into the coating chamber.

10. The coating apparatus according to any one of claims 1 to 8, characterized in that, The sublimation chamber includes: A sublimation chamber, wherein a quick-change receiving tray is provided inside the sublimation chamber for receiving the solid raw material; and The outlet is connected to the sublimation chamber and is used to discharge the gas produced by the sublimation of the solid raw material into the pyrolysis furnace.

11. The coating equipment according to claim 10, characterized in that, The sublimation chamber also includes: A flip-top end cap is used to seal the sublimation chamber, and the slope of the flip-top end cap is less than 90°.

12. The coating equipment according to claim 10, characterized in that, The sublimation chamber also includes: A control valve assembly is used to control the delivery of the solid raw material into the sublimation chamber.

13. The coating equipment according to claim 12, characterized in that, The control valve assembly includes at least two control valves, which are spaced apart from each other and are used to control the opening and closing of the feeding channel respectively.

14. The coating equipment according to claim 13, characterized in that, Each control valve includes a valve core and a heating element, the heating element being used to regulate the temperature of the valve core.

15. The coating apparatus according to any one of claims 1 to 8, characterized in that, The pyrolysis furnace includes: Cracking furnace piping; and Multiple fins are located inside the pyrolysis furnace pipe.

16. The coating equipment according to claim 15, characterized in that, Each fin has multiple grooves.

17. The coating apparatus according to any one of claims 1 to 8, characterized in that, The coating chamber is provided with a rotating bracket or a fixed bracket for placing the substrate.

18. The coating equipment according to claim 17, characterized in that, The coating chamber is equipped with a flow equalization component for equalizing the flow of the second gaseous raw material.

19. The coating equipment according to claim 18, characterized in that, The flow equalization component includes: A primary flow equalizer is used to diffuse the second gaseous feedstock in all directions; and The secondary flow equalizer is located downstream of the primary flow equalizer along the airflow direction of the second gas raw material, and the secondary flow equalizer is provided with a plurality of first vent holes.

20. The coating equipment according to claim 19, characterized in that, The flow equalization component further includes: The third-stage flow equalizer is located downstream of the second-stage flow equalizer, along the airflow direction of the second gas feedstock.

21. The coating equipment according to claim 20, characterized in that, The three-stage flow equalizer is provided with multiple second vents; or The three-stage flow equalizer comprises multiple layers of staggered slotted plates; or The three-stage flow equalizer includes multiple convection structures.

22. The coating apparatus according to any one of claims 1 to 8, characterized in that, The coating equipment also includes a vacuum system for evacuating the coating chamber.

23. The coating equipment according to claim 22, characterized in that, The vacuum system includes an air extraction pipeline, which is equipped with a pump unit for extracting air from the coating chamber.

24. The coating equipment according to claim 23, characterized in that, The extraction pipeline includes a coarse extraction pipeline and a fine extraction pipeline. The coarse extraction pipeline is connected to the coating chamber, and the fine extraction pipeline is connected to the coating chamber through a cold trap.

25. The coating equipment according to claim 23, characterized in that, The vacuum system also includes a valve whose opening can be controlled to adjust the pumping speed of the pumping pipeline in order to stabilize the vacuum pressure in the coating chamber.

26. The coating equipment according to claim 23, characterized in that, The vacuum system further includes a first vacuum pressure sensor for detecting the pressure in the evacuation line, and the sublimation chamber includes a second vacuum pressure sensor for detecting the pressure inside the sublimation chamber.

27. The coating equipment according to claim 23, characterized in that, The coating equipment also includes an exhaust gas treatment device, which is connected to the extraction pipeline and is used to treat and discharge the gas extracted through the extraction pipeline.

28. The coating apparatus according to any one of claims 1 to 8, characterized in that, The coating equipment also includes a plasma discharge device, which may be an external plasma discharge mechanism or an internal plasma discharge mechanism.

29. A coating method, characterized in that, The coating method employs the coating equipment according to any one of claims 1 to 28, and the coating method includes: The substrate is placed inside the coating chamber of the coating equipment; The temperature inside the evaporation chamber, sublimation chamber, pyrolysis chamber, and / or coating chamber is heated to the process set temperature. Evacuate the evaporation chamber, sublimation chamber, pyrolysis chamber and / or coating chamber to 5mTorr-100mTorr; The pressure inside the coating chamber is stabilized to the process pressure by controlling the air extraction rate. The liquid raw material is vaporized and then transported into the coating chamber via a liquid feeding device to form a first gaseous raw material, and / or the solid raw material is sublimated and then cracked and then transported into the coating chamber via a solid feeding device to form a second gaseous raw material, and / or the gaseous raw material is transported into the coating chamber via a gas feeding device to form a third gaseous raw material. In this process, the first gaseous material, the second gaseous material, and / or the third gaseous material undergo chemical reaction individually or together in the coating chamber to deposit a film layer on the surface of the substrate.

30. The coating method according to claim 29, characterized in that, Also includes: The thickness of the film layer on the substrate is monitored by a real-time film thickness monitoring system. When the thickness of the film layer reaches a predetermined thickness, the liquid feeding device, the solid feeding device, and / or the gas feeding device are shut down.

31. The coating method according to claim 29, characterized in that, The volume of the coating chamber is 50L-2000L.

32. The coating method according to claim 29, characterized in that, The temperature in the evaporation chamber is 60℃-200℃, the temperature in the sublimation chamber is 80℃-250℃, the temperature in the pyrolysis chamber is 500℃-750℃, and the temperature in the coating chamber is 20℃-80℃.

33. The coating method according to claim 29, characterized in that, The process pressure inside the coating chamber is 1 mTorr-500 mTorr.

34. The coating method according to claim 29, characterized in that, The solid raw material is spherical, sheet-like, or granular phenelzine.

35. The coating method according to claim 34, characterized in that, The spherical, sheet-like, or granular P-relin is made from at least one of P-relin N powder, C powder, D powder, F powder, or HT powder.

36. The coating method according to claim 29, characterized in that, The liquid raw material includes at least one of the following: organic compounds having at least two unsaturated bonds, epoxy organic compounds, unsaturated organic compounds containing aromatic rings, perfluoropolyethers and perfluoropolyether derivatives, fluorocarbon compounds, long alkyl chain unsaturated organic compounds, optionally substituted linear, branched or cyclic organosilicon compounds, perfluorinated compounds mainly composed of -CF3, and perfluoroolefins.

37. A film layer, characterized in that, It is prepared by the coating method according to any one of claims 29 to 36.

38. A device, characterized in that, At least a portion of the surface of the device includes the film layer according to claim 37.

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