Electronic device comprising flexible printed circuit board

Abstract

An electronic device according to an embodiment may comprise a conductive side structure, a first printed circuit board (PCB), a first flexible PCB (FPCB), a second FPCB, and a key button. The first FPCB may include a substrate including a first surface and a second surface opposite to the first surface, a connector mounted on the first surface of the substrate and coupled to the first PCB, and a non-conductive stiffener disposed on a portion of the second surface of the substrate opposite to the connector. The key button may be disposed on the second FPCB and at least partially accommodated in an opening of the conductive side structure to define a portion of the exterior of the electronic device. The second FPCB may include an electromagnetic interference (EMI) shielding layer. At least a portion of the EMI shielding layer of the second FPCB may overlap the non-conductive stiffener of the first FPCB.

Description

Electronic devices including flexible printed circuit boards

[0001] The present disclosure relates to electronic devices including flexible printed circuit boards.

[0002] Electronic devices, such as smartphones, may include a printed circuit board on which components, such as an application processor, are mounted. The electronic device may include flexible printed circuit boards for connecting other electronic components or other printed circuit boards to the printed circuit board.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0004] In one embodiment, an electronic device may include a conductive side structure, a first printed circuit board (PCB), a first flexible PCB (FPCB), a second FPCB, and a key button. The conductive side structure may define a portion of an exterior appearance of the electronic device, be configured to function at least partially as an antenna of the electronic device, and may have an opening. The first FPCB may include a substrate having a first side and a second side opposite the first side, a connector mounted on the first side of the substrate and coupled to the first PCB, and a non-conductive stiffener disposed on a portion of the second side of the substrate opposite the connector. The key button may be disposed on the second FPCB and be at least partially received within the opening of the conductive side structure to define another portion of the exterior appearance of the electronic device. The second FPCB may include an electromagnetic interference (EMI) shielding layer. At least a portion of the EMI shielding layer of the second FPCB may overlap with the non-conductive stiffener of the first FPCB.

[0005] In one embodiment, an electronic device may include a first printed circuit board (PCB), a first flexible PCB (FPCB), a second FPCB, and a third FPCB. The first FPCB may include a substrate, a connector disposed on a first surface of the substrate and coupled to the first PCB, and a non-conductive stiffener disposed on a second surface of the substrate to overlap the connector. The second FPCB may extend from the first PCB across the non-conductive stiffener of the first FPCB. The third FPCB may extend from the first PCB across the second FPCB. The electronic device may include a non-conductive layer disposed between the second FPCB and the third FPCB to space the second FPCB and the third FPCB apart. The second FPCB may include an electromagnetic interference (EMI) shielding layer facing the non-conductive stiffener of the first FPCB.

[0006] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0007] FIG. 2A illustrates an example of an unfolded state of an electronic device according to one embodiment.

[0008] FIG. 2b illustrates an example of a folded state of an electronic device according to one embodiment.

[0009] FIG. 2c is an exploded view of an electronic device according to one embodiment.

[0010] FIG. 3 is a drawing showing a first housing part of an electronic device according to one embodiment.

[0011] FIG. 4 is a cross-sectional view of a first housing part of an electronic device according to one embodiment.

[0012] Fig. 5 is a drawing showing the noise propagation path of the first housing part through FPCBs.

[0013] FIG. 6a illustrates FPCBs according to one embodiment.

[0014] FIG. 6b is a cross-sectional view showing FPCBs according to one embodiment.

[0015] FIG. 7 is a cross-sectional view of a first housing part of an electronic device according to one embodiment.

[0016] FIG. 8 is a cross-sectional view of a first housing part of an electronic device according to one embodiment.

[0017] Figure 9 illustrates a first PCB according to one embodiment.

[0018] Figure 10a is a graph showing the antenna performance of an electronic device.

[0019] Figure 10b is a diagram showing the electric field distribution of an electronic device.

[0020] FIG. 11A is a graph showing antenna performance of an electronic device according to one embodiment.

[0021] FIG. 11b is a diagram showing the electric field distribution of an electronic device according to one embodiment.

[0022] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0023] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0024] The processor (120) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0025] The auxiliary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0026] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0027] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144) or an application (146).

[0028] Can be.

[0029] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0030] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0031] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0032] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0033] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0034] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0035] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0036] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0037] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0038] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0039] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0040] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, Wi-Fi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0041] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0042] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0043] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0044] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0045] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service by itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0046] FIG. 2a illustrates an example of an unfolded state of an electronic device according to one embodiment, FIG. 2b illustrates an example of a folded state of an electronic device according to one embodiment, and FIG. 2c is an exploded view of an electronic device according to one embodiment.

[0047] Referring to FIGS. 2A, 2B, and 2C, the electronic device (201) may include a first housing part (210), a second housing part (220), and a foldable display (230). The electronic device (201) may be referred to as a foldable electronic device in that it is configured to fold about a folding axis (237).

[0048] In one embodiment, the electronic device (201) may include a first housing part (210), a second housing part (220), a hinge structure (260), a foldable display (230), a printed circuit board (250), a display (235), and / or a back plate (290). According to one embodiment, the electronic device (201) may omit at least one of the components or additionally include other components.

[0049] In one embodiment, the first housing part (210) may define a portion of an outer surface of the electronic device (201). For example, the first housing part (210) may define a first side surface (211), a second side surface (212) spaced apart from and opposite the first side surface (211), and a first side surface of a first side wall (213) that surrounds at least a portion of the first side surface (211) and the second side surface (212). In one embodiment, the first housing part (210) may provide a space defined by the first side surface (211), the second side surface (212), and the first side surface as a space for arranging components of the electronic device (201).

[0050] In one embodiment, the second side wall (223) may be pivotably connected to the first side wall (213) via a hinge structure (260) disposed on a hinge cover (265). The hinge structure (260) may include a hinge module and hinge plates (266, 267). The hinge plates may include a first hinge plate (266) and a second hinge plate (267), and the first hinge plate (266) may be connected to the first housing part (210), and the second hinge plate (267) may be connected to the second housing part (220).

[0051] In one embodiment, the second housing part (220) may include a third face (221), a fourth face (222) facing and spaced from the third face (221), and a second side wall (223) surrounding at least a portion of the third face (221) and the fourth face (222). The second housing part (220) may provide a space defined by the third face (221), the fourth face (222), and the second side of the second side wall (223) as a space for arranging components of the electronic device (201).

[0052] In one embodiment, the foldable display (230) may include a window exposed to the outside. The window may protect the surface of the foldable display (230) and may be formed of a transparent material to transmit visual information provided from the foldable display (230) to the outside. The window may include a glass material such as ultra-thin glass (UTG) or a polymer material such as polyimide (PI).

[0053] In one embodiment, the foldable display (230) may form at least a portion of a first side (211) of the first housing part (210) (e.g., a front side of the first housing part (210)) and a third side (221) of the second housing part (220) (e.g., a front side of the second housing part (220)). The foldable display (230) may be disposed on the first side (211) of the first housing part (210) and the third side (221) of the second housing part (220) across a hinge structure (260) within a hinge cover (265). The foldable display (230) may be configured to bend within a folded state of the electronic device (201) by the hinge structure (260). The foldable display (230) may include a first display area (231), a second display area (232), and a third display area (233). For example, the foldable display (230) may include a first display area (231) disposed on a first surface (211) of a first housing, a second display area (232) disposed on a third surface (221) of a second housing, and a third display area (233) between the first display area (231) and the second display area (232). The foldable display (230) may be supported by a first bracket (270) of the first housing part (210) and a second bracket (280) of the second housing part (220).

[0054] According to one embodiment, the foldable display (230) may include an opening formed in a portion of the screen display area, or a bracket supporting the foldable display (230) may include a recess or an opening. The electronic device (201) may include at least one camera aligned with the recess or the opening. For example, the first display area (231) may further include at least one camera (236) capable of acquiring an image from the outside through a portion of the first display area (231). According to one embodiment, at least one camera (236) may be included on the rear surface of the foldable display (230) corresponding to the first display area (231) or the second display area (232) of the foldable display (230). For example, the at least one camera (236) may be disposed below the foldable display (230) and may be surrounded by the foldable display (230). At least one camera (236) may be an under-display camera (UDC) that is covered by the foldable display (230) and is not exposed to the outside. However, the present invention is not limited thereto, and the foldable display (230) may include an opening that exposes at least one camera (236) to the outside. In one embodiment, the camera (236) may acquire images of the external environment and / or external objects through the opening.

[0055] In one embodiment, the fourth side (222) of the second housing part (220) may further include at least one camera (234) and display (235) exposed through a portion of the fourth side (222).

[0056] In one embodiment, the hinge structure (260) may be configured to pivotally connect a first bracket (270) forming a first housing part (210) and a second bracket (280) forming a second housing part (220).

[0057] In one embodiment, the electronic device (201) may be in one of a folded state, an unfolded state, or an intermediate state. The folded state may be a state in which the first surface (211) of the first housing part (210) and the third surface (221) of the second housing part (220) face each other. In the folded state, the direction in which the first surface (211) faces and the direction in which the third surface (221) faces may be opposite to each other. The unfolded state may be a state in which the first surface (211) of the first housing part (210) and the third surface (221) of the second housing part (220) are substantially continuous planes. In the unfolded state, the direction in which the first surface (211) faces and the direction in which the third surface (221) faces may be the same. The intermediate state may be a state between the unfolded state and the folded state. In the intermediate state, the direction in which the first side (211) faces and the direction in which the third side (221) faces may be different.

[0058] In one embodiment, while the electronic device (201) is in a folded state, the hinge cover (265) surrounding the hinge structure (260) may be at least partially exposed between the first housing part (210) and the second housing part (220). In another embodiment, while the electronic device (201) is in an unfolded state, the hinge cover (265) may be covered by the first housing part (210) and the second housing part (220).

[0059] In one embodiment, the electronic device (201) can be folded about a folding axis (237) passing through the hinge cover (265) or the hinge structure (260). For example, the hinge structure (260) within the hinge cover (265) can be disposed between the first housing part (210) and the second housing part (220) of the electronic device (201) to enable the electronic device (201) to be bent, curved, or folded. For example, the first housing part (210) can be connected to the second housing part (220) through the hinge structure (260) disposed within the hinge cover (265) and can be rotated about the folding axis (237).

[0060] In one embodiment, the electronic device (201) can be folded such that the first housing part (210) and the second housing part (220) face each other by rotating about the folding axis (237). In one embodiment, the electronic device (201) can be folded such that the first housing part (210) and the second housing part (220) cover or overlap each other.

[0061] The hinge structure (260) may include a hinge module and hinge plates (266, 267). The hinge module may include a hinge gear (262, 263) that allows the first housing part (210) and the second housing part (220) to pivot.

[0062] The first housing part (210) may include a first bracket (270), and the second housing part (220) may include a second bracket (280). The first bracket (270) may be partially surrounded by the first side wall (213), and the second bracket (280) may be partially surrounded by the second side wall (223). The first bracket (270) may be formed integrally with the first side wall (213), and the second bracket (280) may be formed integrally with the second side wall (223). According to one embodiment, the first bracket (270) may be formed separately from the first side wall (213), and the second bracket (280) may be formed separately from the second side wall (223). The first side wall (213) and the second side wall (223) may be formed of a metallic material, a non-metallic material, or a combination thereof. For example, the first side wall (213) may include a conductive portion (218) and a non-conductive portion (219). The conductive portion (218) may be used as a radiator of the antenna.

[0063] One side of the first bracket (270) can be coupled with the rear plate (290), and the other side of the first bracket (270) can be coupled with the foldable display (230). One side of the second bracket (280) can be coupled with the display (235), and the other side of the second bracket (280) can be coupled with the foldable display (230).

[0064] A printed circuit board (250) and a battery may be placed in the space between the surface formed by the first bracket (270) and the second bracket (280) and the surface formed by the display (235) and the rear plate (290). The printed circuit board (250) may be separated so that it may be placed in each of the first bracket (270) of the first housing part (210) and the second bracket (280) of the second housing part (220). Components for implementing various functions of the electronic device (201) may be placed on the printed circuit board (250).

[0065] According to one embodiment, the first printed circuit board (251) may have components for implementing the overall function of the electronic device (201) arranged thereon, and the second printed circuit board (252) may have electronic components for implementing some functions of the first printed circuit board (251) arranged thereon, or components for driving the display panel arranged on the fourth surface (222) may be arranged thereon. The first printed circuit board (251) and the second printed circuit board (252) may be electrically connected by a flexible printed circuit board (240).

[0066] The battery (255) may be, for example, a device for supplying power to at least one component of the electronic device (201), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (255) may be disposed substantially flush with the printed circuit board (250). The substantially flush surfaces of the printed circuit board (250) and the battery (255) may be disposed on one surface of the first bracket (270) and the second bracket (280) (e.g., the surface facing the second surface (212) and the fourth surface (222), or the surface facing the display panel and the back plate (290). For example, a flexible display (230) may be placed on the first side (211) and the third side (221), and a printed circuit board (250) and a battery (255) may be placed on the second side (212) and the fourth side (222) facing the side on which the flexible display (230) is placed.

[0067] Antenna (285) may be positioned between the rear plate (290) and the battery (255) in one embodiment. Antenna (285) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. Antenna (285) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging.

[0068] In FIGS. 2A, 2B, and 2C, the electronic device (201) is illustrated as including a plurality of foldable housing parts, but is not limited thereto. For example, the electronic device (201) may be a bar-type electronic device.

[0069] Hereinafter, overlapping descriptions of components having the same reference numerals as the aforementioned components may not be repeated, and reference numerals of other drawings may be referenced in the description of a specific drawing.

[0070] FIG. 3 is a drawing showing a first housing part of an electronic device according to one embodiment. In FIG. 3, for convenience of explanation, the rear plate (290) of the first housing part (210) is omitted.

[0071] Referring to FIG. 3, according to one embodiment, a first housing part (210) of an electronic device (201) may include a first printed circuit board (PCB) (301) (e.g., a printed circuit board (250)), a second PCB (302), a battery (355) (e.g., a battery (255)), a first flexible PCB (FPCB) (310), a second FPCB (320), and a third FPCB (330).

[0072] In one embodiment, the first PCB (301) and the second PCB (302) may be disposed on the first bracket (270) of the first housing part (210). For example, the first PCB (301) and the second PCB (302) may be disposed on the first side of the first bracket (270). The first side of the first bracket (270) may be a side facing the direction of the rear plate (290) (e.g., the -z direction). The first PCB (301) and the second PCB (302) may be spaced apart from each other. The first PCB (301) may be adjacent to the top of the first sidewall (213) (e.g., the portion of the first sidewall (213) facing the +y direction), and the second PCB (302) may be adjacent to the bottom of the first sidewall (213) (e.g., the portion of the first sidewall (213) facing the -y direction).

[0073] In one embodiment, the battery (355) may be disposed on the first bracket (270) of the first housing part (210). For example, the battery (355) may be disposed on the first surface of the first bracket (270). The battery (355) may be positioned between the first PCB (301) and the second PCB (302). In one embodiment, the first bracket (270) may include a bottom portion on which the first PCB (301), the second PCB (302), and the battery (355) are mounted, and one or more walls (e.g., walls (571, 572, and 573) of FIG. 5) extending vertically from the bottom portion. The one or more walls of the first bracket (270) may be positioned around the battery (355). For example, one or more of the walls of the first bracket (270) may at least partially face or surround a side of the battery (355).

[0074] In one embodiment, the first FPCB (310) can electrically connect the first PCB (301) and the second PCB (302). The first FPCB (310) can transmit various signals (e.g., a power signal, a data signal, and a clock signal) to the first PCB (301) and / or the second PCB (302).

[0075] In one embodiment, the first end portion (311) of the first FPCB (310) may be coupled to the first PCB (301). For example, the first end portion (311) of the first FPCB (310) may be coupled to the first surface of the first PCB (301). For example, the first surface of the first PCB (301) may be a surface facing the direction of the rear plate (290) (e.g., the -z direction).

[0076] In one embodiment, the second end (312) of the first FPCB (310) may be coupled to the second PCB (302). For example, the second end (312) of the second FPCB (310) may be coupled to a first surface of the second PCB (302). The first surface of the second PCB (302) may be a surface facing the direction of the back plate (290) (e.g., the -z direction).

[0077] In one embodiment, a connector configured to be coupled to an external device or an external connector may be arranged at the third end (313) of the first FPCB (310). The connector of the third end (313) may be exposed to the outside of the first side wall (213) to accommodate the external device or the external connector. For example, the connector of the third end (313) may be exposed to the outside through an opening formed in the first side wall (213). For example, the connector of the third end (313) may be configured to accommodate an external connector through the opening of the first side wall (213). The connector of the third end (313) may include, but is not limited to, a USB connector, for example.

[0078] In one embodiment, the first FPCB (310) may include a connecting portion (314) extending from a portion of the first end portion (311) to a second end portion (312) and extending from another portion of the first end portion (311) to a third end portion (313). The second end portion (312) and the third end portion (313) may branch from the end of the connecting portion (314) so ​​as to be spaced apart from each other.

[0079] In one embodiment, the second FPCB (320) may extend from the first surface of the first PCB (301) across the first FPCB (310) and the third FPCB (330). For example, the first end portion (321) of the second FPCB (320) may be coupled to the first surface of the first PCB (301). For example, the second end portion (322) of the second FPCB (320) may be adjacent to the inner surface of the first side wall (213). For example, the connecting portion (323) extending from the first end portion (321) of the second FPCB (320) to the second end portion (322) may extend across the first FPCB (310) and the third FPCB (330). In one embodiment, a key button may be disposed on the second end (322) of the second FPCB (320) and exposed through an opening formed in the first side wall (213). The key button may be configured to receive a user input.

[0080] In one embodiment, the third FPCB (330) may extend from the first surface of the first PCB (301) to the first surface of the second PCB (302). For example, a first end portion (331) of the third FPCB (330) may be coupled to the first surface of the first PCB (301), and a second end portion (332) of the third FPCB (330) may be coupled to the first surface of the second PCB (302). The third FPCB (330) may be configured to transmit, for example, a radio frequency (RF) signal. In this regard, the third FPCB (330) may be referred to as a flexible RF cable (FRC).

[0081] FIG. 4 is a cross-sectional view of a first housing part of an electronic device according to one embodiment. FIG. 4 may be a cross-section taken along line A-A' of FIG. 3.

[0082] Fig. 5 is a drawing showing the noise propagation path of the first housing part through FPCBs.

[0083] Referring to FIG. 4, in one embodiment, the first PCB (301) may include a first connector (306) and a second connector (307) disposed on the first surface. For example, the first connector (306) and the second connector (307) may be mounted on the first surface of the first PCB (301).

[0084] In one embodiment, a first end portion (311) of a first FPCB (310) may include a substrate (315), a connector (316) (e.g., a plug) disposed on a first side of the substrate (315) facing the direction of the first PCB (301) (e.g., the +z direction) and coupled to a first connector (306) (e.g., a receptacle) of the first PCB (301), and a non-conductive plate (318) disposed on a second side of the substrate (315) opposite the first side. For example, the connector (316) may be mounted on the first side of the substrate (315). For example, the non-conductive plate (318) may be disposed on a portion of the second side of the substrate (315) corresponding to a portion of the first side of the substrate (315) on which the connector (316) is mounted. The non-conductive plate (318) may be attached to, for example, a portion of the second surface of the substrate (315). The substrate (315) of the first end portion (311) of the first FPCB (310) may extend to the second end portion (312) and the third end portion (313) of the first FPCB (310). In one embodiment, the non-conductive plate (318) may be referred to as a non-conductive stiffener. The non-conductive plate (318) may be formed of, for example, a non-conductive plastic such as polycarbonate (PC).

[0085] In one embodiment, the substrate (315) of the first FPCB (310) may include one or more dielectric layers (or one or more non-conductive layers), and the first FPCB (310) may include one or more conductive regions or one or more conductive traces formed on and / or within the one or more dielectric layers. The one or more conductive regions or the one or more conductive traces may be formed of, for example, a conductive material (e.g., a metal such as copper).

[0086] In one embodiment, the first end portion (321) of the second FPCB (320) may include a connector (327) coupled to the second connector (307) of the first PCB (301). The connection portion (323) of the second FPCB (320) may extend across the non-conductive plate (318) of the first FPCB (310). For example, the connection portion (323) of the second FPCB (320) may at least partially overlap (e.g., in the z-axis direction) with the non-conductive plate (318) of the first FPCB (310). For example, the connection portion (323) of the second FPCB (320) may be in contact with the non-conductive plate (318) of the first FPCB (310).

[0087] Referring to FIG. 5, according to one embodiment, the first side wall (213) of the first housing part (210) may include one or more conductive portions. For example, the first side wall (213) of the first housing part (210) may include a first conductive portion (511) having both open ends and a second conductive portion (512) having both open ends. For example, the first side wall (213) of the first housing part (210) may include a third conductive portion (513) spaced apart from one end of the first conductive portion (511) and a fourth conductive portion (514) extending from the third conductive portion (513) in the direction of the second conductive portion (512) (e.g., +y direction) and spaced apart from one end of the second conductive portion (512). The third conductive portion (513) may be adjacent to the second end portion (322) of the second FPCB (320). A key button (e.g., a key button (660) of FIG. 6A) exposed through the third conductive portion (513) may be disposed on the second end portion (322) of the second FPCB (320). Although not shown, the electronic device (201) according to one embodiment may include another FPCB extending from the first PCB (301) toward the fourth conductive portion (514). Another key button (e.g., a volume key button) exposed through the fourth conductive portion (514) may be disposed on the other FPCB.

[0088] In one embodiment, a non-conductive material (e.g., a plastic such as a molded element) may be disposed between the one end of the first conductive portion (511) and the third conductive portion (513). A non-conductive material (e.g., a plastic such as a molded element) may be disposed between the one end of the second conductive portion (512) and the fourth conductive portion (514). The first side wall (213) of the first housing part (210) may be referred to as a lateral structure or a conductive lateral structure in that it includes one or more conductive portions.

[0089] In one embodiment, the first conductive portion (511) of the first side wall (213) may function as an antenna radiator of the electronic device (201). For example, the first conductive portion (511) may function as an inverted F antenna (IFA) type or a planar IFA (PIFA) type antenna, which is powered at a first point (F1) and grounded at a second point (G1). For example, a wireless communication circuit (e.g., a wireless communication module (192)) of the electronic device (201) may transmit and / or receive an RF signal of a designated frequency band using the first conductive portion (511). For example, the designated band may include, but is not limited to, a low band (e.g., a frequency band of 1 MHz or less).

[0090] In one embodiment, the second conductive portion (512) of the first side wall (213) can function as an antenna radiator of the electronic device (201). For example, the second conductive portion (512) can function as an IFA type or PIFA type antenna that is powered at a first point (F2) and grounded at a second point (G2). For example, the wireless communication circuit of the electronic device (201) can transmit and / or receive an RF signal of the designated band using the second conductive portion (512). With reference to the illustration in FIG. 5, the first conductive portion (511) located at the lower left of the first housing part (210) can function as a main antenna for the designated frequency band, and the second conductive portion (512) located at the upper left of the first housing part (210) can function as a sub-antenna for the designated frequency band, but is not limited thereto.

[0091] In one embodiment, the first bracket (270) of the first housing part (210) may include a first wall (571) facing a lower edge (e.g., an edge in the -y direction) of the battery (355), a second wall (572) opposite the first wall (571) and facing a upper edge (e.g., an edge in the +y direction) of the battery (355), and a third wall (573) extending from an end of the first wall (571) to an end of the second wall (572). In one embodiment, the walls (571, 572, and 573) of the first bracket (270) may be formed integrally.

[0092] In one embodiment, the non-conductive plate (318) may be formed of a non-conductive material rather than a conductive material such as stainless steel, thereby reducing the weight of the electronic device (201). However, the non-conductive plate (318) may have difficulty shielding noise caused from and / or to the connector (316) of the first FPCB (310).

[0093] For example, referring to FIG. 5, a noise source generated from a first FPCB (310) may be transmitted along a second FPCB (320), such as a path (P1), and may be induced into a first side wall (213) coupled to a second end (322) of the second FPCB (320). The noise induced into the first side wall (213) may be transmitted along a third conductive portion (513), such as a path (P2), and may be induced into a first conductive portion (511) coupled to the third conductive portion (513). Accordingly, the performance of an antenna using the first conductive portion (511) may be degraded. Additionally, noise induced by the first side wall (213) may be transmitted along the fourth conductive portion (514), such as path (P3), and may be induced in the second conductive portion (512) coupled to the fourth conductive portion (514). Accordingly, the performance of the antenna using the second conductive portion (512) may be degraded.

[0094] The third conductive portion (513) and / or the fourth conductive portion (514) may function as an antenna radiator that operates through transmitted noise. For example, an opening may be formed in the first bracket (270) at a position adjacent to the third conductive portion (513) and / or the fourth conductive portion (514) for arranging a component of the electronic device (201) (e.g., a volume key button or a magnet). Due to this opening, the third conductive portion (513) and / or the fourth conductive portion (514) may operate as a monopole type, dipole type, IFA type, or PIFA type antenna that uses noise as a source. Accordingly, performance degradation of the antenna due to noise may be aggravated.

[0095] In addition, the noise source by the first FPCB (310) can be induced to the third FPCB (330) through the second FPCB (320). The noise induced to the third FPCB (330) can be induced to the second PCB (302), as in the path (P4). In addition, the noise source by the first FPCB (310) can be induced to the second PCB (302) through the first FPCB (310), as in the path (P5). In addition, the noise source by the first FPCB (310) can be induced to the second PCB (302) through the second wall (572), the third wall (573), and the first wall (571), as in the path (P6). Since various circuits for the function of the antenna of the first conductive portion (511) are arranged on the second PCB (302), noise induced on the second PCB (302) may deteriorate the performance of the antenna using the first conductive portion (511).

[0096] Hereinafter, embodiments for reducing or preventing degradation of antenna performance by shielding the above-described noise are described.

[0097] FIG. 6A illustrates FPCBs according to one embodiment. FIG. 6B is a cross-sectional view illustrating FPCBs according to one embodiment.

[0098] Referring to FIG. 6A, according to one embodiment, a second FPCB (320) may include a first end portion (321), a second end portion (322), and a connecting portion (323) extending from the first end portion (321) to the second end portion (322). According to one embodiment, an electronic device (201) may include a key button (660) disposed on the second end portion (322) of the second FPCB (320). The second FPCB (320) on which the key button (660) is mounted may be referred to as a key FPCB or a key button assembly.

[0099] In one embodiment, the connecting portion (323) of the second FPCB (320) may cross the non-conductive plate (318) of the first FPCB (310) and the third FPCB (330). For example, referring to FIG. 6B, the connecting portion (323) of the second FPCB (320) may include a first face (323A) facing the direction of the non-conductive plate (318) of the first FPCB (310) (e.g., +z direction) and a second face (323B) opposite to the first face (323A) and facing the direction of the third FPCB (330) (e.g., -z direction).

[0100] Referring to FIGS. 6A and 6B, according to one embodiment, the second FPCB (320) may include a first electromagnetic interference (EMI) shielding layer (626) facing the non-conductive plate (318) of the first FPCB (310). The first EMI shielding layer (626) may form at least a portion of a first surface (323A) of a connection portion (323) of the second FPCB (320). The first EMI shielding layer (626) may overlap the non-conductive plate (318) of the first FPCB (310) with respect to a vertical direction (e.g., a z-axis direction). The first EMI shielding layer (626) may be in contact with the non-conductive plate (318) of the first FPCB (310). In one embodiment, the first EMI shielding layer (626) may overlap the third FPCB (330) in a vertical direction (e.g., z-axis direction). The first EMI shielding layer (626) may reduce or prevent noise (e.g., noise of the path (P1)) induced from the first FPCB (310) to the second FPCB (320). Accordingly, degradation of the antenna performance of the electronic device (201) due to noise induced from the first FPCB (310) may be reduced or prevented.

[0101] According to one embodiment, the second FPCB (320) may include a second EMI shielding layer (627) facing the direction (e.g., -z direction) of the third FPCB (330). The second EMI shielding layer (627) may form at least a portion of the second surface (323B) of the connection portion (323) of the second FPCB (320). In one embodiment, the second EMI shielding layer (627) may overlap the third FPCB (330) with respect to the vertical direction (e.g., z-axis direction). The second EMI shielding layer (627) may overlap the spacer (681) of the third FPCB (330) with respect to the vertical direction (e.g., z-axis direction). The second EMI shielding layer (627) may be formed integrally with the first EMI shielding layer (626), but is not limited thereto. The first EMI shielding layer (626) and the second EMI shielding layer (627) may include, but are not limited to, a tape configured to shield EMI.

[0102] In one embodiment, the second EMI shielding layer (627) can reduce or prevent noise (e.g., noise of path (P4)) induced from the first FPCB (310) to the third FPCB (330) via the second FPCB (320). Accordingly, degradation of antenna performance of the electronic device (201) due to noise caused by the first FPCB (310) can be reduced or prevented.

[0103] According to one embodiment, the electronic device (201) may include a spacer (681) disposed between a connection portion (323) of the second FPCB (320) and a third FPCB (330). The spacer (681) may space the second FPCB (320) and the third FPCB (330). For example, a gap (g) between the second FPCB (320) and the third FPCB (330), which are spaced apart through the spacer (681), may be about 0.05 mm or more. For example, a gap (g) between the second FPCB (320) and the third FPCB (330), which are spaced apart through the spacer (681), may be about 0.1 mm or more. The spacer (681) may include, for example, a non-conductive tape attached to the second FPCB (320) or the third FPCB (330). The spacer (681) may be referred to as a non-conductive layer.

[0104] In one embodiment, noise (e.g., noise of path (P4)) induced from the second FPCB (320) to the third FPCB (330) can be reduced or prevented through a gap (g) between the second FPCB (320) and the third FPCB (330) provided through the spacer (681).

[0105] Although not shown, the electronic device (201) according to one embodiment may further include a spacer disposed between the non-conductive plate (318) of the first FPCB (310) and the second FPCB (320). Although not shown, the electronic device (201) according to one embodiment may further include a spacer disposed between the second FPCB (320) and the first bracket (270) of the first housing part (210).

[0106] Fig. 7 is a cross-sectional view of a first housing part of an electronic device according to one embodiment. Fig. 7 may be a cross-section taken along line B-B' of Fig. 3.

[0107] Referring to FIG. 7, according to one embodiment, the second end (312) of the first FPCB (310) may extend across the first wall (571) of the first bracket (270).

[0108] An electronic device (201) according to one embodiment may include a spacer (782) attached to a back surface (e.g., a surface facing the +z direction) of a second end portion (312) of a first FPCB (310). The spacer (782) may be attached, for example, to a back surface of a curved section of the second end portion (312) of the first FPCB (310). The spacer (782) may include a portion positioned between the second end portion (312) of the first FPCB (310) and a first wall (571) of the first bracket (270). Accordingly, the second end (312) of the first FPCB (310) can be prevented from contacting the first wall (571) of the first bracket (270), and noise (e.g., noise of the path (P6)) induced from the first bracket (270) to the first FPCB (310) can be reduced or prevented. In one embodiment, the spacer (782) may further include another portion interposed between the second end (312) of the first FPCB (310) and the battery (355). The thickness (t1) of the spacer (782) may be, for example, about 0.1 mm, but is not limited thereto. The spacer (782) may include, for example, a non-conductive tape. The spacer (782) may include, for example, a cushion such as a sponge. The spacer (782) may be referred to as a non-conductive layer or an elastic layer.

[0109] Fig. 8 is a cross-sectional view of a first housing part of an electronic device according to one embodiment. Fig. 8 may be a cross-section taken along line C-C' of Fig. 3.

[0110] Referring to FIG. 8, according to one embodiment, the third end (313) of the first FPCB (310) may extend across the first wall (571) of the first bracket (270).

[0111] An electronic device (201) according to one embodiment may include a spacer (883) attached to a back surface (e.g., a surface facing the +z direction) of a third end portion (313) of a first FPCB (310). The spacer (883) may be attached, for example, to a back surface of a bent section of the third end portion (313) of the first FPCB (310). The spacer (883) may include a portion positioned between the third end portion (313) of the first FPCB (310) and a first wall (571) of the first bracket (270). Accordingly, the third end (313) of the first FPCB (310) can be prevented from contacting the first wall (571) of the first bracket (270), and noise (e.g., noise of the path (P6)) induced from the first bracket (270) to the first FPCB (310) can be reduced or prevented. In one embodiment, the spacer (883) may further include another portion interposed between the third end (313) of the first FPCB (310) and the battery (355). The thickness (t2) of the spacer (883) may be, for example, about 0.1 mm, but is not limited thereto. The spacer (883) may include, for example, a non-conductive tape. The spacer (883) may include, for example, a cushion such as a sponge. The spacer (883) may be referred to as a non-conductive layer or an elastic layer.

[0112] Figure 9 illustrates a first PCB according to one embodiment.

[0113] Referring to FIG. 9, according to one embodiment, a first PCB (301) may include one or more first conductive regions (990) and one or more second conductive regions (995) spaced apart from the one or more first conductive regions (990). The one or more first conductive regions (990) and the one or more second conductive regions (995) may be formed of a conductive material, such as copper.

[0114] In one embodiment, the second connector (307) may be disposed on the first PCB (301). For example, the second connector (307) to which the second FPCB (320) (e.g., connector (327)) is coupled may be mounted on one or more first conductive areas (990) of the first PCB (301). For example, the second connector (307) may be soldered to one or more first conductive areas (990) of the first PCB (301).

[0115] In one embodiment, the second FPCB (320) may be electrically connected to one or more first conductive regions (990) via the second connector (307). For example, the second FPCB (320) may include one or more conductive traces (or one or more conductive regions) configured to function as ground lines (or ground regions). For example, the one or more conductive traces of the second FPCB (320) may be electrically connected to one or more first conductive regions (990) via the second connector (307) of the first PCB (301). For example, one or more conductive traces of the second FPCB (320) may be electrically connected to one or more first conductive areas (990) via one or more ground pins of the connector (327) of the second FPCB (320) and the second connector (307) of the first PCB (301).

[0116] According to one embodiment, the electronic device (201) may include at least one element (997) disposed on a first PCB (301). For example, the at least one element (997) may be surface-mounted on the first PCB (301).

[0117] In one embodiment, at least one element (997) can electrically connect one or more first conductive regions (990) and one or more second conductive regions (995) of the first PCB (301).

[0118] In one embodiment, at least one element (or circuit) (997) can be configured to, for example, block an RF signal. For example, at least one element (997) can be configured to block an RF signal and pass a frequency component of a direct current signal or a digital domain. For example, at least one element (997) can include an inductor. For example, the inductor can have an inductance of, but not limited to, about 50 nH to about 100 nH.

[0119] In one embodiment, the second FPCB (320) may be electrically connected to one or more first conductive regions (990) of the first PCB (301) and one or more second conductive regions (995) of the first PCB (301) via at least one element (997). For example, the one or more conductive traces of the second FPCB (320), which are electrically connected to one or more first conductive regions (990) of the first PCB (301), may be electrically connected to one or more second conductive regions (995) of the first PCB (301) via at least one element (997). In one embodiment, the one or more first conductive regions (990) and the one or more second conductive regions (995) of the first PCB (301) may be configured as a ground region of the first PCB (301). Accordingly, noise of a specific frequency component (e.g., noise of paths (P1, P2, and P3)) that may be induced from the second FPCB (320) to the first conductive portion (511) and the second conductive portion (512) can be blocked, and deterioration of the antenna performance of the electronic device (201) due to such noise can be reduced or prevented.

[0120] Alternatively or additionally to at least one element (997), according to one embodiment, the electronic device (201) may include at least one other element disposed on the second FPCB (320). For example, the at least one other element may be mounted on the second end (322) of the second FPCB (320).

[0121] The at least one other element may be configured to block RF signals. For example, the at least one other element may be configured to block RF signals and pass frequency components of a direct current signal or a digital domain. For example, the at least one other element may include an inductor. For example, the inductor of the at least one other element may have an inductance of, but is not limited to, about 50 nH to about 100 nH.

[0122] In one embodiment, the second FPCB (320) may include one or more other conductive traces (or other conductive regions) spaced apart from the one or more conductive traces (or the one or more conductive regions). The one or more other conductive traces (or other conductive regions) of the second FPCB (320) may be configured to function as a ground line (or ground region) of the second FPCB (320).

[0123] In one embodiment, the one or more conductive traces (or the one or more conductive regions) of the second FPCB (320) and the one or more other conductive traces (or the one or more other conductive regions) of the second FPCB (320) may be electrically connected via the at least one other element. The one or more other conductive traces (or the one or more other conductive regions) of the second FPCB (320) may be located closer to the first sidewall (213) of the first housing part (210) than the one or more conductive traces (or the one or more conductive regions). Accordingly, noise of a specific frequency component (e.g., noise of paths (P1, P2, and P3)) that may be induced from the second FPCB (320) to the first conductive portion (511) and the second conductive portion (512) of the first side wall (213) can be blocked, and deterioration of the antenna performance of the electronic device (201) due to such noise can be reduced or prevented.

[0124] The antenna performance of an electronic device (201) including at least one element (997) or at least one other element is described below with reference to FIGS. 11A and 11B.

[0125] Table 1 below shows antenna performance according to various conditions. Table 1 below shows the received power (PRX) (dBm) according to the frequency band of the antenna using the first side wall (213) of the first housing part (210) (e.g., the first conductive part (511) and / or the second conductive part (512)) when the electronic device (201) is folded.

[0126]

[0127] In the above Table 1, the first frequency band is, for example, 3GPP (3 rdThe second frequency band may be, for example, the B12 band (e.g., 729 MHz to 746 MHz) defined by 3GPP. The third frequency band may be, for example, the B13 band (e.g., 746 MHz to 756 MHz) defined by 3GPP. The fourth frequency band may be, for example, the B14 band (e.g., 758 MHz to 768 MHz) defined by 3GPP.

[0128] A fifth example shows the performance of an antenna according to a frequency band of an electronic device (201) according to one embodiment.

[0129] In the first example, the second FPCB (320) and the third FPCB (330) may be in contact without a spacer (681), and the second FPCB (320) may be in contact with the non-conductive plate (318) of the first FPCB (310) without EMI shielding layers (626 and / or 627). Comparing the fifth example with the first example, the second FPCB (320) and the third FPCB (330) are in close contact, and the second FPCB (320) may be in contact with the non-conductive plate (318) of the first FPCB (310) without an EMI shielding layer, which may deteriorate the performance of the antenna.

[0130] The second example shows the antenna performance when the non-conductive plates (318) of the second FPCB (320) and the first FPCB (310) are spaced apart from each other, and the second FPCB (320) and the third FPCB (330) are spaced apart from each other, compared to the first example. The antenna performance of the second example can be significantly improved compared to the first example, and can be equivalent to or similar to the fifth example. This may mean that the noise induced from the first FPCB (310) has a significant impact on the antenna performance. However, as in the second example, sufficiently separating the second FPCB (320) from the first FPCB (310) can reduce the deterioration of antenna performance due to noise, but there may be limitations depending on the thickness of the electronic device (201).

[0131] The third example, in contrast to the first example, shows the antenna performance in a state where the non-conductive plates (318) of the second FPCB (320) and the first FPCB (310) are vertically spaced apart, and the second FPCB (320) and the third FPCB (330) are in contact. The antenna performance of the third example may be worse than the antenna performances of the first and second examples, which may mean that a noise transmission path (e.g., path (4)) is formed through the second FPCB (320) and the third FPCB (330) that are in contact with each other. The antenna performance of the third example may be worse than the antenna performance of the fifth example.

[0132] The fourth example, in contrast to the third example, illustrates antenna performance when the second FPCB (320) includes an EMI shielding layer (627 and / or 628). The antenna performance of the fourth example may be lower than that of the third example, which may mean that noise may be transmitted even if the second FPCB (320) includes an EMI shielding layer (627 and / or 628) if there is no physical separation distance from the third FPCB (330). The antenna performance of the fourth example may be lower than that of the fifth example.

[0133] Fig. 10a is a graph showing the antenna performance of an electronic device. Fig. 10b is a diagram showing the electric field distribution of an electronic device.

[0134] The graph of FIG. 10a shows, for example, the S parameters of the RF port set in the fourth conductive portion (514) of FIG. 5 and the RF port set in the second conductive portion (512).

[0135] The graph (1001a) of FIG. 10A may represent the S parameter of the first electronic device according to a comparative example. Referring to FIG. 5, the first electronic device may include, for example, a second FPCB (320) and the other FPCB. The other FPCB of the first electronic device may extend, for example, from the first PCB (301) to the periphery of the fourth conductive portion (514) of the first side wall (213). At an end of the other FPCB of the first electronic device, the other key button (e.g., a volume key button) may be arranged. The other key button may be exposed through the fourth conductive portion (514) of the first side wall (213). By supplying power to the fourth conductive portion (514) through the other FPCB, the fourth conductive portion (514) may function as an antenna radiator.

[0136] The graph (1002a) of FIG. 10a may represent the S parameter of a second electronic device according to a comparative example. The second electronic device may include only the second FPCB (320) and may not include the other FPCB, compared to the first electronic device.

[0137] The graph (1003a) of FIG. 10a may represent the S parameter of a third electronic device according to a comparative example. The third electronic device may not include both the second FPCB (320) and the other FPCB, compared to the first electronic device.

[0138] Referring to the graph (1001a) of FIG. 10a, as confirmed by the parasitic frequency (f1) at about 852 MHz, very high interference may be formed between the second conductive portion (512) and the fourth conductive portion (514) of the first electronic device.

[0139] Reference numeral (1001b) of Fig. 10b indicates the electric field distribution of the first electronic device at approximately 852 MHz. Referring to reference numeral (1001b) of Fig. 10b, as indicated by the arrow, a high parasitic component distribution may be formed in the second FPCB (320).

[0140] Referring to the graph (1002a) of FIG. 10a, as confirmed by the parasitic frequency (f2) of about 863 MHz, very high interference may be formed between the second conductive portion (512) and the fourth conductive portion (514) of the second electronic device even though the second electronic device does not include the other FPCB.

[0141] Reference numeral (1002b) of FIG. 10b illustrates the electric field distribution of the second electronic device at approximately 863 MHz. Referring to reference numeral (1002b) of FIG. 10b, as indicated by the arrow, even though the other FPCB is omitted, a high parasitic component distribution can still be formed in the second FPCB (320).

[0142] Referring to the graph (1003a) of Fig. 10a, a parasitic frequency may not be formed.

[0143] That is, when the second FPCB (320) is included, parasitic frequencies (f1, f2) are formed, and when the second FPCB (320) is not included, parasitic frequencies may not be formed. This may be because the interference between the second conductive portion (512) and the fourth conductive portion (514) is dominated by the influence of noise induced by the first FPCB.

[0144] According to one embodiment, the electronic device (201) can reduce or prevent performance degradation of the antenna by reducing noise that may be transmitted by the second FPCB (320) through the EMI shielding layers (626 and / or 627), the spacer (681), the at least one element (997) and the at least one other element of the second FPCB (320).

[0145] FIG. 11a is a graph showing the antenna performance of an electronic device according to an embodiment. FIG. 11b is a diagram showing the electric field distribution of an electronic device according to an embodiment.

[0146] The graphs in FIG. 11a represent, for example, the S parameter between the RF port set in the fourth conductive portion (514) of FIG. 5 and the RF port set in the second conductive portion (512).

[0147] The graph (1101a) of FIG. 11a and the reference numeral (1101b) of FIG. 11b illustrate the S parameter and electric field distribution of an electronic device (201) including at least one element (997) according to one embodiment.

[0148] The graph (1102a) of FIG. 11a and the reference numeral (1102b) of FIG. 11b illustrate the S parameter and electric field distribution of an electronic device (201) including at least one other element according to one embodiment.

[0149] Referring to FIGS. 11A and 11B, according to one embodiment, the frequency of parasitic components between antennas of the electronic device (201) (e.g., frequencies (f1 and f2) of FIG. 10A) can be removed through at least one element (997) or the at least one other element.

[0150] According to one embodiment, an electronic device (201) may include a conductive side structure (213), a first printed circuit board (PCB) (301), a first flexible PCB (FPCB) (310), a second FPCB (320), and a key button (660). The conductive side structure (213) may define a portion of an exterior of the electronic device (201), may be configured to function at least partially as an antenna of the electronic device (201), and may have an opening. The first FPCB (310) may include a substrate (315) having a first side and a second side opposite the first side, a connector (316) mounted on the first side of the substrate (315) and coupled to the first PCB (301), and a non-conductive stiffener (318) disposed on a portion of the second side of the substrate (315) opposite the connector (316). The key button (660) may be disposed on the second FPCB (320) and at least partially accommodated within the opening of the conductive side structure (213) to define another portion of the exterior of the electronic device (201). The second FPCB (320) may include an electromagnetic interference (EMI) shielding layer (626). At least a portion of the EMI shielding layer (626) of the second FPCB (320) may overlap the non-conductive stiffener (318) of the first FPCB (310).

[0151] In one embodiment, the electronic device (201) may include a third FPCB (330) coupled to the first PCB (301) and crossing the second FPCB (320). The second FPCB (320) may include another EMI shielding layer (627) facing the third FPCB (330).

[0152] In one embodiment, the EMI shielding layer (626) and the other EMI shielding layer (627) may be formed integrally.

[0153] In one embodiment, the electronic device (201) may include a spacer (681) disposed between the second FPCB (320) and the third FPCB (330).

[0154] In one embodiment, the spacer (681) may include a non-conductive tape.

[0155] In one embodiment, the third FPCB (330) may be configured to transmit a radio frequency (RF) signal.

[0156] In one embodiment, the electronic device (201) may include a bracket (270) including a second PCB (302) and a bottom portion on which the second PCB (302) is mounted and a wall (571) extending from the bottom portion. The first FPCB (310) may include a portion (312) extending from the connector (316) across the wall (571) to a first surface of the second PCB (302).

[0157] In one embodiment, the electronic device (201) may include another spacer (782) disposed between the portion (312) of the first FPCB (310) and the wall (571).

[0158] In one embodiment, the electronic device (201) may include a battery (355). The wall (571) may be positioned between the battery (355) and the second PCB (302). A portion of the other spacer (782) may be positioned between the first FPCB (310) and the wall (571), and another portion of the other spacer (782) may be positioned between the first FPCB (310) and the battery (355).

[0159] In one embodiment, the other spacer (782) may include a non-conductive tape or sponge attached to the first FPCB (310).

[0160] In one embodiment, the wall (571) may be a first wall (571) adjacent to the bottom of the battery (355). The bracket (270) may include a second wall (572) adjacent to the top of the battery (355) and a third wall (573) extending from an end of the first wall (571) to an end of the second wall (572) along the periphery of the battery (355).

[0161] In one embodiment, the second FPCB (320) may include a first portion (321) having a connector (327) coupled to the first PCB (301), a second portion (323) extending from the first portion (321) across the non-conductive stiffener (318), and a third portion (322) extending from the second portion (323). The key button (660) may be disposed on the third portion (322) of the second FPCB (320).

[0162] In one embodiment, the electronic device (201) may include another connector disposed on the first FPCB (310). The conductive side structure (213) may include another opening. The other connector may be configured to receive an external connector through the other opening of the conductive side structure.

[0163] In one embodiment, the electronic device (201) may include at least one element (997) mounted on the first PCB (301) and configured to block RF signals. The second FPCB (320) may be electrically connected to the ground of the first PCB (301) through the at least one element (997).

[0164] In one embodiment, the electronic device (201) may include at least one other element mounted on the second FPCB (320) and configured to block RF signals. The second FPCB (320) may include a first conductive region and a second conductive region. The first conductive region may be configured to function as a ground. The second conductive region may be configured to function as a ground, be spaced apart from the first conductive region, and be electrically connected to the first conductive region via the at least one other element.

[0165] According to one embodiment, an electronic device (201) may include a first printed circuit board (PCB) (301), a first flexible PCB (FPCB) (310), a second FPCB (320), and a third FPCB (330). The first FPCB (310) may include a substrate (315), a connector (316) disposed on a first surface of the substrate (315) and coupled to the first PCB (301), and a non-conductive stiffener (318) disposed on a second surface of the substrate (315) so as to overlap the connector (316). The second FPCB (320) may extend from the first PCB (301) across the non-conductive stiffener (318) of the first FPCB (310). The third FPCB (330) may extend across the second FPCB (320) from the first PCB (301). The electronic device (201) may include a non-conductive layer (681) disposed between the second FPCB (320) and the third FPCB (330) to separate the second FPCB (320) and the third FPCB (330). The second FPCB (320) may include an electromagnetic interference (EMI) shielding layer (626) facing the non-conductive stiffener (318) of the first FPCB (310).

[0166] In one embodiment, the EMI shielding layer (626) may partially form a first surface of the second FPCB (320). The second FPCB (320) may include another EMI shielding layer (627) forming a second surface opposite to the first surface. The non-conductive layer (681) may be disposed between the other EMI shielding layer (627) of the second FPCB (320) and the third FPCB (330).

[0167] In one embodiment, the electronic device (201) may include at least one element (997) disposed on the first PCB (301) and configured to block an RF signal. The second FPCB (320) may include at least one conductive trace electrically connected to a ground of the first PCB (301) through the at least one element (997).

[0168] In one embodiment, the electronic device (201) may include a conductive side structure (213) that forms a portion of an exterior of the electronic device (201) and functions at least partially as an antenna of the electronic device (201). The second FPCB (320) may include a first ground region and a second ground region. The second ground region may be spaced apart from the first ground region and closer to the conductive side structure (213) than the first ground region. The electronic device (201) may include at least one other element mounted on the second FPCB (320) and configured to block an RF signal. The second ground region of the second FPCB (320) may be electrically connected to the second ground region of the second FPCB (320) through the at least one other element.

[0169] In one embodiment, the electronic device (201) may include a second PCB (302) and a bracket (270) on which the first PCB (301) and the second PCB (302) are mounted. The bracket (270) may include a wall (571) between the first PCB (301) and the second PCB (302). The first FPCB (310) may include the connector (316) and the non-conductive stiffener (318). It may include a first end (311), a connecting portion (314) extending from the first end (311), a second end (312) extending across the wall (571) from a portion of the connecting portion (314) and including a connector (316) coupled to the second PCB (302), and a third end (313) spaced from the second end (312), extending across the wall (571) from another portion of the connecting portion (314), and including a connector (316) configured to receive an external terminal. The electronic device (201) may include a non-conductive layer (782) attached to the second end (312) of the first FPCB (310) so as to face the wall (571) and another non-conductive layer (883) attached to the third end (313) of the first FPCB (310) so as to face the wall (571).

[0170] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments disclosed in this document are not limited to the aforementioned devices.

[0171] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0172] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0173] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more commands stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one command among the one or more commands stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one command called. The one or more commands may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0174] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0175] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, A conductive side structure defining a portion of the exterior of the electronic device and configured to function at least partially as an antenna of the electronic device, the conductive side structure having an opening; a first printed circuit board (PCB); A first FPCB (flexible PCB), wherein the first FPCB: A substrate comprising a first side and a second side opposite to the first side; a connector mounted on the first surface of the above-described substrate and coupled to the first PCB; and A non-conductive stiffener disposed on a portion of the second surface of the substrate opposite to the connector; 2nd FPCB; and A key button disposed on the second FPCB and at least partially accommodated within the opening of the conductive side structure to define another portion of the exterior of the electronic device, The above second FPCB includes an EMI (electromagnetic interference) shielding layer, At least a portion of the EMI shielding layer of the second FPCB overlaps with the non-conductive stiffener of the first FPCB. Electronic devices.

2. In claim 1, A third FPCB is coupled to the first PCB and crosses the second FPCB, The second FPCB includes another EMI shielding layer facing the third FPCB. Electronic devices.

3. In claim 2, The above EMI shielding layer and the other EMI shielding layer are formed integrally, Electronic devices.

4. In claim 2 or claim 3, Including a spacer disposed between the second FPCB and the third FPCB, Electronic devices.

5. In claim 4, The above spacer comprises a non-conductive tape, Electronic devices.

6. In any one of claims 2 to 5, The third FPCB is configured to transmit an RF (radio frequency) signal. Electronic devices.

7. In any one of claims 1 to 6, 2nd PCB; and A bracket including a bottom portion on which the second PCB is mounted and a wall extending from the bottom portion; The first FPCB includes a portion extending from the connector across the wall to the first surface of the second PCB. Electronic devices.

8. In claim 7, Including another spacer disposed between the part of the first FPCB and the wall, Electronic devices.

9. In claim 8, Includes batteries, The wall is located between the battery and the second PCB, A part of said other spacer is positioned between said first FPCB and said wall, and another part of said other spacer is positioned between said first FPCB and said battery. Electronic devices.

10. In claim 8 or claim 9, The above other spacer comprises a non-conductive tape or sponge attached to the first FPCB. Electronic devices.

11. In claim 9 or claim 10, The above wall is a first wall adjacent to the bottom of the battery, The above brackets are, a second wall adjacent to the top of the battery; and comprising a third wall extending from an end of the first wall to an end of the second wall along the periphery of the battery; Electronic devices.

12. In any one of claims 1 to 11, The above second FPCB: A first part having a connector arranged on the first PCB; a second portion extending across the non-conductive stiffener from the first portion; and including a third portion extending from the second portion; The above key button is arranged on the third part of the second FPCB. Electronic devices.

13. In any one of claims 1 to 12, Including another connector arranged on the first FPCB, The above challenging side structure includes another opening, The other connector is configured to receive an external connector through the other opening of the conductive side structure. Electronic devices.

14. In any one of claims 1 to 13, At least one element mounted on the first PCB and configured to block RF signals, The second FPCB comprises, electrically connected to the ground of the first PCB through the at least one element, Electronic devices.

15. In any one of claims 1 to 14, At least one other element mounted on the second FPCB and configured to block RF signals, The above second FPCB: a first conductive region configured to function as a ground; and a second conductive region configured to function as a ground, spaced apart from said first conductive region, and electrically connected to said first conductive region via said at least one other element; Electronic devices.

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