Heat sink structure

Abstract

A heat sink structure is disclosed. The heat sink structure, according to one aspect of the present invention, may comprise: a base coupled to an external cooling target object to receive heat; a plurality of heat dissipation fins continuous with the base, having a height in a first direction and a length in a second direction, and spaced apart from each other along a third direction; and a plurality of flow spaces, each formed between the plurality of heat dissipation fins along the third direction, defined by being surrounded by the base and the heat dissipation fins, and communicating with the outside along the second direction, wherein the heat dissipation fin may include: a fin body having one side in the height direction continuous with the base and extending along the second direction; and a fin hollow formed through the inside of the fin body along the second direction to communicate with the outside.

Description

heat sink structure

[0001] The present invention relates to a heat sink structure, and more particularly, to a heat sink structure having a structure in which a heat exchange area is increased and heat exchange efficiency can be improved.

[0002] Power semiconductor devices, or power semiconductors, are incorporated into power devices and used to convert and control power. With the recent increase in power-driven devices, such as electric vehicles (EVs), demand for power semiconductor devices is also increasing.

[0003] Power semiconductor devices typically carry higher currents than conventional semiconductor devices. Consequently, they generate more heat during operation. If this heat is not properly dissipated, the power semiconductor device may be damaged, potentially compromising its functionality.

[0004] Therefore, it is common for power semiconductor devices to be equipped with a configuration for cooling the generated heat.

[0005] Typically, the larger the component used to cool heat (hereinafter referred to as a "cooling means"), the greater its cooling effect. However, if the size of the cooling means increases excessively, the space occupied within the device containing the power semiconductor devices also increases. This raises concerns about the difficulty in arranging the power semiconductor devices.

[0006] Therefore, a cooling means that improves the cooling efficiency of power semiconductor devices while not being excessively large is required.

[0007] Japanese Utility Model Publication No. 3244143 discloses a power conversion device. Specifically, the power conversion device is disclosed to include a heat dissipation unit capable of cooling semiconductor elements without a separate cooling liquid, including a compressor, air cooler, and cooling block.

[0008] However, the power conversion device disclosed in the above-mentioned prior art document requires additional components for compressing and cooling air for cooling. In other words, the above-mentioned prior art document does not provide a method for cooling semiconductor devices without a separate air treatment process for cooling.

[0009] Additionally, the power conversion device described in the above prior art requires a separate compressor and air cooler. Considering that compressors and air coolers are typically large in size, the above prior art does not provide a method for reducing the size of the components used to cool semiconductor devices included in the power conversion device.

[0010] Japanese Patent Document No. 7479580 discloses a power semiconductor device. Specifically, the device includes a heat sink layer coupled to a case with a plurality of fins arranged thereon. The prior document discloses that a separate uneven surface is formed on the base of the heat sink layer, thereby improving the cooling efficiency of the power semiconductor device.

[0011] However, the power semiconductor device disclosed in the above-mentioned prior art document does not provide a method for improving cooling efficiency by changing the structure of the fins provided in the heat sink layer. In other words, the power semiconductor device disclosed in the above-mentioned prior art document only provides a method for forming the unevenness formed on the base of the heat sink layer into various shapes.

[0012] Japanese Utility Model Publication No. 3244143 (October 4, 2023)

[0013] Japanese Patent Document No. 7479580 (April 25, 2024)

[0014] The present invention is intended to solve the above problems, and an object of the present invention is to provide a heat sink structure having a structure capable of improving cooling efficiency.

[0015] Another object of the present invention is to provide a heat sink structure having a structure capable of improving cooling efficiency without excessive increase in size.

[0016] Another object of the present invention is to provide a heat sink structure having a structure in which the contact area with a fluid introduced for cooling can be increased.

[0017] Another object of the present invention is to provide a heat sink structure having a structure in which a fluid introduced for cooling can flow smoothly.

[0018] Another object of the present invention is to provide a heat sink structure whose shape and arrangement can be diversified.

[0019] The tasks of the present invention are not limited to the tasks mentioned above, and other tasks not mentioned will be clearly understood by those skilled in the art to which the present invention pertains from the description below.

[0020] According to one aspect of the present invention, a heat sink structure is provided, comprising: a base coupled to an external cooling object to receive heat; a plurality of heat dissipation fins continuous with the base, having a height in a first direction and a length in a second direction, and spaced apart from each other along a third direction; and a plurality of flow spaces each formed between the plurality of heat dissipation fins along the third direction, defined by being surrounded by the base and the heat dissipation fins, and communicating with the outside along the second direction, wherein the heat dissipation fins include a fin body having one side in the height direction continuous with the base and extending along the second direction; and a fin hollow formed penetratingly inside the fin body, extending along the second direction, and communicating with the outside.

[0021] At this time, a heat sink structure may be provided in which the pin hollow is formed such that the height in the first direction is longer than the width in the third direction.

[0022] In addition, a heat sink structure may be provided in which the heat dissipation fin is positioned in the fin hollow to divide the fin hollow into a plurality of small spaces and includes a fin rib that is continuous with the inner surface of the fin body surrounding the fin hollow.

[0023] At this time, the fin rib is formed to have a height in the first direction, a length in the second direction, and a width in the third direction, and each end in the third direction is continuous with the inner surface of the fin body, and a heat sink structure can be provided.

[0024] In addition, a heat sink structure may be provided in which a plurality of the fin ribs are provided, the plurality of the fin ribs are spaced apart from each other along the first direction, and the plurality of the small spaces and the plurality of the fin ribs are alternately arranged along the first direction.

[0025] At this time, the base may be provided with a heat sink structure that extends along the second direction to the same length as the fin body.

[0026] In addition, a heat sink structure may be provided in which a portion of the external cooling fluid flows in the flow space along the second direction and exchanges heat with the outer surface of the base or the fin body, and the remainder of the external cooling fluid flows in the fin hollow along the second direction and exchanges heat with the inner surface of the fin body.

[0027] At this time, a heat sink structure may be provided in which a plurality of the pin cavities are formed, and the plurality of the pin cavities are formed to be spaced apart from each other along the first direction.

[0028] Additionally, a heat sink structure may be provided in which the heat dissipation fins include a plurality of fin ribs positioned between the plurality of fin hollows and surrounding the plurality of fin hollows along the first direction.

[0029] At this time, a heat sink structure may be provided in which the fin hollow is formed as a space having a circular cross-section and a length in the second direction, and the fin rib is formed to be rounded so as to be convex in a direction opposite to the fin hollow.

[0030] In addition, a heat sink structure may be provided in which a plurality of the heat dissipation fins extend along the second direction by a length shorter than the base, and the plurality of the heat dissipation fins are alternately arranged with the flow space along the second direction and the third direction.

[0031] At this time, a heat sink structure may be provided in which at least a portion of the cooling fluid that has passed through the plurality of heat dissipation fins spaced apart along the third direction flows into the plurality of flow spaces, and at least a portion of the cooling fluid that has passed through the plurality of flow spaces spaced apart along the third direction flows into the plurality of heat dissipation fins.

[0032] Additionally, a heat sink structure may be provided, including a fan that provides a transport force to an external cooling fluid; and a duct that is respectively coupled to the fan and the heat dissipation fins and forms a flow path through which the cooling fluid flows to the heat dissipation fins.

[0033] At this time, a heat sink structure may be provided in which the fan and the duct are each provided in multiple numbers and spaced apart from each other along the third direction, and the multiple ducts are each connected to the heat dissipation fins.

[0034] According to the above configuration, the heat sink structure according to the embodiment of the present invention can have improved cooling efficiency.

[0035] In addition, according to the above configuration, the heat sink structure according to the embodiment of the present invention can have improved cooling efficiency without excessive increase in size.

[0036] In addition, according to the above configuration, the heat sink structure according to the embodiment of the present invention can have an increased contact area with the fluid introduced for cooling.

[0037] In addition, according to the above configuration, the heat sink structure according to the embodiment of the present invention can allow the fluid introduced for cooling to flow smoothly.

[0038] In addition, according to the above configuration, the heat sink structure according to the embodiment of the present invention can have a variety of shapes and arrangements.

[0039] The effects of the present invention are not limited to the effects described above, and should be understood to include all effects that can be inferred from the detailed description of the present invention or the composition of the invention described in the claims.

[0040] FIG. 1 is a perspective view illustrating a heat sink structure according to one embodiment of the present invention.

[0041] Fig. 2 is an enlarged view of part A of the heat sink structure of Fig. 1.

[0042] FIG. 3 is a cross-sectional view taken along the AA axis showing the heat sink structure of FIG. 1.

[0043] Fig. 4 is an enlarged view of part B of the heat sink structure of Fig. 1.

[0044] Fig. 5 is a front view illustrating the heat sink structure of Fig. 1.

[0045] Fig. 6 is an enlarged view of part C showing the heat sink structure of Fig. 1.

[0046] Fig. 7 is an enlarged view of part C showing a modified example of the heat sink structure of Fig. 1.

[0047] Figure 8 is a plan view illustrating the process of introducing cooling fluid into the heat sink structure of Figure 1.

[0048] FIG. 9 is a side view illustrating a process in which cooling fluid is introduced into the heat sink structure of FIG. 1.

[0049] Fig. 10 is a BB cross-sectional view illustrating the flow of cooling fluid formed in the heat sink structure of Fig. 1.

[0050] FIG. 11 is an enlarged view of part D showing the flow of cooling fluid formed in the heat sink structure of FIG. 1.

[0051] FIG. 12 is an enlarged view of part D showing the flow of cooling fluid formed in a heat sink structure according to a modified example of the heat sink structure of FIG. 1.

[0052] FIG. 13 is a perspective view illustrating a heat sink structure according to another embodiment of the present invention.

[0053] Fig. 14 is an enlarged view of part E showing the heat sink structure of Fig. 13.

[0054] Fig. 15 is a front view illustrating the heat sink structure of Fig. 13.

[0055] Fig. 16 is an enlarged view of part F showing the heat sink structure of Fig. 13.

[0056] Fig. 17 is a CC cross-sectional view illustrating the heat sink structure of Fig. 13.

[0057] Fig. 18 is an enlarged view of part G showing the heat sink structure of Fig. 13.

[0058] Figure 19 is a DD cross-sectional view illustrating the flow of cooling fluid formed in the heat sink structure of Figure 13.

[0059] Fig. 20 is an enlarged view of part H showing the flow of cooling fluid formed in the heat sink structure of Fig. 13.

[0060] FIG. 21 is an enlarged view of a portion H illustrating the flow of cooling fluid formed in a heat sink structure according to a modified example of the heat sink structure of FIG. 13.

[0061] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings so that those skilled in the art can easily practice the present invention. The present invention may be implemented in various different forms and is not limited to the embodiments described herein. To clearly explain the present invention, parts irrelevant to the description are omitted in the drawings, and the same reference numerals designate identical or similar components throughout the specification.

[0062] The words and terms used in this specification and claims should not be construed as limited to their ordinary or dictionary meanings, but should be interpreted in a way that is consistent with the technical idea of ​​the present invention, in accordance with the principles by which the inventor can define terms and concepts in order to best explain his or her invention.

[0063] Therefore, the embodiments described in this specification and the configurations illustrated in the drawings correspond to a preferred embodiment of the present invention, and do not represent all of the technical ideas of the present invention, so there may be various equivalents and modified examples that can replace the configuration at the time of filing of the present invention.

[0064] In the following description, descriptions of some components may be omitted to clarify the features of the present invention.

[0065]

[0066] The term "fluid communication" as used herein refers to one or more elements being fluidly connected to one another. In one embodiment, the fluid communication may be formed by elements such as conduits, pipes, or piping. In the following description, the fluid communication may be used in the same sense as one or more elements being "fluidly connected" to one another.

[0067] The term "conduction" as used herein refers to the connection of one or more elements to enable the transmission of current or electrical signals. In one embodiment, the conduction may be formed in a wired form, such as by a conductor element, or in a wireless form, such as Bluetooth, Wi-Fi, or RFID. In one embodiment, the conduction may also include the meaning of "communication."

[0068] The term "fluid" used in the following description refers to any form of material that can flow and change shape or volume, etc., due to an external force. In one embodiment, the fluid may be a liquid such as water or a gas such as air.

[0069] The terms “upper side,” “lower side,” “left side,” “right side,” “front side,” and “rear side” used in the following description shall be understood with reference to the coordinate system depicted throughout the attached drawings.

[0070]

[0071] The heat sink structure (10, 20) according to an embodiment of the present invention may be combined and utilized in any configuration requiring cooling. In one embodiment, the heat sink structure (10, 20) may be provided in a power semiconductor device and utilized to cool heat generated in the power semiconductor device.

[0072] The heat sink structure (10, 20) may be provided in any form capable of cooling the heat of the above configuration. In one embodiment, the heat sink structure (10, 20) may be configured to include a plurality of fins. Cooling fluid introduced from the outside flows in the space formed between the plurality of fins and can receive the heat transferred to the fins.

[0073] At this time, the heat sink structure (10, 20) according to an embodiment of the present invention may additionally form a space within the fins through which a cooling fluid can flow. That is, the cooling fluid introduced into the heat sink structure (10, 20) according to an embodiment of the present invention can receive heat not only from the outer surface of the fins but also from the inner surface. In other words, the contact area between the cooling fluid and the fins can be maximized.

[0074] Accordingly, the heat exchange efficiency between the heat sink structure (10, 20) and the cooling fluid can be improved. Consequently, the cooling efficiency of the above-described configuration, for example, a power semiconductor device, provided with the heat sink structure (10, 20) can be improved.

[0075] In addition, the heat sink structure (10, 20) according to an embodiment of the present invention may have various changes in the additionally formed space, i.e., the space formed inside the fin. Accordingly, depending on the configuration combined with the heat sink structure (10, 20), various types of heat sink structures (10, 20) may be provided.

[0076] Furthermore, the heat sink structure (10, 20) according to an embodiment of the present invention may have fins arranged in various shapes. In this case, the fins may be formed to maximize the contact area with the introduced cooling fluid.

[0077] Meanwhile, the cooling fluid may be provided as any fluid capable of transferring heat to the heat sink structure (10, 20) through heat exchange in any form, such as conduction, convection, or radiation, thereby cooling the heat sink structure (10, 20). In one embodiment, the cooling fluid may be provided as air. In the above embodiment, the heat sink structure (10, 20) may be said to be cooled in an air-cooled manner.

[0078]

[0079] Referring to FIGS. 1 to 12, a heat sink structure (10) according to one embodiment of the present invention is illustrated.

[0080] The heat sink structure (10) according to the present embodiment includes a component (i.e., a heat dissipation fin (200) to be described later) provided for heat dissipation. At this time, an additional space may be formed within the component for the flow of cooling fluid. Accordingly, cooling fluid provided from the outside may flow and exchange heat not only within the space formed between the components, but also within the components.

[0081] Accordingly, even if the overall size of the heat sink structure (10) is maintained the same or reduced, the heat sink structure (10) can sufficiently exchange heat with the cooling fluid. Accordingly, the cooling efficiency and cooling effect can be improved even as the heat sink structure (10) is miniaturized.

[0082] The heat sink structure (10) may be formed of a material with high thermal conductivity. This is to maximize the heat exchange effect with the provided cooling fluid. In one embodiment, the heat sink structure (10) may be formed of copper (Cu), aluminum (Al), or an alloy thereof.

[0083] In the embodiments illustrated in FIGS. 1 to 7, the heat sink structure (10) includes a base (100), heat dissipation fins (200), and a flow space (300). At this time, the base (100) and heat dissipation fins (200) may be formed integrally or may be formed separately and then combined.

[0084] The base (100) constitutes a portion of the outer shape of the heat sink structure (10). The base (100) is a portion where the heat sink structure (10) is coupled to a cooling target. The base (100) can receive heat from the cooling target. In one embodiment, the base (100) can be coupled to a power semiconductor element to receive heat.

[0085] The base (100) is coupled with a heat dissipation fin (200). Heat transferred to the base (100) can be transferred to the heat dissipation fin (200). In an embodiment where the base (100) and the heat dissipation fin (200) are formed integrally, the base (100) can be said to be continuous with the heat dissipation fin (200).

[0086] The base (100) partially surrounds the flow space (300). In the illustrated embodiment, the base (100) surrounds the flow space (300) on one side in the height direction, i.e., on the upper side.

[0087] As will be described later, in an embodiment further comprising a fan (400) and a duct (500), the base (100) may be coupled with the duct (500). Cooling fluid introduced into the duct (500) may be introduced into the heat dissipation fins (200) coupled with the base (100) and the flow space (300) formed therebetween.

[0088] That is, the base (100) can function as a guide to ensure that the cooling fluid provided through the duct (500) flows to the heat dissipation fin (200) or the flow space (300) without being randomly leaked out to the outside.

[0089] The base (100) is coupled to the cooling object to exchange heat, coupled to the heat dissipation fins (200) to exchange heat, and may have any shape that can partially surround the flow space (300). In the illustrated embodiment, the base (100) is formed in a polygonal plate shape with a width in the left-right direction longer than the length in the front-back direction and a thickness in the up-down direction.

[0090] In the above embodiment, one side in the thickness direction of the base (100), the upper side in the illustrated embodiment, can be coupled with the cooling object and heat exchanged. The other side in the thickness direction of the base (100), the lower side in the illustrated embodiment, can be coupled with the heat dissipation fin (200) and partially surround the flow space (300).

[0091] Meanwhile, the base (100) can directly exchange heat with the cooling fluid flowing in the flow space (300). Therefore, it will be understood that a portion of the heat transferred to the base (100) is directly transferred to the cooling fluid, and the remainder is transferred to the cooling fluid via the heat dissipation fins (200).

[0092] The heat dissipation fin (200) receives heat from the base (100). The heat transferred to the heat dissipation fin (200) can be transferred to the provided cooling fluid. Accordingly, the heat sink structure (10) and the cooling target combined therewith can be cooled.

[0093] The heat dissipation fin (200) is coupled to the base (100). The heat dissipation fin (200) is coupled to the other side in the thickness direction of the base (100), the lower side in the illustrated embodiment. In an embodiment in which the heat dissipation fin (200) and the base (100) are formed integrally, the heat dissipation fin (200) and the base (100) can be said to be continuous.

[0094] The heat dissipation fins (200) partially surround the flow space (300). The heat dissipation fins (200) surround the flow space (300) in the width direction, and in the left-right direction in the illustrated embodiment.

[0095] The heat dissipation fin (200) is coupled to the base (100) to exchange heat, and can be formed in any shape that can surround the flow space (300) together with the base (100). In the illustrated embodiment, the heat dissipation fin (200) is a three-dimensional shape having a thickness in the left-right direction, a height in the up-down direction, and a length in the front-back direction.

[0096] In the above embodiment, the length in the front-back direction of the heat dissipation fin (200) may be the same as the length in the front-back direction of the base (100).

[0097] A plurality of heat dissipation fins (200) may be formed. The plurality of heat dissipation fins (200) may be spaced apart from each other in the width direction of the base (100), or in the left-right direction in the illustrated embodiment, and may be respectively coupled to the base (100). At this time, a plurality of flow spaces (300) are formed between the plurality of heat dissipation fins (200).

[0098] In other words, a plurality of heat dissipation fins (200) and a plurality of flow spaces (300) are alternately arranged along the width direction of the base (100), i.e., the left-right direction.

[0099] In the illustrated embodiment, the heat dissipation fin (200) includes a fin body (210), a fin neck (220), a fin hollow (230), and a fin rib (240).

[0100] The fin body (210) constitutes a portion of the outer shape of the heat dissipation fin (200). The fin body (210) can be connected to the base (100) by the fin neck (220). The fin body (210) receives heat from the fin neck (220) and transfers it to the cooling fluid.

[0101] Inside the fin body (210), a fin hollow (230) is formed penetrating in the longitudinal direction of the heat dissipation fin (200), i.e., in the front-back direction. Therefore, the provided cooling fluid can exchange heat not only with the outer surface of the fin body (210), but also with the inner surface of the fin body (210), i.e., the surface surrounding the fin hollow (230). Accordingly, the contact area between the cooling fluid and the heat dissipation fin (200) is increased, so that the heat exchange effect between them can be maximized.

[0102] The fin body (210) may have a shape corresponding to the shape of the heat dissipation fin (200). In the illustrated embodiment, the fin body (210) is formed in a polygonal plate shape having a thickness in the left-right direction, a height in the up-down direction, and a length in the front-back direction.

[0103] One side of the pin body (210) in the height direction, the upper side in the illustrated embodiment, is connected or continuous with the pin neck (220).

[0104] The fin neck (220) is a portion where the heat dissipation fin (200) is connected to the base (100). The fin neck (220) is connected to the base (100) and the fin body (210), respectively. The fin neck (220) can form a heat exchange passage for transferring heat transferred to the base (100) to the fin body (210). A portion of the heat transferred to the fin neck (220) can be directly transferred to the provided cooling fluid.

[0105] The pin neck (220) is continuous with the pin body (210). The pin neck (220) is continuous with the upper end of the pin body (210) in the height direction, in the illustrated embodiment.

[0106] The pin neck (220) may have any shape that can connect the pin body (210) and the base (100). In the illustrated embodiment, the pin neck (220) is a three-dimensional shape whose cross-sectional area increases in the direction opposite to the base (100), that is, from the upper side to the lower side, and has a length in the front-back direction.

[0107] The fin hollow (230) provides a passage for the provided cooling fluid to flow within the heat dissipation fin (200). The fin hollow (230) may be formed penetrating the interior of the fin body (210) to form a flow path for the cooling fluid together with the flow space (300). The fin hollow (230) may be defined by being surrounded by the inner surface of the fin body (210).

[0108] The fin hollow (230) extends in the longitudinal direction of the fin body (210), in the front-back direction in the illustrated embodiment. One end of the fin hollow (230) in the extension direction, the front side in the illustrated embodiment, may be formed open to form a passage through which a provided cooling fluid flows. The other end of the fin hollow (230) in the extension direction, the rear side in the illustrated embodiment, may be formed open to form a passage through which a cooling fluid flowing through the fin hollow (230) flows out.

[0109] The pin hollow (230) may have a shape corresponding to the shape of the pin body (210). In the illustrated embodiment, the pin hollow (230) is formed as a three-dimensional space having a width in the left-right direction, a height in the up-down direction, and a length in the front-back direction. At this time, each end of the pin hollow (230) in the height direction, the upper end and the lower end in the illustrated embodiment, are formed to be rounded so as to be convex outward.

[0110] A pin rib (240) may be positioned in the pin hollow (230). The pin hollow (230) may be partitioned into a plurality of small spaces by the pin rib (240). The plurality of small spaces partitioned by the pin hollow (230) may be surrounded by the inner surface of the pin body (210) and the pin rib (240), respectively.

[0111] In the embodiments illustrated in FIGS. 1 to 6, the pin hollow (230) is divided into a pair of small spaces in the height direction, i.e., in the up-down direction, by the pin ribs (240). In the above embodiment, the pin ribs (240) are provided in a single number and are continuous with the inner surface in the thickness direction of the pin body (210), i.e., the left inner surface and the right inner surface in the illustrated embodiment, respectively.

[0112] In another embodiment, the pin hollow (230) may be partitioned into three or more small spaces. That is, in the embodiment illustrated in FIG. 7, the pin hollow (230) is partitioned into a total of four small spaces partitioned in the height direction, i.e., in the up-down direction, by the pin ribs (240).

[0113] In the above embodiment, a plurality of pin ribs (240) are provided and spaced apart along the height direction of the pin hollow (230), i.e., the up-down direction. In the above embodiment as well, each pin rib (240) is continuous with the inner surface in the thickness direction of the pin body (210), i.e., the left inner surface and the right inner surface in the illustrated embodiment.

[0114] In any case, it is sufficient if the fin cavity (230) can form a flow path for the cooling fluid together with the flow space (300).

[0115] In an embodiment where the fin hollow (230) is divided into a plurality of small spaces, the area where the cooling fluid flowing in the fin hollow (230) exchanges heat with the inner surface of the fin body (210) or the fin rib (240) can increase. Accordingly, the heat exchange effect and cooling efficiency of the heat sink structure (10) can be improved.

[0116] The pin rib (240) is positioned in the pin hollow (230) and is configured to reinforce the rigidity of the pin body (210). The pin rib (240) extends along the inner surface of the pin body (210) in the thickness direction, that is, between the left and right inner surfaces in the illustrated embodiment, so as to reinforce the rigidity of the pin body (210) along the thickness direction. In addition, the pin rib (240) can receive heat transferred to the pin body (210).

[0117] In addition, the fin rib (240) can divide the fin hollow (230) formed inside the fin body (210) into a plurality of small spaces. The fin rib (240) can partially surround the plurality of small spaces formed by dividing the fin hollow (230). Cooling fluid flowing in the fin hollow (230) can exchange heat with the fin rib (240) and receive heat from the fin rib (240).

[0118] Accordingly, it will be understood that the fin rib (240) reinforces the rigidity of the fin body (210), exchanges heat with the cooling fluid, and divides the fin cavity (230) into a plurality of small spaces.

[0119] The pin rib (240) can be formed in any shape that can perform the above role. In the illustrated embodiment, the pin rib (240) is a three-dimensional shape having a width in the left-right direction, a height in the up-down direction, and a length in the front-back direction.

[0120] In the embodiments illustrated in FIGS. 1 to 6, a single pin rib (240) is provided. The single pin rib (240) is positioned at the central portion in the height direction of the single pin hollow (230), thereby dividing the pin hollow (230) into a pair of small spaces divided in the vertical direction.

[0121] A plurality of pin ribs (240) may be formed. The plurality of pin ribs (240) may be spaced apart from each other to divide the pin hollow (230) into three or more small spaces. In the embodiment illustrated in FIG. 7, a total of three pin ribs (240) are provided, thereby dividing the pin hollow (230) into four small spaces along the height direction of the pin hollow (230), i.e., the up-down direction.

[0122] In the illustrated embodiment, a plurality of pin ribs (240) are spaced apart from each other by the same distance along the height direction of the pin hollow (230). Alternatively, the distances at which the plurality of pin ribs (240) are spaced apart from each other may be formed differently.

[0123] In any case, it is sufficient if the fin rib (240) at least partially surrounds the fin cavity (230) so that heat can be exchanged with the cooling fluid flowing in the fin cavity (230).

[0124] The flow space (300) is a space in which the provided cooling fluid flows and exchanges heat with the base (100) or the heat dissipation fins (200). The cooling fluid flows in the flow space (300) and can receive heat from the base (100) or the heat dissipation fins (200). The cooling fluid that has received heat can flow out of the flow space (300).

[0125] The flow space (300) may be partially surrounded by the base (100). The flow space (300) may be surrounded by the base (100) on one side in the height direction, i.e., the upper side in the illustrated embodiment. The cooling fluid flowing in the flow space (300) may receive heat from the base (100).

[0126] The flow space (300) may be partially surrounded by heat dissipation fins (200). The flow space (300) may be surrounded by heat dissipation fins (200) on each side in the width direction, i.e., the left and right sides in the illustrated embodiment. Cooling fluid flowing in the flow space (300) may receive heat from the heat dissipation fins (200).

[0127] A plurality of flow spaces (300) may be formed. One side in the height direction, i.e., the upper side, of the plurality of flow spaces (300) may be covered by the base (100). In addition, each side in the width direction of the plurality of flow spaces (300), i.e., the left and right sides, may be surrounded by heat dissipation fins (200).

[0128] The flow space (300) may have any shape that can form a flow path for the cooling fluid together with the fin cavity (230). In the illustrated embodiment, the flow space (300) is formed as a three-dimensional space having a width in the left-right direction, a height in the up-down direction, and a length in the front-back direction.

[0129] A detailed description of the process in which the cooling fluid flows in the fin cavity (230) and the flow space (300) will be described later.

[0130] Referring to FIGS. 8 and 9, the heat sink structure (10) according to an embodiment of the present invention may further include a fan (400) and a duct (500).

[0131] The fan (400) provides a conveying force for the cooling fluid to flow toward the heat dissipation fins (200) and the flow space (300). The cooling fluid located outside the heat sink structure (10) can be introduced into the heat dissipation fins (200) and the flow space (300) by the fan (400). In addition, the introduced cooling fluid can be pushed out by the cooling fluid introduced later after heat exchange with the base (100) and the heat dissipation fins (200) and then flowed out.

[0132] The fan (400) may be provided in any form capable of providing a transport force to the cooling fluid. In one embodiment, the fan (400) may be provided in the form of a fan having a plurality of blades. In another embodiment, the fan (400) may be provided in the form of a sirocco fan, which may suck in the cooling fluid in a radial direction and provide it to the heat dissipation fins (200) and the flow space (300).

[0133] The fan (400) can be electrically connected to a control unit (not shown) or a control power source (not shown). Power and control signals required for the operation of the fan (400) can be transmitted from the control unit (not shown) or the control power source (not shown).

[0134] The fan (400) may be coupled with a duct (500). Cooling fluid flowing by the conveying force provided by the fan (400) may pass through the duct (500) and be provided to the heat dissipation fins (200) or the flow space (300). In the illustrated embodiment, the fan (400) is coupled to one longitudinal side of the duct (500), i.e., the front side, and is arranged to face the base (100) and the heat dissipation fins (200) with the duct (500) interposed therebetween.

[0135] A plurality of fans (400) may be provided. The plurality of fans (400) may be spaced apart from each other and respectively connected to a plurality of ducts (500). In the illustrated embodiment, a pair of fans (400) are provided, spaced apart from each other in the left-right direction, and respectively connected to a pair of ducts (500).

[0136] In the illustrated embodiment, a plurality of fans (400) and a plurality of ducts (500) respectively connected thereto are arranged spaced apart from each other in the left-right direction. Alternatively, a plurality of fans (400) and a plurality of ducts (500) respectively connected thereto may be arranged parallel to each other without being spaced apart from each other in the left-right direction, so as to overlap both the heat dissipation fins (200) and the flow space (300) in the front-back direction.

[0137] In any case, it is sufficient if the cooling fluid flowed by the fan (400) can pass through the duct (500) and flow into the heat dissipation fin (200) and the flow space (300).

[0138] The duct (500) guides the cooling fluid flowing by the fan (400) to the heat dissipation fins (200) and the flow space (300). The duct (500) is coupled to the fan (400) and forms a passage for the cooling fluid, which is supplied with a conveying force by the fan (400), to flow to the heat dissipation fins (200) and the flow space (300) without leaking elsewhere.

[0139] The duct (500) is positioned between the heat dissipation fin (200) and the flow space (300) and the fan (400). In the illustrated embodiment, the duct (500) is positioned between the heat dissipation fin (200) and the flow space (300) and the fan (400) along the longitudinal direction of the base (100), i.e., the front-back direction.

[0140] The duct (500) is connected to the base (100) (or the heat dissipation fin (200)). At this time, the duct (500) may be connected to the base (100) so as to completely cover the base (100). Accordingly, the cooling fluid flowing in the duct (500) may flow toward the heat dissipation fin (200) and the flow space (300) without flowing out to other places.

[0141] The duct (500) is coupled to the fan (400). At this time, the duct (500) may be coupled to the fan (400) so as to completely cover the fan (400). Accordingly, the cooling fluid introduced into the fan (400) may flow toward the duct (500) without flowing out elsewhere.

[0142] The duct (500) may be provided in any shape that can be connected to the base (100) or the heat dissipation fins (200) and the fan (400), respectively, and communicate with them. In the illustrated embodiment, the duct (500) is formed to extend in the longitudinal direction of the base (100), i.e., in the front-back direction, and a hollow space (not shown) through which a cooling fluid flows is formed inside.

[0143] In the above embodiment, one longitudinal side of the duct (500), the front side in the illustrated embodiment, may be coupled with the fan (400). Additionally, the other longitudinal side of the duct (500), the rear side in the illustrated embodiment, may be coupled with the base (100) or the heat dissipation fins (200). The duct (500) is positioned between the base (100) or the heat dissipation fins (200) and the fan (400).

[0144] A plurality of ducts (500) may be provided. The plurality of ducts (500) may be spaced apart from each other and connected to a plurality of fans (400) and bases (100) (or heat dissipation fins (200)), respectively. In the illustrated embodiment, a pair of ducts (500) are provided, spaced apart from each other in the left-right direction, and connected to a pair of fans (400), respectively.

[0145] In the illustrated embodiment, a plurality of ducts (500) and a plurality of fans (400) respectively connected thereto are arranged spaced apart in the left-right direction. Alternatively, as described above, a plurality of ducts (500) and a plurality of fans (400) respectively connected thereto may be arranged in parallel with each other in the left-right direction without spaced apart from each other, so as to overlap the heat dissipation fins (200) and the flow space (300) in the front-back direction.

[0146] Referring to FIGS. 10 and 11, the flow (F) of cooling fluid formed in a heat sink structure (10) according to one embodiment of the present invention is illustrated as an example. For convenience of understanding, the fan (400) and the duct (500) are omitted from the illustration.

[0147] External cooling fluid flows toward the heat dissipation fins (200) and the flow space (300). At this time, a portion of the cooling fluid flows into the fin hollows (230) formed inside the heat dissipation fins (200), and flows while exchanging heat with the inner surface of the fin body (210) or the fin ribs (240). In addition, the remainder of the cooling fluid flows into the flow space (300) formed between the plurality of heat dissipation fins (200), and flows while exchanging heat with the outer surface or base (100) of the fin body (210).

[0148] That is, the flow (F) of the cooling fluid can be formed by branching into the fin cavity (230) and the flow space (300). Accordingly, the cooling fluid can exchange heat with the base (100) or the heat dissipation fin (200) at multiple points, so that the heat exchange effect and cooling effect can be improved without expanding the space occupied by the heat sink structure (10).

[0149] Meanwhile, the heat dissipation fins (200) provided in the heat sink structure (10) according to the present embodiment can have their arrangement structure changed in various forms.

[0150] That is, as illustrated in FIG. 12, the heat dissipation fin (200) may be formed so that its length along the longitudinal direction of the base (100), i.e., the front-rear direction in the illustrated embodiment, is shorter than that of the base (100). In the above embodiment, a plurality of heat dissipation fins (200) may be arranged alternately along the longitudinal direction and the width direction of the base (100).

[0151] That is, in the illustrated embodiment, a pair of heat dissipation fins (200) positioned at the most forward side are spaced apart from each other along the left-right direction with a flow space (300) therebetween. In addition, a flow space (300), rather than a heat dissipation fin (200), is formed on each side of the length of each heat dissipation fin (200).

[0152] In addition, three heat dissipation fins (200) positioned on the rear side of the pair of heat dissipation fins (200) are spaced apart from each other in the left-right direction, and a pair of flow spaces (300) are formed between the three heat dissipation fins (200). In addition, a flow space (300) is formed on each side of the length direction of the three heat dissipation fins (200).

[0153] Likewise, a pair of heat dissipation fins (200) positioned on the rear side of the three heat dissipation fins (200) are spaced apart from each other in the left-right direction, and a pair of heat dissipation fins (200) are positioned facing each other with a flow space (300) interposed between them in the left-right direction. In addition, a flow space (300) is formed on each side of the length direction of the pair of heat dissipation fins (200).

[0154] In the above embodiment, the flow (F) of the cooling fluid can be formed along the fin hollows (230) and the flow spaces (300) that are alternately arranged in the left-right direction and the front-back direction. That is, along the front-back direction, the flow (F) of the cooling fluid can be formed to pass through the fin hollows (230) and the flow spaces (300), respectively.

[0155] Accordingly, the cooling fluid can flow and exchange heat alternately between the outer surface or base (100) of the fin body (210) and the inner surface or fin rib (240) of the fin body (210). Accordingly, the heat exchange effect and cooling effect of the heat sink structure (10) can be further improved.

[0156]

[0157] Referring to FIGS. 13 to 21, a heat sink structure (20) according to another embodiment of the present invention is illustrated.

[0158] The heat sink structure (20) according to the present embodiment has differences in the shapes of the fin hollow (230) and the fin rib (240) compared to the heat sink structure (10) according to the above-described embodiment.

[0159] In addition, other components provided in the heat sink structure (20) according to the present embodiment are identical in structure and function to those of the heat sink structure (10) according to the above-described embodiment. Accordingly, the heat sink structure (20) according to the present embodiment will be described below, focusing on the differences from the heat sink structure (10) according to the above-described embodiment.

[0160] The heat sink structure (20) according to the present embodiment includes a component (i.e., a heat dissipation fin (200) to be described later) provided for heat dissipation. At this time, an additional space may be formed within the component for the flow of cooling fluid. Accordingly, cooling fluid provided from the outside may flow and exchange heat not only within the space formed between the components, but also within the components.

[0161] Accordingly, even if the overall size of the heat sink structure (20) is maintained the same or reduced, the heat sink structure (20) can sufficiently exchange heat with the cooling fluid. Accordingly, the cooling efficiency and cooling effect can be improved while the heat sink structure (20) is miniaturized.

[0162] The heat sink structure (20) may be formed of a material with high thermal conductivity. This is to maximize the heat exchange effect with the provided cooling fluid. In one embodiment, the heat sink structure (20) may be formed of copper (Cu), aluminum (Al), or an alloy thereof.

[0163] In the embodiments illustrated in FIGS. 13 to 18, the heat sink structure (20) includes a base (100), heat dissipation fins (200), and a flow space (300). At this time, the base (100) and heat dissipation fins (200) may be formed integrally or may be formed separately and then combined.

[0164] In addition, although not shown separately, the heat sink structure (20) may further include a fan (400) and a duct (500). In this case, the coupling structure and communication relationship between the fan (400) and the duct (500) and other components of the heat sink structure (20) are the same as the coupling structure between each component of the heat sink structure (10) according to the above-described embodiment.

[0165] The base (100) of the heat sink structure (20) according to the present embodiment has the same structure and function as the base (100) of the heat sink structure (10) according to the above-described embodiment. Accordingly, the description of the base (100) will be replaced with the description described above.

[0166] The heat dissipation fin (200) of the heat sink structure (20) according to the present embodiment is almost similar in structure and function to the heat dissipation fin (200) of the heat sink structure (20) according to the above-described embodiment. However, the heat dissipation fin (200) according to the present embodiment has differences in the detailed shapes of the fin hollow (230) and the fin rib (240).

[0167] That is, in the illustrated embodiment, the heat dissipation fin (200) includes a fin body (210), a fin neck (220), a fin hollow (230), and a fin rib (240).

[0168] The structure and function of the fin body (210) and the fin neck (220) are the same as those of the fin body (210) and the fin neck (220) provided in the heat sink structure (10) according to the above-described embodiment. Accordingly, the following description will focus on the fin hollow (230) and the fin rib (240).

[0169] The fin hollow (230) provides a passage for the provided cooling fluid to flow inside the heat dissipation fin (200). The fin hollow (230) is formed penetrating the inside of the fin body (210) and can form a flow path for the cooling fluid together with the flow space (300). The fin hollow (230) can be defined by being surrounded by the inner surface of the fin body (210) and the fin rib (240).

[0170] The fin hollow (230) extends in the longitudinal direction of the fin body (210), in the front-back direction in the illustrated embodiment. One end of the fin hollow (230) in the extension direction, the front side in the illustrated embodiment, may be formed open to form a passage through which a provided cooling fluid flows. The other end of the fin hollow (230) in the extension direction, the rear side in the illustrated embodiment, may be formed open to form a passage through which a cooling fluid flowing through the fin hollow (230) flows out.

[0171] The fin cavity (230) may be of any shape that is connected to the outside and can form a space through which a cooling fluid can flow. In the illustrated embodiment, the fin cavity (230) is formed as a cylindrical space having a circular cross-section and a length in the front-back direction.

[0172] The pin hollow (230) may be surrounded by the inner surface of the pin body (210) and the pin rib (240), respectively. In the illustrated embodiment, each side in the width direction of the pin hollow (230), i.e., the left and right sides, is surrounded by the inner surface of the pin body (210). Each side in the height direction of the pin hollow (230), i.e., the upper and lower sides in the illustrated embodiment, is surrounded by the pin rib (240).

[0173] A plurality of pin cavities (230) may be formed. The plurality of pin cavities (230) may be spaced apart from each other along the height direction of the pin body (210). A plurality of pin ribs (240) may be positioned between the plurality of pin cavities (230). That is, a plurality of pin cavities (230) and pin ribs (240) are alternately arranged along the height direction of the pin body (210).

[0174] Accordingly, it will be understood that the cooling fluid flowing along the plurality of fin cavities (230) can exchange heat with both the fin body (210) and the fin ribs (240).

[0175] The pin rib (240) is positioned in the pin hollow (230) and is configured to reinforce the rigidity of the pin body (210). The pin rib (240) extends along the inner surface of the pin body (210) in the thickness direction, that is, between the left and right inner surfaces in the illustrated embodiment, so as to reinforce the rigidity of the pin body (210) along the thickness direction. In addition, the pin rib (240) can receive heat transferred to the pin body (210).

[0176] In addition, the fin rib (240) can surround a plurality of fin hollows (230) formed inside the fin body (210) in the height direction, respectively. To this end, a plurality of fin ribs (240) can be formed and placed between the plurality of fin hollows (230). Cooling fluid flowing in the fin hollows (230) can exchange heat with the fin ribs (240) and receive heat from the fin ribs (240).

[0177] Accordingly, it will be understood that the fin rib (240) serves to reinforce the rigidity of the fin body (210), exchange heat with the cooling fluid, and at least partially surround the plurality of fin hollows (230).

[0178] The pin rib (240) may be formed in any shape capable of performing the above-described role. In the illustrated embodiment, the pin rib (240) is a three-dimensional shape having a width in the left-right direction, a height in the up-down direction, and a length in the front-back direction. At this time, each side of the pin rib (240) in the height direction is formed to be rounded so as to be convex toward the inside so as to correspond to the shape of the pin hollow (230).

[0179] Referring to FIGS. 19 and 20, the flow (F) of cooling fluid formed in a heat sink structure (20) according to one embodiment of the present invention is illustrated as an example. For convenience of understanding, the fan (400) and the duct (500) are omitted from the illustration.

[0180] External cooling fluid flows toward the heat dissipation fins (200) and the flow space (300). At this time, a portion of the cooling fluid flows into the fin hollows (230) formed inside the heat dissipation fins (200), and flows while exchanging heat with the inner surface of the fin body (210) or the fin ribs (240). In addition, the remainder of the cooling fluid flows into the flow space (300) formed between the plurality of heat dissipation fins (200), and flows while exchanging heat with the outer surface or base (100) of the fin body (210).

[0181] That is, the flow (F) of the cooling fluid can be formed by branching into the fin cavity (230) and the flow space (300). Accordingly, the cooling fluid can exchange heat with the base (100) or the heat dissipation fin (200) at multiple points, so that the heat exchange effect and cooling effect can be improved without expanding the space occupied by the heat sink structure (10).

[0182] As described above, the heat sink structure (20) according to the present embodiment may have a plurality of fin hollows (230) formed therein and spaced apart from each other in the height direction of the fin body (210), i.e., in the vertical direction. Accordingly, it will be understood that the flow (F) of the cooling fluid formed in the fin hollows (230) is branched in the vertical direction and formed in each of the plurality of fin hollows (230).

[0183] Meanwhile, the heat dissipation fins (200) provided in the heat sink structure (20) according to the present embodiment can have their arrangement structure changed in various forms.

[0184] That is, as illustrated in FIG. 21, the heat dissipation fin (200) may be formed so that its length along the longitudinal direction of the base (100), i.e., the front-rear direction in the illustrated embodiment, is shorter than that of the base (100). In the above embodiment, a plurality of heat dissipation fins (200) may be arranged alternately along the longitudinal direction and the width direction of the base (100).

[0185] That is, in the illustrated embodiment, a pair of heat dissipation fins (200) positioned at the most forward side are spaced apart from each other along the left-right direction with a flow space (300) therebetween. In addition, a flow space (300), rather than a heat dissipation fin (200), is formed on each side of the length of each heat dissipation fin (200).

[0186] In addition, three heat dissipation fins (200) positioned on the rear side of the pair of heat dissipation fins (200) are spaced apart from each other in the left-right direction, and a pair of flow spaces (300) are formed between the three heat dissipation fins (200). In addition, a flow space (300) is formed on each side of the length direction of the three heat dissipation fins (200).

[0187] Likewise, a pair of heat dissipation fins (200) positioned on the rear side of the three heat dissipation fins (200) are spaced apart from each other in the left-right direction, and a pair of heat dissipation fins (200) are positioned facing each other with a flow space (300) interposed between them in the left-right direction. In addition, a flow space (300) is formed on each side of the length direction of the pair of heat dissipation fins (200).

[0188] In the above embodiment, the flow (F) of the cooling fluid can be formed along the fin hollows (230) and the flow spaces (300) that are alternately arranged in the left-right direction and the front-back direction. That is, along the front-back direction, the flow (F) of the cooling fluid can be formed to pass through the fin hollows (230) and the flow spaces (300), respectively.

[0189] Accordingly, the cooling fluid can flow and exchange heat alternately between the outer surface or base (100) of the fin body (210) and the inner surface or fin rib (240) of the fin body (210). Accordingly, the heat exchange effect and cooling effect of the heat sink structure (10) can be further improved.

[0190] As described above, the heat sink structure (20) according to the present embodiment may be formed with a plurality of fin hollows (230) and spaced apart in the height direction of the fin body (210), i.e., in the vertical direction. Accordingly, it will be understood that the flow (F) of the cooling fluid formed in the fin hollows (230) is divided in the vertical direction, passes through each of the plurality of fin hollows (230), and then merges in the flow space (300), and is then divided again into a plurality of fin hollows (230).

[0191]

[0192] Although the embodiments of the present invention have been described, the spirit of the present invention is not limited to the embodiments presented in this specification, and those skilled in the art who understand the spirit of the present invention will be able to easily propose other embodiments by adding, changing, deleting, or adding components within the scope of the same spirit, but this will also be considered to fall within the spirit of the present invention.

[0193]

[0194] 10: Heat sink structure 20: Heat sink structure

[0195] 100: Base 200: Heat dissipation fin

[0196] 210: Pin body 220: Pin neck

[0197] 230: Pin hollow 240: Pin rib

[0198] 300: Fluid space 400: Fan

[0199] 500: Duct F: Flow of cooling fluid

Claims

1. A base that is combined with an external cooling target and receives heat; A plurality of heat dissipation fins that are continuous with the base, have a height in the first direction and a length in the second direction, and are spaced apart from each other along the third direction; and A plurality of flow spaces are formed between a plurality of heat dissipation fins along the third direction, are defined by being surrounded by the base and the heat dissipation fins, and are connected to the outside along the second direction. The above heat dissipation fins are, A pin body having one side in the height direction continuous with the base and extending along the second direction; and A pin hollow formed through the inside of the pin body and extending along the second direction to communicate with the outside, Heat sink structure.

2. In paragraph 1, The above pin hollow is formed such that the height in the first direction is longer than the width in the third direction. Heat sink structure.

3. In paragraph 2, The above heat dissipation fins are, A pin rib positioned in the pin hollow and dividing the pin hollow into a plurality of small spaces, and including an inner surface of the pin body surrounding the pin hollow and continuous therewith, Heat sink structure.

4. In paragraph 3, The above pin ribs are, It is formed to have a height in the first direction, a length in the second direction, and a width in the third direction, Each end of the third direction is continuous with the inner surface of the pin body, Heat sink structure.

5. In paragraph 3, The above pin ribs are provided in plurality, and the plurality of pin ribs are spaced apart from each other along the first direction, A plurality of the above small spaces and a plurality of the above pin ribs are alternately arranged along the first direction, Heat sink structure.

6. In paragraph 1, The above base extends along the second direction to the same length as the pin body, Heat sink structure.

7. In paragraph 1, A portion of the external cooling fluid flows in the flow space along the second direction and exchanges heat with the outer surface of the base or the fin body, The remainder of the external cooling fluid flows in the fin hollow along the second direction and exchanges heat with the inner surface of the fin body. Heat sink structure.

8. In paragraph 1, The above pin hollows are formed in plurality, and the plurality of pin hollows are formed spaced apart along the first direction. Heat sink structure.

9. In paragraph 8, The above heat dissipation fins are, A plurality of pin ribs positioned between the plurality of pin hollows and surrounding the plurality of pin hollows along the first direction, Heat sink structure.

10. In paragraph 9, The above pin hollow is formed as a space having a circular cross-section and a length in the second direction, The above pin rib is formed roundly so as to be convex in the direction opposite to the pin hollow. Heat sink structure.

11. In paragraph 1, A plurality of the above heat dissipation fins extend along the second direction by a length shorter than the base, A plurality of the above heat dissipation fins, Alternately arranged with the flow space along the second direction and the third direction, Heat sink structure.

12. In paragraph 11, At least a portion of the cooling fluid passing through the plurality of heat dissipation fins spaced apart along the third direction flows into the plurality of flow spaces, At least a portion of the cooling fluid passing through the plurality of flow spaces spaced apart along the third direction flows into the plurality of heat dissipation fins. Heat sink structure.

13. In paragraph 1, A fan that provides a conveying force to the external cooling fluid; and A duct is included, each of which is connected to the fan and the heat dissipation fins, and forms a path through which the cooling fluid flows to the heat dissipation fins. Heat sink structure.

14. In paragraph 13, The above fans and the above ducts are each provided in multiple numbers and spaced apart along the third direction, and the multiple ducts are each connected to the heat dissipation fins. Heat sink structure.

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