High-toughness electroceramic material and preparation method therefor
By optimizing the preparation method of electrical porcelain materials and introducing raw materials such as silicon nitride whiskers, micro-nano particles TiB2 and Ti2AlC2, combined with specific process steps, the problem of brittleness of ceramic materials has been solved, the tensile and bending strength of electrical porcelain materials has been improved, and their application in the fields of power, communication and electronics has been expanded.
Patent Information
- Application Number
- PCT/CN2024/141166
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-07-18
- Filing Date
- 2024-12-20
- Publication Date
- 2026-01-22
AI Technical Summary
The brittleness of ceramic materials limits their widespread application in the fields of power, communication and electronics, mainly because the interatomic bonds result in few slip systems, making them prone to fracture before slip occurs.
A method for preparing high-toughness electrical porcelain materials was adopted, which involved using raw materials such as bauxite, clay, feldspar, quartz powder, silicon nitride whiskers, micro-nano particles TiB2 and Ti2AlC2, combined with a two-component adhesive of nano-aluminosilicate and modified isocyanurate curing agent, and optimized the preparation process through steps such as wet ball milling, homogenization treatment, dehydration, molding and firing.
It significantly improves the mechanical properties of electrical porcelain materials, especially tensile and flexural strength, and enhances the toughness of the materials, making them suitable for the power, communication and electronics fields.
Abstract
Description
High-toughness electric porcelain material and preparation method thereof TECHNICAL FIELD
[0001] The present application relates to the field of electric porcelain material, in particular to a high-toughness electric porcelain material and a preparation method thereof. BACKGROUND
[0002] Electric porcelain is a high-performance insulating material with good heat resistance, voltage resistance, insulation, corrosion resistance and other properties, and is widely used in the fields of electric power, communication, electronics and the like.
[0003] At present, the brittleness of ceramic materials is one of the main factors restricting their development. The reason is that the atomic bonds in ceramic materials are mainly covalent bonds and ionic bonds. The covalent bond has obvious directionality and saturation, and the repulsion is very large when the like ions of ionic bonds are close. Therefore, the ceramic mainly composed of ionic crystals and covalent crystals has few slip systems, and generally breaks before slip occurs. Therefore, toughening has become the core problem in the field of ceramic material research.
[0004] SUMMARY
[0005] To solve the above problems, the present application provides a high-toughness electric porcelain material and a preparation method thereof.
[0006] To achieve the above purpose, the technical scheme adopted by the present application is as follows:
[0007] A high-toughness electric porcelain material is prepared from the following raw materials by weight:
[0008] 20-25 parts of bauxite, 15-20 parts of clay, 10-15 parts of feldspar, 5-20 parts of quartz powder, 2-4 parts of silicon nitride whisker, 1-5 parts of micro-nano particle TiB2, 0.1-1 parts of Ti2AlC, and 0.5-1 parts of forming agent. 2
[0009] Preferably, the high-toughness electric porcelain material is prepared from the following raw materials by weight:
[0010] 20 parts of bauxite, 15 parts of clay, 10 parts of feldspar, 5 parts of quartz powder, 2 parts of silicon nitride whisker, 1 part of micro-nano particle TiB2, 0.1 parts of Ti2AlC, and 0.5 parts of forming agent. 2
[0011] Preferably, the high-toughness electric porcelain material is prepared from the following raw materials by weight:
[0012] 25 parts of bauxite, 20 parts of clay, 15 parts of feldspar, 20 parts of quartz powder, 4 parts of silicon nitride whisker, 5 parts of micro-nano particle TiB2, 1 parts of Ti2AlC, and 1 parts of forming agent. 2
[0013] Preferably, the following raw materials are prepared by weight parts:
[0014] Bauxite 22.5 parts, clay 17.5 parts, feldspar 12.5 parts, quartz powder 12.5 parts, silicon nitride whisker 3 parts, micro-nano particle TiB2 3 parts, Ti2AlC 2 0.55 parts, molding agent 0.75 parts.
[0015] Further, the molding agent is a two-component adhesive composed of nano-silicate and modified isocyanurate curing agent.
[0016] The application also provides a preparation method of the high-toughness electric porcelain material, comprising the following steps:
[0017] S1, the bauxite, clay, feldspar, quartz powder, silicon nitride whisker, micro-nano particle TiB2, Ti2AlC 2 , the molding agent is placed in the ball mill according to the proportion, a certain amount of water is added for wet ball milling, a uniformly mixed mud is obtained, and the fineness is controlled to be between 0.2-0.4;
[0018] S2, after the mud is deironed, homogenization treatment and dehydration treatment are carried out, a mud cake is obtained, the moisture content of the mud cake is controlled to be 20-25%, and the mud cake is then placed and aged;
[0019] S3, the mud cake after standing and aging is placed in a molding mold, and a blank is pressed to obtain a molded blank, which is dried;
[0020] S4, glaze is applied to the surface of the molded blank after drying in step S3, and then the molded blank is fired and cooled to below 150 DEG C.
[0021] Further, in step S1, the weight ratio of total raw materials to water is 1:1-1.5, the temperature is 50-80 DEG C, and the ball milling time is 8-15 h.
[0022] Further, in step S2, the homogenization treatment temperature is 250-300 DEG C, the pressure is 0.6-0.8 GPa, and the holding time is 1-2 h, and then the furnace is cooled to room temperature.
[0023] Further, in step S4, the molded blank after glazing is placed in a kiln, the initial temperature is room temperature, the temperature is raised to 450-550 DEG C at a rate of 20-30 DEG C / h, then the temperature is raised to 1050-1100 DEG C at a rate of 50-100 DEG C / h for 5-10 h, and finally the temperature is raised to 1250-1350 DEG C at a rate of 20-50 DEG C / h for 1-3 h in a reducing atmosphere.
[0024] The application has the following beneficial effects:
[0025] The application can give high strength to the electric porcelain material and significantly improve the mechanical properties of the electric porcelain material by introducing appropriate amount of silicon nitride whiskers, micro-nano particle TiB2 and Ti2AlC2 and optimizing the preparation process.
[0026] DETAILED DESCRIPTION
[0027] In order to make the purpose and advantages of the present application more clear and explicit, the present application is further described in detail below in combination with examples. It should be understood that the specific examples described herein are only used to explain the present application and do not limit the present application.
[0028] In the following examples, the forming agent is selected from a two-component adhesive composed of nano-silicate and modified isocyanurate curing agent. Example 1
[0029] A high-toughness electric porcelain material, when prepared, includes the following steps:
[0030] S1, aluminum bauxite 20 parts, clay 15 parts, feldspar 10 parts, quartz powder 5 parts, silicon nitride whisker 2 parts, micro-nano particle TiB2 1 part, Ti2AlC 2 0.1 parts, forming agent 0.5 parts, are weighed by weight parts, a certain amount of water is added in a ball mill at a weight ratio of total raw materials to water of 1:1, the temperature is 65 DEG C, wet ball milling is carried out for 11 h, a uniformly mixed mud slurry is obtained, and the fineness is controlled between 0.2 and 0.4;
[0031] S2, after removing iron from the mud slurry, homogenization treatment is carried out at a temperature of 275 DEG C and a pressure of 0.7 GPa for 1.5 h, and then the furnace is cooled to room temperature, and then dehydration treatment is carried out, a mud cake is obtained, the moisture content of the mud cake is controlled to be 20%, and the mud cake is then left to stand and age;
[0032] S3, the mud cake after standing and aging is placed in a forming mold, and a green part is pressed to obtain a formed green part, and then drying is carried out;
[0033] S4, glaze is applied to the surface of the formed green part after drying in step S3, and then the formed green part after glazing is put into a kiln, the initial temperature is room temperature, the temperature is raised to 500 DEG C at a rate of 25 DEG C / h, then the temperature is raised to 1075 DEG C at a rate of 75 DEG C / h and kept for 7.5 h, finally the temperature is raised to 1300 DEG C at a rate of 35 DEG C / h under a reducing atmosphere and kept for 2 h, and then the temperature is lowered to below 150 DEG C, and the high-toughness electric porcelain material is obtained.
[0034] Example 2
[0035] A high-toughness electric porcelain material, when prepared, includes the following steps:
[0036] S1, bauxite 25 parts by weight, clay 20 parts, feldspar 15 parts, quartz powder 20 parts, silicon nitride whisker 4 parts, micro-nano particle TiB2 5 parts, Ti2AlC 2 1 part, 1 part of forming agent, placed in a ball mill, a certain amount of water is added according to the weight ratio of total raw materials to water 1.5, the temperature is 80℃, wet ball milling for 10h, get the mud slurry mixed evenly, fineness control between 0.2-0.4;
[0037] S2, after the mud slurry is deironed, it is homogenized at a temperature of 275℃ and a pressure of 0.7GPa for 1.5h, and then cooled to room temperature with the furnace, and then dehydrated to obtain mud cake, the moisture content of the mud cake is controlled to be 20%, and the mud cake is placed for aging;
[0038] S3, the mud cake after standing and aging is placed in a forming mold, and a blank is pressed to obtain a formed blank, which is dried;
[0039] S4, glaze is applied to the surface of the formed blank after drying in step S3, and then the glazed formed blank is placed in a kiln, the initial temperature is room temperature, the temperature is raised to 500℃ at a rate of 25℃ / h, then the temperature is raised to 1075℃ at a rate of 75℃ / h and kept for 7.5h, and finally the temperature is raised to 1300℃ at a rate of 35℃ / h under reducing atmosphere and kept for 2h, and then cooled to below 150℃.
[0040] Example 3
[0041] A high-toughness porcelain material, when prepared, comprises the following steps:
[0042] S1, bauxite 25 parts by weight, clay 20 parts, feldspar 15 parts, quartz powder 20 parts, silicon nitride whisker 4 parts, micro-nano particle TiB2 5 parts, Ti2AlC 2 0.55 parts, 0.75 parts of forming agent, placed in a ball mill, a certain amount of water is added according to the weight ratio of total raw materials to water 1:1.2, the temperature is 50℃, wet ball milling for 15h, get the mud slurry mixed evenly, fineness control between 0.2-0.4;
[0043] S2, after the mud slurry is deironed, it is homogenized at a temperature of 275℃ and a pressure of 0.7GPa for 1.5h, and then cooled to room temperature with the furnace, and then dehydrated to obtain mud cake, the moisture content of the mud cake is controlled to be 20%, and the mud cake is placed for aging;
[0044] S3, the mud cake after standing and aging is placed in a forming mold, and a blank is pressed to obtain a formed blank, which is dried;
[0045] S4, glazing the surface of the dried formed blank, and then putting the glazed formed blank into a kiln, with room temperature as the initial temperature, heating at a rate of 25℃ / h to 500℃, then heating at a rate of 75℃ / h to 1075℃ for 7.5h, and finally heating at a rate of 35℃ / h to 1300℃ for 2h in a reducing atmosphere, and cooling to below 150℃, to obtain the product.
[0046] Comparative Example 1
[0047] The silicon nitride whiskers in Example 3 are omitted.
[0048] Comparative Example 2
[0049] The micro-nano particles TiB2 in Example 3 are omitted.
[0050] Comparative Example 3
[0051] The Ti2AlC2 in Example 3 is omitted.
[0052] Comparative Example 4
[0053] The silicon nitride whiskers, micro-nano particles TiB2 and Ti2AlC2 in Example 3 are omitted.
[0054] Comparative Example 5
[0055] S2, after removing iron from the slurry, dehydrating to obtain a mud cake, controlling the moisture content of the mud cake to be 20%, and then allowing the mud cake to stand and age;
[0056] The rest of the design is the same as in Example 3.
[0057] Performance test:
[0058] (1) Tensile strength test
[0059] The electrical porcelain materials obtained in Examples 1-3 and Comparative Examples 1-5 were subjected to tensile strength tests, and the test results are shown in Table 1.
[0060] Table 1
[0061] Group Tensile strength (MPa) Example 1 203.9 Example 2 205.3 Example 3 207.1 Comparative Example 1 182.7 Comparative Example 2 181.6 Comparative Example 3 187.3 Comparative Example 4 167 Comparative Example 5 196
[0062] From Table 1, it can be seen that the electromagnetic materials obtained in Examples 1-3 all have high tensile strength; by comparing Example 3 with Comparative Example 1, Comparative Example 2, Comparative Example 3, and Comparative Example 4, it can be found that the tensile strength of Comparative Example 1, Comparative Example 2, Comparative Example 3, and Comparative Example 4 is significantly lower than that of Example 3; specifically, in Comparative Example 1, the tensile strength is reduced by 24.4 MPa due to the omission of the silicon nitride whiskers in Example 3, in Comparative Example 2, the tensile strength is reduced by 25.5 MPa due to the omission of the micro-nano particles TiB2 in Example 3, in Comparative Example 3, the tensile strength is reduced by 19.8 MPa due to the omission of Ti2AlC 22 in Example 3, and in Comparative Example 4, the tensile strength is reduced by 40.1 MPa due to the omission of the silicon nitride whiskers, the micro-nano particles TiB2, and Ti2AlC 22 in Example 3, and the reason is that the silicon nitride whiskers, the micro-nano particles TiB2, and Ti2AlC 22 have a synergistic relationship in enhancing the tensile strength of the electric porcelain material. By comparing Example 3 with Comparative Example 5, it can be found that the tensile strength of the electric porcelain material obtained after omitting the homogenization treatment is reduced, which shows that the homogenization treatment is beneficial to improving the tensile strength of the electric porcelain material.
[0063] (2) Bending strength test
[0064] The electromagnetic materials obtained in Examples 1-3 and Comparative Examples 1-5 were subjected to a bending strength test by a three-point bending loading method, and the results are shown in Table 2.
[0065] Table 2
[0066] Group Bending strength (MPa) Example 1 166 Example 2 169 Example 3 171 Comparative Example 1 123 Comparative Example 2 127 Comparative Example 3 132 Comparative Example 4 89 Comparative Example 5 151
[0067] From Table 2, it can be seen that the electromagnetic materials obtained in Examples 1-3 all have high bending strength; by comparing Example 3 with Comparative Example 1, Comparative Example 2, Comparative Example 3, and Comparative Example 4, it can be found that the bending strength of Comparative Example 1, Comparative Example 2, Comparative Example 3, and Comparative Example 4 is significantly lower than that of Example 3; specifically, in Comparative Example 1, the bending strength is reduced by 48 MPa due to the omission of the silicon nitride whiskers in Example 3, in Comparative Example 2, the bending strength is reduced by 44 MPa due to the omission of the micro-nano particles TiB2 in Example 3, in Comparative Example 3, the bending strength is reduced by 19.8 MPa due to the omission of Ti2AlC 22The bending strength thereof is reduced by 39 MPa, while in the comparative example 4, due to the omission of the silicon nitride whisker, the micro-nano particle TiB2, Ti2AlC2 in the example 3, the bending strength thereof is reduced by 82 MPa, and the reason is that the silicon nitride whisker, the micro-nano particle TiB2, Ti2AlC 22 The three have a synergistic relationship in enhancing the bending strength of the electric porcelain material. By comparing the example 3 with the comparative example 5, it can be found that the bending performance of the electric porcelain material obtained after the omission of the homogenization treatment is reduced, and it can be seen that the homogenization treatment is beneficial to improve the bending performance of the electric porcelain material.
[0068] The above only describes the preferred embodiments of the present application, and it should be noted that for those skilled in the art, without departing from the principles of the present application, a number of improvements and refinements can be made, and these improvements and refinements should also be considered as the protection scope of the present application.
Claims
1. A high-toughness electric porcelain material, characterized by, It is prepared from the following raw materials by weight parts: Bauxite 20-25 parts, clay 15-20 parts, feldspar 10-15 parts, quartz powder 5-20 parts, silicon nitride whisker 2-4 parts, micro-nano particle TiB2 1-5 parts, Ti2AlC 2 0.1-1 parts, forming agent 0.5-1 parts.
2. A high-toughness electric porcelain material as claimed in claim 1, characterized in that, It is prepared from the following raw materials by weight parts: Bauxite 20 parts, clay 15 parts, feldspar 10 parts, quartz powder 5 parts, silicon nitride whisker 2 parts, micro-nano particle TiB2 1 part, Ti2AlC 2 0.1 parts, forming agent 0.5 parts.
3. A high-toughness electric porcelain material as claimed in claim 1, characterized in that, It is prepared from the following raw materials by weight parts: Bauxite 25 parts, clay 20 parts, feldspar 15 parts, quartz powder 20 parts, silicon nitride whisker 4 parts, micro-nano particle TiB2 5 parts, Ti2AlC 2 1 part, forming agent 1 part.
4. A high-toughness electric porcelain material as claimed in claim 1, characterized in that, It is prepared from the following raw materials by weight parts: Bauxite 22.5 parts, clay 17.5 parts, feldspar 12.5 parts, quartz powder 12.5 parts, silicon nitride whisker 3 parts, micro-nano particle TiB2 3 parts, Ti2AlC 2 0.55 parts, forming agent 0.75 parts.
5. A high-toughness electric porcelain material according to any one of claims 1 to 4, characterized in that, The forming agent is a two-component adhesive composed of nano-silicate and modified isocyanurate curing agent.
6. A method for preparing a high-toughness electric porcelain material according to any one of claims 1 to 4, characterized in that, It comprises the following steps: S1, bauxite, clay, feldspar, quartz powder, silicon nitride whisker, micro-nano particle TiB2, Ti2AlC 2 The molding agent is placed in a ball mill in a proportioning manner, a certain amount of water is added for wet ball milling, a mixed mud with a fineness of 0.2-0.4 is obtained; S2, after removing iron, the mud is treated by homogenization and dehydration to obtain mud cake, the moisture content of the mud cake is controlled to be 20-25%, and the mud cake is then placed to stand and age; S3, the mud cake after standing and aging is placed in a forming mold to be pressed into a blank to obtain a formed blank, and then dried; S4, glaze is applied to the surface of the formed blank after drying in step S3, and then the formed blank is fired and cooled to below 150 DEG C to obtain the product.
7. A process for the preparation of a high-toughness electric porcelain material according to claim 6, characterized in that, In step S1, the weight ratio of total raw materials to water is 1:1-1.5, the temperature is 50-80 DEG C, and the ball milling time is 8-15 h.
8. A process for the preparation of a high-toughness electric porcelain material according to claim 6, characterized in that, In step S2, the homogenization treatment temperature is 250-300 DEG C, the pressure is 0.6-0.8 GPa, and the holding time is 1-2 h, and then the furnace is cooled to room temperature.
9. A process for the preparation of a high-toughness electric porcelain material according to claim 6, characterized in that, In step S4, the formed blank after glazing is placed in a kiln, the room temperature is the initial temperature, the temperature is raised to 450-550 DEG C at a rate of 20-30 DEG C / h, then raised to 1050-1100 DEG C at a rate of 50-100 DEG C / h for 5-10 h, and finally raised to 1250-1350 DEG C at a rate of 20-50 DEG C / h for 1-3 h in a reducing atmosphere.
Citation Information
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