Chip aging test apparatus

Abstract

The embodiments of the present description provide a chip aging test apparatus, comprising a box body, wherein a plurality of layers of burn-in boards are provided within the box body, and chips to be tested are mounted on the burn-in boards; a flow guiding mechanism, which forms a plurality of flow guiding channels, and outlet end openings of the plurality of flow guiding channels correspond to the plurality of layers of burn-in boards, respectively; a plurality of air velocity regulating mechanisms are respectively located above the plurality of layers of burn-in boards, wherein each air velocity regulating mechanism comprises a regulating plate, a plurality of air velocity regulating regions are formed on a side of the regulating plate close to the burn-in boards, and a distance between the air velocity regulating regions and the burn-in boards decreases in a direction away from the flow guiding mechanism; and a fan corresponds to inlet end openings of the plurality of flow guiding channels, and a heat dissipation mechanism is arranged below the chips to be tested.

Description

A chip aging test device Technical Field

[0001] This specification relates to the field of chip testing technology, specifically to a chip aging test device. Background Technology

[0002] Currently, the market demand for high-performance GPUs is increasing daily. However, high-performance GPUs all share the common characteristic of high heat generation, which brings some trouble to chip aging tests. How to control the temperature of chip aging tests is a relatively important issue. If the temperature is not well controlled under high-power heat generation, the large temperature difference inside the chip can lead to the formation of some microcracks.

[0003] Currently, mature solutions on the market directly control the chip aging temperature through air cooling. With existing technology, GPUs generate relatively low heat, generally below 500W, so uneven heat distribution across different locations doesn't have a significant impact. Therefore, typical air cooling designs can meet testing requirements. However, with technological advancements, the latest GPUs generate up to 1000W. Testing has shown that without any intervention, a temperature difference exceeding 50°C between different locations on the GPU can easily lead to microcracks due to inconsistent internal expansion and contraction caused by this temperature difference. Summary of the Invention

[0004] In view of this, the embodiments of this specification provide a chip aging test device. By setting a flow guiding mechanism to guide the cooling air, the air volume of each layer of chips to be tested is ensured to be the same. By setting a wind speed adjustment mechanism above each layer of aging board, the wind speed adjustment mechanism adjusts the wind speed above the aging board, so that the wind speed is greater the farther away from the flow guiding mechanism, ensuring the heat dissipation effect of the chips farther away from the flow guiding mechanism, reducing the temperature difference of the chips, and ensuring good temperature uniformity of the chips at different positions in the horizontal direction.

[0005] This specification provides the following technical solution in its embodiments: a chip aging test apparatus, comprising:

[0006] The enclosure contains multiple layers of aging boards, and each layer of the aging board is equipped with several chips to be tested.

[0007] A flow guiding mechanism is provided, which forms multiple flow guiding channels, and the outlet openings of the multiple flow guiding channels correspond to the multilayer aging boards respectively.

[0008] Multiple wind speed adjustment mechanisms are located above the multiple layers of aging plates. Each wind speed adjustment mechanism includes an adjustment plate. The side of the adjustment plate closest to the aging plate forms multiple wind speed adjustment areas. Along the direction away from the airflow guiding mechanism, the distance between the wind speed adjustment areas and the aging plate decreases.

[0009] A fan, the fan corresponding to the inlet opening of the plurality of flow guiding channels;

[0010] A heat dissipation mechanism is provided on the side of the chip under test away from the aging board, and the heat dissipation mechanism dissipates heat from the side of the chip under test away from the aging board.

[0011] Preferably, the adjustment plate includes a first region, a second region, and a third region, the thickness of the first region, the second region, and the third region increasing sequentially, the first region and the aging plate forming a first wind speed adjustment region, the second region and the aging plate forming a second wind speed adjustment region, and the third region and the aging plate forming a third wind speed adjustment region.

[0012] Preferably, the first region is the region where the adjusting plate is close to the flow guiding mechanism, the third region is the region where the adjusting plate is far from the flow guiding mechanism, and the second region is the region between the first region and the third region.

[0013] Preferably, the thickness of the first region is 1 / 5 to 2 / 5 of the thickness of the third region;

[0014] The thickness of the second region is 3 / 5 to 4 / 5 of the thickness of the third region.

[0015] Preferably, the thickness of the third region is 15mm to 30mm.

[0016] Preferably, the distance between the adjusting plate and the aging plate gradually decreases along the direction away from the flow guiding mechanism.

[0017] Preferably, the flow guiding mechanism includes a flow guiding plate, and the flow guiding plate has a plurality of mutually isolated flow guiding channels. The inlet opening width of the plurality of flow guiding channels is the same, the outlet opening width of the plurality of flow guiding channels is the same, and the interval between the plurality of flow guiding channels is the same.

[0018] Preferably, the testing device further includes a cooling mechanism disposed inside the chamber, which cools the fluid that has absorbed heat from the chip under test.

[0019] Preferably, the cooling mechanism includes an evaporator.

[0020] Preferably, the heat dissipation mechanism includes a water cooling mechanism, which includes multiple water cooling plates, each of which is disposed below a plurality of chips to be tested, and each water cooling plate is provided with a liquid inlet and a liquid outlet.

[0021] Compared with the prior art, the beneficial effects that at least one technical solution adopted in the embodiments of this specification can achieve include at least:

[0022] By setting up a flow guiding mechanism to guide the cooling air, the airflow of each layer of chips under test is ensured to be the same. By setting up a wind speed adjustment mechanism above each layer of aging board, the wind speed above the aging board is adjusted so that the wind speed is greater the farther away from the flow guiding mechanism, ensuring the heat dissipation effect of chips farther away from the flow guiding mechanism, reducing the temperature difference of the chips, and ensuring good temperature uniformity of the chips in different positions in the horizontal direction. At the same time, by setting up a heat dissipation mechanism below the chip under test, the heat dissipation mechanism dissipates heat from the bottom of the chip, which can avoid large temperature differences between the top and bottom of the chip. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 is a schematic diagram of the chip aging test device provided in this application;

[0025] Figure 2 is a schematic diagram of the adjustment mechanism of the chip aging test device provided in this application;

[0026] Figure 3 is a schematic diagram of the adjustment mechanism and aging board distribution of the chip aging test device provided in this application.

[0027] Figure 4 is a schematic diagram of the water cooling mechanism of the chip aging test device provided in this application after installation;

[0028] Figure 5 is a schematic diagram of the flow guiding mechanism of the chip aging test device provided in this application;

[0029] Figure 6 is an enlarged schematic diagram of the current guiding mechanism of the chip aging test device provided in this application;

[0030] Figure 7 is a schematic diagram of another structure of the regulating mechanism provided in this application.

[0031] Figure 8 is a schematic diagram of an air-cooled design in the prior art.

[0032] In the diagram, 1. Box; 2. Airflow guiding mechanism; 21. Airflow guide plate; 22. Airflow guiding channel; 3. Wind speed adjustment mechanism; 31. First area; 32. Second area; 33. Third area; 34. Adjustment plate; 4. Aging plate; 5. Chip to be tested; 6. Fan; 7. Water cooling mechanism; 8. Cooling mechanism. Detailed Implementation

[0033] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0034] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. This application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0035] It should be noted that various aspects of embodiments within the scope of the appended claims are described below. It will be apparent that the aspects described herein can be embodied in a wide variety of forms, and any particular structure and / or function described herein is merely illustrative. Based on this application, those skilled in the art will understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspects set forth herein can be used to implement the device and / or practice the method. Additionally, this device and / or method can be implemented using structures and / or functionalities other than one or more of the aspects set forth herein.

[0036] It should also be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. The drawings only show the components related to this application and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0037] Furthermore, specific details are provided in the following description to facilitate a thorough understanding of the examples. However, those skilled in the art will understand that the described aspects can be practiced without these specific details.

[0038] Currently, mature solutions on the market directly control the chip aging temperature through air cooling. With existing technology, GPUs have relatively low heat output, generally below 500W. Uneven heat distribution across different locations does not have a significant impact, so typical air cooling designs can meet testing requirements. Current air cooling designs are generally shown in Figure 8. However, with technological advancements, the latest GPUs now have heat outputs as high as 1000W. Testing has shown that without any intervention, a temperature difference exceeding 50°C between different locations on the GPU can easily lead to microcracks due to inconsistent internal expansion and contraction deformation caused by this temperature difference.

[0039] The inventors conducted extensive and in-depth experiments and designed a chip aging test device.

[0040] The technical problem solved by this invention is: how to ensure that the temperature difference of a high-power GPU is controlled within a certain range.

[0041] The technical solutions provided by the various embodiments of this application are described below with reference to the accompanying drawings.

[0042] As shown in Figures 1-6, a chip aging test apparatus includes:

[0043] Box 1, inside which are arranged multiple layers of aging boards 4, the multiple layers of aging boards 4 are arranged in sequence along the vertical direction, and each layer of aging board 4 is equipped with several chips to be tested 5.

[0044] The flow guiding mechanism 2 forms a plurality of flow guiding channels 22, and the outlet openings of the plurality of flow guiding channels 22 respectively correspond to the multilayer aging board 4;

[0045] Multiple wind speed adjustment mechanisms 3 are located above the multiple layers of aging plates 4. Each wind speed adjustment mechanism 3 includes an adjustment plate 34. The side of the adjustment plate 34 near the aging plate 4 forms multiple wind speed adjustment areas. Along the direction away from the airflow guiding mechanism 2, the distance between the wind speed adjustment areas and the aging plate 4 decreases.

[0046] Fan 6, the fan 6 being corresponding to the inlet opening of the plurality of flow guiding channels 22;

[0047] A heat dissipation mechanism is provided on the side of the chip under test 5 away from the aging board 4, and the heat dissipation mechanism dissipates heat on the side of the chip under test 5 away from the aging board 4.

[0048] Cooling air is blown into the inlet openings of multiple guide channels 22 by the fan 6. The cooling air enters the multiple guide channels 22 evenly and flows into each layer of aging board 4 through the outlet openings of the multiple guide channels 22. The cooling air flows away from the outlet openings of the guide channels 22 and absorbs heat from the chip 5 to be tested on the aging board 4. As the flow distance of the cooling air increases, the temperature of the cooling air gradually increases, resulting in a worse heat dissipation effect on the chip. The wind speed adjustment mechanism 3 adjusts the wind speed above the aging board 4. Along the direction away from the guide mechanism 2, the distance between the wind speed adjustment area and the aging board 4 decreases. Under the same flow rate, the smaller the flow channel cross-section, the greater the flow velocity. This makes the wind speed greater the farther away from the guide mechanism 2, ensuring the heat dissipation effect on the chip farther away from the guide mechanism 2, reducing the temperature difference of the chip, and ensuring good temperature uniformity of the chip at different positions in the horizontal direction. By setting a heat dissipation mechanism below the chip 5 to dissipate heat from the bottom of the chip, a large temperature difference between the top and bottom of the chip can be avoided.

[0049] It should be noted that the number of flow channels 22 is the same as the number of aging plates 4, and each flow channel 22 corresponds to one aging plate 4. The number of wind speed adjustment mechanisms 3 is the same as the number of aging plates 4, and each aging plate 4 is equipped with a wind speed adjustment mechanism 3.

[0050] It should also be noted that the fan 6 is a centrifugal fan. The centrifugal fan 6 can efficiently convert electrical energy or power energy into air kinetic energy, providing strong wind and pressure. The centrifugal fan 6 can provide a pressure difference, allowing the gas to flow smoothly inside the housing 1.

[0051] As shown in Figures 1-3, in some embodiments, the regulating plate 34 includes a first region 31, a second region 32, and a third region 33. The thicknesses of the first region 31, the second region 32, and the third region 33 increase sequentially. A first wind speed regulating region is formed between the first region 31 and the aging plate 4, a second wind speed regulating region is formed between the second region 31 and the aging plate 4, and a third wind speed regulating region is formed between the third region 33 and the aging plate 4. By setting the first region 31, the second region 32, and the third region 33 with sequentially increasing thicknesses on the regulating plate 34, the distances between the first region 31, the second region 32, and the third region 33 and the aging plate 4 decrease sequentially, so that for the same cooling airflow, the flow rate gradually increases in the first wind speed regulating region, the second wind speed regulating region, and the third wind speed regulating region.

[0052] It should be noted that in this embodiment, three test chips 5 are provided under each aging plate 4. The three test chips 5 correspond to the first region 31, the second region 32 and the third region 33 respectively. The adjustment plate 34 can be evenly divided into the first region 31, the second region 32 and the third region 33, or it can be unevenly divided.

[0053] It should also be noted that in other embodiments, the adjusting plate 34 can also be divided into two, four, five or other groups of areas, which can be set according to the actual situation. It is only necessary to ensure that the thickness of the area increases sequentially along the direction away from the guide mechanism 2.

[0054] As shown in Figures 1-3, in some embodiments, the first region 31 is the region of the adjusting plate 34 close to the flow guiding mechanism 2, the third region 33 is the region of the adjusting plate 34 far from the flow guiding mechanism 2, and the second region 32 is the region between the first region 31 and the third region 33. The first region 31 has the smallest thickness, resulting in a larger flow channel between the first region 31 and the aging plate 4. Under the same cooling airflow, the flow rate in the first region 31 is the slowest. The second region 32 has a medium thickness, so under the same cooling airflow, the flow rate in the second region 32 is greater than that in the first region 31. The third region 33 has the largest thickness, so under the same cooling airflow, the flow rate in the third region 33 is greater than that in the second region 32. Therefore, the first region 31 is located closest to the flow guiding mechanism 2, and the third region 33 is located farthest from the flow guiding mechanism 2.

[0055] It should be noted that the upper surface of the wind speed regulating plate 34 is a flat surface, and an inclined first guide surface is provided between the first region 31 and the second region 32, and an inclined second guide surface is provided between the second region 32 and the third region 33.

[0056] As shown in Figures 1-3, in some embodiments, the thickness of the first region 31 is 1 / 5 to 2 / 5 of the thickness of the third region 33; the thickness of the second region 32 is 3 / 5 to 4 / 5 of the thickness of the third region 33. By setting the thickness of the first region 31 to 1 / 5 to 2 / 5 of the thickness of the third region 33, and setting the thickness of the second region 32 to 3 / 5 to 4 / 5 of the thickness of the third region 33, the cooling airflow rates of the first region 31, the second region 32, and the third region 33 are changed. This ensures that the cooling effect of the aging board 4 regions corresponding to the first region 31, the second region 32, and the third region 33 is basically the same, thus ensuring the temperature uniformity of the aging board 4.

[0057] As shown in Figures 1-3, in some embodiments, the thickness of the third region 33 is 15mm to 30mm. By limiting the thickness of the third region 33, it is easier to conduct tests.

[0058] It should be noted that the distance between the lower surface of the third region 33 and the aging plate 4 is generally set to be between 1 and 1.5 times the thickness of the third region 33, which can ensure the normal flow of cooling air.

[0059] As shown in Figure 7, in some embodiments, the distance between the adjusting plate 34 and the aging plate 4 gradually decreases along the direction away from the flow guiding mechanism 2. In this embodiment, the side of the adjusting plate 34 close to the aging plate 4 can be set as an inclined surface, and the inclined surface gradually approaches the aging plate 4 along the direction away from the flow guiding mechanism 2.

[0060] As shown in Figures 1 and 5-6, in some embodiments, the flow guiding mechanism 2 includes a flow guiding plate 21, in which a plurality of mutually isolated flow guiding channels 22 are provided. The inlet opening width of the plurality of flow guiding channels 22 is the same, the outlet opening width of the plurality of flow guiding channels 22 is the same, and the interval between the plurality of flow guiding channels 22 is the same. By setting the inlet opening of each flow guiding channel 22 to be the same size and the interval between each flow guiding channel 22 to be the same, the air volume entering the flow guiding channel 22 from the fan 6 is guaranteed to be the same.

[0061] It should be noted that the guide plate 21 is horizontally "L" shaped, and the inlet openings of the multiple guide channels 22 are all located directly above the fan 6.

[0062] It should also be noted that in this embodiment, the aging plate 4 has 10 layers and the flow channel 22 has 10 channels, with each flow channel 22 corresponding to one aging plate 4. In other embodiments, the number of aging plates 4 can also be other, and the number of flow channels 22 is the same as the number of aging plates 4.

[0063] As shown in Figure 1, in some embodiments, the testing device further includes a cooling mechanism 8, which is disposed inside the housing 1. The cooling mechanism 8 cools the fluid after it absorbs the heat from the chip 5 under test. By setting the cooling mechanism 8 inside the housing 1, the cooling mechanism 8 cools the fluid after it absorbs the heat from the chip 5 under test. The fan 6 blows the cooled fluid to the flow guide mechanism 2 to achieve fluid circulation.

[0064] It should be noted that the fluid circulation process is as follows: Under the action of the fan 6, the low-temperature fluid enters the wind speed regulation mechanism 3 after passing through the flow guiding mechanism 2. In the wind speed regulation mechanism 3, the cold air is heated by the high-temperature test chip 5 and the temperature rises to form a high-temperature fluid. Due to the pressure difference created by the fan 6, the high-temperature fluid flows downward and enters the right side of the cooling mechanism 8. The cooling mechanism 8 cools down the fluid after absorbing the heat of the test chip 5. The cooled fluid is then flowed to the fan 6 under the action of the pressure difference.

[0065] In this embodiment, the cooling mechanism 8 includes an evaporator, which cools the high-temperature fluid. The heat flow becomes a low-temperature fluid after heat exchange through the evaporator, so that the fluid completes heat exchange inside the housing 1.

[0066] In other embodiments, the cooling mechanism 8 can also be other structures, as long as heat exchange from the heat flow to the low-temperature fluid is achieved.

[0067] As shown in Figures 1 and 3-4, in some embodiments, the heat dissipation mechanism includes a water cooling mechanism 7, which includes multiple water cooling plates. The multiple water cooling plates are respectively disposed below the multiple chips to be tested 5. The water cooling plates are provided with liquid inlets and liquid outlets. By setting up the water cooling mechanism 7, cooling liquid enters the cooling plate from the liquid inlet and flows out from the liquid outlet, thereby cooling the area below the chip to be tested 5. This ensures that during the aging process, the temperature difference between the upper and lower surfaces of the chip to be tested 5 is controlled within a small range, such as ±10℃.

[0068] It should be noted that in other embodiments, the heat dissipation mechanism can also be a wind-cooling mechanism or other liquid-cooling mechanism to dissipate heat from the bottom of the chip 5 under test, as long as the temperature difference between the top and bottom of the chip 5 under test is controlled within a suitable range.

[0069] The same or similar parts between the various embodiments in this specification can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the method embodiments described later are relatively simple in description since they correspond to the system, and relevant parts can be referred to the descriptions in the system embodiments.

[0070] [Amended according to Rule 26, 29.04.2025] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A chip burn-in test apparatus, characterized by comprising: The test device comprises: a box body, a plurality of aging boards are arranged in the box body, and a plurality of chips to be tested are arranged on each of the aging boards; a flow guide mechanism, the flow guide mechanism forms a plurality of flow guide channels, and the outlet openings of the plurality of flow guide channels correspond to the plurality of aging boards respectively; a plurality of air speed adjusting mechanisms, the plurality of air speed adjusting mechanisms are arranged above the plurality of aging boards respectively, the air speed adjusting mechanism comprises an adjusting plate, a plurality of air speed adjusting areas are formed on the side of the adjusting plate close to the aging board, and the distance between the adjusting plate and the aging board decreases along the direction away from the flow guide mechanism, so that the air speed of the place far away from the flow guide mechanism is greater; a fan, the fan corresponds to the inlet openings of the plurality of flow guide channels, and the air volume of each flow guide channel from the fan is the same; a heat dissipation mechanism, the heat dissipation mechanism is arranged on the side of the chip to be tested away from the aging board, and the heat dissipation mechanism dissipates heat on the side of the chip to be tested away from the aging board.

2. The chip burn-in test apparatus according to claim 1, wherein The adjusting plate comprises a first area, a second area and a third area, the thicknesses of the first area, the second area and the third area increase in sequence, the first area and the aging board form a first air speed adjusting area, the second area and the aging board form a second air speed adjusting area, and the third area and the aging board form a third air speed adjusting area.

3. The chip burn-in test apparatus according to claim 2, wherein The first area is the area of the adjusting plate close to the flow guide mechanism, the third area is the area of the adjusting plate away from the flow guide mechanism, and the second area is the area between the first area and the third area.

4. The chip burn-in test apparatus according to claim 3, wherein The thickness of the first area is 1 / 5-2 / 5 of the thickness of the third area. The thickness of the second area is 3 / 5-4 / 5 of the thickness of the third area.

5. The chip burn-in test apparatus according to claim 4, wherein The thickness of the third area is 15mm-30mm.

6. The chip burn-in test apparatus of claim 1, wherein The distance between the adjusting plate and the aging board gradually decreases along the direction away from the flow guide mechanism.

7. The chip burn-in test apparatus according to any one of claims 1 to 6, wherein The flow guide mechanism comprises a flow guide plate, a plurality of flow guide channels are formed in the flow guide plate, the inlet openings of the plurality of flow guide channels have the same width, the outlet openings of the plurality of flow guide channels have the same width, and the intervals between the plurality of flow guide channels are the same.

8. The chip burn-in test apparatus according to any one of claims 1 to 6, wherein The test device further comprises a cooling mechanism, the cooling mechanism is arranged in the box body, and the cooling mechanism cools the fluid after absorbing the heat of the chip to be tested.

9. The chip burn-in test apparatus according to claim 8, wherein The cooling mechanism comprises an evaporator.

10. The chip burn-in test apparatus according to any one of claims 1 to 6, wherein The heat dissipation mechanism comprises a water cooling mechanism, the water cooling mechanism comprises a plurality of water cooling plates, the plurality of water cooling plates are arranged below the plurality of chips to be tested respectively, and the water cooling plate is provided with a liquid inlet and a liquid outlet.

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