Substrate in-situ detection system and in-situ detection and transfer method therefor

Abstract

Provided in the present invention are a substrate in-situ detection system and an in-situ detection and transfer method therefor. The substrate in-situ detection system comprises: a processing chamber, wherein a base is provided in the processing chamber, the base at least comprises one holding groove configured to carry a substrate; a transfer chamber connected to the processing chamber, wherein a manipulator is provided in the transfer chamber and is configured to transfer the substrate into or out of the processing chamber; a transfer channel and a first gate valve located on the transfer channel are provided at a connection of the processing chamber and the transfer chamber; when the first gate valve is closed, the transfer channel is closed, and the transfer chamber is relatively isolated from the processing chamber; when the first gate valve is open, the transfer channel is open, and the transfer chamber is in communication with the processing chamber; and a detection assembly arranged in the transfer chamber, wherein the detection assembly acquires image data of the interior of the processing chamber by means of the transfer channel, so as to determine whether the base and / or the substrate reaches a specified position. The present invention prevents a complex environment in the processing chamber from affecting a detection result, thereby improving the accuracy of in-situ detection.

Description

A substrate in-situ detection system and its in-situ detection and transfer method Technical Field

[0001] This invention belongs to the field of semiconductor equipment, and specifically relates to a substrate in-situ detection system and its in-situ detection and transmission method. Background Technology

[0002] In the semiconductor industry, automated substrate transfer systems have replaced traditional manual operations, becoming an indispensable part of the manufacturing process. The substrate includes a wafer and / or a carrier disk for supporting the wafer. During automated substrate transfer, a robotic arm within the transfer chamber transports the substrate to or from the processing chamber. When the substrate is transferred from the transfer chamber to the processing chamber, its position needs to be checked to avoid misplacement or other issues that could affect subsequent substrate processing (e.g., film deposition / epitaxy / etching processes). Currently, substrate position detection is achieved using sensors located within the processing chamber. However, the complex environment within the processing chamber (e.g., high temperature, high gas pressure, strong gas corrosiveness) significantly impacts the sensor's detection results. Furthermore, after multiple processes, byproducts can obstruct the sensor's detection path, affecting the accuracy of position detection and increasing the frequency of sensor replacement, thus increasing costs. Summary of the Invention

[0003] The purpose of this invention is to provide a substrate in-situ detection system and its in-situ detection and transmission method, so as to realize the position detection of the substrate, reduce the influence of the complex environment inside the processing cavity on the detection results, ensure the detection accuracy of the substrate placement position, avoid problems such as substrate misplacement or incorrect placement, extend the life of the detection system, and reduce production costs.

[0004] To achieve the above objectives, a first aspect of the present invention provides a substrate in-situ detection system, comprising: at least one processing chamber having a base therein, the base including at least one placement groove for supporting a substrate, the substrate including a substrate and / or a carrier disk supporting the substrate; a transfer chamber connected to the processing chamber having a robotic arm therein for transferring the substrate to or out of the processing chamber; a transfer channel and a first gate valve located on the transfer channel at the connection between the processing chamber and the transfer chamber; closing the first gate valve, the transfer channel is sealed, and the transfer chamber is relatively isolated from the processing chamber; opening the first gate valve, the transfer channel is open, and the transfer chamber is connected to the processing chamber; and a detection component disposed within the transfer chamber; the detection component acquiring image data within the processing chamber through the transfer channel to determine whether the base and / or the substrate has reached a designated position.

[0005] Optionally, the detection component is disposed on the cavity wall opposite to the first valve; the entrance of the transmission channel located in the transmission cavity is defined as the detection window, and the height of the detection component on the cavity wall is higher than the height of the detection window.

[0006] Optionally, the cavity wall of the transmission cavity is composed of a bottom wall, side walls, and a top cover; the detection component is mounted on the side wall.

[0007] Optionally, the detection component includes an image sensor for acquiring images of the base and / or substrate in the processing cavity via the transmission channel as the image data.

[0008] Optionally, the detection component further includes an illumination component that emits light to the base through the transmission channel; the illumination component forms a detection angle relative to the mounting plane of the base, and the image sensor forms a detection angle relative to the mounting plane of the base, wherein the illumination angle is lower than the detection angle.

[0009] Optionally, the transmission cavity is connected to multiple processing cavities. The connection between each processing cavity and the transmission cavity is separated by a first gate valve. Each first gate valve has a corresponding detection component on the cavity wall of the transmission cavity opposite to it. The detection range of each detection component at least covers part of the mounting plane of the base in the corresponding processing cavity.

[0010] A second aspect of the present invention provides a substrate in-situ detection method, which utilizes the aforementioned substrate in-situ detection system, comprising: opening a first valve; a detection component capturing a first image containing the substrate through a transmission channel, and determining whether the substrate is placed in the mounting slot of the base based on the first image; if the substrate is not placed in the mounting slot of the base, determining that the substrate is not in-situ, and outputting a first alarm signal.

[0011] Optionally, the method for determining whether the substrate is placed in the mounting slot of the base includes: identifying the local contour lines of the substrate and the mounting slot in the first image, and based on whether or not there is a shadow width exceeding a threshold in the contour line area, giving a corresponding judgment on whether or not the substrate is placed in the mounting slot of the base.

[0012] A third aspect of the present invention provides a substrate transfer method, utilizing the aforementioned substrate in-situ detection system, comprising: maintaining a first valve in an open state; performing a substrate transfer operation to the current mounting slot of a base; the substrate transfer operation comprising: transferring a substrate to the mounting slot and performing substrate in-situ detection; wherein the substrate in-situ detection step comprises: step S1, the detection component of the substrate in-situ detection system capturing a first image containing at least a portion of the substrate through a transmission channel; step S2, determining whether the substrate is placed in the current mounting slot based on the first image; if it is determined that the substrate is not placed in the current mounting slot, then outputting a first alarm signal.

[0013] Optionally, the step of outputting a first alarm signal if it is determined that the substrate is not placed in the current mounting slot further includes stopping all transmission operations. Optionally, before performing the substrate transfer operation of the current mounting slot of the base, the step further includes moving the current mounting slot to a designated position and detecting the position of the current mounting slot through the substrate in-situ detection system; wherein, the step of detecting the position of the current mounting slot through the substrate in-situ detection system includes the detection component capturing a second image containing the current mounting slot through the transmission channel and calculating whether the base has reached the designated position based on the second image; if the base has reached the designated position, the transmission program is allowed to continue; otherwise, the base position is adjusted based on the difference between the actual position and the designated position so that the base reaches the designated position; or, any transmission operation is stopped and a second alarm signal is output.

[0014] Optionally, the method for calculating whether the base has reached the specified position includes: identifying the local contour line of the mounting groove through the second image, calculating the center position of the mounting groove of the base through the local contour line, and determining whether the specified position has been reached by checking whether the displacement deviation between the calculated center position and the specified position is within a threshold range.

[0015] By placing the detection component inside the transmission cavity, the present invention enables in-situ detection of the base and / or substrate through the transmission channel, reducing the influence of the detection component on the gas field and temperature field distribution inside the processing cavity and improving the process effect of the processing cavity; at the same time, it avoids the influence of the complex environment inside the processing cavity on the in-situ detection results of the substrate and improves the accuracy of the in-situ detection of the substrate.

[0016] Secondly, by placing the image sensor on the wall of the transmission chamber opposite to the first valve, assembly, debugging, and maintenance can be facilitated. Furthermore, by incorporating an illumination component, the edges of the mounting plane of the base can be captured more clearly in non-high-temperature transmission environments, resulting in clearer image data and improving the accuracy of substrate in-situ detection. Attached Figure Description

[0017] Figure 1 is a top view of a substrate in-situ detection system provided by the present invention;

[0018] Figure 2 is a partial cross-sectional view along the AA direction of a substrate in-situ detection system provided by the present invention in the detection state;

[0019] Figure 3 is a partial cross-sectional view along the AA direction of a substrate in-situ detection system provided by the present invention in the transmission state;

[0020] Figure 4 is a flowchart of a substrate in-situ detection method provided by the present invention;

[0021] Figure 5 is a flowchart of a substrate transport method provided by the present invention. Detailed Implementation

[0022] The technical solutions, structural features, achieved objectives, and effects of the present invention will be described in detail below with reference to Figures 1 to 5 in the embodiments of the present invention.

[0023] In semiconductor manufacturing, substrate transfer is primarily achieved through automated transfer systems. When the substrate is transferred from the transfer cavity to the processing cavity, in-situ detection is a crucial step in ensuring accurate transfer by the automated system. Current technology involves directly creating a groove within the processing cavity and embedding the substrate position sensor within the groove, while maintaining a transparent path to ensure detection accuracy. However, after multiple processing cycles, byproducts adhere to this transparent path, significantly impacting detection accuracy and leading to defects such as low precision and short lifespan in in-situ substrate detection.

[0024] To address the aforementioned deficiencies, embodiments of the present invention provide a substrate in-situ inspection system 100, as shown in FIG1. ​​The substrate in-situ inspection system 100 includes: at least one processing cavity 101 for performing process treatments (e.g., film formation / epitaxy / etching processes); each processing cavity 101 is provided with a base 111, the base 111 including at least one mounting groove 112 for supporting a substrate 107, the substrate 107 including a substrate and / or a carrier disk supporting the substrate; a transfer cavity 102 connected to the processing cavity 101, the transfer cavity 102 being provided with a robotic arm 124 for transferring the substrate 107 to or out of the processing cavity 101; A transmission channel 103 and a first gate valve 131 are provided at the connection between the processing chamber 101 and the transmission chamber 102. When the first gate valve 131 is closed, the transmission channel 103 is sealed, so that the transmission chamber 102 is relatively isolated from the processing chamber 101. When the first gate valve 131 is opened, the transmission channel 103 is open, and the transmission chamber 102 communicates with the processing chamber 101 through the transmission channel 103. A detection component 104 is disposed in the transmission chamber 102. The detection component 104 acquires image data in the processing chamber 101 through the transmission channel 103 and determines whether the base 111 and / or the substrate 107 have reached the designated position.

[0025] By placing the detection component 104 inside the transmission cavity 102, in-situ detection of the base 111 and / or substrate 107 can be completed through the transmission channel 103. Furthermore, since the detection component 104 is placed outside the processing cavity 101 (i.e. inside the transmission cavity 102), the detection component 104 will not damage the sidewall structure of the processing cavity 101, thereby avoiding affecting the gas field and temperature field distribution inside the processing cavity 101 and improving the process effect of the processing cavity 101. At the same time, it avoids the influence of the complex environment inside the processing cavity 101 on the detection results, especially the influence of the cavity environment inside the processing cavity after multiple processes on the detection results, thus improving the accuracy of in-situ detection of the substrate 107.

[0026] As shown in Figures 1 and 2, the detection component 104 is disposed on the cavity wall of the transmission cavity 102 opposite to the first gate valve 131; the entrance of the transmission channel 103 located in the transmission cavity 102 is defined as the detection window 132, and the height of the detection component 104 on the cavity wall is higher than the height of the detection window 132, so as to ensure that the detection component 104 can detect the image data of the mounting groove 112 and / or the substrate 107 on the base 111 through the detection window 132 and the transmission channel 103, and obtain more local details of the mounting groove 112 and / or the substrate 107 or the cooperation details of the two from a larger top view angle. Furthermore, when the transmission cavity 102 is connected to multiple processing cavities 101 (the transmission cavity 102 in Figure 1 is connected to two processing cavities 101), the connection between each processing cavity 101 and the transmission cavity 102 is separated by a first gate valve 131. Each first gate valve 131 is provided with a corresponding detection component 104 on the cavity wall of the transmission cavity 102 opposite to it. The detection range of each detection component 104 at least covers part of the mounting plane of the base 111 in the corresponding processing cavity 101, so as to obtain image data of the mounting area when at least part of the mounting groove 112 is empty or when the substrate 107 is located in the mounting groove 112.

[0027] In a preferred embodiment, as shown in FIG2, the cavity wall of the transmission cavity 102 is composed of a bottom wall 121, a side wall 122, and a top cover 123. The detection component 104 is mounted on the side wall 122, thereby enabling the detection component 104 to have a better detection angle and improving the quality of the acquired image data. As shown in FIG2, the detection component 104 includes an image sensor 141, used to acquire images of the base 111 and / or substrate 107 in the processing cavity through the transmission channel 103 as the image data.

[0028] When the processing chamber 101 is in a vacuum high-temperature transfer environment, the base 111 inside the processing chamber 101 is actually in a bright state because the temperature in the vacuum high-temperature environment is approximately 500-900℃. After the first gate valve 131 is opened, the image sensor 141 can acquire the image of the base 111 through the transmission channel 103. That is to say, no additional lighting is required to complete the detailed imaging of a local area of ​​the base 111. When the processing chamber 101 is in a non-high-temperature transfer environment, the light inside the processing chamber 101 is poor. Therefore, an additional light source is needed for supplementary lighting to make the detailed features of the base 111 and the substrate 107 more obvious, thereby obtaining clearer image data.

[0029] Specifically, as shown in Figure 2, the detection component 104 further includes an illumination component 142, which emits light to the base 111 through the transmission channel 103. The illumination component 142 forms a detection angle relative to the mounting plane of the base 111, and the image sensor 141 forms a detection angle relative to the mounting plane of the base 111. The detection angle is lower than the detection angle. This arrangement allows the light emitted by the illumination component 142 to cover the entire mounting plane of the base 111 more evenly, and at the same time, it can capture the edges of the mounting plane of the base 111 more clearly, thereby obtaining clearer image data, which helps in the in-situ detection of the substrate 107 and improves the accuracy of in-situ detection.

[0030] Furthermore, as shown in Figure 1, the substrate in-situ detection system 100 also includes a load locking cavity 105, which is connected to the transfer cavity 102 via a second valve 106 and is used to hold the substrate 107. The robot arm 124 removes the substrate 107 from the load locking cavity 105 and transfers it to the processing cavity 101 for processing, or removes the substrate 107 from the processing cavity 101 and puts it back into the load locking cavity 105, thus completing the automatic transfer of the substrate 107 in the substrate in-situ detection system 100.

[0031] Another embodiment of the present invention provides a substrate in-situ detection method, implemented using the substrate in-situ detection system 100 provided in the embodiment shown in FIG. 2. As shown in FIG. 4, the method includes: opening a first gate valve 131 to connect the transmission chamber 102 and the processing chamber 101 through a transmission channel 103; a detection component 104 capturing a first image containing a substrate 107 through the transmission channel 103, and determining whether the substrate 107 is placed in the mounting slot 112 of the base 111 based on the first image; if the substrate 107 is not placed in the mounting slot 112 of the base 111, it is determined that the substrate 107 is not in place, and a first alarm signal is output. The substrate 107 includes a substrate and / or a carrier disk for supporting the substrate.

[0032] The method for determining whether the substrate 107 is placed in the mounting slot 112 of the base 111 includes: identifying the local contour lines of the substrate 107 and the mounting slot 112 in the first image, and based on whether or not there is a shadow width exceeding a threshold in the contour line area, giving a corresponding judgment on whether or not the substrate 107 is placed in the mounting slot 112 of the base 111. Since the contour line area is where the surfaces of two different objects come into contact, the light will change significantly here. In this embodiment, there are obvious contour lines at the edges where the carrier disk and the mounting slot 112 or the substrate and the mounting slot 112 meet. If the edges of the carrier disk / substrate and the mounting slot 112 are aligned, the contour line area will transition smoothly, the contour lines of the two are very close, and there will be no wide bright or dark areas between their contour lines, indicating that the carrier disk or substrate is placed in the mounting slot 112. Conversely, if the carrier / base cannot be completely placed within the mounting groove 112, a step will form at the edge where the carrier / base meets the mounting groove 112. This increases the distance between their outlines, resulting in a wider bright or dark area in the captured image, creating a larger shadow. This outline area allows for a more intuitive and convenient determination of the positional relationship between the substrate and the mounting groove 112, improving the accuracy of substrate in-situ detection and saving judgment time.

[0033] Another embodiment of the present invention provides a substrate transfer method, which is performed using the substrate presence detection system 100 provided in the embodiment shown in FIG2. As shown in FIG5, it includes: keeping the first valve 131 in the open state, so that the transfer cavity 102 and the processing cavity 101 are connected through the transfer channel 103; performing a substrate 107 transfer operation in the current mounting slot 112 of the base 111; the substrate transfer operation includes: transferring the substrate 107 into the mounting slot 112 and performing substrate 107 presence detection; wherein, the step of performing substrate 107 presence detection includes: step S1, the detection component 104 of the substrate presence detection system 100 captures a first image containing at least part of the substrate 107 through the transfer channel 103; step S2, determining whether the substrate 107 is placed in the current mounting slot 112 based on the first image; if it is determined that the substrate 107 is not placed in the current mounting slot 112, a first alarm signal is output; otherwise, it is considered that the substrate 107 transfer operation in the current mounting slot 112 is completed, and the next instruction is awaited. Generally, after the transfer operation of the substrate 107 in the current placement slot 112 is completed, the transfer of the substrate 107 in the next placement slot 112 begins, until the transfer operation of all substrates 107 is completed. The determination of whether the substrate 107 is placed in the current placement slot 112 based on the first image is also made by comparing the local contour lines of the substrate 107 and the placement slot 112.

[0034] Furthermore, the step of outputting a first alarm signal if it is determined that the substrate 107 is not placed in the current placement slot 112 also includes stopping all transmission operations to avoid damage to the equipment caused by continued transmission operations, which could lead to production interruption and affect production efficiency and output.

[0035] Furthermore, before performing the step of transferring the substrate 107 into the current mounting slot 112 of the base 111, the method further includes: moving the current mounting slot 112 to a designated position and detecting the position of the current mounting slot 112 by the substrate in-situ detection system 100.

[0036] The step of detecting the position of the current mounting slot 112 by the substrate in-situ detection system 100 includes: the detection component 104 taking a second image containing the current mounting slot 112 through the transmission channel 103, and calculating whether the base 111 has reached the designated position based on the second image; if the base 111 has reached the designated position, the transmission program is allowed to continue, for example, the operation of transmitting the substrate 107 is performed (as shown in Figure 3); otherwise, the position of the base 111 is adjusted based on the difference between the actual position and the designated position of the base 111 so that the base 111 reaches the designated position; or, any transmission operation is stopped and a second alarm signal is output to ensure the safety of the production process.

[0037] The method for calculating whether the base 111 has reached the designated position includes: recognizing the local contour line of the mounting groove 112 through the second image, calculating the center position of the mounting groove 112 on the base 111 through the local contour line, and determining whether the designated position has been reached by checking whether the displacement deviation between the calculated center position and the designated position is within a threshold range, thereby ensuring that the substrate can be accurately placed in the corresponding mounting groove 112, reducing displacement deviation, and improving operational accuracy.

[0038] By placing the detection component 104 inside the transmission cavity 102, the present invention enables in-situ detection of the base 111 and / or substrate 107 through the transmission channel 103, reducing the impact of the detection component 104 on the gas field and temperature field distribution inside the processing cavity 101 and improving the process effect of the processing cavity 101; at the same time, it avoids the influence of the complex environment inside the processing cavity 101 on the in-situ detection results of the substrate 107, thereby improving the accuracy of the in-situ detection of the substrate 107.

[0039] Secondly, by placing the image sensor 141 on the cavity wall of the transmission chamber 102 opposite to the first valve 131, assembly, debugging, and maintenance are facilitated. Furthermore, by setting up the illumination component 142, the edge of the mounting plane of the base 111 can be captured more clearly in a non-high-temperature transfer environment, resulting in clearer image data and improving the accuracy of in-situ detection of the substrate 107.

[0040] It should be noted that, in the embodiments of the present invention, the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing the embodiments. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0041] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0042] Although the present invention has been described in detail through the preferred embodiments above, it should be understood that the above description should not be considered as a limitation of the present invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above description. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A substrate in-situ detection system, characterized by, The system comprises: at least one processing cavity, which is provided with a pedestal, the pedestal comprising at least one loading slot for loading a substrate, the substrate comprising a wafer and / or a wafer carrier; a transfer cavity connected to the processing cavity, which is provided with a robot for transferring the substrate into or out of the processing cavity; a transfer channel is provided at the connection between the processing cavity and the transfer cavity, and a first door valve is provided on the transfer channel; when the first door valve is closed, the transfer channel is sealed, and the transfer cavity is isolated from the processing cavity; when the first door valve is opened, the transfer channel is open, and the transfer cavity is in communication with the processing cavity; a detection assembly is provided in the transfer cavity; the detection assembly acquires image data of the processing cavity through the transfer channel, and determines whether the pedestal and / or the substrate reaches a designated position.

2. The substrate in situ detection system of claim 1, wherein, The detection assembly is provided on the cavity wall opposite to the first door valve; the entrance of the transfer channel in the transfer cavity is defined as a detection window, and the height of the detection assembly on the cavity wall is higher than the height of the detection window.

3. The substrate in situ detection system of claim 1, wherein, The cavity wall of the transfer cavity is composed of a bottom wall, a side wall and a top cover; and the detection assembly is installed on the side wall.

4. The substrate in situ detection system of claim 1, wherein, The detection assembly comprises an image sensor for acquiring the image of the pedestal and / or the substrate in the processing cavity through the transfer channel as the image data.

5. The substrate in situ detection system of claim 4, wherein, The detection assembly further comprises an illumination component for emitting light to the pedestal through the transfer channel; the illumination component forms an illumination angle relative to the loading plane of the pedestal, and the image sensor forms a detection angle relative to the loading plane of the pedestal, and the illumination angle is lower than the detection angle.

6. The substrate in situ detection system of claim 1, wherein, The transfer cavity is connected to multiple processing cavities, and the connection between each processing cavity and the transfer cavity is separated by a first door valve; a corresponding detection assembly is provided on the cavity wall opposite to each first door valve, and the detection range of each detection assembly covers at least part of the loading plane of the pedestal in the corresponding processing cavity.

7. A method of in-situ detection of a substrate, characterized by, The substrate in-position detection system according to any one of claims 1-6 is used to perform the following steps: opening the first door valve; the detection assembly captures a first image containing the substrate through the transfer channel, and determines whether the substrate is placed in the loading slot of the pedestal according to the first image; if the substrate is not placed in the loading slot of the pedestal, it is determined that the substrate is out of position, and a first alarm signal is output.

8. The method of claim 7, wherein the substrate in- place detection is performed by a method comprising: The method for determining whether the substrate is placed in the loading slot of the pedestal comprises: identifying the local contour line of the substrate and the loading slot in the first image, and giving a judgment on whether the substrate is placed in the loading slot of the pedestal based on whether the shadow width in the contour line area exceeds a threshold value.

9. A substrate transport method, characterized by, The substrate in-position detection system according to any one of claims 1-6 is used to perform the following steps: keeping the first door valve in an open state; performing a substrate transfer operation into the current loading slot of the pedestal; the substrate transfer operation comprises: transferring the substrate into the loading slot, and performing substrate in-position detection. The substrate in-place detection step includes: step S1, the detection component of the substrate in-place detection system captures a first image containing at least part of the substrate through the transmission channel; step S2, whether the substrate is placed in the current loading slot is determined according to the first image. If it is determined that the substrate is not placed in the current loading slot, a first alarm signal is output.

10. The method of claim 9, wherein, The step of outputting the first alarm signal if it is determined that the substrate is not placed in the current loading slot further includes stopping all transmission operations.

11. The method of claim 9, wherein, The step of performing the substrate transmission operation of the current loading slot of the base further includes moving the current loading slot to a specified position and detecting the position of the current loading slot by the substrate in-place detection system. The step of detecting the position of the current loading slot by the substrate in-place detection system includes: the detection component captures a second image containing the current loading slot through the transmission channel, and calculates whether the base reaches the specified position according to the second image. If the base reaches the specified position, the transmission program is allowed to continue to be executed. If not, the base position is adjusted based on the difference between the actual position of the base and the specified position so that the base reaches the specified position; or any transmission operation is stopped and a second alarm signal is output.

12. The method of claim 11, wherein, The method of calculating whether the base reaches the specified position includes: identifying the local contour line of the loading slot through the second image, calculating the center position of the loading slot of the base through the local contour line, and judging whether the base reaches the specified position by whether the displacement deviation between the calculated center position and the specified position is within a threshold range.

Images