Electrical connection apparatus and manufacturing process therefor

Abstract

Provided are an electrical connection apparatus and a manufacturing process therefor. The electrical connection apparatus is used for connecting an electrical apparatus to a wire and transferring electrical energy, and comprises a contact portion (1) and a connection portion (2) which are connected to each other, wherein at least part of the region of the contact portion (1) is a contact area (101) connected to the electrical apparatus, and at least part of the region of the connection portion (2) is a connection area (201) connected to the wire; and the surface of the contact portion (1) is electroplated with an underlying plating layer (3), the surface of the contact area (101) on the underlying plating layer (3) is electroplated with a surface plating layer (4), and the regions of the electrical connection apparatus from which the surface of the contact area (101) and the surface of the connection area (201) are removed are provided with an insulating coating layer (5). By using a partial plating method instead of electroplating a surface plating layer on the surface of the entire apparatus, the amount of precious metals used is reduced, which effectively lowers the production costs, thereby solving the problems of serious precious metal waste and high production costs that are caused by the overall plating of the surface of an electrical connection apparatus.

Description

An electrical connection device and its manufacturing process

[0001] Related applications

[0002] This application claims priority to Chinese Patent Application No. 202410964035.0, filed on July 18, 2024, and incorporates the entire contents of the aforementioned patent application as part of this application. Technical Field

[0003] This disclosure relates to the field of electrical connection technology, and more specifically, to an electrical connection device and its manufacturing process. Background Technology

[0004] Before use, electrical connection devices are generally plated with an overall electroplating or chemical plating method to meet the requirements of electrical connection with electrical devices and wires.

[0005] The current conventional method is to apply a plating layer to the entire electrical connection surface. However, this method results in a large area of ​​non-functional areas or areas where plating is not required for the electrical connection device, leading to serious waste of precious metals and high production costs.

[0006] Therefore, a new structure and method are needed to solve the above problems. Summary of the Invention

[0007] This disclosure provides an electrical connection device for connecting an electrical device to a wire and transmitting electrical energy. It includes a contact portion and a connecting portion that are interconnected. At least a portion of the contact portion is a contact area for connecting to the electrical device, and at least a portion of the connecting portion is a connecting area for connecting to the wire. The surface of the contact portion is electroplated with an underlayer, and the contact area is electroplated with a toplayer on the surface of the underlayer. An insulating coating is provided on the electrical connection device in areas other than the surfaces of the contact area and the connecting area.

[0008] Optionally, the melting point of the insulating coating is higher than the ambient temperature during electroplating.

[0009] Optionally, when the surface plating and the insulating coating are located on the same side of the electrical connection device, the surface of the surface plating is higher than the surface of the insulating coating.

[0010] Optionally, an anti-corrosion coating covering the boundary between the surface coating and the insulating coating is further provided in the interface area between the surface coating and the insulating coating.

[0011] Optionally, the contact portion is a plate-shaped structure with a through hole, and the contact area is the inner wall of the through hole and at least a portion of the surface of the contact portion near both ends of the through hole.

[0012] Optionally, the connecting part is a plate-like structure, and the connecting area is the side that contacts the wire or the end that contacts the wire.

[0013] Optionally, the contact portion is a cylindrical structure, and the contact area is at least a portion of the inner wall surface of the cylindrical structure.

[0014] Optionally, the connecting part is a cylindrical structure or a U-shaped structure, and the connecting area is at least a portion of the inner wall surface of the cylindrical structure or at least a portion of the inner surface of the U-shaped structure.

[0015] Optionally, a transition portion is further provided between the contact portion and the connecting portion, and the insulating coating includes a general coating and a heat-resistant coating, wherein the heat-resistant coating is disposed on the surface of the transition portion and / or part of the surface of the connecting portion.

[0016] Optionally, the melting point of the heat-resistant coating is greater than that of the ordinary coating.

[0017] According to another aspect of the present disclosure, a manufacturing process for an electrical connection device is provided, comprising the following steps:

[0018] S10. Define a connection area on the electrical connection device and provide a first shielding layer on the connection area;

[0019] S20, Electroplating: Electroplating the underlying plating layer onto the surface of the contact portion;

[0020] S30. A contact area is defined on the electrical connection device, and a second shielding layer is provided on the contact area;

[0021] S40. The insulating coating is provided on the surface of the electrical connection device;

[0022] S50. Remove the second shielding layer to expose the contact area, while retaining the first shielding layer;

[0023] S60, electroplating, electroplating the surface layer on the surface of the contact area;

[0024] S70. Remove the first masking layer to expose the connection area.

[0025] Optionally, step S05 is provided before step S10: a pretreatment process, which includes sequential ultrasonic degreasing, alkaline etching, and acid etching of the electrical connection device.

[0026] Optionally, if the melting point of the second shielding layer is below 100°C, in step S50, the second shielding layer is removed by immersing the electrical connection device in hot water.

[0027] Optionally, the melting points of the first shielding layer and the insulating coating are greater than the ambient temperature during electroplating.

[0028] Optionally, if the melting point of the insulating coating is greater than that of the first shielding layer, in step S70, the electrical connection device is placed in an environment with a temperature greater than that of the first shielding layer but less than that of the insulating coating, so that the first shielding layer melts and is removed.

[0029] Optionally, a transition portion is further provided between the contact portion and the connecting portion. In step S10, a third shielding layer is provided on the surface of the transition portion. After step S30, step S35 is further provided: the third shielding layer is removed to expose the surface of the transition portion, and a heat-resistant coating is provided on the surface of the transition portion.

[0030] Optionally, the melting point of the third shielding layer is greater than the working ambient temperature during electroplating, but less than the melting point of the ordinary coating.

[0031] Optionally, after step S70, step S80 is further included: in the junction area between the surface coating and the insulating coating, an anti-corrosion coating is also provided to cover the boundary between the surface coating and the insulating coating.

[0032] An electrical connection device and its manufacturing process according to an embodiment of the present disclosure have the following beneficial effects:

[0033] This disclosure provides a surface coating only in the contact area, which not only ensures the stability of signal and power transmission with electrical devices but also saves costs. Furthermore, an insulating coating 5 is provided on the area of ​​the electrical connection device excluding the contact and connection areas. The insulating coating 5 covers the surface of the underlying coating 3 on the contact portion 1 outside the contact area, preventing corrosion of the electrical connection device and providing insulation protection. This results in good conductivity, corrosion resistance, and suitability for mass production. The insulating coating is made of epoxy vinyl alcohol resin, which has good insulation properties and mechanical strength. Epoxy vinyl alcohol resin also has fluidity and processability, allowing it to be applied to the electrical connection device through various processes such as spraying and impregnation, simplifying operations and improving work efficiency.

[0034] By sequentially applying a base plating layer and a top plating layer to the contact area, the electrical connection device exhibits low contact resistance, resulting in more efficient power transmission and reduced energy loss and heat generation. Simultaneously, it significantly enhances corrosion resistance. The layered electroplating of the base and top plating layers improves the adhesion of both layers to the contact area surface, ensuring that the base and top plating layers remain intact and highly corrosion-resistant even after repeated insertions and removals.

[0035] Other features and advantages of this disclosure will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0036] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments of the present disclosure and, together with their description, serve to explain the principles of the present disclosure.

[0037] Figure 1 is a schematic diagram of the structure of the chip electrical connection device in an embodiment of this disclosure;

[0038] Figure 2 is a partial cross-sectional structural schematic diagram of the plate-type electrical connection device in an embodiment of this disclosure;

[0039] Figure 3 is an enlarged structural diagram of part A in Figure 2;

[0040] Figure 4 is a top view of the chip electrical connection device in an embodiment of this disclosure;

[0041] Figure 5 is a schematic diagram of the overall structure of the contact part being a cylindrical structure in an embodiment of this disclosure;

[0042] Figure 6 is a schematic diagram showing the transition section of the chip electrical connection device in conjunction with the heat-resistant coating;

[0043] Figure 7 is a flowchart of the manufacturing process of the electrical connection device;

[0044] Figure 8 is a manufacturing process flow diagram of the first embodiment of the insulating coating in the electrical connection device;

[0045] Figure 9 is a manufacturing process flow diagram of the second embodiment of the insulating coating in the electrical connection device;

[0046] Figure 10 is a manufacturing process flow diagram of the third embodiment of the insulating coating in the electrical connection device;

[0047] Figure 11 is a manufacturing process flow diagram of the fourth embodiment of the insulating coating in the electrical connection device;

[0048] Figure 12 is another flowchart of the manufacturing process of the electrical connection device;

[0049] Figure 13 is another flowchart of the manufacturing process of the electrical connection device.

[0050] Reference numerals: 1. Contact part; 101. Contact area; 102. Connecting hole; 2. Connecting part; 201. Connecting area; 3. Underlying coating; 4. Surface coating; 5. Insulating coating; 501. Ordinary coating; 502. Temperature resistant coating; 6. Anti-corrosion coating; 7. Transition part. Detailed Implementation

[0051] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present disclosure.

[0052] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit this disclosure or its application or use.

[0053] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0054] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0055] According to the present disclosure, an electrical connection device, as shown in FIG1, is used to connect an electrical device to a wire and transmit electrical energy, including a contact portion 1 and a connecting portion 2 connected to each other. At least a portion of the contact portion 1 is a contact area 101 for connecting to the electrical device, and at least a portion of the connecting portion 2 is a connecting area 201 for connecting to the wire. The surface of the contact portion 1 is electroplated with an underlayer plating 3, and the contact area 101 is electroplated with a top layer plating 4 on the surface of the underlayer plating 3. An insulating coating 5 is provided on the area of ​​the electrical connection device excluding the surfaces of the contact area 101 and the connecting area 201.

[0056] The electrical connection device is generally made of copper or copper alloy, or aluminum or aluminum alloy. The contact part 1 and the connection part 2 are integrally formed, which improves the structural stability and reliability of the entire electrical connection device.

[0057] This disclosure provides an underlayer coating 3 on the contact portion 1, which offers excellent protective performance, particularly in corrosive environments such as the atmosphere, alkalis, and certain acids. This is because the underlayer coating 3 has a strong passivation capability, enabling the rapid formation of an extremely thin passivation film on the surface, thereby isolating the substrate from the air and improving corrosion resistance.

[0058] This disclosure provides a surface coating 4 only in the contact area 101, which not only ensures the stability of signal and power transmission with electrical devices but also saves costs. Furthermore, an insulating coating 5 is provided on the electrical connection device, excluding the surfaces of the contact area 101 and the connection area 201. The insulating coating 5 covers the surface of the underlying coating 3 on the contact portion 1, located outside the contact area 101, preventing corrosion of the electrical connection device and providing insulation protection. This results in good conductivity, good corrosion resistance, and suitability for mass production. The insulating coating 5 is made of epoxy vinyl alcohol resin, which has good insulation properties and mechanical strength. Epoxy vinyl alcohol resin also has fluidity and processability, allowing it to be applied to the electrical connection device through various processes such as spraying and impregnation, simplifying operations and improving work efficiency.

[0059] By sequentially applying a bottom plating layer 3 and a top plating layer 4 to the contact area 101, the electrical connection device exhibits low contact resistance, resulting in more efficient power transmission and reduced energy loss and heat generation. Simultaneously, it enhances corrosion resistance. The layered electroplating of the bottom plating layer 3 and the top plating layer 4 improves the adhesion of both plating layers to the surface of the contact area 101, ensuring that the bottom plating layer 3 and the top plating layer 4 remain intact and highly corrosion-resistant even after repeated insertions and removals.

[0060] By using a partial plating method instead of electroplating the entire surface of the device, the amount of precious metals used is significantly reduced, effectively lowering production costs. This solves the problem of serious waste of precious metals and high production costs associated with overall plating of the surface of electrical connection devices.

[0061] In specific implementation, the bottom plating layer 3 is at least one of alkali copper, pyrometallurgical copper, electroless copper plating, electroless nickel plating, or nickel sulfamate; the surface plating layer 4 is a precious metal such as gold, silver, or platinum. Since the surface plating layer 4 is costly and only practically meaningful when placed in the contact area 101, this disclosure, to avoid resource waste, maintain sustainable development, and reduce the cost of the electrical connection device, only places the surface plating layer 4 in the contact area 101. This significantly reduces the amount of precious metals used, effectively lowers production costs, and maintains good conductivity and corrosion resistance in the electrical connection device.

[0062] According to one embodiment of the electrical connection device of this disclosure, the melting point of the insulating coating 5 is greater than the operating ambient temperature during electroplating.

[0063] The typical operating temperature for electroplating is 60℃~70℃. The insulating coating 5 can be made of epoxy vinyl alcohol resin, which has a melting point of 130-150℃. To prevent the insulating coating 5 from peeling off during the electroplating of the undercoat 3 and the topcoat 4, the melting point of the insulating coating 5 is set higher than the operating temperature of the electroplating environment. This prevents the insulating properties of the insulating coating 5 from failing due to temperature increases. Simultaneously, it also reduces process fluctuations caused by temperature changes, improving the stability and reliability of the electroplating process. Furthermore, the high melting point of the insulating coating 5 provides better durability and stability, reducing equipment maintenance and replacement costs due to the failure of the insulating coating 5.

[0064] According to one embodiment of the electrical connection device of this disclosure, as shown in FIG2, when the surface plating layer 4 and the insulating coating layer 5 are located on the same side of the electrical connection device, the surface of the surface plating layer 4 is higher than the surface of the insulating coating layer 5. That is, the outer surface of the surface plating layer 4 protrudes from the outer surface of the insulating coating layer 5, which can ensure better contact between the electrical device and the surface plating layer 4, and ensure the stability of the electrical connection between the electrical connection device and the electrical device; at the same time, it can ensure that the contact area 101 of the electrical connection device connected to the electrical device is not covered by the insulating coating layer 5, thereby maintaining efficient electrical conductivity; and it can clearly define the conductive and non-conductive parts, allowing operators and maintenance personnel to clearly identify the contact area 101 to prevent electric shock and improve work safety. It also helps to more easily identify and adjust the connection points during assembly and debugging, improving work efficiency.

[0065] It should be noted that when stamping the electrical connection device, a boss structure can be designed in the contact area 101 so that the surface of the surface plating layer 4 can be more accurately made higher than the surface of the insulating coating layer 5 during the plating process.

[0066] According to one embodiment of the electrical connection device of this disclosure, as shown in FIG3, an anti-corrosion coating 6 is further provided at the interface between the surface plating layer 4 and the insulating coating 5, covering the boundary between the surface plating layer 4 and the insulating coating 5. In other words, the area where the surface plating layer 4 contacts the insulating coating 5 is covered by the anti-corrosion coating 6. This prevents the interface between the surface plating layer 4 and the insulating coating 5 of the electrical connection device from being exposed, thus avoiding corrosion of the electrical connection device at the exposed location.

[0067] The interface area is often the starting point for coating failure because the physical and chemical properties of the insulating coating 5 and the surface plating 4 may differ. The anti-corrosion coating 6 acts as a "bridge" between the surface plating 4 and the insulating coating 5, reducing interface problems such as peeling and blistering caused by incompatibility between the coating and plating. Through its good adhesion and compatibility, it enhances the bonding force between the insulating coating 5 and the surface plating, making the entire coating system more stable and reliable. Furthermore, the anti-corrosion coating 6 provides an effective protective layer for the surface plating 4 and the insulating coating 5, effectively preventing direct contact between water, oxygen, corrosive gases, and other media and the electrical connection device, thereby slowing down or preventing corrosion. This significantly enhances the corrosion resistance of the entire electrical connection device and extends its service life. In addition, the anti-corrosion coating 6 makes it easier to detect potential problems in the interface area during inspection and maintenance. Once signs of coating damage or corrosion are found, timely repair or replacement can be carried out to prevent the problem from escalating. The presence of the anti-corrosion coating 6 enhances the durability of the entire coating system, thereby extending the replacement cycle of the electrical connection device and reducing maintenance costs.

[0068] It should be noted that, in this embodiment, the anti-corrosion coating 6 can be made of epoxy resin, which has excellent mechanical properties and adhesion strength to the metal substrate. It can effectively prevent water, oxygen, corrosive gases, and other media from directly contacting the electrical connection device, thereby slowing down or preventing the corrosion process. In other embodiments, isocyanate or silyl ester materials can also be used, depending on actual needs, and no limitations are made here.

[0069] According to an embodiment of the electrical connection device of this disclosure, as shown in Figures 2 to 4, the contact portion 1 is a plate-like structure with a through-hole 102. The contact area 101 is the inner wall of the through-hole 102 and at least a portion of the surface of the contact portion 1 near both ends of the through-hole 102. The specific shape of the contact area 101 can be matched to the shape of the electrical device to which it is connected. The plate-like structure of the contact portion 1 is mechanically more stable and can withstand greater stress and pressure. Under dynamic conditions such as insertion / removal or vibration, this design can reduce the risk of deformation and damage to the contact portion 1, ensuring the stability and durability of the electrical connection. The inner wall of the through-hole 102 and the surfaces of the contact portion 1 at both ends together constitute the contact area 101. Compared to a single contact surface, this design significantly increases the contact area. The increased contact area means more current channels and more stable electrical contact, thereby improving the reliability of the contact. At the same time, the contact area 101 facilitates visual inspection and maintenance by personnel. When a problem is found, the fault point can be more easily located and corresponding maintenance measures can be taken.

[0070] According to one embodiment of the electrical connection device of this disclosure, as shown in FIG4, the connection part 2 is a plate-like structure, and the connection area 201 is the side or end in contact with the wire. The plate-like structure provides a larger contact area, which helps reduce contact resistance, improve current transmission efficiency, and reduce energy loss in electrical connections. The plate-like structure also has good rigidity and stability, resisting deformation and displacement under external forces. Under conditions requiring mechanical stress or vibration, this design ensures a stable connection between the wire and the connection part 2, preventing malfunctions caused by loosening or detachment. Furthermore, when current flows, the connection part 2 generates heat; the plate-like structure, with its large surface area, can more effectively dissipate this heat to the surrounding environment, thereby maintaining a lower operating temperature and extending service life.

[0071] According to one embodiment of the electrical connection device of this disclosure, as shown in FIG5, the contact portion 1 is a cylindrical structure, and the contact area 101 is at least a portion of the inner wall surface of the cylindrical structure. The inner wall surface of the cylindrical structure provides a longer contact path, thereby increasing the contact area with wires or other connectors. This helps to reduce contact resistance, improve the efficiency and stability of current or signal transmission, and reduce energy loss and heat generation. The cylindrical structure can better enclose the connector of the electrical device, forming a mating relationship similar to "male and female terminals". This mating method can increase the tightness and stability of the connection, preventing loosening or detachment due to external factors such as vibration, impact, or temperature changes. In addition, the cylindrical structure has good guiding properties, making it easier to achieve precise alignment during installation, reducing installation difficulty, and improving work efficiency. Moreover, in some working conditions requiring waterproofing and dustproofing, the cylindrical structure can be sealed (e.g., using sealing rings, sealant, etc.) to prevent moisture and dust from entering the contact portion 1, thereby protecting the safety and reliability of the electrical connection.

[0072] The contact area 101 can also be at least part of the outer wall surface of a cylindrical structure. When the electrical connection device is plugged into the electrical device, the contact portion 1 of the cylindrical structure is inserted into the target terminal, and the contact between the outer wall of the cylindrical structure and the inner wall of the target terminal realizes the electrical connection between the electrical connection device and the electrical device.

[0073] According to one embodiment of the electrical connection device of this disclosure, as shown in FIG5, the connection portion 2 is a cylindrical structure or a U-shaped structure, and the connection area 201 is at least a portion of the inner wall surface of the cylindrical structure or at least a portion of the inner surface of the U-shaped structure. Both the cylindrical and U-shaped structures have strong adaptability and flexibility, enabling them to accommodate wires of various shapes and sizes for connection. The cylindrical structure can provide a tightly wrapped connection as mentioned above, while the U-shaped structure can provide a more flexible connection direction and spatial layout under certain operating conditions. Moreover, by setting the connection area 201 as the inner wall surface or a portion of the inner surface of the cylindrical and U-shaped structures, the contact area and contact quality of the electrical connection can be more effectively controlled. This helps to reduce contact resistance, improve the transmission efficiency of current or signals, and reduce energy loss and heat generation problems caused by poor contact.

[0074] According to an embodiment of the electrical connection device of this disclosure, as shown in Figures 4 and 6, a transition portion 7 is further provided between the contact portion 1 and the connection portion 2, and the insulating coating 5 includes a general coating 501 and a heat-resistant coating 502, with the heat-resistant coating 502 disposed on the surface of the transition portion 7 and / or part of the surface of the connection portion 2.

[0075] The transition section 7 helps to distribute and withstand stress deformation from the connecting section 2 and the contact section 1, reducing structural damage that may result from direct connection and increasing the stability and reliability of the overall structure. It also allows for flexible adjustment of the connection direction.

[0076] In this embodiment, based on its good insulation performance and cost-effectiveness, a common coating 501 is used on the contact portion 1. The contact portion 1 typically comes into direct contact with electrical devices, therefore requiring good insulation performance to ensure the safe operation of the circuit. The common coating 501 meets this requirement while maintaining a low cost. During the spot welding process between the connection portion 2 and the wire, instantaneous high temperatures are generated. These high temperatures can damage or melt the adjacent common coating 501, thus affecting the insulation of the connection and overall safety. Therefore, a heat-resistant coating 502 is used on the connection portion 2. The heat-resistant coating 502 not only provides basic insulation performance but also effectively isolates the common coating 501 from the direct effects of high temperatures, preventing its melting and ensuring the insulation of the connection.

[0077] The integrity of the insulating coating 5 is crucial for preventing electrical short circuits, leakage, and other safety issues. Damage to the insulating coating 5 can lead to serious safety hazards. The protective effect of the heat-resistant coating 502 over the ordinary coating 501 prevents these problems and extends the service life of the entire connection structure.

[0078] It should be noted that in this embodiment, the connection area 201 can be the entire surface of the connection portion 2. In this case, the heat-resistant coating 502 is applied to the transition portion 7 to prevent the high temperature generated during the welding connection between the wire and the connection portion 2 from affecting the ordinary coating 501 applied to the contact portion 1. As shown in Figures 1 and 2, the connection area 201 can also be a portion of the surface of the connection portion 2. If the connection area 201 is set in this way, then the heat-resistant coating 502 on the transition portion 7 should extend to the area of ​​the connection portion 2 excluding the surface of the connection area 201, further preventing the high temperature during welding from directly affecting the ordinary coating 501 and preventing the ordinary coating 501 from melting. At the same time, in electrical connections, additional insulation protection can be provided to prevent current leakage in paths where it should not flow, ensuring the safety and stability of the electrical system.

[0079] In some embodiments, the melting point of the heat-resistant coating 502 is higher than that of the ordinary coating 501. In this embodiment, the ordinary coating 501 can be made of epoxy vinyl alcohol resin, which has a melting point of 130-150°C. It has good insulation properties, weather resistance, and mechanical strength, preventing current from flowing in unexpected paths and reducing the risk of short circuits and electric shocks. It also has high hardness and wear resistance, ensuring the stability and reliability of electrical connections. In addition, epoxy vinyl alcohol resin also has good flowability and processability, and can be coated onto electrical connection devices through various processes such as spraying and impregnation, which is simple to operate and can improve work efficiency. The heat-resistant coating 502 can be made of polytetrafluoroethylene (PTFE), which has high temperature resistance, excellent insulation, and corrosion resistance. Its melting point is 327°C, which can meet the requirements of high-temperature environments. It can maintain stable insulation properties in high-temperature and high-humidity environments and can resist the erosion of corrosive substances such as acids, alkalis, and salts. In other embodiments, the heat-resistant coating 502 can also be made of other materials, which can be set according to actual needs, and no limitation is made here. The high melting point of the heat-resistant coating 502 enables it to remain stable in high-temperature environments, preventing it from melting or failing. This allows the heat-resistant coating 502 to effectively isolate the ordinary coating 501 from the direct impact of the instantaneous high temperature generated during the spot welding connection between the connector 2 and the wire, thus preventing the ordinary coating 501 from melting.

[0080] The manufacturing process of the electrical connection device according to this disclosure, as shown in Figure 7, includes the following steps:

[0081] S10. Define a connection area 201 on the electrical connection device and provide a first shielding layer on the connection area 201;

[0082] S20, electroplating, electroplating a base layer 3 onto the surface of the contact part 1;

[0083] S30. Define a contact area 101 on the electrical connection device and provide a second shielding layer on the contact area 101;

[0084] S40. An insulating coating 5 is provided on the surface of the electrical connection device;

[0085] S50. Remove the second shielding layer to expose the contact area 101, while retaining the first shielding layer;

[0086] S60, electroplating, electroplating a surface layer 4 on the surface of the contact area 101;

[0087] S70. Remove the first masking layer to expose the connection area 201.

[0088] In S10, the first shielding layer is used to avoid setting the insulating coating 5, the bottom plating layer 3 and the top plating layer 4 in the connection area 201.

[0089] S20. Electroplating an underlayer 3 on the surface of the contact portion 1 provides excellent protective performance, especially in corrosive environments such as the atmosphere, alkalis, and certain acids. This is because the underlayer 3 has a strong passivation capability, which can quickly form an extremely thin passivation film on the surface, thereby isolating the substrate from the air and improving corrosion resistance.

[0090] Electroplating is a process that uses electrolysis to attach a metal film to the surface of the contact part 1 to form a bottom plating layer 3, which prevents the contact part 1 from being corroded and improves its wear resistance, conductivity, reflectivity, corrosion resistance and aesthetics.

[0091] S30. A contact area 101 is defined on the electrical connection device, and a second shielding layer is provided on the contact area 101; the second shielding layer prevents the formation of an insulating coating 5 on the bottom plating layer 3 of the contact area 101.

[0092] S40. An insulating coating 5 is provided on the surface of the electrical connection device; that is, an insulating coating is provided at the location where the connection area 201 and the contact area 101 are removed. The insulating coating 5 of the contact part 1 is formed on the bottom coating outside the contact area 101. It is used to protect the non-conductive area, prevent safety hazards such as short circuit and electric shock, improve the safety of the device, and ensure the insulation performance of the non-conductive area.

[0093] S50. Remove the second shielding layer to expose the contact area 101, preparing for the electroplating of the surface coating 4 in S60. Retain the first shielding layer to prevent the formation of the surface coating 4 in the connection area 201.

[0094] S60. Electroplating: Electroplating a surface coating 4 on the surface of the contact area 101 to ensure the stability of signal transmission and power transmission between the electrical connection device and the electrical device. In this disclosure, the surface coating 4 is only provided in the contact area 101, which can reduce the amount of raw materials used for the surface coating 4 and reduce the production cost of the electrical connection device.

[0095] S70. Remove the first shielding layer to expose the connection area 201. The melting point of the first shielding layer is below 100°C. Place the electrical connection device in boiling water to remove the first shielding layer.

[0096] In specific implementation, the first shielding layer in S10 can be epoxy ethylene ether resin with a melting point of 90℃-110℃.

[0097] The coating process for the first masking layer:

[0098] (1) Place the electrical connection device into mold A and fix it in place. The mold will cover the area of ​​connection area 201.

[0099] (2) Spray the first masking layer onto the exposed connection area 201 of mold A;

[0100] (3) Remove mold A;

[0101] (4) Set a hanging point at the side rib position of the contact part 1, put the electrical connection device (terminal) into the curing oven, bake at 115°C for 30 minutes, then cool down to 60°C for 1 hour to cure the first shielding layer (epoxy ethylene ether resin) and finally cool to room temperature.

[0102] It should be noted that in step (2) of the coating process for the first masking layer, the first masking agent sprayed is epoxy ethylene ether resin powder. The epoxy ethylene ether resin powder needs to be melted at a relatively high temperature and then cooled to form a tight protective layer.

[0103] As shown in Figure 2, in S20, the surface of the contact portion 1 is electroplated with a bottom layer 3 and in S60, a top layer 4 is electroplated on the surface of the bottom layer 3. Taking a chip electrical connection device as an example, the bottom layer 3 is formed by electroplating Ni (nickel sulfamate) at a thickness of 25-30 μm on the surface of the contact portion 1. The top layer 4 is formed by electroplating silver at a thickness of 3-6 μm on the bottom layer 3 located in the contact area 101. The remaining part is an unplated area.

[0104] As shown in Figure 5, taking the charging dock slotted electrical connection device as an example, its inner surface is the contact area 101. The contact part 1 is designed with an electroplated nickel bottom layer 3. Silver is electroplated on the bottom layer 3 located in the contact area 101 to form a surface layer 4. The nickel layer of the bottom layer 3 is 3-5 μm thick, and the silver layer 4 is electroplated 10-15 μm thick; the rest of the part has no plating.

[0105] In S30, the second shielding layer can be paraffin wax with a melting point of 47℃-64℃;

[0106] The coating process for the second masking layer is as follows:

[0107] (1) Place the electrical connection device into mold B and fix it in place, with only the contact area 101 exposed in the mold;

[0108] (2) Inject paraffin wax into the mold and coat it on the exposed contact area 101;

[0109] (3) Cool for 10 minutes to allow the second shielding layer material to cool and solidify;

[0110] (4) Use a knife to remove the excess paraffin wax that has overflowed from the mold, so that the second masking layer material (paraffin wax) is evenly covered.

[0111] (5) Remove mold B.

[0112] S40, the insulating coating 5 includes a general coating 501 and a heat-resistant coating 502. When the connection area 201 of the electrical connection device is the entire surface of the connection part 2, as shown in FIG8, in step S40', a general coating 501 is provided on the area of ​​the contact part 1 excluding the surface of the contact area 101; the general coating 501 may be epoxy vinyl alcohol resin with a melting point of 130-150°C.

[0113] Coating process for ordinary coating 501:

[0114] (1) The electrical connection device coated with the first masking layer and the second masking layer is placed into the C mold and fixed. The C mold covers the entire connection area 201 and the contact area 101, exposing the rest of the electrical connection device.

[0115] (2) Apply ordinary coating 501 to the exposed parts of the electrical connection device;

[0116] (3) Remove mold C;

[0117] (4) Place the electrical connection device (terminal) into the curing oven, bake at 155°C for 30 minutes, then cool down to 60°C for 1 hour to cure the insulating coating material 5 (epoxy vinyl alcohol resin), and finally cool to room temperature.

[0118] It should be noted that before placing the electrical connection device into the curing oven, different molds should be used to protect and fasten the contact area 101 and the connection area 201 respectively, so as to prevent the first and second shielding layers from melting and losing during the melting and curing process of the insulating coating 5, thus rendering the shielding layer ineffective.

[0119] Method for removing the second shielding layer in S50:

[0120] (1) Place the electrical connection device into mold D, exposing only the contact area 101 to be electroplated, while the insulating coating 5 on it is exposed.

[0121] (2) Use a knife to remove the insulating coating 5 material and part of the thickness of the second shielding layer on the contact area 101. At this time, there is only the second shielding layer on the contact area 101, and the part of the contact part 1 other than the contact area 101 is the insulating coating 5 material.

[0122] (3) Remove mold D;

[0123] (4) Immerse the contact part 1 of the electrical connection device (terminal) in hot water at 70℃~80℃. The melting point of the second shielding layer is 47℃-64℃, so it melts and desorbs in hot water at 70℃~80℃.

[0124] (5) The terminals from which the second shielding layer has been removed are air-dried at room temperature and then dried at 60°C to obtain a contact area 101 that can be electroplated through the S60 surface plating layer 4 for use in electroplating.

[0125] Method for removing the first masking layer in S70:

[0126] (1) Immerse the electrical connection device (terminal) in boiling water at 100°C;

[0127] (2) The first shielding layer has a melting point of 90℃-110℃, so it melts and desorbs in boiling water at 100℃;

[0128] (3) The terminals with the first shielding layer removed are air-dried at room temperature and then dried at 60°C to obtain the final electrical connection device.

[0129] By precisely controlling the shielding and electroplating processes described above, the contact area 101 of the electrical connection device can be accurately electroplated. This not only improves the overall performance and reliability of the electrical connection device but also significantly reduces the amount of precious metals used, lowering production costs. This solves the problem of significant precious metal waste and high production costs associated with overall surface plating of electrical connection devices.

[0130] In another embodiment, when the connection area 201 of the electrical connection device is part of the surface of the connection portion 2, as shown in FIG9, in step S40”, a common coating 501 is applied to the area of ​​the contact portion 1 excluding the surface of the contact area 101, and a heat-resistant coating 502 is applied to the area of ​​the connection portion 2 excluding the surface of the connection area 201. These coatings are then baked and cured to complete the coverage of the insulating coating 5.

[0131] According to an embodiment of the manufacturing process of the electrical connection device disclosed herein, as shown in FIG12, step S05 is further performed before step S10: a pretreatment process, which includes ultrasonic degreasing, alkaline etching and acid etching of the electrical connection device in sequence.

[0132] Ultrasonic degreasing utilizes the cavitation, stirring, and strong emulsification effects of ultrasound waves in a solvent to accelerate the removal of oil and impurities from the surface of electrical connection devices. This process effectively removes grease, dirt, and other contaminants adhering to the device surface, providing a clean, oil-free surface for subsequent processing steps. Ultrasonic degreasing significantly shortens degreasing time and improves degreasing efficiency. For electrical connection devices with high precision requirements, ultrasonic degreasing avoids the damage that may be caused by traditional mechanical degreasing. Ultrasonic degreasing reduces the use of chemical solvents, lowers environmental pollution, and also saves energy.

[0133] Generally, the material of the surface-mount terminal is aluminum or aluminum alloy. Based on the total volume of the electroplating solution, the ultrasonic degreasing plating solution consists of 40-50 g / L sodium carbonate, 40-50 g / L trisodium phosphate, and 20-30 g / L sodium silicate, at a temperature of 50-70℃, using an ultrasonic frequency greater than 26 kHz, and the ultrasonic degreasing time for the electrical connection device is 8-16 minutes.

[0134] Alkaline etching involves immersing electrical connection devices in an alkaline solution. Through a chemical reaction, it removes the oxide layer, passivation layer, and some contaminants from the device's surface, further cleaning and activating the surface. This step facilitates subsequent electroplating processes, allowing the plating layer to adhere better to the device's surface. Alkaline etching can penetrate deep into the device's surface, cleaning even the smallest pores and depressions, removing hard-to-reach contaminants. By removing the oxide and passivation layers, alkaline etching activates the device's surface, improving the adhesion and bonding strength of the plating layer. Alkaline etching can also alter the texture and gloss of the device's surface to some extent, meeting aesthetic requirements.

[0135] Based on the total volume of the electroplating solution, the alkaline etching solution consists of 50-70 g / L sodium hydroxide, 30-40 g / L trisodium phosphate, 20-30 g / L sodium carbonate, and 5-10 g / L sodium silicate, at a temperature of 60-80℃ and a time of 60-120 s.

[0136] Acid etching is a step performed after alkaline etching. It uses an acidic solution to further clean and micro-etch the surface of the device. Acid etching removes any residues that may have formed during alkaline etching and creates tiny pits or bumps on the device surface, which helps increase the adhesion area and bonding strength of the plating layer. Acid etching thoroughly removes residues and impurities from the device surface, providing a cleaner substrate for electroplating. Through micro-etching, acid etching increases the contact area between the plating layer and the device surface, thereby improving the adhesion and bonding strength of the plating layer. Acid etching can also, to some extent, adjust the morphology and roughness of the device surface to meet specific process requirements.

[0137] Based on the total volume of the electroplating solution, the acid etching solution consists of 750-800 g / L concentrated nitric acid and 250-300 g / L 40% hydrofluoric acid, at room temperature, for 50-90 seconds.

[0138] Alternatively, in some embodiments, taking the electrical connection device in the form of a slotted charging dock as an example, step S05 is provided before step S10: a pretreatment process, which includes ultrasonic degreasing, electrolytic degreasing and acid etching performed sequentially on the electrical connection device.

[0139] Among them, the ultrasonic degreasing method is the same as the ultrasonic degreasing method of the plate-type electrical connection device.

[0140] Electrolytic degreasing involves immersing parts in an alkaline degreasing agent, with the terminals acting as cathodes. The polarization and hydrogen generated during electrolysis tear and desorb the oil stains from the product surface.

[0141] Based on the total volume of the electroplating solution, the electrolytic degreasing plating solution consists of 10-15 g / L sodium hydroxide, 20-30 g / L sodium carbonate, 50-70 g / L sodium phosphate, and 10-15 g / L sodium silicate, at a temperature of 50-70℃, a current density of 3-8 A / dm2, and a time of 10-15 minutes.

[0142] Acid etching involves immersing the terminals in a dilute sulfuric acid solution to remove the oxide scale on the terminal surface and activate the terminals.

[0143] Based on the total volume of the electroplating solution, the pickling solution consists of 10%-20% sulfuric acid (by volume) and the pickling time is 60-90 seconds.

[0144] This deep cleaning and activation treatment of the device surface provides a good substrate condition for subsequent electroplating steps. This design not only improves the quality and performance of the electroplated layer, but also extends the service life and reliability of the electrical connection device.

[0145] According to one embodiment of the manufacturing process of the electrical connection device disclosed herein, the second shielding layer has a melting point below 100°C. In step S50, the second shielding layer is removed by immersing the electrical connection device in hot water at 70°C to 80°C. The material of the second shielding layer is paraffin wax, with a melting point of 47°C to 64°C. Setting the melting point of the second shielding layer below 100°C means that the shielding layer can be easily removed at slightly higher temperatures. Moreover, the temperature of hot water is typically much higher than 65°C, which can quickly and effectively soften and remove the second shielding layer, while also ensuring that other coatings are not damaged during the removal of the second shielding layer. Furthermore, this method does not require complex equipment or chemicals; only a container capable of holding the electrical connection device and heating it to the appropriate temperature is needed, reducing production costs and simplifying the process.

[0146] According to an embodiment of the manufacturing process of the electrical connection device disclosed herein, the melting point of the first shielding layer and the insulating coating 5 is higher than the operating ambient temperature during electroplating. Because the melting point of the first shielding layer and the insulating coating 5 is higher than the operating ambient temperature during electroplating, the first shielding layer and the insulating coating 5 will not melt and peel off during step S20 when the electrical connection device is electroplated with the bottom layer 3, and during step S60 when the electrical connection device is electroplated with the top layer 4.

[0147] During electroplating, the ambient temperature may rise due to factors such as equipment operation and chemical reactions. The typical operating temperature for electroplating is 60–70°C. If the melting point of the first shielding layer is lower than this temperature, it may soften, detach, melt, or even fail, thus failing to effectively protect the connection area 201. Therefore, the first shielding layer can be made of epoxy ether resin with a melting point much higher than the ambient temperature, typically between 90 and 110°C. This ensures that the second shielding layer can still protect the connection area 201 at high temperatures.

[0148] According to one embodiment of the manufacturing process of the electrical connection device disclosed herein, the melting point of the insulating coating 5 is greater than that of the first shielding layer. In step S70, the electrical connection device is placed in an environment with a temperature greater than the melting point of the first shielding layer but less than the melting point of the insulating coating 5, causing the first shielding layer to melt and be removed. By precisely controlling the ambient temperature, the first shielding layer can be accurately melted and removed while avoiding damage to the insulating coating 5. Furthermore, since the ambient temperature is lower than the melting point of the insulating coating 5, thermal damage to the insulating coating 5 or other components due to overheating can be avoided, helping to maintain product quality and reliability. Moreover, this method is generally more efficient than manual removal or the use of chemical solvents, and the precise control of the removal process can be achieved by adjusting the ambient temperature, contributing to improved production efficiency and product consistency.

[0149] According to an embodiment of the manufacturing process of the electrical connection device disclosed herein, as shown in FIG13, a transition portion 7 is further provided between the contact portion 1 and the connection portion 2. In step S10, a third shielding layer is further provided on the surface of the transition portion 7. After step S30, step S35 is further provided: the third shielding layer is removed to expose the surface of the transition portion 7, and a heat-resistant coating 502 is provided on the surface of the transition portion 7.

[0150] Specifically, in step S10, a third shielding layer needs to be applied to the surface of the transition portion 7 before electroplating the underlayer 3 to ensure that the transition portion 7 is protected during subsequent processing. In step S55, after removing the third shielding layer, a heat-resistant coating 502 is immediately applied to the surface of the transition portion 7. It is ensured that the heat-resistant coating 502 adheres evenly and firmly to the surface of the transition portion 7, achieving the desired protective effect.

[0151] The transition section 7 helps to disperse and withstand stress deformation from the connecting section 2 and the contact section 1, reducing structural damage that may result from direct connection and increasing the stability and reliability of the overall structure; it also facilitates flexible adjustment of the connection direction. The third shielding layer prevents electroplating solutions, chemical solvents, or other harmful substances from directly contacting the surface of the transition section 77, thereby avoiding corrosion, contamination, or other adverse effects. The high-temperature resistant coating 502 is mainly used to isolate the adjacent ordinary coating 501 from damage or melting caused by the high temperature generated during the welding connection between the connecting section 2 and the wire, effectively isolating the ordinary coating 501 from the direct effect of high temperature and preventing its melting.

[0152] It is understood that in this embodiment, the third shielding layer can be made of polymer materials (such as polyphenylene sulfide, polyimide, polyetheretherketone, etc.), and the specific material can be selected according to actual needs, without any limitation.

[0153] It is worth mentioning that if the electrical connection device includes the transition portion 7 and the connection area 201 is the entire surface of the connection portion 2, as shown in FIG10, the third shielding layer can be removed in step S35, and in step S40”', a normal coating 501 is provided on the area of ​​the contact portion 1 excluding the surface of the contact area 101; and a heat-resistant coating 502 is provided on the surface of the transition portion 7.

[0154] Alternatively, when the electrical connection device includes a transition portion 7 and the connection area 201 is part of the surface of the connection portion 2, as shown in FIG11, the third shielding layer can be removed in step S35, and in S40””, a common coating 501 is provided on the area of ​​the contact portion 1 excluding the surface of the contact area 101, and a heat-resistant coating 502 is provided on the surface of the transition portion 7 and the area of ​​the connection portion 2 excluding the surface of the connection area 201.

[0155] Specifically, the melting point of the third shielding layer is higher than the ambient temperature during electroplating but lower than the melting point of the insulating coating. This design ensures that the third shielding layer will not melt due to increased ambient temperature during electroplating, thus maintaining its integrity and effectively preventing the penetration of the electroplating solution. Simultaneously, setting the melting point of the third shielding layer to be lower than that of the ordinary coating 501 allows for easy removal of the shielding layer in subsequent steps, facilitating further processing or treatment. This ensures the feasibility and efficiency of the removal process.

[0156] According to an embodiment of the manufacturing process of the electrical connection device disclosed herein, after step S70, a step S80 is further included: an anti-corrosion coating 6 is provided at the interface between the surface plating layer 4 and the insulating coating 5, covering the boundary between the surface plating layer 4 and the insulating coating 5. This prevents the interface between the surface plating layer 4 and the insulating coating 5 of the electrical connection device from being exposed, thus avoiding corrosion of the electrical connection device at the exposed location.

[0157] The anti-corrosion coating 6 directly covers the interface between the surface plating 4 and the insulating coating 5, providing an additional protective barrier. Since the interface is often a vulnerable point for corrosion, this design significantly improves overall corrosion resistance. The anti-corrosion coating 6 has excellent electrical insulation and water-repellent properties, effectively preventing direct contact between corrosive media (such as moisture, oxygen, acids, and alkalis) and the plating or coating, thereby slowing down or preventing corrosion. By adding the anti-corrosion coating 6, damage to the surface plating 4 and the insulating coating 5 caused by corrosion can be reduced, thus extending the service life of the entire component or product and further improving the overall performance of the product.

[0158] While specific embodiments of this disclosure have been described in detail by way of example, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of this disclosure. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of this disclosure. The scope of this disclosure is defined by the appended claims.

Claims

1. An electrical connection device for connecting an electrical device to a conductor and transferring electrical energy, characterized in that The electric connection device comprises a contact part and a connection part, the contact part has a contact area for connecting with the electric device, and the connection part has a connection area for connecting with the wire; the surface of the contact part is plated with a bottom layer, and the surface of the contact area is plated with a surface layer on the surface of the bottom layer; the surface of the electric connection device is provided with an insulating coating except the surface of the contact area and the surface of the connection area.

2. The electrical connection device of claim 1, wherein, The melting point of the insulating coating is higher than the working temperature of the plating process.

3. The electrical connection device of claim 1, wherein, When the surface layer and the insulating coating are on the same surface of the electric connection device, the surface of the surface layer is higher than the surface of the insulating coating.

4. The electrical connection device of claim 1, wherein, The boundary between the surface layer and the insulating coating is provided with an anticorrosion coating.

5. The electrical connection device of claim 1, wherein, The contact part is a plate structure, and a connection hole is provided through the contact part; the contact area is the inner wall of the connection hole and at least part of the surface of the contact part near the two ends of the connection hole.

6. The electrical connection device of claim 1, wherein, The connection part is a plate structure, and the connection area is a surface for contacting with the wire or an end for contacting with the wire.

7. The electrical connection device of claim 1, wherein, The contact part is a cylindrical structure, and the contact area is at least part of the inner wall surface of the cylindrical structure.

8. The electrical connection device of claim 1, wherein, The connection part is a cylindrical structure or a U-shaped structure, and the connection area is at least part of the inner wall surface of the cylindrical structure or at least part of the inner surface of the U-shaped structure.

9. The electrical connection device of claim 1, wherein, The transition part is provided between the contact part and the connection part, and the insulating coating comprises a general coating and a temperature-resistant coating, and the temperature-resistant coating is provided on the surface of the transition part and / or part of the surface of the connection part.

10. The electrical connection device of claim 9, wherein, The melting point of the temperature-resistant coating is higher than the melting point of the general coating.

11. A process for manufacturing an electrical connection device as claimed in any one of the claims 1-10, characterized in that, The method comprises the following steps: S10, determining the connection area on the electric connection device, and providing a first shielding layer on the connection area; S20, plating, and plating the bottom layer on the surface of the contact part; S30, determining the contact area on the electric connection device, and providing a second shielding layer on the contact area; S40, providing the insulating coating on the surface of the electric connection device; S50, removing the second shielding layer to expose the contact area, and retaining the first shielding layer; S60, plating, and plating the surface layer on the surface of the contact area; S70, removing the first shielding layer to expose the connection area.

12. The manufacturing process of an electrical connection device according to claim 11, characterized in that, Before the step S10, the method further comprises a pretreatment process, and the pretreatment process comprises ultrasonic degreasing, alkali etching and acid etching performed on the electric connection device in sequence.

13. The manufacturing process of an electrical connection device according to claim 11, characterized in that, The melting point of the second shielding layer is lower than 100°C, and in the step S50, the second shielding layer is removed by placing the electric connection device in hot water.

14. The manufacturing process of an electrical connection device according to claim 11, characterized in that, The melting point of the first shielding layer and the insulating coating is higher than the working temperature of the plating process.

15. The manufacturing process of an electrical connection device according to claim 11, wherein, The melting point of the insulating coating is higher than the melting point of the first shielding layer, and in the step S70, the electric connection device is placed in an environment with a temperature higher than the melting point of the first shielding layer but lower than the melting point of the insulating coating, so that the first shielding layer is melted and removed.

16. The manufacturing process of an electrical connection device according to claim 11, wherein, The transition part is further arranged between the contact part and the connecting part, and a third shielding layer is arranged on the surface of the transition part in step S10; after step S30, step S35 is further included, in which the third shielding layer is removed to expose the surface of the transition part, and a temperature-resistant coating is arranged on the surface of the transition part.

17. The manufacturing process of an electrical connection device according to claim 16, characterized in that, The third shielding layer has a melting point greater than the working temperature of the electroplating environment and less than the melting point of the ordinary coating.

18. The manufacturing process of an electrical connection device according to claim 11, wherein, After step S70, step S80 is further included, in which a corrosion-resistant coating covering the boundary between the surface layer plating layer and the insulating coating is arranged at the boundary between the surface layer plating layer and the insulating coating.

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