Optical bench, optical component, and optical component production method

Abstract

An optical bench (1) comprises: a first inner surface (11) which is a side surface; a second inner surface (12) which is a side surface; a first outer surface (13) which is a side surface that is positioned opposite from the first inner surface (11); a second outer surface (14) which is a side surface that is positioned opposite from the second inner surface (12); a plurality of first optical waveguide parts (20) which extend from the first inner surface (11) to the first outer surface (13); and a plurality of second optical waveguide parts (25) which extend from the second inner surface (12) to the second outer surface (14). The angle formed by the first inner surface (11) and the second inner surface (12) is 60-120 degrees.

Description

Optical bench, optical component, and method for manufacturing optical component

[0001] This application claims priority to Japanese Patent Application No. 2024-114900, filed on July 18, 2024, and incorporates by reference the entire contents of said Japanese application.

[0002] Patent Document 1 discloses an optical circuit in which a fiber block for fixing an optical fiber and a waveguide are provided on opposite ends of a chip-shaped silica-based optical circuit. Patent Document 2 discloses an example of an optical switch chip.

[0003] JP 2019-095485 A U.S. Patent Application Publication No. 2022 / 0317381 A

[0004] An optical bench according to an embodiment of the present disclosure includes a first inner surface that is a side surface, a second inner surface that is a side surface, a first outer surface that is a side surface facing the first inner surface, a second outer surface that is a side surface facing the second inner surface, a plurality of first optical waveguides extending from the first inner surface to the first outer surface, and a plurality of second optical waveguides extending from the second inner surface to the second outer surface. In this optical bench, the first inner surface and the second inner surface form an angle of 60 degrees or more and 120 degrees or less with each other.

[0005] FIG. 1 is a plan view showing an optical component according to a first embodiment. FIG. 2 is a perspective view showing an example of an optical bench included in the optical component shown in FIG. 1. FIG. 3 is a side view showing an optical bench and an optical connector included in the optical component shown in FIG. 1. FIG. 4 is a diagram showing a cross section of a chip component included in the optical component shown in FIG. 1. FIG. 5 is a perspective view showing a modified example of the optical bench. FIG. 6 is a plan view showing an optical component according to a second embodiment. FIG. 7 is a plan view showing an optical component according to a third embodiment. FIG. 8 is a plan view showing an optical component according to a fourth embodiment. FIG. 9 is a plan view showing an optical component according to a fifth embodiment. FIG. 10 is a plan view showing an optical component according to a sixth embodiment. FIG. 11 is a plan view showing an optical component according to a seventh embodiment. FIG. 12 is a plan view showing an example of a general optical connection structure.

[0006] Chip components such as optical switches generally have a structure in which both opposing ends are connected to optical fibers. In such a general structure, as shown in FIG. 12 , optical benches 110 and 115 are connected to the opposing ends of a chip component 140, respectively. The chip component 140 is optically connected to the optical fiber by a plurality of optical waveguides 120 and 125 formed inside the optical benches 110 and 115, and a plurality of optical connectors 130 and 135 connected to the optical waveguides 120 and 125. This type of optical connection structure (optical component 101) tends to be vertically long, as shown in FIG. 12 , making it difficult to miniaturize.

[0007] The present disclosure aims to provide an optical bench, an optical component, and a method for manufacturing an optical component that can reduce the size of an optical connection structure that includes a component having an optical circuit.

[0008] According to the present disclosure, it is possible to reduce the size of an optical connection structure including a component having an optical circuit.

[0009] First, the contents of the embodiments of the present disclosure will be listed and described. [1] An optical bench according to one embodiment includes a first inner surface which is a side surface, a second inner surface which is a side surface, a first outer surface which is a side surface facing the first inner surface, a second outer surface which is a side surface facing the second inner surface, a plurality of first optical waveguides extending from the first inner surface to the first outer surface, and a plurality of second optical waveguides extending from the second inner surface to the second outer surface. In this optical bench, the first inner surface and the second inner surface form an angle of 60 degrees or more and 120 degrees or less with respect to each other.

[0010] In this optical bench, the first inner surface and the second inner surface, which are side surfaces, form an angle of 60 degrees or more and 120 degrees or less. In this case, the first outer surface and the second outer surface can be arranged adjacent to each other so as to intersect or be perpendicular to each other, rather than being arranged opposite each other. By using such an optical bench, it is possible to make the optical connection structure including components having optical circuits smaller overall by utilizing both the vertical and horizontal dimensions, rather than making it longer only vertically.

[0011] [2] In the optical bench of [1] above, a first outer pitch D [μm] between the multiple first optical waveguides on the first outer surface may be larger than a first inner pitch d [μm] between the multiple first optical waveguides on the first inner surface. A second outer pitch between the multiple second optical waveguides on the second outer surface may be larger than a second inner pitch between the multiple second optical waveguides on the second inner surface. In this optical bench, a distance Lb [mm] between the first inner surface and the first outer surface may satisfy the following relationship: (D / d)×1 mm<Lb<(D / d)×10 mm. In this case, the optical connection structure can be reliably miniaturized. The "pitches D, d between the first optical waveguide sections" referred to here mean the center pitch between adjacent optical waveguide sections when each first optical waveguide section is formed from one optical waveguide, and mean the pitch between the center positions of the two outermost optical waveguides included in each first optical waveguide section, which are also the pitch between the center positions of adjacent optical waveguide sections, when each first optical waveguide section is formed from a plurality of optical waveguide sections.

[0012] [3] The optical bench of [1] or [2] above may be made of glass. In this case, when the optical bench is mounted on a silicon substrate, the difference in the thermal expansion coefficient between the two is small, so that an increase in optical coupling loss due to misalignment caused by the difference in thermal expansion can be prevented.

[0013] [4] In the optical bench according to any one of [1] to [3] above, each of the plurality of first optical waveguide sections may include a plurality of optical waveguides. Each of the plurality of second optical waveguide sections may include a plurality of optical waveguides. In this case, the amount of optical communication processed by the optical bench can be increased.

[0014] [5] The optical bench according to any one of [1] to [4] above may have an L-shape in plan view. In this optical bench, the first inner surface and the second inner surface may form the inside of the L-shape, and the first outer surface and the second outer surface may form the outside of the L-shape. In this case, the optical bench has an L-shape, and by using such an optical bench, it is possible to more reliably reduce the size of an optical connection structure including a chip component having an optical circuit.

[0015] [6] The optical bench according to any one of [1] to [5] above may have a rectangular parallelepiped shape in which at least one corner is cut out. In this optical bench, the cutout may include a first inner surface and a second inner surface. In an optical bench having such a shape, if one corner of the rectangular parallelepiped shape is cut out by, for example, a countersink, a mounting surface for mounting a component having an optical circuit can be formed adjacent to the first inner surface and the second inner surface, allowing for accurate alignment of the component. Furthermore, in an optical bench having such a shape, if a pair of corners of the rectangular parallelepiped shape (corners corresponding to one corner of the rectangular shape) are cut out by, for example, a hollowing-out, a spatial region for aligning a component having an optical circuit can be maintained sufficiently close to the first inner surface and the second inner surface, allowing for easy alignment of the component.

[0016] [7] In the optical bench according to any one of [1] to [6] above, the plurality of first optical waveguides may be arranged in multiple stages. In this case, many connectors and waveguides (optical waveguides) can be provided, thereby increasing the amount of optical communication that can be processed. In addition, the width of the outer surface of the waveguides (optical waveguides) can be reduced, thereby further miniaturizing the optical connection structure.

[0017] [8] The optical bench according to any one of [1] to [7] above may include a first optical bench member including a first inner surface, a first outer surface, and a plurality of first optical waveguides, and a second optical bench member including a second inner surface, a second outer surface, and a plurality of second optical waveguides. The first optical bench member and the second optical bench member may be separate members. In this case, when connecting each optical bench member to a chip component, the position of each bench member can be adjusted, allowing the chip component to be connected to the optical bench with high precision. This improves the optical connection efficiency between the chip component and the optical bench.

[0018] [9] The optical bench according to any one of [1] to [8] above may further include an alignment mechanism for determining the position of a component optically connected to the first inner surface and the second inner surface of the optical bench. This alignment mechanism may be provided on at least one of the first inner surface and the second inner surface, or in proximity to at least one of the first inner surface and the second inner surface. In this case, the component can be easily aligned with respect to the optical bench and optically connected to the optical bench with high precision. This improves the efficiency of optical connection between the component and the optical bench.

[0019]

[10] In the optical bench according to any one of [1] to [9] above, the mode field diameter of the optical waveguide included in each of the plurality of first optical waveguide portions may be wider in a first region near the first inner surface than in a second region near the first outer surface. In this case, a component having an optical circuit can be connected to the optical bench with high precision. This improves the optical connection efficiency between the component and the optical bench.

[0020]

[11] An optical component according to one embodiment includes the optical bench according to any one of [1] to

[10] above, and a plurality of first optical connectors optically connected to the plurality of first optical waveguides on the first outer surface. In this case, as described above, it is possible to miniaturize an optical connection structure including a component having an optical circuit. Note that this optical component may further include a plurality of second optical connectors optically connected to the plurality of second optical waveguides on the second outer surface. In this case, the first optical connector and the second optical connector are arranged on adjacent surfaces. This ensures that the entire optical connection structure can be miniaturized.

[0021]

[12] The optical component of

[11] may further include a lens provided on the first inner surface. The lens may optically couple the plurality of first optical waveguides to an optical circuit of the component. In this case, the optical connection efficiency between the optical waveguides and the optical circuit of the component can be improved.

[0022]

[13] The optical component of

[11] or

[12] above may further include a chip component optically coupled to the optical bench. This chip component may include an optical circuit, a first end face having a plurality of first optical input / output terminals of the optical circuit, and a second end face having a plurality of second optical input / output terminals of the optical circuit. The plurality of first optical input / output terminals may be optically connected to a plurality of first optical waveguide portions. The plurality of second optical input / output terminals may be optically connected to a plurality of second optical waveguide portions. In this case, as described above, it is possible to miniaturize an optical connection structure including a chip component having an optical circuit.

[0023]

[14] In the optical component of

[13] above, the distance between the first inner surface of the optical bench and the first end face of the chip component may be 20 μm or less. In this case, even if a gap occurs between the optical waveguide and the end face of the chip component, it is possible to prevent a decrease in the efficiency of optical connection between the optical waveguide and the optical circuit of the chip component.

[0024]

[15] A method for manufacturing an optical component according to one embodiment includes the steps of: providing an optical bench according to any one of [1] to

[10] above; providing a component including an optical circuit, a first end face having a plurality of first optical input / output terminals of the optical circuit, and a second end face having a plurality of second optical input / output terminals of the optical circuit; and attaching the component to the optical bench so that the plurality of first optical input / output terminals are optically connected to the plurality of first optical waveguides and the plurality of second optical input / output terminals are optically connected to the plurality of second optical waveguides. In this case, as described above, it is possible to easily manufacture a product having a miniaturized optical connection structure including a component having an optical circuit.

[0025] Specific examples of optical benches, optical components, and methods for manufacturing optical components according to embodiments of the present disclosure will be described below with reference to the drawings. In the following description, identical elements or elements having identical functions will be designated by the same reference numerals, and duplicated explanations will be omitted. Note that the present invention is not limited to these examples, but is defined by the claims, and is intended to include all modifications within the meaning and scope equivalent to the claims.

[0026] [First Embodiment] An optical component according to a first embodiment will be described with reference to Fig. 1 to Fig. 4. Fig. 1 is a plan view showing the optical component according to the first embodiment. Fig. 2 is a perspective view showing an example of an optical bench included in the optical component shown in Fig. 1. Fig. 3 is a side view showing an optical bench and an optical connector included in the optical component shown in Fig. 1. Fig. 4 is a view showing a cross section of a chip component included in the optical component shown in Fig. 1.

[0027] As shown in FIG. 1 , the optical component 1 includes an optical bench 10 and a plurality of first optical connectors 30. The optical component 1 may also include at least one of a plurality of second optical connectors 35 and a chip component 40, or both. The chip component 40 is a chip component including an optical circuit, such as an optical switch or a power splitter. However, the chip component 40 is not limited to these and may be any component that has an optical circuit inside. Optical switches can be used, for example, in data centers and AI computers. As the amount of information communication increases, the number of optical switches installed in optical devices is increasing, and there is a demand for miniaturization of each switch.

[0028] The optical bench 10 is a member for connecting chip components 40 including optical circuits to a plurality of first optical connectors 30 and a plurality of second optical connectors 35. As shown in FIGS. 1 and 2 , the optical bench 10 has a first inner surface 11, a second inner surface 12, a first outer surface 13, and a second outer surface 14. The optical bench 10 may have at least one of a first side surface 15, a second side surface 16, a top surface 17, and a bottom surface 18, or any combination thereof, or all of these. The optical bench 10 has a rectangular parallelepiped shape with one corner cut out, and includes a notch F. Due to the notch F, the first side surface 15, the second side surface 16, and the top surface 17 are L-shaped. The bottom surface 18 is rectangular, as are the first inner surface 11, the second inner surface 12, the first outer surface 13, and the second outer surface 14. The notch F includes the first inner surface 11 and the second inner surface 12. The notch F is further provided with a mounting surface 19 that extends in a direction perpendicular to the first inner surface 11 and the second inner surface 12. The mounting surface 19 is a portion on which the chip component 40 is placed, and is, for example, a flat surface that is approximately the same size as the flat surface of the chip component 40.

[0029] The first inner surface 11 is a side surface facing the first end face 41 of the chip component 40. As an example, the first inner surface 11 contacts the first end face 41 of the chip component 40. The second inner surface 12 is a side surface facing the second end face 42 of the chip component 40. As an example, the second inner surface 12 contacts the second end face 42 of the chip component 40. The first outer surface 13 is a side surface facing the first inner surface 11 on the side opposite the chip component 40. The first outer surface 13 is wider (length in the left and right directions as shown) than the first inner surface 11 and is configured to allow multiple first optical connectors 30 to be attached. The width of the first outer surface 13 may be 1.5 times or more, or may be 2 times or more, the width of the first inner surface 11. The second outer surface 14 is a side surface facing the second inner surface 12 on the side opposite the chip component 40. The second outer surface 14 is wider (length from top to bottom as shown in the figure) than the second inner surface 12, and is configured to be able to attach multiple second optical connectors 35. The width of the second outer surface 14 may be 1.5 times or more, or may be twice or more, the width of the second inner surface 12.

[0030] The first inner surface 11 and the second inner surface 12 are perpendicular to each other so that the angle between them is 90 degrees. However, the angle between the first inner surface 11 and the second inner surface 12 may be, for example, 60 degrees or more and 120 degrees or less, 70 degrees or more and 110 degrees or less, 80 degrees or more and 100 degrees or less, 85 degrees or more and 95 degrees or less, or 88 degrees or more and 92 degrees or less. The first inner surface 11, the second inner surface 12, the first outer surface 13, the second outer surface 14, and the first side surface 15, the second side surface 16, which are in this relationship, form an L-shape when viewed from above. The first inner surface 11 and the second inner surface 12 form the inside of this L-shape, and the first outer surface 13 and the second outer surface 14 form the outside of the L-shape.

[0031] The optical bench 10 is made of a light-transmitting material. The material of the optical bench 10 is, for example, glass. The glass used here is synthetic quartz (linear expansion coefficient: 0.5×10 －６ / K), Borofloat glass (linear expansion coefficient: 3×10 －６ / K), aluminosilicate glass (linear expansion coefficient: 3.5×10－６ / K) can be exemplified.

[0032] 1, a plurality of first optical waveguides 20 and a plurality of second optical waveguides 25 are formed inside or on top of the optical bench 10. Each first optical waveguide 20 extends from the first inner surface 11 to the first outer surface 13, and is a portion that connects a first input / output end at a first end face 41 of the optical circuit of the chip component 40 to the first optical connector 30, thereby propagating an optical signal. Each second optical waveguide 25 extends from the second inner surface 12 to the second outer surface 14, and is a portion that connects a second optical input / output end at a second end face 42 of the optical circuit of the chip component 40 to the second optical connector 35, thereby propagating an optical signal.

[0033] In the example shown in FIG. 1 , the optical bench 10 is provided with four first optical waveguides 20 and four second optical waveguides 25. However, the number of each of the first optical waveguides 20 and second optical waveguides 25 provided in the optical bench 10 is not limited to four, and may be two or more, or may be five or more. The number of first optical waveguides 20 and the number of second optical waveguides 25 may be the same or different. Each of the first optical waveguides 20 and the second optical waveguides 25 has one or more optical waveguides 21, 26, and may have one optical waveguide 21, 26 or multiple (two or more) optical waveguides 21, 26. In the example shown in FIG. 1 , each of the first optical waveguides 20 and the second optical waveguides 25 has four optical waveguides 21, 26.

[0034] In FIG. 1 and in FIGS. 6 to 11 described later, the first optical waveguide 20 and the second optical waveguide 25 connect the first optical connector 30, the second optical connector 35, and the chip component 40 in a straight line, but this is not limited to this and they may have curved portions in some parts as long as they expand from the inside to the outside.

[0035] Each of the optical waveguides 21 and 26 can be fabricated by forming one or more waveguide cores on a lower cladding layer on a silicon substrate and then forming an upper cladding layer covering the waveguide cores. The waveguide cores have a higher refractive index than the upper and lower cladding layers. In another embodiment, an optical waveguide can be fabricated by irradiating the interior of an optical material (e.g., glass) with a laser to change the refractive index of the irradiated portion. Various known methods can be used to fabricate such optical waveguides.

[0036] The first optical connector 30 is an optical connector that holds one or more optical fibers, such as an MPO connector. The multiple first optical connectors 30 are attached to the first outer surface 13 at predetermined intervals. Each first optical connector 30 is provided to correspond to a first optical waveguide 20 and is optically connected to one outer end of the first optical waveguide 20 (one or more optical waveguides 21). Another adapter that holds an optical fiber may be connected to the first optical connector 30 via a connection adapter.

[0037] Like the first optical connector 30, the second optical connector 35 is an optical connector that holds one or more optical fibers, such as an MPO connector. The multiple second optical connectors 35 are attached to the second outer surface 14 at predetermined intervals. Each second optical connector 35 is provided to correspond to a second optical waveguide 25 and is optically connected to one outer end of the second optical waveguide 25 (one or more optical waveguides 26). Like the first optical connector 30, the second optical connector 35 may be connected to another adapter that holds an optical fiber via a connection adapter.

[0038] The plurality of first optical waveguides 20 and the plurality of first optical connectors 30, as well as the plurality of second optical waveguides 25 and the plurality of second optical connectors 35, may be formed one-dimensionally (in a row), or may be formed two-dimensionally (in multiple stages) as shown in Fig. 3. Note that, although the example shown in Fig. 3 describes a case where four optical waveguides and connectors are formed in a two-stage configuration, the present invention is not limited to this and may be formed in three or more stages.

[0039] As described above, the chip component 40 is an optical chip that includes an optical circuit therein. The chip component 40 is, for example, an optical switch or a power splitter. The chip component 40 has a first end face 41 facing the first inner surface 11 and a second end face 42 facing the second inner surface 12. The optical circuit of the chip component 40 is connected to a first optical input / output terminal provided on the first end face 41 and a second optical input / output terminal provided on the second end face.

[0040] The chip component 40 is provided so as to be located at one corner (notch F) of the optical bench 10. The chip component 40 is attached to the optical bench 10 so that the first end face 41 faces the first inner surface 11 and the second end face 42 faces the second inner surface 12. If the optical bench 10 is provided with a mounting surface 19 (see FIG. 2 ), the chip component 40 is mounted on the mounting surface 19. The chip component 40 may be provided so that the first end face 41 contacts the first inner surface 11 and the second end face 42 contacts the second inner surface 12, or so that the first end face 41 and the first inner surface 11 are spaced apart and the second end face 42 and the second inner surface 12 are spaced apart.

[0041] The chip component 40 may have a layer structure as shown in Fig. 4. The chip component 40 includes an adhesive layer 43, a first silicon (Si) layer 44, a BOX layer 45, a second silicon (Si) layer 46, and a silica (SiO ２ The second silicon (Si) layer 46 functions as a core through which light propagates. The BOX layer 45 has a refractive index lower than that of silicon and functions as an optical cladding.

[0042] Here, the relationship between the inner pitch (first inner pitch) d [μm] between the first optical waveguides 20, the outer pitch (first outer pitch) D [μm] between the first optical waveguides 20, and the distance Lb [mm] between the first inner surface 11 and the first outer surface 13 will be described. In the optical component 1 or optical bench 10 according to this embodiment, the multiple first optical waveguides 20 are formed such that the first outer pitch D between the multiple first optical waveguides 20 on the first outer surface 13 is larger than the first inner pitch d between the multiple first optical waveguides 20 on the first inner surface 11. The optical component 1 or optical bench 10 according to this embodiment is formed so as to satisfy the following formula (1): (D / d)×1 mm<Lb<(D / d)×10 mm (1) In this case, the distance between the first inner surface 11 and the first outer surface 13 can be sufficiently small, and the optical component 1 or optical bench 10 can be made smaller. Note that the "pitches D, d between the first optical waveguides 20" referred to here mean the center pitch between adjacent optical waveguides 21 when each first optical waveguide 20 is formed from one optical waveguide 21, and mean the pitch between the centers of the two outermost optical waveguides 21 included in each first optical waveguide 20 when each first optical waveguide 20 is formed from a plurality of optical waveguides 21. Furthermore, although the relationship in the first optical waveguide 20 has been described above, the relationship between the pitch (second inner pitch) d [μm] between the second optical waveguides 25 on the inside, the pitch (second outer pitch) D [μm] between the second optical waveguides 25 on the outside, and the distance Wb [mm] between the second inner surface 12 and the second outer surface 14 may also be similar.

[0043] Next, the relationship between the sizes of the optical bench 10 and the chip component 40 in a planar direction when viewed from above will be described. Here, the area Sa [mm ２ ] can be expressed as the first length of the chip La [mm] × the second length of the chip Wa [mm]. On the other hand, the area Sb [mm] of the optical bench 10 in the planar direction ２] can be expressed as (first length La [mm] of chip + first length Lb [mm] of optical bench (side surface 15)) x (second length Wa [mm] of chip + second length Wb [mm] of optical bench (side surface 16)). The optical component 1 or optical bench 10 according to this embodiment is formed so that the ratio (Sa / Sb) of the area Sa of the chip component 40 to the area Sb of the optical bench 10 satisfies the following formula (2): 0.1<Sa / Sb<1 (2) In this case, the area Sb [mm ２ ], the area Sa [mm ２ ] can be easily optimized, and the optical component 1 or the optical bench 10 can be made smaller.

[0044] The above-described optical component 1 can be manufactured, for example, by the following method. First, the above-described optical bench 10 (see FIG. 2 ) is provided (prepared). When preparing the optical bench 10, a plurality of first optical connectors 30 are attached to the first outer surface 13 of the optical bench 10 at a predetermined interval (e.g., outer pitch D), and a plurality of second optical connectors 35 are attached to the second outer surface 14 of the optical bench 10 in a predetermined relationship (e.g., outer pitch D). Note that an optical bench 10 may be prepared in which a plurality of first optical connectors 30 are pre-attached to the first outer surface 13 at a predetermined interval, and a plurality of second optical connectors 35 are pre-attached to the second outer surface 14 in a predetermined relationship. Also, a chip component 40 is provided (prepared), the chip component 40 including an optical circuit, a first end face 41 having a plurality of first optical input / output terminals of the optical circuit, and a second end face 42 having a plurality of second optical input / output terminals of the optical circuit.

[0045] Next, the chip component 40 is attached to the optical bench 10 so that the plurality of first optical input / output terminals of the chip component 40 are optically connected to the plurality of first optical waveguide sections 20, and the plurality of second optical input / output terminals of the chip component 40 are optically connected to the plurality of second optical waveguide sections 25. During this attachment, the optical input / output terminals of the chip component 40 and the optical waveguide sections (optical waveguides) are aligned and connected to reduce connection loss. In this way, the optical component 1 described above is fabricated.

[0046] As described above, according to the optical component 1 and optical bench 10 of this embodiment, the first inner surface 11 and the second inner surface 12 facing the chip component 40 form an angle of 60 degrees or more and 120 degrees or less with respect to each other. As shown in FIG. 12 , in a conventional optical component 101, optical benches 110, 115 (optical waveguides 120, 125) and optical connectors 130, 135 are provided at both ends of the chip component 140, resulting in an overall vertically elongated structure. In contrast, according to this embodiment, the first outer surface 13 and the second outer surface 14 to which the optical connectors are attached can be arranged adjacent to each other so as to intersect or intersect at right angles, rather than facing each other. By using such an optical bench 10, an optical connection structure including a chip component 40 having an optical circuit can be made smaller overall by utilizing both vertical and horizontal dimensions, rather than being made longer vertically.

[0047] In the optical component 1 and optical bench 10 according to this embodiment, the first outer pitch D [μm] between the multiple first optical waveguides 20 on the first outer surface 13 is larger than the first inner pitch d [μm] between the multiple first optical waveguides 20 on the first inner surface 11. Furthermore, the second outer pitch between the multiple second optical waveguides 25 on the second outer surface 14 is larger than the second inner pitch between the multiple second optical waveguides 25 on the second inner surface 12. In the optical component 1 and the optical bench, the distance Lb [mm] between the first inner surface 11 and the first outer surface 13 satisfies the following: (D / d)×1 mm<Lb<(D / d)×10 mm (1). This ensures that the optical connection structure can be miniaturized.

[0048] The optical component 1 and the optical bench 10 according to this embodiment are made of glass. This reduces the difference in thermal expansion coefficient between the two when mounting the optical bench 10 on a silicon substrate, preventing an increase in optical coupling loss due to misalignment caused by the difference in thermal expansion.

[0049] In the optical component 1 and optical bench 10 according to this embodiment, each of the plurality of first optical waveguide sections 20 may include a plurality of optical waveguides 21, and each of the plurality of second optical waveguide sections 25 may include a plurality of optical waveguides 26. This allows the amount of optical communication processed by the optical bench 10 to be increased.

[0050] The optical bench 10 according to this embodiment may have an L-shape when viewed from above. In the optical bench 10, the first inner surface 11 and the second inner surface 12 may form the inside of the L-shape, and the first outer surface 13 and the second outer surface 14 form the outside of the L-shape. By using such an optical bench 10, it is possible to more reliably reduce the size of an optical connection structure including a chip component 40 having an optical circuit.

[0051] The optical bench 10 according to this embodiment may have a rectangular parallelepiped shape with at least one corner cut out. In this optical bench 10, the cutout includes the first inner surface 11 and the second inner surface 12. For example, if one corner of the rectangular parallelepiped is cut out by countersinking (see FIG. 2 ), a mounting surface 19 for mounting the chip component 40 can be formed adjacent to the first inner surface 11 and the second inner surface 12. This allows for accurate alignment of the chip component 40. Furthermore, an L-shaped optical bench 10A (see FIG. 5 ) may be used, in which a pair of corners (corresponding to one corner of the rectangular parallelepiped) are cut out by hollowing out, for example. This also allows for the optical component 1 having the structure shown in FIG. 1 to be formed. Furthermore, in this case, a wide spatial region G for aligning the chip component 40 can be maintained sufficiently close to the first inner surface 11 and the second inner surface 12. This allows for easy alignment of the chip component 40.

[0052] In the optical component 1 and optical bench 10 according to this embodiment, the plurality of first optical waveguides 20 and the plurality of second optical waveguides 25 may be arranged in multiple stages. In this case, many connectors and waveguides (optical waveguides) can be provided, thereby increasing the amount of optical communication that can be processed. In addition, the width of the outer surface of the waveguides (optical waveguides) can be reduced, thereby further miniaturizing the optical connection structure.

[0053] The optical component 1 according to this embodiment includes an optical bench 10, a plurality of first optical connectors 30 optically connected to the plurality of first optical waveguides 20, respectively, on the first outer surface 13, and a plurality of second optical connectors 35 optically connected to the plurality of second optical waveguides 25, respectively, on the second outer surface 14. This makes it possible to miniaturize an optical connection structure including a chip component having an optical circuit.

[0054] Second Embodiment Next, an optical component 1A according to a second embodiment will be described with reference to FIG. 6 . Hereinafter, explanations of points overlapping with those of the first embodiment may be omitted. As shown in FIG. 6 , the optical component 1A includes an optical bench 10B and a plurality of first optical connectors 30. The optical component 1A may also include at least one of a second optical connector 35 and a chip component 40, or both. In the optical bench 10B, the width of the first outer surface 13A is wider than the width of the first outer surface 13 according to the first embodiment, and the width of the second outer surface 14A is wider than the width of the second outer surface 14 according to the first embodiment. Note that, although the optical bench 10B according to the second embodiment has a shape with hollowed corners like the optical bench 10A according to the modified example, it may also be applied to a countersunk shape like the optical bench 10. In addition, in the second embodiment, each first optical waveguide 20 is formed from one optical waveguide 21, and each second optical waveguide 25 is formed from one optical waveguide 26, but each waveguide may include multiple optical waveguides 21, 26.

[0055] In addition to the effects of the first embodiment described above, the optical component 1A according to the second embodiment has a larger outer surface, which allows for the arrangement of more first optical waveguides 20, second optical waveguides 25, first optical connectors 30, and second optical connectors 35.

[0056] Third Embodiment Next, an optical component 1B according to a third embodiment will be described with reference to FIG. 7 . Hereinafter, explanations of points overlapping with the first and second embodiments may be omitted. As shown in FIG. 7 , the optical component 1B includes a first optical bench member 10C, a second optical bench member 10D, and a first optical connector 30. The optical component 1B may also include at least one of a second optical connector 35 and a chip component 40, or both. In the optical component 1B according to the third embodiment, the first optical bench member 10C and the second optical bench member 10D form an optical bench corresponding to the optical bench 10B of the optical component 1A according to the second embodiment. That is, in the third embodiment, the first optical bench member 10C and the second optical bench member 10D that form the optical bench are separate members.

[0057] According to the optical component 1B of the third embodiment, when connecting each of the first optical bench member 10C and the second optical bench member 10D to the chip component 40, the position of each bench member can be adjusted, thereby enabling the chip component 40 to be connected to the optical bench with high precision. This makes it possible to further improve the optical connection efficiency between the chip component 40 and the optical bench, in addition to the effects of the first and second embodiments described above.

[0058] Fourth Embodiment Next, an optical component 1C according to a fourth embodiment will be described with reference to FIG. 8 . Hereinafter, explanations of points overlapping with the first to third embodiments may be omitted. As shown in FIG. 8 , the optical component 1C includes an optical bench 10E and a first optical connector 30. The optical component 1C may also include at least one of a second optical connector 35 and a chip component 40, or both. In the optical bench 10E, a first alignment mechanism 51 is provided on the first inner surface 11, and a second alignment mechanism 52 is provided on the second inner surface 12. The first alignment mechanism 51 and the second alignment mechanism 52 are mechanisms for determining the position of the chip component 40 connected to the inner surfaces 11 and 12, and may be, for example, protrusions protruding outward from the outer ends of the inner surfaces 11 and 12. This pair of protrusions aligns and fixes the chip component 40 to a predetermined position relative to the first inner surface 11 and the second inner surface 12 of the optical bench 10E.

[0059] According to the optical component 1C of the fourth embodiment, the chip component 40 can be easily aligned with the optical bench 10E, and the chip component 40 can be optically connected to the optical bench 10E with high precision. This not only achieves the effects of the first to third embodiments described above, but also improves the efficiency of optical connection between the chip component 40 and the optical bench 10E. Furthermore, since the connection between the two is facilitated, manufacturing efficiency can be improved.

[0060] Fifth Embodiment Next, an optical component 1D according to a fifth embodiment will be described with reference to FIG. 9 . Hereinafter, explanations of points overlapping with the first to fourth embodiments may be omitted. As shown in FIG. 9 , the optical component 1D includes an optical bench 10F and a first optical connector 30. The optical component 1D may also include at least one of a second optical connector 35 and a chip component 40, or both. In the optical bench 10F, a first alignment mechanism 53 is provided on the first inner surface 11, and a second alignment mechanism 54 is provided on the second inner surface 12. The first alignment mechanism 53 and the second alignment mechanism 54 are mechanisms for determining the positions of the chip components 40 connected to the inner surfaces 11 and 12, and may be, for example, protrusions protruding outward near the outer ends of the inner surfaces 11 and 12. The protrusion of the first alignment mechanism 53 corresponds to the hole 48 provided in the first end surface 41 of the chip component 40, and the protrusion of the second alignment mechanism 54 corresponds to the hole 49 provided in the second end surface 42 of the chip component 40. By inserting such a pair of protrusions into the corresponding holes 48, 49, the chip component 40 is aligned and fixed to a predetermined position with respect to the first inner surface 11 and the second inner surface 12 of the optical bench 10F.

[0061] According to the optical component 1D of the fifth embodiment, the chip component 40 can be easily aligned with the optical bench 10F, and the chip component 40 can be optically connected to the optical bench 10F with high precision. This not only achieves the effects of the first to fourth embodiments described above, but also improves the efficiency of optical connection between the chip component 40 and the optical bench 10F. Furthermore, since the connection between the two is facilitated, manufacturing efficiency can be improved.

[0062] Sixth Embodiment Next, an optical component 1E according to a sixth embodiment will be described with reference to FIG. 10 . Hereinafter, explanations of points overlapping with the first to fifth embodiments may be omitted. As shown in FIG. 10 , the optical component 1E includes an optical bench 10 and a first optical connector 30. The optical component 1E may also include at least one of a second optical connector 35 and a chip component 40, or both. The optical component 1E further includes lenses 55 and 56. The lens 55 is disposed between the first inner surface 11 and the first end face 41 and optically couples the first optical input / output end of the chip component 40 to the first optical waveguide 20 (optical waveguide 21). The lens 56 is disposed between the second inner surface 12 and the second end face 42 and optically couples the second optical input / output end of the chip component 40 to the second optical waveguide 25 (optical waveguide 26).

[0063] The optical component 1E according to the sixth embodiment further includes lenses 55, 56 provided on the first inner surface 11 and the second inner surface 12, and the lenses 55, 56 optically couple the plurality of first optical waveguides 20 and second optical waveguides 25 to the optical circuit of the chip component 40. As a result, the optical component 1E according to this embodiment can further improve the efficiency of optical connection between the optical waveguides 20, 25 and the optical circuit of the chip component 40, in addition to the effects of the first to fifth embodiments described above.

[0064] The optical components and optical bench according to the present disclosure have been described in detail above, but the present invention is not limited to the above-described embodiments and can be applied to various embodiments and modifications.

[0065] For example, in the optical bench of any of the optical components 1, 1A to 1E according to the above-described embodiments, the mode field diameter of the optical waveguide 21 included in each of the plurality of first optical waveguide units 20 may be wider in a first region 21a near the first inner surface 11 than in other regions (i.e., a second region not near the first inner surface 11, for example, a region 21b near the first outer surface 13) (see FIG. 11 ). Similarly, the mode field diameter of the optical waveguide 26 included in each of the plurality of second optical waveguide units 25 may be wider in a third region 26a near the second inner surface 12 than in other regions (i.e., a fourth region not near the second inner surface 12, for example, a region 26b near the second outer surface 14). In this case, the chip component 40 can be optically connected to the optical bench 10 with high precision. This improves the optical connection efficiency between the chip component 40 and the optical bench 10.

[0066] 11 , the chip component 40 may be disposed so that the second end face 42 is spaced a distance H from the second inner surface 12. Similarly, the first end face 41 may be disposed so that the distance H is spaced a distance H from the first inner surface 11. The distance H between the inner surface of the optical bench and the end face of the chip component may be 20 μm or less. In this case, even if a gap occurs between the optical waveguide and the end face of the chip component 40, it is possible to prevent a decrease in the optical connection efficiency between the optical waveguide and the optical circuit of the chip component 40.

[0067] REFERENCE SIGNS LIST 1, 1A, 1B, 1C, 1D, 1E...Optical component 10, 10A, 10B, 10E, 10F...Optical bench 10C...First optical bench member 10D...Second optical bench member 11...First inner surface 12...Second inner surface 13...First outer surface 14...Second outer surface 15...First side surface 16...Second side surface 17...Top surface 18...Bottom surface 19...Placement surface 20...First optical waveguide section 21...Optical waveguide 21a...First region 21b...Region 25...Second optical waveguide section 26...Optical waveguide 26a...Third region 26b...Region 30...First optical connector 35...Second optical connector 40...Chip component 41...First end surface 42...Second end surface 43...Adhesive layer 44...First silicon (Si) layer 45...BOX layer 46...Second silicon (Si) layer 47...Silica (SiO ２) layers 48, 49...holes 51, 53...first alignment mechanism 52, 54...second alignment mechanism 55, 56...lenses 101...optical component 110, 115...optical bench 120, 125...optical waveguide section 130, 135...optical connector d...inner pitch D...outer pitch F...notch G...spatial region H...distance La...first length of chip Lb...first length of optical bench Wa...second length of chip Wb...second length of optical bench

Claims

1. An optical bench comprising: a first inner surface which is a side surface; a second inner surface which is a side surface; a first outer surface which is a side surface opposite the first inner surface; a second outer surface which is a side surface opposite the second inner surface; a plurality of first optical waveguide sections extending from the first inner surface to the first outer surface; and a plurality of second optical waveguide sections extending from the second inner surface to the second outer surface, wherein the angle between the first inner surface and the second inner surface is between 60 degrees and 120 degrees.

2. An optical bench as described in claim 1, wherein a first outer pitch D [μm] between the plurality of first optical waveguide sections on the first outer surface is larger than a first inner pitch d [μm] between the plurality of first optical waveguide sections on the first inner surface, a second outer pitch between the plurality of second optical waveguide sections on the second outer surface is larger than a second inner pitch between the plurality of second optical waveguide sections on the second inner surface, and a distance Lb [mm] between the first inner surface and the first outer surface satisfies (D / d) × 1 mm < Lb < (D / d) × 10 mm.

3. The optical bench according to claim 1 or claim 2, wherein the optical bench is made of glass.

4. An optical bench according to any one of claims 1 to 3, wherein each of the plurality of first optical waveguide sections includes a plurality of optical waveguides, and each of the plurality of second optical waveguide sections includes a plurality of optical waveguides.

5. An optical bench according to any one of claims 1 to 4, having an L-shape when viewed in a plane, the first inner surface and the second inner surface forming the inside of the L-shape, and the first outer surface and the second outer surface forming the outside of the L-shape.

6. An optical bench according to any one of claims 1 to 5, having a rectangular parallelepiped shape with at least one corner cut out, the cut-out shape including the first inner surface and the second inner surface.

7. The optical bench according to any one of claims 1 to 6, wherein the plurality of first optical waveguide sections are arranged in multiple stages.

8. An optical bench described in any one of claims 1 to 7, comprising: a first optical bench member including the first inner surface, the first outer surface, and the plurality of first optical waveguide portions; and a second optical bench member including the second inner surface, the second outer surface, and the plurality of second optical waveguide portions, wherein the first optical bench member and the second optical bench member are separate members.

9. An optical bench according to any one of claims 1 to 8, further comprising an alignment mechanism for determining the position of components optically connected to the first inner surface and the second inner surface of the optical bench, the alignment mechanism being provided on at least one of the first inner surface and the second inner surface or in proximity to at least one of the first inner surface and the second inner surface.

10. An optical bench according to any one of claims 1 to 9, wherein the mode field diameter of the optical waveguide included in each of the plurality of first optical waveguide sections is wider in a first region near the first inner surface than in a second region near the first outer surface.

11. An optical component comprising: an optical bench according to any one of claims 1 to 10; and a plurality of first optical connectors on the first outer surface, each optically connected to one of the plurality of first optical waveguide portions.

12. The optical component of claim 11, further comprising a lens disposed on said first inner surface, said lens optically coupling said plurality of first optical waveguides to an optical circuit of the component.

13. An optical component according to claim 11 or claim 12, further comprising a chip component optically coupled to the optical bench, the chip component including an optical circuit, a first end face having a plurality of first optical input / output terminals of the optical circuit, and a second end face having a plurality of second optical input / output terminals of the optical circuit, the plurality of first optical input / output terminals being optically connected to the plurality of first optical waveguide sections, and the plurality of second optical input / output terminals being optically connected to the plurality of second optical waveguide sections.

14. The optical component according to claim 13, wherein the separation distance between the first inner surface of the optical bench and the first end face of the chip component is 20 μm or less.

15. A method for manufacturing an optical component, comprising: providing an optical bench according to any one of claims 1 to 10; providing a component including an optical circuit, a first end face having a plurality of first optical input / output terminals of the optical circuit, and a second end face having a plurality of second optical input / output terminals of the optical circuit; and attaching the component to the optical bench so that the plurality of first optical input / output terminals are optically connected to the plurality of first optical waveguide sections and the plurality of second optical input / output terminals are optically connected to the plurality of second optical waveguide sections.

Images