Packaging for chip-shaped electronic components and chip-shaped electronic component packaged structure

Abstract

In plan view, this packaging for chip-shaped electronic components has a plurality of cavities that can accommodate substantially square chip-shaped electronic components. In plan view, an opening section of each of the plurality of cavities has four sides, namely a pair of sides that face each other in a length direction of the packaging for chip-shaped electronic components, and a pair of sides that face each other in a direction perpendicular to the length direction. In plan view, a first side among the four sides of each opening section has an extension section that, when three corner sections of a chip-shaped electronic component are respectively in contact with the three sides other than the first side, is distanced from the remaining corner section other than said three corner sections.

Description

Chip-type electronic component packaging body and chip-type electronic component packaging structure

[0001] The present disclosure relates to a packaging body for chip-type electronic components used when mounting chip-type electronic components such as multilayer ceramic capacitors on a substrate or the like, and also to a chip-type electronic component packaging structure having a chip-type electronic component and a packaging body that houses the chip-type electronic component.

[0002] A prior art packaging for chip-type electronic components is described, for example, in Patent Document 1. In this prior art, when the dimension of the chip-type electronic components along the longitudinal direction of the taping material is defined as A and the dimension along the longitudinal direction of the storage holes, which are recesses formed in the taping material and each store one chip-type electronic component, is defined as B, the dimensional ratio A / B of the dimensions A and B is set to 0.91 > A / B > 0.81, thereby ensuring an appropriate margin for the dimensional relationship between the chip-type electronic components and the storage holes, and allowing the chip-type electronic components to be stored without moving too much within the storage holes or being too cramped.

[0003] Japanese Patent Application Publication No. 10-017070

[0004] The packaging body for chip-type electronic components according to the present disclosure has, in a plan view, a plurality of voids each capable of accommodating a plurality of substantially square-shaped chip-type electronic components. The opening of each of the plurality of voids has, in a plan view, four sides, a pair of sides opposing each other in the longitudinal direction of the packaging body for chip-type electronic components and a pair of sides opposing each other in a direction perpendicular to the longitudinal direction. A first side of the four sides has an extension portion that, in a plan view, is spaced apart from the remaining corners of the chip-type electronic components while the three corners of the chip-type electronic components are in contact with the other three of the four sides.

[0005] The chip-type electronic component packaging structure according to the present disclosure includes the above-described packaging body for chip-type electronic components and the above-described plurality of chip-type electronic components.

[0006] FIG. 1 is a plan view showing recesses of a chip-type electronic component packaging body and recesses of a chip-type electronic component packaging structure according to a first embodiment of the present disclosure; FIG. 2 is a front view showing an example of a packaging device that packages chip-type electronic components in a chip-type electronic component packaging body; FIG. 3 is a perspective view showing an example of a visual inspection device provided in the packaging device; FIG. 4 is an enlarged cross-sectional view of a portion showing the configuration of a chip-type electronic component packaging body; FIG. 5 is a view showing an opening of a recess where an expanded portion is not formed; FIG. 6 is a view showing an opening of a recess where an expanded portion is formed; FIG. 7 is a plan view showing recesses of a chip-type electronic component packaging body and recesses of a chip-type electronic component packaging structure according to a second embodiment of the present disclosure; FIG. 8 is a plan view showing recesses of a chip-type electronic component packaging body and recesses of a chip-type electronic component packaging structure according to a third embodiment of the present disclosure; FIG. 9 is a plan view showing recesses of a chip-type electronic component packaging body and recesses of a chip-type electronic component packaging structure according to a fourth embodiment of the present disclosure; FIG. 10 is a plan view showing recesses of a chip-type electronic component packaging body and recesses of a chip-type electronic component packaging structure according to a fifth embodiment of the present disclosure; FIG. 11 is a plan view showing recesses of a chip-type electronic component packaging body and recesses of a chip-type electronic component packaging structure according to a sixth embodiment of the present disclosure. 1 is a plan view showing a state in which a chip-type electronic component, which is a four-terminal multilayer ceramic capacitor, is housed in a recess.

[0007] Hereinafter, with reference to the drawings, an embodiment of a packaging body for chip-type electronic components (hereinafter, sometimes simply referred to as a "packaging body") according to the present disclosure will be described. Note that, below, a multilayer ceramic capacitor will be described as an example of a chip-type electronic component (hereinafter, sometimes simply referred to as an "electronic component"). However, the electronic components that are the subject of the present disclosure are not limited to multilayer ceramic capacitors, and can be applied to various electronic components such as multilayer piezoelectric elements, multilayer thermistor elements, multilayer chip coils, and multilayer ceramic multilayer substrates.

[0008] For convenience, the drawings may be accompanied by an orthogonal coordinate system XYZ consisting of X-axis, Y-axis, and Z-axis directions. In the electronic component according to the present disclosure, any of the directions may be the X-axis, Y-axis, or Z-axis directions. However, when the electronic component 3 is a multilayer ceramic capacitor, the multilayer ceramic capacitor has a configuration in which multiple internal electrode layers and multiple dielectric layers are alternately stacked, and the stacking direction is defined as the X-axis direction. Furthermore, the direction intersecting the X-axis direction and one direction of the electronic component that is substantially square in plan view is defined as the Y-axis direction, and the direction perpendicular to the X-axis and Y-axis directions is defined as the Z-axis direction.

[0009] (First embodiment) Fig. 1 is a plan view showing a recess 2 (an example of a void) of a package 1 according to a first embodiment of the present disclosure. Fig. 2 is a front view showing an example of a packaging device 4 that packages electronic components 3 in the package 1. Fig. 3 is a perspective view showing an example of a visual inspection device 5 provided in the packaging device 4. Fig. 4 is an enlarged cross-sectional view of a portion showing the configuration of the package 1.

[0010] In the following description, when the package 1 is viewed in plan, the opening 22 of the recess 2 is defined by four sides 21a to 21d, the four inner wall surfaces defining the recess 2 are connected to the sides 21a to 21d in a direction perpendicular to the paper surface (the X-axis direction), and the four inner wall surfaces defining the recess 2 are of the same shape up to the bottom surface of the recess 2. However, this also includes cases where the four inner wall surfaces and the bottom surface defining the recess 2 are inclined within the range of the effects of the present disclosure. For example, the space defined by the four inner wall surfaces and the bottom surface defining the recess 2 is not limited to a rectangular parallelepiped shape, and may be a truncated pyramid shape with the four sides 21a to 21d as its long sides, as long as this is within the range of manufacturing tolerance. Furthermore, the opening 22 is not limited to a rectangle, including a square, and may be a shape other than a rectangle, such as a trapezoid, a trapezoid, or a parallelogram, as long as this is within the range of manufacturing tolerance.

[0011] The package 1 of this embodiment includes a longitudinal carrier tape 30 having a plurality of recesses 2 capable of accommodating electronic components 3 each having a substantially square shape in a plan view; a cover tape 33 attached to a first surface of the carrier tape 30 on which the recesses 2 (or, from another perspective, through holes as an example of voids) are open, thereby closing the recesses 2 from the first surface side; and a bottom tape 35 attached to a second surface of the carrier tape 30 opposite the first surface, thereby closing the recesses 2 from the second surface side. The carrier tape 30 is formed by punching a taping material such as paper or resin with a die, thereby forming through-holes corresponding to the plurality of recesses 2. The cover tape 33 and the bottom tape 35 may be made of, for example, any one of polyethylene (PE), polypropylene (PP), polyacetal, polyethylene terephthalate (PET), and polyvinyl chloride. The cover tape 33 and the bottom tape 35 may be joined to the carrier tape 30 by adhesion, bonding, heat fusion, or the like.

[0012] Such a package 1 is not limited to being composed of three materials, namely, the carrier tape 30, the cover tape 33, and the bottom tape 35. When the carrier tape 30 is composed of a synthetic resin material such as any one of the above-mentioned polyethylene (PE), polypropylene (PP), polyacetal (POM), polyethylene terephthalate (PET), and polyvinyl chloride, the cover tape 33 may be bonded to a tape material in which a plurality of recesses 2 are formed by molding or the like. In this case, the step of bonding the bottom tape 35 to the carrier tape 30 is not necessary, the process of packaging the electronic components 3 into the package 1 is simplified, and the manufacturing cost of the electronic components 3 can be reduced.

[0013] The electronic component 3 includes an element body 6. The element body 6 is substantially rectangular and has six faces. As shown by the imaginary lines in FIG. 1 , in a plan view, with the centroid G1 of the recess 2 and the centroid G2 of the electronic component 3 aligned on the same axis within the recess 2, the element body 6 has main faces located above and below the element body 6 in the X-axis direction, side faces located to the left and right of the element body 6 in the Y-axis direction, and end faces located at the front and rear of the element body 6 in the Z-axis direction. Note that in this specification, the "main face," "side face," and "end face" do not necessarily have to be strictly flat, and may have partial irregularities or may be slightly warped overall. The size of the electronic component 3 may be 0.05 mm to 2.5 mm in length in the X-axis direction, 0.2 mm to 4.0 mm in width in the Y-axis direction, and 0.2 mm to 4.0 mm in length in the Z-axis direction. As an example of dimensions for a multilayer ceramic capacitor, it may be an extremely thin size with a maximum thickness in the X-axis direction of 0.1 mm, a width in the Y-axis direction of 0.6 mm, and a length in the Z-axis direction of 0.6 mm.

[0014] The element body 6 is roughly rectangular parallelepiped in shape and has six faces. The faces located at the top and bottom of the element body 6 in the X-axis direction are called main faces, the faces located at the left and right of the element body 6 in the Y-axis direction are called side faces, and the faces located at the front and back of the element body 6 in the Z-axis direction are called end faces.

[0015] The element body 6 has a plurality of ceramic dielectric layers and a plurality of internal electrode layers. The plurality of ceramic dielectric layers and the plurality of internal electrode layers are alternately stacked in the X-axis direction. The plurality of ceramic dielectric layers may include various ceramic dielectrics. Examples of ceramic dielectrics include barium titanate (BaTiO ３ ) and calcium zirconate (CaZrO ３ The internal electrode layers may be made of a sintered body of glass and various metals such as nickel (Ni), palladium (Pd), copper (Cu), tin (Sn), zinc (Zn), platinum (Pt), silver (Ag), and gold (Au). The thickness of the internal electrode layers may be, for example, about 0.1 μm to 1.0 μm, or about 0.4 μm to 0.5 μm.

[0016] The multiple internal electrode layers are alternately exposed from a pair of end faces of the laminate and connected to the first external electrode 7a or the second external electrode 7b. Of the multiple internal electrode layers, those connected to the first external electrode 7a are referred to as first internal electrode layers, and those connected to the second external electrode 7b are referred to as second internal electrode layers. The first internal electrode layers and the second internal electrode layers are two types of conductor patterns with different polarities. To form the conductor patterns, printing such as screen printing or gravure printing can be used. Each conductor pattern becomes the first internal electrode layer and the second internal electrode layer after firing.

[0017] The electronic component 3 includes the aforementioned element body 6, first external electrode 7a, and second external electrode 7b. The element body 6 includes a substantially rectangular parallelepiped capacitive section formed by a plurality of internal electrode layers and a plurality of ceramic dielectric layers, a first side margin 9a covering one side of the capacitive section, a second side margin 9b covering the other side of the capacitive section, a first cover section covering one main surface of the capacitive section, and a second cover section covering the other main surface of the capacitive section. The first side margin 9a, the second side margin 9b, the first cover section, and the second cover section may be made of a material having the same main component as the ceramic dielectric layers.

[0018] When a voltage is applied between the first external electrode 7a and the second external electrode 7b of the electronic component 3, the voltage is applied to the multiple ceramic dielectric layers between the internal electrode layers. This causes a charge corresponding to the voltage between the first external electrode 7a and the second external electrode 7b to be stored in the electronic component 3. The configuration of the electronic component 3 is not limited to a specific configuration, and any known configuration can be appropriately adopted depending on the size and performance required of the electronic component. For example, the number of internal electrode layers in the laminated portion can be appropriately determined. Furthermore, for example, the longitudinal direction and lateral direction of the element body 6, which has a substantially rectangular parallelepiped shape, may be reversed.

[0019] The electronic component 3 has an element body 6 and external electrodes. The shape of the element body 6 is set as appropriate, but in one example, the element body 6 is a substantially rectangular parallelepiped. In one example, the external electrodes are located on a pair of end faces of the element body 6 and may be formed to extend around to other faces adjacent to the end faces. The external electrode located on one end face is referred to as a first external electrode 7a, and the external electrode located on the other end face is referred to as a second external electrode 7b.

[0020] The packaging device 4 includes a take-up reel 32 that intermittently transports and winds up the carrier tape 30 in the direction of arrow A1. The carrier tape 30 is made of, for example, paper or processed paper. The carrier tape 30 is transported horizontally along a turntable 51 of the visual inspection device 5. The turntable 51 is a circular multilayer panel in plan view, and has a plurality of storage compartments 52 equally spaced circumferentially around its outer periphery. Electronic components 3 are supplied one by one into each storage compartment 52 from a feeder 53. The packaging device 4 is installed, for example, on a horizontal floor F in a factory. The turntable 51 is intermittently rotated in the direction of arrow B1 around a vertical rotation axis L1 in synchronization with the packaging body 1. The turntable 51 transports the electronic components 3 to recesses 2 formed in the carrier tape 30 and stores them in the recesses 2.

[0021] The feeder 53 is disposed upstream of the turntable 51 (to the left in FIG. 2 ), and a heating device 34 for adhering the cover tape 33 to the first surface of the carrier tape 30 is disposed downstream of the turntable 51 (to the right in FIG. 2 ). A bottom tape supply reel 36 is disposed below the turntable 51, around which the bottom tape 35 to be adhered to the second surface of the carrier tape 30 is wound. Further, below the bottom tape supply reel 36, a carrier tape supply reel 37 is disposed below the bottom tape supply reel 36, around which the carrier tape 30 is wound. The cover tape 33 is wound around a cover tape supply reel 38 disposed downstream of the heating device 34.

[0022] 3 , the visual inspection device 5 includes the aforementioned turntable 51 that is intermittently rotated in the direction of arrow B1 about a vertical rotation axis L1, a first camera C1 that is disposed below a supply position of electronic components 3 from a feeder 53 to the turntable 51 and captures images of the electronic components 3 supplied from the feeder 53 to each storage section 52 of the turntable 51 from below, a second camera C2 that is disposed downstream of the first camera C1 in the rotation direction of the turntable 51 in the direction of arrow B1 and captures images of the electronic components 3 in the storage sections 52 from above, and a third camera C3 that is disposed downstream of the supply position from the turntable 51 to the packaging body 1 in the direction of arrow A1 and captures images of the electronic components 3 stored in each recess 2 of the packaging body 1 from above. The first camera C1, the second camera C2, and the third camera C3 may be realized by an imaging device equipped with an imaging element such as a charge coupled device (CCD).

[0023] The appearance inspection device 5 may be configured to detect defective portions of the electronic component 3 based on images captured by the first camera C1, the second camera C2, and the third camera C3. The appearance inspection device 5 may be configured, for example, to binarize the images captured by the first camera C1, the second camera C2, and the third camera C3 and detect the dimensions of each portion of the electronic component 3 based on the luminance difference between the binarized images. Furthermore, the appearance inspection device 5 may have a memory that stores reference dimensions, defective dimension ranges, and normal dimension ranges for each portion of the electronic component 3. The appearance inspection device 5 may be configured to detect defective portions of the electronic component 3 by comparing the detected dimensions of each portion of the electronic component 3 with the reference dimensions, defective dimension ranges, and normal dimension ranges for each portion of the electronic component 3 stored in the memory.

[0024] 5A and 5B are plan views illustrating the formation position of the extension portion 23. Fig. 5A shows the opening 22 of the recess 2 where the extension portion 23 is not formed, and Fig. 5B shows the opening 22 of the recess where the extension portion 23 is formed.

[0025] 5A , it is assumed that the electronic component 3 is housed in the recess 2 with the centroid G2 of the electronic component 3 coinciding with the centroid G1 of the recess 2 in a plan view. The imaginary line 103 in FIG. 5A indicates a state in which the electronic component 3 is housed such that each end face of the electronic component 3 is parallel to the inner wall surfaces connected to the sides 21 c and 21 d, and each side face of the electronic component 3 is parallel to the inner wall surfaces connected to the sides 21 a and 21 b.

[0026] With this state in mind, the distances from each side and end face of the electronic component 3 to each inner wall surface of the recess 2 are set. The distances are set taking into consideration the dimensional accuracy of the electronic component 3 and the insertion accuracy of the packaging device 4. When the main surface shape of the electronic component 3 is square, the distances from each side and end face of the electronic component 3 to each inner wall surface of the recess 2 are set to be the same (a-b) / 2 in the Y-axis and Z-axis directions (a and b will be described later). As a result, the opening shape of the recess 2 has traditionally been square.

[0027] The electronic components 3 housed in the recesses 2 of the package 1 are sucked by a suction nozzle in a component mounter (not shown), carried in that state to a predetermined position on a circuit board, and mounted thereon. If the diameter of the suction nozzle's suction port is smaller than the opening 22 of the recess 2, the suction nozzle can suck one of the main surfaces of the electronic components 3 facing the opening 22. However, since the opening area of ​​the suction port of the suction nozzle is smaller than the opening 22, the electronic components 3 cannot be sucked with a large suction force. On the other hand, if the diameter of the suction nozzle's suction port is larger than the opening 22 of the recess 2, a large suction force is generated because a large area including one of the main surfaces, portions of each end face, and portions of each side face of the electronic components 3 is sucked. However, since the suction port of the suction nozzle does not come into contact with one of the main surfaces of the electronic components 3, air is sucked through the gap between the one of the main surfaces and the suction port, and a large suction force cannot be applied to the electronic components 3.

[0028] Therefore, because the suction force of a suction nozzle used for small-sized electronic components 3 is limited, the manner in which the electronic component 3 contacts each inner wall surface connected to each side 21a-21d of the recess 2 can affect the success rate of suction by the suction nozzle. In particular, if the four corners 3a-3d of the electronic component 3 contact each inner wall surface, the electronic component 3 may become locked within the recess 2, making it difficult to smoothly remove the electronic component 3 from the recess 2 using the suction nozzle. As shown by the imaginary line 203 in Figure 5A, in a package 1 without an expansion section 23, if the electronic component 3 stored in the recess 2 moves within the recess 2 due to factors such as vibration and tilt during movement of the package 1 and rotates around an axis passing through the centroid G2, the four corners 3a-3d of the electronic component 3 will come into contact with the four inner wall surfaces of the recess 2, preventing the electronic component 3 from being sucked by the suction nozzle and smoothly removed from the recess 2.

[0029] 5B , by providing at least one extension portion 23 on at least one side 21c (an example of a first side) in a plan view, even when three corners 3a to 3c are in contact with the inner wall surfaces connected to the sides 21a to 21c, the remaining corner 3d is prevented from contacting the inner wall surface connected to the side 21c by the extension portion 23, thereby ensuring the degree of freedom of the electronic component 3 within the recess 2 and allowing the electronic component 3 to move within the recess 2. Such extension portion 23 reduces the likelihood that the four corners 3a to 3d will simultaneously come into contact with the inner wall surfaces connected to the sides 21a to 21d and enter a locked state.

[0030] 1, two extensions 23 are formed on the inner wall surface connected to the side 21c, symmetrically with respect to a plane of symmetry located at the centroid G1 and perpendicular to the side 21c. By adopting such a configuration, whether the electronic component 3 rotates clockwise or counterclockwise around an axis including the centroid G2 within the recess 2, one of the corners 3d and 3c of the electronic component 3 is positioned in one of the two extensions 23. As a result, the likelihood of the electronic component 3 being locked within the recess 2 is reduced, regardless of the rotation direction of the electronic component 3.

[0031] Each of the plurality of recesses 2 provided in the package 1 has an opening 22 that is defined by four sides, namely, a pair of sides 21a, 21b facing each other in a first direction (Y-axis direction) and a pair of sides 21c, 21d facing each other in a second direction (Z-axis direction), in plan view. The four sides 21a to 21d of the opening 22 include one side 21c that has an extension portion 23 that is spaced apart from the remaining corner 3d while three corners 3a, 3b, and 3c of the electronic component 3 in plan view are in contact with the three sides 21a, 21b, and 21d, respectively.

[0032] The extension 23 has a portion that is a distance x away in the first direction (Y-axis direction) from the first end 3a1, which is the intersection of the sides 21a and 21c of the recess 2. The distance x is expressed by the following formula (1). In plan view, the dimension of each of the sides 21a to 21d of the opening 22 of the recess 2 is a, and the dimension of each of the sides 31a to 31d of the electronic component 3 is b. x=a / 2-{(2 １／２ / 2b) ２ −(a / 2) ２} １／２ …(1)

[0033] Equation (1) can be derived as follows. As shown in FIG. 5A, the dimension from side 21a to centroid G2 of electronic component 3 is a / 2. As shown in FIG. 5B, distance x is a / 2-d. d is the distance in the Y-axis direction from the position of distance x to centroid G2. a / 2 and d correspond to the first and second terms of equation (1), respectively. d is equal to the length of the adjacent side of a right triangle whose hypotenuse is the line segment connecting centroid G2 and the position of distance x. The length of the other adjacent side is a / 2. Therefore, if the length of the hypotenuse is c, then d = {c ２ −(a / 2) ２} １／２ Since c is half the length of the diagonal of the electronic component 3, c (= 2 １／２ / 2b).

[0034] In plan view, the extension portion 23 may be formed in an arc or approximately arc shape with a dimension a1 in the longitudinal direction (Y-axis direction), which is a first direction, and a dimension h in the lateral direction (Z-axis direction), which is a second direction. The dimensions a1 and the distance h are arbitrary. For example, the dimension a1 may be 50 μm or more. The distance h may be, for example, 20 μm or more and 100 μm or less. The distance h may be, for example, 0.01 a or more or 0.03 a or more, and may be 0.20 a or less or 0.10 a or less. The above lower and upper limits may be combined arbitrarily.

[0035] a+h may be interpreted as the longest distance between sides 21c and 21d in the opposing direction (Z-axis direction). a may be interpreted as the shortest distance between the pair of opposing sides 21a, 21b in the direction along side 21c. The ratio of the longest distance to the shortest distance ((a+h) / a) may be, for example, 1.01 or more or 1.03 or more, and may be 1.20 or less or 1.10 or less. The above lower and upper limits may be arbitrarily combined. The values ​​of h and (a+h) / a exemplified here may be incorporated into other embodiments ( FIGS. 6B to 7 ) having a non-arc-shaped extension portion 23, as described below, unless a contradiction arises.

[0036] The package 1 of this embodiment is a longitudinal package having a plurality of recesses 2 capable of accommodating electronic components 3 each having a substantially square shape in plan view. Each of the recesses 2 has an opening 22 formed by four sides 21a to 21d, including a pair of sides 21a, 21b facing each other in a first direction, i.e., a longitudinal direction (Y-axis direction), and a pair of sides 21c, 21d facing each other in a second direction, i.e., a lateral direction (Z-axis direction), which is aligned with the longitudinal direction. The four sides 21a to 21d of the opening 22 include at least one side 21c having an extension 23 that is spaced apart from the remaining corners 3d excluding the three corners 3a, 3b, and 3c when the three corners 3a, 3b, and 3c of the electronic component 3 are in contact with the three sides 21a, 21b, and 21d, respectively. Such extension 23 reduces the likelihood that the electronic component 3 will be locked while housed in the recess 2. This in turn facilitates the suction of the electronic component 3 by suction with the suction nozzle and the removal of the electronic component 3 from the recess 2 .

[0037] 6A is a plan view showing the recess 2a of a package 1a according to a second embodiment. The same reference numerals are used to designate parts corresponding to those in the first embodiment. The package 1a of this embodiment has extensions 23 on two opposing sides 21c, 21d of the opening 22 in the short direction (Z-axis direction) that satisfy the distance x in the above-described formula (1).

[0038] By adopting this configuration, even if the electronic component 3 rotates clockwise or counterclockwise around an axis passing through the centroid G2 within the recess a2, the corner 3d of the electronic component 3 is movable by the extension portion 23 provided on the side 21c, reducing the likelihood of the electronic component 3 becoming locked. In addition, the corner 3a is movable by the extension portion 23 provided on the other side 21d, which also reduces the likelihood of the electronic component 3 becoming locked. Therefore, because the electronic component 3 can move relative to either of the two corners 3d, 3a of the electronic component 3 by the extension portion 23, the electronic component 3 has a high degree of freedom in movement, reducing the likelihood of the electronic component 3 becoming locked.

[0039] Third Embodiment Fig. 6B is a plan view showing a recess 2b of a packaging body 1b of a third embodiment. The same reference numerals are used to designate parts corresponding to those in the first embodiment. In the packaging body 1b of this embodiment, two extension portions 23 are provided on one side 21c of the opening 22. The two extension portions 23 are shaped like three sides of a rectangle in plan view, satisfy the distance x in the above-described formula (1), and are formed symmetrically with respect to a plane including an axis passing through the centroid G1 of the recess 2.

[0040] By adopting such a configuration, regardless of whether the electronic component 3 rotates clockwise or counterclockwise around the axis passing through the centroid G2 within the recess 2b, the corner 3d or 3c of the electronic component 3 has freedom of movement due to the extension portion 23 provided on the side 21c, thereby reducing the likelihood of the electronic component 3 becoming locked.

[0041] (Fourth Embodiment) Figure 6C is a plan view showing a recess 2c of a packaging body 1c of a fourth embodiment. Note that parts corresponding to those in the first embodiment are designated by the same reference numerals. In the packaging body 1c of this embodiment, one side 21c of the opening 22 is formed so as to be inclined as a whole to form two equal sides of an isosceles triangle. Each equal side forms an extension portion 23 that is separated from the remaining corner 3d or 3c by the aforementioned distance h when the three corners 3a, 3b, and 3c or 3d, 3a, and 3b of the electronic component 3 are in contact with the inner wall surface of the recess 2c. This extension portion 23 also satisfies the distance x in equation (1).

[0042] By adopting such a configuration, regardless of whether the electronic component 3 rotates clockwise or counterclockwise around the axis passing through the centroid G2 within the recess 2c, the corner 3d or 3c of the electronic component 3 has freedom of movement due to the extension portion 23 provided on the side 21c, thereby reducing the likelihood of the electronic component 3 becoming locked.

[0043] Although not specifically shown, each equal side (hereinafter referred to as "diagonal line") may not be a single straight line, but may be a broken line, a curved line, or a combination of straight and curved lines. Furthermore, the diagonal line may or may not bulge outward. The two diagonal lines may or may not have the same shape and dimensions. The two diagonal lines may or may not be smoothly connected. The extension 23 may be a curved line bulging outward along the entire length of side 21c. The diagonal line does not extend beyond the intersection of side 21c and side 21a or 21b to side 21a or 21b, but it may reach there (the straight portions of side 21a and / or 21b may be shortened by the diagonal line).

[0044] 6D is a plan view showing a recess 2d of a packaging body 1d of a fifth embodiment. The same reference numerals are used to designate parts corresponding to those of the first embodiment. In the packaging body 1d of this embodiment, the entire side 21c of the opening 22 is formed as an extension portion 23, at a distance x calculated by the above-described formula (1), by two oblique lines spaced a distance h in the short direction (Z-axis direction) from one corner 3d or 3c of the electronic component 3, and one straight line connecting the two oblique lines.

[0045] By adopting such a configuration, regardless of whether the electronic component 3 rotates clockwise or counterclockwise around the axis passing through the centroid G2 within the recess 2d, the corner 3d or 3c of the electronic component 3 has freedom of movement due to the extension portion 23 provided on the side 21c, thereby reducing the likelihood of the electronic component 3 becoming locked.

[0046] The explanations of various aspects of the oblique line in the fourth embodiment may be applied to the oblique line in the fifth embodiment, unless there is a contradiction, etc. Also, unlike the illustrated example, the linear portion extending in the Y-axis direction may achieve the distance h at the position of the distance x (position 1 or position 2).

[0047] Sixth Embodiment Fig. 6E is a plan view showing a recess 2e of a packaging body 1e of a sixth embodiment. Note that parts corresponding to those in the first embodiment are designated by the same reference numerals. In the packaging body 1e of this embodiment, one side 21c of the opening 22 is entirely formed as an extension 23 extending from the first end 3a1 to the second end 3c1. The first end 3a1 is the intersection of the two sides 21c and 21a, and the second end 3c1 is the intersection of the two sides 21c and 21b. This extension 23 includes a recess 2e formed as a linear extension 23 spaced a distance h from one corner 3d or 3c of the electronic component 3 whose two corners 3a, 3b, and 3c or 3d, 3a, and 3c contact the inner wall surface of the opening 22.

[0048] By adopting such a configuration, regardless of whether the electronic component 3 rotates clockwise or counterclockwise around the axis passing through the centroid G2 within the recess 2e, the corner 3d or 3c of the electronic component 3 has freedom of movement due to the extension portion 23 provided on the side 21c, thereby reducing the likelihood of the electronic component 3 becoming locked.

[0049] 7 is a plan view showing a state in which an electronic component 3, which is a four-terminal multilayer ceramic capacitor with square main surfaces, is housed in a recess 2. Note that the same reference numerals are used to designate parts corresponding to those in the first embodiment. In the first to sixth embodiments, a two-terminal multilayer ceramic capacitor having two external electrodes 7a, 7b has been described. As in the other embodiments, the electronic component 3 may be a four-terminal multilayer ceramic capacitor having four external electrodes 7a, 7b, 7c, and 7d. These four external electrodes 7a, 7b, 7c, and 7d are connected to internal electrode layers exposed from the four corners of the laminated portion of the element body.

[0050] 6A to 6E. The expansion portion 23 may be any portion that, in a plan view, retracts from the remaining corner 3d while the three corners 3a, 3b, and 3c of the electronic component 3 are in contact with the wall surfaces connected to the three sides 21a to 21c of the recess 2, and does not restrict the movement of the electronic component 3 within the recess 2. The recess 2 is not limited to a specific shape or size.

[0051] Although the embodiments of the present disclosure have been described in detail above, the present disclosure is not limited to the above-described embodiments, and various modifications and improvements are possible within the scope of the gist of the present disclosure. It goes without saying that all or part of the components constituting each of the above-described embodiments can be combined as appropriate within the scope of not contradicting each other.

[0052] For example, the configuration in which extensions 23 are formed on sides 21c and 21d as in Fig. 6A may be combined with the shapes of extensions 23 in Fig. 6B to Fig. 6E. Also, for example, the configuration in which two extensions 23 are formed on side 21c as in Fig. 1 may be combined with the shape of extensions 23 in Fig. 5B.

[0053] In the first embodiment, the first side having the extension portion 23 is side 21c. Naturally, the first side may be one of the other sides 21a, 21b, and 21d. From another perspective, the first side may be a side that faces another side in the Y-axis direction, rather than a side that faces another side in the Z-axis direction. This is similar to other embodiments. Furthermore, when extension portions 23 are provided on two sides that face each other as shown in FIG. 6A , the two sides may be two sides 21a and 21b that face each other in the Y-axis direction.

[0054] Although not specifically shown, the possibility of locking occurring in both clockwise and counterclockwise directions may be reduced by providing extension portions 23 on two intersecting sides. For example, in FIG. 5B , in addition to the extension portion 23 on side 21c, an extension portion 23 may be provided on side 21a near the first end 3a1. Alternatively, extension portions 23 may be provided on each of the third and fourth sides. Alternatively, extension portions 23 may be provided on either or both of sides 21a and 21b that face each other in the Y-axis direction.

[0055] As described in the first embodiment, in any embodiment, the ratio (a+h) / a of the longest distance a+h between side 21c and side 21d opposite side 21c in the opposing direction (Z-axis direction) to the shortest distance a between a pair of sides 21a, 21b opposing each other in the direction along side 21c (an example of a first side) (Y-axis direction) may be 1.20 or less.

[0056] In this embodiment, for example, the amount of expansion of the recess 2 by the expansion portion 23 is relatively small. Therefore, for example, displacement of the electronic component 3 relative to the recess 2 is easily restricted. As a result, for example, the likelihood of a decrease in the success rate of suction due to a large displacement is reduced.

[0057] 6C to 6E, the extension 23 extends over the entire length of the side 21c. In this case, the likelihood of locking is reduced compared to the case where the extension 23 is formed at a pinpoint as in FIG. 1. From another perspective, the manufacturing precision of the extension 23 can be reduced.

[0058] 6C and 6D , the expansion portion 23 is located at the center of the side 21 c, and the expansion amount of the opening 22 caused by the expansion portion 23 at the center position of the side 21 c (the distance from the side 21 c to the expansion portion 23 when the expansion portion 23 is not present) is greater than the expansion amount at positions on both ends of the side 21 c relative to the center position. In particular, the expansion portion 23 may have two diagonal lines whose expansion amount increases toward the center position.

[0059] In this embodiment, when the electronic component 3 translates and / or rotates, the corners 3a to 3d formed by the external electrodes 7a and 7b are more likely to come into contact with the sides 21a to 21d of the recess 2 before the intermediate portions of the sides 31a to 31d formed by the element body 6, compared to the embodiment shown in FIG. 6B . From another perspective, the likelihood that the corners of the recess 2 resulting from the formation of the extension 23 (see the corners of the convex portion protruding toward the −Z side on the side 21c in FIG. 6B ) will come into contact with the element body 6 is reduced. As a result, the element body 6 is more likely to be protected. Furthermore, for example, the shape of the opening 22 is more likely to approximate the shape of the tip of the suction nozzle (generally circular). As a result, the area of ​​the tip of the suction nozzle that can be inserted into the opening 22 is more likely to be increased. Furthermore, compared to FIG. 6E , unnecessary translation of the electronic component 3 in the Z-axis direction is more likely to be reduced.

[0060] 1 and 5B to 6D, the opening 22 has an asymmetric shape in at least one of the Y-axis direction and the Z-axis direction due to the inclusion of the extension 23. In this embodiment, for example, the orientation of the opening 22 can be more easily grasped by a device and / or a person. Also, for example, the vibration of the electronic component 3 in the recess 2 is more likely to be asymmetric, reducing the likelihood of resonance.

[0061] 1 and 5B to 6B, the extension 23 does not extend over the entire length of the side 21 c. In this configuration, the displacement of the electronic component 3 relative to the recess 2 is more easily restricted than in a configuration in which the extension 23 extends over the entire length of the side 21 c.

[0062] The combination of the packaging body 1 and the plurality of electronic components 3 housed in the plurality of recesses 2 may be regarded as a chip-type electronic component packaging structure. Also, unlike the description of the embodiment, the carrier tape 30 may be regarded as an example of a packaging body for chip-type electronic components according to the present disclosure.

[0063] In the case of a chip-type electronic component having a substantially square shape, as in the case of the present disclosure, when the four corners contact the inner wall of the storage hole, the rotational moment that releases the lock against the frictional force acting at each contact point is approximately equal. This makes it highly likely that the chip-type electronic component will be locked in the storage hole, potentially preventing the chip-type electronic component from moving freely within the storage hole. In such a case, the chip-type electronic component stored in the storage hole cannot be accurately sucked by the suction nozzle of the mounting device. Therefore, the chip-type electronic component packaging body and chip-type electronic component packaging structure according to the present disclosure can reduce the likelihood of the chip-type electronic component being locked in the recess, even if the stored chip-type electronic component is substantially square.

[0064] On the other hand, in the prior art described in Patent Document 1, because the chip electronic component is generally rectangular, when the four corners of the chip electronic component contact the inner wall of the storage hole, a difference occurs in the rotational moment that releases the lock against the frictional force acting at each contact point, resulting in contact points with a large rotational moment and contact points with a small rotational moment. The rotational moment at contact points with a small rotational moment is always smaller than the interface moment in the case of a generally square shape. As a result, even if the four corners contact the inner wall of the storage hole, the lock is released at the points with a small rotational moment, so the likelihood of the chip electronic component being locked in the storage hole is low.

[0065] DESCRIPTION OF SYMBOLS 1, 1a to 1e Chip electronic component packaging body 2, 2a to 2e Recess 3 Chip electronic component 3a to 3d Corner 4 Packaging device 5 Visual inspection device 6 Element body 7a, 7b External electrodes 21a to 21d Side of opening 22 22 Opening 23 Expanded portion 30 Carrier tape 31a to 31d Side of chip electronic component 3 32 Take-up reel 33 Cover tape 35 Bottom tape 36 Bottom tape supply reel 37 Carrier tape supply reel 38 Cover tape supply reel 51 Turntable 52 Storage section 53 Feeder C1 First camera C2 Second camera C3 Third camera

Claims

1. A packaging structure for chip-type electronic components comprising: a plurality of chip-type electronic components that are substantially square in shape in plan view; and a longitudinal packaging body for chip-type electronic components having a plurality of voids capable of accommodating each of the plurality of chip-type electronic components, wherein each of the plurality of voids has an opening having four sides in plan view, namely a pair of sides facing in a first direction along the longitudinal direction of the packaging body for chip-type electronic components and a pair of sides facing in a second direction perpendicular to the longitudinal direction, and a first of the four sides has an extension portion in plan view that is spaced apart from the remaining corners of the chip-type electronic components while each of the three corners is in contact with the three sides other than the first side.

2. When the dimension of one side of the opening in a plan view is a and the dimension of one side of the chip-type electronic component is b, the distance x from the first end of the first side in a direction along the first side is expressed as follows: x = a / 2 - {(2 １／２ / 2b) ２ −(a / 2) ２ } １／２ The chip-like electronic component packaging structure according to claim 1 , comprising a portion in which 3. The chip-type electronic component packaging structure according to claim 1 or 2, wherein the extension portion extends over the entire length of the first side.

4. A chip-type electronic component packaging structure according to any one of claims 1 to 3, wherein the ratio of the longest distance in the opposing direction between the first side and the side opposing the first side to the shortest distance between a pair of opposing sides in the direction along the first side is 1.20 or less.

5. A chip-type electronic component packaging structure according to any one of claims 1 to 4, wherein the expansion portion is located at the center of the first side, and the amount of expansion of the opening caused by the expansion portion at the center position of the first side is greater than the amount of expansion at positions on both ends of the first side relative to the center position.

6. A chip-type electronic component packaging structure according to any one of claims 1 to 5, wherein the opening includes the expansion portion, and thereby has an asymmetric shape in at least one of the first direction and the second direction.

7. The chip-type electronic component packaging structure according to claim 1 or 2, wherein the extension does not extend over the entire length of the first side.

8. A chip-type electronic component packaging structure according to any one of claims 1 to 7, wherein the chip-type electronic component packaging body comprises a longitudinal carrier tape having the plurality of voids, and a cover tape attached to a first surface of the carrier tape where the plurality of voids are open.

9. The chip-type electronic component packaging structure according to claim 8, wherein the chip-type electronic component packaging body includes a bottom tape attached to a second surface of the carrier tape opposite to the first surface.

10. A chip-like electronic component packaging structure according to any one of claims 1 to 9, wherein the distance between a pair of sides of the plurality of voids facing each other in the first direction is different from the distance between a pair of sides of the plurality of voids facing each other in the second direction in a plan view.

11. A packaging body for chip-type electronic components having a plurality of voids capable of accommodating a plurality of substantially square-shaped chip-type electronic components in a plan view, wherein each of the plurality of voids has an opening having four sides, a pair of sides facing in a first direction along the longitudinal direction of the packaging body for chip-type electronic components in a plan view, and a pair of sides facing in a second direction perpendicular to the longitudinal direction, and wherein a first of the four sides has an extension portion that, in a plan view, separates from the remaining corners of the chip-type electronic components while each of the three corners of the chip-type electronic components is in contact with the three sides other than the first side of the four sides.

Images