Board assembly and electronic device comprising same

Abstract

The present disclosure relates to an electronic device. The electronic device according to an embodiment of the present disclosure comprises: a housing that forms the exterior; and a board assembly disposed inside the housing. The board assembly may comprise: a first printed circuit board including a first surface and a second surface opposite to the first surface; a second printed circuit board that is spaced apart from the first printed circuit board and includes a third surface facing the first surface; an interposer that is disposed between the first printed circuit board and the second printed circuit board and includes a signal via for electrically connecting the first printed circuit board and the second printed circuit board and a dummy via disposed at the edge of the interposer; and a dummy solder which is disposed on the first surface of the first printed circuit board and connected to the dummy via and protrudes to the outside of the interposer.

Description

Substrate assembly and electronic device including the same

[0001] The present disclosure relates to a substrate assembly and an electronic device, for example, to a substrate assembly including an interposer and an electronic device including the same.

[0002] Electronic devices can refer to devices that perform specific functions based on their embedded programs, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, and car navigation systems. For example, these electronic devices can output stored information as audio or video.

[0003] As the integration of electronic devices increases and ultra-high-speed, high-capacity wireless communications become more widespread, a single electronic device, such as a mobile terminal, can now incorporate a variety of functions. For example, in addition to communication functions, entertainment functions like gaming, multimedia functions like music and video playback, communication and security functions like mobile banking, and even calendar management and electronic wallet functions are being integrated into a single electronic device. These electronic devices are also becoming smaller and more portable for users.

[0004] An electronic device according to one embodiment of the present disclosure may include a housing forming an exterior, and a substrate assembly disposed inside the housing, wherein the substrate assembly may include a first printed circuit board including a first surface and a second surface opposite the first surface, a second printed circuit board spaced apart from the first printed circuit board and including a third surface facing the first surface, an interposer disposed between the first printed circuit board and the second printed circuit board, the interposer including a signal via electrically connecting the first printed circuit board and the second printed circuit board, and a dummy via disposed at an edge of the interposer, and a dummy solder disposed on a first surface of the first printed circuit board, connected to the dummy via, and protruding outside the interposer.

[0005] A substrate assembly according to one embodiment of the present disclosure may include a first printed circuit board including a first surface and a second surface opposite the first surface, a second printed circuit board including a third surface spaced apart from the first printed circuit board and facing the first surface, an interposer disposed between the first printed circuit board and the second printed circuit board, the interposer including a signal via electrically connecting the first printed circuit board and the second printed circuit board, and a dummy via disposed at an edge of the interposer, and a dummy solder disposed on the first surface of the first printed circuit board, connected to the dummy via, and protruding outward from the interposer.

[0006] An electronic device according to one embodiment of the present disclosure includes a housing forming an exterior, and a substrate assembly disposed inside the housing, wherein the substrate assembly may include a first printed circuit board having a first surface and a second surface opposite to the first surface, a second printed circuit board spaced apart from the first surface of the first printed circuit board and facing the first surface, a third printed circuit board spaced apart from the second surface of the first printed circuit board and facing the second surface, a first interposer disposed between the first printed circuit board and the second printed circuit board, and a first dummy solder disposed on the first surface of the first printed circuit board and connected to the first interposer, a second interposer disposed between the first printed circuit board and the third printed circuit board, and a second dummy solder disposed on the second surface of the first printed circuit board and connected to the second interposer, wherein the first dummy solder may be, when viewed from above the first surface, a portion of the first interposer. The second dummy solder may protrude outwardly, and the second dummy solder may protrude outwardly from the second interposer when viewed from above the second surface.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0008] FIG. 2 is a perspective view of an electronic device showing a front side of the electronic device according to one embodiment of the present disclosure.

[0009] FIG. 3 is a perspective view of an electronic device showing a rear side of the electronic device according to one embodiment of the present disclosure.

[0010] FIG. 4 is a perspective view of a portion of an electronic device showing a substrate assembly disposed in a housing of the electronic device, according to one embodiment of the present disclosure.

[0011] FIG. 5 is an exploded perspective view of a substrate assembly according to one embodiment of the present disclosure.

[0012] FIG. 6 is a plan view of a portion of a substrate assembly from which a second printed circuit board has been removed, according to one embodiment of the present disclosure.

[0013] FIG. 7 is a schematic cross-sectional view of one area of ​​the electronic device illustrated in FIG. 4, showing a substrate assembly and a housing.

[0014] FIG. 8 is an enlarged view of an area of ​​the substrate assembly illustrated in FIG. 6, illustrating solders according to one embodiment of the present disclosure.

[0015] FIG. 9 is a plan view of a dummy solder according to one embodiment of the present disclosure.

[0016] FIG. 10 illustrates an interposer before it is soldered to a first printed circuit board, according to one embodiment of the present disclosure.

[0017] FIG. 11 illustrates an embodiment of the present disclosure when an interposer is placed on solder cream on a first printed circuit board and heat is applied to the solder cream.

[0018] Figure 12 is a top view of an area of ​​Figure 11, showing the flow direction of molten solder cream.

[0019] FIG. 13 illustrates an interposer mounted on a first printed circuit board according to one embodiment of the present disclosure.

[0020] FIG. 14 illustrates an interposer (1330) before being soldered onto a first printed circuit board (310) according to another embodiment of the present disclosure.

[0021] FIG. 15 is a bottom view of a portion of a substrate assembly illustrating a reinforcing member according to one embodiment of the present disclosure.

[0022] FIG. 16 is a perspective view of a portion of a substrate assembly illustrating solders according to one embodiment of the present disclosure.

[0023] FIG. 17 is a plan view of a dummy solder according to one embodiment of the present disclosure.

[0024] FIG. 18 is an enlarged view of a region of the substrate assembly illustrated in FIG. 6, and is a cross-sectional view of a portion of the substrate assembly showing a dummy solder and a shield can according to one embodiment of the present disclosure.

[0025] FIG. 19 is a schematic cross-sectional view of a portion of an electronic device showing a dummy solder and a non-conductive member according to one embodiment of the present disclosure.

[0026] FIG. 20 is a schematic cross-sectional view of a portion of an electronic device showing dummy solder and metal layers according to one embodiment of the present disclosure.

[0027] FIGS. 21, 22, 23, 24, and 25 are schematic drawings of portions of a substrate assembly illustrating dummy solder according to various embodiments of the present disclosure.

[0028] FIG. 26 is a perspective view of a portion of a substrate assembly according to one embodiment of the present disclosure.

[0029] FIG. 27 is a side view of a portion of the substrate assembly shown in FIG. 26, showing dummy solders.

[0030] The following description of the accompanying drawings may provide an understanding of various exemplary implementations of the present disclosure, including the claims and their equivalents. While the exemplary embodiments disclosed in the following description include numerous specific details to aid understanding, they are to be considered as one example of various exemplary embodiments. Accordingly, those skilled in the art will appreciate that various modifications and variations of the various implementations described herein may be made without departing from the scope and spirit of the disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0031] The terms and words used in the following description and claims are not limited to their reference meanings and can be used to clearly and consistently describe one embodiment of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various implementations of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the disclosure and its equivalents.

[0032] Unless the context clearly dictates otherwise, the singular forms of "a," "an," and "the" should be understood to include plural meanings. Thus, for example, "a component surface" could be understood to include one or more of the surfaces of the component.

[0033] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0034] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0035] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0036] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0037] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0038] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0039] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0040] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0041] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0042] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0043] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0044] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0045] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0046] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0047] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0048] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0049] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0050] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0051] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0052] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0053] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0054] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0055] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0056] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0057] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0058] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0059] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0060] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0061] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0062] FIG. 2 is a perspective view of an electronic device (101) showing a front side (210A) of the electronic device (101) according to one embodiment of the present disclosure. FIG. 3 is a perspective view of an electronic device (101) showing a rear side (210B) of the electronic device (101) according to one embodiment of the present disclosure.

[0063] Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment of the present disclosure may include a first surface (or front surface) (210A), a second surface (or back surface) (210B), and a third surface (or side surface) (210C) surrounding a space between the first surface (210A) and the second surface (210B).

[0064] According to one embodiment of the present disclosure, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The back plate (211) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side structure (or “side bezel structure”) (218) that is joined to the front plate (202) and the back plate (211) and includes a metal and / or a polymer. In one embodiment, the back plate (211) and the side structure (218) may be formed integrally and include the same material (e.g., a metal material such as aluminum).

[0065] According to one embodiment of the present disclosure, the electronic device (101) may include at least one of a display (220), an audio module (203, 207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), a light emitting element (206), and a connector hole (208, 209). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., the key input device (217) or the light emitting element (206)) or may additionally include other components.

[0066] According to one embodiment of the present disclosure, the display (220) may be visually exposed, for example, through a substantial portion of the front plate (202). In one embodiment, at least a portion of the display (220) may be visually exposed through the front plate (202) forming the first surface (210A) or through a portion of a side surface (210C). In one embodiment, the corners of the display (220) may be formed to be substantially identical to the adjacent outer shape of the front plate (202).

[0067] In one embodiment of the present disclosure (not shown), a recess or opening may be formed in a part of a screen display area of ​​the display (220), and at least one of an audio module (214), a sensor module (204), a camera module (205), and a light-emitting element (206) may be included that are aligned with the recess or opening. In one embodiment of the present disclosure (not shown), at least one of an audio module (214), a sensor module (204), a camera module (205), a fingerprint sensor (not shown), and a light-emitting element (206) may be included on a back surface of the screen display area of ​​the display (220). In one embodiment of the present disclosure (not shown), the display (220) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen.

[0068] According to one embodiment of the present disclosure, the audio module (203, 207, 214) may include a microphone hole (203) and a speaker hole (207, 214). The microphone hole (203) may have a microphone disposed therein for acquiring external sounds, and in one embodiment, multiple microphones may be disposed so as to detect the direction of sounds. The speaker hole (207, 214) may include an external speaker hole (207) and a receiver hole (214) for calls. In one embodiment, the speaker hole (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (207, 214) (e.g., a piezo speaker).

[0069] According to one embodiment of the present disclosure, the sensor modules (204, 219) may generate electrical signals or data values ​​corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor modules (204, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) and / or a fourth sensor module (e.g., a fingerprint sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on not only the first surface (210A) (e.g., the display (220)) of the housing (210), but also the second surface (210B) or the side surface (210C). The electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0070] According to one embodiment of the present disclosure, the camera modules (205, 212, 213) may include a first camera device (205) disposed on a first side (210A) of the electronic device (101), a second camera device (212) disposed on a second side (210B), and / or a flash (213). The camera devices (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (101). In one embodiment, the flash (213) may emit infrared light, and the infrared light emitted by the flash (213) and reflected by the subject may be received through the third sensor module (219). The electronic device (101) or the processor of the electronic device (101) may detect depth information of the subject based on the point in time when the infrared light is received by the third sensor module (219).

[0071] According to one embodiment of the present disclosure, the key input device (217) may be disposed on a side surface (210C) of the housing (210). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (220). In one embodiment, the key input device may include a sensor module disposed on a second surface (210B) of the housing (210).

[0072] According to one embodiment of the present disclosure, the light-emitting element (206) may be disposed, for example, on the first surface (210A) of the housing (210). The light-emitting element (206) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light-emitting element (206) may provide a light source that is linked to the operation of, for example, the camera module (205). The light-emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0073] The connector holes (208, 209) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (209) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0074] FIG. 4 is a perspective view of a portion of an electronic device (101) showing a substrate assembly (300) disposed in a housing (210) of the electronic device (101) according to one embodiment of the present disclosure. FIG. 5 is an exploded perspective view of the substrate assembly (300) according to one embodiment of the present disclosure.

[0075] Referring to FIGS. 4 and 5, an electronic device (101) according to one embodiment of the present disclosure may include a housing (210) forming an exterior appearance and a substrate assembly (300) disposed inside the housing (210). The housing (210) may be referred to as a frame (210). The housing (210) may be visually exposed to the exterior of the electronic device (101). The housing (210) may include a key hole (217H) in which a key input device (217) is disposed.

[0076] According to one embodiment of the present disclosure, a substrate assembly (300) may include a printed circuit board (310, 320, see FIG. 5). The substrate assembly (300) may have electronic components of an electronic device (101) disposed thereon (e.g., a processor (120), a memory (130), and / or a communication module (190) of FIG. 1). The substrate assembly (300) may include a first printed circuit board (310). The substrate assembly (300) may include a second printed circuit board (320). The substrate assembly (300) may include an interposer (330).

[0077] According to one embodiment of the present disclosure, a first printed circuit board (310) may include a first side (311) and a second side (312) facing in an opposite direction to the first side (311). Electronic components or electrical elements of an electronic device (101) may be disposed on the first side (311) and / or the second side (312). A second printed circuit board (320) may be spaced apart from the first printed circuit board. The second printed circuit board (320) may be disposed to face the first printed circuit board. The second printed circuit board (320) may include a third side (321) facing the first side (311) of the first printed circuit board (310). The second printed circuit board (320) may include a fourth side (322) facing in an opposite direction to the third side (321). Electronic components or electrical elements of the electronic device (101) may be placed on the third side (321) and / or the fourth side (322).

[0078] According to one embodiment of the present disclosure, an interposer (330) may be disposed between a first printed circuit board (310) and a second printed circuit board (320). The interposer (330) may electrically connect the first printed circuit board (310) and the second printed circuit board (320). As an example, the interposer (330) may include a through via that electrically connects the first printed circuit board (310) and the second printed circuit board (320).

[0079] According to one embodiment of the present disclosure, the interposer (330) may extend in a loop shape along an edge (320E) of the second printed circuit board (320). The interposer (330) extended in a loop shape may provide a space in which an electronic component (e.g., a shield can (340)) is placed between the first printed circuit board (310) and the second printed circuit board (320).

[0080] According to one embodiment of the present disclosure, the substrate assembly (300) may include a shield can (340). The shield can (340) may be positioned between a first printed circuit board (310) and a second printed circuit board (320). As an example, the shield can (340) may be disposed on a first side (311) of the first printed circuit board (310). As another example, the shield can (340) may be disposed on a third side (321) of the second printed circuit board (310). The shield can (340) may be at least partially surrounded by an interposer (330).

[0081] According to one embodiment of the present disclosure, the first printed circuit board (310) may include a first region (313) that overlaps the second printed circuit board (320) when viewed from above the first surface (311). The first printed circuit board (310) may include a second region (314) that does not overlap the second printed circuit board (320) when viewed from above the first surface (311). As an example, a shield can (340) may be placed in the first region (313) of the first printed circuit board (310).

[0082] According to one embodiment of the present disclosure, the housing (210) may include a first bracket portion (215) facing the substrate assembly (300). The first bracket portion (215) may be understood as a region of the housing (210) that supports a second printed circuit board (320) of the substrate assembly (300). As an example, the first bracket portion (215) may include a portion of the housing (210) that extends parallel to the second printed circuit board (320).

[0083] According to one embodiment of the present disclosure, the housing (210) may include a second bracket portion (216) connected to a first bracket portion (215). The second bracket portion (216) may be positioned adjacent to an edge of the first printed circuit board (310). The second bracket portion (216) may be understood as a portion of the housing (210) adjacent to the second region (314) of the first printed circuit board (310). The relationship between the second bracket portion (216) and the board assembly (300) will be described in detail below with reference to FIG. 7.

[0084] FIG. 6 is a plan view of a portion of a substrate assembly (300) from which a second printed circuit board (320) has been removed, according to one embodiment of the present disclosure.

[0085] Referring to FIG. 6, according to one embodiment of the present disclosure, an interposer (330) may be disposed on a first surface (311) of a first printed circuit board (310). The interposer (330) may include an outer lateral surface (339) and an inner lateral surface (338). The outer lateral surface (339) of the interposer (330) may be visually exposed to the outside of the interposer (330). The inner lateral surface (338) of the interposer (330) may define a space that is at least partially surrounded by the interposer (330). As an example, the inner lateral surface (338) of the interposer (330) may face a side surface of a shield can (340, see FIG. 5).

[0086] According to one embodiment of the present disclosure, a first surface (311) of a first printed circuit board (310) may include an outer portion (311A, 311B) positioned outside an interposer (330) and an inner portion (311C) positioned inside an interposer (330). Dummy solders (410, 420, 430) may be disposed on the first surface (311) of the first printed circuit board (310). As illustrated in FIG. 6, the substrate assembly (300) may include a plurality of dummy solders (410, 420, 430), and the dummy solders (410, 420, 430) may be disposed on the outer portions (311A, 311B, 311C) of the first surface (311), respectively. The dummy solder (410, 420, 430) may protrude outside the interposer (330).

[0087] According to one embodiment of the present disclosure, the term "dummy" in the dummy solder (410, 420, 430) is a term used to distinguish it from the signal solder (440, see FIG. 8), and it can be understood that it means that no electrical signal for the functional operation of the electronic device flows, and does not limit any other technical meaning. The dummy solder (410, 420, 430) will be described in detail below with reference to FIGS. 7 to 27.

[0088] According to one embodiment of the present disclosure, the dummy solder (410, 420, 430) may be understood as a member formed by cooling solder paste (or solder cream) after an SMD reflow process. The SMD reflow process may be understood as a process including a reflow soldering step of melting the solder paste after placing an electronic component (e.g., an interposer (330)) on the solder paste. As an example, the solder paste may include SAC (silver, aluminum, copper) solder paste.

[0089] FIG. 7 is a schematic cross-sectional view of one area (P) of the electronic device (101) illustrated in FIG. 4, showing a substrate assembly (300) and a housing (210).

[0090] Referring to FIG. 7, according to one embodiment of the present disclosure, a first printed circuit board (310) may include a conductive pad (315). The conductive pad (315) may be disposed on a first surface (311) of the first printed circuit board (310). A dummy solder (410) may be disposed on the conductive pad (315). An interposer (330) may be connected to the conductive pad (315) via the dummy solder (410). The conductive pad (315) may be referred to as a dummy pad (315).

[0091] According to one embodiment of the present disclosure, the electronic device (101) may include a reinforcing member (500) disposed on a second surface (312) of the first printed circuit board (310). The reinforcing member (500) may extend from a first region (313) to a second region (314) of the first printed circuit board (310). When viewed from above the second surface (312) or when viewed from above the first surface (311), the reinforcing member (500) and the dummy solder (410) may overlap each other.

[0092] According to one embodiment of the present disclosure, when an impact is applied to the electronic device (101), the impact or external force may be transmitted to the substrate assembly (300), and the solder (e.g., dummy solder (410)) at the edge of the interposer (330) may be damaged. For example, when the electronic device (101) is dropped, warpage of the electronic device (101) may occur due to the impact, and at this time, the impact may be transmitted to a region of the substrate assembly (300) (e.g., a second region (314) of the first printed circuit board (310)) through a mechanism (e.g., a bracket portion (216) of the housing (210)) around the substrate assembly (300). As another example, due to the difference in area between the first printed circuit board (310) and the second printed circuit board (320), a region (e.g., the second region (314)) of the first printed circuit board (310) may be exposed to contact with a peripheral device (e.g., the bracket portion (216) of the housing (210). As another example, during the manufacturing process of the board assembly (300), when an external force is applied by a worker's hand, manufacturing equipment, etc., the external force may be transmitted through a region (e.g., the second region (314) of the first printed circuit board (310)) of the board assembly (300), causing damage to the board assembly (300).

[0093] According to one embodiment of the present disclosure, the dummy solder (410) may be spaced apart from the bracket portion (216) of the housing (210). As an example, the gap (D) between the dummy solder (410) and a peripheral device (e.g., the bracket portion (216) of the housing (210)) may be greater than the width of the dummy solder (410) (e.g., the width (W3) of the second portion (412B) of FIG. 9).

[0094] According to another embodiment of the present disclosure, the description of the impact and external force transmission of the bracket portion (216) of the housing (210) and the substrate assembly (300) described with reference to FIG. 7 can be substantially equally applied to the substrate assembly (300) and other structures of the electronic device (101) adjacent to the substrate assembly (300). The bracket portion (216) of the housing (210) described with reference to FIG. 7 can be described as being replaced with a physical structure located around the substrate assembly (300).

[0095] FIG. 8 is an enlarged view of an area (A, or B) of the substrate assembly (300) illustrated in FIG. 6, illustrating solders (411, 412, 413, 414, 415, 416, 440) according to one embodiment of the present disclosure. FIG. 9 is a plan view of a dummy solder (412) according to one embodiment of the present disclosure. FIG. 9 illustrates a view of the dummy solder (e.g., second dummy solder (412)) as viewed from above the first surface (311) of the first printed circuit board (310).

[0096] The description of the dummy solder (412) described with reference to FIGS. 8 and 9 can be substantially equally applied to the dummy solders (410, 420, 430) illustrated in FIG. 6 to the extent that they are not arranged with each other. The description of the shape of the dummy solder (412) described with reference to FIGS. 8 and 9 can be substantially equally applied to the shape of the conductive pad (315) illustrated in FIG. 7.

[0097] Referring to FIGS. 8 and 9, according to one embodiment of the present disclosure, a substrate assembly (410) may include solders (411, 412, 413, 414, 415, 416, 440). The plurality of solders (411, 412, 413, 414, 415, 416, 440) may include a first dummy solder (411) and a second dummy solder (412). The first dummy solder (411) and the second dummy solder (412) may be exposed to the outside of the interposer (330). The first dummy solder (411) may connect the interposer (330) and the first printed circuit board (310). The second dummy solder (412) can connect the interposer (330) and the first printed circuit board (310).

[0098] According to one embodiment of the present disclosure, the first dummy solder (411) may include a first portion (411A) that overlaps the interposer (330) and a second portion (411B) that does not overlap the interposer (330) when viewed from above the first surface (311). The second dummy solder (412) may include a first portion (412A) that overlaps the interposer (330) and a second portion (412B) that does not overlap the interposer (330) when viewed from above the first surface (311). Parts of the first dummy solder (411) and the second dummy solder (412) (e.g., the second portions (411B, 412B)) may be disposed in a second area (314, see FIG. 6) of the first printed circuit board (310).

[0099] According to one embodiment of the present disclosure, a first portion (411A) of a first dummy solder (411) may be disposed between an interposer (330) and a first surface (311) of a first printed circuit board (310) and connected to a dummy via (332). A first portion (412A) of a second dummy solder (412) may be disposed between an interposer (330) and a first surface (311) of a first printed circuit board (310) and connected to a dummy via (332).

[0100] According to one embodiment of the present disclosure, the second portion (411B) of the first dummy solder (411) may extend from the first portion (411A) and protrude outwardly of the interposer (330). By increasing the size of the first dummy solder (411), the bonding strength between the first printed circuit board (310) and the interposer (330) by the first dummy solder (411) may be improved. The second portion (412B) of the second dummy solder (412) may extend from the first portion (412A) and protrude outwardly of the interposer (330). By increasing the size of the second dummy solder (412), the bonding strength between the first printed circuit board (310) and the interposer (330) by the second dummy solder (412) may be improved.

[0101] According to one embodiment of the present disclosure, the interposer (330) may include a curved section extending in a curved manner along an edge (320E) of the second printed circuit board (320). The first dummy solder (411) and the second dummy solder (412) may connect the curved section of the interposer (330) and the first printed circuit board (310).

[0102] According to one embodiment of the present disclosure, the first dummy solder (411) may extend in a first direction from the first portion (411A) to the second portion (411B). The second dummy solder (412) may extend in a second direction from the first portion (412A) to the second portion (412B). The first direction and the second direction may intersect each other. As an example, the first direction and the second direction may extend radially with respect to the interposer. The first direction may be named a first radial direction, and the second direction may be named a second radial direction.

[0103] According to one embodiment of the present disclosure, the substrate assembly (300) may include a dummy bridge (415, 416) extending along an edge of the interposer (330) from a first dummy solder (411) or a second dummy solder (412). The dummy bridge (415, 416) may connect the dummy solder (411, 412) and the dummy solder (413, 414). The interposer (330) and the first printed circuit board (310) may be connected to each other through the dummy solder (411, 412), the dummy bridge (415, 416), and the dummy solder (413, 414).

[0104] According to one embodiment of the present disclosure, the substrate assembly (300) may include a signal solder (440). The signal solder (440) may be understood as a solder ball through which an electrical signal of the substrate assembly (300) flows. The signal solder (440) may be disposed on a first surface (311) of the first printed circuit board (310). The first printed circuit board (310) and a signal via (331, see FIG. 10) of the interposer (330) may be electrically connected through the signal solder (440).

[0105] According to one embodiment of the present disclosure, when viewed from above the first surface (311), the width (W3) of the second portion (412B) may be greater than the width (W2) of the first portion (412A). The widths (W1, W2) of the first portion (412A) may become narrower from the outside to the inside of the interposer (330). The first portion (412A) may become narrower from the second portion (412B) to the end (412E) of the first portion (412A). Although FIG. 9 illustrates a case where the edges (412C, 412D) of the first portion (412A) are substantially straight, the shapes of the edges (412C, 412D) may be variously changed, and for example, may have a curved shape.

[0106] According to one embodiment of the present disclosure, when viewed from above the first side (311) of the first printed circuit board (310), the dummy via (332) may overlap the first portion (412A) of the second dummy solder (412). As an example, when viewed from above the first side (311) of the first printed circuit board (310), the dummy via (332) may be located inside the first portion (412A) of the second dummy solder (412).

[0107] FIG. 10 illustrates an interposer (330) before being soldered to a first printed circuit board (310), according to one embodiment of the present disclosure, with solder cream (L1, L2) applied on the first printed circuit board (310).

[0108] The description of the conductive pad (315) described with reference to FIG. 7 can be substantially equally applied to the first conductive pad (315) and the second conductive pad (316) illustrated in FIGS. 10 to 13, to the extent that they are not arranged with each other.

[0109] Referring to FIG. 10, a manufacturing process of a substrate assembly (300) according to one embodiment of the present disclosure may include a process of applying solder cream (L1, L2) on first conductive pads (315) and second conductive pads (316) of a first printed circuit board (310), and then placing an interposer (330) on the solder cream (L1, L2). As an example, the second printed circuit board (320) may be placed on the first printed circuit board (310) together with the interposer (330), or may be placed on the interposer (330) after the interposer (330) is placed. FIGS. 10 to 13 illustrate, as an example, a case where the interposer (330) and the second printed circuit board (320) are first joined through soldering, and then the interposer (330) is soldered on the first printed circuit board (310).

[0110] According to one embodiment of the present disclosure, the interposer (330) may include a plurality of through vias (331, 332). A pad-shaped conductive material (e.g., interposer pads N1, N2 of FIG. 14) may be disposed at the ends of the through vias (331, 332). The pad-shaped conductive material may be connected to the through vias (331, 332) or may be formed integrally with the through vias (331, 332). As an example, a conductive material (e.g., interposer pads (N1, N2) of FIG. 14) disposed at the ends of the through vias (331, 332) may be formed to have a larger area than the cross-section of the through vias (331, 332) to provide a stable electrical connection between the first printed circuit board (310) (e.g., the first conductive pad (315) and / or the second conductive pad (316)) and the through vias (331, 332).

[0111] According to one embodiment of the present disclosure, the interposer (330) may include a signal via (331) that electrically connects the first printed circuit board (310) and the second printed circuit board (320). An electrical signal may be transmitted between the first printed circuit board (310) and the second printed circuit board (320) through the signal via (331). The signal via (331) may be electrically connected to a first signal line (SL1) of the first printed circuit board (310) and a second signal line (SL2) of the second printed circuit board (320).

[0112] According to one embodiment of the present disclosure, the interposer (330) may include a dummy via (332) arranged at an edge of the interposer (330). The dummy via (332) may be connected to a dummy solder (410, 420, 430, see FIG. 6). The dummy via (332) may be understood as a via that is not connected to the signal lines (SL1, SL2) of the first printed circuit board (310) and the second printed circuit board (320). The dummy via (332) may be spaced apart from the signal via (331).

[0113] According to one embodiment of the present disclosure, the 'dummy' of the dummy via (332) is a term used to distinguish it from the signal via (331), and has the meaning that no electrical signal for the functional operation of the electronic device flows, and can be understood as not limiting any other technical meaning.

[0114] FIG. 11 illustrates an appearance when heat is applied to the solder cream (L1, L2, see FIG. 12) after the interposer (330) is placed on the solder cream (L1, L2, see FIG. 12) on the first printed circuit board (310) according to one embodiment of the present disclosure. FIG. 12 is a top view of a region (J) of FIG. 11, illustrating the flow of the molten solder cream (L11, L12). FIG. 13 illustrates an appearance when the interposer (330) is mounted on the first printed circuit board (310) according to one embodiment of the present disclosure.

[0115] Referring to FIGS. 11 to 13, a process for manufacturing a substrate assembly (300) according to one embodiment of the present disclosure may include a process of placing an interposer (330) on a first printed circuit board (310) while solder cream (L1, L2) is applied thereto. The solder cream (L1, L2) may be in contact with a signal via (331) and a dummy via (332) of the interposer (330) placed on the first printed circuit board (310).

[0116] According to one embodiment of the present disclosure, the first conductive pad (315) and the dummy solder (e.g., the dummy solder (411, 412) of FIG. 9) may have a width that becomes narrower toward the inside of the interposer (330). Therefore, when the solder cream (L1, L2) is heated and melted while the interposer (330) is placed on the solder cream (L1, L2, see FIG. 10), the melted solder cream (L1) on the first conductive pad (315) may be pressed by the interposer (330) and partially pushed out of the interposer (330), or may not overflow to the outside of the first conductive pad (315), but may easily flow into the space between the interposer (e.g., the dummy via (332)) and the first conductive pad (315) and be evenly distributed on the first conductive pad (315).

[0117] According to one embodiment of the present disclosure, a process for manufacturing a substrate assembly (300) may include a process of cooling the molten solder cream (L1, L2) after an interposer (330) is placed on the molten solder cream (L1, L2). The cooled solder cream (L1, L2) may be formed into a plurality of dummy solders (411, 412, 413, 414, 415, 416, 440) as illustrated in FIG. 8.

[0118] FIG. 14 illustrates an interposer (1330) before being soldered onto a first printed circuit board (310) according to another embodiment of the present disclosure.

[0119] The description of the process of mounting an interposer (330) on a first printed circuit board (310) according to one embodiment of the present disclosure, described with reference to FIGS. 10 to 13, can be substantially equally applied to the method of mounting an interposer (1330) on a first printed circuit board (310) as shown in FIG. 14, to the extent that they are not arranged with each other.

[0120] Referring to FIG. 14, according to another embodiment of the present disclosure, an interposer (1330) may not include a dummy via (331, see FIGS. 10 to 13). The interposer (1330) may include interposer pads (N1, N2) connected to conductive pads (315, 316) of a first printed circuit board (310). As an example, the interposer pads (N1, N2) may be understood as copper thin films disposed on the interposer (1330). For convenience of explanation, the interposer pad (N1) connected to the first conductive pad (315) may be referred to as a first interposer pad, and the interposer pad (N2) connected to the second conductive pad (316) may be referred to as a second interposer pad.

[0121] According to another embodiment of the present disclosure, the first interposer pad (N1) may be positioned at an edge of the interposer (1330). The first interposer pad (N1) may be positioned closer to the edge (e.g., the outer surface (339)) of the interposer (1330) than the second interposer pad (N2). As an example, the first interposer pad (N1) may be understood as an interposer pad that is positioned closest to the outer surface (339) of the interposer (1330) among the plurality of interposer pads (N1, N2).

[0122] According to another embodiment of the present disclosure, the first interposer pad (N1) may be connected to the first conductive pad (315) via a dummy solder (e.g., a first portion (412A) of the second dummy solder (412), see FIG. 13). The second interposer pad (N2) may be connected to the second conductive pad (316) via a signal solder (440, see FIG. 8). The process of connecting the first interposer pad (N1) and the second interposer pad (N2) to the first printed circuit board (310) via the solder cream (L1, L2) may be performed according to the process of connecting the interposer (330) to the first printed circuit board (310) described with reference to FIGS. 10 to 13.

[0123] According to another embodiment of the present disclosure, the second interposer pad (N2) may be located on the inner side of the interposer (1330). For example, the second interposer pad (N2) may be located further from an edge (e.g., an outer surface (339)) of the interposer (1330) than the first interposer pad (N1). The second interposer pad (N2) may be located at an end of a signal via (331). The second interposer pad (N2) may be formed integrally with the signal via (331) or may be soldered to the end of the signal via (331).

[0124] According to another embodiment of the present disclosure, the second interposer pad (N2) may be electrically connected to the second conductive pad (316) via a signal solder (440, see FIG. 8). The second interposer pad (N2) may be connected to the second conductive pad (316) via a signal solder (440, see FIG. 8).

[0125] According to another embodiment of the present disclosure, the second interposer pad (N2) may be electrically connected to the signal via (331). The signal via (331) and the first signal line (SL1) may be electrically connected through the second interposer pad (N2) and the second conductive pad (316). As an example, the second interposer pad (N2) may be understood as a copper thin film having a width (or widths) greater than the width of the signal via (331).

[0126] FIG. 15 is a bottom view of a portion of a substrate assembly (300) illustrating a reinforcing member (500) according to one embodiment of the present disclosure.

[0127] Referring to FIG. 15, according to one embodiment of the present disclosure, the electronic device (101) may include a reinforcing member (500) disposed on a second surface (312) of the first printed circuit board (310). The reinforcing member (500) may extend from a first region (313) to a second region (314) of the first printed circuit board (310). When viewed from above the second surface (312) or when viewed from above the first surface (311), the reinforcing member (500) and the dummy solder (410) may overlap each other. A reinforcing member (500) is arranged on the second surface (312) of the first printed circuit board (310) to minimize warpage of the second area (314) of the first printed circuit board (310) due to a peripheral structure (e.g., a bracket portion (216) of the housing (210), see FIG. 7).

[0128] FIG. 16 is a perspective view of a portion of a substrate assembly (300) illustrating dummy solders (1411, 1412, 1413, 1414, 1415, 1416, 1417, 1418) according to one embodiment of the present disclosure. FIG. 17 is a plan view of a dummy solder (e.g., a second dummy solder (1412)) according to one embodiment of the present disclosure.

[0129] The description of the dummy solders (411, 412) described with reference to FIGS. 8 and 9 can be substantially equally applied to the dummy solders (1411, 1412, 1413, 1414, 1415, 1416, 1417, 1418) illustrated in FIGS. 16 and 17 within a range where they are not arranged with each other.

[0130] The description of the dummy via (332) described with reference to FIGS. 8 to 13 can be substantially equally applied to the dummy vias (332A, 332B) illustrated in FIGS. 16 and 17, to the extent that they are not arranged with each other.

[0131] Referring to FIGS. 16 and 17, a substrate assembly (300) according to one embodiment of the present disclosure may include a plurality of dummy solders (1411, 1412, 1413, 1414, 1415, 1416, 1417, 1418). The plurality of dummy solders (1411, 1412, 1413, 1414, 1415, 1416, 1417, 1418) may include dummy solders (1411, 1412, 1413, 1414) and dummy bridges (1415, 1416, 1417, 1418). Adjacent dummy solders (e.g., a first dummy solder (1411) and a second dummy solder (1412)) may be connected by a dummy bridge (e.g., a first dummy bridge (1415)). A plurality of dummy solders (1411, 1412, 1413, 1414, 1415, 1416, 1417, 1418) may connect the interposer (330) and the first printed circuit board (310).

[0132] According to one embodiment of the present disclosure, a plurality of solders (1411, 1412, 1413, 1414, 1415, 1416, 1417, 1418) may be sequentially connected. The plurality of solders (1411, 1412, 1413, 1414, 1415, 1416, 1417, 1418) may be arranged along a boundary line (BL) extending along an edge of the interposer (330).

[0133] According to one embodiment of the present disclosure, when viewed from above the first surface (311), the width (W03) of the second portion (1412B) of the second dummy solder (1412) may be greater than the width (W02) of the first portion (1412A). The widths (W01, W02) of the first portion (1412A) may become narrower from the outside to the inside of the interposer (330). The first portion (1412A) may become narrower from the second portion (1412B) to the end (1412E) of the first portion (1412A). FIG. 17 illustrates a case where the edges (1412C, 1412D) of the first portion (1412A) are substantially straight, but the shape of the edges (1412C, 1412D) can be changed in various ways, and as an example, can have a curved shape.

[0134] According to one embodiment of the present disclosure, when viewed from above on the first side (311) of the first printed circuit board (310), the plurality of dummy vias (332A, 332B) may overlap with the first portion (1412A) of the second dummy solder (1412). As an example, when viewed from above on the first side (311) of the first printed circuit board (310), the plurality of dummy vias (332A, 332B) may be located inside the first portion (1412A) of the second dummy solder (1412).

[0135] FIG. 18 is an enlarged view of a region (C) of the substrate assembly (300) illustrated in FIG. 6, and is a cross-sectional view of a portion of the substrate assembly (300) showing a dummy solder (430) and a shield can according to one embodiment of the present disclosure.

[0136] According to one embodiment of the present disclosure, the dummy solder (430) may protrude from the interposer (330) toward the interior of the substrate assembly (300). The shield can (340) may be at least partially surrounded by the interposer (330). The shield can (340) may be connected to the dummy solder (430). Accordingly, the conductive pad for mounting the shield can (340) to the first printed circuit board (310) may be eliminated while increasing the bonding strength between the interposer (330) and the first printed circuit board (310).

[0137] FIG. 19 is a cross-sectional view of a portion of an electronic device (101) showing a dummy solder (410) and a non-conductive member (R) according to one embodiment of the present disclosure.

[0138] According to one embodiment of the present disclosure, the electronic device (101) may include a non-conductive member (R) that at least partially covers a portion of the dummy solder (410) protruding outwardly of the interposer (330) (e.g., a second portion (412B) of the second dummy solder (412) of FIG. 8). As an example, the non-conductive member (R) may include a resin that is applied and then hardened on a portion of the dummy solder (410) protruding outwardly.

[0139] According to one embodiment of the present disclosure, the dummy solder (410) can be electrically connected to the ground layer of the first printed circuit board (310). Since the dummy solder (410) connected to the ground layer of the first printed circuit board (310) is blocked from contact with a surrounding structure (e.g., a bracket portion (216) of a housing (210)) by a non-conductive member (R), stable grounding performance can be secured through the dummy solder (410).

[0140] FIG. 20 is a cross-sectional view of a portion of an electronic device (101) showing a dummy solder (410) and a metal layer (336) according to one embodiment of the present disclosure.

[0141] According to one embodiment of the present disclosure, the substrate assembly (300) may include a metal layer (336) that at least partially covers an outer lateral surface (339) of the interposer and is connected to the dummy solder (410). The metal layer (336) may contact the first printed circuit board (310). The metal layer (336) may contact the second printed circuit board (320). By connecting the metal layer (336) and a portion of the dummy solder (410) protruding outside of the interposer (330) (e.g., the second portion (412B) of the second dummy solder (412) of FIG. 8), the structural stability of the substrate assembly (300) may be improved.

[0142] FIGS. 21 through 25 are schematic drawings of a portion of a substrate assembly (300) showing dummy solder (2410, 3410) according to various embodiments of the present disclosure.

[0143] The description of the second dummy solder (412), the first portion (412A), and the second portion (412B) described with reference to FIG. 8 can be substantially equally applied to the dummy solder (2410, 3410, 4410), the first portion (2410A, 3410A, 4410A), and the second portion (2410B, 3410B, 4410B) illustrated in FIGS. 21 to 25, to the extent that they are not arranged with each other.

[0144] Referring to FIGS. 21 and 22, according to one embodiment of the present disclosure, the second portion (2410B) of the dummy solder (2410) may have a wider width as it goes toward the outside of the interposer (330). The first portion (2410A) of the dummy solder (2410) may overlap with one dummy via (332) or may overlap with multiple dummy vias (332A, 332B).

[0145] Referring to FIGS. 21 and 22, according to one embodiment of the present disclosure, the second portion (3410B) of the dummy solder (3410) may have a width that increases toward the outside of the interposer (330). The first portion (3410A) of the dummy solder (3410) may overlap with one dummy via (332) or may overlap with multiple dummy vias (332A, 332B). The second portion (3410B) of the dummy solder (3410) may have a shape that becomes narrower toward the outside. As an example, the second portion (3410B) of the dummy solder (3410) may have a round shape.

[0146] Referring to FIG. 25, a dummy solder (4410) according to one embodiment of the present disclosure may extend across the interposer (330). As an example, the extension direction of the dummy solder (4410) may intersect the extension direction of the interposer (330). The dummy solder (4410) may be connected to a plurality of dummy vias (332) of the interposer (330). The dummy solder (4410) may couple the interposer (330) and the first printed circuit board (310).

[0147] According to one embodiment of the present disclosure, the dummy solder (4410) may include a first portion (4410A) that overlaps the interposer (330). The dummy solder (4410) may include a second portion (4410B) that protrudes from the first portion (4410A) to the outside of the interposer (330). The dummy solder (4410) may include a third portion (4410C) that protrudes from the first portion (4410A) to the inside of the interposer (330).

[0148] FIG. 26 is a perspective view of a portion of a substrate assembly (300) according to one embodiment of the present disclosure. FIG. 27 is a side view of a portion of the substrate assembly (300) illustrated in FIG. 26, showing dummy solders (411, 412, 413, 411', 412', 413').

[0149] The description of the second printed circuit board (320) described with reference to FIGS. 5 and 6 can be substantially equally applied to the third printed circuit board (320') described with reference to FIGS. 26 and 27, to the extent that they are not arranged with each other. The description of the interposer (330) described with reference to FIGS. 5 and 6 can be substantially equally applied to the second interposer (330') described with reference to FIGS. 26 and 27, to the extent that they are not arranged with each other.

[0150] Referring to FIGS. 26 and 27, according to one embodiment of the present disclosure, a substrate assembly (300) may include a third printed circuit board (320') spaced apart from a second surface (312) of the first printed circuit board (310) and facing the second surface (312). The substrate assembly (300) may include a second interposer (330') disposed between the first printed circuit board (310) and the third printed circuit board (320').

[0151] According to one embodiment of the present disclosure, the substrate assembly (300) may include a second dummy solder (410') disposed on the second surface (312) of the first printed circuit board (310) and connected to the second interposer (330'). The description of the first dummy solder (410) described with reference to FIGS. 6 to 15 may be substantially equally applied to the second dummy solder (410') illustrated in FIGS. 26 and 27 to the extent that they are not disposed with each other.

[0152] According to one embodiment of the present disclosure, the second dummy solder (410') may protrude outside the second interposer (330') when viewed from above the second surface (312). When viewed from above the first surface (311), the first dummy solder (410) may overlap the second dummy solder (410'). Therefore, by overlapping the first dummy solder (410) and the second dummy solder (410'), the structural stability of the substrate assembly (300) may be improved.

[0153] Due to the limited space available for electronic devices, printed circuit boards (PCBs) and electronic components (e.g., interposers or SMDs) mounted thereon can be damaged (e.g., cracked) by interference from surrounding structures (e.g., brackets, housings, etc.) when subjected to impact. Therefore, extensive research is being conducted to improve the structural stability of electronic components located within electronic devices.

[0154] The problem to be solved in the present disclosure may be to improve the bonding strength between a printed circuit board and an electronic component by solder.

[0155] A problem to be solved in the present disclosure may be to evenly distribute solder cream when soldering electronic components to a printed circuit board.

[0156] The problem to be solved in this disclosure is not limited to the problem mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.

[0157] Electronic devices according to various embodiments of the present disclosure can improve bonding strength between a printed circuit board and an electronic component (e.g., an interposer) by increasing the size of solder connecting the printed circuit board and the electronic component.

[0158] An electronic device according to various embodiments of the present disclosure can evenly distribute solder cream during the process of mounting electronic components on a printed circuit board by allowing melted solder cream to easily flow between the printed circuit board and the electronic components.

[0159] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0160] According to one embodiment of the present disclosure, an electronic device (101) may include a housing (210) forming an exterior, and a substrate assembly (300) disposed inside the housing (210).

[0161] According to one embodiment of the present disclosure, the substrate assembly (300) may include a first printed circuit board (310) including a first side (311) and a second side (312) opposite to the first side (311).

[0162] According to one embodiment of the present disclosure, the substrate assembly (300) may include a second printed circuit board (320) spaced apart from the first printed circuit board (310) and including a third side (321) facing the first side (311) and a fourth side (322) opposite the third side (321).

[0163] According to one embodiment of the present disclosure, the substrate assembly (300) may include an interposer (330) disposed between the first printed circuit board (310) and the second printed circuit board (320).

[0164] According to one embodiment of the present disclosure, the interposer (330) may include a signal via (331) that electrically connects the first printed circuit board (310) and the second printed circuit board (320).

[0165] According to one embodiment of the present disclosure, the interposer (330) may include a dummy via (332) arranged at an edge of the interposer (330).

[0166] According to one embodiment of the present disclosure, the substrate assembly (300) may include a signal solder (440) disposed on a first surface (311) of the first printed circuit board (310) and connected to the signal via (331).

[0167] According to one embodiment of the present disclosure, the substrate assembly (300) may include a dummy solder (410, 420, 430) disposed on a first surface (311) of the first printed circuit board (310) and connected to the dummy via (332).

[0168] According to one embodiment of the present disclosure, the dummy solder (410, 420, 430) may protrude outside of the interposer (330).

[0169] According to one embodiment of the present disclosure, the dummy solder (411, 412) may include a first portion (411A, 412A) that overlaps the interposer (330) and a second portion (411B, 412B) that does not overlap the interposer (330) when viewed from above the first surface (311).

[0170] According to one embodiment of the present disclosure, the second portion (411B) of the first dummy solder (411) may extend from the first portion (411A) and protrude outwardly from the interposer (330). By increasing the size of the first dummy solder (411), the bonding strength between the first printed circuit board (310) and the interposer (330) by the first dummy solder (411) may be improved.

[0171] According to one embodiment of the present disclosure, the second portion (412B) of the second dummy solder (412) may extend from the first portion (412A) and protrude outwardly from the interposer (330). By increasing the size of the second dummy solder (412), the bonding strength between the first printed circuit board (310) and the interposer (330) by the second dummy solder (412) may be improved.

[0172] According to one embodiment of the present disclosure, when viewed from above the first surface (311), the width (W3) of the second portion (412B) may be greater than the width (W2) of the first portion (412A).

[0173] According to one embodiment of the present disclosure, the width of the first portion (412A) may become narrower from the outside to the inside of the interposer.

[0174] According to one embodiment of the present disclosure, the second portion (2410B) of the dummy solder (2410) may have a width that increases toward the outside of the interposer (330).

[0175] According to one embodiment of the present disclosure, the first printed circuit board (310) may include a first region (313) that overlaps the second printed circuit board (320) when viewed from above the first surface (311).

[0176] According to one embodiment of the present disclosure, the first printed circuit board (310) may include a second area (314) in which a portion of the dummy solder (410) is disposed, and does not overlap with the second printed circuit board (320) when viewed from above the first surface (311).

[0177] According to one embodiment of the present disclosure, the electronic device (101) may include a reinforcing member (500) disposed on a second surface (312) of the first printed circuit board (310).

[0178] According to one embodiment of the present disclosure, the reinforcing member (500) may extend from the first region (313) to the second region (314) of the first printed circuit board (310).

[0179] According to one embodiment of the present disclosure, when viewed from above the second surface (312), the reinforcing member (500) may overlap the dummy solder (410).

[0180] According to one embodiment of the present disclosure, the interposer (330) may extend in a loop shape along an edge (320E) of the second printed circuit board (320).

[0181] According to one embodiment of the present disclosure, the dummy solder (430) may protrude from the interposer (330) toward the interior of the substrate assembly (300).

[0182] According to one embodiment of the present disclosure, the substrate assembly (300) may include a shield can (340) positioned between the first printed circuit board (310) and the second printed circuit board (320).

[0183] According to one embodiment of the present disclosure, the shield can (340) may be at least partially surrounded by the interposer (330).

[0184] According to one embodiment of the present disclosure, the shield can (340) can be connected to the dummy solder (430).

[0185] According to one embodiment of the present disclosure, the substrate assembly (300) may include a dummy bridge (415, 416) extending along an edge of the interposer (330) from the dummy solder (410).

[0186] According to one embodiment of the present disclosure, the interposer (330) may include a curved section extending curvedly along an edge (320E) of the second printed circuit board (320).

[0187] According to one embodiment of the present disclosure, the dummy solder (410) may include a first dummy solder (411) extending in a first direction from the first portion (411A) to the second portion (411B).

[0188] According to one embodiment of the present disclosure, the dummy solder (410) may include a second dummy solder (412) extending in a second direction intersecting the first direction from the first portion (412A) to the second portion (412B).

[0189] According to one embodiment of the present disclosure, the first direction and the second direction may extend radially with respect to the interposer.

[0190] According to one embodiment of the present disclosure, the dummy vias (332) may be formed in multiple numbers and arranged along the edge of the interposer (330).

[0191] According to one embodiment of the present disclosure, the dummy via (332) may include a plurality of dummy vias (332A, 332B) connected to a first portion (1411A, 1412A, 1413A, 1414A) of the dummy solder (1411, 1412, 1413, 1414).

[0192] According to one embodiment of the present disclosure, the substrate assembly (300) may include a metal layer (336) that at least partially covers an outer lateral surface (339) of the interposer and is connected to the dummy solder (410).

[0193] According to one embodiment of the present disclosure, the interposer (330) may include a non-conductive member (R) that at least partially covers a portion of the dummy solder (410) protruding outward.

[0194] According to one embodiment of the present disclosure, the dummy solder (410) can be electrically connected to a ground layer of the first printed circuit board (310).

[0195] According to one embodiment of the present disclosure, the substrate assembly (300) may include a third printed circuit board (320') spaced apart from the second side (312) of the first printed circuit board (310) and facing the second side (312).

[0196] According to one embodiment of the present disclosure, the substrate assembly (300) may include a second interposer (330') disposed between the first printed circuit board (310) and the third printed circuit board (320').

[0197] According to one embodiment of the present disclosure, the substrate assembly (300) may include a second dummy solder (410') disposed on a second surface (312) of the first printed circuit board (310) and connected to the second interposer (330').

[0198] According to one embodiment of the present disclosure, the second dummy solder (410') may protrude outside the second interposer (330') when viewed from above the second surface (312).

[0199] According to one embodiment of the present disclosure, when viewed from above the first surface (311), the first dummy solder (410) may overlap the second dummy solder (410').

[0200] Although the detailed description of this document has described specific embodiments, it will be apparent to those skilled in the art that various modifications are possible without departing from the scope of this document.

Claims

1. In an electronic device (101), a housing (210) forming the exterior; and Includes a substrate assembly (300) placed inside the housing (210), The above substrate assembly (300): A first printed circuit board (310) including a first side (311) and a second side (312) opposite to the first side (311); A second printed circuit board (320) spaced apart from the first printed circuit board (310) and including a third surface (321) facing the first surface (311); An interposer (330) disposed between the first printed circuit board (310) and the second printed circuit board (320), the interposer (330) including a signal via (331) electrically connecting the first printed circuit board (310) and the second printed circuit board (320), and a dummy via (332) disposed at an edge of the interposer (330); and An electronic device comprising a dummy solder (410, 420, 430) disposed on a first surface (311) of the first printed circuit board (310), connected to the dummy via (332), and protruding outside the interposer (330).

2. In paragraph 1, The above dummy solder (411, 412): When viewed from above the first surface (311), it includes a first portion (411A, 412A) that overlaps the interposer (330) and a second portion (411B, 412B) that does not overlap the interposer (330). An electronic device in which, when viewed from above the first surface (311), the width (W3) of the second portion (411B, 412B) is greater than the width (W2) of the first portion (411A, 412A).

3. In paragraph 2, An electronic device in which the width of the first portion (412A) becomes narrower from the outside to the inside of the interposer.

4. In paragraph 2 or paragraph 3, An electronic device in which the second part (2410B) of the above dummy solder (2410) becomes wider as it goes toward the outside of the interposer (330).

5. In any one of paragraphs 1 to 4, The above first printed circuit board (310): When viewed from above the first surface (311), a first area (313) overlapping with the second printed circuit board (320); and An electronic device including a second area (314) in which a portion of the dummy solder (410) is arranged, and which does not overlap with the second printed circuit board (320) when viewed from above the first surface (311).

6. In paragraph 5, An electronic device further comprising a reinforcing member (500) disposed on a second surface (312) of the first printed circuit board (310) and extending from a first region (313) of the first printed circuit board (310) to a second region (314).

7. In paragraph 6, When viewed from above the second surface (312), the reinforcing member (500) is an electronic device overlapping the dummy solder (410).

8. In any one of paragraph 1 and paragraphs 5 to 7, The above interposer (330) extends in a loop shape along the edge (320E) of the second printed circuit board (320), The above dummy solder (430) is an electronic device that protrudes from the interposer (330) toward the inside of the substrate assembly (300).

9. In paragraph 8, The above substrate assembly (300) is An electronic device further comprising a shield can (340) positioned between the first printed circuit board (310) and the second printed circuit board (320), at least partially surrounded by the interposer (330), and connected to the dummy solder (430).

10. In any one of paragraphs 1 to 9, The above substrate assembly (300) is An electronic device further comprising a dummy bridge (415, 416) extending along the edge of the interposer (330) from the dummy solder (410).

11. In any one of paragraphs 1 to 10, The above interposer (330) is It includes a curved section extending in a curved manner along the edge (320E) of the second printed circuit board (320), The above dummy solder (410) is: A first dummy solder (411) extending in a first direction from the first part (411A) to the second part (411B); and An electronic device comprising a second dummy solder (412) extending in a second direction intersecting the first direction from the first portion (412A) to the second portion (412B).

12. In paragraph 11, An electronic device in which the first direction and the second direction extend radially with respect to the interposer.

13. In any one of paragraphs 1 to 12, The above dummy via (332) is An electronic device comprising a plurality of dummy vias (332A, 332B) arranged along an edge of the interposer (330) and connected to a first portion (1411A, 1412A, 1413A, 1414A) of the dummy solder (1411, 1412, 1413, 1414).

14. In any one of paragraphs 1 to 13, The above substrate assembly (300): An electronic device further comprising a metal layer (336) at least partially covering an outer lateral surface (339) of the interposer (330) and connected to the dummy solder (410).

15. In any one of paragraphs 1 to 14, Further comprising a non-conductive member (R) that at least partially covers a portion of the dummy solder (410) protruding outside of the interposer (330), The above dummy solder (410) is an electronic device electrically connected to the ground layer of the first printed circuit board (310).

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