Case and electrical apparatus

Abstract

The present application is applicable to the technical field of energy storage, and provides a case and an electrical apparatus. The case comprises a case body; the case body is internally provided with an accommodation cavity, and the case body comprises a first case wall and a second case wall; the first case wall is provided with an air inlet hole and a first flow channel, the first flow channel and the air inlet hole being arranged at intervals; the second case wall is provided with an air outlet hole, the air outlet hole being in communication with the air inlet hole by means of the accommodation cavity. The first case wall is a bottom wall of the case body, and the first case wall comprises a first portion and a second portion; the first flow channel is provided in the first portion, the air inlet hole is provided in the second portion, and the first portion protrudes from the second portion towards the accommodation cavity. The case and the electrical apparatus provided in the present application have high heat dissipation efficiency.

Description

Cabinet and electric device

[0001] The present application claims priority to the Chinese Patent Application No. 202421783980.2, filed on July 25, 2024, and entitled "Cabinet and Electric Device", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application belongs to the technical field of energy storage, and particularly relates to a cabinet and an electric device. BACKGROUND

[0003] The secondary control system of the battery generally includes an energy storage converter, an energy management system, a battery management system, a power control system, a safety monitoring system, etc. At least one cabinet is generally arranged between the above systems or between the systems. At least one cabinet is arranged in the cabinet, a plurality of circuit boards are generally arranged in the cabinet, and a plurality of electronic elements are arranged on the circuit boards. However, some electronic elements have a large amount of heat. The current cabinet structure has low heat dissipation efficiency and cannot meet the use requirements. SUMMARY

[0004] The purpose of the embodiments of the present application is to provide a cabinet and an electric device, and to solve the technical problem of how to improve the heat dissipation efficiency. TECHNICAL SOLUTION

[0005] The technical solution adopted by the embodiments of the present application is:

[0006] In a first aspect, the embodiments of the present application provide a cabinet, which includes a cabinet body; a receiving cavity is arranged in the cabinet body; the cabinet body includes a first cabinet wall and a second cabinet wall; the first cabinet wall is provided with an air inlet hole and a first flow channel; the first flow channel and the air inlet hole are arranged at intervals; the second cabinet wall is provided with an air outlet hole; the air outlet hole is communicated with the air inlet hole through the receiving cavity.

[0007] The cabinet provided by the embodiments of the present application is provided with the first flow channel and the air inlet hole on the first cabinet wall of the cabinet body. The first flow channel can be used for the cooling medium to pass through. The cooling medium can be a cooling medium with a temperature lower than the ambient temperature according to the needs, so that the gas entering the receiving cavity of the cabinet through the first cabinet wall can be cooled during the process of passing through the air inlet hole, and then the temperature difference between the gas entering the receiving cavity and the temperature of the circuit board is larger, which is helpful for the rapid cooling of the circuit board. Compared with the cabinet with the air cooling heat dissipation structure in the related art, the cabinet provided by the embodiments of the present application has higher heat dissipation efficiency.

[0008] In some embodiments, the first box wall is the bottom wall of the box body, and the first box wall includes a first part and a second part. A first flow channel is disposed in the first part, and an air inlet is disposed in the second part. The first part protrudes from the second part toward the receiving cavity. With this design, condensate can flow along the outer wall of the first part to the air inlet and then be discharged from the box body through the air inlet.

[0009] In some embodiments, the first flow channel includes a first branch and a second branch. Multiple first branches are provided, spaced apart, and connected via a second branch. The first and / or second branches have openings for communication with an external cooling medium supply system, and air inlets are located between adjacent first branches. This arrangement simplifies the structure of the first wall of the enclosure and facilitates the outflow of condensate, achieving multiple benefits.

[0010] In some embodiments, there are two second branches, located at opposite ends of the first branch and connected to multiple first branches respectively. In this embodiment, the same second branch is connected to multiple first branches, forming multiple connecting paths. This allows the cooling medium to flow quickly through different flow paths after entering the first flow channel. Compared to the first flow channel having only one flow path, this allows different areas of the first chamber wall to be cooled in a timely manner, contributing to the uniformity of temperature regulation in different areas of the first chamber wall and the receiving cavity.

[0011] In some embodiments, two openings are provided, one on each of the two second branches. Providing two openings reduces the number of openings in the first flow channel, facilitating connection between the first flow channel and an external cooling medium supply system.

[0012] In some embodiments, the second branch has a first end and a second end disposed opposite to each other; one opening is located at the first end of one of the second branches, and the other opening is located at the second end of the other second branch. The two openings being located at different ends of the two second branches allows the cooling medium entering the first flow channel through one opening (the aforementioned inlet) to flow a longer path within either flow path before being discharged through the other opening (the aforementioned outlet). This results in a longer residence time of the cooling medium within the first flow channel, contributing to the full utilization of the cooling medium.

[0013] In some embodiments, multiple air inlets are spaced apart between two adjacent first branches along the extension direction of the first branch. Using the solution provided in this embodiment, a larger number of air inlets can be provided, facilitating the entry of gas into the housing through the air inlets and helping to improve heat dissipation efficiency.

[0014] In some embodiments, a circuit board is provided within the receiving cavity, and a first branch is located below the circuit board, with the extension direction of the first branch forming an angle with the surface of the circuit board. This angled arrangement of the first branch with the surface of the circuit board serves two purposes: firstly, it allows for a longer flow path formed by the first and second branches, resulting in a longer residence time of the cooling medium within the first flow channel, thus facilitating full utilization of the cooling medium; secondly, this arrangement prevents the circuit board from completely blocking the air inlets located between the first branches, regardless of its configuration, thereby aiding in chassis heat dissipation.

[0015] In some embodiments, the first branch is spaced apart from the circuit board. This separation prevents direct contact with the circuit board, unlike related technologies that use liquid cooling plates on the circuit board, thus avoiding interference with circuit board insertion and removal. Therefore, the chassis provided in this application can meet heat dissipation requirements without affecting circuit board insertion and removal operations.

[0016] In some embodiments, the extension direction of the first branch is perpendicular to the surface of the circuit board. This allows the extension direction of the first branch to be parallel to the width or length direction of the first housing wall, facilitating the design and fabrication of the first branch.

[0017] In some embodiments, the size of the air inlet vent along the first direction is larger than the size of the air inlet vent along the second direction. The first and second directions are perpendicular to the through direction of the air inlet vent, and the first direction is the extension direction of the first branch. Using the solution provided in this embodiment, the opening area of ​​the air inlet vent can be made larger, facilitating rapid cooling of the chassis.

[0018] In some embodiments, a heat dissipation structure is provided on the side of the first enclosure wall away from the receiving cavity. The heat dissipation structure can increase the contact area between the first enclosure wall and the gas located outside the enclosure, improve the heat exchange efficiency between the gas entering the receiving cavity through the air inlet and the first enclosure wall, and further increase the temperature difference between the gas and the circuit board after entering the receiving cavity, which helps the enclosure to cool down quickly.

[0019] In some embodiments, the heat dissipation structure includes a plurality of heat sinks, which are parallel to each other and spaced apart along a first direction. At least a portion of the heat sinks is located on the flow path of the gas flowing through the air inlet, and the first direction is the extension direction of the first branch. The inclusion of multiple heat sinks simplifies the structure and facilitates fabrication and processing. The fact that at least a portion of the heat sinks is located on the flow path of the gas flowing through the air inlet allows other gases entering the cavity through the air inlet to exchange heat with the first chamber wall before entering the cavity, thus facilitating rapid cooling of this portion of gas and consequently, rapid cooling of the chassis.

[0020] In some embodiments, the length direction of the heat sink is perpendicular to the first direction; in the first direction, the size of the heat sink is smaller than the size of the air inlet. Using the solution provided in this embodiment, the overlapping portion of the heat sink and the air inlet will not completely block the air inlet, allowing gas to smoothly pass through the air inlet and enter the receiving cavity.

[0021] In some embodiments, the heat sink is perpendicular to the first housing wall. This reduces the friction between the gas and the heat sink when the gas passes through the air inlet, facilitating the smooth flow of gas into the receiving cavity.

[0022] In some embodiments, the first and second enclosure walls are arranged opposite to each other. The solution provided in this embodiment facilitates gas convection within the enclosure's accommodating cavity, thereby promoting rapid gas exhaust and aiding in rapid heat dissipation from the enclosure.

[0023] In some embodiments, the enclosure further includes a third enclosure wall located between and connected to the first and second enclosure walls, wherein at least one of the second and third enclosure walls has a second flow channel internally. This can further improve the heat dissipation efficiency of the enclosure.

[0024] In some embodiments, the chassis further includes a water collection device located on the side of the first chassis wall away from the receiving cavity. The water collection device prevents condensate from falling outside the chassis, making it suitable for environments where other waterproof electrical appliances or devices are located below the first chassis wall.

[0025] In some embodiments, the thickness of the first enclosure wall is less than or equal to 2.3 mm. This dimension allows for a smaller thickness of the first enclosure wall, facilitating miniaturized enclosure design.

[0026] In some embodiments, the first box wall is a blown plate. Using the solution provided in this embodiment, the air inlet can be located at the pressing point of the blown plate, allowing the first box wall to be thinner and easier to manufacture.

[0027] Secondly, embodiments of this application provide an electrical device, including the chassis of any of the above-described solutions.

[0028] The electrical device provided in this application includes the chassis of any of the above-described solutions, and has high heat dissipation efficiency.

[0029] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or exemplary technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 is a schematic diagram of the cabinet structure provided in some embodiments of this application, where the cabinet door is not shown.

[0032] Figure 2 is a schematic diagram of the chassis provided in some embodiments of this application;

[0033] Figure 3 is a schematic diagram of the structure of the first chassis wall in a chassis provided in some embodiments of this application;

[0034] Figure 4 is a schematic diagram of the main structure of the first box wall shown in Figure 3;

[0035] Figure 5 is a side view of the first box wall shown in Figure 3;

[0036] Figure 6 is a structural schematic diagram of a chassis provided in another embodiment of this application;

[0037] Figure 7 is a schematic diagram of the assembly structure of the first chassis wall and the water collection device in a chassis provided in an embodiment of this application.

[0038] The reference numerals in the detailed embodiments are as follows: 1000, cabinet; 100, cabinet body; 200, chassis; 10, chassis body; 11, receiving cavity; 12, first chassis wall; 13, second chassis wall; 14, air outlet; 15, third chassis wall; 20, circuit board; 30, first flow channel; 31, first branch; 32, second branch; 33, opening; 40, air inlet; 50, heat dissipation structure; 51, heat sink; 60, second flow channel; 70, water collection device; 80, ventilation channel; X, first direction / extension direction of the first branch; Y, length direction of the heat sink. Detailed Implementation

[0039] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0041] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0042] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0043] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between associated objects, indicating that three relationships can exist. For example, "and / or B" can represent: existing alone, existing with B simultaneously, or existing with B alone. Additionally, the character " / " in this document generally indicates that the preceding and following associated objects have an "or" relationship.

[0044] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0045] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0046] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0047] With the development of technology, power batteries are widely used in energy storage systems such as hydropower, thermal power, wind power, and solar power plants; electric vehicles such as electric bicycles, electric motorcycles, and electric cars; and in military equipment and aerospace, among other fields. Because the energy storage capacity of a single battery cell is relatively small, multiple battery cells are generally required in the same electrical device or energy storage system. However, due to limitations in electrode materials and manufacturing processes, lithium batteries and other power batteries often exhibit differences in internal resistance, capacity, and voltage between different battery cells. Therefore, in practical applications, uneven heat dissipation or overcharging / discharging can easily occur among the battery cells. This can shorten battery life. If a battery is severely overcharged, there is also a risk of explosion.

[0048] To address the aforementioned issues, electrical devices or energy storage systems typically incorporate a secondary control system for the battery. This secondary control system generally includes an energy storage converter, energy management system, battery management system, power control system, and safety monitoring system. At least one cabinet is typically installed between these systems or between different systems. This cabinet contains at least one chassis, which generally houses multiple circuit boards with various electronic components. Some of these electronic components generate significant heat.

[0049] To ensure stable performance and a long lifespan for electronic components and circuit boards, heat dissipation structures are typically installed on or inside the chassis. These structures can be air-cooled, using airflow to cool the electronic components (such as control chips) and circuit boards within the chassis. Air-cooling structures generally fall into two categories: natural convection and forced convection driven by a fan. Both methods involve fixing the heat sink to the surface of the electronic components on the circuit board using a thermally conductive interface material (such as thermal adhesive), allowing heat to be carried away by air convection. This technology (air-cooling) suffers from at least the following problems: low heat exchange efficiency, large equipment size (including the air-cooling structure and chassis), high noise levels, low heat flux density, and insufficient heat exchange. The insufficient heat exchange is primarily due to the chassis's need to meet electromagnetic compatibility (EMC) requirements, resulting in low perforation and limited airflow.

[0050] With societal development, the demands on battery control and data processing are increasing, leading to more complex functions for circuit boards and their electronic components, which are increasingly moving towards higher performance and higher heat flux density. This results in certain electronic components, such as Central Processing Unit (CPU) chips, Field-Programmable Gate Array (FPGA) chips, and Artificial Intelligence (AI) chips, generating enormous amounts of heat. If these components are not cooled in time, they may experience performance degradation, reduced lifespan, or even shutdown. Therefore, the aforementioned air-cooling structures are insufficient to meet these cooling requirements.

[0051] To improve, or at least partially improve, the present application provides a chassis. This chassis has a first flow channel and an air inlet on its first wall. The first flow channel allows a cooling medium to pass through. This cooling medium can be a medium with a temperature lower than the ambient temperature, allowing the gas entering the chassis cavity after passing through the first wall to be cooled as it passes through the air inlet. This results in a greater temperature difference between the gas entering the cavity and the circuit board, facilitating rapid cooling of the circuit board. Compared to chassis using air-cooled structures in related technologies, the chassis provided by this application has higher heat dissipation efficiency.

[0052] The chassis provided in this application embodiment can be used for electrical devices with chassis or various energy storage systems. Electrical devices can be, but are not limited to, server racks, computer systems, servers, power tools, electric vehicles, electric cars, ships, spacecraft, etc. Spacecraft can include airplanes, rockets, space shuttles, and spacecraft, etc. Energy storage systems can include energy storage cabinets, energy storage valves, etc.

[0053] For ease of explanation, the following embodiments use a server rack as an example of an electrical device provided in an embodiment of this application.

[0054] Figure 1 is a structural schematic diagram of a cabinet provided in some embodiments of this application, where cabinet doors are not shown. As shown in Figure 1, the cabinet 1000 includes a cabinet body 100 and a chassis 200 disposed within the cabinet body 100. The cabinet body 100 is used to house the chassis 200 and other electrical or electronic equipment, and generally has multiple side panels, at least one of which is open, or at least one side panel is detachable or can be opened and closed. The aforementioned detachable or openable side panels generally serve as cabinet doors and are not shown in the figure. These side panels are typically made of cold-rolled steel or alloys, but can also be made of other materials (such as plastics, composite materials, etc.).

[0055] Figure 2 is a schematic diagram of the chassis structure provided in some embodiments of this application. As shown in Figure 2, the chassis 200 generally includes a housing 10. In addition, the chassis 200 may include other structures as needed, such as electronic components, heat dissipation structures, and electrical control structures, which can be determined according to the specific needs of the application.

[0056] The enclosure 10 is typically composed of multiple side panels, with a receiving cavity and at least one opening communicating with the receiving cavity. Each side panel is usually made of sheet metal, providing good protective performance, but can also be made of other materials (such as plastics, composite materials, etc.). In addition to the side panels, to ensure the structural stability of the enclosure 200 and meet vibration requirements, a supporting structure is generally installed inside the enclosure 10. This may include square tube support columns at the connection points of adjacent side panels, with adjacent support columns connected by welding, plugging, or other methods.

[0057] Figure 3 is a schematic diagram of the structure of the first chassis wall in a chassis provided in some embodiments of this application. Please refer to Figures 2 and 3 together. Embodiments of this application provide a chassis 200. The chassis 200 includes a housing 10. The housing 10 has a receiving cavity 11. The housing 10 includes a first chassis wall 12 and a second chassis wall 13. The first chassis wall 12 has a first flow channel 30 and an air inlet 40. The first flow channel 30 and the air inlet 40 are spaced apart. The second chassis wall 13 has an air outlet 14. The air outlet 14 is connected to the air inlet 40 through the receiving cavity 11.

[0058] The first box wall 12 and the second box wall 13 are each of the side panels that form the box body 10.

[0059] The air inlet 40 is a through hole that penetrates the first box wall 12 along the thickness direction. Multiple inlets are typically provided, and they can be evenly or unevenly distributed on the first box wall 12, depending on the specific application requirements. The air outlet 14 is a through hole that penetrates the second box wall 13 along the thickness direction. Multiple outlet 14 are typically provided, and they can be evenly or unevenly distributed on the second box wall 13, depending on the specific application requirements.

[0060] The first flow channel 30 is a cavity or channel through which the cooling medium passes. The first flow channel 30 is open at both ends, allowing it to connect to an external cooling medium supply system. This enables the cooling medium to flow, carrying away heat absorbed by the first chamber wall 12 as it passes through the first flow channel 30, thus achieving cooling. The cooling medium is a fluid, meaning it is a fluid capable of cooling and flowing; it can be a liquid, a gas-liquid mixture, a liquid-solid mixture, etc. When the cooling medium is a liquid, it can be water, ethylene glycol solution, fluorinated liquid, cooling oil, or other media compatible with the chamber material.

[0061] The first flow channel 30 can be arranged in various ways on the first box wall 12. For example, the first flow channel 30 can be completely arranged inside the first box wall 12 of the box body 10, or it can be completely arranged on the surface of the first box wall 12, or it can be partially arranged inside the first box wall 12 and the other part can be arranged to protrude from the first box wall 12.

[0062] The heat dissipation principle of the chassis 200 provided in this application embodiment is as follows:

[0063] During use, the electronic components of the chassis 200, such as the circuit board 20, generate heat, causing the temperature of the gas inside the enclosure 11 of the chassis 10 to be higher than the temperature of the gas outside the chassis 10. This causes the gas inside the chassis 10 to continuously flow out of the enclosure 11 through the air outlet 14, while the gas outside the chassis 10 enters the enclosure 11 of the chassis 10 through the air inlet 40 on the first chassis wall 12 under the action of air pressure. The cooler gas entering the enclosure 11 then exchanges heat with the hot air inside the enclosure 11 and the circuit board 20, causing the temperature of the circuit board 20 to decrease.

[0064] The first chamber wall 12 is provided with a first flow channel 30, which is used for the passage of cooling medium. In use, a cooling medium with a lower temperature can be introduced into the first flow channel 30. For example, if the temperature of the gas outside the chamber 10 is 20°C, a cooling medium with a temperature of 10°C, 15°C, or other temperatures can be introduced into the first flow channel 30; or if the temperature of the gas outside the chamber 10 is 55°C, a cooling medium with a temperature of 20°C, 23°C, or other temperatures can be introduced into the first flow channel 30.

[0065] In this way, as the gas located outside the housing 10 enters the housing cavity 11 of the housing 10 through the air inlet 40, the gas will exchange heat with the first housing wall 12 and the first flow channel 30 on it when it comes into contact with the first housing wall 12 and the first flow channel 30, causing its own temperature to drop, such as by 3℃-4℃ or more. In this way, the temperature difference between the gas entering the housing cavity 11 and the circuit board 20 will be greater, which helps the circuit board 20 to cool down quickly.

[0066] It is understandable that the temperature difference of the gas before and after passing through the air inlet 40 is affected by a variety of factors, such as the influence of the temperature of the top of the chamber on the temperature of the first chamber wall, as well as the flow rate and contact area of ​​the cooling medium.

[0067] Of course, if the chassis 200 is equipped with a fan or other device, the air convection in the above process can be further accelerated, thereby improving the cooling of the plastic.

[0068] Therefore, the chassis 200 provided in this embodiment has a first flow channel 30 and an air inlet 40 on the first wall 12 of the chassis 10. The first flow channel 30 allows a cooling medium to pass through. The cooling medium can be a cooling medium with a temperature lower than the ambient temperature, so that the gas entering the receiving cavity 11 of the chassis 10 after passing through the first wall 12 can be cooled as it passes through the air inlet 40. This results in a larger temperature difference between the gas entering the receiving cavity 11 and the circuit board 20, which helps to cool the circuit board 20 quickly. Compared with the chassis 200 using a wind-cooled heat dissipation structure in related technologies, the chassis 200 provided in this embodiment has higher heat dissipation efficiency.

[0069] As shown in Figures 2 and 3, in some embodiments, the first box wall 12 is the bottom wall of the box body 10. The first box wall 12 includes a first part and a second part. A first flow channel 30 is provided in the first part, and an air inlet 40 is provided in the second part. The first part protrudes from the second part toward the receiving cavity 11.

[0070] The bottom wall is the wall located at the bottom of the box 10, which serves a supporting function.

[0071] Both the first part and the second part are part of the first box wall 12.

[0072] The first part protruding from the receiving cavity 11 and the second part protruding from the receiving cavity 11 means that the side of the first part facing the receiving cavity 11 protrudes from the side of the second part facing the receiving cavity 11.

[0073] Because the gas temperature in the containment cavity 11 is high during use, while the temperature of the first chamber wall 1212 is low due to the presence of the cooling medium, any moisture in the gas in the containment cavity 11 will condense upon contact with the protruding part (i.e., the first part) of the first chamber wall 1212. Condensation is the phenomenon of gas condensing into a liquid state when it encounters cold. That is, the gas will form condensate on the first part, which protrudes from the second part. The condensate can flow along the outer wall of the first part to the air inlet 40 and then be discharged from the chamber 10 through the air inlet 40.

[0074] As shown in Figures 2 and 3, in some embodiments, the first flow channel 30 includes a first branch 31 and a second branch 32. Multiple first branches 31 are provided. These multiple first branches 31 are arranged sequentially at intervals and are connected through the second branch 32. The first branch 31 and / or the second branch 32 are provided with openings 33 for communication with an external cooling medium supply system. An air inlet 40 is located between two adjacent first branches 31.

[0075] Both the first branch 31 and the second branch 32 are components of the first flow channel 30, and both are channels through which the cooling medium can flow. The interval setting means that there is a gap between any two adjacent first branches 31.

[0076] It should be noted that in this embodiment, two adjacent first branches 31 can be arranged in parallel or at an angle. The interval between any two adjacent first branches 31 can be the same as or different from the interval between other two adjacent first branches 31, depending on the usage requirements.

[0077] The external cooling medium supply system is a system located outside the chassis 200 that can supply cooling medium to the first flow channel 30. The system can also receive cooling medium flowing out of the first flow channel 30.

[0078] The opening 33 is an opening that connects to an external cooling medium supply system. It can be set on the first branch 31, the second branch 32, or both, depending on the needs of use.

[0079] Because the first branch 31 protrudes from the plane of the first housing wall 12, a recessed structure is formed between two adjacent first branches 31. The air inlet 40 is located between two adjacent first branches 31, which allows the hot air in the housing 11 to condense and form condensate after contacting the first branch 31. The condensate can then flow along the outer wall of the first branch 31 to the air inlet 40, facilitating its outflow. This design simplifies the structure of the first housing wall 12 of the housing 10 and facilitates the outflow of condensate, achieving multiple benefits.

[0080] In some embodiments, there are two second branches 32. The two second branches 32 are located at opposite ends of the first branch 31 and are connected to the plurality of first branches 31 respectively.

[0081] In this embodiment, the same second branch 32 is connected to multiple first branches 31 respectively, and the first branches 31 and the second branches 32 form multiple connected paths. This allows the cooling medium to flow quickly through different flow paths after entering the first flow channel 30. Compared with the first flow channel 30 which only includes one flow path, different areas of the first box wall 12 can be cooled in time, which helps to adjust the temperature uniformity of different areas in the first box wall 12 and the receiving cavity 11.

[0082] In some embodiments, there are two openings 33, which are respectively located on two second branches 32.

[0083] One of the two openings 33 can be used as an inlet, connected to the water supply port of an external cooling medium supply system; the other opening 33 can be used as an outlet, discharging cooling medium to the outside or to an external cooling medium supply system.

[0084] By providing two openings 33, the number of openings 33 in the first flow channel 30 can be reduced, which facilitates the connection of the first flow channel 30 to the external cooling medium supply system.

[0085] In some embodiments, the second branch 32 has a first end and a second end disposed opposite to each other. One opening 33 is located at the first end of one of the second branches 32, and the other opening 33 is located at the second end of the other second branch 32.

[0086] The two openings 33 are located at different ends of the two second branches 32, which allows the cooling medium entering the first flow channel 30 through one of the openings 33 (the aforementioned inlet) to flow a longer path in either flow path before being discharged through the other opening 33 (the aforementioned outlet). This allows the cooling medium to stay in the first flow channel 30 for a longer time, which helps to make full use of the cooling medium.

[0087] In some embodiments, there are a plurality of air inlets 40 spaced apart between two adjacent first branches 31 along the extension direction of the first branch 31.

[0088] The extension direction of the first branch 31 is the length direction of the first branch 31, which is also the flow direction of the cooling medium within the first branch 31, and is also the first direction X in Figure 3. The interval distribution refers to a certain gap between two adjacent air inlets 40, meaning that two adjacent air inlets 40 are not connected.

[0089] The solution provided in this embodiment can result in a larger number of air inlets 40, which facilitates the entry of gas into the housing 10 through the air inlets 40, thereby improving heat dissipation efficiency.

[0090] As shown in Figures 2 and 3, in some embodiments, a circuit board 20 is provided inside the receiving cavity 11. A first branch 31 is located below the circuit board 20. The extending direction of the first branch 31 is set at an angle to the surface of the circuit board 20.

[0091] There are usually multiple circuit boards 20, and the number and function of electronic components on each circuit board 20 can be determined according to the usage requirements. The circuit boards 20 can be inserted into the receiving cavity 11 of the housing 10, or they can be fixedly connected to the receiving cavity 11 of the housing 10 by bolts or the like, depending on the usage requirements.

[0092] It is understood that only one circuit board 20 is shown in Figure 2. Depending on the usage requirements, other circuit boards can be installed inside the housing 10. Other circuit boards 20 can be arranged parallel to the circuit board 20 shown, perpendicular to the circuit board 20 shown, or at other angles.

[0093] The circuit board 20 is generally positioned perpendicular to the first enclosure wall 12. The surface of the circuit board 20 is generally parallel to the width direction of the first enclosure wall 12 and perpendicular to the length direction of the first enclosure wall 12. The extension direction of the first branch can be the length direction of the first enclosure wall 12, or it can be another direction that forms a certain angle with the length direction of the first enclosure wall 12, depending on the application requirements.

[0094] It is understandable that the surface of the circuit board 20 is parallel to the length direction of the first box wall 12 and perpendicular to the width direction of the first box wall 12. The extension direction of the first branch 31 can be the width direction of the first box wall 12, or it can be another direction that forms a certain angle with the width direction of the first box wall 12, depending on the application requirements.

[0095] The extension direction of the first branch 31 is set at an angle to the surface of the circuit board 20. On the one hand, this allows the flow path formed by the first branch 31 and the second branch 32 to be longer, so that the cooling medium stays in the first flow channel 30 for a longer time, which helps to make full use of the cooling medium. On the other hand, this setting makes it difficult for the circuit board to completely block the air inlet 40 located between the first branch 31, no matter how the circuit board is set, which helps the chassis 200 to dissipate heat.

[0096] In some embodiments, the first branch 31 is spaced apart from the circuit board 20.

[0097] The interval setting means that there is a certain distance between the first branch 31 and the circuit board 20, and the two do not make direct contact.

[0098] The first branch 31 is spaced apart from the circuit board 20 and does not directly contact the circuit board 20. Compared with the related technology that sets a liquid cooling plate on the circuit board 20, this does not affect the insertion and removal of the circuit board 20. Therefore, the chassis 200 provided in this application embodiment can meet the heat dissipation requirements without affecting the insertion and removal operation of the circuit board 20.

[0099] In some embodiments, the extension direction of the first branch 31 is perpendicular to the surface of the circuit board 20.

[0100] This allows the extension direction of the first branch 31 to be parallel to the width or length direction of the first box wall 12, which facilitates the design and processing of the first branch 31.

[0101] In some embodiments, the dimension of the air inlet 40 along the first direction X is larger than the dimension of the air inlet 40 along the second direction. The first direction X and the second direction are perpendicular to the through direction of the air inlet 40. And the first direction X is the extension direction of the first branch 31.

[0102] In this embodiment, the air inlet 40 is an elongated hole. An elongated hole is defined as a hole whose length is significantly larger than its dimensions in other directions. "Significantly larger" means that the length is more than 1.5 times the length in other directions.

[0103] The solution provided in this embodiment allows for a larger opening area for the air inlet 40, facilitating rapid cooling of the chassis 200.

[0104] In some embodiments, a heat dissipation structure 50 is provided on the side of the first box wall 12 away from the receiving cavity 11.

[0105] The heat dissipation structure 50 can be a heat sink, heat fin, or anything else that can dissipate heat.

[0106] The heat dissipation structure 50 can increase the contact area between the first box wall 12 and the gas located outside the box 10, improve the heat exchange efficiency between the gas entering the containment cavity 11 through the air inlet 40 and the first box wall 12, further increase the temperature difference between the gas entering the containment cavity 11 and the circuit board 20, and help the chassis 200 cool down quickly.

[0107] In some embodiments, the heat dissipation structure 50 includes a plurality of heat sinks 51. The plurality of heat sinks 51 are parallel to each other and spaced apart along a first direction X. At least a portion of the heat sinks 51 are located in the flow path of the gas flowing through the air inlet 40. The first direction X is the extension direction of the first branch 31.

[0108] In this embodiment, the heat dissipation structure 50 may include only the heat sink 51, or it may include other structures in addition to the heat sink 51, such as heat dissipation blocks, flow guiding structures, etc.

[0109] The heat sink 51 can be set perpendicular to the first box wall 12 or at an angle to the first box wall 12, depending on the application requirements.

[0110] The statement that at least a portion of the heat sink 51 is located on the flow path of the gas flowing through the air inlet 40 means that at least a portion of the heat sink 51 is located on the inlet side of the air inlet 40, and its position corresponds to the position of the air inlet 40. The gas entering the receiving cavity 11 through the air inlet 40 will pass through this portion of the heat sink 51 before entering the air inlet 40. Since the gas entering the receiving cavity 11 of the housing 10 generally enters through the air inlet 40, the side of the air inlet 40 facing away from the receiving cavity 11 is the aforementioned inlet side.

[0111] The heat dissipation structure 50 includes multiple heat sinks 51, which simplifies the structure and facilitates its fabrication and processing. At least a portion of the heat sinks 51 are located in the flow path of the gas passing through the air inlet 40, allowing other gases entering the receiving cavity 11 via the air inlet 40 to exchange heat with the first housing wall 12 before entering the cavity 11. This facilitates rapid cooling of this portion of the gas, thereby contributing to the rapid cooling of the chassis 200.

[0112] Figure 4 is a schematic front view of the first casing wall shown in Figure 3. As shown in Figures 3 and 4, in some embodiments, the length direction Y of the heat sink 51 is perpendicular to the first direction X. In the first direction X, the dimension a of the heat sink 51 is smaller than the dimension b of the air inlet 40.

[0113] Heat sink 51 is generally a three-dimensional structure with a certain length, width and thickness.

[0114] The solution provided in this embodiment ensures that the overlapping portion of the heat sink 51 and the air inlet 40 does not completely block the air inlet 40, allowing gas to pass smoothly through the air inlet 40 into the receiving cavity 11.

[0115] Figure 5 is a side view of the first enclosure wall shown in Figure 3. As shown in Figure 5, in some embodiments, the heat sink 51 is perpendicular to the first enclosure wall 12.

[0116] This reduces the friction between the gas and the heat sink 51 when the gas passes through the heat sink 51 and enters the air inlet 40, making it easier for the gas to pass smoothly through the air inlet 40 and enter the receiving cavity 11.

[0117] As shown in Figure 2, in some embodiments, the first box wall 12 and the second box wall 13 are arranged opposite to each other.

[0118] "Relative arrangement" means that the first box wall and the second box wall are spaced apart and face to face. For example, in this embodiment, when the first box wall 12 is the bottom wall of the box, the second box wall 13 is the top wall of the box; when the first box wall 12 is the left side wall of the box, the second box wall is the right side wall of the box.

[0119] The solution provided in this embodiment facilitates the convection of gas in the receiving cavity 11 of the enclosure 10, thereby facilitating the rapid discharge of gas and contributing to the rapid heat dissipation of the chassis 200.

[0120] Figure 6 is a schematic diagram of the chassis structure provided in another embodiment of this application. As shown in Figure 6, in some embodiments, the chassis 10 further includes a third chassis wall 15. The third chassis wall 15 is located between the first chassis wall 12 and the second chassis wall 13, and is connected to the first chassis wall 12 and the second chassis wall 13. At least one of the second chassis wall 13 and the third chassis wall 15 is provided with a second flow channel 60.

[0121] The third box wall 15 is also one of the side walls that form the box body 10.

[0122] The second flow channel 60 is also used for the flow of cooling medium. Its structure and arrangement can be the same as or different from the first flow channel 30, depending on the specific needs of use.

[0123] A second flow channel 60 can be provided on any one or more side walls of the enclosure 10, except for the first enclosure wall 12, which can further improve the heat dissipation efficiency of the enclosure 200.

[0124] Understandably, if the first flow channel on the first box wall is sufficient to meet the usage requirements, then there is no need to set up a second flow channel 60.

[0125] Figure 7 is a schematic diagram of the assembly structure of the first enclosure wall and the water collection device in a chassis according to an embodiment of this application. As shown in Figure 7, in some embodiments, the chassis further includes a water collection device 70. The water collection device 70 is located on the side of the first enclosure wall 12 away from the receiving cavity.

[0126] The water collection device 70 is used to collect condensate discharged through the air inlet 40. A ventilation channel 80 is formed between the water collection device 70 and the first box wall 12. The ventilation channel 80 connects the air inlet 40 and the external space.

[0127] The water collection device 70 is a device for collecting condensate, and may include a tray, a water collection plate, etc., as long as it can achieve the above functions.

[0128] The water collection device 70 can be connected to the first tank wall 12 or fixedly installed inside the cabinet, depending on the specific needs.

[0129] The water collection device 70 prevents condensate from falling outside the chassis 200, making it suitable for environments where there are other electrical appliances or devices that require waterproofing below the first wall 12 of the chassis 200.

[0130] In some embodiments, the thickness c of the first box wall 12 is less than or equal to 2.3 mm.

[0131] Using this size allows for a smaller thickness of the first enclosure wall 12, facilitating the miniaturization design of the chassis 200.

[0132] In some embodiments, the first box wall 12 is an inflatable plate.

[0133] During preparation, the designed first flow channel can be formed by graphite powder plate sandwiched between two layers of aluminum sheet. The non-flow channel part is compacted by hot pressing combined with cold pressing process. Air inlet holes are processed in the compacted part. The type, size and position of the air inlet holes can be designed and changed according to the optimization of heat dissipation efficiency. Alternatively, the air inlet holes can be made by punching, and the folded edge is retained to increase the ventilation contact area and improve the heat exchange efficiency between the air inlet and the first box wall.

[0134] Using the solution provided in this embodiment, the air inlet can be set at the pressing point of the blown plate, which makes the thickness of the first box wall 12 thinner and easier to manufacture.

[0135] According to some embodiments of this application, this application also provides an electrical device including a chassis of any of the above solutions.

[0136] The electrical device provided in this application includes the chassis of any of the above-described solutions, and has high heat dissipation efficiency.

[0137] Referring to Figures 1 to 5, according to some embodiments of this application, a cabinet 1000 is provided. The cabinet 1000 can be a screen cabinet or other types of cabinets. The cabinet 1000 includes a cabinet body 100 and a chassis 200 disposed within the cabinet body 100. The chassis 200 includes a housing 10 and a circuit board 20. The housing 10 has a receiving cavity 11 and a first housing wall 12. The circuit board 20 is disposed within the receiving cavity 11. The first housing wall 12 has a first flow channel 30 and an air inlet 40. The first flow channel 30 is used for the passage of cooling medium. The first flow channel 30 is disposed to avoid the air inlet 40. At least a portion of the first flow channel 30 protrudes towards the receiving cavity 11. The protruding portion of the first flow channel 30 is used to guide condensate water to the air inlet 40.

[0138] The first flow channel 30 includes a first branch 31 and a second branch 32. Multiple first branches 31 are provided. These multiple first branches 31 are arranged sequentially at intervals and are connected through the second branches 32. The first branch 31 and / or the second branch 32 are provided with openings 33 for communication with an external cooling medium supply system. At least a portion of the first branch 31 protrudes towards the receiving cavity 11. Two second branches 32 are provided. The two second branches 32 are located at opposite ends of the first branch 31 and are respectively connected to the multiple first branches 31.

[0139] There are two openings 33, which are respectively located on two second branches 32. Each second branch 32 has a first end and a second end that are opposite to each other. One opening 33 is located at the first end of one of the second branches 32, and the other opening 33 is located at the second end of the other second branch 32.

[0140] The first branch 31 extends along a first direction X. The first direction X is perpendicular to the surface of the circuit board. At least a portion of the second branch 32 protrudes toward the receiving cavity 11. The air inlet 40 is located within the recessed structure formed by the first branch 31 and the second branch 32. The air inlet 40 includes an elongated hole. The length direction of the elongated hole is along the first direction X.

[0141] A heat dissipation structure 50 protrudes from the outer wall of the first enclosure wall 12. The heat dissipation structure 50 includes a plurality of heat dissipation fins 51. The plurality of heat dissipation fins 51 are parallel to each other and spaced apart along a first direction X. At least a portion of the heat dissipation fins 51 is located in the flow path of the gas flowing through the air inlet 40. The length direction of the heat dissipation fins 51 is perpendicular to the first direction X, and the thickness of the heat dissipation fins 51 is less than the length of the air inlet 40. The heat dissipation fins 51 are perpendicular to the first enclosure wall 12.

[0142] An air outlet 14 is provided on the second wall 13 of the housing 10. A second flow channel 60 is provided on the first side wall of the housing 10. The first side wall is any one of the other side walls of the housing 10 except for the first wall 12. The first wall 12 is the bottom wall of the housing 10, and the second wall 13 is the top wall of the housing.

[0143] The first box wall 12 is made of an inflatable plate, the first flow channel 30 is set on the inner wall of the first box wall 12, the air inlet 40 is set at the pressing point, and the thickness of the inflatable plate is less than or equal to 2.3mm.

[0144] The cabinet 1000 provided in this embodiment can be used in energy storage valve systems or other systems, depending on the specific needs.

[0145] The relevant technology fixes the liquid cooling plate to the circuit board 20 through a thermally conductive interface material, ensuring close contact between the liquid cooling plate and the chips on the circuit board 20. The refrigerant inside the liquid cooling plate carries away the heat from the chips. Although this method has high heat dissipation efficiency, it has at least the following problems: the circuit boards inside the chassis 200 need to be plugged in and out frequently; the heat dissipation method of the liquid cooling plate contacting the chips is inflexible during plugging and unplugging, and long-term plugging and unplugging can easily cause leakage risks; the circuit boards and heat dissipation devices are inconvenient to maintain and difficult to assemble; condensation problems caused by ambient temperature and humidity issues can cause short circuits in the chips inside the circuit boards; due to the targeted installation of the liquid cooling plate, the heat dissipation design of multiple chips on the circuit board is not flexible; and fixing the liquid cooling plate to the circuit board and contacting the chips results in high load-bearing requirements for the board.

[0146] Compared to air cooling, the cabinet 1000 provided in this embodiment is more efficient, eliminating the need for fans and other equipment used for forced air convection. This results in a compact structure, small size, and low noise for the chassis 200. Instead of the liquid cooling plate directly receiving the circuit board 20, the liquid cooling channel (i.e., the first flow channel) is designed inside the first wall 12 of the chassis 200, preventing direct contact between the liquid cooling channel and the circuit board 20. This avoids affecting the insertion and removal of the circuit board 20 within the chassis 200, facilitating separate maintenance of the circuit board 20 and the first wall 12. Furthermore, the liquid cooling channel's location on the first wall 12 reduces the temperature of the air entering through the air inlet (i.e., air inlet 40) of the chassis 200, addressing the issue of high inlet temperatures after multiple chassis 200 temperature iterations. The temperature of the circuit board 20 and chips inside the chassis 200 can be reduced through forced air cooling or natural cooling. Simultaneously, the bottom of the chassis 200 retains the air inlet 40, allowing the first wall 12 to function as a heat exchanger, cooling the air entering through the air inlet using the cooling medium.

[0147] In this embodiment, the first box wall 12 can be processed by blowing plate, and the thickness can be within 2.3mm. The first flow channel 30 is designed flexibly, which can effectively reduce the flow resistance of the cooling medium in the first flow channel 30.

[0148] In this embodiment, there are two openings 33, that is, there is only one pair of inlet and outlet. Compared with setting more openings 33, the internal design of the chassis 200 can be simplified, the risk of cooling medium leakage can be reduced to a certain extent, the reliability of the liquid cooling structure can be greatly improved, and maintenance is convenient.

[0149] The solution provided in this embodiment, by using a bottom liquid cooling structure to cool the air, eliminates the need for the fans that were originally fixed to the bottom of the chassis 200 and the top of the cabinet, which reduces system noise to a certain extent and improves system lifespan. The indirect liquid cooling heat exchange method avoids the problem of difficult board insertion and removal caused by directly fixing the liquid cooling plate to the chip, as well as the risk of leakage.

[0150] The chassis 200 has 6 enclosure surfaces. Since the direction of gravity in this design is from top to bottom, the second enclosure wall 13 and the first enclosure wall 12 of the chassis 200 need to be perforated for natural or forced convection heat dissipation.

[0151] In this embodiment, the first box wall 12 is redesigned from the original aluminum sheet metal part into a thin liquid cooling plate. The type of liquid cooling plate is modified to include, but is not limited to, an expansion plate, and the air inlet and outlet openings are set at the welding point of the liquid cooling plate (the pressing point of the expansion plate).

[0152] The solution provided in this embodiment optimizes the ambient temperature inside the chassis 200 by reducing the air inlet temperature, thereby reducing the board temperature; it can be combined with forced convection (through fans, etc.) for deeper cooling.

[0153] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A cabinet, characterized in that, The box includes a box body, a containing cavity in the box body, a first box wall, a second box wall, an air inlet hole in the first box wall, a first flow channel in the first box wall, the first flow channel and the air inlet hole being spaced apart, an air outlet hole in the second box wall, and the air outlet hole being communicated with the air inlet hole through the containing cavity.

2. The cabinet of claim 1, wherein, The first box wall is a bottom wall of the box body, the first box wall includes a first part and a second part, the first flow channel is arranged in the first part, the air inlet hole is arranged in the second part, and the first part protrudes from the second part towards the containing cavity.

3. The cabinet according to claim 1 or 2, characterized in that The first flow channel includes a first branch and a second branch, a plurality of first branches are arranged, the plurality of first branches are spaced apart, and the plurality of first branches are communicated through the second branch, the first branch and / or the second branch is provided with an opening for communicating with an external cooling medium supply system, and the air inlet hole is located between two adjacent first branches.

4. The cabinet of claim 3, wherein, The second branch is provided with two second branches, the two second branches are arranged at opposite ends of the first branch, and any second branch is respectively communicated with a plurality of first branches.

5. The cabinet of claim 4, wherein, The opening is provided with two openings, and the two openings are respectively arranged on the two second branches.

6. The cabinet of claim 5, wherein, The second branch has a first end and a second end arranged oppositely, one of the openings is located at the first end of one of the second branches, and the other opening is located at the second end of the other second branch.

7. A cabinet as claimed in any of claims 3 to 6, wherein, A plurality of air inlet holes are arranged between two adjacent first branches along the extension direction of the first branch.

8. Cabinet according to any of claims 3-7, characterized in that The containing cavity is provided with a circuit board, the first branch is located below the circuit board, and the extension direction of the first branch is arranged at an angle with the surface of the circuit board.

9. The cabinet of claim 8, wherein, The first branch is spaced apart from the circuit board.

10. The cabinet according to claim 8 or 9, characterized in that The extension direction of the first branch is perpendicular to the surface of the circuit board.

11. The cabinet according to any of claims 3-10, characterized in that The size of the air inlet hole along the first direction is greater than the size of the air inlet hole along the second direction, the first direction and the second direction are respectively perpendicular to the through direction of the air inlet hole, and the first direction is the extension direction of the first branch.

12. The cabinet of any of claims 3-11, wherein, The side of the first box wall away from the containing cavity is provided with a heat dissipation structure.

13. The enclosure of claim 12, wherein, The heat dissipation structure includes a plurality of heat dissipation fins, the plurality of heat dissipation fins are parallel to each other and arranged in a first direction, at least part of the heat dissipation fins are located on the flow path of the gas flowing through the air inlet hole, and the first direction is the extension direction of the first branch.

14. The cabinet of claim 13, wherein, The length direction of the heat dissipation fin is perpendicular to the first direction. In the first direction, the size of the heat dissipation fin is smaller than the size of the air inlet hole.

15. The cabinet according to claim 13 or 14, characterized in that The heat dissipation fin is perpendicular to the first box wall.

16. The cabinet of any of claims 1-15, wherein, The first box wall and the second box wall are arranged oppositely.

17. The cabinet of any of claims 1-16, wherein, The box further includes a third box wall located between the first box wall and the second box wall and connected with the first box wall and the second box wall, and at least one of the second box wall and the third box wall is provided with a second flow channel.

18. The cabinet of any of claims 1-17, wherein, The case further includes a water collecting device arranged on the side of the first box wall away from the containing cavity.

19. The cabinet of any of claims 1-18, wherein, The thickness of the first box wall is less than or equal to 2.3 mm.

20. The enclosure of any one of claims 1-19, wherein, The first box wall is a blown panel.

21. An electrical device, comprising: A machine enclosure comprising the box of any of claims 1-20.

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