Cooling plate for controlling the temperature of electrical and / or electronic components
The cooling plate design addresses non-uniform heat transfer by reducing the inlet surface area and increasing the outlet area, along with strategic material weakenings, to achieve homogeneous heat transfer and improved temperature control for electrical and electronic components.
Patent Information
- Application Number
- PCT/EP2025/064131
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-07-23
- Filing Date
- 2025-05-22
- Publication Date
- 2026-01-29
AI Technical Summary
Existing cooling plates for electrical and electronic components, particularly traction batteries, suffer from non-uniform heat transfer performance due to varying coolant temperatures along the channel system, leading to inefficiencies in heating or cooling processes.
The cooling plate design features a reduced cooling surface area in the inlet region and increased surface area in the outlet region, along with strategic material weakenings and channel configurations to manage coolant flow velocity and conduction, ensuring homogeneous heat transfer across the plate.
This design enhances the homogeneity of heat transfer performance by reducing temperature differences and optimizing coolant flow, resulting in improved temperature control and efficiency for electrical and electronic components.
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Figure EP2025064131_29012026_PF_FP_ABST
Abstract
Description
[0001] Cooling plate for tempering electrical and / or electronic components
[0002] The present invention relates to a cooling plate for temperature control of electrical and / or electronic components. The invention relates in particular to a battery cooling plate for temperature control of battery cells in a traction battery.
[0003] In many technical applications, heat must be dissipated from electrical components to prevent overheating or to slow down component aging. Similarly, certain electrical components and / or operating conditions may require heating to achieve, for example, particularly high efficiency. For instance, in the case of a traction battery in a battery-electric vehicle, heating the battery cells to a specific charging temperature can be advantageous for optimized charging. Similarly, during power delivery, heating the battery cells may be necessary, for example, at low ambient temperatures, to prevent premature discharge.In contrast, if the batteries are subject to high power output, it may be necessary to cool them to prevent overheating of the battery cells and also to improve energy efficiency.
[0004] For temperature control, i.e., heating or cooling, cooling plates can be used. These plates allow a liquid coolant to flow through them and, when in use, are in contact with the component to be cooled, particularly a traction battery, thus transferring heat. Such cooling plates, which can also be called heat exchanger plates, are characterized by their flat and, in particular, planar design and require little installation space. For example, such cooling plates can be installed in, under, or above a battery housing to accommodate battery cells.
[0005] In cases where a large number of electrical and / or electronic components, or a correspondingly large electrical component such as a traction battery, need to be kept at a uniform temperature, a cooling plate with a coolant inlet for supplying the coolant (which can also be called a temperature control fluid) and a coolant outlet for removing the coolant often presents the problem that the heat is not supplied to or removed from the respective components uniformly within the coolant channel system inside the cooling plate, which fluidically connects the coolant inlet and outlet. This is because, for example, the temperature of the coolant inevitably decreases or increases along the channel system from the coolant inlet to the coolant outlet, depending on whether heat is being supplied or removed.
[0006] The present invention addresses the problem of providing an improved embodiment for a cooling plate of the type described above, which is characterized in particular by a heat transfer performance, especially cooling performance, that is as homogeneous as possible along the cooling plate.
[0007] This problem is solved according to the invention by the subject matter of the independent claim. Advantageous embodiments are the subject matter of the dependent claims.
[0008] The invention is based on the general concept of selecting a smaller percentage of the cooling surface exposed to the coolant in the inlet area compared to the outlet area, relative to the total available plate area. The invention utilizes the finding that heat transfer performance is significantly reduced in areas with a smaller cooling surface area. By reducing the cooling surface area in the inlet area, the homogenization of heat transfer performance along the entire cooling plate can be improved. This is because the greatest temperature difference between the coolant and the components to be cooled exists in the inlet area, while this temperature difference has decreased in the outlet area due to the heat transfer that has already taken place.Since the temperature difference is a key driving force of heat transfer, the heat transfer efficiency can be reduced by decreasing the cooling surface area in the inlet area and correspondingly increased in the outlet area by increasing it. This compensates for the decreasing temperature difference from the inlet to the outlet area.
[0009] Specifically, the invention proposes a cooling plate comprising a preferably largely flat plate body, which extends in its main dimension or extent in a single plane and has a top surface for heat-transferring coupling with the components, as well as a bottom surface facing away from the top surface. The relative terms "top" and "bottom" refer in particular to the proper installation position of the cooling plate during its use, which is preferably also the case when the cooling plate rests on a substrate with its bottom surface. The cooling plate further comprises at least one channel system formed in the plate body between the top and bottom surfaces for guiding a coolant.The plate body also features at least one coolant inlet for supplying the coolant to the respective channel system and at least one coolant outlet for removing the coolant from the respective channel system. The respective channel system fluidically connects the at least one coolant inlet to the at least one coolant outlet. In a projection oriented perpendicular to the plate plane, within a considered reference surface, a cooling surface area of the respective channel system, through which the coolant flows, defines a cooling surface fraction within this reference surface relative to the plate surface formed by the plate body within this reference surface.The respective channel system has an inlet region comprising at least one coolant inlet, in which the coolant flows away from the respective coolant inlet, and an outlet region comprising at least one coolant outlet, in which the coolant flows towards the respective coolant outlet. According to the invention, the respective channel system is configured such that the cooling surface area in the inlet region is smaller than in the outlet region. The inlet region and the outlet region each form such a reference surface. In the present context, "configuration" is synonymous with "design" and / or "setup" and / or "programming," so that the phrase "configured such that" is synonymous with the phrase "designed and / or set up such that."
[0010] According to an advantageous embodiment, the respective channel system can be configured such that the cooling surface area in the inlet region is larger than in the outlet region. This makes it possible, in particular, to configure the respective channel system so that the coolant flow velocity in the inlet region is significantly lower than in the outlet region due to the larger cooling surface area. The coolant flow velocity represents another important factor that determines heat transfer. The higher the flow velocity, the greater the heat transfer. By reducing the flow velocity in the inlet region or by increasing the flow velocity in the outlet region, heat transfer can be reduced in the inlet region and increased in the outlet region, thus supporting the desired homogenization of the heat transfer performance across the entire cooling plate.
[0011] According to an advantageous embodiment, the respective channel system can be configured such that the cooling surface area in the inlet area is less than 50%, in particular less than 45%, preferably less than 40%, while the cooling surface area in the outlet area is more than 50%, in particular more than 55%, preferably more than 60%. This improves the homogenization of heat transfer across the entire cooling plate.
[0012] According to an advantageous embodiment, the respective channel system in the inlet area can have several separate inlet channels through which the coolant can flow in parallel and which are spaced apart from one another. A particularly advantageous configuration is one in which the cooling plate in the inlet area of the respective channel system has at least one material weakening between adjacent inlet channels to reduce heat conduction within the plate body. This material weakening represents a significant obstacle to heat conduction within the plate body. This embodiment is based on the understanding that the high temperature difference in the inlet area between the coolant and the components to be cooled leads to a correspondingly high heat conduction through the material of the plate body. In particular, heat can be dissipated within the plate body into areas not occupied by components, which is undesirable.Furthermore, this can lead to particularly strong cooling of the component's edge areas, which is also undesirable. The respective material weakening significantly reduces this heat conduction, thus correspondingly reducing the contribution of heat conduction to the heat transfer between the coolant and the components. This results in improved homogenization of the heat transfer performance across the entire cooling plate.
[0013] It may be advantageous to provide for at least one such material weakening by means of a recess on the top and / or bottom surface of the plate. For example, a groove could be appropriately machined into the top and / or bottom surface of the plate. The respective recess can be subsequently machined at the desired location. Alternatively, such a recess can be incorporated or formed during the manufacturing process of the plate body.
[0014] Additionally or alternatively, at least one such material weakening can be created by a through-hole penetrating the plate body. Such a through-hole represents a particularly high resistance to heat conduction. The through-hole can be round, non-round, or slot-shaped. The respective through-hole can be subsequently created at the desired location by machining. Likewise, such a through-hole can be incorporated or formed during the manufacturing of the plate body itself.
[0015] According to an advantageous embodiment, the plate body can be designed in two parts, comprising an upper plate section with the top surface and a lower plate section with the bottom surface. The respective channel system can then be formed at least partially in the upper plate section and / or at least partially in the lower plate section, such that the coolant guided in the respective channel system is in direct contact with both the upper plate section and the lower plate section. For example, the channel system can have recesses on the upper surface of the lower plate section, which are covered by the underside of the upper plate section. Likewise, the channel system can have recesses on the underside of the upper plate section, which are covered by the upper surface of the lower plate section.Similarly, the channel system can have recesses on both the underside of the upper plate section and the upper side of the lower plate section, forming the channel system when the upper plate section rests on the lower plate section. It may be advantageous to provide at least one such material weakening in the upper plate section and / or the lower plate section. Since the components to be tempered are located on the upper plate section, such material weakenings on the upper plate section have a particularly significant effect on heat transfer.
[0016] According to an advantageous embodiment, at least one such material weakening can be formed by a depression on the upper and / or lower plate part. The respective depression can be located on the upper surface of the upper plate part, i.e., on the top surface of the plate, or on the underside of the lower plate part, i.e., on the underside of the plate. It is also conceivable to form the respective depression on the underside of the upper plate part and / or on the upper surface of the lower plate part, thereby creating a corresponding cavity in the finished plate body.
[0017] Additionally or alternatively, at least one such material weakening can be formed by a through-opening penetrating the upper and / or lower plate part. Since the components to be cooled are located on the upper plate part, through-openings on the upper plate part are particularly effective in reducing heat transfer. An embodiment in which the respective material weakening is arranged in the inlet area in a region immediately adjacent to the at least one coolant inlet is particularly advantageous.This embodiment is based on the consideration that the greatest temperature difference between the coolant and the components to be cooled exists immediately after the respective coolant inlet, i.e., in the immediate vicinity of the inlet area. At the same time, a comparatively large amount of the plate body material can be in contact with the coolant, thus enabling a relatively high heat transfer. This strong heat transfer can be counteracted by the targeted placement of the respective material weakening in this immediate vicinity of the inlet area.
[0018] According to an advantageous embodiment, the channel system in the inlet region can have several inlet channels through which the coolant can flow in parallel. In the inlet region, the number of inlet channels can increase from the at least one coolant inlet to a distant region where the inlet region has the greatest number of parallel inlet channels. The near region, in which the respective material weakening can be formed, is located between the at least one coolant inlet and the distant region. This embodiment is based on the consideration that the number of inlet channels is comparatively small in the near region, so that a relatively large amount of plate material is available for heat conduction between adjacent inlet channels. The arrangement of material weakening in this near region is then particularly efficient.
[0019] A preferred embodiment has at least one recess in the inlet area on the upper surface of the plate to create an air gap between the plate surface and the respective components. This air gap provides insulation, significantly reducing the cooling effect on the respective component. This improves the homogenization of the cooling performance across the entire cooling plate. Optionally, the recess can be filled with a thermally insulating material to further reduce the cooling effect at that point and to minimize heat loss.
[0020] According to another embodiment, the channel system can be configured such that heat transfer between the coolant and the cooling plate body, relative to the cooling surface, is lower in the inlet area than in the outlet area. This also supports the homogenization of the cooling plate's cooling performance.
[0021] For example, predominantly low-performance channel contours can be used in the inlet area, such as preferably smooth channels without corrugations and / or contouring. Furthermore, the fewest possible number of support nubs, preferably large-scale, can be used. Further downstream, the effect of the changing area ratio can be advantageously enhanced by further performance-enhancing measures: for example, the channels can become narrower or shallower, thereby increasing the flow velocity and correspondingly reducing heat transfer. Additionally or alternatively, the corrugation of the channels can increase, i.e., increasing lateral deflection with decreasing wavelength. Additionally or alternatively, the channels can be contoured on the underside with increasing dimensions of the embossing and / or decreasing spacing of the embossing, e.g.,Transverse ribs can be provided with or without an angle to the main flow direction and with or without height variation across the channel width. Additionally, indentations can be incorporated into the lower channel edges. Furthermore, or alternatively, a higher number of preferably closer-spaced, ideally small-scale, performance nubs can be provided.
[0022] According to an advantageous embodiment, it can be provided that the respective channel system in the inlet area has several separate inlet channels through which the coolant can flow in parallel and which are spaced apart from each other.
[0023] Additionally or alternatively, the respective channel system can be configured so that it has only a single outlet channel in the outlet area, in which flow-guiding elements are arranged that allow the coolant to flow around them. With such a configuration, the cooling surface area in the inlet area can be configured to be significantly smaller than in the outlet area. The flow-guiding elements improve the flow through the outlet channel and enhance heat transfer between the coolant and the plate body.
[0024] According to an advantageous embodiment, the respective channel system in the inlet region can branch out from the at least one coolant inlet via several dividing points into multiple inlet channels, through which the coolant can flow in parallel. Furthermore, the respective channel system can have a transition region in which the inlet channels open into the outlet channel via several connection points. Thus, the respective channel system comprises the inlet region, the outlet region, and the transition region, which fluidically connects the inlet region to the outlet region. In the transition region, the multiple inlet channels of the inlet region are fluidically connected to the single outlet channel of the outlet region.
[0025] According to a suitable embodiment, the inlet channels in the transition area can open directly into the outlet channel via the connection points. The transition area then consists essentially only of the connection points. In an alternative embodiment, however, the inlet channels in the transition area can open into transition channels via several first connection points, which in turn open into the outlet channel via several second connection points. In this embodiment, the transition area includes, in addition to the connection points, several transition channels through which the coolant can flow in parallel. This initially reduces the number of parallel channels in the transition area. This, in particular, simplifies the channel routing within the cooling plate.
[0026] According to an advantageous embodiment, at least one such channel system can be configured as a U-flow system, in which the at least one coolant inlet and the at least one coolant outlet are formed on the same side of a plate edge that surrounds the plate body. The respective coolant inlet and the respective coolant outlet can, in particular, be located next to each other, which significantly simplifies the supply of coolant to and the discharge of coolant from the cooling plate.
[0027] Additionally or alternatively, at least one such channel system can be configured as an I-flow system, in which the at least one coolant inlet and the at least one coolant outlet are located on opposite sides of a plate edge surrounding the plate body. Such an I-configuration simplifies the homogenization of heat transfer along the plate body.
[0028] Additionally or alternatively, it can be provided that at least two such channel systems are formed in the plate body, each independently connecting at least one coolant inlet to at least one coolant outlet. With two or more such channel systems, two or more groups of components to be cooled can be cooled independently of one another. In particular, two or more channel systems can form a first channel system and a second channel system, etc. The first channel system connects at least one first coolant inlet to at least one first coolant outlet, while the second channel system connects at least one second coolant inlet to at least one second coolant outlet.
[0029] Further important features and advantages of the invention will become apparent from the dependent claims, the drawings and the associated description of the figures based on the drawings.
[0030] It is understood that the features mentioned above and those to be explained below can be used not only in the combinations specified, but also in other combinations or individually, without departing from the scope of the invention as defined by the claims. Components of a higher-level unit, such as a device, apparatus, or arrangement, mentioned above and those to be mentioned below, which are designated separately, can form separate parts or components of this unit or be integral areas or sections of this unit, even if this is depicted differently in the drawings.
[0031] Preferred embodiments of the invention are shown in the drawings and are explained in more detail in the following description, wherein identical reference numerals refer to identical or similar or functionally identical components.
[0032] They show, schematically,
[0033] Figure 1 shows a sectional view of a cooling plate in the area of a channel system in a first embodiment.
[0034] Figure 2 shows a sectional view as in Figure 1, but in a second embodiment.
[0035] As shown in Figures 1 and 2, a cooling plate 1, used for temperature control (i.e., cooling and / or heating) of electrical and / or electronic components (not shown here), comprises a plate body 2 extending in a plate plane 3, which lies in the plane of the drawing in Figures 1 and 2. The plate body 2 is largely planar but may also be curved or bent to some extent. In any case, the plate body 2 extends with its main dimensions in the plate plane 3. The plate body 2 has a top surface (not specified here) for heat-transferring coupling with the components and a bottom surface (also not specified here). The section plane of Figures 1 and 2 runs parallel to the plate plane 3 and extends in a thickness direction of the plate body 2 perpendicular to the plate plane 3 between the top and bottom surfaces.In this thickness direction between the top and bottom surfaces of the plate, at least one channel system 4 is formed in the plate body 2, configured to guide a preferably liquid coolant 5. The coolant 5 is indicated in Figures 1 and 2 by arrows, which simultaneously represent the flow direction of the coolant 5 during operation of the cooling plate 1. In the examples shown in Figures 1 and 2, the plate body 2 has only a single channel system 4. In another embodiment, two or more channel systems 4 can be formed in the plate body 2.
[0036] The cooling plate 1 has at least one coolant inlet 6 on the plate body 2 for supplying the coolant 5 to the channel system 4. In the examples shown in Figures 1 and 2, only a single coolant inlet 6 is shown. In other embodiments, two or more coolant inlets 6 may be provided, which supply the coolant 5 to the channel system 4. Furthermore, the cooling plate 1 has at least one coolant outlet 7 on the plate body 2 for discharging the coolant 5 from the channel system 4. In the example shown in Figures 1 and 2, only a single coolant outlet 7 is provided. In other embodiments, two or more coolant outlets 7 may be provided, which serve to discharging the coolant 5 from the channel system 4.The channel system 4 is now configured to fluidically connect the coolant inlet 6 with the coolant outlet 7 and, during operation of the cooling plate 1, to direct the coolant 5 from the coolant inlet 6 through the plate body 2 to the coolant outlet 7.
[0037] In a projection oriented perpendicular to the plane of the plate 3, a cooling surface 8 of the channel system 4, through which the coolant 5 flows, defines a cooling surface area 10 within a reference area, relative to a plate surface 9 formed by the plate body 2 within this reference area. The plate surface 9 is formed within the reference area by the total surface area of the plate body 2 in the projection perpendicular to the plane of the plate 3. The cooling surface 8 is formed within the reference area by the free area within the plate body 2, which is formed by the channel system 4 in the plate body 2 and is available for the flow of the coolant 5. The difference between the plate surface 9 and the cooling surface 8 is formed within the reference area by the portion of the plate body 2 through which the coolant 5 does not flow.The imaginary projection is made against an imaginary projection wall, which extends parallel to the plate plane 3 and at a distance from it. The cooling surface area 10 is then the percentage of the cooling surface 8 within or adjacent to the plate surface 9.
[0038] The channel system 4 has an inlet area 11 and an outlet area 12, which are each indicated in Figures 1 and 2 by a dashed line. The inlet area 11 contains the coolant inlet 6. The outlet area 12 contains the coolant outlet 7. In the inlet area 11, the coolant 5 flows away from the coolant inlet 6. In the outlet area 12, the coolant 5 flows towards the coolant outlet 7. The channel system 4 is configured such that the cooling surface area 10 in the inlet area 11 is smaller than in the outlet area 12. The inlet area 11 and the outlet area 12 each form a reference area. This can be seen in Figures 1 and 2 because a proportionally larger portion of the plate area 9 is used by the channel system 4 in the outlet area 12, resulting in a comparatively larger cooling surface area 8.In contrast, in the inlet area 11, a comparatively large proportion of the plate surface 9 is not occupied by the channel system 4. The cooling surface area 10 in the inlet area 11 is therefore in any case less than 50%, in particular less than 45%, and preferably less than 40%. In the outlet area 12, on the other hand, the cooling surface area 10 is at least more than 50%, in particular more than 55%, and preferably more than 60%.
[0039] Furthermore, it is advantageously provided that the channel system 4 is configured such that the cooling surface 8 in the inlet region 11 is larger than in the outlet region 12. This is achieved in Figures 1 and 2 by the fact that the inlet region 11 extends over a significantly larger proportion of the plate area 9 than the outlet region 12. Although, relatively speaking, the proportion of the cooling surface 10 in the inlet region 11 is smaller than in the outlet region 12, the cooling surface 8 present in the inlet region 11 is, in absolute terms, larger than in the outlet region 12. This allows the flow of the coolant 5 in the inlet region 11 to be distributed over a significantly larger cross-section, resulting in a comparatively low flow velocity of the coolant 5 in the inlet region 11.In contrast, in the outlet area 12, the cross-section available for the flow of coolant 5 is correspondingly reduced, which increases the flow velocity of the coolant 5 in the outlet cross-section 12.
[0040] The channel system 4 has several separate inlet channels 13 in the inlet region 11, through which the coolant 5 can flow in parallel and which are spaced apart from one another. The cooling plate 1 has at least one material weakening 14 in the inlet region 11 of the channel system 4 between adjacent inlet channels 13 to reduce heat conduction in the plate body 2. Figure 1 shows, purely by way of example and without limitation of generality, four such separate material weakenings 14. Figure 2 shows, purely by way of example and without limitation of generality, three such separate material weakenings 14.
[0041] At least one of these material weakenings 14 can be formed by a depression on the upper surface and / or the lower surface of the plate. At least one such material weakening 14 can be formed by a through-opening penetrating the plate body 2. According to an advantageous embodiment, the plate body 2 can be designed in two parts and comprise an unspecified upper plate part and an unspecified lower plate part, wherein the upper plate part comprises the upper surface of the plate and the lower plate part comprises the lower surface. The channel system 4 is formed at least partially in the upper plate part and / or at least partially in the lower plate part, such that the coolant 5 is in contact with both the upper and lower plate parts. At least one of the material weakenings 14 can be formed only in the upper plate part, only in the lower plate part, or in both the upper and lower plate parts.The respective material weakening 14 can be formed by a depression located on the upper or lower part of the plate. On the upper part of the plate, the depression can be located on an underside facing the lower part, or, as described above, on the upper surface. On the lower part of the plate, the respective depression can be located on an upper surface facing the upper part of the plate, or, as described above, on the underside. A depression located on the underside of the upper part of the plate, or on the upper surface of the lower part of the plate, forms a cavity in the plate body 2 through which the coolant 5 cannot flow. This cavity represents the material weakening 14 and reduces heat conduction in the plate body 2.At least one of the material weakenings 14 can be designed as a through-opening that completely penetrates the upper part of the plate or that completely penetrates the lower part of the plate. It is also conceivable that a through-opening completely penetrates both the upper and lower parts of the plate.
[0042] As shown in Figures 1 and 2, the material weakenings 14 are arranged within the inlet region 11 in a near region 15, which is directly adjacent to the coolant inlet 6. This near region 15 is marked in Figures 1 and 2 by a dashed line running within the inlet region 11. The channel system 4 is advantageously configured such that the number of inlet channels 13 increases in the inlet region 11 from the coolant inlet 6 to a far region 16, with the channel system 4 having the greatest number of parallel flowable inlet channels 13 in the far region 16. The far region 16 extends from the near region 15 to the downstream end of the inlet region 11. The near region 15 is thus located between the coolant inlet 6 and the far region 16.
[0043] In the preferred embodiments shown here, the channel system 4 has several inlet channels 13 in the inlet region 11, while only a single outlet channel 17 is provided in the outlet region 12. A plurality of flow-guiding elements 18 are arranged in the outlet channel, which are open to flow by the coolant 5 during operation of the cooling plate 1. The channel system 4 is advantageously configured such that, in the inlet region 11, it branches out from the coolant inlet 6 via several dividing points 19 into the multiple inlet channels 13, allowing the coolant 5 to flow through them in parallel. Furthermore, the channel system 4 has a transition region 20 in which the inlet channels 13 open into the outlet channel 17 via several connection points 21. In the example of Figure 1, the inlet channels 13 of the inlet area 11 within the transition area 20 open via several first connection points 21.1 into transition channels 22, which open via several second connection points 21.2 open into the outlet channel 17. In the embodiment shown in Figure 2, the inlet channels 13 of the inlet area 11 open directly into the outlet channel 17 via the connection points 21 in the transition area 20.
[0044] In the examples shown in Figures 1 and 2, the channel system 4 is configured as a U-flow system, characterized by the coolant inlet 6 and coolant outlet 7 being located on the same side 23 of a plate edge 24 that surrounds the plate body 2. In an alternative embodiment, not shown here, the channel system 4 can also be configured as an I-flow system. The I-flow system is characterized by the coolant inlet 6 and coolant outlet 7 being located on opposite sides of the plate edge 4. For example, as in Figures 1 and 2, the coolant inlet 6 can be located on the left side 23 of the plate body 4, while the coolant outlet 7 is then located on the opposite right side 25 of the plate body 2. In the examples shown here, the cooling plate 1 has only a single channel system 4 within the plate body 2.In another embodiment, not shown here, two or more channel systems 4 may be provided, each of which may be identical or different in design. At least one of these channel systems 4 is then configured as described above.
[0045] Regardless of the configuration of the channel system 4 shown, the plate body 2 can have at least one recess (not shown) on the upper surface of the plate in the inlet area 11 to create an air gap between the upper surface of the plate and the respective components. Furthermore, the channel system 4 can be configured such that heat transfer between the coolant and the plate body 2, with respect to the cooling surface 8, is less in the inlet area 11 than in the outlet area 12. (Reference numeral list)
[0046] Cooling plate
[0047] plate body
[0048] plate level
[0049] canal system
[0050] coolant
[0051] Coolant inlet
[0052] Coolant outlet
[0053] Cooling surface
[0054] Surface area
[0055] Cooling surface area
[0056] Entrance area
[0057] outlet area
[0058] Inlet channel
[0059] Material weakening
[0060] close range
[0061] long range
[0062] outlet channel
[0063] Flow guide element
[0064] Allocation point
[0065] Transition area
[0066] Junction Transitional Canal Page
[0067] edge
[0068] Page
Claims
Patent claims 1. Cooling plate (1) for temperature control of electrical and / or electronic components, in particular a battery cooling plate for temperature control of battery cells, comprising a plate body (2) extending in a plate plane (3) and having a plate top for heat-transferring coupling with the components and a plate bottom, comprising at least one channel system (4) formed between the plate top and the plate bottom in the plate body (2) for guiding a coolant (5), comprising at least one coolant inlet (6) formed on the plate body (2) for supplying the coolant (5) to the respective channel system (4), comprising at least one coolant outlet (7) formed on the plate body (2) for discharging the coolant (5) from the respective channel system (4), wherein the respective channel system (4) fluidically connects the at least one coolant inlet (6) with the at least one coolant outlet (7).wherein, in a projection oriented perpendicular to the plate plane (3), a cooling surface (8) of the respective channel system (4) through which the coolant (5) flows defines a cooling surface fraction (10) with respect to a plate surface (9) formed by the plate body (2), wherein the respective channel system (4) has an inlet region (11) having at least one coolant inlet (6) in which the coolant (5) flows away from the respective coolant inlet (6), and an outlet region (12) having at least one coolant outlet (7) in which the coolant (5) flows towards the respective coolant outlet (7), wherein the respective channel system (4) is configured such that the cooling surface fraction (10) in the inlet region (11) is smaller than in the outlet region (12).
2. Cooling plate (1) according to claim 1, characterized in that, that the respective channel system (4) is configured such that the cooling surface (8) in the inlet area (11) is larger than in the outlet area (12).
3. Cooling plate (1 ) according to claim 1 or 2, characterized in that the respective channel system (4) is configured such that the cooling surface area (10) in the inlet area (11 ) is less than 50%, in particular less than 45%, preferably less than 40%, and that the cooling surface area (10) in the outlet area (12) is more than 50%, in particular more than 55%, preferably more than 60%.
4. Cooling plate (1 ) according to one of the preceding claims, characterized in that the respective channel system (4) in the inlet area (11 ) has several separate inlet channels (13) which can be flowed through in parallel by the coolant (5) and which are spaced apart from each other, that the cooling plate (1 ) in the inlet area (11 ) of the respective channel system (4) has at least one material weakening (14) in order to reduce heat conduction in the plate body (2) between adjacent inlet channels (13).
5. Cooling plate (1 ) according to claim 4, characterized in that at least one such material weakening (14) is formed by a depression on the top surface of the plate and / or on the bottom surface of the plate.
6. Cooling plate (1 ) according to claim 4 or 5, characterized in that at least one such material weakening (14) is formed by a through-opening penetrating the top and / or bottom of the plate.
7. Cooling plate (1 ) according to one of claims 4 to 6, characterized in that the respective material weakening (14) in the inlet area (11 ) is arranged in a near area (15) immediately adjoining the at least one coolant inlet (6).
8. Cooling plate (1 ) according to claim 7, characterized in that in the inlet region (11 ) the number of inlet channels (13) increases from the at least one coolant inlet (6) to a distant region (16) in which the inlet region (11 ) has the largest number of parallel flowable inlet channels (13), and that in the inlet region (11 ) the near region (15) is arranged between the at least one coolant inlet (6) and the distant region (16).
9. Cooling plate (1 ) according to one of the preceding claims, characterized in that the plate body (2) has at least one recess in the inlet area (11 ) on the top of the plate for creating an air gap between the top of the plate and the respective components.
10. Cooling plate (1 ) according to one of the preceding claims, characterized in that the channel system (4) is configured such that heat transfer between the coolant and the plate body (2) with respect to the cooling surface (8) is smaller in the inlet area (11 ) than in the outlet area (12).
11. Cooling plate (1) according to one of the preceding claims, characterized in that that the respective channel system (4) in the inlet area (11) has several separate inlet channels (13) which can be flowed through in parallel by the coolant (5) and which are spaced apart from each other.
12. Cooling plate (1 ) according to one of the preceding claims, characterized in that the respective channel system (4) in the outlet area (12) has only a single outlet channel (17) in which flow guide elements (18) are arranged that can be surrounded by the coolant.
13. Cooling plate (1 ) according to claims 11 and 12, characterized in that the respective channel system (4) in the inlet area (11 ) branches out from the at least one coolant inlet (6) via several dividing points (19) into several inlet channels (13) which can be flowed through in parallel by the coolant (5), and that the respective channel system (4) has a transition area (20) in which the inlet channels (13) open into the outlet channel (17) via several connection points (21 ).
14. Cooling plate (1) according to claim 13, characterized in that the inlet channels (13) in the transition area (20) extend over the Connection points (21) open directly into the outlet channel (17), or that the inlet channels (13) open in the transition area (20) via several first connection points (21.1) into transition channels (22), which open into the outlet channel (17) via several second connection points (21.2).
15. Cooling plate (1) according to one of the preceding claims, characterized in that at least one such channel system (4) is configured as a U-flow system, wherein the at least one coolant inlet (6) and the at least one coolant outlet (7) are formed on the same side (23) of a plate edge (24) surrounding the plate body (2), and / or that at least one such channel system (4) is configured as an I-flow system in which the at least one coolant inlet (6) and the at least one coolant outlet (7) are formed on two opposite sides (23, 25) of a plate edge (24) surrounding the plate body (2), and / or that at least two such channel systems (4) are formed in the plate body (2), each independently connecting at least one coolant inlet (6) with at least one coolant outlet (7) fluidically.
Citation Information
Patent Citations
Liquid distribution module and heat dissipation system
CN113747738A
Heat transfer device , power battery package and electric motor car of battery package
CN207265190U
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DE102017215759A1
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DE102019112831B3
Refrigerant-based battery cooling plate
DE202022102022U1